TWI822190B - Ultrasonic transducing module and ultrasonic probe - Google Patents

Abstract

An ultrasonic transducing module including a base, a piezoelectric ultrasonic transducer, and a micromachined ultrasonic transducer is provided. The piezoelectric ultrasonic transducer is disposed on the base. The micromachined ultrasonic transducer is disposed on the piezoelectric ultrasonic transducer. The piezoelectric ultrasonic transducer is disposed between the base and the micromachined ultrasonic transducer. An ultrasonic wave emitted by the piezoelectric ultrasonic transducer penetrates through the micromachined ultrasonic transducer and is then transmitted to the outside. An ultrasonic probe is also provided.

Description

Ultrasonic transducer module and ultrasonic probe

The present invention relates to a transducer and a probe, and in particular, to an ultrasonic transducer module and an ultrasonic probe.

Ultrasonic transducer is a transducer that realizes mutual conversion of sound energy and electrical energy within the ultrasonic frequency range. Ultrasonic transducers can be mainly divided into three categories: 1. Transmitter; 2. Receiver; and 3. Transceiver transducer. The transducer used to emit ultrasonic waves is called a transmitter. When the transducer is in the transmitting state, it converts electrical energy into mechanical energy and then into sound energy. The transducer used to receive sound waves is called a receiver. When the transducer is in the receiving state, it converts sound energy into mechanical energy and then into electrical energy. In some cases, the transducer can be used as both a transmitter and a receiver, which is called a transceiver. Transceiver transducers are the core content and one of the key technologies of ultrasonic technology, and are widely used in non-destructive testing, medical imaging, ultrasonic microscopes, fingerprint recognition, and the Internet of Things.

When traditional ultrasonic transducers detect the human body, the frequency and resolution of the ultrasonic waves used will be different depending on the different components or parts to be detected (such as the heart, carotid artery, abdomen, etc.). At this time, whenever different parts are used for ultrasonic image detection, it is often necessary to replace different ultrasonic transducers, which will cause inconvenience in use and increase equipment costs.

The invention provides an ultrasonic transducer module, which has a wide range of functions.

The invention provides an ultrasonic probe, which has a wide range of functions.

An embodiment of the present invention provides an ultrasonic transducer module, which includes a substrate, a piezoelectric ultrasonic transducer and a micromachined ultrasonic transducer. The piezoelectric ultrasonic transducer is arranged on the substrate, and the micromachined ultrasonic transducer is arranged on the piezoelectric ultrasonic transducer. The piezoelectric ultrasonic transducer is arranged between the substrate and the micromachined ultrasonic transducer, and the ultrasonic waves emitted by the piezoelectric ultrasonic transducer penetrate the micromachined ultrasonic transducer and are transmitted to the outside world.

An embodiment of the present invention provides an ultrasonic probe, which includes a hand grip, a piezoelectric ultrasonic transducer, and a micromachined ultrasonic transducer. The handheld grip has a first end and a second end, the piezoelectric ultrasonic transducer is disposed on the first end of the handgrip, and the micromechanical ultrasonic transducer is disposed on the piezoelectric ultrasonic transducer. The ultrasonic wave emitted by the one of the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer that is closer to the second end penetrates the other of the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer that is farther away from the second end. The correct ones are passed to the outside world.

In the ultrasonic transducer module and ultrasonic probe of the embodiment of the present invention, stacked piezoelectric ultrasonic transducers and micro-machined ultrasonic transducers are used, and the piezoelectric ultrasonic transducers and micro-machined ultrasonic transducers are The device can perform different ultrasonic sensing or output. Therefore, the ultrasonic transducer module and ultrasonic probe according to the embodiment of the present invention have a wider range of functions.

Figure 1 is an exploded schematic diagram of an ultrasonic probe according to an embodiment of the present invention, and Figure 2A is a cross-sectional schematic diagram of an embodiment of the ultrasonic transducer module in Figure 1, in which the base of the ultrasonic transducer module in Figure 2A has no To illustrate, the substrate can be referred to as shown in Figure 1 . Referring to FIGS. 1 and 2A , the ultrasonic probe 100 of this embodiment includes a handgrip 110 , a piezoelectric ultrasonic transducer 300 and a micromachined ultrasonic transducer 400 . The handheld grip 110 has a first end 112 and a second end 114. The piezoelectric ultrasonic transducer 300 is disposed on the first end 112 of the handheld grip 110. The micromachined ultrasonic transducer 400 is disposed on the piezoelectric ultrasonic transducer 110. On the ultrasonic transducer 300. The ultrasonic wave 302 emitted by one of the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducer 400 that is closer to the second end 114 (for example, the piezoelectric ultrasonic transducer 300 in FIGS. 1 and 2A ) Penetrates the other one of the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducer 400 that is farther away from the second end 114 (for example, the micromachined ultrasonic transducer 400 in FIGS. 1 and 2A ) and transmits it to the outside world. .

In this embodiment, the piezoelectric ultrasonic transducer 300 is disposed between the handgrip 110 and the micromachined ultrasonic transducer 400 . However, in other embodiments, the micromachined ultrasonic transducer 400 may also be disposed between the handgrip 110 and the piezoelectric ultrasonic transducer 300 . In this embodiment, an ultrasonic transducer module 200 can be disposed on the first end 112 of the handheld handle 110. The ultrasonic transducer module 200 includes a substrate 210, the above-mentioned piezoelectric ultrasonic transducer 300 and the above-mentioned micro machine. Ultrasonic transducer 400. The piezoelectric ultrasonic transducer 300 is disposed on the substrate 210 , and the micromachined ultrasonic transducer 400 is disposed on the piezoelectric ultrasonic transducer 300 . The piezoelectric ultrasonic transducer 300 is disposed between the substrate 210 and the micromachined ultrasonic transducer 400. The ultrasonic waves 302 emitted by the piezoelectric ultrasonic transducer 300 penetrate the micromachined ultrasonic transducer 400 and are transmitted to the outside world.

In this embodiment, the micromachined ultrasonic transducer 400 is, for example, a capacitive micromachined ultrasonic transducer (CMUT), a micro-component manufactured using micro-electromechanical process technology, which is manufactured on a silicon substrate. ), glass or flexible substrate, such as SU-8 thick film photoresist, polydimethylsiloxane (PDMS) or polyimide (PI), etc., while the piezoelectric ultrasonic transducer 300 For example, it is a lead zirconium titanate (PZT) ultrasonic transducer or a single crystal ultrasonic transducer. In addition, in this embodiment, the micromachined ultrasonic transducer 400 is a film-type micromachined ultrasonic transducer, and the piezoelectric ultrasonic transducer 300 is in a sheet shape. In one embodiment, the thickness T1 of the micromachined ultrasonic transducer 400 falls within the range of 1 micron to 10 microns.

In this embodiment, the piezoelectric ultrasonic transducer 300 is in an arc shape. In addition, in this embodiment, the micromachined ultrasonic transducer 400 has flexibility. Therefore, the micromachined ultrasonic transducer 400 can assume an arc shape along with the piezoelectric ultrasonic transducer 300, and the piezoelectric ultrasonic transducer 300 can form an arc. The transducer 300 and the micromachined ultrasonic transducer 400 are disposed on the arc-shaped surface of the substrate 210, which can effectively expand the sensing range. However, in another embodiment, the piezoelectric ultrasonic transducer 300 may also be in a planar shape, and the micromachined ultrasonic transducer 400 may also be in a planar shape.

In the ultrasonic transducer module 200 and the ultrasonic probe 100 of this embodiment, a stacked piezoelectric ultrasonic transducer 300 and a micromachined ultrasonic transducer 400 are used, and the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducer are The ultrasonic transducer 400 can perform different ultrasonic sensing or output. Therefore, the ultrasonic transducer module 200 and the ultrasonic probe 100 of this embodiment have wider functions.

In this embodiment, the piezoelectric ultrasonic transducer 300 includes a piezoelectric layer 330 , a first electrode 310 and a second electrode 320 . The piezoelectric layer 330 is made of, for example, lead zirconate titanate, and the piezoelectric layer 330 is disposed between the first electrode 310 and the second electrode 320 . When a voltage difference is applied between the first electrode 310 and the second electrode 320, the piezoelectric layer 330 will vibrate and emit ultrasonic waves. On the other hand, when ultrasonic waves from the outside are transmitted to the piezoelectric layer 330 and vibrate the piezoelectric layer 330 , the voltage between the first electrode 310 and the second electrode 320 will change due to the piezoelectric effect, and the controller 220 The voltage change between the first electrode 310 and the second electrode 320 can be sensed and analyzed to achieve the sensing function of external ultrasonic waves. The piezoelectric layer 330 and one of the first electrode 310 and the second electrode 320 can be divided into multiple units to form multiple array elements. Alternatively, in another embodiment, the piezoelectric layer 330, the first electrode 310 and the second electrode 320 may not be divided and form a single array element.

In this embodiment, the micromachined ultrasonic transducer 400 includes a blocking wall 440, a third electrode 410, a fourth electrode 420 and a thin film 450. The retaining wall 440 is formed with a plurality of microcavities 430. The microcavities 430 are located between the third electrode 410 and the fourth electrode 420. The film 450 spans over the microcavities 430, and the fourth electrode 420 is disposed on the film 450. The film 450 is, for example, a flexible film, which can be deformed by force. When a voltage change is applied to the third electrode 410 and the fourth electrode 420, the thin film 450 vibrates due to the change in the electric force line between the third electrode 410 and the fourth electrode 420, thereby emitting ultrasonic waves. On the other hand, when an appropriate voltage is applied between the third electrode 410 and the fourth electrode 420, the external ultrasonic wave is transmitted to the film 450 to cause the film 450 to vibrate, so that the output of the third electrode 410 and the fourth electrode 420 has a changing current signal. The controller 220 can control, sense and analyze the electrical signal between the third electrode 410 and the fourth electrode 420, thereby achieving the function of emitting ultrasonic waves and ultrasonic wave sensing to the outside. In addition, the fourth electrode 420 can be divided into multiple units along with the microcavity 430 to form multiple array elements. The micromachined ultrasonic transducer 400 may be a phase array transducer, a linear or arc-shaped transducer.

Referring to FIG. 2A, the ultrasonic transducer module 200 further includes a controller 220, which is electrically connected to the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducer 400, for example, electrically connected to the first electrode 310, the first electrode 310, and the first electrode 310. Two electrodes 320, a third electrode 410 and a fourth electrode 420. The controller 220 is used to command the piezoelectric ultrasonic transducer 300 to emit an ultrasonic wave 302. The ultrasonic wave 302 penetrates the micromachined ultrasonic transducer 400 and is transmitted to an object to be measured 50. The object to be measured 50 reflects the ultrasonic wave 302 into a reflected wave 52. , and the micromachined ultrasonic transducer 400 receives the reflected wave 52 . In this way, the object to be measured 50 can be sensed through the micromachined ultrasonic transducer 400 . In this way, the ultrasonic transducer module 200 can be used for thermal monitoring of ultrasonic knife, electric cautery knife, laser acupuncture, phototherapy, etc. For example, the piezoelectric ultrasonic transducer 300 can be used as a high intensity focused ultrasound therapeutic system (HIFU), such as a single element transducer, and the micromachined ultrasonic transducer 400 It can be used as a sensing array (ie, multiple array elements) for observing ultrasonic images.

In this embodiment, the ultrasonic transducer module 200 further includes a matching layer 230 disposed between the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducer 400, which can help reduce the frequency of ultrasonic waves in the piezoelectric ultrasonic transducer. The acoustic resistance encountered during transmission between the transducer 300 and the micromachined ultrasonic transducer 400. In addition, in one embodiment, more than 90% of the energy of the ultrasonic wave 302 emitted by the piezoelectric ultrasonic transducer 300 penetrates the micromachined ultrasonic transducer 400 without causing too much energy loss.

FIG. 2B is a schematic cross-sectional view of another application mode of the ultrasonic transducer module in FIG. 2A . Please refer to FIG. 2B. In the ultrasonic transducer module 200 of this embodiment, the controller 220 is used to command the piezoelectric ultrasonic transducer 300 to emit a first ultrasonic wave (ie, ultrasonic wave 302). The first ultrasonic wave penetrates the micromachine. The ultrasonic transducer 400 transmits the first ultrasonic wave to the object 50 under test. The object 50 reflects the first ultrasonic wave into a first reflected wave (ie, reflected wave 52), and the piezoelectric ultrasonic transducer 300 receives the first reflected wave. In addition, the controller 220 is used to command the micromachined ultrasonic transducer 400 to emit a second ultrasonic wave (ie, ultrasonic wave 402). The second ultrasonic wave is transmitted to the object under test 50, and the object under test 50 reflects the second ultrasonic wave into a second reflected wave. (ie, reflected wave 54), and the micromachined ultrasonic transducer 400 receives the second reflected wave.

The ultrasonic transducer module 200 of this embodiment can be used as a multi-purpose integrated ultrasonic transducer module. For example, the piezoelectric ultrasonic transducer 300 can be a linear transducer or a curved transducer, and the micromachined ultrasonic transducer 400 can be a phased array transducer or a two-dimensional array transducer. In addition, the pitch of the array elements of the piezoelectric ultrasonic transducer 300 may be the same as or different from the pitch of the array elements of the micromachined ultrasonic transducer 400 . In addition, when the piezoelectric ultrasonic transducer 300 and the micromechanical ultrasonic transducer 400 are both arc-shaped transducers, the centers of curvature of the two may be the same or close to each other. The ultrasonic transducer module 200 can achieve the effect of integrating diagnosis and treatment, for example, it can locate collagen and deliver drugs to break bubbles and blood-brain barriers. Alternatively, during puncture applications, the piezoelectric ultrasonic transducer 300 can be used to observe deeper tissue, and the micromechanical ultrasonic transducer 400 can be used to observe shallower tissue, and the first ultrasonic wave and the second ultrasonic wave The frequencies can be different.

Figure 2C is a schematic cross-sectional view of another application mode of the ultrasonic transducer module in Figure 2A. Please refer to FIG. 2C. In the ultrasonic transducer module 200 of this embodiment, the controller 220 is used to command the piezoelectric ultrasonic transducer 300 to emit a first ultrasonic wave (ie, ultrasonic wave 302). The first ultrasonic wave penetrates the micromachines. The ultrasonic transducer 400 transmits the ultrasonic wave to an object 50 to be measured. In addition, the controller 220 is used to command the micromachined ultrasonic transducer 400 to emit a second ultrasonic wave (ie, the ultrasonic wave 402 ), and the second ultrasonic wave is transmitted to the object under test 50 . The object under test 50 reflects the second ultrasonic wave into a reflected wave 54 , and the micromechanical ultrasonic transducer 400 receives the reflected wave 54 .

The ultrasonic transducer module 200 of this embodiment can perform destructive treatment positioning to replace part of the functions of computer tomography (CT) or magnetic resonance imaging (MRI). For example, the piezoelectric ultrasonic transducer 300 can be used as a high-intensity focused or non-focused ultrasonic treatment system, such as a HIFU, which can be a single array element or multiple array elements arranged in an array. The micromachined ultrasonic transducer 400 may have array elements arranged in a one-dimensional array or a two-dimensional array, which can perform calibration of real-time disease symptoms.

Figure 3 is a schematic cross-sectional view of an ultrasonic transducer module according to another embodiment of the present invention. Please refer to Figure 3. The ultrasonic transducer module 200a of this embodiment is similar to the ultrasonic transducer module 200 of Figure 2A, and the differences between the two are as follows. In the ultrasonic transducer module 200a of this embodiment, the micromachined ultrasonic transducer 400a is a piezoelectric micromachined ultrasonic transducer (PMUT), which includes a retaining wall 440, a third electrode 410, a Four electrodes 420, thin film 450 and piezoelectric thin film 460. The retaining wall 440 is formed with a plurality of micro cavities 430. The third electrode 410 and the fourth electrode 420 are both located above the micro cavities 430. The thin film 450 spans over the micro cavities 430, and the third electrode 410 is disposed on the thin film 450. . The piezoelectric film 460 is disposed on the third electrode 410 , and the fourth electrode 420 is disposed on the piezoelectric film 460 . When a voltage change is applied to the third electrode 410 and the fourth electrode 420, the piezoelectric film 460 will vibrate, causing the film 450 to vibrate and emit ultrasonic waves. On the other hand, when external ultrasonic waves are transmitted to the piezoelectric film 460 to cause it to vibrate, the voltage between the third electrode 410 and the fourth electrode 420 will change due to the piezoelectric effect, causing the third electrode 410 to vibrate. The fourth electrode 420 outputs a changing voltage signal. The controller 220 can sense and analyze the voltage change between the third electrode 410 and the fourth electrode 420 to achieve the sensing function of external ultrasonic waves. In addition, the piezoelectric film 460 and one of the third electrode 410 and the fourth electrode 420 can be divided into multiple units along with the microcavity 430 to form multiple array elements.

Furthermore, at least one of the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducers 400 and 400a can be used to send ultrasonic signals, and the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducer At least one of the transducers 400 and 400a can also be used to receive ultrasonic signals, and the ultrasonic signals sent and/or received by the piezoelectric ultrasonic transducer 300 and the micromachined ultrasonic transducers 400 and 400a can be mutually transmitted. Communicate to achieve various ultrasonic applications.

To sum up, in the ultrasonic transducer module and ultrasonic probe of the embodiment of the present invention, a stacked piezoelectric ultrasonic transducer and a micromachined ultrasonic transducer are used, and the piezoelectric ultrasonic transducer and Micromachined ultrasonic transducers can perform different ultrasonic sensing or output. Therefore, the ultrasonic transducer module and ultrasonic probe according to the embodiment of the present invention have a wider range of functions.

50:Object to be tested 52, 54: Reflected wave 100: Ultrasonic probe 110:Hand-held grip 112:First end 114:Second end 200, 200a: Ultrasonic transducer module 210: Base 220:Controller 230: Matching layer 300: Piezoelectric ultrasonic transducer 302, 402: Ultrasound 310: first electrode 320: Second electrode 330: Piezoelectric layer 400, 400a: Micromachined ultrasonic transducer 410:Third electrode 420:Fourth electrode 430:Microcavity 440: retaining wall 450:Thin film 460: Piezoelectric film

Figure 1 is an exploded schematic diagram of an ultrasonic probe according to an embodiment of the present invention. FIG. 2A is a schematic cross-sectional view of an embodiment of the ultrasonic transducer module in FIG. 1 . FIG. 2B is a schematic cross-sectional view of another application mode of the ultrasonic transducer module in FIG. 2A . Figure 2C is a schematic cross-sectional view of another application mode of the ultrasonic transducer module in Figure 2A. Figure 3 is a schematic cross-sectional view of an ultrasonic transducer module according to another embodiment of the present invention.

100: Ultrasonic probe

110:Hand-held grip

112:First end

114:Second end

200: Ultrasonic transducer module

210: Base

300: Piezoelectric ultrasonic transducer

400: Micromachined ultrasonic transducer

Claims (15)

An ultrasonic transducer module, including: a substrate; a piezoelectric ultrasonic transducer, configured on the substrate; and a micro-mechanical ultrasonic transducer, configured on the piezoelectric ultrasonic transducer, wherein the voltage An electrical ultrasonic transducer is disposed between the substrate and the micromachined ultrasonic transducer. The ultrasonic waves emitted by the piezoelectric ultrasonic transducer penetrate the micromachined ultrasonic transducer and are transmitted to the outside world. The microelectromechanical The ultrasonic transducer is configured to cover the piezoelectric ultrasonic transducer. The ultrasonic transducer module as claimed in claim 1, wherein the micromachined ultrasonic transducer is a capacitive micromachined ultrasonic transducer or a piezoelectric micromachined ultrasonic transducer. The ultrasonic transducer module as claimed in claim 1, wherein the micro-machined ultrasonic transducer is a thin-film micro-machined ultrasonic transducer. The ultrasonic transducer module as claimed in claim 3, wherein the micromachined ultrasonic transducer is flexible. The ultrasonic transducer module as claimed in claim 1, wherein the piezoelectric ultrasonic transducer is arc-shaped. The ultrasonic transducer module of claim 1 further includes a controller electrically connected to the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer, wherein the controller is used to command the piezoelectric ultrasonic transducer. The ultrasonic transducer emits the ultrasonic wave, and the ultrasonic wave penetrates the micromachined ultrasonic transducer and is transmitted to an object to be measured. The object under test reflects the ultrasonic wave into a reflected wave, and the micromechanical ultrasonic transducer receives the reflected wave. The ultrasonic transducer module of claim 1 further includes a controller electrically connected to the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer, wherein the controller is used to command the piezoelectric ultrasonic transducer. The ultrasonic transducer emits a first ultrasonic wave. The first ultrasonic wave penetrates the micromachined ultrasonic transducer and is transmitted to an object to be measured. The object to be measured reflects the first ultrasonic wave into a first reflected wave, and the pressure The electrical ultrasonic transducer receives the first reflected wave, and the controller is used to command the micro-mechanical ultrasonic transducer to emit a second ultrasonic wave. The second ultrasonic wave is transmitted to the object under test, and the object under test transmits the second ultrasonic wave. The ultrasonic wave is reflected into a second reflected wave, and the micromechanical ultrasonic transducer receives the second reflected wave. The ultrasonic transducer module of claim 1 further includes a controller electrically connected to the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer, wherein the controller is used to command the piezoelectric ultrasonic transducer. The ultrasonic transducer emits a first ultrasonic wave. The first ultrasonic wave penetrates the micro-machined ultrasonic transducer and is transmitted to an object to be measured. The controller is used to command the micro-machined ultrasonic transducer to emit a second ultrasonic wave. The second ultrasonic wave is transmitted to the object to be measured, the object to be measured reflects the second ultrasonic wave into a reflected wave, and the micromachined ultrasonic transducer receives the reflected wave. An ultrasonic probe includes: a handgrip having a first end and a second end; a piezoelectric ultrasonic transducer disposed on the first end of the handgrip; and A micro-machined ultrasonic transducer, configured on the piezoelectric ultrasonic transducer, wherein the piezoelectric ultrasonic transducer and the micro-machined ultrasonic transducer emit a sound that is closer to the second end. The ultrasonic wave penetrates the one of the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer that is farther away from the second end and is transmitted to the outside world. The piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer The one farther away from the second end covers the piezoelectric ultrasonic transducer and the one closer to the second end of the micromechanical ultrasonic transducer. The ultrasonic probe according to claim 9, wherein the micromachined ultrasonic transducer is a capacitive micromachined ultrasonic transducer or a piezoelectric micromachined ultrasonic transducer. The ultrasonic probe according to claim 9, wherein the micro-machined ultrasonic transducer is a thin-film micro-machined ultrasonic transducer. The ultrasonic probe according to claim 9, wherein the micromachined ultrasonic transducer is flexible. The ultrasonic probe according to claim 9, wherein the piezoelectric ultrasonic transducer is arc-shaped. The ultrasonic probe of claim 9, wherein the piezoelectric ultrasonic transducer is disposed between the hand grip and the micro-mechanical ultrasonic transducer. The ultrasonic probe according to claim 14, further comprising a controller electrically connected to the piezoelectric ultrasonic transducer and the micromachined ultrasonic transducer, wherein the controller is used to command the piezoelectric ultrasonic transducer The device emits the ultrasonic wave, and the ultrasonic wave penetrates the micromachined ultrasonic transducer and is transmitted to an object to be measured. The object under test reflects the ultrasonic wave into a reflected wave, and the micromechanical ultrasonic transducer receives the reflected wave.

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