TWI819863B - Display panel - Google Patents

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Publication number
TWI819863B
TWI819863B TW111140646A TW111140646A TWI819863B TW I819863 B TWI819863 B TW I819863B TW 111140646 A TW111140646 A TW 111140646A TW 111140646 A TW111140646 A TW 111140646A TW I819863 B TWI819863 B TW I819863B
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Taiwan
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light
emitting element
emitting
pads
width
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TW111140646A
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Chinese (zh)
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呂嘉揚
王培筠
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友達光電股份有限公司
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Priority to TW111140646A priority Critical patent/TWI819863B/en
Priority to CN202310143341.3A priority patent/CN116130503A/en
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Publication of TWI819863B publication Critical patent/TWI819863B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Abstract

A display panel including a pixel array substrate, a first planarization layer, a plurality of first bonding pads, a first light emitting device, a second planarization layer, a plurality of second bonding pads and a second light emitting device is provided. The first planarization layer is disposed on the pixel array substrate. The first bonding pads are disposed on the first planarization layer. The first light emitting device is electrically bonded to the first bonding pads. The second planarization layer covers the first light emitting device. The second bonding pads are disposed on the second planarization layer. The second light emitting device is electrically bonded to the second bonding pads.

Description

顯示面板display panel

本發明是有關於一種顯示面板,且特別是有關於一種具有發光元件的顯示面板。The present invention relates to a display panel, and in particular, to a display panel having a light-emitting element.

近年來,在有機發光二極體(Organic light-emitting diode,OLED)顯示面板的製造成本偏高及其使用壽命無法與現行的主流顯示器相抗衡的情況下,微型發光元件顯示器(Micro LED Display)逐漸吸引各科技大廠的投資目光。為了取得較低的生產成本與較大的產品設計裕度,微型發光元件顯示器的製造技術係採用晶粒轉移的方式。更具體地說,晶粒製造商需先將客戶所需的微型發光元件晶粒製作(或放置)在暫存基板上,客戶再依據不同的應用需求將存放在暫存基板上的微型發光元件晶粒轉移至不同產品的驅動電路板上。In recent years, with the high manufacturing cost of organic light-emitting diode (OLED) display panels and their service life unable to compete with current mainstream displays, Micro LED Displays Gradually attracting the investment attention of major technology companies. In order to achieve lower production costs and larger product design margins, the manufacturing technology of micro-light-emitting element displays uses die transfer. More specifically, the chip manufacturer needs to first make (or place) the micro-light-emitting component chips required by the customer on the temporary storage substrate, and then the customer will store the micro-light-emitting components on the temporary substrate according to different application requirements. The dies are transferred to the driver circuit boards of different products.

然而,隨著顯示畫面解析度的增加,微型發光元件的尺寸及排列間距都不斷地縮小,也因此增加了微型發光元件晶粒的轉移製程難度。如何兼顧高解析度的顯示需求以及晶粒轉移的良率,對於微型發光元件顯示器來說仍是一個有待解決的難題。However, as the resolution of display screens increases, the size and arrangement pitch of micro-light-emitting elements continue to shrink, which also increases the difficulty of the transfer process of micro-light-emitting element crystals. How to balance the high-resolution display requirements and the yield of die transfer is still a difficult problem to be solved for micro-light-emitting element displays.

本發明提供一種顯示面板,其發光元件的轉移接合良率較高。The present invention provides a display panel whose light-emitting elements have a high transfer bonding yield.

本發明的顯示面板,包括畫素陣列基板、第一平坦層、多個第一接墊、第一發光元件、第二平坦層、多個第二接墊及第二發光元件。第一平坦層設置在畫素陣列基板上。多個第一接墊設置在第一平坦層上。第一發光元件電性接合至這些第一接墊。第二平坦層覆蓋第一發光元件。多個第二接墊設置在第二平坦層上。第二發光元件電性接合至這些第二接墊。The display panel of the present invention includes a pixel array substrate, a first flat layer, a plurality of first pads, a first light-emitting element, a second flat layer, a plurality of second pads and a second light-emitting element. The first flat layer is disposed on the pixel array substrate. A plurality of first pads are disposed on the first flat layer. The first light-emitting element is electrically connected to the first pads. The second flat layer covers the first light emitting element. A plurality of second pads are disposed on the second flat layer. The second light-emitting element is electrically connected to the second pads.

基於上述,在本發明的一實施例的顯示面板中,用來接合第一發光元件的多個第一接墊以及用來接合第二發光元件的多個第二接墊之間設有平坦層。此平坦層覆蓋這些第一接墊和第一發光元件,且其上設有這些第二接墊。透過此平坦層的設置,可避免先接合的第一發光元件在第二發光元件的接合製程中損壞的風險,並有效提升第二發光元件的接合良率。此外,發光元件的轉移良率較不容易受發光元件的尺寸大小及排列狀態影響。Based on the above, in the display panel according to an embodiment of the present invention, a flat layer is provided between a plurality of first pads for bonding the first light-emitting elements and a plurality of second pads for bonding the second light-emitting elements. . The flat layer covers the first pads and the first light-emitting elements, and has the second pads on it. Through the arrangement of this flat layer, the risk of damage to the first light-emitting element bonded first during the bonding process of the second light-emitting element can be avoided, and the bonding yield of the second light-emitting element can be effectively improved. In addition, the transfer yield of light-emitting elements is less likely to be affected by the size and arrangement of the light-emitting elements.

本文使用的「約」、「近似」、「本質上」、或「實質上」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或例如±30%、±20%、±15%、±10%、±5%內。再者,本文使用的「約」、「近似」、「本質上」、或「實質上」可依量測性質、切割性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about," "approximately," "substantially," or "substantially" includes the stated value and an average within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account that Discuss the measurement and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±15%, ±10%, ±5%, for example. Furthermore, the terms "approximately", "approximately", "substantially" or "substantially" used in this article can be used to select a more acceptable deviation range or standard deviation based on the measurement properties, cutting properties or other properties, and can Not one standard deviation applies to all properties.

在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrical connection" can be the presence of other components between the two components.

此外,諸如「下」或「底部」和「上」或「頂部」的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其它元件的「下」側的元件將被定向在其它元件的「上」側。因此,示例性術語「下」可以包括「下」和「上」的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件「下方」或「下方」的元件將被定向為在其它元件「上方」。因此,示例性術語「上面」或「下面」可以包括上方和下方的取向。Additionally, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation illustrated in the figures. For example, if the device in one of the figures is turned over, elements described as "lower" than other elements would then be oriented "above" the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "upper" or "lower" may include both upper and lower orientations.

本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此,可以預期到作為例如製造技術及/或(and/or)公差的結果的圖示的形狀變化。因此,本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀,而是包括例如由製造導致的形狀偏差。例如,示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外,所示的銳角可以是圓的。因此,圖中所示的區域本質上是示意性的,並且它們的形狀不是旨在示出區域的精確形狀,並且不是旨在限制申請專利範圍。Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Accordingly, variations in the shapes illustrated in the illustrations are to be expected as a result of, for example, manufacturing techniques and/or tolerances. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, regions shown or described as flat may typically have rough and/or non-linear characteristics. Additionally, the acute angles shown may be rounded. Accordingly, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the precise shapes of the regions and are not intended to limit the scope of the claims.

現將詳細地參考本發明的示範性實施方式,示範性實施方式的實例說明於所附圖式中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.

圖1是依照本發明的第一實施例的顯示面板的剖視示意圖。圖2是圖1的顯示面板的俯視示意圖。請參照圖1及圖2,顯示面板10包括畫素陣列基板100。舉例來說,畫素陣列基板100可設有多個畫素區,且每個畫素區內設有至少兩個發光元件LED。在本實施例中,每一個畫素區可設有三個發光元件LED,例如圖1中的第一發光元件LED1、第二發光元件LED2和第三發光元件LED3,但不以此為限。在另一未繪示的實施例中,每個畫素區內也可僅設有第一發光元件LED1和第二發光元件LED2的組合,或者是第二發光元件LED2和第三發光元件LED3的組合。FIG. 1 is a schematic cross-sectional view of a display panel according to a first embodiment of the present invention. FIG. 2 is a schematic top view of the display panel of FIG. 1 . Referring to FIGS. 1 and 2 , the display panel 10 includes a pixel array substrate 100 . For example, the pixel array substrate 100 can be provided with a plurality of pixel areas, and each pixel area is provided with at least two light-emitting elements LED. In this embodiment, each pixel area may be provided with three light-emitting elements LED, such as the first light-emitting element LED1, the second light-emitting element LED2 and the third light-emitting element LED3 in FIG. 1, but is not limited thereto. In another not-shown embodiment, each pixel area may be provided with only a combination of the first light-emitting element LED1 and the second light-emitting element LED2, or a combination of the second light-emitting element LED2 and the third light-emitting element LED3. combination.

詳細而言,顯示面板10還可包括第一平坦層PL1、多個第一接墊、第二平坦層PL2、多個第二接墊、第三平坦層PL3以及多個第三接墊。第一平坦層PL1設置在畫素陣列基板100上,且第一平坦層PL1上設有多個第一接墊。第一發光元件LED1電性接合至這些第一接墊。第二平坦層PL2覆蓋第一發光元件LED1和第一接墊。多個第二接墊設置在第二平坦層PL2上,且第二發光元件LED2電性接合至這些第二接墊。相似於第二平坦層PL2,第三平坦層PL3覆蓋第二發光元件LED2和第二接墊。多個第三接墊設置在第三平坦層PL3上,且第三發光元件LED3電性接合至這些第三接墊。In detail, the display panel 10 may further include a first flat layer PL1, a plurality of first pads, a second flat layer PL2, a plurality of second pads, a third flat layer PL3, and a plurality of third pads. The first flat layer PL1 is disposed on the pixel array substrate 100, and a plurality of first pads are provided on the first flat layer PL1. The first light-emitting element LED1 is electrically connected to these first pads. The second flat layer PL2 covers the first light emitting element LED1 and the first pad. A plurality of second pads are disposed on the second planar layer PL2, and the second light emitting element LED2 is electrically connected to these second pads. Similar to the second planar layer PL2, the third planar layer PL3 covers the second light emitting element LED2 and the second pad. A plurality of third pads are disposed on the third planar layer PL3, and the third light emitting element LED3 is electrically connected to these third pads.

更具體地說,本實施例的第一發光元件LED1、第二發光元件LED2和第三發光元件LED3並非設置在同一膜層上。第一平坦層PL1、第二平坦層PL2和第三平坦層PL3的材質可包括有機絕緣材料、無機絕緣材料或其組合,其中有機絕緣材料包括聚亞醯胺、有機光阻材料、或其組合,無機絕緣材料包括氧化矽、氮化矽、氮氧化矽或其組合。較佳地,平坦層的材料可選用高透光度的有機絕緣材料或無機絕緣材料。More specifically, the first light-emitting element LED1, the second light-emitting element LED2 and the third light-emitting element LED3 of this embodiment are not arranged on the same film layer. The materials of the first planar layer PL1, the second planar layer PL2, and the third planar layer PL3 may include organic insulating materials, inorganic insulating materials, or combinations thereof, wherein the organic insulating materials include polyimide, organic photoresist materials, or combinations thereof , inorganic insulating materials include silicon oxide, silicon nitride, silicon oxynitride or combinations thereof. Preferably, the material of the flat layer can be an organic insulating material or an inorganic insulating material with high transmittance.

在本實施例中,第一發光元件LED1和第二發光元件LED2的發光顏色可選自藍色和綠色,而第三發光元件LED3的發光顏色可選自紅色,但不以此為限。在其他實施例中,不同發光顏色的發光元件的層疊順序可根據發光元件的發光效率來調整。在本實施例中,發光元件LED可包括磊晶結構層EPS、第一電極E1和第二電極E2。第一電極E1和第二電極E2可分別電性連接磊晶結構層EPS中具不同摻雜特性的兩半導體層(例如未繪示的P型半導體層和N型半導體層),而這兩個半導體層間夾設有發光層(未繪示)。In this embodiment, the light-emitting color of the first light-emitting element LED1 and the second light-emitting element LED2 can be selected from blue and green, and the light-emitting color of the third light-emitting element LED3 can be selected from red, but is not limited thereto. In other embodiments, the stacking sequence of light-emitting elements with different emitting colors can be adjusted according to the luminous efficiency of the light-emitting elements. In this embodiment, the light-emitting element LED may include an epitaxial structure layer EPS, a first electrode E1 and a second electrode E2. The first electrode E1 and the second electrode E2 can respectively be electrically connected to two semiconductor layers with different doping characteristics (such as a P-type semiconductor layer and an N-type semiconductor layer not shown) in the epitaxial structure layer EPS, and these two A light-emitting layer (not shown) is sandwiched between the semiconductor layers.

另一方面,發光元件LED的第一電極E1和第二電極E2的材料可包括銦、鈦、錫、鎳、金、或上述的堆疊層,接墊的材料可包括鋁、鈦、銦錫氧化物、銦鋅氧化物、鉬、銦鎵鋅氧化物、或上述的堆疊層,但不以此為限。發光元件的電極材料和接墊材料也可選用其他合適且能讓彼此在接合製程中產生共金鍵結的導電材料。On the other hand, the materials of the first electrode E1 and the second electrode E2 of the light-emitting element LED may include indium, titanium, tin, nickel, gold, or the above stacked layers, and the material of the contact pad may include aluminum, titanium, indium tin oxide material, indium zinc oxide, molybdenum, indium gallium zinc oxide, or the above stacked layers, but is not limited to this. The electrode material and pad material of the light-emitting element can also be made of other suitable conductive materials that can create a common gold bond with each other during the bonding process.

基於上述的堆疊結構可知,在顯示面板10的製造過程中,不同發光顏色的多個發光元件的轉移及接合製程之間還包括平坦層和接墊的形成步驟。例如:在顯示面板10的多個畫素區內的多個第一發光元件LED1的轉移及接合製程完成後,依序進行第二平坦層PL2與多個第二接墊的形成步驟。接著,進行第二次的轉移製程,以將多個第二發光元件LED2與這些第二接墊相接合。完成後,依序進行第三平坦層PL3與多個第三接墊的形成步驟。接著,進行第三次的轉移製程,以將多個第三發光元件LED3與這些第三接墊相接合。Based on the above stacked structure, it can be seen that during the manufacturing process of the display panel 10, the transfer and bonding process of multiple light-emitting elements with different emitting colors also includes the steps of forming a flat layer and a contact pad. For example, after the transfer and bonding processes of the plurality of first light-emitting elements LED1 in the plurality of pixel areas of the display panel 10 are completed, the steps of forming the second planarization layer PL2 and the plurality of second pads are sequentially performed. Then, a second transfer process is performed to connect the plurality of second light-emitting elements LED2 to the second pads. After completion, the steps of forming the third planarization layer PL3 and a plurality of third pads are performed in sequence. Then, a third transfer process is performed to connect the plurality of third light-emitting elements LED3 to the third pads.

特別一提的是,透過第二平坦層PL2的設置,可有效避免同一畫素區內的第一發光元件LED1在第二發光元件LED2的轉移及接合製程中損壞或影響其發光特性,並且同時提升第二發光元件LED2的轉移良率。相同地,透過第三平坦層PL3的設置,可有效避免同一畫素區內的第二發光元件LED2在第三發光元件LED3的轉移及接合製程中損壞或影響其發光特性,並且同時提升第三發光元件LED3的轉移良率。In particular, through the arrangement of the second flat layer PL2, it can effectively prevent the first light-emitting element LED1 in the same pixel area from being damaged or affecting its light-emitting characteristics during the transfer and bonding process of the second light-emitting element LED2, and at the same time Improve the transfer yield of the second light-emitting element LED2. Similarly, through the arrangement of the third flat layer PL3, it can effectively prevent the second light-emitting element LED2 in the same pixel area from being damaged or affect its light-emitting characteristics during the transfer and bonding process of the third light-emitting element LED3, and at the same time improve the third light-emitting element LED2. Transfer yield of light-emitting element LED3.

在本實施例中,每一個畫素區(如圖1所示)內可設有用來接合第一發光元件LED1的第一接墊P1a和第一接墊P1b、用來接合第二發光元件LED2的第二接墊P2a和第二接墊P2b以及用來接合第三發光元件LED3的第三接墊P3a和第三接墊P3b。畫素陣列基板100可包括對應每一個畫素區設置的第一主動元件T1、第二主動元件T2和第三主動元件T3。第一主動元件T1、第二主動元件T2和第三主動元件T3可以是非晶矽薄膜電晶體(Amorphous Silicon TFT,a-Si TFT)、低溫多晶矽薄膜電晶體(LTPS TFT)、微晶矽薄膜電晶體(micro-Si TFT)或金屬氧化物電晶體(Metal Oxide Transistor)。In this embodiment, each pixel area (as shown in Figure 1) may be provided with a first pad P1a and a first pad P1b for bonding the first light-emitting element LED1, and a first pad P1b for bonding the second light-emitting element LED2. The second pads P2a and P2b and the third pads P3a and P3b used to connect the third light-emitting element LED3. The pixel array substrate 100 may include a first active element T1, a second active element T2 and a third active element T3 provided corresponding to each pixel area. The first active element T1, the second active element T2 and the third active element T3 can be amorphous silicon thin film transistors (Amorphous Silicon TFT, a-Si TFT), low temperature polycrystalline silicon thin film transistors (LTPS TFT), microcrystalline silicon thin film transistors Crystal (micro-Si TFT) or metal oxide transistor (Metal Oxide Transistor).

舉例來說,第一接墊P1a可貫穿第一平坦層PL1以電性連接第一主動元件T1,第二接墊P2b可貫穿第一平坦層PL1和第二平坦層PL2以電性連接第二主動元件T2,第三接墊P3b可貫穿第一平坦層PL1、第二平坦層PL2和第三平坦層PL3以電性連接第三主動元件T3。For example, the first pad P1a can penetrate the first planar layer PL1 to electrically connect the first active element T1, and the second pad P2b can penetrate the first planar layer PL1 and the second planar layer PL2 to electrically connect the second The active element T2 and the third pad P3b can penetrate the first planar layer PL1, the second planar layer PL2 and the third planar layer PL3 to electrically connect the third active element T3.

在本實施例中,第一主動元件T1、第二主動元件T2和第三主動元件T3可分別作為第一發光元件LED1、第二發光元件LED2和第三發光元件LED3發光與否的控制元件。然而,本發明不限於此。在其他實施例中,發光元件的接墊也可電性連接畫素驅動電路,而畫素驅動電路可以是多個電容器和多個主動元件所構成的且具有不同功能的電路區塊組合。In this embodiment, the first active element T1 , the second active element T2 and the third active element T3 can respectively serve as control elements for whether the first light-emitting element LED1 , the second light-emitting element LED2 and the third light-emitting element LED3 emit light. However, the present invention is not limited to this. In other embodiments, the pads of the light-emitting element can also be electrically connected to the pixel driving circuit, and the pixel driving circuit can be a combination of circuit blocks composed of multiple capacitors and multiple active components and having different functions.

特別注意的是,由於第一接墊、第二接墊和第三接墊分別設置在不同的平坦層上,這些接墊可沿著一方向(例如圖2的方向X)可交替排列。舉例來說,在本實施例中,每一個畫素區內的多個第一接墊和多個第二接墊可沿著方向X交替排列,且多個第二接墊和多個第三接墊可沿著方向X交替排列。更具體地說,在沿著方向Z的視線方向上,第二接墊P2b位在第三接墊P3a與第三接墊P3b之間,第三接墊P3a和第一接墊P1b位在第二接墊P2a與第二接墊P2b之間,第二接墊P2a位在第一接墊P1a與第一接墊P1b之間。因此,在本實施例中,第一發光元件LED1、第二發光元件LED2和第三發光元件LED3是沿著方向X(即第一方向)排列。It is particularly important to note that since the first pad, the second pad and the third pad are respectively disposed on different flat layers, these pads can be alternately arranged along one direction (for example, direction X in FIG. 2 ). For example, in this embodiment, a plurality of first pads and a plurality of second pads in each pixel area may be alternately arranged along the direction The pads can be alternately arranged along the direction X. More specifically, in the viewing direction along the direction Z, the second pad P2b is located between the third pad P3a and the third pad P3b, and the third pad P3a and the first pad P1b are located between the third pad P3a and the first pad P1b. Between the second pad P2a and the second pad P2b, the second pad P2a is located between the first pad P1a and the first pad P1b. Therefore, in this embodiment, the first light-emitting element LED1, the second light-emitting element LED2 and the third light-emitting element LED3 are arranged along the direction X (that is, the first direction).

從另一觀點來說,由於多個第一接墊、多個第二接墊和多個第三接墊為交替排列,接合在這些接墊上的第一發光元件LED1、第二發光元件LED2和第三發光元件LED3的至少兩者是相互重疊的。此處的重疊關係例如是兩元件沿著垂直於畫素陣列基板100的方向(例如方向Z)相互重疊。以下若非特別提及,則兩構件間的重疊關係都是以此方式來界定,便不再贅述。From another point of view, since the plurality of first pads, the plurality of second pads and the plurality of third pads are alternately arranged, the first light-emitting element LED1, the second light-emitting element LED2 and the like are bonded to these pads. At least two of the third light emitting elements LED3 overlap each other. The overlapping relationship here is, for example, that the two elements overlap each other along a direction perpendicular to the pixel array substrate 100 (eg, direction Z). Unless otherwise mentioned below, the overlapping relationship between the two components will be defined in this way and will not be described again.

舉例來說,在本實施例中,第一發光元件LED1具有被第二平坦層PL2所覆蓋的第一出光面ES1,且第一出光面ES1沿著方向Z重疊於第二接墊P2a。相似地,第二發光元件LED2具有被第三平坦層PL3所覆蓋的第二出光面ES2,且第二出光面ES2沿著方向Z重疊於第三接墊P3a。特別說明的是,此處的出光面例如是發光元件LED的磊晶結構層EPS背離第一電極E1和第二電極E2的表面。For example, in this embodiment, the first light-emitting element LED1 has a first light-emitting surface ES1 covered by the second planar layer PL2, and the first light-emitting surface ES1 overlaps the second pad P2a along the direction Z. Similarly, the second light-emitting element LED2 has a second light-emitting surface ES2 covered by the third planar layer PL3, and the second light-emitting surface ES2 overlaps the third pad P3a along the direction Z. Specifically, the light-emitting surface here is, for example, the surface of the epitaxial structure layer EPS of the light-emitting element LED facing away from the first electrode E1 and the second electrode E2.

在本實施例中,第一發光元件LED1的第一出光面ES1具有重疊於第二發光元件LED2的第一部分ES1p1以及不重疊於第二發光元件LED2的第二部分ES1p2。第一出光面ES1的第一部分ES1p1沿著方向X具有第一遮擋寬度BW1,而其第二部分ES1p2沿著方向X具有第一出光寬度EW1。特別注意的是,第一發光元件LED1沿著方向X的第一元件寬度DW1大於第一出光寬度EW1,且第一出光寬度EW1大於第一遮擋寬度BW1。較佳地,第一遮擋寬度BW1大於0且小於第一元件寬度DW1的一半值。In this embodiment, the first light-emitting surface ES1 of the first light-emitting element LED1 has a first portion ES1p1 that overlaps the second light-emitting element LED2 and a second portion ES1p2 that does not overlap the second light-emitting element LED2. The first part ES1p1 of the first light-emitting surface ES1 has a first blocking width BW1 along the direction X, and the second part ES1p2 thereof has a first light-emitting width EW1 along the direction X. It is particularly noted that the first element width DW1 of the first light emitting element LED1 along the direction X is greater than the first light emission width EW1, and the first light emission width EW1 is greater than the first blocking width BW1. Preferably, the first blocking width BW1 is greater than 0 and less than half of the first element width DW1.

相似地,第二發光元件LED2的第二出光面ES2具有重疊於第三發光元件LED3的第一部分ES2p1以及不重疊於第三發光元件LED3的第二部分ES2p2。第二出光面ES2的第一部分ES2p1沿著方向X具有第二遮擋寬度BW2,而其第二部分ES2p2沿著方向X具有第二出光寬度EW2。特別注意的是,第二發光元件LED2沿著方向X的第二元件寬度DW2大於第二出光寬度EW2,且第二出光寬度EW2大於第二遮擋寬度BW2。較佳地,第二遮擋寬度BW2大於0且小於第二元件寬度DW2的一半值。Similarly, the second light-emitting surface ES2 of the second light-emitting element LED2 has a first portion ES2p1 that overlaps the third light-emitting element LED3 and a second portion ES2p2 that does not overlap the third light-emitting element LED3. The first part ES2p1 of the second light-emitting surface ES2 has a second blocking width BW2 along the direction X, and the second part ES2p2 thereof has a second light-emitting width EW2 along the direction X. It is particularly noted that the second element width DW2 of the second light emitting element LED2 along the direction X is greater than the second light emission width EW2, and the second light emission width EW2 is greater than the second blocking width BW2. Preferably, the second shielding width BW2 is greater than 0 and less than half of the second element width DW2.

由於第三發光元件LED3位在顯示面板10的最上層,其沿著方向X的第三元件寬度DW3大致上等於其第三出光面ES3沿著方向X的第三出光寬度EW3。Since the third light emitting element LED3 is located on the uppermost layer of the display panel 10, its third element width DW3 along the direction X is substantially equal to the third light emitting width EW3 along the direction X of its third light emitting surface ES3.

特別一提的是,由於具不同發光顏色的第一發光元件LED1、第二發光元件LED2和第三發光元件LED3分別位在不同的平坦層上,其各自在XY平面上的配置更為彈性,例如:第二發光元件LED2可部分覆蓋第一發光元件LED1的第一出光面ES1,而第三發光元件LED3可部分覆蓋第二發光元件LED2的第二出光面ES2。也就是說,第一發光元件LED1發出的部分第一光束LB1會被第二接墊P2a和第二發光元件LED2所遮擋,而第二發光元件LED2發出的部分第二光束LB2會被第三接墊P3a和第三發光元件LED3所遮擋。由於第三發光元件LED3位在顯示面板10的最上層,其發出的第三光束LB3都可直接出射顯示面板10。In particular, since the first light-emitting element LED1, the second light-emitting element LED2 and the third light-emitting element LED3 with different light-emitting colors are respectively located on different flat layers, their respective configurations on the XY plane are more flexible. For example, the second light-emitting element LED2 can partially cover the first light-emitting surface ES1 of the first light-emitting element LED1, and the third light-emitting element LED3 can partially cover the second light-emitting surface ES2 of the second light-emitting element LED2. That is to say, part of the first light beam LB1 emitted by the first light-emitting element LED1 will be blocked by the second pad P2a and the second light-emitting element LED2, and part of the second light beam LB2 emitted by the second light-emitting element LED2 will be blocked by the third contact pad P2a. It is blocked by the pad P3a and the third light-emitting element LED3. Since the third light-emitting element LED3 is located on the uppermost layer of the display panel 10, the third light beam LB3 emitted by it can directly exit the display panel 10.

在出光效率許可的前提下,透過上述的重疊關係可有效縮減每一個畫素區所需的配置空間。換句話說,有助於提高顯示面板10的畫素解析度。此外,發光元件LED的分層轉移方式還能避免顯示面板10因高解析度需求而使發光元件LED的轉移製程難度增加。As long as the light extraction efficiency permits, the above-mentioned overlapping relationship can effectively reduce the configuration space required for each pixel area. In other words, it helps to improve the pixel resolution of the display panel 10 . In addition, the layered transfer method of the light-emitting element LED can also prevent the display panel 10 from increasing the difficulty of the transfer process of the light-emitting element LED due to the high resolution requirements.

另一方面,為了避免被第二接墊P2a遮擋的部分第一光束LB1以及被第三接墊P3a遮擋的部分第二光束LB2被(漫)反射至相鄰的畫素區而造成顯示解析度的下降,與發光元件的出光面相重疊的接墊上朝向出光面的一側還可設有吸光層(未繪示)以吸收這些被遮擋的第一光束LB1和第二光束LB2,但不以此為限。On the other hand, in order to prevent the part of the first light beam LB1 blocked by the second pad P2a and the part of the second light beam LB2 blocked by the third pad P3a from being (diffusely) reflected to the adjacent pixel area and causing the display resolution to decrease. The pad that overlaps the light-emitting surface of the light-emitting element can also be provided with a light-absorbing layer (not shown) on the side facing the light-emitting surface to absorb these blocked first light beams LB1 and second light beams LB2, but this is not the case. is limited.

以下將列舉另一些實施例以詳細說明本發明,其中相同的構件將標示相同的符號,並且省略相同技術內容的說明,省略部分請參考前述實施例,以下不再贅述。Other embodiments will be enumerated below to describe the present invention in detail, in which the same components will be marked with the same symbols, and descriptions of the same technical content will be omitted. Please refer to the previous embodiments for the omitted parts, which will not be described again.

圖3是依照本發明的第二實施例的顯示面板的俯視示意圖。圖4是依照本發明的第三實施例的顯示面板的俯視示意圖。請參照圖3,本實施例的顯示面板10A與圖2的顯示面板10的差異僅在於:發光元件的重疊關係不同。具體而言,在本實施例的顯示面板10A中,用來接合第一發光元件LED1-A的第一接墊P1a-A和第一接墊P1b-A以及用來接合第二發光元件LED2-A的第二接墊P2a-A和第二接墊P2b-A是沿著方向Y並排設置,並非如圖2的顯示面板10是沿著方向X交替排列。也就是說,在本實施例中,第一發光元件LED1-A和第二發光元件LED2-A是沿著方向Y排列並且不相互重疊。FIG. 3 is a schematic top view of a display panel according to a second embodiment of the present invention. FIG. 4 is a schematic top view of a display panel according to a third embodiment of the present invention. Please refer to FIG. 3 . The only difference between the display panel 10A of this embodiment and the display panel 10 of FIG. 2 is that the overlapping relationship of the light-emitting elements is different. Specifically, in the display panel 10A of this embodiment, the first pads P1a-A and P1b-A are used to connect the first light-emitting element LED1-A, and the first pads P1b-A are used to connect the second light-emitting element LED2-A. The second pads P2a-A and P2b-A of A are arranged side by side along the direction Y, instead of being alternately arranged along the direction X as shown in the display panel 10 of FIG. 2 . That is to say, in this embodiment, the first light-emitting element LED1-A and the second light-emitting element LED2-A are arranged along the direction Y and do not overlap each other.

特別注意的是,在本實施例中,用來接合第三發光元件LED3-A的第三接墊P3a-A和第三接墊P3b-A的延伸方向(例如方向X)可垂直於第二接墊和第三接墊的延伸方向(例如方向Y)。從另一觀點來說,第三接墊P3a-A和第三接墊P3b-A的排列方向(例如方向Y)垂直於第二接墊P2a-A和第二接墊P2b-A(或第一接墊P1a-A和第一接墊P1b-A)的排列方向(例如方向X)。It is particularly noted that in this embodiment, the extending direction (for example, direction The extension direction of the pad and the third pad (for example, direction Y). From another point of view, the arrangement direction (for example, direction Y) of the third pad P3a-A and the third pad P3b-A is perpendicular to the second pad P2a-A and the second pad P2b-A (or the direction Y). The arrangement direction (for example, direction X) of one pad P1a-A and the first pad P1b-A).

在本實施例中,第三發光元件LED3-A可同時部分重疊於第二發光元件LED2-A的第二出光面ES2-A以及第一發光元件LED1-A的第一出光面ES1-A。舉例來說,第三發光元件LED3-A可以是出光效率較差的紅光發光二極體。因此,透過上述與第二發光元件LED2-A和第一發光元件LED1-A的重疊設置關係,除了可實現第一發光元件LED1-A、第二發光元件LED2-A和第三發光元件LED3-A的緊密排列外,還可進一步增加第三發光元件LED3-A的第三出光面ES3-A的出光面積,以縮減第三發光元件LED3-A與其他發光顏色的發光元件(例如第一發光元件LED1-A和第二發光元件LED2-A)間的出光效率差異。In this embodiment, the third light-emitting element LED3-A can partially overlap the second light-emitting surface ES2-A of the second light-emitting element LED2-A and the first light-emitting surface ES1-A of the first light-emitting element LED1-A. For example, the third light-emitting element LED3-A may be a red light-emitting diode with poor light extraction efficiency. Therefore, through the overlapping arrangement relationship with the second light-emitting element LED2-A and the first light-emitting element LED1-A, in addition to the first light-emitting element LED1-A, the second light-emitting element LED2-A and the third light-emitting element LED3-A, the first light-emitting element LED1-A, the second light-emitting element LED2-A and the third light-emitting element LED3-A can be realized. In addition to the close arrangement of A, the light-emitting area of the third light-emitting surface ES3-A of the third light-emitting element LED3-A can be further increased, so as to reduce the distance between the third light-emitting element LED3-A and other light-emitting elements of other color (such as the first light-emitting element). The difference in light extraction efficiency between the element LED1-A and the second light-emitting element LED2-A).

然而,本發明不限於此。請參照圖4,在另一變形實施例中,顯示面板10B的第一發光元件LED1-B的第一出光面ES1-B以及第二發光元件LED2-B的第二出光面ES2-B可較圖3的第一發光元件LED1-A的第一出光面ES1-A以及第二發光元件LED2-A的第二出光面ES2-A來得小。因此,第三發光元件LED3-B的第三出光面ES3-B可在第一發光元件LED1-B和第二發光元件LED2-B的排列方向(例如方向Y)上內縮,並顯露出圖3中第一出光面ES1-A和第二出光面ES2-A原本被第三發光元件LED3-A所遮擋的一部分,以調整第一發光元件LED1-B、第二發光元件LED2-B和第三發光元件LED3-B間的出光比例關係。However, the present invention is not limited to this. Referring to FIG. 4 , in another modified embodiment, the first light-emitting surface ES1-B of the first light-emitting element LED1-B and the second light-emitting surface ES2-B of the second light-emitting element LED2-B of the display panel 10B can be relatively small. The first light-emitting surface ES1-A of the first light-emitting element LED1-A and the second light-emitting surface ES2-A of the second light-emitting element LED2-A of FIG. 3 are smaller. Therefore, the third light-emitting surface ES3-B of the third light-emitting element LED3-B can be retracted in the arrangement direction (for example, direction Y) of the first light-emitting element LED1-B and the second light-emitting element LED2-B, and reveal the figure. 3. The part of the first light-emitting surface ES1-A and the second light-emitting surface ES2-A that was originally blocked by the third light-emitting element LED3-A is used to adjust the first light-emitting element LED1-B, the second light-emitting element LED2-B and the third light-emitting element LED3-A. The light output ratio relationship between the three light-emitting elements LED3-B.

換句話說,由於這些具不同發光顏色的發光元件是接合在不同的平坦層上,因此可藉由調整這些發光元件的重疊關係及重疊比例來調配這些發光元件間的出光比例。據此,可增加不同發光顏色的發光元件的選用彈性。In other words, since these light-emitting elements with different light-emitting colors are bonded to different flat layers, the light emission ratio between these light-emitting elements can be adjusted by adjusting the overlapping relationship and overlapping ratio of these light-emitting elements. Accordingly, the flexibility in selecting light-emitting elements with different light-emitting colors can be increased.

圖5是依照本發明的第四實施例的顯示面板的剖視示意圖。請參照圖5,本實施例的顯示面板10C與圖1的顯示面板10的差異僅在於:本實施例的顯示面板10C還可選擇性地包括遮光圖案層150,設置在第三發光元件LED3與第三平坦層PL3上。遮光圖案層150具有多個開口OP,且這些開口OP分別重疊於第一發光元件LED1的第一出光面ES1的第二部分ES1p2、第二發光元件LED2的第二出光面ES2的第二部分ES2p2以及第三發光元件LED3的第三出光面ES3。遮光圖案層150的材料可包括黑色樹脂材料或不透光的光阻材料。FIG. 5 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present invention. Please refer to FIG. 5. The only difference between the display panel 10C of this embodiment and the display panel 10 of FIG. on the third flat layer PL3. The light-shielding pattern layer 150 has a plurality of openings OP, and these openings OP respectively overlap with the second part ES1p2 of the first light-emitting surface ES1 of the first light-emitting element LED1 and the second part ES2p2 of the second light-emitting surface ES2 of the second light-emitting element LED2. and the third light-emitting surface ES3 of the third light-emitting element LED3. The material of the light-shielding pattern layer 150 may include black resin material or opaque photoresist material.

利用遮光圖案層150遮擋由第一發光元件LED1的第一出光面ES1的第一部分ES1p1出射的第一光束LB1以及由第二發光元件LED2的第二出光面ES2的第一部分ES2p1出射的第二光束LB2,可避免這些光束被(漫)反射至相鄰的畫素區而造成顯示解析度的下降。The light-shielding pattern layer 150 is used to block the first light beam LB1 emitted from the first part ES1p1 of the first light-emitting surface ES1 of the first light-emitting element LED1 and the second light beam emitted from the first part ES2p1 of the second light-emitting surface ES2 of the second light-emitting element LED2 LB2 can prevent these light beams from being (diffusely) reflected to adjacent pixel areas and causing a decrease in display resolution.

綜上所述,在本發明的一實施例的顯示面板中,用來接合第一發光元件的多個第一接墊以及用來接合第二發光元件的多個第二接墊之間設有平坦層。此平坦層覆蓋這些第一接墊和第一發光元件,且其上設有這些第二接墊。透過此平坦層的設置,可避免先接合的第一發光元件在第二發光元件的接合製程中損壞的風險,並有效提升第二發光元件的接合良率。此外,發光元件的轉移良率較不容易受發光元件的尺寸大小及排列狀態影響。To sum up, in the display panel according to an embodiment of the present invention, a plurality of first pads for bonding the first light-emitting elements and a plurality of second pads for bonding the second light-emitting elements are provided. Flat layer. The flat layer covers the first pads and the first light-emitting elements, and has the second pads on it. Through the arrangement of this flat layer, the risk of damage to the first light-emitting element bonded first during the bonding process of the second light-emitting element can be avoided, and the bonding yield of the second light-emitting element can be effectively improved. In addition, the transfer yield of light-emitting elements is less likely to be affected by the size and arrangement of the light-emitting elements.

10、10A、10B、10C:顯示面板 100:畫素陣列基板 150:遮光圖案層 BW1:第一遮擋寬度 BW2:第二遮擋寬度 DW1:第一元件寬度 DW2:第二元件寬度 DW3:第三元件寬度 EW1:第一出光寬度 EW2:第二出光寬度 EW3:第三出光寬度 E1:第一電極 E2:第二電極 EPS:磊晶結構層 ES1、ES1-A、ES1-B:第一出光面 ES1p1、ES2p1:第一部分 ES1p2、ES2p2:第二部分 ES2、ES2-A、ES2-B:第二出光面 ES3、ES3-A、ES3-B:第三出光面 LB1:第一光束 LB2:第二光束 LB3:第三光束 LED、LED1、LED2、LED3、LED1-A、LED2-A、LED3-A、LED1-B、LED2-B、LED3-B:發光元件 OP:開口 P1a、P1b、P1a-A、P1b-A:第一接墊 P2a、P2b、P2a-A、P2b-A:第二接墊 P3a、P3b、P3a-A、P3b-A:第三接墊 PL1、PL2、PL3:平坦層 T1、T2、T3:主動元件 X、Y、Z:方向 10, 10A, 10B, 10C: display panel 100: Pixel array substrate 150:Light-shielding pattern layer BW1: first occlusion width BW2: Second occlusion width DW1: first component width DW2: Second component width DW3: Width of third component EW1: First light width EW2: Second light width EW3: The third light width E1: first electrode E2: second electrode EPS: epitaxial structural layer ES1, ES1-A, ES1-B: the first light-emitting surface ES1p1, ES2p1: Part 1 ES1p2, ES2p2: Part 2 ES2, ES2-A, ES2-B: Second light-emitting surface ES3, ES3-A, ES3-B: The third light-emitting surface LB1: first beam LB2: Second beam LB3: The third beam LED, LED1, LED2, LED3, LED1-A, LED2-A, LED3-A, LED1-B, LED2-B, LED3-B: light-emitting components OP: Open your mouth P1a, P1b, P1a-A, P1b-A: first pad P2a, P2b, P2a-A, P2b-A: second pad P3a, P3b, P3a-A, P3b-A: third pad PL1, PL2, PL3: flat layer T1, T2, T3: active components X, Y, Z: direction

圖1是依照本發明的第一實施例的顯示面板的剖視示意圖。 圖2是圖1的顯示面板的俯視示意圖。 圖3是依照本發明的第二實施例的顯示面板的俯視示意圖。 圖4是依照本發明的第三實施例的顯示面板的俯視示意圖。 圖5是依照本發明的第四實施例的顯示面板的剖視示意圖。 FIG. 1 is a schematic cross-sectional view of a display panel according to a first embodiment of the present invention. FIG. 2 is a schematic top view of the display panel of FIG. 1 . FIG. 3 is a schematic top view of a display panel according to a second embodiment of the present invention. FIG. 4 is a schematic top view of a display panel according to a third embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a display panel according to a fourth embodiment of the present invention.

10:顯示面板 10:Display panel

100:畫素陣列基板 100: Pixel array substrate

E1:第一電極 E1: first electrode

E2:第二電極 E2: second electrode

EPS:磊晶結構層 EPS: epitaxial structural layer

ES1:第一出光面 ES1: The first shining surface

ES1p1、ES2p1:第一部分 ES1p1, ES2p1: Part 1

ES1p2、ES2p2:第二部分 ES1p2, ES2p2: Part 2

ES2:第二出光面 ES2: The second light-emitting surface

ES3:第三出光面 ES3: The third shining surface

LB1:第一光束 LB1: first beam

LB2:第二光束 LB2: Second beam

LB3:第三光束 LB3: The third beam

LED、LED1、LED2、LED3:發光元件 LED, LED1, LED2, LED3: light-emitting components

P1a、P1b:第一接墊 P1a, P1b: first pad

P2a、P2b:第二接墊 P2a, P2b: second pad

P3a、P3b:第三接墊 P3a, P3b: third pad

PL1、PL2、PL3:平坦層 PL1, PL2, PL3: flat layer

T1、T2、T3:主動元件 T1, T2, T3: active components

X、Y、Z:方向 X, Y, Z: direction

Claims (12)

一種顯示面板,包括:一畫素陣列基板,包括一第一主動元件與一第二主動元件;一第一平坦層,設置在該畫素陣列基板上;多個第一接墊,設置在該第一平坦層上;一第一發光元件,電性接合至該些第一接墊;一第二平坦層,覆蓋該第一發光元件;多個第二接墊,設置在該第二平坦層上;以及一第二發光元件,電性接合至該些第二接墊,其中該些第一接墊的一者貫穿該第一平坦層以電性連接該第一主動元件,該些第二接墊的一者貫穿該第一平坦層與該第二平坦層以電性連接該第二主動元件。 A display panel includes: a pixel array substrate including a first active element and a second active element; a first flat layer disposed on the pixel array substrate; a plurality of first pads disposed on the On the first flat layer; a first light-emitting element electrically connected to the first pads; a second flat layer covering the first light-emitting element; a plurality of second pads disposed on the second flat layer on; and a second light-emitting element electrically connected to the second pads, wherein one of the first pads penetrates the first planar layer to electrically connect the first active element, and the second One of the pads penetrates the first planar layer and the second planar layer to electrically connect the second active element. 如請求項1所述的顯示面板,其中該第一發光元件具有一第一出光面,該第一發光元件的該第一出光面重疊於該些第二接墊的一者。 The display panel of claim 1, wherein the first light-emitting element has a first light-emitting surface, and the first light-emitting surface of the first light-emitting element overlaps one of the second pads. 如請求項2所述的顯示面板,其中該第一發光元件與該第二發光元件沿著一第一方向排列,該第一發光元件的該第一出光面具有重疊於該第二發光元件的一第一部分,該第一發光元件沿著該第一方向具有一第一元件寬度,該第一出光面的該第一部分沿著該第一方向具有一第一遮擋寬度,該第一遮擋寬度大於0且小於該第一元件寬度的一半值。 The display panel of claim 2, wherein the first light-emitting element and the second light-emitting element are arranged along a first direction, and the first light-emitting surface of the first light-emitting element has a surface that overlaps the second light-emitting element. a first part, the first light-emitting element has a first element width along the first direction, the first part of the first light-emitting surface has a first blocking width along the first direction, the first blocking width is greater than 0 and less than half the width of the first element. 如請求項2所述的顯示面板,其中該第一發光元件與該第二發光元件沿著一第一方向排列,該第一發光元件的該第一出光面具有重疊於該第二發光元件的一第一部分以及不重疊於該第二發光元件的一第二部分,該第一發光元件沿著該第一方向具有一第一元件寬度,該第一出光面的該第一部分和該第二部分沿著該第一方向分別具有一第一遮擋寬度和一第一出光寬度,該第一元件寬度大於該第一出光寬度,且該第一出光寬度大於該第一遮擋寬度。 The display panel of claim 2, wherein the first light-emitting element and the second light-emitting element are arranged along a first direction, and the first light-emitting surface of the first light-emitting element has a surface that overlaps the second light-emitting element. a first part and a second part not overlapping the second light-emitting element, the first light-emitting element has a first element width along the first direction, the first part and the second part of the first light-emitting surface There is a first blocking width and a first light exiting width respectively along the first direction, the first element width is greater than the first light exiting width, and the first light exiting width is greater than the first blocking width. 如請求項2所述的顯示面板,更包括:一第三平坦層,覆蓋該第二發光元件;多個第三接墊,設置在該第三平坦層上;以及一第三發光元件,電性接合至該些第三接墊。 The display panel of claim 2, further comprising: a third flat layer covering the second light-emitting element; a plurality of third pads disposed on the third flat layer; and a third light-emitting element electrically Sexually coupled to the third pads. 如請求項5所述的顯示面板,其中該第二發光元件具有一第二出光面,該第二發光元件的該第二出光面重疊於該些第三接墊的一者。 The display panel of claim 5, wherein the second light-emitting element has a second light-emitting surface, and the second light-emitting surface of the second light-emitting element overlaps one of the third pads. 如請求項6所述的顯示面板,其中該第二發光元件與該第三發光元件沿著一第一方向排列,該第二發光元件的該第二出光面具有重疊於該第三發光元件的一第一部分,該第二發光元件沿著該第一方向具有一第二元件寬度,該第二出光面的該第一部分沿著該第一方向具有一第二遮擋寬度,該第二遮擋寬度大於0且小於該第二元件寬度的一半值。 The display panel of claim 6, wherein the second light-emitting element and the third light-emitting element are arranged along a first direction, and the second light-emitting surface of the second light-emitting element has a surface that overlaps the third light-emitting element. a first part, the second light-emitting element has a second element width along the first direction, the first part of the second light-emitting surface has a second blocking width along the first direction, and the second blocking width is greater than 0 and less than half the width of the second element. 如請求項6所述的顯示面板,其中該第二發光元件與該第三發光元件沿著一第一方向排列,該第二發光元件的該第二出光面具有重疊於該第三發光元件的一第一部分以及不重疊於該第三發光元件的一第二部分,該第二發光元件沿著該第一方向具有一第二元件寬度,該第二出光面的該第一部分和該第二部分沿著該第一方向分別具有一第二遮擋寬度和一第二出光寬度,該第二元件寬度大於該第二出光寬度,且該第二出光寬度大於該第二遮擋寬度。 The display panel of claim 6, wherein the second light-emitting element and the third light-emitting element are arranged along a first direction, and the second light-emitting surface of the second light-emitting element has a surface that overlaps the third light-emitting element. a first part and a second part not overlapping the third light-emitting element, the second light-emitting element has a second element width along the first direction, the first part and the second part of the second light-emitting surface There is a second blocking width and a second light exiting width respectively along the first direction, the second element width is greater than the second light exiting width, and the second light exiting width is greater than the second blocking width. 如請求項6所述的顯示面板,其中該第三發光元件的發光顏色為紅色,該第一發光元件與該第二發光元件的發光顏色為藍色和綠色。 The display panel of claim 6, wherein the third light-emitting element emits red light, and the first light-emitting element and the second light-emitting element emits light colors of blue and green. 如請求項2所述的顯示面板,其中該些第一接墊與該些第二接墊交替排列,且該些第一接墊與該些第二接墊的延伸方向相互平行。 The display panel of claim 2, wherein the first pads and the second pads are alternately arranged, and the extending directions of the first pads and the second pads are parallel to each other. 如請求項1所述的顯示面板,更包括:一第三平坦層,覆蓋該第二發光元件;多個第三接墊,設置在該第三平坦層上;以及一第三發光元件,電性接合至該些第三接墊,其中該第三發光元件重疊於該第一發光元件與該第二發光元件。 The display panel of claim 1, further comprising: a third flat layer covering the second light-emitting element; a plurality of third pads disposed on the third flat layer; and a third light-emitting element electrically The third light-emitting element overlaps the first light-emitting element and the second light-emitting element. 如請求項11所述的顯示面板,其中該些第三接墊的延伸方向垂直於該些第一接墊和該些第二接墊的延伸方向。 The display panel of claim 11, wherein the extending direction of the third pads is perpendicular to the extending directions of the first pads and the second pads.
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