TWI819214B - Laminated thin heat dissipation device and method of manufacturing the same - Google Patents

Abstract

The invention relates to a stacked thin heat dissipation device, which mainly includes an upper end plate, at least a first layer plate, at least a second layer plate, a lower end plate and a working fluid. The first and second layer plates each include at least a first, second and second layer plates. a second hollow groove; wherein the upper end plate, the first layer plate, the second layer plate and the lower end plate are stacked and joined to each other to form a hollow body, and the first hollow groove and the second hollow groove are connected with each other and form a closed cavity, It includes at least one first fluid channel and at least one second fluid channel; the working fluid system is filled in the closed cavity of the hollow body, wherein the first fluid channel is used as a vapor flow path, and the second fluid channel is used as a condensate flow path. .

Description

Stacked thin heat dissipation device and manufacturing method thereof

The present invention relates to a stacked thin heat dissipation device and a manufacturing method thereof, in particular to a thin heat dissipation device suitable for portable electronic devices and a manufacturing method thereof.

As the computing power of portable electronic devices continues to improve, the demand for heat dissipation has become increasingly important. In addition, the size of portable electronic devices continues to become thinner and smaller, which undoubtedly limits the configuration space of the heat dissipation device.

Heat dissipation components for portable electronic devices have been developed in the prior art, such as U.S. Patent Publication No. US9565786 "Sheet-like heat pipe, and electronic device provided with sheet-like heat pipe, and electronic device provided with" same)』. However, as mentioned in the previous technology above, it is still inevitable to have a capillary structure inside a traditional heat pipe for the return flow of the condensed working fluid. Common capillary structures include mesh, fiber body, sintered powder body, or micro-grooves, etc. .

Furthermore, the capillary structure in the heat pipe not only increases the manufacturing cost, but the manufacturing process is also quite complicated. For example, in order to fix the capillary structure such as mesh, fiber body, or sintered powder body, it must be heated and bonded or sintered, and an annealing process is derived. However, annealing may change material properties and affect reliability. On the other hand, if micro-trenches are used, etching, sputtering, or other processes for forming microstructures, such as CVD or PVD, must be performed. In addition, the capillary structure in the heat pipe must also have a considerable volume to provide enough working fluid for vapor-liquid circulation. As a result, the overall thickness of the heat pipe is limited, and the thickness cannot be reduced, which indirectly affects the thickness of the electronic device.

In addition, in other related prior art, it has also been found that semiconductor manufacturing processes are used to prepare thin heat dissipation devices, such as U.S. Patent Publication No. US2020/025458 "Vapor chamber, electronic machine, metal sheet for vapor chamber, and method of manufacturing vapor chamber/" VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER AND MANUFACTURING METHOD OF VAPOR CHAMBER", which uses semiconductor photolithography and etching processes to prepare the flow path of the working fluid. However, this process method is expensive and time-consuming, difficult to produce on a large scale, and also limits the form of the working fluid flow path.

On the other hand, the invention in the PCT application "Thin heat dissipation device and method for manufacturing the same" (application number: PCT/US2020/013981) previously submitted by the applicant of this case provides The structures and manufacturing methods of various innovative heat dissipation devices are mostly stamped with molds, and the structures are quite simple. Compared with the related prior art, both the manufacturing cost and the process time have been significantly improved. However, the applicant has been more active in developing a thin heat dissipation device that is more reliable, has a longer service life, can adapt to various needs and can flexibly change various flow channel structures, and a manufacturing method thereof.

The main purpose of the present invention is to provide a laminated thin heat dissipation device that has a simple structure, high reliability, and long service life. Its structural dimensions can be easily and elastically changed, and its thickness can also be quite thin.

Another object of the present invention is to provide a manufacturing method of a stacked thin heat dissipation device. The manufacturing process is relatively simple, the yield is high, and the manufacturing cost is relatively low, making it suitable for mass production.

In order to achieve the above object, the present invention is a stacked thin heat dissipation device, which mainly includes an upper end plate, at least a first layer plate, at least a first layer plate, a lower end plate, and a working fluid; each first and second Each layer board includes at least one first and second hollow groove, which respectively penetrates the upper and lower surfaces of the first and second layer boards; wherein, the upper end plate, at least one first layer board, at least one second layer board, and The lower end plates are stacked and joined to each other to form a hollow body, and at least one first hollow groove and at least one second hollow groove are connected with each other to form a closed cavity; and the closed cavity includes at least one first fluid channel and at least A second fluid passage; the working flow system fills the closed cavity of the hollow body.

It can be seen from the above that the present invention can use the stacked upper end plate, the first hollow groove of the first layer plate, the second hollow groove of the second layer plate, and the lower end plate to form the first and second fluid channels that communicate with each other, wherein One fluid channel serves as a vapor flow path, and the other fluid channel serves as a condensate flow path. Accordingly, the overall structure of the device of the present invention is quite simple and reliable, the cost is quite low, and the heat dissipation efficiency is also good; the size or shape of the device can be easily and flexibly changed, for example, according to the required heat dissipation efficiency and actual configuration. The area, thickness, and shape of the device to be dissipated are changed.

Preferably, the first one in the stacked thin heat dissipation device of the present invention The height of the communicating end surface between the fluid channel and the second fluid channel can be less than or equal to 0.1mm. Since a channel less than or equal to 0.1mm can provide excellent capillary action, it can replace the conventional mesh, fiber body, or sintered powder. body and other capillary structures. Furthermore, the first fluid channel and the second fluid channel may extend along the length direction of the hollow body; and the first fluid channel and the second fluid channel may be arranged side by side in the width direction of the hollow body or stacked in the height direction, and Connected to each other.

In addition, in the stacked thin heat dissipation device of the present invention, the first hollow groove of the first layer plate may include a plurality of first flow guide parts and a first converging part, and the plurality of first flow guide parts may be along the surface of the hollow body. Extending in the length direction, the first converging part can extend along the width direction of the hollow body and be connected with a plurality of first guide parts; on the other hand, the second hollow groove of the second layer plate can include a plurality of second guide parts, and a second confluence part, and the plurality of second flow guide parts can extend along the length direction of the hollow body, and the second confluence part can extend along the width direction of the hollow body and communicate with the plurality of second flow guide parts. In other words, through the configuration of the above-mentioned flow guide part and the converging part, the present invention can be used to form a heat dissipation plate with multiple heat conduction channels, which can provide heat transfer and heat dissipation over a large area while maintaining a relatively thin thickness. Moreover, the first converging part and the second converging part can provide a converging flow of working fluids in vapor and liquid states, thereby achieving uniform temperature of the entire heat dissipation device.

In order to achieve the aforementioned objectives, the present invention provides a method for manufacturing a stacked thin heat dissipation device, which includes the following steps: (A) providing an upper end plate, at least a first layer plate, at least a second layer plate, and a lower end plate: each The first layer plate includes at least one first hollow groove that penetrates the upper and lower surfaces of at least one first layer plate; each second layer plate includes at least one second hollow groove that penetrates the upper surface of at least one second layer plate. , lower surface; (B) stack and join the upper end plate, at least one first layer plate, at least one second layer plate, and lower end plate to form a hollow body; (C) inject a After the working fluid is degassed, the hollow body is closed to form a closed cavity; wherein the closed cavity includes at least one first fluid channel and at least one second fluid channel.

Accordingly, the manufacturing method provided by the present invention is very simple and low-cost. It only requires mechanical processing of the die. That is, after forming the first and second hollow grooves by punching, the upper and lower ends are directly connected. The board can be stacked and joined to the first and second layers without etching or sintering, and there is no need for additional processes to form the conventional capillary structure. It is indeed a very innovative and ingenious manufacturing method.

1:Laminated thin heat dissipation device

3: First layer board

4: Second layer board

21:Upper end plate

22:Lower end plate

31: First hollow slot

41:Second layer board

311: The first diversion department

312:First Confluence Department

C: Closed cavity

CH1: first fluid channel

CH2: Second fluid channel

H: height

HZ: evaporation zone

HB: Hollow body

LZ: condensation zone

T:Thickness

W: Width

Figure 1A is a perspective view of the first embodiment of the present invention.

Figure 1B is a cross-sectional view of the first embodiment of the present invention.

Figure 1C is an exploded view of the first embodiment of the present invention.

Figure 2A is a cross-sectional view of the second embodiment of the present invention.

Figure 2B is an exploded view of the second embodiment of the present invention.

Figure 3 is a cross-sectional view of the third embodiment of the present invention.

Figure 4A is a cross-sectional view of the fourth embodiment of the present invention.

Figure 4B is an exploded view of the fourth embodiment of the present invention.

Figure 5A is a cross-sectional view of the fifth embodiment of the present invention.

Figure 5B is a front view of the first layer board according to the fifth embodiment of the present invention.

Figure 5C is a front view of the second layer board according to the fifth embodiment of the present invention.

Before the stacked thin heat dissipation device and its manufacturing method of the present invention are described in detail in this embodiment, it should be noted that in the following description, similar components will be represented by the same component symbols. Furthermore, the drawings of the present invention are only for schematic illustration and are not necessarily drawn to scale, and not all details are necessarily shown. shown in the diagram.

Please refer to FIGS. 1A, 1B, and 1C together. FIG. 1A is a perspective view of the first embodiment of the stacked thin heat dissipation device 1 of the present invention. FIG. 1B is a cross-sectional view of the first embodiment of the stacked thin heat dissipation device 1 of the present invention. , Figure 1C is an exploded view of the first embodiment of the stacked thin heat dissipation device 1 of the present invention.

As shown in FIG. 1 , the stacked thin heat dissipation device 1 of this embodiment is in a long strip shape. However, the heat dissipation device of the present invention is not limited to this shape and can be in any shape, such as a flat plate shape. In addition, as shown in Figure 1, both ends of the device are respectively an evaporation zone HZ and a condensation zone LZ. The evaporation zone HZ is used to contact high-temperature devices. After the working fluid is evaporated by high temperature in the evaporation zone HZ, it is evaporated as steam. The liquid flows back to the condensation zone LZ and condenses into a liquid, which then flows to the evaporation zone HZ in liquid form through the capillary structure, thereby achieving heat conduction and heat removal in a continuous cycle.

However, the stacked thin heat sink 1 of this embodiment mainly includes an upper end plate 21, a first layer plate 3, a second layer plate 4, and a lower end plate 22; wherein, the upper end plate 21, the first layer plate 3, The second layer plate 4 and the lower end plate 22 are strip plates with the same outer contour shape. The first layer plate 3 is provided with a first hollow groove 31 that penetrates the upper and lower surfaces of the first layer plate 3; The second layer board 4 is also provided with a second hollow groove 41 that penetrates the upper and lower surfaces of the second layer board 4 .

Furthermore, the upper end plate 21, the first layer plate 3, the second layer plate 4, and the lower end plate 22 are stacked and joined to each other to form a hollow body HB, and the first hollow groove 31 and the second hollow groove 41 are connected with each other. A closed cavity C is formed; and the closed cavity C includes a first fluid channel CH1 and two second fluid channels CH2; and the closed cavity C of the hollow body HB is filled with working fluid, which can be ammonia, acetone, Methanol, ethanol, heptane, or water, etc., the appropriate working fluid can be selected according to different working temperature ranges.

The first fluid channel CH1 and the second fluid channel CH2 extend along the length direction of the hollow body HB; and the first fluid channel CH1 and the second fluid channel CH2 are arranged side by side in the width direction of the hollow body HB and communicate with each other. In this embodiment, the first fluid channel CH1 is used as a channel for vapor circulation, and the second fluid channel CH2 is used as a capillary effect structure, that is, a channel for condensed liquid reflux.

To further explain, as shown in Figures 1B and 1C, the cross-sectional area of the through opening of the first hollow groove 31 of this embodiment is larger than the cross-sectional area of the through opening of the second hollow groove 41; therefore, from the cross-sectional view of Figure 1B See, when the first layer board 3 and the second layer board 4 are stacked on each other, the closed cavity C presents a "T" shaped cross-section. Among them, the first fluid channel CH1 is formed in the overlapping space between the first hollow groove 31 and the second hollow groove 41; and the second fluid channel CH2 is formed from the first hollow groove 31 and the space between the second hollow groove 41 and the first hollow groove 31. The space of the overlapping part is the space on the two sides above the first fluid channel CH1.

Furthermore, the thickness T of the first layer plate 3 in this embodiment is 40 μm, so the height of the end surface that forms the communication between the first fluid channel CH1 and the second fluid channel CH2 is also 40 μm. In fact, according to actual research results, capillary effect can be formed when the channel height is less than or equal to 0.1mm. The smaller the height, the more obvious the capillary phenomenon will be. Accordingly, since the height of the second fluid channel CH2 in this embodiment is only 40 μm, it can provide an excellent liquid return effect.

In addition, the thickness of other layers of this embodiment including the second layer 4, the upper end plate 21, and the lower end plate 22 are also 40 μm, so the overall thickness of the device is only 160 μm. In addition, the material of all the laminates in this embodiment can be selected from materials with excellent thermal conductivity, such as copper. However, since the overall thickness is quite thin, the strength (hardness) must also be considered. Therefore, materials such as copper alloy, aluminum, aluminum, etc. can also be selected. alloy, Materials such as iron, stainless steel, composite material of copper and stainless steel (Cu-SUS), or composite material of nickel and stainless steel (Ni-SUS).

According to this, when the working fluid absorbs heat in the evaporation zone HZ and forms vapor, a local high pressure is generated in the cavity at this moment, driving the working fluid vapor to flow to the condensation zone LZ at high speed through the first fluid channel CH1, and condenses into a liquid in the condensation zone LZ , flows back to the evaporation zone HZ through the capillary structure of the second fluid channel CH2, and this cycle operates. In other words, due to the two-phase change of liquid and vapor in the continuous circulation of the working fluid in the cavity, that is, the convection of the vapor fluid and the condensate fluid back and forth between the heat absorption end (evaporation zone HZ) and the heat release end (condensation zone LZ), the surface of the cavity is It exhibits the characteristics of rapid temperature equalization to achieve the purpose of heat transfer and heat dissipation.

Please refer to FIG. 2A and FIG. 2B at the same time. FIG. 2A is a cross-sectional view of the second embodiment of the present invention, and FIG. 2B is an exploded view of the second embodiment of the present invention. The main difference between this embodiment and the aforementioned first embodiment is that the opening cross-sectional areas of the first hollow groove 31 and the second hollow groove 41 are the same, but they are located on the first layer plate 3 and the second layer plate 4 The arrangement is not centered, but offset to two sides in the width direction.

To further explain, the first hollow groove 31 and the second hollow groove 41 are offset from each other in the width direction of the device and include an overlapping portion and a non-overlapping portion; the overlapping portion constitutes the first fluid channel CH1; the non-overlapping portion Two second fluid channels CH2 are formed, which are respectively located on the left and right sides of the upper and lower ends of the first fluid channel CH1. In other words, based on the cross-section shown in FIG. 2A , the first fluid channel CH1 and the second fluid channel CH2 have a substantially "Z"-shaped cross-section. However, the advantage of this embodiment is that the specifications of the first layer board 3 and the second layer board 4 are exactly the same, that is, only one kind of layer board needs to be manufactured, and they can be arranged staggered with each other during assembly, which reduces the manufacturing cost. More advantages.

Please refer to FIG. 3 , which is a cross-sectional view of a third embodiment of a stacked thin heat dissipation device according to the present invention. The main difference between this embodiment and the aforementioned first embodiment is that this embodiment adds a first layer board 3 between the second layer board 4 and the lower end plate 22 . However, through this configuration, the number of second fluid channels CH2 can be doubled, thereby greatly increasing the amount of condensed liquid return, thereby significantly improving efficiency. Accordingly, through this embodiment, one of the advantages of the present invention can be clearly demonstrated, that is, by increasing or decreasing the number of the first and second layer boards, the space size of the first fluid channel CH1 and the second fluid channel can be easily adjusted. The quantity of CH2 is to meet the heat dissipation requirements of various specifications.

Please refer to FIG. 4A and FIG. 4B at the same time. FIG. 4A is a cross-sectional view of the fourth embodiment of the present invention, and FIG. 4B is an exploded view of the fourth embodiment of the present invention. As shown in the figure, the main difference between this embodiment and the previous embodiments is that in the first to third embodiments, the first fluid channel CH1 and the second fluid channel CH2 are arranged side by side in the width direction of the hollow body HB and with each other. connected; and the first fluid channel CH1 and the second fluid channel CH2 in this embodiment are stacked in the height (thickness) direction of the hollow body HB.

To further explain, the second layer plate 4 of this embodiment is provided with a plurality of second hollow grooves 41, which are equidistantly distributed along the length direction; and the width W of each second fluid channel CH2 is 0.1 mm. In other words, as mentioned above, the width of the connected end surface between the first fluid channel CH1 and the second fluid channel CH2 is less than or equal to 0.1mm, which constitutes a capillary structure. Therefore, the second fluid channel CH2 in this embodiment can be used as a condensed liquid. Return channel.

Please refer to Figure 5A, Figure 5B, and Figure 5C together. Figure 5A is a cross-sectional view of the fifth embodiment of the present invention. Figure 5B is a front view of the first layer of the fifth embodiment of the stacked thin heat dissipation device of the present invention. Figure 5C is the fifth embodiment of the present invention. Front view of the second floor. This embodiment is intended to show that the present invention is not limited to a long heat pipe, and can also be shaped into a VAPOR CHAMBER.

To further explain, the heat dissipation device of this embodiment includes three first layer boards 3 and two second layer boards 4 , together with the upper end plate 21 and the lower end plate 22 to form a 7-layer vapor chamber structure. Furthermore, the first hollow groove 31 on the first layer board 3 of this embodiment includes two first guide parts 311 and a first converging part 312, where the two first guide parts 311 are along the first layer. The plate 3 extends in the length direction, and the first converging portion 312 extends along the width direction of the first layer plate 3 and is connected with the first flow guide portion 311 . Similarly, the second hollow groove 41 on the second layer board 4 of this embodiment includes two second flow guides 411 and a second converging part 412, where the two second flow guides 411 are along the second layer. The plate 4 extends in the length direction, and the second converging portion 412 extends along the width direction of the second layer plate 4 and is connected with the second converging portion 412 .

Taking the heat dissipation requirements of a smart phone as an example, the dimensions of this embodiment can be designed as follows: the length of the upper end plate 21 , the lower end plate 22 , and each layer plate can be 50 mm, and the width can be 24 mm; The length can be 36mm and the width can be 8mm; the length of the first converging part 312 can be 18mm and the width can be 8mm; the length of the second flow guide part 411 can be 37mm and the width can be 6mm; the length of the second converging part 412 Can be 16mm, width can be 5mm. In addition, the thickness of all laminated plates in this embodiment is 40 μm, so the overall thickness of the device is only 0.28 mm.

Accordingly, as shown in this embodiment, the present invention is not limited to long thin heat pipes, but can also include flat plate-shaped VAPOR CHAMBER; moreover, the present invention can be adapted to actual needs, such as the size of electronic devices. , shape, or the position, size or shape of the parts to be radiated, etc., and elastically adjust the size of the first fluid channel CH1, the second fluid channel CH2, and each plate, Quantity, shape and other parameters.

The following first embodiment is taken as an example to illustrate the manufacturing method of the present invention; first, step (A) provides an upper end plate 21, a first layer plate 3, a second layer plate 4, and a lower end plate 22; wherein, the first layer plate The first hollow groove 31 and the second hollow groove 41 have been respectively formed in 3 and the second layer board 4 in advance. In this embodiment, the first hollow groove 31 and the second hollow groove 41 are formed through a punching process, which can be completed using only general mechanical processing equipment (punch), which is very suitable for mass production and the cost is quite low. .

However, the present invention is not limited to using punching processing to form the first hollow groove 31 and the second hollow groove 41. Other equivalent processing methods are also applicable, such as chemical etching, electrical discharge processing, 3D printing, PVD, and CVD. , or even machining such as milling, etc. It should be noted that if it is necessary to form a relatively fine hollow groove, such as the second hollow groove 41 of the fourth embodiment mentioned above, because it has exceeded the limit of general machining, the common etching process in semiconductor manufacturing can be considered. , physical or chemical vapor deposition process, etc. to form.

Next, in step (B), the upper end plate 21, the first layer plate 3, the second layer plate 4, and the lower end plate 22 are stacked and joined to form a hollow body HB; in other words, taking the first embodiment of the present invention as an example, After stacking the lower end plate 22 , the second layer plate 4 , the first layer plate 3 , and the upper end plate 21 sequentially from bottom to top, diffusion bonding can be used to join all the plates. Of course, during this joining step, a through hole must be reserved for filling the working fluid and degassing.

Furthermore, in step (C), after injecting a working fluid into the hollow body HB and degassing it, the hollow body HB is closed to form a closed cavity C; that is, for example, by heating or vacuum suction or a combination of these After degassing by means such as riveting, welding, or diffusion bonding, the through holes are sealed to form a seal. The closed cavity C is the device that completes the present invention. Accordingly, the manufacturing process of the present invention is quite simple and can be completed using only general mechanical processing. It is very suitable for mass production, has a very low cost and extremely high production efficiency, and the process conditions and product specifications can be easily changed flexibly according to actual needs. , is actually an innovative invention that is extremely creative, practical, and can be industrialized for mass production.

The above-mentioned embodiments are only examples for convenience of explanation. The scope of rights claimed by the present invention shall be subject to the scope of the patent application and shall not be limited to the above-mentioned embodiments.

1:Laminated thin heat dissipation device

3: First layer board

4: Second layer board

21:Upper end plate

22:Lower end plate

C: Closed cavity

CH1: first fluid channel

CH2: Second fluid channel

HB: Hollow body

T:Thickness

Claims (8)

A stacked thin heat dissipation device includes: an upper end plate; at least one first layer plate, each first layer plate including at least a first hollow groove penetrating the upper and lower surfaces of the at least one first layer plate; at least A second layer plate, each second layer plate includes at least a second hollow groove that penetrates the upper and lower surfaces of the at least one second layer plate; a lower end plate; and a working fluid; wherein, the upper end plate, The at least one first layer plate, the at least one second layer plate, and the lower end plate are stacked and joined to each other to form a hollow body. The at least one first hollow groove and the at least one second hollow groove are connected with each other and form a hollow body. A closed cavity; the closed cavity includes at least one first fluid channel and at least one second fluid channel, and the at least one first fluid channel and the at least one second fluid channel extend along the length direction of the hollow body , the first fluid channel and the second fluid channel are arranged side by side in the width direction of the hollow body and communicate with each other; the working fluid system is filled in the closed cavity of the hollow body. The stacked thin heat sink device of claim 1, wherein the width of the end face forming communication between the first fluid channel and the second fluid channel is less than or equal to 0.1 mm. The stacked thin heat dissipation device of claim 1, wherein the opening cross-sectional area of the at least one first hollow groove is larger than the opening cross-sectional area of the at least one second hollow groove; the first fluid channel is formed in the at least one first hollow groove. The space between a hollow groove and the at least one second hollow groove overlaps each other. The second fluid channel is formed from the at least one first hollow groove minus the overlapping portion between the at least one second hollow groove and the at least one second hollow groove. of space. The stacked thin heat dissipation device of claim 1, wherein the at least one first hollow groove and the at least one second hollow groove are offset from each other and include an overlapping portion and a non-overlapping portion; the overlapping portion constitutes the at least one The first fluid channel; the non-overlapping portion constitutes the at least one second fluid channel. The stacked thin heat dissipation device of claim 1, wherein the at least one first hollow groove of the at least one first layer plate includes a plurality of first guide parts and a first converging part, and the plurality of first guide parts The first confluence portion extends along the length direction of the hollow body, and the first confluence portion extends along the width direction of the hollow body and is connected with the plurality of first guide portions; the at least one second confluence portion of the at least one second layer plate The hollow groove includes a plurality of second flow guide portions and a second confluence portion. The plurality of second flow guide portions extend along the length direction of the hollow body. The second confluence portion extends along the width direction of the hollow body. And connected with the plurality of second flow guide parts. A method of manufacturing a stacked thin heat dissipation device, including the following steps: (A) providing an upper end plate, at least a first layer plate, at least a second layer plate, and a lower end plate: each first layer plate includes at least one a first hollow groove that penetrates the upper and lower surfaces of the at least one first layer; each second layer includes at least one second hollow groove that penetrates the upper and lower surfaces of the at least one second layer; ( B) Stack and join the upper end plate, the at least one first layer plate, the at least one second layer plate, and the lower end plate to form a hollow body; and (C) inject a working fluid into the hollow body and After degassing, the hollow body is closed to form a closed cavity; wherein the closed cavity includes at least a first fluid channel and at least a second fluid channel, the at least one first fluid channel and the at least a second fluid channel. Fluid channels are along the length of the hollow body Extending in the direction, the first fluid channel and the second fluid channel are arranged side by side in the width direction of the hollow body and communicate with each other. The manufacturing method of a stacked thin heat sink device as claimed in claim 6, wherein the thickness of at least one of the at least one first layer board and the at least one second layer board is less than or equal to 0.1 mm. The manufacturing method of a stacked thin heat dissipation device as claimed in claim 6, wherein the at least one first hollow groove of the at least one first layer board and the at least one second hollow groove of the at least one second layer board pass through Formed by a punching process.

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