TWI833506B - Non-contact testing apparatus with dual-circulation - Google Patents

Non-contact testing apparatus with dual-circulation Download PDF

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TWI833506B
TWI833506B TW111148402A TW111148402A TWI833506B TW I833506 B TWI833506 B TW I833506B TW 111148402 A TW111148402 A TW 111148402A TW 111148402 A TW111148402 A TW 111148402A TW I833506 B TWI833506 B TW I833506B
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test
chamber
dual
space
circulation
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TW111148402A
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Chinese (zh)
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李文新
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翌實實業有限公司
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Abstract

The present invention provides a non-contact testing apparatus with dual-circulation, which includes a testing device, a temperature adjustment device connected to the testing device, and a gas supplying device. The testing device includes two testing chambers and a testing carrier located thereon. The temperature adjustment device includes a temperature controlling mechanism, a pipe unit, and a fan mechanism that is assembled to the pipe unit. The temperature controlling mechanism includes two chambers, a heating member, and a cooling member, the latter two of which are respectively arranged in the two chambers. The pipe unit connects the two chambers and the two testing chambers so as to form a dual-circulation space. The fan mechanism is configured to form a circulation airflow in the dual-circulation space, and the airflow has a predetermined temperature through the heating member or the cooling member. The gas supplying device is spatially communicated with the dual-circulation space, and the gas supplying device is configured to input a predetermined gas into the dual-circulation space and enables the dual-circulation space to achieve a predetermined pressure.

Description

雙循環式非接觸測試設備Dual cycle non-contact testing equipment

本發明涉及一種測試設備,尤其涉及一種雙循環式非接觸測試設備。 The present invention relates to a kind of testing equipment, in particular to a kind of double cycle non-contact testing equipment.

現有測試設備在對一待測電子元件進行測試時,需以溫控元件抵頂於所述待測電子元件,使得所述待測電子元件達到測試要求的溫度。然而,現有測試設備的接觸式測試方式已逐漸不符合電子產業日新月異的變化與需求。 When the existing testing equipment tests an electronic component to be tested, a temperature control element needs to be pressed against the electronic component to be tested so that the electronic component to be tested reaches the temperature required for testing. However, the contact testing methods of existing test equipment have gradually failed to meet the ever-changing changes and needs of the electronics industry.

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.

本發明實施例在於提供一種雙循環式非接觸測試設備,其能有效地改善現有測試設備所可能產生的缺陷。 An embodiment of the present invention provides a dual-cycle non-contact testing equipment, which can effectively improve the defects that may occur in existing testing equipment.

本發明實施例公開一種雙循環式非接觸測試設備,其包括:一機台本體;一測試裝置,其安裝於所述機台本體,並且所述測試裝置包含有:一第一測試腔體與一第二測試腔體,其皆安裝於所述機台本體;其中,所述第二測試腔體能與所述第一測試腔體沿一第一方向彼此相對地移動,以共同 封閉形成有一測試空間;及一測試載座,設置於所述第二測試腔體,並且所述測試載座用以供一待測電子元件設置;一溫度調節裝置,其安裝於所述第一測試腔體與所述第二測試腔體的至少其中之一的外側,用以連通於所述測試空間;其中,所述溫度調節裝置包含有:一溫控機構,包含有一降溫腔室、一升溫腔室、配置於所述降溫腔室內的一降溫器、及配置於所述升溫腔室內的一升溫器;其中,所述降溫器與所述升溫器能夠選擇性地擇一運作;一管路單元,連接所述降溫腔室、所述升溫腔室、及所述測試空間,以使其彼此連通而共同構成一雙循環空間;一風扇機構,安裝於所述管路單元;其中,所述風扇機構能運轉而形成有於所述雙循環空間內流動的一循環氣流,並且所述循環氣流能通過所述降溫器與所述升溫器的其中之一而具有一預設溫度;及兩個開關閥,其中一個所述開關閥位於所述風扇機構與所述降溫腔室之間,而其中一個所述開關閥位於所述風扇機構與所述升溫腔室之間;其中,兩個所述開關閥能選擇性地擇一關閉,以使所述風扇機構斷開所述降溫腔室或所述升溫腔室;以及一供氣裝置,連通於所述雙循環空間;其中,所述供氣裝置用以通入一預定氣體至所述雙循環空間、並能使所述雙循環空間達到一預設氣壓,以使設置於所述測試載座的所述待測電子元件能在所述預設氣壓與所述預設溫度的環境下進行一非接觸測試作業。 An embodiment of the present invention discloses a dual-cycle non-contact testing equipment, which includes: a machine body; a testing device installed on the machine body, and the testing device includes: a first testing cavity and A second test chamber, both of which are installed on the machine body; wherein, the second test chamber and the first test chamber can move relative to each other along a first direction to jointly It is enclosed to form a test space; and a test carrier is provided in the second test cavity, and the test carrier is used for setting an electronic component to be tested; a temperature adjustment device is installed on the first The outside of at least one of the test chamber and the second test chamber is used to communicate with the test space; wherein the temperature adjustment device includes: a temperature control mechanism including a cooling chamber, a A heating chamber, a cooler disposed in the cooling chamber, and a heater disposed in the heating chamber; wherein, the cooler and the warmer can selectively operate; a tube A pipeline unit connects the cooling chamber, the heating chamber, and the test space so that they are connected with each other to form a pair of circulation spaces; a fan mechanism is installed on the pipeline unit; wherein, The fan mechanism can operate to form a circulating airflow flowing in the double circulation space, and the circulating airflow can pass through one of the cooler and the heater to have a preset temperature; and both A switch valve, one of which is located between the fan mechanism and the cooling chamber, and one of which is located between the fan mechanism and the warming chamber; wherein, two of the switch valves are located between the fan mechanism and the heating chamber; The switch valve can selectively close one of the cooling chambers or the heating chambers so that the fan mechanism disconnects the cooling chamber or the heating chamber; and an air supply device is connected to the double circulation space; wherein, the air supply device The gas device is used to introduce a predetermined gas into the dual circulation space and enable the dual circulation space to reach a preset air pressure, so that the electronic component under test provided on the test carrier can be tested in the A non-contact test operation is performed under the environment of preset air pressure and preset temperature.

綜上所述,本發明實施例所公開的雙循環式非接觸測試設備,其通過多個裝置(如:所述測試裝置、所述溫度調節裝置、及所述供氣裝置)之間的結構搭配,以使得至少一個所述待測電子元件可以經由非接觸方式(如:所述雙循環空間具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。 To sum up, the dual-cycle non-contact testing equipment disclosed in the embodiment of the present invention uses a structure between multiple devices (such as the testing device, the temperature adjustment device, and the air supply device). Coordinated so that at least one of the electronic components to be tested can adjust test parameters (such as temperature) through a non-contact method (such as: the double circulation space has the preset air pressure and the preset temperature) .

為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對 本發明的保護範圍作任何的限制。 In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention, rather than to There is no limitation on the scope of protection of the present invention.

100:雙循環式非接觸測試設備 100:Double cycle non-contact testing equipment

1:機台本體 1:Machine body

11:軌道機構 11: Orbital mechanism

12:升降機構 12:Lifting mechanism

2:測試裝置 2:Test device

21:第一測試腔體 21: The first test chamber

211:第一容置部 211:First Accommodation Department

2111:貫孔 2111:Through hole

212:第一密合部 212:First Close Unit

213:第一強化肋條 213:The first reinforced rib

214:第一開放式隔間 214: First open compartment

22:第二測試腔體 22: Second test chamber

221:第二容置部 221:Second Accommodation Department

222:第二密合部 222:Second Close Section

2221:長形貫孔 2221: Long through hole

2222:環形溝槽 2222: Annular groove

223:第二強化肋條 223: Second reinforced rib

224:第二開放式隔間 224: Second open compartment

23:測試載座 23:Test carrier

24:均流件 24:Current balancing parts

25:氣密墊圈 25: Air sealing gasket

26:密合機構 26: Close mechanism

261:驅動器 261:drive

2611:齒型部 2611:Tooth profile part

262:鎖合件 262:Lock parts

2621:連動端部 2621: Linked end

2622:鎖合端部 2622:Locked end

263:傳動件 263: Transmission parts

3:抽氣裝置 3: Air extraction device

4:溫度調節裝置 4: Temperature adjustment device

41:溫控機構 41:Temperature control mechanism

411:降溫腔室 411: Cooling chamber

412:升溫腔室 412: Heating chamber

413:降溫器 413: Cooler

414:升溫器 414:heater

42:管路單元 42:Pipeline unit

421:分叉管 421: bifurcation tube

4211:安裝孔 4211:Mounting hole

4212:氣流孔 4212:Airflow hole

422:連接管 422:Connecting pipe

4221:外接孔 4221: External hole

423:分流管 423:Shunt tube

4231:分流孔 4231: Diversion hole

43:風扇機構 43:Fan mechanism

431:框體 431:frame

4311:拆裝孔 4311: Disassembly and assembly holes

432:馬達 432: Motor

4321:輸出軸 4321:Output shaft

433:阻隔層 433: Barrier layer

434:轉軸 434:Shaft

435:扇葉 435:Fan blade

436:隔熱聯軸器 436:Thermal insulation coupling

437:外殼 437: Shell

44:加熱燈具 44:Heating lamps

45:開關閥 45:On/off valve

5:供氣裝置 5:Air supply device

S:測試空間 S: test space

C:雙循環空間 C: Double circulation space

F:循環氣流 F: circulating air flow

D1:第一方向 D1: first direction

D2:第二方向 D2: second direction

L:預設軸線 L: Default axis

200:待測電子元件 200: Electronic components to be tested

圖1為本發明實施例的外循環式非接觸測試設備的立體示意圖。 Figure 1 is a schematic three-dimensional view of an external circulation non-contact testing device according to an embodiment of the present invention.

圖2為圖1的後續作動的立體示意圖。 FIG. 2 is a schematic three-dimensional view of the subsequent actions of FIG. 1 .

圖3為圖2的平面剖視示意圖。 FIG. 3 is a schematic cross-sectional plan view of FIG. 2 .

圖4為圖2的後續作動的立體剖視示意圖。 FIG. 4 is a schematic three-dimensional cross-sectional view of the subsequent actions of FIG. 2 .

圖5為圖4的後續作動的立體剖視示意圖。 FIG. 5 is a schematic three-dimensional cross-sectional view of the subsequent actions of FIG. 4 .

圖6為圖5的後續作動以使所述外循環式非接觸測試設備處於非接觸測試作業的立體剖視示意圖。 FIG. 6 is a schematic three-dimensional cross-sectional view of the subsequent actions of FIG. 5 to put the external circulation non-contact testing equipment into non-contact testing operation.

圖7為圖6另一視角的立體示意圖。 Figure 7 is a perspective view of Figure 6 from another perspective.

圖8為本發明實施例的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(一)。 8 is a schematic plan view (1) of the external circulation non-contact testing equipment in non-contact testing operation according to the embodiment of the present invention.

圖9為本發明實施例的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(二)。 9 is a schematic plan view (2) of the external circulation non-contact testing equipment in non-contact testing operation according to the embodiment of the present invention.

圖10為本發明實施例的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(三)。 Figure 10 is a schematic plan view (3) of the external circulation non-contact testing equipment in non-contact testing operation according to the embodiment of the present invention.

圖11為本發明實施例的所述外循環式非接觸測試設備處於非接觸測試作業的平面剖視示意圖(四)。 11 is a schematic plan view (4) of the external circulation non-contact testing equipment in non-contact testing operation according to the embodiment of the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“雙循環式非接觸測試設備”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施 行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following is a specific example to illustrate the implementation of the "dual cycle non-contact testing equipment" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The invention may be implemented through other different specific embodiments Various modifications and changes can be made to various details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

請參閱圖1至圖11所示,其為本發明的實施例。如圖1至圖7所示,本實施例公開一種雙循環式非接觸測試設備100,用以對至少一個待測電子元件200進行一非接觸測試作業。也就是說,所述雙循環式非接觸測試設備100是通過非接觸方式來對所述待測電子元件200進行測試參數(如:溫度)調整。據此,以接觸方式來調整待測電子元件之溫度的任何測試設備,其皆不同於本實施例所指的所述雙循環式非接觸測試設備100。 Please refer to FIGS. 1 to 11 , which are embodiments of the present invention. As shown in FIGS. 1 to 7 , this embodiment discloses a dual-cycle non-contact testing equipment 100 for performing a non-contact testing operation on at least one electronic component 200 to be tested. That is to say, the dual-cycle non-contact testing equipment 100 adjusts the test parameters (such as temperature) of the electronic component to be tested 200 in a non-contact manner. Accordingly, any testing equipment that uses a contact method to adjust the temperature of the electronic component under test is different from the dual-cycle non-contact testing equipment 100 referred to in this embodiment.

所述雙循環式非接觸測試設備100於本實施例中包含有一機台本體1、安裝於所述機台本體1的一測試裝置2、協助所述測試裝置2運作的一抽氣裝置3、安裝於所述測試裝置2的一溫度調節裝置4、及安裝於所述溫度調節裝置4的一供氣裝置5,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述雙循環式非接觸測試設備100也可以省略所述抽氣裝置3。 In this embodiment, the double-cycle non-contact testing equipment 100 includes a machine body 1, a testing device 2 installed on the machine body 1, and an air extraction device 3 that assists the operation of the testing device 2. A temperature adjustment device 4 is installed on the testing device 2, and an air supply device 5 is installed on the temperature adjustment device 4, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the dual-cycle non-contact testing equipment 100 may also omit the air extraction device 3 .

於本實施例中,所述測試裝置2包含有一第一測試腔體21、對應於所述第一測試腔體21的一第二測試腔體22、設置於所述第二測試腔體22的一測試載座23、安裝於所述第一測試腔體21內部的兩個均流件24、位於所述 第一測試腔體21與所述第二測試腔體22之間的一氣密墊圈25、及一密合機構26,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述雙循環式非接觸測試設備100可依據設計需求而選擇性地採用兩個所述均流件24、所述氣密墊圈25、及所述密合機構26至少其中之一、或是以其他構件取代。 In this embodiment, the test device 2 includes a first test chamber 21, a second test chamber 22 corresponding to the first test chamber 21, and a second test chamber 22 provided in the second test chamber 22. A test carrier 23 and two flow equalizers 24 installed inside the first test chamber 21 are located in the An airtight gasket 25 and a sealing mechanism 26 are provided between the first test chamber 21 and the second test chamber 22, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the dual-circulation non-contact testing equipment 100 can selectively use two of the flow equalizers 24 and the air-tight gasket 25 according to design requirements. , and at least one of the close-fitting mechanisms 26, or be replaced by other components.

如圖1至圖4所示,所述第一測試腔體21與所述第二測試腔體22皆安裝於所述機台本體1,以使所述第二測試腔體22能與所述第一測試腔體21沿一第一方向D1(如:鉛錘方向)彼此相對地移動,以共同封閉形成有一測試空間S。需說明的是,所述第一測試腔體21與所述第二測試腔體22的具體結構可依設計需求而加以調整變化,所以下述僅說明其中一種可行的態樣。 As shown in Figures 1 to 4, the first test chamber 21 and the second test chamber 22 are both installed on the machine body 1, so that the second test chamber 22 can be connected with the The first test chambers 21 move relative to each other along a first direction D1 (such as the plumb bob direction) to jointly close a test space S. It should be noted that the specific structures of the first test chamber 21 and the second test chamber 22 can be adjusted and changed according to design requirements, so the following only describes one of the feasible aspects.

所述第一測試腔體21包含有一第一容置部211、相連於所述第一容置部211周緣的一第一密合部212、及形成於所述第一容置部211外表面與所述第一密合部212外表面的多個第一強化肋條213。於本實施例中,所述第一容置部211大致呈矩形槽且於其兩側部位分別形成有連通於所述測試空間S的兩個貫孔2111(如:圖8),而兩個所述均流件24的位置分別對應於兩個所述貫孔2111,所述第一密合部212相連於所述第一容置部211的槽口而呈矩形環狀。 The first test cavity 21 includes a first accommodating part 211, a first sealing part 212 connected to the periphery of the first accommodating part 211, and a first sealing part 212 formed on the outer surface of the first accommodating part 211. A plurality of first reinforcing ribs 213 are formed on the outer surface of the first sealing portion 212 . In this embodiment, the first accommodating part 211 is generally in the shape of a rectangular groove and two through holes 2111 connected to the test space S are respectively formed on both sides of the first accommodating part 211 (eg, Figure 8), and two The positions of the flow equalizing members 24 correspond to the two through holes 2111 respectively. The first sealing portion 212 is connected to the notch of the first accommodating portion 211 and is in a rectangular ring shape.

再者,所述第一容置部211、所述第一密合部212、及多個所述第一強化肋條213共同形成有多個第一開放式隔間214。其中,多個所述第一開放式隔間214之中的四個分別位於所述第一測試腔體21的多個角落,並且所述第一測試腔體21以四個所述第一開放式隔間214安裝固定於所述機台本體1(也就是,所述第一測試腔體21於本實施例中不會相對於所述機台本體1移動),而兩個所述貫孔2111(如:圖8)則是分別連通於多個所述第一開放式隔間214之中的另外兩個。 Furthermore, the first accommodating part 211 , the first sealing part 212 , and the plurality of first reinforcing ribs 213 jointly form a plurality of first open compartments 214 . Wherein, four of the plurality of first open compartments 214 are respectively located at multiple corners of the first test chamber 21 , and the first test chamber 21 has four first open compartments 214 . The type compartment 214 is installed and fixed on the machine body 1 (that is, the first test chamber 21 will not move relative to the machine body 1 in this embodiment), and the two through holes 2111 (eg, Figure 8) are respectively connected to the other two of the plurality of first open compartments 214.

所述第二測試腔體22包含有一第二容置部221、相連於所述第二容置部221周緣的一第二密合部222、及形成於所述第二容置部221外表面與所述第二密合部222外表面的多個第二強化肋條223。於本實施例中,所述第二容置部221大致呈矩形體,而所述測試載座23設置於所述第二容置部221,用以供至少一個所述待測電子元件200設置與進行電性測試;所述第二密合部222則是呈矩形環狀並形成有多個長形貫孔2221,並且所述第二密合部222形成有位於所述測試載座23與多個所述長形貫孔2221之間的一環形溝槽2222,以使所述氣密墊圈25嵌於所述環形溝槽2222內。 The second test cavity 22 includes a second accommodating part 221, a second sealing part 222 connected to the periphery of the second accommodating part 221, and a second accommodating part 221 formed on the outer surface of the second accommodating part 221. A plurality of second reinforcing ribs 223 are formed on the outer surface of the second sealing portion 222 . In this embodiment, the second accommodating part 221 is generally rectangular, and the test carrier 23 is provided in the second accommodating part 221 for at least one of the electronic components to be tested 200 to be placed. and perform electrical testing; the second sealing portion 222 is in a rectangular ring shape and is formed with a plurality of elongated through holes 2221, and the second sealing portion 222 is formed between the test carrier 23 and An annular groove 2222 is formed between the elongated through holes 2221 so that the airtight gasket 25 is embedded in the annular groove 2222.

再者,所述第二密合部222沿所述第一方向D1面向於所述第一密合部212,而所述氣密墊圈25位於所述第一密合部212與所述第二密合部222之間,並且多個所述第二強化肋條223的位置大致沿所述第一方向D1分別對應於多個所述第一強化肋條213。其中,所述第二容置部221、所述第二密合部222、及多個所述第二強化肋條223共同形成有多個第二開放式隔間224,並且多個所述第二開放式隔間224沿所述第一方向D1分別對應於多個所述第一開放式隔間214,而每個所述長形貫孔2221則是連通於一個所述第二開放式隔間224。 Furthermore, the second sealing part 222 faces the first sealing part 212 along the first direction D1, and the airtight gasket 25 is located between the first sealing part 212 and the second sealing part 212. between the close-fitting portions 222, and the positions of the plurality of second reinforcing ribs 223 generally correspond to the plurality of first reinforcing ribs 213 along the first direction D1. Wherein, the second accommodating part 221, the second sealing part 222, and the plurality of second reinforcing ribs 223 jointly form a plurality of second open compartments 224, and the plurality of second open compartments 224 are formed. The open compartments 224 respectively correspond to a plurality of the first open compartments 214 along the first direction D1, and each of the elongated through holes 2221 is connected to one of the second open compartments. 224.

依上所述,所述第一測試腔體21與所述第二測試腔體22能相對地移動,以使所述第一容置部211與所述第二容置部221共同包圍形成所述測試空間S,並且所述第一密合部212與所述第二密合部222夾持於所述氣密墊圈25,以實現一預合作業。 According to the above, the first test cavity 21 and the second test cavity 22 can move relatively, so that the first accommodating part 211 and the second accommodating part 221 jointly surround and form the The test space S is provided, and the first sealing part 212 and the second sealing part 222 are clamped by the airtight gasket 25 to achieve a pre-cooperation operation.

進一步地說,所述第一測試腔體21與所述第二測試腔體22之間的作動於本實施例中是通過所述機台本體1來實現,以下說明所述機台本體1的其中一種可行態樣,但本發明不以此為限。 Furthermore, in this embodiment, the action between the first test chamber 21 and the second test chamber 22 is realized through the machine body 1. The following describes the operation of the machine body 1. One of the possible forms is, but the present invention is not limited to this.

如圖1至圖4所示,所述機台本體1包含有一軌道機構11(如:線 性滑軌)與位置對應於所述軌道機構11的一升降機構12(如:氣壓缸或液壓缸)。其中,所述第二測試腔體22安裝於所述軌道機構11,以使所述第二測試腔體22能通過所述軌道機構11而沿垂直所述第一方向D1的一第二方向D2於一置料位置(如:圖1)與一作業位置(如:圖2和圖3)之間移動。 As shown in Figures 1 to 4, the machine body 1 includes a track mechanism 11 (such as a line (e.g., a sliding rail) and a lifting mechanism 12 (such as a pneumatic cylinder or a hydraulic cylinder) whose position corresponds to the track mechanism 11. Wherein, the second test chamber 22 is installed on the track mechanism 11 so that the second test chamber 22 can pass through the track mechanism 11 along a second direction D2 perpendicular to the first direction D1. Move between a material placement position (e.g. Figure 1) and an operating position (e.g. Figure 2 and Figure 3).

舉例來說,如圖1所示,當所述第二測試腔體22位於所述置料位置時,所述第二測試腔體22相對於所述第一測試腔體21呈錯位設置,以使安裝於所述第二測試腔體22的所述測試載座23能用以供至少一個所述待測電子元件200設置。 For example, as shown in FIG. 1 , when the second test chamber 22 is located at the material placement position, the second test chamber 22 is disposed in a staggered position relative to the first test chamber 21 . The test carrier 23 installed in the second test cavity 22 can be used for setting at least one of the electronic components 200 to be tested.

如圖2和圖3所示,當所述第二測試腔體22位於所述作業位置時,所述第二密合部222沿所述第一方向D1面向於所述第一密合部212,所述升降機構12的位置對應於位在所述作業位置的所述第二測試腔體22,並且所述升降機構12能驅使位在所述作業位置的所述第二測試腔體22沿所述第一方向D1移動而實現所述預合作業(如:圖4)。 As shown in FIGS. 2 and 3 , when the second test chamber 22 is in the working position, the second sealing part 222 faces the first sealing part 212 along the first direction D1 , the position of the lifting mechanism 12 corresponds to the second test cavity 22 in the working position, and the lifting mechanism 12 can drive the second testing cavity 22 in the working position along the The first direction D1 moves to realize the pre-cooperation operation (eg, Figure 4).

如圖1至圖7所示,所述密合機構26包含一驅動器261、多個鎖合件262、及傳輸所述驅動器261動力至與多個所述鎖合件262的一傳動件263。其中,所述驅動器261安裝於所述機台本體1且鄰近於所述第一測試腔體21,並且所述驅動器261於本實施例中是以一驅動馬達來說明,其包含有作為動力輸出使用的一齒型部2611。 As shown in FIGS. 1 to 7 , the close mechanism 26 includes a driver 261 , a plurality of locking parts 262 , and a transmission part 263 that transmits the power of the driver 261 to the plurality of locking parts 262 . Among them, the driver 261 is installed on the machine body 1 and adjacent to the first test chamber 21, and the driver 261 is illustrated as a drive motor in this embodiment, which includes a power output as a power output. A toothed part 2611 is used.

再者,每個所述鎖合件262具有分別位於相反兩端的一連動端部2621與一鎖合端部2622,並且多個所述鎖合件262可轉動地設置於所述第一測試腔體21的所述第一密合部212。於本實施例中,每個所述鎖合件262配置於一個所述第一開放式隔間214且直立地安裝於所述第一密合部212(也就是,多個所述連動端部2621的旋轉軸線彼此平行),並且每個所述鎖合件262的所述連動端部2621與所述鎖合端部2622是分別位於所述第一密合部212的相反 兩側。 Furthermore, each of the locking parts 262 has a linking end part 2621 and a locking end part 2622 respectively located at opposite ends, and a plurality of the locking parts 262 are rotatably disposed in the first test chamber. The first sealing portion 212 of the body 21 . In this embodiment, each locking member 262 is disposed in one of the first open compartments 214 and is installed upright on the first sealing portion 212 (that is, a plurality of the linking end portions). 2621 are parallel to each other), and the linking end 2621 and the locking end 2622 of each locking member 262 are respectively located opposite to the first sealing portion 212 both sides.

更詳細地說,每個所述鎖合件262的所述連動端部2621為一齒輪,並且所述齒型部2611與多個所述連動端部2621配置在高於所述第一測試腔體21(也就是,遠離所述第二測試腔體22的所述第一測試腔體21一側)的一平面。此外,所述傳動件263連接所述驅動器261與多個所述鎖合件262的所述連動端部2621;也就是說,所述傳動件263於本實施例中為嚙合於所述齒型部2611與多個所述連動端部2621的一傳動鍊條,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述傳動件263與多個所述連動端部2621之間的配合也可以是採用皮帶與多個摩擦輪的方式實現;或者,所述驅動器261可以通過採用氣壓缸或液壓缸搭配其他構造來實現。 In more detail, the interlocking end portion 2621 of each locking member 262 is a gear, and the toothed portion 2611 and the plurality of interlocking end portions 2621 are arranged higher than the first test chamber. A plane of the body 21 (that is, the side of the first test chamber 21 away from the second test chamber 22). In addition, the transmission member 263 connects the driver 261 and the linkage end portions 2621 of the plurality of locking members 262; that is to say, the transmission member 263 is engaged with the tooth profile in this embodiment. A transmission chain consisting of a portion 2611 and a plurality of linking end portions 2621, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the cooperation between the transmission member 263 and the plurality of linkage end portions 2621 can also be achieved by using a belt and a plurality of friction wheels; or, The driver 261 can be implemented by using a pneumatic cylinder or a hydraulic cylinder in combination with other structures.

再者,多個所述鎖合端部2622的位置與形狀分別對應於多個所述長形貫孔2221的位置與形狀。據此,於所述預合作業之後,如圖6和圖7所示,所述驅動器261能通過所述傳動件263而驅使多個所述鎖合件262同步轉動來實現一鎖合作業,以使每個所述鎖合件262的所述鎖合端部2622與所述第一密合部212分別夾持於所述第二密合部222的相反兩側。也就是說,每個所述鎖合端部2622於所述預合作業時穿過相對應的所述長形貫孔2221、並於所述鎖合作業時旋轉錯位於相對應的所述長形貫孔2221。 Furthermore, the positions and shapes of the plurality of locking end portions 2622 respectively correspond to the positions and shapes of the plurality of elongated through holes 2221 . Accordingly, after the pre-locking operation, as shown in FIGS. 6 and 7 , the driver 261 can drive a plurality of the locking members 262 to rotate synchronously through the transmission member 263 to achieve a locking operation. Therefore, the locking end portion 2622 of each locking member 262 and the first sealing portion 212 are clamped on opposite sides of the second sealing portion 222 respectively. That is to say, each of the locking end portions 2622 passes through the corresponding elongated through hole 2221 during the pre-locking operation, and is rotated and misaligned with the corresponding elongated through hole 2221 during the locking operation. Shaped through hole 2221.

需額外說明的是,基於所述密合機構26在實施所述鎖合作業之後,所述測試裝置2的所述測試空間S需能夠長時間維持在高壓環境,所以對於所述密合機構26的所述鎖合作業之密合度要求極高(如:所述驅動器261必須以極大的輸出動力來實現所述鎖合作業),因而導致所述鎖合作業不易於實施。 It should be additionally noted that after the sealing mechanism 26 performs the locking operation, the test space S of the test device 2 needs to be able to maintain a high-pressure environment for a long time, so for the sealing mechanism 26 The locking operation requires extremely high tightness (for example, the driver 261 must use a huge output power to achieve the locking operation), which makes the locking operation difficult to implement.

據此,於所述預合作業之後,如圖5至圖7所示,所述雙循環式非接觸測試設備100於本實施例中是進一步採用所述抽氣裝置3(如:幫浦) 來對所述測試空間S進行一抽真空作業,以使所述測試空間S呈現負壓狀態、而令所述第一密合部212與所述第二密合部222更為緊密地抵接(或更為緊密地夾持所述氣密墊圈25),用以利於所述密合機構26接著實施所述鎖合作業(如:所述驅動器261能以較小的輸出動力來實現所述鎖合作業),使得所述測試空間S能夠通過所述密合機構26而長時間維持在高壓環境。 Accordingly, after the preparatory work, as shown in Figures 5 to 7, the double cycle non-contact testing equipment 100 in this embodiment further uses the air extraction device 3 (such as a pump) To perform a vacuuming operation on the test space S, so that the test space S presents a negative pressure state, so that the first sealing portion 212 and the second sealing portion 222 are more closely contacted. (or clamp the air-tight gasket 25 more tightly) to facilitate the closing mechanism 26 to then perform the locking operation (for example: the driver 261 can achieve the locking operation with a smaller output power). Locking operation), so that the test space S can be maintained in a high-pressure environment for a long time through the sealing mechanism 26.

更詳細地說,所述抽氣裝置3連通於所述第一容置部211與所述第二容置部221的至少其中之一(如:所述抽氣裝置3於本實施例中是以通過連接於所述溫度調節裝置4而連通於所述第一容置部211),據以連通於所述測試空間S而能夠實施所述抽真空作業。 In more detail, the air extraction device 3 is connected to at least one of the first accommodation part 211 and the second accommodation part 221 (for example: the air extraction device 3 in this embodiment is By being connected to the temperature adjustment device 4 and communicating with the first accommodating part 211), the vacuuming operation can be performed by communicating with the test space S.

所述溫度調節裝置4安裝於所述第一測試腔體21與所述第二測試腔體22的至少其中之一的外側,用以連通於所述測試空間S。於本實施例中,所述溫度調節裝置4是安裝於所述第一測試腔體21的外側、並通過兩個所述貫孔2111而連通於所述測試空間S,但本發明不受限於此。 The temperature adjustment device 4 is installed on the outside of at least one of the first test chamber 21 and the second test chamber 22 to communicate with the test space S. In this embodiment, the temperature adjustment device 4 is installed outside the first test chamber 21 and connected to the test space S through the two through holes 2111, but the invention is not limited thereto. Here it is.

具體來說,如圖8至圖11所示,所述溫度調節裝置4包含有一溫控機構41、連接所述溫控機構41與所述第一測試腔體21的一管路單元42、安裝於所述管路單元42的一風扇機構43、兩個所述開關閥45、及位於所述測試空間S之內的一加熱燈具44。其中,所述溫度調節裝置4於本實施例的圖式中是僅以連接於所述第一測試腔體21來繪示,但所述溫度調節裝置4也可依據設計需求而進一步固定於所述機台本體1。 Specifically, as shown in FIGS. 8 to 11 , the temperature adjustment device 4 includes a temperature control mechanism 41 , a pipeline unit 42 connecting the temperature control mechanism 41 and the first test chamber 21 , and an installation unit 42 . A fan mechanism 43 in the pipeline unit 42, two switch valves 45, and a heating lamp 44 located in the test space S. Among them, the temperature adjustment device 4 is only shown as being connected to the first test chamber 21 in the drawings of this embodiment, but the temperature adjustment device 4 can also be further fixed to the first test chamber 21 according to design requirements. Describe the machine body 1.

所述溫控機構41包含有一降溫腔室411、一升溫腔室412、配置於所述降溫腔室411內的一降溫器413(如:蒸發器)、及配置於所述升溫腔室412內的一升溫器414(如:電熱器)。其中,所述降溫器413與所述升溫器414於本實施例中能夠依據實際需求而選擇性地擇一運作。 The temperature control mechanism 41 includes a cooling chamber 411, a heating chamber 412, a cooling device 413 (such as an evaporator) arranged in the cooling chamber 411, and a temperature increasing chamber 412. A heater 414 (such as an electric heater). Among them, the temperature lowering device 413 and the heating device 414 can selectively operate according to actual needs in this embodiment.

所述管路單元42連接所述降溫腔室411、所述升溫腔室412、與 所述測試空間S,以使其彼此連通而共同構成一雙循環空間C。所述管路單元42於本實施例中是以包含有一分叉管421、一分流管423、及兩個連接管422來說明,但所述管路單元42的具體配置方式可依據設計需求而加以調整變化,本發明在此不加以限制。 The pipeline unit 42 connects the cooling chamber 411, the heating chamber 412, and The test spaces S are connected with each other to form a pair of circulation spaces C. In this embodiment, the pipeline unit 42 is illustrated as including a bifurcated pipe 421, a shunt pipe 423, and two connecting pipes 422, but the specific configuration of the pipeline unit 42 can be determined according to design requirements. Adjustments and changes may be made, and the invention is not limited here.

更詳細地說,所述分叉管421具有相互連通的一安裝孔4211及三個氣流孔4212,所述風扇機構43安裝於所述安裝孔4211,並且所述分叉管421以其中兩個所述氣流孔4212分別連接於所述降溫腔室411的一端與所述升溫腔室412的一端。 In more detail, the bifurcated pipe 421 has a mounting hole 4211 and three airflow holes 4212 that are connected to each other. The fan mechanism 43 is installed in the mounting hole 4211, and the bifurcated pipe 421 has two of them. The airflow holes 4212 are respectively connected to one end of the cooling chamber 411 and one end of the warming chamber 412 .

所述分流管423具有相互連通的三個分流孔4231,並且所述分流管423以其中兩個所述分流孔4231分別連接於所述降溫腔室411的另一端與所述升溫腔室412的另一端。兩個所述連接管422的一端分別連接於所述第一測試腔體21的兩個所述貫孔2111,並且兩個所述連接管422的另一端分別連接於所述分叉管421的其中另一個所述氣流孔4212以及所述分流管423的其中另一個所述分流孔4231,據以使所述降溫腔室411與所述升溫腔室412能通過所述分叉管421、所述分流管423、與兩個所述連接管422而連通於所述測試空間S。 The shunt tube 423 has three shunt holes 4231 that communicate with each other, and two of the shunt holes 4231 of the shunt tube 423 are connected to the other end of the cooling chamber 411 and the heating chamber 412 respectively. another side. One end of the two connecting tubes 422 is connected to the two through holes 2111 of the first test chamber 21 respectively, and the other end of the two connecting tubes 422 is connected to the bifurcated tube 421 respectively. The other airflow hole 4212 and the other branch hole 4231 of the branch pipe 423 enable the cooling chamber 411 and the heating chamber 412 to pass through the branch pipe 421 and the other branch pipe 423 . The shunt pipe 423 and the two connecting pipes 422 are connected to the test space S.

再者,兩個所述連接管422的至少其中之一形成有至少一個外接孔4221,並且至少一個所述外接孔4221的數量於本實施例中為多個,據以使所述抽氣裝置3與所述供氣裝置5各連接於至少一個所述外接孔4221而連通於所述雙循環空間C,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述抽氣裝置3及/或所述供氣裝置5也可依據設計需求、而通過所述第一測試腔體21或所述第二測試腔體22另行開設的孔洞而連通於所述雙循環空間C。 Furthermore, at least one of the two connecting pipes 422 is formed with at least one external connection hole 4221, and the number of the at least one external connection hole 4221 is multiple in this embodiment, so that the air extraction device 3 and the air supply device 5 are each connected to at least one of the external holes 4221 and connected to the double circulation space C, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the air extraction device 3 and/or the air supply device 5 may also pass through the first test chamber 21 or the air supply device 5 according to design requirements. The second test cavity 22 is connected to the double circulation space C through a separate hole.

所述風扇機構43能運轉而形成有於所述雙循環空間C內流動且經過所述溫控機構41的一循環氣流F,並且所述循環氣流F能通過所述降溫器 413與所述升溫器414的其中之一而具有一預設溫度。其中,位於所述測試空間S之內的所述加熱燈具44能用以搭配所述升溫器414來加熱所述循環氣流F,據以有效地提升加熱效率。 The fan mechanism 43 can operate to form a circulating airflow F flowing in the double circulation space C and passing through the temperature control mechanism 41, and the circulating airflow F can pass through the cooler. One of 413 and the temperature riser 414 has a preset temperature. Among them, the heating lamp 44 located in the test space S can be used with the temperature riser 414 to heat the circulating air flow F, thereby effectively improving the heating efficiency.

進一步地說,所述風扇機構43較佳是要能避免影響所述雙循環空間C內的所述循環氣流F的溫度與壓力,所以所述風扇機構43於下述內容是以其中一種可行的態樣來說明,但本發明不受限於此。 Furthermore, the fan mechanism 43 is preferably able to avoid affecting the temperature and pressure of the circulating air flow F in the double circulation space C. Therefore, the fan mechanism 43 can be configured in one of the following ways: However, the present invention is not limited thereto.

於本實施例中,所述風扇機構43包含有一框體431、安裝於所述框體431的一馬達432、安裝於所述框體431內的一阻隔層433、可轉動地穿設於所述阻隔層433的一轉軸434、固定於所述轉軸434的一扇葉435、位於所述框體431內的一隔熱聯軸器436、及一外殼437,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述外殼437也可依據設計需求而省略或以其他構件取代。 In this embodiment, the fan mechanism 43 includes a frame 431, a motor 432 installed in the frame 431, a barrier layer 433 installed in the frame 431, and is rotatably installed in the frame 431. A rotating shaft 434 of the barrier layer 433, a fan blade 435 fixed on the rotating shaft 434, an insulating coupling 436 located in the frame 431, and a housing 437, but the invention is not limited thereto. . For example, in other embodiments not shown in the present invention, the housing 437 can also be omitted or replaced with other components according to design requirements.

更詳細地說,所述框體431大致呈方管狀且其一端安裝於所述管路單元42(如:所述分叉管421的所述安裝孔4211),所述馬達432安裝於所述框體431的另一端,並且所述馬達432的一輸出軸4321位於所述框體431之內,而所述馬達432的本體位於所述框體431之外。再者,所述阻隔層433鄰近於所述框體431與所述分叉管421的交界處,以隔絕所述框體431內的空間與所述雙循環空間C之間的溫度與氣壓。 In more detail, the frame 431 is generally in the shape of a square tube and one end thereof is installed on the pipeline unit 42 (such as the installation hole 4211 of the bifurcated pipe 421), and the motor 432 is installed on the The other end of the frame 431 and an output shaft 4321 of the motor 432 are located inside the frame 431 , while the body of the motor 432 is located outside the frame 431 . Furthermore, the barrier layer 433 is adjacent to the junction of the frame 431 and the bifurcated pipe 421 to isolate the temperature and air pressure between the space in the frame 431 and the double circulation space C.

所述轉軸434的一端位於所述框體431之內,並且所述轉軸434的另一端位於所述雙循環空間C之內,而所述扇葉435固定於所述轉軸434的所述另一端。其中,所述輸出軸4321與所述轉軸434皆沿著一預設軸線L配置,並且所述隔熱聯軸器436連接所述輸出軸4321與所述轉軸434的所述一端。據此,所述輸出軸4321與所述轉軸434不但能通過所述隔熱聯軸器436而同步轉動,並且所述輸出軸4321與所述轉軸434還能通過所述隔熱聯軸器436而有效 地降低熱能的彼此相互傳遞。 One end of the rotating shaft 434 is located within the frame 431, and the other end of the rotating shaft 434 is located within the double circulation space C, and the fan blade 435 is fixed to the other end of the rotating shaft 434. . The output shaft 4321 and the rotating shaft 434 are both arranged along a preset axis L, and the heat-insulating coupling 436 connects the output shaft 4321 and the one end of the rotating shaft 434 . Accordingly, the output shaft 4321 and the rotating shaft 434 can not only rotate synchronously through the heat insulating coupling 436, but the output shaft 4321 and the rotating shaft 434 can also rotate through the heat insulating coupling 436. And effective Reduce the transfer of heat energy to each other.

需額外說明的是,所述框體431較佳是形成有位置對應於所述隔熱聯軸器436的一拆裝孔4311,據以使所述隔熱聯軸器436能通過所述拆裝孔4311而於所述框體431內進行安裝或拆卸。再者,所述外殼437安裝於所述分叉管421且其包覆且封閉所述框體431與所述馬達432(如:所述本體)於內,據以使所述馬達432和所述隔熱聯軸器436能通過所述外殼437而與外部環境隔開。 It should be noted that the frame 431 is preferably formed with a disassembly and assembly hole 4311 corresponding to the position of the heat-insulating coupling 436, so that the heat-insulating coupling 436 can pass through the disassembly and assembly hole 4311. The mounting holes 4311 are used for installation or disassembly in the frame 431 . Furthermore, the housing 437 is installed on the bifurcated tube 421 and covers and seals the frame 431 and the motor 432 (such as the body), so that the motor 432 and the motor 432 are connected to each other. The insulated coupling 436 can be isolated from the external environment by the housing 437 .

此外,所述分叉管421相對於所述扇葉435與所述轉軸434對應關係可依設計需求而調整變化,以下列舉其中一種可行的態樣來說明。所述分叉管421的其中一個所述氣流孔4212的中心位於所述預設軸線L且其位置對應於所述扇葉435,並且其中另一個所述氣流孔4212的中心位於垂直所述預設軸線L的一徑向方向上且其位置對應於所述轉軸434。再者,所述扇葉435的半徑較佳是不小於其所對應的所述氣流孔4212的最大內徑。 In addition, the corresponding relationship between the bifurcated tube 421 and the fan blades 435 and the rotating shaft 434 can be adjusted and changed according to design requirements. One of the possible aspects is listed below for description. The center of one of the airflow holes 4212 of the bifurcated tube 421 is located on the preset axis L and its position corresponds to the fan blade 435, and the center of the other airflow hole 4212 is located perpendicular to the preset axis L. It is assumed that the axis L is in a radial direction and its position corresponds to the rotation axis 434 . Furthermore, the radius of the fan blade 435 is preferably no less than the maximum inner diameter of the corresponding airflow hole 4212 .

依上所述,所述馬達432能以所述輸出軸4321、並通過所述隔熱聯軸器436與所述轉軸434而驅使所述扇葉435轉動,以形成於所述雙循環空間C內流動經過所述降溫器413或所述升溫器414的所述循環氣流F。據此,所述溫度調節裝置4於本實施例中通過所述隔熱聯軸器436與所述阻隔層433,以使其所形成的氣流之溫度能夠不被所述馬達432影響,進而精準地被控制。 As mentioned above, the motor 432 can drive the fan blade 435 to rotate with the output shaft 4321 and through the heat insulation coupling 436 and the rotating shaft 434 to form the double circulation space C. The circulating air flow F flows through the cooler 413 or the warmer 414 . Accordingly, in this embodiment, the temperature adjustment device 4 passes through the heat-insulating coupling 436 and the barrier layer 433 so that the temperature of the airflow formed by it is not affected by the motor 432 and thus can be accurately The ground is controlled.

需說明的是,所述扇葉435是指能夠通過轉動而形成氣流的構造,所以所述扇葉435的具體構造可依據設計需求而加以調整變化、並不受限於圖式所呈現的構造。舉例來說,在本發明未繪示的其他實施例中,所述扇葉435可以是利於機械增壓的渦輪構造。 It should be noted that the fan blade 435 refers to a structure that can form airflow through rotation. Therefore, the specific structure of the fan blade 435 can be adjusted and changed according to design requirements and is not limited to the structure presented in the drawings. . For example, in other embodiments not shown in the present invention, the fan blades 435 may be of a turbine structure that is conducive to supercharging.

進一步地說,所述溫度調節裝置4於本實施例中是通過兩個所述開關閥45來控制所述循環氣流F的流動方向。具體來說,其中一個所述開關閥 45位於所述風扇機構43與所述降溫腔室411之間,而其中一個所述開關閥45位於所述風扇機構43與所述升溫腔室412之間。據此,兩個所述開關閥45能選擇性地擇一關閉,以使所述風扇機構43斷開所述降溫腔室411或所述升溫腔室412。 Furthermore, in this embodiment, the temperature regulating device 4 controls the flow direction of the circulating air flow F through two switch valves 45 . Specifically, one of the switching valves 45 is located between the fan mechanism 43 and the cooling chamber 411 , and one of the switch valves 45 is located between the fan mechanism 43 and the heating chamber 412 . Accordingly, the two switch valves 45 can be selectively closed, so that the fan mechanism 43 disconnects the cooling chamber 411 or the heating chamber 412 .

也就是說,當所述降溫器413於運作時,所述風扇機構43與所述降溫腔室411之間經由相對應所述開關閥45的開啟而彼此連通,並且所述風扇機構43與所述升溫腔室412之間經由相對應所述開關閥45的關閉而斷開。或者,當所述升溫器414於運作時,所述風扇機構43與所述升溫腔室412之間經由相對應所述開關閥45的開啟而彼此連通,並且所述風扇機構43與所述降溫腔室411之間經由相對應所述開關閥45的關閉而斷開。 That is to say, when the cooler 413 is in operation, the fan mechanism 43 and the cooling chamber 411 are connected to each other through the corresponding opening of the switch valve 45, and the fan mechanism 43 and the cooling chamber 411 are connected to each other. The temperature-raising chambers 412 are disconnected by correspondingly closing the switch valve 45 . Alternatively, when the temperature riser 414 is in operation, the fan mechanism 43 and the heating chamber 412 are connected to each other through the corresponding opening of the switch valve 45, and the fan mechanism 43 and the cooling chamber are connected to each other. The chambers 411 are disconnected by correspondingly closing the switch valve 45 .

需額外說明的是,在實施所述鎖合作業之後,所述雙循環空間C大致呈真空狀態,所以所述雙循環式非接觸測試設備100可以採用所述供氣裝置5通入一預定氣體至所述雙循環空間C、並能使所述雙循環空間C達到一預設氣壓,以使設置於所述測試載座23的至少一個所述待測電子元件200能在所述預設氣壓與所述預設溫度的環境下進行所述非接觸測試作業。 It should be additionally noted that after the locking operation is performed, the double circulation space C is generally in a vacuum state, so the double circulation non-contact testing equipment 100 can use the gas supply device 5 to introduce a predetermined gas. to the dual circulation space C, and enable the dual circulation space C to reach a preset air pressure, so that at least one of the electronic components to be tested 200 disposed on the test carrier 23 can operate at the preset air pressure. The non-contact testing operation is performed in an environment with the preset temperature.

依上所述,所述雙循環式非接觸測試設備100於本實施例中是通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件200可以經由非接觸方式(如:所述雙循環空間C具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。 As mentioned above, in this embodiment, the dual-cycle non-contact testing equipment 100 uses a structural combination of multiple devices, so that at least one of the electronic components to be tested 200 can be tested through a non-contact method (such as: The double circulation space C has the preset air pressure and the preset temperature) to adjust test parameters (such as temperature).

此外,所述供氣裝置5所輸出的所述預定氣體可以依據需求而加以變化;舉例來說,所述預定氣體可以採用乾燥氣體或是分子量大於空氣的氣體(如:二氧化碳氣體),據以進一步形成具有預設溫度的所述循環氣流F,進而利於所述雙循環空間C快速地達到所述預設氣壓。再者,每個所述均流件24形成有多個孔洞,以使所述循環氣流F能夠更為均勻地分佈於所述測試空間 S,進而有助於至少一個所述待測電子元件200達到測試要求的溫度。 In addition, the predetermined gas output by the gas supply device 5 can be changed according to demand; for example, the predetermined gas can be dry gas or a gas with a molecular weight greater than air (such as carbon dioxide gas). The circulating air flow F with a preset temperature is further formed, thereby facilitating the double circulation space C to quickly reach the preset air pressure. Furthermore, each of the flow equalizers 24 is formed with a plurality of holes so that the circulating airflow F can be more evenly distributed in the test space. S, thereby helping at least one of the electronic components under test 200 to reach the temperature required for testing.

[本發明實施例的技術效果] [Technical effects of the embodiments of the present invention]

綜上所述,本發明實施例所公開的雙循環式非接觸測試設備,其通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件可以經由非接觸方式(如:所述雙循環空間具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。 To sum up, the dual-cycle non-contact testing equipment disclosed in the embodiment of the present invention uses structural coordination between multiple devices so that at least one of the electronic components to be tested can be tested in a non-contact manner (such as: The double circulation space has the preset air pressure and the preset temperature) to adjust test parameters (such as temperature).

再者,本發明實施例所公開的雙循環式非接觸測試設備,其進一步採用所述抽氣裝置來對所述測試空間進行抽真空作業,以使所述測試空間呈現負壓狀態、而令所述第一密合部與所述第二密合部更為緊密地抵接(或更為緊密地夾持所述氣密墊圈),用以利於所述密合機構接著實施所述鎖合作業(如:所述驅動器能以較小的輸出動力來實現所述鎖合作業),使得所述測試空間能夠通過所述密合機構而長時間維持在高壓環境。 Furthermore, the dual-cycle non-contact testing equipment disclosed in the embodiment of the present invention further uses the air extraction device to perform vacuuming operation on the test space, so that the test space presents a negative pressure state and makes the test space The first sealing part and the second sealing part abut more closely (or clamp the airtight gasket more closely) to facilitate the sealing mechanism to then implement the locking cooperation. (for example, the driver can perform the locking operation with a smaller output power), so that the test space can be maintained in a high-pressure environment for a long time through the sealing mechanism.

另外,本發明實施例所公開的溫度調節裝置,其通過所述隔熱聯軸器與所述阻隔層,以使其所形成的氣流之溫度能夠不被所述馬達影響,進而精準地被控制。 In addition, the temperature regulating device disclosed in the embodiment of the present invention uses the thermal insulation coupling and the barrier layer so that the temperature of the air flow formed can not be affected by the motor and can be accurately controlled. .

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。 The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. within.

100:雙循環式非接觸測試設備 100:Double cycle non-contact testing equipment

1:機台本體 1:Machine body

11:軌道機構 11: Orbital mechanism

12:升降機構 12:Lifting mechanism

4:溫度調節裝置 4: Temperature adjustment device

41:溫控機構 41:Temperature control mechanism

411:降溫腔室 411: Cooling chamber

412:升溫腔室 412: Heating chamber

413:降溫器 413: Cooler

414:升溫器 414:heater

42:管路單元 42:Pipeline unit

421:分叉管 421: bifurcation tube

4212:氣流孔 4212:Airflow hole

423:分流管 423:Shunt tube

4231:分流孔 4231: Diversion hole

43:風扇機構 43:Fan mechanism

435:扇葉 435:Fan blade

45:開關閥 45:On/off valve

C:雙循環空間 C: Double circulation space

D2:第二方向 D2: second direction

Claims (10)

一種雙循環式非接觸測試設備,其包括: 一機台本體; 一測試裝置,其安裝於所述機台本體,並且所述測試裝置包含有: 一第一測試腔體與一第二測試腔體,其皆安裝於所述機台本體;其中,所述第二測試腔體能與所述第一測試腔體沿一第一方向彼此相對地移動,以共同封閉形成有一測試空間;及 一測試載座,設置於所述第二測試腔體,並且所述測試載座用以供一待測電子元件設置; 一溫度調節裝置,其安裝於所述第一測試腔體與所述第二測試腔體的至少其中之一的外側,用以連通於所述測試空間;其中,所述溫度調節裝置包含有: 一溫控機構,包含有一降溫腔室、一升溫腔室、配置於所述降溫腔室內的一降溫器、及配置於所述升溫腔室內的一升溫器;其中,所述降溫器與所述升溫器能夠選擇性地擇一運作; 一管路單元,連接所述降溫腔室、所述升溫腔室、及所述測試空間,以使其彼此連通而共同構成一雙循環空間; 一風扇機構,安裝於所述管路單元;其中,所述風扇機構能運轉而形成有於所述雙循環空間內流動的一循環氣流,並且所述循環氣流能通過所述降溫器與所述升溫器的其中之一而具有一預設溫度;及 兩個開關閥,其中一個所述開關閥位於所述風扇機構與所述降溫腔室之間,而其中一個所述開關閥位於所述風扇機構與所述升溫腔室之間;其中,兩個所述開關閥能選擇性地擇一關閉,以使所述風扇機構斷開所述降溫腔室或所述升溫腔室;以及 一供氣裝置,連通於所述雙循環空間;其中,所述供氣裝置用以通入一預定氣體至所述雙循環空間、並能使所述雙循環空間達到一預設氣壓,以使設置於所述測試載座的所述待測電子元件能在所述預設氣壓與所述預設溫度的環境下進行一非接觸測試作業。 A dual-cycle non-contact testing equipment, which includes: One machine body; A testing device installed on the machine body, and the testing device includes: A first test chamber and a second test chamber, both of which are installed on the machine body; wherein, the second test chamber and the first test chamber can move relative to each other along a first direction. , forming a test space with common closure; and A test carrier is provided in the second test cavity, and the test carrier is used for placing an electronic component under test; A temperature adjustment device installed on the outside of at least one of the first test chamber and the second test chamber to communicate with the test space; wherein the temperature adjustment device includes: A temperature control mechanism includes a cooling chamber, a warming chamber, a cooler disposed in the cooling chamber, and a temperature riser disposed in the warming chamber; wherein the cooler and the The heater can selectively choose one operation; A pipeline unit connects the cooling chamber, the heating chamber, and the testing space so that they are connected with each other and together form a pair of circulation spaces; A fan mechanism is installed on the pipeline unit; wherein the fan mechanism can operate to form a circulating air flow flowing in the double circulation space, and the circulating air flow can pass through the cooler and the One of the temperature risers has a preset temperature; and Two switching valves, one of which is located between the fan mechanism and the cooling chamber, and one of which is located between the fan mechanism and the warming chamber; wherein, two The switch valve can be selectively closed so that the fan mechanism disconnects the cooling chamber or the heating chamber; and A gas supply device is connected to the dual circulation space; wherein the gas supply device is used to introduce a predetermined gas into the dual circulation space and enable the dual circulation space to reach a preset air pressure, so that The electronic component to be tested disposed on the test carrier can perform a non-contact test operation in the environment of the preset air pressure and the preset temperature. 如請求項1所述的雙循環式非接觸測試設備,其中,所述第一測試腔體形成有兩個貫孔,所述管路單元包含有: 一分叉管,具有相互連通的一安裝孔及三個氣流孔;所述風扇機構安裝於所述安裝孔,並且所述分叉管以其中兩個所述氣流孔分別連接於所述降溫腔室的一端與所述升溫腔室的一端; 一分流管,具有相互連通的三個分流孔,並且所述分流管以其中兩個所述分流孔分別連接於所述降溫腔室的另一端與所述升溫腔室的另一端;及 兩個連接管,其一端分別連接於兩個所述貫孔,並且兩個所述連接管的另一端分別連接於所述分叉管的其中另一個所述氣流孔及所述分流管的其中另一個所述分流孔。 The dual-circulation non-contact testing equipment as claimed in claim 1, wherein the first testing cavity is formed with two through holes, and the pipeline unit includes: A bifurcated pipe has a mounting hole and three airflow holes that are connected to each other; the fan mechanism is installed in the mounting hole, and the bifurcated pipe is connected to the cooling chamber with two of the airflow holes. One end of the chamber and one end of the heating chamber; A shunt tube has three mutually connected shunt holes, and the shunt tube is connected to the other end of the cooling chamber and the other end of the heating chamber with two of the shunt holes respectively; and Two connecting pipes, one end of which is connected to the two through-holes respectively, and the other end of the two connecting pipes is connected to the other of the air flow holes of the branch pipe and one of the branch pipes. Another said diverter hole. 如請求項2所述的雙循環式非接觸測試設備,其中,兩個所述連接管的至少其中之一形成有至少一個外接孔,並且所述供氣裝置連接於至少一個所述外接孔而連通於所述雙循環空間。The dual-circulation non-contact testing equipment according to claim 2, wherein at least one of the two connecting pipes is formed with at least one external connection hole, and the air supply device is connected to at least one of the external connection holes. Connected to the double circulation space. 如請求項2所述的雙循環式非接觸測試設備,其中,所述測試裝置包含有兩個均流件,並且兩個所述均流件安裝於所述第一測試腔體的內部且其位置分別對應於兩個所述貫孔。The dual-cycle non-contact testing equipment according to claim 2, wherein the testing device includes two current equalizing parts, and the two current equalizing parts are installed inside the first test chamber and their The positions respectively correspond to the two through holes. 如請求項2所述的雙循環式非接觸測試設備,其中,所述溫度調節裝置包含有一加熱燈具,其位於所述測試空間之內,用以搭配所述升溫器來加熱所述循環氣流。The dual-circulation non-contact testing equipment according to claim 2, wherein the temperature adjustment device includes a heating lamp located in the test space and used to heat the circulating airflow in conjunction with the temperature riser. 如請求項1所述的雙循環式非接觸測試設備,其中,當所述降溫器於運作時,所述風扇機構與所述降溫腔室之間經由相對應所述開關閥的開啟而彼此連通,並且所述風扇機構與所述升溫腔室之間經由相對應所述開關閥的關閉而斷開;其中,當所述升溫器於運作時,所述風扇機構與所述升溫腔室之間經由相對應所述開關閥的開啟而彼此連通,並且所述風扇機構與所述降溫腔室之間經由相對應所述開關閥的關閉而斷開。The dual-cycle non-contact testing equipment of claim 1, wherein when the cooler is in operation, the fan mechanism and the cooling chamber are connected to each other through the corresponding opening of the switch valve. , and the fan mechanism and the heating chamber are disconnected through the corresponding closing of the switch valve; wherein, when the heater is in operation, the fan mechanism and the heating chamber are disconnected. They are connected to each other by corresponding opening of the switch valve, and disconnected from the fan mechanism and the cooling chamber by corresponding closing of the switch valve. 如請求項1所述的雙循環式非接觸測試設備,其中,所述第一測試腔體包含有一第一容置部及相連於所述第一容置部周緣的一第一密合部;所述第二測試腔體包含有一第二容置部及相連於所述第二容置部周緣的一第二密合部,並且所述第二密合部沿所述第一方向面向於所述第一密合部;所述測試裝置包含位於所述第一密合部與所述第二密合部之間的一氣密墊圈;其中,所述第一測試腔體與所述第二測試腔體能相對地移動,以使所述第一容置部與所述第二容置部共同包圍形成所述測試空間,並且所述第一密合部與所述第二密合部夾持於所述氣密墊圈,以實現一預合作業。The dual-cycle non-contact testing equipment according to claim 1, wherein the first test chamber includes a first accommodating part and a first sealing part connected to the periphery of the first accommodating part; The second test cavity includes a second accommodating part and a second sealing part connected to the periphery of the second accommodating part, and the second sealing part faces the first direction along the first direction. The first sealing part; the test device includes an airtight gasket between the first sealing part and the second sealing part; wherein the first test chamber and the second test chamber The cavity can move relatively, so that the first accommodating part and the second accommodating part jointly surround and form the test space, and the first sealing part and the second sealing part are clamped in The airtight gasket is used to achieve a pre-coupling operation. 如請求項7所述的雙循環式非接觸測試設備,其中,所述測試裝置進一步包括有一密合機構,其包含: 一驅動器,安裝於所述機台本體; 多個鎖合件,可轉動地設置於所述第一測試腔體的所述第一密合部,並且每個所述鎖合件具有分別位於相反兩端的一連動端部與一鎖合端部;及 一傳動件,連接所述驅動器與多個所述鎖合件的所述連動端部; 其中,於所述預合作業之後,所述驅動器能通過所述傳動件而驅使多個所述鎖合件同步轉動來實現一鎖合作業,以使每個所述鎖合件的所述鎖合端部與所述第一密合部分別夾持於所述第二密合部的相反兩側。 The double-cycle non-contact testing equipment as claimed in claim 7, wherein the testing device further includes a sealing mechanism, which includes: A driver installed on the machine body; A plurality of locking parts are rotatably disposed on the first sealing part of the first test chamber, and each locking part has a linking end and a locking end respectively located at opposite ends. Department; and A transmission member connecting the driver and the linkage ends of the plurality of locking members; Wherein, after the pre-locking operation, the driver can drive a plurality of the locking members to rotate synchronously through the transmission member to achieve a locking operation, so that the locking member of each locking member The closing end portion and the first sealing portion are respectively clamped on opposite sides of the second sealing portion. 如請求項8所述的雙循環式非接觸測試設備,其中,所述雙循環式非接觸測試設備進一步包括一抽氣裝置,其連通於所述第一容置部與所述第二容置部的至少其中之一;其中,於所述預合作業之後,所述抽氣裝置能對所述測試空間進行一抽真空作業,用以利於接著實施所述鎖合作業。The dual-cycle non-contact testing equipment according to claim 8, wherein the dual-cycle non-contact testing equipment further includes an air extraction device connected between the first accommodation part and the second accommodation part. At least one of the parts; wherein, after the pre-locking operation, the exhaust device can perform a vacuum operation on the test space to facilitate the subsequent implementation of the locking operation. 如請求項1所述的雙循環式非接觸測試設備,其中,所述風扇機構包含有: 一框體,其一端安裝於所述管路單元; 一馬達,安裝於所述框體的另一端,並且所述馬達的一輸出軸位於所述框體之內; 一阻隔層,安裝於所述框體內,以隔絕所述框體內的空間與所述雙循環空間之間的溫度與氣壓; 一轉軸,可轉動地穿設於所述阻隔層;其中,所述轉軸的一端位於所述框體之內,並且所述轉軸的另一端位於所述雙循環空間之內; 一扇葉,固定於所述轉軸的所述另一端;及 一隔熱聯軸器,連接所述輸出軸與所述轉軸的所述一端; 其中,所述馬達能以所述輸出軸、並通過所述隔熱聯軸器與所述轉軸而驅使所述扇葉轉動,以形成流動經過所述降溫器或所述升溫器的所述循環氣流。 The double-circulation non-contact testing equipment as described in claim 1, wherein the fan mechanism includes: A frame, one end of which is installed on the pipeline unit; A motor is installed at the other end of the frame, and an output shaft of the motor is located within the frame; A barrier layer is installed in the frame to isolate the temperature and air pressure between the space in the frame and the double circulation space; A rotating shaft rotatably penetrates the barrier layer; wherein, one end of the rotating shaft is located within the frame, and the other end of the rotating shaft is located within the double circulation space; a fan blade fixed to the other end of the rotating shaft; and An insulated coupling connecting the output shaft and the one end of the rotating shaft; Wherein, the motor can drive the fan blade to rotate with the output shaft and through the thermal insulation coupling and the rotating shaft to form the circulation flowing through the cooler or the heater. Airflow.
TW111148402A 2022-12-16 2022-12-16 Non-contact testing apparatus with dual-circulation TWI833506B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130062047A1 (en) * 2010-05-26 2013-03-14 Bripco Bvba Data Centre Cooling Systems
CN104237767A (en) * 2013-06-18 2014-12-24 致茂电子股份有限公司 Temperature control module of test seat
TW202036010A (en) * 2019-03-15 2020-10-01 鴻勁精密股份有限公司 Test device with a temperature control unit and test categorizing equipment applying the same having a processor to analyze the surface temperature sensed data of the electronic components and the circuit board temperature sensed data with the data in database
TW202137861A (en) * 2020-03-30 2021-10-01 群翊工業股份有限公司 Temperature control apparatus and method including a heating element, an air supply plate and a plurality of adjusting plates
TW202144799A (en) * 2020-05-15 2021-12-01 洪義明 High-pressure burn-in test apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130062047A1 (en) * 2010-05-26 2013-03-14 Bripco Bvba Data Centre Cooling Systems
CN104237767A (en) * 2013-06-18 2014-12-24 致茂电子股份有限公司 Temperature control module of test seat
TW201500746A (en) * 2013-06-18 2015-01-01 Chroma Ate Inc Temperature control module for a socket
TW202036010A (en) * 2019-03-15 2020-10-01 鴻勁精密股份有限公司 Test device with a temperature control unit and test categorizing equipment applying the same having a processor to analyze the surface temperature sensed data of the electronic components and the circuit board temperature sensed data with the data in database
TW202137861A (en) * 2020-03-30 2021-10-01 群翊工業股份有限公司 Temperature control apparatus and method including a heating element, an air supply plate and a plurality of adjusting plates
TW202144799A (en) * 2020-05-15 2021-12-01 洪義明 High-pressure burn-in test apparatus

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