TWI823074B - Detection device, signal processing device, module thereof and wearable product thereof - Google Patents
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Abstract
Description
本揭露有關於一種偵測裝置、訊號處理裝置、其模組及其穿戴式產品。 The present disclosure relates to a detection device, a signal processing device, a module thereof and a wearable product thereof.
習知的穿戴式產品可包含偵測裝置及訊號處理裝置,偵測裝置包含數個偵測點,以偵測人體的生理訊號。訊號處理裝置可處理偵測點所偵測之生理訊號,以取得人體的生理資訊。使用上,必須結合偵測裝置與訊號處理裝置,以電性連接偵測裝置與訊號處理裝置。穿戴式產品會接觸人體,偵測裝置與訊號處理裝置在設計上必須考量結合穩定性、人體工學及/或阻隔影響裝置壽命等各種因素等,其中阻隔性可包含防水性、干涉遮蔽性或UV遮蔽等。 Conventional wearable products may include a detection device and a signal processing device. The detection device includes several detection points to detect physiological signals of the human body. The signal processing device can process the physiological signals detected by the detection points to obtain physiological information of the human body. In use, the detection device and the signal processing device must be combined and electrically connected to the detection device and the signal processing device. Wearable products will come into contact with the human body. The design of detection devices and signal processing devices must consider various factors such as stability, ergonomics, and/or barrier that affect the life of the device. Barrier properties may include waterproofness, interference shielding, or UV shielding, etc.
本揭露係有關於一種偵測裝置、訊號處理裝置、其訊號偵測處理模組及其穿戴式產品。 The present disclosure relates to a detection device, a signal processing device, its signal detection and processing module and its wearable products.
根據本揭露之一實施例,提出一種偵測裝置。偵測裝置用以結合至訊號處理裝置且包括感知器、傳輸線及第一銜接器。感知器用以感知受測體之生理訊號及/或動作訊號。第一銜接器用以與訊號處理裝置之一第二銜接器直接或間接透過一磁吸力結合。傳輸線電性連接感知器與第一銜接器。 According to an embodiment of the present disclosure, a detection device is provided. The detection device is used to be coupled to the signal processing device and includes a sensor, a transmission line and a first connector. The sensor is used to sense physiological signals and/or movement signals of the subject. The first connector is used to couple with a second connector of the signal processing device directly or indirectly through a magnetic attraction force. The transmission line electrically connects the sensor and the first connector.
根據本揭露之另一實施例,提出一種訊號處理裝置。訊號處理裝置用以結合至偵測裝置且包括第二銜接器、處理器及傳輸線。第二銜接器用以與偵測裝置之一第一銜接器直接或間接透過一磁吸力結合。處理器用以處理來自於偵測裝置的生理訊號及/或動作訊號。傳輸線電性連接第二銜接器與處理器。 According to another embodiment of the present disclosure, a signal processing device is provided. The signal processing device is used to be coupled to the detection device and includes a second connector, a processor and a transmission line. The second connector is used to couple with the first connector of the detection device directly or indirectly through a magnetic attraction force. The processor is used to process physiological signals and/or motion signals from the detection device. The transmission line electrically connects the second connector and the processor.
根據本揭露之另一實施例,提出一種訊號偵測處理模組。訊號偵測處理模組包括偵測裝置及訊號處理裝置。偵測裝置包括感知器、第一傳輸線及第一銜接器。感知器用以感知受測體之生理訊號及/或動作訊號。第一傳輸線電性連接感知器與第一銜接器。訊號處理裝置包括第二銜接器、處理器及第二傳輸線。處理器用以處理生理訊號及/或動作訊號。第二傳輸線電性連接第二銜接器與處理器。偵測裝置與訊號處理裝置透過磁吸力結合。 According to another embodiment of the present disclosure, a signal detection and processing module is provided. The signal detection and processing module includes a detection device and a signal processing device. The detection device includes a sensor, a first transmission line and a first connector. The sensor is used to sense physiological signals and/or movement signals of the subject. The first transmission line electrically connects the sensor and the first connector. The signal processing device includes a second connector, a processor and a second transmission line. The processor is used to process physiological signals and/or motion signals. The second transmission line electrically connects the second connector and the processor. The detection device and the signal processing device are combined through magnetic attraction.
根據本揭露之另一實施例,提出一種穿戴式產品。穿戴式產品包括載體及前述訊號偵測處理模組。訊號偵測處理模組配置在載體中。 According to another embodiment of the present disclosure, a wearable product is provided. Wearable products include carriers and the aforementioned signal detection and processing modules. The signal detection and processing module is configured in the carrier.
為了對本揭露之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above and other aspects of the present disclosure, embodiments are given below and described in detail with reference to the accompanying drawings:
10:穿戴式產品 10: Wearable products
11:載體 11: Carrier
20:工具 20:Tools
20a:開孔 20a:Opening
100,200,300,400,500,600:訊號偵測處理模組 100,200,300,400,500,600: Signal detection and processing module
110,310,410,510,610:偵測裝置 110,310,410,510,610:Detection device
111:感知器 111:Perceptron
111A,111A’:吸盤 111A, 111A’: suction cup
112:第一銜接器 112:First connector
113:第一傳輸線 113: First transmission line
113A:線股 113A: Line stock
113A1:單芯線 113A1:Single core wire
113A2:第二包覆層 113A2: Second cladding layer
113B:第一包覆層 113B: First cladding layer
113C:可拉伸材 113C: Stretchable material
1131:導線 1131:Wire
1132:阻隔層 1132: Barrier layer
114:固定件 114: Fixtures
114a:固定孔 114a:fixing hole
114s,224s:外表面 114s, 224s: outer surface
120,220,320,420,520,620:訊號處理裝置 120,220,320,420,520,620:Signal processing device
121:處理器 121: Processor
122:第二銜接器 122: Second connector
123:第二傳輸線 123: Second transmission line
124,224,424,624:外接盒 124,224,424,624:External box
124s:內側面 124s: medial surface
114e,124e,2241e,2242e:端面 114e,124e,2241e,2242e: end face
124a:貫孔 124a:Through hole
1241:第一分件 1241: First piece
1241A:第一扣合部 1241A: First fastening part
1241s:第一對接面 1241s: First docking surface
1242:第二分件 1242:Second piece
1242A:第二扣合部 1242A: Second fastening part
1242b,424s,624s:內表面 1242b, 424s, 624s: inner surface
1242s:第二對接面 1242s: Second docking surface
125:抵壓件 125: Pressure-resisting parts
2241:本體 2241:Ontology
2242:延伸部 2242:Extension
330:固定盒 330:Fixed box
315:第一結合部 315:First joint
326:第二結合部 326:Second joint
331:第三結合部 331:The third joint part
332:第四結合部 332:The fourth joint
415,515,615:第一結合部 415,515,615: The first joint
426,526,626:第二結合部 426,526,626: The second junction
SP:密閉空間 SP: Confined space
S1:生理訊號 S1: physiological signal
S2:動作訊號 S2: action signal
第1圖繪示依照本揭露一實施例之穿戴式產品的示意圖。 Figure 1 is a schematic diagram of a wearable product according to an embodiment of the present disclosure.
第2A圖繪示第1圖之穿戴式產品的訊號偵測處理模組之偵測裝置與訊號處理裝置的分解示意圖。 Figure 2A shows an exploded schematic diagram of the detection device and signal processing device of the signal detection and processing module of the wearable product in Figure 1 .
第2B圖繪示第2A圖之偵測裝置與訊號處理裝置的結合圖。 Figure 2B shows a combination diagram of the detection device and the signal processing device in Figure 2A.
第2C1圖繪示第2A圖之第一傳輸線113沿方向2C1-2C1’的剖面圖。
Figure 2C1 shows a cross-sectional view of the
第2C2圖繪示依照本揭露另一實施例之第一傳輸線的示意圖。 Figure 2C2 is a schematic diagram of a first transmission line according to another embodiment of the present disclosure.
第2D圖繪示第2A圖之訊號處理裝置沿方向2D-2D’的剖面圖。
Figure 2D shows a cross-sectional view of the signal processing device of Figure 2A along the
第3A圖繪示依照本揭露另一實施例之訊號偵測處理模組的示意圖。 Figure 3A is a schematic diagram of a signal detection and processing module according to another embodiment of the present disclosure.
第3B圖繪示第3A圖之訊號處理裝置沿方向3B-3B’的剖面圖。
Figure 3B shows a cross-sectional view of the signal processing device of Figure 3A along
第4A圖繪示依照本揭露另一實施例之訊號偵測處理模組的示 意圖。 Figure 4A illustrates a signal detection and processing module according to another embodiment of the present disclosure. intention.
第4B圖繪示第4A圖之訊號偵測處理模組沿方向4B-4B’的剖面圖。
Figure 4B shows a cross-sectional view of the signal detection and processing module of Figure 4A along
第5A圖繪示依照本揭露另一實施例之訊號偵測處理模組之偵測裝置與訊號處理裝置的分解示意圖。 Figure 5A shows an exploded schematic diagram of the detection device and the signal processing device of the signal detection and processing module according to another embodiment of the present disclosure.
第5B圖繪示第5A圖之偵測裝置與訊號處理裝置的結合示意圖。 Figure 5B shows a schematic diagram of the combination of the detection device and the signal processing device in Figure 5A.
第6A圖繪示依照本揭露另一實施例之訊號偵測處理模組的示意圖。 Figure 6A is a schematic diagram of a signal detection and processing module according to another embodiment of the present disclosure.
第6B圖繪示第6A圖之第二結合部的側視圖。 Figure 6B shows a side view of the second joint portion of Figure 6A.
第6C圖繪示在另一實施例中第6A圖之訊號偵測處理模組更包含固定盒的示意圖 Figure 6C shows a schematic diagram of the signal detection and processing module of Figure 6A further including a fixing box in another embodiment.
第7A圖繪示依照本揭露另一實施例之訊號偵測處理模組之偵測裝置與訊號處理裝置的分解示意圖。 Figure 7A shows an exploded schematic diagram of the detection device and the signal processing device of the signal detection and processing module according to another embodiment of the present disclosure.
第7B圖繪示第7A圖之偵測裝置與訊號處理裝置的結合示意圖。 Figure 7B shows a schematic diagram of the combination of the detection device and the signal processing device in Figure 7A.
第8A圖繪示使用工具一次操作數個第一銜接器的示意圖。 Figure 8A shows a schematic diagram of using a tool to operate several first connectors at one time.
第8B圖繪示第8A圖之工具在第一銜接器與第二銜接器結合後脫離的示意圖。 Figure 8B is a schematic diagram of the tool of Figure 8A being detached after the first adapter and the second adapter are coupled.
請參照第1及2A~2D圖,第1圖繪示依照本揭露一實施例之穿戴式產品10的示意圖,第2A圖繪示第1圖之穿戴式產品10的訊號偵測處理模組100之偵測裝置110與訊號處理裝置120的分解示意圖,第2B圖繪示第2A圖之偵測裝置110與訊號處理裝置120的結合圖,第2C1圖繪示第2A圖之第一傳輸線113沿方向2C1-2C1’的剖面圖,第2C2圖繪示依照本揭露另一實施例之第一傳輸線113’的示意圖,而第2D圖繪示第2A圖之訊號處理裝置120沿方向2D-2D’的剖面圖。
Please refer to Figures 1 and 2A~2D. Figure 1 illustrates a schematic diagram of a
穿戴式產品10可包括載體11及訊號偵測處理模組100。訊號偵測處理模組100配置於載體11中。穿戴式產品10例如是智慧衣,然本揭露實施例不以此為限。穿戴式產品10可於一液態環境中操作,如海水,然本揭露實施例不受此限。
The
載體11可以是完整衣物外形或衣物外形的一部分。在本實施例中,載體11為完整衣物外形,訊號偵測處理模組100可長期固定配置於載體11中,或者,亦可視使用需求快速分離訊號處理裝置120與偵測裝置110,例如穿脫或清洗等。在一實施例中,載體11可以是衣物外形的一部分,其形狀例如是圓形、多邊形、橢圓形或其它邊界由直線、曲線或其組合線段所組成的形狀,訊號偵測處理模組100中之偵測裝置110,可預先配置於載體11,然後
載體11再採用貼合、黏合、燙印等方式配置於智慧衣中,可快速與訊號處理裝置120吸著固定形成訊號偵測處理模組100。
The
載體11例如是適合穿戴的材質,其具有可撓性、可拉伸性等特性。載體11例如是織物、非織物或複合物。織物例如是布面或織品,其可採用編織、縫合等方式形成。非織物例如是包含可拉伸膜、熱塑性氨酯(Thermoplastic Urethane,TPU)、聚氨酯(Polyurethane,PU)、矽膠、橡膠、塑膠等非編織品。複合物例如是包含織物與非織物的組合。
The
訊號偵測處理模組100包括偵測裝置110及訊號處理裝置120。偵測裝置110與訊號處理裝置120例如是採用磁吸力結合。偵測裝置110包括至少一感知器111、至少一第一銜接器112及至少一第一傳輸線113。感知器111用以感知待測物體之生理訊號S1及/或動作訊號S2。而受測體可以是生物體或非生物體(如,機械人),第一傳輸線113電性連接感知器111與第一銜接器112。訊號處理裝置120包括處理器121、至少一第二銜接器122及至少一第二傳輸線123。處理器121可處理生理訊號S1及/或動作訊號S2。第二傳輸線123電性連接第二銜接器122與處理器121。偵測裝置110之第一銜接器112與訊號處理裝置120之第二銜接器122可直接或間接透過磁吸力接觸。磁吸力可讓偵測裝置110與訊號處理裝置120進行結合。在一實施例中,
第一銜接器112及第二銜接器122可以是具有磁性的材質,如導磁金屬或導磁合金、可以被磁吸的材質或者非磁性金屬。在一實施例中,第一銜接器112及第二銜接器122的端部可配置有導磁板,其作用可讓磁力線限制在一完整且範圍縮小的密閉磁力圈內,以增加磁力。此外,若第一銜接器112及第二銜接器122採用非磁性金屬時,可藉由具磁吸的額外結構(如第6A圖所示之第一結合部515與第二結合部526)讓第一銜接器112與第二銜接器122可接觸以傳輸訊號。
The signal detection and
感知器111例如是任何生理訊號感知器,感知器111的種類可視穿戴式產品10的要求而定,本揭露實施例不加以限定。此外,感知器111相對於第一銜接器112的位置可視穿戴式產品10的要求而定,本揭露實施例不加以限定。
The
如第2A圖所示,偵測裝置110可更包含至少一固定器,固定器可為吸盤、導電膠、導電橡膠、導電纖維墊、導電魔鬼氈靜電膜、矽膠、透氣膠膜等等,將偵測端固定在受測體上,例如人類皮膚、動物皮膚或者機械人身上。此外,可由偵測環境來選擇適合材質,在一實施例中,偵測端固定處可以有防水設計以避免短路,如吸盤或者靜電防水膜等;或者,在乾燥環境,偵測端固定處可以為含水量高的矽膠、導電伸縮膠材、導電橡膠、導電纖維墊、非導電物質或其它可避免偵測端
點容易脫落之材質。固定器以吸盤為例,至少一吸盤111A及至少一吸盤111A’,其可配置於感知器111。吸盤111A可吸附於受測體上,受測體可以是生物體或機械人等,以增加受測體與感知器111之間的結合性。在一實施例中,一個吸盤111A配置在一個感知器111上,然亦可一個吸盤111A’圍繞數個感知器111。在另一實施例中,偵測裝置110可省略吸盤111A。處理器121可處理感知器111所感知之生理訊號S1及/或動作訊號S2等,並據以取得生物體的每分鐘脈搏數(脈搏值)、血氧量、血壓、其他生物體的生理訊息及/或動作訊號等。生物體例如是人體或其他動物,而非生物體例如是機械人或各種形狀的機械物體。此外,吸盤111A’例如是具有介於0.2毫米~100毫米的直徑,且/或可具有合適的形狀及/或顏色,本揭露實施例不限定吸盤111A’的尺寸、形狀及/或顏色。
As shown in Figure 2A, the
第一銜接器112及第二銜接器122除了可以兩者皆具有磁性或其中一個具有磁性而另一個為可被磁吸之材質,即其中一個具有磁性與另一個為導磁銜接,且可更具有導電性及無方向性,例如導磁金屬或導磁合金等。如此,當第一銜接器112及第二銜接器122結合時(如第2B圖所示),感知器111所感知之生理訊號S1及/或動作訊號S2可透過第一銜接器112及第二銜接器122傳輸於處理器121。
The
第一銜接器112與第二銜接器122之一者例如是磁鐵,第一銜接器112與第二銜接器122之另一者可受到磁鐵的磁場作用而磁化,如具有鐵磁性。如此,如第2B圖所示,第一銜接器112與第二銜接器122可透過磁吸力結合。在另一實施例中,第一銜接器112與第二銜接器122可皆為磁鐵。此外,第一銜接器112及/或第二銜接器122的材料例如是包含鈮(Nb)、鐵(Fe)、硼(B)或其組合,然本揭露實施例不受此限。
One of the
如第2A圖所示,偵測裝置110之一條第一傳輸線113連接一個第一銜接器112與一個感知器111。本揭露實施例不限定第一傳輸線113的數量、第一銜接器112的數量及感知器111的數量,其可視穿戴式產品10之實際應用而定。第一傳輸線113的製程手法可例如是金屬編織纏繞、印刷具彈性的導電膠體在可撓性或可拉伸材質上或者利用紡織方法或刺繡手法將金屬線編織於織物或非織物上。此外,數個第一銜接器112可匯集在一起。例如,偵測裝置110更包括一固定件114,數個第一銜接器112可固定於固定件114。此些第一銜接器112之間的相對位置受到固定件114拘束。例如,固定件114具有至少一固定孔114a,各第一銜接器112可穿設並固定於固定孔114a。
As shown in FIG. 2A , a
在一實施例中,第一傳輸線113表面可以包覆防水膠材、防水膜層、或具有疏水性膜層以阻絕水氣侵蝕進而提升耐候性,
此包覆材質可以是具備彈性、薄膜形式或是經表面處理而使其具有防水或防潑水能力的材質,如第2C1圖所示,第一傳輸線113例如是阻隔傳輸線。例如,第一傳輸線113包含至少一導線1131及至少一阻隔層1132,其中阻隔層1132包覆導線1131。阻隔層1132可阻隔外界(如,水氧、海水或淡水等)影響導線1131。第一傳輸線113可包含至少一條線股113A,另可選擇性以第一包覆層113B包覆線股113A。第一包覆層113B例如是絕緣層,絕緣層的材質可為塑膠、彈性防水層、無機薄膜或有機無機複合多層膜等,本揭露實施例並不以此為限。各線股113A包含至少一條單芯線113A1,其中單芯線113A1包含導線1131及阻隔層1132,另可選擇性以第二包覆層113A2包覆此些單芯線113A1。第二包覆層113A2例如是絕緣層,絕緣層的材質可為塑膠、彈性防水層、無機薄膜或有機無機複合多層膜等,本揭露實施例亦不以此為限。
In one embodiment, the surface of the
當載體11為織物時,第一傳輸線113可直接編織成載體11的至少一部分,或者採用網印、噴塗或轉印等技術形成於載體11的至少一部分。相似地,當載體11為非織物或複合物時,第一傳輸線113可直接編織成載體11的至少一部分,或者採用網印、噴塗或轉印等技術形成於載體11的至少一部分。
When the
載體11可具有可拉伸性。在一實施例中,可採用例如是編織方法,使載體11具備可拉伸性。在另一實施例中,如第2C2
圖所示,第一傳輸線113’本身可具有可拉伸性。第一傳輸線113’包括可拉伸材113C及前述第一傳輸線113,其中第一傳輸線113可螺旋狀地圍繞可拉伸材113C,如此螺旋狀之第一傳輸線113’也具備可拉伸性。
The
前述阻隔層1132不限於應用傳輸線。偵測裝置110的至少一部分的外表面、訊號處理裝置120的至少一部分的外表面及/或載體11的至少一部分的外表面也可塗佈有阻隔層1132。
The
以材質來說,阻隔層1132可用以防水氧或是減少訊號干擾,例如是包含聚矽氮烷、二甲基二氯矽烷、三甲基氯矽烷,SiOx、SiNx、SiOxNy、塑膠材料(包含聚氯乙烯(Polyvinyl Chloride,PVC)或聚乙烯(Poly Ethylene,PE)等高分子材料)、漆料(如,漆包線(Enameled MagnetWire)或特殊絕緣耐熱之漆料)及/或RB電線(Rubber Insulated Power Wire),其中RB電線以天然橡膠含橡膠碳化氫30%以上之混合絕緣物。此外,為提升附著能力,可於阻隔材與被塗物之間形成例如是3-氨基-丙基三乙氧基矽烷、3-縮水甘油基氧基丙基三乙氧基矽烷、3-(三甲氧基甲矽烷基)-1-丙硫醇、乙烯基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、N-(2-氨基乙基)-3-氨基丙基三甲氧基矽烷、雙(3-三乙氧基甲矽烷基丙基)
胺、N-(n-butyl)-3-氨基丙基三甲氧基矽烷和N-(2-氨基乙基)-3-氨基丙基甲基二甲氧基矽烷等材料。
In terms of materials, the
在一實施例中,阻隔層1132可採用將液態阻隔材料固化後形成。在此例子中,導線1131可浸潤於此液態阻隔材料或將液態阻隔材料塗佈在導線1131上,使液態阻隔材料在固化後形成包覆導線1131之阻隔層,此浸潤或塗佈手法製作之阻隔層可以是一層或多層,甚或可藉由表面處理(如,電漿處理、電暈處理、照光處理或加熱處理等)進行改質,進而增加阻隔層的防水氧特性。
In one embodiment, the
此外,阻隔層1132也可以是固態阻隔膜,其可採用貼合、黏合等技術形成於載體11,以覆蓋偵測裝置110的至少一部分的外表面、訊號處理裝置120的至少一部分的外表面及/或載體11的至少一部分的外表面。
In addition, the
前述固態阻隔膜例如是可拉伸膜、可拉伸的阻隔材料或其它合適的固態阻隔膜。在實施例中,固態阻隔膜的厚度例如可介於5微米~1000微米之間,然亦可更大或更小,如小於1微米。此外,可拉伸型的阻隔膜的厚度可介於5奈米~2000微米之間。固態阻隔膜例如是單層或多層結構,以多層結構來說,其可以是無機層堆疊、有機層堆疊或其組合堆疊。 The aforementioned solid barrier film is, for example, a stretchable film, a stretchable barrier material or other suitable solid barrier film. In embodiments, the thickness of the solid barrier film can be, for example, between 5 microns and 1000 microns, but can also be larger or smaller, such as less than 1 micron. In addition, the thickness of the stretchable barrier film can range from 5 nanometers to 2000 microns. The solid barrier film is, for example, a single layer or a multi-layer structure. For a multi-layer structure, it can be an inorganic layer stack, an organic layer stack or a combination stack thereof.
以可拉伸膜來說,可拉伸膜例如是透明丁基橡膠(T-IIR),可改善半導體及金屬易氧化的問題。丁基橡膠材料 改造用於可伸縮電子產品基板,T-IIR不僅光滑透明,還具有獨特的低透氣性,可用於防止電子材料受水氧影響。 For stretchable films, stretchable films such as transparent butyl rubber (T-IIR) can improve the problem of semiconductors and metals being easily oxidized. Butyl rubber material Adapted for use in stretchable electronics substrates, T-IIR is not only smooth and transparent, but also has unique low air permeability, which can be used to protect electronic materials from the influence of water and oxygen.
以可拉伸的彈性阻隔材料來說,可拉伸的彈性阻隔材料例如是雙向拉伸聚丙烯薄膜(Biaxially Oriented Polypropylene,BOPP)。「雙向拉伸」意指縱向(Machine Direction,MD)及橫向(Transverse direction,TD)拉伸。延伸後的高分子,可以使高分子拉伸方向規則排列,產生高度的配向,提升材料密度與薄膜強度,此可讓機械性質變好、阻氣性增加而表面的光澤度及透明性也會增加。BOPP薄膜具有質輕、無毒、防潮、機械強度高、尺寸穩定性好、印刷性能良好、抗撕裂性佳、透明性好等優點,以及優異的阻隔水氣能力,電暈處理後與油墨附著力好等優點。 As for stretchable elastic barrier materials, the stretchable elastic barrier material is, for example, biaxially oriented polypropylene film (Biaxially Oriented Polypropylene, BOPP). "Bidirectional stretching" means stretching in the machine direction (MD) and in the transverse direction (TD). The stretched polymer can be regularly arranged in the stretching direction of the polymer, resulting in a high degree of alignment, improving the material density and film strength. This can improve the mechanical properties, increase the gas barrier properties, and improve the gloss and transparency of the surface. Increase. BOPP film has the advantages of light weight, non-toxic, moisture-proof, high mechanical strength, good dimensional stability, good printing performance, good tear resistance, good transparency, etc., as well as excellent water vapor barrier ability, and adheres to ink after corona treatment Good strength and other advantages.
如第2D圖所示,訊號處理裝置120可更包括一外接盒124。第二銜接器122配置在外接盒124並從外接盒124露出,以與第一銜接器112結合。外接盒124具有端面124e及至少一貫孔124a,第二銜接器122配置且固定在貫孔124a。貫孔124a從端面124e延伸,而第二銜接器122從端面124e突出,以便於與第一銜接器112對接。處理器121配置在外接盒124內,可受到外接盒124保護。第二傳輸線123可形成於外接盒124之內側面124s。第二傳輸線123可採用例如是印刷等技術形成於外接盒
124之內側面124s。此外,第一銜接器112與第二銜接器122還可以利用卡榫或是活動板固定後相互銜接易於插拔,避免過多硬物存在而影響穿戴舒適度。第一銜接器112與第二銜接器122兩者可無磁性,利用固定件114與訊號處理裝置120磁吸結合,將第一銜接器112與第二銜接器122對位銜接使訊號可以傳遞。
As shown in FIG. 2D , the
在一實施例中,第二銜接器122可與端面124e齊平、相對端面124e突出或內凹,只要第一銜接器112與第二銜接器122得以銜接即可。第一銜接器112亦可有類似的設計。本揭露之其他實施例皆可視需求如上述調整第一銜接器112與第二銜接器122的樣貌。
In one embodiment, the
如第2D圖所示,外接盒124包括可對接之第一分件1241與第二分件1242。前述處理器121、第二銜接器122及第二傳輸線123可配置於第一分件1241上,然本揭露實施例不受此限。第一分件1241與第二分件1242可採用例如卡合方式結合。第一分件1241包含第一扣合部1241A,而第二分件1242包含一第二扣合部1242A,第一扣合部1241A與第二扣合部1242A卡扣,以固定第一分件1241與第二分件1242之間的相對位置。此外,第一分件1241具有一第一對接面1241s,而第二分件1242具有一第二對接面1242s。當第一分件1241與第二分件1242對接時,第一對接面1241s與第二對接面1242s貼合,可
阻隔外界雜質入侵至外接盒124內部。本文的外界雜質例如是包含各種會影響訊號偵測處理模組的液體(如,海水)、固體或氣體。此外,第一扣合部1241A及第二扣合部1242A可呈環形(從第2D圖之訊號處理裝置120的俯視方向看去),如封閉環形,以對位於外接盒124內的元件提供一全周式(360度)的完整保護。
As shown in FIG. 2D , the
如第2D圖所示,訊號處理裝置120可更包括一抵壓件125。抵壓件125配置於外接盒124內,並抵壓處理器121,進而固定處理器121與外接盒124之間的相對位置。抵壓件125位於第二分件1242與處理器121之間。當第一分件1241與第二分件1242結合時,第二分件1242施以一壓力給抵壓件125,使抵壓件125將處理器121抵壓在第一分件1241上,藉此固定處理器121與外接盒124之間的相對位置。處理器121可包含至少一接腳1211,接腳1211接觸第二傳輸線123,以電性連接第二傳輸線123。透過抵壓件125,可固定處理器121與外接盒124之間的相對位置,進而固定接腳1211與第二傳輸線123之間的相對位置,避免接腳1211與第二傳輸線123發生脫離(電性分離)。此外,如第2D圖所示,抵壓件125例如是由可撓性材料或彈性材料製成,如塑膠、橡膠等材質,可避免壓損處理器121。在一實施例中,抵壓件125可以是彈簧。在本實施例中,抵壓件125預設在第二分件1242之內表面1242b,內表面1242b面向處理器
121。在另一實施例中,抵壓件125與外接盒124也可以是一體成形結構。在其它實施例中,若不需要,偵測裝置110亦可省略抵壓件125。
As shown in FIG. 2D , the
請參照第3A及3B圖,第3A圖繪示依照本揭露另一實施例之訊號偵測處理模組200的示意圖,而第3B圖繪示第3A圖之訊號處理裝置220沿方向3B-3B’的剖面圖。
Please refer to Figures 3A and 3B. Figure 3A illustrates a schematic diagram of the signal detection and
訊號偵測處理模組200包括偵測裝置110及訊號處理裝置220。訊號偵測處理模組200之訊號處理裝置220的處理器121與第二銜接器122間的距離較大(相較於訊號處理裝置120的處理器121與第二銜接器122間的距離而言),可避免電磁波干擾處理器的可能。
The signal detection and
如第3B圖所示,訊號處理裝置220包含處理器121、至少一第二銜接器122、至少一第二傳輸線123、外接盒224及抵壓件125。外接盒224包含本體2241及延伸部2242,延伸部2242連接於本體2241,例如,本體2241具有端面2241e,延伸部2242可從端面2241e往外延伸,如往遠離處理器121的方向延伸。第二銜接器122可配置於延伸部2242,而處理器121可配置於本體2241內,如此可增加處理器121與第二銜接器122之間的距離,避免第二銜接器122的磁性干擾(若有的話)處理器121。此外,延伸部2242可具有至少一貫孔124a,其從延伸部
2242之端面2242e延伸,第二銜接器122可穿設並固定於貫孔124a。此外,相似於外接盒124之分件設計(第一分件1241及第二分件1242),外接盒224也可以分拆成二分件對接而成,容此不再贅述。
As shown in FIG. 3B , the
請參照第4A及4B圖,第4A圖繪示依照本揭露另一實施例之訊號偵測處理模組300的示意圖,而第4B圖繪示第4A圖之訊號偵測處理模組300沿方向4B-4B’的剖面圖。
Please refer to Figures 4A and 4B. Figure 4A illustrates a schematic diagram of the signal detection and
如第4A圖所示,訊號偵測處理模組300包括偵測裝置310、訊號處理裝置320及固定盒330。在偵測裝置310與訊號處理裝置320對接後,固定盒330可固定偵測裝置310與訊號處理裝置320,以增加偵測裝置310與訊號處理裝置320之間的結合性與防水性,且固定盒330可阻擋外力直接作用在第一銜接器112與第二銜接器122,避免第一銜接器112與第二銜接器122輕易分離。固定盒330例如是包含部件,其中此些部件可以彼此樞接或彼此完全分離,此些部件可組合在偵測裝置310及訊號處理裝置320上,固定偵測裝置310與訊號處理裝置320之間的相對位置。
As shown in FIG. 4A , the signal detection and
如第4B圖所示,偵測裝置310包括至少一感知器111、至少一第一銜接器112、至少一第一傳輸線113、固定件114及第一結合部315。第一結合部315配置在固定件114之外表
面114s。在一實施例中,第一結合部315與固定件114可以是一體成形結構。訊號處理裝置320包括處理器121、至少一第二銜接器122、至少一第二傳輸線123、外接盒224及第二結合部326,第二結合部326配置在外接盒224之外表面224s。在一實施例中,第二結合部326與外接盒224可以是一體成形結構。
As shown in FIG. 4B , the
如第4B圖所示,固定盒330包括第三結合部331及第四結合部332,第三結合部331及第四結合部332分別卡合於第一結合部315及第二結合部326,以固定偵測裝置310、訊號處理裝置320與固定盒330之間的相對位置。在一實施例中,第一結合部315及第二結合部326例如是凸部與凹部之一者,而第三結合部331及第四結合部332例如是凸部與凹部之另一者。凸部與凹部緊配,可增加偵測裝置310、訊號處理裝置320與固定盒330之間的結合性與防水能力。結合方式可以利用卡榫或是磁吸方式達成。
As shown in Figure 4B, the fixed
在一實施例中,第一結合部315、第二結合部326、第三結合部331及第四結合部332可呈環狀,如封閉環形,以全周式(360度)環繞固定盒330。偵測裝置310、訊號處理裝置320與固定盒330之間形成一密閉空間SP。
In one embodiment, the
如第4B圖所示,第一銜接器112及第二銜接器122位於第一結合部315與第二結合部326之間,使第一銜接器112
及第二銜接器122位於密閉空間SP內,而可受到充分保護,避免外界雜質侵害第一銜接器112及第二銜接器122。此外,在一實施例中,可對固定件114、固定盒330及/或外接盒124的表面進行阻隔處理,例如塗佈阻隔層、防水漆或者防水表面處理等,強化阻隔水氧進入避免影響訊號傳遞。本揭露之其他實施例亦可視需求如上述進行阻隔處理。
As shown in Figure 4B, the
請參照第5A及5B圖,第5A圖繪示依照本揭露另一實施例之訊號偵測處理模組400之偵測裝置410與訊號處理裝置420的分解示意圖,而第5B圖繪示第5A圖之偵測裝置410與訊號處理裝置420的結合示意圖。
Please refer to Figures 5A and 5B. Figure 5A illustrates an exploded schematic diagram of the
訊號偵測處理模組400包括偵測裝置410及訊號處理裝置420。偵測裝置410包括至少一感知器111、至少一第一銜接器112、至少一第一傳輸線113、固定件114及第一結合部415。第一結合部415位於固定件114之外表面114s。訊號處理裝置420包括處理器121、至少一第二銜接器122、至少一第二傳輸線123、外接盒424及第二結合部426,第二結合部426配置在外接盒424之內表面424s。在一實施例中,第一結合部415例如是凹槽與凸緣之一者,而第二結合部426例如是凹槽與凸緣之另一者。凹槽與凸緣可緊配,以增加偵測裝置410與訊號處理裝置420之間的結合性。
The signal detection and
由於第一結合部415與第二結合部426的扣合,可阻擋外力直接作用在第一銜接器112與第二銜接器122,避免第一銜接器112與第二銜接器122輕易分離。
Due to the fastening of the
在一實施例中,第一結合部415及第二結合部426可呈環狀,如封閉環形。如第5B圖所示,當偵測裝置410與訊號處理裝置420結合時,偵測裝置410與訊號處理裝置420之間形成密閉空間SP。第一銜接器112及第二銜接器122位於密閉空間SP內,而可受到充分保護,避免外界雜質侵害第一銜接器112及第二銜接器122。
In one embodiment, the
請參照第6A~6C圖,第6A圖繪示依照本揭露另一實施例之訊號偵測處理模組500的示意圖,第6B圖繪示第6A圖之第二結合部526的側視圖,而第6C圖繪示在另一實施例中第6A圖之訊號偵測處理模組500更包含固定盒330的示意圖。
Please refer to Figures 6A to 6C. Figure 6A illustrates a schematic diagram of the signal detection and
訊號偵測處理模組500包括偵測裝置510及訊號處理裝置520。訊號偵測處理模組500之偵測裝置510之第一結合部515與訊號處理裝置520之第二結合部526以磁吸力結合。
The signal detection and
偵測裝置510包括至少一感知器111、至少一第一銜接器112、至少一第一傳輸線113、固定件114及第一結合部515。第一結合部515配置在固定件114之端面114e。第一結合部515環繞此些第一銜接器112。訊號處理裝置520包括處理器
121、至少一第二銜接器122、至少一第二傳輸線123、外接盒124及第二結合部526,第二結合部526配置在外接盒124之端面124e。如第6B圖所示,第二結合部526環繞此些第二銜接器122。當第一結合部515與第二結合部526對接時,第一銜接器112可與第二銜接器122對接。第一結合部515與第二結合部526以磁吸力結合,可增加偵測裝置510與訊號處理裝置520的結合性。
The
如第6C圖所示,在偵測裝置310與訊號處理裝置320對接後,固定盒330可固定偵測裝置310與訊號處理裝置320,以增加偵測裝置310與訊號處理裝置320之間的結合性與防水性,且固定盒330可阻擋外力直接作用在第一銜接器112與第二銜接器122,避免第一銜接器112與第二銜接器122輕易分離。
As shown in Figure 6C, after the
請參照第7A及7B圖,第7A圖繪示依照本揭露另一實施例之訊號偵測處理模組600之偵測裝置610與訊號處理裝置620的分解示意圖,而第7B圖繪示第7A圖之偵測裝置610與訊號處理裝置620的結合示意圖。訊號偵測處理模組600包括偵測裝置610及訊號處理裝置620。偵測裝置610包括至少一感知器111、至少一第一銜接器112、至少一第一傳輸線113、固定件114及第一結合部615。第一結合部615相對於固定件114之外表
面114s突出。訊號處理裝置620包括處理器121、至少一第二銜接器122、至少一第二傳輸線123、外接盒624及第二結合部626,第二結合部626相對外接盒624之內表面624s內陷。在一實施例中,第一結合部615例如是彈性元件。如第7A圖所示,第一結合部615處於一釋放狀態。在偵測裝置610與訊號處理裝置620的組合過程中,第一結合部615形變而儲存一彈性位能。在偵測裝置610與訊號處理裝置620的組合後,如第7B圖所示,第一結合部615釋放彈性位能,使第一結合部615卡合於第二結合部626。
Please refer to Figures 7A and 7B. Figure 7A illustrates an exploded schematic diagram of the
請參照第8A及8B圖,第8A圖繪示使用工具20一次操作數個第一銜接器112的示意圖,第8B圖繪示第8A圖之工具20在第一銜接器112與第二銜接器122結合後脫離的示意圖。
Please refer to Figures 8A and 8B. Figure 8A shows a schematic diagram of using the
如第8A圖所示,數個第一銜接器112可固定於工具20中,然後工具20再將此些第一銜接器112一次性地連接至訊號處理裝置120(訊號處理裝置120繪示於第8B圖)之數個第二銜接器122(繪示於第8B圖)。工具20具有至少一開孔20a,其內徑可大於第一傳輸線113的外徑,容許第一傳輸線113穿過,可以小於第一銜接器112的外徑,避免第一銜接器112脫離工具20。
As shown in FIG. 8A , several
如第8B圖所示,在第一銜接器112與第二銜接器122結合後,工具20可脫離第一銜接器112,即,工具20不保留在訊號偵測處理模組100中。如此,偵測裝置110可減少穿戴上的不適感。
As shown in FIG. 8B , after the
本揭露實施例提出一種適用於穿戴式產品之偵測裝置、訊號處理裝置、其訊號偵測處理模組以及其穿戴式產品。訊號偵測處理模組包括偵測裝置及訊號處理裝置,其中偵測裝置與訊號處理裝置可透過磁吸力結合。在一實施例中,偵測裝置及訊號處理裝置分別包括第一結合部及第二結合部,其中第一結合部與第二結合部結合後,可固定偵測裝置與訊號處理裝置之間的相對位置。在另一實施例中,在第一結合部與第二結合部結合後,偵測裝置與訊號處理裝置可形成一空間,第一銜接器與第二銜接器被配置於空間內,以達到對銜接器的保護效果,包括防水保護、預防訊號銜接錯誤或訊號干擾的保護等。在其它實施例中,訊號偵測處理模組可更包括固定盒,固定盒可固定偵測裝置與訊號處理裝置的相對位置,固定盒可阻擋外力直接作用在第一銜接器與第二銜接器,避免第一銜接器與第二銜接器輕易分離並加強防護。 The embodiments of this disclosure provide a detection device, a signal processing device, a signal detection and processing module thereof, and a wearable product suitable for wearable products. The signal detection and processing module includes a detection device and a signal processing device, wherein the detection device and the signal processing device can be combined through magnetic attraction. In one embodiment, the detection device and the signal processing device respectively include a first combination part and a second combination part, wherein the first combination part and the second combination part can fix the connection between the detection device and the signal processing device after being combined. relative position. In another embodiment, after the first coupling part and the second coupling part are combined, the detection device and the signal processing device can form a space, and the first connector and the second connector are arranged in the space to achieve alignment. The protective effect of the connector includes waterproof protection, protection against signal connection errors or signal interference, etc. In other embodiments, the signal detection and processing module may further include a fixing box. The fixing box can fix the relative position of the detection device and the signal processing device. The fixing box can block external forces from directly acting on the first connector and the second connector. , to prevent the first connector and the second connector from being easily separated and to enhance protection.
綜上所述,雖然本揭露已以實施例揭露如上,然其並非用以限定本揭露。本揭露所屬技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾。因此,本 揭露之保護範圍當視後附之申請專利範圍及其均等範圍所界定者為準。 In summary, although the present disclosure has been disclosed in the above embodiments, they are not used to limit the present disclosure. Those with ordinary knowledge in the technical field to which this disclosure belongs can make various modifications and modifications without departing from the spirit and scope of this disclosure. Therefore, this The scope of protection disclosed shall be determined by the appended patent application scope and its equivalent scope.
110:偵測裝置 110:Detection device
111:感知器 111:Perceptron
111A,111A’:吸盤 111A, 111A’: suction cup
112:第一銜接器 112:First connector
113:第一傳輸線 113: First transmission line
114:固定件 114: Fixtures
114a:固定孔 114a:fixing hole
120:訊號處理裝置 120:Signal processing device
121:處理器 121: Processor
122:第二銜接器 122: Second connector
123:第二傳輸線 123: Second transmission line
Claims (16)
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