TWI823455B - Vibration sensing device - Google Patents
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- TWI823455B TWI823455B TW111124646A TW111124646A TWI823455B TW I823455 B TWI823455 B TW I823455B TW 111124646 A TW111124646 A TW 111124646A TW 111124646 A TW111124646 A TW 111124646A TW I823455 B TWI823455 B TW I823455B
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Abstract
Description
本發明是有關於一種振動偵測技術，特別是指一種利用微波實現振動偵測之振動感應裝置。 The present invention relates to a vibration detection technology, and in particular, to a vibration sensing device that uses microwaves to realize vibration detection.
現有的振動偵測可利用機械式、微機電等方式來實現，即機械式振動儀與微機電振動感測器。機械式振動儀是利用重錘的慣性加上傳統滾紙或感應線圈來記錄環境的振動資訊。微機電振動感測器可感應環境振動造成的加速度之變化反應為電訊號輸出。 Existing vibration detection can be realized by mechanical, micro-electromechanical and other methods, namely mechanical vibration meters and micro-electromechanical vibration sensors. Mechanical vibration meters use the inertia of a heavy hammer plus traditional paper rollers or induction coils to record environmental vibration information. Microelectromechanical vibration sensors can sense changes in acceleration caused by environmental vibrations and respond as electrical signal outputs.
機械式振動儀之體積龐大，微機電振動感測器雖得利於積體電路技術之發展而可微小化，然而此兩種振動偵測方式之振動偵測靈敏度仍有其極限，無法感測極小振動。 Mechanical vibration meters are bulky, and microelectromechanical vibration sensors can be miniaturized thanks to the development of integrated circuit technology. However, the vibration detection sensitivity of these two vibration detection methods still has its limits, and it is impossible to detect extremely small vibration sensors. vibration.
有鑑於此，本發明一實施例提出一種振動感應裝置，包括一振動感應器、一訊號產生器及一訊號處理器。振動感應器包括一微波感測器及一擺錘。擺錘垂置於微波感測器上方，其中擺錘相鄰於微波感測器之面上設有一金屬層。訊號產生器耦接微波感測器，以饋入一載波訊號至微波感測器，使微波感測器依據載波訊號形成一電場，並感測電場受金屬層位移之擾動而產生一感測訊號。訊號處理器耦接微波感測器，以對感測訊號進行訊號處理而獲得一振動資訊。 In view of this, an embodiment of the present invention provides a vibration sensing device, which includes a vibration sensor, a signal generator and a signal processor. The vibration sensor includes a microwave sensor and a pendulum. The pendulum is placed vertically above the microwave sensor, and a metal layer is provided on the surface of the pendulum adjacent to the microwave sensor. The signal generator is coupled to the microwave sensor to feed a carrier signal to the microwave sensor, so that the microwave sensor forms an electric field based on the carrier signal, and senses that the electric field is disturbed by the displacement of the metal layer to generate a sensing signal. . The signal processor is coupled to the microwave sensor to perform signal processing on the sensing signal to obtain vibration information.
本發明另一實施例提出一種振動感應裝置，包括二振動感應器、一訊號產生器及一訊號處理器。每一振動感應器包括一微波感測器及一擺錘。擺錘垂置於微波感測器上方，其中擺錘相鄰於微波感測器之面上設有一金屬層。訊號產生器耦接各微波感測器，以分別饋入一載波訊號至微波感測器，使微波感測器依據載波訊號形成一電場，並感測電場受金屬層位移之擾動而產生一感測訊號。訊號處理器耦接各微波感測器，以分別對感測訊號進行訊號處理而獲得一振動資訊。 Another embodiment of the present invention provides a vibration sensing device, including two vibration sensors, a signal generator and a signal processor. Each vibration sensor includes a microwave sensor and a pendulum. The pendulum is placed vertically above the microwave sensor, and a metal layer is provided on the surface of the pendulum adjacent to the microwave sensor. The signal generator is coupled to each microwave sensor to feed a carrier signal to the microwave sensor respectively, so that the microwave sensor forms an electric field based on the carrier signal, and senses that the electric field is disturbed by the displacement of the metal layer to generate an induction. test signal. The signal processor is coupled to each microwave sensor to perform signal processing on the sensing signals to obtain vibration information.
依據本發明一些實施例之振動感應裝置，可透過微波感測器偵測擺錘之微幅振動，實現高靈敏度之振動偵測。 According to the vibration sensing device according to some embodiments of the present invention, the micro-amplitude vibration of the pendulum can be detected through a microwave sensor, thereby achieving high-sensitivity vibration detection.
10:訊號產生器 10: Signal generator
20:振動感應器 20:Vibration sensor
21:擺錘 21: Pendulum
211:本體 211:Ontology
212:金屬層 212:Metal layer
213:擺繩 213: Rope swing
22:微波感測器 22:Microwave sensor
221:微帶線 221:Microstrip line
222:互補裂隙環形圖案 222: Complementary crack ring pattern
223:輸入埠 223:Input port
224:輸出埠 224:Output port
30:訊號處理器 30:Signal processor
31:包絡檢波器 31: Envelope detector
32:處理器 32: Processor
33:頻率檢測器 33: Frequency detector
A0:初始位置 A 0 : initial position
A:擺動位置 A:Swing position
B:靜止位置 B:rest position
D0:外力 D 0 : external force
Dx,dy:位移距離 Dx,dy: displacement distance
P:固定處 P: fixed place
d,g,r,w,S1,S2:參數 d,g,r,w,S 1 ,S 2 : parameters
x,y:軸線 x, y: axis
θ:夾角 θ: included angle
φ:角度 φ: angle
△x,△y:振動幅度 △x,△y: vibration amplitude
[圖1]為本發明第一實施例之振動感應裝置之方塊示意圖。 [Fig. 1] is a block diagram of a vibration sensing device according to the first embodiment of the present invention.
[圖2]為本發明第一實施例之振動偵測示意圖。 [Fig. 2] is a schematic diagram of vibration detection according to the first embodiment of the present invention.
[圖3]為本發明第一實施例之微波感測器之示意圖。 [Fig. 3] is a schematic diagram of a microwave sensor according to the first embodiment of the present invention.
[圖4]為本發明第一實施例之微波感測器於不同位移距離dx之模擬頻率響應圖。 [Fig. 4] is a simulated frequency response diagram of the microwave sensor at different displacement distances dx according to the first embodiment of the present invention.
[圖5]為本發明第一實施例之微波感測器於不同位移距離dy之模擬頻率響應圖。 [Fig. 5] is a simulated frequency response diagram of the microwave sensor at different displacement distances dy according to the first embodiment of the present invention.
[圖6]為本發明第一實施例之微波感測器偵測不同頻率的外力振動之頻譜圖。 [Fig. 6] is a spectrum diagram of the microwave sensor detecting external force vibrations of different frequencies according to the first embodiment of the present invention.
[圖7]為本發明第一實施例之微波感測器偵測不同頻率的外力振動之另一頻譜圖。 [Fig. 7] is another spectrum diagram of the microwave sensor detecting external force vibrations of different frequencies according to the first embodiment of the present invention.
[圖8]為本發明第二實施例之振動感應裝置之立體示意圖。 [Fig. 8] is a schematic three-dimensional view of the vibration sensing device according to the second embodiment of the present invention.
[圖9]為本發明第二實施例之外力方向示意圖。 [Fig. 9] is a schematic diagram of the direction of external force according to the second embodiment of the present invention.
[圖10]為本發明第三實施例之振動感應裝置之方塊示意圖。 [Fig. 10] is a block diagram of a vibration sensing device according to the third embodiment of the present invention.
參照圖1，係為本發明第一實施例之振動感應裝置之方塊示意圖。振動感應裝置包括一訊號產生器10、一振動感應器20及一訊號處理器30。振動感應器20包括擺錘21及微波感測器22。擺錘21垂置於微波感測器22上方(如圖2所示)，其中擺錘21相鄰於微波感測器22之面上設有一金屬層212。訊號產生器10耦接微波感測器22，以饋入一載波訊號至微波感測器22，使微波感測器22依據載波訊號形成一電場，並感測電場受金屬層212位移之擾動而產生一感測訊號。訊號處理器30耦接微波感測器22，以對感測訊號進行訊號處理而獲得一振動資訊(如振動頻率、振動幅度)。 Refer to FIG. 1 , which is a block diagram of a vibration sensing device according to a first embodiment of the present invention. The vibration sensing device includes a signal generator 10, a vibration sensor 20 and a signal processor 30. The vibration sensor 20 includes a pendulum 21 and a microwave sensor 22 . The pendulum 21 is vertically placed above the microwave sensor 22 (as shown in FIG. 2 ), wherein a metal layer 212 is provided on the surface of the pendulum 21 adjacent to the microwave sensor 22 . The signal generator 10 is coupled to the microwave sensor 22 to feed a carrier signal to the microwave sensor 22, so that the microwave sensor 22 forms an electric field according to the carrier signal, and senses that the electric field is disturbed by the displacement of the metal layer 212. Generate a sensing signal. The signal processor 30 is coupled to the microwave sensor 22 to perform signal processing on the sensing signal to obtain vibration information (such as vibration frequency, vibration amplitude).
參照圖2，係為本發明第一實施例之振動偵測示意圖。擺錘21包括本體211、金屬層212及擺繩213。擺繩213之一端連接於一固定處P，另一端連接本體211。本體211的下側連接金屬層212，使得金屬層212靠近微波感測器22。當靜止時，金屬層212之初始位置A0、靜止位置B(其為初始位置A0垂直投影至微波感測器22的位置)及固定處P等三點連成一鉛錘線。當發生振動時，擺錘21受力而擺動，擺繩213與鉛錘線呈一夾角θ，金屬層212之擺動位置A與靜止位置B分別在軸線x上之投影位置之間具有一位移距離dx。 Refer to Figure 2, which is a schematic diagram of vibration detection according to the first embodiment of the present invention. The pendulum 21 includes a body 211, a metal layer 212 and a pendulum rope 213. One end of the swing rope 213 is connected to a fixed point P, and the other end is connected to the body 211. The lower side of the body 211 is connected to the metal layer 212 so that the metal layer 212 is close to the microwave sensor 22 . When at rest, three points including the initial position A 0 of the metal layer 212 , the rest position B (which is the position vertically projected from the initial position A0 to the microwave sensor 22 ), and the fixed position P are connected to form a plumb line. When vibration occurs, the pendulum 21 is forced to swing. The pendulum rope 213 forms an angle θ with the plumb line. The swing position A and the rest position B of the metal layer 212 have a displacement distance between the projected positions on the axis x respectively. dx.
在一些實施例中，金屬層212透過黏貼、焊接、磁吸或鎖 固等方式連接於本體211。 In some embodiments, the metal layer 212 is formed by adhesion, welding, magnetic attraction or locking. Connected to the body 211 in a fixed manner.
在一些實施例中，擺繩213之材質為錫或棉。然而，本發明之實施例不限於此，亦可以使用其他導電或非導電材質。 In some embodiments, the swing rope 213 is made of tin or cotton. However, embodiments of the present invention are not limited thereto, and other conductive or non-conductive materials may also be used.
合併參照圖2及圖3。圖3為本發明第一實施例之微波感測器22之示意圖。在一些實施態樣中，微波感測器22是以互補裂隙環形共振器(complementary split ring resonator，CSRR)實現。在此，係示例一種互補裂隙環形共振器的具體結構，但本發明不以此為限。舉例而言，還可以是開口諧振環(split-ring resonator，SRR)、步階式阻抗共振器(stepped impedance resonator，SIR)等。 Please refer to Figure 2 and Figure 3 together. FIG. 3 is a schematic diagram of the microwave sensor 22 according to the first embodiment of the present invention. In some implementations, the microwave sensor 22 is implemented as a complementary split ring resonator (CSRR). Here, a specific structure of a complementary split ring resonator is exemplified, but the invention is not limited thereto. For example, it can also be a split-ring resonator (SRR), a stepped impedance resonator (SIR), etc.
互補裂隙環形共振器包括有一微帶線221及一互補裂隙環形圖案222。斜線部分為導電部分。微帶線221橫越通過互補裂隙環形圖案222且與互補裂隙環形圖案222間隔一距離，例如微帶線221與互補裂隙環形圖案222分別位於一基板之兩側面。微帶線221的兩端分別耦接訊號產生器10及訊號處理器30，以分別接收載波訊號並輸出感測訊號。在此，靜止位置B是位於互補裂隙環形圖案222之中心。前述軸線x平行於微帶線221。軸線y與軸線x垂直。 The complementary split ring resonator includes a microstrip line 221 and a complementary split ring pattern 222. The hatched part is the conductive part. The microstrip line 221 traverses the complementary slit annular pattern 222 and is spaced a distance from the complementary slit annular pattern 222. For example, the microstrip line 221 and the complementary slit annular pattern 222 are respectively located on both sides of a substrate. Both ends of the microstrip line 221 are respectively coupled to the signal generator 10 and the signal processor 30 to receive the carrier signal and output the sensing signal respectively. Here, the resting position B is located at the center of the complementary slit annular pattern 222 . The aforementioned axis x is parallel to the microstrip line 221. The axis y is perpendicular to the axis x.
在一些實施例中，圖3所示之互補裂隙環形共振器的尺寸數值如下：參數r=3.75公釐(mm)，參數w=參數d=參數g=參數S2=0.5公釐，參數S1=1.15公釐。分隔微帶線221與互補裂隙環形圖案222的基板為RO3210基板(介電常數εr=10.2，損耗角正切(loss tangent)為0.003，厚度為1.28公釐。互補裂隙環形共振器與金屬層212的間隔為0.5公釐。金屬層212為6公釐見方的銅片。 In some embodiments, the dimensions of the complementary split ring resonator shown in Figure 3 are as follows: parameter r = 3.75 millimeters (mm), parameter w = parameter d = parameter g = parameter S 2 = 0.5 mm, parameter S 1 =1.15 mm. The substrate that separates the microstrip line 221 and the complementary crack ring pattern 222 is an RO3210 substrate (dielectric constant εr=10.2, loss tangent (loss tangent) is 0.003, and thickness is 1.28 mm. The complementary crack ring resonator and the metal layer 212 The spacing is 0.5 mm. The metal layer 212 is a 6 mm square copper sheet.
擺錘21的位移變化穿越微波感測器22的輻射電磁場，會造成互補裂隙環形共振器的輸出響應變化。例如共振頻率、散射係數(Scatter coefficient)的幅值(Magnitude)或相位(Phase)等都會受到影響。擺錘21底部的金屬層212可增加晃動時擺錘21與微波感測器22之間電磁場的擾動量。當擺錘21位置不同時，微波感測器22的穿透係數(Transmission coefficient)也會不同。在固定載波頻率下觀察頻譜，穿透係數的振幅變化即與外力振動有關。另一方面，擺錘21底部的金屬層212與互補裂隙環形共振器間形成一耦合電容，當擺錘21位置不同時，此電容值也不同，造成互補裂隙環形共振器的共振頻率產生偏移，亦即共振頻率變化也與外力振動有關。藉由對應的調變、解調變方式，便可反求出外力振動的資訊。 The displacement change of the pendulum 21 passing through the radiated electromagnetic field of the microwave sensor 22 will cause the output response of the complementary split ring resonator to change. For example, the resonance frequency, the magnitude (Magnitude) or phase (Phase) of the scattering coefficient (Scatter coefficient) will be affected. The metal layer 212 at the bottom of the pendulum 21 can increase the amount of electromagnetic field disturbance between the pendulum 21 and the microwave sensor 22 when shaking. When the position of the pendulum 21 is different, the transmission coefficient of the microwave sensor 22 will also be different. Observing the spectrum at a fixed carrier frequency, the amplitude change of the penetration coefficient is related to the external vibration. On the other hand, a coupling capacitor is formed between the metal layer 212 at the bottom of the pendulum 21 and the complementary gap ring resonator. When the position of the pendulum 21 is different, the capacitance value is also different, causing the resonance frequency of the complementary gap ring resonator to shift. , that is, the change in resonance frequency is also related to external force vibration. Through the corresponding modulation and demodulation methods, the information of the external force vibration can be obtained.
參照圖1，訊號處理器30包括包絡檢波器(Envelope detector)31及處理器32。包絡檢波器31耦接微波感測器22的輸出端，用以解調感測訊號的振幅變化，以獲得一振動訊號。處理器32耦接包絡檢波器31，以對振動訊號進行頻域分析(例如快速傅立葉轉換)，據以分析微波感測器22的輸出響應，而可獲得一振動頻率資訊。此外，依據振動訊號在時域的幅值變化，可獲得振動幅度資訊。 Referring to FIG. 1 , the signal processor 30 includes an envelope detector 31 and a processor 32 . The envelope detector 31 is coupled to the output end of the microwave sensor 22 for demodulating the amplitude change of the sensing signal to obtain a vibration signal. The processor 32 is coupled to the envelope detector 31 to perform frequency domain analysis (such as fast Fourier transform) on the vibration signal, thereby analyzing the output response of the microwave sensor 22 to obtain vibration frequency information. In addition, vibration amplitude information can be obtained based on the amplitude changes of the vibration signal in the time domain.
合併參照圖4及圖5，係分別為本發明第一實施例之微波感測器22於不同位移距離dx、dy之模擬頻率響應圖。所述位移距離dy係金屬層212之擺動位置A與靜止位置B分別在軸線y上之投影位置之間距。軸線y與軸線x位於同一水平面上且相互垂直。亦即，軸線x平行於微帶線221，軸線y垂直於微帶線221。可以看出在一定的位移範圍內， 當擺錘21沿軸線x移動時，頻率響應幾乎無變化；沿軸線y移動時，頻率響應則有明顯變化。亦即，振動感應器20具有一振動感應方向，該振動感應方向的振動偵測靈敏度為最大。在此，振動感應方向係垂直於微帶線221。 Referring to FIGS. 4 and 5 , they are respectively simulated frequency response diagrams of the microwave sensor 22 at different displacement distances dx and dy according to the first embodiment of the present invention. The displacement distance dy is the distance between the projection positions of the swing position A and the rest position B of the metal layer 212 on the axis y respectively. The axis y and the axis x are located on the same horizontal plane and are perpendicular to each other. That is, the axis x is parallel to the microstrip line 221 and the axis y is perpendicular to the microstrip line 221 . It can be seen that within a certain displacement range, When the pendulum 21 moves along the axis x, the frequency response has almost no change; when it moves along the axis y, the frequency response changes significantly. That is, the vibration sensor 20 has a vibration sensing direction in which the vibration detection sensitivity is maximum. Here, the vibration sensing direction is perpendicular to the microstrip line 221.
參照圖6，係為本發明第一實施例之微波感測器22偵測不同頻率的外力振動之頻譜圖。圖6呈現係，在振動感應方向上分別施以0.5Hz、1Hz、2Hz之頻率的外力振動於振動感應器20，處理器32對包絡檢波器31輸出的振動訊號進行頻域分析的結果。可以看到，可清楚偵測到1Hz及2Hz之頻率的外力振動。在此，擺繩213是錫材質。 Referring to FIG. 6 , there is a spectrum diagram of the microwave sensor 22 detecting external force vibrations of different frequencies according to the first embodiment of the present invention. FIG. 6 shows the results of frequency domain analysis by the processor 32 on the vibration signal output by the envelope detector 31 when external forces with frequencies of 0.5 Hz, 1 Hz, and 2 Hz are respectively applied to the vibration sensor 20 in the vibration sensing direction. It can be seen that external vibrations with frequencies of 1Hz and 2Hz can be clearly detected. Here, the swing rope 213 is made of tin.
參照圖7，係為本發明第一實施例之微波感測器22偵測不同頻率的外力振動之另一頻譜圖。圖7呈現係，在振動感應方向上分別施以0.5Hz、1Hz、2Hz之頻率的外力振動於振動感應器20，處理器32對包絡檢波器31輸出的振動訊號進行頻域分析的結果。可以看到，可清楚偵測到0.5Hz、1Hz及2Hz之頻率的外力振動。在此，擺繩213是棉材質。 Referring to FIG. 7 , another spectrum diagram of the microwave sensor 22 detecting external force vibrations of different frequencies according to the first embodiment of the present invention is shown. FIG. 7 shows the results of frequency domain analysis of the vibration signal output by the envelope detector 31 by the processor 32 when external forces with frequencies of 0.5 Hz, 1 Hz, and 2 Hz are respectively applied to the vibration sensor 20 in the vibration sensing direction. It can be seen that external vibrations at frequencies of 0.5Hz, 1Hz and 2Hz can be clearly detected. Here, the swing rope 213 is made of cotton.
此外，由於機械架構的特性，頻譜上還可觀察到一阻尼自然頻率成分。不同材質造成不同的阻尼自然頻率(圖6之3.4Hz、圖7之2.4Hz)，其對於感受振動的靈敏度也不同，可以針對不同量測目標選用不同材料的擺繩213。 In addition, due to the characteristics of the mechanical architecture, a damped natural frequency component can also be observed in the spectrum. Different materials cause different damping natural frequencies (3.4Hz in Figure 6 and 2.4Hz in Figure 7), and their sensitivity to vibration is also different. Pendulum ropes 213 of different materials can be selected for different measurement targets.
參照圖8，係為本發明第二實施例之振動感應裝置之立體示意圖。與第一實施例之差異在於，本實施例之振動感應裝置具有二個振動感應器20，分別偵測兩個軸向的振動。也就是說，其中一個振動感
應器20的振動感應方向平行於第一軸向，以偵測第一軸向之振動；另一個振動感應器20的振動感應方向平行於第二軸向，以偵測第一軸向之振動。其中，第一軸向與第二軸向相互垂直。兩輸入埠223分別耦接兩振動感應器20的微波感測器22，以分別饋入一載波訊號至此兩微波感測器22。兩輸出埠224分別耦接兩振動感應器20的微波感測器22並耦接至訊號處理器30，以分別將兩振動感應器20輸出感測訊號至訊號處理器30。透過此兩振動感應器20之感測訊號，訊號處理器30可分別獲得二軸向的振動資訊(如振動頻率、振動幅度等)。如圖9所示，係為本發明第二實施例之外力D0方向示意圖。透過兩軸向的振動幅度△x、△y，可計算兩者合成向量上的振動資訊。進一步，根據兩軸向的振動幅度△x、△y，還可計算振動外力D0之方向。角度
參照圖10，係為本發明第三實施例之振動感應裝置之方塊示意圖。相較於前述第一實施例，本實施例係以頻率檢測器33取代前述包絡檢波器31。頻率檢測器33用以解調微波感測器22輸出的感測訊號的頻率變化，據以獲得一振動訊號。頻率檢測器33可例如為頻譜分析儀。第三實施例之振動感應裝置同樣可以包括多個振動感應器20，以分別偵測多軸向的振動。 Refer to FIG. 10 , which is a block diagram of a vibration sensing device according to a third embodiment of the present invention. Compared with the aforementioned first embodiment, this embodiment uses a frequency detector 33 to replace the aforementioned envelope detector 31 . The frequency detector 33 is used to demodulate the frequency change of the sensing signal output by the microwave sensor 22 to obtain a vibration signal. The frequency detector 33 may be, for example, a spectrum analyzer. The vibration sensing device of the third embodiment may also include a plurality of vibration sensors 20 to detect multi-axial vibrations respectively.
在一些實施例中，訊號處理器30為一雲端計算裝置或一本地計算裝置。微波感測器22產生之感測訊號可先透過有線或無線方式(如有線網路、無線網路、藍牙等)傳送至一儲存裝置(如記憶體、硬 碟、雲端資料庫等)進行儲存，再由訊號處理器30向儲存裝置讀取出感測訊號來進行分析計算。 In some embodiments, the signal processor 30 is a cloud computing device or a local computing device. The sensing signal generated by the microwave sensor 22 can first be transmitted to a storage device (such as memory, hardware, etc.) through wired or wireless means (such as wired network, wireless network, Bluetooth, etc.) disk, cloud database, etc.), and then the signal processor 30 reads the sensing signal from the storage device for analysis and calculation.
依據本發明實施例之振動感應裝置，可透過微波感測器偵測擺錘之微幅振動，實現高靈敏度之振動偵測。 According to the vibration sensing device according to the embodiment of the present invention, the micro-amplitude vibration of the pendulum can be detected through a microwave sensor, thereby achieving high-sensitivity vibration detection.
10:訊號產生器 10: Signal generator
20:振動感應器 20:Vibration sensor
21:擺錘 21: Pendulum
22:微波感測器 22:Microwave sensor
30:訊號處理器 30:Signal processor
31:包絡檢波器 31: Envelope detector
32:處理器 32: Processor
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| US6315062B1 (en) * | 1999-09-24 | 2001-11-13 | Vermeer Manufacturing Company | Horizontal directional drilling machine employing inertial navigation control system and method |
| CN109883534A (en) * | 2019-01-25 | 2019-06-14 | 北京航天计量测试技术研究所 | A kind of vibrative sensor and method for sensing based on microwave interference |
| CN113125396A (en) * | 2019-12-31 | 2021-07-16 | 罗伯特·博世有限公司 | Sensor refreshing system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6315062B1 (en) * | 1999-09-24 | 2001-11-13 | Vermeer Manufacturing Company | Horizontal directional drilling machine employing inertial navigation control system and method |
| CN109883534A (en) * | 2019-01-25 | 2019-06-14 | 北京航天计量测试技术研究所 | A kind of vibrative sensor and method for sensing based on microwave interference |
| CN113125396A (en) * | 2019-12-31 | 2021-07-16 | 罗伯特·博世有限公司 | Sensor refreshing system |
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