TWI832349B - Method for manufacturing heat dissipation device - Google Patents

Abstract

A method for manufacturing heat dissipation device comprises: providing at least one heat pipe, a heat dissipation base seat having a channel at one side, a fixing plate and a heat dissipation fin set; placing the at least one heat pipe correspondingly onto the channel of the heat dissipation base seat so that the surface of the at least one heat pipe is flush with a surface of the heat dissipation base seat, using the fixing plate to press against the at least one heat pipe to anchor the at least one heat pipe on the heat dissipation base seat; providing a fixing jig having a base and an upper cover, placing an end of the heat dissipation fin set onto the base and placing the heat dissipation base seat on another end of the heat dissipation fin set, covering the upper cover correspondingly to the heat dissipation base seat, fastening the heat dissipation base seat with the upper cover by screwing four corners of the upper cover; putting the fixing jig with the associated heat dissipation base seat and the associated heat dissipation fin set into a welding furnace for a certain time and taking out for cooling afterward and disassembling the fixing jig and the fixing plate. Accordingly, the welding of a heat device can be fully and integrally accomplished in a welding furnace in one time.

Description

Heat sink manufacturing method

A heat sink manufacturing method, in particular, a heat sink manufacturing method that only requires a single pass of furnace welding to shorten the manufacturing time through the assistance of a jig.

Heat dissipation devices are divided into heat-absorbing elements and heat-dissipating elements according to different characteristics and details. According to the corresponding heat sources, bases of different structures or shapes must be used to combine and fix the heat-absorbing or heat-dissipating elements to form a heat dissipation device. The more common fixed ones The method is to integrate the heat-absorbing and heat-dissipating components and the base through welding. The welding method of the heat-dissipating device is: usually a solder layer is first coated on the surface of the part where the heat-absorbing and the base are to be combined, and the heat-absorbing and heat-dissipating components are combined with the base. After the base is clamped and fixed by the jig, it is placed in a heating furnace (soldering furnace) for the first time to perform heating and welding work. After the solder layer is melted, it is then taken out of the heating furnace and cooled to complete the first step. After the first heating and welding operation, the jig is dismantled and the components that have been welded for the first time are removed after cooling. You may choose to cut, grind or flatten the heat-absorbing unit to make it flush with the surface of the base. After that, repeat the previous assembly operation, assemble the base combined with the heat-absorbing unit and the heat-dissipating element (the combined surface of the two is coated with a solder layer) and put it into the heating furnace again through the jig clamping Carry out heating and welding work and subsequent cooling operations and fixture removal operations. In addition, if you want to recombine other heat dissipation and heat conduction components, you must repeat the above various operating procedures again, that is, as the heat dissipation device dissipates heat, The more heat-absorbing components there are, the more installation and disassembly of different fixtures must be repeated multiple times, and the whole unit must be repeatedly placed into the heating furnace for heating, and then taken out of the heating furnace for cooling. Therefore, when you want to The more parts are assembled, the number of repeated heating and welding operations will increase, thereby increasing the man-hours, and multiple sets of combined and fixed jigs must be developed, which in turn consumes a lot of manufacturing costs. Therefore, how to reduce the number of heating and welding operations? , as well as reducing the development and use of fixed tools, thereby reducing man-hours and saving costs, are the top goals for those in this craft.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a device that only needs to enter the heating furnace once to complete the welding of all components to form a heat sink, thereby reducing the need to repeatedly enter the welding furnace for heating and cooling. times, thereby reducing labor hours and manufacturing costs.

In order to achieve the above purpose, the present invention provides a heat sink manufacturing method, which includes the following steps: Step 1: Provide a heat pipe, a heat sink base with a groove on one side, a fixed plate, a heat sink fin set, and a solder layer. ; Step 2: Set the heat pipe into the groove of the heat dissipation base, make the surface of the heat pipe flush with the surface of the heat dissipation base, then press the heat pipe through the fixing plate and fix it on the heat dissipation base; Step 3: Provide a fixed fixture with a base and an upper cover, place one end of the heat dissipation fin set on the base, and place the heat dissipation base on the heat dissipation fins On the other end of the upper cover, place the corresponding cover of the upper cover on the heat dissipation base, and then lock and fix the base and the upper cover with screw locks through the four corners of the upper cover; Step 4: Attach the The fixed fixture assembled with the heat dissipation base and the heat dissipation fins is sent into the welding furnace for a period of time and then taken out to cool, and the fixed fixture and the fixed plate are removed.

The present invention can improve the traditional manufacturing process of the heat dissipation device, which requires entering the welding furnace multiple times for heating and taking out the cooling device. All welding work can be completed by entering the welding furnace without repeated heating and cooling, thereby reducing working hours and lowering manufacturing costs.

1:Heat pipe

2: Cooling base

21: First side

22: Second side

23: Groove

24:Trench

25:Through hole

3: Fixed plate

31:Perforation

:Cooling fin set 4

41:Heating side

42: Endothermic side

5:bolt

51: Nut

6: Fixed fixture

61:Pedestal

62: Upper cover

63: concave part

7:Screw lock component

Figure 1 is a manufacturing flow chart of the heat sink manufacturing method of the present invention; Figure 2 is a schematic diagram of the heat sink manufacturing method of the present invention; Figure 3 is a schematic diagram of the heat sink manufacturing method of the present invention;

The above objects and structural and functional characteristics of the present invention will be explained based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1, 2, and 3, which are the manufacturing flow chart and structural schematic diagram of the heat sink manufacturing method of the present invention. As shown in the figures, the heat sink manufacturing method of the present invention includes the following steps: Step 1: Provide a heat pipe and a heat dissipation base with a groove on one side, a fixing plate, a heat dissipation fin set and a solder layer; at least one heat pipe 1 and a heat dissipation base 2 and a fixing plate 3 and a heat dissipation fin set 4 are provided, and A solder layer is pre-coated on the parts where the aforementioned components are to be combined with each other. The heat dissipation base 2 has a first side 21 and a second side 22, and are respectively provided on the upper and lower sides of the heat dissipation base 2. , a groove 23 is provided on the first side 21, the heat pipes 1 are provided in the groove 23, the groove 23 can be connected or not connected to the second side 22, and the heat dissipation fin group 4 is provided on the On the second side 22, the solder layer can be provided, for example, by coating the solder layer on the surface of the heat pipe 1 in advance, or by setting a solder layer and the heat dissipation base between the heat pipe 1 and the groove 23 of the heat dissipation base 2. 2. The surface of the heat dissipation fin group 4 and the side surface of the heat dissipation fin group 4 and the heat dissipation base 2 are heated. After heating, the solder layer or solder is melted to combine and fix the heat pipe in the recess. inside the tank.

A plurality of perforations 31 are provided on the surface of the fixing plate 3, the main purpose of which is to reduce the weight of the fixing plate 3, and the perforations 31 can also increase the cooling efficiency after welding.

Step 2: Set the heat pipe into the groove of the heat dissipation base, and make the surface of the heat pipe flush with the surface of the heat dissipation base. Then press the heat pipe through the fixing plate and fix it on the heat dissipation base; first Place the heat pipe 1 correspondingly into the groove 23 of the heat dissipation base 2, and then apply external pressure to the portion of the heat pipe 1 that protrudes from the groove 23, so that the heat pipe 1 protrudes from the groove 23. The part is flush with the surface of the first side 21 of the heat dissipation base 2, and external pressure can be applied through mechanical processing, such as rolling processing, forging processing, stamping processing, milling processing or grinding.

At the same time, in order to temporarily position the heat pipe 1 in the groove 23 of the heat dissipation base 2, the fixing plate 3 is used to cover the surface of the first side 21 of the heat dissipation base 2, covering the heat pipe 1 and the groove at the same time. 23. The fixing plate 3 is locked to one side (the first side 21) of the heat dissipation base 2 with the groove 23 through a pair of bolts 5, and at the same time, the heat pipe 1 is pressed so that the heat pipe 1 is temporarily fixed in the groove. 23, the heat dissipation base 2 has a through hole 25 corresponding to the position where the bolts 5 are locked. The through hole 25 can be provided with internal threads so that the bolts 5 can be directly locked, or in another location. A nut 51 is provided on one side for the bolt 5 to be inserted and locked.

Step 3: Provide a fixed fixture with a base and an upper cover, place one end of the heat dissipation fin set on the base, and place the heat dissipation base on the heat dissipation fins On the other end, attach the corresponding cover of the upper cover to the heat dissipation base, and then lock and fix the base and the upper cover with screw locks through the four corners of the upper cover.

Step 3: Provide a fixed fixture with a base and an upper cover, place one end of the heat dissipation fin set on the base, and place the heat dissipation base on the heat dissipation fins On the other end, attach the corresponding cover of the upper cover to the heat dissipation base, and then lock and fix the base and the upper cover with screw locks through the four corners of the upper cover; A fixed fixture 6 is provided. The fixed fixture 6 is mainly used to temporarily position and assemble the aforementioned heat dissipation base 2 and the heat dissipation fin group 4. The fixed fixture 6 has a base 61 and an upper cover 62. The heat dissipation fin set 4 has a heat absorption side 42 and a heat dissipation side 41, which are respectively arranged on the upper and lower sides of the heat dissipation fin set 4.

First, the heat dissipation fin group 4 is correspondingly arranged above the base 61 through the heat dissipation side 41, and then the aforementioned heat dissipation base 2 is arranged above the heat absorption side 42 of the heat dissipation fin group 4, and then through the fixing fixture The upper cover 62 of 6 is correspondingly pressed above the heat dissipation base 2, and because the fixing plate 3 is locked on the surface of the first side 21 of the heat dissipation base 2 and is higher than the surface of the first side 21, in order to To make the upper cover 62 lock more firmly, the upper cover 62 has a recess 63 on one side relative to the fixed plate 3, and the fixed plate 3 can be correspondingly accommodated in the recess 63, then the base 61 and the four corners of the upper cover 62 are penetrated with a screw lock element 7 to lock and fix the base 61 and the upper cover 62 .

Step 4: Put the fixed fixture assembled with the heat dissipation base and the heat dissipation fins into the welding furnace for a period of time, take it out to cool, and remove the fixed fixture and the fixed plate.

Put the heat dissipation base 2, heat pipe 1, and heat dissipation fin set 4 that have been clamped and fixed by the fixing jig 6 into the soldering furnace for one-time heating. After the solder layer is heated and melted, the heat dissipation base 2. After solid solution bonding occurs on the surfaces of the heat pipe 1 and the heat dissipation fin group 4, they are taken out of the welding furnace and cooled, and the fixing fixture 6 and the fixing plate 3 are removed to complete the welding operation.

The present invention temporarily assembles and fixes the heat dissipation base, heat pipe, and heat dissipation fin group through the fixing plate and the fixing fixture, and places them together in the welding furnace for heating operation, which improves the need for conventional heat dissipation devices with more than one component. Welding and bonding requires multiple heating and cooling operations, which is very time-consuming. The manufacturing method of the present invention only needs to enter the welding furnace once for heating and take it out for cooling, and then all processing operations can be completed, which shortens the working hours and reduces the manufacturing cost.

Claims (6)

A method for manufacturing a heat dissipation device, which includes the following steps: Step 1: Provide a heat pipe, a heat dissipation base with a groove on one side, a fixed plate, a heat dissipation fin set and a solder layer; Step 2: Set the heat pipe accordingly into the groove of the heat dissipation base, and make the surface of the heat pipe flush with the surface of the heat dissipation base, then press the heat pipe through the fixing plate and fix it on the heat dissipation base; Step 3: Provide a fixing fixture. The fixed fixture has a base and an upper cover. One end of the heat dissipation fin set is placed on the base, and the heat dissipation base is placed on the other end of the heat dissipation fins. The upper cover is The corresponding cover of the board is attached to the heat dissipation base, and then the base and the upper cover are locked and fixed with screw locks through the four corners of the upper cover; Step 4: Assemble the heat dissipation base and heat dissipation fins The fixed fixture is sent into the welding furnace for a period of time and then taken out to cool, and the fixed fixture and the fixed plate are removed. In the heat dissipation device manufacturing method described in claim 1 of the patent application, the upper cover plate has a recessed portion on one side relative to the fixing plate, and the fixing plate can be correspondingly accommodated in the recessed portion. For example, in the manufacturing method of the heat dissipation device described in item 1 of the patent application, the fixing plate is locked on one side of the heat dissipation base with the groove through a pair of bolts, and at the same time, the heat pipe is pressed, so that the heat pipe is temporarily fixed on the heat dissipation base. inside the groove. For example, in the manufacturing method of a heat dissipation device described in item 1 of the patent application, the surface of the heat pipe and the surface of the heat dissipation base are aligned by machining to press the heat pipe into the groove and flatten the surface of the heat pipe. Cut flush with the surface of the cooling base. For example, in the method for manufacturing a heat dissipation device described in item 1 of the patent application, in step 1, the solder layer can be pre-coated on the surface of the heat pipe, or a solder layer can be provided between the heat pipe and the groove of the heat dissipation base to be heated. The solder layer or solder is then melted to combine and fix the heat pipe in the groove. For example, in the manufacturing method of a heat dissipation device described in Item 1 of the patent application, the heat dissipation fin group has a heat absorption side and a heat dissipation side, and are respectively arranged on the upper and lower sides of the heat dissipation fin group.

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