TWI833504B - Non-contact testing apparatus with internal circulation - Google Patents
Non-contact testing apparatus with internal circulation Download PDFInfo
- Publication number
- TWI833504B TWI833504B TW111148359A TW111148359A TWI833504B TW I833504 B TWI833504 B TW I833504B TW 111148359 A TW111148359 A TW 111148359A TW 111148359 A TW111148359 A TW 111148359A TW I833504 B TWI833504 B TW I833504B
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- internal circulation
- temperature control
- test chamber
- temperature
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 229
- 230000007246 mechanism Effects 0.000 claims abstract description 63
- 238000007789 sealing Methods 0.000 claims description 52
- 230000008878 coupling Effects 0.000 claims description 16
- 238000010168 coupling process Methods 0.000 claims description 16
- 238000005859 coupling reaction Methods 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000000605 extraction Methods 0.000 claims description 11
- 230000004888 barrier function Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000004308 accommodation Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
本發明涉及一種測試設備,尤其涉及一種內循環式非接觸測試設備。The present invention relates to a kind of testing equipment, in particular to an internal circulation non-contact testing equipment.
現有測試設備在對一待測電子元件進行測試時,需以溫控元件抵頂於所述待測電子元件,使得所述待測電子元件達到測試要求的溫度。然而,現有測試設備的接觸式測試方式已逐漸不符合電子產業日新月異的變化與需求。When the existing testing equipment tests an electronic component to be tested, a temperature control element needs to be pressed against the electronic component to be tested so that the electronic component to be tested reaches the temperature required for testing. However, the contact testing methods of existing test equipment have gradually failed to meet the ever-changing changes and needs of the electronics industry.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.
本發明實施例在於提供一種內循環式非接觸測試設備,其能有效地改善現有測試設備所可能產生的缺陷。An embodiment of the present invention provides an internal circulation non-contact testing equipment, which can effectively improve the defects that may occur in existing testing equipment.
本發明實施例公開一種內循環式非接觸測試設備,其包括:一機台本體;一測試裝置,其安裝於所述機台本體,並且所述測試裝置包含有:一第一測試腔體與一第二測試腔體,其皆安裝於所述機台本體;其中,所述第二測試腔體能與所述第一測試腔體沿一第一方向彼此相對地移動,以共同封閉形成有一測試空間;所述第一測試腔體的頂部形成有連通於所述測試空間的一開口;及一測試載座,設置於所述第二測試腔體,並且所述測試載座用以供一待測電子元件設置;一溫度調節裝置,其安裝於所述第一測試腔體,並且所述溫度調節裝置的部分位於所述測試空間之內;其中,所述溫度調節裝置包含有:一溫控機構,包含有:一導流罩,位於所述測試空間內,並且所述導流罩位於所述測試載座的上方;及一溫控單元,配置於所述導流罩內且鄰近於所述開口;及一風扇機構,安裝於所述第一測試腔體的所述開口且面向所述溫控單元,並且所述測試空間通過所述導流罩與所述風扇機構而定義有於所述導流罩內側與外側進行循環且沿經所述溫控單元的一內循環路徑;其中,所述風扇機構能運轉而形成有沿所述內循環路徑流動的一循環氣流,並且所述循環氣流能通過所述溫控單元而具有一預設溫度;以及一供氣裝置,連通於所述測試空間;其中,所述供氣裝置用以通入一預定氣體至所述測試空間、並能使所述測試空間達到一預設氣壓,以使設置於所述測試載座的所述待測電子元件能在所述預設氣壓與所述預設溫度的環境下進行一非接觸測試作業。An embodiment of the present invention discloses an internal circulation non-contact testing equipment, which includes: a machine body; a testing device installed on the machine body, and the testing device includes: a first testing cavity and A second test chamber, both of which are installed on the machine body; wherein, the second test chamber and the first test chamber can move relative to each other along a first direction to be jointly closed to form a test chamber. space; the top of the first test chamber is formed with an opening connected to the test space; and a test carrier is provided in the second test chamber, and the test carrier is used for a test Test electronic components; a temperature adjustment device, which is installed in the first test cavity, and part of the temperature adjustment device is located in the test space; wherein, the temperature adjustment device includes: a temperature control The mechanism includes: a flow guide cover located in the test space, and the flow guide cover is located above the test carrier; and a temperature control unit configured in the flow guide cover and adjacent to the The opening; and a fan mechanism, installed at the opening of the first test chamber and facing the temperature control unit, and the test space is defined by the air guide and the fan mechanism. The inside and outside of the shroud circulate and follow an internal circulation path through the temperature control unit; wherein the fan mechanism can operate to form a circulating airflow flowing along the internal circulation path, and the circulation The air flow can pass through the temperature control unit to have a preset temperature; and an air supply device is connected to the test space; wherein the air supply device is used to introduce a predetermined gas into the test space and can The test space is brought to a preset air pressure, so that the electronic component to be tested disposed on the test carrier can perform a non-contact test operation in the environment of the preset air pressure and the preset temperature.
綜上所述,本發明實施例所公開的內循環式非接觸測試設備,其通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件可以經由非接觸方式(如:所述測試空間具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。To sum up, the internal circulation non-contact testing equipment disclosed in the embodiment of the present invention uses the structural coordination between multiple devices so that at least one of the electronic components to be tested can be tested in a non-contact manner (such as: The test space has the preset air pressure and the preset temperature) to adjust test parameters (such as temperature).
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.
以下是通過特定的具體實施例來說明本發明所公開有關“內循環式非接觸測試設備”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a specific example to illustrate the implementation of the "internal circulation non-contact testing equipment" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.
請參閱圖1至圖9所示,其為本發明的一實施例。本實施例公開一種內循環式非接觸測試設備100,用以對至少一個待測電子元件200進行一非接觸測試作業。也就是說,所述內循環式非接觸測試設備100是通過非接觸方式來對所述待測電子元件200進行測試參數(如:溫度)調整。據此,以接觸方式來調整待測電子元件之溫度的任何測試設備,其皆不同於本實施例所指的所述內循環式非接觸測試設備100。Please refer to FIG. 1 to FIG. 9 , which is an embodiment of the present invention. This embodiment discloses an internal circulation
如圖1至圖4所示,所述內循環式非接觸測試設備100於本實施例中包含有一機台本體1、安裝於所述機台本體1的一測試裝置2、協助所述測試裝置2運作的一抽氣裝置3、安裝於所述測試裝置2的一溫度調節裝置4、及安裝於所述溫度調節裝置4的一供氣裝置5,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述內循環式非接觸測試設備100也可以省略所述抽氣裝置3。As shown in Figures 1 to 4, the internal circulation
於本實施例中,所述測試裝置2包含有一第一測試腔體21、對應於所述第一測試腔體21的一第二測試腔體22、設置於所述第二測試腔體22的一測試載座23、位於所述第一測試腔體21與所述第二測試腔體22之間的一氣密墊圈24、及一密合機構25,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述內循環式非接觸測試設備100可依據設計需求而選擇性地採用所述氣密墊圈24及所述密合機構25至少其中之一、或是以其他構件取代。In this embodiment, the
所述第一測試腔體21與所述第二測試腔體22皆安裝於所述機台本體1,以使所述第二測試腔體22能與所述第一測試腔體21沿一第一方向D1(如:鉛錘方向)彼此相對地移動,以共同封閉形成有一測試空間S。需說明的是,所述第一測試腔體21與所述第二測試腔體22的具體結構可依設計需求而加以調整變化,所以下述僅說明其中一種可行的態樣。The
所述第一測試腔體21包含有一第一容置部211、相連於所述第一容置部211周緣的一第一密合部212、及形成於所述第一容置部211外表面與所述第一密合部212外表面的多個第一強化肋條213。於本實施例中,所述第一容置部211大致呈矩形槽且於其頂部形成有連通於所述測試空間S的一開口2111,所述第一密合部212相連於所述第一容置部211的槽口而呈矩形環狀。The
此外,所述第一測試腔體21於所述第一容置部211形成有連通於所述測試空間S的至少一個外接孔2112,並且至少一個所述外接孔2112的數量於本實施例中為多個,據以使所述抽氣裝置3與所述供氣裝置5各連接於至少一個所述外接孔2112而連通於所述測試空間S,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述抽氣裝置3及/或所述供氣裝置5也可依據設計需求、而通過所述第二測試腔體22(如:下述第二容置部221)另行開設的孔洞而連通於所述測試空間S。In addition, the
再者,所述第一容置部211、所述第一密合部212、及多個所述第一強化肋條213共同形成有多個第一開放式隔間214。其中,多個所述第一開放式隔間214之中的四個分別位於所述第一測試腔體21的多個角落,並且所述第一測試腔體21以四個所述第一開放式隔間214安裝固定於所述機台本體1(也就是,所述第一測試腔體21於本實施例中不會相對於所述機台本體1移動)。Furthermore, the first
所述第二測試腔體22包含有一第二容置部221、相連於所述第二容置部221周緣的一第二密合部222、及形成於所述第二容置部221外表面與所述第二密合部222外表面的多個第二強化肋條223。於本實施例中,所述第二容置部221大致呈矩形體,而所述測試載座23設置於所述第二容置部221,用以供至少一個所述待測電子元件200設置與進行電性測試;所述第二密合部222則是呈矩形環狀並形成有多個長形貫孔2221,並且所述第二密合部222形成有位於所述測試載座23與多個所述長形貫孔2221之間的一環形溝槽2222,以使所述氣密墊圈24嵌於所述環形溝槽2222內。The
再者,所述第二密合部222沿所述第一方向D1面向於所述第一密合部212,而所述氣密墊圈24位於所述第一密合部212與所述第二密合部222之間,並且多個所述第二強化肋條223的位置大致沿所述第一方向D1分別對應於多個所述第一強化肋條213。其中,所述第二容置部221、所述第二密合部222、及多個所述第二強化肋條223共同形成有多個第二開放式隔間224,並且多個所述第二開放式隔間224沿所述第一方向D1分別對應於多個所述第一開放式隔間214,而每個所述長形貫孔2221則是連通於一個所述第二開放式隔間224。Furthermore, the second sealing
依上所述,所述第一測試腔體21與所述第二測試腔體22能相對地移動,以使所述第一容置部211與所述第二容置部221共同包圍形成所述測試空間S,並且所述第一密合部212與所述第二密合部222夾持於所述氣密墊圈24,以實現一預合作業(如:圖4)。According to the above, the
進一步地說,所述第一測試腔體21與所述第二測試腔體22之間的作動於本實施例中是通過所述機台本體1來實現,以下說明所述機台本體1的其中一種可行態樣,但本發明不以此為限。Furthermore, in this embodiment, the action between the
如圖1至圖3所示,所述機台本體1包含有一軌道機構11(如:線性滑軌)與位置對應於所述軌道機構11的一升降機構12(如:氣壓缸或液壓缸)。其中,所述第二測試腔體22安裝於所述軌道機構11,以使所述第二測試腔體22能通過所述軌道機構11而沿垂直所述第一方向D1的一第二方向D2於一置料位置(如:圖1)與一作業位置(如:圖2和圖3)之間移動。As shown in Figures 1 to 3, the machine body 1 includes a track mechanism 11 (such as a linear slide rail) and a lifting mechanism 12 (such as a pneumatic cylinder or a hydraulic cylinder) positioned corresponding to the
舉例來說,如圖1所示,當所述第二測試腔體22位於所述置料位置時,所述第二測試腔體22相對於所述第一測試腔體21呈錯位設置,以使安裝於所述第二測試腔體22的所述測試載座23能用以供至少一個所述待測電子元件200設置。For example, as shown in FIG. 1 , when the
如圖2和圖3所示,當所述第二測試腔體22位於所述作業位置時,所述第二密合部222沿所述第一方向D1面向於所述第一密合部212,所述升降機構12的位置對應於位在所述作業位置的所述第二測試腔體22,並且所述升降機構12能驅使位在所述作業位置的所述第二測試腔體22沿所述第一方向D1移動而實現所述預合作業。As shown in FIGS. 2 and 3 , when the
如圖3至圖6所示,所述密合機構25包含一驅動器251、多個鎖合件252、及傳輸所述驅動器251動力至與多個所述鎖合件252的一傳動件253。其中,所述驅動器251安裝於所述機台本體1且鄰近於所述第一測試腔體21,並且所述驅動器251於本實施例中是以一驅動馬達來說明,其包含有作為動力輸出使用的一齒型部2511。As shown in FIGS. 3 to 6 , the
再者,每個所述鎖合件252具有分別位於相反兩端的一連動端部2521與一鎖合端部2522,並且多個所述鎖合件252可轉動地設置於所述第一測試腔體21的所述第一密合部212。於本實施例中,每個所述鎖合件252配置於一個所述第一開放式隔間214且直立地安裝於所述第一密合部212(也就是,多個所述連動端部2521的旋轉軸線彼此平行),並且每個所述鎖合件252的所述連動端部2521與所述鎖合端部2522是分別位於所述第一密合部212的相反兩側。Furthermore, each of the
更詳細地說,每個所述鎖合件252的所述連動端部2521為一齒輪,並且所述齒型部2511與多個所述連動端部2521配置在高於所述第一測試腔體21(也就是,遠離所述第二測試腔體22的所述第一測試腔體21一側)的一平面。此外,所述傳動件253連接所述驅動器251與多個所述鎖合件252的所述連動端部2521;也就是說,所述傳動件253於本實施例中為嚙合於所述齒型部2511與多個所述連動端部2521的一傳動鍊條,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述傳動件253與多個所述連動端部2521之間的配合也可以是採用皮帶與多個摩擦輪的方式實現;或者,所述驅動器251可以通過採用氣壓缸或液壓缸搭配其他構造來實現。In more detail, the interlocking
再者,多個所述鎖合端部2522的位置與形狀分別對應於多個所述長形貫孔2221的位置與形狀。據此,於所述預合作業之後,所述驅動器251能通過所述傳動件253而驅使多個所述鎖合件252同步轉動來實現一鎖合作業(如:圖5和圖6),以使每個所述鎖合件252的所述鎖合端部2522與所述第一密合部212分別夾持於所述第二密合部222的相反兩側。也就是說,每個所述鎖合端部2522於所述預合作業時穿過相對應的所述長形貫孔2221、並於所述鎖合作業時旋轉錯位於相對應的所述長形貫孔2221。Furthermore, the positions and shapes of the plurality of locking
需額外說明的是,基於所述密合機構25在實施所述鎖合作業之後,所述測試裝置2的所述測試空間S需能夠長時間維持在高壓環境,所以對於所述密合機構25的所述鎖合作業之密合度要求極高(如:所述驅動器251必須以極大的輸出動力來實現所述鎖合作業),因而導致所述鎖合作業不易於實施。It should be additionally noted that after the
據此,如圖2至圖6所示,於所述預合作業之後,所述內循環式非接觸測試設備100於本實施例中是進一步採用所述抽氣裝置3(如:幫浦)來對所述測試空間S進行一抽真空作業,以使所述測試空間S呈現負壓狀態、而令所述第一密合部212與所述第二密合部222更為緊密地抵接(或更為緊密地夾持所述氣密墊圈24),用以利於所述密合機構25接著實施所述鎖合作業(如:所述驅動器251能以較小的輸出動力來實現所述鎖合作業),使得所述測試空間S能夠通過所述密合機構25而長時間維持在高壓環境。Accordingly, as shown in FIGS. 2 to 6 , after the preparatory work, the internal circulation
更詳細地說,所述抽氣裝置3連通於所述第一容置部211與所述第二容置部221的至少其中之一(如:所述抽氣裝置3於本實施例中是連通於所述第一容置部211),據以連通於所述測試空間S而能夠實施所述抽真空作業。In more detail, the air extraction device 3 is connected to at least one of the
如圖6至圖9所示,所述溫度調節裝置4安裝於所述第一測試腔體21,並且所述溫度調節裝置4的部分位於所述測試空間S之內。具體來說,所述溫度調節裝置4包含有一溫控機構41、安裝於所述第一測試腔體21(如:所述開口2111)的一風扇機構43、及位於所述測試空間S之內的一加熱燈具42。As shown in FIGS. 6 to 9 , the
所述溫控機構41包含有一導流罩411及配置於所述導流罩411內的一溫控單元412。其中,所述導流罩411位於所述測試空間S內並且位在所述測試載座23的上方。The
更詳細地說,所述導流罩411包含有鄰近於所述開口2111的一配置管4111、及自所述配置管4111底緣朝向所述第二測試腔體22延伸的一罩體4112。其中,所述罩體4112的容積自所述配置管4111朝所述第二測試腔體22的方向呈漸增狀;也就是說,所述罩體4112大致呈截錐狀且其較佳是與所述第一測試腔體21及所述第二測試腔體22之間留有間隙。In more detail, the
再者,所述溫控單元412設置於所述導流罩411(如:所述配置管4111)內且鄰近於所述開口2111,並且所述溫控單元412包含有一升溫器4121(如:電熱器)與一降溫器4122(如:蒸發器)的至少其中之一。也就是說,所述溫控單元412於本實施例中能夠依據設計需求而搭配需要的所述升溫器4121的數量與所述降溫器4122的數量。Furthermore, the
所述風扇機構43安裝於所述第一測試腔體21的所述開口2111且面向所述溫控單元412,並且所述測試空間S通過所述導流罩411與所述風扇機構43而定義有於所述導流罩411內側與外側進行循環且沿經所述溫控單元412的一內循環路徑。所述風扇機構43能運轉而形成有沿所述內循環路徑流動的一循環氣流F,並且所述循環氣流F能通過所述溫控單元412而具有一預設溫度。其中,位於所述測試空間S之內的所述加熱燈具42能用以搭配所述溫控單元412(如:所述升溫器4121)來加熱所述循環氣流F,據以有效地提升加熱效率。The
進一步地說,所述風扇機構43較佳是要能避免影響所述測試空間S內的所述循環氣流F的溫度與壓力,所以所述風扇機構43於下述內容是以其中一種可行的態樣來說明,但本發明不受限於此。Furthermore, the
於本實施例中,所述風扇機構43包含有一框體431、安裝於所述框體431的一馬達432、安裝於所述框體431內的一阻隔層433、可轉動地穿設於所述阻隔層433的一轉軸434、固定於所述轉軸434的一扇葉435、位於所述框體431內的一隔熱聯軸器436、及一外殼437,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述外殼437也可依據設計需求而省略或以其他構件取代。In this embodiment, the
更詳細地說,所述框體431大致呈方管狀且其一端安裝於所述開口2111,所述馬達432安裝於所述框體431的另一端,並且所述馬達432的一輸出軸4321位於所述框體431之內,而所述馬達432的本體位於所述框體431之外。再者,所述阻隔層433鄰近於所述框體431與所述開口2111的交界處,以隔絕所述框體431內的空間與所述測試空間S之間的溫度與氣壓。In more detail, the
所述轉軸434的一端位於所述框體431之內,並且所述轉軸434的另一端位於所述導流罩411(如:所述配置管4111)之內,而所述扇葉435固定於所述轉軸434的所述另一端,所述扇葉435位於所述配置管4111內且鄰近於所述溫控單元412。其中,所述輸出軸4321與所述轉軸434皆沿著一預設軸線L配置,並且所述隔熱聯軸器436連接所述輸出軸4321與所述轉軸434的所述一端。據此,所述輸出軸4321與所述轉軸434不但能通過所述隔熱聯軸器436而同步轉動,並且所述輸出軸4321與所述轉軸434還能通過所述隔熱聯軸器436而有效地降低熱能的彼此相互傳遞。One end of the
需額外說明的是,所述框體431較佳是形成有位置對應於所述隔熱聯軸器436的一拆裝孔4311,據以使所述隔熱聯軸器436能通過所述拆裝孔4311而於所述框體431內進行安裝或拆卸。再者,所述外殼437安裝於所述第一測試腔體21的所述頂部且其包覆且封閉所述框體431與所述馬達432(如:所述本體)於內,據以使所述馬達432和所述隔熱聯軸器436能通過所述外殼437而與外部環境隔開。It should be noted that the
依上所述,所述馬達432能以所述輸出軸4321、並通過所述隔熱聯軸器436與所述轉軸434而驅使所述扇葉435轉動,以形成於所述測試空間S內流動經過所述溫控單元412的所述循環氣流F。據此,所述溫度調節裝置4於本實施例中通過所述隔熱聯軸器436與所述阻隔層433,以使其所形成的氣流之溫度能夠不被所述馬達432影響,進而精準地被控制。As mentioned above, the
需說明的是,所述扇葉435是指能夠通過轉動而形成氣流的構造,所以所述扇葉435的具體構造可依據設計需求而加以調整變化、並不受限於圖式所呈現的構造。舉例來說,在本發明未繪示的其他實施例中,所述扇葉435可以是利於機械增壓的渦輪構造。It should be noted that the
此外,所述風扇機構43於本實施例中能夠依據實際需求而選擇性地執行一第一運轉模式(如:圖7)或一第二運轉模式(如:圖8)。具體來說,如圖7所示,當所述風扇機構43執行所述第一運轉模式時,所述風扇機構43的所述扇葉435轉動,以形成沿著所述內循環路徑且自所述扇葉435朝向所述溫控單元412(或所述測試載座23)流動的所述循環氣流F,據以利於使所述循環氣流F能夠較為快速地與至少一個所述待測電子元件200進行熱能交換。或者,如圖8所示,當所述風扇機構43執行所述第二運轉模式時,所述扇葉435轉動,以形成沿著所述內循環路徑且自所述溫控單元412朝向所述扇葉435流動的所述循環氣流F,據以使所述測試空間S內的溫度分佈較為穩定。In addition, in this embodiment, the
需額外說明的是,在實施所述鎖合作業之後,所述測試空間S大致呈真空狀態,所以所述內循環式非接觸測試設備100可以採用所述供氣裝置5通入一預定氣體至所述測試空間S、並能使所述測試空間S達到一預設氣壓,以使設置於所述測試載座23的至少一個所述待測電子元件200能在所述預設氣壓與所述預設溫度的環境下進行所述非接觸測試作業。It should be additionally noted that after the locking operation is performed, the test space S is generally in a vacuum state, so the internal circulation
依上所述,所述內循環式非接觸測試設備100於本實施例中是通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件200可以經由非接觸方式(如:所述測試空間S具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。As mentioned above, in this embodiment, the internal circulation
此外,所述供氣裝置5所輸出的所述預定氣體可依據需求而加以變化;舉例來說,所述預定氣體可以採用乾燥氣體或是分子量大於空氣的氣體(如:二氧化碳氣體),據以進一步形成具有預設溫度的所述循環氣流F,進而利於所述測試空間S快速地達到所述預設氣壓。In addition, the predetermined gas output by the
[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]
綜上所述,本發明實施例所公開的內循環式非接觸測試設備,其通過多個裝置之間的結構搭配,以使得至少一個所述待測電子元件可以經由非接觸方式(如:所述測試空間具有所述預設氣壓與所述預設溫度)來對進行測試參數(如:溫度)的調整。To sum up, the internal circulation non-contact testing equipment disclosed in the embodiment of the present invention uses the structural coordination between multiple devices so that at least one of the electronic components to be tested can be tested in a non-contact manner (such as: The test space has the preset air pressure and the preset temperature) to adjust test parameters (such as temperature).
再者,本發明實施例所公開的內循環式非接觸測試設備,其進一步採用所述抽氣裝置來對所述測試空間進行抽真空作業,以使所述測試空間呈現負壓狀態、而令所述第一密合部與所述第二密合部更為緊密地抵接(或更為緊密地夾持所述氣密墊圈),用以利於所述密合機構接著實施所述鎖合作業(如:所述驅動器能以較小的輸出動力來實現所述鎖合作業),使得所述測試空間能夠通過所述密合機構而長時間維持在高壓環境。Furthermore, the internal circulation non-contact test equipment disclosed in the embodiment of the present invention further uses the air extraction device to perform vacuuming operation on the test space, so that the test space presents a negative pressure state, so that The first sealing part and the second sealing part abut more closely (or clamp the airtight gasket more closely) to facilitate the sealing mechanism to then implement the locking cooperation. operation (for example, the driver can realize the locking operation with a smaller output power), so that the test space can be maintained in a high-pressure environment for a long time through the sealing mechanism.
另外,本發明實施例所公開的溫度調節裝置,其通過所述隔熱聯軸器與所述阻隔層,以使其所形成的氣流之溫度能夠不被所述馬達影響,進而精準地被控制。In addition, the temperature regulating device disclosed in the embodiment of the present invention uses the thermal insulation coupling and the barrier layer so that the temperature of the air flow formed can not be affected by the motor and can be accurately controlled. .
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. within.
100:內循環式非接觸測試設備 1:機台本體 11:軌道機構 12:升降機構 2:測試裝置 21:第一測試腔體 211:第一容置部 2111:開口 2112:外接孔 212:第一密合部 213:第一強化肋條 214:第一開放式隔間 22:第二測試腔體 221:第二容置部 222:第二密合部 2221:長形貫孔 2222:環形溝槽 223:第二強化肋條 224:第二開放式隔間 23:測試載座 24:氣密墊圈 25:密合機構 251:驅動器 2511:齒型部 252:鎖合件 2521:連動端部 2522:鎖合端部 253:傳動件 3:抽氣裝置 4:溫度調節裝置 41:溫控機構 411:導流罩 4111:配置管 4112:罩體 412:溫控單元 4121:升溫器 4122:降溫器 42:加熱燈具 43:風扇機構 431:框體 4311:拆裝孔 432:馬達 4321:輸出軸 433:阻隔層 434:轉軸 435:扇葉 436:隔熱聯軸器 437:外殼 5:供氣裝置 S:測試空間 F:循環氣流 D1:第一方向 D2:第二方向 L:預設軸線 200:待測電子元件100: Internal circulation non-contact testing equipment 1:Machine body 11: Orbital mechanism 12:Lifting mechanism 2:Test device 21: The first test cavity 211:First Accommodation Department 2111:Open your mouth 2112: External hole 212:First Close Unit 213:The first reinforced rib 214: First open compartment 22: Second test chamber 221:Second Accommodation Department 222:Second Close Section 2221: Long through hole 2222: Annular groove 223: Second reinforced rib 224: Second open compartment 23:Test carrier 24: Air sealing gasket 25: Close mechanism 251:drive 2511:Tooth profile part 252:Lock parts 2521: Linked end 2522:Locked end 253: Transmission parts 3: Air extraction device 4: Temperature adjustment device 41:Temperature control mechanism 411:Shroud 4111:Configuration management 4112:Cover body 412:Temperature control unit 4121:heater 4122: Cooler 42:Heating lamps 43:Fan mechanism 431:frame 4311: Disassembly and assembly holes 432: Motor 4321:Output shaft 433: Barrier layer 434:Shaft 435:Fan blade 436:Thermal insulation coupling 437: Shell 5:Air supply device S: test space F: circulating air flow D1: first direction D2: second direction L: Default axis 200: Electronic components to be tested
圖1為本發明實施例的內循環式非接觸測試設備的立體示意圖。Figure 1 is a three-dimensional schematic diagram of an internal circulation non-contact testing device according to an embodiment of the present invention.
圖2為圖1的後續作動的立體示意圖。FIG. 2 is a schematic three-dimensional view of the subsequent actions of FIG. 1 .
圖3為圖2的平面剖視示意圖。FIG. 3 is a schematic cross-sectional plan view of FIG. 2 .
圖4為圖2的後續作動的立體剖視示意圖。FIG. 4 is a schematic three-dimensional cross-sectional view of the subsequent actions of FIG. 2 .
圖5為圖4的後續作動的立體剖視示意圖。FIG. 5 is a schematic three-dimensional cross-sectional view of the subsequent actions of FIG. 4 .
圖6為圖5的後續作動以使所述內循環式非接觸測試設備處於非接觸測試作業的立體剖視示意圖。FIG. 6 is a schematic three-dimensional cross-sectional view of the subsequent actions of FIG. 5 to put the internal circulation non-contact testing equipment into non-contact testing operation.
圖7為本發明實施例的所述內循環式非接觸測試設備在風扇機構處於第一運轉模式時的平面剖視示意圖。7 is a schematic plan view of the internal circulation non-contact testing equipment when the fan mechanism is in the first operating mode according to the embodiment of the present invention.
圖8為本發明實施例的所述內循環式非接觸測試設備在所述風扇機構處於第二運轉模式時的平面剖視示意圖。8 is a schematic plan view of the internal circulation non-contact testing device when the fan mechanism is in the second operating mode according to the embodiment of the present invention.
圖9為本發明實施例的所述風扇機構的立體剖視示意圖。Figure 9 is a schematic three-dimensional cross-sectional view of the fan mechanism according to the embodiment of the present invention.
100:內循環式非接觸測試設備 100: Internal circulation non-contact testing equipment
1:機台本體 1:Machine body
11:軌道機構 11: Orbital mechanism
12:升降機構 12:Lifting mechanism
2:測試裝置 2:Test device
21:第一測試腔體 21: The first test chamber
211:第一容置部 211:First Accommodation Department
2111:開口 2111:Open your mouth
2112:外接孔 2112: External hole
212:第一密合部 212:First Close Unit
213:第一強化肋條 213: The first reinforced rib
214:第一開放式隔間 214: First open compartment
22:第二測試腔體 22: Second test chamber
221:第二容置部 221:Second Accommodation Department
222:第二密合部 222:Second Close Section
2222:環形溝槽 2222: Annular groove
223:第二強化肋條 223: Second reinforced rib
224:第二開放式隔間 224: Second open compartment
23:測試載座 23:Test carrier
24:氣密墊圈 24: Air sealing gasket
25:密合機構 25: Close mechanism
252:鎖合件 252:Lock parts
2521:連動端部 2521: Linked end
253:傳動件 253: Transmission parts
3:抽氣裝置 3: Air extraction device
4:溫度調節裝置 4: Temperature adjustment device
41:溫控機構 41:Temperature control mechanism
411:導流罩 411:Shroud
4111:配置管 4111:Configuration management
4112:罩體 4112:Cover body
412:溫控單元 412:Temperature control unit
4121:升溫器 4121:heater
4122:降溫器 4122: Cooler
42:加熱燈具 42:Heating lamps
43:風扇機構 43:Fan mechanism
5:供氣裝置 5:Air supply device
S:測試空間 S: test space
F:循環氣流 F: circulating air flow
D1:第一方向 D1: first direction
L:預設軸線 L: Default axis
200:待測電子元件 200: Electronic components to be tested
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111148359A TWI833504B (en) | 2022-12-16 | 2022-12-16 | Non-contact testing apparatus with internal circulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111148359A TWI833504B (en) | 2022-12-16 | 2022-12-16 | Non-contact testing apparatus with internal circulation |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI833504B true TWI833504B (en) | 2024-02-21 |
TW202426934A TW202426934A (en) | 2024-07-01 |
Family
ID=90825134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111148359A TWI833504B (en) | 2022-12-16 | 2022-12-16 | Non-contact testing apparatus with internal circulation |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI833504B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005325A2 (en) * | 2000-07-11 | 2002-01-17 | Temptronic Corporation | Chuck with heat exchanger and temperature control fluid |
CN1534754A (en) * | 2003-03-21 | 2004-10-06 | Զ���� | Temperature monitoring system of test classifier |
CN105051556A (en) * | 2013-03-15 | 2015-11-11 | 泰拉丁公司 | Air circulation in a system |
US20160091559A1 (en) * | 2014-09-25 | 2016-03-31 | Pentamaster Instrumentation Sdn Bhd | Apparatus for Burn-In Test |
TW201818053A (en) * | 2016-11-14 | 2018-05-16 | 精工愛普生股份有限公司 | Temperature-measuring apparatus, inspection apparatus, and control method |
-
2022
- 2022-12-16 TW TW111148359A patent/TWI833504B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005325A2 (en) * | 2000-07-11 | 2002-01-17 | Temptronic Corporation | Chuck with heat exchanger and temperature control fluid |
CN1534754A (en) * | 2003-03-21 | 2004-10-06 | Զ���� | Temperature monitoring system of test classifier |
CN105051556A (en) * | 2013-03-15 | 2015-11-11 | 泰拉丁公司 | Air circulation in a system |
US20160091559A1 (en) * | 2014-09-25 | 2016-03-31 | Pentamaster Instrumentation Sdn Bhd | Apparatus for Burn-In Test |
TW201818053A (en) * | 2016-11-14 | 2018-05-16 | 精工愛普生股份有限公司 | Temperature-measuring apparatus, inspection apparatus, and control method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6178507B2 (en) | Fully automatic vacuum drying furnace | |
CN105618884A (en) | Horizontal type vacuum furnace for diamond particle brazing | |
KR20190070840A (en) | Integrated chamber for vacuum coating | |
TWI833504B (en) | Non-contact testing apparatus with internal circulation | |
CN109092022B (en) | Internal and external circulation air duct switching structure and humidity control device thereof | |
CN208078480U (en) | One kind can dehumidify ring heat radiating type electric power cabinet | |
TW202426934A (en) | Non-contact testing apparatus with internal circulation | |
KR101021114B1 (en) | Cooling system for battery of driving vehicle | |
TWI833503B (en) | Testing apparatus | |
CN104637837B (en) | Reaction chamber and plasma processing device | |
TWI833506B (en) | Non-contact testing apparatus with dual-circulation | |
TWI839023B (en) | Non-contact testing apparatus with external circulation | |
TWI836799B (en) | Temperature adjustment device of testing apparatus | |
CN218276274U (en) | Vacuum sealing motor | |
TW202426925A (en) | Testing apparatus | |
TW202426936A (en) | Temperature adjustment device of testing apparatus | |
TW202426935A (en) | Non-contact testing apparatus with external circulation | |
TW202426937A (en) | Non-contact testing apparatus with dual- circulation | |
CN108517393A (en) | A kind of Full-automatic high-temperature heat treatment cycle system | |
CN109404306B (en) | Centrifugal hot air circulating fan capable of cooling inside kiln | |
CN112161435B (en) | Rapid cooling vacuum drying device and method | |
TWM472484U (en) | Isothermal pressurized oven | |
CN207781547U (en) | A kind of solidification apparatus for baking of multichip IC packaging technology section | |
CN218269906U (en) | Double-station negative pressure drying box | |
CN112652553B (en) | Loading chamber and semiconductor processing equipment |