TWI817785B - Light detecting component and detecting panel - Google Patents

Light detecting component and detecting panel Download PDF

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TWI817785B
TWI817785B TW111140285A TW111140285A TWI817785B TW I817785 B TWI817785 B TW I817785B TW 111140285 A TW111140285 A TW 111140285A TW 111140285 A TW111140285 A TW 111140285A TW I817785 B TWI817785 B TW I817785B
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sensing
light
voltage
signal line
period
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TW111140285A
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TW202418562A (en
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謝宗賢
黃正義
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友達光電股份有限公司
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Abstract

A light detecting component and a detecting panel including a plurality of light detecting components are provided. The light detecting component includes a light detecting circuit, a detecting transistor, and a reading transistor. In a luminance duration, the light detecting circuit detects a luminance strength, and a voltage of a detecting terminal is changed according to the luminance strength. In a luminance strength detecting duration, the detecting transistor changes a voltage of a luminance strength detecting signal in response to the voltage of the detecting terminal. In a compensation duration, a voltage of a main scan line is selectively changed with the voltage of a luminance strength detecting signal. In a reading duration, the reading transistor is conducted according to a pulse of the main scan line so that a reading line reflects the voltage of the detecting terminal. The luminance strength detecting duration is later than the luminance duration, the compensation duration is later than the luminance strength detecting duration, and the reading duration is later than the compensation duration.

Description

光感測元件與感測面板 Light sensing components and sensing panels

本發明是有關於一種光感測元件與感測面板,且特別是有關於一種具光照補償功能的光感測元件與感測面板。 The present invention relates to a light sensing element and a sensing panel, and in particular, to a light sensing element and a sensing panel with illumination compensation function.

隨著數位技術的演進,X光診斷拍攝亦已進步至數位方式。請參見第1圖,其係對受測者進行X光拍攝的光感測系統之示意圖。光感測系統10包含:光源11、控制器15、顯示面板17與感測面板13。進行拍攝時,受測者14位於感測面板13前,且光源11發出X光。在受測者14身後的感測面板13包含多個排列為陣列的光感測元件(light sensing unit)。隨著人體組織的分布,光感測元件的受光強度也不完全相同。接著,再由控制器15讀出光感測元件經過光照影響後的電路特性,搭配影像處理的方式,轉換為圖像資料imgDAT。控制器15將圖像資料imgDAT傳送至顯示面板17後,使用者便可以在顯示面板上17觀看影像。 With the evolution of digital technology, X-ray diagnostic photography has also advanced to digital methods. Please refer to Figure 1, which is a schematic diagram of the light sensing system for taking X-ray shots of a subject. The light sensing system 10 includes: a light source 11, a controller 15, a display panel 17 and a sensing panel 13. When taking pictures, the subject 14 is located in front of the sensing panel 13, and the light source 11 emits X-rays. The sensing panel 13 behind the subject 14 includes a plurality of light sensing units (light sensing units) arranged in an array. With the distribution of human tissue, the light intensity of the light sensing elements is not exactly the same. Then, the controller 15 reads the circuit characteristics of the light sensing element after being affected by light, and converts it into image data imgDAT using an image processing method. After the controller 15 transmits the image data imgDAT to the display panel 17 , the user can view the image on the display panel 17 .

請參見第2圖,其係感測面板上的光感測元件之示意圖。為便於說明,本文以座標格式代表光感測元件的位置。此處假設感測面板13包含排列為M行與N列的光感測元件lgtSU(1,1)~lgtSU(M,N)。其中,M、N為 正整數。光感測元件lgtSU(1,1)~lgtSU(M,1)位於第一列,沿x軸方向排列;感測元件lgtSU(1,1)~lgtSU(1,N)位於第一行,沿y軸方向排列。 Please refer to Figure 2, which is a schematic diagram of the light sensing element on the sensing panel. For ease of explanation, this article represents the position of the light sensing element in coordinate format. It is assumed here that the sensing panel 13 includes light sensing elements lgtSU(1,1)˜lgtSU(M,N) arranged in M rows and N columns. Among them, M and N are Positive integer. The light sensing elements lgtSU(1,1)~lgtSU(M,1) are located in the first column, arranged along the x-axis direction; the sensing elements lgtSU(1,1)~lgtSU(1,N) are located in the first row, arranged along the arranged in the y-axis direction.

隨著受測者14的身體組織分布的不同,對光源11產生之光照的阻擋強度也不同,連帶的,光感測元件lgtSU(1,1)~lgtSU(M,N)的受光強度也不同。若光感測元件lgtSU(1,1)~lgtSU(M,N)發生過曝情況時,光感測元件lgtSU(1,1)~lgtSU(M,N)內部的漏電流將變大,進而影響圖像資料imgDAT的正確性。 As the body tissue distribution of the subject 14 is different, the blocking intensity of the light generated by the light source 11 is also different, and the light receiving intensity of the light sensing elements lgtSU(1,1)~lgtSU(M,N) is also different. . If the light sensing elements lgtSU(1,1)~lgtSU(M,N) are overexposed, the leakage current inside the light sensing elements lgtSU(1,1)~lgtSU(M,N) will increase, and then Affects the correctness of image data imgDAT.

為便於說明,本文假設基於圖像資料imgDAT所還原的影像包含M*N個像素PXL(1,1)~PXL(M,N),即,每個像素PXL(1,1)~PXL(M,N)對應於一個光感測元件lgtSU(1,1)~lgtSU(M,N)的感測結果。 For the convenience of explanation, this article assumes that the image restored based on the image data imgDAT contains M*N pixels PXL(1,1)~PXL(M,N), that is, each pixel PXL(1,1)~PXL(M ,N) corresponds to the sensing result of a light sensing element lgtSU(1,1)~lgtSU(M,N).

請參見第3圖,其係當感測面板前方的某個區塊過曝時,在理想狀態下,顯示面板基於圖像資料imgDAT所還原的影像之示意圖。理想情況下,當位於感測面板13前方的某個區塊(例如,光感測元件lgtSU(X1,Y1)~lgtSU(X2,Y2)對應的範圍),X光的光線穿透組織物的比例較高時,顯示面板17根據圖像資料imgDAT所顯示的影像23應呈現空白區塊23a的外觀。此處假設空白區塊23a涵蓋P*Q個位於第X1~X2行(共P行)、第Y1~Y2列(共Q列)的像素PXL(X1,Y1)~PXL(X2,Y2)。 Please refer to Figure 3, which is a schematic diagram of the image restored by the display panel based on the image data imgDAT under ideal conditions when a certain area in front of the sensing panel is overexposed. Ideally, when a certain area is located in front of the sensing panel 13 (for example, the range corresponding to the light sensing elements lgtSU (X1, Y1) ~ lgtSU (X2, Y2)), the X-ray light penetrates the tissue When the ratio is higher, the image 23 displayed by the display panel 17 according to the image data imgDAT should appear as a blank area 23a. It is assumed here that the blank area 23a covers P*Q pixels PXL(X1, Y1)~PXL(X2, Y2) located in rows X1~X2 (P rows in total) and columns Y1~Y2 (Q columns in total).

請參見第4A圖,其係當感測面板前方的某個區塊過曝而出現漏電流現象時,習用技術基於圖像資料而顯示的影像中,有部分區域的亮度受干擾之示意圖。比較第3、4A圖可以看出,根據習用技術的作法,若感測面板13前方,對應於空白區塊23a位置因受測者14的組織物分布較易被光線穿透時,與此範圍對應位置的光感測元件lgtSU(X1,Y1)~lgtSU(X2,Y2)可 能呈現漏電流變大的情況。隨著光感測元件lgtSU(X1,Y1)~lgtSU(X2,Y2)的漏電流變大的影響,控制器15無法自光感測元件lgtSU(X1,1)~lgtSU(X2,Y-1)獲得準確的圖像資料imgDAT,使第4A圖所示之影像25包含空白區塊25a與受干擾區塊25c。即,除了真正存在過曝現象所對應之範圍的光感測元件外,其他位於同樣行數(X1~X2行)但不同列數(第1~(Y1-1)列)的光感測元件,雖然未發生過曝現象,但其產生的感測結果仍然受到漏電流的影響。連帶的,使用從影像25上,將看到受干擾區塊25c的亮度有誤。 Please refer to Figure 4A, which is a schematic diagram showing that when a certain area in front of the sensing panel is overexposed and leakage current occurs, the brightness of some areas in the image displayed based on the image data using conventional technology is disturbed. Comparing Figures 3 and 4A, it can be seen that according to conventional technology, if the position in front of the sensing panel 13 corresponding to the blank area 23a is more easily penetrated by light due to the tissue distribution of the subject 14, this range The light sensing elements lgtSU(X1,Y1)~lgtSU(X2,Y2) at the corresponding position can The leakage current may become larger. As the leakage current of the light sensing elements lgtSU(X1,Y1)~lgtSU(X2,Y2) becomes larger, the controller 15 cannot ) to obtain accurate image data imgDAT, so that the image 25 shown in Figure 4A includes a blank block 25a and a disturbed block 25c. That is, in addition to the light sensing elements in the range corresponding to the actual overexposure phenomenon, other light sensing elements located in the same number of rows (rows X1~X2) but different numbers of columns (columns 1~(Y1-1)) , although overexposure does not occur, the sensing results produced are still affected by leakage current. Connectedly, using the slave image 25, one will see that the brightness of the disturbed area 25c is incorrect.

請參見第4B圖,其係習用技術採用降低光感測元件之靈敏度的做法,改善第4A圖之影像的示意圖。為避免光感測元件lgtSU(X1,Y1)~lgtSU(X2,Y2)產生漏電流而影響其他光感測元件的感測結果,習用技術的作法為,降低光感測元件的靈敏度。採用降低光感測元件之靈敏度的做法時,光感測元件lgtSU(X1,Y1)~lgtSU(X2,Y2)較不容易因為光線過曝而產生漏電流。惟,此種作法雖然可以改善影像27中過曝區域27a光照過強(過度曝光)的現象,但使非過曝區域27c與其他區域都變得更暗。甚至,還會使過曝區塊27a的細節無法呈現。因此,如何能在改善過曝現象的同時,維持影像的成像效果,仍有待改善。 Please refer to Figure 4B, which is a schematic diagram of improving the image in Figure 4A by reducing the sensitivity of the light sensing element in conventional technology. In order to prevent the light sensing elements lgtSU(X1,Y1)~lgtSU(X2,Y2) from generating leakage current and affecting the sensing results of other light sensing elements, a common technical approach is to reduce the sensitivity of the light sensing elements. When the sensitivity of the light sensing elements is reduced, the light sensing elements lgtSU(X1,Y1)~lgtSU(X2,Y2) are less likely to generate leakage current due to overexposure to light. However, although this approach can improve the phenomenon of excessive light (overexposure) in the overexposed area 27a in the image 27, it makes the non-overexposed area 27c and other areas darker. Even the details of the overexposed area 27a will not be presented. Therefore, how to improve the overexposure phenomenon while maintaining the imaging effect of the image still needs to be improved.

本發明係有關於一種光感測元件與感測面板。光感測元件包含主動感測部分與被動讀取部分。主動感測部分為一感測電晶體,用於在被動讀取進行前,預先對光感測元件的光照強度進行感測。之後,再依據感測結果而選擇是否在進行被動讀取前,透過改變主要掃描信號線之 電壓,達到補償資料讀取信號線之效果的方式,避免光感測元件因為過度曝光而產生漏電流,進而改善因漏電流所引起的偽影現象。 The invention relates to a light sensing element and a sensing panel. The light sensing element includes an active sensing part and a passive reading part. The active sensing part is a sensing transistor, which is used to sense the light intensity of the light sensing element in advance before passive reading. After that, based on the sensing results, it is selected whether to change the main scanning signal line before performing passive reading. The voltage is used to compensate for the effect of the data reading signal line, preventing the light sensing element from generating leakage current due to overexposure, thereby improving the artifacts caused by leakage current.

根據本發明之第一方面,提出一種光感測元件。光感測元件,電連接於資料讀取信號線、光強度感測信號線、主要掃描信號線與輔助掃描信號線。光感測元件包含:感光電路、感測電晶體與讀取電晶體。感光電路電連接於感測端點與輔助掃描信號線。感光電路於光照期間感測光照強度使感測端點的電壓隨著光照強度而改變。感測電晶體電連接於該感測端點與光強度感測信號線。感測電晶體於光強度感測期間因應感測端點的電壓而改變光強度感測信號線的電壓。主要掃描信號線的電壓於補償期間,因應光強度感測信號線的電壓而選擇性改變。讀取電晶體電連接於感測端點、資料讀取信號線與主要掃描信號線。讀取電晶體於讀取期間根據主要掃描信號線的脈波而導通,進而使資料讀取信號線反映感測端點的電壓。光強度感測期間晚於光照期間、補償期間晚於光強度感測期間,且讀取期間晚於補償期間。 According to a first aspect of the present invention, a light sensing element is provided. The light sensing element is electrically connected to the data reading signal line, the light intensity sensing signal line, the main scanning signal line and the auxiliary scanning signal line. The light sensing element includes: photosensitive circuit, sensing transistor and reading transistor. The photosensitive circuit is electrically connected to the sensing terminal and the auxiliary scanning signal line. The photosensitive circuit senses light intensity during illumination so that the voltage at the sensing terminal changes with the light intensity. The sensing transistor is electrically connected to the sensing terminal and the light intensity sensing signal line. The sensing transistor changes the voltage of the light intensity sensing signal line in response to the voltage of the sensing terminal during the light intensity sensing period. The voltage of the main scanning signal line is selectively changed in response to the voltage of the light intensity sensing signal line during the compensation period. The reading transistor is electrically connected to the sensing terminal, the data reading signal line and the main scanning signal line. The reading transistor is turned on according to the pulse wave of the main scanning signal line during reading, so that the data reading signal line reflects the voltage of the sensing endpoint. The light intensity sensing period is later than the illumination period, the compensation period is later than the light intensity sensing period, and the reading period is later than the compensation period.

根據本發明之第二方面,提出一種電連接於控制器的感測面板。感測面板包含:排列為M行與N列的複數個光感測元件。該等光感測元件包含前述光感測元件。控制器根據資料讀取信號線在讀取期間的電壓而產生與光感測元件對應之圖像資料。 According to a second aspect of the present invention, a sensing panel electrically connected to a controller is provided. The sensing panel includes: a plurality of light sensing elements arranged in M rows and N columns. The light sensing elements include the aforementioned light sensing elements. The controller generates image data corresponding to the light sensing element according to the voltage of the data reading signal line during reading.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下: In order to have a better understanding of the above and other aspects of the present invention, examples are given below and are described in detail with reference to the accompanying drawings:

10,3:光感測系統 10,3:Light sensing system

11,33:光源 11,33:Light source

13,311:感測面板 13,311: Sensing panel

14:受測者 14: Subject

15,315,43,515:控制器 15,315,43,515:Controller

17,37:顯示面板 17,37:Display panel

imgDAT:圖像資料 imgDAT: image data

lgtSU(1,1),lgtSU(M,1),lgtSU(1,N),lgtSU(M,N),lgtSU(m,n),lgtSU(m,1),lgtSU(m,2),lgtSU(m,3),lgtSU(m,4):光感測元件 lgtSU(1,1),lgtSU(M,1),lgtSU(1,N),lgtSU(M,N),lgtSU(m,n),lgtSU(m,1),lgtSU(m,2),lgtSU (m,3),lgtSU(m,4): light sensing element

23,25,27:影像 23,25,27:Image

23a,25a:空白區塊 23a,25a: Blank block

25c:干擾區塊 25c: Interference block

27a:過曝區域 27a: Overexposed area

27c:非過曝區域 27c: non-overexposed area

31:光感測裝置 31:Light sensing device

319a:主要選取電路 319a: Main selection circuit

319c:輔助選取電路 319c: Auxiliary selection circuit

313:圖像讀取電路 313:Image reading circuit

317:光強度感測電路 317:Light intensity sensing circuit

38:偏壓電路 38: Bias circuit

lgtctlS:光源控制信號 lgtctlS: light source control signal

rdDAT_d[1]~rdDAT_d[M],rdDAT_d[m]:數位讀取信號 rdDAT_d[1]~rdDAT_d[M],rdDAT_d[m]: digital read signal

mctlS,ectlS:列選取控制信號 mctlS,ectlS: column selection control signal

mSR[1],mSR[N],mSR[n],mSR[2],mSR[3],mSR[4]:主要掃描信號 mSR[1],mSR[N],mSR[n],mSR[2],mSR[3],mSR[4]: main scanning signal

eSR[1],eSR[N],eSR[n],eSR[2],eSR[3],eSR[4]:輔助掃描信號 eSR[1],eSR[N],eSR[n],eSR[2],eSR[3],eSR[4]: auxiliary scanning signal

Vbs:偏壓信號(線) Vbs: bias signal (line)

expDET[1],expDET[M],expDET[m]:光強度感測信號 expDET[1],expDET[M],expDET[m]: light intensity sensing signal

bsES:偏壓致能信號 bsES: bias enable signal

expDET_d[1]~expDET_d[M],expDET_d[m]:數位感測信號 expDET_d[1]~expDET_d[M],expDET_d[m]: digital sensing signal

T1(m,n):讀取電晶體 T1(m,n): read transistor

Np(m,n),Np(m,1),Np(m,2),Np(m,3),Np(m,4):感測端點 Np(m,n),Np(m,1),Np(m,2),Np(m,3),Np(m,4): sensing endpoint

D(m,n):光電二極體 D(m,n): photodiode

T2(m,n),T2(m,1),T2(m,2),T2(m,3),T2(m,4):感測電晶體 T2(m,n),T2(m,1),T2(m,2),T2(m,3),T2(m,4): sensing transistor

C(m,n):電容 C(m,n): capacitance

Nbs:偏壓端點 Nbs: bias endpoint

413:讀取電路 413:Reading circuit

413a,513a:積分器 413a, 513a: Integrator

413c,45a,513c:類比數位轉換器 413c, 45a, 513c: Analog to digital converter

rdDAT[m]:資料讀取信號 rdDAT[m]: data reading signal

rdDAT_a[m]:類比積分讀取信號 rdDAT_a[m]: Analog integral reading signal

T[m]:分壓電晶體 T[m]: voltage divider transistor

Vss:接地電壓 Vss: ground voltage

45:光強度感測電路 45:Light intensity sensing circuit

eqR(m,1),eqR(m,2),eqR(m,3),eqR(m,4):等效電阻 eqR(m,1),eqR(m,2),eqR(m,3),eqR(m,4): equivalent resistance

eqRT[m]:分壓等效電阻 eqR T [m]: voltage divider equivalent resistance

Tucyc:元件感測期間 Tucyc : component sensing period

uT_m1:元件重置期間 uT_m1: During component reset

uT_m2:元件光照期間 uT_m2: component lighting period

uT_m3:元件光強度感測期間 uT_m3: During component light intensity sensing

uT_m4:元件補償期間 uT_m4: component compensation period

uT_m5:元件讀取期間 uT_m5: During component reading

Tmp:主要掃描脈波的脈波寬度 Tmp: Pulse width of main scanning pulse wave

Vmp:主要掃描脈波的電壓幅度 Vmp: the voltage amplitude of the main scanning pulse wave

Tep:輔助掃描脈波的脈波寬度 Tep: Pulse width of auxiliary scanning pulse wave

Vrs:重置電壓 Vrs: reset voltage

Vep:輔助掃描脈波的電壓幅度 Vep: voltage amplitude of auxiliary scanning pulse wave

△Vdrp:下拉電壓幅度 △Vdrp: pull-down voltage amplitude

t1~t7:時點 t1~t7: time point

Vexp(m,n):光感測元件lgtSU(m,n)的感測電壓 Vexp(m,n): Sensing voltage of light sensing element lgtSU(m,n)

Vrd(m,n):光感測元件lgtSU(m,n)的讀取電壓 Vrd(m,n): read voltage of light sensing element lgtSU(m,n)

Tcyc[x]:第x次感測的感測期間 T cyc [x]: sensing period of the xth sensing

Tcyc[x+1]:第(x+1)次感測的感測期間 T cyc [x+1]: sensing period of the (x+1)th sensing

pT_m1:面板重置期間 pT_m1: During panel reset

pT_m2:面板光照期間 pT_m2: panel lighting period

pT_m3:面板光強度感測期間 pT_m3: Panel light intensity sensing period

pT_m4:面板補償期間 pT_m4: Panel compensation period

pT_m5:面板讀取期間 pT_m5: During panel reading

△t1,△t2,△t3,△t4:數位感測期間 △t1, △t2, △t3, △t4: digital sensing period

△t5,△t6,△t7,△t8:數位讀取期間 △t5, △t6, △t7, △t8: Digital reading period

53:多工器 53:Multiplexer

fsS[m]:功能選取信號 fsS[m]: function selection signal

Mn:NMOS電晶體 Mn:NMOS transistor

Mp:PMOS電晶體 Mp: PMOS transistor

513:光強度感測暨圖像讀取電路 513: Light intensity sensing and image reading circuit

selDAT[m]:資料選取信號 selDAT[m]: data selection signal

selDAT_a[m]:類比資料選取信號 selDAT_a[m]: analog data selection signal

selDAT_d[m]:數位資料選取信號 selDAT_d[m]: digital data selection signal

第1圖,其係對受測者進行X光拍攝的光感測系統之示意圖;第2圖,其係感測面板上的光感測元件之示意圖;第3圖,其係當感測面板前方的某個區塊過曝時,在理想狀態下,顯示面板基於圖像資料imgDAT所還原的影像之示意圖;第4A圖,其係當感測面板前方的某個區塊過曝而出現漏電流現象時,習用技術基於圖像資料而顯示的影像中,有部分區域的亮度受干擾之示意圖;第4B圖,其係習用技術採用降低光感測元件之靈敏度的做法,改善第4A圖之影像的示意圖;第5圖,其係根據本揭露構想之光感測系統的方塊圖;第6圖,其係根據本揭露構想之光感測元件lgtSU(m,n)的內部元件之示意圖;第7圖,其係光感測元件lgtSU(m,n)中的讀取電晶體T1(m,n)的導通電流Ids和閘極-源極壓差Vgs的關係圖;第8圖,其係控制器搭配類比數位轉換器和讀取電路,對同樣位於第m行的光感測元件lgtSU(m,1)~lgtSU(m,4)進行感測和讀取之示意圖;第9A、9B、9C圖,其係因光感測元件lgtSU(m,1)~lgtSU(m,4)內的感測電晶體T2(m,1)~T2(m,4)之連接關係表示為彼此並聯之等效電阻eqR(m,1)~eqR(m,4)的示意圖;第10圖,其係光感測元件lgtSU(m,n)在未過曝與過曝的情況下,與光感測元件lgtSU(m,n)相關的控制信號的波形圖;第11圖,其係採用第8圖架構時,與光感測元件lgtSU(m,1)~lgtSU(m,4) 對應之控制信號的波形圖;以及第12圖,其係搭配多工器的使用,將感測電路與讀取電路結合之示意圖。 Figure 1 is a schematic diagram of the light sensing system that performs When a certain area in the front is overexposed, under ideal conditions, the display panel restores the image based on the image data imgDAT; Figure 4A shows when a certain area in front of the sensing panel is overexposed and leakage occurs. When the current phenomenon occurs, the brightness of some areas in the image displayed based on the image data is disturbed by the conventional technology. Figure 4B shows that the conventional technology adopts the method of reducing the sensitivity of the light sensing element to improve the brightness of the image in Figure 4A. A schematic diagram of the image; Figure 5, which is a block diagram of the light sensing system according to the concept of the present disclosure; Figure 6, which is a schematic diagram of the internal components of the light sensing element lgtSU(m,n) based on the concept of the present disclosure; Figure 7, which is the relationship between the on-current Ids and the gate-source voltage difference Vgs of the reading transistor T1(m,n) in the light sensing element lgtSU(m,n); Figure 8, which Schematic diagram of the controller, coupled with an analog-to-digital converter and a reading circuit, sensing and reading the light sensing elements lgtSU(m,1)~lgtSU(m,4) also located in the mth row; 9A and 9B , Figure 9C, which is because the connection relationship of the sensing transistors T2(m,1)~T2(m,4) in the light sensing elements lgtSU(m,1)~lgtSU(m,4) is expressed as parallel connection with each other. The schematic diagram of the equivalent resistance eqR(m,1)~eqR(m,4); Figure 10, which is the light sensing element lgtSU(m,n) without overexposure and overexposure, and the light sensor The waveform diagram of the control signal related to the sensing element lgtSU(m,n); Figure 11, which is based on the structure of Figure 8, and the light sensing element lgtSU(m,1)~lgtSU(m,4) The waveform diagram of the corresponding control signal; and Figure 12, which is a schematic diagram of combining the sensing circuit and the reading circuit using a multiplexer.

為改善習用技術的問題,本揭露提供一種光感測元件與感測面板,可避免受過曝所引起之漏電流的現象。藉由抑制漏電流的發生,控制器根據感測面板而產生的影像資料將不會失真。因此,顯示面板在顯示影像資料時,並不會產生因為感測面板在接收光照時的某個區域過亮,而連帶影響其他區域之顯示效果的情形。 In order to improve the problems of conventional technologies, the present disclosure provides a light sensing element and a sensing panel that can avoid leakage current caused by overexposure. By suppressing the occurrence of leakage current, the image data generated by the controller based on the sensing panel will not be distorted. Therefore, when the display panel displays image data, there will not be a situation where a certain area of the sensing panel is too bright when receiving light, thereby affecting the display effect of other areas.

請參見第5圖,其係根據本揭露構想之光感測系統的方塊圖。光感測系統3包含:光源33、光感測裝置31與顯示面板37。此處簡要介紹各元件的連接關係,以及彼此間傳送的信號。關於信號的產生時點與用途等,將於後續的圖式說明。此外,在本文中,以相同的符號代表信號,以及傳送該信號的信號線。例如,以Vbs同時代表偏壓信號與偏壓信號線。 Please refer to Figure 5, which is a block diagram of a light sensing system conceived according to the present disclosure. The light sensing system 3 includes: a light source 33 , a light sensing device 31 and a display panel 37 . Here is a brief introduction to the connection relationships of each component and the signals transmitted between them. The timing and usage of the signal will be explained in the following diagrams. Furthermore, in this document, the same symbol is used to represent a signal, as well as a signal line carrying the signal. For example, Vbs represents both the bias signal and the bias signal line.

光感測裝置31包含:控制器315、圖像讀取電路313、感測面板311、光強度感測電路317、偏壓電路38、主要選取電路319a與輔助選取電路319c。實際應用時,可將控制器315、圖像讀取電路313、光強度感測電路317、偏壓電路38、主要選取電路319a與輔助選取電路319c整合於一控制電路。為便於說明,此處假設顯示面板37包含M*N個像素,且感測面板311包含M*N個光感測元件lgtSU(1,1)~lgtSU(M,N)。實際應用時,顯示面板37包含的像素數量,與感測面板311包含的光感測元件的數量可能相等或不等。 The light sensing device 31 includes: a controller 315, an image reading circuit 313, a sensing panel 311, a light intensity sensing circuit 317, a bias circuit 38, a main selection circuit 319a and an auxiliary selection circuit 319c. In practical applications, the controller 315, the image reading circuit 313, the light intensity sensing circuit 317, the bias circuit 38, the main selection circuit 319a and the auxiliary selection circuit 319c can be integrated into one control circuit. For ease of explanation, it is assumed here that the display panel 37 includes M*N pixels, and the sensing panel 311 includes M*N light sensing elements lgtSU(1,1)˜lgtSU(M,N). In actual application, the number of pixels included in the display panel 37 may be equal to or different from the number of light sensing elements included in the sensing panel 311 .

控制器315電連接於光源33、圖像讀取電路313、光強度感測電路317、偏壓電路38、主要選取電路319a與輔助選取電路319c。顯示面板 37電連接於圖像讀取電路313、光強度感測電路317、偏壓電路38、主要選取電路319a與輔助選取電路319c。 The controller 315 is electrically connected to the light source 33, the image reading circuit 313, the light intensity sensing circuit 317, the bias circuit 38, the main selection circuit 319a and the auxiliary selection circuit 319c. display panel 37 is electrically connected to the image reading circuit 313, the light intensity sensing circuit 317, the bias circuit 38, the main selection circuit 319a and the auxiliary selection circuit 319c.

控制器315傳送光源控制信號lgtctlS至光源33,用以控制光源33發光或停止發光。此外,控制器315產生影像資訊imgDAT至顯示面板37,供顯示面板37顯示受測影像。控制器315將列選取控制信號mctlS、ectlS傳送至主要選取電路319a、輔助選取電路319c;以及,傳送偏壓致能信號bsES至偏壓電路38。 The controller 315 sends the light source control signal lgtctls to the light source 33 to control the light source 33 to emit light or stop emitting light. In addition, the controller 315 generates image information imgDAT to the display panel 37 for the display panel 37 to display the measured image. The controller 315 transmits the column selection control signals mctlS and ectlS to the main selection circuit 319a and the auxiliary selection circuit 319c; and transmits the bias enable signal bsES to the bias circuit 38.

主要選取電路319a根據列選取控制信號mctlS而產生主要掃描信號msR[1]~msR[N]至感測面板311。輔助選取電路319c根據列選取控制信號ectlS而產生輔助掃描信號eSR[1]~eSR[N]至感測面板311。偏壓電路38根據偏壓致能信號bsES而調整傳送至感測面板31的偏壓信號Vbs。感測面板311因應主要掃描信號msR[1]~msR[N]、輔助掃描信號eSR[1]~eSR[N]與偏壓信號Vbs的改變,產生資料讀取信號rdDAT[1]~rdDAT[M]至圖像讀取電路313;以及,產生光強度感測信號expDET[1]~expDET[M]至光強度感測電路317。 The main selection circuit 319a generates main scanning signals msR[1]~msR[N] to the sensing panel 311 according to the column selection control signal mctlS. The auxiliary selection circuit 319c generates auxiliary scanning signals eSR[1]~eSR[N] to the sensing panel 311 according to the column selection control signal ectlS. The bias circuit 38 adjusts the bias signal Vbs transmitted to the sensing panel 31 according to the bias enable signal bsES. The sensing panel 311 generates data reading signals rdDAT[1]~rdDAT[ in response to changes in the main scanning signals msR[1]~msR[N], the auxiliary scanning signals eSR[1]~eSR[N], and the bias signal Vbs. M] to the image reading circuit 313; and, generate light intensity sensing signals expDET[1]~expDET[M] to the light intensity sensing circuit 317.

光強度感測電路317將光強度感測信號expDET[1]~expDET[M]轉換為數位感測信號expDET_d[1]~expDET_d[M]後,將數位感測信號expDET_d[1]~expDET_d[M]後傳送至控制器315。其中,控制器315根據數位感測信號expDET_d[1]~expDET_d[M]而動態決定是否調整列選取控制信號mctlS的格式,進而使主要選取電路319a改變主要掃描信號mSR[1]~mSR[N]的電壓。 After the light intensity sensing circuit 317 converts the light intensity sensing signals expDET[1]~expDET[M] into digital sensing signals expDET_d[1]~expDET_d[M], it converts the digital sensing signals expDET_d[1]~expDET_d[ M] and then sent to the controller 315. Among them, the controller 315 dynamically decides whether to adjust the format of the column selection control signal mctlS according to the digital sensing signals expDET_d[1]~expDET_d[M], thereby causing the main selection circuit 319a to change the main scanning signals mSR[1]~mSR[N ] voltage.

圖像讀取電路313將資料讀取信號rdDAT[1]~rdDAT[M]轉換為數位讀取信號rdDAT_d[1]~rdDAT_d[M]後,將數位讀取信號 rdDAT_d[1]~rdDAT_d[M]傳送至控制器315。之後,控制器315再根據數位讀取信號rdDAT_d[1]~rdDAT_d[M]而產生影像資訊imgDAT。 The image reading circuit 313 converts the data reading signals rdDAT[1]~rdDAT[M] into digital reading signals rdDAT_d[1]~rdDAT_d[M], and then converts the digital reading signals rdDAT_d[1]~rdDAT_d[M] are sent to the controller 315. Afterwards, the controller 315 generates image information imgDAT according to the digital read signals rdDAT_d[1]~rdDAT_d[M].

為簡化說明,以下以位於第m行、第n列的光感測元件lgtSU(m,n)為例。其中,m、n為正整數,m

Figure 111140285-A0305-02-0011-8
M,且n
Figure 111140285-A0305-02-0011-9
N。此外,位於光感測元件lgtSU(m,n)的內部元件,將以相同的座標(m,n)表示。 To simplify the description, the following takes the light sensing element lgtSU(m,n) located in the m-th row and n-th column as an example. Among them, m and n are positive integers, m
Figure 111140285-A0305-02-0011-8
M, and n
Figure 111140285-A0305-02-0011-9
N. In addition, the internal components located in the light sensing element lgtSU(m,n) will be represented by the same coordinates (m,n).

請參見第6圖,其係根據本揭露構想之光感測元件lgtSU(m,n)的內部元件之示意圖。光感測元件lgtSU(m,n)包含:讀取電晶體T1(m,n)、感測電晶體T2(m,n)、光電二極體D(m,n)與電容C(m,n)。其中,光電二極體D(m,n)與電容C(m,n)平行連接,並可視為一感光電路。 Please refer to Figure 6, which is a schematic diagram of the internal components of the light sensing element lgtSU(m,n) according to the concept of the present disclosure. The light sensing element lgtSU(m,n) includes: reading transistor T1(m,n), sensing transistor T2(m,n), photodiode D(m,n) and capacitor C(m, n). Among them, the photodiode D(m,n) and the capacitor C(m,n) are connected in parallel and can be regarded as a photosensitive circuit.

讀取電晶體T1(m,n)的閘極接收主要掃描信號mSR[n],源極電連接於感測端點Np(m,n),汲極電連接於資料讀取信號線rdDAT[m]。感測電晶體T2(m,n)的閘極電連接於感測端點Np(m,n),汲極接收偏壓信號Vbs,源極電連接於光強度感測信號線expDET[m]。光電二極體D(m,n)的陽極接收輔助掃描信號eSR[n],陰極則電連接於感測端點Np(m,n)。電容C(m,n)的一端接收輔助掃描信號eSR[n],另一端電連接於感測端點Np(m,n)。 The gate of the read transistor T1(m,n) receives the main scanning signal mSR[n], the source is electrically connected to the sensing terminal Np(m,n), and the drain is electrically connected to the data read signal line rdDAT[ m]. The gate of the sensing transistor T2(m,n) is electrically connected to the sensing terminal Np(m,n), the drain receives the bias signal Vbs, and the source is electrically connected to the light intensity sensing signal line expDET[m] . The anode of the photodiode D(m,n) receives the auxiliary scanning signal eSR[n], and the cathode is electrically connected to the sensing terminal Np(m,n). One end of the capacitor C(m,n) receives the auxiliary scanning signal eSR[n], and the other end is electrically connected to the sensing terminal Np(m,n).

由第6圖的連接關係可以看出,讀取電晶體T1(m,n)的導通與否取決於主要掃描信號mSR[n]和感測端點Np(m,n)之間的壓差。且,當讀取電晶體T1(m,n)導通時,感測端點Np(m,n)的電壓等於資料讀取信號rdDAT[m]。此外,感測電晶體T2(m,n)的導通與否取決於感測端點Np(m,n)和光強度感測信號expDET[m]之間的壓差。其中,感測端點Np(m,n)受到電容C(m,n)之充放電,以及光電二極體D(m,n)的電壓變化所影響。 It can be seen from the connection relationship in Figure 6 that the conduction of the read transistor T1(m,n) depends on the voltage difference between the main scanning signal mSR[n] and the sensing endpoint Np(m,n) . Moreover, when the read transistor T1(m,n) is turned on, the voltage of the sensing terminal Np(m,n) is equal to the data read signal rdDAT[m]. In addition, whether the sensing transistor T2(m,n) is turned on depends on the voltage difference between the sensing terminal Np(m,n) and the light intensity sensing signal expDET[m]. Among them, the sensing terminal Np(m,n) is affected by the charge and discharge of the capacitor C(m,n) and the voltage change of the photodiode D(m,n).

請參見第7圖,其係光感測元件lgtSU(m,n)中的讀取電晶體T1(m,n)的導通電流Ids和閘極-源極壓差Vgs的關係圖。當讀取電晶體T1(m,n)的閘極-源極壓差Vgs大於或等於臨界電壓(Vgs

Figure 111140285-A0305-02-0011-10
Vth)時,讀取電晶體T1(m, n)處於導通狀態。當讀取電晶體T1(m,n)的閘極-源極壓差Vgs小於臨界電壓(Vgs<Vth)時,讀取電晶體T1(m,n)處於關閉狀態。 Please refer to Figure 7, which is a relationship diagram between the on-current Ids and the gate-source voltage difference Vgs of the read transistor T1(m,n) in the light sensing element lgtSU(m,n). When the gate-source voltage difference Vgs of the reading transistor T1(m,n) is greater than or equal to the critical voltage (Vgs
Figure 111140285-A0305-02-0011-10
Vth), the read transistor T1(m, n) is in the conducting state. When the gate-source voltage difference Vgs of the read transistor T1(m,n) is less than the critical voltage (Vgs<Vth), the read transistor T1(m,n) is in a closed state.

當讀取電晶體T1(m,n)處於關閉狀態時,隨著閘極-源極壓差Vgs的改變,讀取電晶體T1(m,n)可能出現漏電流的情形。如第7圖所示,若閘極-源極壓差Vgs低於電壓V1,或是介於電壓V2與0V時,讀取電晶體T1(m,n)漏電流較高。另一方面,若閘極-源極壓差Vgs介於電壓V1與電壓V2之間時,讀取電晶體T1(m,n)的漏電流較低。 When the read transistor T1(m,n) is in the off state, as the gate-source voltage difference Vgs changes, the read transistor T1(m,n) may leak current. As shown in Figure 7, if the gate-source voltage difference Vgs is lower than the voltage V1, or between the voltage V2 and 0V, the leakage current of the reading transistor T1(m,n) is high. On the other hand, if the gate-source voltage difference Vgs is between the voltage V1 and the voltage V2, the leakage current of the read transistor T1(m,n) is low.

請同時參見第6、7圖。如第6圖所示,讀取電晶體T1(m,n)的閘極接收主要掃描信號mSR[n]、源極電連接於感測端點Np(m,n)。因此,讀取電晶體T1(m,n)的閘極-源極壓差Vgs即為主要掃描信號mSR[n]與感測端點Np(m,n)的電壓差。 Please also see Figures 6 and 7. As shown in Figure 6, the gate of the read transistor T1(m,n) receives the main scanning signal mSR[n], and the source is electrically connected to the sensing terminal Np(m,n). Therefore, the gate-source voltage difference Vgs of the read transistor T1(m,n) is the voltage difference between the main scanning signal mSR[n] and the sensing terminal Np(m,n).

由於光電二極體D(m,n)的陰極電連接於感測端點Np(m,n),且光電二極體D(m,n)的兩端壓差在經過光照後,隨著光照強度而改變。連帶的,讀取電晶體T1(m,n)的閘極-源極壓差Vgs也隨著光感測元件lgtSU(m,n)的光照強度而改變。根據前述說明,隨著光感測元件lgtSU(m,n)的光照強度的不同,感測端點Np(m,n)的電壓、讀取電晶體T1(m,n)的閘極-源極壓差Vgs、讀取電晶體T1(m,n)的狀態與漏電流的情形,亦隨著改變,如表1所示。 Since the cathode of the photodiode D(m,n) is electrically connected to the sensing terminal Np(m,n), and the voltage difference between the two ends of the photodiode D(m,n) increases with the changes with light intensity. Relatedly, the gate-source voltage difference Vgs of the reading transistor T1(m,n) also changes with the illumination intensity of the light sensing element lgtSU(m,n). According to the foregoing description, as the light intensity of the light sensing element lgtSU(m,n) is different, the voltage of the sensing terminal Np(m,n) and the gate-source of the reading transistor T1(m,n) The extreme voltage difference Vgs, the state of the reading transistor T1(m,n) and the leakage current also change accordingly, as shown in Table 1.

Figure 111140285-A0305-02-0012-1
Figure 111140285-A0305-02-0012-1
Figure 111140285-A0305-02-0013-3
Figure 111140285-A0305-02-0013-3

當讀取電晶體T1(m,n)出現漏電流的情形時,資料讀取信號rdDAT[m]將受影響。由於資料讀取信號線rdDAT[m]同時與讀取電晶體T1(m,1)~T1(m,N)相連的緣故,讀取電晶體T1(m,1)~T1(m,N)彼此間可能互相干擾。根據實際應用的不同,主要掃描信號mSR[1]~mSR[N]的選取順序可能不同。且,隨著主要掃描信號mSR[1]~mSR[N]的選取順序(脈波產生順序)不同,讀取電晶體T1(m,1)~T1(m,N)彼此間形成的干擾現象也跟著改變。 When leakage current occurs in the read transistor T1(m,n), the data read signal rdDAT[m] will be affected. Since the data read signal line rdDAT[m] is connected to the read transistors T1(m,1)~T1(m,N) at the same time, the read transistors T1(m,1)~T1(m,N) They may interfere with each other. Depending on the actual application, the selection order of the main scanning signals mSR[1]~mSR[N] may be different. Moreover, as the selection order (pulse wave generation order) of the main scanning signals mSR[1]~mSR[N] is different, the interference phenomenon formed between the read transistors T1(m,1)~T1(m,N) Also changed.

當主要掃描信號mSR[1]~mSR[N]的選取順序為遞增(自1至N)時,若讀取電晶體T1(m,n)出現漏電流現象,將影響讀取電晶體T1(m,1)~T1(m,n-1)的操作。換言之,當主要掃描信號mSR[1]~mSR[N]的選取順序為1到N時,讀取電晶體T1(m,n)的漏電流現象,亦影響像素PXL(m,1)~PXL(m,n-1)在顯示時的亮度。 When the selection order of the main scanning signals mSR[1]~mSR[N] is increasing (from 1 to N), if the reading transistor T1(m,n) leaks current, it will affect the reading transistor T1(m,n). Operations of m,1)~T1(m,n-1). In other words, when the selection order of the main scanning signals mSR[1]~mSR[N] is 1 to N, the leakage current phenomenon of the read transistor T1(m,n) also affects the pixels PXL(m,1)~PXL (m,n-1) brightness when displayed.

另一方面,當主要掃描信號mSR[1]~mSR[N]的選取順序為遞減(自N至1)時,若讀取電晶體T1(m,n)出現漏電流現象,將影響讀取電晶體T1(m,n+1)~T1(m,N)的操作。換言之,當主要掃描信號mSR[1]~mSR[N]的選取順序由N到1時,讀取電晶體T1(m,n)的漏電流現象,亦影響像素PXL(m,n+1)~PXL(m,N)在顯示時的亮度。 On the other hand, when the selection order of the main scanning signals mSR[1]~mSR[N] is decreasing (from N to 1), if the reading transistor T1(m,n) leaks current, it will affect the reading. Operation of transistors T1(m,n+1)~T1(m,N). In other words, when the selection order of the main scanning signals mSR[1]~mSR[N] is from N to 1, the leakage current phenomenon of the read transistor T1(m,n) also affects the pixel PXL(m,n+1) ~PXL(m,N) brightness when displayed.

換言之,主要掃描信號mSR[1]~mSR[N]的選取順序將影響顯示面板37上呈現受干擾的位置。為便於說明,本文的實施例假設主要掃描信號mSR[1]~mSR[N]的選取順序為遞增(自1至N)的情況。但在實際應用時,類似的作法亦可應用於主要掃描信號mSR[1]~mSR[N]的選取順序為遞減(自N至1)的情況。 In other words, the selection order of the main scanning signals mSR[1]~mSR[N] will affect the position on the display panel 37 where interference is present. For ease of explanation, the embodiment of this article assumes that the selection order of the main scanning signals mSR[1]~mSR[N] is increasing (from 1 to N). However, in practical applications, a similar approach can also be applied to the case where the selection order of the main scanning signals mSR[1]~mSR[N] is decreasing (from N to 1).

請同時參見第4A、6、7圖。對光感測元件lgtSU(m,1)~lgtSU(m,Y1)而言,其導通電流Ids和閘極-源極壓差Vgs的關係位於第7圖的A點。即,光感測元件lgtSU(m,1)~lgtSU(m,Y1)在關閉狀態處於低漏電的情況。但是,對光感測元件lgtSU(m,Y1+1)~lgtSU(m,Y2)而言,其導通電流Ids和閘極-源極壓差Vgs的關係位於第7圖的B點。即,光感測元件lgtSU(m,1)~lgtSU(m,Y1)在關閉狀態處於高漏電的情況。 Please also see Figures 4A, 6, and 7. For the light sensing elements lgtSU(m,1)~lgtSU(m,Y1), the relationship between the on-current Ids and the gate-source voltage difference Vgs is located at point A in Figure 7. That is, the light sensing elements lgtSU(m,1)~lgtSU(m,Y1) are in a low leakage state in the off state. However, for the light sensing elements lgtSU(m,Y1+1)~lgtSU(m,Y2), the relationship between the on-current Ids and the gate-source voltage difference Vgs is located at point B in Figure 7. That is, the light sensing elements lgtSU(m,1)~lgtSU(m,Y1) are in a high leakage state in the off state.

如第4A圖所示,若與位於第Y1~Y2列的像素PXL(X1,Y1)~PXL(X2,Y2)對應的光感測元件lgtSU(m,Y1)~lgtSU(m,Y2)(其中m=X1~X2)出現過曝情形,光感測元件lgtSU(m,Y1)~lgtSU(m,Y2)將產生漏電流影響資料讀取信號線rdDAT[m]的電壓。據此,當主要掃描信號mSR[n]選取與位於第Y1~Y2列的像素對應的光感測元件lgtSU(m,Y1)~lgtSU(m,Y2)時,光感測元件lgtSU(m,Y1)~lgtSU(m,Y2)產生流至資料讀取信號線rdDAT[m]的漏電流,進而影響讀取電晶體T1(m,1)~T1(m,Y1)的特性,以及控制器315從讀取電晶體T1(m,1)~T1(m,Y1)讀取時的結果。 As shown in Figure 4A, if the light sensing elements lgtSU(m,Y1)~lgtSU(m,Y2)( When m=X1~X2) is overexposed, the light sensing elements lgtSU(m,Y1)~lgtSU(m,Y2) will generate leakage current and affect the voltage of the data reading signal line rdDAT[m]. Accordingly, when the main scanning signal mSR[n] selects the light sensing elements lgtSU(m,Y1)~lgtSU(m,Y2) corresponding to the pixels located in the Y1~Y2 columns, the light sensing element lgtSU(m, Y1)~lgtSU(m,Y2) generates leakage current flowing to the data read signal line rdDAT[m], which in turn affects the characteristics of the read transistors T1(m,1)~T1(m,Y1) and the controller 315 is the result when reading from the reading transistors T1(m,1)~T1(m,Y1).

參考第7圖可以得知,讀取電晶體T1(m,n)出現漏電流的情形與讀取電晶體T1(m,n)的閘極-源極壓差Vgs相關。因此,本揭露提供一種藉由事先感測端點Np(m,n)的電壓後,根據感測結果而調整主要掃描信號mSR[n]之電壓,進而控制讀取電晶體T1(m,n)的閘極-源極壓差Vgs,使讀取電晶體T1(m,n)處於低漏電流狀態的做法。此種作法相當於,改變讀取電晶體T1(m,Y1)~T1(m,Y2)的閘極-源極壓差Vgs,使其導通電流Ids和閘極-源極壓差Vgs的關係由第7圖的B點移動至C點。一旦將讀取電晶體T1(m,Y1)~T1(m,Y2)的狀態控制在第7圖的C點時,讀取電晶體T1(m,Y1)~T1(m,Y2)的漏電流便不至於影響控制器315利用資料讀取信號rdDAT[m]讀取前級的感測端點Np(m,1)~Np(m,(Y1-1))的讀取結果。 Referring to Figure 7, it can be known that the leakage current of the read transistor T1(m,n) is related to the gate-source voltage difference Vgs of the read transistor T1(m,n). Therefore, the present disclosure provides a method for controlling the read transistor T1(m,n) by sensing the voltage of the terminal Np(m,n) in advance and adjusting the voltage of the main scanning signal mSR[n] according to the sensing result. ), the gate-source voltage difference Vgs puts the read transistor T1(m,n) in a low leakage current state. This approach is equivalent to changing the gate-source voltage difference Vgs of the read transistors T1(m,Y1)~T1(m,Y2), so that the relationship between the conduction current Ids and the gate-source voltage difference Vgs Move from point B to point C in Figure 7. Once the states of the reading transistors T1(m,Y1)~T1(m,Y2) are controlled at point C in Figure 7, the drains of the reading transistors T1(m,Y1)~T1(m,Y2) The current will not affect the reading result of the controller 315 using the data reading signal rdDAT[m] to read the sensing endpoints Np(m,1)~Np(m,(Y1-1)) of the previous stage.

為更具體說明位於同一行的光感測元件因光照強度不同而對應的控制方式,以下針對N=4的情況下,說明感測面板311上位於第m行的光感測元件lgtSU(m,1)~lgtSU(m,4)的電路連接關係(第8圖),並搭配與其對應的波形圖(第11圖)。 In order to more specifically explain the control method of the light sensing elements located in the same row due to different light intensities, the following is a description of the light sensing element lgtSU(m, 1)~lgtSU(m,4) circuit connection relationship (Figure 8), and its corresponding waveform diagram (Figure 11).

請參見第8圖,其係控制器搭配類比數位轉換器和讀取電路,對同樣位於第m行的光感測元件lgtSU(m,1)~lgtSU(m,4)進行感測和讀取之示意圖。因光感測元件lgtSU(m,1)~lgtSU(m,4)的內部元件均與第6圖相似,此處不予詳述。 Please refer to Figure 8. The controller is equipped with an analog-to-digital converter and a reading circuit to sense and read the light sensing elements lgtSU(m,1)~lgtSU(m,4) also located in the mth row. schematic diagram. Since the internal components of the light sensing elements lgtSU(m,1)~lgtSU(m,4) are similar to those in Figure 6, they will not be described in detail here.

同樣位於第m行的光感測元件lgtSU(m,1)~lgtSU(m,4)共同電連接於資料讀取信號線rdDAT[m]、光強度感測信號線expDET[m]與偏壓信號線Vbs。光感測元件lgtSU(m,n)與主要掃描信號mSR[n]和輔助掃描信號eSR[n]之間的連線方式按照各列的順序相連。光感測元件lgtSU(m,1)接收主要掃描信號mSR[1]與輔助掃描信號eSR[1];光感測元件lgtSU(m,2)接收主要掃描信號mSR[2]與輔助掃描信號eSR[2];光感測元件lgtSU(m,3)接收主要掃描信號mSR[3]與輔助掃描信號eSR[3];且,光感測元件lgtSU(m,4)接收主要掃描信號mSR[4]與輔助掃描信號eSR[4]。 The light sensing elements lgtSU(m,1)~lgtSU(m,4), also located in the mth row, are electrically connected to the data reading signal line rdDAT[m], the light intensity sensing signal line expDET[m] and the bias voltage. Signal line Vbs. The light sensing element lgtSU(m,n) is connected to the main scanning signal mSR[n] and the auxiliary scanning signal eSR[n] in the order of each column. The light sensing element lgtSU(m,1) receives the main scanning signal mSR[1] and the auxiliary scanning signal eSR[1]; the light sensing element lgtSU(m,2) receives the main scanning signal mSR[2] and the auxiliary scanning signal eSR [2]; The light sensing element lgtSU(m,3) receives the main scanning signal mSR[3] and the auxiliary scanning signal eSR[3]; and, the light sensing element lgtSU(m,4) receives the main scanning signal mSR[4] ] and auxiliary scanning signal eSR[4].

光感測元件lgtSU(m,1)~lgtSU(m,4)輪流決定光強度感測信號expDET[m]的電壓,並將光強度感測信號expDET[m]傳送至光強度感測電路45。光強度感測電路45包含分壓電晶體T[m]與類比數位轉換器45a。分壓電晶體T[m]的一端電連接於光強度感測信號線expDET[m]、另一端電連接於接地電壓Vss。分壓電晶體T[m]的閘極接收定電壓Vd,使分壓電晶體T[m]維持半導通的狀態。類比數位轉換器45a電連接於光強度感測信號線expDET[m]與控制器43。類比數位轉換器45a將光強度感測信號expDET[m] 轉換為數位感測信號expDET_d[m]後,將數位感測信號expDET_d[m]傳送至控制器43。 The light sensing elements lgtSU(m,1)~lgtSU(m,4) take turns to determine the voltage of the light intensity sensing signal expDET[m], and transmit the light intensity sensing signal expDET[m] to the light intensity sensing circuit 45 . The light intensity sensing circuit 45 includes a voltage dividing transistor T[m] and an analog-to-digital converter 45a. One end of the voltage dividing transistor T[m] is electrically connected to the light intensity sensing signal line expDET[m], and the other end is electrically connected to the ground voltage Vss. The gate of the voltage-dividing transistor T[m] receives a constant voltage Vd, so that the voltage-dividing transistor T[m] maintains a semi-conductive state. The analog-to-digital converter 45a is electrically connected to the light intensity sensing signal line expDET[m] and the controller 43. The analog-to-digital converter 45a converts the light intensity sensing signal expDET[m] After being converted into a digital sensing signal expDET_d[m], the digital sensing signal expDET_d[m] is sent to the controller 43 .

藉由分時切換的控制方式,光感測元件lgtSU(m,1)~lgtSU(m,4)輪流決定資料讀取信號rdDAT[m]的電壓,並將資料讀取信號rdDAT[m]傳送至讀取電路413。讀取電路413包含積分器413a與類比數位轉換器413c。積分器413a將資料讀取信號rdDAT[m]轉換為類比積分讀取信號rdDAT_a[m]後,將類比積分讀取信號rdDAT_a[m]傳送至類比數位轉換器413c。類比數位轉換器413c進一步將類比積分讀取信號rdDAT_a[m]轉換為數位讀取信號rdDAT_d[m],並將數位讀取信號rdDAT_d[m]傳送至控制器43。之後,控制器43再將數位讀取信號rdDAT_d[m]轉換為提供給顯示面板37的影像資訊imgDAT。 Through the time-sharing switching control method, the light sensing elements lgtSU(m,1)~lgtSU(m,4) take turns to determine the voltage of the data reading signal rdDAT[m] and transmit the data reading signal rdDAT[m] to read circuit 413. The reading circuit 413 includes an integrator 413a and an analog-to-digital converter 413c. After the integrator 413a converts the data read signal rdDAT[m] into the analog integral read signal rdDAT_a[m], it transmits the analog integral read signal rdDAT_a[m] to the analog-to-digital converter 413c. The analog-to-digital converter 413c further converts the analog integral read signal rdDAT_a[m] into a digital read signal rdDAT_d[m], and transmits the digital read signal rdDAT_d[m] to the controller 43 . Afterwards, the controller 43 converts the digital read signal rdDAT_d[m] into image information imgDAT provided to the display panel 37 .

請參見第9A、9B、9C圖,其係因光感測元件lgtSU(m,1)~lgtSU(m,4)內的感測電晶體T2(m,1)~T2(m,4)之連接關係表示為彼此並聯之等效電阻eqR(m,1)~eqR(m,4)的示意圖。請同時參見第8、9A圖。 Please refer to Figures 9A, 9B, and 9C, which are due to the sensing transistors T2(m,1)~T2(m,4) in the light sensing elements lgtSU(m,1)~lgtSU(m,4). The connection relationship is expressed as a schematic diagram of equivalent resistances eqR(m,1)~eqR(m,4) connected in parallel with each other. Please also see Figures 8 and 9A.

第9A圖繪式在光感測元件lgtSU(m,1)~lgtSU(m,4)中,與光強度感測信號expDET[m]相關的元件。由第8圖可以看出,感測電晶體T2(m,1)~T2(m,4)的一端均共同電連接於偏壓端點Nbs,且感測電晶體T2(m,1)~T2(m,4)的另一端均共同電連接於光強度感測信號線expDET[m]。因此,在第9A圖中,可將感測電晶體T2(m,1)~T2(m,4)視為彼此並聯。此外,分壓電晶體T[m]亦電連接於光強度感測信號線expDET[m]。 The 9A diagram illustrates elements related to the light intensity sensing signal expDET[m] among the light sensing elements lgtSU(m,1)~lgtSU(m,4). It can be seen from Figure 8 that one end of the sensing transistors T2(m,1)~T2(m,4) is electrically connected to the bias terminal Nbs, and the sensing transistors T2(m,1)~ The other ends of T2(m, 4) are both electrically connected to the light intensity sensing signal line expDET[m]. Therefore, in Figure 9A, the sensing transistors T2(m,1)~T2(m,4) can be regarded as being connected in parallel with each other. In addition, the voltage dividing transistor T[m] is also electrically connected to the light intensity sensing signal line expDET[m].

當輔助掃描信號eSR[n]為高電壓時,感測電晶體T2(m,1)~T2(m,4)處於半導通狀態。因此,在第9B圖中,將感測電晶體T2(m,1)~T2(m,4)表示為個別等效電阻eqR(m,1)~eqR(m,4),以及將分壓電晶體T[m]表示為分壓等效電阻eqRT[m]。延續第9A圖可以得知,感測電晶體T2(m, 1)~T2(m,4)的個別等效電阻eqR(m,1)~eqR(m,4)彼此並聯。且,並聯等效電阻eqR[m]可表示為,eqR[m]=eqR(m,1)//eqR(m,2)//eqR(m,3)//eqR(m,4)。根據電阻公式可以得知,並聯等效電阻eqR[m]的電阻值亦隨著個別等效電阻eqR(m,1)~eqR(m,4)的電阻值變化而改變。當個別等效電阻eqR(m,1)~eqR(m,4)的電阻值越大時,與第m行對應之並聯等效電阻eqR[m]的電阻值越大;反之,當個別等效電阻eqR(m,1)~eqR(m,4)的電阻值越小時,與第m行對應之並聯等效電阻eqR[m]的電阻值越小。 When the auxiliary scanning signal eSR[n] is a high voltage, the sensing transistors T2(m,1)~T2(m,4) are in a semi-conducting state. Therefore, in Figure 9B, the sensing transistors T2(m,1)~T2(m,4) are expressed as individual equivalent resistances eqR(m,1)~eqR(m,4), and the divided voltage The transistor T[m] is expressed as the voltage-divided equivalent resistance eqR T [m]. Continuing from Figure 9A, it can be seen that the individual equivalent resistances eqR(m,1)~eqR(m,4) of the sensing transistors T2(m, 1)~T2(m,4) are connected in parallel with each other. Moreover, the parallel equivalent resistance eqR[m] can be expressed as, eqR[m]=eqR(m,1)//eqR(m,2)//eqR(m,3)//eqR(m,4). According to the resistance formula, it can be known that the resistance value of the parallel equivalent resistance eqR[m] also changes as the resistance value of the individual equivalent resistances eqR(m,1)~eqR(m,4) changes. When the resistance value of the individual equivalent resistors eqR(m,1)~eqR(m,4) is larger, the resistance value of the parallel equivalent resistance eqR[m] corresponding to the m-th row is larger; conversely, when the individual equivalent resistances eqR(m,1)~eqR(m,4) are The smaller the resistance value of the effective resistance eqR(m,1)~eqR(m,4), the smaller the resistance value of the parallel equivalent resistance eqR[m] corresponding to the m-th row.

在第9C圖,以彼此串聯的並聯等效電阻eqR[m]和分壓等效電阻eqRT[m]代表在光感測元件lgtSU(m,1)~lgtSU(m,4)中,與光強度感測信號expDET[m]相關的元件所形成的等效電路。由第9C圖可以看出,光強度感測信號線expDET[m]可根據並聯等效電阻eqR[m]和分壓等效電阻eqRT[m]而得出。即,expDET[m]=(Vbs-Vss)*eqRT[m]/(eqRT[m]+eqR[m])。當與第m行對應之並聯等效電阻eqR[m]的電阻值越小時,光強度感測信號expDET[m]的電壓越高。或者,當與第m行對應之並聯等效電阻eqR[m]的電阻值越大時,光強度感測信號expDET[m]的電壓越小。 In Figure 9C, the parallel equivalent resistance eqR[m] and the voltage-divided equivalent resistance eqR T [m] in series with each other are represented in the light sensing elements lgtSU(m,1)~lgtSU(m,4), and The equivalent circuit formed by the components related to the light intensity sensing signal expDET[m]. As can be seen from Figure 9C, the light intensity sensing signal line expDET[m] can be obtained based on the parallel equivalent resistance eqR[m] and the voltage-divided equivalent resistance eqR T [m]. That is, expDET[m]=(Vbs-Vss)*eqR T [m]/(eqR T [m]+eqR[m]). When the resistance value of the parallel equivalent resistance eqR[m] corresponding to the m-th row is smaller, the voltage of the light intensity sensing signal expDET[m] is higher. Or, when the resistance value of the parallel equivalent resistance eqR[m] corresponding to the m-th row is larger, the voltage of the light intensity sensing signal expDET[m] is smaller.

根據晶體的特性,若感測電晶體T2(m,n)的閘極電壓和偏壓信號Vbs的壓差越大時,流經感測電晶體T2(m,n)的導通電流Ids也越大。因此,當感測電晶體T2(m,n)導通時,與其對應之個別等效電阻eqR(m,n)的大小,隨著導通電流的大小而改變。即,當流經感測電晶體T2(m,n)的導通電流Ids越大時,個別等效電阻eqR(m,n)越小。表2彙整隨著曝光程度的不同,與光感測元件lgtSU(m,n)(n=1~4)相關的信號與參數如何改變。 According to the characteristics of the crystal, if the voltage difference between the gate voltage of the sensing transistor T2(m,n) and the bias signal Vbs is larger, the conduction current Ids flowing through the sensing transistor T2(m,n) will also be larger. big. Therefore, when the sensing transistor T2(m,n) is turned on, the size of its corresponding individual equivalent resistance eqR(m,n) changes with the size of the conduction current. That is, when the on-current Ids flowing through the sensing transistor T2(m,n) is larger, the individual equivalent resistance eqR(m,n) is smaller. Table 2 summarizes how the signals and parameters related to the light sensing element lgtSU(m,n)(n=1~4) change with different exposure levels.

Figure 111140285-A0305-02-0017-4
Figure 111140285-A0305-02-0017-4
Figure 111140285-A0305-02-0018-5
Figure 111140285-A0305-02-0018-5

如前所述,當感測端點Np(m,n)的電壓越高時,代表光感測元件lgtSU(m,n)對應的光照強度越弱(受測對象的遮光程度越高)。且,光強度感測信號expDET[m]的電壓越高。 As mentioned before, when the voltage of the sensing terminal Np(m,n) is higher, it means that the light intensity corresponding to the light sensing element lgtSU(m,n) is weaker (the degree of light shading of the object being measured is higher). Moreover, the voltage of the light intensity sensing signal expDET[m] is higher.

另一方面,當感測端點Np(m,n)的電壓越低時,代表光感測元件lgtSU(m,n)對應的光照強度越強(受測對象的遮光程度越低)。且,光強度感測信號expDET[m]的電壓越低。 On the other hand, when the voltage of the sensing terminal Np(m,n) is lower, it means that the illumination intensity corresponding to the light sensing element lgtSU(m,n) is stronger (the degree of shading of the object under test is lower). Moreover, the voltage of the light intensity sensing signal expDET[m] is lower.

是故,控制器43可以根據光強度感測信號expDET[m]的電壓變化,獲知光感測元件lgtSU(m,n)所接收的光照強度是否可能導致過曝。即,控制器43所接收到的數位感測信號expDET_d[m]代表光強度感測信號expDET[m]的電壓越高時,代表感測端點Np(m,n)的電壓越高,且光感測元件lgtSU(m,n)的光照強度越弱。 Therefore, the controller 43 can learn whether the light intensity received by the light sensing element lgtSU(m,n) may cause overexposure according to the voltage change of the light intensity sensing signal expDET[m]. That is, when the digital sensing signal expDET_d[m] received by the controller 43 represents the higher voltage of the light intensity sensing signal expDET[m], it represents the higher voltage of the sensing end point Np(m,n), and The weaker the light intensity of the light sensing element lgtSU(m,n).

再者,控制器43可以設定一個預設門檻,作為判斷光感測元件lgtSU(m,n)是否過曝的依據。當光強度感測信號expDET[m]的電壓高於或等於預設門檻時,控制器43可藉由數位感測信號expDET_d[m]判斷感測端點Np(m,n)電壓並未偏低,即,光感測元件lgtSU(m,n)並未過曝。反之,當光強度感測信號expDET[m]的電壓低於預設門檻時,控制器43可藉由數位感測 信號expDET_d[m]判斷感測端點Np(m,n)電壓偏低,即,光感測元件lgtSU(m,n)已過曝。 Furthermore, the controller 43 can set a preset threshold as a basis for determining whether the light sensing element lgtSU(m,n) is overexposed. When the voltage of the light intensity sensing signal expDET[m] is higher than or equal to the preset threshold, the controller 43 can determine that the voltage of the sensing terminal Np(m,n) is not biased by the digital sensing signal expDET_d[m]. Low, that is, the light sensing element lgtSU(m,n) is not overexposed. On the contrary, when the voltage of the light intensity sensing signal expDET[m] is lower than the preset threshold, the controller 43 can use digital sensing to The signal expDET_d[m] determines that the voltage of the sensing terminal Np(m,n) is low, that is, the light sensing element lgtSU(m,n) has been overexposed.

其後,控制器43在元件補償期間uT_m4,便可根據在元件光強度感測期間uT_m3的光強度感測信號expDET[n]的電壓,動態地判斷是否改變主要掃描信號mSR[n]的電壓。若光強度感測信號expDET[n]的電壓偏低,則需在元件補償期間uT_m4將主要掃描信號mSR[n]的電壓拉低(-8V→-9V)。因主要掃描信號線mSR[n]電連接於讀取電晶體T1(m,n)的閘極,將主要掃描信號mSR[n]的電壓拉低的做法將影響讀取電晶體T1(m,n)的閘極-源極壓差Vgs,進而改變讀取電晶體T1(m,n)的漏電流之大小(由第7圖的B點移動至C點)。反之,若光強度感測信號expDET[n]並未偏低,則在元件補償期間pT_m4維持主要掃描信號mSR[n]的電壓。 Thereafter, during the element compensation period uT_m4, the controller 43 can dynamically determine whether to change the voltage of the main scanning signal mSR[n] based on the voltage of the light intensity sensing signal expDET[n] during the element light intensity sensing period uT_m3. . If the voltage of the light intensity sensing signal expDET[n] is low, the voltage of the main scanning signal mSR[n] needs to be pulled down (-8V→-9V) during the element compensation period uT_m4. Since the main scanning signal line mSR[n] is electrically connected to the gate of the reading transistor T1(m,n), pulling down the voltage of the main scanning signal mSR[n] will affect the reading transistor T1(m,n). The gate-source voltage difference Vgs of n) changes the leakage current of the read transistor T1(m,n) (moving from point B to point C in Figure 7). On the contrary, if the light intensity sensing signal expDET[n] is not low, the voltage of the main scanning signal mSR[n] is maintained during the element compensation period pT_m4.

根據本揭露所採用之感測電晶體T2(m,1)~T2(m,4)與分壓電晶體T[m]的連接方式,可使流經感測電晶體T2(m,1)~T2(m,4)與分壓電晶體T[m]的電流反映感測端點Np(m,1)~Np(m,4)的電壓,屬於主動(active)感測作法。另一方面,讀取電晶體T1(m,n)則採用被動讀取操作。接著,以第10圖比較與光感測元件lgtSU(m,n)相關的控制信號,如何隨著光照強度的不同而改變。 According to the connection method of the sensing transistors T2(m,1)~T2(m,4) and the voltage dividing transistor T[m] adopted in the present disclosure, the flow through the sensing transistor T2(m,1) can be The currents of ~T2(m,4) and the voltage dividing transistor T[m] reflect the voltage of the sensing terminals Np(m,1)~Np(m,4), which is an active sensing method. On the other hand, the read transistor T1(m,n) adopts a passive read operation. Next, use Figure 10 to compare how the control signal related to the light sensing element lgtSU(m,n) changes with different light intensities.

第10圖上方的虛線框選處為光感測元件lgtSU(m,n)並未過曝的情況下,與光感測元件lgtSU(m,n)相關的控制信號的波形圖;第10圖下方的虛線框選處為光感測元件lgtSU(m,n)過曝的情況下,與光感測元件lgtSU(m,n)相關的控制信號的波形圖。 The dotted line frame at the top of Figure 10 is the waveform diagram of the control signal related to the light sensing element lgtSU(m,n) when the light sensing element lgtSU(m,n) is not overexposed; Figure 10 The dotted line frame below is the waveform diagram of the control signal related to the light sensing element lgtSU(m,n) when the light sensing element lgtSU(m,n) is overexposed.

第10圖的橫軸為時間。光感測元件lgtSU(m,n)的元件感測期間Tucyc包含:元件重置期間uT_m1、元件光照期間uT_m2、元件光強度感測期間uT_m3、元件補償期間uT_m4,與元件讀取期間uT_m5。 The horizontal axis of Figure 10 is time. The element sensing period Tucyc of the light sensing element lgtSU(m,n) includes: element reset period uT_m1, element illumination period uT_m2, element light intensity sensing period uT_m3, element compensation period uT_m4, and element reading period uT_m5.

第10圖的縱軸依序為光感測元件lgtSU(m,n)接收的主要掃描信號mSR[n]、輔助掃描信號eSR[n]、感測端點Np(m,n)的電壓、光強度感測信號expDAT[m]、資料讀取信號rdDAT[m]。此外,為比較未補償和補償的不同,在第10圖的下方的虛線框選處將主要掃描信號mSR[n]的波形分為兩種,一種為未進行補償時的波形(相當於使讀取電晶體T1(m,n)處於第7圖的B點);另一種為進行補償時的波形(相當於使讀取電晶體使T1(m,n)處於第7圖的C點)。 The vertical axis of Figure 10 is the main scanning signal mSR[n] received by the light sensing element lgtSU(m,n), the auxiliary scanning signal eSR[n], the voltage of the sensing end point Np(m,n), Light intensity sensing signal expDAT[m], data reading signal rdDAT[m]. In addition, in order to compare the difference between uncompensated and compensated, the waveform of the main scanning signal mSR[n] is divided into two types in the dotted line selection at the bottom of Figure 10. One is the waveform without compensation (equivalent to reading Take the transistor T1(m,n) to be at point B in Figure 7); the other is the waveform when performing compensation (equivalent to making the reading transistor T1(m,n) be at point C in Figure 7).

在此圖式中,以點狀網底標示處於浮接狀態的信號。例如,光強度感測信號expDET[m]在元件光強度感測期間uT_m3以外的時段均處於浮接狀態;以及,在元件重置期間uT_m1和元件讀取期間uT_m5以外的資料讀取信號rdDAT[m]均處於浮接狀態。接著,依照時間順序,說明在光感測元件lgtSU(m,n)未過曝與過曝情況下,與光感測元件lgtSU(m,n)相關的信號的變化方式。 In this diagram, the dotted bottom of the net indicates the signal in the floating state. For example, the light intensity sensing signal expDET[m] is in a floating state during periods other than the component light intensity sensing period uT_m3; and, during the component reset period uT_m1 and the component reading period uT_m5, the data read signal rdDAT[ m] are all in floating state. Next, in chronological order, the change pattern of the signal related to the light sensing element lgtSU(m,n) is explained when the light sensing element lgtSU(m,n) is not overexposed and overexposed.

在元件重置期間uT_m1(時點t1~t2期間),主要掃描信號mSR[n]產生導通讀取電晶體T1(m,n)的主要掃描脈波(例如,8.5V)。主要掃描脈波的脈波寬度為Tmp,主要掃描脈波的電壓幅度為Vmp。隨著讀取電晶體T1(m,n)的導通,電容C(m,n)接收資料讀取信號rdDAT[m]並進行充電。當電容C(m,n)被充滿時,感測端點Np(m,n)的電壓(Np(m,n)=Vrst)被設為重置電壓(Vrst)。在此同時,輔助掃描信號eSR[n]仍為低電壓(例如,-7V)。在元件重置期間uT_m1,逐漸增加的感測端點Np(m,n)的電壓尚不足以導通感測電晶體T2(m,n)。因此,光強度感測信號expDET[m]在元件重置期間uT_m1因感測電晶體T2(m,n)為斷開而為浮接狀態。資料讀取信號rdDAT[m]在元件重置期間uT_m1接收自控制器43輸出的電流,並經導通的讀取電晶體T1(m, n)將電流導通至感測端點Np(m,n)。故資料讀取信號rdDAT[m]的電壓在元件重置期間uT_m1等於感測端點Np(m,n)的電壓。 During the element reset period uT_m1 (during time points t1 to t2), the main scanning signal mSR[n] generates a main scanning pulse wave (for example, 8.5V) that turns on the read transistor T1(m,n). The pulse width of the main scanning pulse wave is Tmp, and the voltage amplitude of the main scanning pulse wave is Vmp. As the read transistor T1(m,n) is turned on, the capacitor C(m,n) receives the data read signal rdDAT[m] and is charged. When the capacitor C(m,n) is full, the voltage of the sensing terminal Np(m,n) (Np(m,n)=Vrst) is set to the reset voltage (Vrst). At the same time, the auxiliary scanning signal eSR[n] is still at a low voltage (for example, -7V). During the element reset period uT_m1, the gradually increasing voltage of the sensing terminal Np(m,n) is not enough to turn on the sensing transistor T2(m,n). Therefore, the light intensity sensing signal expDET[m] is in a floating state during the element reset period because the sensing transistor T2(m,n) is turned off. The data read signal rdDAT[m] receives the current output from the controller 43 during the element reset period, and passes through the turned on read transistor T1(m, n) Conduct current to the sensing terminal Np(m,n). Therefore, the voltage of the data read signal rdDAT[m] during the component reset period uT_m1 is equal to the voltage of the sensing terminal Np(m,n).

另請留意,感測端點Np(m,n)的電壓(Np(m,n)=Vrst)在元件重置期間uT_m1剛開始(時點t1)的電壓可能不同。例如,若是光感測系統3在開機後第一次進行X光診斷拍攝時,感測端點Np(m,n)的電壓(Np(m,n)=Vrst)在時點t1的電壓為0V。若是連續進行X光診斷拍攝時,感測端點Np(m,n)的電壓(Np(m,n)=Vrst)在時點t1的電壓為前一次進行X光診斷拍攝後的感測結果。 Please also note that the voltage of the sensing terminal Np(m,n) (Np(m,n)=Vrst) may be different from the voltage at the beginning of the component reset period uT_m1 (time point t1). For example, if the light sensing system 3 performs X-ray diagnostic shooting for the first time after being powered on, the voltage of the sensing terminal Np(m,n) (Np(m,n)=Vrst) at time point t1 is 0V. . If X-ray diagnostic shooting is performed continuously, the voltage of the sensing end point Np(m,n) (Np(m,n)=Vrst) at time point t1 is the sensing result after the previous X-ray diagnostic shooting.

在元件光照期間uT_m2(t2~t3),控制器43控制X光光源發光。當X光的強度越強時,元件光照期間uT_m2(t2~t3)越短。在元件光照期間uT_m2(t2~t3),光電二極體D(m,n)隨著光感測元件lgtSU(m,n)所接收之曝光強度的不同而改變兩端壓差。一旦光電二極體D(m,n)的兩端壓差產生變化,感測端點Np(m,n)的電壓也跟著變化。 During the component illumination period uT_m2 (t2~t3), the controller 43 controls the X-ray light source to emit light. When the intensity of X-ray is stronger, the component illumination period uT_m2 (t2~t3) is shorter. During the element illumination period uT_m2 (t2~t3), the voltage difference between the two ends of the photodiode D(m,n) changes with the different exposure intensity received by the light sensing element lgtSU(m,n). Once the voltage difference across the photodiode D(m,n) changes, the voltage of the sensing terminal Np(m,n) also changes accordingly.

隨著受測對象的組織分布不同,不同位置的光感測元件lgtSU(m,n)所接收之光照強度也不同。連帶的,感測端點Np(m,n)的電壓降低幅度跟著光感測元件lgtSU(m,n)的位置不同而異。由第10圖可以看出,在元件光照期間uT_m2結束時(時點t3),若光感測元件lgtSU(m,n)所接收之光照強度較低時(如上方虛線框選處所標示),感測端點Np(m,n)的電壓較高;若光感測元件lgtSU(m,n)所接收之光照強度較高(如下方虛線框選處所標示),感測端點Np(m,n)的電壓較低。 As the tissue distribution of the subject is different, the light intensity received by the light sensing element lgtSU(m,n) at different positions is also different. Relatedly, the voltage drop amplitude of the sensing terminal Np(m,n) varies with the position of the light sensing element lgtSU(m,n). It can be seen from Figure 10 that at the end of the component lighting period uT_m2 (time point t3), if the light intensity received by the light sensing component lgtSU(m,n) is low (as marked by the dotted line selection above), the sensor The voltage of the sensing endpoint Np(m,n) is higher; if the light intensity received by the light sensing element lgtSU(m,n) is higher (as indicated by the dotted line selection below), the sensing endpoint Np(m,n) n) has a lower voltage.

在元件光照期間uT_m2(時點t2~t3期間),主要掃描信號mSR[n]與輔助掃描信號eSR[n]均為低電壓(mSR[n]=-8V、eSR[n]=-7V)。因此,於感測電晶體T2(m,n)與讀取電晶體T1(m,n)在元件光照期間uT_m2均 為斷開。連帶地,光強度感測信號expDET[m]與資料讀取信號rdDAT[m]在元件光照期間uT_m2(t2~t3)均為浮接狀態。 During the element illumination period uT_m2 (during time point t2~t3), the main scanning signal mSR[n] and the auxiliary scanning signal eSR[n] are both low voltage (mSR[n]=-8V, eSR[n]=-7V). Therefore, during the device illumination period uT_m2 is equal to the sensing transistor T2(m,n) and the reading transistor T1(m,n). for disconnection. Together, the light intensity sensing signal expDET[m] and the data reading signal rdDAT[m] are both in a floating state during the component illumination period uT_m2 (t2~t3).

在元件光強度感測期間uT_m3(時點t3~t4期間),控制器43控制光源停止發光。在此同時,輔助掃描信號eSR[n]產生輔助掃描脈波(例如,4V)並使感測端點Np(m,n)的電壓因電容C(m,n)耦合效應的關係而一併升高Vrs的幅度。為便於說明,定義輔助掃描脈波的脈波寬度為Tep,輔助掃描脈波的電壓幅度為Vep。如第6圖所示,電容C(m,n)的一端接收輔助掃描信號eSR[n]。因此,當輔助掃描信號eSR[n]的電壓隨著輔助掃描脈波而上升時,感測端點Np(m,n)的電壓升高幅度Vrs等於輔助掃描脈波的電壓幅度Vep(Vrs=Vep)。也因此,在元件光強度感測期間uT_m3,感測電晶體T2(m,n)隨著因閘極接收升高後的感測端點Np(m,n)的電壓而導通。延續第9A、9B、9C圖與表2的說明可以得知,感測電晶體T2(m,n)的導通電流Ids隨著感測端點Np(m,n)的電壓而改變,且光強度感測信號expDET[m]也連帶受影響。 During the element light intensity sensing period uT_m3 (during time points t3 to t4), the controller 43 controls the light source to stop emitting light. At the same time, the auxiliary scan signal eSR[n] generates the auxiliary scan pulse wave (for example, 4V) and makes the voltage of the sensing endpoint Np(m,n) combine with the coupling effect of the capacitor C(m,n). Increase the amplitude of Vrs. For ease of explanation, the pulse width of the auxiliary scanning pulse wave is defined as Tep, and the voltage amplitude of the auxiliary scanning pulse wave is defined as Vep. As shown in Figure 6, one end of the capacitor C(m,n) receives the auxiliary scanning signal eSR[n]. Therefore, when the voltage of the auxiliary scan signal eSR[n] rises with the auxiliary scan pulse wave, the voltage rise amplitude Vrs of the sensing end point Np(m,n) is equal to the voltage amplitude Vep of the auxiliary scan pulse wave (Vrs= Vep). Therefore, during the element light intensity sensing period uT_m3, the sensing transistor T2(m,n) is turned on as the gate receives the increased voltage of the sensing terminal Np(m,n). Continuing the description in Figures 9A, 9B, and 9C and Table 2, it can be known that the on-current Ids of the sensing transistor T2(m,n) changes with the voltage of the sensing terminal Np(m,n), and the light The intensity sensing signal expDET[m] is also affected.

請留意,感測端點Np(m,n)在時點t4的電壓(即,光感測元件lgtSU(m,n)的感測電壓Vexp(m,n))相當於,感測端點Np(m,n)的電壓在時點t3的電壓和輔助掃描脈波的電壓幅度Vep的總和。由於輔助掃描脈波的電壓幅度Vep的電壓為固定,且在元件光照期間uT_m2結束時(時點t3),感測端點Np(m,n)在光照強度較低時的電壓,高於感測端點Np(m,n)在光照強度較高時的電壓。連帶的,在元件光強度感測期間uT_m3結束時(時點t4),光照強度較低(上方的虛線框選處)時的感測端點Np(m,n)的電壓,亦高於光照強度較高(下方的虛線框選處)時的感測端點Np(m,n)的電壓。 Please note that the voltage of the sensing terminal Np(m,n) at time point t4 (ie, the sensing voltage Vexp(m,n) of the light sensing element lgtSU(m,n)) is equivalent to the sensing terminal Np The voltage of (m, n) is the sum of the voltage at time point t3 and the voltage amplitude Vep of the auxiliary scanning pulse wave. Since the voltage amplitude Vep of the auxiliary scanning pulse wave is fixed, and at the end of the component illumination period uT_m2 (time point t3), the voltage of the sensing endpoint Np(m,n) when the illumination intensity is low is higher than the sensing The voltage of endpoint Np(m,n) when the light intensity is high. Relatedly, at the end of the component light intensity sensing period uT_m3 (time point t4), the voltage of the sensing endpoint Np(m,n) when the light intensity is low (selected by the dotted line above) is also higher than the light intensity. The voltage of the sensing endpoint Np(m,n) when it is higher (selected by the dotted line box below).

由於主要掃描信號mSR[n]在元件光強度感測期間uT_m3為低電壓(例如,mSR[n]=-8V),讀取電晶體T1(m,n)在此段期間為關閉狀態。理想狀況下,並無電流流經讀取電晶體T1(m,n)。但,由第7圖可以得知,處 於關閉狀態的讀取電晶體T1(m,n),仍可能因閘極-源極壓差Vgs的不同而存在漏電流。 Since the main scanning signal mSR[n] is low voltage uT_m3 during the component light intensity sensing period (for example, mSR[n]=-8V), the read transistor T1(m,n) is turned off during this period. Under ideal conditions, no current flows through the read transistor T1(m,n). However, as can be seen from Figure 7, where The read transistor T1(m,n) in the off state may still have leakage current due to the difference in gate-source voltage difference Vgs.

請同時參見第10圖上方的虛線框選處的波形與表2的第一欄。當光感測元件lgtSU(m,n)接收的光照強度較弱時,感測端點Np(m,n)在時點t4的電壓較高。連帶的,光強度感測信號expDET[m]在時點t4的電壓也較高。因此,控制器43可根據由類比數位轉換器413c對光強度感測信號expDET[m]進行類比數位轉換而得出的數位感測信號expDET[m],得知光感測元件lgtSU(m,n)處於暗態。 Please also see the waveform selected by the dashed line above Figure 10 and the first column of Table 2. When the light intensity received by the light sensing element lgtSU(m,n) is weak, the voltage of the sensing terminal Np(m,n) is higher at time point t4. Relatedly, the voltage of the light intensity sensing signal expDET[m] is also higher at time point t4. Therefore, the controller 43 can learn the light sensing element lgtSU(m, n) in dark state.

根據前述說明可以得知,在此種情況下,資料讀取信號rdDAT[m]所代表之,與光感測元件lgtSU(m,n)對應的讀取電壓Vrd(m,n)較高。再者,由於與讀取電晶體T1(m,n)之源極相連的感測端點Np(m,n)在時點t4的電壓較高的緣故,讀取電晶體T1(m,n)的閘極-源極壓差Vgs較小。因此,讀取電晶體T1(m,n)處於第7圖A點的狀態,且流經讀取電晶體T1(m,n)的漏電流較低。 According to the foregoing description, it can be known that in this case, the read voltage Vrd(m,n) represented by the data read signal rdDAT[m] and corresponding to the light sensing element lgtSU(m,n) is relatively high. Furthermore, since the voltage of the sensing terminal Np(m,n) connected to the source of the reading transistor T1(m,n) is higher at time point t4, the reading transistor T1(m,n) The gate-source voltage difference Vgs is small. Therefore, the read transistor T1(m,n) is in the state of point A in FIG. 7, and the leakage current flowing through the read transistor T1(m,n) is low.

請同時參見第10圖下方的虛線框選的波形與表2的第二欄。當光感測元件lgtSU(m,n)接收的光照強度較強時,感測端點Np(m,n)在時點t4的電壓較低。連帶的,光強度感測信號expDET[m]在時點t4的電壓也較低。因此,控制器43可根據由類比數位轉換器413c對光強度感測信號expDET[m]進行類比數位轉換而得出的數位感測信號expDET[m],得知光感測元件lgtSU(m,n)處於亮態。 Please also see the waveform selected by the dotted line below Figure 10 and the second column of Table 2. When the light intensity received by the light sensing element lgtSU(m,n) is relatively strong, the voltage of the sensing terminal Np(m,n) at time point t4 is relatively low. Relatedly, the voltage of the light intensity sensing signal expDET[m] at time point t4 is also low. Therefore, the controller 43 can learn the light sensing element lgtSU(m, n) is in a bright state.

根據前述說明可以得知,在此種情況下,資料讀取信號rdDAT[m]所代表之,與光感測元件lgtSU(m,n)對應的讀取電壓Vrd(m,n)較低。再者,由於與讀取電晶體T1(m,n)之閘源相連的感測端點Np(m,n)在時點t4的電壓較低的緣故,讀取電晶體T1(m,n)的閘極-源極壓差Vgs較大。因 此,讀取電晶體T1(m,n)處於第7圖B點的狀態,且流經讀取電晶體T1(m,n)的漏電流較高。 According to the foregoing description, it can be known that in this case, the read voltage Vrd(m,n) represented by the data read signal rdDAT[m] and corresponding to the light sensing element lgtSU(m,n) is relatively low. Furthermore, because the voltage of the sensing terminal Np(m,n) connected to the gate source of the reading transistor T1(m,n) is low at time t4, the reading transistor T1(m,n) The gate-source voltage difference Vgs is larger. because Therefore, the reading transistor T1 (m, n) is in the state of point B in FIG. 7, and the leakage current flowing through the reading transistor T1 (m, n) is high.

由於讀取電晶體T1(m,n)在光感測元件lgtSU(m,n)為暗態時的漏電流較小,控制器43在元件補償期間uT_m4無須針對讀取電晶體T1(m,n)進行調整。因此,控制器43在元件補償期間uT_m4可維持主要掃描信號mSR[n]在低電壓(例如,mSR[n]=-8V)。 Since the leakage current of the read transistor T1(m,n) is small when the light sensing element lgtSU(m,n) is in the dark state, the controller 43 does not need to target the read transistor T1(m, n) make adjustments. Therefore, the controller 43 can maintain the main scanning signal mSR[n] at a low voltage (eg, mSR[n]=-8V) during the component compensation period uT_m4.

另一方面,由於讀取電晶體T1(m,n)在光感測元件lgtSU(m,n)為亮態時的漏電流較大,控制器43在元件補償期間uT_m4須針對讀取電晶體T1(m,n)進行調整。即,藉由改變主要掃描信號mSR[n]的電壓,影響讀取電晶體T1(m,n)的閘極-源極壓差Vgs,達到補償讀取電晶體T1(m,n)的漏電流現象的效果。在第10圖下方的虛線框選處中,同時列出若未進行補償情況下的主要掃描信號mSR[n],以及,進行補償情況下的主要掃描信號mSR[n]的波形。 On the other hand, since the leakage current of the reading transistor T1(m,n) is large when the light sensing element lgtSU(m,n) is in the bright state, the controller 43 must adjust the reading transistor T1(m,n) during the element compensation period uT_m4. T1(m,n) is adjusted. That is, by changing the voltage of the main scan signal mSR[n], the gate-source voltage difference Vgs of the read transistor T1(m,n) is affected, so as to compensate the leakage of the read transistor T1(m,n). Effects of current phenomena. In the dotted frame selection at the bottom of Figure 10, the waveforms of the main scanning signal mSR[n] without compensation and the main scanning signal mSR[n] with compensation are listed simultaneously.

若控制器43未利用主要掃描信號mSR[n]進行補償時,主要掃描信號mSR[n]在元件補償期間uT_m4均維持在低電壓(例如,mSR[n]=-8V)。若控制器43利用主要掃描信號mSR[n]進行補償時,主要掃描信號mSR[n]在元件補償期間uT_m4將自低電壓(例如,-8V)再降低一段下拉電壓幅度△Vdrp(例如,-1V)至補償電壓(例如,-9V)。 If the controller 43 does not use the main scanning signal mSR[n] for compensation, the main scanning signal mSR[n] is maintained at a low voltage (for example, mSR[n]=-8V) during the component compensation period uT_m4. If the controller 43 uses the main scanning signal mSR[n] for compensation, the main scanning signal mSR[n] will decrease from the low voltage (for example, -8V) by a pull-down voltage amplitude ΔVdrp (for example, -8V) during the component compensation period uT_m4 1V) to the compensation voltage (for example, -9V).

在元件補償期間uT_m4,感測端點Np(m,n)的電壓因讀取電晶體T1(m,n)為關閉狀態而維持不變。另請留意,無論是否利用主要掃描信號mSR[n]進行補償,讀取電晶體T1(m,n)與感測電晶體T2(m,n)在元件補償期間uT_m4均維持為關閉狀態,因此,本揭露所採用之補償方式,並不影響光強度感測信號expDET[m]與資料讀取信號rdDAT[m]的波形。在實際應用 中,只要能在面板補償期間pT_m4結束前,將主要掃描信號mSR[n]下拉至補償電壓即可。 During the element compensation period uT_m4, the voltage of the sensing terminal Np(m,n) remains unchanged because the read transistor T1(m,n) is in the off state. Please also note that regardless of whether the main scan signal mSR[n] is used for compensation, the read transistor T1(m,n) and the sensing transistor T2(m,n) remain in the off state during the component compensation period uT_m4, so , the compensation method adopted in this disclosure does not affect the waveforms of the light intensity sensing signal expDET[m] and the data read signal rdDAT[m]. in practical application , as long as the main scanning signal mSR[n] can be pulled down to the compensation voltage before the panel compensation period pT_m4 ends.

在元件讀取期間uT_m5(時點t6~t7期間),主要掃描信號mSR[n]產生脈波並導通讀取電晶體T1(m,n)。隨著讀取電晶體T1(m,n)的導通,控制器43藉由資料讀取信號線rdDAT[m]而對電容C(m,n)進行充電。並且,控制器43可根據電容C(m,n)在元件讀取期間uT_m5所需之充電量的多寡,得知資料讀取信號rdDAT[m]在時點t6所代表之感測端點Np(m,n)的狀態。 During the element reading period uT_m5 (during time point t6~t7), the main scanning signal mSR[n] generates a pulse wave and turns on the reading transistor T1(m,n). As the read transistor T1(m,n) is turned on, the controller 43 charges the capacitor C(m,n) through the data read signal line rdDAT[m]. Furthermore, the controller 43 can know the sensing end point Np ( m, n) state.

根據前述說明可以得知,掃描信號mSR[n]在元件重置期間uT_m1與讀取期間uT_m5的波形是相同的。且,控制器43藉由資料讀取信號線rdDAT[m]而對電容C(m,n)進行充電的同時,亦可使感測端點Np(m,n)的電壓逐步上升至重置電壓Vrst。因此,在實際應用時,可藉由此特性而使前後兩次的感測過程互相重疊(overlap),進而提升感測的效率。 According to the foregoing description, it can be known that the waveforms of the scanning signal mSR[n] during the element reset period uT_m1 and the reading period uT_m5 are the same. Moreover, while the controller 43 charges the capacitor C(m,n) through the data read signal line rdDAT[m], it can also gradually increase the voltage of the sensing terminal Np(m,n) to the reset level. Voltage Vrst. Therefore, in practical applications, this characteristic can be used to overlap the two sensing processes before and after, thereby improving the sensing efficiency.

附帶一提,在第10圖中,主要掃描脈波的脈波寬度Tmp與輔助掃描脈波的脈波寬度Tep的長度可能相等或不等,且主要掃描脈波的脈波寬度Tmp能較輔助掃描脈波的脈波寬度Tep寬或窄。主要掃描脈波的電壓幅度Vmp(-8V~8.5V)大於輔助掃描脈波的電壓幅度Vep(-7V~4V)。 Incidentally, in Figure 10, the pulse width Tmp of the main scanning pulse wave and the pulse width Tep of the auxiliary scanning pulse wave may be equal or different in length, and the pulse width Tmp of the main scanning pulse wave may be longer than that of the auxiliary scanning pulse wave. The pulse width Tep of the scanning pulse wave is wide or narrow. The voltage amplitude Vmp (-8V~8.5V) of the main scanning pulse wave is greater than the voltage amplitude Vep (-7V~4V) of the auxiliary scanning pulse wave.

根據前述說明,在第10圖中,隨著光照強度的不同,與光感測元件lgtSU(m,n)相關的控制信號之比較,可彙整於表3 According to the foregoing description, in Figure 10, the comparison of control signals related to the light sensing element lgtSU(m,n) with different light intensities can be summarized in Table 3 .

Figure 111140285-A0305-02-0025-6
Figure 111140285-A0305-02-0025-6
Figure 111140285-A0305-02-0026-7
Figure 111140285-A0305-02-0026-7

第10圖針對控制信號的說明,較著眼於單一光感測元件lgtSU(m,n)的行為。接著,基於第3圖的情境,說明感測面板採用本案之光感測元件lgtSU(m,n)時,顯示面板37並不會形成如第4A圖所示之畫面的原因。 Figure 10 illustrates the control signal, focusing more on the behavior of a single light sensing element lgtSU(m,n). Next, based on the scenario in Figure 3, the reason why the display panel 37 does not form the picture as shown in Figure 4A is explained when the sensing panel adopts the light sensing element lgtSU(m,n) of this case.

請同時參見第3、8、11圖。此處假設光感測元件lgtSU(m,1)~lgtSU(m,4)對應於第3圖中,位於第X1~X2行的像素。且,假設光感測元 件lgtSU(m,1)對應於影像23中位於空白區塊23a上方的像素、假設光感測元件lgtSU(m,2)、lgtSU(m,3)對應於影像中位於空白區塊23a的像素,以及,假設光感測元件lgtSU(m,4)對應於影像中位於空白區塊23a下方的像素。 Please also see Figures 3, 8, and 11. It is assumed here that the light sensing elements lgtSU(m,1)~lgtSU(m,4) correspond to the pixels located in rows X1~X2 in Figure 3. And, assuming that the light sensing element The element lgtSU(m,1) corresponds to the pixel located above the blank area 23a in the image 23. It is assumed that the light sensing elements lgtSU(m,2) and lgtSU(m,3) correspond to the pixels located above the blank area 23a in the image. , and assume that the light sensing element lgtSU(m,4) corresponds to the pixel located below the blank area 23a in the image.

請參見第11圖,其係採用第8圖的架構時,與光感測元件lgtSU(m,1)~lgtSU(m,4)對應之控制信號的波形圖。此圖式由上而下分別為主要掃描信號mSR[1]~mSR[4]、輔助掃描信號eSR[1]~eSR[4]、偏壓信號Vbs、數位感測信號expDET_d[m],以及數位讀取信號rdDAT_d[m]。請留意,此處說明所使用的電壓值,僅作為說明信號關係的舉例,並非用於限定本案的應用。 Please refer to Figure 11, which is a waveform diagram of the control signal corresponding to the light sensing elements lgtSU(m,1)~lgtSU(m,4) when the structure of Figure 8 is used. From top to bottom, this diagram shows the main scanning signals mSR[1]~mSR[4], the auxiliary scanning signals eSR[1]~eSR[4], the bias signal Vbs, the digital sensing signal expDET_d[m], and Digital read signal rdDAT_d[m]. Please note that the voltage values used in the description here are only used as examples to illustrate signal relationships and are not used to limit the application of this case.

第11圖的橫軸為時間。時點t1~t2期間為面板重置期間pT_m1;時點t2~t3期間為面板光照期間pT_m2;時點t3~t4期間為面板光強度感測期間pT_m3;時點t4~t6期間為面板補償期間pT_m4;且,時點t6~t7期間為面板讀取期間pT_m5。以下按照時點的順序說明。請同時參見第8、11圖。 The horizontal axis of Figure 11 is time. The period from time point t1 to t2 is the panel reset period pT_m1; the period from time point t2 to t3 is the panel illumination period pT_m2; the period from time point t3 to t4 is the panel light intensity sensing period pT_m3; the period from time point t4 to t6 is the panel compensation period pT_m4; and, The period from time point t6 to t7 is the panel reading period pT_m5. The following is explained in order of time. Please also see Figures 8 and 11.

在面板重置期間pT_m1,主要掃描信號mSR[1]~mSR[4]輪續產生自-8V上升至8.5V後,再下降至-8V的主要掃描脈波。其中,每個主要掃描脈波的期間Tmp彼此等長。光感測元件lgtSU(m,1)~lgtSU(m,4)內的讀取電晶體T1(m,1)~T1(m,4)隨著輪續產生的主要掃描信號mSR[1]~mSR[4]的脈波而輪流導通,使電容C(m,1)~C(m,n)輪流充電,進而使感測端點Np(m,1)~Np(m,4)的電壓上升至重置電壓Vrst。在此同時,輔助掃描信號eSR[1]~eSR[4]為-7V、偏壓信號Vbs為0V。光強度感測電路317未產生數位感測信號expDET_d[m],且圖像圖取電路313亦未產生數位讀取信號rdDAT_d[m]。 During the panel reset period pT_m1, the main scanning signals mSR[1]~mSR[4] continuously generate main scanning pulse waves that rise from -8V to 8.5V and then drop to -8V. Among them, the periods Tmp of each main scanning pulse wave are equal to each other. The main scanning signals mSR[1]~ generated by the read transistors T1(m,1)~T1(m,4) in the light sensing elements lgtSU(m,1)~lgtSU(m,4) follow the cycle. The pulse wave of mSR[4] is turned on in turn, so that the capacitors C(m,1)~C(m,n) are charged in turns, thereby increasing the voltage of the sensing endpoints Np(m,1)~Np(m,4). rises to the reset voltage Vrst. At the same time, the auxiliary scanning signals eSR[1]~eSR[4] are -7V, and the bias signal Vbs is 0V. The light intensity sensing circuit 317 does not generate the digital sensing signal expDET_d[m], and the image capturing circuit 313 does not generate the digital reading signal rdDAT_d[m].

在面板光照期間pT_m2,控制器43啟動光源33。在此期間,感測面板311上的光感測元件lgtSU(m,1)~lgtSU(m,4)產生的信號隨受測對 象的不同而改變。當光源33發出的X光強度越強時,面板光照期間pT_m2越短,反之亦然。光感測元件lgtSU(m,1)~lgtSU(m,4)內的光電二極體隨著位置不同而感應不同的光強度。在這段期間,主要掃描信號mSR[1]~mSR[4]維持在-8V,輔助掃描信號eSR[1]~eSR[4]維持在-7V,偏壓信號Vbs維持在0V,且數位感測信號expDET_d[m],以及數位讀取信號rdDAT_d[m]均未產生。 During the panel illumination period pT_m2, the controller 43 activates the light source 33. During this period, the signals generated by the light sensing elements lgtSU(m,1)~lgtSU(m,4) on the sensing panel 311 change with the measured Changes depending on the image. When the X-ray intensity emitted by the light source 33 is stronger, the panel illumination period pT_m2 is shorter, and vice versa. The photodiodes in the light sensing elements lgtSU(m,1)~lgtSU(m,4) sense different light intensities with different positions. During this period, the main scanning signals mSR[1]~mSR[4] are maintained at -8V, the auxiliary scanning signals eSR[1]~eSR[4] are maintained at -7V, the bias signal Vbs is maintained at 0V, and the digital sensor Neither the detection signal expDET_d[m] nor the digital read signal rdDAT_d[m] is generated.

在面板光強度感測期間pT_m3,主要掃描信號mSR[1]~mSR[4]均維持在-8V,且輔助掃描信號eSR[1]~eSR[4]輪續產生自-7V上升至4V後,再下降至-7V的輔助掃描脈波。其中,每個輔助掃描脈波的期間Tep彼此等長。在面板光強度感測期間pT_m3,偏壓信號Vbs上升至一個正電壓(例如,4V或5V),且根據光強度感測信號expDET[m]所產生之數位感測信號expDET_d[m],在數位感測期間△t1~△t4分別與光感測元件lgtSU(m,1)~lgtSU(m,4)對應。在此期間,數位讀取信號rdDAT_d[m]尚未產生。控制器43先根據在數位感測期間△t1~△t4的數位感測信號expDET_d[m]而分別判斷光感測元件lgtSU(m,1)~lgtSU(m,4)的受光情況。數位感測期間△t1~△t4的長度均較輔助掃描脈波的期間Tep短,且數位感測期間△t1~△t4分別介於與輔助掃描信號eSR[1]~eSR[4]對應之輔助掃描脈波的期間Tep內。 During the panel light intensity sensing period pT_m3, the main scanning signals mSR[1]~mSR[4] are maintained at -8V, and the auxiliary scanning signals eSR[1]~eSR[4] are continuously generated after rising from -7V to 4V. , and then drops to the auxiliary scanning pulse wave of -7V. The periods Tep of each auxiliary scanning pulse wave are equal to each other. During the panel light intensity sensing period pT_m3, the bias signal Vbs rises to a positive voltage (for example, 4V or 5V), and the digital sensing signal expDET_d[m] generated according to the light intensity sensing signal expDET[m], The digital sensing periods △t1~△t4 correspond to the light sensing elements lgtSU(m,1)~lgtSU(m,4) respectively. During this period, the digital read signal rdDAT_d[m] has not yet been generated. The controller 43 first determines the light receiving conditions of the light sensing elements lgtSU(m,1)~lgtSU(m,4) based on the digital sensing signals expDET_d[m] during the digital sensing period Δt1~Δt4. The lengths of the digital sensing periods △t1~△t4 are shorter than the period Tep of the auxiliary scanning pulse wave, and the digital sensing periods △t1~△t4 are respectively between the periods corresponding to the auxiliary scanning signals eSR[1]~eSR[4]. Within the period Tep of the auxiliary scanning pulse wave.

接著,控制器43根據在面板光強度感測期間pT_m3所判斷之光感測元件lgtSU(m,1)~lgtSU(m,4)的受光情況,決定主要掃描信號mSR[1]~mSR[4]在面板補償期間pT_m4的電壓。延續前述假設的情況下,即,假設光感測元件lgtSU(m,1)、lgtSU(m,4)並未過曝,故主要掃描信號mSR[1]、mSR[4]在面板補償期間pT_m4維持-8V。另一方面,因為光感測元件lgtSU(m,2)、lgtSU(m,3)過曝的緣故,故主要掃描信號mSR[2]、mSR[3]在面板補償期間pT_m4的前期(時點t4~t5期間)維持-8V,但在面板補償期間pT_m4的後期(時點t5~t6期間)則降低至-9V。在面板補償期間pT_m4,輔助掃描信號 eSR[1]~eSR[4]為-7V,偏壓信號Vbs為0V。數位強度感測信號expDET_d[m],以及數位讀取信號rdDAT_d[m]均未產生。 Then, the controller 43 determines the main scanning signals mSR[1]~mSR[4 according to the light receiving conditions of the light sensing elements lgtSU(m,1)~lgtSU(m,4) determined during the panel light intensity sensing period pT_m3 ]The voltage of pT_m4 during panel compensation. Continuing the above assumption, that is, assuming that the light sensing elements lgtSU(m,1) and lgtSU(m,4) are not overexposed, the main scanning signals mSR[1] and mSR[4] are during the panel compensation period pT_m4 Maintain -8V. On the other hand, because the light sensing elements lgtSU(m,2) and lgtSU(m,3) are overexposed, the main scanning signals mSR[2] and mSR[3] are in the early stage of the panel compensation period pT_m4 (time point t4 ~t5 period) maintains -8V, but decreases to -9V in the later part of the panel compensation period pT_m4 (time point t5~t6 period). During panel compensation pT_m4, auxiliary scanning signal eSR[1]~eSR[4] are -7V, and the bias signal Vbs is 0V. Neither the digital intensity sensing signal expDET_d[m] nor the digital read signal rdDAT_d[m] is generated.

附帶一提,基於簡化控制的考量,在實際應用時,在面板補償期間pT_m4可採同步控制的方式產生主要掃描信號mSR[1]~mSR[N]。即,非僅改變發生過曝現象所在之列數的光感測元件lgtSU(m,n)所對應的主要掃描信號mSR[n]的波形,而是在發現位於第m行的N個光感測元件lgtSU(m,1)~lgtSU(m,N)有任何一列存在過曝現象時,便在面板補償期間pT_m4同步產生具有補償波形的主要掃描信號mSR[1]~mSR[N]。 By the way, based on the consideration of simplified control, in practical applications, pT_m4 can be controlled synchronously to generate the main scanning signals mSR[1]~mSR[N] during the panel compensation period. That is, instead of just changing the waveform of the main scanning signal mSR[n] corresponding to the light sensing element lgtSU(m,n) in the column where the overexposure phenomenon occurs, it is found that the N light sensors located in the mth row When any column of the measuring components lgtSU(m,1)~lgtSU(m,N) is overexposed, pT_m4 will synchronously generate main scanning signals mSR[1]~mSR[N] with compensation waveforms during the panel compensation period.

此種同步改變主要掃描信號mSR[1]~mSR[N]之電壓的作法,不需針對存在過曝現象的特定列數進行控制,而是整體性的對全部的列數進行控制,故可簡化控制的複雜度。如前所述,在面板補償期間pT_m4改變主要掃描信號mSR[1]~mSR[N]的電壓,並不會影響其他信號的波形。因此,此種作法並不會影響光強度感測電路45所接收的資料讀取信號rdDAT[m],亦不會影響控制器43所接收的數位強度感測信號expDET_d[m]。 This method of synchronously changing the voltage of the main scanning signals mSR[1]~mSR[N] does not need to control the specific number of columns where overexposure occurs, but controls all the number of columns as a whole, so it can Simplify control complexity. As mentioned before, pT_m4 changes the voltage of the main scanning signals mSR[1]~mSR[N] during the panel compensation period and does not affect the waveforms of other signals. Therefore, this approach will not affect the data reading signal rdDAT[m] received by the light intensity sensing circuit 45, nor will it affect the digital intensity sensing signal expDET_d[m] received by the controller 43.

在面板讀取期間pT_m5,主要掃描信號mSR[1]~mSR[4]輪續產生先自-8V或-9V上升至8.5V後,再下降至-8V或-9V的主要掃描信號脈波。輔助掃描信號eSR[1]~eSR[4]在面板讀取期間pT_m5維持在-7V,偏壓信號Vbs為0V。光強度感測信號expDET[m]在面板讀取期間pT_m5未產生。根據資料讀取信號rdDAT[m]所產生之數位讀取信號rdDAT_d[m],在數位讀取期間△t5~△t8分別與光感測元件lgtSU(m,1)~lgtSU(m,4)對應。因此,控制器43可根據在數位讀取期間△t5~△t8的數位讀取信號rdDAT_d[m],分別產生與光感測元件lgtSU(m,1)~lgtSU(m,4)對應的影像資料。數位讀取期間△t5~△t8的長度均較主要掃描脈波的期間Tmp短,且數位讀取期間△t5~△t8分別介於與主要掃描信號mSR[1]~mSR[4]對應之主要掃描脈波的期間Tmp內。 During the panel reading period pT_m5, the main scanning signals mSR[1]~mSR[4] continuously generate main scanning signal pulses that first rise from -8V or -9V to 8.5V, and then drop to -8V or -9V. The auxiliary scanning signals eSR[1]~eSR[4] are maintained at -7V during panel reading, and the bias signal Vbs is 0V. The light intensity sensing signal expDET[m] is not generated during panel reading. The digital read signal rdDAT_d[m] generated according to the data read signal rdDAT[m] is connected to the light sensing element lgtSU(m,1)~lgtSU(m,4) respectively during the digital read period △t5~△t8. correspond. Therefore, the controller 43 can generate images corresponding to the light sensing elements lgtSU(m,1)~lgtSU(m,4) respectively according to the digital read signals rdDAT_d[m] during the digital read period Δt5~Δt8. material. The lengths of the digital reading periods △t5~△t8 are shorter than the period Tmp of the main scanning pulse wave, and the digital reading periods △t5~△t8 are respectively between those corresponding to the main scanning signals mSR[1]~mSR[4]. It mainly scans the period Tmp of the pulse wave.

採用第11圖的方式控制感測面板311時,控制器43可根據數位感測信號expDET_d[m]在數位感測期間△t1~△t4的變化,判斷光感測元件lgtSU(m,1)~lgtSU(m,4)所感測到的光照強度是否過強。並且,針對出現過曝情況的光感測元件lgtSU(m,2)、lgtSU(m,3)進行補償,藉以在面板補償期間pT_m4動態地改變主要掃描信號mSR[2]、mSR[3]的電壓。 When controlling the sensing panel 311 in the manner shown in Figure 11, the controller 43 can determine the light sensing element lgtSU(m,1) based on the change of the digital sensing signal expDET_d[m] during the digital sensing period Δt1~Δt4. Whether the light intensity sensed by ~lgtSU(m,4) is too strong. In addition, compensation is performed for the light sensing elements lgtSU(m,2) and lgtSU(m,3) that are overexposed, thereby dynamically changing the main scanning signals mSR[2] and mSR[3] during the panel compensation period pT_m4 voltage.

隨著主要掃描信號mSR[2]、mSR[3]在面板補償期間pT_m4的改變,光感測元件lgtSU(m,2)、lgtSU(m,3)中的漏電流情形將獲得改善。因此,光感測元件lgtSU(m,1)並不會因為光感測元件lgtSU(m,2)、lgtSU(m,3)的漏電流而改變亮度。因此,採用本案構想之光感測元件時,顯示面板37可如實的顯示如第3圖所示的畫面,並不會出現如第4A圖所示的情形。 As the main scanning signals mSR[2], mSR[3] change pT_m4 during the panel compensation period, the leakage current situation in the light sensing elements lgtSU(m,2), lgtSU(m,3) will be improved. Therefore, the brightness of the light sensing element lgtSU(m,1) will not change due to the leakage current of the light sensing elements lgtSU(m,2) and lgtSU(m,3). Therefore, when using the light sensing element conceived in this project, the display panel 37 can faithfully display the image as shown in Figure 3, and the situation as shown in Figure 4A will not occur.

基於簡化設計的考量,實際應用時,亦可在面板光強度感測期間pT_m3開始時(時點t3),將輔助掃描信號eSR[1]~eSR[4]同步拉高,並在面板光強度感測期間pT_m3同時維持在4V,待面板光強度感測期間pT_m3結束後(時點t4),再將輔助掃描信號eSR[1]~eSR[4]同步拉回至-7V。 Based on the consideration of simplified design, in actual application, the auxiliary scanning signals eSR[1]~eSR[4] can be pulled up synchronously at the beginning of the panel light intensity sensing period pT_m3 (time point t3), and the auxiliary scanning signals eSR[1]~eSR[4] can be pulled high when the panel light intensity sensing period starts. During the measurement period, pT_m3 is maintained at 4V at the same time. After the panel light intensity sensing period pT_m3 ends (time point t4), the auxiliary scanning signals eSR[1]~eSR[4] are synchronously pulled back to -7V.

以同步方式產生輔助掃描信號eSR[1]~eSR[4]時,讀取電晶體T1(m,1)~T1(m,2)將同時導通,且光強度感測信號expDET[m]的電壓同時受到讀取電晶體T1(m,1)~T1(m,2)所影響。因此,根據光強度感測信號expDET[m]而轉換產生的數位感測信號expDET_d[m]反映一個由光感測元件lgtSU(m,1)~lgtSU(m,4)共同影響後的結果。也因此,控制器43雖可得知位於光感測元件lgtSU(m,1)~lgtSU(m,4)中的某處存在過曝情況,但無法明確得知發生過曝現象的光感測元件lgtSU(m,n)所在的列數(n的數值)。 When the auxiliary scanning signals eSR[1]~eSR[4] are generated in a synchronous manner, the read transistors T1(m,1)~T1(m,2) will be turned on at the same time, and the light intensity sensing signal expDET[m] The voltage is also affected by the read transistors T1(m,1)~T1(m,2). Therefore, the digital sensing signal expDET_d[m] converted according to the light intensity sensing signal expDET[m] reflects a result that is jointly affected by the light sensing elements lgtSU(m,1)~lgtSU(m,4). Therefore, although the controller 43 can know that there is an overexposure situation somewhere among the light sensing elements lgtSU(m,1)~lgtSU(m,4), it cannot clearly know the light sensor where the overexposure phenomenon occurs. The number of columns (the value of n) where the element lgtSU(m,n) is located.

在第11圖中,以變數x代表進行感測的次數。時點t1~t6對應於進行第x次感測的感測期間Tcyc[x],時點t6開始為第(x+1)次感測的感測期 間Tcyc[x+1]。其中,時點t5~t6為感測期間Tcyc[x]中的元件讀取期間uT_m5,亦為感測期間Tcyc[x+1]中的元件重置期間uT_m1。即,連續兩次的感測期間Tcyc[x]、Tcyc[x+1],可部分重疊。 In Figure 11, a variable x represents the number of times sensing is performed. Time points t1 to t6 correspond to the sensing period T cyc [x] for the x-th sensing, and time point t6 starts as the sensing period T cyc [x+1] for the (x+1)-th sensing. Among them, time points t5 to t6 are the element reading period uT_m5 in the sensing period T cyc [x], and are also the element reset period uT_m1 in the sensing period T cyc [x+1]. That is, two consecutive sensing periods T cyc [x] and T cyc [x+1] may partially overlap.

請參見第12圖,其係搭配多工器的使用,將感測電路與讀取電路結合之示意圖。此圖式的光感測元件lgtSU(m,1)~lgtSU(m,4)的連接方式均與第8圖相似。與第8圖不同的是,在第12圖中,並非獨立設置讀取電路413和光強度感測電路45,而是提供結合光強度感測功能和讀取功能的光強度感測暨圖像讀取電路513,並搭配多工器53使用。 Please refer to Figure 12, which is a schematic diagram of combining the sensing circuit and the reading circuit using a multiplexer. The connection methods of the light sensing elements lgtSU(m,1)~lgtSU(m,4) in this figure are similar to those in Figure 8. What is different from Figure 8 is that in Figure 12, the reading circuit 413 and the light intensity sensing circuit 45 are not provided independently, but a light intensity sensing and image reading system that combines the light intensity sensing function and the reading function is provided. Take circuit 513 and use it with multiplexer 53.

多工器53包含PMOS電晶體Mp與NMOS電晶體Mn,PMOS電晶體Mp與NMOS電晶體的閘極由功能選取信號fsS[m]控制。控制器515可視情況改變功能選取信號fsS[m]的電壓,並選擇性導通含PMOS電晶體Mp與NMOS電晶體Mn的其中一者。例如,當功能選取信號fsS[m]為高邏輯位準時,NMOS電晶體Mn導通且PMOS電晶體Mp斷開;當功能選取信號fsS[m]為低邏輯位準時,PMOS電晶體Mp導通且NMOS電晶體Mn斷開。 The multiplexer 53 includes a PMOS transistor Mp and an NMOS transistor Mn. The gates of the PMOS transistor Mp and the NMOS transistor are controlled by the function selection signal fsS[m]. The controller 515 may optionally change the voltage of the function selection signal fsS[m] and selectively turn on one of the PMOS transistor Mp and the NMOS transistor Mn. For example, when the function selection signal fsS[m] is a high logic level, the NMOS transistor Mn is turned on and the PMOS transistor Mp is turned off; when the function selection signal fsS[m] is a low logic level, the PMOS transistor Mp is turned on and the NMOS transistor Mp is turned off. Transistor Mn is disconnected.

光強度感測信號線expDET[m]與資料讀取信號線rdDAT[m]均共同電連接至多工器53。當PMOS電晶體Mp導通時,光強度感測暨圖像讀取電路513自多工器53接收的資料選取信號selDAT[m]為光強度感測信號線expDET[m]。另一方面,當NMOS電晶體Mn導通時,光強度感測暨圖像讀取電路513自多工器53接收的資料選取信號selDAT[m]為資料讀取信號rdDAT[m]。 The light intensity sensing signal line expDET[m] and the data reading signal line rdDAT[m] are both electrically connected to the multiplexer 53 . When the PMOS transistor Mp is turned on, the data selection signal selDAT[m] received by the light intensity sensing and image reading circuit 513 from the multiplexer 53 is the light intensity sensing signal line expDET[m]. On the other hand, when the NMOS transistor Mn is turned on, the data selection signal selDAT[m] received by the light intensity sensing and image reading circuit 513 from the multiplexer 53 is the data reading signal rdDAT[m].

兼具光強度感測功能和讀取功能的光強度感測暨圖像讀取電路513自多工器53接收資料選取信號selDAT[m]後,先利用積分器513a轉 換為類比資料選取信號selDAT_a[m]。之後,再利用類比數位轉換器513c將類比資料選取信號selDAT_a[m]轉換為數位資料選取信號selDAT_d[m]。當控制器515從類比數位轉換器513c接收數位資料選取信號selDAT_d[m]後,再依據數位資料選取信號selDAT_d[m]的來源為光強度感測信號線expDET[m]或資料讀取信號線rdDAT[m]而進行後續的控制。 The light intensity sensing and image reading circuit 513, which has both the light intensity sensing function and the reading function, receives the data selection signal selDAT[m] from the multiplexer 53, and first uses the integrator 513a to convert Change to analog data selection signal selDAT_a[m]. After that, the analog-to-digital converter 513c is used to convert the analog data selection signal selDAT_a[m] into the digital data selection signal selDAT_d[m]. When the controller 515 receives the digital data selection signal selDAT_d[m] from the analog-to-digital converter 513c, the source of the digital data selection signal selDAT_d[m] is the light intensity sensing signal line expDET[m] or the data reading signal line. rdDAT[m] for subsequent control.

另請留意,此處雖假設光強度感測信號線expDET[m]電連接於PMOS電晶體Mp,且資料讀取信號線rdDAT[m]電連接於NMOS電晶體Mn。但在實際應用時,多工器53的內部設計,以及如何與光強度感測信號線expDET[m]和資料讀取信號線rdDAT[m]相連等細節,並不以此為限。 Please also note that it is assumed here that the light intensity sensing signal line expDET[m] is electrically connected to the PMOS transistor Mp, and the data reading signal line rdDAT[m] is electrically connected to the NMOS transistor Mn. However, in actual applications, the internal design of the multiplexer 53 and how it is connected to the light intensity sensing signal line expDET[m] and the data reading signal line rdDAT[m] are not limited to this.

如前所述,根據本揭露構想的感測面板,透過在實際讀取前,預先感測在感測端點Np(m,n)的電壓,進而根據感測結果,在讀取前預先改變與原本會出現過曝現象的光感測元件相連之主要掃描信號mSR[n]的電壓(-8V→-9V),使讀取電晶體T1(m,n)產生的漏電流降低。 As mentioned above, the sensing panel according to the present disclosure pre-senses the voltage at the sensing terminal Np(m,n) before actually reading, and then pre-changes the voltage before reading based on the sensing result. The voltage of the main scanning signal mSR[n] (-8V→-9V) connected to the light sensing element that would otherwise be overexposed reduces the leakage current generated by the read transistor T1(m,n).

藉由此種預先感測、預先調整閘極電壓的方式,可以防止因為部分的光感測元件因為過曝而產生影響其他光感測元件之漏電流現象。且,採用本案構想時,並不會改變資料讀取信號rdDAT[m]的波形。因此,並不會出現如第4B圖所述之影響細節呈現的情況,而可維持感測影像的準確性。 By pre-sensing and pre-adjusting the gate voltage, it is possible to prevent leakage current from affecting other photo-sensing elements due to overexposure of some photo-sensing elements. Moreover, when the concept of this project is adopted, the waveform of the data read signal rdDAT[m] will not be changed. Therefore, the situation that affects the presentation of details as described in Figure 4B will not occur, and the accuracy of the sensed image can be maintained.

綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed above through embodiments, they are not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the appended patent application scope.

3:光感測系統 3:Light sensing system

33:光源 33:Light source

31:光感測裝置 31:Light sensing device

37:顯示面板 37:Display panel

315:控制器 315:Controller

319a:主要選取電路 319a: Main selection circuit

319c:輔助選取電路 319c: Auxiliary selection circuit

311:感測面板 311: Sensing panel

313:圖像讀取電路 313:Image reading circuit

317:光強度感測電路 317:Light intensity sensing circuit

38:偏壓電路 38: Bias circuit

lgtctlS:光源控制信號 lgtctlS: light source control signal

rdDAT_d[1]~rdDAT_d[M]:數位讀取信號 rdDAT_d[1]~rdDAT_d[M]: digital read signal

mctlS,ectlS:列選取控制信號 mctlS,ectlS: column selection control signal

mSR[1]~mSR[N]:主要掃描信號 mSR[1]~mSR[N]: main scanning signal

eSR[1]~eSR[N]:輔助掃描信號 eSR[1]~eSR[N]: auxiliary scanning signal

Vbs:偏壓信號(線) Vbs: bias signal (line)

expDET[1]~expDET[M]:光強度感測信號 expDET[1]~expDET[M]: light intensity sensing signal

bsES:偏壓致能信號 bsES: bias enable signal

expDET_d[1]~expDET_d[M]:數位感測信號 expDET_d[1]~expDET_d[M]: digital sensing signal

Claims (10)

一種光感測元件,電連接於一資料讀取信號線、一光強度感測信號線、一主要掃描信號線與一輔助掃描信號線,包含:一感光電路,電連接於一感測端點與該輔助掃描信號線,其係於一光照期間感測一光照強度,使該感測端點的電壓隨著該光照強度而改變;一感測電晶體,電連接於該感測端點與該光強度感測信號線,其係於一光強度感測期間因應該感測端點的電壓而改變該光強度感測信號線的電壓,且該主要掃描信號線的電壓係於一補償期間,因應該光強度感測信號線的電壓而選擇性改變;以及,一讀取電晶體,電連接於該感測端點、該資料讀取信號線與該主要掃描信號線,其係於一讀取期間,根據該主要掃描信號線的脈波而導通,進而使該資料讀取信號線反映該感測端點的電壓,其中該光強度感測期間晚於該光照期間、該補償期間晚於該光強度感測期間,且該讀取期間晚於該補償期間。 A light sensing element electrically connected to a data reading signal line, a light intensity sensing signal line, a main scanning signal line and an auxiliary scanning signal line, including: a photosensitive circuit electrically connected to a sensing terminal and the auxiliary scanning signal line, which senses an illumination intensity during an illumination period, so that the voltage of the sensing endpoint changes with the illumination intensity; a sensing transistor, electrically connected between the sensing endpoint and The light intensity sensing signal line changes the voltage of the light intensity sensing signal line according to the voltage of the sensing terminal during a light intensity sensing period, and the voltage of the main scanning signal line changes during a compensation period. , selectively changed in response to the voltage of the light intensity sensing signal line; and, a reading transistor, electrically connected to the sensing endpoint, the data reading signal line and the main scanning signal line, which is connected to a During the reading period, the main scanning signal line is turned on according to the pulse wave, so that the data reading signal line reflects the voltage of the sensing endpoint, wherein the light intensity sensing period is later than the illumination period and the compensation period is later During the light intensity sensing period, and the reading period is later than the compensation period. 如請求項1所述之光感測元件,其中該主要掃描信號線係於一重置期間產生導通該讀取電晶體的脈波,且該感測端點的電壓係於該重置期間上升至一重置電壓,其中該光照期間晚於該重置期間。 The light sensing element of claim 1, wherein the main scanning signal line generates a pulse wave that turns on the reading transistor during a reset period, and the voltage of the sensing terminal increases during the reset period. to a reset voltage, wherein the illumination period is later than the reset period. 如請求項2所述之光感測元件,其中該感測電晶體係於該重置化期間、該光照期間、該補償期間與該讀取期間維持斷開。 The light sensing element of claim 2, wherein the sensing transistor remains disconnected during the reset period, the illumination period, the compensation period and the reading period. 如請求項2所述之光感測元件,其中該感光電路係包含:一光電二極體,電連接於該感測端點與該輔助掃描信號線;以及,一電容,電連接於該感測端點與該輔助掃描信號線,其係於該重置期間透過該讀取電晶體的導通而充電。 The light sensing element as described in claim 2, wherein the light sensing circuit includes: a photodiode, electrically connected to the sensing endpoint and the auxiliary scanning signal line; and, a capacitor, electrically connected to the sensing endpoint. The detection endpoint and the auxiliary scanning signal line are charged through the conduction of the reading transistor during the reset period. 如請求項1所述之光感測元件,其中該讀取電晶體,係於該光照期間、該光強度感測期間與該補償期間維持斷開。 The light sensing element of claim 1, wherein the reading transistor remains turned off during the illumination period, the light intensity sensing period and the compensation period. 如請求項1所述之光感測元件,其中該感測電晶體係電連接於一偏壓信號線,其中該偏壓信號線在該光強度感測期間的電壓,高於在該光照期間與該補償期間的電壓。 The light sensing element of claim 1, wherein the sensing transistor is electrically connected to a bias signal line, wherein the voltage of the bias signal line during the light intensity sensing period is higher than during the illumination period. and the voltage during this compensation period. 如請求項6所述之光感測元件,其中在該光強度感測期間,該感測電晶體係因應感測端點的電壓而選擇性將該偏壓信號線的電壓傳導至該光強度感測信號線。 The light sensing element of claim 6, wherein during the light intensity sensing period, the sensing transistor selectively conducts the voltage of the bias signal line to the light intensity in response to the voltage of the sensing terminal. Sensing signal line. 如請求項1所述之光感測元件,其中當該光照強度越強時,該光強度感測信號線在該光強度感測期間的電壓越低,且 當該光強度感測信號線的電壓低於一預設門檻時,該主要掃描信號線在該補償期間自一第一電壓切換為一第二電壓,其中該第一電壓高於該第二電壓;以及,當該光強度感測信號線高於或等於該預設門檻時,該主要掃描信號線在該補償期間維持在該第一電壓。 The light sensing element of claim 1, wherein when the light intensity is stronger, the voltage of the light intensity sensing signal line during the light intensity sensing period is lower, and When the voltage of the light intensity sensing signal line is lower than a preset threshold, the main scanning signal line switches from a first voltage to a second voltage during the compensation period, wherein the first voltage is higher than the second voltage. ; And, when the light intensity sensing signal line is higher than or equal to the preset threshold, the main scanning signal line is maintained at the first voltage during the compensation period. 一種感測面板,電連接於一控制器,包含:複數個光感測元件,排列為M行與N列,其中該等光感測元件中的一第一光感測元件係位於一第m行與一第n列,且該第一光感測元件係電連接於一第m行資料讀取信號線、一第m行光強度感測信號線、一第n列主要掃描信號線與一第n列輔助掃描信號線,其中該第一光感測元件係包含:一感光電路,電連接於一感測端點與該第n列輔助掃描信號線,其係於一光照期間感測一光照強度,使該感測端點的電壓隨著該光照強度而改變;一感測電晶體,電連接於該感測端點與該第m行光強度感測信號線,其係於一光強度感測期間因應該感測端點的電壓而改變該第m行光強度感測信號線的電壓,且該第n列主要掃描信號線的電壓係於一補償期間因應該第m行光強度感測信號線的電壓而選擇性改變;以及,一讀取電晶體,電連接於該感測端點、該第m行資料讀取信號線與該主要掃描信號線,其係於一讀取期間根據該第n列主要掃描信號線的脈波而導通,進而使該第m行資料讀取信號線反映該感測端點的電壓,其中該控制器係根據該第m行資料讀取 信號線在該讀取期間的電壓而產生與該第一光感測元件對應之一圖像資料,其中該光強度感測期間晚於該光照期間、該補償期間晚於該光強度感測期間,且該讀取期間晚於該補償期間,其中M、N、m、n為正整數、m小於或等於M,且n小於或等於N。 A sensing panel, electrically connected to a controller, including: a plurality of light sensing elements arranged in M rows and N columns, wherein a first light sensing element among the light sensing elements is located at an mth row and an n-th column, and the first light sensing element is electrically connected to an m-th row data reading signal line, an m-th row light intensity sensing signal line, an n-th column main scanning signal line and an The nth column of auxiliary scanning signal lines, wherein the first light sensing element includes: a photosensitive circuit electrically connected to a sensing terminal and the nth column of auxiliary scanning signal lines, which senses a The intensity of light causes the voltage of the sensing terminal to change with the intensity of light; a sensing transistor is electrically connected to the sensing terminal and the m-th row of light intensity sensing signal lines, which are connected to a light During the intensity sensing period, the voltage of the light intensity sensing signal line of the m-th row is changed in response to the voltage of the sensing terminal, and the voltage of the main scanning signal line of the n-th column is changed in response to the light intensity of the m-th row during a compensation period. The voltage of the sensing signal line is selectively changed; and, a reading transistor is electrically connected to the sensing terminal, the m-th row data reading signal line and the main scanning signal line, which is connected to a reading During this period, it is turned on according to the pulse wave of the main scanning signal line of the nth column, so that the data reading signal line of the mth row reflects the voltage of the sensing endpoint, wherein the controller reads the data of the mth row according to the The voltage of the signal line during the reading period generates image data corresponding to the first light sensing element, wherein the light intensity sensing period is later than the illumination period, and the compensation period is later than the light intensity sensing period. , and the reading period is later than the compensation period, where M, N, m, and n are positive integers, m is less than or equal to M, and n is less than or equal to N. 如請求項9所述之感測面板,其中該等光感測元件中的一第二光感測元件係位於該第m行與一第(n+1)列,且該等光感測元件中的一第三光感測元件係位於一第(m+1)行與該第n列,其中該第二光感測元件係電連接於該第m行資料讀取信號線、該第m行光強度感測信號線、一第(n+1)列主要掃描信號線與一第(n+1)列輔助掃描信號線,且該第三光感測元件係電連接於一第(m+1)行資料讀取信號線、一第(m+1)行光強度感測信號線、該第n列主要掃描信號線與該第n列輔助掃描信號線。 The sensing panel as claimed in claim 9, wherein a second light sensing element among the light sensing elements is located in the mth row and an (n+1)th column, and the light sensing elements A third light sensing element is located in a (m+1)th row and the nth column, wherein the second light sensing element is electrically connected to the mth row data reading signal line, the mth Row light intensity sensing signal lines, an (n+1)th column main scanning signal line and an (n+1)th column auxiliary scanning signal line, and the third light sensing element is electrically connected to an (m+1)th column +1) row data reading signal line, a (m+1)th row light intensity sensing signal line, the nth column main scanning signal line and the nth column auxiliary scanning signal line.
TW111140285A 2022-10-24 2022-10-24 Light detecting component and detecting panel TWI817785B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201625981A (en) * 2015-01-09 2016-07-16 群創光電股份有限公司 X-ray sensor panel
CN114338867A (en) * 2020-10-12 2022-04-12 苹果公司 Electronic device comprising a glass-ceramic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201625981A (en) * 2015-01-09 2016-07-16 群創光電股份有限公司 X-ray sensor panel
CN114338867A (en) * 2020-10-12 2022-04-12 苹果公司 Electronic device comprising a glass-ceramic component

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