TWI812473B - Adaptive grid generating method and adaptive grid generating system - Google Patents

Adaptive grid generating method and adaptive grid generating system Download PDF

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TWI812473B
TWI812473B TW111135294A TW111135294A TWI812473B TW I812473 B TWI812473 B TW I812473B TW 111135294 A TW111135294 A TW 111135294A TW 111135294 A TW111135294 A TW 111135294A TW I812473 B TWI812473 B TW I812473B
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mesh
grid
dimensional surface
dimensional
adaptive
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TW202414262A (en
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陳學良
黃振洲
王怡昌
洪宗顯
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英業達股份有限公司
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Abstract

An adaptive grid generating method includes obtaining a first three-dimensional grid of a target structure; importing the first three-dimensional grid into a computer-aided engineering software to obtain a first two-dimensional planar grid; importing the first two-dimensional planar grid into a grid cleaning software to obtain a second two-dimensional planar grid; and importing the second two-dimensional planar grid into the computer-aided engineering software to obtain a second three-dimensional planar grid.

Description

自適應網格產生方法及自適應網格產生系統 Adaptive grid generation method and adaptive grid generation system

本發明涉及一種自適應網格產生方法及自適應網格產生系統,尤指一種對網格清理及修復的自適應網格產生方法及自適應網格產生系統。 The invention relates to an adaptive grid generation method and an adaptive grid generation system, and in particular to an adaptive grid generation method and an adaptive grid generation system for grid cleaning and repair.

電腦系統的快速發展為工程分析提供了強而有力的工具,因此工程師可以利用數值模擬方法來模擬產品的結構遇到的實際問題。例如,在設計產品的結構時會利用有限元素結構分析軟體ABAQUS來分析結構的網格模型。然而,當產品的結構非常複雜,ABAQUS分析結構的網格模型時的資訊量過大。在此情形下,如何適當地簡化產品的結構,再進行ABAQUS分析結構的網格模型以兼顧效率及品質就成為業界所努力的目標。 The rapid development of computer systems has provided powerful tools for engineering analysis, so engineers can use numerical simulation methods to simulate actual problems encountered in the structure of products. For example, when designing the structure of a product, the finite element structural analysis software ABAQUS is used to analyze the grid model of the structure. However, when the structure of the product is very complex, the amount of information required when ABAQUS analyzes the grid model of the structure is too large. Under this situation, how to appropriately simplify the structure of the product and then analyze the grid model of the structure with ABAQUS to take into account both efficiency and quality has become the goal of the industry.

本發明的主要目的之一在於提供一自適應網格產生方法及自適應網格產生系統,以解決上述問題。 One of the main objectives of the present invention is to provide an adaptive grid generation method and an adaptive grid generation system to solve the above problems.

本發明提供一種自適應網格產生方法,包含有獲得一目標結構的一第一三維網格;將該第一三維網格匯入一電腦輔助工程軟體,以獲得一第一二 維表面網格;將該第一二維表面網格匯入一網格清理軟體,以獲得一第二二維表面網格;以及將該第二二維表面網格匯入該電腦輔助工程軟體,以獲得一第二三維網格。 The invention provides an adaptive mesh generation method, which includes obtaining a first three-dimensional mesh of a target structure; importing the first three-dimensional mesh into a computer-aided engineering software to obtain a first and second a two-dimensional surface mesh; importing the first two-dimensional surface mesh into a mesh cleaning software to obtain a second two-dimensional surface mesh; and importing the second two-dimensional surface mesh into the computer-aided engineering software , to obtain a second three-dimensional grid.

本發明提供一種自適應網格產生系統,包含有一處理器;以及一記憶體,用來儲存一程式碼,該程式碼指示該處理器執行一自適應網格產生方法,該自適應網格產生方法包含有獲得一目標結構的一第一三維網格;將該第一三維網格匯入一電腦輔助工程軟體,以獲得一第一二維表面網格;將該第一二維表面網格匯入一網格清理軟體,以獲得一第二二維表面網格;以及將該第二二維表面網格匯入該電腦輔助工程軟體,以獲得一第二三維網格。 The present invention provides an adaptive grid generation system, which includes a processor; and a memory for storing a program code that instructs the processor to execute an adaptive grid generation method. The adaptive grid generation method The method includes obtaining a first three-dimensional mesh of a target structure; importing the first three-dimensional mesh into a computer-aided engineering software to obtain a first two-dimensional surface mesh; converting the first two-dimensional surface mesh Importing a mesh cleaning software to obtain a second two-dimensional surface mesh; and importing the second two-dimensional surface mesh into the computer-aided engineering software to obtain a second three-dimensional mesh.

1:結構強度分析系統 1: Structural strength analysis system

2,3:流程 2,3:Process

10:處理器 10: Processor

20:記憶體 20:Memory

S200,S202,S204,S206,S208,S210,S300,S302,S304:步驟 S200,S202,S204,S206,S208,S210,S300,S302,S304: Steps

第1圖為本發明實施例一自適應網格產生系統之示意圖。 Figure 1 is a schematic diagram of an adaptive grid generation system according to an embodiment of the present invention.

第2圖為本發明實施例自適應網格產生方法流程之示意圖。 Figure 2 is a schematic diagram of the flow of an adaptive grid generation method according to an embodiment of the present invention.

第3圖為本發明實施例網格模型之示意圖。 Figure 3 is a schematic diagram of a grid model according to an embodiment of the present invention.

第4圖為本發明另一實施例網格模型之示意圖。 Figure 4 is a schematic diagram of a grid model according to another embodiment of the present invention.

第5圖為本發明實施例第二三維網格之示意圖。 Figure 5 is a schematic diagram of the second three-dimensional grid according to the embodiment of the present invention.

第6圖為本發明實施例之網格清理方法的示意圖。 Figure 6 is a schematic diagram of a mesh cleaning method according to an embodiment of the present invention.

在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,硬體製造商可能會用不同的名詞來稱呼同一個元件。本說明書及後續的申請專利範圍並不以名稱的差異來做為 區分元件的方式,而是以元件在功能上的差異來做為區分的準則。在通篇說明書及後續的申請專利範圍當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。以外,「耦接」一詞在此係包含任何直接及間接的電氣連接手段。因此,若文中描述一第一裝置耦接於一第二裝置,則代表該第一裝置可直接電氣連接於該第二裝置,或透過其他裝置或連接手段間接地電氣連接至該第二裝置。 Certain words are used in the description and subsequent patent claims to refer to specific components. It will be understood by those with ordinary knowledge in the art that hardware manufacturers may use different terms to refer to the same component. The scope of this specification and subsequent patent applications does not depend on the difference in name. The way to distinguish components is to use the functional differences of components as the criterion for differentiation. The "include" mentioned throughout the specification and subsequent patent claims is an open-ended term, and therefore should be interpreted as "include but not limited to". In addition, the word "coupling" here includes any direct and indirect means of electrical connection. Therefore, if a first device is coupled to a second device, it means that the first device can be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connections.

請參考第1圖,第1圖為本發明實施例一自適應網格產生系統1之示意圖。自適應網格產生系統1包含有相互耦接之一處理器10以及一記憶體20,記憶體20用來儲存一程式碼,程式碼指示處理器10執行一自適應網格產生方法,用以簡化一產品結構的網格模型,以快速分析產品結構並兼顧分析結果的品質。需注意的是,自適應網格產生系統1僅表示執行自適應網格產生方法所需之必要元件,其基本架構為本領域所熟知,故不贅述,本領域具通常知識者當可根據所需,適當增加其他元件,如主機板、電源、連接線、輸入裝置等,而不限於此,或是以適當裝置或設備實現自適應網格產生系統1。 Please refer to Figure 1 , which is a schematic diagram of an adaptive grid generation system 1 according to an embodiment of the present invention. The adaptive grid generation system 1 includes a processor 10 and a memory 20 coupled to each other. The memory 20 is used to store a program code. The program code instructs the processor 10 to execute an adaptive grid generation method for Simplify the grid model of a product structure to quickly analyze the product structure while taking into account the quality of the analysis results. It should be noted that the adaptive grid generation system 1 only represents the necessary components required to implement the adaptive grid generation method. Its basic structure is well known in the art, so it will not be described in detail. Those with ordinary knowledge in the art can make the calculation based on the required information. If necessary, other components may be appropriately added, such as motherboard, power supply, connecting cables, input devices, etc., but not limited to these, or the adaptive grid generation system 1 may be implemented with appropriate devices or equipment.

關於自適應網格產生系統1執行的自適應網格產生方法,可歸納為一流程2,如第2圖所示。流程2包含以下步驟: The adaptive grid generation method performed by the adaptive grid generation system 1 can be summarized as a process 2, as shown in Figure 2. Process 2 includes the following steps:

步驟S200:開始。 Step S200: Start.

步驟S202:獲得一目標結構的一第一三維網格。 Step S202: Obtain a first three-dimensional mesh of a target structure.

步驟S204:將第一三維網格匯入一電腦輔助工程軟體,以獲得一第一二維表面網格。 Step S204: Import the first three-dimensional mesh into a computer-aided engineering software to obtain a first two-dimensional surface mesh.

步驟S206:將第一二維表面網格匯入一網格清理軟體,以獲得一第二二維表面網格。 Step S206: Import the first two-dimensional surface mesh into a mesh cleaning software to obtain a second two-dimensional surface mesh.

步驟S208:將第二二維表面網格匯入該電腦輔助工程軟體,以獲得一第二三維網格。 Step S208: Import the second two-dimensional surface mesh into the computer-aided engineering software to obtain a second three-dimensional mesh.

步驟S210:結束。 Step S210: end.

根據流程2,於步驟S202中,自適應網格產生系統1由一製圖軟體匯出目標結構的第一三維網格,例如,請參考第3圖,第一三維網格可以是Cero CAD軟體所匯出的一IDX格式檔案,而不以此為限。於步驟S204中,自適應網格產生系統1將第一三維網格匯入一電腦輔助工程軟體,以獲得第一二維表面網格。例如,電腦輔助工程軟體可以是一有限元素結構分析軟體ABAQUS,透過在ABAQUS中選擇2D Planar模式可以將第一三維網格轉換並匯出為一STL格式(*.stl)的第一二維表面網格,其基本轉換過程為本領域所熟知,故不贅述。 According to the process 2, in step S202, the adaptive grid generation system 1 exports the first three-dimensional grid of the target structure through a drawing software. For example, please refer to Figure 3, the first three-dimensional grid can be generated by Cero CAD software. An IDX format file exported, but not limited to this. In step S204, the adaptive mesh generation system 1 imports the first three-dimensional mesh into a computer-aided engineering software to obtain the first two-dimensional surface mesh. For example, the computer-aided engineering software can be a finite element structural analysis software ABAQUS. By selecting the 2D Planar mode in ABAQUS, the first three-dimensional mesh can be converted and exported into a first two-dimensional surface in STL format (*.stl). The basic conversion process of the grid is well known in the art, so it will not be described in detail.

於步驟S206中,自適應網格產生系統1將第一二維表面網格匯入網格清理軟體並執行一網格清理方法,以對第一二維表面網格進行網格清理,如此一來,第一二維表面網格即可簡化為第二二維表面網格。例如,網格清理軟體可以是基於Python的PyMesh套件,PyMesh套件是用於幾何處理的一種快速原型製作平台,其應用範疇主要是三維列印。簡言之,自適應網格產生系統1利用PyMesh套件中的網格清理方法對第一二維表面網格進行網格清理並得到STL格式的第二二維表面網格。 In step S206, the adaptive mesh generation system 1 imports the first two-dimensional surface mesh into the mesh cleaning software and executes a mesh cleaning method to perform mesh cleaning on the first two-dimensional surface mesh. In this way Then, the first two-dimensional surface mesh can be simplified into the second two-dimensional surface mesh. For example, the mesh cleaning software can be the Python-based PyMesh suite. The PyMesh suite is a rapid prototyping platform for geometry processing, and its main application area is three-dimensional printing. In short, the adaptive mesh generation system 1 uses the mesh cleaning method in the PyMesh suite to clean the first two-dimensional surface mesh and obtain the second two-dimensional surface mesh in STL format.

具體而言,在上述步驟之後,第二二維表面網格相較於第一二維表面網格去除了可以簡化的部分,因此,於步驟S208中,自適應網格產生系統1即可將第二二維表面網格匯入電腦輔助工程軟體ABAQUS,以獲得第二三維網格。如此一來,電腦輔助工程軟體ABAQUS即可根據第二三維網格分析目標結 構的網格模型並且兼顧分析效率及分析品質。 Specifically, after the above steps, compared with the first two-dimensional surface grid, the second two-dimensional surface grid removes the parts that can be simplified. Therefore, in step S208, the adaptive grid generation system 1 can The second two-dimensional surface mesh was imported into the computer-aided engineering software ABAQUS to obtain the second three-dimensional mesh. In this way, the computer-aided engineering software ABAQUS can analyze the target structure based on the second three-dimensional grid. It adopts a structured grid model and takes into account both analysis efficiency and analysis quality.

舉例而言,目標結構可以是一筆記型電腦的一C件。請參考第3圖、第4圖及第5圖,需注意的是,由於C件的結構非常複雜,因此第3圖及第4圖擷取C件的不同部分以做說明。具體而言,第3a圖及第4a圖為本發明實施例C件的第一三維網格之示意圖,其中第一三維網格對應C件較複雜的結構處會呈現較小的複數個網格(例如,粗體線標示之複數個網格)。第3b圖及第4b為第一二維表面網格之示意圖,自適應網格產生系統1將第一三維網格轉換為第一二維表面網格,其中第一二維表面維格對應C件較複雜的結構處亦以粗體線標示。第3c圖及第4c圖為第二二維表面網格之示意圖,自適應網格產生系統1對第一二維表面網格執行網格清理獲得第二二維表面網格。如第3c圖及第4c圖所示,對應第3b圖及第4b圖之粗體線的區域已被清理並簡化。第3d圖及第4d圖為第二三維網格之示意圖,自適應網格產生系統1將第二二維表面網格轉換為第二三維網格。如第3d圖及第4d圖所示,第二三維網格相較於第一三維網格去除了可以簡化的部分。進一步地,如第5圖所示,第5圖為對應完整的C件的第二三維網格,電腦輔助工程軟體ABAQUS即可根據第二三維網格分析C件的網格模型並且兼顧分析效率及分析品質。 For example, the target structure may be a C component of a laptop computer. Please refer to Figures 3, 4 and 5. It should be noted that since the structure of Part C is very complex, Figures 3 and 4 capture different parts of Part C for illustration. Specifically, Figures 3a and 4a are schematic diagrams of the first three-dimensional grid of Part C according to the embodiment of the present invention. The first three-dimensional grid will present a plurality of smaller grids corresponding to the more complex structure of Part C. (For example, multiple grids marked with bold lines). Figures 3b and 4b are schematic diagrams of the first two-dimensional surface grid. The adaptive grid generation system 1 converts the first three-dimensional grid into a first two-dimensional surface grid, where the first two-dimensional surface grid corresponds to C The more complex structures of the piece are also marked with bold lines. Figures 3c and 4c are schematic diagrams of the second two-dimensional surface grid. The adaptive grid generation system 1 performs grid cleaning on the first two-dimensional surface grid to obtain the second two-dimensional surface grid. As shown in Figures 3c and 4c, the areas corresponding to the bold lines in Figures 3b and 4b have been cleaned up and simplified. Figure 3d and Figure 4d are schematic diagrams of the second three-dimensional grid. The adaptive grid generation system 1 converts the second two-dimensional surface grid into a second three-dimensional grid. As shown in Figure 3d and Figure 4d, compared with the first three-dimensional grid, the second three-dimensional grid has removed parts that can be simplified. Further, as shown in Figure 5, which is the second three-dimensional grid corresponding to the complete C part, the computer-aided engineering software ABAQUS can analyze the grid model of C part based on the second three-dimensional grid and take into account the analysis efficiency. and analytical quality.

在另一實施例中,關於自適應網格產生系統1執行的網格清理方法,可歸納為一流程3,如第6圖所示。流程3包含以下步驟: In another embodiment, the mesh cleaning method performed by the adaptive mesh generation system 1 can be summarized as a process 3, as shown in Figure 6. Process 3 includes the following steps:

步驟S300:根據第一二維表面網格及一網格清理係數,執行網格清理方法以獲得近似二維表面網格。 Step S300: According to the first two-dimensional surface mesh and a mesh cleaning coefficient, perform a mesh cleaning method to obtain an approximate two-dimensional surface mesh.

步驟S302:比較第一二維表面網格與近似二維表面網格的一體積變化率以調整網格清理係數。 Step S302: Compare a volume change rate of the first two-dimensional surface grid and the approximate two-dimensional surface grid to adjust the grid cleaning coefficient.

步驟S303:輸入近似二維表面網格為第二二維表面網格。 Step S303: Input the approximate two-dimensional surface grid as the second two-dimensional surface grid.

於步驟S300中,自適應網格產生系統1可以設定網格清理係數,並根據網格清理係數對第一二維表面網格執行網格清理方法以獲得近似二維表面網格。於步驟S302中,自適應網格產生系統1比較第一二維表面網格與近似二維表面網格的體積變化率,當第一二維表面網格與近似二維表面網格的一面積變化率大於一預定變化率時,調整網格清理方法的網格清理係數,並再次執行流程3。當第一二維表面網格與近似二維表面網格的面積變化率小於等於預定變化率,輸入近似二維表面網格為第二二維表面網格。例如,自適應網格產生系統1設定預定變化率為3%,當體積變化率大於3%時,調整網格清理係數,並再次執行流程3。當體積變化率小於3%時,輸入近似二維表面網格為第二二維表面網格。 In step S300, the adaptive mesh generation system 1 may set a mesh cleaning coefficient, and perform a mesh cleaning method on the first two-dimensional surface mesh according to the mesh cleaning coefficient to obtain an approximate two-dimensional surface mesh. In step S302, the adaptive grid generation system 1 compares the volume change rate of the first two-dimensional surface grid and the approximate two-dimensional surface grid. When an area of the first two-dimensional surface grid and the approximate two-dimensional surface grid When the change rate is greater than a predetermined change rate, adjust the mesh cleaning coefficient of the mesh cleaning method, and execute process 3 again. When the area change rate between the first two-dimensional surface grid and the approximate two-dimensional surface grid is less than or equal to the predetermined change rate, the approximate two-dimensional surface grid is input as the second two-dimensional surface grid. For example, the adaptive mesh generation system 1 sets a predetermined change rate of 3%. When the volume change rate is greater than 3%, the mesh cleaning coefficient is adjusted and process 3 is executed again. When the volume change rate is less than 3%, the approximate two-dimensional surface grid is input as the second two-dimensional surface grid.

需注意的是,自適應網格產生系統1係為本發明之實施例,本領域具通常知識者當可依本發明的精神加以結合、修飾或變化以上所述的實施例,而不限於此。上述所有的說明、步驟、及/或流程(包含建議步驟),可透過硬體、軟體、韌體(即硬體裝置與電腦指令的組合,硬體裝置中的資料為唯讀軟體資料)、電子系統、或上述裝置的組合等方式實現。硬體可包含類比、數位及混合電路(即微電路、微晶片或矽晶片)。電子系統可包含系統單晶片(system on chip,SoC)、系統封裝(system in package,SiP)、電腦模組(computer on module,CoM)及自適應網格產生系統1。本發明之流程步驟與實施例可以程式碼或指令的型態存在而儲存於記憶體20中。記憶體20可為電腦可讀取記錄媒體,記憶體20可包括唯讀記憶體(read-only memory,ROM)、快閃記憶體(Flash Memory)、隨機存取記憶體(random-access memory,RAM)、用戶識別模組(Subscriber Identity Module,SIM)、硬碟、光碟唯讀記憶體(CD-ROM/DVD-ROM/ BD-ROM),但不以此為限。上述流程及實施例可被編譯成程式代碼或指令並儲存於記憶體20。處理器10可用於讀取與執行記憶體20中所儲存的程式碼或指令以實現前述所有步驟與功能。 It should be noted that the adaptive grid generation system 1 is an embodiment of the present invention. Those of ordinary skill in the art can combine, modify or change the above-described embodiments according to the spirit of the present invention, but are not limited thereto. . All the above instructions, steps, and/or processes (including recommended steps) can be achieved through hardware, software, and firmware (that is, the combination of hardware devices and computer instructions, and the data in the hardware devices are read-only software data), Electronic system, or a combination of the above devices. Hardware can include analog, digital, and hybrid circuits (i.e., microcircuits, microchips, or silicon chips). Electronic systems may include system on chip (SoC), system in package (SiP), computer on module (CoM) and adaptive grid generation system 1 . The process steps and embodiments of the present invention may exist in the form of program codes or instructions and be stored in the memory 20 . The memory 20 can be a computer-readable recording medium, and the memory 20 can include read-only memory (ROM), flash memory (Flash Memory), random-access memory (random-access memory, RAM), Subscriber Identity Module (SIM), hard disk, CD-ROM/DVD-ROM/ BD-ROM), but not limited to this. The above-mentioned processes and embodiments can be compiled into program codes or instructions and stored in the memory 20 . The processor 10 can be used to read and execute the program codes or instructions stored in the memory 20 to implement all the aforementioned steps and functions.

綜上所述,相較於傳統技術,本發明的自適應網格產生系統可以利用網格清理軟體清理目標結構的網格模型,再匯入電腦輔助工程軟體分析目標結構,如此可以減少分析軟體大量的運算並且兼顧分析準確度。 In summary, compared with traditional technology, the adaptive mesh generation system of the present invention can use mesh cleaning software to clean the mesh model of the target structure, and then import it into computer-aided engineering software to analyze the target structure, which can reduce the number of analysis software A large number of calculations and taking into account the accuracy of analysis.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only preferred embodiments of the present invention, and all equivalent changes and modifications made in accordance with the patentable scope of the present invention shall fall within the scope of the present invention.

2:流程 2: Process

S200,S202,S204,S206,S208,S210:步驟 S200, S202, S204, S206, S208, S210: steps

Claims (6)

一種自適應網格產生方法,包含有:(a)獲得一目標結構的一第一三維網格;(b)將該第一三維網格匯入一電腦輔助工程軟體,以獲得一第一二維表面網格;(c)將該第一二維表面網格匯入一網格清理軟體,以獲得一第二二維表面網格;以及(d)將該第二二維表面網格匯入該電腦輔助工程軟體,以獲得一第二三維網格;其中步驟(c)包含有:根據該第一二維表面網格,執行一網格清理方法以獲得一近似二維表面網格;當該第一二維表面網格與該近似二維表面網格的一面積變化率大於一預定變化率時,調整該網格清理方法的一網格清理係數,並再次執行步驟(c);以及當該第一二維表面網格與該近似二維表面網格的該面積變化率小於等於該預定變化率,輸入該近似二維表面網格為該第二二維表面網格。 An adaptive mesh generation method includes: (a) obtaining a first three-dimensional mesh of a target structure; (b) importing the first three-dimensional mesh into a computer-aided engineering software to obtain a first or second three-dimensional surface mesh; (c) import the first two-dimensional surface mesh into a mesh cleaning software to obtain a second two-dimensional surface mesh; and (d) import the second two-dimensional surface mesh Enter the computer-aided engineering software to obtain a second three-dimensional mesh; wherein step (c) includes: performing a mesh cleaning method according to the first two-dimensional surface mesh to obtain an approximate two-dimensional surface mesh; When an area change rate between the first two-dimensional surface grid and the approximate two-dimensional surface grid is greater than a predetermined change rate, adjust a grid cleaning coefficient of the grid cleaning method, and perform step (c) again; And when the area change rate between the first two-dimensional surface grid and the approximate two-dimensional surface grid is less than or equal to the predetermined change rate, the approximate two-dimensional surface grid is input as the second two-dimensional surface grid. 如請求項1所述之自適應網格產生方法,其中該電腦輔助工程軟體為ABAQUS。 The adaptive grid generation method as described in claim 1, wherein the computer-aided engineering software is ABAQUS. 如請求項1所述之自適應網格產生方法,其中該網格清理軟體為PyMesh。 The adaptive mesh generation method as described in claim 1, wherein the mesh cleaning software is PyMesh. 一種自適應網格產生系統,包含有:一處理器;以及一記憶體,用來儲存一程式碼,該程式碼指示該處理器執行一自適應網格產生方法,該自適應網格產生方法包含有:(a)獲得一目標結構的一第一三維網格;(b)將該第一三維網格匯入一電腦輔助工程軟體,以獲得一第一二維表面網格;(c)將該第一二維表面網格匯入一網格清理軟體,以獲得一第二二維表面網格;以及(d)將該第二二維表面網格匯入該電腦輔助工程軟體,以獲得一第二三維網格;其中步驟(c)包含有:根據該第一二維表面網格,執行一網格清理方法以獲得一近似二維表面網格;當該第一二維表面網格與該近似二維表面網格的一面積變化率大於一預定變化率時,調整該網格清理方法的一網格清理係數,並再次執行步驟(c);以及當該第一二維表面網格與該近似二維表面網格的該面積變化率小於等於該預定變化率,輸入該近似二維表面網格為該第二二維表面網格。 An adaptive grid generation system includes: a processor; and a memory used to store a program code, the program code instructs the processor to execute an adaptive grid generation method, the adaptive grid generation method The method includes: (a) obtaining a first three-dimensional mesh of a target structure; (b) importing the first three-dimensional mesh into a computer-aided engineering software to obtain a first two-dimensional surface mesh; (c) Import the first two-dimensional surface mesh into a mesh cleaning software to obtain a second two-dimensional surface mesh; and (d) import the second two-dimensional surface mesh into the computer-aided engineering software to obtain a second two-dimensional surface mesh. Obtain a second three-dimensional mesh; wherein step (c) includes: performing a mesh cleaning method according to the first two-dimensional surface mesh to obtain an approximate two-dimensional surface mesh; when the first two-dimensional surface mesh When the area change rate between the grid and the approximate two-dimensional surface grid is greater than a predetermined change rate, adjust a grid cleaning coefficient of the grid cleaning method, and perform step (c) again; and when the first two-dimensional surface The area change rate between the grid and the approximate two-dimensional surface grid is less than or equal to the predetermined change rate, and the approximate two-dimensional surface grid is input as the second two-dimensional surface grid. 如請求項4所述之自適應網格產生系統,其中該電腦輔助工程軟體為ABAQUS。 The adaptive grid generation system as described in claim 4, wherein the computer-aided engineering software is ABAQUS. 如請求項4所述之自適應網格產生系統,其中該網格清理軟體為PyMesh。 The adaptive mesh generation system as described in claim 4, wherein the mesh cleaning software is PyMesh.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201927523A (en) * 2017-12-13 2019-07-16 芬蘭商塔克圖科技有限公司 Arrangement and method for facilitating electronics design in connection with 3D structures
CN111737896A (en) * 2020-06-17 2020-10-02 中国科学院武汉岩土力学研究所 Open caisson key point calculation stress automatic extraction and analysis system and method based on ABAQUS
US20210034801A1 (en) * 2019-07-29 2021-02-04 Thornton Tomasetti, Inc. Methods and systems for designing metamaterials
CN113361147A (en) * 2021-07-21 2021-09-07 湖北大学 Construction method, system, terminal and medium of heat conduction model of three-dimensional composite material
CN114398711A (en) * 2022-03-25 2022-04-26 中国长江三峡集团有限公司 Concrete gravity dam CAE integrated analysis method and device and electronic equipment
CN114818430A (en) * 2022-05-10 2022-07-29 山东大学 Method and system for online visualization of strain field and three-dimensional deformation of bearing structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201927523A (en) * 2017-12-13 2019-07-16 芬蘭商塔克圖科技有限公司 Arrangement and method for facilitating electronics design in connection with 3D structures
US20210034801A1 (en) * 2019-07-29 2021-02-04 Thornton Tomasetti, Inc. Methods and systems for designing metamaterials
CN111737896A (en) * 2020-06-17 2020-10-02 中国科学院武汉岩土力学研究所 Open caisson key point calculation stress automatic extraction and analysis system and method based on ABAQUS
CN113361147A (en) * 2021-07-21 2021-09-07 湖北大学 Construction method, system, terminal and medium of heat conduction model of three-dimensional composite material
CN114398711A (en) * 2022-03-25 2022-04-26 中国长江三峡集团有限公司 Concrete gravity dam CAE integrated analysis method and device and electronic equipment
CN114818430A (en) * 2022-05-10 2022-07-29 山东大学 Method and system for online visualization of strain field and three-dimensional deformation of bearing structure

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