TWI810768B - Printed circuit board and manufacturing method thereof - Google Patents

Abstract

A printed circuit board and a method for manufacturing a printed circuit board. The method comprises providing a first substrate and a second substrate. The first substrate comprises a first substrate layer and a first copper layer, and the first copper layer is located on the first surface of the first substrate layer. The second substrate comprises a second substrate layer and a second copper layer, and the second copper layer is located on the third surface of the second substrate layer. Pretreatment is performed to form a first fluff layer on the first copper layer, and a second fluff layer on the second copper layer. The first fluff layer comprises a plurality of first fluffs and a plurality of first containing portions, and the first containing portions are formed between the first fluffs. The second fluff layer comprises a plurality of second fluffs and a plurality of second containing portions, and the second containing portions are formed between the second fluffs. The first substrate is butted with the second substrate, so that the first fluff layer and the second fluff layer are fitted with each other.

Description

Circuit board and manufacturing method of circuit board

The present application relates to a circuit board and a method for making the circuit board, in particular to a circuit board with a high-density docking effect.

The traditional flexible printed circuit (FPC) has to be made into multi-layers, such as ten to twenty layers, which is generally more complicated and difficult to operate.

In addition, the traditional FPC is multi-layer stacked with adhesive layers. However, in the case of layer-by-layer stacking, it is easy to consume time and energy. In addition, when adhesive layers are used for bonding and stacking, in order to electrically connect the layers, it is necessary to generate additional conductive pillars, which makes the manufacturing process more complicated, and the yield rate will also be affected. Furthermore, FPC often needs to be welded or pressed at a high temperature, causing the FPC to be subjected to high temperature to affect its characteristics.

In view of the above, according to an embodiment, a method for manufacturing a circuit board is provided, including providing a first substrate and a second substrate. The first substrate includes a first base material layer and a first copper layer, the first base material layer has a first surface and a second surface opposite to each other, and the first copper layer is located on the first surface. The second substrate includes a second base material layer and a second copper layer, the second base material layer has a third surface and a fourth surface opposite to each other, and the second copper layer is located on the third surface. Pretreatment is performed to form a first fluff layer on the surface of the first copper layer of the first substrate, and to form a second fluff layer on the surface of the second copper layer of the second substrate. The first fluff layer has a plurality of first fluffs and a plurality of first accommodation parts, and the first accommodation parts are formed between the first fluffs. The second fluff layer has a plurality of second fluffs and a plurality of second accommodation parts, and the second accommodation parts are formed between the second fluffs. The first substrate is docked with the second substrate, so that the first hairs of the first substrate are connected to the second receiving parts of the second substrate, and the second hairs of the second substrate are connected to the first hairs of the first substrate. The accommodating parts are fitted with each other.

In some embodiments, before the step of providing the first substrate and the second substrate, electroplating deposition is performed to form the first metal layer on the first surface of the first base material layer, and form a metal layer on the third surface of the second base material layer. second metal layer. Electroplating is performed to form a first copper layer on the first metal layer and a second copper layer on the second metal layer.

In some embodiments, before the step of providing the first substrate and the second substrate, metal coating is performed to form a first metal layer on the first surface of the first base material layer. A second metal layer is formed on the third surface of the second base material layer. A redox reaction is performed to form a first copper layer on the first metal layer and a second copper layer on the second metal layer.

In some embodiments, before the steps of providing the first substrate and the second substrate, metallization is performed to form a first metal layer on the first surface of the first base material layer. A second metal layer is formed on the third surface of the second base material layer. Electroplating is performed to form a first copper layer on the first metal layer and a second copper layer on the second metal layer.

In some embodiments, the first substrate layer and the second substrate layer are made of polyimide, modified polyimide, liquid crystal polymer, fluorine polymer or ceramic material.

In some embodiments, wherein the first substrate includes a third copper layer, and the third copper layer is located on the second surface. The second substrate includes a fourth copper layer, and the fourth copper layer is located on the fourth surface. Pretreatment is performed to form a third fluff layer on the surface of the third copper layer of the first substrate, and form a fourth fluff layer on the surface of the fourth copper layer of the second substrate. The third fluff layer has a plurality of third fluffs and a plurality of third receiving parts, and the third receiving parts are formed between the third fluffs. The fourth fluff layer has a plurality of fourth fluffs and a plurality of fourth receiving parts, and the fourth receiving parts are formed between the fourth fluffs.

In some embodiments, the thickness of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer is 2 to 150 μm.

According to an embodiment, a circuit board is provided, including a first substrate and a second substrate. The first substrate includes a first base material layer and a first copper layer, the first base material layer has a first surface and a second surface opposite to each other, and the first copper layer is located on the first surface. The surface of the first copper layer of the first substrate has a first fluff layer, and the first fluff layer has a plurality of first fluffs and a plurality of first accommodation parts, and the first accommodation parts are formed between the first fluffs. The second substrate has a second base material layer and a second copper layer, the second base material layer has a third surface and a fourth surface opposite to each other, and the second copper layer is located on the third surface. There is a second fluff layer on the surface of the second copper layer of the second substrate, and the second fluff layer has a plurality of second fluffs and a plurality of second accommodation parts, and the second accommodation parts are formed between the second fluffs. The first substrate is docked with the second substrate, so that the first hairs of the first substrate and the second receiving parts of the second substrate are mutually fitted, and the second hairs of the second substrate are connected with the first hairs of the first substrate. The first receiving parts fit into each other.

In some embodiments, it further includes a third substrate, the third substrate includes a third substrate layer and a fifth copper layer, the third substrate layer has a fifth surface and a sixth surface opposite to each other, and the fifth copper layer is located on the fifth surface. The surface of the fifth copper layer of the third substrate has a fifth fluff layer, and the fifth fluff layer has a plurality of fifth fluffs and a plurality of fifth receiving parts, and the fifth receiving parts are formed between the fifth fluffs. The first substrate is docked with the third substrate, so that the first hairs of the first substrate are fitted with the fifth receiving parts of the third substrate, and the fifth hairs of the third substrate are connected with the fifth receiving parts of the first substrate. The first accommodating parts are fitted with each other, and the third substrate and the second substrate are parallel to each other.

In some embodiments, the first substrate layer includes at least one substrate, at least two metal lines, and at least one via hole. At least two metal circuits are formed on two opposite sides of at least one substrate, and at least one via hole penetrates through at least one substrate and electrically connects at least two metal circuits.

To sum up, through the manufacturing method of the circuit board, the substrate with the copper hair surface structure is manufactured. By modularizing the substrate with the fuzzy copper surface structure, the substrate can be interfitted with the fuzz layers of other substrates through the fuzz layer, so as to achieve the effect of fast pressing and fitting. In addition, since the bonding between the substrate and other substrates can be carried out at a relatively low temperature, it is possible to avoid affecting the characteristics of the circuit board due to a relatively high temperature operating environment.

Please refer to FIG. 11 and also refer to FIGS. 1 to 6B. FIG. 1 is a schematic perspective view of a substrate with a copper layer according to a manufacturing method of a circuit board according to a first embodiment. FIG. 2 is a schematic perspective view of a substrate with a fuzzy copper layer according to a manufacturing method of a circuit board according to a first embodiment. FIG. 3A is a partially enlarged view of the number 3A in FIG. 2 . FIG. 3B is a partially enlarged view of the symbol 3B in FIG. 2 . FIG. 4 is a perspective view of a circuit board according to a first embodiment. FIG. 5 is a partially enlarged view of the number 5 in FIG. 4 . FIG. 6A is a side view of a substrate of a manufacturing method of a circuit board according to a first embodiment. FIG. 6B is a schematic diagram of a substrate structure of a circuit board according to a first embodiment. FIG. 11 is a flow chart of a method for manufacturing a circuit board according to a first embodiment. The circuit board 100 is a flexible circuit board, which can be applied to mobile phones, notebook computers or tablet computers.

A method for manufacturing a circuit board 100 includes providing a first substrate 110 and a second substrate 130 (step S10 ). As shown in Figure 1, the first substrate 110 includes a first base material layer 111 and a first copper layer 112, the first base material layer 111 has a first surface 111a and a second surface 111b opposite, the first copper layer 112 is located on the second A surface 111a. The second substrate 130 has a second base material layer 131 and a second copper layer 132 , the second base material layer 131 has a third surface 131 a and a fourth surface 131 b opposite to each other, and the second copper layer 132 is located on the third surface 131 a.

Carry out pretreatment (step S11A), as shown in Fig. 2, Fig. 3A and Fig. 3B, form the first fluff layer 113 on the surface of the first copper layer 112 of the first substrate 110, on the second copper layer of the second substrate 130 The second fluff layer 133 is formed on the surface of the 132 . The first fluff layer 113 has a plurality of first fluffs 1131 and a plurality of first receiving portions 1132 , and the first receiving portions 1132 are formed between the first fluffs 1131 . The second fluff layer 133 has a plurality of second fluff 1331 and a plurality of second receiving portions 1332 , and the second receiving portions 1332 are formed between each second fluff 1331 .

In the first embodiment, the first substrate 110 and the second substrate 130 have the same corresponding structure. In the first embodiment, as shown in FIG. 1 , the first substrate 110 and the second substrate 130 are flexible copper clad laminates (FCCL). FIG. 6A shows a substrate with double-sided copper foil, but it is not limited thereto, and may have only one-sided copper foil. In other implementations, the first substrate 110 and the second substrate 130 can be, for example, low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC) or multi-layer ceramic capacitors (Multi-layer Ceramic Capacitor, MLCC) with copper the substrate. In addition, the copper layers of the first substrate 110 and the second substrate 130 can also be formed by electroplating or redox reaction. Regarding the formation of the first copper layer 112 of the first substrate 110 and the second copper layer 132 of the second substrate 130, there are various implementations (details will be described later).

Next, the first substrate 110 is docked with the second substrate 130 (step S12), as shown in FIG. 4 and FIG. The portions 1332 are fitted with each other, and the second hairs 1331 of the second substrate 130 are fitted with the first receiving portions 1132 of the first substrate 110 .

Specifically, the first copper layer 112 of the first substrate 110 has a plurality of first fluffs 1131, the gaps between each first fluff 1131 form a first receiving portion 1132, the second copper layer 132 of the second substrate 130 has a plurality of Each second fluff 1331, the gap between each second fluff 1331 forms a second receiving portion 1332. When the first substrate 110 and the second substrate 130 are docked with each other, the first fluff 1131 of the first substrate 110 is accommodated in the second receiving portion 1332 of the second substrate 130, and the second fluff 1331 of the second substrate 130 is accommodated in the first substrate. The first accommodating portion 1132 of 110 is such that the first fluff layer 113 and the second fluff layer 133 form a zipper-like form and fit together. In the first embodiment, the first substrate 110 and the second substrate 130 are fitted together by welding or pressing at a temperature below 250° C.

That is to say, through the manufacturing method of the circuit board 100 , the first substrate 110 and the second substrate 130 having the copper-fluff structure are manufactured. The first substrate 110 with the fuzzy copper surface structure is modularized, so that the first substrate 110 can be embedded with the fuzz layer of the second substrate 130 through the fuzz layer, so as to achieve the effect of rapid press-fitting and engagement. In addition, since the fitting of the first substrate 110 and the second substrate 130 can be performed at a relatively low temperature, it is possible to avoid a relatively high temperature working environment from affecting the characteristics of the circuit board. In the first embodiment, the first substrate layer 111 and the second substrate layer 131 are made of polyimide, modified polyimide, liquid crystal polymer, fluorine polymer or ceramic material, and The first base material layer 111 and the second base material layer 131 may be made of the same material or different materials. Here, the fluorine polymer system is polytetrafluoroethylene, tetrachloroethylene copolymer resin or fluorine resin.

In the first embodiment, the first substrate layer 111 and the second substrate layer 131 can be, for example, a substrate layer composed of one or more substrates, so that the substrate layer module composed of one or more substrates into the first base material layer 111 or the second base material layer 131, and then these modularized first base material layers 111 or the second base material layer 131 are pressed and fitted together, so that the overall process speed can be greatly improved. promote. Please refer to FIG. 6B . FIG. 6B is a schematic diagram of a substrate structure of a circuit board according to a first embodiment. For example, the first substrate 110 has a first base material layer 111 formed by stacking a multi-layer base material 1112 and a metal circuit 1113 . As shown in FIG. 6B , metal circuits 1113 of different layers are electrically connected to each other through via holes 1111 formed through the substrate 1112 . The via hole 1111 is formed in a conventional way, for example, by forming a through hole and then filling it with metal paste or electroplating layer, which will not be described in detail here. In this way, the base material layer is modularized and connected to other modularized base material layers through the copper layer, so as to achieve the effect of multi-layer board and multi-layer board butt joint.

In FIG. 6B , a four-layer board is used as an example for illustration, but the present invention is not limited thereto. In other implementation forms, various forms such as single-sided boards, double-sided boards, and five-layer boards are also applicable.

In other implementations, the circuit board 100 may be composed of multiple substrates, not limited to the stacking of two substrates of the first substrate 110 and the second substrate 130 (details will be described later).

Regarding the formation of the first copper layer 112 of the first substrate 110 and the second copper layer 132 of the second substrate 130, there are various implementation aspects.

Next, please refer to FIG. 12 and also refer to FIG. 7 and FIG. 8 . FIG. 7 is a schematic perspective view of a substrate according to a manufacturing method of a circuit board according to a second embodiment. FIG. 8 is a schematic diagram of a substrate with a metal layer according to a manufacturing method of a circuit board according to a second embodiment. FIG. 12 is a flow chart of forming a copper layer in a manufacturing method of a circuit board according to a second embodiment. In the second embodiment, before the step of providing the first substrate 110 and the second substrate 130, electroplating deposition (step S8A) is performed to form the first metal layer 114a on the first surface 111a of the first substrate layer 111, and then The third surface 131a of the second substrate layer 131 forms a second metal layer 134a. Electroplating is performed (step S9A), the first copper layer 112 is formed on the first metal layer 114a, and the second copper layer 132 is formed on the second metal layer 134a. Specifically, as shown in FIG. 7, the first substrate 110 and the second substrate 130 do not have a copper layer originally, but, as shown in FIG. The first metal layer 114a and the second metal layer 134a are respectively formed on the material layer 131, and then the first copper layer 112 and the second copper layer 132 are respectively formed by gradual plating, and the first substrate 110 and the second substrate 130 of FIG. 1 are obtained. . In the second embodiment, the metal deposited by electroplating on the first substrate 110 and the second substrate 130 is, for example, nickel or an inert metal.

Please refer to FIG. 13 and also refer to FIG. 7 and FIG. 9 . FIG. 9 is a schematic perspective view of a substrate with a metal layer according to a third embodiment of a circuit board and a manufacturing method of a fourth embodiment. FIG. 13 is a flow chart of forming a copper layer in a manufacturing method of a circuit board according to a third embodiment. In the third embodiment, before the step of providing the first substrate 110 and the second substrate 130, metal coating (step S8B) is performed to form the first metal layer 114b on the first surface 111a of the first substrate layer 111, The second metal layer 134b is formed on the third surface 131a of the second base material layer 131 . Carry out redox reaction (step S9B), form the first copper layer 112 on the first metal layer 114b, form the second copper layer 132 on the second metal layer 134b, obtain the first substrate 110 and the second substrate 130 of FIG. 4 .

Please refer to FIG. 14 and also refer to FIG. 7 and FIG. 9 . FIG. 14 is a flow chart of forming a copper layer in a method for manufacturing a circuit board according to a fourth embodiment. In the fourth embodiment, before the step of providing the first substrate 110 and the second substrate 130, metallization (step S8C) is performed to form the first metal layer 114b on the first surface 111a of the first substrate layer 111, and then The third surface 131a of the second substrate layer 131 forms the second metal layer 134b. Perform electroplating (step S9C), form the first copper layer 112 on the first metal layer 114b, form the second copper layer 132 on the second metal layer 134b, and obtain the first substrate 110 and the second substrate 130 in FIG. 4 .

In other embodiments, the circuit board 100 may be composed of multiple substrates, and is not limited to the stack of two substrates of the first substrate 110 and the second substrate 130 .

Please refer to Figure 15 in conjunction with Figure 10A. FIG. 10A is a schematic perspective view of a circuit board according to a fifth embodiment. FIG. 15 is a flowchart of a method for manufacturing a circuit board according to a fifth embodiment. In the fifth embodiment, the first substrate 110 further includes a third copper layer 115 located on the second surface 111b. The second substrate 130 further includes a fourth copper layer 135 located on the fourth surface 131b. During pretreatment, in addition to forming the first fluff layer 113 and the second fluff layer 133, also carry out pretreatment (step S11B), form the 3rd fluff layer 116 on the surface of the 3rd copper layer 115 of the first substrate 110, in the second A fourth fluff layer 136 is formed on the surface of the fourth copper layer 135 of the second substrate 130 . The third fluff layer 116 has a plurality of third fluffs 1161 and a plurality of third receiving portions 1162 , and the third receiving portions 1162 are formed between the third fluffs 1161 . The fourth fluff layer 136 has a plurality of fourth fluffs 1361 and a plurality of fourth receiving portions 1362 , and the fourth receiving portions 1362 are formed between the fourth fluffs 1361 .

Specifically, the circuit board 100 can be formed by stacking a plurality of substrates. As shown in FIG. The fluff layer of the substrate, and the second substrate 130 can also be connected through the fourth copper layer 135 on the fourth surface 131 b of the second base material layer 131 . Since the copper fluff layer can be quickly stacked, the production time and manpower consumption can be effectively reduced. In addition, because the copper fluff layer is stacked more conveniently and easily, it is easier to manufacture thicker multilayer boards. In the fifth embodiment, the thickness of the first copper layer 112 , the second copper layer 132 , the third copper layer 115 and the fourth copper layer 135 is 2 to 150 μm.

In the sixth embodiment, the substrates of the circuit board 100 can be stacked in multiple directions to achieve the effect of multi-directional bending. Please refer to FIG. 10B and FIG. 10C . FIG. 10B is a schematic perspective view of a circuit board according to a sixth embodiment. FIG. 10C is a partially enlarged view of the reference numeral 10C in FIG. 10B . The circuit board 100 further includes a third substrate 150, the third substrate 150 includes a third base material layer 151 and a fifth copper layer 152, the third base material layer 151 has a fifth surface 151a and a sixth surface 151b opposite, the fifth copper layer 151 Layer 152 is located on fifth surface 151a. The fifth copper layer 152 of the third substrate 150 has a fifth fluff layer 153 on the surface, and the fifth fluff layer 153 has a plurality of fifth fluff 1531 and a plurality of fifth receiving portions 1532, and the fifth fluff 1531 forms a fifth fluff layer. Five receiving parts 1532. The first substrate 110 is docked with the third substrate 150, so that the first fluffs 1131 of the first substrate 110 and the fifth receiving portions 1532 of the third substrate 150 are fitted together, and the fifth fluffs of the third substrate 150 1531 fits with the first receiving portions 1132 of the first substrate 110 , and the third substrate 150 and the second substrate 130 are parallel to each other. Specifically, both ends of the first substrate 110 are extended, the second substrate 130 and the third substrate 150 are respectively connected to the two ends of the first substrate 110, there is a gap between the second substrate 130 and the third substrate 150, and parallel to each other. A gap is reserved between the second substrate 130 and the third substrate 150 to reserve a space for the first substrate 110 to bend. In this way, the circuit board 100 can be formed by stacking substrates in different directions, and has the effect of multi-directional bending.

To sum up, through the manufacturing method of the circuit board 100 , the first substrate 110 and the second substrate 130 with the copper-fluff structure are manufactured. The first substrate 110 with the fuzzy copper surface structure is modularized so that the first substrate 110 can be embedded with the fuzz layer of the second substrate 130 through the fuzz layer. Since the copper fluff layer can be quickly stacked, the production time and manpower consumption can be effectively reduced. In addition, because the copper fluff layer is stacked more conveniently and easily, it is easier to manufacture thicker multilayer boards. In addition, since the fitting of the first substrate 110 and the second substrate 130 can be performed at a relatively low temperature, it is possible to avoid a relatively high temperature working environment from affecting the characteristics of the circuit board.

100: circuit board 110: the first substrate 111: the first substrate layer 111a: the first surface 111b: second surface 1111: via hole 1112: Substrate 1113: metal circuit 112: The first copper layer 113: the first fluff layer 1131: the first fluff 1132: The first containment department 114a, 114b: first metal layer 115: the third copper layer 116: The third fluff layer 1161: The third fluff 1162: The third containment department 130: second substrate 131: second substrate layer 131a: third surface 131b: fourth surface 132: second copper layer 133: Second fluff layer 1331: second fluff 1332: The second storage unit 134a, 134b: second metal layer 135: The fourth copper layer 136: The fourth fluff layer 1361: The fourth fluff 1362: The fourth containment department 150: The third substrate 151: the third substrate layer 151a: fifth surface 151b: sixth surface 152: fifth copper layer 153: The fifth fluff layer 1531: The fifth fluff 1532: Fifth Containment Department Step S8A: performing electroplating deposition, forming a first metal layer on the first surface of the first substrate layer, and forming a second metal layer on the third surface of the second substrate layer Step S8B: Carrying out metal coating, forming a first metal layer on the first surface of the first substrate layer, and forming a second metal layer on the third surface of the second substrate layer Step S8C: performing metallization, forming a first metal layer on the first surface of the first substrate layer, and forming a second metal layer on the third surface of the second substrate layer Step S9A: performing electroplating, forming a first copper layer on the first metal layer, and forming a second copper layer on the second metal layer Step S9B: performing redox reaction, forming a first copper layer on the first metal layer, and forming a second copper layer on the second metal layer Step S9C: performing electroplating, forming a first copper layer on the first metal layer, and forming a second copper layer on the second metal layer Step S10: providing a first substrate and a second substrate Step S11A: performing pretreatment, forming a first fluff layer on the surface of the first copper layer of the first substrate, and forming a second fluff layer on the surface of the second copper layer of the second substrate Step S11B: perform pretreatment, form the first fluff layer and the third fluff layer on the surface of the first copper layer of the first substrate and the surface of the third copper layer respectively, and form the first fluff layer and the third fluff layer on the surface of the second copper layer and the third copper layer of the second substrate The surface of the four copper layers forms the second fluff layer and the fourth fluff layer respectively Step S12: docking the first substrate with the second substrate

[FIG. 1] is a three-dimensional schematic diagram of a substrate with a copper layer according to a manufacturing method of a circuit board according to a first embodiment. [FIG. 2] It is a three-dimensional schematic diagram of a substrate with a copper layer with fluff according to a manufacturing method of a circuit board according to a first embodiment. [FIG. 3A] is a partially enlarged view of reference number 3A in FIG. 2. [FIG. 3B] is a partially enlarged view of the symbol 3B in FIG. 2. [FIG. 4] is a schematic perspective view of a circuit board according to a first embodiment. [FIG. 5] is a partially enlarged view of number 5 in FIG. 4. [FIG. 6A] is a side view of a substrate according to a manufacturing method of a circuit board according to a first embodiment. [FIG. 6B] is a schematic diagram of the substrate structure of the circuit board according to a first embodiment. [ FIG. 7 ] is a perspective schematic view of a substrate according to a manufacturing method of a circuit board according to a second embodiment. [ FIG. 8 ] is a schematic diagram of a substrate with a metal layer according to a method of manufacturing a circuit board according to a second embodiment. [ FIG. 9 ] is a three-dimensional schematic diagram of a substrate with a metal layer according to a circuit board of a third embodiment and a manufacturing method of a fourth embodiment. [FIG. 10A] is a schematic perspective view of a circuit board according to a fifth embodiment. [FIG. 10B] is a schematic perspective view of a circuit board according to a sixth embodiment. [FIG. 10C] is a partially enlarged view of the number 10C in FIG. 10B. [FIG. 11] is a flow chart of a manufacturing method of a circuit board according to a first embodiment. [ FIG. 12 ] is a flow chart of forming a copper layer in a method for manufacturing a circuit board according to a second embodiment. [ FIG. 13 ] is a flow chart of forming a copper layer in a method for manufacturing a circuit board according to a third embodiment. [ FIG. 14 ] is a flow chart of forming a copper layer in a method for manufacturing a circuit board according to a fourth embodiment. [FIG. 15] is a flowchart of a method of manufacturing a circuit board according to a fifth embodiment.

100: circuit board 110: the first substrate 111: the first substrate layer 111a: first surface 111b: second surface 112: The first copper layer 130: second substrate 131: second substrate layer 131a: third surface 131b: fourth surface 132: second copper layer

Claims (14)

A method for manufacturing a circuit board, comprising: providing a first substrate and a second substrate, the first substrate includes a first base material layer and a first copper layer, the first base material layer has an opposite first surface and a second surface, the first copper layer is located on the first surface, the second substrate includes a second base material layer and a second copper layer, the second base material layer has an opposite third surface and A fourth surface, the second copper layer is located on the third surface; pretreatment is performed to form a first fluff layer on the surface of the first copper layer of the first substrate, and the second fluff layer is formed on the second substrate of the second substrate. A second fluff layer is formed on the surface of the copper layer, wherein the first fluff layer has a plurality of first fluffs and a plurality of first accommodation portions, the first accommodation portion is formed between each of the first fluffs, and the second fluff layer The fluff layer has a plurality of second fluffs and a plurality of second accommodation parts, the second accommodation parts are formed between the second fluffs; and the first substrate and the second substrate are welded or welded at a temperature below 250°C. butt against each other in a press-fitting manner, so that the first hairs of the first substrate and the second receiving parts of the second substrate are fitted together, and the second hairs of the second substrate and the second receiving parts of the first substrate The first accommodating parts are fitted with each other. The method for manufacturing a circuit board as described in Claim 1, wherein, before the step of providing the first substrate and the second substrate, it further includes performing electroplating deposition to form a A first metal layer, forming a second metal layer on the third surface of the second base material layer; and electroplating, forming the first copper layer on the first metal layer, forming on the second metal layer the second copper layer. The method for manufacturing a circuit board as described in claim 1, wherein, before the step of providing the first substrate and the second substrate, it further includes performing metal coating to form a a first metal layer, forming a second metal layer on the third surface of the second base material layer; and performing a redox reaction to form the first copper layer on the first metal layer, The second copper layer is formed on the layer. The method for manufacturing a circuit board as described in claim 1, wherein, before the step of providing the first substrate and the second substrate, it further includes performing metallization to form a A first metal layer, forming a second metal layer on the third surface of the second base material layer; and electroplating, forming the first copper layer on the first metal layer, forming the second metal layer on the second metal layer second copper layer. The method for making a circuit board according to claim 1, wherein the first base material layer and the second base material layer are polyimide, modified polyimide, liquid crystal polymer, fluorine polymer or made of ceramic materials. The method for manufacturing a circuit board according to any one of claims 1 to 4, wherein the first substrate further includes a third copper layer, the third copper layer is located on the second surface, and the second substrate further includes a The fourth copper layer, the fourth copper layer is located on the fourth surface, and the manufacturing method further includes: performing pretreatment, forming a third fluff layer on the surface of the third copper layer of the first substrate, and forming a third fluff layer on the first substrate A fourth fluff layer is formed on the surface of the fourth copper layer of the second substrate, wherein the third fluff layer has a plurality of third fluffs and a plurality of third receiving parts, each of the third fluffs The third accommodation portion is formed between them, the fourth fluff layer has a plurality of fourth fluff and a plurality of fourth accommodation portions, and the fourth accommodation portion is formed between each of the fourth fluff. The method for manufacturing a circuit board according to claim 6, wherein the thicknesses of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer are 2 to 150 μm. A circuit board, comprising: a first substrate, the first substrate includes a first base material layer and a first copper layer, the first base material layer has a first surface and a second surface opposite, the first base material layer A copper layer is located on the first surface, wherein the surface of the first copper layer of the first substrate has a first fluff layer, and the first fluff layer has a plurality of first fluff and a plurality of first receiving parts, The first accommodation part is formed between each of the first hairs; and a second substrate, the second substrate has a second base material layer and a second copper layer, and the second base material layer has an opposite third surface and a fourth surface, the second copper layer is located on the third surface, wherein the surface of the second copper layer of the second substrate has a second fluff layer, and the second fluff layer has a plurality of second Villi and a plurality of second accommodation parts, the second accommodation parts are formed between each second fluff; wherein, the first substrate and the second substrate are butted with each other by welding or pressing at a temperature below 250°C, The first fluffs of the first substrate are fitted with the second receiving parts of the second substrate, and the second fluffs of the second substrate are mutually fitted with the first receiving parts of the first substrate. Chimeric. The circuit board as claimed in claim 8, wherein the first surface of the first substrate layer has a first metal layer, and the third surface of the second substrate layer has a second metal layer. metal layer, the first metal layer has the first copper layer on it, and the second metal layer has the second copper layer on it. The circuit board according to claim 8, wherein the first substrate layer and the second substrate layer are made of polyimide, modified polyimide, liquid crystal polymer, fluorine polymer or ceramic material made by. The circuit board as described in claim 8 or 9, wherein the first substrate includes a third copper layer, the third copper layer is located on the second surface, the second substrate includes a fourth copper layer, the fourth The copper layer is located on the fourth surface, wherein the first substrate has a third fluff layer on the surface of the third copper layer, and the second substrate has a fourth fluff layer on the surface of the fourth copper layer, The third fluff layer has a plurality of third fluffs and a plurality of third receiving parts, the third receiving parts are formed between the third fluffs, and the fourth fluff layer has a plurality of fourth fluffs and a plurality of fourth receiving parts , the fourth receiving portion is formed between the fourth hairs. The circuit board according to claim 11, wherein the thickness of the first copper layer, the second copper layer, the third copper layer and the fourth copper layer is 2 to 150 μm. The circuit board as described in claim 8 further includes a third substrate, the third substrate includes a third base material layer and a fifth copper layer, and the third base material layer has an opposite fifth surface and a The sixth surface, the fifth copper layer is located on the fifth surface, wherein the surface of the fifth copper layer of the third substrate has a fifth fluff layer, and the fifth fluff layer has a plurality of fifth fluff and a plurality of a fifth receiving portion, the fifth receiving portion is formed between each of the fifth hairs; wherein, the first substrate is docked with the third substrate, so that the first hairs of the first substrate and the third substrate are connected. The fifth accommodating parts are fitted with each other, and the fifth piles of the third substrate The hairs are fitted into the first receiving portions of the first substrate, and the third substrate and the second substrate are parallel to each other. The circuit board as described in Claim 8, wherein the first base material layer comprises at least one base material, at least two metal lines and at least one via hole, and the at least two metal lines are formed on opposite sides of the at least one base material , the at least one via hole runs through the at least one substrate and electrically connects the at least two metal lines.

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