TWI831667B - Device for transferring electronic component - Google Patents

Abstract

The present invention provides a device for transferring electronic component, including: a first frame, which is used to carry a carrier on which an electronic component is to be transferred; a second frame, which is used to carry a substrate, which is arranged opposite to the first frame; a pushing element, which is arranged adjacent to the first frame and controlled by an actuating mechanism, can face the carrier carried on the first frame, and act a pushing action to the electronic component to be transferred through the carrier; and a supporting element, which is arranged adjacent to the second frame, can provide a regional support surface to the substrate carried on the second frame when the pushing element is acting the pushing action. The device for transferring electronic component of the present invention is suitable for transferring electronic component, such as LED.

Description

Device for transferring electronic components

The present application relates to a device for transferring electronic components, and in particular, to a device for transferring electronic components that includes a support element.

With the miniaturization of electronic components, the transfer of electronic components between carriers and substrates requires increasingly higher precision and stability of equipment.

When the substrate is carried on the frame, the center area of the substrate will be positioned slightly lower than the edge area due to gravity, so that the center area and edge area of the substrate are not located on the same plane. This phenomenon that the central area and edge area of the substrate are not on the same plane due to gravity is not conducive to the transfer of electronic components. Therefore, traditional devices for transferring electronic components have problems with poor transfer efficiency and accuracy in the central area of the substrate.

In view of the above-mentioned shortcomings of traditional devices for transferring electronic components. The present invention provides a device for transferring electronic components, thereby improving the problem of poor transfer efficiency and accuracy caused by the central area and edge area of the substrate not being on the same plane when transferring electronic components.

In order to achieve the above objects and other objects, the present invention provides a device for transferring electronic components, which includes: a first frame, which is used to carry a carrier on which an electronic component is to be transferred. The above-mentioned device for transferring electronic components also includes: a second frame, which is used to carry a substrate and is arranged relative to the first frame. The above-mentioned device for transferring electronic components also includes: a resisting component, which is disposed adjacent to the first frame and is controlled by an actuating mechanism. It can face the carrier carried on the first frame and pass through the first frame. The carrier acts against the electronic component to be transferred. The above-mentioned device for transferring electronic components also includes: a supporting element, which is disposed adjacent to the second frame, and which can support the supporting element carried on the second frame when the resisting element is in a resisting action. The base plate provides a regional support surface.

In the above device for transferring electronic components, the second frame can move relative to the support element, so that the support element can provide the regional support surface at different positions of the substrate carried by the second frame.

In the above-mentioned device for transferring electronic components, the supporting element can be a hollow body and can provide an annular regional supporting surface.

In the above-mentioned device for transferring electronic components, the material of the supporting component can be light-transmissive.

In the above-mentioned device for transferring electronic components, the light-transmissible material may be quartz, diamond or glass.

The above-mentioned device for transferring electronic components may further include an energy beam generating mechanism, which can generate an energy beam passing through the hollow part of the supporting element and acting on the substrate carried by the second frame.

The above-mentioned device for transferring electronic components may further include an energy beam generating mechanism that can generate an energy beam that passes through the support element and acts on the substrate carried by the second frame.

In the above device for transferring electronic components, the energy beam generating mechanism can be a laser beam generating mechanism.

The above-mentioned device for transferring electronic components may further include a camera that can capture an image of the substrate carried by the second frame through the hollow part of the supporting component.

The above-mentioned device for transferring electronic components may further include a camera that can capture an image of the substrate carried by the second frame through the supporting component.

By providing a supporting element, the device for transferring electronic components of the present invention can improve the problem of poor transfer efficiency and accuracy caused by the central area and edge area of the substrate not being on the same plane when transferring electronic components.

10: Devices used to transfer electronic components

11:First frame

12:Second frame

13: Push against the component

14:Support element

14’: Support element

111: Want to transfer electronic components

111’: To transfer electronic components

112: Carrier

121:Substrate

131: Actuating mechanism

141: Regional support surface

141’: Regional support surface

20: Devices for transferring electronic components

21:First frame

22:Second frame

23: Push against components

24:Support element

25: Energy beam generating mechanism

211: Want to transfer electronic components

212: Carrier

221:Substrate

231: Actuating mechanism

241:Regional support surface

251:Energy Beam

30: Devices for transferring electronic components

31:First frame

32: Second frame

33: Push against components

34:Support element

35:Camera

311: To transfer electronic components

312: Carrier

321:Substrate

331: Actuating mechanism

341: Regional support surface

X:X axis

Y:Y axis

Z:Z axis

For convenience of description and clarity, the size of each element in the drawings is exaggerated, omitted, or schematically depicted. At the same time, the size of each component does not fully reflect its true size.

[Fig. 1] is a schematic diagram of a device for transferring electronic components according to Embodiment 1 of the present invention; [Fig. 2] is a schematic diagram of the electronic components and supporting elements in the device for transferring electronic components according to Embodiment 1 of the present invention. A schematic top view of the relationship; [Fig. 3] is a schematic top view of the relative relationship between electronic components and supporting components in a device for transferring electronic components according to another embodiment of the present invention; [Fig. 4] is an embodiment of the present invention. 2 is a schematic diagram of a device for transferring electronic components; and [Fig. 5] is a schematic diagram of a device for transferring electronic components according to Embodiment 3 of the present invention.

Example 1

Please refer to Figures 1, 2 and 3. Figure 1 is a schematic diagram of a device for transferring electronic components according to Embodiment 1 of the present invention; and Figures 2 and 3 are schematic diagrams of a device for transferring electronic components according to Embodiment 1 of the present invention. A schematic top view of the relative relationship between electronic components and supporting components in an electronic component device. As shown in FIGS. 1 , 2 and 3 , the device 10 for transferring electronic components in Embodiment 1 includes: a first frame 11 , a second frame 12 , a resisting component 13 and a supporting component 14 .

As shown in FIG. 1 , the first frame 11 is used to carry a carrier 112 on which an electronic component 111 is to be transferred.

As shown in FIG. 1 , the second frame 12 is used to carry a substrate 121 , which is disposed relative to the first frame 11 .

As shown in FIG. 1 , the resisting element 13 is disposed adjacent to the first frame 11 and is controlled by an actuating mechanism 131 to face the carrier 112 carried on the first frame 11 and to the carrier 112 through the carrier 112 . To transfer the electronic component 111 is a pushing action.

As shown in Figures 1 and 2, the support element 14 is disposed adjacent to the second frame 12, and can support the base plate 121 carried on the second frame 12 when the resisting element 13 is in a resisting action. A regional support surface 141 is provided.

As shown in Figure 2, in this embodiment, the support element 14 provides an annular regional support surface 141. The outer diameter of the support element 14 is approximately equal to the length of the diagonal of the square electronic component 111 to be transferred, and The inner diameter of the supporting element 14 is slightly larger than the side of the square electronic component 111 to be transferred. However, the present invention is not limited thereto. Those skilled in the art can adjust the shape and size of the supporting surface 141 according to the shape and size of the electronic component 111 to be transferred.

As shown in Figure 3, in another embodiment, the support element 14' is provided with an annular regional support surface 141', and the inner diameter of the support element 14' is slightly larger than the square of the electronic component to be transferred 111'. The length of the corner line.

When the actuating mechanism 131 drives the resisting component 13 to move downward to push against the electronic component 111 to be transferred through the carrier 112 , since the supporting component 14 is loaded on the second frame 12 The substrate 121 provides a regional support surface 141 so that the central region and the edge region of the substrate 121 are located on the same plane, which is conducive to the transfer of the electronic components 111 to be transferred and effectively improves the transfer efficiency and accuracy of the electronic components 111 to be transferred.

In a preferred embodiment, the second frame 12 is movable relative to the support element 14 so that the support element 14 can provide the regional support surface 141 at different positions of the substrate 121 carried by the second frame 12 , but the present invention is not limited to this.

In a preferred embodiment, the supporting element 14 is a hollow body, which can provide an annular regional supporting surface 141, whereby the electronic component 111 to be transferred can be observed through the hollow part of the supporting element 14, or the electronic component 111 to be transferred can be observed. An energy beam is made to irradiate the electronic component 111 to be transferred through the hollow part of the supporting element 14, but the invention is not limited thereto.

In a preferred embodiment, the material of the supporting element 14 is light-transmissive, whereby the electronic component 111 to be transferred can be observed through the supporting element 14, or an energy beam can be irradiated through the supporting element 14. The electronic component 111 is to be transferred, but the invention is not limited thereto. In this preferred embodiment, the light-transmissible material may be quartz, diamond or glass, but the invention is not limited thereto.

In a preferred embodiment, the carrier 112 is a blue film, but the invention is not limited thereto.

In a preferred embodiment, the substrate 121 is a glass substrate, but the invention is not limited thereto.

In a preferred embodiment, the first frame 11 can move horizontally along the X-axis and Y-axis parallel to the surface of the carrier 112, and can also rotate along the R-axis that runs vertically through the center of the carrier 112. In addition, the first frame 11 can also move up and down along the Z-axis perpendicular to the surface of the carrier 112 .

In a preferred embodiment, the second frame 12 can move horizontally along the X-axis and Y-axis parallel to the surface of the substrate 121, and can also move up and down along the Z-axis perpendicular to the surface of the substrate 121.

In a preferred embodiment, the device 10 for transferring electronic components may include multiple sets of resisting components 13 and supporting components 14 to further improve the efficiency of transferring electronic components.

Example 2

Please refer to FIG. 4 which is a schematic diagram of a device for transferring electronic components according to Embodiment 2 of the present invention. As shown in FIG. 4 , the device 20 for transferring electronic components in Embodiment 2 includes: a first frame 21 , a second frame 22 , a resisting element 23 , a supporting element 24 and an energy beam generating mechanism 25 .

As shown in FIG. 4 , the first frame 21 is used to carry a carrier 212 on which an electronic component 211 is to be transferred.

As shown in FIG. 4 , the second frame 22 is used to carry a substrate 221 , which is disposed relative to the first frame 21 .

As shown in FIG. 4 , the resisting element 23 is disposed adjacent to the first frame 21 and is controlled by an actuating mechanism 231 to face the carrier 212 carried on the first frame 21 and to the carrier 212 through the carrier 212 . To transfer the electronic component 211 is a pushing action.

As shown in FIG. 4 , the support element 24 is disposed adjacent to the second frame 22 and can provide an area for the base plate 221 carried on the second frame 22 when the resisting element 23 is in a resisting action. Support surface 241.

Compared with Embodiment 1, the supporting element 24 of Embodiment 2 is a hollow body, whereby an energy beam 251 can pass through the hollow part of the supporting element 24 and irradiate the electronic component 211 to be transferred.

Compared with Embodiment 1, Embodiment 2 further includes an energy beam generating mechanism 25, which can generate an energy beam 251 through the hollow part of the support element 24 and act on the substrate 221 carried by the second frame 22, thereby This can further enable the energy beam 251 to irradiate the adhesive between the electronic component 211 to be transferred and the carrier 212 to weaken the adhesive force between the electronic component 211 to be transferred and the carrier 212 to facilitate the transfer. Transfer of electronic components 211.

In another embodiment including the energy beam generating mechanism 25, the supporting element 24 is not hollow, but the material of the supporting element 24 is light-transmissible, whereby the energy beam 251 can pass through the supporting element 24 and act. on the substrate 221 carried by the second frame 22 . That is, in an embodiment including the energy beam generating mechanism 25 , the supporting element 24 can be a hollow body or the material of the supporting element 24 can be light-transmissive, as long as the energy beam 251 can pass through the supporting element 24 That’s it.

In a preferred embodiment, the energy beam generating mechanism 25 is a laser beam generating mechanism, but the invention is not limited thereto.

Example 3

Please refer to FIG. 5 which is a schematic diagram of a device for transferring electronic components according to Embodiment 3 of the present invention. As shown in FIG. 5 , the device 30 for transferring electronic components in Embodiment 3 includes: a first frame 31 , a second frame 32 , a resisting component 33 , a supporting component 34 and a camera 35 .

As shown in FIG. 5 , the first frame 31 is used to carry a carrier 312 on which an electronic component 311 is to be transferred.

As shown in FIG. 5 , the second frame 32 is used to carry a substrate 321 , which is disposed relative to the first frame 31 .

As shown in FIG. 5 , the resisting element 33 is disposed adjacent to the first frame 31 and is controlled by an actuating mechanism 331 to face the carrier 312 carried on the first frame 31 and to the carrier 312 through the carrier 312 . To transfer the electronic component 311 is a pushing action.

As shown in FIG. 5 , the support element 34 is disposed adjacent to the second frame 32 and can provide an area for the base plate 321 carried on the second frame 32 when the resisting element 33 is in a resisting action. Support surface 341.

Compared with Embodiment 1, the supporting element 34 of Embodiment 3 is a hollow body, whereby a camera 35 can capture an image of the substrate 321 carried by the second frame 32 through the hollow part of the supporting element 34 .

Compared with Embodiment 1, Embodiment 3 further includes a camera 35, which can capture an image of the substrate 321 carried by the second frame 32 through the hollow part of the support element 34, whereby the captured image can be analyzed. The image taken is used to determine whether the position of the electronic component 311 to be transferred to the substrate 321 is as expected.

In another embodiment including a camera 35, the supporting element 34 is not hollow, but the material of the supporting element 34 is light-transmissible, so that the camera 35 can capture the second image through the supporting element 34. Image of the substrate 321 carried by the frame 32. That is, in the embodiment including the camera 35, the supporting element 34 can be a hollow body or the material of the supporting element 34 can be light-transmissive, as long as The camera 35 can be allowed to capture the image of the substrate 321 carried by the second frame 32 through the supporting element 34 .

In a preferred embodiment including a camera 35, the camera 35 can move up and down along a Z-axis perpendicular to the surface of the substrate 321 carried by the second frame 32, thereby focusing to capture clearer images. image. In addition, the camera 35 can also move horizontally along the X-axis and Y-axis parallel to the surface of the substrate 321 carried by the second frame 32 to capture images of each electronic component 311 to be transferred.

In a preferred embodiment, the device for transferring electronic components of the present invention can include an energy beam generating mechanism and a camera at the same time, whereby the device for transferring electronic components is also equipped with an energy beam generating mechanism to weaken the It has two functions: transferring the adhesive force between the electronic component and the carrier, and capturing the image of the substrate carried by the second frame.

In a preferred embodiment that includes both a laser beam generating mechanism and a camera, a half-reflecting mirror can be disposed below the supporting element, and the energy beam generating mechanism and the camera are respectively disposed on the transmission and reflection sides of the half-reflecting mirror. on the path, so that the substrate carried by the second frame can be irradiated by the energy beam while capturing images through the camera.

In summary, the device for transferring electronic components of the present invention, by providing a supporting element, can effectively improve the problem caused by the central area and edge area of the substrate not being on the same plane when transferring electronic components, thereby improving the Efficiency and accuracy in transferring electronic components. In a preferred embodiment of the present invention, by further including an energy beam generating mechanism, the energy beam generating mechanism can further weaken the adhesion between the electronic component to be transferred and the carrier, thereby further improving the efficiency of transferring the electronic component. and accuracy. In a preferred embodiment of the present invention, by further including a camera, an image of the substrate carried by the second frame can be further captured to further determine whether the position of the electronic component to be transferred to the substrate is as expected. .

The device for transferring electronic components of the present invention is suitable for transferring electronic components, such as LEDs.

10: Devices used to transfer electronic components

11:First frame

12:Second frame

13: Push against the component

14:Support element

111: Want to transfer electronic components

112: Carrier

121:Substrate

131: Actuating mechanism

141: Regional support surface

X:X axis

Y:Y axis

Z:Z axis

Claims (9)

A device for transferring electronic components, which includes: a first frame, which is used to carry a carrier on which an electronic component is to be transferred; a second frame, which is used to carry a substrate, which is opposite to the carrier The first frame is provided with; a resisting element, which is provided adjacent to the first frame and is controlled by an actuating mechanism, can face the carrier carried on the first frame, and use the carrier to push the electronic component to be transferred A pushing action; and a supporting element disposed adjacent to the second frame, which can provide a regional support surface for the substrate carried on the second frame when the pushing element is in a pushing action. , wherein the material of the supporting element is light-transmissible. The device for transferring electronic components as described in claim 1, wherein the second frame is movable relative to the supporting element, so that the supporting element can provide the area support at different positions of the substrate carried by the second frame. noodle. The device for transferring electronic components as described in claim 1, wherein the supporting component is a hollow body that can provide an annular regional supporting surface. The device for transferring electronic components as described in claim 1, wherein the light-transmissive material is quartz, diamond or glass. The device for transferring electronic components as described in claim 3 further includes an energy beam generating mechanism that can generate an energy beam that passes through the hollow part of the supporting element and acts on the substrate carried by the second frame. The device for transferring electronic components as described in claim 1 further includes an energy beam generating mechanism that can generate an energy beam that passes through the support element and acts on the substrate carried by the second frame. The device for transferring electronic components as described in claim 5 or 6, wherein the energy beam generating mechanism is a laser beam generating mechanism. The device for transferring electronic components as described in claim 3 further includes a camera that can capture an image of the substrate carried by the second frame through the hollow part of the supporting component. The device for transferring electronic components as described in claim 1 further includes a camera that can capture an image of the substrate carried by the second frame through the supporting component.

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