TWI811455B - An exhaust gas purification system - Google Patents

Abstract

This case reveals an exhaust gas purification system used to purify pollutants in the exhaust gas in the reflow furnace furnace, including a first-stage cooling unit, a second-stage cooling unit and a filter unit, which can make the pollutants in the exhaust gas less likely to adhere to the cooling the inner wall of the device, thereby extending maintenance intervals. This case also discloses a self-cleaning exhaust gas purification system, including a cooling unit, a filter unit, a heating component, a first channel, and a second channel. The gas forms a self-cleaning gas in the cooling unit, the first channel, the filter unit, and the second channel. circulation, so that the exhaust gas purification system can be easily maintained.

Description

Exhaust gas purification system

This case involves an exhaust gas treatment system for a reflow soldering furnace, and in particular, an exhaust gas purification system used to purify the exhaust gas in the furnace of the reflow soldering furnace.

In the manufacturing process of printed circuit boards, a process called "reflow soldering" is usually used to mount electronic components onto the circuit board. In a typical reflow soldering process, solder paste (eg, solder paste) is deposited onto selected areas on a circuit board, and the leads of one or more electronic components are inserted into the deposited solder paste. The circuit board then passes through a reflow oven where the solder paste is reflowed in a heated area (i.e., heated to melting or reflow temperature) and then cooled in a cooled area to electrically and mechanically connect the electronic components' leads. to the circuit board. The term "circuit board" as used herein includes any type of electronic component substrate component, including, for example, a wafer substrate. In a reflow oven, air or a basically inert gas (such as nitrogen) is usually used as the working gas, and different working gases are used for circuit boards with different process requirements. The furnace of the reflow oven is filled with working gas, and soldering is performed in the working gas while the circuit board is transported through the furnace by a conveyor.

In a reflow oven, solder paste includes not only solder, but also flux that encourages the solder to become moist and provide a good soldered joint. Other additives such as solvents and catalysts may also be included. After the solder paste is deposited on the circuit board, the circuit board is transferred on a conveyor through multiple heated zones of the reflow oven. The heat in the heated area causes the solder paste to melt, and volatile organic compounds (called "VOCs"), mainly including flux, vaporize to form vapor, thereby forming "pollutants". The accumulation of these contaminants in the reflow oven can cause problems. For example, if contaminants reach the cooling area, they will condense on the circuit board and contaminate the circuit board, making subsequent cleaning steps necessary. Contaminants can also condense on the surface of the reflow oven's cooler, blocking the pores. In addition, condensation may also drip onto subsequent circuit boards, potentially damaging components on the circuit boards or necessitating subsequent cleaning steps on contaminated circuit boards.

The exhaust gas containing pollutants in the reflow furnace needs to be discharged from the furnace to keep the working atmosphere in the reflow furnace clean, thereby preventing pollutants from entering the cooling area of the reflow furnace and causing the above problems in the reflow furnace.

When the reflow oven uses a basically inert gas (such as nitrogen) as the working gas, since the basically inert gas (such as nitrogen) is expensive, it is usually hoped that the waste gas discharged from the reflow soldering furnace will be cleaned by the waste gas purification system. It is transported back to the reflow oven for reuse. When the reflow oven uses air as the working gas, the exhaust gas discharged from the reflow oven can be directly discharged into the atmosphere after being cleaned by the exhaust gas purification system, or can be transported back to the reflow oven for reuse.

One treatment solution is to cool the exhaust gas to below about 80°C in a cooling device, so that the pollutants in the exhaust gas are condensed from gaseous form into liquid or solid form, and then the liquid or solid form of pollutants are removed. However, liquid or solid pollutants formed by cooling not only easily adhere to the inner wall of the cooling device and are difficult to clean, resulting in a short maintenance cycle and high maintenance costs, but also adhere to the heat exchange components of the cooling device (such as replacement parts). hot plate or heat exchange tube), affecting the heat exchange efficiency.

On the other hand, in the exhaust gas purification system of the prior art, cleaning the connecting pipes and various parts of the exhaust gas purification system requires manual cleaning, which is very inconvenient.

After observation and research, the applicant found that the difficult-to-clean pollutants attached to the inner wall of the cooling device and the heat exchange components in the exhaust gas purification system are mainly rosin in solid form. This is because the rosin and other fluxes in the pollutants will directly solidify from the gas form to the solid form when cooled from high temperature to about 80°C, and adhere to the inner wall of the cooling device and the heat exchange components, making the exhaust gas purification system When the maintenance cycle is too short, it also affects the heat exchange efficiency.

In order to solve at least one of the above problems, at least one purpose of this case is to provide an exhaust gas purification system for use in the furnace of a reflow soldering furnace, which can prevent rosin from easily adhering to the inner wall of the cooling device, thereby extending the maintenance cycle.

In order to achieve the above purpose, the first aspect of this case provides an exhaust gas purification system for purifying pollutants in the exhaust gas in the reflow furnace furnace, including: a first-stage cooling unit, the first-stage cooling unit has an exhaust gas inlet and a gas outlet, the first-stage cooling unit is used to cool the exhaust gas entering the first-stage cooling unit through the exhaust gas inlet to a first temperature, so that the exhaust gas entering the first-stage cooling unit is A part of the pollutants is cooled from gaseous state to liquid state and discharged from the first-stage cooling unit, and a part of the remaining part of the pollutants in the exhaust gas entering the first-stage cooling unit remains in gaseous state; in the second-stage cooling unit, the The second-stage cooling unit has a gas inlet and a gas outlet. The gas inlet of the second-stage cooling unit is in fluid communication with the gas outlet of the first-stage cooling unit. The second-stage cooling unit is used to remove the gas from the first-stage cooling unit. The exhaust gas entering the second-stage cooling unit from the first-stage cooling unit is cooled from the first temperature to the second temperature, so that a part of the pollutants in the exhaust gas entering the second-stage cooling unit is cooled from a gaseous state to a liquid state. And discharged from the second-stage cooling unit, part of the remaining part of the pollutants in the exhaust gas entering the second-stage cooling unit remains in a gaseous or mist state; a filtering unit, the filtering unit has a gas inlet and a net Gas outlet, the gas inlet of the filter unit is in fluid communication with the gas outlet of the second-stage cooling unit, the filter unit is used to filter the exhaust gas entering the filter unit, and pass at least part of the filtered gas through the The air is discharged from the clean air outlet of the filter unit.

According to the above first aspect, the exhaust gas purification system further includes: a collection unit, each of the first-stage cooling unit and the second-stage cooling unit has a waste liquid outlet, and the collection unit is controllably connected to the first-stage cooling unit. The waste liquid outlet of the first-stage cooling unit and the second-stage cooling unit are both in fluid communication for collecting discharged liquid waste gas.

According to the above first aspect, at the first temperature, the pollutants in the exhaust gas that are cooled from the gaseous state to the liquid state include rosin organic matter; at the second temperature, the pollutants in the exhaust gas that are cooled from the gaseous state to the liquid state include other low-level pollutants. Acids, esters or ether organic compounds with freezing points.

According to the above first aspect, the first temperature is 110~130°C; the second temperature is 60~80°C.

According to the above first aspect, the exhaust gas inlet of the first-stage cooling unit is used to be in controllably fluid communication with the furnace hearth of the reflow oven.

The second aspect of this case provides an exhaust gas purification system capable of self-cleaning, including: a cooling unit having a self-cleaning gas inlet and a gas outlet; a filtering unit having a gas inlet and a self-cleaning gas outlet; Heating component, the heating component is provided in the filter unit for raising the gas temperature in the filter unit; a first channel connects the gas outlet of the cooling unit and the filter unit a gas inlet, the first channel is used to transport the gas in the cooling unit to the filter unit; and a second channel connects the self-cleaning gas outlet of the filter unit and the A self-cleaning gas inlet of the cooling unit, the second channel is used to controllably transport the gas in the filter unit to the cooling unit; wherein the cooling unit, the first channel, the filter unit and the second channel A self-cleaning gas cycle is formed.

According to the above second aspect, the exhaust gas purification system further includes: a fluid power device that enables gas to circulate in the filter unit and the cooling unit through the first channel and the second channel. .

According to the above second aspect, the cooling unit includes an exhaust gas inlet, the exhaust gas inlet is used to controllably connect with the furnace of the reflow soldering furnace; the filter unit includes a clean gas outlet, the clean gas outlet is used to controllably connect Drain the gas from the filter unit.

According to the above second aspect, the exhaust gas purification system further includes: a collection unit, the cooling unit and the filter unit each have a waste liquid outlet, the collection unit is controllably connected to the cooling unit and the filter unit. The waste liquid outlets are all fluidly connected and used to collect discharged liquid waste gas.

According to the above second aspect, the cooling unit also has an air supply port, the air supply port is used to controllably communicate with the protective gas fluid, so that the protective gas enters the exhaust gas purification system; the filter unit has an exhaust port , the exhaust port is used to controllably discharge the gas in the exhaust gas purification system.

The following will further describe the concept, specific structure and technical effects of this case in conjunction with the accompanying drawings, in order to fully understand the purpose, characteristics and effects of this case.

Various specific embodiments of the present invention will be described below with reference to the accompanying drawings that form a part of this specification. It should be understood that although terms indicating direction are used in this case, such as "front", "back", "upper", "lower", "left", "right", "top", "bottom", "side" "" etc. describe various example structural parts and elements of the present application, but these terms are used here for convenience of explanation only and are determined based on the orientation of the examples shown in the drawings. Since the embodiments disclosed in this case can be arranged in different directions, these terms indicating directions are for illustration only and should not be regarded as limiting.

Those skilled in the art need to know that the waste gas or gas described in this embodiment refers to components that are mostly gaseous, and may also include some mist-like or granular components.

FIG. 1A illustrates a simplified structural block diagram of an exhaust gas purification system according to an embodiment of the present application, for illustrating the connection relationship of various parts of the exhaust gas purification system 100 . As shown in FIG. 1A , the exhaust gas purification system 100 is disposed outside the reflow furnace chamber 118 and is connected to the furnace chamber 118 of the reflow furnace. When the reflow oven uses a substantially inert gas (eg, nitrogen) as the working gas, the exhaust gas purification system 100 receives the exhaust gas discharged from the furnace 118 of the reflow oven and delivers the purified gas back to the furnace 118 . When the reflow soldering furnace uses air as the working gas, the exhaust gas purification system 100 receives the exhaust gas discharged from the furnace 118 of the reflow soldering furnace, and the purified gas may or may not be transported back to the furnace 118. is discharged to the outside of the furnace 118. In FIG. 1A , the exhaust gas purification system 100 delivers the purified gas back into the furnace 118 .

As shown in FIG. 1A , the exhaust gas purification system 100 includes a first-stage cooling unit 110 , a second-stage cooling unit 120 and a filter unit 130 , which are connected in sequence and connected to the furnace 118 to purify the exhaust gas discharged from the furnace 118 . The exhaust gas purification system 100 can also deliver the purified gas back to the furnace 118 . In addition, the exhaust gas purification system 100 can also self-clean the first-stage cooling unit 110, the second-stage cooling unit 120, the filter unit 130 and the connecting channels between them.

Specifically, the first-stage cooling unit 110 has a waste gas inlet 111.1, a self-cleaning gas inlet 114, a gas outlet 111.2 and a first waste liquid outlet 141.1. The second stage cooling unit 120 has a gas inlet 121.1, a gas outlet 121.2 and a waste liquid outlet 141.2. The filter unit 130 has a gas inlet 131.1, a self-cleaning gas outlet 134, a clean gas outlet 131.2 and a waste liquid outlet 141.3.

The exhaust gas inlet 111.1 of the first stage cooling unit 110 is in controllably fluid communication with the high temperature zone of the furnace 118 through a valve member 117.1. The gas outlet 111.2 of the first stage cooling unit 110 is in fluid communication with the gas inlet 121.1 of the second stage cooling unit 120 through the connecting channel 125.1. The gas outlet 121.2 of the second-stage cooling unit 120 is in fluid communication with the gas inlet 131.1 of the filter unit 130 through the connecting channel 125.2. The clean gas outlet 131.2 of the filter unit 130 is controllably fluidly connected to the low temperature zone of the furnace 118 through the valve component 117.2. Therefore, the exhaust gas discharged from the furnace 118 can be purified by the first-stage cooling unit 110 , the second-stage cooling unit 120 and the filter unit 130 in sequence, and then return to the furnace 118 .

In addition, the self-cleaning gas outlet 134 of the filter unit 130 is connected to the gas inlet 114 of the first-stage cooling unit 110 through the connecting channel 135. The connecting channel 135 is provided with a channel switch component 117.5 to connect the self-cleaning gas outlet 134 of the filter unit 130. In controllable fluid communication with the gas inlet 114 of the first stage cooling unit 110 . Therefore, the gas discharged from the self-cleaning gas outlet 134 of the filter unit 130 can enter the first-stage cooling unit 110, and can flow through the first-stage cooling unit 110 and the second-stage cooling unit 120 in sequence, and then return to the filter unit. 130 to form a self-cleaning gas circulation inside the exhaust gas purification system 100 .

According to an embodiment of this case, the first-stage cooling unit 110 may not be provided with a self-cleaning gas inlet 114 separate from the exhaust gas inlet 111.1, but use the same inlet as the exhaust gas inlet and the self-cleaning gas inlet. Similarly, the filter unit 130 may not be provided with a self-cleaning gas outlet 134 separate from the clean gas outlet 131.2, but use the same outlet as the self-cleaning gas outlet 134 and the clean gas outlet 131.2.

The exhaust gas purification system 100 also includes an air supply port 112 provided on the first-stage cooling unit 110 and an exhaust port 132 provided on the filter unit 130, as well as a gas concentration detection component for detecting the gas concentration in the filter unit 130. As an example, the gas concentration detection component 155 is an oxygen concentration detection component, which detects the oxygen concentration to obtain the concentration of the working gas. The oxygen concentration detection component is arranged near the exhaust port 132 . The air supply port 112 is controllably opened and closed by a valve component 117.3, and the exhaust port 132 is controllably opened and closed by a valve component 117.4. When the reflow oven uses a substantially inert gas (such as nitrogen) as the working gas, it can Working gas (that is, a substantially inert gas (such as nitrogen)) is replenished into the exhaust gas purification system 100 through the gas supply port 112. The exhaust port 132 is used to cooperate with the gas supply port 112 when the gas supply port 112 is working. By providing the air supply port 112 and the exhaust port 132, the concentration of the working gas in the exhaust gas purification system 100 can be adjusted to match the concentration of the working gas in the furnace 118. The make-up port 112 may be in controllably fluid communication with a source of working gas (ie, a substantially inert gas such as nitrogen) via valve member 117.3, and the exhaust port 132 may be in controllably fluid communication with the atmosphere via valve member 117.4.

The filter unit 130 is provided with a filter component 136 . The gas inlet 131.1 of the filter unit 130 is disposed on the upstream side of the filter component 136, and the self-cleaning gas outlet 134 and the clean gas outlet 131.2 are disposed on the downstream side of the filter component 136. It should be noted that “upstream” and “downstream” here are relative to the gas flow direction in the exhaust gas purification system 100 . The filter component 136 may be a steel ball filter or a paper filter, etc.

The filter unit 130 is also provided with a heating component 133 located below the filter component 136 for heating the filter component 136 .

The exhaust gas purification system 100 also includes a fan 124 for driving the flow of gas in the exhaust gas purification system 100 . In the embodiment shown in FIG. 1A , the fan 124 is provided in the filter unit 130 . More specifically, the fan 124 is disposed above the filter component 136. The air inlet side of the fan 124 is in fluid communication with the cavity in the filter unit 130, and the air outlet side of the fan 124 is in fluid communication with the clean air outlet 131.2 and the self-cleaning gas of the filter unit 130. The outlet 134 and the exhaust port 132 are in fluid communication. In other embodiments, other fluid power devices (such as blowers, pumps, etc.) can also be used to replace the fan 124 in the embodiment shown in FIG. 1A , as long as the gas in the exhaust gas purification system 100 can be driven to flow according to the expected path. That’s it.

The exhaust gas purification system 100 also includes a collection unit 140. The waste liquid outlet 141.1 of the first-stage cooling unit 110, the waste liquid outlet 141.2 of the second-stage cooling unit 120, and the waste liquid outlet 141.3 of the filter unit 130 are all connected with the collection unit 140, so as to This allows the liquid discharged from the first-stage cooling unit 110 , the second-stage cooling unit 120 and the filter unit 130 to flow into the collection unit 140 . A valve component 117.6 is provided at the inlet of the collection unit 140. When the collection unit 140 needs to be replaced or the liquid in the collection unit 140 needs to be poured out, closing the valve component 117.6 can separate the collection unit 140 from the first-stage cooling unit 110 and the second-stage cooling unit 110. The cooling unit 120 and the filter unit 130 are disconnected.

The exhaust gas purification system 100 further includes temperature detection components 151, 152 respectively configured to detect temperatures in the first-stage cooling unit 110 and the second-stage cooling unit 120.

It should be noted that, in the embodiment shown in FIG. 1 , the exhaust gas purification system 100 includes two-stage cooling units, and the two-stage cooling units are fluidly connected through the connecting channel 125.1. In other embodiments, the exhaust gas purification system may also include only the first-stage cooling unit 110 or the second-stage cooling unit 120 .

The exhaust gas purification system 100 has a working state and a maintenance state. In the working state, the exhaust gas purification system 100 purifies the gas discharged from the reflow oven furnace 118 . In the maintenance state, the exhaust gas purification system 100 no longer receives the gas discharged from the reflow oven furnace 118, but performs self-cleaning on the inside of the exhaust gas purification system 100. By controlling the opening and closing of each valve component 117.1, 117.2, 117.3, 117.4, 117.5, 117.6, the exhaust gas purification system 100 can be switched between the working state and the maintenance state. The following takes a reflow oven that uses a substantially inert gas (such as nitrogen) as the working gas as an example to illustrate the gas flow paths in the two working states of the exhaust gas purification system 100 in this case.

FIG. 1B illustrates the gas flow path when the exhaust gas purification system 100 in FIG. 1A is in operation. As shown in Figure 1B, when the exhaust gas purification system 100 is in working condition, the valve components 117.1, 117.2, 117.6 are opened, the valve component 117.3 and the valve component 117.4 are closed, and the channel switch component 117.5 can be closed, or at least partially opened. After the exhaust gas containing pollutants (temperature is approximately 170°C) in the reflow furnace furnace 118 is discharged from the high temperature area of the furnace 118, it is first cooled to a first temperature, such as 110~130°C, through the first-stage cooling unit 110. At this temperature, organic matter such as rosin in the exhaust gas pollutants in the first-stage cooling unit 110 condenses from gaseous state to liquid state and can be discharged into the collection unit 140 from the waste liquid outlet 141.1 of the first-stage cooling unit 110, and the remaining part The exhaust gas is then sent to the second-stage cooling unit 120 for further cooling. The gas entering the second-stage cooling unit 120 is cooled to a second temperature in the second-stage cooling unit 120, such as 60~80°C, so that other pollutant organic matter (such as low condensation point acids or esters) in the exhaust gas or ether organic matter) condenses from the gaseous state into the liquid state, and is discharged into the collection unit 140 through the waste liquid outlet 141.2 of the second-stage cooling unit 120. The remaining waste gas is transported to the filtering unit 130 for filtration and purification. After the exhaust gas entering the filter unit 130 is filtered, the particulate and mist organic matter in the exhaust gas is removed, so clean air can be obtained. Finally, the clean gas is transported back to the low temperature area of the reflow furnace furnace 118 to complete the purification of the waste gas.

When the exhaust gas purification system 100 is in operation, if the valve component 117.5 is closed, the clean air filtered by the filter unit 130 cannot return to the first-stage cooling unit 110 through the connecting channel 135. If the channel switch component 117.5 is opened or partially opened, a part of the clean air filtered by the filter unit 130 can return to the first-stage cooling unit 110 through the connecting channel 135, thereby taking advantage of the lower temperature in the filter unit 130. The clean air cools the gas in the first-stage cooling unit 110 to save cooling media used for heat exchange in the first-stage cooling unit 110 .

FIG. 1C illustrates the flow direction of gas when the exhaust gas purification system 100 is in a maintenance state. As shown in FIG. 1C , when the exhaust gas purification system 100 is in the maintenance state, the valve components 117.1, 117.2, 117.3, and 117.4 are disconnected, and the valve component 117.6 and the channel switch component 117.5 are opened. At this time, by heating the gas in the filter unit 130 through the heating component 133 in the filter unit 130, the temperature inside the filter unit 130 can be raised, for example, to about 150°C to 170°C. At this temperature, part of the solid pollutants attached to the filter component 136 is converted into a liquid state, and part is converted into a gaseous state. The liquid can be discharged through the waste liquid outlet 141.3 of the filter unit 130, while the gas passes through the connecting channel 135 at a higher temperature. Transported to the first-level cooling unit 110 and the second-level cooling unit 120 . The gas in the first-stage cooling unit 110 and the second-stage cooling unit 110 flows back to the filter unit 130 through the connecting channels 125.1, 125.2 as in the above exhaust gas purification process, so that the first-stage cooling unit 110 and the second-stage The solid form of pollutant organic matter attached to various components in the cooling unit 120 and on the inner walls of the connecting channel 125.1 and the cooling channel 125.2 is reheated into a liquid or gaseous state, and the liquid passes through the waste liquid outlet of the first-stage cooling unit 110 141.1 and the waste liquid outlet 141.2 of the second-stage cooling unit 120 are discharged, and the gas is transported back to the filter unit 130 to complete the self-cleaning gas cycle.

In the self-cleaning gas circulation program shown in FIG. 1C , since the valve components 117.1 and 117.2 are disconnected, the self-cleaning gas circulation program can be performed without affecting the operation of the reflow oven. That is to say, even if the reflow oven is in a working program, the exhaust gas purification system 100 can be in a maintenance state and perform self-cleaning inside it.

For a reflow oven that uses a substantially inert gas (such as nitrogen) as the working gas, the working gas in the furnace 118 needs to maintain a certain concentration range to meet process requirements. The reflow oven is usually provided with a unit for adjusting the concentration of the working gas in the furnace 118 (eg, a unit for replenishing the working gas). When the exhaust gas purification system 100 is in the working state, the gas in the furnace 118 of the reflow soldering furnace is continuously purified by the exhaust gas purification system 100 and sent back to the furnace 118 of the reflow soldering furnace. Therefore, the exhaust gas purification system 100 is in the working state. The concentration of the working gas is similar to the concentration unit of the working gas in the furnace 118 of the reflow oven. However, after the exhaust gas purification system 100 is disconnected from the furnace 118 of the reflow oven for self-cleaning maintenance, the concentration of the working gas in the exhaust gas purification system 100 will usually be smaller than the concentration of the working gas in the furnace 118 . Therefore, according to this case, after the maintenance status of the exhaust gas purification system 100 is completed (including maintenance procedures for self-cleaning gas circulation or maintenance procedures for other cleaning methods), before the exhaust gas purification system 100 is reconnected to the furnace 118 of the reflow oven , a certain amount of working gas can be added to the exhaust gas purification system 100 so that the working gas in the exhaust gas purification system 100 reaches the same or similar concentration as the working gas in the reflow oven. To this end, the working gas is replenished into the exhaust gas purification system 100 through the gas supply port 112, and at the same time, the gas in the exhaust gas purification system 100 is discharged through the exhaust port 132, until the gas concentration detection component 155 determines that the protective gas in the exhaust gas purification system 100 is The concentration reaches that of the protective gas in the reflow oven.

When the exhaust gas purification system 100 is used in a reflow oven that uses air as the working gas, the gas purified by the exhaust gas purification system 100 may be transported back to the furnace 118, or may not be transported back to the furnace 118, but directly discharged to the atmosphere. middle. If the purified gas of the exhaust gas purification system 100 is directly discharged into the atmosphere, then the clean gas outlet 131.2 of the filter unit 130 shown in FIG. 1B is controllably fluidly connected to the atmosphere through the valve component 117.2 instead of being connected to the furnace 118.

According to this case, the first-stage cooling unit 110 and the second-stage cooling unit 120 in the exhaust gas purification system 100 may adopt any known type of heat exchange device.

According to this case, the first-stage cooling unit 110, the second-stage cooling unit 120 and the filter unit 130 of the exhaust gas purification system 100 can be integrated together, so that the entire exhaust gas purification system 100 forms a box-type exhaust gas purification device to facilitate reflow soldering. Use with furnace.

Two specific structural examples of the exhaust gas purification device are introduced below. Figures 2A to 6 illustrate the specific structure of the exhaust gas purification device 200 according to one embodiment of the present case. Figures 7A to 11 illustrate another embodiment of the present case. The specific structure of the exhaust gas purification device 700.

2A-2C are schematic diagrams of the overall structure of the exhaust gas purification device 200, where FIG. 2A is a three-dimensional structural view of the exhaust gas purification device 200, FIG. 2B is a front view of FIG. 2A, and FIG. 2C is a top view of FIG. 2A. As shown in Figures 2A-2C, the exhaust gas purification device 200 includes a housing 201. The housing 201 is generally box-shaped with a cavity inside, and includes a top 202, a bottom 203, a left part 204, a right part 205, a front part 206 and a Rear 207. The top 202, bottom 203, left part 204, right part 205 and rear part 207 of the housing 201 are connected together to form a box cavity, for example by welding, and the front part 206 is detachably connected to the top 202 by, for example, buckles. and the bottom 203 to close the box cavity. The top 202, the bottom 203, the left 204, the right 205 and the front 206 are shown in Figure 2B, and the rear 207 is shown in Figure 2C.

As shown in Figures 2A-2C, the exhaust gas purification device 200 also includes an exhaust gas inlet 211.1 and a clean gas outlet 231.2 provided on the housing 201. The exhaust gas inlet 211.1 is provided with a connecting pipe 251.1, and the connecting pipe 251.1 is provided with a valve component 217.1. The valve part 217.1 can be opened and closed. The exhaust gas inlet 211.1 is connected to the high temperature zone (not shown in the figure) of the reflow furnace furnace through a connecting pipe 251.1. The clean gas outlet 231.2 is provided with a connecting pipe 251.2, and the connecting pipe 251.2 is provided with a valve component 217.2. The valve part 217.2 can be opened and closed. The clean gas outlet 231.2 is connected to the low temperature zone (not shown in the figure) of the reflow furnace furnace through a connecting pipe 251.2. The exhaust gas discharged from the furnace can enter the exhaust gas purification device 200 from the exhaust gas inlet 211.1. After being purified into clean gas by the exhaust gas purification device 200, it is then discharged from the clean gas outlet 231.2 to the low temperature zone of the reflow furnace furnace.

Viewed from the front of the exhaust gas purification device 200 as shown in Figure 2B, the exhaust gas inlet 211.1 is located at the rear of the right portion 205 of the housing 201, and the clean air outlet 231.2 is located at the left of the rear portion 207 of the housing 201. This makes the flow direction of the exhaust gas in the exhaust gas purification device 200 generally flow from right to left.

The front portion 206 of the housing 201 includes a first front panel 206.1 and a second front panel 206.2. The first front plate 206.1 is used to seal a part of the cavity inside the casing 201 from the front side (see the filter cavity 342 in Figure 3), and the second front plate 206.2 is used to seal another part of the cavity inside the casing 201 from the front side. cavity (see cooling volume 341 in Figure 3). The second front plate 206.2 is provided with several openings 271 for inserting the cooling device into the cooling cavity 341 through the openings 271 on the second front plate 206.2 (this will be described in detail in conjunction with FIG. 3).

The exhaust gas purification device 200 also includes a collection device, which is connected to the bottom 203 of the housing 201 . In the example shown in the figure, the collection device includes two collection bottles 240.1 and 240.2, each of which is connected to the bottom 203 of the housing 201 through a valve member 217.6, so that the contaminants condensed into liquid can be controllably discharged into Collect in bottles 240.1 and 240.2. The bottom 203 includes a bottom plate that gradually slopes downward in the direction from back to front, and the collection bottles 240.1 and 240.2 are connected to the front side of the bottom plate (see Figure 4). The collection bottle 240.1 is used to communicate with the filter cavity 342 (see Figure 3) inside the housing 201, and the collection bottle 240.2 is used to communicate with the cooling cavity 341 (see Figure 3) inside the housing 201. By arranging an inclined bottom plate, contaminants that have condensed into liquid can flow into the collection device more easily.

The exhaust gas purification device 200 also includes an exhaust port 232 and an air supply port 212 (see Figure 2C). As an example, the air supply port 212 is provided on the top 202 of the housing 201 near the exhaust gas inlet 211.1. The exhaust port 232 is provided on the pipe 251.1 connected to the clean gas outlet 231.2, and is located between the clean gas outlet 231.2 and the valve component 217.1. An oxygen concentration detection device 455 (see Figure 4) is provided at the bottom of the connecting pipe 251.1 at the clean gas outlet 231.2. The oxygen concentration detection device 455 is used to detect the oxygen concentration in the gas discharged from the clean gas outlet 231.2. Therefore, the flow direction of the protective gas supplied to the exhaust gas purification device 200 is also generally from right to left, so that the concentration of the working gas in the entire exhaust gas purification device 200 can be increased. The exhaust port 232 and the air supply port 212 are respectively provided with valve components, and the valve components are used to control the opening or closing of the exhaust port 232 and the air supply port 212, for example, through solenoid valve control. Those skilled in the art should know that in order to maintain the gas pressure in the exhaust gas purification device 200 within a certain range, the valve components on the exhaust port 232 and the air supply port 212 should be opened or closed at the same time. Of course, the exhaust port 232 and the air supply port 212 can also be arranged at other positions, as long as the gas can be controllably input into the exhaust gas purification device 200 through the air supply port 212, and the gas can be controllably discharged from the exhaust gas purification device 200 through the exhaust port 232. That is, Can. The exhaust gas purification device 200 also includes a fan 224. The driving component of the fan 224 is arranged on the left side of the top 202 of the housing 201, and the impeller of the fan 224 is arranged in the filter cavity 342 in the housing 201 (see Figure 5). The impeller of the fan 224 has an air inlet side and an air outlet side, where the air inlet side is in fluid communication with the filter chamber 342 and the air outlet side is in fluid communication with the clean air outlet 231.2.

The exhaust gas purification device 200 also includes temperature detectors 213.1, 213.2, 213.3, 213.4, 213.5 and 213.6. The temperature detectors 213.1 and 213.2 are respectively provided at the exhaust gas inlet 211.1 and the clean air outlet 231.2. The temperature detectors 213.3, 213.4 and 213.5 are connected to the rear portion 207 of the housing 201 and extend into the cooling cavity 341 of the exhaust gas purification device 200 ( See Figure 5). The temperature detector 213.6 is connected to the left part 204 of the housing 201 and extends into the filter chamber 342 (see Figure 5) of the exhaust gas purification device 200. As an example, temperature detectors 213.1, 213.2, 213.3, 213.4, 213.5 and 213.6 are thermocouples. In other examples, the exhaust gas purification device 200 may also include only a part of the temperature detectors or provide other types of temperature detectors.

The exhaust gas purification device 200 also includes a plurality of heating rods 222 . The heating rod 222 is also connected to the left portion 204 of the housing 201 and extends into the filter chamber 342 (see FIG. 5 ) of the exhaust gas purification device 200 to clean the filter chamber 342 during the self-cleaning procedure of the exhaust gas purification device 200 . Filter element 336 (see Figure 5) is heated. In other examples, other heating devices may be used instead of the heating rod 222 . Of course, the heating rod 222 may not be included in an exhaust gas purification device that does not require self-cleaning.

FIG. 3 is an exploded structural view of the exhaust gas purification device 200 , showing the internal structure and components of the exhaust gas purification device 200 . As shown in Figure 3, the interior of the housing 201 includes a partition plate 437 (see Figure 4 for the specific structure of the partition plate 437). The partition plate 437 divides the chamber inside the housing 201 into a cooling chamber 341 and a filter chamber. Cavity 342, the cooling cavity 341 is located on the right side of the filter cavity 342. And the partition plate 437 has an upper opening 432 and a lower opening 431 (see FIG. 4 ), and the upper opening 432 and the lower opening 431 can communicate with the cooling cavity 341 and the filtering cavity 342 . The cooling cavity 341 is connected to the exhaust gas inlet 211.1, and the filtering cavity 342 is connected to the clean gas outlet 231.2. A cooling device is provided in the cooling chamber 341, and the cooling device is used to reduce the temperature of the gas in the cooling chamber 341. The cooling device includes a first-level cooling device 310 and a second-level cooling device 320. The first-level cooling device 310 is located on the right side of the second-level cooling device 320. After the gas enters the cooling chamber 341 from the exhaust gas inlet 211.1, it flows through the first-stage cooling device 310 and the second-stage cooling device 320 from right to left. A filter component 336 is provided in the filter cavity 342, and the filter component 336 is installed transversely in the filter cavity 342, so that after the gas enters the filter cavity 342, it can flow through the filter component 336 from bottom to top to clean the air above the filter component 336. The air outlet 231.2 flows out of the filter chamber 342.

The cooling cavity 341 is also provided with a hoarding 327, which is disposed at the top of the cooling device at the rear side. The hoarding 327 and the housing 201 together form a part of the connection channel through which the self-cleaning gas flows, which will be in the cooling chamber 341. Described in detail later.

After the waste gas is discharged from the high-temperature area of the reflow furnace furnace, it enters the waste gas purification device 200 from the waste gas inlet 211.1, where the rosin and other pollutants in the waste gas are removed by the first-stage cooling device 310 and the second-stage cooling device 320 through the cooling chamber 341. It condenses from gaseous state into liquid state and is discharged into the collection bottle 240.2. The remaining gas in the exhaust gas flows into the filter chamber 342 through the opening 431, and is filtered into clean gas by the filter component 336 in the filter chamber 342. Finally, the clean gas is It is discharged from the clean gas outlet 231.2 to the low temperature area of the reflow oven furnace.

It should be noted that the cooling cavity 341 can also be arranged on the left side of the filter cavity 342, but in this case, the exhaust gas inlet 211.1 needs to be located at the left part 204 of the housing to maintain communication with the cooling cavity 341, and the clean gas outlet 231.2 The right portion 205 of the housing maintains communication with the filter volume 342 .

As still shown in FIG. 3 , the first-stage cooling device 310 includes a plurality of cooling plates 315 , and the second-stage cooling device 320 includes a plurality of cooling plates 317 . Each cooling plate 315, 317 can contain cooling media inside. The cooling medium in the cooling plates 315 and 317 exchanges heat with the exhaust gas through the outer peripheral side walls of the cooling plates 315 and 317 to reduce the temperature of the exhaust gas. Each of the openings 271 of the second front plate 206.2 of the housing is sized to match the size of a corresponding cooling plate 315 or 317, such that each cooling plate 315 or 317 is inserted into the corresponding opening 271. Finally, the corresponding opening 271 can be sealed. The end plate of each cooling plate 315 or 317 located outside the housing 201 is provided with a cooling medium inlet 355 or 357 and a cooling medium outlet 365 or 367. Through the cooling medium inlet 355 or 357, the cooling medium can be fed into the corresponding cooling plate 315 or 317. The cooling medium is added, and the cooling medium in the corresponding cooling plate 315 or 317 can be discharged through the cooling medium outlet 365 or 367. The cooling medium inlet 355 or 357 and the cooling medium outlet 365 or 367 can be sealed.

In the embodiment shown in FIG. 3 , the cooling medium in the cooling plates 315 of the first-stage cooling device 310 is compressed gas, and the cooling medium in the cooling plates 317 of the second-stage cooling device 320 is air. Mufflers 208 (see FIG. 2A ) are provided at the cooling medium outlets 365 of the cooling plates 315 of the first-stage cooling device 310 to reduce the noise caused by the flow of compressed gas. The cooling medium inlet 357 of the cooling plates 317 of the second-stage cooling device 320 is also provided with a filter, and is connected to a gas pipeline 318 and an exhaust fan 319, so that air can be input from the cooling medium inlet 357 at a certain speed. and output from the cooling medium outlet 367. Of course, those skilled in the art can also choose other types of cooling media, such as cooling water, according to the actual working environment.

FIG. 4 is a cross-sectional view along line A-A in FIG. 2B , showing the specific structure of the partition plate 437 . As shown in FIG. 4 , the internal partition plate 437 of the housing 201 is connected between the top 202 and the bottom 203 of the housing 201 for separating the cooling cavity 341 and the filtering cavity 342 . The partition plate 437 is provided with an upper opening 432 and a lower opening 431, wherein the upper opening 432 is positioned higher in the housing than the filter component 336 (not shown in Figure 4), and the lower opening 431 is positioned higher in the housing. lower than filter element 336 (not shown in Figure 4). The upper opening 432 is in fluid communication with the air outlet side 584 of the impeller 580 of the fan 224 (see Figure 5 ).

The enclosure 327 has an L-shaped cross-section and includes interconnected horizontal plates 425 and vertical plates 426 , wherein the horizontal plates 425 abut or substantially abut against the rear portion 207 of the housing 201 , and the vertical plates 426 abut against the housing 201 The top 202 of the housing 201 such that the enclosure 327 and the housing 201 together form a connection channel 635 (see FIG. 6 ). The connection channel 635 is aligned with and communicates with the upper opening 432 of the partition plate 437 , so that the gas in the filter chamber 342 can enter the connection channel 635 through the upper opening 432 of the partition plate 437 .

Therefore, the gas in the cooling cavity 341 can flow into the filter cavity 342 through the lower opening 431 , flow from bottom to top in the filter cavity 342 , and be filtered by the filter component 336 into clean gas. Moreover, a part of the filtered clean gas in the filter cavity 342 can be discharged to the reflow oven through the clean gas outlet 231.2, and the other part of the clean gas flows through the upper opening 432 through the connecting channel 635 and then flows back to the cooling cavity 341.

FIG. 5 is a cross-sectional view along line B-B in FIG. 2C , showing the specific structures of the first-stage cooling device 310 , the second-stage cooling device 320 and the filter component 336 , and illustrating the flow path of the gas in the exhaust gas purification process. As shown in FIG. 5 , the first-stage cooling device 310 includes four cooling plates 315 , and the second-stage cooling device 320 includes two cooling plates 317 .

The four cooling plates 315 are arranged transversely of the housing 201 (that is, arranged in the left-right direction). Each cooling plate 315 has a cavity 546.1 that communicates with the cooling medium inlet 355 and the cooling medium outlet 365 on the housing 201 so that compressed air as the cooling medium can flow into and out of the cavity 546.1 of the cooling plate 315. The two cooling plates 317 are also arranged laterally (that is, arranged in the left and right direction). Each cooling plate 317 has a cavity 546.2. The cavity 546.2 is connected with the cooling medium inlet 357 and the cooling medium outlet 367 on the housing 201, so that the air The cooling medium can flow into and out of the cavity 546.2 of the cooling plate 317. Each cooling plate 315 and 317 is made of a thermally conductive material, such as metal, so that the gas around the cooling plate 315 and 317 can conduct heat exchange with the cooling medium contained in the cooling plate 315 and 317 . By adjusting the speed of the cooling medium flowing into or out of the cooling plates 315 and 317, the gas in the first-stage cooling device 310 and the second-stage cooling device 320 can be cooled to a certain temperature range.

Each cooling plate 315, 317 is placed vertically (ie, placed in a direction perpendicular to the top 202 and bottom 203 of the housing), and a vertical gas channel 548 is formed between every two adjacent cooling plates. Each cooling plate 315, 317 has two left and right side walls. When the exhaust gas in the cooling cavity 341 flows through the vertical gas channel 548, the exhaust gas carries out heat exchange with the cooling media in the cavity 546.1 and the cavity 546.2 through the left and right side walls of the cooling plate 315, 317. , lowering the temperature of the exhaust gas. As the exhaust gas decreases, a part of the pollutants in the exhaust gas can condense into liquid and flow down to the bottom 203 of the housing along the left and right side walls of the cooling plates 315, 317. It should be noted that, for the leftmost cooling plate, in addition to forming a vertical gas channel 548 between the cooling plate and the adjacent cooling plate on the right, it also forms a vertical gas channel with the partition plate 437 on the left. 548. Similarly, for the rightmost cooling plate, in addition to the vertical gas channel 548 formed between the cooling plate and the adjacent cooling plate on the left side, the cooling plate also forms a vertical gas channel 548 with the right part 205 of the housing.

Moreover, each cooling plate 315, 317 also forms a bottom transverse gas channel 549.2 with the bottom 203 of the housing or a top transverse gas channel 549.1 with the top 202 of the housing. Each of the top transverse gas channel 549.1 and the bottom transverse gas channel 549.2 is connected with at least one vertical gas channel 548 to form a gas channel 550 for exhaust gas flow. As an example, the top lateral gas channels 549.1 and the bottom lateral gas channels 549.2 are alternately arranged in the arrangement direction of the cooling plates 315, 317 to form a curved gas channel 550 as shown in Figure 5. The exhaust gas inlet 211.1 is connected to the rightmost vertical gas channel 548, and the lower opening 431 of the partition plate is connected to the leftmost vertical gas channel 548, so that exhaust gas can flow into the gas channel 550 from the rightmost vertical gas channel 548. , and flows out of the gas channel 550 from the leftmost vertical gas channel 548. In other embodiments, the top transverse gas channel, the bottom transverse channel and the vertical gas channel can also be arranged in other arrangements to form other gas channels, as long as the exhaust gas can flow in the gas channel and flow through each cooling block Just use the board.

As those skilled in the art should know, in this embodiment, in order to form the curved gas channel 550, each cooling plate 315, 317 only forms one of the bottom lateral gas channel 549.2 or the top lateral gas channel 549.1. When the bottom transverse gas channel 549.2 is formed between the cooling plates 315, 317 and the casing bottom 203, the cooling plates 315, 317 need to abut the casing top 202 or block the gap between them in other ways, so that the fluid cannot flow from the cooling plates 315, 317 and the top 202 of the housing. Similarly, when the top transverse gas channel 549.2 is formed between the cooling plate and the top of the housing 202, the cooling plates 315, 317 need to abut the bottom of the housing 203 or otherwise block the gap between the two, so that the fluid cannot be cooled from the cooling plate. Between the plates 315, 317 and the bottom 203 of the housing.

In the embodiment shown in Figure 5, there are three cooling plates 315, 317 forming a top transverse gas channel 549.1 between the top 202 of the housing. A set of sealing plates 554 connected to the bottom 203 of the housing are respectively provided at positions where the three cooling plates 315 and 317 are close to the bottom 203 of the housing. Each set of sealing plates 554 includes two sealing plates 554 which are respectively pressed against the left and right sides of the lower part of the corresponding cooling plates 315 and 317 to block the gap between the cooling plates 315 and 317 and the bottom of the housing 203 so that fluid cannot flow from the cooling plates. 315, 317 and the bottom 203 of the housing. By providing the sealing plate 554 , even when the casing bottom 203 has an inclined shape as shown in FIG. 4 , fluid can be blocked from flowing between the cooling plates 315 and 317 and the casing bottom 203 . Of course, those skilled in the art can also directly design the shape of the cooling plate without providing the sealing plate 554 so that the cooling plate matches the shape of the bottom 203 of the housing.

As shown in Figure 5, the temperature detector 213.3 is used to detect the gas temperature at the gas inlet of the first-stage cooling device 310, and the temperature detector 213.4 is used to detect the gas temperature at the gas outlet of the first-stage cooling device 310. Temperature detection The detector 213.5 is used to detect the gas temperature at the gas outlet of the second-stage cooling device 320, and the temperature detector 213.6 is used to detect the gas temperature in the filtering device. These temperature detectors can instantly detect the gas temperature in the exhaust gas purification device 200 and adjust the flow rate of the cooling medium according to the temperature condition. When the detected gas temperature is too high, or the effect of adjusting the flow rate of the cooling medium on the gas temperature is not obvious, the exhaust gas purification device 200 may need to be self-cleaned.

The filter component 336 is disposed in the middle of the filter chamber 342, dividing the filter chamber 342 into two upper and lower sub-cavities, where the lower sub-cavity is connected to the lower opening 431 of the partition plate, and the impeller 580 of the fan 224 is disposed in the upper part. in the sub-cavity, so that the air inlet side 582 of the impeller 580 of the fan 224 is in fluid communication with the upper sub-cavity. The air outlet side 584 of the impeller 580 of the fan 224 is in fluid communication with the clean air outlet 231.2 and the upper opening 432 of the partition plate. When the impeller 580 rotates, the gas can flow in the cooling chamber 341 and the filter chamber 342 in the direction of the arrow shown in FIG. 5 . As an example, the filter component 336 is a steel ball filter, which is beneficial to heat conduction and can be cleaned for reuse to save costs.

It should be noted that when the cooling cavity maintains a certain size, the lateral width of the cooling plate 315 of the first-stage cooling device 310 should be as small as possible while accommodating enough cooling media, so that the exhaust gas flows through the first-stage cooling device 310 . The rosin condensed into liquid during the primary cooling device 310 can be less accumulated on the top of the cooling plate 315 . Therefore, the first-stage cooling device 310 includes cooling plates 315 with a smaller transverse width but a larger number, while the second-stage cooling device 320 includes cooling plates 317 with a larger transverse width but a smaller number. In the embodiment shown in FIG. 5 , the lateral width of the cooling plate 315 of the first-stage cooling device 310 is one third of the lateral width of the cooling plate 317 of the second-stage cooling device 320 . In other embodiments, other numbers of cooling plates 315 and 317 can also be provided, and the lateral widths of the cooling plates 315 and 317 can also be in other proportions, as long as it is ensured that the cooling media contained in the cooling plates 315 and 317 is sufficient to cool the exhaust gas. to the desired temperature.

Figure 6 is a schematic three-dimensional structural diagram of the cooling device in the exhaust gas purification device 200 in Figure 5. It is used to show the specific structure and positional relationship of the cooling plate, the partition plate 437 and the enclosure plate 327 to illustrate the self-cleaning gas circulation program. flow path. In order to show the internal structure of the cooling plates 315, 317, the end plates of the cooling plates 315, 317 (ie, the end plates with the cooling medium inlet and outlet shown in FIG. 3) are removed in FIG. 6. As shown in FIG. 6 , the partition plate 437 , the cooling plate 315 and the cooling plate 317 in the exhaust gas purification device 200 are vertically placed substantially parallel and spaced apart from each other to form the gas passage 550 as mentioned above.

The enclosure 327 is provided on the rear side and above the cooling plate 315 and the cooling plate 317, and extends in the left-right direction. As an example of an arrangement, a part of the cooling plate, such as the part of the cooling plate that forms the bottom transverse gas channel 549.2 between the bottom of the housing 203 and the bottom part of the cooling plate 203, has a step-shaped support portion on the rear side of the top. This step-shaped support portion is used to accommodate the L-shaped enclosure 327 . This arrangement can make the structure of the exhaust gas purification device 200 more compact. Those skilled in the art should know that the enclosure 327 does not need to be L-shaped or the cooling plate is not provided with a support, etc., as long as the cooling plate, enclosure 327 and shell can be sealed as required to form a gas Channel 550 is sufficient.

Through the above arrangement, the enclosure 327 can form a connecting channel 635 with the housing 201. Both ends of the connecting channel 635 have a self-cleaning gas outlet 634 and a self-cleaning gas inlet 614, where the self-cleaning gas outlet 634 is connected to the upper opening of the partition plate 437. 432 is connected, the self-cleaning gas inlet 614 is in fluid communication with the cooling chamber 341 at the first-stage cooling device 310 . As an example, self-cleaning gas inlet 614 is located near exhaust gas inlet 211.1.

As an example, the size of the upper opening 432 of the partition plate 437 can be adjusted, so that the gas in the filter chamber 342 can controllably flow into the connecting channel 635. In the embodiment of this case, an adjustable baffle 638 is movably connected to the partition plate 437. The adjustable baffle 638 can move forward and backward to cover the upper opening 432 or open the upper opening 432. The upper opening 432 can also be adjusted. the size of the opening. The adjustable baffle 638 is provided with a guide groove 661, and the partition plate 437 is provided with a guide pin 662 inserted into the guide groove 661 to achieve a movable connection between the adjustable baffle 638 and the partition plate 437.

Therefore, when the exhaust gas purification device 200 is in the maintenance state, the gas in the filter chamber 342 can flow into the connecting channel 635 through the upper opening 432, and flow to the first-stage cooling device 310 through the connecting channel 635.

As still shown in Figure 6, the cavity 546.1 inside the cooling plate 315 includes a flow equalizing plate 656.1. Similarly, the cavity 546.2 inside the cooling plate 317 includes a flow equalizing plate 656.2. Each flow equalizing plate is provided with a plurality of flow plates. hole. As an example, the flow equalizing plate 656.1 is provided with a plurality of circular holes 658.1 evenly, and the flow equalizing plate 656.2 is provided with a plurality of elongated holes 658.2. The flow equalizing plates 656.1 and 656.2 are respectively provided on the flow path of the cooling medium in the cavities 546.1 and 546.2, so that the cooling medium can pass through the through holes and flow evenly and stably. For the cooling plate 317, the air flows from the cooling medium inlet 357 into the cavity 546.2 of the cooling plate, passes through the flow equalizing plate 656.2 from bottom to top, and then flows out from the cooling medium outlet 367, and exchanges heat with the exhaust gas through the side wall of the cooling plate 317. . For the cooling plate 315, the compressed gas flows from the cooling medium inlet 355 into the cavity 546.1 of the cooling plate 315, passes through the flow equalizing plate 656.1 from bottom to top, then flows out from the cooling medium outlet 365, and interacts with the exhaust gas through the side wall of the cooling plate 315. heat exchange.

The general purification process of waste gas in the waste gas purification device 200 is as follows: after the waste gas containing pollutants (temperature is approximately 170°C) is discharged from the high temperature area of the reflow furnace furnace, it enters the gas channel 550 from the waste gas inlet 211.1. When the exhaust gas flows through the cooling plate 315 in the first-stage cooling device 310, the exhaust gas is cooled to approximately 110~130°C (at the outlet of the first-stage cooling device 310) by adjusting the flow of compressed air into and out of the cooling plate 315. gas temperature, measured by the temperature detection device 213.4). At this temperature, organic matter such as rosin and other fluxes in the exhaust gas condenses from gaseous state to liquid state and can be discharged into the collection bottle 240.2. The remaining part of the exhaust gas flows through the cooling plate 317 in the second-stage cooling device 320. By adjusting the flow of air into and out of the cooling plate 317, the remaining part of the exhaust gas is cooled to about 60~80°C (the second-stage cooling device 320 outlet gas temperature, measured by the temperature detection device 213.5), at this temperature, other pollutant organic matter in the exhaust gas, such as acids or esters or ether organic matter with low freezing point, condenses from gaseous state to liquid state, and Can be drained into collection bottle 240.2. The remaining exhaust gas flows into the filter chamber 342 through the lower opening 431 of the partition plate 437, and then flows through the filter component 336 from bottom to top, and is filtered by the filter component 336 to remove particulate and mist organic matter therein to obtain Clean air. Finally, most of the clean gas is discharged from the clean gas outlet 231.2 to the low temperature area of the reflow oven furnace to complete the purification process of the waste gas. A small part of the clean gas can flow back to the first stage through the upper opening 432 and the connecting channel 635 It is mixed with the exhaust gas in the cooling device 310 and reduces the temperature of the exhaust gas. Adjusting the opening size of the upper opening 431 can change the amount of clean air flowing back to the first-stage cooling device 310 through the upper opening 432 and the connecting channel 635 . Of course, the upper opening 431 can also be completely closed to prevent the clean air from flowing back to the first-stage cooling device 310 through the upper opening 432 and the connecting channel 635 .

The self-cleaning procedure of the exhaust gas purification device 200 is as follows: close the exhaust gas inlet 211.1 and the clean gas outlet 231.2 through the valve components 217.1 and 217.2, and use the heater 222 to heat the gas in the filter chamber 342 until the temperature in the filter chamber 342 rises. to about 150°C ~ 170°C (measured by the temperature detection device 213.6), so that part of the solid contaminants attached to the filter component 336 is converted into a liquid state, and part is converted into a gaseous state, where the liquid contaminants flow to the bottom 203 of the housing. The high-temperature gaseous pollutants flow from bottom to top to the upper opening 432 of the partition plate under the action of the fan 224, and then flow through the connecting channel 635 and are transported back to the first-stage cooling device 310 and the second-stage cooling device 320, and The solid form of pollutants attached to the surfaces of components such as the inner wall of the casing, the outer wall of the cooling device, the enclosure 327 and the filter component 336 in the exhaust gas purification device 200 are reheated into a liquid state to be cleaned. The liquid contaminants at the bottom 203 of the housing are collected by collection devices 240.1 and 240.2.

After the self-cleaning process is completed, working gas such as nitrogen is replenished into the exhaust gas purification device 200 through the gas replenishment port 212 , and the gas in the exhaust gas purification device 200 is discharged from the exhaust port 232 . After detecting that the oxygen concentration in the exhaust gas purification device 200 reaches the requirement, the exhaust gas purification device 200 is connected to the furnace of the reflow soldering furnace.

7A to 11 illustrate the structure of an exhaust gas purification device 700 according to another embodiment of the present invention. The difference between the exhaust gas purification device 700 and the exhaust gas purification device 200 mainly lies in the specific structure of the cooling device.

7A to 7C are schematic diagrams of the overall structure of the exhaust gas purification device 700, where FIG. 7A is a three-dimensional structural view of the exhaust gas purification device 700, FIG. 7B is a front view of FIG. 7A, and FIG. 7C is a top view of FIG. 7A. As shown in Figures 7A-7C, the exhaust gas purification device 700 includes a casing 701. The casing 701 has a similar structure to the casing 201 of the exhaust gas purification device 200, including a top 702, a bottom 703, a left part 704, a right part 705, and a front part. Part 706 and rear part 707 will not be repeated here.

The clean air outlet 731.2 of the exhaust gas purification device 700 is disposed on the left side of the rear portion 707 of the housing 701. Different from the exhaust gas inlet 211.1 of the exhaust gas purification device 200, the exhaust gas inlet 711.1 of the exhaust gas purification device 700 is disposed on the rear portion 707 of the housing 701, and the exhaust gas inlet 711.1 is disposed on the right side of the rear portion 707 of the housing 701. Correspondingly, the air supply port 712 is also located on the rear side of the top 702 of the housing 701, near the exhaust gas inlet 711.1. The positions of the exhaust port 732 and the oxygen concentration detection device 955 (see Figure 9) remain unchanged.

The front portion 706 of the housing 701 includes a first front panel 706.1 and a second front panel 706.2. The second front plate 706.2 is also provided with a plurality of openings 771 for inserting the cooling device into the second cooling cavity 862. The exhaust gas purification device 700 also includes collection bottles 740.1 and 740.2 connected to the bottom 703 of the housing, and a fan 724 connected to the top 702 of the housing.

FIG. 8 is an exploded structural view of the exhaust gas purification device 700 , showing the cooling chamber 841 and the filtering chamber 842 inside the exhaust gas purification device 700 to illustrate the flow direction of gas in the exhaust gas purification device 700 . As shown in Figure 8, the interior of the housing 701 includes a partition plate 937 (the structure of the partition plate 937 is the same as the partition plate 437, see Figure 9 for details). The partition plate 937 divides the interior of the housing 701 into cooling chambers. 841 and the filter chamber 842, the cooling chamber 841 and the filter chamber 842 are connected through the lower opening 931 (see Figure 9) of the partition plate 937. The cooling chamber 841 includes a first cooling chamber 861 and a second cooling chamber 862. The first cooling chamber 861 is provided with a first-stage cooling device 810, and the second cooling chamber 862 is provided with a second-stage cooling device. 820. After the gas enters the cooling chamber 841 from the exhaust gas inlet 711.1, it flows through the first-stage cooling device 810 and the second-stage cooling device 820 from right to left. The filter cavity 842 includes a filter component 836. After the gas enters the filter cavity 842, it flows through the filter component 836 from bottom to top, and can flow out of the filter cavity 842 from the clean air outlet 731.2. The structure of the second-stage cooling device 820 is the same as the structure of the second-stage cooling device 320 in the exhaust gas purification device 200, and will not be described again here. An L-shaped enclosure 827 is provided on the rear side of the upper part of the second-stage cooling device 820. Different from the enclosure 327 in the exhaust gas purification device 200 shown in FIG. 2A-6, the enclosure 827 is only provided on the second-stage cooling device 820. stage cooling device 820.

As still shown in FIG. 8 , the first-stage cooling device 810 includes cooling fins 863 and cooling tubes 865 . Each cooling tube 865 can accommodate a cooling medium inside. The cooling medium in the cooling tube 865 exchanges heat with the exhaust gas through the cooling fins 863 . The second-stage cooling device 820 includes several cooling plates 817, and the size of the cooling plates 817 matches the openings 771 on the second front plate 706.2. As can be seen from the front of the housing, the first-stage cooling device 810 is provided with a cooling medium inlet 855 and a cooling medium outlet 815, and the second-stage cooling device 820 is provided with a cooling medium inlet 857 and a cooling medium outlet 816. It should be noted that the two sets of cooling media inlets 855 and cooling media outlets 815 are not arranged side by side. One set of cooling media inlets 855 and cooling media outlets 815 are relatively close to each other, while the other set of cooling media inlets 855 and cooling media outlets 815 are relatively close to each other. are far apart (see Figure 7B). In the embodiment shown in FIG. 8 , the cooling medium in the cooling pipe 865 of the first-stage cooling device 810 is compressed gas, and the cooling medium in the cooling plates 817 of the second-stage cooling device 820 is air. A muffler 708 is also provided at each cooling medium outlet 815 of the first-stage cooling device 810 .

FIG. 9 is a cross-sectional view along line A-A in FIG. 7B , showing the specific structure of the partition plate 937 . The partition plate 937 is similar in structure to the partition plate 437 in the exhaust gas purification device 200 shown in FIG. 2A-6 , and also has an upper opening 932 and a lower opening 931 . And the enclosure 827 includes a horizontal plate 925 and a vertical plate 926, which together with the housing 701 form a connection channel 1135 (see Figure 11). The upper opening 932 is also in fluid communication with the air outlet side 1084 (see Figure 10) of the impeller 1080 of the fan 724.

10A and 10B are used to show the specific structures of the first-stage cooling device 810, the second-stage cooling device 820 and the filter component 836 to illustrate the flow path of the gas in the exhaust gas purification process. FIG. 10A is a cross-sectional view along line B-B in FIG. 7C , and FIG. 10B is a cross-sectional view along line C-C in FIG. 10A . In order to more clearly display the specific structure of the first cooling device 810 , only the first cooling device 810 is illustrated in FIG. 10B . A cooling device 810 with other components removed.

As shown in FIGS. 10A and 10B , the first-stage cooling device 810 includes four layers of cooling fins 863 and four layers of cooling tubes 865 , and the four layers of cooling tubes 865 contain cooling media. The cooling pipe 865 is connected to the cooling fin 863, and the cooling fin 863 performs heat exchange with the exhaust gas to reduce the temperature of the exhaust gas.

Four layers of cooling fins 863 are arranged longitudinally (that is, arranged in the up and down direction), each layer of cooling fins 863 is placed transversely (that is, placed in the left and right direction), and there is a certain distance between two adjacent layers of cooling fins 863 . Cooling tube 865 has cavity 1046.1. The cooling fin 863 is made of a thermally conductive material, such as metal, so that the exhaust gas in the first cooling cavity 861 can heat transfer with the cooling medium in the cavity 1046.1 of the cooling tube 865 through the heat transfer of the cooling fin 863 Exchange.

Each layer of cooling fins 863 is generally U-shaped and has a through groove 1064 and a side groove 1072 (see also FIG. 11 ), where the through groove 1064 is provided at the bottom 1066 of the cooling fin 863 and extends in the left-right direction. The exhaust gas passes through the slot 1064 at the bottom of the cooling fin 863 to form a longitudinal gas flow 1068 from top to bottom. It should be noted that since the exhaust gas inlet 711.1 is provided on the rear side of the housing, the exhaust gas will flow from back to front in addition to flowing from top to bottom. The side grooves 1072 are provided on the two side walls 1067 of the cooling fin 863, and the two ends of the through groove 1064 are respectively connected with a pair of side grooves 1072. The cooling tube 865 passes through a pair of side grooves 1072 to support the cooling fins 863 so that the cooling fins 863 are detachably connected to the cooling tube 865.

Each layer of cooling fins is provided with several through-slots 1064 , and at least part of the through-slots 1064 in two adjacent layers of cooling fins 863 are staggered, so that the exhaust gas does not pass through each layer of cooling fins 863 in a straight line from top to bottom, but along a curved path. The paths pass through each layer of cooling fins, thereby enabling better heat exchange with the cooling tubes 865 and cooling fins 863 . In the example shown in FIGS. 10A and 10B , the through grooves 1064 of the first and second layers of cooling fins 863 are staggered, and the through grooves 1064 of the third and fourth layers of cooling fins 863 are staggered.

The number of cooling pipes 865 and side grooves 1072 is provided corresponding to the number of through grooves 1064 . And the cooling pipes 865 of each layer are connected with the cooling medium inlet 855 and the cooling medium outlet 815 on the housing 701, so that the compressed air as the cooling medium can flow into the cooling pipes 865 and flow out from the cooling pipes 865. As an example, after the cooling pipes 865 of each layer are merged together through the input main pipe 1081 and/or the output main pipe 1085 (see also FIG. 11 ), the input main pipe 1081 and the output main pipe 1085 are connected to the cooling medium inlet on the shell 701 855 and cooling media outlet 815 are connected. The input main pipe 1081 and the output main pipe 1085 are pipes extending in the front-rear direction, one end of which is closed, and the other end is connected to the cooling medium inlet 855 or the cooling medium outlet 815.

As an example, the corresponding cooling pipes of the first and fourth layers are connected together to form a U-shaped cooling pipe with an opening on the right side, in which the U-shaped cooling pipe nozzle of the first layer is connected to the output main pipe 1085, and the U-shaped cooling pipe of the fourth layer is connected to the output main pipe 1085. The U-shaped cooling pipe nozzle is connected to the input main pipe 1081. Similarly, the cooling pipes on the second and third floors are connected together to form a U-shaped cooling pipe with an opening on the left. The U-shaped cooling pipe on the second floor is connected to the output main pipe 1085, and the U-shaped cooling pipe on the third floor is connected to the output main pipe 1085. The pipe mouth is connected to the input main pipe 1081. Therefore, it is sufficient to provide only two sets of cooling medium inlet 855 and cooling medium outlet 815 on the housing 701 . In other embodiments, separate input manifolds and output manifolds may be provided at both ends of the cooling pipes of each layer to connect to the shell 701. In this case, four sets of cooling medium inlets and cooling media outlets need to be provided on the shell.

In the example shown in the figure, the first and fourth layers of cooling tubes 865 include six cooling tubes, while the second and third layers include five cooling tubes.

Therefore, the cooling pipe 865 can expand the area for heat exchange with the longitudinal gas flow 1068 through the cooling fins 863, so that the temperature of the longitudinal gas flow 1068 formed by the exhaust gas is reduced, and part of the pollutants in the exhaust gas can be condensed into liquid and passed through the channel 1064. Flows from top to bottom to the bottom 703 of the housing.

The second-stage cooling device 820 includes two cooling plates 817. Each cooling plate 817 has the same structure as the cooling plate 317 in FIG. 5 to form a vertical gas channel 1048. The cooling plate 817 has a cavity 1046.2 for accommodating a cooling medium (such as air). The cavity 1046.2 is connected with the air inlet 716.1 and the air outlet 716.2 on the housing 701 so that air can flow into and out of the cooling plate 817 as the cooling medium. The bottom lateral gas channel 1049.2 is formed between the cooling plate 817 on the right side and the bottom 703 of the casing, and the top lateral gas channel 1049.1 is formed between the cooling plate 817 on the left side and the top 702 of the casing. The top lateral gas channel 1049.1 and the bottom lateral gas channel 1049.2 are in fluid communication with the vertical gas channel 1048 to form a curved gas cooling channel 1050. And the bottom transverse gas channel 1049.2 is connected with the first-stage cooling device 810, so that the longitudinal gas flow 1068 in the first cooling chamber 861 can enter the gas cooling channel 1050 after passing through the first-stage cooling device 810 from top to bottom.

Returning to Figure 10A, similarly, the filter component 836 is disposed in the middle of the filter chamber 842, dividing the filter chamber 842 into two upper and lower sub-cavities, where the lower sub-cavity is connected to the lower opening 931 of the partition plate, and the upper part is connected to the lower opening 931 of the partition plate. The sub-cavity is connected with the clean air outlet 731.2 and the upper opening 932 of the partition plate. The impeller 1080 of the fan 724 is disposed in the upper sub-chamber, so that the air inlet side 1082 of the impeller 1080 of the fan 724 is in fluid communication with the upper sub-chamber. The air outlet side 1084 of the impeller 1080 of the fan 724 is in fluid communication with the clean air outlet 731.2 and the upper opening 932 of the partition plate. When the impeller 1080 rotates, the gas can flow in the cooling chamber 841 and the filter chamber 842 in the direction of the arrow shown in FIG. 10A . As an example, the filter component 836 is also a steel ball filter.

It should be noted that the first-stage cooling device 810 in this embodiment can also be any finished fin heat exchanger known to those skilled in the art to save costs.

Figure 11 is a schematic three-dimensional structural diagram of the cooling device in the exhaust gas purification device 700 of this case, which is used to show the specific structure and positional relationship of the first-stage cooling device 810, the second-stage cooling device 820, the partition plate 937 and the enclosure plate 827. Similar to the exhaust gas purification device 200 , a step-shaped slot for accommodating the enclosure plate 827 is provided on the top rear side of the right cooling plate 817 in the second-stage cooling device 820 . The enclosure 827 can form a connecting channel 1135 with the housing 701. The connecting channel 1135 has a self-cleaning gas outlet 1134 and a self-cleaning gas inlet 1114. The self-cleaning gas outlet 1134 is connected to the upper opening 932 of the partition plate 937. The self-cleaning gas Inlet 1114 communicates with exhaust gas inlet 711.1. In this embodiment, since the position of the exhaust gas inlet 711.1 is relatively close to the second-stage cooling device 820, the enclosure 827 only needs to be disposed behind the second-stage cooling device 820 so that the self-cleaning gas inlet of the connecting channel 1135 can be 1114 is connected to the exhaust gas inlet 711.1.

Similarly, an adjustable baffle 1138 is also connected to the partition plate 937 to adjust the opening size of the upper opening 932 . This arrangement enables a part of the gas in the upper sub-cavity of the filter chamber 342 to be discharged into the reflow oven from the clean gas outlet 731.2, and the other part of the gas flows into the connecting channel 1135 through the upper opening 932, and flows to the exhaust gas through the connecting channel 1135. Near entrance 711.1.

The cavity 1046.2 inside the cooling plate 817 includes a flow equalizing plate 1156, and each flow equalizing plate is provided with a plurality of elongated holes 1158.

The general purification process of waste gas in the waste gas purification device 700 is as follows: after the waste gas containing pollutants (temperature is approximately 170°C) is discharged from the high temperature area of the reflow furnace furnace, it enters the first cooling chamber 861 from the waste gas inlet 711.1. The exhaust gas first flows through the first-stage cooling device 810 from top to bottom and from back to front. By adjusting the speed of the compressed air flowing in and out of the cooling pipe 865, the exhaust gas is cooled to a gas temperature of about 110~130°C at the outlet. , at this temperature, organic matter such as rosin in the exhaust gas condenses from gaseous state to liquid state, and flows from top to bottom through the channel 1064 to the bottom 703 of the housing. The remaining part of the exhaust gas flows through the cooling plate 817 in the second-stage cooling device 820 from right to left. By adjusting the speed of air flowing in and out of the cooling plate 817, the remaining part of the exhaust gas is cooled to the gas temperature at the outlet of about 60~80°C. At this temperature, other pollutant organic matter in the exhaust gas, such as acids, esters or ether organic matter with low freezing point, condenses from gaseous state to liquid state, and flows along the side wall of cooling plate 817 to the shell. Bottom 703. The remaining exhaust gas flows into the filter chamber 842 through the lower opening 931 of the partition plate 937, and then flows through the filter component 836 from bottom to top, and is filtered by the filter component 836 to remove the particulate and mist organic matter therein to obtain Clean air. Finally, most of the clean clean gas is discharged from the clean gas outlet 731.2 to the low temperature area of the reflow oven furnace to complete the purification process of the waste gas. The remaining small part of the clean gas flows back to the first through the upper opening 932 and the connecting channel 1135. The cooling device 810 mixes with the exhaust gas and reduces the temperature of the exhaust gas. Adjusting the opening size of the upper opening 932 can change the amount of clean air flowing back to the first-stage cooling device 810 through the upper opening 932 and the connecting channel 1135 . Of course, the upper opening 932 can also be completely closed to prevent the clean air from flowing back to the first-stage cooling device 810 through the upper opening 932 and the connecting channel 1135 . The liquid contaminants at the bottom 703 of the housing are collected by the collection device 740.2.

The self-cleaning procedure of the exhaust gas purification device 700 is similar to that of the exhaust gas purification device 200 and will not be described again.

The main difference between the exhaust gas purification device 200 and the exhaust gas purification device 700 in the two embodiments of this case is that the first-stage cooling device is different. The cooling plate 315 in the first-stage cooling device 310 of the exhaust gas purification device 200 has a smaller lateral area, so that less pollutants are accumulated on the heat exchange component (cooling plate 315), and therefore can have longer maintenance. Interval time. The first-stage cooling device 810 of the exhaust gas purification device 700 is a commercially available finished product, which can have a lower cost.

Although the present case will be described with reference to specific embodiments shown in the drawings, it should be understood that the exhaust gas purification system and exhaust gas purification device of the present case may have many variations without departing from the spirit, scope and context of the teachings of the present case. One of ordinary skill in the art will also recognize that there are different ways to modify the arrangements of the disclosed embodiments, all within the spirit and scope of the disclosure and claims.

100: Exhaust gas purification system 110: First level cooling unit 111.1: Exhaust gas inlet 111.2: Gas outlet 112: Air supply port 114:Self-cleaning gas inlet 117.1: Valve parts 117.2: Valve parts 117.3: Valve parts 117.4: Valve parts 117.5: Channel switch components 117.6: Valve parts 118:Hearth 120: Second stage cooling unit 121.1:Gas inlet 121.2: Gas outlet 124:Fluid power device 125.1:Connection channel 125.2: Connection channel 130:Filter unit 131.1:Gas inlet 131.2: Clean gas outlet 132:Exhaust port 133: Heating parts 134:Self-cleaning gas outlet 135:Connection channel 136:Filter components 140: Collection unit 141.1:Waste liquid outlet 141.2:Waste liquid outlet 141.3:Waste liquid outlet 151: Temperature detection parts 152: Temperature detection parts 155: Gas concentration detection parts 200: Exhaust gas purification device 201: Shell 202:Top 203: Bottom 204:Left 205:Right 206:Front 206.1: First front plate 206.2: Second front plate 207:Rear 211.1: Near the exhaust gas inlet 212: Air supply port 213.1: Temperature detector 213.2: Temperature detector 213.3: Temperature detector 213.4: Temperature detector 213.5: Temperature detector 213.6: Temperature detector 217.1: Valve components 217.2: Valve parts 217.6: Valve parts 222:Heating rod 224:Fan 231.2: Clean gas outlet 232:Exhaust port 240.1: Collection bottle 240.2: Collection bottle 251.1:Connecting pipes 251.2: Connecting pipes 271:Open your mouth 310: First stage cooling device 315:Cooling plate 317:Cooling plate 318:Gas pipeline 319:Exhaust fan 320: Second stage cooling device 327:Hoarding 336:Filter components 341:Filter components 342:Filter cavity 355: Cooling media inlet 357: Cooling media inlet 365: Cooling media outlet 367: Cooling media outlet 425:Horizontal board 426:Riser 431:Lower opening 432: Upper opening 437:Divider 455: Oxygen concentration detection device 546.1:Cavity 546.2:Cavity 548:Vertical gas channel 549.1: Top transverse gas channel 549.2: Bottom transverse gas channel 550:Gas channel 554:Sealing plate 580: Impeller 582:Inlet side 584:Outlet side 614: Clean gas inlet 634: Clean gas outlet 635:Connection channel 638: Adjustable baffle 656.1: Current equalizing plate 656.2: Current equalizing plate 658.1: Round hole 658.2: Elongated hole 661:Guide groove 662:Guide pin 700: Exhaust gas purification device 701: Shell 702:Top 703: Bottom 704:Left 705:Right 706:Front 706.1: First front plate 706.2: Second front plate 707:Rear 708:muffler 711.1: Exhaust gas inlet 712: Air supply port 724:Fan 731.2: Clean gas outlet 732:Exhaust port 740.1: Collection bottle 740.2: Collection bottle 771:Open your mouth 810: First stage cooling device 815: Cooling media outlet 816: Cooling media outlet 817:Cooling plate 820: Second stage cooling device 827:hoarding 836:Filter components 841: Cooling cavity 842:Filter chamber 855: Cooling media inlet 857: Cooling media inlet 861: First cooling cavity 862: Second cooling cavity 863: Cooling fin 865: Cooling pipe 925:Horizontal board 926:Riser 931: Opening at the lower part of the partition 932: Upper opening of partition plate 937:Divider 955: Oxygen concentration detection device 1046.1:Cavity 1046.2:Cavity 1049.1: Top transverse gas channel 1049.2: Bottom transverse gas channel 1050:Gas cooling channel 1064:Through slot 1066: Bottom 1067:Side wall 1068:Longitudinal gas flow 1072:Side slot 1080: Impeller 1081: Enter the manager 1082: Inlet side 1084: Outlet side 1085:Output header 1114:Self-cleaning gas inlet 1134:Self-cleaning gas outlet 1135:Connection channel 1138: Adjustable baffle 1156: Current equalizing plate 1158: long hole

Figure 1A is a simplified structural block diagram of an exhaust gas purification system according to an embodiment of the present case;

Figure 1B is a block diagram showing the gas flow path when the exhaust gas purification system in Figure 1A is in operation;

Figure 1C is a block diagram illustrating the gas flow path when the exhaust gas purification system in Figure 1A is in a maintenance state;

Figure 2A is a schematic three-dimensional structural diagram of an exhaust gas purification device according to an embodiment of the present case;

Figure 2B is a front view of the exhaust gas purification device shown in Figure 2A;

Figure 2C is a top view of the exhaust gas purification device shown in Figure 2A;

Figure 3 is an exploded structural view of the exhaust gas purification device shown in Figure 2A;

Figure 4 is a cross-sectional view along line A-A of Figure 2B;

Figure 5 is a cross-sectional view along line B-B of Figure 2C;

Figure 6 is a schematic three-dimensional structural view of the cooling device in the exhaust gas purification device shown in Figure 2A;

Figure 7A is a schematic three-dimensional structural diagram of an exhaust gas purification device according to another embodiment of the present case;

Figure 7B is a front view of the exhaust gas purification device shown in Figure 7A;

Figure 7C is a top view of the exhaust gas purification device shown in Figure 7A;

Figure 8 is an exploded structural view of the exhaust gas purification device shown in Figure 7A;

Figure 9 is a cross-sectional view along line A-A of Figure 7B;

Figure 10A is a cross-sectional view along line B-B of Figure 7C;

Figure 10B is a cross-sectional view along line C-C of Figure 10A;

Fig. 11 is a schematic three-dimensional structural view of the cooling device in the exhaust gas purification device shown in Fig. 7A.

Domestic storage information (please note in order of storage institution, date and number) without

Overseas storage information (please note in order of storage country, institution, date, and number) without

100: Exhaust gas purification system

110: First level cooling unit

111.1: Exhaust gas inlet

111.2: Gas outlet

112: Air supply port

114:Self-cleaning gas inlet

117.1: Valve components

117.2: Valve components

117.3: Valve components

117.4: Valve parts

117.5: Channel switch components

117.6: Valve parts

118:Hearth

120: Second stage cooling unit

121.1:Gas inlet

121.2: Gas outlet

124:Fluid power device

125.1:Connection channel

125.2: Connection channel

130:Filter unit

131.1:Gas inlet

131.2: Clean gas outlet

132:Exhaust port

133: Heating parts

134:Self-cleaning gas outlet

135:Connection channel

136:Filter components

140: Collection unit

141.1:Waste liquid outlet

141.2:Waste liquid outlet

141.3:Waste liquid outlet

151: Temperature detection parts

152: Temperature detection parts

155: Gas concentration detection parts

Claims (9)

An exhaust gas purification system for purifying pollutants in exhaust gas in a reflow furnace furnace (118), which: includes: a first-stage cooling unit (110), the first-stage cooling unit (110) has an exhaust gas inlet ( 111.1) and gas outlet (111.2), the first-stage cooling unit (110) is used to cool the exhaust gas entering the first-stage cooling unit (110) through the exhaust gas inlet (111.1) to the first temperature, So that part of the pollutants in the exhaust gas entering the first-stage cooling unit (110) is cooled from gaseous state to liquid state and discharged from the first-stage cooling unit (110), entering the first-stage cooling unit (110) ) in the exhaust gas remains in a gaseous state; a second-stage cooling unit (120), the second-stage cooling unit (120) has a gas inlet (121.1) and a gas outlet (121.2), the second-stage cooling unit (120) The gas inlet (121.1) of the secondary cooling unit (120) is in fluid communication with the gas outlet (111.2) of the first-stage cooling unit (110). The second-stage cooling unit (120) is used to remove the gas from the first-stage cooling unit (110). The exhaust gas entering the second-stage cooling unit (120) from the first-stage cooling unit (110) is cooled from the first temperature to the second temperature, so that the exhaust gas entering the second-stage cooling unit (120) A part of the pollutants are cooled from gaseous state to liquid state and discharged from the second-stage cooling unit (120), entering the second-stage cooling unit (120) A part of the remaining part of the pollutants in the exhaust gas remains in a gaseous or mist state; a filtering unit (130), the filtering unit (130) has a gas inlet (131.1) and a clean gas outlet (131.2), the filtering unit (131.2) The gas inlet (131.1) of 130) is in fluid communication with the gas outlet (121.2) of the second-stage cooling unit (120), the filter unit (130) is used to filter the exhaust gas entering the filter unit (130), and At least part of the filtered gas is discharged through the clean gas outlet (131.2) of the filter unit (130), wherein the exhaust gas inlet (111.1) of the first-stage cooling unit (110) is used to controllably communicate with the The furnace chamber (118) of the reflow oven is in fluid communication. The exhaust gas purification system according to claim 1, further comprising: a collection unit (140), the first-stage cooling unit (110) and the second-stage cooling unit (120) each have a waste liquid outlet (141.1, 141.2 ), the collection unit (140) is controllably fluidly connected with the waste liquid outlets (141.1, 141.2) of the first-stage cooling unit (110) and the second-stage cooling unit (120) for collection Expelled liquid waste gas. The exhaust gas purification system according to claim 1, wherein: at the first temperature, the pollutants in the exhaust gas that are cooled from the gaseous state to the liquid state include rosin organic matter; At the second temperature, the pollutants in the exhaust gas that are cooled from the gaseous state to the liquid state include other acids, esters or ether organic compounds with low freezing point. The exhaust gas purification system according to claim 3, wherein: the first temperature is 110~130°C; the second temperature is 60~80°C. An exhaust gas purification system capable of self-cleaning, which includes: a cooling unit (110,120) with a self-cleaning gas inlet (114) and a gas outlet (121.2); a filtering unit (130), the filtering unit (110,120) The unit (130) has a gas inlet (131.1) and a self-cleaning gas outlet (134); a heating component (133) provided in the filter unit (130) for raising the filter The gas temperature in the unit (130); the first channel (125.2), the first channel (125.2) connects the gas outlet (121.2) of the cooling unit (110,120) and the gas inlet (130) of the filter unit (130) 131.1), the first channel (125.2) is used to transport the gas in the cooling unit (110, 120) to the filter unit (130); and the second channel (135), the second channel (135 ) connects the self-cleaning gas outlet (134) of the filter unit (130) and the self-cleaning gas inlet (114) of the cooling unit (110, 120), so The second channel (135) is used to controllably transport the gas in the filter unit (130) to the cooling unit (110,120); where the gas is in the cooling unit (110,120) and the first channel (125.2 ), the filter unit (130) and the second channel (135) form a self-cleaning gas cycle, wherein the cooling unit (110, 120) includes an exhaust gas inlet (111.1) for controllably communicating with the backflow The furnace (118) of the welding furnace is connected. The exhaust gas purification system according to claim 5, further comprising: a fluid power device (124), the fluid power device (124) enabling gas to pass through the first channel (125.2) and the second channel (135) Circulates in the filtration unit (130) and the cooling unit (110, 120). The exhaust gas purification system according to claim 5, wherein: the filter unit (130) includes a clean gas outlet (131.2), and the clean gas outlet (131.2) is used to controllably discharge the gas in the filter unit (130) . The exhaust gas purification system according to claim 5, characterized by further comprising: a collection unit (140), the cooling unit (110, 120) and the filter unit (130) each have a waste liquid outlet (141.1, 141.2, 141.3), so The above collection unit (140) can The cooling unit (110) and the waste liquid outlet (141.1, 141.2) of the filter unit (130) are all fluidly connected in a controlled manner for collecting discharged liquid waste gas. The exhaust gas purification system according to claim 5, wherein: the cooling unit (110, 120) also has an air supply port (112), the air supply port (112) is used to controllably communicate with the protective gas fluid, so that the protective gas enters the In the exhaust gas purification system (100); the filter unit (130) has an exhaust port (132), and the exhaust port (132) is used to controllably discharge the gas in the exhaust gas purification system (100).