TWI812466B - Comparison method, device front-end module - Google Patents

Abstract

Provides a load port and a comparison processing method in the load port that detect mixed loading of objects having different planar dimensions before and after an intermediate processing process, thereby helping to improve utilization rates in semiconductor manufacturing. It is configured to perform: seating holding processing to hold the transportation container (FOUP (3) or the second transportation container (C)) on the placement table (5); and rear pulling processing to place the placement table (5) on the The transfer container is moved from the seating position to the transfer object receiving position; and the first comparison process is to place the comparison device (M2) through the opening (41) of the frame (4) in the open state to detect the first The first comparison position (P1) of the conveyance object (W) is executed; and the second comparison process is executed by placing the comparator (M2) at the second comparison position capable of detecting the second conveyance object (F). .

Description

Comparison method, device front-end module

The present invention relates to an EFEM (Equipment Front End Module) used in a semiconductor manufacturing process to transfer objects to and from a FOUP, a transport container that can accommodate a plurality of wafers and other objects to be transported in multi-stage slots. ; Equipment front-end module), especially EFEM, which has a mapping mechanism for comparing information on the presence or absence of conveyance objects in each slot of the FOUP, and a mapping method.

For example, in the semiconductor manufacturing process, in order to improve the yield or quality, wafers are processed in a clean room. In recent years, the "Mini-Environment method" has been introduced, which is to further improve the cleanliness of only the local space around the wafer and use it for other processing such as wafer transportation. In the micro-environment method, a part of the wall that forms a substantially closed wafer transfer chamber (hereinafter referred to as the transfer chamber) is placed inside the frame, and a transfer container is used to store wafers and other transfer objects in a high-clean internal space. That is, a FOUP (Front-Opening Unified Pod; wafer), and a load port that has the function of opening and closing the FOUP door in close proximity to the FOUP door is installed adjacent to the transfer room. Hereinafter, the load port door that can be engaged with the FOUP door to open and close the FOUP door is called a "load port door".

Such a loading port is a device for taking out and placing objects to be transported into and out of the transport chamber, and serves as an interface between the transport chamber and the FOUP. Furthermore, if the FOUP door and the load port are opened at the same time while the load port is in close contact with the FOUP door, the transfer robot disposed in the transfer chamber can transfer the FOUP to the load port. The objects to be transported are taken out to the transport chamber, or the objects to be transported are stored in the FOUP from the transport chamber.

The loading port is equipped with a comparison mechanism that can detect the presence or storage posture of objects to be transported in the multi-stage slots in the FOUP. As an example of the collation mechanism, a mapper (mapper) equipped with a collation sensor at the front end is configured so that it can be moved back further than the frame of the load port. It moves between a non-collatable position on the chamber side and a collatable position that is closer to the FOUP than the non-collatable position through the opening of the frame. In addition, the collation mechanism is equipped with a collation moving part (collation arm) that supports the collimator. It is configured to maintain the collimator at a collatable position and move the collation arm in the height direction, thereby enabling multi-stage detection for each slot. The object to be transported in the slot. In addition, the lifting movement of the control arm is performed integrally or independently with the lifting movement of the loading port.

However, in the intermediate to post-processes of semiconductor manufacturing (such as back-lapping processing, wafer lamination processing, dicing processing, etc.), multiple types of processing chambers are installed adjacent to the transfer chamber. Give appropriate treatment to each. Therefore, in the processing chamber, for example, the wafer before the bottom polishing process and the thin wafer after the bottom polishing process are transported while being held in the ring frame.

Here, the annular frame for holding the thin wafer after the bottom polishing process is set to a thickness of about 0.3 to 0.7 mm, for example. The wafers held in the ring-shaped frame are transported while being accommodated in a frame cassette, a dedicated container that is different from the FOUP.

In the above-mentioned intermediate process to the post-process of semiconductor manufacturing, conventionally, thin wafers (thin wafers held in a ring frame) after the intermediate processing process are transported and stored by a dedicated robot that transports the ring frame, or The frame of the ring frame is directly transported to the next process by a dedicated robot, or is transported to a dedicated loading space for the frame that is different from the loading port. In addition, in a semiconductor manufacturing apparatus in which a plurality of processing chambers with different processing contents (bottom polishing processing process, wafer lamination processing process, dicing processing process, etc.) are provided for the transfer chamber, the transport of the cassette to the load port , loading is performed by the operator.

On the other hand, when focusing on the improvement of transportation efficiency and improvement of transportation throughput (takt) of the mechanism that transfers containers to and from the loading port (such as OHT; Overhead Hoist Transfer; overhead transport system) In a structure where a transfer chamber is provided with a plurality of types of processing chambers with different processing contents, it is expected that the ideal method is to use a wafer transfer robot to transfer a ring frame holding a thin wafer, or to use a FOUP loading space, that is, a wafer transfer chamber. The port is used as a storage space for the box, thereby using a common device to access the box and FOUP.

When such a use situation is assumed, it is expected that after the intermediate processing process, for example, the wafer before the bottom polishing process, that is, the wafer is not held in the ring frame, or the wafer is held in the ring frame after the bottom polishing process. A state in which wafers in a ring-shaped frame are mixed and stored in a FOUP on the load port or in a cassette. In other words, there may be situations where wafers that should be stored in the FOUP are mistakenly put in/stowed into the cassette by mistake, or ring frames that are supposed to be stored in the cassette are mistakenly put in/stowed into the FOUP by mistake. possibility. If such a situation occurs, it will hinder the smooth progress of the semiconductor manufacturing process and directly lead to a reduction in manufacturing efficiency.

Patent Document 1 discloses a comparison process in which a comparison sensor arranged around a transfer container is moved up and down along the height direction of the transfer container to determine whether each slot in the transfer container contains a wafer. It is expected that such a comparison process can also determine whether a wafer is stored in the transfer container. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2016-181655

[Problem to be solved by the invention]

However, in the structure described in Patent Document 1, when wafers of different sizes are mixedly loaded in the transfer container, it is expected that it will be impossible to distinguish whether mixed loading occurs. Furthermore, the structure described in Patent Document 1, which requires a comparison sensor to be arranged around the transport container, results in an increase in the size of the comparison mechanism and an increase in the occupied area. In addition, in order to prevent the irradiation light from the comparison sensor from being Shielding of the transport container requires that there be no shield in the transport container or that the transport container be made of a translucent material, so there is a problem that the applicable transport containers are limited.

In addition, as a technology designed to be able to share a collation device in a load port that handles wafers of different sizes, a collation device is also proposed, which is a collation sensor that points the irradiation axis of the detection wave in the horizontal direction to the left and right. It is attached to the comparison arm that moves in the up and down direction, so that the first extended sensor, which directs the irradiation axis of the detection wave in the horizontal direction to the left and right, is moved away from the movement direction of the comparison sensor and is installed on the comparison element. The irradiation axis of the detection wave is directed toward the second extension sensor in the up-down movement direction of the reference sensor (see Japanese Patent Application Laid-Open No. 2015-211164).

According to such a collation device, when the collation sensor is inserted into the interior of a minimum-sized transport container and moved in the up-and-down direction within the transport container, it is possible to detect possible collation by the first extension sensor. The sensor collides with the protruding wafer, and the second protruding sensor can detect the protruding wafer that has moved earlier than the reference sensor and may collide with the first protruding sensor.

However, such a comparison device requires a first extension sensor and a second extension sensor in addition to the comparison sensor. Therefore, the number of sensors increases, the structure becomes complex, and the cost also increases. problem.

The present invention was developed with an eye on such problems to be solved, and its main purpose is to provide a structure that can detect the mixed loading of conveyance objects with different planar dimensions before and after passing through the intermediate process without significantly changing the structure of the conventional loading port (including A load port that helps improve the utilization rate in semiconductor manufacturing due to misplacement/incorrect stowage) in a transport container, and a comparison processing method in the load port. In addition, the present invention is not limited to the aspect that the plane size of the object to be transported after the intermediate process depends on the plane size of the annular frame, but is applicable to the object to be transported before the intermediate process and the object to be transported after the intermediate process. The technique of changing the appearance of objects in different plane dimensions. [Technical means to solve problems]

In other words, the present invention relates to a loading port of the EFEM that is formed together with a transfer chamber equipped with a transfer robot inside. In the present invention, in the front-rear direction where the loading port and the transfer chamber are arranged side by side, the loading port side is defined as the front and the transfer chamber side is defined as the rear.

The loading port of the present invention is provided with: a flat frame, which is installed in the transport room in a standing position and has an opening through which the first transport object can pass in a substantially horizontal position; and a loading table on which the first transport object can be placed. The transport container is the FOUP; the loading port door engages with the FOUP door of the FOUP and can open and close the opening of the frame; and the seating retaining mechanism retains the FOUP transported from the outside on the loading table. on the table; and a door opening and closing mechanism that moves the loading port door to the door opening position that retreats toward the transfer chamber side, thereby opening the opening of the frame; and a pulling mechanism that faces forward relative to the frame The placement table with a protruding posture moves the FOUP in the front-to-back direction between the seating position and the transfer object receiving and receiving position; and the control mechanism sets the opening to the open state by the door opening and closing mechanism. , compares the information on the presence or absence of the first conveyance object in each slot in the FOUP located at the conveyance object receiving position; and the control unit, controls the various mechanisms (seating retention mechanism, traction mechanism, door opening and closing mechanism, and control mechanism) action. Here, as the first transfer object in the present invention, a wafer can be cited. In addition, if the object to be transferred is, for example, a wafer, the transfer chamber used to transfer the object is a wafer transfer chamber.

In addition, the transfer robot in the present invention may be anything disposed in a transfer room, and any known robot can be used. In addition, the transfer robot may not constitute a part of the load port of the present invention, or may constitute a part of the load port of the present invention. As a transfer robot, there is known a structure in which a manipulator is provided at the tip of a link mechanism that connects a plurality of arm elements, and the manipulator can hold a conveyance object and put it in and out between a conveyance container and a conveyance chamber. thing. However, the transport robot in the present invention is not limited to this type.

The comparison mechanism in the present invention is provided with: a comparison device having a comparison sensor at a tip; and a comparison moving part that supports the comparison device and moves the comparison device through an opening in an open state to a position where the comparison sensor can be passed The first comparison position containing the first transfer target object is detected in the FOUP. Here, the comparison moving part in the present invention may satisfy the first operating condition of moving in the front-rear direction and the up-down direction together with the loading port door by the door opening and closing mechanism, and the second operating condition of operating independently from the door opening and closing mechanism. Things that are both sides of the action conditions, or things that satisfy one of them. In addition, in the present invention, as a specific example of the structure of moving the collimator to the first collation position, there can be cited a structure in which the collimator is tilted forward and placed in the first collation position by tilting the entire collation moving part. , or a structure in which the collimator moves forward and is placed in the first collation position by sliding the entire collation moving part forward.

Furthermore, the loading port of the present invention is characterized in that the control unit can execute the seating holding process to hold the second conveying object having a different planar size from the first conveying object by the seating holding mechanism. The second transport container or FOUP in the multi-stage slot is held on the placement table; and the rear traction process uses the traction mechanism to move the second transport container or FOUP on the placement table from the seating position to the transportation target. The object transfer position; and the door opening process, which uses the door opening and closing mechanism to open the opening; and the first comparison process, which places the comparison device in the first comparison position through the opening in the open state to perform comparison. The comparison process performed by the organization; and the second comparison process, placing the comparison device through the opening in the open state on the second transfer container that can detect the second transfer object contained in the second transfer container by the comparison sensor Comparing a location and causing it to perform the comparison processing performed by the comparison agency; it is to selectively perform one or both of the first comparison processing and the second comparison processing.

Here, as an example of "the second transfer object having a planar size different from that of the first transfer object", a combination of a thin wafer after the intermediate process and a ring frame holding it, or a ring frame alone can be cited body, etc., but is not limited to this. In addition, a thin wafer is transported together with an annular frame having a planar size larger than that of the thin wafer. Therefore, the member that regulates the planar size of the second transfer object is not the thin wafer but the annular frame. When such a ring frame is a second conveyance object, the "second conveyance container capable of accommodating the second conveyance object in a multi-stage slot" in the present invention means that the ring frame can be placed in a multi-stage manner. The storage frame and the second transport container are not limited to this.

According to the load port of the present invention, a second comparison process is performed using a comparison mechanism that compares information including the presence or absence of the first conveyance object in each slot in the FOUP, whereby the relevant information can be compared. Information on the presence or absence of the second transfer target object in each slot in the second transfer container is included.

Furthermore, when the planar size of the second conveyance object is larger than that of the first conveyance object, it is determined whether each slot in the FOUP, which is the first conveyance container placed on the mounting table, is accommodated. In the second comparison process of the second conveyance object, if it is detected that the second conveyance object is stored, it can be understood that the second conveyance object has been put into the FOUP by mistake. In addition, when the second transport container is placed on the placement table, if the slot is related to the information that does not contain the second transport object according to the second comparison process, the first comparison If the detection result of the process is that the first conveyance object is stored, it can be understood that the first conveyance object has been put into the second conveyance container by mistake.

In this way, according to the load port of the present invention, a comparison mechanism including at least a comparison device and a comparison moving unit is used to perform a comparison based on the detection result of the first comparison process and the detection result (detection information) of the second comparison process. Both parties or one of them can identify whether objects to be transported with different planar dimensions are mixed in the transport container. Therefore, according to the load port of the present invention, there is no need to significantly change the structure of the conventional load port, and the enlargement of the comparison mechanism and the complexity of the structure are avoided. After the intermediate process, even if the objects to be transported with different planar dimensions are used, Even if the object is stored in the FOUP (first transport container) or the second transport container placed on a common loading port and taken out, it is still possible to detect the objects being transported in the FOUP or the second transport container. It is possible to improve the utilization rate in semiconductor manufacturing by mistakenly mixing the containers (wrongly adding/wrongly stowing).

In addition, even when the first or second transport object is allowed to be mixed in the first or second transport container, according to the present invention, the mixed state can be grasped through the comparison process.

Furthermore, in the present invention, the second collation position where the collation device is placed when the second collation process is executed is set to a position different from the first collation position where the collation device is placed when the first collation process is executed. As a comparative example of the present invention, if it is configured to detect conveyance objects with different planar dimensions by using the comparison sensor of the comparator placed at the same comparison processing position, it is necessary to ensure that the conveyance objects with different planar dimensions must be detected. Parts of the outer edges of the objects are aligned with each other. Then, in order to align a part of the outer edges of objects to be conveyed with different planar dimensions, the conveying distance or the conveying position of the object to be conveyed by the conveying robot has to be changed according to the planar size of the object to be conveyed, and this forces the Do complex controls. On the other hand, in the loading port of the present invention, there is no need to make the center of the conveyance object placed on the table different depending on the first conveyance object and the second conveyance object, and the conventional conveyance control can be adopted as the conveyance robot. simple controls. Therefore, according to the present invention, it is not required to change the conveying distance or the conveying position of the conveyed object by the conveying robot according to the planar size of the conveyed object. Compared with the above comparative example, the control can be simpler, and it is also helpful for semiconductor manufacturing. The utilization rate in .

The "first comparison position" and the "second comparison position" in the present invention can be appropriately set according to the planar dimensions of the first conveyance object and the second conveyance object. However, as a good example of the first comparison position, there can be cited The comparison sensor is arranged in the center of the frame and in front of the rear wall of the transfer chamber (the wall closest to the transfer room). As a good example of the second comparison position, the comparison sensor is arranged in the comparison frame. The rear wall is also in the rear position. Furthermore, in the present invention, it can be configured such that the first comparison process is performed by instructing the comparison moving unit to perform a lifting movement while the comparison device is placed in the first comparison position, and the second comparison process is performed after the comparison device is placed in the second comparison position. The status instructs the comparison moving part to perform a lifting and lowering operation to thereby perform the second comparison process.

In addition, in the load port of the present invention, if the control unit has a container discriminating unit for discriminating which of the FOUP and the second transport container is held by the seating holding mechanism, it can be based on what the container discriminating unit determines. The judgment information is based on a preset sequence of actions such as the seating holding process, the door opening process, the rear pulling process, the first comparison process, the second comparison process, or both the first comparison process and the second comparison process. , or perform comparison processing on only one of them to automatically control the actions of each mechanism.

In particular, in the present invention, it is preferable that the control unit sequentially executes the seating holding process, the door opening process, and the rear pulling process when the container determining unit determines that the second transport container is held by the seating holding mechanism. After the processing, both the first comparison process and the second comparison process are executed. This is a unique action sequence of the present invention. It is to avoid that when the size of the second transport container in the front-rear direction is larger than the FOUP, if the rear pulling process is performed before the door opening process, the second transport container will be Collision loading port situation. In addition, the order of the first comparison process and the second comparison process is not particularly limited. In addition, the second conveyance object accommodated in the second conveyance container, which is larger than the FOUP in the front-rear direction, has a planar size larger than that of the first conveyance object. By performing both the second collation process for determining the presence or absence of the second conveyance object and the first collation process for determining the presence or absence of the first conveyance object, it is possible to improve the detection of the first conveyance mixed in the second conveyance container. Comparison accuracy between the object and the second conveyed object.

Furthermore, the present invention relates to a collation processing method in a load port provided with a collation mechanism for storing a plurality of first conveyance objects in a first multi-stage slot. The first transfer object is exchanged between the transfer container and the transfer chamber, and information on the presence or absence of the first transfer object in each slot including the first transfer container is compared, and is characterized in that it is suitable as a loading port. The second transport container is configured to exchange and receive the second transport object to and from the second transport container, and the second transport container is capable of storing a plurality of second transport objects having different planar dimensions from the first transport object in the multi-stage slot. , as the comparison mechanism, it is suitable to include: a comparison device having a comparison sensor at the tip; and a comparison moving part that supports the comparison device and moves the comparison device to a position where the comparison sensor can detect whether there is a comparison sensor contained in the first transport container. The object at the first comparison position of the first conveyance object selectively performs: the first comparison process, placing the comparison device at the first comparison position and causing it to perform the comparison process performed by the comparison mechanism; and the second comparison process. , place the colarator at one or both of the two locations where the collation sensor can detect the second collation position containing the second transport object in the second transport container and execute the collation process;

Such a comparison processing method can exert various functions and effects similar to those exerted by the above-mentioned load port, and can improve the utilization rate in semiconductor manufacturing. In particular, in the present invention, it is preferable that the first transfer object and the second transfer object are collated in a state in which the center positions of each other are aligned with each other in the first transfer container or the second transfer container. Treatment (first control treatment, second control treatment). [The effect of invention]

The present invention is a load port and comparison processing method in a semiconductor manufacturing process. It is a comparison processing method in a load port equipped with a comparison mechanism. The comparison mechanism is used to compare multiple chips with each other. Wafers are stored in the multi-stage slots and first transfer objects such as wafers are exchanged between the first transfer containers, and the presence or absence of the first transfer objects in each slot including the first transfer container is compared. The information is characterized in that the first transfer object can be transferred to and received from a second transfer container, and the second transfer container can store a plurality of second transfer objects having a larger planar size than the first transfer object. In multi-stage slots, as a comparison mechanism, it is suitable to include: a comparison device with a comparison sensor at the tip; and a comparison moving part that supports the comparison device and can be operated together with the loading port door by the door opening and closing mechanism, and can The thing that operates independently of the door opening and closing mechanism can perform the first comparison process, and place the comparison device at a first comparison position that can detect the first transportation object contained in the FOUP by the comparison sensor to make it Executing a comparison process; and a second comparison process, placing the comparison device at a second comparison position where the comparison sensor can detect that the second transfer object is contained in the second transfer container, and executing the comparison process; it is optional to execute one or both of the first comparison process and the second comparison process.

That is to say, the present invention adopts a novel technical idea of using a collation mechanism with a simple structure to execute the first collation process and the second collation process, and to selectively execute the first collation process. and one or both parties to the second comparison process. According to the present invention based on such a technical idea, it is possible to provide a first transfer container, that is, a FOUP or a second transfer container, which can be used on a common loading port before and after the intermediate processing process without increasing the size of the comparison mechanism and complicating the structure. A loading port and a comparison processing method in a loading port that detect whether there are mixed objects to be transported with different planar dimensions in a transport container, thereby helping to improve the utilization rate in semiconductor manufacturing.

An embodiment of the present invention will be described below with reference to the drawings.

The load port 1 of this embodiment is used, for example, in a semiconductor manufacturing process. As shown in FIGS. 1 and 2 , in a clean room, it forms part of the wall surface of the transfer chamber 2 and is used to connect the transfer chamber 2 and the FOUP 3 Transfer objects such as wafers W are taken out and put in and out between the transfer containers 3 . The loading port 1 constitutes a part of the EFEM (Equipment Front End Module) and functions as an interface part between the transfer container 3 and the transfer chamber 2 . The size of the wafer W used in EFEM is standardized to SEMI (Semiconductor Equipment and Materials International; International Semiconductor Equipment and Materials Association) specifications. In this embodiment, a wafer W with a diameter of 300 mm (radius 150) mm is used.

The FOUP 3 in this embodiment is equipped with a FOUP body 32 that can open the inner space 3S only to the rear through the carry-out entrance 31, and a FOUP body 32 that can open and close the carry-out entrance 31, as schematically modeled in FIG. 1 . The FOUP 3 is provided with multi-stage slots inside, and is configured to accommodate the wafers W that are the objects to be transported W in each slot, and is configured to be a known thing in which the wafers W can be taken out and put in through the unloading port 31 . FIG. 8 , which will be described later, schematically illustrates a state in which the wafer W is accommodated in the slot 34 in the FOUP 3 . On the upper surface of the FOUP body 32, a flange portion 35 for holding a device (for example, OHT: Over Head Transport) that automatically transports the transport container 3 is provided.

The loading port 1 of this embodiment, as shown in FIGS. 2 to 6 , etc., is provided with a plate-shaped frame 4 , which constitutes a part of the wall surface of the transfer chamber 2 and is formed to open the internal space 2S of the transfer chamber 2 . the opening 41; and the placement table 5, which is installed in a substantially horizontal posture protruding forward with respect to the frame 4; and the seating holding mechanism 6, which holds the FOUP 3 transported from the outside on the placement table on the table 5; and the traction mechanism 7, on the placement table 5, to move the FOUP 3 in the front-rear direction D between the seating position and the transfer object receiving position; and the loading port 8, to open the opening 41 of the frame 4 opening and closing; and the door opening and closing mechanism 9 moves the loading port door 8 to the door opening position (O) retreating toward the transfer chamber 2 side, thereby setting the opening 41 of the frame 4 in an open state; and the comparison mechanism M, With the opening 41 of the frame 4 opened by the door opening and closing mechanism 9, a comparison is made as to whether there is a wafer W in each slot 34 including the FOUP 3 located at the transport object acceptance position (equivalent to the present invention). Information on the status of "the first transfer object").

The frame 4 is arranged in a standing posture and is a substantially rectangular plate-shaped object having an opening 41 large enough to communicate with the carry-out entrance of the FOUP 3 placed on the placement table 5 . FIG. 1 illustrates the opening 41 of the frame 4 as a model. In the loading port 1 of this embodiment, the frame 4 forms part of the wall surface of the transfer chamber 2 . At the lower end of the frame 4, a foot portion 42 having casters and setting feet is provided.

The placement table 5 is provided on the upper part of a horizontal base 50 (support base) arranged in a substantially horizontal attitude at a position slightly above the center in the height direction of the frame 4. The FOUP body 32 and the frame 4 face each other. FOUP3 objects can be placed when facing downwards. As shown in FIG. 4 , the mounting table 5 is provided with a plurality of protrusions 51 that protrude upward, and these protrusions 51 are engaged with holes (not shown) formed in the bottom surface of the FOUP 3 to achieve loading. Position the FOUP3 on the table 5.

The seating holding mechanism 6 is in a locked state in which the lock claw 61 (see FIG. 5 ) provided on the placement table 5 is hooked and fixed to a locked portion (not shown) provided on the bottom surface of the FOUP 3 . Thereby, the FOUP 3 is held on the placement table 5 . In addition, in the loading port 1 of this embodiment, by releasing the locking state of the locking pawl 61 of the locked part, the FOUP 3 can be set in a state where it can be separated from the placement table 5 .

The traction mechanism 7 is a mechanism that positions the FOUP 3 on the loading table 5 at a position where the FOUP body 32 is a predetermined distance away from the loading port 8, that is, the seated position, and makes the FOUP body 32 close to the loading port 8. That is, the conveyance object moves in the forward and backward direction D between the receiving and receiving positions. The traction mechanism 7 is configured using a slide rail (not shown) that moves the mounting table 5 forward and backward. The seating holding mechanism 6 and the traction mechanism 7 can also be thought of as mechanisms included in the placing table 5 .

In addition, in FIG. 1 , the placement state of the FOUP 3 on the placement table 5 is simplified and illustrated as a state in which the bottom surface of the FOUP 3 contacts the upper surface of the placement table 5 . However, in fact, the plurality of protrusions 51 that protrude upward than the upper surface of the placement table 5 will engage with the bottomed holes formed in the bottom surface of the FOUP 3 to thereby support the FOUP 3 and the placement table 5 The upper surface and the bottom surface of the FOUP 3 are not in contact with each other, and a predetermined gap is formed between the upper surface of the placement table 5 and the bottom surface of the FOUP 3 .

In the present invention and the present embodiment, in the front and back direction D (see FIG. 1 etc.) where the FOUP 3 and the frame 4 placed on the placement table 5 are arranged side by side, the FOUP 3 side is defined as the front and the frame 4 side is defined as the rear.

The loading port door 8 is a fully closed position (C) that seals the opening 41 of the frame 4, and a door open position (O) that can be moved back toward the transfer chamber 2 side from the fully closed position (C), and It is a thing that moves the opening space of the opening 41 between a fully open position (not shown) and a fully opened space toward the rear. The loading port 8 is equipped with an engaging portion 81 (see FIG. 4 ) that can absorb and hold the FOUP body 32, and is configured to maintain the engagement state with the FOUP body 32 and be integrated with the FOUP body 32 in the fully closed position (C ), door open position (O) and fully open position. In this embodiment, the fully closed position (C), the door open position (O), and the position of the loaded loading port 8 are set to the same position. In addition, the moving path of the loading port door 8 between the fully open position and the fully closed position (C) is such that the loading port door 8 in the fully closed position (C) maintains its height position and moves toward the transfer chamber 2 side. It consists of a path (horizontal path) to the door open position (O) and a path (vertical path) to the load port door 8 in the door open position (O) while maintaining its front and rear position and moving downward to the fully open position. . In order to allow the load port 8 placed in the door open position (O) to move in either the vertical direction or the horizontal direction, the FOUP of the load port 8 placed in the door open position (O) is held The main body 32 is placed together with the loading port 8 at a position further back than the frame 4 (a position completely away from the FOUP main body 32 and arranged in the internal space 2S of the transfer chamber 2).

Such movement of the load port door 8 is realized by the door opening and closing mechanism 9 provided in the load port 1 . The door opening and closing mechanism 9 is a thing that moves the loading port door 8 to the door open position (O) or the fully open position, thereby connecting the internal space of the FOUP 3 to the transfer chamber 2 through the opening of the frame 4 in the open state. . The door opening and closing mechanism 9 is, for example, a movable block (not shown) supported by the support frame 80 of the port door 8 so as to be movable in the front-rear direction D, or a movable block movable in the up-down direction. H is moved by a slide rail (not shown) that supports it, and a drive source (not shown) such as an actuator is activated to move the loading port 8 in the front-rear direction D and the up-down direction H. things. In addition, it is also possible to provide an actuator for forward and backward movement and an actuator for up and down movement. However, in terms of reducing the number of parts, a common actuator is used as the driving source. The forward and backward movement and up and down movement of loading port 8 are relatively good.

The load port 8 of this embodiment is equipped with a connection switching mechanism 82, which releases the engagement state (latched state) between the FOUP door 32 and the FOUP body 32 to create a state in which the FOUP door 32 can be detached from the FOUP body 32. (Unlatched state) (see Figure 4).

The collation mechanism M, as shown in Figures 3, 5, 8, etc., is equipped with a comparator M2 at the tip end, which has a function that can detect multi-stage slits 34 in the height direction H through the multi-stage slots 34 provided in the FOUP 3. The comparison sensor M1 (transmitter M11, receiver M12) for the presence or absence of the stored conveyance object W; and the comparison arm M3 (equivalent to the "control moving part" of the present invention), supporting the comparison device M2; are a detectable The presence or storage position of the transport object W in FOUP3. FIG. 8 shows a model of the accommodation state of the wafer W (the first transfer object) placed in the slot 34 in the FOUP 3 .

As shown in FIG. 8 , the comparator M2 is in a shape that protrudes forward from a predetermined position of the comparison arm M3. A pair of left and right devices are provided at a predetermined distance apart in the width direction, and a comparison sensor M1 is installed at the tip. things. The comparison sensor M1 is composed of a transmitter M11 (light-emitting sensor) that emits a signal, that is, a light beam (linear light), and a receiver M12 (light-receiving sensor) that receives the signal from the transmitter M11. In addition, the comparison sensor M1 may also be constituted by a transmitter and a reflecting part that reflects linear light emitted from the transmitter toward the transmitter. In this case, the transmitter also functions as a receiver. As shown in Figure 8, in order to prevent the comparison sensor M1 (M11, M12) with the optical axis ML facing the left and right horizontal direction from interfering with the detection target, that is, the transport object W, during the comparison process, the comparison sensor is The left and right spans between the devices M1 (M11, M12) are set to appropriate values in accordance with the planar size of the conveyance object W.

The control arm M3 is the position of the control device M2 in the front-rear direction D. At the position shown in FIG. 8(ii) , that is, the control arm M3 can detect the center of the FOUP 3 through the control sensor M1 through the opening 41 in the open state. The first comparison position (P1) containing the wafer W and the position shown in Figure 8(i) can also be detected by the comparison sensor M1 and the non-matching wafer position (P2) containing the wafer W in the FOUP3. ). The control arm M3 of this embodiment, as shown in FIG. 3 , has a frame shape and has an upper frame part M31 integrally or integrally with a pair of left and right side frame parts extending downward from both ends of the upper frame part M31 . M32, and a lower frame portion M33 provided between the lower ends of the two side frame portions M32, and is configured to face the front and rear direction D surrounded by the upper frame portion M31, both side frame portions M32, and the lower frame portion M33. The internal space MS of the open control arm M3 can accommodate the main body of the loading port 8 and the door cover 83 covering the peripheral components of the loading port 8 from the transfer chamber 2 side.

In this embodiment, the collimator M2 is supported on the upper frame part M31 of the collation arm M3 in a posture that protrudes forward. Therefore, the comparison sensor M1 provided at the tip of the comparison device M2 is disposed at a position that protrudes forward from the comparison arm M3. The loading port 1 of this embodiment is a component which forms the door opening and closing mechanism 9 by attaching the lower frame part M33 of the control arm M3. Specifically, the lower frame part M33 is attached to the support frame 80 that supports the load port 8 . Therefore, as the door opening and closing mechanism 9 lifts and lowers the loading port door 8, the control arm M3 also moves integrally. As a result, the entire comparison mechanism M and the loading port 8 move up and down in the same direction. In addition, in this embodiment, although the comparison mechanism M and the door 8 are configured to operate integrally, a dedicated lifting mechanism (a mechanism that only raises and lowers the comparison mechanism M independently) may be provided in the comparison mechanism M. The control mechanism M is configured to move up and down independently relative to the door 8 .

The comparison mechanism M of this embodiment includes a tilting mechanism M4 that tilts the entire comparison arm M3 with the pivot point in the mounting portion of the comparison arm M3 and the door opening and closing mechanism 9 as the center. The tilting mechanism M4, as shown in Figures 3, 5 and 6, is equipped with: a tilting crank M41 connected to the lower frame part M33; and a connecting shaft M42 (equivalent to a pivot point) to align the axis direction with the long side direction. The tilt crank M41 and the door support frame 80 are arranged in an attitude consistent with the width direction of the loading port 1, and the tilt crank M41 and the door support frame 80 are connected to each other; The posture configuration allows for forward and backward movements in the front and rear direction D; and the pivot shaft M44 pivotally connects the lower end of the tilting crank M41 to the rear end of the forward and backward movable portion M43.

Such a tilting mechanism M4 moves the forward and backward movable portion M43 backward (transfer chamber) by a drive source not shown in the figure when the collimator M2 shown in Fig. 5 and others is placed in a state where the wafer cannot be collated (P2). 2) movement, thereby pushing the lower end of the tilt crank M41 backward to cause the entire tilt crank M41 to rotate (tilt) around the pivot axis M44. Thereby, the tilting crank M41 rotates in the direction of moving the upper end forward (FOUP3 side), and the control arm M3 connected to the tilting crank M41 tilts in the same direction as the tilting crank M41. As a result, the upper end side areas of the two side frame portions M32 of the control arm M3 and the entire upper frame portion M31 protrude through the opening 41 into a space in front of the rearmost surface 4B of the frame 4 (the space on the FOUP 3 side). Based on the above, as shown in FIG. 6 , the comparator M2 is placed at the first comparison position (P1) in which the comparison sensor M1 protrudes through the opening 41 into a space in front of the rearmost surface 4B of the frame 4 . In addition, the tilting mechanism M4 can place the comparator M2 in the state of placing the comparator M2 in the first collation position (P1) by moving the forward and backward movable portion M43 forward (to the FOUP3 side). The wafer position (P2) cannot be compared.

The collation mechanism M is configured to move up and down integrally with the up and down movement of the door opening and closing mechanism 9 while maintaining the position of the collimator M2 in the front-rear direction at the first collation position (P1) or the wafer disable collation position (P2). As described above, the comparison arm M3 in this embodiment is moved in the front-rear direction and the up-down direction together with the loading port door 8 by the door opening and closing mechanism 9, and is independently operated by the door opening and closing mechanism 9. Tilt mechanism M4 action object.

The loading port 1 of this embodiment can be equipped with a bottom purge portion, which is provided on the mounting table 5 and can be appropriately selected to inject nitrogen, inert gas, dry air, etc. into the FOUP 3 from the bottom side of the FOUP 3 The gas is also ambient gas (also called purge gas, in this embodiment, nitrogen or dry air is mainly used), and the gas environment in FOUP 3 can be replaced with ambient gas. The bottom drain part is mainly composed of a plurality of nozzles (not shown) provided at predetermined positions on the mounting table 5, so that the plurality of nozzles function as bottom drain injection nozzles for injecting a prescribed ambient gas. , or use a bottom drain nozzle to discharge the gas environment in FOUP3. These plural nozzles can be connected in a state of being embedded in the injection port and the discharge port (both are omitted in the figure) provided at the bottom of the FOUP 3. The ambient gas can be supplied to the internal space 2S of FOUP3 through the injection nozzle from the bottom, and the gas environment in the internal space 2S of FOUP3 can be discharged from the bottom through the exhaust nozzle (this gas environment is executed from the purge process From the beginning until a predetermined time, it is air or low-purity ambient gas other than air, and after the predetermined time has elapsed, it is high-purity ambient gas that fills the internal space 2S of FOUP 3), thereby performing the purification process.

Such a loading port 1 together with the transfer chamber 2 including the transfer robot 21 constitute an EFEM. In this embodiment, as shown in FIG. 2 , a plurality of load ports 1 (for example, three) are arranged side by side on the front surface (front wall surface) 2F of the transfer chamber 2 . The operation of EFEM is controlled by the controller of load port 1 (control unit 1C shown in FIG. 3) or the controller of the entire EFEM (control unit 2C shown in FIG. 1).

In the internal space 2S of the transfer chamber 2, a transfer robot 21 capable of transferring transfer objects such as the wafer W between the FOUP 3 on the load port 1 and the processing chamber R is provided. As shown in FIGS. 1 and 2 , the transfer robot 21 is, for example, an arm 212 that connects a plurality of link elements to each other in a horizontally rotatable manner and is provided with a transfer object holding part 211 (robot) at the tip end. and a thing that rotatably supports the arm base constituting the base end of the arm 212 and the running portion that runs in the width direction of the transfer chamber 2 (the parallel direction of the loading port 1). The transfer robot 21 has a link structure (multi-joint structure), and its shape changes between a folded state in which the arm length becomes the smallest, and an extended state in which the arm length becomes longer than the folded state. It can be applied to the transfer robot 21 in which a plurality of individually controllable manipulators 211 are arranged in multiple stages in the height direction at the tip of the arm 212 .

The transfer chamber 2 is configured to connect the load port 1 and the processing chamber R, thereby allowing the internal space 2S to be in a slightly sealed state. In the internal space 2S of the transfer chamber 2, a downflow (down flow), which is an air flow from above to below, is formed. Therefore, even if there are particles contaminating the surface of the wafer W in the internal space 2S of the transfer chamber 2, the particles can still be pushed downward by the downward flow, thereby preventing the particles from adhering to the wafer W being transferred. s surface. In FIG. 1 , the flow of gas in the transfer chamber 2 in which a downflow is formed is modeled by arrows. An EFEM may be configured in which appropriate workstations such as a buffer workstation and an aligner are arranged on the side of the transfer chamber 2 or in the internal space 2S of the transfer chamber 2 .

In this embodiment, a wall surface 2B (rear wall surface) facing the wall surface 2F (front wall surface) of the loading port 1 is arranged in the transfer chamber 2, and a plurality of (three chambers in the example in the figure) are arranged side by side in the width direction. The processing chambers R (semiconductor processing apparatus) are configured so that different and appropriate processes are performed in each of the processing chambers R. Examples of processing performed in an intermediate process or a post-process of a semiconductor manufacturing process include a bottom polishing process, a wafer lamination process, a dicing process, and the like. In addition, the operation of the processing chamber R is controlled by the controller of the processing chamber R (the control unit RC shown in FIG. 1). Here, the controller of the entire processing chamber R (control unit RC) or the controller of the entire EFEM (control unit 2C) is a higher-level controller than the control unit 1C of the load port 1 .

The internal space MS of each processing chamber R, the internal space 2S of the transfer chamber 2, and the internal space 2S of the FOUP 3 placed on each load port 1 are maintained at high definition. On the other hand, the cleanliness is relatively low in the space where the load port 1 is arranged, that is, outside the processing room and outside the EFEM. In addition, FIGS. 1 and 2 are schematic diagrams illustrating the relative positional relationship between the load port 1 and the transfer chamber 2, and the relative positional relationship between the EFEM and the processing chamber R having the load port 1 and the transfer chamber 2.

In this embodiment, appropriate processing is performed in each of a plurality of types of processing chambers R provided adjacent to the transfer chamber 2 . Therefore, the wafer W before the bottom polishing process, or the thin wafer W1 held in the annular frame F after the bottom polishing process, etc. will be transferred to the processing chamber R through the load port 1 provided adjacent to the transfer chamber 2. within. Here, the annular frame F that holds the thin wafer W1 after the bottom polishing process (the wafer W1 is processed to be thinner than before the bottom polishing process) is a device structure formed to a certain extent. The bottom polishing process and the like are set to a thickness of about 0.3 to 0.7 mm, for example. In addition, the planar dimensions of the wafer W and the thin wafer W1 did not change before and after the bottom polishing process. Figure 7(i) shows the first transfer object, which is the wafer W, Figure 7(ii) shows the ring-shaped frame F that does not hold the thin wafer W1, and Figure (iii) shows the ring-shaped frame F that holds the thin wafer W1 Box F.

The annular frame F is composed of an annular body F1 having a planar size one circle larger than that of the wafer W, and a film F2 attached to the entire annular body F1. It is a frame that can be attached to the film F2 to maintain the bottom polishing. Thin wafer W1 after processing. The thin wafer W1 held in such annular frame F is conveyed in a state where the annular frames F are accommodated in the cassette C that is a dedicated conveyance container 3 . The frame box C is provided with multi-stage slots C1, and is configured so that the annular frame F can be placed in each slot C1. FIG. 9 shows a model in which the annular frame F is placed in the slot C1 of the frame box C. As shown in FIG.

In this embodiment, the transport chamber 2 is focused on improving the transport efficiency and the transport throughput (takt) of the automatic transport container transport device (OHT) that exchanges the transport containers 3 with the load port 1. In a configuration in which a plurality of processing chambers R having different processing contents are provided, the transport robot 21 is used to transport the annular frame F holding the thin wafer W1 after the bottom polishing process, or the loading space of the FOUP 3 is used. Load port 1 is used as a storage space for cartridge C, whereby cartridge C and FOUP3 can be used in parallel. In other words, the loading port 1 is used as an interface, and the ring-shaped frames F can be transported one by one between the frame cassette C placed on the loading port 1 and the transport robot 21 . Here, the annular frame F holding the thin wafer W1 corresponds to the "second transfer object" of the present invention, and the frame cassette C corresponds to the "second transfer container" of the present invention.

The loading port 1 of this embodiment is configured to be able to place a cassette C containing a multi-stage annular frame F having a different planar size from the wafer W on the loading table 5, and by sitting on the The holding mechanism 6 holds the frame C on the placement table 5, and the pulling mechanism 7 can move the frame C on the placement table 5 in the front-rear direction between the seating position and the transport object receiving position. The seating position and the transport object receiving and receiving position when the FOUP 3 is placed on the mounting table 5 are respectively the seating position and the transport object when the frame C is mounted on the mounting table 5. The positions of object giving and receiving are the same. That is to say, the amount of movement of the placement table 5 during the pulling process by the placement pulling mechanism 7 is determined when the FOUP 3 is placed on the placement table 5 and when the placement table 5 is placed on the placement table 5 . When the frame C is placed on it, the amount of movement is the same.

In this embodiment, the workpiece centers (the center of the wafer W and the center of the annular frame F) of the transfer container 3 (FOUP 3, cassette C) held on the placement table 5 are aligned with each other. Therefore, the center of the wafer W in the FOUP 3 at the time when the FOUP 3 on the placement table 5 is moved from the seating position to the transfer object receiving position by the pulling mechanism 7 will be on the placement table. At the time when the cassette C on the cassette C is moved from the seating position to the transport object receiving position by the pulling mechanism 7, the centers of the annular frames F in the cassette C are aligned. Accordingly, when the transfer robot 21 takes out and places the workpiece (wafer W, ring frame F) into the transfer container 3 (FOUP 3, cassette C), the transfer robot 21 only needs to align the workpiece center. , without the need for teaching for each different transport container 3, the control of the transport robot 21 will become simple.

In addition, in this embodiment, the opening 41 of the frame 4 is set to an opening size that allows the annular frame F to pass in a substantially horizontal attitude.

However, when the wafer W transport robot 21 is configured to transport the annular frame F holding the thin wafer W1 after the bottom polishing process, or the loading space of the FOUP 3, that is, the load port 1 is used as the loading space of the frame cassette C , and in the case where cassette C and FOUP 3 can be used in parallel on the common load port 1, it is expected that there may be wafers W before bottom polishing in the cassette C on the mounting table 5 and the bottom polishing process remains. The ring frame F of the thin wafer W1 after the bottom polishing process is mixed, or the ring frame F holding the thin wafer W1 after the bottom polishing process is mixed with the wafer W before the bottom polishing process in the FOUP 3 placed on the table 5 state of affairs.

In view of this, the loading port 1 of this embodiment is configured to be able to determine whether there is transportation in the transportation container 3 (FOUP 3, cassette C) on the placement table 5 through the comparison process performed by the comparison mechanism M The object W (the wafer W before the bottom polishing process, the annular frame F holding the thin wafer W1 after the bottom polishing process) is mixed.

In this embodiment, the centers of the transfer objects W (wafers W, ring frames F) placed on the placement table 5 at the transfer object receiving and receiving positions are aligned, so that the transfer objects have different planar dimensions. The edge positions and edge positions of W (wafer W, annular frame F) do not coincide with each other, but there is a gap in the front-rear direction D. In this embodiment, a difference occurs in the position of the conveyance object W (wafer W, ring frame F) in the front-rear direction D, and the configuration is configured so that the comparison process performed by the comparison mechanism M can be used to determine where the object W is placed is placed. Is there any object to be transferred (wafer W before bottom polishing process, wafer W before bottom polishing process, ring frame holding thin wafer W1 after bottom polishing process) in the transfer container 3 (FOUP3, cassette C) on the table 5? F) Mixed loading.

The control unit 1C of this embodiment has a container discriminating unit 1Ca that discriminates whether the FOUP 3 or the cassette C is held on the placement table 5 by the seating holding mechanism 6 . As the container discriminating unit 1Ca, a structure that emits a detection signal only when the cassette C is placed on the placement table 5 is used. Specifically, it is configured so that it can be determined whether or not the frame C is held on the placement table 5 through detection processing by a reflective sensor.

Furthermore, the load port 1 of this embodiment is characterized in that the control unit 1C can execute the first comparison process by placing the comparator M2 in the first comparison position (P1) through the opening 41 in the open state. It executes the comparison processing performed by the comparison mechanism M; and the second comparison processing, placing the comparator M2 through the opening 41 in the open state so that the ring contained in the frame box C can be detected by the comparison sensor M1 The second comparison position (P2) of the frame F is caused to perform the comparison processing performed by the comparison mechanism M, which selectively performs one or both of the first comparison processing and the second comparison processing. In this embodiment, the second collation position (P2) is set at the same position as the wafer disabling collation position (P2) in the front-rear direction D. In the first collation process, the collimator M2 is placed in the first collation position (P1), and the collation arm M3 is commanded to perform a lifting and lowering movement, whereby each slot in the transport container (each slot 34 in the FOUP) is , each slot C1 in the frame C) is a process of obtaining information about the conveyed object. The second comparison process is to command the comparison arm M3 to move up and down in a state where the comparator M2 is placed in the second comparison position (P2). An operation is performed to obtain information about the transport object W for each slot 34 in the transport container 3 .

Here, the comparison sensor M1 emits a signal, that is, a light beam (linear light). Whether or not the signal is received is used to detect the presence or absence of the transport object W. The trajectory of the light beam (linear light line) can be thought of as is the detection line ML. That is, the detection line ML during the first collation process with the collimator M2 placed in the first collation position (P1) is a line that crosses the wafer W accommodated in the FOUP 3 (see FIG. 7 (ii)), the detection line ML during the second comparison process with the comparator M2 placed in the second comparison position (P2) is a line that crosses the annular frame F accommodated in the frame box C. (Refer to Figure 8(i)). In particular, in this embodiment, focusing on the fact that the cassette C has a larger plane size than the wafer W, the second collation process is performed with the collimator M2 placed in the second collation position (P2). The detection line ML is set so as not to cross the wafer W accommodated in FOUP3. The first collation position (P1) and the second collation position (P2) of such a collimator M2 can respond to changes from the center WC or FC of the transport object W (wafer W, ring frame F) or the transport container 3 (FOUP3). , the distance along the front-rear direction D from the center of the frame box C) to the detection line ML is set.

During the first comparison process, the signal path formed between the transmitter M11 and the receiver M12 by sending a signal from the transmitter M11 toward the receiver M12 will be blocked where the wafer W exists. Where it does not exist, it will not be blocked and will reach the receiver M12. Thereby, the presence or absence or storage posture of the wafers W stored side by side in the height direction H can be detected sequentially. In this way, information on the presence or absence of the wafer W or the storage posture (transport object detection information) can be obtained for all the slots 34 in the FOUP 3 or all the slots C1 in the cassette C.

During the second comparison process, the signal path formed between the transmitter M11 and the receiver M12 by sending a signal from the transmitter M11 to the receiver M12 will be blocked where the ring frame F exists. Where frame F does not exist, it will not be blocked and will reach the receiver M12. Thereby, the presence or absence or the storage posture of the ring frames F stored side by side in the height direction H can be detected sequentially. In this way, information on the presence or absence of the ring frame F or the storage posture (transport object detection information) can be obtained for all the slots 34 in the FOUP 3 or all the slots 34 in the frame box C.

In the load port 1 of this embodiment, predetermined operations are executed by giving drive commands to each part and each mechanism from the control unit 1C. The control unit 1C has a structure including an input/output interface ( IF), and the bus that connects them to communicate information between departments.

In the memory unit, control procedures (action sequences) are stored in accordance with the type of processing executed in the load port 1. In other words, a prescribed action program is stored in this memory unit. The program in this embodiment is stored as an executable program in a non-transitory computer-readable recording medium (hard disk, etc.).

ROM is composed of hard disk, EEPROM, flash memory, etc., and is a recording medium that memorizes CPU operation programs, etc. RAM functions as the workspace of the CPU, etc. The I/O port, for example, outputs control signals output by the CPU to various parts and mechanisms, or supplies information from sensors to the CPU.

The CPU constitutes the core of the control unit 1C and executes the operation program stored in the ROM. The CPU controls the operation of load port 1 according to the program stored in the memory unit.

Next, the usage method (especially the comparison processing method) and the function of the load port 1 in this embodiment will be described with reference to FIG. 10 and other diagrams illustrating the operation flow.

First, one of the FOUP 3 or the cassette C automatically transports containers such as the OHT by operating a linear transport line (moving line) extending along the common wall surface 3A of the loading port 1 in the transport chamber 2 The transport device is transported above the loading port 1 and is placed on the placement table 5. In the loading port 1 of this embodiment, the control unit 1C executes the task of holding the seating holding mechanism 6 on the loading port 1. The seating holding process St1 on the placement table 5 (refer to FIG. 10). The specific process of the seating holding process St1 in this embodiment is to hook the lock claw 61 on the placement table 5 to a locked portion (not shown) provided on the bottom surface of the FOUP 3 or the bottom surface of the frame box C. Processing of setting to locked state. Thereby, the FOUP 3 or the frame C can be mounted and fixed at a predetermined seating position on the mounting table 5 . When the FOUP 3 is placed on the mounting table 5 , the positioning protrusions 51 provided on the mounting table 5 will fit into the positioning recess of the FOUP 3 .

In the present embodiment, the control unit 1C determines which of the FOUP 3 or the cassette C is held by the seating holding mechanism 6 based on the output signal of the container identifying unit 1Ca (container identifying process St2). The container discrimination process St2 of this embodiment is a process in which the container discrimination part 1Ca judges whether the conveyance container on the placement table 5 is a cassette C. In addition, the loading port 1 of this embodiment has different operation sequences when the FOUP 3 is held on the mounting table 5 and when the cassette C is held on the mounting table 5 .

In addition, in this embodiment, it can also be configured so that the FOUP 3 or the cassette C can be placed on each of the loading tables 5 of three loading ports 1 arranged side by side in the width direction of the transfer chamber 2, and the transport is detected by The seating sensor (illustration omitted) detects whether the container (FOUP3, box C) is placed at a predetermined position on the placement table 5 to detect whether the container (FOUP3, box C) has been placed. In the seating position on the placement table 5.

In the load port 1 of this embodiment, when the control unit 1C determines that the FOUP 3 is held on the placement table 5 (container determination processing St2; No), the control unit 1C follows the following processing procedure. Continuing the above-mentioned seating holding process St1, in the load port 1 of this embodiment, the control unit 1C uses the traction mechanism 7 to move the placement table 5 backward from the seating position toward the frame 4 to the transfer object receiving and receiving position ( Rear traction treatment St3). By this rear pulling process St3, the FOUP door 32 can be docked to the loading port door 8 that has been ordered to stand by in the fully closed position (C) in advance, and can be maintained in a close contact state. In this embodiment, the FOUP door 32 is connected to the load port 8 using the engaging portion 81 provided in the load port 8 and is held in close contact with the load port 8 .

In the loading port 1 of this embodiment, when the FOUP 3 is placed in the seating position on the placement table 5, the control unit 1C detects that the bottom portion of the FOUP 3 is pushed against the placement table 5. For example, the pressure sensor takes this as an opportunity, and the control unit 1C instructs the bottom drain injection nozzle and the bottom drain discharge nozzle provided on the placement table 5 to move higher than the upper surface of the placement table 5 . The driving command (signal) extending from above. As a result, each of the nozzles (the bottom purge injection nozzle, the bottom purge discharge nozzle) is connected to the injection port and the discharge port of FOUP 3, and the purge process is enabled.

Then, in the load port 1 of this embodiment, the control unit 1C issues a drive command to execute the purging process St4 on the internal space 2S of the FOUP 3. In this purge process St4, a predetermined ambient gas is supplied from the bottom purge injection nozzle to the internal space 2S of the FOUP 3 through the injection port, and the gas that has previously accumulated in the internal space 2S of the FOUP 3 is purged from the bottom through the discharge port. Discharge using a nozzle. By this purging process St4, the internal space 2S of the FOUP 3 can be filled with ambient gas, the moisture concentration and the oxygen concentration in the FOUP 3 can be reduced to below the prescribed value in a short time, and the conveyed objects in the FOUP 3 can be removed. The surrounding environment of W is set to a low humidity environment and a low oxygen environment.

In addition, it is applicable to the FOUP 3 that has been subjected to the purge process at a time point before being placed on the placement table 5. For such FOUP 3, the purge process St4 can be performed, or the purge process St4 can be selected not to be performed.

Next, in the load port 1 of this embodiment, the control unit 1C uses the connection switching mechanism 82 to release the engagement state between the FOUP door 32 and the FOUP body 32 so that the FOUP door 32 can be detached from the FOUP body 32 Processing of unlocking status (unlatch processing St5).

Continuing with the unlatching process St5, in the load port 1 of this embodiment, the control unit 1C executes the door opening and closing mechanism 9 to move the load port door 8 backward from the fully closed position (C) to the door open position (O). ), and the opening 41 of the frame 4 is brought into the open state (door opening process St6). Specifically, the control unit 1C uses the door opening and closing mechanism 9 to move the loading port door 8 by a predetermined distance along the above-mentioned horizontal path from the fully closed position (C) to the door open position (O). At this time, the loading port 8 moves while holding the FOUP door 32 integrally with the engaging portion 81 . Therefore, in the door opening process St6, the carry-out entrance 31 of the FOUP 3 is also opened in the same manner as the opening 41 of the frame 4.

Next, in the load port 1 of this embodiment, the control unit 1C performs the second comparison process St7 by the comparison mechanism M. The collimator M2 of the collation mechanism M is placed in a position (P2) in which the wafer cannot be collated immediately after the execution of the door opening process St6 (refer to FIG. 8(i) ). In this embodiment, the second collation position (P2) of the collimator M2 is set to the same position as the wafer disable collation position (P2), and the height position of the collimator sensor M1 immediately after the door opening process St6 is completed. It is set slightly above the uppermost slot 34 in FOUP3. The height position of this comparison sensor M1 is set as the "second comparison start height position". According to the load port 1 of this embodiment, the second comparison process St7 can be performed immediately after the door opening process St6 is completed. In addition, in the load port 1 of this embodiment, the door opening process St6 is executed at a time point before the second comparison process St7 is executed, so the opening 41 of the frame 4 and the carry-out entrance 31 of the FOUP 3 are in an open state.

Then, in the load port 1 of this embodiment, the door opening and closing mechanism 9 moves the load port door 8 downward from the door open position (O) to the fully open position, and the entire collation mechanism M also moves downward. Thereby, the comparator M2 maintains the front-to-back position at the second comparison position (P2), and moves from the second comparison start height position to a position lower than the lowermost slot 34 (the second comparison end height position). . The control unit 1C follows the above procedure, detects whether the signal path formed between the comparison sensors M1 is blocked, and acquires information on the presence or absence of the ring frame F or the storage posture (transfer object) for each slot 34 The second control treatment St7 of the substance detection information).

When the result of the second comparison process St7 is "detected", it can be seen that the annular frame F is accommodated in the slot 34 in the FOUP 3 placed on the table 5 . In addition, when the size of the ring frame F does not fit into FOUP3, it can be set to report an error based on the result of the second comparison process St7 being "detected" without executing the first comparison process St9. (to stop the comparison process), or it can be set not to execute the second comparison process St7 at all.

On the other hand, when the result of the second comparison process St7 is "no detection", it can be seen that the ring frame F is not accommodated in the slot 34 .

In the load port 1 of this embodiment, the control unit 1C continues the second collation process St7 and executes a process of raising the comparator M2 from the second collation end height position to the second collation start height position (collation rising process St8). Specifically, the comparison raising process St8 in this embodiment can be performed by moving the loading port door 8 upward from the fully open position toward the door open position (O) by the door opening and closing mechanism 9 .

Next, in the load port 1 of this embodiment, the control unit 1C performs the first comparison process St9 by the comparison mechanism M. Specifically, the tilting mechanism M4 moves the comparator M2 from the second comparison position (P2) to the first comparison position (P1) shown in Figures 6 and 8(ii), and places the comparator M2 on The comparison sensor M1 will be arranged at a height position slightly above the uppermost slot 34 in the FOUP 3 (the first comparison starting height position), and the door opening and closing mechanism 9 will move the loading port door 8 from the door open position. (O) moves downward toward the fully open position, and the entire control mechanism M also moves downward. Thereby, the comparator M2 maintains the front-to-back position at the first collation position (P1), and moves from the first collation starting height position to a position lower than the lowermost slot 34 (the first collating end height position). . The control unit 1C follows the above procedure, detects whether the signal path formed between the comparison sensors M1 is blocked, and acquires information on the presence or storage posture of the wafer W (transfer target object) for each slot 34 Test information) The first control treatment St9.

In addition, at the time when the comparator M2 moves from the second comparison position (P2) to the first comparison position (P1) following the comparison rising process St8, if the size condition of the comparison sensor M1 is If the uppermost slot 34 in the FOUP 3 is still on the lower side, then through appropriate processing (in this embodiment, the comparison mechanism M and the loading port 8 are integrally moved upward by a predetermined distance). The height position of the comparator M2 is adjusted so that the comparison sensor M1 is placed above the uppermost slot 34 in the FOUP 3 .

When the result of the first comparison process St9 is "detected", it can be identified that one of the ring frame F and the wafer W is accommodated in the slot 34 in the FOUP 3 on the mounting table 5 . On the other hand, when the result of the first comparison process St9 is "no detection", it can be seen that neither the wafer W nor the annular frame F is accommodated in the slot 34 .

Then, in this embodiment, as shown in FIG. 11 , the storage status in the FOUP 3 can be identified based on the results of the conveyed object detection information obtained by the first comparison process St9 and the second comparison process St7. That is to say, when the detection result of the second comparison process St7 is "no detection" and the detection result of the first comparison process St9 is "detection", it can be identified that the storage in the slot 34 There is wafer W (normal stowage). In addition, when the detection result of the second comparison process St7 is "no detection" and the detection result of the first comparison process St9 is also "no detection", it can be determined that there is no accommodation in the slot 34 Either the wafer W or the annular frame F is present (empty slot state).

On the other hand, when the detection result of the second comparison process St7 is "detected" and the detection result of the first comparison process St9 is also "detected", it can be identified that the slot 34 is One of the ring frame F and the wafer W is stored (mixed). In addition, when the detection result of the second comparison process St7 is "detected" and the detection result of the first comparison process St9 is "no detection", the storage status in the slot 34 becomes contradictory. , so sensor errors can be identified.

According to the above, while FOUP3 is maintained on the placement table 5, if the detection result of the second comparison process St7 is "no detection", the detection result of the first comparison process St9 is "detection ”, it can be identified as “normal loading” in which wafer W and ring frame F are not mixed in FOUP3. If the detection result is other than this, it can be identified that wafer W and ring frame F are mixedly loaded in FOUP3. Ring box F, or sensor error.

Next, the operation sequence will be described in the case where the cassette C is held on the placement table 5 . In the load port 1 of this embodiment, when the control unit 1C determines that the cassette C is held on the placement table 5 (container determination processing St2; Yes), the control unit 1C follows the following processing procedures. Continuing the above-mentioned seating holding process St1, in the load port 1 of this embodiment, the control unit 1C executes the door opening and closing mechanism 9 to move the load port door 8 backward from the fully closed position (C) to the door open position. (O), and the process of opening the opening 41 of the frame 4 (door opening process St6), following the door opening process St6, the mounting table 5 is moved backward from the seating position toward the frame 4 by the pulling mechanism 7 To the transport object receiving and receiving position (rear pulling processing St3).

The plane size of the frame C applied to this embodiment, especially the front-to-back direction, is larger than the front-to-back direction size of FOUP 3. Therefore, when the rear pulling process St3 is executed before the door opening process St6, the storage The annular frame F inside the frame C or the frame C itself may come into contact with the load port 8 . In view of this, in this embodiment, when the cassette C is placed on the placement table 5, it is set so that the door opening process St6 is executed with priority over the rear pulling process St3.

In addition, since the frame box C applied to this embodiment is an open box, the draining process and the unlatching process can be omitted. In addition, in the intermediate process and the post-process, high space cleanliness in the transfer chamber 2 is not necessary, so an open box can be used as the transfer container 3 of the ring frame F.

Then, in the load port 1 of this embodiment, the control unit 1C continues the rear pulling process St3 and executes the second collation process St7 (refer to FIG. 9( i)), the comparison raising process St8, and the first comparison process St9 performed by placing the comparator M2 at the first comparison position (P1) (see FIG. 9(ii)).

When the result of the second comparison process St7 is "detected", it can be seen that the annular frame F is accommodated in the slot C1 in the frame box C placed on the table 5 . On the other hand, when the result of the second comparison process St7 is "no detection", it can be seen that the ring frame F is not accommodated in the slot C1.

When the result of the first comparison process St9 is "detected", it can be identified that one of the annular frame F and the wafer W is accommodated in the slot C1 in the frame cassette C placed on the table 5 By. On the other hand, when the result of the first comparison process St9 is "no detection", it can be seen that neither the wafer W nor the annular frame F is accommodated in the slot C1.

Then, in this embodiment, as shown in FIG. 11 , the storage status in the frame box C can be identified based on the results of the conveyed object detection information obtained by the first comparison process St9 and the second comparison process St7. That is to say, when the detection result of the second comparison process St7 is "detected" and the detection result of the first comparison process St9 is also "detected", it can be identified that the gap in the slot C1 Contains Ring Frame F. In addition, when the detection result of the second comparison process St7 is "detected" and the detection result of the first comparison process St9 is "no detection", the storage status in the slot C1 becomes contradictory. , so sensor errors can be identified.

On the other hand, when the detection result of the second comparison process St7 is "no detection" and the detection result of the first comparison process St9 is "detection", it can be determined that the storage in the slot C1 There is wafer W. In addition, when the detection result of the second comparison process St7 is "no detection" and the detection result of the first comparison process St9 is also "no detection", it can be determined that there is no accommodation in the slot 34 There is either annular frame F or wafer W (empty slot state).

According to the above, while the frame box C is held on the placing table 5, if the detection result of the second comparison process St7 is "detected", the detection result of the first comparison process St9 is also "detected". Detected", it can be identified as "normal loading" in which the annular frame F and the wafer W are not mixed in the cassette C. If the detection result is other than this, it can be identified that the wafer W is in the cassette C. Mixed loading contains ring frame F and wafer W, or sensor error.

In the load port 1 of this embodiment, when the FOUP 3 is held on the placement table 5, and when the cassette C is held on the placement table 5, in either case, the control unit 1C The first collation process and the second collation process are both executed. After these two collation processes are completed, the comparator M2 is placed in the internal space of the transfer chamber 2 (for example, placed at the second collation position (P2). ) state), the process of lowering the loading port door 8 to the fully open position by the door opening and closing mechanism 9 is performed. Thereby, the comparison mechanism M will move downward together with the loading port 8 moving to the fully open position. In the load port 1 of this embodiment, when the control unit 1C determines that the non-mixed load state or the sensor error state is based on the detection results of the first comparison process and the second comparison process, the control unit 1C executes the slave load The FOUP 3 or the cassette C on the table 5 sequentially moves the transfer objects (wafers W, ring frames F) to the predetermined transfer destination (processing room R (specifically, load/load) by the transfer robot 21 room), buffer workstation, aligner, etc.) handling.

On the other hand, when a mixed load state or a sensor error state is determined based on the detection results of the first comparison process and the second comparison process, the FOUP 3 or the frame C placed on the table 5 will be The automatic container transfer device is transferred from the loading table 5 to other spaces. The new FOUP3 or frame C is loaded on the loading table 5 by the automatic container transfer device, and the above action sequence is followed. .

As described above, the load port 1 of this embodiment can be executed using the collation mechanism M that collates information including the presence or absence of the first transfer target object (wafer W) in each slot 34 in the FOUP 3 The second comparison process is used to compare information on the presence or absence of the second conveyance target object (annular frame F) in each slot C1 in the second conveyance container (frame box C). , based on both or one of the detection results of the first comparison process and the second comparison process, it can be determined whether the conveyance objects W with different planar sizes are mixed in the FOUP 3 or FOUP 3 on the placement table 5 Inside box C. Therefore, according to the load port 1 of this embodiment, there is no need to significantly change the structure of the conventional load port, and the comparison mechanism M can be avoided from enlarging and complicating the structure. After the intermediate process, even if the plan dimensions are different from each other, The transfer objects (wafer W, ring frame F) are stored in FOUP 3 (first transfer container) or cassette C (second transfer container) placed on load port 1 using the common load port 1 In the case of the use mode of taking out, it can still be detected that different transfer objects (wafer W, ring frame F) are mistakenly mixed (misplaced/misloaded) in FOUP3 or frame C, and it can Seek to increase utilization rate in semiconductor manufacturing.

Furthermore, in this embodiment, the collimator M2 placed at the first collation position (P1) or the second collation position (P2) is configured to detect that the centers of the workpieces placed on the table 5 are consistent with each other. The end portion of the transfer object (wafer W, ring frame F). That is, in this embodiment, the first transfer object (wafer W) and the second transfer object (ring frame F) are configured in the first transfer container (FOUP3) or the second transfer container (FOUP3). The comparison process (first comparison process, second comparison process) is performed in a state where the center positions of each other are accommodated in the cassette C) so that they coincide with each other, so there is no need to cope with the transfer target (wafer W, ring frame F) By changing the transport distance or transport position of the transport object by the transport robot 21 according to the size of the transport robot 21, control can be simplified.

In addition, according to the load port 1 of this embodiment, the control unit 1C has the container discriminating unit 1Ca for discriminating which of the FOUP 3 or the cassette C is held by the seating holding mechanism 6. Therefore, the control unit 1C can determine based on the container discriminating unit The discrimination information performed by 1Ca is based on a preset sequence of actions such as the seating hold processing, the door opening processing, the rear pulling processing, the first comparison processing, the second comparison processing, or the first comparison processing and the second comparison. Processing both sides, or performing comparison processing on only one of them, etc., to automatically control the actions of each mechanism.

In particular, in the load port 1 of this embodiment, when it is determined that the transport container holding the cassette C by the seating holding mechanism 6 is the cassette C, the seating holding process and the door opening are sequentially executed. After the processing and rear pulling processing, both the first comparison processing and the second comparison processing are executed, thereby preventing the collision between the frame C and the load port 8.

In addition, according to the comparison processing method in the load port 1 adopted in this embodiment, various functions and effects similar to those exerted by the load port mentioned above can be exerted, and the utilization rate in semiconductor manufacturing can be improved.

In addition, the present invention is not limited to the above-described embodiment. For example, in the above embodiment, a wafer is exemplified as the first transfer object, and a ring-shaped frame holding a thin wafer that has been processed in the intermediate process is exemplified as the second transfer object having a different plane size from the first transfer object. , but the first conveyance object and the second conveyance object are not limited to them. The second transport container for accommodating the second transport object is not limited to the frame box, and may be an appropriate transport container corresponding to the size of the second transport object. As a transport container, a frame box with a door can also be used. In this case, the door needs to be removed (unlatched).

In addition, the second conveyance object may be smaller in planar size than the first conveyance object. In this case, the position of the comparator (the second comparison position) when performing the comparison process (the second comparison process) on the second conveyance object will be different from the position when the comparison process (the first comparison process) on the first conveyance object is executed. The position of the comparator (the first comparison position) during the comparison processing) is still forward.

The "first comparison position" and the "second comparison position" in the present invention can be appropriately set according to the planar dimensions of the first conveyance object and the second conveyance object. The second comparison position can also be the same as in the above embodiment. It is impossible to compare the positions of different wafer positions. According to the present invention, from the viewpoint of productivity improvement, the wafer diameter is being enlarged, from the current diameter of 300 mm (radius 150) mm to a diameter of 450 mm (radius 225) mm or even a diameter of 500 (radius 250) mm. It can also respond well to recent trends such as the advancement of wafer transformation. In other words, not only in the intermediate process and post-process of semiconductor manufacturing as mentioned above, but also in the initial process, the load port of the present invention can be used to access two types of transportation objects with different sizes and two types of transportation corresponding thereto. Containers for proper control processing.

The order of the first collation process executed by placing the colarator at the first collation position and the second collation process executed by placing the colarator at the second collation position can be appropriately changed. In addition, when there are no mixed objects to be transported in the first or second transport container, it is possible to use one type of loading port to access two types of transport containers and two types of transport objects. , only one of the first comparison processing or the second comparison processing corresponding to the transportation container and the transportation object is executed.

In the above-mentioned embodiment, the collation moving part (collation arm) of the collation mechanism is exemplified by the door opening and closing mechanism that moves in the front-rear direction and the up-down direction together with the loading port door, and operates independently from the door opening and closing mechanism. 2. Things that meet both action conditions, as long as it satisfies one of the conditions. For example, it is possible to apply a collation mechanism that has a sliding mechanism that horizontally moves the collating moving part in the front-rear direction, and uses the sliding mechanism to move the collating device back and forth between the first collating position and the second collating position, or it can be applied. A moving mechanism different from the door opening and closing mechanism is used to move the control mechanism in the height direction. In addition, the collation mechanism may be anything that can perform the collation process in a state in which the opening of the frame is opened by the door opening and closing mechanism. In the present invention, the so-called "state in which the opening of the frame is opened" is used. ” is a concept that includes both the state in which the loading port door is placed in the door-open position and the state in which it is placed in the fully-open position in the above embodiment. As long as the comparison mechanism is a thing that can move up and down independently of the lifting movement of the load port, the comparison can also be performed with the load port door placed at a position equivalent to the door open position in the above embodiment. The comparison process may be performed with the door placed at a position corresponding to the fully open position in the above-mentioned embodiment.

In addition, in the present invention, the following can be applied as the collation mechanism, that is, a collimator having a collimator having a collimator sensor at a distal end portion; and a collimator moving portion that moves the proximal end portion or the proximal end portion of the collimator adjacent to the collimator. It is supported so as to be able to rotate horizontally or slightly horizontally, and the collimator is moved through the opening of the frame in the open state to a position where the collation sensor can detect that the first transport object is accommodated in the first transport container (FOUP). The first comparison position. In this case, for example, the comparison moving part is provided with: a pair of left and right rotation shafts as the rotation center of the comparison sensor; a driving part that appropriately and synchronously rotates the rotation shaft in the forward and reverse directions; and accommodating the rotation shaft and the drive part. At least a part or all of the chassis; the chassis is configured to be installed at a suitable place on the load port, so that the comparator can be set to be in the first comparison position, and not to be detected by the comparison sensor. It is detected that the first transfer object contained in the first transfer container cannot move around the rotation axis between the wafer positions. Furthermore, a design may be adopted in which the rotation angle of the comparator (for example, the rotation angle based on the comparator installed at the non-colariable position) is set to be different from the rotation angle when the comparator is moved from the non-colariable position to the first collation position. value, whereby the collimator is placed at the second collation position where the second transport object is stored in the second transport container through the collation sensor through the opening of the frame in the open state ( The first configuration), or is designed to set the rotation angle of the comparator to the same value as the rotation angle when it moves from the non-comparison position to the first comparison position, and to control the forward and backward movement of the loading port in the forward and backward directions. (forward, backward), thereby placing the comparator in the second comparison position (second configuration). With the first configuration, the second comparison position and the non-comparison position of the comparator can be set to the same position. On the other hand, with the second configuration, the second comparison position and the non-comparison position will inevitably be different. Location. Even with such a collation mechanism, the loading port can be moved up and down appropriately with the comparator placed in the first collation position, thereby raising and lowering the entire collation mechanism to perform the first collation process. With the comparator placed in the second collation position, the load port is moved up and down appropriately, thereby raising and lowering the entire collation mechanism to perform the second collation process. With such a structure, the control arm or the tilting mechanism in the above-mentioned embodiment is unnecessary.

In addition, after the transportation object (the first transportation object and the second transportation object) is stored in the transportation container (the first transportation container and the second transportation container) on the loading port by the transportation robot, the second transportation object may also be carried out. Both or one of the 1st comparison process and the 2nd comparison process is used to identify whether it is a mixed load state.

In addition, the specific structure and driving source of each mechanism such as the seating retention mechanism, the traction mechanism, and the door opening and closing mechanism can also be appropriately changed.

As a container discriminating unit for discriminating which of different types of transport containers (FOUP or cassette in the above embodiment) is held by the seating holding mechanism, it can also be applied by detecting whether the placement The transport container on the platform is FOUP to identify the transport container.

The loading port of the present invention can be used as a part of the EFEM as described above, and can also be applied to transport devices other than the EFEM.

In addition, for example, it can also be used as a part of a screening device in which a plurality of loading ports of the present invention are arranged on the wall of a transfer chamber, and can be placed on the transfer chamber by a transfer robot. The objects to be transported are exchanged between the transport containers on the loading table of each loading port.

The transfer chamber arranged adjacent to the loading port of the present invention is equipped with a transfer robot in the internal space. In the present invention, the objects to be transported (the first object to be transported, the second object to be transported) for the transport containers (the first transport container, the second transport container) on the placement table of each loading port can be The loading and unloading processing may be performed by a single transfer robot or may be performed by a plurality of transfer robots. As the transfer robot, a thing having three or more transfer object holding parts (manipulators in the case of the above embodiment) can be applied. In addition, as the transfer robot, a thing having one transfer target object holding part can be applied. In addition, it can also be applied to a transport robot in which the transport object holding part is composed of predetermined components other than the robot arm.

There can also be one loading port arranged on the wall of the transfer room. In the above embodiment, the frame of the load port is configured as a part of the outer wall of the transfer chamber. However, the frame may be provided along the outer wall of the transfer chamber.

In the above embodiment, the wafer is exemplified as the transfer object, but the transfer object may also be a reticle, a liquid crystal transfer object, a glass transfer object, a culture plate (culture plate), a culture container, a dish, Or a petri dish, etc. In other words, the present invention can be applied to a loading port for transferring objects contained in containers in various fields such as semiconductors, liquid crystals, and cell culture.

The processing content or quantity of the processing chamber installed adjacent to the transfer chamber can also be changed appropriately.

In the above embodiment, the load port is provided with a control unit, and the control unit controls the movement of the load port and other operations of the components. However, the load port may also be configured to be controlled by a higher-level device (in the case of In the above-mentioned embodiment, the operation control unit of the EFEM or the processing chamber (the upper controller is the control unit of the entire EFEM or the control unit of the processing chamber) collectively controls the operation of the load port.

In addition, the above-mentioned control unit does not rely on a dedicated system, but can be implemented using a common computer system. For example, a control unit for executing the above-mentioned processing can be configured in a general-purpose computer by installing the program from a recording medium (floppy disk, CD-ROM, etc.) storing the program for executing the above-mentioned processing. In addition, the means used to provide these programs are arbitrary. In addition to being provided through prescribed recording media as mentioned above, it can also be provided through communication lines, communication networks, communication systems, etc., for example. In this case, for example, the program can also be published on a bulletin board (BBS) of the communication network, and then superimposed on the carrier through the network to provide it. In addition, the above-mentioned processing can be performed by activating the program provided in this way and executing it like other applications under the control of the OS.

In addition, the specific configuration of each part is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

1:Loading port 1C: Control section (loading port 1) 1Ca: Container identification department 2:Transportation room 2C: (EFEM overall) Control Department 21:Transport robot 4:Box 41:Opening part 3:FOUP 32:FOUP door 34:Slot 5: Place the table 6: Seating retention mechanism 7: Traction mechanism 8:Load port 9: Door opening and closing mechanism C: 2nd transport container (frame box) F: Second transfer object (ring frame) M: Comparative institution M1: Control sensor M2: Comparator M3: Control moving part (control arm) RC: Control department (of processing room R) W: First transfer object (wafer)

[Fig. 1] A modeled schematic side view showing the relative positional relationship between an EFEM equipped with a load port and its peripheral devices according to an embodiment of the present invention. [Fig. 2] A simplified plan view of the relative positional relationship shown in Fig. 1. [Fig. 3] A perspective view of the loading port of the same embodiment. [Fig. 4] A front view of the same embodiment with part of the loading port omitted. [Fig. 5] A side view of the loading port of the same embodiment with the cassette placed on the loading table and the loading port door in the open position. [Fig. 6] A diagram corresponding to Fig. 5 illustrating a state in which the comparator is placed in the first collation position. [Fig. 7] A plan view of the object to be transported in the same embodiment. [Fig. 8] A schematic diagram illustrating a model of the comparison processing operation of the comparison mechanism for the first conveyance object accommodated in the slot in the FOUP. [Fig. 9] A schematic diagram illustrating a model of the comparison processing operation of the comparison mechanism for the second conveyance object contained in the slot in the second conveyance container. [Fig. 10] A flowchart illustrating the operation procedure of the load port in this embodiment. [Fig. 11] A diagram illustrating the detection status and comparison results of the first comparison process and the second comparison process in this embodiment.

Claims (6)

A comparison method is a comparison method in a comparison mechanism that compares the transportation objects when the transportation objects are exchanged between a transportation container and a transportation chamber capable of storing a plurality of pieces of transportation objects in a multi-stage slot. The state of the conveyance object in each slot of the container, the comparison mechanism includes: a comparison device having a comparison sensor; and a comparison moving part that supports the comparison device and moves the comparison device to a position where the comparison can be performed The sensor detects a comparison position in the transportation container where the transportation object is stored, and the comparison mechanism is selectively caused to execute one of the first comparison process and the second comparison process using the common comparison sensor. One or both parties, wherein the first comparison process is to place the aforementioned comparator at the first comparison position and let it perform the comparison process, and the second comparison process is to place the aforementioned comparator at the aforementioned first comparison position. The comparison process is performed at a different second comparison position. The collation method according to claim 1, wherein the first collation position is set closer to the center of the conveyance object than the second collation position. The collation method according to claim 2, wherein when the conveyed object is not detected by the second collation process, the first collation process is executed. The comparison method as described in any one of claims 1 to 3, wherein: container identification processing is performed to determine the aforementioned transport container. Whether the container is a first transportation container that accommodates a first transportation object or a second transportation container that accommodates a second transportation object that is different in plane size from the first transportation object is based on the result of the aforementioned container discrimination process and the aforementioned first transportation object. 1. Compare the results of the first comparison process and the second comparison process, and perform a process of identifying the sensing results, wherein the sensing results at least include the empty slot state, mixed loading state, normal loading state, and sensor error state of the transport container. The comparison method according to claim 4, wherein the first transfer object is a wafer, and the second transfer object is a wafer held in a ring frame. An equipment front-end module is provided with: a transfer chamber; and a loading port for receiving and receiving the transfer objects between a transfer container capable of storing a plurality of pieces of transfer objects in multi-stage slots and the transfer chamber, and further having: a comparison a mechanism that compares information on the presence or absence of the transport object in each of the slots in the transport container seated on the loading table of the loading port; and a control unit that controls the control mechanism including the comparison mechanism In the operation of the mechanism part, the comparison mechanism includes: a comparison device having a comparison sensor; and a comparison moving part that supports the comparison device and moves the comparison device to a position where the comparison sensor can detect the transfer container. The control unit selectively executes one or both of the first comparison process and the second comparison process with respect to the comparison mechanism using the common comparison sensor at the comparison position where the conveyance object is stored, wherein: The first control process is to place the aforementioned control device The second comparison process is performed by placing the comparator at a second comparison position different from the first comparison position and performing the comparison process at the first comparison position.

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