TWI810635B - Thermal image-based temperature measurement calibration method and thermal image device - Google Patents

Thermal image-based temperature measurement calibration method and thermal image device Download PDF

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TWI810635B
TWI810635B TW110131509A TW110131509A TWI810635B TW I810635 B TWI810635 B TW I810635B TW 110131509 A TW110131509 A TW 110131509A TW 110131509 A TW110131509 A TW 110131509A TW I810635 B TWI810635 B TW I810635B
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temperature
processor
thermal image
measurement
image
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TW202225647A (en
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柯呈達
林宏聲
莊俊德
陳志仁
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財團法人工業技術研究院
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Priority to US17/550,656 priority patent/US11818334B2/en
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Abstract

A thermal image-based temperature measurement calibration method applicable to a thermal image device is provided. The method includes a recording stage, a processing stage and a calibration state. During the recording stage, the thermal image device records a monitored environment to generate a measured thermal image. During the processing stage, a processor performs an operation according to the measured thermal image to generate a target information, wherein the target information corresponds to a target in the monitored environment, and the target information includes a target image block and a target measured temperature corresponding to the target image block. During the calibration stage, the processor obtains a distance compensation value according to a pixel number of the target image block, and the processor performs a calibration operation to the target measured temperature at least according to the distance compensation value to generate a calibrated temperature value corresponding to the target.

Description

基於熱影像的溫度量測校正方法及熱影像裝置Thermal image-based temperature measurement and correction method and thermal image device

本發明關於溫度量測,特別是一種基於熱影像的溫度量測校正方法及熱影像裝置。The invention relates to temperature measurement, in particular to a thermal image-based temperature measurement correction method and a thermal image device.

新型冠狀病毒(COVID-19)已成為近來年傳染力及致死率極高的病毒,而患者的常見症狀為發燒,為避免疫情蔓延,醫療院所及公共場所需要進行體溫管制。以人力進行額溫量測的速度緩慢,容易導致出入口處的排隊現象,且大幅增加檢測的人力成本。此外,常見的體溫量測工具如額溫槍或耳溫槍,因需要接觸人體而無法進行快速的非接觸式量測,甚至可能因為量測者和受測者的距離過近而增加傳染風險。The novel coronavirus (COVID-19) has become a highly contagious and fatal virus in recent years, and the common symptom of patients is fever. In order to avoid the spread of the epidemic, temperature control is required in medical institutions and public places. The speed of forehead temperature measurement by manpower is slow, which will easily lead to queuing at the entrance and exit, and greatly increase the labor cost of detection. In addition, common body temperature measurement tools such as forehead thermometers or ear thermometers cannot perform rapid non-contact measurements due to the need to touch the human body, and may even increase the risk of infection due to the close distance between the measurer and the subject .

非接觸式溫度量測工具如熱影像裝置,雖然能夠提供快速檢測而減輕人力成本,但現階段的精準度仍不盡理想。舉例來說,當人體與熱影像裝置之間的距離不同時,所測量到的溫度落差極大。此外,在多人環境時,熱影像裝置產生的熱影像中具有多個熱源,如何精準地辨識出哪些熱源屬於人的體溫具有一定的困難度,以上種種因素造成了現有的熱影像裝置無法在大量人流時準確地偵測到體溫。Although non-contact temperature measurement tools such as thermal imaging devices can provide rapid detection and reduce labor costs, the accuracy at this stage is still not ideal. For example, when the distance between the human body and the thermal imaging device is different, the measured temperature drop is extremely large. In addition, in a multi-person environment, the thermal image generated by the thermal imaging device has multiple heat sources, and it is difficult to accurately identify which heat sources belong to human body temperature. Accurately detect body temperature when a large number of people flow.

本發明提出一種基於熱影像的溫度量測校正方法及熱影像裝置,可在多人環境中快速地量測多人的體溫,並迅速定位異常溫度的人員。本發明採用非接觸式量測,具有高精確度且低成本的特色。The present invention proposes a thermal imaging-based temperature measurement and correction method and thermal imaging device, which can quickly measure the body temperature of multiple people in a multi-person environment, and quickly locate people with abnormal temperatures. The invention adopts non-contact measurement and has the characteristics of high precision and low cost.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,適用於一熱影像裝置,該熱影像裝置包括一熱影像攝影機及一處理器,該基於熱影像的溫度量測校正方法包括:拍攝階段,以該熱影像攝影機拍攝一監控環境以產生一量測熱影像;處理階段,以該處理器依據該量測熱影像執行運算以取得一目標資訊,該目標資訊對應於該監控環境中的一量測目標,該目標資訊包括一目標影像區塊及對應於該目標影像區塊的一目標量測溫度;以及校正階段,以該處理器依據該目標影像區塊之一像素數量取得一距離補償值,及以該處理器至少依據該距離補償值對該目標量測溫度執行校正運算以產生對應於該量測目標的一校正溫度值。According to an embodiment of the present invention, a thermal image-based temperature measurement and correction method is suitable for a thermal image device, the thermal image device includes a thermal image camera and a processor, and the thermal image-based temperature measurement and correction method includes : In the shooting stage, the thermal imaging camera shoots a monitoring environment to generate a measurement thermal image; in the processing stage, the processor performs calculations based on the measurement thermal image to obtain a target information, and the target information corresponds to the monitoring environment In a measurement target, the target information includes a target image block and a target measurement temperature corresponding to the target image block; A distance compensation value, and the processor at least performs a correction operation on the target measurement temperature according to the distance compensation value to generate a correction temperature value corresponding to the measurement target.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該熱影像裝置更包括一溫度參考裝置;該溫度量測校正方法的該拍攝階段更包括:以該溫度參考裝置執行加熱至一指定參考溫度;該處理階段更包括:以該處理器依據該量測熱影像執行運算以取得對應於該溫度參考裝置的一參考資訊,該參考資訊包括一參考影像區塊及對應於該參考影像區塊的一參考量測溫度;以及該校正階段更包括:以該處理器依據該指定參考溫度及該參考量測溫度計算一環境補償值,其中該校正溫度值是以該處理器依據該距離補償值及該環境補償值對該目標量測溫度執行校正運算而產生。According to an embodiment of the present invention, a thermal image-based temperature measurement and correction method, wherein the thermal image device further includes a temperature reference device; the photographing stage of the temperature measurement and correction method further includes: performing heating with the temperature reference device to a designated reference temperature; the processing stage further includes: using the processor to perform calculations based on the measured thermal image to obtain a reference information corresponding to the temperature reference device, the reference information includes a reference image block and corresponding to the a reference measurement temperature of the reference image block; and the calibration stage further includes: calculating an environmental compensation value by the processor according to the designated reference temperature and the reference measurement temperature, wherein the correction temperature value is based on the processor The distance compensation value and the environment compensation value are generated by performing a correction operation on the target measured temperature.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該處理器是執行加總該目標量測溫度、該環境補償值及該距離補償值以產生該校正溫度值。According to a thermal image-based temperature measurement correction method according to an embodiment of the present invention, the processor performs summing of the target measurement temperature, the environment compensation value and the distance compensation value to generate the corrected temperature value.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該溫度參考裝置具有維持該指定參考溫度的一熱輻射片及可對該熱輻射片加熱的一加熱器,且在該處理階段中以該處理器依據該量測熱影像執行運算以取得該參考資訊包括:以該處理器對該量測熱影像執行運算以取得該量測熱影像的至少一候選參考區塊,其中每一候選參考區塊的溫度與該指定參考溫度之差值小於或等於一門檻值;以該處理器依據該至少一候選參考區塊的形狀與該熱輻射片的形狀執行比對,決定該至少一候選參考區塊中之一為該參考影像區塊;以及以該處理器依據該參考影像區塊的像素值計算該參考量測溫度。According to an embodiment of the present invention, a temperature measurement and correction method based on a thermal image, wherein the temperature reference device has a thermal radiation sheet for maintaining the specified reference temperature and a heater capable of heating the thermal radiation sheet, and in the In the processing stage, using the processor to perform calculations based on the measured thermal image to obtain the reference information includes: using the processor to perform calculations on the measured thermal image to obtain at least one candidate reference block of the measured thermal image, wherein The difference between the temperature of each candidate reference block and the specified reference temperature is less than or equal to a threshold value; the processor performs a comparison according to the shape of the at least one candidate reference block and the shape of the heat radiation sheet to determine the One of the at least one candidate reference block is the reference image block; and the reference measurement temperature is calculated by the processor according to the pixel values of the reference image block.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該處理器還儲存一距離補償表,該距離補償表記錄多個比對像素數量值及多個預設距離補償值之間的對應關係,且以該處理器依據該目標影像區塊之該像素數量取得該距離補償值包括:以該處理器依據該目標影像區塊之該像素數量查找該距離補償表以決定該些預設距離補償值中之一為該距離補償值。According to an embodiment of the present invention, a thermal image-based temperature measurement and correction method, wherein the processor further stores a distance compensation table, and the distance compensation table records the difference between a plurality of compared pixel quantity values and a plurality of preset distance compensation values The corresponding relationship among them, and obtaining the distance compensation value by the processor according to the number of pixels of the target image block includes: using the processor to search the distance compensation table according to the number of pixels of the target image block to determine these One of the preset distance compensation values is the distance compensation value.

依據本發明一實施例的一種所述基於熱影像的溫度量測校正方法,其中該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。According to an embodiment of the present invention, the thermal image-based temperature measurement and correction method, wherein the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,更包括一參數設定階段,該參數設定階段包括:該溫度參考裝置加熱至一指定測試溫度,並且該溫度參考裝置與該熱影像攝影機的間距為一預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一測試熱影像;以該處理器依據該測試熱影像執行運算以取得對應於該溫度參考裝置的測試參考資訊,該測試參考資訊包括一參考影像區塊及一參考量測溫度;以及以該處理器依據該測試參考資訊更新該距離補償表,其中該測試參考資訊的該參考影像區塊的像素數量為該些比對像素數量值中的一者,該參考量測溫度與該指定測試溫度的差值為該些預設距離補償值中的一者。According to an embodiment of the present invention, a temperature measurement and correction method based on thermal images further includes a parameter setting stage, the parameter setting stage includes: heating the temperature reference device to a specified test temperature, and the temperature reference device and the thermal The distance between the image cameras is a preset distance; the thermal image camera is used to shoot the temperature reference device to generate a test thermal image; the processor is used to perform calculations based on the test thermal image to obtain test reference information corresponding to the temperature reference device , the test reference information includes a reference image block and a reference measurement temperature; and the distance compensation table is updated by the processor according to the test reference information, wherein the number of pixels in the reference image block of the test reference information is the One of the comparison pixel quantity values, the difference between the reference measurement temperature and the specified test temperature is one of the preset distance compensation values.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該熱影像裝置更包括一可見光攝影機,該拍攝階段更包括以該可見光攝影機拍攝該監控環境以產生一光學影像,該處理階段更包括以該處理器依據該熱影像、該光學影像及一物件辨識模型執行運算以決定該目標影像區塊。According to an embodiment of the present invention, a method for temperature measurement and correction based on thermal imaging, wherein the thermal imaging device further includes a visible light camera, and the shooting stage further includes using the visible light camera to shoot the monitoring environment to generate an optical image, the processing The stage further includes using the processor to perform operations according to the thermal image, the optical image and an object recognition model to determine the target image block.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中以該處理器依據該目標影像區塊之該像素數量取得該距離補償值包括:以該處理器依據該目標影像區塊之該像素數量及一距離補償函數執行運算以取得該距離補償值,其中該距離補償函數表示多個比對像素數量值及多個預設距離補償值的擬合曲線。According to a thermal image-based temperature measurement and correction method according to an embodiment of the present invention, using the processor to obtain the distance compensation value according to the number of pixels of the target image block includes: using the processor to obtain the distance compensation value according to the target image block An operation is performed on the number of pixels and a distance compensation function to obtain the distance compensation value, wherein the distance compensation function represents a fitting curve of a plurality of compared pixel number values and a plurality of preset distance compensation values.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。According to an embodiment of the present invention, a method for temperature measurement and correction based on thermal images, wherein the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value.

依據本發明一實施例的一種基於熱影像的溫度量測校正方法,其中該熱影像裝置更包括一溫度參考裝置;且該溫度量測校正方法更包括一參數設定階段,該參數設定階段包括:以該溫度參考裝置加熱至一指定測試溫度;調整該溫度參考裝置與該熱影像攝影機的間距為一第一預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第一測試熱影像;以該處理器依據該第一測試熱影像執行運算以取得一第一參考資訊,該第一參考資訊對應於該溫度參考裝置與第一預設距離並且包括一第一參考影像區塊及一第一參考量測溫度;以該處理器計算一第一預設距離補償值,該第一預設距離補償值為該第一參考量測溫度與該指定測試溫度的差值;調整該溫度參考裝置與該熱影像攝影機的間距為一第二預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第二測試熱影像;以該處理器依據該第二測試熱影像執行運算以取得一第二參考資訊,該第二參考資訊對應於該溫度參考裝置與第二預設距離並且包括一第二參考影像區塊及一第二參考量測溫度;以該處理器計算一第二預設距離補償值,該第二預設距離補償值為該第二參考量測溫度與該指定測試溫度的差值;及以該處理器依據該第一參考影像區塊的像素數量、該第二參考影像區塊的像素數量、該第一預設距離補償值、該第二預設距離補償值執行曲線擬合運算,以產生該距離補償函數。According to an embodiment of the present invention, a thermal image-based temperature measurement and correction method, wherein the thermal image device further includes a temperature reference device; and the temperature measurement and correction method further includes a parameter setting stage, the parameter setting stage includes: Heating the temperature reference device to a specified test temperature; adjusting the distance between the temperature reference device and the thermal imaging camera to a first preset distance; photographing the temperature reference device with the thermal imaging camera to generate a first test thermal image ; using the processor to perform calculations based on the first test thermal image to obtain a first reference information, the first reference information corresponds to the temperature reference device and a first preset distance and includes a first reference image block and a the first reference measurement temperature; calculate a first preset distance compensation value with the processor, the first preset distance compensation value is the difference between the first reference measurement temperature and the specified test temperature; adjust the temperature reference The distance between the device and the thermal image camera is a second preset distance; the temperature reference device is photographed by the thermal image camera to generate a second test thermal image; the processor is used to perform calculations based on the second test thermal image to obtain A second reference information, the second reference information corresponds to the temperature reference device and a second preset distance and includes a second reference image block and a second reference measurement temperature; a second prediction is calculated by the processor Set a distance compensation value, the second preset distance compensation value is the difference between the second reference measurement temperature and the designated test temperature; A curve fitting operation is performed with reference to the number of pixels of the image block, the first preset distance compensation value, and the second preset distance compensation value to generate the distance compensation function.

依據本發明一實施例的一種一種熱影像裝置,包括:一熱影像攝影機,拍攝一監控環境以產生一量測熱影像;以及一處理器,電性連接該熱影像攝影機,該處理器依據該量測熱影像執行運算以取得一目標資訊,該目標資訊對應於該監控環境中的一量測目標,該目標資訊包括一目標影像區塊及對應於該目標影像區塊的一目標量測溫度;該處理器依據該目標影像區塊之一像素數量取得一距離補償值;該處理器至少依據該距離補償值對該目標量測溫度執行校正以產生對應於該量測目標的一校正溫度值。A thermal imaging device according to an embodiment of the present invention includes: a thermal imaging camera that shoots a monitoring environment to generate a measurement thermal image; and a processor that is electrically connected to the thermal imaging camera, and the processor is based on the Perform calculations on measuring thermal images to obtain target information corresponding to a measurement target in the monitoring environment, the target information including a target image block and a target measurement temperature corresponding to the target image block The processor obtains a distance compensation value according to the number of pixels of the target image block; the processor at least performs correction on the target measurement temperature according to the distance compensation value to generate a corrected temperature value corresponding to the measurement target .

依據本發明一實施例的一種熱影像裝置,更包括一溫度參考裝置電性連接該處理器,該溫度參考裝置執行加熱至一指定參考溫度,該處理器依據該量測熱影像執行運算以取得對應該溫度參考裝置的一參考資訊,該參考資訊包括一參考影像區塊及對應該參考影像區塊的一參考量測溫度,該處理器依據該指定參考溫度及該參考量測溫度計算一環境補償值,其中該校正溫度值是以該處理器依據該距離補償值及該環境補償值對該目標量測溫度執行校正運算而產生。A thermal imaging device according to an embodiment of the present invention further includes a temperature reference device electrically connected to the processor, the temperature reference device performs heating to a specified reference temperature, and the processor executes calculations based on the measured thermal image to obtain A reference information corresponding to the temperature reference device, the reference information includes a reference image block and a reference measurement temperature corresponding to the reference image block, the processor calculates an environment according to the specified reference temperature and the reference measurement temperature The compensation value, wherein the corrected temperature value is generated by performing a correction operation on the target measured temperature by the processor according to the distance compensation value and the environment compensation value.

依據本發明一實施例的一種熱影像裝置,該處理器是執行加總該目標量測溫度、該環境補償值及該距離補償值以產生該校正溫度值。According to a thermal imaging device according to an embodiment of the present invention, the processor performs summing of the target measured temperature, the environment compensation value and the distance compensation value to generate the corrected temperature value.

依據本發明一實施例的一種熱影像裝置,該溫度參考裝置具有維持該指定參考溫度的一熱輻射片及可對該熱輻射片加熱的一加熱器,該處理器對該量測熱影像執行運算以取得該量測熱影像的至少一候選參考區塊,其中每一候選參考區塊的溫度與該指定參考溫度之差值小於或等於一門檻值,該處理器依據該至少一候選參考區塊的形狀與該熱輻射片的形狀執行比對,決定該至少一候選參考區塊中之一為該參考影像區塊;以及該處理器依據該參考影像區塊的像素值計算該參考量測溫度。According to a thermal image device according to an embodiment of the present invention, the temperature reference device has a thermal radiation sheet for maintaining the specified reference temperature and a heater capable of heating the thermal radiation sheet, and the processor executes the measurement of the thermal image operation to obtain at least one candidate reference block of the measured thermal image, wherein the difference between the temperature of each candidate reference block and the specified reference temperature is less than or equal to a threshold value, and the processor is based on the at least one candidate reference block The shape of the block is compared with the shape of the heat radiation sheet, and one of the at least one candidate reference block is determined to be the reference image block; and the processor calculates the reference measurement according to the pixel value of the reference image block temperature.

依據本發明一實施例的一種熱影像裝置,其中該處理器還儲存一距離補償表,該距離補償表記錄多個比對像素數量值及多個預設距離補償值之間的對應關係,且該處理器依據該目標影像區塊之該像素數量查找該距離補償表以決定該些預設距離補償值中之一為該距離補償值。According to a thermal imaging device according to an embodiment of the present invention, the processor further stores a distance compensation table, and the distance compensation table records the corresponding relationship between a plurality of compared pixel quantity values and a plurality of preset distance compensation values, and The processor searches the distance compensation table according to the number of pixels of the target image block to determine one of the preset distance compensation values as the distance compensation value.

依據本發明一實施例的一種熱影像裝置,其中該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。According to a thermal imaging device according to an embodiment of the present invention, the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value.

依據本發明一實施例的一種熱影像裝置,在該溫度參考裝置加熱至該指定測試溫度之前,該溫度參考裝置加熱至一指定測試溫度,並且該溫度參考裝置與該熱影像攝影機的間距為一預設距離,該熱影像攝影機拍攝該溫度參考裝置以產生一測試熱影像;該處理器依據該測試熱影像執行運算以取得對應於該溫度參考裝置的測試參考資訊,該測試參考資訊包括一參考影像區塊及一參考量測溫度;該處理器依據該測試參考資訊更新該距離補償表,其中該測試參考資訊的該參考影像區塊的像素數量為該些比對像素數量值中的一者,該參考量測溫度與該指定測試溫度的差值為該些預設距離補償值中的一者。According to a thermal imaging device according to an embodiment of the present invention, before the temperature reference device is heated to the specified test temperature, the temperature reference device is heated to a specified test temperature, and the distance between the temperature reference device and the thermal imaging camera is one The thermal image camera captures the temperature reference device at a preset distance to generate a test thermal image; the processor executes calculations based on the test thermal image to obtain test reference information corresponding to the temperature reference device, and the test reference information includes a reference an image block and a reference measurement temperature; the processor updates the distance compensation table according to the test reference information, wherein the number of pixels in the reference image block of the test reference information is one of the comparison pixel number values , the difference between the reference measurement temperature and the specified test temperature is one of the preset distance compensation values.

依據本發明一實施例的一種熱影像裝置,更包括一可見光攝影機電性連接該處理器,該可見光攝影機拍攝該監控環境以產生一光學影像,該處理器依據該熱影像、該光學影像及一物件辨識模型執行運算以決定該目標影像區塊。A thermal imaging device according to an embodiment of the present invention further includes a visible light camera electrically connected to the processor, the visible light camera captures the monitoring environment to generate an optical image, and the processor bases the thermal image, the optical image and a The object recognition model performs calculations to determine the target image block.

依據本發明一實施例的一種熱影像裝置,該處理器依據該目標影像區塊之該像素數量及一距離補償函數執行運算以取得該距離補償值,其中該距離補償函數表示多個比對像素數量值及多個預設距離補償值的擬合曲線。According to a thermal imaging device according to an embodiment of the present invention, the processor executes an operation according to the number of pixels of the target image block and a distance compensation function to obtain the distance compensation value, wherein the distance compensation function represents a plurality of comparison pixels Fitting curves of quantity values and multiple preset distance compensation values.

依據本發明一實施例的一種熱影像裝置,該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。According to a thermal imaging device according to an embodiment of the present invention, the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value.

依據本發明一實施例的一種熱影像裝置,該熱影像裝置更包括一溫度參考裝置,在該溫度參考裝置加熱至該指定參考溫度之前,該溫度參考裝置加熱至一指定測試溫度;且該熱影像裝置執行以下步驟;調整該溫度參考裝置與該熱影像攝影機的間距為一第一預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第一測試熱影像;以該處理器依據該第一測試熱影像執行運算以取得一第一參考資訊,該第一參考資訊對應於該溫度參考裝置與第一預設距離並且包括一第一參考影像區塊及一第一參考量測溫度;以該處理器計算一第一預設距離補償值,該第一預設距離補償值為該第一參考量測溫度與該指定測試溫度的差值;調整該溫度參考裝置與該熱影像攝影機的間距為一第二預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第二測試熱影像;以該處理器依據該第二測試熱影像執行運算以取得一第二參考資訊,該第二參考資訊對應於該溫度參考裝置與第二預設距離並且包括一第二參考影像區塊及一第二參考量測溫度;以該處理器計算一第二預設距離補償值,該第二預設距離補償值為該第二參考量測溫度與該指定測試溫度的差值;及以該處理器依據該第一參考影像區塊的像素數量、該第二參考影像區塊的像素數量、該第一預設距離補償值、該第二預設距離補償值執行曲線擬合運算,以產生該距離補償函數。According to a thermal imaging device according to an embodiment of the present invention, the thermal imaging device further includes a temperature reference device, before the temperature reference device is heated to the specified reference temperature, the temperature reference device is heated to a specified test temperature; and the thermal The imaging device performs the following steps: adjust the distance between the temperature reference device and the thermal imaging camera to be a first preset distance; use the thermal imaging camera to photograph the temperature reference device to generate a first test thermal image; The first test thermal image executes calculations to obtain a first reference information, the first reference information corresponds to the temperature reference device and a first preset distance and includes a first reference image block and a first reference measurement temperature ; use the processor to calculate a first preset distance compensation value, the first preset distance compensation value is the difference between the first reference measurement temperature and the designated test temperature; adjust the temperature reference device and the thermal imaging camera The spacing is a second preset distance; the temperature reference device is photographed by the thermal image camera to generate a second test thermal image; the processor is used to perform calculations based on the second test thermal image to obtain a second reference information, The second reference information corresponds to the temperature reference device and a second preset distance and includes a second reference image block and a second reference measurement temperature; a second preset distance compensation value is calculated by the processor, the The second preset distance compensation value is the difference between the second reference measurement temperature and the specified test temperature; The quantity, the first preset distance compensation value, and the second preset distance compensation value perform a curve fitting operation to generate the distance compensation function.

以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the disclosure and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and provide a further explanation of the patent application scope of the present invention.

以下在實施方式中詳細敘述本發明之詳細特徵以及特點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之構想及特點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and characteristics of the present invention are described in detail below in the implementation mode, and its content is enough to enable any person familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings , anyone who is familiar with the related art can easily understand the ideas and features related to the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

圖1是本發明一實施例的熱影像裝置10的方塊圖,此熱影像裝置10包括熱影像攝影機12、溫度參考裝置14及處理器30。處理器30電性連接熱影像攝影機12及溫度參考裝置14。圖2是本發明一實施例的熱影像裝置10、監控環境及量測目標70的示意圖,熱影像裝置10適用於量測監控環境中的量測目標70的溫度,例如公共場所出入口的民眾的體溫,並對量測到的溫度進行校正。監控環境例如是熱影像攝影機12可拍攝到的範圍,如圖2中以虛線標示的區域,FIG. 1 is a block diagram of a thermal imaging device 10 according to an embodiment of the present invention. The thermal imaging device 10 includes a thermal imaging camera 12 , a temperature reference device 14 and a processor 30 . The processor 30 is electrically connected to the thermal imaging camera 12 and the temperature reference device 14 . 2 is a schematic diagram of a thermal imaging device 10, a monitoring environment, and a measurement target 70 according to an embodiment of the present invention. The thermal imaging device 10 is suitable for measuring the temperature of the measurement target 70 in the monitoring environment, such as the temperature of people at the entrances and exits of public places. body temperature and correct the measured temperature. The monitoring environment is, for example, the range that can be photographed by the thermal imaging camera 12, such as the area marked with a dotted line in FIG. 2 ,

熱影像攝影機12拍攝監控環境以產生量測熱影像,量測熱影像具有多個像素,每個像素值代表在此像素對應的位置量測到的溫度值。實務上,可將量測熱影像轉換為灰階圖以便檢視監控環境中的溫度分佈。熱影像攝影機12例如為紅外線攝影機,但本發明不以此為限。The thermal image camera 12 captures the monitoring environment to generate a thermal measurement image. The thermal measurement image has a plurality of pixels, and each pixel value represents a temperature value measured at a position corresponding to the pixel. In practice, the measured thermal image can be converted into a grayscale image to view the temperature distribution in the monitoring environment. The thermal imaging camera 12 is, for example, an infrared camera, but the present invention is not limited thereto.

溫度參考裝置14設置於監控環境,溫度參考裝置14執行溫度控制以維持指定參考溫度,指定參考溫度應高於監控環境的溫度,並介於量測目標70的預期溫度範圍之中。例如正常額溫的範圍從攝氏35度至攝氏37度,則溫度參考裝置14的指定參考溫度可設為約攝氏36度。溫度參考裝置14具有維持指定參考溫度的熱輻射片及可對熱輻射片執行溫度控制的溫控器,溫控器可以例如是加熱器,然溫控器不以加熱器為限,也可以是具冷卻功能之裝置,亦可達到溫度控制目的。The temperature reference device 14 is set in the monitoring environment. The temperature reference device 14 performs temperature control to maintain a specified reference temperature. The specified reference temperature should be higher than the temperature of the monitoring environment and within the expected temperature range of the measurement target 70 . For example, the normal forehead temperature ranges from 35 degrees Celsius to 37 degrees Celsius, and the specified reference temperature of the temperature reference device 14 can be set at about 36 degrees Celsius. The temperature reference device 14 has a heat radiation sheet that maintains a specified reference temperature and a temperature controller that can perform temperature control on the heat radiation sheet. The temperature controller can be, for example, a heater, but the temperature controller is not limited to the heater, and can also be a The device with cooling function can also achieve the purpose of temperature control.

溫度參考裝置14與熱影像攝影機12可採用分離式設計或整合式設計,其差異在於溫度參考裝置14與熱影像攝影機12之間的間隔距離,整合式設計為此間隔距離大於一預設值,分離式設計為此間隔距離小於該預設值。分離式設計如圖2所示,採用分離式設計拍攝到的量測熱影像如圖3所示,圖3中的參考影像區塊141對應於熱影像攝影機12拍攝到的溫度參考裝置14,目標影像區塊701對應於熱影像攝影機拍攝到的量測目標70。整合式設計如圖4所示,溫度參考裝置14設置在熱影像攝影機12的鏡頭上方,因此拍攝到的量測熱影像如圖5所示,參考影像區塊141位於量測熱影像的上方。本發明並不限制整合式設計中溫度參考裝置14的設置位置,例如溫度參考裝置14可設置在熱影像攝影機的鏡頭的左上角、左下角、右下角、右上角、左方、右方、上方或下方;採用上述舉例的整合式設計所拍攝到的量測熱影像及其中的參考影像區塊141的位置如圖6所示。The temperature reference device 14 and the thermal image camera 12 can adopt a separate design or an integrated design. The difference lies in the distance between the temperature reference device 14 and the thermal image camera 12. In the integrated design, the distance is greater than a preset value. The separation is designed so that the distance is less than the preset value. The separate design is shown in Figure 2, and the measurement thermal image captured by the separate design is shown in Figure 3. The reference image block 141 in Figure 3 corresponds to the temperature reference device 14 captured by the thermal image camera 12, and the target The image block 701 corresponds to the measurement target 70 captured by the thermal imaging camera. The integrated design is shown in FIG. 4 . The temperature reference device 14 is set above the lens of the thermal imaging camera 12 , so the captured thermal measurement image is shown in FIG. 5 , and the reference image block 141 is located above the thermal measurement image. The present invention does not limit the installation position of the temperature reference device 14 in the integrated design, for example, the temperature reference device 14 can be installed at the upper left corner, lower left corner, lower right corner, upper right corner, left, right, or upper of the lens of the thermal imaging camera or below; the measured thermal image and the position of the reference image block 141 captured by the above-mentioned integrated design are shown in FIG. 6 .

處理器30依據量測熱影像執行運算以取得參考資訊及目標資訊,參考資訊對應於溫度參考裝置14,參考資訊包括參考影像區塊141及對應於參考影像區塊141的參考量測溫度;目標資訊對應於量測目標70,目標資訊包括目標影像區塊701及對應於目標影像區塊701的目標量測溫度。處理器30依據參考資訊、目標資訊及指定參考溫度執行校正以產生量測目標70的校正溫度值,以下透過本發明一實施例的基於熱影像的溫度量測校正方法說明處理器30產生校正溫度值的細節。The processor 30 performs calculations based on the measured thermal image to obtain reference information and target information. The reference information corresponds to the temperature reference device 14. The reference information includes a reference image block 141 and a reference measurement temperature corresponding to the reference image block 141; the target The information corresponds to the measurement target 70 , and the target information includes the target image block 701 and the target measurement temperature corresponding to the target image block 701 . The processor 30 executes calibration according to the reference information, target information, and specified reference temperature to generate the corrected temperature value of the measurement target 70. The temperature measurement calibration method based on a thermal image according to an embodiment of the present invention will be used to illustrate the calibration temperature generated by the processor 30. value details.

圖7是本發明一實施例的基於熱影像的溫度量測校正方法的流程圖,此方法包括參數設定階段P0、拍攝階段P1、處理階段P2及校正階段P3。7 is a flow chart of a temperature measurement and correction method based on a thermal image according to an embodiment of the present invention. The method includes a parameter setting stage P0, a photographing stage P1, a processing stage P2, and a correction stage P3.

在本發明一實施例的熱影像裝置10實際應用之前,可執行多次參數設定階段P0以建立距離補償表,以便後續對量測溫度進行校正時使用。距離補償表記錄多個比對像素數量值及多個預設距離補償值之間的對應關係。下方表一是距離補償表的範例,距離補償表可包括多個列,每一列記錄預設面積(即:比對像素數量值)、預設距離及距離補償值(即:預設距離補償值)。Before the thermal imaging device 10 of an embodiment of the present invention is put into practical use, the parameter setting stage P0 may be performed multiple times to establish a distance compensation table for subsequent use in correcting the measured temperature. The distance compensation table records correspondences between multiple comparison pixel quantity values and multiple preset distance compensation values. Table 1 below is an example of the distance compensation table. The distance compensation table can include multiple columns, and each column records the preset area (ie: the number of pixels compared), the preset distance and the distance compensation value (ie: the preset distance compensation value ).

表一 預設面積A 0 預設距離D 距離補償值∆T dis 81像素 3.0公尺 0.1 °C 64像素 3.2公尺 0.5 °C 49像素 3.4公尺 1.0 °C Table I Default area A 0 preset distance D Distance compensation value ∆T dis 81 pixels 3.0 meters 0.1°C 64 pixels 3.2 meters 0.5°C 49 pixels 3.4 meters 1.0°C

圖8是在參數設定階段P0建立距離補償表的流程圖。步驟S81是「決定溫度參考裝置及熱影像攝影機之間的預設距離」,預設距離例如是表一中所示的3.0、3.2或3.4公尺。步驟S82是「加熱使溫度參考裝置維持指定測試溫度」,詳言之,溫度參考裝置加熱至指定測試溫度,指定測試溫度應高於監控環境的溫度(例如室溫),並介於量測目標70的預期溫度範圍(例如人體之溫度)。步驟S83是「熱影像攝影機拍攝維持指定測試溫度的溫度參考裝置以產生測試熱影像」。步驟S84是「處理器依據測試熱影像執行運算以取得參考資訊」。參考資訊對應於溫度參考裝置14,且包括參考影像區塊141及參考量測溫度。參考影像區塊141為測試熱影像中對應於溫度參考裝置14的多個像素組成的影像區塊,參考量測溫度為依據參考影像區塊141的多個像素值計算得到的溫度值,本發明不限制參考量測溫度的計算方式,例如將所有參考影像區塊141中的像素值的平均值(或最大值)設定為參考量測溫度。步驟S84的第一種實施方式是自行定義測試熱影像中的特定位置為參考影像區塊141。例如在圖5中,使用者可指定測試熱影像上方的特定區域為參考影像區塊141。步驟S84的第二種實施方式是處理器30自動偵測測試熱影像中的參考影像區塊141。Fig. 8 is a flow chart of establishing a distance compensation table in the parameter setting phase P0. Step S81 is "determining a preset distance between the temperature reference device and the thermal imaging camera", and the preset distance is, for example, 3.0, 3.2 or 3.4 meters as shown in Table 1. Step S82 is "heating to maintain the temperature reference device at the specified test temperature", in detail, the temperature reference device is heated to the specified test temperature, and the specified test temperature should be higher than the temperature of the monitoring environment (such as room temperature) and between the measurement target 70 for the expected temperature range (e.g. the temperature of the human body). Step S83 is "the thermal image camera captures the temperature reference device maintaining the specified test temperature to generate a test thermal image". Step S84 is "the processor executes calculation according to the test thermal image to obtain reference information". The reference information corresponds to the temperature reference device 14 and includes a reference image block 141 and a reference measurement temperature. The reference image block 141 is an image block composed of a plurality of pixels corresponding to the temperature reference device 14 in the test thermal image, and the reference measurement temperature is a temperature value calculated based on a plurality of pixel values of the reference image block 141. The present invention The calculation method of the reference measurement temperature is not limited, for example, the average value (or maximum value) of the pixel values in all the reference image blocks 141 is set as the reference measurement temperature. A first implementation of step S84 is to define a specific location in the test thermal image as the reference image block 141 . For example, in FIG. 5 , the user can designate a specific area above the test thermal image as the reference image block 141 . A second implementation of step S84 is that the processor 30 automatically detects the reference image block 141 in the test thermal image.

圖9是步驟S84的第二種實施方式的流程圖。溫度參考裝置14具有發出指定測試溫度的一表面,且熱影像攝影機12可拍攝到該表面。因此,處理器30可在測試熱影像中檢測該表面所對應的多個像素。步驟S91是「處理器取得測試熱影像的每一像素值」,每個像素值代表此像素對應的位置量測到的溫度值。步驟S92是「處理器標記對應於指定測試溫度的多個像素」,換言之,處理器30判斷測試熱影像的每一像素值是否對應於指定測試溫度,如果是則標記此像素,否則不予標記。步驟S93是「處理器判斷標記的像素構成的形狀是否與溫度參考裝置的表面的形狀相同」,如果是,則代表處理器30找到測試熱影像中的參考影像區塊141,且處理器30記錄對應於指定測試溫度的多個像素的位置,並將這些像素設定為參考影像區塊141。FIG. 9 is a flowchart of a second implementation manner of step S84. The temperature reference device 14 has a surface emitting a specified test temperature, and the thermal imaging camera 12 can photograph the surface. Therefore, the processor 30 can detect a plurality of pixels corresponding to the surface in the test thermal image. Step S91 is "the processor obtains each pixel value of the test thermal image", and each pixel value represents the temperature value measured at the position corresponding to the pixel. Step S92 is "the processor marks a plurality of pixels corresponding to the specified test temperature", in other words, the processor 30 judges whether each pixel value of the test thermal image corresponds to the specified test temperature, and if so, marks the pixel, otherwise it does not mark . Step S93 is "the processor judges whether the shape of the marked pixel is the same as the shape of the surface of the temperature reference device", if yes, it means that the processor 30 has found the reference image block 141 in the test thermal image, and the processor 30 records Positions of a plurality of pixels corresponding to the specified test temperature are set as the reference image block 141 .

請參考圖8,步驟S85是「處理器更新距離補償表」,詳言之,處理器30依據測試參考資訊更新距離補償表。處理器30將步驟S84中取得的參考影像區塊141的面積設定為預設面積,並將參考量測溫度與指定測試溫度的差值設定為預設距離補償值。參考影像區塊141的面積的計算方式例如採用像素個數,或者是依據參考影像區塊141的形狀計算其面積,本發明對此不予限制。參考量測溫度通常會低於指定測試溫度,這是因為溫度參考裝置14所處環境中的氣流會帶走溫度參考裝置14散發出的輻射熱。Please refer to FIG. 8 , step S85 is "update the distance compensation table by the processor", in detail, the processor 30 updates the distance compensation table according to the test reference information. The processor 30 sets the area of the reference image block 141 obtained in step S84 as a preset area, and sets the difference between the reference measurement temperature and the specified test temperature as a preset distance compensation value. The calculation method of the area of the reference image block 141 is, for example, the number of pixels, or the area of the reference image block 141 is calculated according to the shape of the reference image block 141 , which is not limited in the present invention. The reference measurement temperature is usually lower than the specified test temperature, because the airflow in the environment where the temperature reference device 14 is located will take away the radiant heat emitted by the temperature reference device 14 .

步驟S85是處理器30判斷「距離補償表是否完成」。例如預期量測距離熱影像攝影機12從3到4公尺之間的量測目標70,且預設距離的間隔為0.2公尺,則距離補償表具有6列,這6列分別對應的預設距離為3公尺、3.2公尺、3.4公尺、3.6公尺、3.8公尺、4公尺;上述舉例所用的數字係用於說明而非限制本發明。若距離補償表已完成,則繼續執行圖7的拍攝階段P1;否則返回步驟S81,選擇另一個預設距離,重複執行步驟S82~S84的流程。In step S85, the processor 30 judges "whether the distance compensation table is completed". For example, the expected measurement distance from the thermal imaging camera 12 is from 3 to 4 meters from the measurement target 70, and the interval of the preset distance is 0.2 meters, then the distance compensation table has 6 columns, and these 6 columns correspond to the preset The distances are 3 meters, 3.2 meters, 3.4 meters, 3.6 meters, 3.8 meters, and 4 meters; the numbers used in the above examples are for illustration but not limitation of the present invention. If the distance compensation table has been completed, continue to execute the shooting phase P1 of FIG. 7; otherwise, return to step S81, select another preset distance, and repeat the process of steps S82-S84.

實務上,可適應性修改圖8的流程,將建立距離補償表改為建立距離補償函數。例如在步驟S81中一次選擇多個預設距離,在步驟S82~S84中依據這些預設距離拍攝多個測試熱影像,再透過處理器30計算得出多個距離補償值,然後基於上述多個預設距離及多個距離補償值以曲線擬合(curve fitting)的方式建立距離補償函數,距離補償函數對應的曲線如圖10所示。詳言之,溫度參考裝置14加熱至指定測試溫度;調整溫度參考裝置14與熱影像攝影機12的間距為第一預設距離;熱影像攝影機12拍攝溫度參考裝置14以產生第一測試熱影像;處理器30依據第一測試熱影像執行運算以取得第一參考資訊,該一參考資訊對應於溫度參考裝置與第一預設距離並且包括第一參考影像區塊及一第一參考量測溫度;以該處理器計算一第一預設距離補償值,該第一預設距離補償值為第一參考量測溫度與指定測試溫度的差值;調整溫度參考裝置14與熱影像攝影機12的間距為一第二預設距離;熱影像攝影機12拍攝溫度參考裝置14以產生第二測試熱影像;處理器30依據第二測試熱影像執行運算以取得第二參考資訊,第二參考資訊對應於溫度參考裝置14與第二預設距離並且包括第二參考影像區塊及第二參考量測溫度;處理器30計算第二預設距離補償值,第二預設距離補償值為第二參考量測溫度與指定測試溫度的差值;及處理器30依據該第一參考影像區塊的像素數量、第二參考影像區塊的像素數量、第一預設距離補償值、第二預設距離補償值執行曲線擬合運算,以產生距離補償函數。在一實施例中,處理器30是執行加總目標量測溫度及該距離補償值以取得校正溫度值In practice, the process in FIG. 8 can be adaptively modified, and the establishment of the distance compensation table is changed to the establishment of the distance compensation function. For example, in step S81, multiple preset distances are selected at one time, and multiple test thermal images are taken according to these preset distances in steps S82~S84, and then multiple distance compensation values are calculated by the processor 30, and then based on the above multiple The preset distance and multiple distance compensation values are used to establish the distance compensation function by means of curve fitting, and the curve corresponding to the distance compensation function is shown in FIG. 10 . Specifically, the temperature reference device 14 is heated to a specified test temperature; the distance between the temperature reference device 14 and the thermal imaging camera 12 is adjusted to a first preset distance; the thermal imaging camera 12 shoots the temperature reference device 14 to generate a first test thermal image; The processor 30 executes an operation according to the first test thermal image to obtain first reference information, the reference information corresponds to the temperature reference device and the first preset distance and includes a first reference image block and a first reference measurement temperature; Calculate a first preset distance compensation value with the processor, and the first preset distance compensation value is the difference between the first reference measurement temperature and the specified test temperature; adjust the distance between the temperature reference device 14 and the thermal imaging camera 12 as A second preset distance; the thermal image camera 12 photographs the temperature reference device 14 to generate a second test thermal image; the processor 30 executes calculations based on the second test thermal image to obtain second reference information, and the second reference information corresponds to the temperature reference The device 14 is at a second preset distance and includes a second reference image block and a second reference measurement temperature; the processor 30 calculates a second preset distance compensation value, and the second preset distance compensation value is the second reference measurement temperature The difference with the specified test temperature; and the processor 30 executes according to the number of pixels of the first reference image block, the number of pixels of the second reference image block, the first preset distance compensation value, and the second preset distance compensation value A curve fitting operation to generate a distance compensation function. In one embodiment, the processor 30 performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value

為了提升熱影像攝影機12的量測精準度,在參數決定階段P0中,可另外加入全平面溫度自我校正的流程,如圖11所示:步驟S111為「黑體爐初始化」,例如將黑體爐設定為攝氏37度。步驟S112為「熱影像攝影機拍攝黑體爐以產生測試熱影像」。步驟S113為「處理器依據測試熱影像更新補償矩陣」,由於黑體爐相較於溫度參考裝置14具有更大的表面,且熱輻射更為穩定,理論上,測試熱影像中對應於黑體爐的每個像素值都相同,例如都代表攝氏37度。因此,若處理器30找到某一像素值相異於黑體爐初始化溫度值,則在補償矩陣中記錄此像素值與黑體爐初始化的溫度值之間的差值,其中補償矩陣的元素一一對應於測試熱影像的像素。步驟S114為「熱影像攝影機拍攝具有指定測試溫度的溫度參考裝置」,步驟S115為處理器30依據補償矩陣判斷「參考量測溫度與指定測試溫度的誤差是否小於一閾值」。若步驟S115的判斷為「是」,代表熱影像攝影機12本身已完成全平面溫度自我校正。更新後的補償矩陣將儲存於熱影像攝影機12中,並在執行圖7中的拍攝階段P1時被熱影像攝影機12重複使用。若步驟S115的判斷為「否」,則返回步驟S111重新校正。In order to improve the measurement accuracy of the thermal imaging camera 12, in the parameter determination stage P0, an additional self-calibration process of the full-plane temperature can be added, as shown in Figure 11: Step S111 is "blackbody furnace initialization", for example, set the blackbody furnace to It is 37 degrees Celsius. Step S112 is "photographing the blackbody furnace with a thermal image camera to generate a test thermal image". Step S113 is "the processor updates the compensation matrix according to the test thermal image". Since the blackbody furnace has a larger surface than the temperature reference device 14, and the thermal radiation is more stable, theoretically, the test thermal image corresponding to the blackbody furnace Each pixel value is the same, for example, both represent 37 degrees Celsius. Therefore, if the processor 30 finds that a certain pixel value is different from the initial temperature value of the blackbody furnace, the difference between the pixel value and the initial temperature value of the blackbody furnace is recorded in the compensation matrix, wherein the elements of the compensation matrix correspond one by one Pixels for testing thermal images. Step S114 is "photographing a temperature reference device with a specified test temperature by the thermal imaging camera", and step S115 is that the processor 30 judges "whether the error between the reference measurement temperature and the specified test temperature is less than a threshold" according to the compensation matrix. If the determination in step S115 is "Yes", it means that the thermal imaging camera 12 has completed the full-plane temperature self-calibration. The updated compensation matrix will be stored in the thermal imaging camera 12 , and will be reused by the thermal imaging camera 12 when performing the shooting phase P1 in FIG. 7 . If the determination in step S115 is "No", then return to step S111 for recalibration.

請參考圖7,從拍攝階段P1、處理階段P2至校正階段P3的流程相當於將本發明一實施例的熱影像裝置10實際應用在監控環境。在拍攝階段P1時,熱影像裝置10拍攝監控環境以產生量測熱影像,監控環境中具有量測目標70及溫度參考裝置14。在處理階段P2時,處理器30依據量測熱影像執行運算以取得目標資訊及參考資訊。目標資訊對應於監控環境中的量測目標70,目標資訊包括目標影像區塊701及對應於目標影像區塊701的目標量測溫度。參考資訊對應於溫度參考裝置14,參考資訊包括參考影像區塊141及對應參考影像區塊141的參考量測溫度。Please refer to FIG. 7 , the flow from the photographing stage P1 , the processing stage P2 to the correction stage P3 is equivalent to the actual application of the thermal imaging device 10 according to one embodiment of the present invention in a monitoring environment. During the photographing phase P1, the thermal imaging device 10 photographs the monitoring environment to generate a measurement thermal image, and the monitoring environment has the measurement target 70 and the temperature reference device 14 . In the processing stage P2, the processor 30 executes calculations according to the measured thermal image to obtain target information and reference information. The target information corresponds to the measurement target 70 in the monitoring environment, and the target information includes the target image block 701 and the target measurement temperature corresponding to the target image block 701 . The reference information corresponds to the temperature reference device 14 , and the reference information includes the reference image block 141 and the reference measurement temperature corresponding to the reference image block 141 .

在處理階段P2中,處理器30依據量測熱影像執行運算以取得參考資訊包括下列步驟:處理器30對量測熱影像執行運算以取得量測熱影像的至少一候選參考區塊,其中每一候選參考區塊的溫度與指定參考溫度之差值小於或等於門檻值;處理器30依據至少一候選參考區塊的形狀與該熱輻射片的形狀執行比對,決定至少一候選參考區塊中之一為參考影像區塊141;以及處理器30依據參考影像區塊141的像素值計算參考量測溫度。本發明不特別限制門檻值的數值。在一實施例,候選區塊的溫度例如是候選區塊中的所有像素的溫度值的平均值。In the processing stage P2, the processor 30 executes an operation according to the thermal measurement image to obtain reference information including the following steps: the processor 30 executes an operation on the thermal measurement image to obtain at least one candidate reference block of the thermal measurement image, wherein each The difference between the temperature of a candidate reference block and the specified reference temperature is less than or equal to the threshold value; the processor 30 performs a comparison based on the shape of at least one candidate reference block and the shape of the heat radiation sheet, and determines at least one candidate reference block One of them is the reference image block 141 ; and the processor 30 calculates the reference measurement temperature according to the pixel values of the reference image block 141 . The present invention does not specifically limit the value of the threshold value. In an embodiment, the temperature of the candidate block is, for example, the average value of the temperature values of all pixels in the candidate block.

在校正階段P3時,處理器30依據目標資訊及補償值(包括環境補償值及距離補償值)執行校正,以產生量測目標70的校正溫度值,換言之,處理器30至少依據距離補償值對目標量測溫度執行校正運算以產生對應於量測目標70的校正溫度值。在一實施例中,處理器30是執行加總目標量測溫度、環境補償值及距離補償值以產生該校正溫度值。在另一實施例中,處理器30是執行加總目標量測溫度及距離補償值以取得該校正溫度值。In the calibration phase P3, the processor 30 executes calibration according to the target information and compensation values (including environmental compensation values and distance compensation values) to generate the corrected temperature value of the measurement target 70. In other words, the processor 30 performs calibration based on at least the distance compensation value The target measurement temperature performs a correction operation to generate a corrected temperature value corresponding to the measurement target 70 . In one embodiment, the processor 30 performs summing of the target measured temperature, the environment compensation value and the distance compensation value to generate the corrected temperature value. In another embodiment, the processor 30 performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value.

在校正階段P3的一實施例中,處理器30按下方式一計算校正溫度值。In an embodiment of the calibration phase P3, the processor 30 calculates the calibration temperature value in the following manner.

(式一) (Formula 1)

其中 為校正溫度值, 為目標量測溫度, 為距離補償值, 為環境補償值。 in To correct the temperature value, To measure the temperature of the target, is the distance compensation value, Compensation value for the environment.

在處理階段P2,處理器30依據量測熱影像執行運算以取得目標量測溫度 及參考量測溫度,且處理器30計算參考量測溫度減去指定參考溫度的差值作為環境補償值 。本發明利用溫度參考裝置14的實際溫度與量測溫度之間的關係反映監控環境對於量測溫度時的影響,並且將此影響補償至校正溫度值 In the processing stage P2, the processor 30 performs calculations based on the measured thermal image to obtain the target measured temperature and the reference measurement temperature, and the processor 30 calculates the difference between the reference measurement temperature minus the specified reference temperature as the environmental compensation value . The present invention uses the relationship between the actual temperature and the measured temperature of the temperature reference device 14 to reflect the influence of the monitoring environment on the measured temperature, and compensates the influence to the corrected temperature value .

在處理階段P2,處理器30依據量測熱影像執行運算以取得目標影像區塊701。在一實施例中,處理器30依據目標影像區塊701的面積 查找距離補償表,以獲知量測目標70與熱影像攝影機12之間的距離 ,並進一步獲知該距離 對應的距離補償值 。在另一實施例中,處理器30將目標影像區塊701的面積 輸入至距離補償函數中,距離補償函數的輸出值即為距離補償值 。換言之,處理器30依據目標影像區塊701之像素數量及距離補償函數執行運算以取得距離補償值,其中該距離補償函數表示多個比對像素數量值及多個預設距離補償值的擬合曲線。 In the processing stage P2, the processor 30 executes calculations according to the measured thermal image to obtain the target image block 701 . In one embodiment, the processor 30 according to the area of the target image block 701 Look up the distance compensation table to know the distance between the measurement target 70 and the thermal imaging camera 12 , and further know the distance Corresponding distance compensation value . In another embodiment, the processor 30 takes the area of the target image block 701 Input to the distance compensation function, the output value of the distance compensation function is the distance compensation value . In other words, the processor 30 executes an operation according to the number of pixels of the target image block 701 and the distance compensation function to obtain the distance compensation value, wherein the distance compensation function represents the fitting of multiple comparison pixel quantity values and multiple preset distance compensation values curve.

在校正階段P3的一實施例中,處理器30依據距離補償值 及環境補償值 之加總作為補償值,且校正溫度值 為目標量測溫度 及補償值之加總。 In an embodiment of the calibration stage P3, the processor 30 calculates the distance compensation value according to and environmental compensation value The sum is used as the compensation value, and the temperature value is corrected measure the temperature of the target and the sum of compensation values.

在校正階段P3的其他實施例中,補償值僅採用距離補償值 及環境補償值 中的一者。例如不採用距離補償表或距離補償函數時,補償值為環境補償值。不採用溫度參考裝置14時,補償值為距離補償值。 In other embodiments of the correction phase P3, the compensation value only adopts the distance compensation value and environmental compensation value one of. For example, when the distance compensation table or distance compensation function is not used, the compensation value is the environment compensation value. When the temperature reference device 14 is not used, the compensation value is a distance compensation value.

實務上,當處理器30計算出的校正溫度值大於預設值時,處理器30可產生一警報訊號,且該警報訊號例如被傳送至一顯示裝置或一擴音裝置以通知相關人員前往處理。In practice, when the corrected temperature value calculated by the processor 30 is greater than the preset value, the processor 30 can generate an alarm signal, and the alarm signal is, for example, sent to a display device or a loudspeaker device to notify relevant personnel to deal with it .

在本發明另一實施例中,熱影像裝置10更包括一可見光攝影機電性連接處理器30。在拍攝階段P1,可見光攝影機拍攝監控環境以產生光學影像,在處理階段P2,處理器30可依據光學影像、熱影像及物件辨識模型執行運算以決定目標影像區塊701的範圍,透過物件辨識模型可進一步提升目標影像區塊701的辨識精確度。圖12及圖13分別是具有可見光攝影機50的熱影像裝置10採用分離式設計與整合式設計的示意圖。所述物件辨識模型可透過測試熱影像蒐集及物件特徵標記的步驟訓練而成。在實際應用時,熱影像攝影機12輸入量測熱影像至物件辨識模型,物件辨識模型進行特徵框選之後再輸出此量測熱影像進行後續處理。物件辨識模型例如可以採用YOLO影像辨識模型或人體輪廓橢圓擬合演算法等,但不以此為限,物件辨識模型也可以依運作環境,利用歷史資料訓練建構。In another embodiment of the present invention, the thermal imaging device 10 further includes a visible light camera electrically connected to the processor 30 . In the shooting phase P1, the visible light camera captures the monitoring environment to generate an optical image. In the processing phase P2, the processor 30 can perform calculations based on the optical image, thermal image, and object recognition model to determine the range of the target image block 701. Through the object recognition model The identification accuracy of the target image block 701 can be further improved. FIG. 12 and FIG. 13 are schematic diagrams of a thermal imaging device 10 with a visible light camera 50 adopting a separate design and an integrated design, respectively. The object recognition model can be trained through the steps of testing thermal image collection and object feature marking. In practical application, the thermal image camera 12 inputs the measured thermal image to the object recognition model, and the object recognition model outputs the measured thermal image for subsequent processing after feature selection. The object recognition model can use, for example, the YOLO image recognition model or the human body contour ellipse fitting algorithm, etc., but it is not limited thereto. The object recognition model can also be constructed using historical data training according to the operating environment.

綜上所述,本發明利用溫度參考裝置的量測溫度及實際溫度計算出環境補償值,同時利用熱影像本身計算距離補償值,藉由上述兩種補償值,本發明提升了溫度校正時的精準度。此外,本發明僅使用低成本的溫度參考裝置,無需使用昂貴的距離感測器便可以量測到與熱影像攝影機具有不同距離的多個目標的溫度。本發明可在多人環境中快速地量測多人的體溫,並迅速定位具有異常體溫的人員。本發明採用非接觸式量測,具有高精確度且低成本的優點。To sum up, the present invention uses the temperature measured by the temperature reference device and the actual temperature to calculate the environmental compensation value, and at the same time uses the thermal image itself to calculate the distance compensation value. With the above two compensation values, the present invention improves the accuracy of temperature correction Spend. In addition, the present invention only uses a low-cost temperature reference device, and can measure the temperature of multiple targets at different distances from the thermal imaging camera without using expensive distance sensors. The invention can quickly measure the body temperature of many people in a multi-person environment, and quickly locate the person with abnormal body temperature. The invention adopts non-contact measurement, which has the advantages of high precision and low cost.

雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, all changes and modifications are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.

10:熱影像裝置 12:熱影像攝影機 14:溫度參考裝置 141:參考影像區塊 30:處理器 50:可見光攝影機 70:量測目標 701:目標影像區塊 P0:參數設定階段 P1:拍攝階段 P2:處理階段 P3:校正階段 S81~S86、S91~S93、S111~S115:步驟 10: Thermal imaging device 12: Thermal imaging camera 14: Temperature reference device 141:Reference image block 30: Processor 50:Visible light camera 70: Measurement target 701: target image block P0: parameter setting stage P1: Shooting stage P2: Processing stage P3: Calibration phase S81~S86, S91~S93, S111~S115: steps

圖1是本發明一實施例的熱影像裝置的方塊圖; 圖2是本發明一實施例的熱影像裝置、監控環境及量測目標的示意圖; 圖3是溫度參考裝置與熱影像攝影機採用分離式設計的熱影像範例; 圖4是溫度參考裝置與熱影像攝影機採用整合式設計的示意圖; 圖5是溫度參考裝置與熱影像攝影機採用整合式設計的熱影像範例; 圖6是溫度參考裝置與熱影像攝影機採用整合式設計的其他熱影像範例; 圖7是本發明一實施例的基於熱影像的溫度量測校正方法的流程圖; 圖8是建立距離補償表的流程圖; 圖9是圖8中步驟S84的第二種實施方式的流程圖; 圖10繪示距離補償函數對應的曲線; 圖11是對熱影像攝影機執行全平面溫度自我校正的流程圖; 圖12是本發明另一實施例的熱影像裝置採用採用整合式設計的示意圖;以及 圖13是本發明另一實施例的熱影像裝置採用採用分離式設計的示意圖。 FIG. 1 is a block diagram of a thermal imaging device according to an embodiment of the present invention; 2 is a schematic diagram of a thermal imaging device, a monitoring environment and a measurement target according to an embodiment of the present invention; Figure 3 is an example of a thermal image in which the temperature reference device and the thermal imaging camera are designed separately; Fig. 4 is a schematic diagram of an integrated design of a temperature reference device and a thermal imaging camera; Figure 5 is an example of a thermal image with an integrated design of a temperature reference device and a thermal imaging camera; Figure 6 is another example of thermal imaging in which the temperature reference device and thermal imaging camera adopt an integrated design; FIG. 7 is a flowchart of a temperature measurement and correction method based on a thermal image according to an embodiment of the present invention; Fig. 8 is the flowchart of establishing distance compensation table; FIG. 9 is a flowchart of a second implementation of step S84 in FIG. 8; Fig. 10 shows the curve corresponding to the distance compensation function; Fig. 11 is a flow chart of performing full-plane temperature self-calibration to a thermal imaging camera; FIG. 12 is a schematic diagram of a thermal imaging device adopting an integrated design according to another embodiment of the present invention; and FIG. 13 is a schematic diagram of a thermal imaging device adopting a separate design according to another embodiment of the present invention.

10:熱影像裝置 10: Thermal imaging device

12:熱影像攝影機 12: Thermal imaging camera

14:溫度參考裝置 14: Temperature reference device

70:量測目標 70: Measurement target

Claims (22)

一種基於熱影像的溫度量測校正方法,適用於一熱影像裝置,該熱影像裝置包括一熱影像攝影機及一處理器,該基於熱影像的溫度量測校正方法包括:拍攝階段,以該熱影像攝影機拍攝一監控環境以產生一量測熱影像;處理階段,以該處理器依據該量測熱影像執行運算以取得一目標資訊,該目標資訊對應於該監控環境中的一量測目標,該目標資訊包括一目標影像區塊及對應於該目標影像區塊的一目標量測溫度;以及校正階段,以該處理器依據該目標影像區塊之一像素數量取得一距離補償值,及以該處理器至少依據該距離補償值對該目標量測溫度執行校正運算以產生對應於該量測目標的一校正溫度值。 A temperature measurement and correction method based on thermal images, suitable for a thermal image device, the thermal image device includes a thermal image camera and a processor, the temperature measurement and correction method based on thermal images includes: a shooting stage, using the thermal image The image camera captures a monitoring environment to generate a measurement thermal image; in the processing stage, the processor executes calculations based on the measurement thermal image to obtain target information, and the target information corresponds to a measurement target in the monitoring environment, The target information includes a target image block and a target measurement temperature corresponding to the target image block; and a correction stage, the processor obtains a distance compensation value according to a pixel quantity of the target image block, and The processor at least performs a correction operation on the target measured temperature according to the distance compensation value to generate a corrected temperature value corresponding to the measured target. 如請求項1所述基於熱影像的溫度量測校正方法,其中該熱影像裝置更包括一溫度參考裝置;該溫度量測校正方法的該拍攝階段更包括:以該溫度參考裝置執行加熱至一指定參考溫度;該處理階段更包括:以該處理器依據該量測熱影像執行運算以取得對應於該溫度參考裝置的一參考資訊,該參考資訊包括一參考影像區塊及對應於該參考影像區塊的一參考量測溫度;以及該校正階段更包括:以該處理器依據該指定參考溫度及該參考量測溫度計算一環境補償值,其中該校正溫度值是以該處理器依據該距離補償值及該環境補償值對該目標量測溫度執行校正運算而產生。 The temperature measurement and correction method based on thermal image as described in claim 1, wherein the thermal image device further includes a temperature reference device; the shooting stage of the temperature measurement and correction method further includes: using the temperature reference device to perform heating to a Designate a reference temperature; the processing stage further includes: using the processor to perform calculations based on the measured thermal image to obtain a reference information corresponding to the temperature reference device, the reference information includes a reference image block and a block corresponding to the reference image a reference measurement temperature of the block; and the calibration stage further includes: calculating an environmental compensation value by the processor according to the designated reference temperature and the reference measurement temperature, wherein the correction temperature value is based on the processor according to the distance The compensation value and the environmental compensation value are generated by performing a correction operation on the target measurement temperature. 如請求項2所述基於熱影像的溫度量測校正方法,其中該處理器是執行加總該目標量測溫度、該環境補償值及該距離補償值以產生該校正溫度值。 The thermal image-based temperature measurement correction method as described in claim 2, wherein the processor executes summing the target measurement temperature, the environment compensation value and the distance compensation value to generate the corrected temperature value. 如請求項2所述基於熱影像的溫度量測校正方法,其中該溫度參考裝置具有維持該指定參考溫度的一熱輻射片及可對該熱輻射片加熱的一加熱器,且在該處理階段中以該處理器依據該量測熱影像執行運算以取得該參考資訊包括:以該處理器對該量測熱影像執行運算以取得該量測熱影像的至少一候選參考區塊,其中每一候選參考區塊的溫度與該指定參考溫度之差值小於或等於一門檻值;以該處理器依據該至少一候選參考區塊的形狀與該熱輻射片的形狀執行比對,決定該至少一候選參考區塊中之一為該參考影像區塊;以及以該處理器依據該參考影像區塊的像素值計算該參考量測溫度。 The method for temperature measurement and correction based on thermal images as described in claim 2, wherein the temperature reference device has a heat radiation sheet that maintains the specified reference temperature and a heater that can heat the heat radiation sheet, and in the processing stage Using the processor to perform calculations based on the measured thermal image to obtain the reference information includes: using the processor to perform calculations on the measured thermal image to obtain at least one candidate reference block of the measured thermal image, each of which The difference between the temperature of the candidate reference block and the specified reference temperature is less than or equal to a threshold value; the processor performs comparison according to the shape of the at least one candidate reference block and the shape of the heat radiation sheet to determine the at least one One of the candidate reference blocks is the reference image block; and the processor calculates the reference measurement temperature according to the pixel values of the reference image block. 如請求項1所述基於熱影像的溫度量測校正方法,其中該處理器還儲存一距離補償表,該距離補償表記錄多個比對像素數量值及多個預設距離補償值之間的對應關係,且以該處理器依據該目標影像區塊之該像素數量取得該距離補償值包括:以該處理器依據該目標影像區塊之該像素數量查找該距離補償表以決定該些預設距離補償值中之一為該距離補償值。 The temperature measurement and correction method based on thermal image as described in claim 1, wherein the processor also stores a distance compensation table, which records the distance between multiple comparison pixel quantity values and multiple preset distance compensation values Corresponding relationship, and using the processor to obtain the distance compensation value according to the number of pixels of the target image block includes: using the processor to search the distance compensation table according to the number of pixels of the target image block to determine the presets One of the distance compensation values is the distance compensation value. 如請求項5所述基於熱影像的溫度量測校正方法,其中該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。 The temperature measurement correction method based on thermal image as described in claim 5, wherein the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value. 如請求項5所述基於熱影像的溫度量測校正方法,更包括一參數設定階段,該參數設定階段包括:該溫度參考裝置加熱至一指定測試溫度,並且該溫度參考裝置與該熱影像攝影機的間距為一預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一測試熱影像;以該處理器依據該測試熱影像執行運算以取得對應於該溫度參考裝置的測試參考資訊,該測試參考資訊包括一參考影像區塊及一參考量測溫度;以及以該處理器依據該測試參考資訊更新該距離補償表,其中該測試參考資訊的該參考影像區塊的像素數量為該些比對像素數量值中的一者,該參考量測溫度與該指定測試溫度的差值為該些預設距離補償值中的一者。 The temperature measurement and correction method based on thermal image as described in claim 5, further includes a parameter setting stage, the parameter setting stage includes: the temperature reference device is heated to a specified test temperature, and the temperature reference device and the thermal image camera The interval is a preset distance; the temperature reference device is photographed by the thermal image camera to generate a test thermal image; the processor is used to perform calculations based on the test thermal image to obtain test reference information corresponding to the temperature reference device, the The test reference information includes a reference image block and a reference measurement temperature; and the distance compensation table is updated by the processor according to the test reference information, wherein the number of pixels in the reference image block of the test reference information is the ratio For one of the pixel quantity values, the difference between the reference measurement temperature and the specified test temperature is one of the preset distance compensation values. 如請求項1所述基於熱影像的溫度量測校正方法,其中該熱影像裝置更包括一可見光攝影機,該拍攝階段更包括以該可見光攝影機拍攝該監控環境以產生一光學影像,該處理階段更包括以該處理器依據該熱影像、該光學影像及一物件辨識模型執行運算以決定該目標影像區塊。 The temperature measurement and correction method based on thermal image as described in claim 1, wherein the thermal image device further includes a visible light camera, and the shooting stage further includes shooting the monitoring environment with the visible light camera to generate an optical image, and the processing stage further includes The method includes using the processor to perform calculations according to the thermal image, the optical image and an object recognition model to determine the target image block. 如請求項1所述基於熱影像的溫度量測校正方法,其中以該處理器依據該目標影像區塊之該像素數量取得該距離補償值包括:以該處理器依據該目標影像區塊之該像素數量及一距離補償函數執行運算以取得該距離補償值,其中該距離補償函數表示多個比對像素數量值及多個預設距離補償值的擬合曲線。 The temperature measurement and correction method based on thermal image as described in claim 1, wherein using the processor to obtain the distance compensation value based on the number of pixels of the target image block includes: using the processor to obtain the distance compensation value based on the target image block The number of pixels and a distance compensation function perform an operation to obtain the distance compensation value, wherein the distance compensation function represents a fitting curve of a plurality of compared pixel number values and a plurality of preset distance compensation values. 如請求項9所述基於熱影像的溫度量測校正方法,其中該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。 The thermal image-based temperature measurement correction method as described in claim 9, wherein the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value. 如請求項9所述基於熱影像的溫度量測校正方法,其中該熱影像裝置更包括一溫度參考裝置;且該溫度量測校正方法更包括一參數設定階段,該參數設定階段包括:以該溫度參考裝置加熱至一指定測試溫度;調整該溫度參考裝置與該熱影像攝影機的間距為一第一預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第一測試熱影像;以該處理器依據該第一測試熱影像執行運算以取得一第一參考資訊,該第一參考資訊對應於該溫度參考裝置與第一預設距離並且包括一第一參考影像區塊及一第一參考量測溫度;以該處理器計算一第一預設距離補償值,該第一預設距離補償值為該第一參考量測溫度與該指定測試溫度的差值;調整該溫度參考裝置與該熱影像攝影機的間距為一第二預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第二測試熱影像;以該處理器依據該第二測試熱影像執行運算以取得一第二參考資訊,該第二參考資訊對應於該溫度參考裝置與第二預設距離並且包括一第二參考影像區塊及一第二參考量測溫度;以該處理器計算一第二預設距離補償值,該第二預設距離補償值為該第二參考量測溫度與該指定測試溫度的差值;及以該處理器依據該第一參考影像區塊的像素數量、該第二參考影像區塊的像素數量、該第一預設距離補償值、該第二預設距離補償值執行曲線擬合運算,以產生該距離補償函數。 The temperature measurement and correction method based on thermal image as described in claim 9, wherein the thermal image device further includes a temperature reference device; and the temperature measurement and correction method further includes a parameter setting stage, the parameter setting stage includes: using the heating the temperature reference device to a specified test temperature; adjusting the distance between the temperature reference device and the thermal imaging camera to a first preset distance; photographing the temperature reference device with the thermal imaging camera to generate a first test thermal image; The processor executes an operation according to the first test thermal image to obtain a first reference information, the first reference information corresponds to the temperature reference device and a first preset distance and includes a first reference image block and a first reference measurement temperature; calculate a first preset distance compensation value with the processor, the first preset distance compensation value is the difference between the first reference measurement temperature and the specified test temperature; adjust the temperature reference device and The distance between the thermal image cameras is a second preset distance; the thermal image camera is used to shoot the temperature reference device to generate a second test thermal image; the processor is used to perform calculations based on the second test thermal image to obtain a first test thermal image Two reference information, the second reference information corresponds to the temperature reference device and a second preset distance and includes a second reference image block and a second reference measurement temperature; a second preset distance is calculated by the processor Compensation value, the second preset distance compensation value is the difference between the second reference measurement temperature and the designated test temperature; A curve fitting operation is performed on the number of pixels of the block, the first preset distance compensation value, and the second preset distance compensation value to generate the distance compensation function. 一種熱影像裝置,包括: 一熱影像攝影機,拍攝一監控環境以產生一量測熱影像;以及一處理器,電性連接該熱影像攝影機,該處理器依據該量測熱影像執行運算以取得一目標資訊,該目標資訊對應於該監控環境中的一量測目標,該目標資訊包括一目標影像區塊及對應於該目標影像區塊的一目標量測溫度;該處理器依據該目標影像區塊之一像素數量取得一距離補償值;該處理器至少依據該距離補償值對該目標量測溫度執行校正以產生對應於該量測目標的一校正溫度值。 A thermal imaging device comprising: A thermal image camera, shooting a monitoring environment to generate a measurement thermal image; and a processor, electrically connected to the thermal image camera, the processor executes calculations based on the measurement thermal image to obtain a target information, the target information Corresponding to a measurement target in the monitoring environment, the target information includes a target image block and a target measurement temperature corresponding to the target image block; the processor obtains according to a pixel quantity of the target image block A distance compensation value; the processor corrects the target measured temperature at least according to the distance compensation value to generate a corrected temperature value corresponding to the measurement target. 如請求項12所述熱影像裝置,更包括一溫度參考裝置電性連接該處理器,該溫度參考裝置執行加熱至一指定參考溫度,該處理器依據該量測熱影像執行運算以取得對應該溫度參考裝置的一參考資訊,該參考資訊包括一參考影像區塊及對應該參考影像區塊的一參考量測溫度,該處理器依據該指定參考溫度及該參考量測溫度計算一環境補償值,其中該校正溫度值是以該處理器依據該距離補償值及該環境補償值對該目標量測溫度執行校正運算而產生。 The thermal imaging device as described in claim 12 further includes a temperature reference device electrically connected to the processor, the temperature reference device performs heating to a specified reference temperature, and the processor performs calculations based on the measured thermal image to obtain the corresponding A reference information of the temperature reference device, the reference information includes a reference image block and a reference measurement temperature corresponding to the reference image block, the processor calculates an environmental compensation value according to the specified reference temperature and the reference measurement temperature , wherein the corrected temperature value is generated by performing a correction operation on the target measured temperature by the processor according to the distance compensation value and the environment compensation value. 如請求項12所述熱影像裝置,該處理器是執行加總該目標量測溫度、該環境補償值及該距離補償值以產生該校正溫度值。 In the thermal imaging device according to claim 12, the processor performs summing of the target measured temperature, the environment compensation value and the distance compensation value to generate the corrected temperature value. 如請求項12所述熱影像裝置,該溫度參考裝置具有維持該指定參考溫度的一熱輻射片及可對該熱輻射片加熱的一加熱器,該處理器對該量測熱影像執行運算以取得該量測熱影像的至少一候選參考區塊,其中每一候選參考區塊的溫度與該指定參考溫度之差值小於或等於一門檻值,該處理器依據該至少一候選參考區塊的形狀與該熱輻射片的形狀執行 比對,決定該至少一候選參考區塊中之一為該參考影像區塊;以及該處理器依據該參考影像區塊的像素值計算該參考量測溫度。 As the thermal image device described in claim 12, the temperature reference device has a thermal radiation sheet that maintains the specified reference temperature and a heater that can heat the thermal radiation sheet, and the processor executes an operation on the measured thermal image to Obtaining at least one candidate reference block of the measured thermal image, wherein the difference between the temperature of each candidate reference block and the specified reference temperature is less than or equal to a threshold value, and the processor is based on the at least one candidate reference block shape performs with the shape of the heat radiating sheet comparing and determining one of the at least one candidate reference block as the reference image block; and the processor calculates the reference measurement temperature according to the pixel value of the reference image block. 如請求項12所述熱影像裝置,其中該處理器還儲存一距離補償表,該距離補償表記錄多個比對像素數量值及多個預設距離補償值之間的對應關係,且該處理器依據該目標影像區塊之該像素數量查找該距離補償表以決定該些預設距離補償值中之一為該距離補償值。 The thermal imaging device as described in claim 12, wherein the processor also stores a distance compensation table, the distance compensation table records the corresponding relationship between a plurality of comparison pixel quantity values and a plurality of preset distance compensation values, and the processing The processor looks up the distance compensation table according to the number of pixels of the target image block to determine one of the preset distance compensation values as the distance compensation value. 如請求項12所述熱影像裝置,其中該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。 The thermal imaging device as claimed in claim 12, wherein the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value. 如請求項16所述熱影像裝置,在該溫度參考裝置加熱至該指定測試溫度之前,該溫度參考裝置加熱至一指定測試溫度,並且該溫度參考裝置與該熱影像攝影機的間距為一預設距離,該熱影像攝影機拍攝該溫度參考裝置以產生一測試熱影像;該處理器依據該測試熱影像執行運算以取得對應於該溫度參考裝置的測試參考資訊,該測試參考資訊包括一參考影像區塊及一參考量測溫度;該處理器依據該測試參考資訊更新該距離補償表,其中該測試參考資訊的該參考影像區塊的像素數量為該些比對像素數量值中的一者,該參考量測溫度與該指定測試溫度的差值為該些預設距離補償值中的一者。 The thermal imaging device as described in claim 16, before the temperature reference device is heated to the specified test temperature, the temperature reference device is heated to a specified test temperature, and the distance between the temperature reference device and the thermal imaging camera is a preset distance, the thermal image camera captures the temperature reference device to generate a test thermal image; the processor executes calculations based on the test thermal image to obtain test reference information corresponding to the temperature reference device, and the test reference information includes a reference image area block and a reference measurement temperature; the processor updates the distance compensation table according to the test reference information, wherein the pixel quantity of the reference image block of the test reference information is one of the comparison pixel quantity values, the The difference between the reference measurement temperature and the specified test temperature is one of the preset distance compensation values. 如請求項12所述熱影像裝置,更包括一可見光攝影機電性連接該處理器,該可見光攝影機拍攝該監控環境以產生一光學影像,該處理器依據該熱影像、該光學影像及一物件辨識模型執行運算以決定該目標影像區塊。 The thermal imaging device as described in claim 12 further includes a visible light camera electromechanically connected to the processor, the visible light camera photographs the monitoring environment to generate an optical image, and the processor recognizes the thermal image, the optical image and an object The model performs calculations to determine the target image block. 如請求項12所述熱影像裝置,該處理器依據該目標影像區塊之該像素數量及一距離補償函數執行運算以取得該距離補償值,其中該距離補償函數表示多個比對像素數量值及多個預設距離補償值的擬合曲線。 As the thermal imaging device described in claim 12, the processor executes an operation according to the number of pixels of the target image block and a distance compensation function to obtain the distance compensation value, wherein the distance compensation function represents a plurality of comparison pixel quantity values and a fitting curve of multiple preset distance compensation values. 如請求項20所述熱影像裝置,該處理器是執行加總該目標量測溫度及該距離補償值以取得該校正溫度值。 As for the thermal imaging device described in claim 20, the processor performs summing of the target measured temperature and the distance compensation value to obtain the corrected temperature value. 如請求項20所述熱影像裝置,該熱影像裝置更包括一溫度參考裝置,在該溫度參考裝置加熱至該指定參考溫度之前,該溫度參考裝置加熱至一指定測試溫度;且該熱影像裝置執行以下步驟;調整該溫度參考裝置與該熱影像攝影機的間距為一第一預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第一測試熱影像;以該處理器依據該第一測試熱影像執行運算以取得一第一參考資訊,該第一參考資訊對應於該溫度參考裝置與第一預設距離並且包括一第一參考影像區塊及一第一參考量測溫度;以該處理器計算一第一預設距離補償值,該第一預設距離補償值為該第一參考量測溫度與該指定測試溫度的差值;調整該溫度參考裝置與該熱影像攝影機的間距為一第二預設距離;以該熱影像攝影機拍攝該溫度參考裝置以產生一第二測試熱影像;以該處理器依據該第二測試熱影像執行運算以取得一第二參考資訊,該第二參考資訊對應於該溫度參考裝置與第二預設距離並且包括一第二參考影像區塊及一第二參考量測溫度; 以該處理器計算一第二預設距離補償值,該第二預設距離補償值為該第二參考量測溫度與該指定測試溫度的差值;及以該處理器依據該第一參考影像區塊的像素數量、該第二參考影像區塊的像素數量、該第一預設距離補償值、該第二預設距離補償值執行曲線擬合運算,以產生該距離補償函數。 The thermal imaging device as described in claim 20, the thermal imaging device further includes a temperature reference device, and the temperature reference device is heated to a specified test temperature before the temperature reference device is heated to the specified reference temperature; and the thermal imaging device Perform the following steps: adjust the distance between the temperature reference device and the thermal image camera to be a first preset distance; use the thermal image camera to shoot the temperature reference device to generate a first test thermal image; use the processor according to the first A test thermal image performs an operation to obtain a first reference information, the first reference information corresponds to the temperature reference device and a first preset distance and includes a first reference image block and a first reference measurement temperature; The processor calculates a first preset distance compensation value, the first preset distance compensation value is the difference between the first reference measurement temperature and the specified test temperature; adjusts the distance between the temperature reference device and the thermal imaging camera is a second preset distance; use the thermal image camera to shoot the temperature reference device to generate a second test thermal image; use the processor to perform calculations based on the second test thermal image to obtain a second reference information, the first The second reference information corresponds to the temperature reference device and a second preset distance and includes a second reference image block and a second reference measurement temperature; calculating a second preset distance compensation value with the processor, the second preset distance compensation value is the difference between the second reference measurement temperature and the specified test temperature; and using the processor according to the first reference image The pixel quantity of the block, the pixel quantity of the second reference image block, the first preset distance compensation value, and the second preset distance compensation value perform a curve fitting operation to generate the distance compensation function.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200600056A (en) * 2004-06-25 2006-01-01 Univ Southern Taiwan Tech Fever detecting method and system
CN109916517A (en) * 2017-12-12 2019-06-21 纬创资通股份有限公司 Thermal imagery processing system and method
CN111458037A (en) * 2020-06-08 2020-07-28 深圳市迪米科技有限公司 Body temperature screening recording device and body temperature screening processing method
TWM601379U (en) * 2020-03-17 2020-09-11 城市學校財團法人臺北城市科技大學 Intelligent forehead temperature sensing with automatic identity recognition
CN112033545A (en) * 2020-08-17 2020-12-04 深圳市视美泰技术股份有限公司 Human body temperature infrared measurement method and device and computer equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200600056A (en) * 2004-06-25 2006-01-01 Univ Southern Taiwan Tech Fever detecting method and system
CN109916517A (en) * 2017-12-12 2019-06-21 纬创资通股份有限公司 Thermal imagery processing system and method
TWM601379U (en) * 2020-03-17 2020-09-11 城市學校財團法人臺北城市科技大學 Intelligent forehead temperature sensing with automatic identity recognition
CN111458037A (en) * 2020-06-08 2020-07-28 深圳市迪米科技有限公司 Body temperature screening recording device and body temperature screening processing method
CN112033545A (en) * 2020-08-17 2020-12-04 深圳市视美泰技术股份有限公司 Human body temperature infrared measurement method and device and computer equipment

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