TWI822300B - Semiconductor deposition system and operation method of the same - Google Patents

Abstract

A semiconductor deposition system according to an embodiment of the present invention includes: an operation distribution device for establishing a distribution plan for unit operations based on equipment information and distributing the unit operations; a deposition facility for allocating the unit operation to a plurality of chambers based on the distribution plan established by the operation distribution device; a sensing device for detecting the state of the deposition equipment and generating state data; and a control device for generating the facility information on the deposition facility based on the state data, wherein the distribution plan includes contents corresponding to the unit operations for each of the plurality of chambers.

Description

Semiconductor deposition system and method of operating the same

Embodiments of the present invention relate to semiconductor deposition systems and operating methods, and in particular to a system that can optimize production in real time by applying fault prediction algorithms to each production line of semiconductor deposition equipment and based on abnormal signals of the deposition equipment and the effective life of major components. Planned semiconductor deposition system and method of operation thereof.

Semiconducting thin films can be produced in various ways. For example, Chemical Vapor Deposition (CVD) that uses chemical methods to form an insulating film (or metal film), etc., Physical Vapor Deposition (PVD) that uses physical methods to form a metal film, and oxidation using oxygen through rotation. Films and spin-on-glass (SOG) methods are used to spray wafers coated with a film-forming solution, and damascene methods are used to decompose the solution and perform electroplating to form a copper mold.

Recently, atomic layer deposition (ALD) technology, which can satisfy both film thickness and reliability, is being adopted.

Atomic layer deposition is not a physical method similar to PVD, but a chemical method similar to CVD. Input raw materials are provided in sequence, so that the single atom (or molecule) layer is deposited in each cycle. A method of forming a Mono Layer (ML). At this time, the atomic layer has the characteristic of being easily adsorbed on the wall of the gap or trench through adsorption.

For example, atomic layer deposition is performed by placing the primary raw material (precursor) into the chamber and triggering adsorption on its surface, and then placing the secondary raw material (reactive object) into the chamber to chemically replace it with the primary raw material. , and finally generate the third new substance (membrane).

The equipment used to perform the above-mentioned atomic layer deposition (ie, ALD equipment) distributes tasks requested by an upper-level system (eg, Enterprise Resource Planning (ERP), etc.) to multiple chambers respectively. The ALD device confirms the chamber status and does not distribute tasks to chambers with abnormal status.

However, with the existing method, since the equipment itself cannot confirm the chamber status and distribute tasks, it leads to an increase in inefficiency such as production line interruption, and there is a problem of low production efficiency.

Therefore, there is an urgent need for a semiconductor deposition system and its operating method that can optimize production plans in real time based on abnormal signals of deposition equipment and the effective life of major components.

[Prior technical documents]

[Patent Document]

(Patent Document 1) Japanese Patent Publication No. 2021-60929 "Production Visualization System" (published on April 15, 2021)

(Patent document 2) Japanese Patent Publication No. 2020-197912 "Production monitoring device, production monitoring system, production monitoring method and program" (published on December 10, 2020)

In view of this, our inventors devoted themselves to further research on the semiconductor deposition system, and began to carry out research and development and improvement, hoping to solve the above problems with a better invention, and after continuous testing and modification, the present invention was born.

An object of the present invention is to provide a semiconductor deposition system and its operating method that can optimize production plans in real time by applying a fault prediction algorithm to each production line of semiconductor deposition equipment and based on abnormal signals of the deposition equipment and the effective life of major components.

Another object of the present invention is to provide a semiconductor deposition system and an operating method thereof that can manage and allocate tasks on a chamber basis.

Another object of the present invention is to provide a semiconductor deposition system and an operating method thereof that enable continuous production of deposition equipment, minimize equipment losses, and maximize production throughput.

Another object of the present invention is to provide a semiconductor deposition system and an operating method thereof that can minimize operation and maintenance costs by calculating the repair time of the equipment in advance.

A semiconductor deposition system according to an embodiment of the present invention includes: a task allocation device that establishes an allocation plan for unit tasks based on equipment information and allocates the unit tasks; and a deposition equipment that is based on the allocation established by the task allocation device. a plan that distributes the unit tasks to a plurality of chambers; a sensing device that generates status data by sensing the status of the deposition equipment; and a control device that generates all the parameters for the deposition equipment based on the status data. The equipment information is provided, and the distribution plan includes the content of each of the unit tasks corresponding to each of the plurality of chambers.

In addition, the equipment information includes at least one of equipment failure information and equipment repair information. The equipment failure information includes whether a failure occurs and a failure prediction result of the deposition equipment and each of the plurality of chambers. The equipment The repair information includes the repair time to repair the fault.

In addition, the task allocation device establishes and modifies the allocation plan in real time based on the equipment information and using task allocation optimization and scheduling algorithms.

In addition, the task allocation device establishes the allocation plan, and when the deposition equipment fails or is predicted to fail, the unit task is not allocated to the corresponding deposition equipment during the repair time, and the task The allocation device establishes the allocation plan, and when a failure occurs or is predicted to occur in any one of the plurality of chambers, the unit task is not allocated to the corresponding chamber during the repair time.

Additionally, each of the plurality of chambers includes a well and a pump.

Furthermore, the sensing device includes: an equipment sensing unit for sensing a state of the deposition equipment; a well sensing unit for sensing a state of a well of each of the plurality of chambers; and a pump A sensing unit configured to sense the status of the pump in each of the plurality of chambers.

In addition, the control device includes: a fault judgment unit for judging whether the deposition equipment and each of the plurality of chambers are faulty; a fault prediction unit for predicting whether the deposition equipment and each of the plurality of chambers are faulty. A fault occurs in a chamber; and a repair time calculation unit is used to calculate the repair time used to repair the fault.

In addition, the fault determination unit determines that a fault occurs in the corresponding chamber when at least one of the corresponding well and the corresponding pump in any one of the plurality of chambers fails.

In addition, the fault prediction unit uses an artificial intelligence model to derive the remaining effective life of the component based on the status data, and predicts the occurrence of a failure based on the remaining effective life.

Furthermore, the deposition equipment is an atomic layer deposition equipment.

Furthermore, the sensing device senses the state of the deposition equipment at least twice, and generates the state data by integrating sensing results.

The operating method of a semiconductor deposition system according to an embodiment of the present invention includes the following steps: a task allocation device establishes an allocation plan for unit tasks based on equipment information, and allocates the unit tasks; the deposition equipment is based on the task allocation plan established by the task allocation device. a distribution plan that distributes the unit task to a plurality of chambers; the plurality of chambers execute the unit task; a sensing device generates status data by sensing a status of the deposition equipment; and a control device based on the status data , generating the equipment information for the deposition equipment, and the distribution plan includes content that the unit tasks respectively correspond to each of the plurality of chambers.

In addition, the equipment information includes at least one of equipment failure information and equipment repair information, and the equipment failure information includes whether failures of the deposition equipment and each of the plurality of chambers have occurred and failure prediction results. The repair information includes the repair time to repair the fault.

In addition, the step of establishing the allocation plan and allocating the unit tasks includes: the task allocation device confirms whether the deposition equipment fails and whether the failure is predicted based on the equipment information; and when the deposition equipment fails When a failure occurs or a failure is predicted to occur, the corresponding deposition equipment is excluded from the allocation objects.

In addition, the step of establishing the allocation plan and allocating the unit tasks includes: the task allocation device confirms whether a failure occurs in the multiple chambers and whether a failure is predicted based on the equipment information; when the multiple chambers When at least one of the chambers fails or is predicted to fail, the task allocation device excludes the corresponding chamber from the allocation object; and the task allocation device establishes the allocation plan based on the allocation object, and allocates Said unit mission.

Furthermore, in the step of generating status data by sensing the status of the deposition equipment, the sensing device senses the status of the deposition equipment at least twice, and generates status data by integrating the sensing results.

The semiconductor deposition system and its operating method of the present invention can optimize the production plan in real time based on the abnormal signals of the deposition equipment and the effective life of the main components by applying a fault prediction algorithm in each production line of the semiconductor deposition equipment.

In addition, the semiconductor deposition system and its operating method of the present invention have the effect of being able to manage and allocate tasks according to chamber units.

In addition, the semiconductor deposition system and its operating method of the present invention can continuously produce through the deposition equipment, which can have the effect of minimizing equipment losses and maximizing production throughput.

In addition, the semiconductor deposition system and its operating method of the present invention have the effect of minimizing operation and maintenance costs by calculating the repair time of the equipment in advance.

In addition, the semiconductor deposition system and its operating method of the present invention have the effect of improving the reliability of the sensing results by sensing at least once.

[Invention]

10:Semiconductor deposition system

100:Task distribution device

20:Resource management system

200:Deposition equipment

210: First deposition equipment

220: Second deposition equipment

300: Chamber

310:First chamber

320: Second chamber

330:Third chamber

340:Fourth chamber

400: Sensing device

410: Device sensing unit

420: Trap sensing unit

430: Pump sensing unit

500:Control device

510:Fault judgment unit

520:Fault prediction unit

530: Time calculation unit

S10, S20, S30, S40, S50, S60: steps

[Fig. 1] is a schematic diagram of a semiconductor deposition system according to an embodiment of the present invention; [Fig. 2] is a schematic diagram of an operating method of a semiconductor deposition system according to an embodiment of the present invention; [Fig. 3] is a schematic diagram of a semiconductor deposition system according to an embodiment of the present invention A schematic diagram of the operating method of the system; [Fig. 4] is a schematic diagram of a sensing device according to an embodiment of the present invention; [Fig. 5] is a schematic diagram of a control device according to an embodiment of the present invention; [Fig. 6] is a schematic diagram of a control device according to an embodiment of the present invention; A flow chart of an operating method of a semiconductor deposition system; [Fig. 7] is a detailed flow chart of an operating method of a semiconductor deposition system according to an embodiment of the present invention.

Regarding the technical means of our inventors, several preferred embodiments are described in detail below along with the drawings, so as to provide readers with a thorough understanding and recognition of the present invention.

The present invention is described in further detail below.

The embodiments of the present invention and matters required to make the contents of the present invention easy to be understood by those of ordinary skill in the art will be described in detail below with reference to the accompanying drawings. However, the present invention can be implemented in various forms within the scope of the claims, and therefore the embodiments described below are merely exemplary and have nothing to do with their expression.

The same reference numerals represent the same components, and in the drawings, the thickness, ratio, and size of the components are exaggerated in order to effectively illustrate the technical content of the present invention. "And/or" may include all of at least one combination defined by the associated member.

Although the terms first, second, etc. may be used herein to describe various components, these components are not limited by these terms. These terms are used to distinguish one component from another component. For example, without exceeding the scope of rights of the present invention, the first component may be named the second component, and similarly the second component may also be named the first component. Expressions in the singular may include the plural unless the context clearly indicates otherwise.

In addition, the terms "under", "under", "above" and "on", It is used to explain the connection relationship between the components shown in the drawings. The above terms are relative concepts and will be explained based on the directions shown in the drawings.

Terms such as "comprises" and "having" should be understood as indicating the existence of the features, numbers, steps, operations, components, parts and/or combinations described in the specification, and are not used to predict the existence of The presence or possibility of addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof is excluded.

That is, the present invention is not limited to the embodiments disclosed below, but can be implemented in various ways. In the following description, if it is described that a certain part is connected to other parts, this includes not only the case of direct connection, but also the case where other parts are interposed. The condition of electrical connection of components. In addition, it should be noted that when the same components in the drawings are represented in other drawings, the same reference numbers and symbols are used as much as possible.

FIG. 1 is a schematic diagram of a semiconductor deposition system 10 according to an embodiment of the present invention.

Referring to FIG. 1 , the semiconductor deposition system 10 may include a task allocation device 100 , a deposition equipment 200 , a chamber 300 , a sensing device 400 and a control device 500 .

The task allocation device 100 may receive the unit task TSK for the semiconductor deposition process from an external system (eg, an Enterprise Resource Planning (ERP) system). However, the present invention is not limited thereto, and the task allocation device 100 may receive the unit task TSK from various systems or administrator devices. The unit task TSK in this specification may refer to the deposition task used to perform the atomic layer deposition process end.

The task allocation device 100 can establish an allocation plan for the unit task TSK based on the equipment information MCI. At this time, the distribution plan may include content that the unit task TSK corresponds to each of the plurality of chambers 300 . That is, the allocation plan may include allocation of each unit task TSK and contents of each plurality of chambers 300 corresponding to the deposition apparatus 200 to be executed.

The task allocation device 100 can allocate unit tasks TSK according to the allocation plan. For example, the task allocation device 100 may allocate the unit task TSK to the deposition equipment 200 and send the allocation plan together.

The deposition apparatus 200 may distribute the unit task TSK to the plurality of chambers 300 based on the distribution plan established by the task distribution device 100 .

According to an embodiment, the deposition apparatus 200 may be an atomic layer deposition (ALD) apparatus. For example, the deposition apparatus 200 may include a plurality of chambers 300 for performing unit tasks TSK of an atomic layer deposition process. At this time, the chamber 300 may be a processing chamber for performing a semiconductor deposition process.

According to embodiments, chamber 300 may include a well and a pump (eg, a vacuum pump) for performing an atomic layer deposition process. At this time, the trap may be arranged between the discharge port of the atomic layer deposition apparatus and the vacuum pump. To prevent damage to the vacuum pump, the trap removes unreacted precursors from the outflow.

The sensing device 400 may generate status data SDT by sensing the status of the deposition apparatus 200 . According to embodiments, the sensing device 400 may be a sensor configured on the deposition apparatus 200 . In this specification, the sensing device 400 sensing the state of the deposition apparatus 200 may refer to also sensing the states of the plurality of chambers 300 included in the deposition apparatus 200.

The control device 500 may generate equipment information MCI related to the deposition equipment 200 based on the status data SDT. At this time, the equipment information MCI may include at least one of equipment failure information and equipment repair information. The equipment failure information may include whether a failure occurs in the deposition equipment 200 and each of the plurality of chambers 300 as well as failure prediction results. Equipment repair information may include repair times to repair the fault.

According to embodiments, the task allocation device 100 can establish and modify the allocation plan in real time based on the device information MCI and using task allocation optimization and scheduling algorithms. The task allocation optimization algorithm can be an allocation algorithm that applies tasks to the optimal chamber and executes them based on task type, task required time, and task characteristics. The scheduling algorithm may be an algorithm that schedules tasks to available chambers based on time.

For example, the task allocation device 100 may establish an allocation plan so that when the deposition equipment 200 fails or is predicted to fail, the unit task TSK is not allocated to the corresponding deposition equipment 200 during the repair time. Details related to this will be explained in Figure 2 .

The task allocation device 100 can establish an allocation plan, and when any one of the plurality of chambers 300 fails or is predicted to fail, the unit task TSK is not allocated to the corresponding chamber during the repair time. Details related to this will be explained in Figure 3 .

FIG. 2 is a schematic diagram of an operating method of the semiconductor deposition system 10 according to an embodiment of the present invention.

Specifically, FIG. 2 illustrates the operation of the task allocation device 100 when the deposition equipment 200 fails or is predicted to fail.

Referring to FIGS. 1 and 2 , the semiconductor deposition system 10 may include a task allocation device 100 , a first deposition device 210 , a second deposition device 220 , a first chamber 310 , a second chamber 320 , a third chamber 330 , a fourth Chamber 340, sensing device 400 and control device 500.

The task allocation device 100 receives the unit tasks TSK required for the semiconductor deposition process, and establishes an allocation plan for the unit tasks TSK based on the equipment information MCI.

In the following, description will be given assuming that the first deposition apparatus 210 fails or is predicted to fail.

The sensing device 400 may sense the status of the first deposition device 210 and generate status data SDT.

The control device 500 may generate device information MCI for the first deposition device 210 based on the status data SDT. At this time, the equipment information MCI may include equipment fault information for displaying the first deposition equipment Backup 210 fails or a failure is predicted. In addition, the equipment information MCI may include equipment repair information for displaying a repair time required to repair a fault of the first deposition equipment 210 .

The task allocation device 100 may generate an allocation plan of the unit task TSK based on the equipment information MCI, so that the unit task TSK is not allocated to the first deposition equipment 210 during the repair time.

The task allocation device 100 may not allocate the unit task TSK to the first deposition equipment 210 but allocate it to the second deposition equipment 220 during the repair time according to the allocation plan.

The second deposition apparatus 220 may distribute the assigned unit tasks TSK to the third chamber 330 and the fourth chamber 340 respectively. The third chamber 330 and the fourth chamber 340 may perform the atomic layer deposition process by executing the assigned unit tasks TSK.

FIG. 3 is a schematic diagram of an operating method of the semiconductor deposition system 10 according to an embodiment of the present invention.

Specifically, FIG. 3 illustrates the operation of the task allocation device 100 when the first chamber 310 fails or is predicted to fail.

Referring to FIGS. 1 and 3 , the semiconductor deposition system 10 may include a task distribution device 100 , a first deposition device 210 , a second deposition device 220 , a first chamber 310 , a second chamber 320 , a third chamber 330 , a fourth Chamber 340, sensing device 400 and control device 500.

The task allocation device 100 receives the unit tasks TSK required for the semiconductor deposition process, and establishes an allocation plan for the unit tasks TSK based on the equipment information MCI.

Below, description will be given assuming that the first chamber 310 fails or is predicted to fail.

The sensing device 400 may sense the status of the first chamber 310 and generate status data SDT.

The control device 500 may generate equipment information MCI for the first chamber 310 based on the status data SDT. At this time, the equipment information MCI may include equipment failure information, which is used to show that a failure occurs in the first chamber 310 or that a failure is predicted. In addition, the equipment information MCI may include equipment repair information for displaying the repair time required to repair the fault of the first chamber 310 .

The task allocation device 100 may generate an allocation plan of the unit task TSK based on the equipment information MCI so that the unit task TSK is not allocated to the first chamber 310 during the repair time.

The task allocation device 100 may allocate the unit task TSK to the first deposition equipment 210 and the second deposition equipment 220 according to the allocation plan.

The first deposition apparatus 210 may distribute the assigned unit task TSK to the second chamber 320 instead of the first chamber 310 . For example, the first deposition apparatus 210 may not distribute unit tasks TSK to the first chamber 310 during repair time.

The second chamber 320 may perform an atomic layer deposition process by executing the assigned unit tasks TSK.

The second deposition device 220 may distribute the assigned unit tasks TSK to the third chamber 330 and the fourth chamber 340 respectively.

The third chamber 330 and the fourth chamber 340 may perform the atomic layer deposition process by executing the assigned unit tasks TSK.

According to an embodiment, the task allocation device 100 may generate an allocation plan based on the number of available chambers of the first deposition device 210 and the second deposition device 220 .

For example, the task allocation device 100 may generate an allocation plan so that the unit task TSK allocated to the second deposition equipment 220 is twice that of the first deposition equipment 210 .

According to an embodiment, when sensing the state of the first chamber 310 , the sensing device 400 senses the state of the first chamber 310 at least twice to improve sensing reliability. That is, the sensing device 400 of the present invention confirms the status of the first chamber 310. When the first chamber 310 fails or is predicted to fail, the first chamber 310 can be re-sensed at least once. to reconfirm the status.

In detail, the sensing device 400 may sense the state of the first chamber 310 at least twice in a preset period. Therefore, the sensing device 400 can improve the reliability of the state sensing results corresponding to the chamber where a failure occurs or is predicted to occur. In addition, since the task allocation device 100 can generate an allocation plan based on the number of available chambers, the production plan can be optimized.

Figure 4 is a schematic diagram of a sensing device 400 according to an embodiment of the present invention.

Referring to FIG. 4 , the sensing device 400 may include a device sensing unit 410 , a well sensing unit 420 , and a pump sensing unit 430 .

The equipment sensing unit 410 may sense the status of the deposition equipment. For example, the equipment sensing unit 410 may sense the overall operating status of the deposition equipment, the status of component parts of the equipment, and the like.

The well sensing unit 420 may sense the status of the wells of each of the plurality of chambers. For example, trap sensing unit 420 may sense the status of the trap by measuring unreacted precursors in the effluent.

The pump sensing unit 430 may sense the status of the pump for each of the plurality of chambers. For example, the pump sensing unit 430 may sense the status of the pump by measuring a pressure change of the vacuum pump of the chamber, or the like.

Figure 5 is a schematic diagram of a control device 500 according to an embodiment of the present invention.

Referring to FIGS. 4 and 5 , the control device 500 may include a fault judgment unit 510 , a fault prediction unit 520 and a time calculation unit 530 .

The fault determination unit 510 can determine whether the deposition equipment and each of the plurality of chambers are faulty. The fault judgment unit 510 is based on the status data received by the sensing device 400 (for example, the sensing device 400 senses Sensing data obtained at least once) can respectively determine whether the deposition equipment and each of the plurality of chambers have failed. In detail, based on the status data received by the sensing device 400 , such as at least two sensing data sensed by the sensing device 400 , the fault determination unit 510 may respectively determine whether the deposition equipment and each of the plurality of chambers are faulty. A malfunction occurred. Therefore, the control device 500 according to the embodiment can improve the reliability of the sensing results.

For example, when at least one of the trap and the corresponding pump corresponding to any one of the plurality of chambers fails, the fault determination unit 510 determines that the corresponding chamber fails.

The failure prediction unit 520 may separately predict whether the deposition equipment and each of the plurality of chambers will fail.

For example, the fault prediction unit 520 may use an artificial intelligence model to derive the remaining effective life of the component based on the status data, and predict the occurrence of the failure based on the remaining effective life.

According to an embodiment, the fault prediction unit 520 may use an algorithm based on machine learning technology to evaluate health in real time and predict the time point at which a fault occurs, to deduce the components of the deposition equipment and each of the plurality of chambers respectively. Remaining effective life and predict the occurrence of failure.

According to another embodiment, the fault prediction unit 520 can apply fault prediction software (eg, HIFACPMS system) to the deposition equipment and each of the plurality of chambers, derive the remaining effective life of the component, and predict the occurrence of faults.

The fault prediction unit 520 may additionally have a database to run the artificial intelligence model based on the above machine learning.

The time calculation unit 530 may calculate the repair time required to repair the fault. For example, the time calculation unit 530 confirms the faulty object, fault type, component type, etc., and substitutes a preset mathematical formula to calculate the repair time. However, the present invention is not limited thereto. In order to calculate the repair time required to repair the fault, the time calculation unit 530 may use an artificial intelligence model to obtain a calculated value.

6 is a flowchart of a method of operating a semiconductor deposition system according to an embodiment of the present invention.

Next, the operation method of the semiconductor deposition system 10 will be described with reference to FIGS. 1 to 6 .

First, the task allocation device 100 can establish an allocation plan for the unit task TSK based on the equipment information MCI, and allocate the unit task TSK (S10). For example, if there is no device information MCI, the task allocation device 100 can establish an allocation plan based on a preset initial value.

The deposition apparatus 200 may distribute the unit task TSK to the plurality of chambers 300 based on the distribution plan established by the task distribution device 100 (S20). For example, the deposition apparatus 200 may include a plurality of chambers 300, and the unit tasks TSK may be evenly distributed to the different chambers 300.

The chamber 300 can execute the distributed unit task TSK (S30). For example, chamber 300 may be a processing chamber for performing an atomic layer deposition process.

The sensing device 400 may generate status data SDT by sensing the status of the deposition apparatus 200 (S40). For example, the sensing device 400 may sense the status of the deposition apparatus 200 and the plurality of chambers 300 included in the deposition apparatus 200 . The sensing device 400 may transmit status data SDT to the task allocation device 100 . Further, the sensing device 400 may sense the state by sensing the deposition apparatus 200 at least twice. Therefore, the sensing device according to the embodiment of the present invention can improve the reliability of the status data SDT.

The control device 500 may generate device information MCI for the deposition device 200 based on the status data SDT (S50). For example, the control device 500 may receive the status data SDT through the task allocation device 100 and transmit the device information MCI to the task allocation device 100 .

When the process has not ended (No in S60 ), step S10 may be executed, that is, the task allocation device 100 establishes an allocation plan for the unit task TSK based on the equipment information MCI, and allocates the unit task TSK.

7 is a detailed flowchart of a method of operating a semiconductor deposition system according to an embodiment of the present invention.

Next, step S10 of establishing an allocation plan and allocating unit tasks shown in FIG. 7 will be described in detail with reference to FIGS. 1 to 7 .

First, the task allocation device 100 can confirm whether a failure occurs in the deposition equipment 200 and whether the failure is predicted based on the equipment information MCI (S11).

If the deposition equipment 200 fails or is predicted to fail (S12), the task allocation device 100 may exclude the corresponding deposition equipment 200 from the allocation objects during the repair time (S13). For example, the task allocation device 100 may prepare to establish an allocation plan for the allocation object, that is, the equipment or chamber.

The task allocation device 100 may confirm whether a fault occurs and whether a fault is predicted for the plurality of chambers 300 based on the equipment information MCI (S14).

If at least one of the plurality of chambers 300 fails or is predicted to fail (S15), the task allocation device 100 may exclude the corresponding chamber 300 from the allocation objects during the repair time (S16).

The task allocation device 100 can establish an allocation plan based on the allocation target, and allocate the unit task TSK (S17).

In the above manner, the semiconductor deposition system and its operating method of the present invention can optimize production plans in real time by applying fault prediction algorithms in each production line of semiconductor deposition equipment based on abnormal signals of the deposition equipment and the effective life of major components.

In addition, the semiconductor deposition system and its operating method of the present invention have the effect of being able to manage and allocate tasks according to chamber units.

In addition, the semiconductor deposition system and its operating method of the present invention can continuously produce through the deposition equipment, which can have the effect of minimizing equipment losses and maximizing production throughput.

In addition, the semiconductor deposition system and its operating method of the present invention have the effect of minimizing operation and maintenance costs by calculating the repair time of the equipment in advance.

Above, the functional operations described in this specification and the embodiments related to the subject matter include the structures disclosed in this specification and their structural equivalents, which can be implemented in digital electronic circuits or computer software, firmware or hardware, or at least in them. realized in a combination.

Embodiments of the subject matter described in this specification may be implemented by at least one computer program product, ie, one or more modules associated with computer program instructions encoded on a tangible program medium for execution on a data processing apparatus or for controlling operations. The tangible program medium may be a radio wave signal or a computer-readable medium. Radio signals are artificially generated signals, such as machine-generated electrical, optical or electromagnetic signals, which are generated in order to be executable by a computer and encode information for transmission to an appropriate receiving device. The computer-readable medium may be a combination of a machine-readable storage device, a machine-readable storage substrate, a storage device, a substance that affects machine-readable radio wave signals, or a combination of at least one or more thereof.

A computer program (also called a program, software, application, script or code) may be produced in any form of programming language, including compiled or parsed languages and a priori or procedural languages, and may be expanded to include stand-alone programs or any form including a module, component, subroutine or other unit suitable for use in a computer environment.

The computer program does not necessarily need to correspond to the file on the file device. Programs may be stored in a single file provided in the requested program, in multiple files that interact with each other (e.g., files storing more than one module, subroutine, or portion of code), or in a file that carries other A portion of a program or data file (for example, one or more scripts stored in a markup language file).

A computer program may be deployed on a single website, or may be distributed across multiple websites and executed on multiple computers or a single computer that are connected to each other through a communications network.

Furthermore, the logic flow and structural block diagrams described in this patent document are used to describe the corresponding functions supported by the disclosed structural devices and the corresponding behaviors and/or specific methods supported by the disclosed steps. They can also be used to construct Corresponding software structures, algorithms and their equivalents.

The processes and logic flows described in this specification may be performed by more than one programmable processor that executes more than one computer program in order to operate on input data and generate output to perform functions.

Examples of processors suitable for the execution of a computer program include both general and special purpose microprocessors, and any one or more processors of any type of digital computer. Typically, a processor receives instructions and data from read-only memory or random access memory, or both.

The core elements of a computer are at least one storage device for storing instructions and data and a processor for executing the instructions. In addition, computers are generally designed to receive data from at least one mass storage device for storing data, such as a magnetic disk, a magneto-optical disk, or an optical disk, or to transmit data to the mass storage device, or to perform both operations. And can be operated in combination with or include the one or more mass storage devices. However, the computer does not need to have these devices.

In summary, the technical means disclosed in the present invention can indeed effectively solve the problems of conventional knowledge and achieve the expected purposes and effects. They have not been published in publications or publicly used before the application and are of long-term progress. They are truly worthy of the title. The invention described in the Patent Law is correct. I have submitted the application in accordance with the law. I sincerely pray that Jun will review it carefully and grant a patent for the invention. I am deeply grateful.

However, the above are only several preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, all equivalent changes and modifications made based on the patent scope of the present invention and the content of the invention specification are It should still fall within the scope of the patent of this invention.

10:Semiconductor deposition system

100:Task distribution device

20:Resource management system

200:Deposition equipment

300: Chamber

400: Sensing device

500:Control device

Claims (12)

A semiconductor deposition system, including: a task allocation device, which establishes an allocation plan for unit tasks based on equipment information, and allocates the unit tasks; a deposition equipment, which based on the allocation plan established by the task allocation device, allocates the said Unit tasks are distributed to multiple chambers; a sensing device generates status data by sensing the status of the deposition equipment; and a control device generates the equipment information for the deposition equipment based on the status data, so The distribution plan includes the unit tasks corresponding to the contents of each of the plurality of chambers; the equipment information includes at least one of equipment failure information and equipment repair information, and the equipment failure information includes the deposition equipment and each of the Whether the faults of the plurality of chambers have occurred and the fault prediction results, the equipment repair information includes the repair time for repairing the faults; the task allocation device establishes the allocation plan, when the deposition equipment fails or When a failure is predicted to occur, the unit task is not allocated to the corresponding deposition equipment during the repair time; the task allocation device establishes the allocation plan, when a failure occurs in any one of the plurality of chambers or When a failure is predicted to occur, the unit task is not assigned to the corresponding chamber during the repair time. The semiconductor deposition system of claim 1, wherein the task allocation device establishes and modifies the allocation plan in real time based on the equipment information and using a task allocation optimization and scheduling algorithm. The semiconductor deposition system of claim 1, wherein the plurality of chambers respectively include wells and pumps. The semiconductor deposition system according to claim 3, wherein the sensing device includes: an equipment sensing unit for sensing the state of the deposition equipment; a well sensing unit for sensing each of the A state of a well of a plurality of chambers; and a pump sensing unit for sensing a state of a pump of each of the plurality of chambers. The semiconductor deposition system according to claim 4, wherein the control device includes: a fault judgment unit for judging whether the deposition equipment and each of the plurality of chambers are faulty; a fault prediction unit for Predicting the occurrence of faults in the deposition equipment and each of the plurality of chambers; and a repair time calculation unit configured to calculate the repair time used to repair the fault. The semiconductor deposition system according to claim 5, wherein the fault judgment unit determines that when at least one of the corresponding wells and the corresponding pumps in any one of the plurality of chambers fails, a fault occurs in the corresponding chamber. Fault. The semiconductor deposition system of claim 5, wherein the fault prediction unit uses an artificial intelligence model to derive the remaining effective life of the component based on the status data, and predicts the occurrence of the failure based on the remaining effective life. The semiconductor deposition system of claim 1, wherein the deposition equipment is an atomic layer deposition equipment. The semiconductor deposition system of claim 1, wherein the sensing device senses the status of the deposition equipment at least twice, and generates the status data by integrating sensing results. An operating method of a semiconductor deposition system, including the following steps: The task allocation device establishes an allocation plan for unit tasks based on equipment information, and allocates the unit tasks; the deposition equipment distributes the unit tasks to multiple chambers based on the allocation plan established by the task allocation device; the multiple chambers Each chamber performs the unit task; the sensing device generates status data by sensing the status of the deposition equipment; and the control device generates the equipment information for the deposition equipment based on the status data, and the allocation plan The unit tasks include content corresponding to each of the plurality of chambers. The equipment information includes at least one of equipment failure information and equipment repair information. The equipment failure information includes the deposition equipment and each of the plurality of chambers. Whether a fault occurs in the room and the fault prediction result, the equipment repair information includes the repair time for repairing the fault; wherein, the step of establishing the allocation plan and allocating the unit tasks includes: the task allocation device Based on the equipment information, confirm whether the plurality of chambers fails and whether a failure is predicted; when at least one of the plurality of chambers fails or is predicted to fail, within the repair time period , the task allocation device excludes the corresponding chamber from the allocation object; and the task allocation device establishes the allocation plan based on the allocation object, and allocates the unit task. The operating method of the semiconductor deposition system according to claim 10, wherein the step of establishing the allocation plan and allocating the unit tasks includes: the task allocation device confirms whether the deposition equipment occurs based on the equipment information. the failure and whether the failure was predicted; and When the deposition equipment fails or is predicted to fail, the corresponding deposition equipment is excluded from the allocation object. The operating method of a semiconductor deposition system as claimed in claim 10, wherein in the step of generating status data by sensing the status of the deposition equipment, the sensing device senses the status of the deposition equipment at least twice, And generate status data by integrating sensing results.