TWI818157B - Adhesive sheet for image display devices and adhesive sheet laminate for image display devices - Google Patents
Adhesive sheet for image display devices and adhesive sheet laminate for image display devices Download PDFInfo
- Publication number
- TWI818157B TWI818157B TW109106147A TW109106147A TWI818157B TW I818157 B TWI818157 B TW I818157B TW 109106147 A TW109106147 A TW 109106147A TW 109106147 A TW109106147 A TW 109106147A TW I818157 B TWI818157 B TW I818157B
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- TW
- Taiwan
- Prior art keywords
- adhesive sheet
- adhesive
- image display
- weight
- meth
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 99
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 98
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 24
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 22
- 239000012790 adhesive layer Substances 0.000 claims abstract description 21
- 150000002148 esters Chemical class 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 238000003860 storage Methods 0.000 claims abstract description 19
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 16
- 229920001577 copolymer Polymers 0.000 claims abstract description 14
- 239000012948 isocyanate Substances 0.000 claims abstract description 14
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000013039 cover film Substances 0.000 abstract description 23
- 238000005336 cracking Methods 0.000 abstract description 4
- 239000000178 monomer Substances 0.000 description 30
- 229920000058 polyacrylate Polymers 0.000 description 26
- 239000010408 film Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 239000002904 solvent Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- 239000005056 polyisocyanate Substances 0.000 description 7
- 229920001228 polyisocyanate Polymers 0.000 description 7
- -1 (meth)acrylic acid 3-hydroxypropyl ester Chemical class 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
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- 238000007865 diluting Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
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- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- MHVJRKBZMUDEEV-UHFFFAOYSA-N (-)-ent-pimara-8(14),15-dien-19-oic acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(C=C)(C)C=C1CC2 MHVJRKBZMUDEEV-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical group CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- MXYATHGRPJZBNA-KRFUXDQASA-N isopimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@@](C=C)(C)CC2=CC1 MXYATHGRPJZBNA-KRFUXDQASA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
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- 239000003505 polymerization initiator Substances 0.000 description 2
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- MHVJRKBZMUDEEV-APQLOABGSA-N (+)-Pimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@](C=C)(C)C=C2CC1 MHVJRKBZMUDEEV-APQLOABGSA-N 0.000 description 1
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- MFLLXRJTHGPGEB-UHFFFAOYSA-N 1-propylperoxypropane Chemical compound CCCOOCCC MFLLXRJTHGPGEB-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
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- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- AWFYPPSBLUWMFQ-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,6,7-tetrahydropyrazolo[4,3-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=C2 AWFYPPSBLUWMFQ-UHFFFAOYSA-N 0.000 description 1
- VGZZAZYCLRYTNQ-UHFFFAOYSA-N 2-ethoxyethoxycarbonyloxy 2-ethoxyethyl carbonate Chemical compound CCOCCOC(=O)OOC(=O)OCCOCC VGZZAZYCLRYTNQ-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- QPIRYFWCAHUZTB-UHFFFAOYSA-N 3,5,5-trimethyl-1-(3,5,5-trimethylhexylperoxy)hexane Chemical compound CC(C)(C)CC(C)CCOOCCC(C)CC(C)(C)C QPIRYFWCAHUZTB-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
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- COCLLEMEIJQBAG-UHFFFAOYSA-N 8-methylnonyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C(C)=C COCLLEMEIJQBAG-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
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- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- LWMFAFLIWMPZSX-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LWMFAFLIWMPZSX-UHFFFAOYSA-N 0.000 description 1
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- 239000004611 light stabiliser Substances 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000003626 triacylglycerols Chemical class 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
本發明提供一種圖像顯示裝置用黏著片及圖像顯示裝置用黏著片積層體,能夠於圖像顯示裝置安裝覆蓋膜等時,防止於覆蓋膜發生破裂或剝落。本發明係一種圖像顯示裝置用黏著片,具備包含黏著性組成物的交聯物之黏著層,前述黏著性組成物含有作為主成分的(甲基)丙烯酸酯共聚物、異氰酸酯系交聯劑、及松香酯系黏著賦予性樹脂,相對於前述(甲基)丙烯酸酯共聚物100重量份,含有前述松香酯系黏著賦予性樹脂1重量份至40重量份,前述黏著層在1Hz的tanδ的最大值為-20℃以下,前述黏著層在1Hz及25℃的儲藏彈性模數為1.0×105 Pa以下。The present invention provides an adhesive sheet for an image display device and an adhesive sheet laminate for an image display device, which can prevent the cover film from cracking or peeling when a cover film or the like is installed on the image display device. The present invention is an adhesive sheet for an image display device, which is provided with an adhesive layer containing a cross-linked product of an adhesive composition containing (meth)acrylate copolymer and an isocyanate-based cross-linking agent as main components. , and a rosin ester-based adhesive-imparting resin, containing 1 to 40 parts by weight of the aforementioned rosin ester-based adhesive-imparting resin relative to 100 parts by weight of the aforementioned (meth)acrylate copolymer, and the aforementioned adhesive layer has a tan delta of 1 Hz. The maximum value is below -20°C, and the storage elastic modulus of the aforementioned adhesive layer at 1Hz and 25°C is below 1.0×10 5 Pa.
Description
本發明係一種圖像顯示裝置用黏著片及圖像顯示裝置用黏著片積層體。The present invention relates to an adhesive sheet for an image display device and an adhesive sheet laminated body for an image display device.
近年來,為了將構成智慧型手機等所使用的觸控面板顯示器之覆蓋膜、電極膜、框體等貼合而積層,例如使用專利文獻1所記載的黏著片。
[先前技術文獻]
[專利文獻]In recent years, in order to laminate and laminate cover films, electrode films, frames, and the like constituting touch panel displays used in smartphones and the like, the adhesive sheet described in
[專利文獻1]日本特開2012-025808號公報[Patent Document 1] Japanese Patent Application Publication No. 2012-025808
[發明所欲解決之課題][Problem to be solved by the invention]
另一方面,近年來觸控面板顯示器等圖像顯示裝置有些具有曲面或屈曲面,甚至有反覆屈曲而使用之情形,因此作為該圖像顯示裝置的構成構件的覆蓋膜等亦必須追隨曲面等而予以貼附。然而,若於這種曲面貼附覆蓋膜,則有覆蓋膜發生破裂或剝落之虞,因此期望改善這種情況。本發明係為了解決上述問題而成,目的在於提供一種圖像顯示裝置用黏著片及圖像顯示裝置用黏著片積層體,於對圖像顯示裝置安裝覆蓋膜等時,能夠防止覆蓋膜發生破裂或剝落。 [用以解決課題之手段]On the other hand, in recent years, some image display devices such as touch panel displays have curved or curved surfaces, and some are even used with repeated bending. Therefore, the cover film and other components of the image display device must also follow the curved surface, etc. And be attached. However, if a cover film is attached to such a curved surface, there is a risk that the cover film will crack or peel off, so it is desired to improve this situation. The present invention is made to solve the above problems, and aims to provide an adhesive sheet for an image display device and an adhesive sheet laminate for an image display device that can prevent the cover film from cracking when a cover film or the like is mounted on an image display device. or peeling. [Means used to solve problems]
方案1. 一種圖像顯示裝置用黏著片,具備包含黏著性組成物的交聯物之黏著層,前述黏著性組成物含有作為主成分的(甲基)丙烯酸酯共聚物、異氰酸酯系交聯劑及松香酯系黏著賦予性樹脂,相對於前述(甲基)丙烯酸酯共聚物100重量份,係含有前述松香酯系黏著賦予性樹脂1重量份至40重量份;且前述黏著層於1Hz的tanδ的最大值為-20℃以下;前述黏著層於1Hz及25℃的儲藏彈性模數為1.0×105
Pa以下。
方案2. 如方案1所記載之圖像顯示裝置用黏著片,於1Hz及-20℃的儲藏彈性模數為1.0×105
Pa以下。Option 2. The adhesive sheet for image display devices as described in
方案3. 如方案1或方案2所記載之圖像顯示裝置用黏著片,厚度為5μm至100μm。Option 3. The adhesive sheet for an image display device as described in
方案4. 一種圖像顯示裝置用黏著片積層體,具備用於剝離之基材片,前述用於剝離之基材片安裝於如方案1至方案3中任一方案所記載之圖像顯示裝置用黏著片的至少一面。
[發明功效]Embodiment 4. An adhesive sheet laminate for an image display device, which is provided with a base material sheet for peeling off, and the base material sheet for peeling off is mounted on the image display device according to any one of
根據本發明的黏著片,能夠在對圖像顯示裝置安裝覆蓋膜時,防止覆蓋膜發生破裂或剝落。According to the adhesive sheet of the present invention, the cover film can be prevented from cracking or peeling when the cover film is attached to an image display device.
以下,對本發明的黏著片的一實施形態予以說明。該黏著片係用以安裝構成觸控面板顯示器等圖像顯示裝置之覆蓋膜、電極膜、框體等,尤其適合用於對表面彎曲或屈曲之顯示器安裝覆蓋膜。該黏著片係將黏著性組成物予以交聯而成,該黏著性組成物含有作為主成分的(甲基)丙烯酸酯共聚物、異氰酸酯系交聯劑、及松香酯系黏著賦予性樹脂。以下,詳細地予以說明。Hereinafter, one embodiment of the adhesive sheet of the present invention will be described. The adhesive sheet is used to install cover films, electrode films, frames, etc. that constitute image display devices such as touch panel displays. It is especially suitable for installing cover films on displays with curved or buckled surfaces. The adhesive sheet is formed by cross-linking an adhesive composition containing (meth)acrylate copolymer, an isocyanate-based cross-linking agent, and a rosin ester-based adhesive-imparting resin as main components. This is explained in detail below.
[1.(甲基)丙烯酸酯共聚物] (甲基)丙烯酸酯聚合物較佳為含有烷基的碳數為2至20的(甲基)丙烯酸烷基酯、分子內具有反應性官能基之單體(含反應性官能基之單體)作為單體單元。藉此,能夠表現出較佳的黏著性。[1.(Meth)acrylate copolymer] The (meth)acrylate polymer is preferably an alkyl (meth)acrylate having an alkyl group and a carbon number of 2 to 20, or a monomer having a reactive functional group in the molecule (a monomer containing a reactive functional group). ) as a single unit. In this way, better adhesion can be demonstrated.
作為烷基的碳數為2至20的(甲基)丙烯酸烷基酯,較佳為玻璃轉移溫度(Tg)為-40℃以下的均聚物(以下有時稱為「特定丙烯酸酯」。)。藉由含有這種特定丙烯酸酯作為構成單體單元,變得容易設定本實施形態之黏著片的tanδ的最大值成為下述範圍。The (meth)acrylic acid alkyl ester having an alkyl group having 2 to 20 carbon atoms is preferably a homopolymer having a glass transition temperature (Tg) of -40°C or lower (hereinafter sometimes referred to as "specific acrylate"). ). By containing such a specific acrylate as a constituent monomer unit, it becomes easy to set the maximum value of tan δ of the adhesive sheet of this embodiment to the following range.
作為特定丙烯酸酯,較佳為使用例如丙烯酸正丁酯(Tg為-55℃)、丙烯酸正辛酯(Tg為-65℃)、丙烯酸異辛酯(Tg為-58℃)、丙烯酸2-乙基己酯(Tg為-70℃)、丙烯酸異壬酯(Tg為-58℃)、丙烯酸異癸酯(Tg為-60℃)、甲基丙烯酸異癸酯(Tg為-41℃)、甲基丙烯酸正月桂酯(Tg為-65℃)、丙烯酸十三烷基酯(Tg為-55℃)、甲基丙烯酸十三烷基酯(-40℃)等。其中,就更有效地減小儲藏彈性模數之觀點而言,作為特定丙烯酸酯,更佳為均聚物的Tg為-45℃以下的丙烯酸酯,尤佳為-50℃以下。具體而言,尤佳為丙烯酸正丁酯及丙烯酸2-乙基己酯。該等丙烯酸酯可單獨使用,亦可組合2種以上予以使用。再者,烷基碳數為2至20的(甲基)丙烯酸烷基酯中之烷基意指直鏈狀、分枝鏈狀或環狀的烷基。As the specific acrylate, it is preferable to use, for example, n-butyl acrylate (Tg: -55°C), n-octyl acrylate (Tg: -65°C), isooctyl acrylate (Tg: -58°C), 2-ethyl acrylate Hexyl acrylate (Tg is -70℃), isononyl acrylate (Tg is -58℃), isodecyl acrylate (Tg is -60℃), isodecyl methacrylate (Tg is -41℃), methanol n-lauryl acrylate (Tg is -65°C), tridecyl acrylate (Tg is -55°C), tridecyl methacrylate (-40°C), etc. Among these, from the viewpoint of reducing the storage elastic modulus more effectively, the specific acrylate is more preferably an acrylate having a homopolymer Tg of -45°C or less, and particularly preferably -50°C or less. Specifically, n-butyl acrylate and 2-ethylhexyl acrylate are particularly preferred. These acrylic esters can be used individually or in combination of 2 or more types. Furthermore, the alkyl group in the alkyl (meth)acrylate having an alkyl group carbon number of 2 to 20 means a linear, branched chain or cyclic alkyl group.
(甲基)丙烯酸酯聚合物較佳為含有特定丙烯酸酯60質量%以上作為單體單元,更佳為含有80質量%以上,尤佳為含有90質量%以上。藉由含有上述特定丙烯酸酯60質量%以上,變得容易設定本實施形態之黏著片的tanδ的最大值成為下述範圍。The (meth)acrylate polymer preferably contains 60% by mass or more of the specific acrylate as a monomer unit, more preferably 80% by mass or more, and even more preferably 90% by mass or more. By containing 60 mass % or more of the above-mentioned specific acrylate, it becomes easy to set the maximum value of tan δ of the adhesive sheet of this embodiment to the following range.
另外,(甲基)丙烯酸酯聚合物較佳為含有特定丙烯酸酯99.9質量%以下作為單體單元,更佳為含有99質量%以下,尤佳為含有98質量%以下。藉由含有99.9質量%以下的上述特定丙烯酸酯,能夠對(甲基)丙烯酸酯聚合物中導入適宜量的其他單體成分(尤其是含反應性官能基之單體)。In addition, the (meth)acrylate polymer preferably contains 99.9% by mass or less of the specific acrylate as a monomer unit, more preferably 99% by mass or less, and particularly preferably 98% by mass or less. By containing 99.9% by mass or less of the above-mentioned specific acrylate, an appropriate amount of other monomer components (especially monomers containing reactive functional groups) can be introduced into the (meth)acrylate polymer.
(甲基)丙烯酸酯聚合物藉由含有含反應性官能基之單體作為單體單元,經由源自該含反應性官能基之單體的反應性官能基而與下述交聯劑進行反應,由此形成交聯結構(立體網狀結構),而獲得具有所需的凝聚力之黏著片。The (meth)acrylate polymer contains a reactive functional group-containing monomer as a monomer unit and reacts with the following cross-linking agent via the reactive functional group derived from the reactive functional group-containing monomer. , thereby forming a cross-linked structure (three-dimensional network structure), and obtaining an adhesive sheet with the required cohesive force.
關於(甲基)丙烯酸酯聚合物作為單體單元而含有的含反應性官能基之單體,較佳為分子內具有羥基之單體(含羥基之單體)、分子內具有胺基之單體(含胺基之單體)等。該等單體中,尤佳為含羥基之單體。含羥基之單體的玻璃轉移溫度(Tg)多為0℃以下,容易將本實施形態之黏著片的tanδ的最大值設定至下述範圍。The reactive functional group-containing monomer contained in the (meth)acrylate polymer as a monomer unit is preferably a monomer having a hydroxyl group in the molecule (hydroxyl-containing monomer) or a monomer having an amine group in the molecule. monomers (amine-containing monomers), etc. Among these monomers, hydroxyl-containing monomers are particularly preferred. The glass transition temperature (Tg) of the hydroxyl-containing monomer is often 0° C. or lower, and it is easy to set the maximum value of tan δ of the adhesive sheet of this embodiment to the following range.
作為含羥基之單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丁酯、(甲基)丙烯酸4-羥基丁酯等(甲基)丙烯酸羥基烷基酯等。其中,就玻璃轉移溫度(Tg)、所獲得之(甲基)丙烯酸酯聚合物中的羥基與交聯劑之反應性、以及與其他單體的共聚合性之方面而言,較佳為丙烯酸2-羥基乙酯、丙烯酸2-羥基丙酯、丙烯酸3-羥基丙酯及丙烯酸4-羥基丁酯中的至少一種。該等可單獨使用,亦可組合2種以上予以使用。Examples of the hydroxyl-containing monomer include: (meth)acrylic acid 2-hydroxyethyl ester, (meth)acrylic acid 2-hydroxypropyl ester, (meth)acrylic acid 3-hydroxypropyl ester, (meth)acrylic acid 2 -Hydroxyalkyl (meth)acrylate such as hydroxybutyl ester, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, etc. Among them, acrylic acid is preferred in terms of glass transition temperature (Tg), reactivity of the hydroxyl group in the obtained (meth)acrylate polymer with the cross-linking agent, and copolymerizability with other monomers. At least one of 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate and 4-hydroxybutyl acrylate. These can be used individually or in combination of 2 or more types.
(甲基)丙烯酸酯共聚物的羥值並無特別限制,於以將黏著片與被黏著體予以密接之狀態使黏著片反覆屈曲之情形時,就抑制從被黏著體剝落之觀點而言,下限較佳可列舉5mgKOH/g以上,更佳可列舉10mgKOH/g以上。另一方面,上限較佳為100mgKOH/g以下,更佳為90mgKOH/g以下。The hydroxyl value of the (meth)acrylate copolymer is not particularly limited. When the adhesive sheet and the adherend are in close contact with each other and the adhesive sheet is repeatedly buckled, from the viewpoint of suppressing peeling from the adherend, The lower limit is preferably 5 mgKOH/g or more, and more preferably 10 mgKOH/g or more. On the other hand, the upper limit is preferably 100 mgKOH/g or less, more preferably 90 mgKOH/g or less.
(甲基)丙烯酸酯聚合物較佳為含有含反應性官能基之單體0.1質量%以上作為單體單元,更佳為含有0.5質量%以上,尤佳為含有1質量%以上。另外,(甲基)丙烯酸酯聚合物較佳為含有含反應性官能基之單體30質量%以下作為單體單元,更佳為含有20質量%以下,尤佳為含有8質量%以下。The (meth)acrylate polymer preferably contains 0.1% by mass or more of a reactive functional group-containing monomer as a monomer unit, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. In addition, the (meth)acrylate polymer preferably contains 30% by mass or less of a reactive functional group-containing monomer as a monomer unit, more preferably 20% by mass or less, and even more preferably 8% by mass or less.
其中,本實施形態之(甲基)丙烯酸酯聚合物不含有含羧基之單體、尤其是丙烯酸作為單體單元。羧基由於為酸成分,因此藉由不含有含羧基之單體,能夠抑制黏著片的貼附對象因酸而產生不良情況,例如存在摻錫氧化銦(ITO)等的透明導電膜、或金屬膜、金屬網等之情形時,能夠抑制酸所致之這些貼附對象的不良情況(腐蝕、電阻值變化等)。However, the (meth)acrylate polymer of this embodiment does not contain a carboxyl group-containing monomer, especially acrylic acid, as a monomer unit. Since carboxyl groups are acid components, by not containing carboxyl group-containing monomers, it is possible to prevent acid-induced defects in the objects to which the adhesive sheet is attached, such as transparent conductive films or metal films containing tin-doped indium oxide (ITO). , metal mesh, etc., it can suppress defects (corrosion, resistance value changes, etc.) caused by acid in these attached objects.
(甲基)丙烯酸酯聚合物的聚合方式可為無規共聚物,亦可為嵌段共聚物。The polymerization mode of the (meth)acrylate polymer can be a random copolymer or a block copolymer.
(甲基)丙烯酸酯聚合物的重量平均分子量的下限值較佳為20萬以上,更佳為30萬以上,尤佳為40萬以上。若(甲基)丙烯酸酯聚合物的重量平均分子量的下限值為上述值以上,則於加工黏著片時可抑制黏著的滲出等不良情況。再者,本說明書中之重量平均分子量係藉由凝膠滲透層析法(GPC)法所測定之以標準聚苯乙烯換算的值。The lower limit of the weight average molecular weight of the (meth)acrylate polymer is preferably 200,000 or more, more preferably 300,000 or more, and particularly preferably 400,000 or more. If the lower limit value of the weight average molecular weight of the (meth)acrylate polymer is equal to or higher than the above value, problems such as adhesive bleeding during processing of the adhesive sheet can be suppressed. Furthermore, the weight average molecular weight in this specification is a value measured by gel permeation chromatography (GPC) and converted to standard polystyrene.
另外,(甲基)丙烯酸酯聚合物的重量平均分子量的上限值較佳為100萬以下,更佳為90萬以下,尤佳為80萬以下。若(甲基)丙烯酸酯聚合物的重量平均分子量的上限值為上述值以下,則所獲得之黏著片與被黏著體的密接力及儲藏彈性模數變得容易處於下述適宜的範圍。In addition, the upper limit of the weight average molecular weight of the (meth)acrylate polymer is preferably 1 million or less, more preferably 900,000 or less, and particularly preferably 800,000 or less. If the upper limit of the weight average molecular weight of the (meth)acrylate polymer is equal to or less than the above-mentioned value, the adhesive force and storage elastic modulus of the obtained adhesive sheet and adherend will be easily within the following appropriate ranges.
再者,於本實施形態之黏著劑中,(甲基)丙烯酸酯聚合物可單獨使用上述中之1種,亦可組合2種以上予以使用。Furthermore, in the adhesive agent of this embodiment, one of the above-mentioned (meth)acrylate polymers may be used alone, or two or more types may be used in combination.
[2.異氰酸酯系交聯劑] 若加熱本實施形態之黏著性組成物,則異氰酸酯系交聯劑將(甲基)丙烯酸酯聚合物予以交聯,而形成立體網狀結構。藉此,所獲得之黏著片的凝聚力提升。[2. Isocyanate cross-linking agent] When the adhesive composition of this embodiment is heated, the isocyanate cross-linking agent cross-links the (meth)acrylate polymer to form a three-dimensional network structure. Thereby, the cohesiveness of the obtained adhesive sheet is improved.
異氰酸酯系交聯劑至少含有多異氰酸酯化合物。作為多異氰酸酯化合物,例如可列舉:甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族多異氰酸酯、1,6-己二異氰酸酯等脂肪族多異氰酸酯、異佛酮二異氰酸酯、氫化二苯基甲烷二異氰酸酯等脂環式多異氰酸酯等、及該等多異氰酸酯的雙縮脲體、異三聚氰酸酯體、以及作為與乙二醇、丙二醇、新戊二醇、三羥甲基丙烷、蓖麻油等低分子含活性氫化合物的反應物之加合體等。其中就與羥基的反應性的觀點而言,較佳為經三羥甲基丙烷改性之芳香族多異氰酸酯,尤其是經三羥甲基丙烷改性之甲苯二異氰酸酯及經三羥甲基丙烷改性之苯二甲基二異氰酸酯。The isocyanate cross-linking agent contains at least a polyisocyanate compound. Examples of the polyisocyanate compound include aromatic polyisocyanates such as toluene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate, aliphatic polyisocyanates such as 1,6-hexamethylene diisocyanate, and isophorone diisocyanate. , alicyclic polyisocyanates such as hydrogenated diphenylmethane diisocyanate, etc., and biuret bodies, isocycyanurate bodies of these polyisocyanates, and as combinations with ethylene glycol, propylene glycol, neopentyl glycol, triglyceride Adducts of reactants of low molecular weight active hydrogen-containing compounds such as hydroxymethylpropane and castor oil. Among them, from the viewpoint of reactivity with hydroxyl groups, aromatic polyisocyanates modified with trimethylolpropane are preferred, especially toluene diisocyanate modified with trimethylolpropane and trimethylolpropane-modified toluene diisocyanate. Modified xylylene diisocyanate.
黏著性組成物中的異氰酸酯系交聯劑的含量相對於(甲基)丙烯酸酯聚合物100重量份,較佳為0.01質量份以上,尤佳為0.05質量份以上,更佳為0.1質量份以上。另外,該含量較佳為10質量份以下,尤佳為8質量份以下,更佳為5質量份以下。The content of the isocyanate cross-linking agent in the adhesive composition is preferably 0.01 part by mass or more, particularly preferably 0.05 part by mass or more, and more preferably 0.1 part by mass or more based on 100 parts by weight of the (meth)acrylate polymer. . In addition, the content is preferably 10 parts by mass or less, particularly preferably 8 parts by mass or less, and more preferably 5 parts by mass or less.
[3.松香酯系黏著賦予性樹脂] 本實施形態之松香酯系黏著賦予樹脂係屬以松香酸(abietic acid)、長葉松酸(palustric acid)、新松香酸、海松脂酸(pimaric acid)、異海松脂酸、去氫松香酸等樹脂酸作為主成分的脂松香、木松香、妥爾油松香等松香系黏著賦予樹脂與各種醇的酯之松香酯系黏著賦予樹脂。[3. Rosin ester-based adhesive-imparting resin] The rosin ester adhesive-imparting resin of this embodiment is composed of abietic acid, palustric acid, neorosin acid, pimaric acid, isopimaric acid, and dehydroabietic acid. Rosin ester-based tackifying resins are rosin-based tackifying resins such as gum rosin, wood rosin, tall oil rosin and other rosin-based tackifying resins whose main components are resin acids and esters of various alcohols.
黏著性組成物中的松香酯系黏著賦予性樹脂的含量相對於(甲基)丙烯酸酯聚合物100重量份,較佳為1重量份至40重量份,更佳為1.5重量份至35重量份,進而更佳為2重量份至30重量份。若含量為1重量份以上,則藉由黏著片將覆蓋膜安裝於圖像顯示裝置時的耐屈曲性能提升。另一方面,藉由使含量為40重量份以下,能夠抑制黏著片的白濁。The content of the rosin ester-based tackifying resin in the adhesive composition is preferably 1 to 40 parts by weight, more preferably 1.5 to 35 parts by weight based on 100 parts by weight of the (meth)acrylate polymer. , and more preferably 2 to 30 parts by weight. If the content is 1 part by weight or more, the buckling resistance of the cover film when mounted on an image display device through an adhesive sheet is improved. On the other hand, by setting the content to 40 parts by weight or less, white turbidity of the adhesive sheet can be suppressed.
[4.添加劑] 於黏著性組成物中,視需要可添加通常使用於丙烯酸系黏著劑之各種添加劑,例如矽烷偶合劑、紫外線吸收劑、抗靜電劑、黏著賦予劑、抗氧化劑、光穩定劑、軟化劑、填充劑、折射率調整劑等。再者,下述的聚合溶劑、稀釋溶劑視為構成黏著性組成物之添加劑所不含的物質。[4.Additives] In the adhesive composition, various additives commonly used in acrylic adhesives may be added as necessary, such as silane coupling agents, ultraviolet absorbers, antistatic agents, adhesion-imparting agents, antioxidants, light stabilizers, softeners, and fillers. agents, refractive index adjusters, etc. In addition, the following polymerization solvent and dilution solvent are regarded as substances not included in the additives constituting the adhesive composition.
[5.黏著片的物性] [5-1.黏著片的厚度] 黏著片的厚度較佳為5μm至100μm,更佳為10μm至50μm。原因在於,若將厚度設為未達5μm,則有覆蓋膜容易剝落之可能性。另一方面,若厚度超過100μm,則由於推壓覆蓋膜時覆蓋膜會陷入,因此有鉛筆硬度降低之虞。[5. Physical properties of the adhesive sheet] [5-1. Thickness of adhesive sheet] The thickness of the adhesive sheet is preferably 5 μm to 100 μm, more preferably 10 μm to 50 μm. The reason is that if the thickness is less than 5 μm, the cover film may peel off easily. On the other hand, if the thickness exceeds 100 μm, the cover film may sink in when the cover film is pressed, so the pencil hardness may decrease.
[5-2.儲藏彈性模數及tanδ] 本實施形態之黏著片在1Hz的tanδ的最大值(玻璃轉移溫度)為-20℃以下,且在1Hz及25℃的儲藏彈性模數為1.0×105 Pa以下。tanδ的最大值越低,儲藏彈性模數越變低,黏著片越變得柔軟。因此,黏著片在1Hz的tanδ的最大值較佳為-30℃以下,更佳為-50℃以下。黏著片在1Hz及25℃的儲藏彈性模數較佳為更低,較佳為1.0×105 Pa以下,更佳為8.0×104 Pa以下,進而更佳為5.0×104 Pa以下,尤佳為3.0×104 Pa以下。另外,為了在低溫下亦保持柔軟性,黏著片在1Hz及-20℃的儲藏彈性模數較佳為1.0×105 Pa以下,更佳為7.0×104 Pa以下,尤佳為5.5×104 Pa以下。[5-2. Storage elastic modulus and tan δ] The maximum value of tan δ (glass transition temperature) of the adhesive sheet of this embodiment at 1 Hz is -20°C or less, and the storage elastic modulus at 1 Hz and 25° C. is 1.0× Below 10 5 Pa. The lower the maximum value of tan δ, the lower the storage elastic modulus becomes, and the softer the adhesive sheet becomes. Therefore, the maximum value of tan δ of the adhesive sheet at 1 Hz is preferably -30°C or lower, and more preferably -50°C or lower. The storage elastic modulus of the adhesive sheet at 1Hz and 25°C is preferably lower, preferably 1.0×10 5 Pa or less, more preferably 8.0×10 4 Pa or less, and even more preferably 5.0×10 4 Pa or less, especially Preferably, it is 3.0×10 4 Pa or less. In addition, in order to maintain flexibility at low temperatures, the storage elastic modulus of the adhesive sheet at 1Hz and -20°C is preferably 1.0×10 5 Pa or less, more preferably 7.0×10 4 Pa or less, and particularly preferably 5.5×10 Below 4 Pa.
再者,tanδ的最大值例如可使用TA Instruments公司製造的「Discovery HR-3」予以測定,儲藏彈性模數可藉由依據JIS K7244-6之方法予以測定。In addition, the maximum value of tanδ can be measured using "Discovery HR-3" manufactured by TA Instruments, for example, and the storage elastic modulus can be measured by a method based on JIS K7244-6.
[6.黏著片的製造方法] 本實施形態之黏著片的製造方法並無特別限定,例如可藉由如下方式進行。[6. Manufacturing method of adhesive sheet] The manufacturing method of the adhesive sheet of this embodiment is not specifically limited, For example, it can be carried out by the following method.
首先,混合(甲基)丙烯酸酯聚合物、異氰酸酯系交聯劑、及松香酯系黏著賦予性樹脂,視需要加入上述的添加劑。First, a (meth)acrylate polymer, an isocyanate cross-linking agent, and a rosin ester-based tackifying resin are mixed, and the above-mentioned additives are added as necessary.
(甲基)丙烯酸酯聚合物能夠藉由利用通常的自由基聚合法將構成聚合物之單體的混合物予以聚合而製造。(甲基)丙烯酸酯聚合物的聚合較佳為視需要使用聚合起始劑,藉由溶液聚合法來進行。作為聚合溶劑,例如可列舉:乙酸乙酯、乙酸正丁酯、乙酸異丁酯、甲苯、丙酮、己烷、甲基乙基酮等,亦可併用2種以上。(Meth)acrylate polymers can be produced by polymerizing a mixture of monomers constituting the polymer using a common radical polymerization method. The polymerization of the (meth)acrylate polymer is preferably carried out by a solution polymerization method using a polymerization initiator as necessary. Examples of the polymerization solvent include ethyl acetate, n-butyl acetate, isobutyl acetate, toluene, acetone, hexane, methyl ethyl ketone, and the like, and two or more types may be used in combination.
作為聚合起始劑,可列舉偶氮系化合物、有機過氧化物等,亦可併用2種以上。作為偶氮系化合物,例如可列舉:2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2-甲基丁腈)、1,1'-偶氮雙(環己烷1-甲腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2,4-二甲基-4-甲氧基戊腈)、2,2'-偶氮雙(2-甲基丙酸二甲酯)、4,4'-偶氮雙(4-氰基戊酸)、2,2'-偶氮雙(2-羥基甲基丙腈)、2,2'-偶氮雙[2-(2-咪唑啉-2-基)丙烷]等。Examples of the polymerization initiator include azo compounds, organic peroxides, and the like, and two or more types may be used in combination. Examples of azo compounds include: 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane) Alkane 1-carbonitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethyl-4-methoxypentane) nitrile), 2,2'-azobis(2-methylpropionic acid dimethyl ester), 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis(2 -hydroxymethylpropionitrile), 2,2'-azobis[2-(2-imidazolin-2-yl)propane], etc.
作為有機過氧化物,例如可列舉:過氧化苯甲醯、過氧化苯甲酸第三丁酯、過氧化氫異丙苯、過氧化二碳酸二異丙酯、過氧化二碳酸二正丙酯、過氧化二碳酸二(2-乙氧基乙基)酯、過氧化新癸酸第三丁酯、過氧化新戊酸第三丁酯、過氧化3,5,5-三甲基己醯、過氧化二丙醯、過氧化二乙醯等。Examples of organic peroxides include: benzoyl peroxide, tert-butyl peroxybenzoate, cumene hydroperoxide, diisopropyl peroxydicarbonate, di-n-propyl peroxydicarbonate, Di(2-ethoxyethyl) peroxydicarbonate, tert-butyl peroxyneodecanoate, tert-butyl peroxypivalate, 3,5,5-trimethylhexyl peroxide, Dipropyl peroxide, diethyl peroxide, etc.
再者,於上述聚合步驟中,能夠藉由調配2-巰基乙醇等鏈轉移劑,而調節所獲得之聚合物的重量平均分子量。Furthermore, in the above-mentioned polymerization step, the weight average molecular weight of the obtained polymer can be adjusted by formulating a chain transfer agent such as 2-mercaptoethanol.
於獲得(甲基)丙烯酸酯聚合物後,藉由對(甲基)丙烯酸酯聚合物的溶液添加異氰酸酯系交聯劑、松香酯系黏著賦予性樹脂、及視需要之添加劑及稀釋溶劑,並充分地予以混合,而獲得經溶劑稀釋之黏著性組成物(塗佈溶液)。After obtaining the (meth)acrylate polymer, add an isocyanate cross-linking agent, a rosin ester-based adhesive resin, and optional additives and diluting solvents to the solution of the (meth)acrylate polymer, and Mix thoroughly to obtain a solvent-diluted adhesive composition (coating solution).
再者,關於上述各成分中之任一種,於使用固體狀之情形時或者以未經稀釋之狀態與其他成分混合時會發生析出之情形時,亦可將此成分單獨預先溶解或稀釋於稀釋溶劑後,再與其他成分混合。Furthermore, when any of the above components is used in solid form or when it is mixed with other components in an undiluted state and precipitates, the component can be separately pre-dissolved or diluted in a diluted solution. Solvent before mixing with other ingredients.
作為上述稀釋溶劑,例如可使用:己烷、庚烷、環己烷等脂肪族烴、甲苯、二甲苯等芳香族烴、二氯化碳、氯化乙烯等鹵化烴、甲醇、乙醇、丙醇、丁醇、1-甲氧基-2-丙醇等醇、丙酮、甲基乙基酮、2-戊酮、異佛酮、環己酮等酮、乙酸乙酯、乙酸丁酯等酯、乙基溶纖劑等溶纖劑系溶劑等。As the dilution solvent, for example, aliphatic hydrocarbons such as hexane, heptane, and cyclohexane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as carbon dichloride and ethylene chloride, methanol, ethanol, and propanol can be used. , butanol, 1-methoxy-2-propanol and other alcohols, acetone, methyl ethyl ketone, 2-pentanone, isophorone, cyclohexanone and other ketones, ethyl acetate, butyl acetate and other esters, Cellosolve solvents such as ethyl cellosolve, etc.
作為如此製備之塗佈溶液的濃度、黏度,只要為能夠予以塗佈的範圍即可,可視狀況適當選擇。例如可將黏著性組成物的濃度稀釋至10質量%至60質量%。再者,當獲得塗佈溶液時,添加稀釋溶劑等並非必要條件,如果黏著性組成物為能夠進行塗佈之黏度等,亦可不添加稀釋溶劑。於此情形時,黏著性組成物即是將(甲基)丙烯酸酯聚合物的聚合溶劑直接作為稀釋溶劑之塗佈溶液。The concentration and viscosity of the coating solution thus prepared only need to be within a range that enables coating, and can be appropriately selected depending on the situation. For example, the concentration of the adhesive composition can be diluted to 10 mass% to 60 mass%. Furthermore, when obtaining the coating solution, it is not necessary to add a diluting solvent. If the adhesive composition has a viscosity that enables coating, the diluting solvent does not need to be added. In this case, the adhesive composition is a coating solution in which the polymerization solvent of the (meth)acrylate polymer is directly used as the diluting solvent.
上述的黏著性組成物的交聯通常可藉由加熱處理來進行。再者,該加熱處理亦可藉由乾燥處理附帶進行,該乾燥處理係使稀釋溶劑等從塗佈於所需對象物之黏著性組成物的塗膜揮發時所進行之處理。The above-mentioned cross-linking of the adhesive composition can usually be performed by heat treatment. Furthermore, the heat treatment may be performed incidentally by a drying treatment performed to volatilize a dilute solvent or the like from the coating film of the adhesive composition applied to the desired object.
加熱處理的加熱溫度較佳為50℃至150℃,更佳為70℃至120℃。另外,加熱時間例如較佳為10秒鐘至10分鐘,更佳為50秒鐘至2分鐘。The heating temperature of the heat treatment is preferably 50°C to 150°C, more preferably 70°C to 120°C. In addition, the heating time is preferably from 10 seconds to 10 minutes, for example, and more preferably from 50 seconds to 2 minutes.
亦可於加熱處理後,視需要在常溫(例如23℃及50%RH)設置1週至2週左右的熟化期。於需要此熟化期之情形時,係於熟化期過後再形成黏著片。另一方面,於無需熟化期之情形時,加熱處理完畢後即形成黏著片。After the heat treatment, a curing period of about 1 to 2 weeks can also be set at normal temperature (such as 23°C and 50%RH) as needed. When this curing period is required, the adhesive sheet will be formed after the curing period. On the other hand, when there is no need for a curing period, an adhesive sheet will be formed after the heat treatment is completed.
藉由上述的加熱處理(及熟化),使(甲基)丙烯酸酯聚合物經由異氰酸酯系交聯劑來充分地交聯以形成交聯結構,而獲得黏著片。Through the above-mentioned heat treatment (and aging), the (meth)acrylate polymer is fully cross-linked through the isocyanate-based cross-linking agent to form a cross-linked structure, and an adhesive sheet is obtained.
[7.黏著片積層體]
其次,對本實施形態之黏著片積層體予以說明。如圖1所示,本實施形態之黏著片積層體具備第1剝離片1、積層於該第1剝離片1上之黏著層2、及配置於該黏著層2上之第2剝離片3。第1剝離片1及第2剝離片3為公知的剝離片,至少一側具有剝離面。[7. Adhesive sheet laminate]
Next, the adhesive sheet laminate of this embodiment will be described. As shown in FIG. 1 , the adhesive sheet laminate of this embodiment includes a
該黏著片積層體例如可藉由如下方式製造。首先,從捲繞著第1剝離片1之抽出輥將第1剝離片1抽出。然後,於第1剝離片1的剝離面塗佈上述的黏著劑組成物的塗佈液,進行加熱處理將黏著劑組成物予以熱交聯,藉此形成黏著層2。該黏著層2相當於本發明的黏著片。其後,以覆蓋該黏著層2之方式貼附第2剝離片3。此時,使第2剝離片3的剝離面與黏著層2接觸。如此形成如圖1所示的黏著片積層體。The adhesive sheet laminate can be produced in the following manner, for example. First, the
[8.覆蓋膜] 經由上述的黏著片貼附於圖像顯示裝置之覆蓋膜並無特別限定,可採用公知的覆蓋膜。於覆蓋膜安裝上述黏著片之方法有多種。例如可藉由剝離上述的黏著片積層體的第1剝離片或第2剝離片後,將露出的黏著層轉印至覆蓋膜,而安裝於覆蓋膜。或者,亦可藉由在覆蓋膜的一面塗佈上述的黏著劑組成物的塗佈液,進行加熱處理將黏著劑組成物予以熱交聯,而形成黏著層(黏著片)。[8. Covering film] The cover film attached to the image display device via the above-mentioned adhesive sheet is not particularly limited, and a known cover film can be used. There are many ways to install the above adhesive sheet on the cover film. For example, the adhesive layer can be attached to the cover film by peeling off the first release sheet or the second release sheet of the adhesive sheet laminate and then transferring the exposed adhesive layer to the cover film. Alternatively, the adhesive layer (adhesive sheet) may be formed by applying the above-mentioned coating liquid of the adhesive composition on one side of the cover film and performing heat treatment to thermally cross-link the adhesive composition.
[9.特徵] 本發明的黏著片由於儲藏彈性模數低且含有松香酯系黏著性樹脂,因此將設置有該黏著片之覆蓋膜沿著具有屈曲部分之圖像顯示裝置予以貼附時,能夠藉由黏著片將因屈曲而用作於覆蓋膜之應力予以緩和。因此,能夠於覆蓋膜屈曲時防止發生包括裂痕在內之破裂或剝落。 [實施例][9.Features] Since the adhesive sheet of the present invention has a low storage elastic modulus and contains a rosin ester-based adhesive resin, when a cover film provided with the adhesive sheet is attached along an image display device having a curved portion, the adhesive sheet can The stress exerted on the covering film due to buckling is relaxed. Therefore, it is possible to prevent cracking or peeling including cracks from occurring when the cover film flexes. [Example]
其次,對本發明的實施例予以說明。其中,本發明並不限定於以下的實施例。Next, embodiments of the present invention will be described. However, the present invention is not limited to the following examples.
[1.實施例及比較例的製作] 準備實施例1至實施例7及比較例1至比較例4之黏著片。進而,藉由各黏著片將覆蓋膜貼附於對象膜,而製作如圖2所示的積層體。覆蓋膜及對象膜如下。 (1)覆蓋膜:厚度為100μm且於屈曲試驗中於R=3.0mm時不產生裂痕之丙烯酸樹脂膜 (2)對象膜:厚度為30μm的聚醯亞胺樹脂膜 再者,對象膜設想為作為覆蓋膜的貼附對象之圖像顯示裝置。[1. Preparation of Examples and Comparative Examples] Adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4 were prepared. Furthermore, the cover film was attached to the target film using each adhesive sheet, and a laminated body as shown in FIG. 2 was produced. Covering films and target films are as follows. (1) Covering film: an acrylic resin film with a thickness of 100 μm and no cracks when R=3.0mm in the buckling test (2) Target film: Polyimide resin film with a thickness of 30 μm Furthermore, the target film is assumed to be an image display device to which the cover film is attached.
實施例1至實施例7及比較例1至比較例4之黏著劑的組成如下所示。構成異氰酸酯系交聯劑之Coronate L-55E為Tosoh公司製造,BXX8515為東洋油墨公司製造,Duranate TPA-100為旭化成公司製造。另外,構成松香酯系黏著賦予性樹脂之Pinecrystal ME-GH為荒川化學工業股份有限公司製造。對於丙烯酸酯共聚物,揭示重量平均分子量及羥值。
[表1]
實施例1至實施例7及比較例1至比較例4之黏著片的物性值如下所示。The physical property values of the adhesive sheets of Examples 1 to 7 and Comparative Examples 1 to 4 are as follows.
黏著片的儲藏彈性模數及損耗正切tanδ的測定係使用TA Instruments公司製造的「Discovery HR-3」來進行。測定條件如下所示。 (測定條件) 測定模式:剪切模式 變形率:0.1% 測定頻率:1Hz 測定溫度:-60℃至25℃(以5℃/min予以升溫) 測定樣品:重疊各黏著片的黏著層,使總厚度成為約1mm並予以測定。The storage elastic modulus and loss tangent tan δ of the adhesive sheet were measured using "Discovery HR-3" manufactured by TA Instruments. The measurement conditions are as follows. (Measurement conditions) Measurement mode: Cut mode Deformation rate: 0.1% Measuring frequency: 1Hz Measuring temperature: -60℃ to 25℃ (heating at 5℃/min) Measurement sample: The adhesive layers of each adhesive sheet are stacked so that the total thickness becomes approximately 1 mm and measured.
[表2]
另外,對於各黏著片,以玻璃/黏著片/PET膜積層構成來測定全光線透射率及霧度率。依據JIS K7136-1測定全光線透射率,依據JIS K7136測定霧度的結果如表3所示。In addition, for each adhesive sheet, the total light transmittance and haze rate were measured using a laminated structure of glass/adhesive sheet/PET film. The total light transmittance was measured in accordance with JIS K7136-1 and the haze was measured in accordance with JIS K7136. The results are shown in Table 3.
進而,對使用有各黏著片之圖2所示的積層體進行屈曲試驗。屈曲試驗係使用圖3所示的無負荷U字試驗機。該試驗機具有能夠旋轉的2塊可動板,以可動板的旋轉軸成為平行的方式讓旋轉軸彼此靠近配置。然後,於圖3中的(a)所示的水平狀態的可動板上配置作為樣品片的積層體。此時,以積層體的覆蓋膜面與可動板接觸的方式配置積層體。繼而,如圖3中的(b)所示,藉由使兩可動板旋轉90度,使樣品片屈曲成U字形。於常溫下,以0.85秒/次的試驗速度反覆進行這種屈曲。然後,於試驗後確認樣品片的覆蓋膜是否產生裂痕,並根據以下的(1)至(3)的基準評價耐屈曲性。以樣品片的屈曲半徑R成為2.5mm及3.0mm的方式實施試驗,試驗出結果是否屬如下(1)至(3)的某一個。
(1)於R=2.5mm及屈曲次數為10萬次以上的條件下未產生裂痕(R=2.5mm、無裂痕);
(2)於R=2.5mm及屈曲次數未達10萬次的條件下產生了裂痕,但於R=3.0mm及屈曲次數10萬次以上的條件下未產生裂痕(R=3.0mm、無裂痕);
(3)於R=3.0mm及屈曲次數未達10萬次的條件下產生了裂痕(R=3.0mm、產生裂痕)
[表3]
根據表3,實施例1至實施例7於R=2.5mm或3.0mm及屈曲次數10萬次以上的條件下於覆蓋膜未產生裂痕,而比較例1至比較例4於R=3.0mm及屈曲次數未達10萬次的條件下產生了裂痕。於實施例6中,於R=2.5mm及屈曲次數未達10萬次的條件下產生了裂痕,但認為此情況的原因在於松香酯系黏著賦予性樹脂的含量少。According to Table 3, Examples 1 to 7 did not produce cracks in the covering film under the conditions of R = 2.5 mm or 3.0 mm and the number of buckling times of more than 100,000 times, while Comparative Examples 1 to 4 did not produce cracks in the covering film under the conditions of R = 3.0 mm and flexion times of more than 100,000 times. Cracks occurred under the condition that the number of buckling times did not reach 100,000 times. In Example 6, cracks occurred under the conditions of R = 2.5 mm and the number of buckling times less than 100,000 times. However, it is believed that the reason for this is that the content of the rosin ester-based adhesive-imparting resin is small.
認為比較例1至比較例4由於25℃儲藏彈性模數均高,故而耐屈曲性能低。再者,認為比較例2由於如上所述儲藏彈性模數高,故而即使含有松香酯系黏著賦予性樹脂,耐屈曲性能仍低。It is considered that Comparative Examples 1 to 4 have low buckling resistance due to their high storage elastic modulus at 25°C. Furthermore, it is considered that Comparative Example 2 has low flexural resistance even if it contains a rosin ester-based tackifier-imparting resin because the storage elastic modulus is high as described above.
1:第1剝離片 2:黏著片(黏著層) 3:第2剝離片1: 1st peeling piece 2: Adhesive sheet (adhesive layer) 3: 2nd peeling piece
[圖1]係本發明的一實施形態的黏著片積層體之剖視圖。 [圖2]係用於屈曲試驗之試驗片的剖視圖。 [圖3]係顯示屈曲試驗的方法之圖。[Fig. 1] is a cross-sectional view of an adhesive sheet laminate according to an embodiment of the present invention. [Figure 2] is a cross-sectional view of the test piece used for the buckling test. [Fig. 3] is a diagram showing the buckling test method.
1:第1剝離片 1: 1st peeling piece
2:黏著片(黏著層) 2: Adhesive sheet (adhesive layer)
3:第2剝離片 3: 2nd peeling piece
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