TWI829418B - Wafer magnetic fixing mechanism and wafer magnetic fixture comprising thereof - Google Patents

Abstract

The present invention discloses a wafer magnetic fixing mechanism, comprising a main body, a device positioning portion, and a wafer alignment groove. The device positioning portion is combined with the bottom side of the main body, and the device positioning portion is provided with a mechanism fixing portion. The device positioning part is combined with one side of a platform. The wafer alignment groove is an open groove that extends in the horizontal direction from the main body. The shape of the wafer alignment groove matches the shape of the outer edge of one of the sidewalls of the wafer, so that the outer edge of one of the sidewalls of the wafer is aligned to precisely position the wafer.

Description

Wafer magnetic positioning mechanism and wafer magnetic positioning jig containing the same

The present invention relates to a wafer positioning mechanism and a wafer positioning fixture including the same, and in particular to a wafer magnetic positioning mechanism that facilitates rapid and accurate positioning and a wafer magnetic positioning fixture including the same.

In an era of advanced technological innovation and rapid technological changes, integrated circuit components have the characteristics of small size and powerful functions, so they are widely used in various fields or types of electronic products. In order to realize more miniaturized and high-performance electronic products, there is an increasing demand for thin wafers. While reducing the size of the wafers, it is necessary to ensure that the performance of subsequent fabricated memories or power devices is not affected or even possible. It has better electrical performance, heat dissipation performance, etc., giving electronic products more advantages.

At present, the most common wafer thinning method is grinding, which means that during the wafer manufacturing process, a wafer grinding and thinning process is required to reduce the thickness of the wafer and flatten the surface. In general, wafer grinding During the procedure, tape is first attached to the surface of the wafer for protection, and then the wafer is placed on the grinder table with the back side facing up, and the grinder is allowed to grind the back side of the wafer to achieve the purpose of thinning the wafer. thickness.

In addition, during the wafer manufacturing process, after the wafer is cut from the ingot or ingot, the saw lines and damaged layers on the surface or the laser slicing burnt or damaged areas need to be polished to remove the defective areas. And make the wafer surface reach a relatively flat state. During the process, the wafer needs to be adsorbed and fixed through a vacuum suction cup to facilitate subsequent surface grinding with a grinding wheel to flatten it.

When performing a planarization process for wafer thinning or removal of defective areas, accurately positioning the wafer on the carrier platform is a very important step. For example, in wafer processing equipment that uses vacuum suction cups as the carrying platform, operators must visually adjust the wafer positioning to complete the wafer positioning operation. This method not only takes too much time to calibrate, resulting in low efficiency, but also reduces the positioning accuracy. Differences arise due to the experience of the operator. Therefore, the present invention provides a wafer magnetic positioning mechanism and a wafer magnetic positioning jig including the same to solve the above problems.

The main purpose of the present invention is to provide a wafer magnetic positioning mechanism, which includes a body part, a device positioning part, and a wafer alignment groove. The device positioning part is combined with the bottom side of the body part, and a mechanical magnetic attraction part is provided on the device positioning part. The wafer alignment groove is an open groove formed by extending in the horizontal direction from the body part. The shape of the wafer alignment groove is consistent with the shape of the outer edge of one side wall of a wafer to provide space for the middle part of the wafer. The outer edge of one side wall is aligned to position the wafer.

Furthermore, the magnetic attraction part of the mechanism is a magnet or a magnetic adsorption piece.

Further, the wafer alignment groove is an arc-shaped opening groove, the outer edge of one of the side walls is the circumferential area of the wafer, and the arc-shaped opening groove conforms to the curvature of the circumferential area for the outer edge of the side wall to pass Depend on.

Furthermore, the arc-shaped opening groove further includes a protruding portion, the protruding portion conforms to the shape of the notch of the wafer for leaning against the notch on the outer edge of the side wall.

Further, the wafer alignment groove is a trapezoidal opening groove, the outer edge of one of the side walls is a flat edge area of the wafer, and the trapezoidal opening groove conforms to the shape of the flat edge area for the outer edge of the side wall. Depend on fate.

Further, the outer edge of one of the side walls further includes circumferential areas located on opposite sides of the flat edge area of the wafer, and the opposite sides of the trapezoidal opening groove further include an arcuate portion consistent with the curvature of the circumferential area. Provides support for the circumferential area of the wafer.

Further, the material of the wafer magnetic positioning mechanism is metal, metal alloy, ceramic, silicon carbide, metal nitride, metal oxide, rubber, plastic, glass fiber composite material, carbon fiber composite material, organic fiber composite material or A combination of the above materials.

Another object of the present invention is to provide a wafer magnetic positioning fixture, which includes a wafer magnetic positioning mechanism as described above and a platform. The platform includes a platform body, a wafer setting table on the top side of the platform body, and a platform magnetic part provided on one side of the platform body corresponding to the magnetic part of the mechanism. Through the platform magnetic part and the magnetic part of the mechanism, Correspondingly, the wafer magnetic positioning mechanism is fixed on the platform body. When the wafer magnetic positioning mechanism is fixed on the platform, the bottom side of the wafer alignment groove abuts the wafer on the top side of the platform body. The table is arranged so that the wafer alignment groove is supported by the outer edge of one side wall of the wafer in the horizontal direction.

Further, the platform body includes a base and a wafer suction disk disposed on the base, and the wafer setting table is disposed on the top side of the wafer suction disk.

Further, the magnetic suction part of the platform is arranged around the periphery of the platform body, and the number of the magnetic suction parts of the wafer magnetic suction positioning mechanism is at least two, and each of the magnetic suction parts of the mechanism respectively attracts the magnetic suction part of the platform so that the magnetic suction part of the platform is The wafer magnetic positioning mechanism is fixed on the platform.

Furthermore, the magnetic attraction part of the platform is a first magnet with opposite magnetic poles to the adjacent two sides, and the magnetic attraction part of the mechanism is a second magnet or a magnetic adsorption piece that respectively attracts the adjacent first magnets.

Further, the other two magnetic attraction portions of the platform on adjacent sides of each magnetic attraction portion of the platform body have opposite magnetic poles to each other.

Further, the magnetic attraction part of the platform is a magnetic adsorption piece, and the magnetic attraction part of the mechanism is a magnet that respectively attracts the magnetic attraction part of the platform.

Furthermore, the magnetic attraction part of the mechanism is a magnetic adsorption part, and the magnetic attraction part of the platform is a magnet corresponding to the magnetic attraction part of the mechanism.

Therefore, the wafer magnetic positioning mechanism and the wafer magnetic positioning fixture of the present invention help to position the wafer quickly and accurately, and help improve the work efficiency of the operation. In addition, the wafer magnetic positioning mechanism and the wafer magnetic positioning fixture of the present invention have a simple structure, are easy to process and manufacture, and are convenient to operate. In addition, the wafer magnetic positioning mechanism and the wafer magnetic positioning fixture of the present invention can be used in equipment with a low degree of automation, and can also be used in automated equipment, and have a wide range of applications.

The detailed description and technical content of this creation are described below with reference to the drawings. Furthermore, the figures in this creation are for convenience of explanation, and their proportions may not be drawn according to actual proportions, but may be exaggerated. These figures and their proportions are not intended to limit the scope of this creation.

Please refer to "Figure 1" to "Figure 2", which are schematic appearance views of the first to sixth embodiments of the wafer magnetic positioning mechanism of the present invention, and "Figure 3", which are different embodiments of the wafer alignment groove of the present invention. The top schematic diagram and "Fig. 4" to "Fig. 5" are combination schematic diagrams (1) and (2) of different embodiments of the wafer magnetic positioning fixture of the present invention, as shown in the figures.

The present invention discloses a wafer magnetic positioning mechanism 100, which is used to be combined with the platform 200 (as shown in "Fig. 4" and "Fig. 5") to accurately position the wafer WF to facilitate processing of the wafer WF. The materials of the wafer magnetic positioning mechanism 100 include, but are not limited to, metals, metal alloys, ceramics, silicon carbide, metal nitrides, metal oxides, rubber, plastics, glass fiber composite materials, carbon fiber composite materials, and organic fibers. Composite materials or combinations of the above materials, or any other single material or composite materials used to form a solid structure and are not adsorbed by magnets. In one embodiment, the processing includes, for example, wafer defective layer removal, wafer grinding, wafer polishing, and thinning procedures, which are not limited in the present invention.

The wafer magnetic positioning mechanism 100 includes a body part 10, a device positioning part 20, and a wafer alignment groove 30. The device positioning part 20 is combined with the bottom side of the body part 10 for assembly on the platform. On one side of the device 200, the device positioning portion 20 is provided with a mechanical magnetic attraction portion 21. The magnetic attraction part 21 of the mechanism is, for example, but not limited to, a magnet or a magnetic adsorption piece. The magnet (or magnet) is an object that can attract the magnetic adsorption piece and generate a magnetic field outside it, and the magnetic adsorption piece is, for example, But it is not limited to metals or alloys containing iron, nickel, cobalt, or components or structures containing material properties of paramagnetic or ferromagnetic properties to be adsorbed by magnets. The platform 200 is provided with a corresponding magnetic adsorption mechanism. 21 components or structures, the following paragraphs will describe the combination of the wafer magnetic positioning mechanism 100 and the platform 200 in detail. The magnetic attraction part 21 of the mechanism is, for example, but not limited to, coupled to the bottom side of the body part 10 through fitting, snapping, adhesion or other ways or means. This is not limited in the present invention and will be explained here. .

The wafer alignment groove 30 is an open groove formed by the main body 10 extending in the horizontal direction D1 (as shown in "Fig. 4" and "Fig. 5"). The shape of the wafer alignment groove 30 is consistent with the shape of the wafer alignment groove 30. The shape of the outer edge LS of one of the side walls of the circle WF is consistent, so that the outer edge LS of one of the side walls of the wafer can be aligned to accurately position the wafer WF. Specifically, the wafer alignment groove 30 opens in the horizontal direction D1 (that is, the direction parallel to the surface of the platform 200 ), and the opening is consistent in shape with the outer edge LS of the side wall of the wafer WF. In addition to being completely consistent, the shapes described above may also be partially consistent. For example, the wafer alignment groove 30 may be in a zigzag shape (such as (A) in "Figure 3") or a wavy shape (such as in "Figure 3"). (B)) or other similar shapes, when a chord is determined by two points on the circumference, the shape is consistent if at least the two most protruding points form a stop (interference) with the wafer WF. This is explained first.

In one embodiment, as shown in (A) in "Figure 1" and "Figure 2" (first and fourth embodiments of the wafer magnetic positioning mechanism 100), the wafer alignment groove 30 It is an arc-shaped opening groove, and the outer edge LS of one of the side walls is the circumferential area of the wafer WF, and the arc-shaped opening groove conforms to the curvature of the circumferential area for the outer edge LS of the side wall to lean. In another embodiment, as shown in (B) in "Figure 1" and "Figure 2" (the second and fourth embodiments of the wafer magnetic positioning mechanism 100), the wafer alignment groove 30 is an arc-shaped opening groove, and the outer edge LS of one of the side walls is the circumferential area of the wafer WF, and the arc-shaped opening groove is consistent with the curvature of the circumferential area for the outer edge LS of the side wall to lean. The arc-shaped opening groove further includes a protrusion 31. The protrusion 31 is consistent with the shape of the notch NT (Notch) of the wafer WF and is used for the notch NT on the outer edge LS of the side wall (as shown in "Figure 6 "Indicated by (B)) is reliable. In another embodiment, as shown in (C) in "Figure 1" and "Figure 2" (the third and sixth embodiments of the wafer magnetic positioning mechanism 100), the wafer alignment groove 30 is It is a trapezoidal opening groove, and the outer edge LS of one of the side walls is the flat edge area (Flat) of the wafer WF, and the trapezoidal opening groove conforms to the shape of the flat edge area to provide space for the outer edge LS of the side wall. (referring to the aforementioned flat-edge area), wherein the opposite sides of the trapezoidal opening groove are, for example, but not limited to, maintaining a distance from the wafer WF or being able to contact the wafer WF. For example, the above-mentioned The outer edge of one side wall further includes circumferential areas located on opposite sides of the flat edge area of the wafer WF, and the opposite sides of the trapezoidal opening groove further include an arcuate portion 32 consistent with the curvature of the circumferential area for the The outer edge of the side wall (referring to the aforementioned circumferential area) of the wafer WF rests against it. The following paragraphs will describe the specific implementation of the wafer magnetic positioning mechanism 100 using the device positioning part 20 to be combined with the platform 200, which will be described here first.

Continuing, please refer to "Fig. 4" to "Fig. 5", which are assembly schematic diagrams (1) and (2) of different embodiments of the wafer magnetic positioning fixture of the present invention, and "Fig. 6", which is a schematic diagram of the wafer magnetic positioning fixture of the present invention. Schematic diagram of the magnetic pole configuration of the circular magnetic positioning fixture, and please refer to "Figure 1" to "Figure 2" as shown in the figure.

The present invention also discloses a wafer magnetic positioning fixture 300. The wafer magnetic positioning fixture 300 includes a wafer magnetic positioning mechanism 100 of any of the aforementioned embodiments and a platform 200. The platform 200 includes a platform body 40, a wafer setting table P1 on the top side of the platform body 40, and a platform magnetic part P2 provided on one side of the platform body 40 corresponding to the magnetic part 21 of the mechanism. Through the platform The magnetic suction part P2 corresponds to the magnetic suction part 21 of the mechanism to fix the wafer magnetic suction positioning mechanism 100 on the platform body 40. When the wafer magnetic suction positioning mechanism 21 is fixed on the platform 200, the wafer alignment groove The bottom side of 30 is against the wafer setting table P1 on the top side of the platform body 40, so that the wafer alignment groove 30 is supported by the outer edge LS of one side wall of the wafer WF in the horizontal direction D1 . The platform magnetic part P2 is coupled to the platform body 40 by, for example but not limited to, fitting, snapping, adhesion or other ways or means. This is not limited in the present invention and will be described in advance.

The platform body 40 includes a base 41 and a wafer suction disc 42 disposed on the base 41 . The wafer setting table P1 is disposed on the top side of the wafer suction disc 42 . The platform magnetic portion P2 of the platform body 40 is for the magnetic attraction 21 of the wafer magnetic positioning mechanism 100 to be correspondingly attracted, so as to assemble and fix the wafer magnetic positioning mechanism 100 to the platform body. 40, and when the wafer magnetic positioning mechanism 100 is assembled and fixed on the platform 200, the bottom side of the wafer alignment groove 30 abuts the wafer setting table P1 on the top side of the platform body 40, so as to The wafer alignment groove 30 is configured to lean against the outer edge LS of one of the side walls of the wafer WF in the horizontal direction D1.

The bottom side of the wafer alignment groove 30 is against what is referred to as "resistance" on the wafer setting table P1 on the top side of the platform body 40. For example, but not limited to, the bottom side of the wafer alignment groove 30 It is closely attached to the wafer setting table P1, or is partially in contact, or the bottom side of the wafer alignment groove 30 and the wafer setting table P1 still maintain a fine distance. If the distance is maintained, the distance is at least smaller than the thickness of the wafer WF. , ensuring that the wafer alignment groove 30 is supported by the outer edge LS of the side wall of the wafer WF.

In one embodiment, the platform magnetic suction parts P2 are arranged around the periphery of the platform body 40 , and the number of the magnetic suction parts 21 of the wafer magnetic suction positioning mechanism 100 is at least two (ie, two or two). above), each magnetic attraction part 21 of the mechanism respectively attracts the magnetic attraction part P2 of the platform, so that the wafer magnetic attraction positioning mechanism 100 can be assembled and fixed on the platform 200, as shown in "Figure 4" and "Figure 5" , two magnetic suction parts 21 of the mechanism are used to form two points and one line on the platform body 40 for fixation. In another embodiment, the difference between this embodiment and the previous embodiment is that the number and position of the magnetic attraction portion P2 of the platform and the magnetic attraction portion 21 of the mechanism are corresponding. The present invention does not intend to limit the size, shape, quantity or position of the platform magnetic attraction part P2 and the mechanism magnetic attraction part 21, which will be described in advance.

In one embodiment, the magnetic attraction part P2 of the platform is a first magnet with opposite magnetic poles to the adjacent two sides, and the magnetic attraction part 21 of the mechanism is a third magnet that respectively attracts the adjacent first magnets. 2. Magnets, or magnetic adsorption parts. The magnetic adsorption parts are, for example, but not limited to, metals or their alloys containing iron, nickel, cobalt, etc., or components with paramagnetic properties, ferromagnetism, etc. that can be adsorbed by magnets, as shown in "Fig. As shown in (A) in 6", the magnetic attraction part P2 of the platform is arranged around the platform body 40 in a magnetic pole arrangement of N, S, N, S... and so on to achieve a balanced arrangement and avoid damaging the wafer. When WF is grinding or polishing, the platform 200 vibrates or shakes, and the two magnetic suction parts 21 of the mechanism (i.e., the second magnet) have opposite magnetic poles to achieve the balance of the setting, and can correspondingly absorb adjacent ones that also have opposite magnetic poles. The magnetic attraction part P2 (ie the first magnet) of the platform achieves the effect of combination. In another embodiment, the difference between this embodiment and the previous embodiment is that the other two magnetic suction parts P2 on the adjacent sides of each platform magnetic suction part P2 arranged around the platform body 40 are mutually exclusive. Opposite magnetic poles, as shown in (B) in "Figure 6", the magnetic part P2 of the platform is arranged around the magnetic poles in a magnetic pole arrangement of N, N, S, S, N, N, S, S... and so on. The platform body 40 utilizes the magnetic attraction part 21 (i.e., the second magnet) of the mechanism with opposite magnetic poles to be correspondingly attracted to the adjacent magnetic attraction part P2 (i.e., the first magnet) of the platform, and is attracted by the magnetic attraction of the platform. Part P2 also has opposite magnetic poles to achieve the effect of combination. In another embodiment, the magnetic attraction parts 21 of the mechanism (i.e., the second magnet) have the same magnetic poles, and the magnetic attraction part P2 (i.e., the first magnet) of the platform corresponds to the number and position of the magnetic attraction parts 21 of the mechanism. and magnetic poles are configured for corresponding adsorption by the magnetic suction part 21 of the mechanism. As shown in (C) in "Figure 6", the mechanism magnets with the same magnetic poles (such as but not limited to at least two N poles or S poles) The suction part 21 (i.e., the second magnet) is correspondingly attracted to the platform magnetic suction part P2 (i.e., the first magnet) whose magnetic pole is opposite to that of the magnetic suction part 21 of the mechanism, thereby achieving the combined effect. The present invention does not intend to limit the number or magnetic poles of the magnetic suction portion 21 of the mechanism and the magnetic suction portion P2 of the platform, which will be described in advance.

The mechanism magnetic suction part 21 and the platform magnetic suction part P2 are both equipped with magnets, which can play an "anti-fooling role" when the wafer magnetic suction positioning mechanism 100 is assembled on the platform 200. Specifically, the magnets on the platform body 40 The platform magnetic suction part P2 can be provided with a magnet with an opposite magnetic pole to the magnetic suction part 21 of the wafer magnetic suction positioning mechanism 100 at a position where it is not desired to dispose the wafer magnetic suction positioning mechanism 100, so that the wafer magnetic suction positioning mechanism 100 can reach the platform at a specific position. The mutual repulsion effect of the magnetic suction part P2 is based on the principle of like poles repelling each other and opposite poles attracting each other to achieve the anti-fooling effect during combination. For example, as in the embodiment of (A) in "Figure 6", the magnetic suction part 21 of the mechanism (the magnetic poles from top to bottom are N and S) can only be in contact with the position Z1 of the platform body 40 (from the left side from top to bottom). The magnetic poles at the bottom are S and N), position Z2 (the magnetic poles on the upper side from left to right are N and S), position Z3 (the magnetic poles on the right side from top to bottom are N and S), and position Z4 (the lower side is from left to right). The magnetic parts P2 of the platform with magnetic poles S and N on the right are attracted to each other and repel with the magnetic parts P2 of the platform that are adjacent but at different positions to achieve a fool-proof effect when combined; as shown in "Figure 6" In the embodiment of (B), the magnetic attraction part 21 of the mechanism (the magnetic poles S and N from top to bottom) can only be located at the position Z5 on both sides of the platform body 40 (the magnetic poles N and S from top to bottom on the left side). ; The magnetic poles S and N of the platform to the right repel each other to achieve a fool-proof effect during combination; as in the embodiment of (C) in "Figure 6", the magnetic portion 21 of the mechanism (from top to bottom) (Double N poles at the bottom) can only be magnetically attracted to the platform at position Z7 (double S poles from top to bottom on the left side) and Z8 (double S poles from top to bottom on the right side) on opposite sides of the platform body 40 The magnetic parts P2 attract each other and repel the magnetic parts P2 on the upper and lower sides (double N poles from left to right) of the platform, thereby achieving a fool-proof effect during combination.

In one embodiment, the magnetic attraction part P2 of the platform is a magnetic adsorption member, such as but not limited to metals or their alloys including iron, nickel, cobalt, etc., or having paramagnetic properties, ferromagnetism, etc., which can be As a component for magnet attraction, the magnetic attraction parts 21 of the mechanism are magnets corresponding to the magnetic attraction parts P2 of the platform. The magnetic poles of the magnetic attraction parts 21 (i.e., the magnets) of the mechanism can be the same or opposite, preferably as follows The magnetic pole of the mechanism magnetic attraction part 21 is opposite to that of the adjacent side to achieve the balance of the arrangement. In another embodiment, the magnetic attraction part 21 of the mechanism is a magnetic adsorption piece, such as but not limited to metals containing iron, nickel, cobalt and other components or their alloys, or having paramagnetic properties, ferromagnetic properties, etc. For the components that are attracted by magnets, the magnetic attraction portions P2 of the platform are magnets that respectively attract the magnetic attraction portions 21 of the mechanism. The magnetic poles of the magnetic attraction portions P2 (i.e., the magnets) of the platform can be arranged in a regular or arbitrary manner. Setting, the magnetic attraction part P2 of the platform is preferably arranged around the platform body 40 in a magnetic pole arrangement of N, S, N, S... and so on, so as to achieve a balanced setting to avoid grinding or polishing the wafer WF. causing the platform 200 to vibrate or shake. The present invention does not intend to limit the number or magnetic poles of the magnetic suction portion 21 of the mechanism and the magnetic suction portion P2 of the platform, which will be described in advance.

Continuing, please refer to "Figure 4" and "Figure 5" together, which are schematic diagrams of the combination of the wafer magnetic positioning fixture and the wafer according to different embodiments of the present invention. Please refer to "Figure 1" and "Figure 1" together. 2", as shown in the figure; the structural differences of the wafer alignment grooves of each wafer magnetic positioning mechanism in "Figure 1" and "Figure 2" are as mentioned above, so the description will not be repeated in this paragraph, and the following is One of the wafer magnetic positioning mechanisms in "Figure 1" and "Figure 2" illustrates the combination relationship with the platform, which will be described here first.

In one embodiment, as shown in "Fig. 4", the wafer magnetic positioning mechanism 100 is based on (A) in "Fig. 1" as an example. The wafer magnetic positioning mechanism 100 is along the horizontal direction D1 Combined with the platform 200, when the magnetic suction part 21 of the mechanism is correspondingly attracted to the magnetic suction part P2 of the platform, the supporting wall 22 on the bottom side of the device positioning part 20 of the wafer magnetic positioning mechanism 100 abuts against the platform body. 40 periphery.

In another embodiment, as shown in "Fig. 5", the wafer magnetic positioning mechanism 100 is based on (A) in "Fig. 2" as an example. In order to increase the combination of the wafer magnetic positioning mechanism 100 And fixed to the horizontal stability of the platform 200, the top side of the base 41 of the platform body 40 is surrounded by a plurality of rivet posts P3 (or studs, hereafter collectively referred to as rivet posts) located on the outer peripheral side of the wafer adsorption plate 42. , The bottom side of the device positioning portion 20 of the wafer magnetic positioning mechanism 100 is provided with a limiting groove 23 for the rivet post P3 to be inserted. The limiting groove 23 opens in a direction close to the center of the wafer suction plate 42, so as to The rivet posts P3 are inserted along the horizontal direction D1, and the rivet posts P3 are respectively fixed in the corresponding limiting grooves 23 to form horizontal limiting, and the bottom side of the device positioning portion 20 of the wafer magnetic positioning mechanism 100 The supporting wall 22 is against the outer periphery of the platform body 40 .

Continuing, please refer to "Figure 7", which is a schematic diagram of the combination of the wafer magnetic positioning fixture and the wafer according to different embodiments of the present invention, and please refer to "Figure 1" as well, as shown in the figure; "Figure 1" and "Figure 2". The structural differences between the wafer alignment grooves of each wafer magnetic positioning mechanism and the combination of the bottom side of the device positioning part and the platform are as mentioned above, so the description will not be repeated in this paragraph. The following is The positioning relationship between the wafer magnetic positioning fixture and the wafer is explained using each wafer magnetic positioning mechanism in "Figure 1", which will be described first.

In one embodiment, as shown in (A) in "Fig. 7", the wafer magnetic positioning mechanism 100 is based on (A) in "Fig. 1" as an example. In actual application, first The wafer magnetic positioning mechanism 100 is assembled on the platform 200 . After the wafer magnetic positioning mechanism 100 is positioned, the wafer WF is placed on the wafer setting table P1 and faces the direction of the wafer alignment groove 30 The wafer WF is moved so that the outer edge LS (referring to the circumferential area) of the side wall of the wafer WF leans against the wafer alignment groove 30 which is an arc-shaped opening groove, thereby completing the positioning of the wafer WF.

In another embodiment, as shown in (B) in "Fig. 7", the wafer magnetic positioning mechanism 100 is based on (B) in "Fig. 1" as an example. The wafer is also first The magnetic positioning mechanism 100 is assembled on the platform 200, and then places the wafer WF on the wafer setting table P1, and moves the wafer WF in the direction of the wafer alignment groove 30 to align the notch NT of the wafer WF to the protruding portion 31, and make the sidewall outer edge LS (referring to the circumferential area) of the wafer WF lean against the wafer alignment groove 30 which is an arc-shaped opening groove, thereby completing the positioning of the wafer WF.

In another embodiment, as shown in (C) in "Figure 7", the wafer magnetic positioning mechanism 100 is based on (C) in "Figure 1" as an example. The wafer is also first The magnetic positioning mechanism 100 is assembled on the platform 200, and then places the wafer WF on the wafer setting table P1, and moves the wafer WF in the direction of the wafer alignment groove 30, so that the outer edge LS of the side wall of the wafer WF (Referring to the flat edge area and the circumferential area) The positioning of the wafer WF is completed by relying on the wafer alignment groove 30 which is a trapezoidal opening groove including arcuate portions 32 on opposite sides.

In summary, the wafer magnetic positioning mechanism and the wafer magnetic positioning jig of the present invention help to position the wafer quickly and accurately, and help improve the work efficiency of the operation. In addition, the wafer magnetic positioning mechanism and the wafer magnetic positioning fixture of the present invention have a simple structure, are easy to process and manufacture, and are convenient to operate. In addition, the present invention can be used in equipment with a low degree of automation and can also be used in automated equipment, and its application range is wide.

The invention has been described in detail above. However, the above is only one of the preferred embodiments of the invention. This should not be used to limit the scope of the invention, that is, any work based on the scope of the patent application for this invention is equivalent. Changes and modifications should still fall within the scope of the patent for this creation.

100: Wafer magnetic positioning mechanism 10: Ontology part 20:Device positioning department 21: Mechanism magnetic suction department 22: Lean against the wall 23:Limit slot 30: Wafer alignment groove 31:Protrusion 32: Arc part 200:Platform 300: Wafer magnetic positioning fixture 40:Platform ontology 41:Base 42: Wafer suction disc P1: Wafer setting table P2: Platform magnetic suction part P3: Rivet post WF: wafer NT: notch D1: horizontal direction LS: outer edge of side wall Z1 to Z8: position

Figure 1, (A) to (C) are schematic appearance views of the first to third embodiments of the wafer magnetic positioning mechanism of the present invention.

Figure 2, (A) to (C) are schematic appearance views of the fourth to sixth embodiments of the wafer magnetic positioning mechanism of the present invention.

Figure 3, (A) to (B) are schematic top views of the wafer alignment groove of the present invention.

Figure 4 is a schematic diagram (1) of the assembly of the wafer magnetic positioning fixture of the present invention.

Figure 5 is a schematic diagram (2) of the assembly of the wafer magnetic positioning fixture of the present invention.

Figure 6, (A) to (C) are schematic diagrams of the magnetic pole configuration of the wafer magnetic positioning fixture of the present invention.

Figure 7, (A) to (C) are partial schematic diagrams of the combination of the wafer magnetic positioning fixture and the wafer of the present invention.

100: Wafer magnetic positioning mechanism

10: Ontology part

20:Device positioning department

21: Mechanism magnetic suction department

22: Lean against the wall

30: Wafer alignment groove

200:Platform

300: Wafer magnetic positioning fixture

40:Platform ontology

41:Base

42: Wafer suction disc

P1: Wafer setting table

P2: Platform magnetic suction part

P3: Rivet post

D1: horizontal direction

Claims (14)

A wafer magnetic positioning mechanism, including: One body part; A device positioning part is combined with the bottom side of the body part, and a mechanism magnetic part is provided on the device positioning part; and A wafer alignment groove is an open groove formed by extending in the horizontal direction from the body part. The shape of the wafer alignment groove is consistent with the shape of the outer edge of one side wall of a wafer to provide the wafer with The outer edge of one side wall is aligned to position the wafer. The wafer magnetic positioning mechanism according to claim 1, wherein the magnetic part of the mechanism is a magnet or a magnetic adsorption piece. The wafer magnetic positioning mechanism according to claim 1, wherein the wafer alignment groove is an arc-shaped opening groove, the outer edge of one of the side walls is the circumferential area of the wafer, and the arc-shaped opening groove is in line with the circumferential area of the wafer. The curvature of the circumferential area is consistent with that of the outer edge of the side wall. The wafer magnetic positioning mechanism as claimed in claim 3, wherein the arc-shaped opening groove further includes a protrusion that matches the shape of the notch of the wafer to accommodate the notch on the outer edge of the side wall. Rely on. The wafer magnetic positioning mechanism according to claim 1, wherein the wafer alignment groove is a trapezoidal opening groove, the outer edge of one side wall is the flat edge area of the wafer, and the trapezoidal opening groove It conforms to the shape of the flat area for the outer edge of the side wall to rest against. The wafer magnetic positioning mechanism according to claim 5, wherein the outer edge of one of the side walls further includes circumferential areas located on opposite sides of the flat edge area of the wafer, and the trapezoidal opening groove further includes two opposite sides of the flat edge area of the wafer. An arc-shaped portion conforming to the curvature of the circumferential area is included for the circumferential area of the wafer to lean against. The wafer magnetic positioning mechanism as described in claim 1, wherein the material of the wafer magnetic positioning mechanism is metal, metal alloy, ceramic, silicon carbide, metal nitride, metal oxide, rubber, plastic, glass Fiber composite materials, carbon fiber composite materials, organic fiber composite materials or a combination of the above materials. A wafer magnetic positioning fixture, including: The wafer magnetic positioning mechanism as described in any one of claims 1 to 7; and A platform, including a platform body, a wafer setting table on the top side of the platform body, and a platform magnetic part provided on one side of the platform body corresponding to the magnetic part of the mechanism, through which the platform magnetic part is magnetically attracted to the mechanism Correspondingly, the wafer magnetic positioning mechanism is fixed on the platform body. When the wafer magnetic positioning mechanism is fixed on the platform, the bottom side of the wafer alignment groove is against the wafer on the top side of the platform body. The circle is arranged on the table, so that the wafer alignment groove is supported by the outer edge of one of the side walls of the wafer in the horizontal direction. The wafer magnetic positioning fixture as described in claim 8, wherein the platform body includes a base and a wafer suction disk arranged on the base, and the wafer setting table is provided on the wafer suction disk. top side. The wafer magnetic positioning fixture as claimed in claim 8, wherein the platform magnetic part is arranged around the periphery of the platform body, and the number of the mechanism magnetic parts of the wafer magnetic positioning mechanism is at least two, each of which is The magnetic attraction part of the mechanism respectively attracts the magnetic attraction part of the platform so that the wafer magnetic attraction positioning mechanism is fixed on the platform. The wafer magnetic positioning fixture according to claim 10, wherein the magnetic attraction part of the platform is a first magnet with opposite magnetic poles to the adjacent two sides, and the magnetic attraction part of the mechanism is for adsorbing adjacent ones respectively. The second magnet or magnetic adsorption member of the first magnet. The wafer magnetic positioning fixture as claimed in claim 10, wherein the other two magnetic parts of the platform on adjacent sides of each magnetic part of the platform arranged around the platform body have opposite magnetic poles to each other. The wafer magnetic positioning fixture according to claim 10, wherein the magnetic attraction part of the platform is a magnetic adsorption part, and the magnetic attraction part of the mechanism is a magnet that respectively adsorbs the magnetic attraction part of the platform. The wafer magnetic positioning fixture according to claim 10, wherein the magnetic attraction part of the mechanism is a magnetic adsorption part, and the magnetic attraction part of the platform is a magnet corresponding to the magnetic attraction part of the mechanism.

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