TWI815381B - Probe card device - Google Patents

Abstract

A probe card device is provided. The probe card device includes a frame, and a lower needle assembly, a fan-out converting member, an upper needle assembly, and a limiting member that are disposed on the frame. The lower needle assembly includes a first carrier and a plurality of first conductive probes. Both ends of each of the first conductive probes are exposed to an outside of the first carrier, respectively. The fan-out converter includes a mounting board, and a plurality of first conductive structures and a plurality of second conductive structures that are disposed on the mounting board and are electrically coupled to each other. A separation distance between two adjacent first conductive structures is greater than a separation distance between two adjacent second conductive structures. The upper needle assembly includes a second carrier and a plurality of second conductive probes. Both ends of each of the second conductive probes are exposed to an outside of the second carrier respectively, and are electrically coupled to the second conductive structures and an object. Accordingly, the object to be tested can be detected by the test substrate.

Description

probe card device

The present invention relates to a probe card, and in particular to a probe card device.

The existing probe card device mainly cooperates with a test substrate to test each chip and package. Among them, the spacing and size between the pins of the chip or package are different based on its function or design. Therefore, the contacts (or conductive pins) on the existing probe card device and the test substrate must also cater to the chip (or package) are adjusted simultaneously.

However, the unit price of the test substrate is inversely proportional to the chip size. That is, the smaller the chip process size, the higher the unit price of the test substrate. Therefore, when small-size wafers of different specifications can be tested using large-size test substrates, the test can be greatly reduced. cost.

Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a probe card device in view of the shortcomings of the existing technology.

An embodiment of the present invention discloses a probe card device, which includes: a frame having a lower accommodation slot and an upper accommodation slot that are connected to each other; a lower needle assembly is disposed in the lower accommodation slot, and the lower needle assembly It includes: a first carrier; and a plurality of first conductive probes, which are arranged on the first carrier, with two ends of each first conductive probe respectively exposed outside the first carrier; a fan-out The conversion part includes: a mounting plate installed on the lower needle assembly; a plurality of first conductive structures and a plurality of second conductive structures disposed on opposite sides of the mounting plate, a plurality of the first conductive structures The structures are electrically coupled to a plurality of second conductive structures respectively, and parts of a plurality of first conductive structures and parts of a plurality of second conductive structures are exposed on the mounting board, and any two adjacent ones The portions of the first conductive structure are arranged at a first separation distance and are electrically coupled to a plurality of the first conductive probes respectively, and the portions of any two adjacent second conductive structures are A second spacing distance is configured, and the second spacing distance is smaller than the first spacing distance; an upper needle assembly is provided in the upper receiving groove, the upper needle assembly includes: a second carrier; and A plurality of second conductive probes are arranged on the second carrier. Both ends of each second conductive probe are exposed outside the second carrier. One of the plurality of second conductive probes One end is electrically coupled to a plurality of second conductive structures respectively, and the other ends of the plurality of second conductive probes can be used to electrically couple an object to be measured; and a limiting member is provided on the On the frame, the limiting member is used to limit the object to be measured.

In summary, the probe card device disclosed in the embodiment of the present invention can be electrically coupled to the plurality of first conductive structures of the lower needle assembly through "the plurality of first conductive structures of the fan-out conversion member." "First conductive probe", "Any two adjacent second conductive structures are arranged at a second separation distance smaller than the first distance, and a plurality of the second conductive structures are electrically coupled to multiple The design of "the first conductive structure" and "the two ends of each second conductive probe of the upper needle assembly can be electrically coupled to the second conductive structure and the object under test respectively" , the lower pin assembly, the fan-out conversion piece, and the upper pin assembly can be modularized, and a test substrate (for example, a large-size test substrate) can be configured by selecting the appropriate lower pin assembly, all The fan-out converter and the upper pin assembly are used to test wafers of different sizes.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a specific embodiment to illustrate the implementation of the "probe card device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.

It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

In addition, in the following description, if it is pointed out that please refer to a specific figure or as shown in a specific figure, it is only used to emphasize that in the subsequent description, most of the relevant content described appears in the specific figure. , but this does not limit the subsequent description to only refer to the specific drawings.

Referring to Figures 1 to 10, this embodiment provides a probe card device 100. The probe card device 100 can be used with a test substrate (not shown in the figure) to test an object under test Z ( As shown in Figure 5) for testing. In practice, the object under test Z may be a chip (Chip IC), a wafer-level packaging (Wafer-level packaging), or a stacked wafer (Wafer-on-Wafer), but the invention is not limited thereto. .

As shown in FIGS. 1 and 2 , the probe card device 100 includes a frame 1 , a lower needle assembly 2 and an upper needle assembly 3 disposed on the frame 1 . There is a fan-out conversion member 4 between the needle assemblies 3 and a limiting member 5 provided on the frame 1 . Next, each component of the probe card device 100 and the connection relationship between the components will be introduced below.

As shown in FIGS. 3 to 5 , the frame 1 has a lower accommodating groove G11 and an upper accommodating groove G12 that communicate with each other. Specifically, the frame 1 has a bearing part 11 and a surrounding wall part 12 in this embodiment. Wherein, the carrying part 11 is a frame-shaped plate structure, and the outer edges of the two opposite sides of the carrying part 11 (ie, the upper and lower sides in Figure 5) are raised to form the surrounding wall part 12, so that The upper accommodating groove G12 and the lower accommodating groove G11 are formed by the area enclosed by the surrounding wall portion 12 with respect to both side surfaces of the bearing portion 11 .

Preferably, the frame 1 also has two notches 13 on one side of the load-bearing part 11, and the two notches 13 are located on opposite sides of the surrounding wall part 12, and two The notch 13 can be used for positioning the upper needle assembly 3 (described in detail later).

As shown in FIGS. 3 to 5 , the lower needle assembly 2 is disposed in the lower receiving groove G11 and includes a first carrier 21 and a plurality of first conductive probes disposed on the first carrier 21 . Needle 22. Two ends of each first conductive probe 22 are respectively exposed outside the first carrier 21 for electrical coupling between the test substrate and the fan-out converter 4 .

In a practical application, the first carrier 21 includes a first upper cover 211 and a first lower cover 212, and a plurality of the first cover 211 and the first lower cover 212 are disposed between the first upper cover 211 and the first lower cover 212. Conductive probes 22, and both ends of the plurality of first conductive probes 22 can be exposed through the first upper cover 211 and the first lower cover 212 respectively.

Looking more closely, as shown in FIGS. 4 to 6 , the first upper cover 211 has a first stage 2111 , a first ring wall portion 2112 , and a first setting groove 2113 .

The first stage 2111 has two opposite wide sides, and the first stage 2111 also has a plurality of first upper fixing holes H2111. The plurality of first upper fixing holes H2111 are arranged equidistantly from each other, and both ends of the plurality of first upper fixing holes H2111 are connected to the two wide sides of the first stage 2111 .

The first ring wall part 2112 is connected to one of the wide sides of the first stage 2111 (ie, the upper side in FIG. 6 ) in a convex manner, so that the first ring wall part 2112 The top surface is higher than the aforementioned wide sides. When the fan-out converter 4 is installed in the area surrounded by the first ring wall portion 2112, the fan-out converter 4 can be abutted by the inner edge of the first ring wall portion 2112 to limit movement. . The first setting groove 2113 is formed on the other wide side of the first stage 2111 (ie, the lower side in FIG. 6 ).

Preferably, in the wide side of the first stage 2111 facing the frame 1, the height of the wide side in the area enclosed by the first ring wall portion 2112 is higher than the height of the wide side. The wide side is at a height outside the area enclosed by the first ring wall portion 2112 . In other words, the first stage 2111 has a stepped structure, and the top surface of the highest part of the first stage 2111 is connected to the first ring wall portion 2112 .

In addition, as shown in FIGS. 4 to 6 , the first lower cover 212 is a plate-like structure and is disposed in the first setting groove 2113 , and the outer surface of the first lower cover 212 is preferably cut. Align the first upper cover 211 away from the wide side of the frame 1 . in. The first lower cover 212 has a first plate body 2121 and a plurality of first lower fixing holes 2122 located on the first plate body 2121. The plurality of first lower fixing holes 2122 correspond to the plurality of first lower fixing holes 2122. An upper fixing hole H2111, and any first lower fixing hole 2122 and the corresponding first upper fixing hole H2111 are jointly provided with a first conductive probe 22.

In detail, each of the first conductive probes 22 is a spring connector (POGO PIN) in this application, and each of the first conductive probes 22 is disposed on the first stage 2111 and the between the first plates 2121, and both ends of each first conductive probe 22 can be exposed to the first through the corresponding first upper fixing hole H2111 and the first lower fixing hole 2122 respectively. Carrier 21 outside.

It is worth noting that the first lower cover 212 may be fixed to the side of the first upper cover 211 away from the frame 1 . Specifically, the first ring wall portion 2112 has a plurality of first limiting holes H2112, and the areas where the plurality of first limiting holes H2112 are projected onto the first setting grooves 2113 are located in the plurality of first limiting holes H2112. First on one side of fixing hole H2111. The first lower cover 212 has a plurality of first alignment holes H212. The plurality of first alignment holes H212 and the plurality of first limiting holes H2112 correspond to each other, and the first positioning holes H2112 correspond to each other. The alignment hole H212 and the first limiting hole H2112 can jointly accommodate a first alignment post 23 of the lower needle assembly 2 to limit the first lower cover 212 compared to the first carrier 21 horizontal movement.

In addition, the first carrier 21 may also include an adhesive layer (not shown in the figure), and the adhesive layer is disposed between the first lower cover 212 and the first carrier 21 so that the first The upper cover 211 is fixed to the first lower cover 212 . In practice, the adhesive layer is, for example, an underfill.

As shown in FIGS. 3 to 5 , the fan-out converter 4 includes a mounting plate 41 and a plurality of first conductive structures 42 and a plurality of second conductive structures 43 provided on the mounting plate 41 . Specifically, the mounting plate 41 includes an upper plate body 411 and a lower plate body 412. The area of a wide side of the upper plate body 411 is smaller than that of a wide side of the lower plate body 412, and the upper plate The body 411 is fixed on the wide side of the lower plate body 412 (through an adhesive layer Q4 of the fan-out converter 4), that is, the mounting plate 41 has a stepped structure.

Furthermore, as shown in FIGS. 5 and 8 , a plurality of the first conductive structures 42 are arranged on the lower plate body 412 at intervals from each other, and a plurality of the second conductive structures 43 are arranged at intervals from each other on the upper plate body 412 . On the plate body 411 , that is, a plurality of the first conductive structures 42 and a plurality of the second conductive structures 43 are disposed on opposite sides of the mounting plate 41 . Wherein, parts of the plurality of first conductive structures 42 and parts of the plurality of second conductive structures 43 are exposed on the mounting plate 41 , and the parts of any two adjacent first conductive structures 42 A plurality of first conductive probes 22 are arranged with a first separation distance D1 and are electrically coupled respectively, and the portions of any two adjacent second conductive structures 43 are arranged with a second separation distance D2 , and the second separation distance D2 is smaller than the first separation distance D1.

Preferably, each of the second conductive structures 43 has a second outer end 431 and a second inner end 432 located on opposite sides of the upper plate body 411, and the second outer end 431 and the third The two inner ends 432 are protruding compared to the upper plate body 411, and the second outer end 431 is cylindrical, and the second inner end 432 is spherical. In addition, each of the first conductive structures 42 has a first outer end 421 and a first inner end 422 located on opposite sides of the lower plate body 412 . The first outer end 421 is smaller than the lower plate body 412 . The plate body 412 is protruding and cylindrical, and the first inner end 422 is recessed and exposed compared to the lower plate body 412 (that is, the first inner end 422 is located in the exposed hole of the lower plate body 412 ). Of course, in other not-shown embodiments of the present invention, each of the first outer end 421, the first inner end 422, the second outer end 431, and the second inner end 432 can be adjusted according to the designer's needs. For example, each of the first outer end 421, the first inner end 422, the second outer end 431, and the second inner end 432 may be cylindrical.

As shown in FIGS. 3 to 5 , the upper needle assembly 3 is disposed in the upper receiving groove G12 and includes a second carrier 31 and a plurality of second conductive probes disposed on the second carrier 31 . Needle 32. Two ends of each second conductive probe 32 are respectively exposed outside the second carrier 31 for electrical coupling between the object under test Z and the fan-out conversion component 4 .

In a practical application, as shown in Figures 4, 5 and 7, the second carrier 31 includes a second upper cover 311 and a second lower cover 312, and the second upper cover 311 and the second lower cover A plurality of second conductive probes 32 are disposed between the covers 312 , and both ends of the plurality of second conductive probes 32 can be exposed through the second upper cover 311 and the second lower cover 312 respectively. .

Looking more closely, the second upper cover 311 has a second stage 3111, a second ring wall portion 3112, and a second setting groove 3113.

The second stage 3111 has two opposite wide sides, and the second stage 3111 also has a plurality of second upper fixing holes H3111. The plurality of second upper fixing holes H3111 are arranged equidistantly from each other, and both ends of the plurality of second upper fixing holes H3111 are connected to the two wide sides of the second stage 3111.

The second ring wall part 3112 is connected to one of the wide sides of the second stage 3111 (ie, the upper side in FIG. 7 ) in a convex manner, so that the second ring wall part 3112 The top surface is higher than the aforementioned wide sides. When the object under test Z is installed in the area surrounded by the second ring wall part 3112, the object under test Z can be resisted by the inner edge of the second ring wall part 3112 to limit its movement. The second setting groove 3113 is formed on the other wide side of the second stage 3111 (ie, the lower side in FIG. 7 ).

Preferably, the second stage 3111 also has two limiting protrusions 3111A on opposite sides, and the positions of the two limiting protrusions 3111A correspond to the two notches 13 of the frame 1 respectively. , and the two limiting protrusions 3111A can be abutted by the inner edges of the two notches 13 , so that the movement of the second stage 3111 is restricted. Of course, the two limiting bumps and the two notches can also be omitted as appropriate.

Furthermore, in the wide side of the second stage 3111 facing the frame 1, the height of the wide side in the area enclosed by the second ring wall portion 3112 is higher than the width. The side surface is at a height outside the area enclosed by the second ring wall portion 3112 . In other words, the second stage 3111 has a stepped structure, and the top surface of the highest part of the second stage 3111 is connected to the second ring wall portion 3112 .

In addition, as shown in FIG. 7 , the second lower cover 312 is a plate-like structure and is disposed in the second setting groove 3113 , and the outer surface of the second lower cover 312 is preferably flush with the The second upper cover 311 is away from the wide side of the frame 1 . in. The second lower cover 312 has a second plate body 3121 and a plurality of second lower fixing holes 3122 located on the second plate body 3121. The plurality of second lower fixing holes 3122 correspond to the plurality of second lower fixing holes 3122. There are two upper fixing holes H3111, and any one of the second lower fixing holes 3122 and the corresponding second upper fixing hole H3111 is jointly provided with a second conductive probe 32.

In detail, each of the second conductive probes 32 is a spring connector (POGO PIN) in this application, and each of the second conductive probes 32 is disposed on the second stage 3111 and the third pin. between the two plates 3121, and both ends of each second conductive probe 32 can be exposed to the second carrier through the corresponding second upper fixing hole H3111 and the second lower fixing hole 3122 respectively. 31 outside.

It is worth noting that the second lower cover 312 may be fixed to the side of the second upper cover 311 away from the frame 1 . Specifically, the second ring wall portion 3112 has a plurality of second limiting holes H3112, and the area where the plurality of second limiting holes are projected onto the second setting groove is located in the plurality of second limiting holes H3112. On one side of the fixing hole H3111. The second lower cover 312 has a plurality of second alignment holes H312. The plurality of second alignment holes H312 and the plurality of second limiting holes H3112 correspond to each other, and the second corresponding holes H3112 correspond to each other. The alignment hole H312 and the second limiting hole H3112 can jointly accommodate a second alignment post 33 of the upper needle assembly 3 to limit the comparison of the second lower cover 312 with the second carrier 31 horizontal movement.

In addition, the second carrier 31 may also include an adhesive layer Q31, and the adhesive layer Q31 is disposed between the second lower cover 312 and the second carrier 31, so that the second upper cover 311 and the The second lower cover 312 is fixed between them. In practice, the adhesive layer Q31 is, for example, an underfill.

As shown in Figures 3 to 5, the limiting member 5 is provided on the frame 1, and the limiting member 5 can be used to limit the object Z to ensure that the object Z is A plurality of second conductive structures 43 are electrically coupled.

In a practical application, the limiting member 5 can be designed to be manual. Specifically, the limiting member 5 includes a pressing member 51 and two fasteners 52 disposed on both sides of the pressing member 51 . The positions of the two fasteners 52 correspond to the two fasteners 52 of the frame 1 . The two fasteners 52 buckle the two matching parts 14 so that the pressing part 51 is fixed on the frame 1 . The pressing member 51 can move toward the frame 1 in a spiral manner to abut the object Z to be measured, so that the movement of the object Z is restricted.

In another practical application, as shown in Figures 9 and 10, the limiter 5' can be designed to be automatic, that is, the limiter 5' can cooperate with an automatic device (such as a robotic arm), The limiting member 5' can be driven by the automatic equipment to limit the movement of the object Z to be measured.

[Technical effects of the embodiments of the present invention]

In summary, the probe card device disclosed in the embodiment of the present invention can be electrically coupled to the plurality of first conductive structures of the lower needle assembly through "the plurality of first conductive structures of the fan-out conversion member." "First conductive probe", "Any two adjacent second conductive structures are arranged at a second separation distance smaller than the first distance, and a plurality of the second conductive structures are electrically coupled to multiple The design of "the first conductive structure" and "the two ends of each second conductive probe of the upper needle assembly can be electrically coupled to the second conductive structure and the object under test respectively" , the lower pin assembly, the fan-out conversion piece, and the upper pin assembly can be modularized, and a test substrate (for example, a large-size test substrate) can be configured by selecting the appropriate lower pin assembly, all The fan-out converter and the upper pin assembly are used to test wafers of different sizes.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

100:Probe card device

1:Frame

11: Bearing part

12:Fence Department

13: Notch

14: Matching parts

G11: Lower storage tank

G12: Upper storage tank

2: Lower needle assembly

21:First carrier

211:First cover

2111:The first carrier

2112:The first ring wall

2113: First setting slot

H2111: First upper fixing hole

H2112: First limit hole

212: First cover

2121:First plate body

2122: First fixing hole

H212: First alignment hole

22: First conductive probe

23:First pair of posts

3: Upper needle assembly

31: Second carrier

311: Second upper cover

3111: Second carrier

3111A:Limiting bump

3112:Second ring wall

3113: Second setting slot

H3111: Second upper fixing hole

H3112: Second limit hole

312:Second lower cover

3121:Second plate body

3122:Second lower fixing hole

H312: Second alignment hole

32: Second conductive probe

33:Second counterpoint

4: Fan-out conversion piece

41:Mounting plate

411: Upper plate body

412:Lower plate body

42: First conductive structure

421: first outer end

422: first inner end

43: Second conductive structure

431:Second outer end

432:Second inner end

5. 5’: Limiting piece

51: Urgent items

52:Fasteners

D1: first separation distance

D2: The second separation distance

Z: object to be tested

Figure 1 is a schematic three-dimensional view of the probe card device of the present invention.

Figure 2 is another perspective view of the probe card device of the present invention.

Figure 3 is an exploded schematic diagram of the probe card device of the present invention.

Figure 4 is another exploded schematic view of the probe card device of the present invention.

Figure 5 is a schematic cross-sectional view of the probe card device of the present invention.

FIG. 6 is a partially enlarged schematic diagram of the VI region in FIG. 5 .

FIG. 7 is a partially enlarged schematic diagram of region VII in FIG. 5 .

FIG. 8 is a partially enlarged schematic diagram of region VIII in FIG. 5 .

FIG. 9 is an exploded schematic view of the probe card device of the present invention with another form of limiting member.

FIG. 10 is another exploded schematic view of the probe card device of the present invention with another form of limiting member.

100:Probe card device

1:Frame

14: Matching parts

2: Lower needle assembly

5: Limiting parts

51: Urgent items

52:Fasteners

Claims (9)

A probe card device includes: a frame having a lower accommodation slot and an upper accommodation slot that are connected to each other; a lower needle assembly is arranged in the lower accommodation slot, and the lower needle assembly includes: a first A carrier; and a plurality of first conductive probes arranged on the first carrier, with two ends of each first conductive probe respectively exposed outside the first carrier; a fan-out conversion piece, including: A mounting plate is installed on the lower needle assembly; a plurality of first conductive structures and a plurality of second conductive structures are arranged on opposite sides of the mounting plate, and the plurality of first conductive structures are electrically coupled respectively. A plurality of second conductive structures are connected, and parts of a plurality of first conductive structures and parts of a plurality of second conductive structures are exposed on the mounting board, and any two adjacent first conductive structures The parts of the structure are arranged at a first separation distance and are electrically coupled to a plurality of the first conductive probes respectively, and the parts of any two adjacent second conductive structures are at a second separation distance. configured, and the second spacing distance is smaller than the first spacing distance; and an upper plate body and a lower plate body, the upper plate body is installed on a wide side of the lower plate body, and the upper plate body The area of a wide side of the body is smaller than the wide side of the lower plate body; an upper needle assembly is disposed in the upper receiving groove, and the upper needle assembly includes: a second carrier; and a plurality of third Two conductive probes are arranged on the second carrier. Both ends of each second conductive probe are exposed to the outside of the second carrier. One end of the plurality of second conductive probes is electrically conductive. The plurality of second conductive structures are sexually coupled, and the other ends of the plurality of second conductive probes can be used to An object to be measured is electrically coupled; and a limiting member is provided on the frame, and the limiting member is used to limit the object to be measured. The probe card device according to claim 1, wherein the first carrier includes: a first upper cover, including: a first carrier with two opposite wide sides, and the first carrier has a connecting A plurality of first upper fixing holes on the two wide sides; a first ring wall portion connected to one of the wide sides of the first stage, and the inner edge of the first ring wall portion is against By the fan-out conversion piece; a first setting groove, located on the other wide side of the first stage; and a first lower cover, set in the first setting groove, the first setting groove The lower cover has a first plate body and a plurality of first lower fixing holes located on the first plate body. The plurality of first lower fixing holes correspond to the plurality of first upper fixing holes, and any one The first lower fixing hole and the corresponding first upper fixing hole are jointly provided with a first conductive probe. The probe card device according to claim 2, wherein the outer surface of the first lower cover is flush with the wide side of the first upper cover away from the frame; Among the wide sides of the frame, the height of the wide side in the area surrounded by the first ring wall part is higher than the height of the wide side outside the area surrounded by the first ring wall part. . The probe card device according to claim 2, wherein the first ring wall portion has a plurality of first limiting holes, the first lower cover has a plurality of first alignment holes, and the plurality of first alignment holes A pair of positioning holes and the plurality of first limiting holes are positioned correspondingly to each other, and The first alignment hole and the first limiting hole corresponding to each other jointly accommodate a first alignment post of the lower needle assembly to limit the first lower cover compared to the first carrier. horizontal movement. The probe card device according to claim 1, wherein the second carrier includes: a second upper cover, including: a second carrier with two opposite wide sides, and the second carrier has a connecting A plurality of second upper fixing holes on the two wide sides; a second ring wall portion connected to one of the wide sides of the second stage, and the inner edge of the second ring wall portion is to abut the object to be measured; a second setting groove located on the other wide side of the second stage; and a second lower cover provided in the second setting groove, the The second lower cover has a second plate body and a plurality of second lower fixing holes located on the second plate body. The plurality of second lower fixing holes correspond to the plurality of second upper fixing holes. One of the second lower fixing holes and the corresponding second upper fixing hole are jointly provided with a second conductive probe. The probe card device according to claim 5, wherein the outer surface of the second lower cover is aligned with the wide side of the second upper cover away from the frame; Among the wide sides of the frame, the height of the wide side in the area surrounded by the second ring wall part is higher than the height of the wide side outside the area surrounded by the second ring wall part. . The probe card device according to claim 5, wherein the second ring wall portion has a plurality of second limiting holes, the second lower cover has a plurality of second alignment holes, and the plurality of second positioning holes The two alignment holes and the plurality of second limiting holes are positioned corresponding to each other, and The second alignment hole and the second limiting hole corresponding to each other jointly accommodate a second alignment post of the upper needle assembly to limit the comparison of the second lower cover with the second carrier. horizontal movement. The probe card device according to claim 1, wherein each of the second conductive structures is disposed on the upper plate body, and each of the second conductive structures has two conductors located on opposite sides of the upper plate body. An outer end and an inner end, the outer end is cylindrical, and the inner end is spherical; each of the first conductive structures is provided on the lower plate body, and each of the first conductive structures has a An outer end of the lower plate body is cylindrical. The probe card device according to claim 1, wherein the limiting member includes a pressing member and two fasteners arranged on both sides of the pressing member, and the positions of the two fasteners correspond to the There are two matching parts of the frame, and the two fasteners buckle the two matching parts to fix the pressing part on the frame.