TWI832496B - Heat dissipation structure having insulation protective design - Google Patents

Abstract

A heat dissipation structure suitable for being disposed on a circuit board and thermally coupled to a heat source on the circuit board is provided. The heat dissipation structure includes a heat sink, a liquid metal thermal grease, a first protection layer and a second protection layer. The heat sink is located above the heat source, and the heat source is located between the heat sink and the circuit board. The liquid metal thermal grease is disposed between the heat sink and the heat source, and the heat sink is thermally coupled to the heat source through the liquid metal thermal grease. The first protective layer contacts the heat sink and is located between the heat sink and the circuit board. The second protection layer contacts the first protection layer and the circuit board, and is located between the first protection layer and the circuit board. The first protective layer and the second protective layer surround the liquid metal thermal grease and the heat source. A width of the second protective layer is able to be increased by being compressed by the first protective layer.

Description

Heat dissipation structure with insulation protection design

The present invention relates to a heat dissipation structure, and in particular to a heat dissipation structure with an insulation protection design.

As the computing performance of electronic devices continues to improve, how to quickly dissipate the heat generated when the central processing unit or graphics processor inside the electronic device is running has always been a major research and development project of relevant manufacturers.

Generally speaking, the heat sink is thermally coupled to the central processing unit or the graphics processor, and the evaporation section of the heat pipe is thermally coupled to the heat sink, so that the liquid working fluid in the evaporation section absorbs heat and evaporates into a gaseous working fluid. Then, the gaseous working fluid flows from the evaporation section to the condensation section, and the airflow generated when the fan is running is blown to the condensation section for heat exchange, so that the gaseous working fluid releases heat and condenses into liquid working fluid and flows back from the condensation section to the evaporation section.

Currently, heat sinks are mostly fixed to central processing units or graphics processors using thermal grease. Because liquid metal thermal grease has extremely excellent thermal conductivity, it is gradually favored by related manufacturers. Because the liquid metal thermal paste is conductive, if the liquid metal thermal paste is squeezed by the heat sink and overflows to the circuit board, it is very likely that the liquid metal thermal paste will contact the electronic components on the circuit board (such as circuits, passive components or circuits). contact) resulting in a short circuit.

The present invention provides a heat dissipation structure that can avoid short circuit.

The present invention proposes a heat dissipation structure, which is suitable for being disposed on a circuit board and thermally coupled to a heat source on the circuit board. The heat dissipation structure includes a heat sink, a liquid metal heat dissipation paste, a first protective layer and a second protective layer. The heat sink is located above the heat source, and the heat source is located between the heat sink and the circuit board. The liquid metal heat dissipation paste is disposed between the heat sink and the heat source, and the heat sink is thermally coupled to the heat source through the liquid metal heat dissipation paste. The first protective layer contacts the heat sink and is located between the heat sink and the circuit board. The second protective layer contacts the first protective layer and the circuit board, and is located between the first protective layer and the circuit board. The first protective layer and the second protective layer surround the liquid metal thermal paste and the heat source. The first protective layer has a first width, wherein the second protective layer before being extruded by the first protective layer has a second width smaller than the first width, and the second protective layer after being extruded by the first protective layer has a width greater than the first width. The third width of one width.

Based on the above, the heat dissipation structure of the present invention has an insulation protection design to prevent liquid metal heat dissipation paste from overflowing onto the circuit board and causing a short circuit.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic cross-sectional view of the heat dissipation structure in a first state according to an embodiment of the present invention. FIG. 2 is a schematic bottom view of the heat dissipation structure of FIG. 1 . FIG. 3 is a schematic cross-sectional view of the heat dissipation structure in a second state according to an embodiment of the present invention. Please refer to FIGS. 1 to 3 . In this embodiment, the heat dissipation structure 100 can be used to dissipate the heat generated by the heat source 10 in the electronic device. The heat dissipation structure 100 and the heat source 10 are disposed on the circuit board 20 , and the heat source 10 is disposed on the circuit board 20 . between the heat dissipation structure 100 and the circuit board 20 . Specifically, the heat dissipation structure 100 includes a heat sink 110 , a liquid metal heat dissipation paste 120 , a first protective layer 130 and a second protective layer 140 . The heat sink 110 can be made of copper, aluminum or other high thermal conductivity materials, and is located on the heat source 10 above. The liquid metal heat dissipation paste 120 is disposed between the heat sink 110 and the heat source 10 , and the heat sink 110 is thermally coupled to the heat source 10 through the liquid metal heat dissipation paste 120 .

The heat source 10 may include an electronic component 11 and a carrier board 12 carrying the electronic component 11 , wherein the carrier board 12 is connected to the circuit board 20 , and the carrier board 12 is located between the electronic component 11 and the circuit board 20 . On the other hand, the electronic component 11 is located between the liquid metal heat dissipation paste 120 and the carrier 12 , in which the heat sink 110 is bonded to the electronic component 11 through the liquid metal heat dissipation paste 120 , and the electronic component 11 serves as the main heat source. Therefore, the heat generated by the electronic component 11 can be transferred to the heat sink 110 through the liquid metal heat dissipation paste 120 . For example, the electronic component 11 can be a central processing unit or a graphics processor, and is electrically connected to the circuit board 20 through the carrier board 12 .

As shown in FIGS. 1 and 3 , the electronic component 11 and the carrier board 12 fall within the orthographic projection range of the heat sink 110 on the circuit board 20 , that is to say, the heat sink 110 covers one side of the heat source 10 . Increase heat reception.

Please refer to FIGS. 1 to 3 . In this embodiment, the first protective layer 130 and the second protective layer 140 are stacked between the heat sink 110 and the circuit board 20 and surround the liquid metal heat dissipation paste 120 and the heat source 10 . In detail, the first protective layer 130 contacts the heat sink 110 and is located between the heat sink 110 and the circuit board 20 . The second protective layer 140 contacts the first protective layer 130 and the circuit board 20 and is located between the first protective layer 130 and the circuit board 20 . That is to say, the first protective layer 130 and the circuit board 20 are separated by the second protective layer 140 .

As shown in FIGS. 1 and 2 , the first protective layer 130 and the second protective layer 140 are both hollow rectangular structures. The material of the first protective layer 130 may include gold, aluminum, rubber or foam, and the second protective layer 130 may be made of gold, aluminum, rubber or foam. 140 may be composed of insulating glue. For example, the second protective layer 140 can be formed on the first protective layer 130 by dispensing, coating or printing (such as screen printing), and the first protective layer 130 can be attached and fixed through the second protective layer 140 on the circuit board 20.

In the first state shown in FIG. 1 , the second protective layer 140 has not been squeezed by the first protective layer 130 , so the first protective layer 130 has a first width W1 , and the second protective layer 140 has a width smaller than the first width W1 . The second width of W1 is W2. In addition, the second protective layer 140 before being squeezed by the first protective layer 130 is separated from the carrier plate 12 , that is, between the second protective layer 140 before being squeezed by the first protective layer 130 and the edge of the carrier plate 12 Maintain gap G.

The first protective layer 130 has a bottom surface 131 facing the circuit board 20 , and the second protective layer 140 has a top surface 141 facing the heat sink 110 . Specifically, the bottom surface 131 of the first protective layer 130 contacts the top surface 141 of the second protective layer 140. When the second protective layer 140 is not squeezed by the first protective layer 130, the top surface 141 of the second protective layer 140 The surface area is smaller than the surface area of the bottom surface 131 of the first protective layer 130, as shown in FIG. 1 .

In the second state shown in FIG. 3 , the second protective layer 140 is squeezed by the first protective layer 130 and deformed. At this time, the width of the first protective layer 130 (ie, the first width W1) may remain unchanged, but the second protective layer 140 expands laterally after being squeezed, so that the width of the second protective layer 140 changes from the second width W2 increases to the third width W3, and the third width W3 is larger than the first width W1. In addition, since the width of the second protective layer 140 increases from the second width W2 to the third width W3, the surface area of the top surface 141 of the second protective layer 140 increases and is larger than the surface area of the bottom surface 131 of the first protective layer 130.

Furthermore, the second protective layer 140 squeezed by the first protective layer 130 contacts the carrier board 12 and fills the gap G (see FIG. 1 ) to prevent the liquid metal thermal paste 120 from overflowing to the circuit board 20 and causing short circuit.

As shown in FIG. 3 , since the first protective layer 130 and the second protective layer 140 are blocked between the liquid metal heat dissipation paste 120 and the circuit board 20 , even if the liquid metal heat dissipation paste 120 overflows, the first protective layer 130 and the second protective layer 130 will not be connected to the circuit board 20 . The second protective layer 140 can also block the liquid metal thermal paste 120 to prevent the liquid metal thermal paste 120 from contacting the circuit board 20 .

Please refer to FIGS. 1 and 3 . When the second protective layer 140 is not squeezed by the first protective layer 130 , the second protective layer 140 has a first thickness T. When the second protective layer 140 is squeezed by the first protective layer 130, the second protective layer 140 expands in the transverse direction and compresses in the longitudinal direction. That is to say, the second protective layer 140 after being squeezed by the first protective layer 130 The thickness of is reduced from the first thickness T to the second thickness T1.

To sum up, the heat dissipation structure of the present invention has an insulation protection design to prevent liquid metal heat dissipation paste from overflowing onto the circuit board and causing a short circuit. Furthermore, the insulation protection design is composed of a first protective layer and a second protective layer, and is blocked between the liquid metal heat dissipation paste and the circuit board, so it can prevent the liquid metal heat dissipation paste from overflowing to the circuit board and causing a short circuit.

Although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the appended patent application scope.

10:Heat source

11: Electronic components

12: Carrier board

20:Circuit board

100:Heat dissipation structure

110:Heat sink

120: Liquid metal thermal paste

130:First protective layer

131: Bottom surface

140:Second layer of protection

141:Top surface

G: Gap

T: first thickness

T1: second thickness

W1: first width

W2: second width

W3: third width

FIG. 1 is a schematic cross-sectional view of the heat dissipation structure in a first state according to an embodiment of the present invention. FIG. 2 is a schematic bottom view of the heat dissipation structure of FIG. 1 . FIG. 3 is a schematic cross-sectional view of the heat dissipation structure in a second state according to an embodiment of the present invention.

10:Heat source

11: Electronic components

12: Carrier board

20:Circuit board

100:Heat dissipation structure

110:Heat sink

120: Liquid metal thermal paste

130:First protective layer

131: Bottom surface

140:Second layer of protection

141:Top surface

G: Gap

T: first thickness

W1: first width

W2: second width

Claims (9)

A heat dissipation structure with an insulation protection design, suitable for being disposed on a circuit board and thermally coupled to a heat source on the circuit board, wherein the heat dissipation structure includes: The heat sink is located above the heat source, and the heat source is located between the heat sink and the circuit board; Liquid metal heat dissipation paste is disposed between the heat sink and the heat source, and the heat sink is thermally coupled to the heat source through the liquid metal heat dissipation paste; A first protective layer contacts the heat sink and is located between the heat sink and the circuit board, wherein the first protective layer surrounds the liquid metal thermal paste and the heat source; and The second protective layer contacts the first protective layer and the circuit board, and is located between the first protective layer and the circuit board, wherein the second protective layer surrounds the liquid metal thermal paste and the heat source, The first protective layer has a first width, wherein the second protective layer before being squeezed by the first protective layer has a second width smaller than the first width, and the third protective layer after being squeezed by the first protective layer The second protective layer has a third width greater than the first width. The heat dissipation structure with insulation protection design as claimed in claim 1, wherein the heat source includes an electronic component and a carrier board carrying the electronic component, and the electronic component is located between the liquid metal heat dissipation paste and the carrier board, and the carrier board Connected to the circuit board and located between the electronic component and the circuit board, wherein the second protective layer surrounds the carrier board. The heat dissipation structure with an insulating protection design as claimed in claim 2, wherein the second protective layer before being extruded by the first protective layer is separated from the carrier plate, and the third protective layer after being extruded by the first protective layer The second protective layer contacts the carrier board. The heat dissipation structure with an insulating protection design as claimed in claim 2, wherein a gap is maintained between the second protective layer and the carrier plate before being squeezed by the first protective layer, and is squeezed by the first protective layer The second protective layer fills the gap. The heat dissipation structure with an insulating protection design as claimed in claim 1, wherein the second protective layer before being squeezed by the first protective layer has a first thickness, and the second protective layer after being squeezed by the first protective layer The protective layer has a second thickness less than the first thickness. The heat dissipation structure with insulation protection design as claimed in claim 1, wherein the material of the second protection layer includes insulating glue. The heat dissipation structure with insulation protection design as claimed in claim 1, wherein the first protection layer is made of gold, aluminum, rubber or foam. The heat dissipation structure with insulation protection design as claimed in claim 1, wherein the first protective layer has a bottom surface facing the circuit board, and the second protective layer has a top surface facing the heat sink, and the first protective layer The bottom surface contacts the top surface of the second protective layer. The surface area of the top surface of the second protective layer before being squeezed by the first protective layer is smaller than the surface area of the bottom surface of the first protective layer, and is affected by the third protective layer. After a protective layer is extruded, the surface area of the top surface of the second protective layer is greater than the surface area of the bottom surface of the first protective layer. The heat dissipation structure with insulation protection design as claimed in claim 1, wherein both the first protection layer and the second protection layer are hollow rectangular structures.

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