TWI823434B - Waveguide circuit board and its manufacturing method - Google Patents

Abstract

A method for manufacturing a waveguide circuit board comprises the following steps: a foaming material filler is arranged in a slot of an inner substrate. An outer substrate is respectively arranged on the opposite sides of the inner substrate, the outer substrate covers the slot, and the foaming material filler butts the outer substrate to obtain the waveguide circuit board. The manufacturing method of the waveguide circuit board provided by the disclosure is supported in the slot by a foaming material filler, so as to avoid the collapse of the slot during the pressing process. In addition, the present disclosure also provides a waveguide circuit board.

Description

Waveguide circuit board and manufacturing method thereof

The present application relates to the field of electromagnetic signal reception, and in particular, to a waveguide circuit board and a manufacturing method thereof.

Generally, when high-frequency signals in the millimeter wave or sub-megahertz bands are transmitted through a circuit board, in order to reduce the transmission loss of the high-frequency signals, a waveguide (waveguide) is mainly formed by forming a conductive cavity in the circuit board. The waveguide is then Transmit the high-frequency signal.

However, the main method of forming a conductive cavity in a circuit board is to first make a groove on the circuit substrate, and then press another circuit substrate to cover the groove to form a cavity. Due to the high temperature, high pressure and vacuum environment during lamination, the circuit substrate above the slot will be dented to varying degrees after lamination. In severe cases, signal transmission may be affected.

In view of the above, it is necessary to provide a manufacturing method of a waveguide circuit board to solve the above problems.

In addition, there is a need to provide a waveguide circuit board.

A method for manufacturing a waveguide circuit board, including the steps of: arranging a foam material filling body in a slot of an inner substrate, and arranging outer substrates on opposite sides of the inner substrate, and the outer substrate covers the slot , the foam material filling body abuts the outer substrate, and the waveguide circuit board is obtained.

Further, the inner substrate includes an inner base material layer and inner conductive layers disposed on opposite sides of the inner base material layer, and the outer substrate includes an outer base material layer and an outer conductive layer disposed outside the outer base material layer. layer, the step of "setting outer substrates on opposite sides of the inner substrate respectively" includes: setting a first adhesive layer between the inner conductive layer and the outer conductive layer, and the first adhesive layer is provided with a third An opening, the first opening is arranged corresponding to the slot, the foam filling body abuts the inside of the first opening, and presses the inner substrate, the first adhesive layer and the The outer substrate is used to obtain a first intermediate.

Further, the method further includes: first through holes and second through holes provided through the first intermediate body, the first through holes and the second through holes being provided on opposite sides of the slot, and A first conductive body is provided in the first through hole, and a second conductive body is provided in the second through hole. The first conductive body and the second conductive body are connected to opposite sides of the inner substrate. The two outer conductive layers are such that the two outer conductive layers, the first conductive body and the second conductive body are collectively surrounded to form a first waveguide, and the foam material filling body is in contact with the in the first waveguide.

Further, the inner substrate includes an inner base material layer, an inner conductive layer and an inner conductive body. The inner conductive layer is provided on opposite sides of the inner base material layer, and the inner conductive body is disposed in the slot. On the opposite sides, the inner conductive body is connected to the inner conductive layer, the foam material filling body is in contact with the inner conductive body, and the outer substrate includes an outer base material layer and an outer base material layer provided on the outer base material layer. For the outer conductive layer, the step of "setting outer substrates on opposite sides of the inner substrate respectively" includes: setting a second adhesive layer and an outer conductor between the inner conductive layer and the outer conductive layer, the second A second opening is provided through the adhesive layer, and the second opening is arranged corresponding to the slot. The outer conductive body is arranged inside the second opening, and the outer conductive body is arranged corresponding to the inner conductive body. and pressing the inner substrate, the second adhesive layer and the outer substrate, so that the two outer conductive bodies are connected to the outer conductive layer and the inner conductive body, and the two outer conductive layers And the two inner conductive bodies connected between the two outer conductive layers, the two inner conductive layers and the plurality of outer conductive bodies are surrounded to form a second waveguide, and the foam material filling body is in contact with the first waveguide. within the second waveguide.

Further, the inner substrate includes an inner base material layer, an inner conductive layer and an inner conductive body. The inner conductive layer is provided on opposite sides of the inner base material layer, and the inner conductive body is disposed in the slot. On the opposite sides, the inner conductive body is connected to the inner conductive layer, the foam material filling body is in contact with the inner conductive body, and the outer substrate includes an outer base material layer and an outer base material layer provided on the outer base material layer. For the outer conductive layer, the step of "setting outer substrates on opposite sides of the inner substrate respectively" includes: setting a third adhesive layer between the inner conductive layer and the outer conductive layer, and the third adhesive layer penetrates A third opening is provided corresponding to the slot, and the inner substrate, the third adhesive layer and the outer substrate are pressed together to obtain a second intermediate body.

Further, the method further includes the step of: arranging a first opening and a second opening in the second intermediate body, the first opening and the second opening being provided on opposite sides of the slot, partially The inner conductive layer is exposed at the bottom of the first opening and the second opening, and a third conductive body is provided in the first opening, and a fourth conductive body is provided in the second opening, The third conductive body connects the adjacent inner conductive layer and the outer conductive layer, and the fourth conductive body connects the adjacent inner conductive layer and the outer conductive layer, so that the two outer conductive layers and the two outer conductive layers The inner conductive layers, the third conductive body and the fourth conductive body are collectively surrounded to form a third waveguide, and the foam material filling body is in contact with the third waveguide.

Further, the step of "arranging a foaming material filling body in a slot of an inner substrate" includes: arranging a foaming agent in the slot, and the foaming agent is made of materials including polyethylene, polystyrene, and polypropylene. and at least one of polyurethane; and heating the foaming agent to expand the foaming agent to obtain the foaming material filling body.

Further, the step of "pressing the inner substrate, the first adhesive layer and the outer substrate", the step of "pressing the inner substrate, the second adhesive layer and the outer substrate" or the step "Laminating the inner substrate, the third adhesive layer and the outer substrate" and the step "heating the foaming agent" are performed simultaneously.

Further, the step "heating the foaming agent" precedes the step "pressing the inner substrate, the first adhesive layer and the outer substrate", or precedes the step "pressing the inner substrate, all the second adhesive layer and the outer substrate", or precede the step of "pressing the inner substrate, the third adhesive layer and the outer substrate"

Further, the inner substrate includes an inner base material layer, an inner conductive layer and an inner conductive body. The inner conductive layer is provided on opposite sides of the inner base material layer, and the inner conductive body is disposed in the slot. On the opposite sides, the inner conductive body is connected to the inner conductive layer, and the outer substrate includes a carrier plate. The step of "arranging a foam filling body in a slot of an inner substrate" includes: placing a foam filler in a slot of an inner conductive layer. A carrier plate is provided, and the carrier plate and the two inner conductive bodies are surrounded to form an accommodation space. A foaming agent is provided in the accommodation space, and the material of the foaming agent includes at least one of polyethylene, polystyrene, polypropylene and polyurethane. Another carrier plate is provided on the other outer conductive layer, the other carrier plate closes the accommodation space, and the foaming agent is heated to expand the foaming agent to obtain the foaming material filling body, and the foam filling body abuts the carrier plate.

Further, the method further includes the step of removing the carrier plate to expose the foaming material filling body to obtain a third intermediate. A first electroplating layer is provided on two opposite surfaces of the third intermediate body, the first electroplating layer covers the foam material filling body and the outer conductive layer, and the first electroplating layer and the outer side are etched The conductive layer is used to form a first circuit layer, and the two first circuit layers and the two inner conductive bodies connected between the two first circuit layers are surrounded to form a fourth waveguide, and the foam material The filling body is in contact with the fourth waveguide.

A method for manufacturing a waveguide circuit board, including the steps of: providing an inner substrate, the inner substrate including an inner base material layer, an inner conductive layer and a fourth adhesive layer, the inner conductive layer being disposed opposite to the inner base material layer On both surfaces, the inner substrate is provided with slots, and the fourth adhesive layer is provided on two opposite inner sides of the slots. A covering body is provided in the slot. The covering body includes a foam filling body and a conductive shell covering the foam filling body. The fourth adhesive layer is connected to the conductive shell. On the opposite inner sides of the housing and the slot, part of the conductive housing is flush with the inner conductive layer. A second electroplating layer is respectively provided on the two opposite inner conductive layers and part of the conductive shell, and the second electroplating layer, the conductive shell and the inner conductive layer are etched to form a second electroplating layer. The circuit layer, the two second circuit layers, and another part of the conductive shell connected between the two second circuit layers form a fifth waveguide, and the foam material filling body is in contact with the second circuit layer. in the fifth waveguide.

A waveguide circuit board includes an inner substrate, two outer substrates, and a foam material filling body. The inner substrate is provided with a slot, and the foam material filling body is provided in the slot. The outer substrate Located on opposite sides of the inner substrate, the two outer substrates cover the slot.

Further, it also includes a first conductive body, a second conductive body and a first adhesive layer. The first conductive body and the second conductive body both penetrate the circuit board. The inner substrate includes an inner base material layer. and inner conductive layers provided on opposite sides of the inner base material layer. The outer substrate includes an outer base material layer and an outer conductive layer provided outside the outer base material layer. The first adhesive layer is provided on the outer base material layer. Between the inner conductive layer and the outer conductive layer, the first adhesive layer is provided with a first opening, the first opening is provided corresponding to the slot, and the first conductive body and the second conductive body are both The two outer conductive layers located on opposite sides of the inner substrate are connected, and the two outer conductive layers, the first conductive body and the second conductive body are collectively surrounded to form a first waveguide, and the The foam filling body is in contact with the first waveguide.

Further, it also includes a second adhesive layer and an outer conductor. The inner substrate includes an inner base material layer, an inner conductive layer and an inner conductor. The inner conductive layer is provided on opposite sides of the inner base material layer. , the inner conductive body is arranged on the opposite sides of the slot, and the inner conductive body is connected to The inner conductive layer, the outer substrate includes an outer base material layer and an outer conductive layer disposed outside the outer base material layer, and the second adhesive layer is disposed between the inner conductive layer and the outer conductive layer, The second adhesive layer is provided with a second opening, and the second opening is arranged corresponding to the slot. The outer conductive body is disposed inside the second opening, and the outer conductive body corresponds to the inner side. Conductive bodies are provided, the outer conductive bodies are connected to the outer conductive layer and the inner conductive body, two outer conductive layers and two inner conductive bodies connected between the two outer conductive layers, two An inner conductive layer and an outer conductive body are surrounded to form a second waveguide, and the foam material filling body is in contact with the second waveguide.

Further, it also includes a third conductive body, a fourth conductive body and a third adhesive layer. The third adhesive layer is provided between the inner conductive layer and the outer conductive layer. The third adhesive layer penetrates A third opening is provided, the third opening is arranged corresponding to the slot, the third conductive body connects the adjacent inner conductive layer and the outer conductive layer, and the fourth conductive body connects the adjacent inner conductive layer and the outer conductive layer. The inner conductive layer and the outer conductive layer, the two outer conductive layers, the two inner conductive layers, the third conductive body and the fourth conductive body are collectively surrounded to form a third waveguide, and the foam material The filling body is in contact with the third waveguide.

Further, the inner substrate includes an inner base material layer, an inner conductive body and a circuit layer, the inner base material layer is provided with the slot, and the inner conductive body is provided on two opposite sides of the slot, The circuit layer is provided on the opposite sides of the inner base material layer. The circuit layer covers the slot and is connected to the inner conductive body. The circuit layer and the inner conductive body are surrounded to form a fourth waveguide. , the foam material filling body is in contact with the fourth waveguide.

Compared with the conventional technology, the manufacturing method of the waveguide circuit board provided by the present application has the following advantages: (1) The foam material filler is resisted in the groove, thereby avoiding the groove during the pressing process. Collapse occurs. (2) Foaming materials similar to air can replace air and fill the slots before the adhesive layer flows after being heated and pressed, so that the subsequent flowing adhesive layer will not fill the slot. In the slot, it is beneficial to maintain the transmission channel of the waveguide, and can greatly improve the yield and consistency of the cavity waveguide. (3) During the lamination process of making cavity-type circuit boards, plastic with foaming properties is filled into the aforementioned cavity, so that the plastic starts to foam earlier than the lamination resin flow during the lamination and heating process. The plastic formed after the bubble fills the entire cavity, preventing subsequent lamination resin flow from flowing into the cavity or greatly reducing the inflow. Due to the high pressure during lamination, the foamed plastic is restricted in the cavity when the plastic is foamed, which can prevent the expanded substrate from collapsing due to pressure or vacuum. After the hardening time of the resin is over, the foamed plastic The glue has completed the foaming reaction. When the temperature and pressure return to normal conditions, the volume and size of the foamed plastic inside the cavity will no longer change.

100:The first waveguide circuit board

10: First inner substrate

11: First inner base material layer

12: First inner conductive layer

13: Second inner conductive layer

14: First slot

16:First waveguide

17:First intermediate

171: First through hole

172: Second through hole

173:First conductor

174:Second conductor

18: First foaming agent

19: Second foaming agent

88:Third foaming agent

181: First foaming material filling body

191: Second foam material filling body

20: First bonding layer

21:First opening

22:Second bonding layer

23:Outer conductor

300:Third waveguide circuit board

60:Second intermediate

61: First opening

611:Third conductor

62:Second opening

621:Fourth conductor

63:Third waveguide

200: Second waveguide circuit board

40: Second inner substrate

41: Second inner base material layer

42:Third inner conductive layer

43: The fourth inner conductive layer

44: First inner conductor

45: Second slot

50:Third outer base plate

51: The third outer base material layer

52: Fifth outer conductive layer

53:Sixth outer conductive layer

54:Fourth outer base plate

55: The fourth outer base material layer

56:Seventh outer conductive layer

57: The eighth outer conductive layer

571:Second waveguide

400: Fourth waveguide circuit board

80:Third inner substrate

81: The third inner base material layer

82: Fifth inner conductive layer

821: First plating layer

831: Second plating layer

841:Enclosed space

83:Sixth inner conductive layer

84:Third slot

85: Second inner conductor

86: First carrier board

87: Second carrier board

881: Third foam material filling body

1: The fourth foaming material filling body

2: Flat cladding

3: Conductive shell

4: Covering body

5: The fourth inner substrate

6: The fourth inner base material layer

7:Seventh inner conductive layer

8: The eighth inner conductive layer

71: The third electroplating layer

72: The third line layer

73: The fourth electroplating layer

74: The fourth line layer

91:Fourth slot

93: First line layer

94: Second line layer

95:Fourth waveguide

96:Fifth waveguide

D, H: Thickness direction

30: First outer substrate

31: First outer base material layer

32: First outer conductive layer

33: Second outer conductive layer

34:Second outer base plate

35: Second outer base material layer

36: The third outer conductive layer

37: The fourth outer conductive layer

FIG. 1 is a schematic cross-sectional view of the first inner substrate provided in the first embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of the first inner substrate shown in FIG. 1 after being provided with a first groove.

FIG. 3 is a schematic cross-sectional view of the first inner substrate shown in FIG. 2 after a foaming agent is placed in the first groove.

Figure 4 is a schematic cross-sectional view after heating the foaming agent shown in Figure 3 to form a first foaming material filling body.

Figure 5 is a schematic cross-sectional view of the first intermediate body before pressing according to the first embodiment of the present application.

Figure 6 is a schematic cross-sectional view of the first intermediate provided in the first embodiment of the present application.

FIG. 7 is a schematic cross-sectional view of the first intermediate body shown in FIG. 6 after being provided with first through holes and second through holes.

FIG. 8 is a schematic cross-sectional view of the waveguide circuit board provided in the first embodiment of the present application.

FIG. 9 is a schematic cross-sectional view of the second inner substrate provided in the second embodiment of the present application.

FIG. 10 is a schematic cross-sectional view of the second inner substrate shown in FIG. 9 after a foaming agent is placed in the second groove.

FIG. 11 is a schematic cross-sectional view before laminating the waveguide circuit board provided in the second embodiment of the present application.

Figure 12 is a schematic cross-sectional view of a waveguide circuit board provided in the second embodiment of the present application.

Figure 13 is a schematic cross-sectional view after heating the foaming agent shown in Figure 10 to form a second foaming material filling body.

Figure 14 is a schematic cross-sectional view of the second intermediate provided by the third embodiment of the present application.

FIG. 15 is a schematic cross-sectional view of the second intermediate body shown in FIG. 14 after being provided with first openings and second openings.

Figure 16 is a schematic cross-sectional view of the third waveguide circuit board provided in the third embodiment of the present application.

FIG. 17 is a schematic cross-sectional view of the fourth inner substrate provided in the fourth embodiment of the present application.

FIG. 18 is a schematic cross-sectional view of the fourth inner substrate shown in FIG. 17 after being provided with a second inner conductive body.

FIG. 19 is a schematic cross-sectional view of the fourth inner substrate shown in FIG. 18 after being provided with a foaming agent.

Figure 20 is a schematic cross-sectional view after the foaming agent shown in Figure 19 is heated to form a third foaming material filling body.

FIG. 21 is a schematic cross-sectional view of the third foam filling body shown in FIG. 20 after being provided with a first electroplating layer and a second electroplating layer.

Figure 22 is a schematic cross-sectional view of the fourth waveguide circuit board provided in the fourth embodiment of the present application.

Figure 23 is a schematic cross-sectional view of the fourth foam filling body provided in the fifth embodiment of the present application.

Figure 24 is a schematic cross-sectional view of the fourth foam filling body shown in Figure 23 after being provided with a flat coating layer.

Figure 25 is a schematic cross-sectional view of a covering body provided in the fifth embodiment of the present application.

Figure 26 is a schematic cross-sectional view of the fourth inner substrate provided in the fifth embodiment of the present application.

FIG. 27 is a schematic cross-sectional view after the coating body shown in FIG. 25 is disposed on the fourth inner substrate shown in FIG. 26 .

FIG. 28 is a schematic cross-sectional view of the fourth inner substrate shown in FIG. 27 after being provided with a third electroplating layer and a fourth electroplating layer.

Figure 29 is a schematic cross-sectional view of a waveguide circuit board provided in the fifth embodiment of the present application.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some, not all, of the embodiments of the present application.

Referring to Figures 1 to 7, a first embodiment of the present application provides a method of manufacturing a first waveguide circuit board 100. The manufacturing method includes the steps:

S1: Referring to FIG. 1 , a first inner substrate 10 is provided. The first inner substrate 10 includes a first inner base material layer 11 , a first inner conductive layer 12 , and a second inner conductive layer 13 . The first inner conductive layer 12 and the second inner conductive layer 13 are respectively provided on two opposite sides of the first inner base material layer 11 .

S2: Please refer to Figure 2. The first inner substrate 10 has a thickness direction D. Along the thickness direction D, a first slot 14 is provided through the first inner substrate 10. The first slot 14 Penetrating the first inner base material layer 11 , the first inner conductive layer 12 and the second inner conductive layer 13 .

S3: Please refer to Figure 3. A first adhesive layer 20 is provided on one side of the first inner substrate 10. A first opening 21 is provided through the first adhesive layer 20. The first opening 21 corresponds to the One end of the first slot 14 is provided; and a first outer substrate 30 is provided on the first adhesive layer 20. The first outer substrate 30 includes a first outer base material layer 31, a first outer conductive layer 32, and the second outer conductive layer 33 . The first outer conductive layer 32 and the second outer conductive layer 33 are respectively disposed on opposite sides of the first outer base material layer 31 . The first adhesive layer 20 is disposed between the first outer conductive layer 32 and the second inner conductive layer 13 , and part of the first outer conductive layer 32 is between the first opening 21 and the second inner conductive layer 13 . A slot 14 is exposed; and a first foaming agent 18 is provided on the first outer conductive layer 32 in the portion where the first opening 21 and the first slot 14 are exposed. Among them, the first foaming agent 18 is a compound that can release gases such as carbon dioxide and nitrogen after being heated and decomposed, and form pores in the polymer composition. The material of the first foaming agent 18 includes at least one of polyethylene, polystyrene, polypropylene and polyurethane. The foaming temperature of the first foaming agent 18 is appropriate, the foaming degree is high and the foaming temperature is high. It still retains a high hardness and can withstand higher temperatures after foaming. In some embodiments of the present application, the material of the first foaming agent 18 includes other honeycomb hollow structures or foamable media such as glass, ceramics, sponge, pumice, etc.

S4: Please refer to FIG. 5 , another first adhesive layer 20 is provided on the other side of the first inner substrate 10 , and another first adhesive layer 20 is penetrated by another first adhesive layer 20 . Opening 21, the other first opening 21 is provided corresponding to the other end of the first slot 14; and a second outer substrate 34 is provided on the other first adhesive layer 20, the second outer substrate 34 It includes a second outer base material layer 35, a third outer conductive layer 36, and a fourth outer conductive layer 37. The third outer conductive layer 36 and the fourth outer conductive layer 37 are respectively disposed on opposite sides of the second outer base material layer 35 . The other first adhesive layer 20 is disposed between the third outer conductive layer 36 and the first inner conductive layer 12 . Wherein, the two first adhesive layers 20 are prepregs, and the prepregs will flow when heated and/or pressurized. Curing occurs when cooled and/or returned to normal pressure, and the semi-cured film can be used for adhesive connections.

S5: Refer to FIG. 6 , heat and press one first inner substrate 10 , two first adhesive layers 20 , one first outer substrate 30 , and one second outer substrate 34 to form The first intermediate 17 is obtained. At the same time, the first foaming agent 18 is heated and expanded to form a first foaming material. Filling body 181, the first foam material filling body 181 contacts the first outer conductive layer 32, the third outer conductive layer 36, the inside of the first opening 21, and the first slot 14 inside.

In some embodiments of the present application, the thermal expansion of the first foaming agent 18 is limited to heating and pressing, and step S5 includes:

S51: Please refer to Figure 4. The first foaming agent 18 after step S4 is heated, so that the first foaming agent 18 is heated to expand to form the first foaming material filling body 181, and part of the first foaming agent 18 is heated. The material filling body 181 exposes the first slot 14 .

S52: Please refer to FIG. 6 again, set another first adhesive layer 20 on the first inner conductive layer 12, and set a second outer substrate 34 on the other first adhesive layer 20, and then One first inner substrate 10 , two first adhesive layers 20 , one first outer substrate 30 , and one second outer substrate 34 are pressed together, so that the first foaming material is filled The body 181 is accommodated in the first slot 14 and the two first openings 21 to obtain the first intermediate body 17 .

S6: Please refer to FIG. 7 , a first through hole 171 and a second through hole 172 are provided through the first intermediate body 17 . The first through hole 171 and the second through hole 172 are respectively disposed on opposite sides of the first slot 14 .

S7: Referring to FIG. 8 , a first conductive body 173 is provided in the first through hole 171 and a second conductive body 174 is provided in the second through hole 172 to obtain the first waveguide circuit board 100 . The first conductive body 173 connects the third outer conductive layer 36 and the first outer conductive layer 32 , and the second conductive body 174 connects the third outer conductive layer 36 and the first outer conductive layer 32 . Conductive layer 32. The two third outer conductive layers 36 and the first conductive bodies 173 and the second conductive bodies 174 connected to the two third outer conductive layers 36 together form the first waveguide 16. The first foam The material filling body 181 is in contact with the first waveguide 16 to prevent the first waveguide 16 from being dented and deformed. In some embodiments, the first conductive body 173 and the second conductive body 174 are formed by electroplating or chemical plating.

Referring to Figure 8, the first embodiment of the present application also provides a first waveguide circuit board 100. The first waveguide circuit board 100 includes a first inner substrate 10, a first outer substrate 30, a second outer substrate 34, a first Foam material filling body 181, first conductive body 173, second conductive body 174 and two first adhesive layers 20. The first inner substrate 10 is provided with a first slot 14 penetrating therethrough. The first foam material filling body 181 is provided in the first slot 14 . The first outer substrate 30 and the second outer substrate 34 are respectively disposed on opposite sides of the first inner substrate 10 . The first outer substrate 30 and the second outer substrate 30 The side substrate 34 covers the first slot 14 . The first foam filling body 181 is in contact with the first outer substrate 30 and the second outer substrate 34 .

In this embodiment, the first inner substrate 10 includes a first inner base material layer 11 , a first inner conductive layer 12 and a second inner conductive layer 13 . The first inner conductive layer 12 and the second inner conductive layer 13 are respectively provided on opposite sides of the first inner base material layer 11 . The first outer substrate 30 includes a first outer base material layer 31 , a first outer conductive layer 32 , and a second outer conductive layer 33 . The first outer conductive layer 32 and the second outer conductive layer 33 are respectively disposed on opposite sides of the first outer base material layer 31 . The second outer substrate 34 includes a second outer base material layer 35 , a third outer conductive layer 36 , and a fourth outer conductive layer 37 . The third outer conductive layer 36 and the fourth outer conductive layer 37 are respectively disposed on opposite sides of the second outer base material layer 35 .

The first adhesive layer 20 is disposed between the first inner conductive layer 12 and the third outer conductive layer 36 . The other first adhesive layer 20 is disposed between the second inner conductive layer 13 and the first outer conductive layer 32 . Both first adhesive layers 20 are provided with first openings 21 , and the first openings are arranged corresponding to the first slots.

The first conductive body 173 and the second conductive body 174 both penetrate the first waveguide circuit board 100 , and the first conductive body 173 connects the third outer conductive layer 36 and the first outer conductive layer 32. The second conductive body connects the third outer conductive layer 36 and the first outer conductive layer 32 . That is, the third outer conductive layer 36 , the first outer conductive layer 32 , and the first conductor 173 connected between the third outer conductive layer 36 and the first outer conductive layer 32 . Two conductive bodies 174 surround the first waveguide 16 , and the first foam filling body 181 is in contact with the first waveguide 16 to support the first waveguide 16 from the inside. Due to the function of the first waveguide 16, even if the environment changes subsequently, such as a temperature change, the shape of the first waveguide 16 will not be significantly changed. The first waveguide 16 can be used to transmit high-frequency signals.

Compared with the prior art, the manufacturing method of the first waveguide circuit board 100 provided by this application has the following advantages:

(1) The first foam material filling body 181 is resisted in the first slot 14 to prevent the first slot 14 from collapsing during the pressing process.

(2) Instead of air, a foaming material similar to air can be used to fill the first slot 14 before the first adhesive layer 20 flows after being heated and pressed, so that the first adhesive layer 20 flows subsequently. catch The layer 20 will not be filled in the first slot 14 , which is beneficial to maintaining the transmission channel of the first waveguide 16 and can greatly improve the yield and consistency of the first waveguide 16 .

(3) During the process of laminating and manufacturing the first waveguide circuit board 100 including the first waveguide 16, the first foaming agent 18 is filled into the first slot 14, so that the first foaming agent 18 first The adhesive layer 20 begins to foam before flowing under heat and pressure. The first foaming material filling body 181 formed after foaming fills the entire first slot 14, allowing the first adhesive layer 20 to flow after being subjected to heat and pressure. Flow into the cavity is impossible or the inflow is greatly reduced. Due to the high pressure during lamination, the first foaming material filling body 181 formed by foaming the first foaming agent 18 is limited in the first slot 14, which can prevent the first outer substrate 30 and the second outer side from expanding. The substrate 34 collapses due to pressure or vacuum, and when the temperature and pressure return to normal conditions, the volume and size of the first foam filling body 181 inside the first slot 14 will not change again.

Referring to Figures 9 to 12, a second embodiment of the present application provides a method of manufacturing a second waveguide circuit board 200. The manufacturing method includes the steps:

S8: Please refer to FIG. 9 to provide a second inner substrate 40. The second inner substrate 40 includes a second inner base material layer 41, a third inner conductive layer 42, a fourth inner conductive layer 43, and a first inner conductive layer. Body 44. The third inner conductive layer 42 and the fourth inner conductive layer 43 are respectively disposed on opposite sides of the second inner base material layer 41 . The second inner substrate 40 has a thickness direction H, and a second slot 45 is provided through the second inner substrate 40 along the thickness direction H. The first inner conductive body 44 is disposed on opposite sides of the second slot 45. Two ends of the first inner conductive body 44 are connected to the third inner conductive layer 42 and the fourth inner conductive layer respectively. Layer 43.

S9: Referring to FIG. 10 , a second adhesive layer 22 and an outer conductive body 23 are provided on one side of the second inner substrate 40 . A second opening 24 is disposed through the second adhesive layer 22 , and the second opening 24 is disposed corresponding to one end of the second slot 45 . The outer conductive body 23 is disposed inside the second opening 24 , and the outer conductive body 23 is disposed corresponding to one end of the first inner conductive body 44 ; and a third outer conductor is disposed on the second adhesive layer 22 The third outer substrate 50 includes a third outer base material layer 51 , a fifth outer conductive layer 52 , and a sixth outer conductive layer 53 . The fifth outer conductive layer 52 and the sixth outer conductive layer 53 are respectively disposed on two opposite surfaces of the third outer base material layer 51. The fifth outer conductive layer 52 is disposed on the second adhesive layer. Between the connecting layer 22 and the third outer base material layer 51, part of the fifth outer conductive layer 52 is exposed in the second opening 24 and the second slot 45; and in the exposed second opening 24. Part of the fifth outer conductive layer 52 of the second slot 45 The second foaming agent 19 is provided. In this embodiment, the outer conductive body 23 is conductive paste. The second foaming agent 19 and the first foaming agent 18 are made of substantially the same material.

S10: Referring to FIG. 11, another second adhesive layer 22 and another outer conductor 23 are provided on the other side of the second inner substrate 40. The second opening 24 of the other second adhesive layer 22 is provided corresponding to the other end of the second slot 45, and the other outer conductive body 23 is provided on the third end of the other second adhesive layer 22. Inside the two openings 24, another outer conductive body 23 is provided corresponding to the other end of the first inner conductive body 44; and a fourth outer substrate 54 is provided on the other second adhesive layer 22. The four outer substrates 54 include a fourth outer base material layer 55 , a seventh outer conductive layer 56 , and an eighth outer conductive layer 57 . The seventh outer conductive layer 56 and the eighth outer conductive layer 57 are respectively disposed on the opposite surfaces of the fourth outer base material layer 55 . The seventh outer conductive layer 56 is disposed on the other of the second outer conductive layer 55 . between the adhesive layer 22 and the fourth outer base material layer 55.

S11: Please refer to Figure 12, heat and press one of the third outer substrate 50, one of the second inner substrate 40, one of the fourth outer substrate 54 and two of the second adhesive layers 22, so that the other A first inner conductive body 44 is connected to the fourth inner conductive layer 43 and the seventh outer conductive layer 56. The first inner conductive body 44 is connected to the third inner conductive layer 42 and the third inner conductive layer 42. Five outer conductive layers 52. At the same time, the second foaming agent 19 rapidly expands when heated to form a second foaming material filling body 191 , and the second foaming material filling body 191 contacts the fifth outer conductive layer 52 and the The seventh outer conductive layer 56 , the first inner conductive body 44 , and the inner side of the first slot 14 form the second waveguide circuit board 200 . Wherein, the seventh outer conductive layer 56 and the fifth outer conductive layer 52 are connected to the first inner conductive body 44 between the seventh outer conductive layer 56 and the fifth outer conductive layer 52 , the outer conductive bodies 23 are collectively surrounded to form a second waveguide 571 , and the second foam material filling body 191 is in contact with the second waveguide 571 .

In some embodiments of the present application, in step S11, the second foaming agent 19 is thermally expanded prior to the step of "pressing one of the third outer substrates 50, one of the second inner substrates 40, and one of the The fourth outer substrate 54 and the two second adhesive layers 22″ are processed. Step S11 includes:

S111: Please refer to Figure 13, the second foaming agent 19 after step S10 is heated, so that the second foaming agent 19 is heated and expanded to form a second foaming material filling body 191, and part of the second foaming agent 19 is heated. The material filling body 191 exposes the second slot 45 .

S112: Please refer to FIG. 12 again, set another second adhesive layer 22 on the fourth inner conductive layer 43, and set a fourth outer substrate 54 on the other second adhesive layer 22, and then press The second waveguide circuit board 200 is obtained by combining one third outer substrate 50 , one second inner substrate 40 , one fourth outer substrate 54 and two second adhesive layers 22 .

Referring to Figure 12, a second embodiment of the present application also provides a second waveguide circuit board 200. Different from the first waveguide circuit board 100, the second waveguide circuit board 200 further includes two second adhesive layers 22 and two outer conductive bodies 23. The second adhesive layer 22 is provided with a second opening 24 corresponding to the second slot 45 , and the outer conductive body 23 is disposed in the second opening 24 . Among them, one second adhesive layer 22 is provided between the fourth inner conductive layer 43 and the seventh outer conductive layer 56 , and one outer conductive body 23 connects the fourth inner conductive layer 43 and the seventh outer conductive layer 56 . The seventh outer conductive layer 56 . The other second adhesive layer 22 is disposed between the third inner conductive layer 42 and the fifth outer conductive layer 52 , and the other outer conductive body 23 connects the third inner conductive layer 42 and the fifth outer conductive layer 52 . The fifth outer conductive layer 52 . As a result, the seventh outer conductive layer 56 , the fifth outer conductive layer 52 , the outer conductive body 23 and the first inner conductive body 44 are surrounded to form a second waveguide 571 , and the second foamed The material filling body 191 is in contact with the second waveguide 571 .

Compared with the first embodiment, the manufacturing method of the second waveguide circuit board 200 provided by the second embodiment of the present application is to provide an outer conductive body 23 in the second opening 24 of the second adhesive layer 22. The outer conductive body 23 After pressing, the second inner substrate 40 and the third outer substrate 50 can be connected, and the second inner substrate 40 and the fourth outer substrate 54 can be connected, thereby eliminating the need for drilling, electroplating, etc. The connection between the second inner substrate 40 and the third outer substrate 50 or the fourth outer substrate 54 is realized, which is beneficial to reducing the process of manufacturing the second waveguide circuit board 200 .

Referring to FIGS. 14 to 16 , the third embodiment of the present application provides a method for manufacturing a third waveguide circuit board 300 . The difference from the second embodiment is that step S9 includes: The third adhesive layer 25 between the seventh outer conductive layer 56 and the third opening 26 of the third adhesive layer 25 is not provided with the outer conductor 23 . Step S10 includes: disposing another third adhesive layer between the third inner conductive layer 42 and the fifth outer conductive layer 52 in the third opening 26 of the other third adhesive layer 25 The outer conductive body 23 is not provided, thereby obtaining the second intermediate body 60 (see FIG. 14 ). The manufacturing method of the third waveguide circuit board 300 also includes:

S12: Please refer to Figure 15. Two first openings 61 and two second openings 62 are provided in the second intermediate body 60. The two first openings 61 and the two second openings are 62 are respectively provided on opposite sides of the second slot 45 . Two of the first openings 61 are provided correspondingly, and one of the first openings 61 penetrates the fourth outer substrate 54 , one of the third adhesive layer 25 , and the fourth inner side. In the conductive layer 43, part of the second inner base material layer 41 is exposed at the bottom of one of the first openings 61, and the other first opening 61 penetrates the third outer substrate 50, and the other third outer substrate 50. The three adhesive layers 25, the third inner conductive layer 42, and part of the second inner base material layer 41 are exposed at the bottom of the other first opening 61. Two second openings 62 are provided correspondingly, and one of the second openings 62 penetrates the fourth outer substrate 54, the third adhesive layer 25, and the fourth inner conductive layer 43. Part of the second inner base material layer 41 is exposed at the bottom of one of the second openings 62 , and the other second opening 62 penetrates the third outer substrate 50 and the other third adhesive layer. 25. As for the third inner conductive layer 42, part of the second inner base material layer 41 is exposed at the bottom of the other second opening 62. In some embodiments, the first opening 61 and the second opening 62 are formed by mechanical drilling or laser drilling.

S13: Please refer to Figure 16. Third conductive bodies 611 are respectively provided in the two first openings 61 by electroplating, and third conductive bodies 611 are respectively provided in the two second openings 62 by electroplating. The fourth conductor 621. One of the third conductive body 611 and the fourth conductive body 621 are both connected to the seventh outer conductive layer 56 and the fourth inner conductive layer 43, and the other third conductive body 611 is connected to the other third conductive body 611. The fourth conductive bodies 621 are connected to the third inner conductive layer 42 and the fifth outer conductive layer 52 to obtain the third waveguide circuit board 300 . Among them, the functions of the third conductive body 611 and the fourth conductive body 621 are equivalent to the outer conductive body 23 in the second embodiment. The third inner conductive layer 42, the fourth inner conductive layer 43, The fifth outer conductive layer, the seventh outer conductive layer 56 , the third conductive body 611 , the fourth conductive body 621 , and the first inner conductive body 44 together form a third waveguide 63 , the second foam filling body 191 is in contact with the third waveguide 63 .

Referring to Figure 16, the third embodiment of the present application also provides a third waveguide circuit board 300. The difference from the second waveguide circuit board 200 is that the third waveguide circuit board 300 further includes two third waveguide circuit boards 300. The conductive body 611 and the two fourth conductive bodies 621, and the third conductive body 611 and the fourth conductive body 621 are all connected to the seventh outer conductive layer 56 and the fourth inner conductive layer 43 , the other third conductive body 611 and the other fourth conductive body 621 are both connected to the third inner conductive layer 42 and the fifth outer conductive layer 52 . Therefore, the outer conductive body 23 is replaced, and at the same time it is beneficial to increase the bonding strength of the second inner substrate 40 , the third outer substrate 50 , and the fourth outer substrate 54 .

Referring to Figures 17 to 23, the fourth embodiment of the present application provides a method for manufacturing a fourth waveguide circuit board 400. Different from the first to third embodiments, in the fourth embodiment, the relative position of the third inner substrate 80 There are no outer circuit boards on both sides (for example, the first outer substrate 30, the second outer substrate 34, the third outer substrate 50, and the fourth outer substrate 54). Instead, there are a first carrier board 86 and a second carrier board 87. Specifically, the manufacturing method of the fourth waveguide circuit board 400 includes the steps:

S14: Referring to FIG. 17 , a third inner substrate 80 is provided. The third inner substrate 80 includes a third inner base material layer 81 , a fifth inner conductive layer 82 and a sixth inner conductive layer 83 . The fifth inner conductive layer 82 and the sixth inner conductive layer 83 are respectively provided on opposite sides of the third inner base material layer 81 . A third slot 84 is formed through the third inner substrate 80 .

S15: Referring to FIG. 18 , a second inner conductive body 85 is provided in the third slot 84 . The second inner conductive body 85 is disposed on opposite sides of the third slot 84 , and the second inner conductive body 85 connects the fifth inner conductive layer 82 and the sixth inner conductive layer 83 .

S16: Refer to FIG. 19 , a first carrier plate 86 is provided on the sixth inner conductive layer 83 , and the first carrier plate 86 covers one end of the third slot 84 . Part of the first carrier board 86 is exposed in the third slot 84 . Then, a third foaming agent 88 is placed on the first carrier plate 86 at the portion where the third slot 84 is exposed. Then, a second carrier plate 87 is disposed on the fifth inner conductive layer 82. The second carrier plate 87 covers the other end of the third slot 84, thereby forming a closed space 841. The third foaming agent 88 is disposed in the enclosed space 841. The third foaming agent 88 is made of substantially the same material as the first foaming agent 18 .

S17: Please refer to Figure 20, heat the third foaming agent 88, the third foaming agent 88 expands and forms a third foaming material filling body 881, the third foaming material filling body 881 is in contact with within the enclosed space 841.

S18: Refer to Figure 21, remove the first carrier plate 86 and the second carrier plate 87, and one end surface of the third foam filling body 881 is flush with the fifth inner conductive layer 82. The other end surface is flush with the sixth inner conductive layer 83, and a first electroplating layer 821 is provided on the fifth inner conductive layer 82 and a second electroplating layer 831 is provided on the sixth inner conductive layer 83, The first electroplating layer 821 covers one end surface of the third foam material filling body 881 , and the second electroplating layer 831 covers the other end surface of the third foam material filling body 881 .

S19: Refer to Figure 22, etch the first electroplating layer 821 and the fifth inner conductive layer 82 to form the first circuit layer 93, and etch the second electroplating layer 831 and the sixth inner conductive layer 83 To form the second circuit layer 94, the fourth waveguide circuit board 400 is obtained. Among them, the first circuit layer 93, the second circuit layer 94, and the first circuit layer 93 and the second circuit layer are connected to each other. The second inner conductive body 85 between 94 forms a fourth waveguide 95 , and the third foam filling body 881 is in contact with the fourth waveguide 95 .

Referring to Figure 22, the fourth embodiment of the present application also provides a fourth waveguide circuit board 400. The fourth waveguide circuit board 400 includes a third inner base material layer 81, a second inner conductive body 85, and a first circuit layer 93. , the second circuit layer 94 and the third foam material filling body 881. The third inner base material layer 81 is provided with a third slot 84 penetrating therethrough. The second inner conductive body 85 is disposed on opposite sides of the third slot 84 . The first circuit layer 93 and the second circuit layer 94 are respectively disposed on opposite sides of the third inner base material layer 81. The first circuit layer 93 and the second circuit layer 94 cover the Third slot 84. The third foam material filling body 881 is disposed in the third slot 84, and the third foam material filling body 881 abuts the first circuit layer 93, the second circuit layer 94 and the the second inner conductive body 85. The first circuit layer 93 , the second circuit layer 94 and the second conductor 174 connected between the first circuit layer 93 and the second circuit layer 94 surround and form the fourth waveguide 95 .

Referring to Figures 23 to 29, the fifth embodiment of the present application provides a method for manufacturing a fifth waveguide circuit board 500, including the steps:

S20: Please refer to Figure 23 to provide a fourth foaming material filling body 1. The fourth foaming material filling body 1 is roughly square, and the material of the fourth foaming material filling body 1 is the same as that of the first foaming material filling body 1. The foam filling body 181, the second foam filling body 191 and the third foam filling body 881 are made of the same material.

S21: Please refer to Figure 24. Cover the outside of the fourth foam material filling body 1 with a flat coating layer 2. The flat coating layer 2 covers the micropores on the outer surface of the fourth foam material filling body 1. , the material of the flat covering layer 2 is resin.

S22: Please refer to Figure 25. A conductive shell 3 is provided outside the flat cladding layer 2 to obtain a covering body 4. The covering body 4 includes the fourth foam filling body 1 , the flat covering layer 2 and the conductive shell 3 in order from the inside to the outside.

S23: Please refer to FIG. 26 to provide a fourth inner substrate 5. The fourth inner substrate 5 includes a fourth inner base material layer 6, a seventh inner conductive layer 7, and an eighth inner conductive layer 8. The seventh inner conductive layer 7 and the eighth inner conductive layer 8 are respectively disposed on opposite sides of the fourth inner base material layer 6 . The fourth inner substrate 5 is provided with a fourth slot 91 , the cross-sectional width of the fourth slot 91 is greater than the cross-sectional width of the covering body 4 , and the cross-sectional height of the fourth slot 91 is equal to the The cross-sectional height of the cladding 4.

S24: Please refer to Figure 27, place the covering body 4 in the fourth slot 91, and set an adhesive body 9 between the covering body 4 and the inside of the fourth slot 91. , the adhesive body 9 can fix the covering body 4 in the fourth slot 91 .

S25: Please refer to Figure 28. A third electroplating layer 71 is provided on the seventh inner conductive layer 7. The third electroplating layer 71 covers part of the conductive housing 3; and a third electroplating layer 71 is provided on the eighth inner conductive layer 8. The fourth electroplating layer 73 covers part of the conductive housing 3 .

S26: Refer to FIG. 29, etch the third electroplating layer 71 and part of the conductive housing 3 to form a third circuit layer 72, and etch the fourth electroplating layer 73 and part of the conductive housing 3 to form Fourth circuit layer 74. The fifth waveguide circuit board 500 is obtained. Wherein, the third circuit layer 72, the fourth circuit layer 74, and the part of the conductive housing 3 connected between the third circuit layer 72 and the fourth circuit layer 74 are surrounded to form a third Five waveguides 96 , the fourth foam filling body 1 is in contact with the fifth waveguide 96 .

Referring to Figure 29, the fifth embodiment of the present application also provides a fifth waveguide circuit board 500. The fifth waveguide circuit board 500 includes a fourth inner base material layer 6, a covering body 4, a third circuit layer 72 and a third circuit layer 72. Quad line layer 74. The fourth inner base material layer 6 is provided with a fourth slot 91 , the covering body 4 is disposed in the fourth slot 91 , the third circuit layer 72 and the fourth circuit layer 74 They are respectively provided on opposite sides of the fourth inner base material layer 6 . The covering body 4 includes a fourth foam filling body 1 and a conductive shell 3 covering the fourth foam filling body 1 . The conductive shell 3 is electrically connected to the third circuit layer 72 and the fourth circuit layer 74 . Wherein, the third circuit layer 72, the fourth circuit layer 74, and the part of the conductive housing 3 connected between the third circuit layer 72 and the fourth circuit layer 74 are surrounded to form a third Five waveguides 96 , the fourth foam filling body 1 is in contact with the fifth waveguide 96 .

In addition, those skilled in the art can also make other changes within the concept of this application. Of course, these changes based on the concept of this application should be included in the scope of protection claimed by this application.

100:The first waveguide circuit board

14: First slot

171: First through hole

34:Second outer base plate

10: First inner substrate

30: First outer substrate

173:First conductor

16:First waveguide

181: First foaming material filling body

21:First opening

174:Second conductor

33: Second outer conductive layer

31: First outer base material layer

32: First outer conductive layer

20: First bonding layer

13: Second inner conductive layer

11: First inner base material layer

12: First inner conductive layer

36: The third outer conductive layer

35: Second outer base material layer

37: The fourth outer conductive layer

172: Second through hole

Claims (15)

A method of manufacturing a waveguide circuit board, which includes the steps of: arranging a foam material filler in a slot of an inner substrate; and arranging outer substrates on opposite sides of the inner substrate, and the outer substrate covers the opening. groove, the foam material filling body abuts the outer substrate to obtain the waveguide circuit board; the inner substrate includes an inner base material layer, an inner conductive layer and an inner conductive body, and the inner conductive layer is provided on the On opposite sides of the inner base material layer, the inner conductive body is provided on the opposite sides of the slot, the inner conductive body is connected to the inner conductive layer, and the foam material filling body is in contact with the inner conductive body body, the outer substrate includes an outer base material layer and an outer conductive layer provided outside the outer base material layer, and the step of "arranging outer substrates on opposite sides of the inner substrate" includes: placing outer conductive layers on the inner conductive layer and A second adhesive layer and an outer conductive body are provided between the outer conductive layers. The second adhesive layer is provided with a second opening, and the second opening is provided corresponding to the slot. The outer conductive body is provided on the Inside the second opening, the outer conductive body is arranged corresponding to the inner conductive body; and the inner substrate, the second adhesive layer and the outer substrate are pressed together so that the two outer conductive bodies are both Connecting the outer conductive layer and the inner conductive body, the two outer conductive layers and the two inner conductive bodies connected between the two outer conductive layers, the two inner conductive layers and a plurality of outer conductive bodies A second waveguide is formed around the second waveguide, and the foam material filling body is in contact with the second waveguide. The manufacturing method of claim 1, wherein the inner substrate includes an inner base material layer and inner conductive layers located on opposite sides of the inner base material layer, and the outer substrate includes an outer base material layer and an inner conductive layer located on opposite sides of the inner base material layer. The step of "setting outer substrates on opposite sides of the inner substrate respectively" includes: disposing a first adhesive layer between the inner conductive layer and the outer conductive layer. The first adhesive layer is provided with a first opening, the first opening is arranged corresponding to the slot, the foam material filling body contacts the inside of the first opening; and the inner substrate, the The first adhesive layer and the outer substrate are used to obtain a first intermediate body. The manufacturing method according to claim 2, further comprising: providing a first through hole and a second through hole through the first intermediate body, and the first through hole and the second through hole are provided in the first intermediate body. opposite sides of said slot; and A first conductive body is provided in the first through hole, and a second conductive body is provided in the second through hole. The first conductive body and the second conductive body are connected to opposite sides of the inner substrate. The two outer conductive layers are such that the two outer conductive layers, the first conductive body and the second conductive body are collectively surrounded to form a first waveguide, and the foam material filling body is in contact with the in the first waveguide. The manufacturing method according to claim 1, wherein the inner substrate includes an inner base material layer, an inner conductive layer and an inner conductor, the inner conductive layer is provided on opposite sides of the inner base material layer, and the The inner conductive body is provided on opposite sides of the slot, the inner conductive body is connected to the inner conductive layer, the foam material filling body is in contact with the inner conductive body, and the outer substrate includes an outer base material layer and is provided on the outer conductive layer outside the outer base material layer. The step of "arranging outer substrates on opposite sides of the inner substrate respectively" includes: disposing a third adhesive layer between the inner conductive layer and the outer conductive layer. , the third adhesive layer is provided with a third opening, the third opening is arranged corresponding to the slot; and the inner substrate, the third adhesive layer and the outer substrate are pressed together to obtain the third Two intermediates. The manufacturing method according to claim 4, further comprising the step of: providing a first opening and a second opening in the second intermediate body, and the first opening and the second opening are provided in the second intermediate body. On opposite sides of the slot, part of the inner conductive layer is exposed at the bottom of the first opening and the second opening; and a third conductive body is provided in the first opening, and a third conductive body is provided in the first opening. Two openings are provided with a fourth conductive body, the third conductive body connects the adjacent inner conductive layer and the outer conductive layer, and the fourth conductive body connects the adjacent inner conductive layer and the outer conductive layer, so that The two outer conductive layers, the two inner conductive layers, the third conductive body and the fourth conductive body are collectively surrounded to form a third waveguide, and the foam material filling body is in contact with the third conductive body. Within three waveguides. The manufacturing method according to claim 4 or 5, wherein the step of "arranging a foaming material filling body in a slot of an inner substrate" includes: arranging a foaming agent in the slot, and the material of the foaming agent It includes at least one of polyethylene, polystyrene, polypropylene and polyurethane; and heating the foaming agent to expand the foaming agent to obtain the foaming material filling body. The manufacturing method according to claim 6, wherein the step "presses the inner substrate, the first adhesive layer and the outer substrate", the step "presses the inner substrate, the second adhesive layer layer and the outer substrate" or the step of "pressing the inner substrate, the third adhesive layer and the outer substrate" is respectively performed simultaneously with the step of "heating the foaming agent". The manufacturing method of claim 6, wherein the step of "heating the foaming agent" precedes the step of "pressing the inner substrate, the first adhesive layer and the outer substrate", or precedes the step "Laminating the inner substrate, the second adhesive layer and the outer substrate", or prior to the step of "pressing the inner substrate, the third adhesive layer and the outer substrate". The manufacturing method according to claim 1, wherein the inner substrate includes an inner base material layer, an inner conductive layer and an inner conductor, the inner conductive layer is provided on opposite sides of the inner base material layer, and the The inner conductive body is provided on the opposite sides of the slot, and the inner conductive body is connected to the inner conductive layer. The outer substrate includes a carrier plate. The step of "arranging a foam material filling body in the slot of an inner substrate" It includes: a carrier plate is provided on one of the outer conductive layers, and the carrier plate and the two inner conductive bodies are surrounded to form an accommodation space; a foaming agent is provided in the accommodation space, and the foaming agent The material includes at least one of polyethylene, polystyrene, polypropylene and polyurethane; another carrier plate is provided on the other outer conductive layer, and the other carrier plate closes the accommodation space; and the heating device The foaming agent is used to expand the foaming agent to obtain the foaming material filling body, which is in contact with the carrier plate. The manufacturing method according to claim 9, further comprising the steps of: removing the carrier plate to expose the foaming material filling body to obtain a third intermediate; A first electroplating layer is provided, the first electroplating layer covers the foam material filling body and the outer conductive layer; and the first electroplating layer and the outer conductive layer are etched to form a first circuit layer, two The first circuit layer and the two inner conductive bodies connected between the two first circuit layers are surrounded to form a fourth waveguide, and the foam material filling body is in contact with the fourth waveguide. . A method for manufacturing a waveguide circuit board, which includes the steps of: providing an inner substrate, the inner substrate including an inner base material layer, an inner conductive layer and a fourth adhesive layer, the inner conductive layer being disposed on the inner base material On two opposite surfaces of the layer, the inner substrate is provided with a slot through it, and the fourth adhesive layer is provided on the two opposite inner sides of the slot; A covering body is provided in the slot. The covering body includes a foam filling body and a conductive shell covering the foam filling body. The fourth adhesive layer is connected to the conductive shell. On the opposite inner sides of the housing and the slot, part of the conductive housing is flush with the inner conductive layer; a second second part is respectively provided on the two opposite inner conductive layers and part of the conductive shell. Electroplating layer; and etching the second electroplating layer, the conductive shell and the inner conductive layer to form a second circuit layer, and the two second circuit layers are connected between the two second circuit layers. Another part of the conductive shell is surrounded to form a fifth waveguide, and the foam material filling body is in contact with the fifth waveguide. A waveguide circuit board, which includes an inner substrate, two outer substrates, and a foam material filling body. The inner substrate is provided with a slot, and the foam material filling body is provided in the slot. The outer substrates are arranged on opposite sides of the inner substrate, and the two outer substrates cover the slot; they also include a second adhesive layer and an outer conductor. The inner substrate includes an inner base material layer, an inner conductive layer, and an inner conductive layer. layer and an inner conductive body, the inner conductive layer is disposed on opposite sides of the inner base material layer, the inner conductive body is disposed on opposite sides of the slot, the inner conductive body is connected to the inner conductive body layer, the outer substrate includes an outer base material layer and an outer conductive layer disposed outside the outer base material layer, the second adhesive layer is disposed between the inner conductive layer and the outer conductive layer, the second A second opening is provided through the adhesive layer, and the second opening is arranged corresponding to the slot. The outer conductive body is arranged inside the second opening, and the outer conductive body is arranged corresponding to the inner conductive body. The outer conductive bodies are all connected to the outer conductive layer and the inner conductive body, and the two outer conductive layers and the two inner conductive bodies and two inner conductive layers connected between the two outer conductive layers A second waveguide is formed around the outer conductive body, and the foam material filling body is in contact with the second waveguide. The waveguide circuit board according to claim 12, further comprising a first conductive body, a second conductive body and a first adhesive layer, the first conductive body and the second conductive body both penetrating the circuit board , the inner substrate includes an inner base material layer and inner conductive layers located on opposite sides of the inner base material layer, and the outer substrate includes an outer base material layer and an outer conductive layer located outside the outer base material layer, The first adhesive layer is provided between the inner conductive layer and the outer conductive layer. The first adhesive layer is provided with a first opening. The first opening is provided corresponding to the slot. The first The conductive body and the second conductive body are both connected to the two outer conductive layers provided on opposite sides of the inner substrate, and the two outer conductive layers, The first conductive body and the second conductive body are collectively surrounded to form a first waveguide, and the foam filling body is in contact with the first waveguide. The waveguide circuit board according to claim 12, further comprising a third conductor, a fourth conductor and a third adhesive layer, the third adhesive layer being disposed between the inner conductive layer and the outer conductive layer. In between, the third adhesive layer is provided with a third opening, the third opening is arranged corresponding to the slot, and the third conductive body connects the adjacent inner conductive layer and the outer conductive layer. The fourth conductive body connects the adjacent inner conductive layer and the outer conductive layer, and is surrounded by two outer conductive layers, two inner conductive layers, the third conductive body and the fourth conductive body. A third waveguide is formed, and the foam filling body is in contact with the third waveguide. The waveguide circuit board according to claim 12, wherein the inner substrate includes an inner base material layer, an inner conductive body and a circuit layer, the inner base material layer is provided with the slot, and the inner conductive body is provided with On the opposite sides of the slot, the circuit layer is provided on the opposite sides of the inner base material layer. The circuit layer covers the slot and is connected to the inner conductive body. The circuit layer and the The inner conductive body is surrounded to form a fourth waveguide, and the foam material filling body is in contact with the fourth waveguide.

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