TWI833757B - Coil component and electronic device - Google Patents

Coil component and electronic device Download PDF

Info

Publication number
TWI833757B
TWI833757B TW108118381A TW108118381A TWI833757B TW I833757 B TWI833757 B TW I833757B TW 108118381 A TW108118381 A TW 108118381A TW 108118381 A TW108118381 A TW 108118381A TW I833757 B TWI833757 B TW I833757B
Authority
TW
Taiwan
Prior art keywords
mentioned
coil
lead
external electrode
conductor
Prior art date
Application number
TW108118381A
Other languages
Chinese (zh)
Other versions
TW202004791A (en
Inventor
新井隆幸
寺內直也
町田修一
Original Assignee
日商太陽誘電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018101486A external-priority patent/JP7198000B2/en
Application filed by 日商太陽誘電股份有限公司 filed Critical 日商太陽誘電股份有限公司
Publication of TW202004791A publication Critical patent/TW202004791A/en
Application granted granted Critical
Publication of TWI833757B publication Critical patent/TWI833757B/en

Links

Abstract

A coil component includes: a base part containing a magnetic material and having insulating property; a flat coil embedded in the base part, formed by a wound coil conductor where one end part referred to as a first end part is located on an inner side of the windings, and another end part referred to as a second end part is located on an outer side of the windings; a first lead conductor connected to the first end part of the flat coil; a second lead conductor connected to the second end part of the flat coil; a first external electrode provided on a surface of the base part and connected to the first lead conductor; and a second external electrode provided on a surface of the base part and connected to the second lead conductor; wherein the first lead conductor is connected to the first external electrode in an area on an inner side of an outermost periphery coil conductor of the flat coil when the base part and the flat coil are viewed from above in a direction of a coil axis of the flat coil.

Description

線圈零件及電子機器Coil parts and electronic equipment

本發明係關於線圈零件及電子機器。 The present invention relates to coil parts and electronic equipment.

隨著線圈零件要求薄型化,藉由線圈零件被使用於高頻帶域(例如10MHz以上),而可低電阻化。藉此,近幾年,開始使用線圈零件,該線圈零件係使用將線圈導體周繞為1層漩渦狀之平面線圈。於線圈導體周繞為漩渦狀之平面線圈中,一側之端部位於平面線圈之內側,另一側之端部位於平面線圈之外側。因此,已知有如下構成:將與位於平面線圈之兩端部中之平面線圈內側之端部連接之引出導體自平面線圈之內側引出至較平面線圈更外側並與外部電極連接(例如,專利文獻1)。 As coil components are required to be thinner, the resistance can be reduced by using coil components in high frequency bands (for example, above 10 MHz). Therefore, in recent years, coil parts using a planar coil in which a coil conductor is wound into a single layer of vortex have begun to be used. In a planar coil in which the coil conductor is wound in a spiral shape, one end is located inside the planar coil and the other end is located outside the planar coil. Therefore, a structure is known in which a lead-out conductor connected to an end located inside the planar coil among both ends of the planar coil is led out from the inside of the planar coil to an outside of the planar coil and connected to an external electrode (for example, patent Document 1).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Document]

[專利文獻1]日本專利特開2001-102217號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-102217

於線圈零件使用於高頻帶域之情形時低損失化之要求較大。使用之頻率越高,透過線圈導體及引出導體之磁通之變化越變高速,伴隨於此,因渦電流使導體內部之損失變大。 When coil parts are used in high-frequency bands, there is a greater demand for low losses. The higher the frequency of use, the faster the magnetic flux passing through the coil conductor and the lead conductor changes. With this, the loss inside the conductor increases due to eddy current.

本發明係鑑於上述問題而完成者,目的在於抑制導體內部之損失增加。 The present invention was completed in view of the above-mentioned problems, and aims to suppress an increase in losses within a conductor.

本發明係一種線圈零件,其包含:基體部,其包含磁性材料,且具有絕緣性;平面線圈,其內置於上述基體部,由線圈導體周繞形成,一側之第1端部位於上述周繞之內側,另一側之第2端部位於上述周繞之外側;第1引出導體,其連接於上述平面線圈之上述第1端部;第2引出導體,其連接於上述平面線圈之上述第2端部;第1外部電極,其設置於上述基體部之表面,連接於上述第1引出導體;及第2外部電極,其設置於上述基體部之表面且連接於上述第2引出導體;上述第1引出導體於自上述平面線圈之線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更內側之區域與上述第1外部電極連接。 The present invention is a coil component, which includes: a base part containing a magnetic material and having insulating properties; a planar coil built in the base part and formed by winding a coil conductor, with the first end of one side located on the circumference. On the inside of the winding, the second end on the other side is located on the outside of the above-mentioned winding; the first lead-out conductor is connected to the above-mentioned first end of the above-mentioned planar coil; the second lead-out conductor is connected to the above-mentioned end of the above-mentioned planar coil a second end portion; a first external electrode provided on the surface of the base portion and connected to the first lead-out conductor; and a second external electrode provided on the surface of the base portion and connected to the second lead-out conductor; The first lead-out conductor is connected to the first external electrode in a region further inside than the planar coil when the base portion and the planar coil are planarly viewed from the coil axial direction of the planar coil.

上述構成中,上述第1引出導體可構成為自上述平面線圈之上述第1端部直線狀連接於上述第1外部電極。 In the above structure, the first lead-out conductor may be linearly connected from the first end of the planar coil to the first external electrode.

上述構成中,上述第1引出導體可構成為與上述線圈軸平行。 In the above configuration, the first lead-out conductor may be configured to be parallel to the axis of the coil.

上述構成中,上述第1引出導體可構成為於自上述線圈軸向俯視上述基體部及上述平面線圈時,與上述線圈導體重疊設置。 In the above configuration, the first lead-out conductor may be configured to overlap the coil conductor when the base portion and the planar coil are viewed from above in the coil axial direction.

上述構成中,上述第1引出導體及上述第2引出導體之與上述線圈軸垂直之方向之剖面可構成為圓形形狀。 In the above-mentioned structure, the cross section of the first lead-out conductor and the second lead-out conductor in a direction perpendicular to the coil axis may be formed into a circular shape.

上述構成中,可構成為上述第1引出導體與設置於上述基體部之表面中之第1面之上述第1外部電極連接,上述第2引出導體與設置於上述基體部之上述第1面之上述第2外部電極連接,上述第1外部電極及上述第2外部電極於上述基體部之與上述第1面相反之側之第2面並未設置。 In the above configuration, the first lead-out conductor may be connected to the first external electrode provided on the first surface of the base part, and the second lead-out conductor may be connected to the first lead conductor provided on the first surface of the base part. The second external electrode is connected, and the first external electrode and the second external electrode are not provided on the second surface of the base part opposite to the first surface.

上述構成中,可構成為上述第1外部電極及上述第2外部電極僅設置於上述基體部之表面中之上述第1面。 In the above configuration, the first external electrode and the second external electrode may be provided only on the first surface among the surfaces of the base portion.

上述構成中,可構成為上述第1外部電極自上述基體部之表面中之第1面經由連接於上述第1面及與上述第1面相反之側之第2面之第3面延伸至上述第2面而設置,上述第2外部電極自上述基體部之上述第1面經由連接於上述第1面及上述第2面之第4面延伸至上述第2面而設置。 In the above configuration, the first external electrode may be configured to extend from the first surface of the surface of the base portion to the above-mentioned surface through a third surface connected to the first surface and the second surface on the side opposite to the first surface. The second external electrode is provided on the second surface of the base portion, and extends from the first surface of the base portion to the second surface via a fourth surface connected to the first surface and the second surface.

上述構成中,可構成為包含:第3引出導體,其連接於上述平面線圈之上述第1端部;第4引出導體,其連接於上述平面線圈之上述第2端部;第3外部電極,其設置於上述基體部之表面,且連接於上述第3引出導體;及第4外部電極,其設置於上述基體部之表面,且連接於上述第4引出導 體;且上述第1引出導體與設置於上述基體部之表面中之第1面之上述第1外部電極連接,上述第2引出導體與設置於上述基體部之上述第1面之上述第2外部電極連接,上述第3引出導體於自上述線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更於上述內側之區域與設置於上述基體部之與上述第1面相反側之第2面之上述第3外部電極連接,上述第4引出導體與設置於上述基體部之上述第2面之上述第4外部電極連接。 In the above structure, it may be configured to include: a third lead conductor connected to the first end of the planar coil; a fourth lead conductor connected to the second end of the planar coil; and a third external electrode, It is provided on the surface of the above-mentioned base part and is connected to the above-mentioned third lead-out conductor; and a fourth external electrode is provided on the surface of the above-mentioned base part and is connected to the above-mentioned fourth lead-out conductor. body; and the first lead-out conductor is connected to the first external electrode provided on the first surface of the base part, and the second lead-out conductor is connected to the second external electrode provided on the first surface of the base part The electrodes are connected, and the third lead-out conductor, when the base portion and the planar coil are viewed from above in the axial direction of the coil, is located in a region further inside than the planar coil and is provided on the side of the base portion opposite to the first surface. The third external electrode on the second surface is connected, and the fourth lead-out conductor is connected to the fourth external electrode provided on the second surface of the base part.

上述構成中,可構成為上述第1外部電極與上述第3外部電極於上述基體部之連接於上述第1面及上述第2面之第3面上連接,上述第2外部電極與上述第4外部電極於上述基體部之連接於上述第1面及上述第2面之第4面上連接。 In the above configuration, the first external electrode and the third external electrode may be connected to a third surface of the base portion that is connected to the first surface and the second surface, and the second external electrode and the fourth external electrode may be connected to each other. The external electrode is connected to a fourth surface of the base portion that is connected to the first surface and the second surface.

上述構成中,可構成為上述第1引出導體與設置於上述基體部之表面中之第1面之上述第1外部電極連接,上述第2引出導體與設置於上述基體部之上述第1面之上述第2外部電極連接,上述第1引出導體及上述第2引出導體之端部自上述基體部之上述第1面突出,上述第1外部電極及上述第2外部電極藉由覆蓋上述第1引出導體及上述第2引出導體之上述端部而形成圓頂狀之突起。 In the above configuration, the first lead-out conductor may be connected to the first external electrode provided on the first surface of the base part, and the second lead-out conductor may be connected to the first lead conductor provided on the first surface of the base part. The above-mentioned second external electrode is connected, the ends of the above-mentioned first lead-out conductor and the above-mentioned second lead-out conductor protrude from the above-mentioned first surface of the above-mentioned base part, and the above-mentioned first external electrode and the above-mentioned second external electrode are connected by covering the above-mentioned first lead-out conductor. The conductor and the end portion of the second lead-out conductor form a dome-shaped protrusion.

於上述構成中,構成為上述線圈零件之高度為0.6mm以下。 In the above structure, the height of the coil component is 0.6 mm or less.

本發明係一種電子機器,其包含上述記載之線圈零件與供安裝或組入上述線圈零件之電路基板。 The present invention is an electronic device including the coil component described above and a circuit board for mounting or integrating the coil component.

根據本發明,可抑制導體內部之損失增加。 According to the present invention, an increase in loss inside the conductor can be suppressed.

10:基體部 10: Base part

12:下表面 12: Lower surface

14:上表面 14: Upper surface

16a、16b:端面 16a, 16b: End face

18a、18b:側面 18a, 18b: side

20:中心線 20: Center line

22:中心 22:Center

30:平面線圈 30: Planar coil

32:線圈導體 32: Coil conductor

33:最外周部分 33: The outermost part

34:端部 34:End

36:端部 36:End

38:線圈軸 38: Coil shaft

40:區域 40:Area

42:區域 42:Area

50、51、52、54、56:引出導體 50, 51, 52, 54, 56: Lead conductor

60、62、64、66:外部電極 60, 62, 64, 66: External electrode

65、67:面 65, 67: Noodles

68、70:突起 68, 70:Protrusion

80:基板 80:Substrate

90:電路基板 90:Circuit substrate

92:焊盤圖案 92: Pad pattern

94:焊料 94:Solder

100、110、120、130:線圈零件 100, 110, 120, 130: Coil parts

200、300、400:線圈零件 200, 300, 400: Coil parts

500:電子機器 500:Electronic machinery

1000:線圈零件 1000: Coil parts

B:磁通 B: Magnetic flux

Ia:電流 Ia: current

Ib:渦電流 Ib: eddy current

L1~L4:長度 L1~L4: length

圖1係實施例1之線圈零件之透視立體圖。 Figure 1 is a perspective view of the coil component of Embodiment 1.

圖2(a)係實施例1之線圈零件之透視俯視圖,圖2(b)係仰視圖。 Figure 2(a) is a perspective top view of the coil component of Embodiment 1, and Figure 2(b) is a bottom view.

圖3(a)係圖1之A-A間之剖視圖,圖3(b)係圖1之B-B間之剖視圖。 Fig. 3(a) is a cross-sectional view between A-A in Fig. 1, and Fig. 3(b) is a cross-sectional view between B-B in Fig. 1.

圖4(a)係比較例之線圈零件之透視立體圖,圖4(b)係圖4(a)之A-A間之剖視圖。 Fig. 4(a) is a perspective view of the coil component of the comparative example, and Fig. 4(b) is a cross-sectional view taken along line A-A in Fig. 4(a).

圖5係用以說明比較例之線圈零件產生之課題之圖。 FIG. 5 is a diagram for explaining the problem of producing the coil component of the comparative example.

圖6(a)至圖6(c)係自實施例1之變化例1至變化例3之線圈零件之剖視圖。 6(a) to 6(c) are cross-sectional views of coil components from Modification 1 to Modification 3 of Embodiment 1.

圖7係實施例2之線圈零件之剖視圖。 Figure 7 is a cross-sectional view of the coil component of Embodiment 2.

圖8係實施例3之線圈零件之剖視圖。 Figure 8 is a cross-sectional view of the coil component of Embodiment 3.

圖9係實施例4之線圈零件之剖視圖。 Figure 9 is a cross-sectional view of the coil component of Embodiment 4.

圖10係實施例5之電子機器之剖視圖。 Fig. 10 is a cross-sectional view of the electronic device of Embodiment 5.

以下,參照圖式說明本發明之實施例。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[實施例1] [Example 1]

圖1係實施例1之線圈零件之透視立體圖。圖2(a)係實施例1之線圈零件之透視俯視圖,圖2(b)係仰視圖。另,於圖2(a)中省略外部電極之圖 示,於圖2(b)中透視外部電極等圖示引出導體之剖面。圖3(a)係圖1之A-A間剖視圖,圖3(b)係圖1之B-B間剖視圖。如圖1、圖2(a)及圖2(b)以及圖3(a)及圖3(b)所示,實施例1之線圈零件100包含基體部10、內置於基體部10之平面線圈30、自平面線圈30之端部引出之引出導體50及52、及設置於基體部10表面之外部電極60及62。 Figure 1 is a perspective view of the coil component of Embodiment 1. Figure 2(a) is a perspective top view of the coil component of Embodiment 1, and Figure 2(b) is a bottom view. In addition, the external electrode is omitted in Figure 2(a) As shown in Figure 2(b), the cross-section of the external electrode and other illustrated lead conductors is seen through. Fig. 3(a) is a cross-sectional view between A-A in Fig. 1, and Fig. 3(b) is a cross-sectional view between B-B in Fig. 1. As shown in FIGS. 1 , 2(a) and 2(b) and 3(a) and 3(b) , the coil component 100 of Embodiment 1 includes a base part 10 and a planar coil built in the base part 10 30. The lead-out conductors 50 and 52 drawn out from the end of the planar coil 30, and the external electrodes 60 and 62 provided on the surface of the base part 10.

基體部10呈具有下表面12、上表面14、一對端面16a及16b、1對側面18a及18b之長方體形狀。下表面12係安裝面,上表面14係對於下表面12為相反側之面。端面16a及16b係連接於下表面12及上表面14之短邊的面,側面18a及18b係連接於下表面12及上表面14之長邊的面。另,基體部10並不限定於完全之長方體形狀之情形,亦可為例如各頂點帶圓弧之情形,各棱(各面之邊界部)帶圓弧之情形,或各面具有曲面之情形等。即,長方體形狀為亦包含此種形狀者。 The base portion 10 has a rectangular parallelepiped shape having a lower surface 12, an upper surface 14, a pair of end surfaces 16a and 16b, and a pair of side surfaces 18a and 18b. The lower surface 12 is the mounting surface, and the upper surface 14 is the surface opposite to the lower surface 12 . The end surfaces 16a and 16b are surfaces connected to the short sides of the lower surface 12 and the upper surface 14, and the side surfaces 18a and 18b are surfaces connected to the long sides of the lower surface 12 and the upper surface 14. In addition, the base portion 10 is not limited to a complete rectangular parallelepiped shape. For example, each vertex may have an arc, each edge (boundary portion of each surface) may have an arc, or each surface may have a curved surface. wait. That is, the rectangular parallelepiped shape also includes this shape.

基體部10具有絕緣性,包含磁性金屬粒子或鐵氧體粒子等磁性粒子而形成。基體部10係以主成分包含例如磁性粒子而形成。所謂主成分包含係指例如包含多於50wt%磁性粒子之情形或70wt%以上磁性粒子之情形,或包含80wt%以上磁性粒子之情形。基體部10亦可由含有磁性粒子之樹脂形成,亦可由表面被絕緣被覆之磁性粒子形成。作為磁性金屬粒子,係使用例如FeSi系、FeSiCr系、FeSiAl系、FeSiCrAl系,Fe或Ni等磁性金屬、結晶性磁性金屬、非晶質磁性金屬或奈米結晶磁性金屬。作為鐵氧體粒子,係使用例如NiZn系鐵氧體或MnZn系鐵氧體等。作為樹脂,可使用聚醯亞胺或酚樹脂等熱硬化性樹脂,亦可使用聚乙烯樹脂或聚醯胺樹脂等 熱硬化性樹脂。作為被覆磁性粒子表面之絕緣膜,亦可使用例如氧化矽膜等無機絕緣膜。 The base portion 10 has insulating properties and is formed by containing magnetic particles such as magnetic metal particles or ferrite particles. The base portion 10 is formed by including, for example, magnetic particles as a main component. The term "containing the main component" means, for example, that the composition contains more than 50 wt% of magnetic particles, 70 wt% or more of magnetic particles, or 80 wt% or more of magnetic particles. The base part 10 may be formed of resin containing magnetic particles, or may be formed of magnetic particles whose surface is insulatingly coated. As the magnetic metal particles, for example, magnetic metals such as FeSi-based, FeSiCr-based, FeSiAl-based, FeSiCrAl-based, Fe or Ni, crystalline magnetic metals, amorphous magnetic metals or nanocrystalline magnetic metals are used. As the ferrite particles, for example, NiZn-based ferrite or MnZn-based ferrite is used. As the resin, thermosetting resins such as polyimide or phenol resin can be used, and polyethylene resin, polyamide resin, etc. can also be used. Thermosetting resin. As the insulating film covering the surface of the magnetic particles, an inorganic insulating film such as a silicon oxide film can also be used.

平面線圈30係線圈導體32周繞1層漩渦狀而形成,線圈導體32之一側之端部34設置於周繞之內側,另一側之端部36設置於周繞之外側,亦稱為平面螺旋線圈。端部34與端部36可位於通過平面線圈30之俯視下之中心且與下表面12及上表面14之長邊大致平行之直線上,亦可任一者或兩者自直線上偏離。線圈導體32例如由銅,鋁,鎳,銀,鉑或鈀等金屬材料或包含該等之合金材料形成,且於導體表面亦可設置絕緣被膜。線圈導體32之剖面形狀例如為矩形形狀,但亦可為梯形形狀或包含直線與曲線之半橢圓形狀等。平面線圈30具有與由線圈導體32周繞所規定之面正交之線圈軸38。基體部10之下表面12及上表面14為與線圈軸38大致正交之面,基體部10之端面16a及16b以及側面18a及18b為與線圈軸38大致平行之面。線圈導體32於每個周繞間具有間隙。該間隙可為空間、線圈導體32之絕緣被膜、其他絕緣物,只要使每個周繞絕緣即可。 The planar coil 30 is formed by winding a coil conductor 32 in a spiral shape. One end 34 of the coil conductor 32 is arranged inside the winding, and the other end 36 is arranged outside the winding. It is also called a planar coil 30. Planar spiral coil. The end portion 34 and the end portion 36 may be located on a straight line that passes through the center of the planar coil 30 in plan view and is substantially parallel to the long sides of the lower surface 12 and the upper surface 14 , or either or both may deviate from the straight line. The coil conductor 32 is made of, for example, metal materials such as copper, aluminum, nickel, silver, platinum or palladium or alloy materials containing these, and an insulating film may also be provided on the surface of the conductor. The cross-sectional shape of the coil conductor 32 is, for example, a rectangular shape, but may also be a trapezoidal shape, a semi-elliptical shape including a straight line and a curve, or the like. The planar coil 30 has a coil axis 38 orthogonal to the plane defined by the circumference of the coil conductor 32 . The lower surface 12 and the upper surface 14 of the base portion 10 are substantially orthogonal to the coil axis 38 , and the end surfaces 16 a and 16 b and side surfaces 18 a and 18 b of the base portion 10 are substantially parallel to the coil axis 38 . The coil conductor 32 has gaps between each turn. The gap can be a space, an insulating film of the coil conductor 32, or other insulators, as long as each circumference is insulated.

平面線圈30藉由例如將線圈導體32橢圓狀周繞而呈橢圓形形狀,但亦可藉由線圈導體32圓形周繞而呈圓形形狀,亦可藉由線圈導體32矩形狀周繞而呈矩形形狀,亦可藉由線圈導體32以該等複合形狀周繞而呈所謂之橄欖球形狀。此處,將平面線圈30之形狀,即線圈導體32之周繞形狀視為線圈導體32之最外周部之導體封閉之圖形,表現為橢圓形形狀、圓形形狀、矩形形狀及橄欖球形狀。以下,表示平面線圈30之形狀即線圈導體32之周繞形狀時亦同樣表示。又,設為平面線圈30之短軸長度L2相對於 長軸長度L1之比(L2/L1)為0.9以下之情形時,平面線圈30為橢圓形形狀,於大於0.9之情形時,平面線圈30為圓形形狀。又,於將基體部10之長邊方向之長度設為L3,將短邊方向之長度設為L4之情形時,平面線圈30之長軸長度L1與短軸長度L2之比與基體部10之長邊方向之長度L3與短邊方向之長度L4之比較佳為大致相同(L1:L2≒L3:L4)。線圈軸38係定義為將線圈導體32之周繞形狀視為線圈導體32之最外周部之導體封閉之圖形,垂直通過其中心之軸。於線圈導體32之周繞形狀為橢圓之情形時,線圈導體32之周繞形狀之中心為長軸與短軸之交點;於線圈導體32之周繞形狀為矩形之情形時,線圈導體32之周繞形狀之中心為對角線之交點;於線圈導體32之周繞之形狀為橄欖球形狀之情形時,線圈導體32之周繞形狀之中心為將對稱軸2等分之中央之點。 The planar coil 30 may be formed into an elliptical shape by, for example, surrounding the coil conductor 32 in an elliptical shape. However, the planar coil 30 may also be formed into a circular shape by surrounding the coil conductor 32 in a circular shape, or may be formed in a rectangular shape by surrounding the coil conductor 32 . It has a rectangular shape, or it can also have a so-called rugby shape by winding the coil conductor 32 in these composite shapes. Here, the shape of the planar coil 30 , that is, the surrounding shape of the coil conductor 32 is regarded as a figure in which the conductor of the outermost peripheral portion of the coil conductor 32 is closed, and can be expressed as an elliptical shape, a circular shape, a rectangular shape, or a rugby ball shape. Hereinafter, the shape of the planar coil 30 , that is, the circumferential shape of the coil conductor 32 will be shown in the same manner. Furthermore, it is assumed that the minor axis length L2 of the planar coil 30 is When the ratio of the major axis lengths L1 (L2/L1) is 0.9 or less, the planar coil 30 has an elliptical shape, and when it exceeds 0.9, the planar coil 30 has a circular shape. Furthermore, when the length in the long side direction of the base portion 10 is L3 and the length in the short side direction is L4, the ratio between the long axis length L1 and the short axis length L2 of the planar coil 30 is equal to that of the base portion 10 The ratio of the length L3 in the long side direction to the length L4 in the short side direction is preferably substantially the same (L1: L2≒L3: L4). The coil axis 38 is defined as an axis perpendicularly passing through the center of a conductor-enclosed figure considering the circumferential shape of the coil conductor 32 as the outermost peripheral portion of the coil conductor 32 . When the circumferential shape of the coil conductor 32 is an ellipse, the center of the circumferential shape of the coil conductor 32 is the intersection of the long axis and the short axis; when the circumferential shape of the coil conductor 32 is a rectangle, the center of the circumferential shape of the coil conductor 32 is a rectangle. The center of the circumferential shape is the intersection point of the diagonals; when the circumferential shape of the coil conductor 32 is a rugby ball shape, the center of the circumferential shape of the coil conductor 32 is the center point that bisects the axis of symmetry.

平面線圈30由於係線圈導體32於線圈軸38之方向上未重疊之所謂1層漩渦狀周繞之形狀,故線圈零件100可實現薄型化。例如,可將線圈零件100之高度設為0.6mm以下,0.4mm以下,或0.2mm以下。作為線圈零件100之大小(長度×寬度×高度)之例,可列舉0.2mm×0.1mm×0.1mm、0.3mm×0.2mm×0.1mm、0.3mm×0.2mm×0.2mm、0.4mm×0.2mm×0.2mm、0.6mm×0.3mm×0.3mm、1.0mm×0.5mm×0.3mm、1.6mm×0.8mm×0.3mm、1.6mm×0.8mm×0.4mm、1.6mm×0.8mm×0.5mm、1.6mm×1.0mm×0.3mm、1.6mm×1.0mm×0.4mm、1.6mm×1.0mm×0.5mm、1.6mm×1.2mm×0.3mm、1.6mm×1.2mm×0.4mm、1.6mm×1.2mm×0.5mm、2.0mm×1.2mm×0.3mm、2.0mm×1.2mm×0.4mm、2.0mm×1.2mm×0.5mm、2.0mm×1.2mm×0.6mm、2.0mm×1.6mm× 0.3mm、2.0mm×1.6mm×0.5mm等。 Since the planar coil 30 has a so-called single-layer spiral winding shape in which the coil conductor 32 does not overlap in the direction of the coil axis 38, the coil component 100 can be made thinner. For example, the height of the coil component 100 can be set to 0.6 mm or less, 0.4 mm or less, or 0.2 mm or less. Examples of the size (length × width × height) of the coil component 100 include 0.2 mm × 0.1 mm × 0.1 mm, 0.3 mm × 0.2 mm × 0.1 mm, 0.3 mm × 0.2 mm × 0.2 mm, and 0.4 mm × 0.2 mm. ×0.2mm, 0.6mm×0.3mm×0.3mm, 1.0mm×0.5mm×0.3mm, 1.6mm×0.8mm×0.3mm, 1.6mm×0.8mm×0.4mm, 1.6mm×0.8mm×0.5mm, 1.6 mm×1.0mm×0.3mm, 1.6mm×1.0mm×0.4mm, 1.6mm×1.0mm×0.5mm, 1.6mm×1.2mm×0.3mm, 1.6mm×1.2mm×0.4mm, 1.6mm×1.2mm× 0.5mm, 2.0mm×1.2mm×0.3mm, 2.0mm×1.2mm×0.4mm, 2.0mm×1.2mm×0.5mm, 2.0mm×1.2mm×0.6mm, 2.0mm×1.6mm× 0.3mm, 2.0mm×1.6mm×0.5mm, etc.

外部電極60及62係表面安裝用之外部端子,於自線圈軸38之方向俯視之情形時,位於具有與線圈導體32之端部34及36重疊之部分。外部電極60於基體部10之下表面12靠近端面16a側而設置。外部電極62於基體部10之下表面12靠近端面16b側而設置。外部電極60及62僅設置於基體部10之表面中之下表面12,上表面14、端面16a及16b以及側面18a及18b並未設置。即,外部電極60及62係僅設置於基體部10之表面中之1面的1面電極。外部電極60與外部電極62係對於例如基體部10之端面16a與端面16b之間之中心線20對稱設置。外部電極60與外部電極62亦可對於例如基體部10之下表面12之中心22對稱設置。藉由將外部電極60與外部電極62對於中心線20及/或中心22對稱設置,可將線圈零件100均衡良好地安裝於線路基板等。 The external electrodes 60 and 62 are surface-mounted external terminals, and are located at portions that overlap the end portions 34 and 36 of the coil conductor 32 when viewed from the direction of the coil axis 38 . The external electrode 60 is provided on the lower surface 12 of the base portion 10 close to the end surface 16a. The external electrode 62 is provided on the lower surface 12 of the base portion 10 close to the end surface 16b. The external electrodes 60 and 62 are only provided on the lower surface 12 among the surfaces of the base portion 10, and are not provided on the upper surface 14, end surfaces 16a and 16b, and side surfaces 18a and 18b. That is, the external electrodes 60 and 62 are single-surface electrodes provided on only one surface of the base portion 10 . The external electrodes 60 and 62 are arranged symmetrically with respect to, for example, the center line 20 between the end surfaces 16 a and 16 b of the base portion 10 . The external electrodes 60 and 62 may also be disposed symmetrically with respect to, for example, the center 22 of the lower surface 12 of the base portion 10 . By arranging the external electrodes 60 and 62 symmetrically with respect to the center line 20 and/or the center 22 , the coil component 100 can be mounted on a circuit board or the like in a well-balanced manner.

外部電極60及62係採用例如由銅、鋁、鎳、銀、鉑或鈀等金屬材料或包含該等之合金材料形成之下層、由銀或包含銀之導電性樹脂形成之中層、以及鎳、錫或銅之鍍層即上層的多層構造。另,於各層間有中間層之情形時或上層之上有最上層之情形等時,外部電極60及62之層構成並不限定於例示之情形。 The external electrodes 60 and 62 use, for example, a lower layer made of a metal material such as copper, aluminum, nickel, silver, platinum or palladium or an alloy material containing these, an intermediate layer made of silver or a conductive resin containing silver, and nickel, The plating of tin or copper is the multi-layer structure of the upper layer. In addition, when there is an intermediate layer between each layer or when there is an uppermost layer above the upper layer, the layer structure of the external electrodes 60 and 62 is not limited to the illustrated case.

此處,自線圈軸38之方向俯視平面線圈30時,將以比使線圈導體32之最外周部分33成為最短周長之方式封閉之曲線所包圍之部分更於內側之區域設為區域42(圖2(a)之斜線部分)。引出導體50於自線圈軸38之方向俯 視平面線圈30時,僅位於區域42之內部,且連接平面線圈30之端部34與設置於基體部10之下表面12之外部電極60。即,引出導體50於將以區域42為剖面之基體部10之下表面12與上表面14之間之區域(換言之,隔著區域42之基體部10之下表面12與上表面14之間之區域)設為區域40(圖3(a)及圖3(b)之粗實線內之區域)時,僅位於區域40之內部,並連接平面線圈30之端部34與設置於基體部10之下表面12之外部電極60。 Here, when the planar coil 30 is viewed from the direction of the coil axis 38 , the area enclosed by a curve closed so that the outermost peripheral portion 33 of the coil conductor 32 has the shortest circumference is defined as the area 42 ( FIG. 2 (The slashed part of (a)). The lead conductor 50 is bent in the direction from the coil axis 38 When viewing the planar coil 30 , it is only located inside the area 42 and connects the end 34 of the planar coil 30 and the external electrode 60 provided on the lower surface 12 of the base portion 10 . That is, the conductor 50 is drawn out in the area between the lower surface 12 and the upper surface 14 of the base portion 10 with the area 42 as the cross section (in other words, between the lower surface 12 and the upper surface 14 of the base portion 10 with the area 42 interposed therebetween). When the area) is set to the area 40 (the area within the thick solid line in Figure 3 (a) and Figure 3 (b)), it is only located inside the area 40 and connects the end 34 of the planar coil 30 and the base portion 10 External electrode 60 on lower surface 12 .

引出導體50亦可直線狀連接平面線圈30之端部34與設置於基體部10之下表面12之外部電極60。藉此,由於引出導體50之長度變短故可減小電阻。又,引出導體50亦可與線圈軸38平行並連接平面線圈30之端部34與設置於基體部10之下表面12之外部電極60。藉此,由於引出導體50之長度進一步變短,故電阻進一步變小,可有效地抑制後述之渦電流影響。另,所謂平行於線圈軸38,係指自線圈軸38之方向俯視,引出導體50之兩端重疊。只要至少各端部之一半重疊,就可實現最短長度。又,所謂平行於該線圈軸38,並不限定於嚴密意義上之平行之情形,亦可包含製造誤差程度之微傾及/或階差等。又,引出導體50亦可設為於自線圈軸38之方向俯視時,與線圈導體32重疊。即,引出導體50亦可配置為侷限於線圈導體32寬度內。藉此,引出導體50與線圈導體32之連接穩定性變好,可與連接部分之位置偏離無關地使連接電阻一定。 The lead-out conductor 50 may also linearly connect the end 34 of the planar coil 30 and the external electrode 60 provided on the lower surface 12 of the base part 10 . Thereby, since the length of the lead-out conductor 50 is shortened, the resistance can be reduced. In addition, the lead conductor 50 may be parallel to the coil axis 38 and connect the end 34 of the planar coil 30 and the external electrode 60 provided on the lower surface 12 of the base part 10 . Thereby, since the length of the lead-out conductor 50 is further shortened, the resistance is further reduced, which can effectively suppress the influence of eddy currents described below. In addition, "parallel to the coil axis 38" means that both ends of the lead conductor 50 overlap when viewed from the direction of the coil axis 38. The shortest length is achieved as long as at least half of each end overlaps. In addition, the term "parallel to the coil axis 38" is not limited to parallel in a strict sense, but may also include slight inclination and/or step differences to the extent of manufacturing errors. In addition, the lead conductor 50 may be configured to overlap the coil conductor 32 when viewed from the direction of the coil axis 38 . That is, the lead conductor 50 may be arranged so as to be limited within the width of the coil conductor 32 . Thereby, the connection stability of the lead conductor 50 and the coil conductor 32 becomes better, and the connection resistance can be made constant regardless of the positional deviation of a connection part.

引出導體52亦可直線狀連接平面線圈30之端部36與設置於基體部10之下表面12之外部電極62。藉此可減小引出導體52之電阻。引出導體52亦可與線圈軸38平行並連接平面線圈30之端部36與設置於基體部10之下 表面12之外部電極62。藉此,可進一部減小引出導體52之電阻。又,引出導體52亦可如一般之構造般於基體部10之端面16b與外部電極62連接。 The lead-out conductor 52 may also linearly connect the end 36 of the planar coil 30 and the external electrode 62 provided on the lower surface 12 of the base part 10 . Thereby, the resistance of the lead-out conductor 52 can be reduced. The lead-out conductor 52 may also be parallel to the coil axis 38 and connect the end 36 of the planar coil 30 and be disposed under the base part 10 External electrode 62 on surface 12 . Thereby, the resistance of the lead-out conductor 52 can be further reduced. Moreover, the lead-out conductor 52 may be connected to the external electrode 62 on the end surface 16b of the base part 10 like a general structure.

引出導體50及52例如由銅、鋁、鎳、銀、鉑或鈀等金屬材料或包含該等之合金材料形成。引出導體50及52與線圈導體32可以相同材料形成,亦可以不同材料形成。引出導體50及52之與線圈軸38垂直之方向之剖面形狀為例如圓形形狀。藉此,即便於將線圈導體32之周繞數設定為任意之情形時,由於可使透過引出導體50及52之磁通設為大致一定,故可將損失之影響設為一定。引出導體50及52之直徑為例如50μm至300μm左右。另,引出導體50及52之與線圈軸38垂直之方向之剖面形狀除圓形形狀之情形以外,亦可為例如橢圓形形狀或矩形形狀等之情形。 The lead-out conductors 50 and 52 are formed of, for example, metal materials such as copper, aluminum, nickel, silver, platinum, or palladium, or alloy materials containing these. The lead-out conductors 50 and 52 and the coil conductor 32 may be formed of the same material or may be formed of different materials. The cross-sectional shape of the lead conductors 50 and 52 in the direction perpendicular to the coil axis 38 is, for example, a circular shape. Accordingly, even when the number of windings of the coil conductor 32 is set to an arbitrary value, the magnetic flux passing through the lead-out conductors 50 and 52 can be made approximately constant, so that the influence of the loss can be made constant. The diameters of the lead-out conductors 50 and 52 are, for example, about 50 μm to 300 μm. In addition, the cross-sectional shape of the lead-out conductors 50 and 52 in the direction perpendicular to the coil axis 38 may be an elliptical shape, a rectangular shape, or the like, in addition to the circular shape.

此處,針對實施例1之線圈零件100之製造方法進行說明。線圈零件100係以包含積層複數片生坏片(絕緣性片材)之步驟而形成。生坏片係構成基體部10之絕緣性之前驅物,係例如藉由刮刀法或印刷法將含有磁性粒子之樹脂材料塗布於膜上而形成。 Here, the manufacturing method of the coil component 100 of Example 1 is demonstrated. The coil component 100 is formed by a step including laminating a plurality of green sheets (insulating sheets). The green sheet is an insulating precursor constituting the base portion 10 and is formed by applying a resin material containing magnetic particles on a film by, for example, a doctor blade method or a printing method.

首先,準備複數片生坏片。對複數片生坏片中之一部分生坏片藉由於特定位置進行雷射加工或蝕刻加工等而形成通孔。其次,於形成通孔之生坏片,藉由使用例如印刷法塗布導電性材料,而形成構成平面線圈30之線圈導體32與引出導體50及52之前驅物。又,於形成通孔之其他生坏片,藉由使用例如印刷法塗布導電性材料,形成引出導體50及52之前驅物。該等前驅物藉由燒成成為線圈導體32與引出導體50及52。 First, prepare multiple raw and bad pieces. Through-holes are formed on some of the plurality of green wafers by performing laser processing or etching processing at specific positions. Next, a conductive material is coated on the green sheet with the through hole formed by using, for example, a printing method to form a precursor for the coil conductor 32 and the lead-out conductors 50 and 52 constituting the planar coil 30 . In addition, on other green sheets where through holes are formed, a conductive material is coated using, for example, a printing method to form precursors for lead conductors 50 and 52 . The precursors are fired to become the coil conductor 32 and lead conductors 50 and 52 .

其次,將複數片生坏片按特定順序積層,於積層方向施加壓力壓著複數片生坏片。然後,將壓著後之生坏片以切割器或鍘刀等切斷成晶片單位後,以特定溫度進行燒成。藉由該燒成,形成於內部設置有由線圈導體32所成之平面線圈30與引出導體50及52之基體部10。接著,於基體部10之下表面12形成外部電極60及62。外部電極60及62係藉由糊料印刷或鍍覆及濺鍍等之於薄膜製程中使用之方法而形成。 Secondly, a plurality of raw and defective sheets are stacked in a specific order, and pressure is applied to the plurality of raw and defective sheets in the direction of lamination. Then, the pressed green wafer is cut into wafer units using a cutter or a guillotine, and then fired at a specific temperature. By this firing, the base portion 10 in which the planar coil 30 made of the coil conductor 32 and the lead-out conductors 50 and 52 are provided is formed. Next, external electrodes 60 and 62 are formed on the lower surface 12 of the base portion 10 . The external electrodes 60 and 62 are formed by paste printing or plating, sputtering, or other methods used in thin film manufacturing processes.

其次,針對比較例之線圈零件進行說明。圖4(a)係比較例之線圈零件之透視立體圖,圖4(b)係圖4(a)之A-A間之剖視圖。如圖4(a)及圖4(b)所示,於比較例之線圈零件1000中,連接於位於平面線圈30之兩端部34及36中之平面線圈30之外側的端部36之引出導體52與實施例1同樣,直線狀連接平面線圈30之端部36與設置於基體部10之下表面12之外部電極62。另一方面,連接於位於平面線圈30之內側之端部34的引出導體51自平面線圈30之端部34導出至基體部10之下表面12側後彎曲而自平面線圈30之內側向外側導出。引出導體51導出至較平面線圈30更外側後再次彎曲而向基體部10之下表面12導出,於基體部10之下表面12連接於外部電極60。其他構成由於與實施例1相同,故省略說明。 Next, the coil parts of the comparative example will be described. Fig. 4(a) is a perspective view of the coil component of the comparative example, and Fig. 4(b) is a cross-sectional view taken along line A-A in Fig. 4(a). As shown in FIGS. 4(a) and 4(b) , in the coil component 1000 of the comparative example, the leads connected to the ends 36 located outside the planar coil 30 among the two ends 34 and 36 of the planar coil 30 The conductor 52 linearly connects the end portion 36 of the planar coil 30 and the external electrode 62 provided on the lower surface 12 of the base portion 10 in the same manner as in the first embodiment. On the other hand, the lead conductor 51 connected to the end portion 34 located inside the planar coil 30 is led out from the end portion 34 of the planar coil 30 to the lower surface 12 side of the base portion 10 and then bent to be led out from the inside to the outside of the planar coil 30 . The lead conductor 51 is led out to the outside of the planar coil 30 and then bent again to be led out to the lower surface 12 of the base part 10 , and is connected to the external electrode 60 on the lower surface 12 of the base part 10 . Since other configurations are the same as those in Embodiment 1, description is omitted.

於比較例之線圈零件1000中,與平面線圈30之端部34連接之引出導體51於基體部10內自平面線圈30之內側導出至較平面線圈30更外側。因此,引出導體51與周繞之線圈導體32之全部交叉。藉此,產生因流通於引出導體51之電流產生之磁通通過線圈導體32中與引出導體51交叉之部 分之情形,其結果,於線圈導體32產生渦電流。使用圖5說明此點。 In the coil component 1000 of the comparative example, the lead-out conductor 51 connected to the end portion 34 of the planar coil 30 is led out from the inside of the planar coil 30 to the outside of the planar coil 30 in the base portion 10 . Therefore, the lead conductor 51 intersects all of the surrounding coil conductor 32 . Thereby, the magnetic flux generated by the current flowing through the lead conductor 51 passes through the portion of the coil conductor 32 that intersects the lead conductor 51 In this case, an eddy current is generated in the coil conductor 32 as a result. Use Figure 5 to illustrate this point.

圖5係用以說明比較例之線圈零件所產生之課題之圖。另,於圖5中,為了圖的明瞭化,圖示與引出導體51交叉之線圈導體32之複數圈周繞中之一圈。如圖5所示,藉由於引出導體51流通電流Ia而產生磁通B。電流Ia由於反復被接通與斷開而流動,故磁通B因電流Ia之增減而變化。由於引出導體51與線圈32交叉而導出,故於引出導體51產生之磁通B透過線圈導體32。因透過線圈導體32之磁通B變化,而於線圈導體32產生渦狀之感應電流即渦電流Ib。若於線圈導體32產生渦電流Ib,則因線圈導體32之電阻而使能量之損失增加,即因渦電流引起之線圈導體32內部之損失增加。線圈零件越被使用於高頻帶域,由於流通於引出導體51之電流Ia之接通、斷開之切換快速,故於引出導體51產生之磁通B之變化變快。因此,會使因線圈導體32產生之渦電流引起之線圈導體32內部之損失變大。又,與此相反,產生於線圈導體32產生之磁通透過引出導體51之情形,於該情形亦同樣,會使渦電流引起之引出導體51內部之損失增加。另,於線圈導體32之複數圈周繞與引出導體51交叉之部分之全部中,於引出導體51側及線圈導體32側兩者,產生渦電流引起之導體內部之損失。 FIG. 5 is a diagram for explaining the problems caused by the coil component of the comparative example. In addition, in FIG. 5 , for clarity of the drawing, one of the plurality of turns of the coil conductor 32 intersecting the lead conductor 51 is shown. As shown in FIG. 5 , the magnetic flux B is generated by flowing the current Ia through the lead conductor 51 . The current Ia flows because it is repeatedly turned on and off, so the magnetic flux B changes due to the increase or decrease of the current Ia. Since the lead conductor 51 crosses the coil 32 and is led out, the magnetic flux B generated in the lead conductor 51 passes through the coil conductor 32 . As the magnetic flux B passing through the coil conductor 32 changes, an eddy-shaped induced current, that is, eddy current Ib, is generated in the coil conductor 32 . If the eddy current Ib is generated in the coil conductor 32, the energy loss will increase due to the resistance of the coil conductor 32, that is, the loss inside the coil conductor 32 due to the eddy current will increase. As the coil component is used in a high-frequency band, the current Ia flowing through the lead conductor 51 is switched on and off quickly, so the change of the magnetic flux B generated in the lead conductor 51 becomes faster. Therefore, the loss inside the coil conductor 32 caused by the eddy current generated in the coil conductor 32 becomes larger. On the contrary, if the magnetic flux generated by the coil conductor 32 passes through the lead conductor 51, the loss inside the lead conductor 51 caused by the eddy current will also increase. In addition, in the entire portion where the plurality of turns of the coil conductor 32 intersects the lead conductor 51, losses within the conductor due to eddy currents occur on both the lead conductor 51 side and the coil conductor 32 side.

另一方面,根據實施例1,如圖1及圖2(a)所示,引出導體50於自平面線圈30之線圈軸38之方向俯視基體部10及平面線圈30時,於較平面線圈30更內側之區域42與外部電極60連接。藉此,可減少引出導體50與線圈導體32交叉之部分。因此,可減少因於引出導體50產生之磁通透過線圈導體32及於線圈導體32產生之磁通透過引出導體50而產生之渦電流, 可抑制渦電流引起之導體內部之損失增加。 On the other hand, according to Embodiment 1, as shown in FIGS. 1 and 2(a) , when the base portion 10 and the planar coil 30 are viewed from the direction of the coil axis 38 of the planar coil 30 , the lead conductor 50 is smaller than the planar coil 30 . The inner region 42 is connected to the external electrode 60 . Thereby, the intersection portion of the lead conductor 50 and the coil conductor 32 can be reduced. Therefore, the eddy current generated due to the magnetic flux generated in the lead conductor 50 passing through the coil conductor 32 and the magnetic flux generated in the coil conductor 32 passing through the lead conductor 50 can be reduced. It can suppress the increase of losses inside the conductor caused by eddy current.

引出導體50較佳為直線狀連接平面線圈30之端部34與設置於基體部10之下表面12之外部電極60。藉此,可有效地使線圈導體32及引出導體50產生之渦電流降低。又,亦可減小引出導體50之電阻。 The lead-out conductor 50 is preferably a straight line connecting the end 34 of the planar coil 30 and the external electrode 60 provided on the lower surface 12 of the base portion 10 . Thereby, the eddy current generated by the coil conductor 32 and the lead conductor 50 can be effectively reduced. In addition, the resistance of the lead-out conductor 50 can also be reduced.

引出導體50較佳為如圖3(a)所示,與平面線圈30之線圈軸38平行並直線狀連接平面線圈30之端部34與設置於基體部10之下表面12之外部電極60。藉此,由於引出導體50與線圈導體32之交叉被抑制,故可更有效地減少於線圈導體32及引出導體50產生之渦電流。又,由於引出導體50之長度變短故電阻變小,故就該點而言亦可抑制渦電流之影響。 The lead-out conductor 50 is preferably as shown in FIG. 3(a) , parallel to the coil axis 38 of the planar coil 30 and linearly connecting the end 34 of the planar coil 30 and the external electrode 60 provided on the lower surface 12 of the base part 10 . Thereby, since the intersection of the lead conductor 50 and the coil conductor 32 is suppressed, the eddy current generated in the coil conductor 32 and the lead conductor 50 can be more effectively reduced. In addition, since the length of the lead-out conductor 50 becomes shorter, the resistance becomes smaller, and therefore the influence of eddy currents can also be suppressed in this regard.

引出導體50較佳為如圖3(a)所示,於自線圈軸38之方向俯視基體部10及平面線圈30時,與線圈導體32重疊設置。藉此,引出導體50與線圈導體32之連接穩定性變好,可與連接部分之位置偏離無關地使連接電阻一定。 The lead-out conductor 50 is preferably arranged to overlap the coil conductor 32 when the base portion 10 and the planar coil 30 are viewed from the direction of the coil axis 38 as shown in FIG. 3(a) . Thereby, the connection stability of the lead conductor 50 and the coil conductor 32 becomes better, and the connection resistance can be made constant regardless of the positional deviation of a connection part.

如圖1及圖3(a)所示,較佳為,引出導體52連接平面線圈30之端部36與設置於基體部10之下表面12之外部電極62。外部電極60及62設置於基體部10之下表面12,未設置於上表面14。藉此,可謀求線圈零件100之薄型化。外部電極60及62進而較佳為僅設置於基體部10之表面中之下表面12,於下表面12以外之面未設置。藉此,由於抑制了將線圈零件100安裝於線路基板時之焊料附著於基體部10之端面16a及16b以及側面18a及 18b,故除了線圈零件100之薄型化以外,亦可應對於高密度安裝。 As shown in FIGS. 1 and 3(a) , it is preferable that the lead-out conductor 52 connects the end portion 36 of the planar coil 30 and the external electrode 62 provided on the lower surface 12 of the base portion 10 . The external electrodes 60 and 62 are provided on the lower surface 12 of the base portion 10 and are not provided on the upper surface 14 . Thereby, the coil component 100 can be made thinner. It is further preferred that the external electrodes 60 and 62 are provided only on the lower surface 12 among the surfaces of the base portion 10 and are not provided on surfaces other than the lower surface 12 . This prevents solder from adhering to the end surfaces 16a and 16b and the side surfaces 18a and 18a of the base portion 10 when the coil component 100 is mounted on the circuit board. 18b, so in addition to thinning the coil component 100, it can also cope with high-density mounting.

如圖2(b)所示,引出導體50及52之與線圈軸38垂直之方向之剖面形狀較佳為圓形形狀。藉此,即便引出導體50及52之形成位置根據線圈導體32之周繞程度而變化,由於將於線圈導體32中產生,且透過引出導體50及52之磁通設為大致一定,故可將引出導體50及52產生之渦電流引起之引出導體50及52內部之損失設為一定。又,較佳為,線圈導體32之寬度大於線圈導體32之周繞之導體彼此之間隔,線圈導體32之寬度大於線圈導體32之高度。藉此,自線圈導體32之周繞之導體彼此之間隔部分即線圈軸38之方向觀察,即便於與平面線圈30重疊之區域,以貫通於線圈軸38之方向之方式存在磁性材料,亦可降低於線圈導體32彼此之間產生之渦電流。 As shown in FIG. 2(b) , the cross-sectional shape of the lead conductors 50 and 52 in the direction perpendicular to the coil axis 38 is preferably circular. Accordingly, even if the formation positions of the lead conductors 50 and 52 change according to the degree of winding of the coil conductor 32, the magnetic flux generated in the coil conductor 32 and passing through the lead conductors 50 and 52 is set to be approximately constant. The losses inside the lead conductors 50 and 52 caused by the eddy current generated in the lead conductors 50 and 52 are assumed to be constant. Furthermore, preferably, the width of the coil conductor 32 is greater than the distance between the conductors surrounding the coil conductor 32 , and the width of the coil conductor 32 is greater than the height of the coil conductor 32 . Therefore, when viewed from the direction of the coil axis 38 , which is the spaced-apart portion of the conductors surrounding the coil conductor 32 , even in the area overlapping the planar coil 30 , magnetic material may exist penetrating in the direction of the coil axis 38 . The eddy current generated between the coil conductors 32 is reduced.

如圖2(b)所示,外部電極60與外部電極62較佳對於基體部10之下表面12之中心線20及/或中心22為對稱而設置。藉此,可將線圈零件100均衡良好地安裝於電路基板等。又,外部電極60與外部電極62之間之距離基於抑制短路及製造容易性等之方面而言,較佳為例如100μm以上之情況,更佳為150μm以上之情況,進而更佳為200μm以上之情況。 As shown in FIG. 2(b) , the external electrodes 60 and 62 are preferably arranged symmetrically with respect to the center line 20 and/or the center 22 of the lower surface 12 of the base portion 10 . Thereby, the coil component 100 can be mounted on a circuit board or the like in a well-balanced manner. In addition, the distance between the external electrode 60 and the external electrode 62 is preferably, for example, 100 μm or more, more preferably 150 μm or more, and still more preferably 200 μm or more, from the viewpoint of short circuit suppression, ease of manufacturing, etc. condition.

圖6(a)至圖6(c)係自實施例1之變化例1至變化例3之線圈零件之剖視圖。如圖6(a)所示,於實施例1之變化例1之線圈零件110中,外部電極60及62係自基體部10之下表面12延伸至端面16a及16b。其他構成由於與實施例1相同,故省略說明。如實施例1之變化例1,藉由外部電極60及62延 伸至基體部10之端面16a及16b,於將線圈零件110焊接接合於線路基板時,於設置於基體部10之端面16a及16b之外部電極60及62形成焊料片。因此,可提高線圈零件110與電路基板之接合強度。 6(a) to 6(c) are cross-sectional views of coil components from Modification 1 to Modification 3 of Embodiment 1. As shown in FIG. 6(a) , in the coil component 110 of Modification 1 of Embodiment 1, the external electrodes 60 and 62 extend from the lower surface 12 of the base part 10 to the end surfaces 16a and 16b. Since other configurations are the same as those in Embodiment 1, description is omitted. As in Modification 1 of Embodiment 1, by extending the external electrodes 60 and 62 Extending to the end surfaces 16a and 16b of the base part 10, when the coil component 110 is soldered to the circuit board, solder pieces are formed on the external electrodes 60 and 62 provided on the end surfaces 16a and 16b of the base part 10. Therefore, the bonding strength between the coil component 110 and the circuit board can be improved.

如圖6(b)所示,於實施例1之變化例2之線圈零件120中,引出導體50自平面線圈30之端部34導出至基體部10之下表面12,於下表面12與外部電極60連接。引出導體52自平面線圈30之端部36導出至基體部10之上表面14,於上表面14與外部電極62連接。外部電極60自基體部10之下表面12經由端面16a延伸至上表面14,且外部電極62自基體部10之下表面12經由端面16b延伸至上表面14。即,外部電極60及62成為3面電極。另,外部電極60及62亦可為延伸至側面18a及18b之5面電極。又,引出導體52亦可自平面線圈30之端部36延伸至基體部10之下表面12,且於下表面12與外部電極62連接。其他構成由於與實施例1相同,故省略說明。 As shown in FIG. 6(b) , in the coil component 120 of Modification 2 of Embodiment 1, the lead conductor 50 is led out from the end 34 of the planar coil 30 to the lower surface 12 of the base part 10, between the lower surface 12 and the outside. Electrode 60 is connected. The lead-out conductor 52 is led out from the end 36 of the planar coil 30 to the upper surface 14 of the base portion 10 and is connected to the external electrode 62 on the upper surface 14 . The external electrode 60 extends from the lower surface 12 of the base portion 10 to the upper surface 14 via the end surface 16 a, and the external electrode 62 extends from the lower surface 12 of the base portion 10 to the upper surface 14 via the end surface 16 b. That is, the external electrodes 60 and 62 become three-surface electrodes. In addition, the external electrodes 60 and 62 may also be five-sided electrodes extending to the side surfaces 18a and 18b. In addition, the lead-out conductor 52 may also extend from the end 36 of the planar coil 30 to the lower surface 12 of the base part 10 and be connected to the external electrode 62 on the lower surface 12 . Since other configurations are the same as those in Embodiment 1, description is omitted.

根據實施例1之變化例2,連接於引出導體50之外部電極60自基體部10之下表面12經由端面16a延伸至上表面14而設置。連接於引出導體52之外部電極62自基體部10之下表面12經由端面16b延伸至上表面14而設置。藉此,可將基體部10之下表面12及上表面14兩者作為安裝面使用。 According to Modification 2 of Embodiment 1, the external electrode 60 connected to the lead-out conductor 50 is provided extending from the lower surface 12 of the base portion 10 to the upper surface 14 via the end surface 16 a. The external electrode 62 connected to the lead-out conductor 52 is provided extending from the lower surface 12 of the base portion 10 to the upper surface 14 via the end surface 16 b. Thereby, both the lower surface 12 and the upper surface 14 of the base portion 10 can be used as mounting surfaces.

如圖6(c)所示,於實施例1之變化例3之線圈零件130中,於平面線圈30之端部34除連接有引出導體50還連接有引出導體54。引出導體54於自線圈軸38之方向俯視時,僅位於區域42(參照圖2(a))之內部,連接平面線圈30之端部34與設置於基體部10之上表面14之外部電極64。於平面線圈 30之端部36除連接有引出導體52以外還連接有引出導體56。引出導體56連接平面線圈30之端部36與設置於基體部10之上表面14之外部電極66。由於其他構成與第1實施例相同,故省略說明。 As shown in FIG. 6(c) , in the coil component 130 of Modification 3 of Embodiment 1, a lead conductor 54 is connected to the end 34 of the planar coil 30 in addition to the lead conductor 50 . The lead conductor 54 is located only inside the area 42 (see FIG. 2(a) ) when viewed from the direction of the coil axis 38 , and connects the end 34 of the planar coil 30 and the external electrode 64 provided on the upper surface 14 of the base portion 10 . for planar coils In addition to the lead-out conductor 52, the end 36 of the end 30 is also connected to a lead-out conductor 56. The lead-out conductor 56 connects the end portion 36 of the planar coil 30 and the external electrode 66 provided on the upper surface 14 of the base portion 10 . Since other configurations are the same as those of the first embodiment, description is omitted.

根據實施例1之變化例3,於平面線圈30之端部34連接有引出導體50與引出導體54,且於端部36連接有引出導體52與引出導體56。於自平面線圈30之線圈軸38之方向俯視基體部10及平面線圈30時,引出導體50於較平面線圈30更內側之區域42與設置於基體部10之下表面12之外部電極60連接,引出導體54於內側之區域42與設置於基體部10之上表面14之外部電極64連接。又,引出導體52與設置於基體部10之下表面12之外部電極62連接,引出導體56與設置於基體部10之上表面14之外部電極66連接。藉此,可將基體部10之下表面12及上表面14兩者作為安裝面使用。 According to Modification 3 of Embodiment 1, the lead-out conductor 50 and the lead-out conductor 54 are connected to the end portion 34 of the planar coil 30 , and the lead-out conductor 52 and the lead-out conductor 56 are connected to the end portion 36 . When the base portion 10 and the planar coil 30 are viewed from the direction of the coil axis 38 of the planar coil 30, the lead conductor 50 is connected to the external electrode 60 provided on the lower surface 12 of the base portion 10 in the region 42 further inside than the planar coil 30. The inner region 42 of the lead-out conductor 54 is connected to the external electrode 64 provided on the upper surface 14 of the base portion 10 . Furthermore, the lead conductor 52 is connected to the external electrode 62 provided on the lower surface 12 of the base part 10 , and the lead conductor 56 is connected to the external electrode 66 provided on the upper surface 14 of the base part 10 . Thereby, both the lower surface 12 and the upper surface 14 of the base portion 10 can be used as mounting surfaces.

外部電極60、62、64及66較佳為設置於基體部10之下表面12與上表面14,於下表面12及上表面14以外之面未設置。藉此,由於與於實施例1中說明之理由相同,故可應對於高密度安裝。另,於實施例1之變化例3中,亦與實施例1之變化例2同樣,設置於基體部10之表面之外部電極亦可為3面電極或5面電極。即,設置於基體部10之下表面12之外部電極60與設置於上表面14之外部電極64於端面16a連接,設置於基體部10之下表面12之外部電極62與設置於上表面14之外部電極66亦可於端面16b連接。 The external electrodes 60, 62, 64 and 66 are preferably provided on the lower surface 12 and the upper surface 14 of the base portion 10, and are not provided on surfaces other than the lower surface 12 and the upper surface 14. This makes it possible to cope with high-density mounting for the same reason as described in Embodiment 1. In addition, in Modification 3 of Embodiment 1, similarly to Modification 2 of Embodiment 1, the external electrodes provided on the surface of the base portion 10 may be three-surface electrodes or five-surface electrodes. That is, the external electrode 60 provided on the lower surface 12 of the base part 10 and the external electrode 64 provided on the upper surface 14 are connected at the end surface 16 a, and the external electrode 62 provided on the lower surface 12 of the base part 10 is connected to the external electrode 64 provided on the upper surface 14 The external electrode 66 may also be connected to the end surface 16b.

[實施例2] [Example 2]

圖7係實施例2之線圈零件之剖視圖。如圖7所示,於實施例2之線圈 零件200中,於基體部10中內置有於主面上形成有線圈導體32之基板80。其他構成由於與實施例1相同,故省略說明。實施例2之線圈零件200藉由例如以下之方法製造。首先,於玻璃基板等之絕緣性基板即基板80之主面上,例如使用鍍覆法形成線圈導體32。且,於形成有線圈導體32之基板80之兩主面,藉由例如層壓法或均壓法,形成基體部10。藉此,獲得內置具有線圈導體32之基板80之基體部10。且,於基體部10之下表面12藉由例如雷射加工或蝕刻等形成使平面線圈30之兩端部34及36露出之孔後,於該孔藉由例如印刷法等埋入導電性材料而形成引出導體50及52。其後,於基體部10之下表面12形成外部電極60及62。 Figure 7 is a cross-sectional view of the coil component of Embodiment 2. As shown in Figure 7, the coil in Example 2 In the component 200, a substrate 80 with a coil conductor 32 formed on the main surface is built into the base portion 10. Since other configurations are the same as those in Embodiment 1, description is omitted. The coil component 200 of Example 2 is manufactured by, for example, the following method. First, the coil conductor 32 is formed on the main surface of the substrate 80 which is an insulating substrate such as a glass substrate, using a plating method, for example. Furthermore, the base portion 10 is formed on both main surfaces of the substrate 80 on which the coil conductor 32 is formed, for example, by a lamination method or a voltage equalizing method. Thereby, the base portion 10 in which the substrate 80 having the coil conductor 32 is built is obtained. Furthermore, after a hole is formed in the lower surface 12 of the base part 10 by, for example, laser processing or etching to expose both ends 34 and 36 of the planar coil 30, a conductive material is buried in the hole by, for example, printing. Thus, lead conductors 50 and 52 are formed. Thereafter, external electrodes 60 and 62 are formed on the lower surface 12 of the base portion 10 .

如實施例2之線圈零件200般,亦可為於基體部10內置於主面上形成線圈導體32之基板80之情形。於該情形時,因於線圈導體32之上表面存在基板80,故遍及平面線圈30之上表面全面不存在磁性材料。即,自線圈軸38之方向觀察,不存在如貫通與平面線圈30重疊之區域般之磁性材料。因此,可有效地抑制於線圈導體32產生渦電流。 Like the coil component 200 of Embodiment 2, the substrate 80 with the coil conductor 32 formed on the main surface may be incorporated in the base portion 10 . In this case, since the substrate 80 exists on the upper surface of the coil conductor 32, there is no magnetic material on the entire upper surface of the planar coil 30. That is, when viewed from the direction of the coil axis 38 , there is no magnetic material penetrating the area overlapping the planar coil 30 . Therefore, the generation of eddy current in the coil conductor 32 can be effectively suppressed.

[實施例3] [Example 3]

圖8係實施例3之線圈零件之剖視圖。如圖8所示,於實施例3之線圈零件300中,線圈導體32由附被覆膜之導線所成,剖面形狀為圓形形狀。引出導體50及52係藉由將形成線圈導體32之導線成形加工(彎曲加工)而形成。即,線圈導體32與引出導體50及52係直徑及剖面形狀相同。其他構成由於與實施例1相同,故省略說明。實施例3之線圈零件300藉由例如以下之方法製造。首先,使附被覆膜之導線周繞形成線圈導體32,且將周繞 之導線之兩端部側進行成形加工(彎曲加工)作成引出導體50及52。且,藉由例如層壓法或均壓法,形成內置有線圈導體32以及引出導體50及52之基體部10。此時,使引出導體50及52之端面自基體部10之下表面12露出。其後,於基體部10之下表面12形成外部電極60及62。 Figure 8 is a cross-sectional view of the coil component of Embodiment 3. As shown in FIG. 8 , in the coil component 300 of the third embodiment, the coil conductor 32 is made of a coated wire and has a circular cross-sectional shape. The lead conductors 50 and 52 are formed by shaping (bending) the wire forming the coil conductor 32 . That is, the coil conductor 32 and the lead conductors 50 and 52 have the same diameter and cross-sectional shape. Since other configurations are the same as those in Embodiment 1, description is omitted. The coil component 300 of Example 3 is manufactured by, for example, the following method. First, the coated wire is wound to form the coil conductor 32, and the wound conductor 32 is The lead conductors 50 and 52 are formed by performing forming processing (bending processing) on both end sides of the conductor. Then, the base portion 10 in which the coil conductor 32 and the lead-out conductors 50 and 52 are built is formed by, for example, a lamination method or a voltage equalizing method. At this time, the end surfaces of the lead-out conductors 50 and 52 are exposed from the lower surface 12 of the base part 10 . Thereafter, external electrodes 60 and 62 are formed on the lower surface 12 of the base portion 10 .

亦可如實施例3之線圈零件300般,可為將形成線圈導體32之導線進行成形加工而形成引出導體50及52之情形。於該情形時,於線圈導體32之間不存在磁性材料。即,於與線圈軸38之方向垂直之剖面上,於平面線圈30之周繞導體間不存在於與線圈軸38平行之方向貫通之磁性材料。因此,可有效地抑制於線圈導體32產生渦電流。另,導線並不限定於剖面形成為圓形形狀之圓線,亦可為剖面形狀為矩形形狀之平角線。 Like the coil component 300 of Embodiment 3, the lead conductors 50 and 52 may be formed by forming the wires forming the coil conductor 32 . In this case, there is no magnetic material between coil conductors 32 . That is, in a cross section perpendicular to the direction of the coil axis 38 , there is no magnetic material penetrating between the surrounding conductors of the planar coil 30 in a direction parallel to the coil axis 38 . Therefore, the generation of eddy current in the coil conductor 32 can be effectively suppressed. In addition, the conductive wire is not limited to a round wire having a circular cross-section, but may also be a rectangular wire having a rectangular cross-section.

[實施例4] [Example 4]

圖9係實施例4之線圈零件之剖視圖。如圖9所示,於實施例4之線圈零件400中,引出導體50及52之端部自基體部10之下表面12突出。引出導體50及52之自基體部10之下表面12之突出量例如為5μm至20μm左右。外部電極60覆蓋自基體部10之下表面12突出之引出導體50之端部而形成,藉此,形成圓頂狀隆起之突起68。即,外部電極60具有對於基體部10之下表面12大致平行之面65與以該大致平行之面65為基準於對於基體部10之下表面12於相反側隆起之圓頂狀之突起68。同樣地,外部電極62覆蓋自基體部10之下表面12突起之引出導體52之端部而形成,藉此,形成圓頂狀隆起之突起70。即,外部電極62具有對於基體部10之下表面12大致平行之面67與以該大致平行之面67為基準對於基體部10之下表面12 於相反側隆起之圓頂狀之突起70。另,此處言及之大致平行之面並不限定於嚴密意義上平行之情形,亦可包含製造誤差程度之微傾等。又,圓頂狀之突起係指於突起之外周側部分突起之高度較低,越靠近突起之中央部突起之高度越高之形狀之突起。其他構成由於與實施例1相同,故省略說明。 Figure 9 is a cross-sectional view of the coil component of Embodiment 4. As shown in FIG. 9 , in the coil component 400 of the fourth embodiment, the ends of the lead conductors 50 and 52 protrude from the lower surface 12 of the base part 10 . The amount of protrusion of the lead-out conductors 50 and 52 from the lower surface 12 of the base part 10 is, for example, about 5 μm to 20 μm. The external electrode 60 is formed to cover the end portion of the lead conductor 50 protruding from the lower surface 12 of the base portion 10, thereby forming a dome-shaped protrusion 68. That is, the external electrode 60 has a surface 65 that is substantially parallel to the lower surface 12 of the base portion 10 and a dome-shaped protrusion 68 that bulges on the opposite side to the lower surface 12 of the base portion 10 based on the substantially parallel surface 65 . Similarly, the external electrode 62 is formed to cover the end portion of the lead conductor 52 protruding from the lower surface 12 of the base portion 10, thereby forming a dome-shaped protrusion 70. That is, the external electrode 62 has a surface 67 that is substantially parallel to the lower surface 12 of the base portion 10 and is substantially parallel to the lower surface 12 of the base portion 10 based on the substantially parallel surface 67 . A dome-shaped protrusion 70 raised on the opposite side. In addition, the substantially parallel surfaces mentioned here are not limited to those that are parallel in a strict sense, and may also include slight inclination to the extent of manufacturing error. In addition, the dome-shaped protrusion refers to a protrusion in a shape in which the height of the protrusion is lower at the outer peripheral portion of the protrusion, and the height of the protrusion becomes higher closer to the central portion of the protrusion. Since other configurations are the same as those in Embodiment 1, description is omitted.

實施例4之線圈零件400可使用與例如實施例1中說明之製造方法同樣之方法形成。此時,藉由使用與於基體部10之形成所用之絕緣性材料相比燒成之收縮量較小之材料作為引出導體50及52之形成所用之導電性材料,可獲得引出導體50及52之端部自基體部10之下表面12突出之構造。 The coil component 400 of Embodiment 4 can be formed using the same manufacturing method as described in Embodiment 1, for example. At this time, by using a material that has a smaller amount of shrinkage during firing than the insulating material used to form the base portion 10 as the conductive material used to form the lead conductors 50 and 52, the lead conductors 50 and 52 can be obtained. The end portion protrudes from the lower surface 12 of the base portion 10 .

根據實施例4,引出導體50及52之端部自基體部10之下表面12突出。外部電極60及62係藉由覆蓋自基體部10之下表面12突出之引出導體50及52之端部而形成圓頂狀之突起68及70。藉此,於為了將外部電極60及62安裝於電路基板而按壓至設置於電路基板之焊料之情形時,突起68及70咬入焊料中。因此,即便於將例如拾取裝置真空破壞而使之上昇時之振動及將電路基板搬送至熔融爐時之振動等施加於線圈零件400之情形時,仍可抑制線圈零件400自特定位置偏離。 According to Embodiment 4, the ends of the lead-out conductors 50 and 52 protrude from the lower surface 12 of the base portion 10 . The external electrodes 60 and 62 form dome-shaped protrusions 68 and 70 by covering the end portions of the lead conductors 50 and 52 protruding from the lower surface 12 of the base portion 10 . Thereby, when the external electrodes 60 and 62 are pressed against the solder provided on the circuit board in order to mount the external electrodes 60 and 62 on the circuit board, the protrusions 68 and 70 bite into the solder. Therefore, even when the coil component 400 is subjected to situations such as vibration when the pick-up device is lifted by vacuum breaking or vibration when the circuit board is transported to the melting furnace, the coil component 400 can be suppressed from being displaced from a specific position.

[實施例5] [Example 5]

圖10係實施例5之電子機器之剖視圖。如圖10所示,實施例5之電子機器500包含電路基板90與安裝於電路基板90之實施例1之線圈零件100。線圈零件100藉由外部電極60及62利用焊料94接合於電路基板90之焊盤圖 案92,而安裝於電路基板90。 Fig. 10 is a cross-sectional view of the electronic device of Embodiment 5. As shown in FIG. 10 , the electronic device 500 of the fifth embodiment includes a circuit substrate 90 and the coil component 100 of the first embodiment mounted on the circuit substrate 90 . Pad diagram of coil component 100 bonded to circuit board 90 via external electrodes 60 and 62 using solder 94 case 92, and is mounted on the circuit substrate 90.

另,於實施例5中,雖例示實施例1之線圈零件100安裝於電路基板90之情形,但亦可為實施例1之變化例1至實施例4之線圈零件安裝於電路基板90之情形。例如,藉由實施例4之線圈零件400安裝於電路基板90,如實施例4所說明,抑制了於將線圈零件400安裝於電路基板90時之位置偏移不良。又,線圈零件亦可組入於電路基板90之內部,且於任一情形均可薄型化。 In addition, in Embodiment 5, although the coil component 100 of Embodiment 1 is mounted on the circuit board 90, it may also be a case where the coil components of Modification 1 to 4 of Embodiment 1 are mounted on the circuit board 90. . For example, by mounting the coil component 400 on the circuit board 90 in Embodiment 4, as described in Embodiment 4, positional misalignment when the coil component 400 is mounted on the circuit board 90 is suppressed. In addition, the coil components can also be incorporated into the circuit board 90, and in any case, the thickness can be reduced.

以上針對本發明之實施例進行了詳述,但本發明不限於該特定實施例,在申請專利範圍所記載之本發明之主旨範圍內可進行各種變形/變更。 The embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments, and various modifications/changes are possible within the scope of the gist of the present invention described in the patent claims.

10‧‧‧基體部 10‧‧‧Base part

12‧‧‧下表面 12‧‧‧Lower surface

14‧‧‧上表面 14‧‧‧Upper surface

16a、16b‧‧‧端面 16a, 16b‧‧‧End face

18a、18b‧‧‧側面 18a, 18b‧‧‧Side

30‧‧‧平面線圈 30‧‧‧Planar coil

32‧‧‧線圈導體 32‧‧‧Coil conductor

34‧‧‧端部 34‧‧‧End

36‧‧‧端部 36‧‧‧End

50、52‧‧‧引出導體 50, 52‧‧‧lead conductor

60、62‧‧‧外部電極 60, 62‧‧‧External electrode

100‧‧‧線圈零件 100‧‧‧Coil parts

Claims (13)

一種線圈零件,其包含:基體部,其包含磁性材料,且具有絕緣性;平面線圈,其內置於上述基體部,由線圈導體周繞形成,一側之第1端部位於上述周繞之內側,另一側之第2端部位於上述周繞之外側;第1引出導體,其連接於上述平面線圈之上述第1端部;第2引出導體,其連接於上述平面線圈之上述第2端部;第1外部電極,其於上述基體部之一端,設置於上述基體部之表面,連接於上述第1引出導體;及第2外部電極,其於與上述基體部之上述一端相反之另一端,設置於上述基體部之表面,連接於上述第2引出導體;且上述第1引出導體於自上述平面線圈之線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更內側之區域與上述第1外部電極連接,上述第1外部電極與上述第2外部電極設置為:相對於中心線對稱,或相對於上述中心線之中心點對稱,上述中心線係規定上述基體部之上述一端與上述另一端之間的中間點,上述平面線圈其自上述線圈軸向觀察時之上述平面線圈之外周具有:以上述平面線圈之長軸之長度L1與短軸之長度L2之比所規定之形狀,上述基體部其自上述線圈軸向觀察時之上述基體部之外周具有:以上述基體部之長邊方向之長度L3與短邊方向之長度L4之比所規定之形狀,且相對於長度L1之長度L2之比率(L2/L1)與相對於長度L3之長度L4之比 率(L4/L3)大致相同。 A coil component, which includes: a base portion containing a magnetic material and having insulating properties; a planar coil built into the base portion and formed by winding a coil conductor, with the first end of one side located inside the winding , the second end on the other side is located outside the above-mentioned circumference; the first lead-out conductor is connected to the above-mentioned first end of the above-mentioned planar coil; the second lead-out conductor is connected to the above-mentioned second end of the above-mentioned planar coil part; a first external electrode at one end of the base part, disposed on the surface of the base part and connected to the first lead-out conductor; and a second external electrode at the other end opposite to the one end of the base part , is provided on the surface of the above-mentioned base part and is connected to the above-mentioned second lead-out conductor; and the above-mentioned first lead-out conductor is further inside than the above-mentioned planar coil when the above-mentioned base part and the above-mentioned planar coil are viewed from above in the coil axial direction of the above-mentioned planar coil. The region is connected to the first external electrode, and the first external electrode and the second external electrode are arranged symmetrically with respect to a center line, or symmetrically with respect to a center point of the center line, and the center line defines the above-mentioned position of the base portion. At the midpoint between one end and the other end, the outer circumference of the above-mentioned planar coil when viewed from the axial direction of the above-mentioned planar coil has: specified by the ratio of the length L1 of the long axis of the above-mentioned planar coil to the length L2 of the short axis The outer periphery of the base portion when viewed from the axial direction of the coil has a shape specified by the ratio of the length L3 of the base portion in the long side direction to the length L4 in the short side direction, and relative to The ratio of length L1 to length L2 (L2/L1) and the ratio of length L4 to length L3 The rates (L4/L3) are roughly the same. 一種線圈零件,其包含:基體部,其包含磁性材料,且具有絕緣性;平面線圈,其內置於上述基體部,由線圈導體周繞形成,一側之第1端部位於上述周繞之內側,另一側之第2端部位於上述周繞之外側;第1引出導體,其連接於上述平面線圈之上述第1端部;第2引出導體,其連接於上述平面線圈之上述第2端部;第1外部電極,其設置於上述基體部之表面,連接於上述第1引出導體;及第2外部電極,其設置於上述基體部之表面,連接於上述第2引出導體;且上述第1引出導體於自上述平面線圈之線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更內側之區域與上述第1外部電極連接,上述第1外部電極自上述基體部之表面中之第1面經由連接於上述第1面及與上述第1面相反側之第2面之第3面而延伸至上述第2面而設置,上述第2外部電極自上述基體部之上述第1面經由連接於上述第1面及上述第2面之第4面延伸至上述第2面而設置。 A coil component, which includes: a base portion containing a magnetic material and having insulating properties; a planar coil built into the base portion and formed by winding a coil conductor, with the first end of one side located inside the winding , the second end on the other side is located outside the above-mentioned circumference; the first lead-out conductor is connected to the above-mentioned first end of the above-mentioned planar coil; the second lead-out conductor is connected to the above-mentioned second end of the above-mentioned planar coil part; a first external electrode, which is provided on the surface of the above-mentioned base part and connected to the above-mentioned first lead-out conductor; and a second external electrode, which is provided on the surface of the above-mentioned base part and connected to the above-mentioned second lead-out conductor; and the above-mentioned third 1. When the base portion and the planar coil are viewed from above in the coil axial direction of the planar coil, the lead-out conductor is connected to the first external electrode in a region further inside than the planar coil. The first external electrode extends from the surface of the base portion. The first surface is provided extending to the second surface via a third surface connected to the first surface and the second surface opposite to the first surface, and the second external electrode is formed from the third surface of the base portion. The 1st surface is provided extending to the 2nd surface via the 4th surface connected to the 1st surface and the 2nd surface. 一種線圈零件,其包含:基體部,其包含磁性材料,且具有絕緣性;平面線圈,其內置於上述基體部,由線圈導體周繞形成,一側之第1 端部位於上述周繞之內側,另一側之第2端部位於上述周繞之外側;第1引出導體,其連接於上述平面線圈之上述第1端部;第2引出導體,其連接於上述平面線圈之上述第2端部;第3引出導體,其連接於上述平面線圈之上述第1端部;第4引出導體,其連接於上述平面線圈之上述第2端部;第1外部電極,其設置於上述基體部之表面,連接於上述第1引出導體;及第2外部電極,其設置於上述基體部之表面,連接於上述第2引出導體;第3外部電極,其設置於上述基體部之表面,且連接於上述第3引出導體;及第4外部電極,其設置於上述基體部之表面,且連接於上述第4引出導體;且上述第1引出導體於自上述平面線圈之線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更內側之區域,與設置於上述基體部之表面中之第1面之上述第1外部電極連接,上述第2引出導體與設置於上述基體部之上述第1面之上述第2外部電極連接,上述第3引出導體於自上述線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更於上述內側之區域,與設置於上述基體部之與上述第1面相反側之第2面之上述第3外部電極連接,上述第4引出導體與設置於上述基體部之上述第2面之上述第4外部電極連接。 A coil component, which includes: a base part that contains a magnetic material and has insulating properties; a planar coil that is built into the base part and is formed by winding a coil conductor. One end is located inside the above-mentioned winding, and the second end on the other side is located outside the above-mentioned winding; the first lead-out conductor is connected to the above-mentioned first end of the above-mentioned planar coil; the second lead-out conductor is connected to the second end of the planar coil; a third lead conductor connected to the first end of the planar coil; a fourth lead conductor connected to the second end of the planar coil; a first external electrode , which is provided on the surface of the above-mentioned base part and is connected to the above-mentioned first lead-out conductor; and a second external electrode which is provided on the surface of the above-mentioned base part and is connected to the above-mentioned second lead-out conductor; a third external electrode which is provided on the above-mentioned lead-out conductor The surface of the base part and connected to the above-mentioned third lead-out conductor; and the fourth external electrode, which is provided on the surface of the above-mentioned base part and connected to the above-mentioned fourth lead-out conductor; and the above-mentioned first lead-out conductor is connected from the above-mentioned planar coil When the base portion and the planar coil are viewed from above in the axial direction of the coil, the first external electrode is connected to the first external electrode provided on the first surface of the surface of the base portion in a region further inside than the planar coil, and the second lead-out conductor is connected to The second external electrode provided on the first surface of the base part is connected to the third lead-out conductor in a region further inside than the planar coil when the base part and the planar coil are viewed from above in the axial direction of the coil. , is connected to the third external electrode provided on the second surface of the base part opposite to the first surface, and the fourth lead-out conductor is connected to the fourth external electrode provided on the second surface of the base part . 如請求項3之線圈零件,其中上述第1外部電極與上述第3外部電極於上述基體部之連接於上述第1面及上述第2面的第3面上連接,上述第2外部電極與上述第4外部電極於上述基體部之連接於上述第1面及上述第2面的第4面上連接。 The coil component of claim 3, wherein the first external electrode and the third external electrode are connected to a third surface of the base portion on the first surface and the second surface, and the second external electrode is connected to the third surface of the base portion. The fourth external electrode is connected to a fourth surface of the base portion that is connected to the first surface and the second surface. 一種線圈零件,其包含:基體部,其包含磁性材料,且具有絕緣性;平面線圈,其內置於上述基體部,由線圈導體周繞形成,一側之第1端部位於上述周繞之內側,另一側之第2端部位於上述周繞之外側;第1引出導體,其連接於上述平面線圈之上述第1端部;第2引出導體,其連接於上述平面線圈之上述第2端部;第1外部電極,其設置於上述基體部之表面,連接於上述第1引出導體;及第2外部電極,其設置於上述基體部之表面,連接於上述第2引出導體;且上述第1引出導體於自上述平面線圈之線圈軸向俯視上述基體部及上述平面線圈時,於較上述平面線圈更內側之區域,與設置於上述基體部之表面中之第1面之上述第1外部電極連接,上述第2引出導體與設置於上述基體部之上述第1面之上述第2外部電極連接,上述第1引出導體及上述第2引出導體之端部自上述基體部之上述第1面突出, 上述第1外部電極及上述第2外部電極藉由覆蓋上述第1引出導體及上述第2引出導體之上述端部形成圓頂狀之突起。 A coil component, which includes: a base portion containing a magnetic material and having insulating properties; a planar coil built into the base portion and formed by winding a coil conductor, with the first end of one side located inside the winding , the second end on the other side is located outside the above-mentioned circumference; the first lead-out conductor is connected to the above-mentioned first end of the above-mentioned planar coil; the second lead-out conductor is connected to the above-mentioned second end of the above-mentioned planar coil part; a first external electrode, which is provided on the surface of the above-mentioned base part and connected to the above-mentioned first lead-out conductor; and a second external electrode, which is provided on the surface of the above-mentioned base part and connected to the above-mentioned second lead-out conductor; and the above-mentioned third 1. When the above-mentioned base part and the above-mentioned planar coil are viewed from the coil axial direction of the above-mentioned planar coil, the lead-out conductor is in a region further inside than the above-mentioned planar coil and the above-mentioned first outer part provided on the first surface of the surface of the above-mentioned base part Electrode connection, the above-mentioned second lead-out conductor is connected to the above-mentioned second external electrode provided on the above-mentioned first surface of the above-mentioned base part, and the ends of the above-mentioned first lead-out conductor and the above-mentioned second lead-out conductor are from the above-mentioned first surface of the above-mentioned base part protrude, The first external electrode and the second external electrode form dome-shaped protrusions by covering the end portions of the first lead-out conductor and the second lead-out conductor. 如請求項1至5中任一項之線圈零件,其中上述第1引出導體自上述平面線圈之上述第1端部直線狀連接於上述第1外部電極。 The coil component according to any one of claims 1 to 5, wherein the first lead-out conductor is linearly connected to the first external electrode from the first end of the planar coil. 如請求項6之線圈零件,其中上述第1引出導體與上述線圈軸平行。 The coil component of claim 6, wherein the first lead-out conductor is parallel to the axis of the coil. 如請求項7之線圈零件,其中上述第1引出導體自上述線圈軸向俯視上述基體部及上述平面線圈時,與上述線圈導體重疊設置。 The coil component according to claim 7, wherein the first lead-out conductor is arranged to overlap the coil conductor when the base portion and the planar coil are viewed from above in the axial direction of the coil. 如請求項1至5中任一項之線圈零件,其中上述第1引出導體及上述第2引出導體之與上述線圈軸垂直之方向之剖面為圓形形狀。 The coil component according to any one of claims 1 to 5, wherein the cross-sections of the first lead-out conductor and the second lead-out conductor in a direction perpendicular to the axis of the coil are circular. 如請求項1至5中任一項之線圈零件,其中上述第1引出導體與設置於上述基體部之表面中之第1面之上述第1外部電極連接,上述第2引出導體與設置於上述基體部之上述第1面之上述第2外部電極連接,上述第1外部電極及上述第2外部電極於上述基體部之與上述第1面相反之側之第2面並未設置。 The coil component according to any one of claims 1 to 5, wherein the first lead-out conductor is connected to the first external electrode provided on the first surface of the base portion, and the second lead-out conductor is connected to the first lead-out conductor provided on the first surface of the base portion. The second external electrode is connected to the first surface of the base portion, and the first external electrode and the second external electrode are not provided on the second surface of the base portion opposite to the first surface. 如請求項10之線圈零件,其中上述第1外部電極及上述第2外部電極僅設置於上述基體部之表面中之上述第1面。 The coil component according to claim 10, wherein the first external electrode and the second external electrode are provided only on the first surface among the surfaces of the base portion. 如請求項1至5中任一項之線圈零件,其中上述線圈零件之高度為0.6mm以下。 The coil component according to any one of claims 1 to 5, wherein the height of the coil component is 0.6 mm or less. 一種電子機器,其具備如請求項1至12中任一項之線圈零件,與供安裝或組入上述線圈零件之電路基板。An electronic device provided with the coil component according to any one of claims 1 to 12, and a circuit substrate for mounting or integrating the coil component.
TW108118381A 2018-05-28 2019-05-28 Coil component and electronic device TWI833757B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-101486 2018-05-28
JP2018101486A JP7198000B2 (en) 2018-05-28 2018-05-28 Coil parts and electronic equipment

Publications (2)

Publication Number Publication Date
TW202004791A TW202004791A (en) 2020-01-16
TWI833757B true TWI833757B (en) 2024-03-01

Family

ID=

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180144859A1 (en) 2016-11-24 2018-05-24 Murata Manufacturing Co., Ltd. Coil component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180144859A1 (en) 2016-11-24 2018-05-24 Murata Manufacturing Co., Ltd. Coil component

Similar Documents

Publication Publication Date Title
JP7198000B2 (en) Coil parts and electronic equipment
KR102370813B1 (en) Coil forming board and method for manufacturing the same
US8159322B2 (en) Laminated coil
TWI647720B (en) Coil part
US11189413B2 (en) Multilayer coil component and method for producing the same
JP2020053483A (en) Inductor component
US11626233B2 (en) Chip electronic component and board having the same
US11705272B2 (en) Coil component and electronic device
US11367555B2 (en) Mounting substrate
US20190088406A1 (en) Thin film chip electric component
US11443891B2 (en) Coil component and electronic device
TWI833757B (en) Coil component and electronic device
JP4506425B2 (en) Inductor parts
US11631526B2 (en) Inductor component
US11942255B2 (en) Inductor component
US20210280355A1 (en) Coil device
US11610726B2 (en) Coil device and pulse transformer
JP2021100098A (en) Inductor
JP6520480B2 (en) Coil parts
US20220108834A1 (en) Surface mount inductor
US20220108831A1 (en) Surface mount inductor
JP2023025167A (en) Inductor component
US20190180917A1 (en) Coil component and method for manufacturing the same
JP2023032074A (en) Coil component
JP2004342814A (en) Surface-mounting inductor