TWI816446B - Laser application processing system and method thereof - Google Patents

Abstract

A laser application processing system and its method are applied in the processing environment of laser detection and processing. The laser application processing system of the present invention is used to perform the laser application processing method. When using the laser detection process, first, Move the workpiece (processed object) under the focused light of femtosecond laser SHG or THG detection; then, the data of the spatial distribution of the SHG or THG signal on the workpiece will be obtained; then, the workpiece will be set according to the SHG or THG signal value. The optimal laser processing parameter set required for the point; furthermore, during the laser processing process, the workpiece that has completed the laser inspection process can be moved under the focused light of femtosecond laser processing for laser processing. Laser processing, and/or, first use the focused light of femtosecond laser processing to laser process the workpiece. After the processing is completed, the workpiece is then subjected to a laser inspection process in order to detect whether the workpiece after laser processing is Meet the required requirements. When the laser application processing system of the present invention performs the laser application processing method, for example, by means of the laser detection process, the unevenness of the material can be detected, the detection can be quantified, and a map corresponding to different positions of the material can be established. (For example, a set of X, Y, Z coordinates) detection quantification value table; in addition, during the laser processing process, the detection quantification value table is used to perform optimal parameter set processing at different positions during laser processing. . The laser application processing system and method of the present invention can combine SHG or THG detection techniques and laser processing techniques to complete the post-detection compensation method.

Description

Laser application processing system and method thereof

The present invention relates to a laser application processing system and method. More specifically, it relates to a laser application processing system and method applied in a processing environment for laser detection and processing. The invention is based on the laser detection process. The method can detect the unevenness of the material, quantify the detection, and establish a detection quantification value table corresponding to different positions of the material (for example, a set of X, Y, Z coordinates). In addition, during laser processing During the processing process, during laser processing, the optimal parameter set processing at different positions is performed according to this detection and quantification value table. The laser application processing system and method of the present invention can be combined with SHG or THG detection techniques and laser processing techniques to Compensation method after completion of testing.

As far as the current laser processing and inspection are concerned, the two are separated and carried out on different platforms. For example, the inspection is first completed on an inspection platform and the optimal laser processing parameter set data required for different materials is obtained, so as to facilitate Subsequently, on another laser processing platform, these different materials are laser processed according to the optimal laser processing parameter set data required for different materials.

However, the disadvantage of this conventional laser processing and inspection technology is that since inspection and processing are not on the same platform, the position calibration of the workpiece (processed object) and the laser inspection light/laser processing focused light is often inconsistent. is a problem.

Furthermore, in the conventional technology, when materials are tested, materials are often detected in a destructive manner, which often fails to obtain accurate detection values, and it is also impossible to effectively perform laser processing on the workpiece.

In addition, in the conventional technology, problems such as material defects and unevenness cannot be effectively reflected during material inspection, resulting in difficulties in laser processing of the workpiece.

In addition, the problem faced by the conventional technology is how to overcome the problem that the "same material" but the material itself is uneven, resulting in poor results if the entire material is processed with the same laser parameters.

Taiwan Publication/Announcement No. I758923 "Laser Detection System" discloses a laser detection system in which a laser source emits a laser with a first spectrum and transmits the laser through a first optical fiber, and a gain optical fiber is connected to the first optical fiber. An optical fiber, an optical detector is disposed at the gain fiber, wherein when the laser with the first spectrum passes through the gain fiber, part of the energy level of the laser with the first spectrum is absorbed by the gain fiber, The frequency of the laser with the first spectrum is converted to generate light with the second spectrum, and the intensity of the light with the second spectrum is detected by the light detector. This disclosure uses a gain fiber doped with special ions to absorb part of the energy level of the laser, and generates other light through the frequency conversion phenomenon of the laser, so as to detect the intensity of the other light to derive the power of the laser source.

Taiwan Publication/Announcement No. I668406 "Laser Detection Device" discloses a laser detection device used to measure the contour of a workpiece. It includes a fixed part and a laser displacement sensor fixed on the fixed part. The laser displacement sensor The detector includes a laser transmitter head and a laser receiver head arranged side by side. The laser detection device also includes a reflective member. The reflective member includes a lens fixed on the fixing member and spaced apart from the laser displacement sensor. The lens has a phase phase with the laser light emitted by the laser emitter. With an inclined reflective surface, the laser emitting head can emit laser light to the workpiece from a preset angle and reflect it back to the laser receiving head. The laser can emit the part of the laser emitting head through the reflective surface. The laser light is reflected to the workpiece at another angle and the part of the laser light is directly reflected or reflected back to the laser receiving head through the lens.

Taiwan Publication/Announcement No. I576187 "Laser Processing Device" discloses an accessory device 112, and the accessory device 112 houses an observation optical system composed of a camera 161, a lens 162 and a reflector 163, and is installed on a device equipped with scanning processing laser light. The bottom surface of the laser head 111 of the galvanometer 156 of Lp. The light from the processing surface S is reflected by the reflecting mirror 163 and enters the lens 162 , and the image of the processing surface S is formed on the imaging element of the camera 161 by the lens 162 . The invention is applicable to laser markers, for example.

Taiwan Publication/Announcement No. I560443 "Frequency-doubled non-fluorescent ground state depletion super-resolution microscopy imaging method" discloses a frequency-doubled non-fluorescent ground state depletion super-resolution microscopy imaging method, which includes the following steps: providing an organic material unit ; Focus the excitation light and ground state depletion light; generate frequency doubled signals; perform ground state depletion; and perform microscopic imaging. Through the implementation of the present invention, the organic material unit is irradiated and excited with excitation light, so that its electrons are excited and jump to the singlet energy level, and its molecules are induced to generate frequency doubled signals; and the ground state energy of the organic material unit is increased by ground state depletion light. The first-order electrons are excited to the singlet energy level and converted to the triplet energy level through the intersystem, causing the organic material unit to generate ground state loss, reducing nonlinear absorption, and suppressing the intensity of the frequency-doubled signal, thus modulating (modulating) the non-fluorescent light. The spatial distribution of frequency doubled signals. In this way, STED super-resolution microscopy imaging technology can be applied to the modulation and microscopy imaging of non-fluorescent signals, and the image resolution of microscopy imaging can be improved.

Taiwan Publication/Announcement No. I725849 "System and Method for Detecting Molecular Structure of Biological Tissue" discloses a system for detecting the molecular structure of biological tissue. The system includes a label-free multi-frequency microscope and processor. The label-free multi-frequency microscope is used to image the target object through double frequency (SHG) and triple frequency (THG) to obtain SHG image and THG image respectively. The processor is coupled to the label-free multi-frequency microscope, and is used to add the first pseudo primary color to the SHG image, and add the second pseudo primary color to the THG image, to obtain the pseudo primary color added SHG image and the pseudo primary color respectively. The primary color plus THG image; and the pseudo primary color plus SHG image and the pseudo primary color plus THG image are superimposed to obtain an overlay image, where the overlay image is used to determine whether the target object has a molecular structure.

So how to solve the problem? In terms of conventional laser processing and inspection, the two are separated and performed on different platforms. The disadvantage of this conventional laser processing and inspection technology is that since inspection and processing are not located on the same Platform, therefore, the position calibration of the workpiece (processed object) and the laser detection light/focused light of laser processing is a problem; when conducting material inspection, the material is often detected in a destructive manner, and it is often impossible to obtain accurate results. The detection value cannot effectively perform laser processing on the workpiece; in addition, in the conventional technology, when conducting material testing, problems such as material defects and unevenness cannot be effectively reflected, resulting in the workpiece colliding during laser processing. Difficulties are encountered; also, the issue faced by the conventional technology is how to overcome the problem that the same material is not uniform, so if the entire material is processed with the same laser parameters, the effect will be poor. problems; and all the above are problems to be solved.

The main purpose of the present invention is to provide a laser application processing system and a method thereof, which are applied in the processing environment of laser detection and processing. The laser application processing system of the present invention is used to perform the laser application processing method. When using the laser inspection process, first, the workpiece (processed object) is moved under the focused light of the femtosecond laser SHG or THG inspection; then, the data on the spatial distribution of the SHG or THG signal on the workpiece will be obtained; further, Set the optimal laser processing parameter set required for the point of the workpiece according to the SHG or THG signal value; then, during the laser processing process, the workpiece that has completed the laser inspection process can be moved to femtosecond laser processing Below the focused light for laser processing, and/or, first use the focused light of femtosecond laser processing to laser process the workpiece. After the processing is completed, the workpiece is then processed using laser. The laser inspection process is used to detect whether the workpiece after laser processing meets the required requirements. When the laser application processing system of the present invention performs the laser application processing method, for example, by means of the laser detection process, the unevenness of the material can be detected, the detection can be quantified, and a map corresponding to different positions of the material can be established. (For example, a set of X, Y, Z coordinates) detection quantification value table; in addition, during the laser processing process, the detection quantification value table is used to perform optimal parameter set processing at different positions during laser processing. . The laser application processing system and method of the present invention can combine SHG or THG detection techniques and laser processing techniques to complete the post-detection compensation method.

Another purpose of the present invention is to provide a laser application processing system and method, which are applied in the processing environment of laser detection and processing, and can overcome the problem of "the same material" due to the unevenness of the material itself. If the entire material is processed with the same laser parameters, there will be a problem of poor results; here, the solution is to add online SHG or THG detection, which can effectively detect especially materials with crystal lattice. /Impurities etc. are unevenly distributed to overcome this problem.

Another object of the present invention is to provide a laser application processing system and method, which are applied in the processing environment of laser detection and processing. Since the laser processing and detection systems are located on the same working platform, it can solve the problem of Detection and processing are not on the same platform, so there is a problem in positioning the workpiece (processed object) and the laser detection light/laser processing focused light.

Another object of the present invention is to provide a laser application processing system and method, which are applied in the processing environment of laser detection and processing. When conducting material detection, materials can be detected in a non-destructive manner and can Accurate detection values are obtained to effectively laser process the workpiece.

Another object of the present invention is to provide a laser application processing system and method, which are applied in the processing environment of laser detection and processing. When conducting material detection, the detection method can effectively reflect material defects and unevenness. and other problems, so that the workpiece will not encounter difficulties during laser processing.

Another purpose of the present invention is to provide a laser application processing system and method thereof, which are applied in the processing environment of laser detection and processing. By adding online SHG or THG detection, it can effectively detect especially materials with crystal lattice. , its crystal lattice/impurities are unevenly distributed to overcome the problem of poor results if the entire material is processed with the same laser parameters due to the uneven nature of the material itself.

Another object of the present invention is to provide a laser application processing system and method, which are applied in the processing environment of laser detection and processing. When performing online SHG or THG detection, for example, the SHG signal can be Function can be converted to define different areas/categories of materials, and depending on the After defining the different areas/categories of the material, laser processing is performed in the designated different areas/categories with the same and/or different laser processing parameters according to the different areas/categories of the material, For example, different laser processing powers and different laser processing parameter sets can be used. Here, for example, these different laser processing parameter sets are obtained by optimizing respectively according to different materials/characteristics.

According to the above objectives, the present invention provides a laser application processing system, which includes a laser processing subsystem and a laser detection subsystem applied to the same mobile work platform.

The laser subsystem includes the first femtosecond laser source, the first femtosecond laser processing light, the femtosecond laser processing optical path module, and the first femtosecond laser processing focused light.

The laser detection subsystem includes a second femtosecond laser source, a second femtosecond laser SHG or THG detection light, a femtosecond laser detection optical path module, and a second femtosecond laser SHG or THG detection focused light.

The first femtosecond laser source. The wavelength of the first femtosecond laser source is not limited, but the common wavelengths are 1020-1060nm, 510-530nm, 340-353nm, etc., usually based on the optical properties of the workpiece. Absorbance is selected for the response characteristics of different wavelengths.

The common repetition rate range of pulses is 100kHz-10MHz.

The pulse duration ranges from 300 femtoseconds to 800 femtoseconds.

The pulse energy range is from 1 microjoules to 200 microjoules.

The spot quality (M2) ranges from 1.0 to 1.4, the smaller the better. The smaller the value, the smaller the focus spot with the same incident light spot.

The first femtosecond laser source can be equipped with a means of receiving external voltage signals or instructions to adjust its output power. People familiar with the art know the reason, so it will not be described again here.

The purpose of the first femtosecond laser source is to provide laser light for microprocessing, which is different from the function of the second femtosecond laser source (to provide detection light for SHG or THG).

It is noted that in actual implementation, the first femtosecond laser source and the second femtosecond laser source can also be used as the same one.

Femtosecond laser processing optical path module, the minimum function of the femtosecond laser processing optical path module is to (1) guide the direction of the laser light; and (2) generate a focusing point of the laser light near the workpiece.

This can be achieved in several different ways:

1. Consists of a fixed reflector and a focusing mirror. When using this method, the focused light of the first femtosecond laser processing is fixed. If you need to create a processing track on the workpiece, you can use a mobile work platform to move the workpiece. This method is generally called the fixed beam method.

2. Consists of a movable reflector and a focusing mirror. Using this method, the trajectory can be generated by the movable mirror without moving the workpiece. Or it can be used in conjunction with a mobile work platform. This method is also called single-axis galvo scanning.

3. Consists of two movable reflectors and a focusing mirror. Using this method, the trajectory can be generated by the two movable mirrors, and the workpiece does not move. Or it can be used in combination with the mobile platform 60. This method can also be called dual-axis galvo scanning.

By analogy, it can also be composed of N movable mirrors and a focusing mirror. A common five-axis galvo scanning scanning mirror can provide X, Y directions, and Z direction (parallel to the The direction of the focused light in femtosecond laser processing) and the two tilt angles of the focused light relative to the workpiece.

The femtosecond laser processing optical path module can be implemented by the above methods, alone and/or in combination. The above methods are all within the scope of the technical features included in the femtosecond laser processing optical path module of this invention, but are not limited to this. , as long as it can achieve the functions of (1) guiding the laser light direction and (2) generating a focusing point of the laser light near the workpiece, it should be covered by the femtosecond laser processing optical path module of the present invention. The reason is the same and similar to the technical features mentioned above, and will not be described again here.

After the first femtosecond laser processing light is emitted from the first femtosecond laser source, it passes through the femtosecond laser processing optical path module to form the first femtosecond laser processing focused light on the workpiece.

The second femtosecond laser source emits the second femtosecond laser SHG or THG detection light, and after passing through the femtosecond laser detection optical path module, the second femtosecond laser SHG or THG detection focused light is formed on the workpiece.

The workpiece can be moved by the mobile work platform so that the workpiece falls under the focused light of the first femtosecond laser processing or the focused light of the second femtosecond laser SHG or THG detection. The workpiece can be moved from one position P1 to another position P2 or in the opposite direction. If the distance between the focused light of the first femtosecond laser processing and the SHG or THG detection light of the second femtosecond laser is a constant value, it can be easily The position to which the mobile work platform should be moved is mapped so that the second femtosecond laser SHG or THG detection light and the first femtosecond laser processing focused light can hit the same point on the workpiece after the mobile work platform moves.

This combination of femtosecond laser processing of the laser processing subsystem and femtosecond laser SHG or THG detection function of the laser detection subsystem is the focus of the laser application processing system of the present invention. In the moving work platform/system/machine, femtosecond laser can be used to first conduct SHG or THG inspection, and then use the spatial distribution of the inspection results to determine the use of different laser processing parameter sets at different positions of the workpiece.

Furthermore, during implementation, the workpiece is first laser-processed with the focused light of femtosecond laser processing. After the processing is completed, the workpiece is then subjected to a laser inspection process to detect whether the laser-processed workpiece meets the requirements. Required requirements.

When using the laser application processing system of the present invention to perform the laser application processing method, during the laser detection process, first, the workpiece (processed object) is moved under the focused light of femtosecond laser SHG or THG detection.

Next, data on the spatial distribution of the SHG or THG signal on the workpiece will be obtained.

Then, the optimal laser processing parameter set required for the point of the workpiece is set according to the SHG or THG signal value to complete the laser inspection process.

Then, perform the laser processing process; during the laser processing process, the workpiece that has completed the laser inspection process can be moved under the focused light of femtosecond laser processing to perform laser processing, and/or , first use the focused light of femtosecond laser processing to laser process the workpiece. After the processing is completed, the workpiece is then subjected to a laser inspection process to detect whether the laser-processed workpiece meets the required requirements.

When the laser application processing system of the present invention performs the laser application processing method, for example, by means of the laser detection process, the unevenness of the material can be detected, the detection can be quantified, and a map corresponding to different positions of the material can be established. (For example, a set of X, Y, Z coordinates) detection quantification value table; in addition, during the laser processing process, the detection quantification value table is used to perform optimal parameter set processing at different positions during laser processing. . The laser application processing system and method of the present invention can combine SHG or THG detection techniques and laser processing techniques to complete the post-detection compensation method.

In order to enable those familiar with the art to understand the purpose, characteristics and effects of the present invention, the present invention is described in detail below through the following specific embodiments and the accompanying drawings:

1:wafer

2:Region

11:Region

12:Region

10: The first femtosecond laser source

20: Femtosecond laser processing optical path module

30: The second femtosecond laser source

40: Femtosecond laser detection optical path module

41:High reflective mirror

42:Wavelength spectroscope

43:Light detector

44: Focusing objective lens

50:Artifact

60:Mobile work platform

L1: The first femtosecond laser processing light

L2: The first femtosecond laser processing focused light

L3: Second femtosecond laser SHG or THG detection light/First femtosecond laser SHG or THG detection light

L4: Focus of the second femtosecond laser SHG or THG detection

M1: Beam splitter

M2: High reflective mirror

M3: High reflective mirror

M4: High reflective mirror

101, 102, 103, 104: Steps

Figure 1 is a system schematic diagram used to illustrate the system architecture and operation of the laser application processing system of the present invention; Figure 2 is a flow chart for illustrating a process step of a laser application processing method using the laser application processing system of the present invention as shown in Figure 1; Figure 3 is a flow chart for showing Describes another process step of using the laser application processing system of the present invention as shown in Figure 1 to perform a laser application processing method; Figure 4 is a schematic diagram used to illustrate an example of the laser application processing system of the present invention. Embodiment, and operation situation; Figure 5 is a schematic diagram used to illustrate another embodiment of the laser application processing system of the present invention, and operation situation; Figure 6 is a side view schematic diagram used to illustrate the use of the laser application processing system of the present invention; Figure 4 or Figure 5 is an embodiment of a laser application processing system, which converts SHG or THG signals into laser processing parameters for wafer inspection and processing; Figure 7 is a top view schematic diagram of Figure 6, for Shows the use of the embodiment of the laser application processing system in Figure 4 or Figure 5 to convert SHG or THG signals into laser processing parameters for wafer inspection and processing; and Figure 8 is a schematic diagram for The structure of the femtosecond laser detection optical path module illustrated in Figure 4 and Figure 5 is shown.

Figure 1 is a system schematic diagram for illustrating the system architecture and operation of the laser application processing system of the present invention. As shown in Figure 1, the laser application processing system 1 includes a laser processing subsystem 2 and a laser detection subsystem 3 applied to the same mobile work platform.

Laser processing subsystem 2 includes a first femtosecond laser source (not shown), a first femtosecond laser processing light (not shown), and a femtosecond laser processing optical path module (not shown) , and the focused light of the first femtosecond laser processing (not shown).

The laser detection subsystem 3 includes a second femtosecond laser source (not shown), a second femtosecond laser SHG or THG detection light (not shown), and a femtosecond laser detection light path module (not shown). (shown), and the focused light of the second femtosecond laser SHG or THG detection (not shown).

The first femtosecond laser source. The wavelength of the first femtosecond laser source is not limited, but the common wavelengths are 1020-1060nm, 510-530nm, 340-353nm, etc., usually based on the optical properties of the workpiece. Absorbance is selected for the response characteristics of different wavelengths.

The common repetition rate range of pulses is 100kHz-10MHz.

The pulse duration ranges from 300 femtoseconds to 800 femtoseconds.

The pulse energy range is from 1 microjoules to 200 microjoules.

The spot quality (M2) ranges from 1.0 to 1.4, the smaller the better. The smaller the value, the smaller the focus spot with the same incident light spot.

The first femtosecond laser source can be equipped with a means of receiving external voltage signals or instructions to adjust its output power. People familiar with the art know the reason, so it will not be described again here.

The purpose of the first femtosecond laser source is to provide laser light for microprocessing, which is different from the function of the second femtosecond laser source (to provide detection light for SHG or THG).

It is noted that in actual implementation, the first femtosecond laser source and the second femtosecond laser source can also be used as the same one.

Femtosecond laser processing optical path module, the minimum function of the femtosecond laser processing optical path module is to (1) guide the direction of the laser light; and (2) generate a focusing point of the laser light near the workpiece.

This can be achieved in several different ways:

1. Consists of a fixed reflector and a focusing mirror. When using this method, the focused light of the first femtosecond laser processing is fixed. If you need to create a processing track on the workpiece, you can use a mobile work platform to move the workpiece. This method is generally called the fixed beam method.

2. Consists of a movable reflector and a focusing mirror. Using this method, the trajectory can be generated by the movable mirror without moving the workpiece. Or it can be used in conjunction with a mobile work platform. This method is also called single-axis galvo scanning.

3. Consists of two movable reflectors and a focusing mirror. Using this method, the trajectory can be generated by the two movable mirrors, and the workpiece does not move. Or it can be used in combination with the mobile platform 60. This method can also be called dual-axis galvo scanning.

By analogy, it can also be composed of N movable mirrors and a focusing mirror. A common five-axis galvo scanning scanning mirror can provide X, Y directions, and Z direction (parallel to the The direction of the focused light in femtosecond laser processing) and the two tilt angles of the focused light relative to the workpiece.

The femtosecond laser processing optical path module can be implemented by the above methods, alone and/or in combination. The above methods are all within the scope of the technical features included in the femtosecond laser processing optical path module of this invention, but are not limited to this. , as long as it can (1) guide the laser light direction and (2) generate a focusing point for the laser light The functions and methods near the workpiece should all fall within the scope of the femtosecond laser processing optical path module of the present invention. The principles are the same and similar to the above technical features, and will not be described again here.

After the first femtosecond laser processing light is emitted from the first femtosecond laser source, it passes through the femtosecond laser processing optical path module to form the first femtosecond laser processing focused light on the workpiece.

The second femtosecond laser source emits the second femtosecond laser SHG or THG detection light, and after passing through the femtosecond laser detection optical path module, the second femtosecond laser SHG or THG detection focused light is formed on the workpiece.

The workpiece can be moved by the mobile work platform so that the workpiece falls under the focused light of the first femtosecond laser processing or the focused light of the second femtosecond laser SHG or THG detection. The workpiece can be moved from one position P1 to another position P2 or in the opposite direction. If the distance between the focused light of the first femtosecond laser processing and the SHG or THG detection light of the second femtosecond laser is a constant value, it can be easily The position to which the mobile work platform should be moved is mapped so that the second femtosecond laser SHG or THG detection light and the first femtosecond laser processing focused light can hit the same point on the workpiece after the mobile work platform moves.

This combination of femtosecond laser processing of the laser processing subsystem and femtosecond laser SHG or THG detection function of the laser detection subsystem is the focus of the laser application processing system of the present invention. On the same mobile work platform/system/ In the machine, femtosecond laser can be used to conduct SHG or THG inspection first, and then the spatial distribution of the inspection results can be used to determine the use of different laser processing parameter sets at different positions of the workpiece.

Furthermore, during implementation, the workpiece is first laser-processed with the focused light of femtosecond laser processing. After the processing is completed, the workpiece is then subjected to a laser inspection process to detect whether the laser-processed workpiece meets the requirements. Required requirements.

Femtosecond laser is a laser that can generate pulsed light with a pulse width of tens to hundreds of femtoseconds.

Because of its extremely short pulse width, it can generate extremely high peak power in an instant. If combined with a suitable focusing lens to focus the laser spot to several microns to tens of microns, extremely high peak power can be achieved. Density (peak intensity), this high instantaneous power density can directly dissociate most known materials or destroy the material lattice.

Compared with lasers whose pulses are longer than 1000 femtoseconds (i.e. 1 picosecond), femtosecond lasers are easier to achieve high instantaneous power density while maintaining a low average power (average power). The average power is due to thermal effects. Source.

In short, femtosecond laser is suitable for subtractive processing of materials and has the advantage of not easily causing thermal effects.

In industrial applications, laser material processing applications are of great commercial value, such as wafer cutting, slicing, modification, grooving, repair, etc.

Among them, the materials that can be processed by laser are extremely diverse. They can be semiconductor materials such as silicon, gallium arsenide, silicon carbide, and gallium nitride; or ceramic materials such as alumina, silicon nitride, etc.; or glass materials; or many more Crystalline materials such as sapphire wafers; or organic materials such as polyimide (PI), etc.

From the conventional laser processing technology and general common sense, we can know that during laser processing, the laser processing parameters to be applied to different materials, such as power, speed, number of processing passes, focus point size, laser repetition frequency, wavelength, etc. , all need to be adjusted according to material characteristics such as light absorption rate, material processing threshold (ablation threshold), etc., in order to achieve better results.

In other words, different materials require different optimal sets of laser processing parameters. The "best effect" here can be the smallest heat affected zone, the thinnest processing line width, the highest processing capacity, etc. It can be defined according to the processing requirements, and a group can be found in the project accordingly. The above are more suitable laser processing parameters.

In the same way, if the material to be processed already has unevenness, such as differences in crystal lattice arrangement, impurity concentration, surface roughness, etc., it will affect the characteristics of the material to be processed (the above-mentioned light absorption rate and processing threshold, etc.), so the same A material may also require different optimal laser processing parameter sets for different spatial regions.

This "same material" has different optimal parameter sets due to "imperfection" or "inhomogeneity". One of the solutions can be to find an optimal processing parameter set so that this Parameter groups can cope with non-uniform materials. However, this method will prevent the optimal processing effect from being achieved.

Another possible solution is as follows: use some kind of detection method to detect the unevenness of the material, quantify the detection, and establish a detection quantification corresponding to different positions of the material (for example, X, Y, Z coordinates) value table. Then, during laser processing, the optimal parameter set for different positions is processed according to this table.

This method can be simply called the post-detection compensation method.

The detection method is very critical, and its detection must provide meaningful quantitative values so that the appropriate processing parameter set can be found based on this value in the project.

In terms of detection methods, in the biomedical field, femtosecond laser is used for fluorescence microscopy or nonlinear imaging microscopy. Taking advantage of the extremely high instantaneous power of femtosecond laser, the former excites fluorescent molecules in the sample, and the instrument collects the fluorescent signals and converts them into images; the latter excites second harmonic generation (SHG) in the sample. ) or third harmonic generation (THG) signal, and collects this second or triple frequency light and converts it into an image.

The SHG or THG signal technology is to excite a second harmonic generation (SHG) or third harmonic generation (THG) signal in the sample, and collect the second harmonic generation or third harmonic generation (THG) light and convert it into an image; Among them, the SHG or THG signal is used as a detection method to detect material unevenness, quantify the detection, and establish a detection quantification value table corresponding to different positions of the material (certain X, Y, Z coordinates); then, During laser processing, follow this table to process the optimal parameter set for different positions.

The SHG or THG signal technology, that is, using femtosecond laser to generate SHG or THG light, can also be applied to materials that can be laser processed. This is the core concept of the laser application processing system and method of the present invention. That is to say, the SHG or THG detection method and the laser processing method are combined to achieve post-inspection compensation method.

SHG light can be effectively used to detect non-centrosymmetric materials, because theoretically SHG cannot be produced in centrosymmetric materials except at the interface or surface, while THG light can be effectively used to detect the interface. (interface) exists.

Returning to the above-mentioned problem of material unevenness during laser processing, an innovative solution urgently needs to be proposed.

The laser application processing system and method of the present invention combine the SHG or THG detection method on the femtosecond laser processing machine to overcome the problem of uneven materials during laser processing.

FIG. 2 is a flow chart illustrating a process step of a laser application processing method using the laser application processing system of the present invention as shown in FIG. 1 . As shown in Figure 2, first, in step 101, the workpiece detection start action is performed; the workpiece (processed object) is moved to the focused light of the femtosecond laser SHG or THG detection (for example, the second femtosecond laser Shoot below the focus L4) of SHG or THG detection; and proceed to step 102.

In step 102, the data acquisition operation is performed; using the focused light of femtosecond laser SHG or THG detection (for example, the focus L4 of the second femtosecond laser SHG or THG detection) to generate light of SHG or THG wavelength on the workpiece, Perform SHG or THG detection and collect the light of SHG or THG wavelength for light detection The means of the instrument are converted into data to obtain the spatial distribution results of the detection results. The data of the spatial distribution of the SHG or THG signal on the workpiece will be obtained, and proceed to step 103.

Here, the technology of SHG or THG signal is to excite the second harmonic generation (SHG) or third harmonic generation (THG) signal in the sample, and collect the second harmonic generation or third harmonic generation light and convert it into for images.

In step 103, set the optimal laser processing parameter set action; set the optimal laser processing parameter set required for the point of the workpiece according to the SHG or THG signal value to complete the laser inspection process.

Here, femtosecond laser can be used to perform SHG or THG detection first, and then the spatial distribution of the detection results can be used to determine the use of different laser processing parameter sets at different positions of the workpiece; SHG or THG signals can be used as detection means. Detect material unevenness, quantify the detection, and establish a table of detection quantified values corresponding to different positions of the material (certain X, Y, Z coordinates); then, use this table to perform different positions during laser processing The best laser processing parameter set for processing.

The laser detection process includes steps 101, 102, and 103.

Then, in step 104, a laser processing process is performed; during the laser processing process, the workpiece that has completed the laser inspection process can be moved under the focused light of femtosecond laser processing to perform laser processing. .

When the laser application processing system of the present invention performs the laser application processing method, for example, by means of the laser detection process, the unevenness of the material can be detected, the detection can be quantified, and a map corresponding to different positions of the material can be established. (For example, a set of X, Y, Z coordinates) detection quantification value table; in addition, during the laser processing process, the detection quantification value table is used to perform optimal parameter set processing at different positions during laser processing. . The laser application processing system and method of the present invention can combine SHG or THG detection techniques and laser processing techniques to complete the post-detection compensation method.

FIG. 3 is a flow chart illustrating another process step of using the laser application processing system of the present invention as shown in FIG. 1 to perform a laser application processing method. As shown in Figure 3, first, in step 201, a laser processing process is performed; first, the workpiece is laser processed with the focused light of femtosecond laser processing, and after the processing is completed, the workpiece is used The laser inspection process is to detect whether the workpiece after laser processing meets the required requirements; and proceed to step 202.

In step 202, the workpiece detection start action is performed; the workpiece (processed object) is moved below the focused light of the femtosecond laser SHG or THG detection (for example, the focus L4 of the second femtosecond laser SHG or THG detection) ; and go to step 203.

In step 203, the data acquisition operation is performed; using the focused light of femtosecond laser SHG or THG detection (for example, the focus L4 of the second femtosecond laser SHG or THG detection) to generate light of SHG or THG wavelength on the workpiece, Carry out SHG or THG detection, collect the light of SHG or THG wavelength and convert it into data by means of a light detector, and obtain the spatial distribution result of the detection result. The data of the spatial distribution of the SHG or THG signal on the workpiece will be obtained and processed. Go to step 204.

Here, the technology of SHG or THG signal is to excite the second harmonic generation (SHG) or third harmonic generation (THG) signal in the sample, and collect the second harmonic generation or third harmonic generation light and convert it into for images.

In step 204, set the optimal laser processing parameter set action; set the optimal laser processing parameter set required for the point of the workpiece according to the SHG or THG signal value to complete the laser inspection process.

Here, femtosecond laser can be used to perform SHG or THG detection first, and then the spatial distribution of the detection results can be used to determine the use of different laser processing parameter sets at different positions of the workpiece; SHG or THG signals can be used as detection means. Detect material unevenness, quantify the detection, and establish a table of detection quantified values corresponding to different positions of the material (certain X, Y, Z coordinates); then, use this table to perform different positions during laser processing The best laser processing parameter set for processing.

Here, the laser detection process includes steps 202, 203, and 204.

If the workpiece after the laser inspection process does not meet the requirements, a new laser inspection process will be carried out in order to obtain a new required optimal laser processing parameter set, until the new laser inspection process is completed. After that, another laser processing process will be performed; while performing this other laser processing process, the workpiece that has completed the laser inspection process can be moved under the focused light of femtosecond laser processing to perform Laser processing.

FIG. 4 is a schematic diagram illustrating an embodiment of the laser application processing system of the present invention and its operation.

As shown in FIG. 4 , the laser application processing system 1 includes a laser processing subsystem 2 and a laser detection subsystem 3 applied to the same mobile work platform 60 .

The laser processing subsystem 2 includes the first femtosecond laser source 1(), the first femtosecond laser processing light L1, the femtosecond laser processing optical path module 20, and the first femtosecond laser processing focused light L2 .

The laser detection subsystem 3 includes a second femtosecond laser source 30, a second femtosecond laser SHG or THG detection light L3, a femtosecond laser detection light path module 40, and a second femtosecond laser SHG or THG detection light. The focused light L4.

The wavelength of the first femtosecond laser source 10 is not limited, and the common wavelengths are 1020-1060nm, 510-530nm, 340-353nm, etc., which are usually used to process the workpiece 50 The optical absorbance of the object is selected based on its response characteristics at different wavelengths.

The common repetition rate range of pulses is 100kHz-10MHz.

The pulse duration ranges from 300 femtoseconds to 800 femtoseconds.

The pulse energy range is from 1 microjoules to 200 microjoules.

The spot quality (M2) ranges from 1.0 to 1.4, the smaller the better. The smaller the value, the smaller the focus spot with the same incident light spot.

The first femtosecond laser source 10 may be equipped with a means of receiving external voltage signals or instructions to adjust its output power. Those familiar with the art know the reason, and therefore will not be described in detail here.

The purpose of the first femtosecond laser source 10 is to provide laser light for microprocessing, which is different from the function of the second femtosecond laser source 30 (to provide detection light for SHG or THG).

It should be noted that in actual implementation, the first femtosecond laser source 10 and the second femtosecond laser source 30 can also be used as the same one, as shown in Figure 5 .

Femtosecond laser processing optical path module 20, the minimum functions of the femtosecond laser processing optical path module 20 are to (1) guide the direction of the laser light; and (2) generate a focusing point of the laser light near the workpiece 50.

This can be achieved in several different ways:

1. Consists of a fixed reflector and a focusing mirror. When this method is used, the focused light L2 of the first femtosecond laser processing is fixed. If it is necessary to create a processing track on the workpiece, the mobile work platform 60 can be used to move the workpiece 50. This method is generally called the fixed beam method (fixed beam method). beam).

2. Consists of a movable reflector and a focusing mirror. Using this method, the trajectory can be generated by the movable mirror without moving the workpiece. Or it can be used in combination with the mobile working platform 60. This method can also be called single-axis galvo scanning.

3. Consists of two movable reflectors and a focusing mirror. Using this method, the trajectory can be generated by the two movable mirrors, and the workpiece does not move. Or it can be used in combination with the mobile platform 60. This method can also be called dual-axis galvo scanning.

By analogy, it can also be composed of N movable mirrors and a focusing mirror. A common five-axis galvo scanning scanning mirror can provide X, Y directions, and Z direction (parallel to the The direction of the focused light in femtosecond laser processing) and the two tilt angles of the focused light relative to the workpiece.

The femtosecond laser processing optical path module can be implemented by the above methods, alone and/or in combination. The above methods are all within the scope of the technical features included in the femtosecond laser processing optical path module of this invention, but are not limited to this. , as long as it can achieve the functions of (1) guiding the laser light direction and (2) generating a focusing point of the laser light near the workpiece 50, it should be within the scope of the femtosecond laser processing optical path module of the present invention. , whose principles are the same and similar to the above technical features, will not be described again here.

After the first femtosecond laser processing light L1 is emitted from the first femtosecond laser source 10 , it passes through the femtosecond laser processing optical path module 20 to form the first femtosecond laser processing focused light L2 on the workpiece 50 .

The second femtosecond laser source 30 emits the second femtosecond laser SHG or THG detection light L3, and after passing through the femtosecond laser detection optical path module 40, the second femtosecond laser SHG or THG detection focused light L4 is formed. On the workpiece 50.

The workpiece 50 can be moved by the mobile working platform 60 so that the workpiece 50 falls under the focused light L2 of the first femtosecond laser processing or the focused light L4 of the second femtosecond laser SHG or THG detection. The workpiece 50 can move from one position P1 to another position P2 or in the opposite direction. For example, the distance between the focused light L2 of the first femtosecond laser processing and the second femtosecond laser SHG or THG detection light L3 is a constant value ( (This condition is established in this setup), the position to which the mobile working platform 60 should be moved can be easily mapped so that the second femtosecond laser SHG or THG detection light L3 and the first femtosecond laser processing focused light L2 can be The mobile working platform 60 moves to the same point on the workpiece 50 .

This combination of femtosecond laser processing of the laser processing subsystem 2 and femtosecond laser SHG or THG detection function of the laser detection subsystem 3 is the focus of the laser application processing system 1 of the present invention. On the same mobile work platform /In the system/machine, femtosecond laser can be used to first conduct SHG or THG inspection, and then the spatial distribution of the inspection results can be used to determine the use of different laser processing parameter sets at different positions of the workpiece.

Furthermore, during implementation, the workpiece is first laser-processed with the focused light of femtosecond laser processing. After the processing is completed, the workpiece is then subjected to a laser inspection process to detect whether the laser-processed workpiece meets the requirements. Required requirements.

FIG. 5 is a schematic diagram illustrating another embodiment of the laser application processing system of the present invention and its operation.

As shown in FIG. 5 , the laser application processing system 1 includes a laser processing subsystem 2 and a laser detection subsystem 3 applied to the same mobile work platform 60 .

The laser processing subsystem 2 includes the first femtosecond laser source 10, the first femtosecond laser processing light L1, the femtosecond laser processing optical path module 20, the first femtosecond laser processing focused light L2, and the beam splitter. M1 and high reflective mirror M2.

The laser detection subsystem 3 includes the first femtosecond laser SHG or THG detection light L3, the femtosecond laser detection optical path module 40, the second femtosecond laser SHG or THG detection focused light L4, the high reflection mirror M3, and high-reflection mirror M4.

As shown in Figure 5, the same femtosecond laser source 10 is used as the light source for (1) femtosecond laser processing and (2) femtosecond laser SHG or THG detection method, which is simpler than Figure 4. The advantage is that it only needs to set up a simple optical path such as an optical path composed of M1, M2, M3, M4, etc. lenses.

The wavelength of the first femtosecond laser source 10 is not limited, and the common wavelengths are 1020-1060nm, 510-530nm, 340-353nm, etc., which are usually used to process the workpiece 50 The optical absorbance of the object is selected based on its response characteristics at different wavelengths.

The common repetition rate range of pulses is 100kHz-10MHz.

The pulse duration ranges from 300 femtoseconds to 800 femtoseconds.

The pulse energy range is from 1 microjoules to 200 microjoules.

The spot quality (M2) ranges from 1.0 to 1.4, the smaller the better. The smaller the value, the smaller the focus spot with the same incident light spot.

The first femtosecond laser source 10) may be equipped with a means of receiving external voltage signals or instructions to adjust its output power. Those familiar with the art know the reason, and therefore will not be described in detail here.

The first femtosecond laser source 10 is used here to provide laser light for micro processing. The first femtosecond laser source 10 can also provide SHG or THG detection light through the action of the beam splitter M1 and the high reflection mirror M2. The first femtosecond laser SHG or THG detects the source of light L3.

Femtosecond laser processing optical path module 20, the minimum functions of the femtosecond laser processing optical path module 20 are to (1) guide the direction of the laser light; and (2) generate a focusing point of the laser light near the workpiece 50.

This can be achieved in several different ways:

1. Consists of a fixed reflector and a focusing mirror. When using this method, the focused light L2 of the first femtosecond laser processing is fixed. If it is necessary to process the workpiece The moving work platform 60 can be used to move the workpiece 50 along the trajectory. This method is generally called the fixed beam method.

2. Consists of a movable reflector and a focusing mirror. Using this method, the trajectory can be generated by the movable mirror without moving the workpiece. Or it can be used in combination with the mobile working platform 60. This method can also be called single-axis galvo scanning.

3. Consists of two movable reflectors and a focusing mirror. Using this method, the trajectory can be generated by the two movable mirrors, and the workpiece does not move. Or it can be used in combination with the mobile platform 60. This method can also be called dual-axis galvo scanning.

By analogy, it can also be composed of N movable mirrors and a focusing mirror. A common five-axis galvo scanning scanning mirror can provide X, Y directions, and Z direction (parallel to the The direction of the focused light in femtosecond laser processing) and the two tilt angles of the focused light relative to the workpiece.

The femtosecond laser processing optical path module can be implemented by the above methods, alone and/or in combination. The above methods are all within the scope of the technical features included in the femtosecond laser processing optical path module of this invention, but are not limited to this. , as long as it can achieve the functions of (1) guiding the laser light direction and (2) generating a focusing point of the laser light near the workpiece 50, it should be within the scope of the femtosecond laser processing optical path module of the present invention. , whose principles are the same and similar to the above technical features, will not be described again here.

After the first femtosecond laser processing light L1 is emitted from the first femtosecond laser source 10 , it passes through the femtosecond laser processing optical path module 20 to form the first femtosecond laser processing focused light L2 on the workpiece 50 .

The first femtosecond laser source 10 becomes the source of the first femtosecond laser SHG or THG detection light L3 that provides the detection light of SHG or THG through the action of the beam splitter M1 and the high reflection mirror M2, and the first femtosecond laser The SHG or THG detection light L3 passes through the femtosecond laser detection optical path module 40 and forms the second femtosecond laser SHG or THG detection focused light L4 on the workpiece 50 .

The workpiece 50 can be moved by the mobile working platform 60 so that the workpiece 50 falls under the focused light L2 of the first femtosecond laser processing or the focused light L4 of the second femtosecond laser SHG or THG detection. The workpiece 50 can move from one position P1 to another position P2 or in the opposite direction. For example, the distance between the focused light L2 of the first femtosecond laser processing and the first femtosecond laser SHG or THG detection light L3 is a constant value ( (This condition is established in this setup), the position to which the mobile working platform 60 should be moved can be easily mapped so that the second femtosecond laser SHG or THG detection light L3 and the first femtosecond laser processing focused light L2 can be The mobile working platform 60 moves to the same point on the workpiece 50 .

Figure 6 is a schematic side view showing the use of the embodiment of the laser application processing system in Figure 4 or Figure 5 to convert SHG or THG signals into laser processing parameters for wafer inspection and processing. .

As shown in Figure 6, the wafer 1 has a region 11 and a region 12. Here, the wafer 1 is, for example, silicon wafer, sapphire wafer (Sapphine), silicon carbide (SiC), etc. Single crystal wafer.

The characteristics of area 11 in wafer 1 are different from other areas 12 outside it. Therefore, the SHG or THG signal in area 11 is different from the SHG or THG signal in area 12. After 2D scanning, the SHG or THG signal in area 11 and the SHG or THG signal in area 12 will be obtained respectively.

Figure 7 is a schematic top view of Figure 6, showing an embodiment of using the laser application processing system of Figure 4 or Figure 5 to convert SHG or THG signals into laser processing parameters for wafer inspection and processing. status.

When performing online SHG or THG testing, for example, the function of the SHG signal can be converted to define different areas/categories of the material. After defining the different areas/categories of the material, the These different areas/categories are laser processed with the same and/or different laser processing parameters in the designated different areas/categories. For example, different laser processing powers can be used, and different laser processing can be used. Parameter set, here, for example, these different laser processing parameter sets are obtained by optimizing respectively according to different materials/characteristics.

Here, taking the SHG signal as an example, the total scanning range x _c and the total scanning range y _c in the XY axis are here, using SH, in area 2 outside wafer 1, the function value of the SHG signal in area 2 is approximately is 0, and the function value of the SHG signal in area 12 of wafer 1 is greater than the function value of the SHG signal in area 11.

In addition, the function of the SHG signal can be assumed to be sig(x, y). For example, binarization can be used to convert sig(x, y) into [0, 1], and two different signals can be defined. area.

Then, the function sig(x, y) of the SHG signal may be divided into N categories according to the needs: for example, if 0≦sig(x, y)<k ₁ , then this area is the 1st category; if k ₁ ≦sig(x, y)<k ₂ , then this area is the 2nd category; and so on if kn- ₁ ≦sig(x, y)<k _n , then this area is the nth category; k ₁ , k ₂ ... k _n >0

Alternatively, different regions 11 and 12 may be classified using other classification formulas similar to the above. The principles are the same and similar to the above, so they will not be described again here.

When specifying different laser processing parameters in different areas (for example, area 11 and/or area 12), as mentioned above: (1) According to different function values of the SHG signal in different areas, different laser processing powers can be used , for example, P ₁ power is given to the area of "0" for laser processing; and P ₂ power is given to the area of "1" for laser processing; (2) According to the different function values of the SHG signal in different areas, a laser can be used Laser parameters (P, f _R , ν, m), where P is the power, f _R is the repetition frequency, ν is the speed, and m is an integer; or, use different laser parameter sets (P ^N , f _R ^N , ν ^N , m ^N ) in different regions/N-type regions. Here, for example, the different laser processing parameter sets are obtained by optimizing respectively according to different materials/characteristics.

Figure 8 is a schematic diagram showing the structure of the femtosecond laser detection optical path module described in Figures 4 and 5.

The femtosecond laser detection optical path module 40 generates the input second femtosecond laser SHG or THG detection light L3 or the first femtosecond laser SHG or THG detection light L3 as the second femtosecond laser SHG or THG detection. It focuses the light L4 and outputs it.

The function of the femtosecond laser detection optical path module 40 is to use a femtosecond laser to emit laser light with a specific wavelength λ to generate the focused light L4 for the second femtosecond laser SHG or THG detection on the workpiece 50 SHG or THG wavelength light is collected and converted into data using a light detector.

Here is only one example for illustration, but this example does not limit the wide applicability of the present invention. As long as the femtosecond laser light is used to generate double frequency SHG or triple frequency light on the workpiece (material) and The means or modules for collecting should be within the scope of the present invention.

As shown in Figure 8, the femtosecond laser detection optical path module 40 includes a high reflection mirror 41, a wavelength splitter 42 (dichroic mirror), a photodetector 43 (photodetector), and a focusing objective 44 (focusing objective). .

Among them, the embodiment can be that the light beam L3 input by the femtosecond laser source has a wavelength of 1030nm, and is directed to a wavelength spectrometer 42 via a high-reflection mirror 41. This wavelength spectroscope has the characteristic of high transmittance (for example, 95%) at 1030nm. above), and has high reflectivity for frequency doubled light 515nm.

The 1030nm light is directed to a focusing objective lens 44 after penetrating the wavelength splitting wave 42. This focusing objective lens 44 generates a focused beam L4 and projects it towards the workpiece. After the material of the workpiece interacts with the laser light, it can produce multiplexing due to its own nonlinear characteristics. The light has a wavelength of 515 nm, and this light has a retroreflective component. This light beam can be received by the same focusing objective lens, and then converted into a nearly parallel light beam again, and is highly reflected by the wavelength spectroscope 42 and directed to the light detector 43 , and finally the optical signal is converted into an electrical signal by the light detector and can be sent to a data processing microprocessor or computer for processing.

Based on the above embodiments, we can obtain a laser application processing system and method of the present invention, which are applied in the processing environment of laser detection and processing. The laser application processing system of the present invention is used to perform laser application processing. Method: When using the laser inspection process, first, move the workpiece (object to be processed) under the focused light of the femtosecond laser SHG or THG inspection; then, obtain data on the spatial distribution of the SHG or THG signal on the workpiece. ; Furthermore, the optimal laser processing parameter set required for the point of the workpiece is set according to the SHG or THG signal value; and then, during the laser processing process, the workpiece that has completed the laser inspection process can be moved to femtosecond Under the focused light of laser processing, laser processing is performed, and/or, the workpiece is first laser processed with the focused light of femtosecond laser processing, and after the processing is completed, the workpiece is inspected using laser. process in order to detect whether the workpiece after laser processing meets the required requirements. When the laser application processing system of the present invention performs the laser application processing method, for example, by means of the laser detection process, the unevenness of the material can be detected, the detection can be quantified, and a map corresponding to different positions of the material can be established. (For example, a set of X, Y, Z coordinates) detection quantification value table; in addition, during the laser processing process, the detection quantification value table is used to perform optimal parameter set processing at different positions during laser processing. . The laser application processing system and method of the present invention can combine SHG or THG detection techniques and laser processing techniques to complete the post-detection compensation method.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention; all other equivalent changes or modifications made without departing from the spirit of the present invention shall be included in the following patents. within the range.

101, 102, 103, 104: Steps

Claims (10)

A laser application processing method is applied in the processing environment of laser detection and processing, and utilizes the laser processing subsystem and the laser detection subsystem of the same mobile work platform to perform the laser application processing method, including the following Procedure: Perform workpiece detection start action; move the workpiece under the focused light of femtosecond laser SHG or THG detection; perform data acquisition action; use the focused light of femtosecond laser SHG or THG detection to perform SHG or THG detection , to obtain the spatial distribution results of the inspection results, we will obtain the data of the spatial distribution of the SHG or THG signal on the workpiece; set the optimal laser processing parameter group action; set the optimal point required for the workpiece according to the SHG or THG signal value. Laser processing parameter set; and perform laser processing process; wherein, the function of the SHG/THG signal is converted to define different areas/categories of the material, and according to the different areas/categories of the material, in the specified The different areas/categories perform the laser processing process with the same and/or different optimal laser processing parameter sets; wherein the SHG/THG signal is the SHG signal, and the function of the SHG signal is sig ( x, y), use binarization to convert the sig (x, y) into different values to define the different areas/categories. The laser application processing method as described in claim 1, wherein the femtosecond laser detection optical path module generates the input femtosecond laser SHG or THG detection light as the focused light for femtosecond laser SHG or THG detection. and output it. The laser application processing method as described in claim 1, wherein the focused light of the femtosecond laser SHG or THG detection generates light of SHG or THG wavelength on the workpiece, the SHG or THG detection is performed, and the SHG or THG is collected. The light of the THG wavelength is converted into data by means of a light detector, and the spatial distribution result of the detection result is obtained. The data of the spatial distribution of the SHG or THG signal to the workpiece will be obtained. The laser application processing method as described in claim 3, wherein the light of the SHG wavelength is used to detect non-centrosymmetric materials. The laser application processing method as described in claim 3, wherein the light of the THG wavelength is used to detect the presence of an interface. A laser application processing system is used in a processing environment of laser detection and processing, and includes: a laser detection subsystem; and a laser processing subsystem; wherein, the laser detection subsystem, and the laser processing subsystem The system is located on the same mobile work platform; when the workpiece detection is started, the workpiece is moved under the focused light of the femtosecond laser SHG or THG detection of the laser detection subsystem; among them, when the data acquisition action is carried out, Using the focused light of the femtosecond laser SHG or THG detection of the laser detection subsystem to perform SHG or THG detection, and obtain the spatial distribution results of the detection results, the data of the spatial distribution of the SHG or THG signal on the workpiece will be obtained; wherein , when setting the optimal laser processing parameter set action, set the optimal laser processing parameter set required for the point of the workpiece according to the SHG or THG signal value; and, wherein, the laser detection subsystem determines the point of the workpiece The required optimal laser processing parameter set is provided to the laser processing subsystem to perform the laser processing process; and wherein the function of the SHG/THG signal is converted to define different regions/categories of materials , according to the different areas/categories of the material, the laser processing process is carried out in the designated different areas/categories with the same and/or different optimal laser processing parameter sets, wherein the SHG The /THG signal is an SHG signal, and the function of the SHG signal is sig(x, y). Binarization is used to convert the sig(x, y) into different values to define the different areas/categories. The laser application processing system as described in claim 6, wherein the femtosecond laser detection optical path module of the laser detection subsystem generates the input femtosecond laser SHG or THG detection light as the femtosecond laser SHG or THG detects the focused light and outputs it. The laser application processing system as described in claim 6, wherein the focused light of the femtosecond laser SHG or THG detection generates SHG or THG wavelength light on the workpiece, performs the SHG or THG detection, and collects the SHG or THG wavelength. The THG wavelength light is converted into data by means of the optical detector of the femtosecond laser detection optical path module of the laser detection subsystem, and the spatial distribution result of the detection result is obtained, and the SHG or THG signal is obtained The data for the spatial distribution of the artifact. The laser application processing system of claim 8, wherein the light of the SHG wavelength is used to detect non-centrosymmetric materials. The laser application processing system of claim 8, wherein the light of the THG wavelength is used to detect the presence of an interface.

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