TWI809339B - Connection structure between porous surface structure and substrate, prosthesis, preparation method and device - Google Patents

Connection structure between porous surface structure and substrate, prosthesis, preparation method and device Download PDF

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TWI809339B
TWI809339B TW109146092A TW109146092A TWI809339B TW I809339 B TWI809339 B TW I809339B TW 109146092 A TW109146092 A TW 109146092A TW 109146092 A TW109146092 A TW 109146092A TW I809339 B TWI809339 B TW I809339B
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porous
substrate
electrode
porous surface
surface structure
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TW202133977A (en
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建清 姚
史金虎
朱永良
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大陸商驕英醫療器械(上海)有限公司
大陸商雅博尼西醫療科技(蘇州)有限公司
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Priority claimed from CN201911393091.9A external-priority patent/CN111084676B/en
Priority claimed from CN201911388633.3A external-priority patent/CN110773854B/en
Priority claimed from CN201911395087.6A external-priority patent/CN111012551A/en
Application filed by 大陸商驕英醫療器械(上海)有限公司, 大陸商雅博尼西醫療科技(蘇州)有限公司 filed Critical 大陸商驕英醫療器械(上海)有限公司
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Abstract

本發明公開了一種多孔性表面結構和基底的連接結構、假體及製備方法和裝置。多孔性表面結構與中間體預先連接形成複合體;中間體位於多孔性表面結構與基底之間,中間體與基底接觸;基底與複合體置於第一極性電極和第二極性電極之間;第一極性電極與多孔性表面結構和/或中間體導電接觸,基底與第二極性電極導電接觸,形成電流回路;中間體和基底進行電阻焊接,實現複合體與基底的連接。本發明將複合體和基板通過電阻焊法實現緊固連接,保持基底力學性能;可以保證人工植入假體具備優良的骨長入性能,且使基底的強度不受實質性影響。 The invention discloses a connection structure between a porous surface structure and a substrate, a prosthesis, a preparation method and a device. The porous surface structure and the intermediate are pre-connected to form a complex; the intermediate is located between the porous surface structure and the substrate, and the intermediate is in contact with the substrate; the substrate and the complex are placed between the first polarity electrode and the second polarity electrode; One polarity electrode is in conductive contact with the porous surface structure and/or the intermediate body, and the substrate is in conductive contact with the second polarity electrode to form a current loop; the intermediate body and the substrate are subjected to resistance welding to realize the connection between the complex and the substrate. In the invention, the composite body and the base plate are fastened and connected by resistance welding, and the mechanical properties of the base are maintained; the artificial implant prosthesis can be guaranteed to have excellent bone ingrowth performance, and the strength of the base is not substantially affected.

Description

多孔性表面結構和基底的連接結構、假體及製備方法和裝置 Connection structure between porous surface structure and substrate, prosthesis, preparation method and device

本發明涉及機械結構的連接技術,特別涉及醫療器械,提供一種用於製備多孔性表面結構和基底的連接結構的方法和裝置,一種多孔性表面結構和基底的連接結構,以及基於多孔性表面結構和基底的連接結構的假體。 The invention relates to the connection technology of mechanical structures, in particular to medical devices, and provides a method and device for preparing a connection structure between a porous surface structure and a substrate, a connection structure between a porous surface structure and a substrate, and a structure based on a porous surface structure. The prosthesis of the connection structure with the base.

工程應用常常對機械結構的整體性能和表面性能有不同的要求。比如,人工髖關節的髖臼杯和股骨柄,其整體性能(如疲勞強度)要滿足假體在植入體內後幾十年、平均每年一百萬到兩百萬次走路時承受的動態載荷下的抗疲勞要求,而且對假體表面有特定的性能需要,以滿足假體表面與病人的骨骼組牢固結合在一起,保證假體不鬆動;否則病人會有疼痛,就必須取出假體,使病人再經過一次翻修手術,植入一個新的假體。其它骨科植入物(如脊柱)也有類似情況和需求。事實上,在其它領域,也有基底和表面有不同性能需求,而兩者之間需要可靠有效連接的情況。 Engineering applications often have different requirements on the overall performance and surface performance of mechanical structures. For example, the overall performance (such as fatigue strength) of the acetabular cup and femoral stem of the artificial hip joint must meet the dynamic load that the prosthesis bears when it is implanted in the body for decades, with an average of one million to two million walks per year In addition, there are specific performance requirements for the surface of the prosthesis, so as to meet the firm combination of the surface of the prosthesis and the patient's bone group and ensure that the prosthesis does not loosen; otherwise, the patient will have pain, and the prosthesis must be taken out. The patient undergoes another revision surgery with a new prosthesis implanted. Other orthopedic implants (such as the spine) have similar situations and needs. In fact, in other fields, there are also cases where the substrate and the surface have different performance requirements, and a reliable and effective connection between the two is required.

關節假體常用的人工材料是鈦合金/鈷鉻鋼合金/不銹鋼等,和骨頭無法形成有效的生物或化學結合。假體和骨之間的介面一般主要通過物理/機械結合。比如,高度拋光的假體表面和骨組織無法形成有效的結合力,所以,需要增加骨傳導、骨誘導、骨再生,以加速或加強骨組織與假體表面的結合,進一步提高骨長上或骨長入的性能。有時鈦絲或鈦珠等可以用燒結或擴散焊等方法在假體(如髖臼杯/股骨柄)的表面形成多孔性的塗層。或者,用金屬3D列印增材製造製程、氣相沉澱製程等等,預先製作出具有多孔結構的薄片0001,然後用擴散焊的方式 把薄片0001與假體的實心基底0002結合起來,如圖1所示。這些方式為假體提供了多孔性的表面,與假體接觸的骨組織能夠再生,新的骨組織填充於互相貫通的多孔結構裡,達到了“骨長入”假體的效果。但是,這些製程都有一個不可避免的後果,就是基底的力學強度會大幅降低,從而提高了假體斷裂的風險,特別是當假體(比如股骨柄)受到彎曲扭矩或拉伸應力情況下,容易斷裂。所以,如何可靠牢固地把一個多孔性結構與其基底結合,同時保證基底力學性能不受太明顯的影響成為一個設計/製程難點。 Commonly used artificial materials for joint prostheses are titanium alloys/cobalt-chromium steel alloys/stainless steel, etc., which cannot form effective biological or chemical bonds with bones. The interface between the prosthesis and bone is generally primarily through physical/mechanical bonding. For example, the highly polished prosthesis surface and bone tissue cannot form an effective bonding force, so it is necessary to increase osteoconduction, osteoinduction, and bone regeneration to accelerate or strengthen the combination of bone tissue and the surface of the prosthesis, and further improve bone growth or The performance of bone ingrowth. Sometimes titanium wire or titanium beads can be used to form a porous coating on the surface of the prosthesis (such as acetabular cup/femoral stem) by sintering or diffusion welding. Or, use metal 3D printing additive manufacturing process, vapor deposition process, etc. to pre-fabricate a thin sheet 0001 with a porous structure, and then use diffusion welding Combine the sheet 0001 with the solid base 0002 of the prosthesis, as shown in Figure 1. These methods provide the prosthesis with a porous surface, the bone tissue in contact with the prosthesis can regenerate, and the new bone tissue fills the interpenetrating porous structure, achieving the effect of "bone growing into" the prosthesis. However, these processes have an unavoidable consequence, that is, the mechanical strength of the substrate will be greatly reduced, thereby increasing the risk of fracture of the prosthesis, especially when the prosthesis (such as the femoral stem) is subjected to bending torque or tensile stress, easy to break. Therefore, how to reliably and firmly combine a porous structure with its substrate while ensuring that the mechanical properties of the substrate are not too significantly affected has become a design/process difficulty.

相對而言,焊接製程對基底的力學性能影響較低。但是,當多孔性結構的孔隙率很高時(>50%),互相連接的支架占比較低,而且薄弱;支架之間形成大量孔隙。這樣的高孔隙率結構無論用金屬3D列印增材製造製程實現,還是通過燒結等方式實現,在直接用鐳射焊接對多孔性結構和基底進行連接時,只要雷射光束有效直徑接近甚至大於支架寬度時,鐳射能量可能直接擊斷支架結構,打透多孔性結構,無法對多孔性結構的支架和基底支架實現有效的焊接連接。又或者,當採用滲透焊對多孔性結構和基底進行連接時,由於處於高溫高壓條件下,基底結構的強度會大幅降低。 Relatively speaking, the welding process has less influence on the mechanical properties of the substrate. However, when the porosity of the porous structure is high (>50%), the proportion of interconnected scaffolds is low and weak; a large number of pores are formed between the scaffolds. Whether such a high-porosity structure is realized by metal 3D printing additive manufacturing process or by sintering, when the porous structure and the substrate are directly connected by laser welding, as long as the effective diameter of the laser beam is close to or even larger than that of the stent When the width is wide, the laser energy may directly break the support structure, penetrate the porous structure, and cannot achieve effective welding connection between the porous structure support and the base support. Or, when penetration welding is used to connect the porous structure and the substrate, the strength of the substrate structure will be greatly reduced due to the high temperature and high pressure conditions.

為避免上述鐳射焊和滲透焊的缺陷,可採用一種將兩個被焊工件壓緊在兩電極之間並通過電流流經兩個工件之間的接觸面及鄰近區域產生的電阻熱而使其形成金屬工件之間有效結合的電阻焊法,將多孔性結構和基底進行連接。但是,對於高孔隙率結構而言,當利用電阻焊將多孔性結構和基底直接進行連接時,此時結合效率較低,導致焊接結合強度不足或者需要太高的電流來達到足夠的焊接強度,後者導致上電極和多孔結構上表面接觸產生熱量太高以致於過多損傷多孔結構的表面,包括孔隙結構下沉等,因此,本發明需要在多孔性結構和基底之間設計中間體結構,實現多孔性表面結構與中間底板形成的複合體 與基底緊密結合在一起,用以提高多孔性結構和基底的結合效率以及保證足夠的焊接強度。 In order to avoid the defects of the above-mentioned laser welding and penetration welding, a kind of resistance heat generated by pressing the two workpieces to be welded between the two electrodes and passing the current through the contact surface and the adjacent area between the two workpieces can be used to make it Resistance welding, which forms an effective bond between metal workpieces, connects porous structures and substrates. However, for high-porosity structures, when resistance welding is used to directly connect the porous structure and the substrate, the bonding efficiency is low at this time, resulting in insufficient welding bonding strength or requiring too high a current to achieve sufficient welding strength, The latter causes the contact between the upper electrode and the upper surface of the porous structure to generate too much heat so that the surface of the porous structure is damaged too much, including the sinking of the pore structure. Therefore, the present invention needs to design an intermediate structure between the porous structure and the substrate to realize the porous structure. The complex formed by the surface structure and the middle floor It is closely combined with the substrate to improve the bonding efficiency between the porous structure and the substrate and to ensure sufficient welding strength.

本發明的目的在於提供一種多孔性表面結構和基底的連接結構及其製備方法和製備裝置、並提供一種基於所述多孔性表面結構和基底的連接結構的假體。將多孔性表面結構、中間體(實心板結構或低孔隙率的多孔結構)和基板通過電阻焊法(例如凸焊式電阻焊或點焊式電阻焊等)實現緊固連接,保持基底力學性能;基於本發明的多孔性結構的表面,可以保證人工植入假體具備優良的骨長入性能,並且使基底的強度不受實質性影響。 The object of the present invention is to provide a connection structure between a porous surface structure and a substrate, a preparation method and a preparation device thereof, and a prosthesis based on the connection structure between the porous surface structure and a substrate. The porous surface structure, intermediate (solid plate structure or low-porosity porous structure) and substrate are firmly connected by resistance welding (such as projection welding resistance welding or spot welding resistance welding, etc.) to maintain the mechanical properties of the substrate ; Based on the surface of the porous structure of the present invention, it can ensure that the artificial implant prosthesis has excellent bone ingrowth performance, and the strength of the base is not substantially affected.

為了達到上述目的,本發明通過以下技術方案實現:一種用於連接多孔性表面結構和基底的方法,該方法包含:多孔性表面結構與中間體預先連接形成複合體;所述中間體位於多孔性表面結構與基底之間,所述中間體與所述基底接觸;所述中間體和所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 In order to achieve the above object, the present invention is achieved through the following technical solutions: a method for connecting a porous surface structure and a substrate, the method comprising: the porous surface structure is pre-connected with an intermediate to form a composite; Between the surface structure and the base, the intermediate body is in contact with the base; the intermediate body and the base are subjected to resistance welding to realize the connection between the composite body and the base.

較佳地,所述基底與所述複合體置於第一極性電極和第二極性電極之間;所述第一極性電極與所述多孔性表面結構和/或中間體導電接觸,所述基底與第二極性電極導電接觸,形成電流回路,使所述中間體和所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 Preferably, the substrate and the complex are placed between a first polarity electrode and a second polarity electrode; the first polarity electrode is in conductive contact with the porous surface structure and/or the intermediate body, and the substrate Conducting contact with the second polarity electrode to form a current loop, so that the intermediate body and the substrate are subjected to resistance welding to realize the connection between the composite body and the substrate.

較佳地,所述複合體中的多孔性表面結構稱為第一多孔結構;所述中間體是實心結構,或者,所述中間體是第二多孔結構並且所述第二多孔結構的孔隙率低於所述第一多孔結構的孔隙率。 Preferably, the porous surface structure in the complex is called a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure and the second porous structure The porosity is lower than the porosity of the first porous structure.

較佳地,所述電阻焊接為凸焊式電阻焊和/或點焊式電阻焊。 Preferably, the resistance welding is projection welding resistance welding and/or spot welding resistance welding.

較佳地,當所述電阻焊接為凸焊式電阻焊時,所述第一極性電極是連續的平面電極或分段的多個電極單體,所述第二極性電極是連續的平面電極或分段的多個電極單體;當所述電阻焊接為點焊式電阻焊時,所述第一極性電極和/或所述第二極性電極是分段的多個電極單體。 Preferably, when the resistance welding is projection welding resistance welding, the first polarity electrode is a continuous planar electrode or a plurality of segmented electrode monomers, and the second polarity electrode is a continuous planar electrode or A plurality of segmented electrode units; when the resistance welding is spot welding resistance welding, the first polarity electrode and/or the second polarity electrode is a plurality of segmented electrode units.

較佳地,當點焊式電阻焊時,通過移動以下任意一個或多個部件:第一極性電極、第二極性電極、已在至少一個接觸位置完成焊接的中間體與基底結合體,使得從當前焊接位置移動到下一焊接位置。 Preferably, during spot welding resistance welding, by moving any one or more of the following components: the first polarity electrode, the second polarity electrode, the intermediate body and the base combination that have been welded at least one contact position, so that from The current welding position moves to the next welding position.

較佳地,所述第一極性電極分成多個電極單體時,所述電極單體插入至多孔性表面結構內的預製空隙,電極單體靠近所述中間體,使得插入後的所述電極單體與所述中間體導電接觸或者使得插入後的所述電極單體經過多孔性表面結構與所述中間體導電接觸。 Preferably, when the first polarity electrode is divided into a plurality of electrode monomers, the electrode monomers are inserted into the prefabricated gaps in the porous surface structure, and the electrode monomers are close to the intermediate body, so that the inserted electrodes The monomer is in conductive contact with the intermediate body or the inserted electrode monomer is in conductive contact with the intermediate body through a porous surface structure.

較佳地,所述電極單體從多孔性表面結構的表面穿過直至穿透至中間體表面或中間體的內部,使得插入後的所述電極單體與所述中間體導電接觸。 Preferably, the electrode monomer penetrates from the surface of the porous surface structure to the surface of the intermediate body or the interior of the intermediate body, so that the inserted electrode monomer is in conductive contact with the intermediate body.

較佳地,所述電極單體與所述多孔性表面結構為側向間隙配合,使得所述電極單體與所述多孔性表面結構完全不接觸。 Preferably, the electrode unit is fitted with the porous surface structure in a lateral clearance, so that the electrode unit does not contact the porous surface structure at all.

較佳地,所述多個電極單體並聯連接至另一平面電極且所述另一平面電極與電源端連接,或者,所述多個電極單體並聯並直接連接至電源端。 Preferably, the plurality of electrode units are connected in parallel to another planar electrode and the other planar electrode is connected to the power supply terminal, or the plurality of electrode units are connected in parallel and directly connected to the power supply terminal.

較佳地,所述第一極性電極為柔性電極,所述柔性電極在壓力作用下,通過柔性變形使得其與所述多孔性表面結構的表面相匹配,增大所述柔性電極與所述多孔性表面結構的表面的接觸面積。 Preferably, the first polarity electrode is a flexible electrode, and under the action of pressure, the flexible electrode can be flexibly deformed to match the surface of the porous surface structure, thereby increasing the contact between the flexible electrode and the porous surface structure. The contact area of the surface of the permanent surface structure.

較佳地,所述第一極性電極為正電極,所述第二極性電極為負電極;或者,所述第一極性電極為負電極,所述第二極性電極為正電極。 Preferably, the first polarity electrode is a positive electrode, and the second polarity electrode is a negative electrode; or, the first polarity electrode is a negative electrode, and the second polarity electrode is a positive electrode.

較佳地,所述第一極性電極和所述第二極性電極由導電材料製成;所述基底由導電材料製成,所述多孔性表面結構由導電材料製成,所述中間體由導電材料製成。 Preferably, the first polarity electrode and the second polarity electrode are made of conductive material; the substrate is made of conductive material, the porous surface structure is made of conductive material, and the intermediate is made of conductive material. material.

較佳地,所述中間體包含中間板結構。 Preferably, the intermediate body comprises an intermediate plate structure.

較佳地,所述中間板結構上設置多個凸起結構,所述凸起結構設置在所述中間板結構上靠近所述基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, a plurality of protruding structures are arranged on the middle plate structure, and the protruding structures are arranged on the side of the middle plate structure close to the base, and the protruding points of the protruding structures are in contact with the base touch.

較佳地,所述中間體是所述第二多孔結構,所述第二多孔結構包含多個凸起結構,所述凸起結構形成在所述第二多孔結構上靠近所述基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, the intermediate body is the second porous structure, the second porous structure comprises a plurality of protruding structures, and the protruding structures are formed on the second porous structure close to the substrate On one side, the bumps of the raised structure are in contact with the substrate.

較佳地,所述中間體包含複數個分散佈置的凸起結構,形成在所述多孔性表面結構靠近基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, the intermediate body includes a plurality of protruding structures dispersedly arranged on the side of the porous surface structure close to the substrate, and the bumps of the protruding structures are in contact with the substrate.

較佳地,所述複合體包含複數個支撐柱,每個支撐柱的全部或至少部分位於多孔性表面結構內。 Preferably, the composite body comprises a plurality of support pillars, all or at least part of each support pillar is located in the porous surface structure.

較佳地,所述支撐柱與所述中間體的凸起結構對應佈置並接觸,或所述支撐柱與所述中間體的凸起結構錯位分佈且不接觸。 Preferably, the supporting pillars are arranged correspondingly to and in contact with the protruding structures of the intermediate body, or the supporting pillars are dislocated and not in contact with the protruding structures of the intermediate body.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面;或者,所述支撐柱的遠離基底一側的表面低於所述多孔性表面結構的表面;或者,所述支撐柱的遠離基底一側的表面與所述多孔性表面結構的表面平齊。 Preferably, the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure; or, the surface of the support column on the side away from the substrate is lower than the surface of the porous surface structure; or , the surface of the support column away from the substrate is flush with the surface of the porous surface structure.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面時,在電阻焊完成後,切割所述支撐柱超出所述多孔性表面結構的部分。 Preferably, when the surface of the supporting column on the side away from the base exceeds the surface of the porous surface structure, after the resistance welding is completed, the part of the supporting column exceeding the porous surface structure is cut.

較佳地,所述第一極性電極分成多個電極單體時,所述支撐柱位於所述多孔性表面結構的預製空隙內,所述支撐柱開設凹槽,用於放置所述電極單體,插入後的所述電極單體與所述支撐柱導電接觸; 所述支撐柱的表面超出或平齊於或低於所述多孔性表面結構的表面,所述支撐柱為多孔結構或實心結構。 Preferably, when the first polarity electrode is divided into a plurality of electrode units, the support column is located in the prefabricated gap of the porous surface structure, and the support column is provided with a groove for placing the electrode unit , the inserted electrode monomer is in conductive contact with the support column; The surface of the support column is higher than or equal to or lower than the surface of the porous surface structure, and the support column is a porous structure or a solid structure.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面時:所述支撐柱為多段結構,至少包含超出所述多孔性表面結構的第一段部分和剩餘的第二段部分;所述第一段部分為多孔結構;所述第二段部分為多孔結構或實心結構,所述第二段部分上遠離基底一側的表面平齊於所述多孔性表面結構的表面,使得第一段部分因與第一極性電極接觸生熱導致所述支撐柱下沉至所述第二段部分的遠離基底一側的表面。 Preferably, when the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure: the support column is a multi-segment structure, at least including the first section beyond the porous surface structure and the remaining The second section; the first section is a porous structure; the second section is a porous structure or a solid structure, and the surface on the side of the second section away from the substrate is flush with the porous surface The surface of the structure is such that the heat generated by the first section part due to contact with the first polarity electrode causes the support column to sink to the surface of the second section part away from the base.

較佳地,所述支撐柱為導電體時,所述支撐柱接入到所述電流回路,所述支撐柱與以下任意一個或多個部件導電接觸:第一極性電極、多孔性表面結構、中間體。 Preferably, when the support column is a conductor, the support column is connected to the current loop, and the support column is in conductive contact with any one or more of the following components: first polarity electrode, porous surface structure, intermediate.

較佳地,所述支撐柱為絕緣體。 Preferably, the support column is an insulator.

較佳地,所述凸起結構位於所述中間體上的位置,靠近所述多孔性表面結構與所述中間體的接觸位置。 Preferably, the protruding structure is located on the intermediate body, close to the contact position between the porous surface structure and the intermediate body.

較佳地,所述多孔性表面結構內至少部分的孔隙內填充導電材料。 Preferably, at least part of the pores in the porous surface structure are filled with conductive materials.

較佳地,所述多孔性表面結構內至少部分的孔隙內填充粉末狀的導電材料或絲材狀的導電材料或網狀的導電材料。 Preferably, at least part of the pores in the porous surface structure are filled with powdery conductive material or wire-like conductive material or mesh-like conductive material.

較佳地,多孔性表面結構的至少部分的表面鋪設固體薄膜狀或絲狀或網狀的可變形導電介質,所述可變形導電介質位於所述第一極性電極和所述多孔性表面結構之間;和/或,至少部分的多孔性表面結構的表面與所述第一極性電極之間噴塗固態導電介質或液態導電劑。 Preferably, at least part of the surface of the porous surface structure is covered with a solid film-shaped or filamentary or mesh-shaped deformable conductive medium, and the deformable conductive medium is located between the first polarity electrode and the porous surface structure. and/or, a solid conductive medium or a liquid conductive agent is sprayed between at least part of the surface of the porous surface structure and the first polarity electrode.

較佳地,至少部分的多孔性表面結構的孔隙內注入熔融狀的導電介質,和/或,至少部分的多孔性表面結構的孔隙內置導電介質並通過高 溫使導電介質成熔融狀;所述導電介質的熔點低於基底的熔點和/或多孔性表面結構的熔點。 Preferably, at least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or, at least part of the pores of the porous surface structure is filled with a conductive medium and passed through a high The temperature melts the conductive medium; the melting point of the conductive medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure.

較佳地,所述基底是實心結構,或者,所述基底是第三多孔結構且所述第三多孔結構的孔隙率小於所述多孔性表面結構的孔隙率。 Preferably, the substrate is a solid structure, or, the substrate is a third porous structure and the porosity of the third porous structure is smaller than that of the porous surface structure.

較佳地,所述基底通過鍛造或鑄造或機加工製成。 Preferably, the base is made by forging or casting or machining.

較佳地,所述複合體的多孔性表面結構與中間體一體成型。 Preferably, the porous surface structure of the composite body is integrally formed with the intermediate body.

較佳地,所述複合體的多孔性表面結構與中間體,通過3D列印增材製造製程、或氣相沉澱製程實現。 Preferably, the porous surface structure and the intermediate body of the composite are realized through a 3D printing additive manufacturing process or a vapor deposition process.

較佳地,所述多孔性表面結構、所述中間體和所述支撐柱一體成型。 Preferably, the porous surface structure, the intermediate body and the support column are integrally formed.

較佳地,所述多孔性表面結構的表面設置複數個凹槽,所述凹槽的表面低於所述多孔性表面結構的表面,將所述多孔性表面結構劃分成多個區域;經所述凹槽劃分出的各區域,均被各區域對應接觸的第一極性電極覆蓋,與所述多孔性表面結構的任意一區域對應接觸的第一極性電極的邊緣,與鄰近所述任意一區域的凹槽的位置關係是:第一極性電極的邊緣,未到達凹槽的第一側且與凹槽的第一側不接觸、或到達凹槽的第一側、或跨過凹槽的第一側且不超出凹槽的第二側、或跨過凹槽的第一側並到達凹槽的第二側、或跨過凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,凹槽的第一側為靠近所述任意一區域的一側,凹槽的第二側為遠離所述任意一區域的一側。 Preferably, the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porous surface structure is divided into multiple regions; Each area divided by the groove is covered by the first polarity electrode corresponding to each area, and the edge of the first polarity electrode corresponding to any area of the porous surface structure is in contact with the adjacent any area. The positional relationship of the groove is: the edge of the first polarity electrode does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or straddles the first side of the groove One side and not beyond the second side of the groove, or across the first side of the groove and to the second side of the groove, or across the second side of the groove and contact at least a part of another adjacent area ; Wherein, the first side of the groove is the side close to the arbitrary region, and the second side of the groove is the side away from the arbitrary region.

較佳地,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的第一極性電極同時覆蓋;或者,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被兩個不同的第一極性電極按先後次序分兩次覆蓋;或者,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,被同一個第一極性電極按先後次序分兩次覆蓋。 Preferably, on the surface of the porous surface structure, two adjacent regions divided by grooves are respectively covered simultaneously by two different first polarity electrodes whose covering positions do not overlap; or, the porous surface On the surface of the structure, two adjacent regions divided by grooves are respectively covered twice by two different electrodes of the first polarity in sequence; or, on the surface of the porous surface structure, the regions divided by grooves The two adjacent regions are covered by the same first polarity electrode in two successive steps.

較佳地,所述凹槽為長條狀。 Preferably, the groove is strip-shaped.

較佳地,所述第二極性電極為連續的平面電極;或者,所述第二極性電極分為多個區域的第二極性電極,分別與各個區域相匹配。 Preferably, the second polarity electrode is a continuous planar electrode; or, the second polarity electrode is divided into a plurality of regions of the second polarity electrodes, which are respectively matched with each region.

較佳地,將多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為第一區域的多孔結構和第二區域的多孔結構;第一區域的多孔結構與對應的第一區域的一第一極性電極接觸,完成第一區域的多孔結構與基底的電阻焊接後,所述第一區域的多孔結構與所述第一區域的第一極性電極的接觸邊緣形成凸邊;所述第二區域的多孔結構與對應的第二區域的一第一極性電極接觸,第二區域的一第一極性電極至少覆蓋到第一區域的多孔結構上靠近第二區域的多孔結構一側的凸邊,完成第二區域的多孔結構與基底的電阻焊接。 Preferably, the porous surface structure is divided into a plurality of areas, and any two adjacent areas divided are called the porous structure of the first area and the porous structure of the second area; the porous structure of the first area and the corresponding second area An electrode of a first polarity in a region is in contact, and after the resistance welding between the porous structure of the first region and the substrate is completed, the contact edge between the porous structure of the first region and the electrode of the first polarity in the first region forms a raised edge; The porous structure in the second region is in contact with a first polarity electrode in the corresponding second region, and a first polarity electrode in the second region covers at least one side of the porous structure in the first region close to the porous structure in the second region The convex edge of the second region completes the resistance welding of the porous structure of the second region and the substrate.

較佳地,所述第二極性電極為連續的平面電極;或者,所述第二極性電極分為多個區域的第二極性電極,分別與各個區域相匹配。 Preferably, the second polarity electrode is a continuous planar electrode; or, the second polarity electrode is divided into a plurality of regions of the second polarity electrodes, which are respectively matched with each region.

較佳地,所述基底包含一表面連接層,所述底表面連接層與基底的主體預先連接,所述表面連接層介於所述複合體的中間體與基底的主體之間;所述表面連接層包含凸起結構,所述凸起結構的凸點與所述複合體的中間體接觸。 Preferably, the substrate comprises a surface connection layer, the bottom surface connection layer is pre-connected to the main body of the substrate, and the surface connection layer is interposed between the intermediate body of the composite and the main body of the substrate; the surface The connection layer contains raised structures, the bumps of which are in contact with the intermediate body of the composite.

較佳地,所述表面連接層與基底的主體預先焊接連接。 Preferably, the surface connection layer is pre-welded to the main body of the substrate.

較佳地,所述中間體上靠近所述基底的一側為平面狀;或者,所述中間體上靠近所述基底的一側設置的凸起結構與所述表面連接層的凸起結構錯開。 Preferably, the side of the intermediate body close to the base is planar; or, the protruding structure on the side of the intermediate body close to the base is staggered from the protruding structure of the surface connecting layer .

本發明還提供了一種用於製備連接結構的方法,該方法包含以下過程:採用如上文所述的方法提供至少兩個複合體,分別為第一複合體和第二複合體;第一極性電極和第二極性電極之間設置第一複合體、 基底和第二複合體;所述第一複合體置於所述第一極性電極與所述基底之間,所述第一複合體中的中間體與所述基底接觸,所述第一極性電極與所述第一複合體中的多孔性表面結構和/或中間體導電接觸,所述第二複合體置於所述第二極性電極與所述基底之間,所述第二複合體中的中間體與所述基底接觸,所述第二極性電極與所述第二複合體中的多孔性表面結構和/或中間體導電接觸,用以形成電流回路;所述第一複合體的中間體與所述基底,以及所述第二複合體中的中間體與所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 The present invention also provides a method for preparing a connection structure, the method comprising the following steps: using the method as described above to provide at least two complexes, respectively a first complex and a second complex; the first polarity electrode The first composite body is arranged between the second polarity electrode, A substrate and a second complex; the first complex is placed between the first polarity electrode and the substrate, the intermediate in the first complex is in contact with the substrate, and the first polarity electrode In conductive contact with the porous surface structure and/or intermediate in the first composite body, the second composite body is placed between the second polarity electrode and the substrate, and the second composite body The intermediate body is in contact with the substrate, and the second polarity electrode is in conductive contact with the porous surface structure and/or the intermediate body in the second composite body to form a current loop; the intermediate body of the first composite body performing resistance welding with the substrate, and the intermediate body in the second composite body and the substrate, so as to realize the connection of the composite body with the substrate.

較佳地,採用如上文所述的方法得到所述第一複合體的方法稱為第一方法,採用如上文所述的方法得到所述第二複合體的方法稱為第二方法,所述第一方法與所述第二方法相同或不同。 Preferably, the method for obtaining the first complex by the method as described above is called the first method, and the method for obtaining the second complex by the method as described above is called the second method, and the The first method is the same as or different from the second method.

一種多孔性表面結構和基底的連接結構,包含:複合體,包含預先連接的多孔性表面結構與中間體;基底,與所述中間體接觸,所述中間體位於所述多孔性表面結構與所述基底之間;所述基底與所述複合體置於第一極性電極和第二極性電極之間,通過所述第一極性電極與所述多孔性表面結構和/或中間體導電接觸,以及所述基底與第二極性電極導電接觸,形成電流回路,使得所述中間體和所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 A connection structure of a porous surface structure and a substrate, comprising: a complex, comprising a pre-connected porous surface structure and an intermediate; a substrate, in contact with the intermediate, and the intermediate is located between the porous surface structure and the intermediate between the substrates; the substrate and the complex are placed between a first polarity electrode and a second polarity electrode, and are in conductive contact with the porous surface structure and/or intermediate through the first polarity electrode, and The base is in conductive contact with the second polarity electrode to form a current loop, so that the intermediate body and the base are subjected to resistance welding to realize the connection between the complex and the base.

較佳地,所述複合體中的多孔性表面結構稱為第一多孔結構;所述中間體是實心結構,或者,所述中間體是第二多孔結構並且所述第二多孔結構的孔隙率低於所述第一多孔結構的孔隙率。 Preferably, the porous surface structure in the complex is called a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure and the second porous structure The porosity is lower than the porosity of the first porous structure.

較佳地,基底、多孔性表面結構、中間體由導電材料製成。 Preferably, the substrate, the porous surface structure, and the intermediate body are made of conductive materials.

較佳地,所述中間體包含中間板結構。 Preferably, the intermediate body comprises an intermediate plate structure.

較佳地,所述中間板結構上設置多個凸起結構,所述凸起結構設置在所述中間板結構上靠近所述基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, a plurality of protruding structures are arranged on the middle plate structure, and the protruding structures are arranged on the side of the middle plate structure close to the base, and the protruding points of the protruding structures are in contact with the base touch.

較佳地,所述中間體是所述第二多孔結構,所述第二多孔結構包含多個凸起結構,所述凸起結構形成在所述第二多孔結構上靠近所述基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, the intermediate body is the second porous structure, the second porous structure comprises a plurality of protruding structures, and the protruding structures are formed on the second porous structure close to the substrate On one side, the bumps of the raised structure are in contact with the substrate.

較佳地,所述中間體包含複數個分散佈置的凸起結構,形成在所述多孔性表面結構靠近基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, the intermediate body includes a plurality of protruding structures dispersedly arranged on the side of the porous surface structure close to the substrate, and the bumps of the protruding structures are in contact with the substrate.

較佳地,所述複合體包含複數個支撐柱,每個支撐柱的全部或至少部分位於多孔性表面結構內。 Preferably, the composite body comprises a plurality of support pillars, all or at least part of each support pillar is located in the porous surface structure.

較佳地,所述支撐柱與所述中間體的凸起結構對應佈置並接觸,或所述支撐柱與所述中間體的凸起結構錯位分佈且不接觸。 Preferably, the supporting pillars are arranged correspondingly to and in contact with the protruding structures of the intermediate body, or the supporting pillars are dislocated and not in contact with the protruding structures of the intermediate body.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面;或者,所述支撐柱的遠離基底一側的表面低於所述多孔性表面結構的表面;或者,所述支撐柱的遠離基底一側的表面與所述多孔性表面結構的表面平齊。 Preferably, the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure; or, the surface of the support column on the side away from the substrate is lower than the surface of the porous surface structure; or , the surface of the support column away from the substrate is flush with the surface of the porous surface structure.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面時,在電阻焊完成後,切割所述支撐柱超出所述多孔性表面結構的部分。 Preferably, when the surface of the supporting column on the side away from the base exceeds the surface of the porous surface structure, after the resistance welding is completed, the part of the supporting column exceeding the porous surface structure is cut.

較佳地,所述支撐柱位於所述多孔性表面結構的預製空隙內,所述支撐柱開設凹槽,用於放置所述第一極性電極中的多個電極單體,插入後的電極單體與所述支撐柱導電接觸;所述支撐柱的表面超出或平齊於或低於所述多孔性表面結構的表面,所述支撐柱為多孔結構或實心結構。 Preferably, the support column is located in the prefabricated void of the porous surface structure, and the support column is provided with a groove for placing a plurality of electrode units in the first polarity electrode, and the inserted electrode unit The body is in conductive contact with the support column; the surface of the support column is higher than or equal to or lower than the surface of the porous surface structure, and the support column is a porous structure or a solid structure.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面時:所述支撐柱為多段結構,至少包含超出所述多孔性表面結 構的第一段部分和剩餘的第二段部分;所述第一段部分為多孔結構;所述第二段部分為多孔結構或實心結構,所述第二段部分上遠離基底一側的表面平齊於所述多孔性表面結構的表面,使得第一段部分因與第一極性電極接觸生熱導致所述支撐柱下沉至所述第二段部分的遠離基底一側的表面。 Preferably, when the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure: the support column is a multi-segment structure, at least including The first section of the structure and the remaining second section; the first section is a porous structure; the second section is a porous structure or a solid structure, and the surface on the side of the second section away from the base It is flush with the surface of the porous surface structure, so that the first segment generates heat due to contact with the first polarity electrode, causing the support column to sink to the surface of the second segment that is away from the base.

較佳地,所述支撐柱為導電體時,所述支撐柱接入到所述電流回路,所述支撐柱與以下任意一個或多個部件導電接觸:第一極性電極、多孔性表面結構、中間體。 Preferably, when the support column is a conductor, the support column is connected to the current loop, and the support column is in conductive contact with any one or more of the following components: first polarity electrode, porous surface structure, intermediate.

較佳地,所述支撐柱為絕緣體。 Preferably, the support column is an insulator.

較佳地,所述凸起結構位於所述中間體上的位置,靠近所述多孔性表面結構與所述中間體的接觸位置。 Preferably, the protruding structure is located on the intermediate body, close to the contact position between the porous surface structure and the intermediate body.

較佳地,所述多孔性表面結構內至少部分的孔隙內填充導電材料。 Preferably, at least part of the pores in the porous surface structure are filled with conductive materials.

較佳地,所述多孔性表面結構內至少部分的孔隙內填充粉末狀的導電材料。 Preferably, at least part of the pores in the porous surface structure are filled with powdery conductive material.

較佳地,多孔性表面結構的至少部分的表面鋪設固體薄膜狀的可變形導電介質,所述可變形導電介質位於所述第一極性電極和所述多孔性表面結構之間;和/或,至少部分的多孔性表面結構的表面與所述第一極性電極之間噴塗固態導電介質或液態導電劑。 Preferably, at least part of the surface of the porous surface structure is covered with a solid film-like deformable conductive medium, and the deformable conductive medium is located between the first polarity electrode and the porous surface structure; and/or, A solid conductive medium or a liquid conductive agent is sprayed between at least part of the surface of the porous surface structure and the first polarity electrode.

較佳地,至少部分的多孔性表面結構的孔隙內注入熔融狀的導電介質,和/或,至少部分的多孔性表面結構的孔隙內置導電介質並通過高溫使導電介質成熔融狀;所述導電介質的熔點低於基底的熔點和/或多孔性表面結構的熔點。 Preferably, at least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or, at least part of the pores of the porous surface structure has a built-in conductive medium and the conductive medium is melted by high temperature; The melting point of the medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure.

較佳地,所述基底是實心結構,或者,所述基底是第三多孔結構且所述第三多孔結構的孔隙率小於所述多孔性表面結構的孔隙率。 Preferably, the substrate is a solid structure, or, the substrate is a third porous structure and the porosity of the third porous structure is smaller than that of the porous surface structure.

較佳地,所述基底通過鍛造或鑄造或機加工或粉末冶金或金屬注塑製程製成。 Preferably, the substrate is made by forging or casting or machining or powder metallurgy or metal injection molding process.

較佳地,所述複合體的多孔性表面結構與中間體一體成型。 Preferably, the porous surface structure of the composite body is integrally formed with the intermediate body.

較佳地,所述複合體的多孔性表面結構與中間體,通過3D列印增材製造製程、或氣相沉澱製程實現。 Preferably, the porous surface structure and the intermediate body of the composite are realized through a 3D printing additive manufacturing process or a vapor deposition process.

較佳地,所述多孔性表面結構、所述中間體和所述支撐柱一體成型。 Preferably, the porous surface structure, the intermediate body and the support column are integrally formed.

較佳地,所述多孔性表面結構的表面設置複數個凹槽,所述凹槽的表面低於所述多孔性表面結構的表面,將所述多孔性表面結構劃分成多個區域;經所述凹槽劃分出的各區域,均被各區域對應接觸的第一極性電極覆蓋,與所述多孔性表面結構的任意一區域對應接觸的第一極性電極的邊緣,與鄰近所述任意一區域的凹槽的位置關係是:第一極性電極的邊緣,未到達凹槽的第一側且與凹槽的第一側不接觸、或到達凹槽的第一側、或跨過凹槽的第一側且不超出凹槽的第二側、或跨過凹槽的第一側並到達凹槽的第二側、或跨過凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,凹槽的第一側為靠近所述任意一區域的一側,凹槽的第二側為遠離所述任意一區域的一側。 Preferably, the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porous surface structure is divided into multiple regions; Each area divided by the groove is covered by the first polarity electrode corresponding to each area, and the edge of the first polarity electrode corresponding to any area of the porous surface structure is in contact with the adjacent any area. The positional relationship of the groove is: the edge of the first polarity electrode does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or straddles the first side of the groove One side and not beyond the second side of the groove, or across the first side of the groove and to the second side of the groove, or across the second side of the groove and contact at least a part of another adjacent area ; Wherein, the first side of the groove is the side close to the arbitrary region, and the second side of the groove is the side away from the arbitrary region.

較佳地,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的第一極性電極同時覆蓋;或者,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被兩個不同的第一極性電極按先後次序分兩次覆蓋;或者,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,被同一個第一極性電極按先後次序分兩次覆蓋。 Preferably, on the surface of the porous surface structure, two adjacent regions divided by grooves are respectively covered simultaneously by two different first polarity electrodes whose covering positions do not overlap; or, the porous surface On the surface of the structure, two adjacent regions divided by grooves are respectively covered twice by two different electrodes of the first polarity in sequence; or, on the surface of the porous surface structure, the regions divided by grooves The two adjacent regions are covered by the same first polarity electrode in two successive steps.

較佳地,所述凹槽為長條狀。 Preferably, the groove is strip-shaped.

較佳地,將多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為第一區域的多孔結構和第二區域的多孔結構; 第一區域的多孔結構與對應的第一區域的一第一極性電極接觸,完成第一區域的多孔結構與基底的電阻焊接後,所述第一區域的多孔結構與所述第一區域的第一極性電極的接觸邊緣形成凸邊;所述第二區域的多孔結構與對應的第二區域的一第一極性電極接觸,第二區域的一第一極性電極至少覆蓋到第一區域的多孔結構上靠近第二區域的多孔結構一側的凸邊,完成第二區域的多孔結構與基底的電阻焊接。 Preferably, the porous surface structure is divided into multiple regions, and any two adjacent regions divided are called the porous structure of the first region and the porous structure of the second region; The porous structure of the first region is in contact with a first polarity electrode corresponding to the first region, and after the resistance welding between the porous structure of the first region and the substrate is completed, the porous structure of the first region is connected to the second electrode of the first region. The contact edge of a polarity electrode forms a convex edge; the porous structure of the second region is in contact with a first polarity electrode of the corresponding second region, and a first polarity electrode of the second region at least covers the porous structure of the first region The convex edge on the side close to the porous structure of the second region completes the resistance welding of the porous structure of the second region and the substrate.

較佳地,所述基底包含一表面連接層,所述底表面連接層與基底的主體預先連接,所述表面連接層介於所述複合體的中間體與基底的主體之間;所述表面連接層包含凸起結構,所述表面連接層的凸起結構的凸點與所述複合體的中間體接觸。 Preferably, the substrate comprises a surface connection layer, the bottom surface connection layer is pre-connected to the main body of the substrate, and the surface connection layer is interposed between the intermediate body of the composite and the main body of the substrate; the surface The connection layer contains raised structures, and the bumps of the raised structures of the surface connection layer are in contact with the intermediate body of the composite.

較佳地,所述基底的表面連接層與基底的主體預先焊接連接。 Preferably, the surface connecting layer of the base is pre-welded to the main body of the base.

較佳地,所述中間體上靠近所述基底的一側為平面狀;或者,所述中間體上靠近所述基底的一側設置的凸起結構與所述表面連接層的凸起結構錯開。 Preferably, the side of the intermediate body close to the base is planar; or, the protruding structure on the side of the intermediate body close to the base is staggered from the protruding structure of the surface connecting layer .

本發明又提供了一種多孔性表面結構和基底的連接結構,包含兩個如上文所述連接結構中的複合體,分別為第一複合體和第二複合體,第一複合體、基底和第二複合體設置在第一極性電極和第二極性電極之間;所述第一複合體置於所述第一極性電極與所述基底之間,所述第一複合體中的中間體與所述基底接觸,所述第一極性電極與所述第一複合體中的多孔性表面結構和/或中間體導電接觸,所述第二複合體置於所述第二極性電極與所述基底之間,所述第二複合體中的中間體與所述基底接觸,所述第二極性電極與所述第二複合體中的多孔性表面結構和/或中間體導電接觸,用以形成電流回路;所述第一複合體的中間體與所述基底,以及所述第二複合體中的中間體與所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 The present invention also provides a connection structure between a porous surface structure and a substrate, comprising two complexes in the connection structure as described above, which are respectively the first complex and the second complex, the first complex, the substrate and the second complex. The two composites are arranged between the first polarity electrode and the second polarity electrode; the first composite is placed between the first polarity electrode and the substrate, and the intermediate in the first composite and the The substrate is in contact, the first polarity electrode is in conductive contact with the porous surface structure and/or intermediate in the first complex, and the second complex is placed between the second polarity electrode and the substrate Between, the intermediate in the second complex is in contact with the substrate, and the second polarity electrode is in conductive contact with the porous surface structure and/or the intermediate in the second complex to form a current loop ; The intermediate body of the first composite body and the substrate, and the intermediate body in the second composite body and the substrate are resistance welded to realize the connection between the composite body and the substrate.

較佳地,所述第一複合體和所述第二複合體的結構相同;或者,所述第一複合體和所述第二複合體的結構不同。 Preferably, the first complex and the second complex have the same structure; or, the first complex and the second complex have different structures.

本發明進一步提供了一種用於製備上文所述的連接結構的製備裝置,該製備裝置包含:第一極性電極,其與複合體中的多孔性表面結構和/或複合體中的中間體導電接觸,所述多孔性表面結構和所述中間體預先連接形成所述複合體;第二極性電極,其與基底導電接觸,所述中間體位於多孔性表面結構與基底之間,所述中間體與所述基底接觸,所述基底與所述複合體置於所述第一極性電極和所述第二極性電極之間,使得所述中間體和所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 The present invention further provides a preparation device for preparing the connection structure described above, the preparation device includes: a first polarity electrode, which conducts electricity with the porous surface structure in the composite and/or the intermediate in the composite In contact, the porous surface structure and the intermediate body are pre-connected to form the complex; the second polarity electrode is in conductive contact with the substrate, the intermediate body is located between the porous surface structure and the substrate, and the intermediate body In contact with the substrate, the substrate and the composite body are placed between the first polarity electrode and the second polarity electrode, so that the intermediate body and the substrate are subjected to resistance welding to realize the composite body connection to the substrate.

較佳地,所述電阻焊接為凸焊式電阻焊和/或點焊式電阻焊。 Preferably, the resistance welding is projection welding resistance welding and/or spot welding resistance welding.

較佳地,當所述電阻焊接為凸焊式電阻焊時,所述第一極性電極是連續的平面電極或分段的多個電極單體,所述第二極性電極是連續的平面電極或分段的多個電極單體;當所述電阻焊接為點焊式電阻焊時,所述第一極性電極和/或所述第二極性電極是分段的多個電極單體。 Preferably, when the resistance welding is projection welding resistance welding, the first polarity electrode is a continuous planar electrode or a plurality of segmented electrode monomers, and the second polarity electrode is a continuous planar electrode or A plurality of segmented electrode units; when the resistance welding is spot welding resistance welding, the first polarity electrode and/or the second polarity electrode is a plurality of segmented electrode units.

較佳地,點焊式電阻焊時,通過移動以下任意一個或多個部件:第一極性電極、第二極性電極、已在至少一個接觸位置完成焊接的中間體與基底的結合體,使得從當前焊接位置移動到下一焊接位置。 Preferably, during spot welding resistance welding, by moving any one or more of the following components: the first polarity electrode, the second polarity electrode, the combination of the intermediate body and the substrate that have been welded at least one contact position, so that from The current welding position moves to the next welding position.

較佳地,所述第一極性電極分成多個電極單體時,所述電極單體插入至多孔性表面結構內的預製空隙,電極單體靠近所述中間體,使得插入後的所述電極單體與所述中間體導電接觸或者使得插入後的所述電極單體經過多孔性表面結構與所述中間體導電接觸。 Preferably, when the first polarity electrode is divided into a plurality of electrode monomers, the electrode monomers are inserted into the prefabricated gaps in the porous surface structure, and the electrode monomers are close to the intermediate body, so that the inserted electrodes The monomer is in conductive contact with the intermediate body or the inserted electrode monomer is in conductive contact with the intermediate body through a porous surface structure.

較佳地,所述電極單體從多孔性表面結構的表面穿過直至穿透至中間體表面或中間體的內部,使得插入後的所述電極單體與所述中間體導電接觸。 Preferably, the electrode monomer penetrates from the surface of the porous surface structure to the surface of the intermediate body or the interior of the intermediate body, so that the inserted electrode monomer is in conductive contact with the intermediate body.

較佳地,所述電極單體與所述多孔性表面結構為側向間隙配合,使得所述電極單體與所述多孔性表面結構完全不接觸。 Preferably, the electrode unit is fitted with the porous surface structure in a lateral clearance, so that the electrode unit does not contact the porous surface structure at all.

較佳地,所述多個電極單體並聯連接至另一平面電極且所述另一平面電極與電源端連接,或者,所述多個電極單體並聯並直接連接至電源端。 Preferably, the plurality of electrode units are connected in parallel to another planar electrode and the other planar electrode is connected to the power supply terminal, or the plurality of electrode units are connected in parallel and directly connected to the power supply terminal.

較佳地,所述第一極性電極為柔性電極,所述柔性電極在壓力作用下,通過柔性變形使得其與所述多孔性表面結構的表面相匹配,增大所述柔性電極與所述多孔性表面結構的表面的接觸面積。 Preferably, the first polarity electrode is a flexible electrode, and under the action of pressure, the flexible electrode can be flexibly deformed to match the surface of the porous surface structure, thereby increasing the contact between the flexible electrode and the porous surface structure. The contact area of the surface of the permanent surface structure.

較佳地,所述第一極性電極為正電極,所述第二極性電極為負電極;或者,所述第一極性電極為負電極,所述第二極性電極為正電極。 Preferably, the first polarity electrode is a positive electrode, and the second polarity electrode is a negative electrode; or, the first polarity electrode is a negative electrode, and the second polarity electrode is a positive electrode.

較佳地,所述第一極性電極和所述第二極性電極由導電材料製成。 Preferably, the first polarity electrode and the second polarity electrode are made of conductive material.

較佳地,所述多孔性表面結構的表面設置複數個凹槽,所述凹槽的表面低於所述多孔性表面結構的表面,將所述多孔性表面結構劃分成多個區域;經所述凹槽劃分出的各區域,均被各區域對應接觸的第一極性電極覆蓋,與所述多孔性表面結構的任意一區域對應接觸的第一極性電極的邊緣,與鄰近所述任意一區域的凹槽的位置關係是以下是:第一極性電極的邊緣,未到達凹槽的第一側且與凹槽的第一側不接觸、或到達凹槽的第一側、或跨過凹槽的第一側且不超出凹槽的第二側、或跨過凹槽的第一側並到達凹槽的第二側、或跨過凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,凹槽的第一側為靠近所述任意一區域的一側,凹槽的第二側為遠離所述任意一區域的一側。 Preferably, the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porous surface structure is divided into multiple regions; Each area divided by the groove is covered by the first polarity electrode corresponding to each area, and the edge of the first polarity electrode corresponding to any area of the porous surface structure is in contact with the adjacent any area. The positional relationship of the groove is as follows: the edge of the first polarity electrode does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or straddles the groove of the first side of the groove and not beyond the second side of the groove, or across the first side of the groove and to the second side of the groove, or across the second side of the groove and into contact with another adjacent area At least a part; wherein, the first side of the groove is a side close to any one of the regions, and the second side of the groove is a side away from any one of the regions.

較佳地,多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的第一極性電極同時覆蓋;或者,多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被兩個不同的第一極性電極按先後次序分兩次覆蓋;或者,多孔性表面結構的表 面上,經凹槽劃分的相鄰兩區域,被同一個第一極性電極按先後次序分兩次覆蓋。 Preferably, on the surface of the porous surface structure, two adjacent regions divided by grooves are respectively covered by two different first polarity electrodes whose covering positions do not overlap; or, on the surface of the porous surface structure , the two adjacent areas divided by the groove are respectively covered by two different electrodes of the first polarity in sequence; or, the surface of the porous surface structure On the surface, the two adjacent areas divided by the groove are covered twice by the same first polarity electrode in sequence.

較佳地,所述凹槽為長條狀。 Preferably, the groove is strip-shaped.

較佳地,將多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為第一區域的多孔結構和第二區域的多孔結構;第一區域的多孔結構與對應的第一區域的一第一極性電極接觸,完成第一區域的多孔結構與基底的電阻焊接後,所述第一區域的多孔結構與所述第一區域的第一極性電極的接觸邊緣形成凸邊;所述第二區域的多孔結構與對應的第二區域的一第一極性電極接觸,第二區域的一第一極性電極至少覆蓋到第一區域的多孔結構上靠近第二區域的多孔結構一側的凸邊,完成第二區域的多孔結構與基底的電阻焊接。 Preferably, the porous surface structure is divided into a plurality of areas, and any two adjacent areas divided are called the porous structure of the first area and the porous structure of the second area; the porous structure of the first area and the corresponding second area An electrode of a first polarity in a region is in contact, and after the resistance welding between the porous structure of the first region and the substrate is completed, the contact edge between the porous structure of the first region and the electrode of the first polarity in the first region forms a raised edge; The porous structure in the second region is in contact with a first polarity electrode in the corresponding second region, and a first polarity electrode in the second region covers at least one side of the porous structure in the first region close to the porous structure in the second region The convex edge of the second region completes the resistance welding of the porous structure of the second region and the substrate.

較佳地,所述第二極性電極為連續的平面電極;或者,所述第二極性電極分為多個區域的第二極性電極,分別與各個區域相匹配。 Preferably, the second polarity electrode is a continuous planar electrode; or, the second polarity electrode is divided into a plurality of regions of the second polarity electrodes, which are respectively matched with each region.

一種假體,設置一連接結構,所述連接結構包含:複合體,包含預先連接的多孔性表面結構與中間體;基底,用於形成假體主體,所述假體主體的至少部分表面作為連接區域,用於與所述複合體連接,所述中間體位於所述多孔性表面結構與所述基底之間,所述中間體與所述假體主體的連接區域相連接,使得所述多孔性表面結構位於所述假體主體的連接區域;其中,所述基底與所述複合體置於第一極性電極和第二極性電極之間,通過所述第一極性電極與所述多孔性表面結構和/或中間體導電接觸,以及所述基底與第二極性電極導電接觸,形成電流回路,使得所述中間體和所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 A prosthesis, provided with a connection structure, the connection structure includes: a composite body, including a pre-connected porous surface structure and an intermediate body; a substrate, used to form a prosthesis body, at least part of the surface of the prosthesis body serves as a connection region for connection with the complex, the intermediate body is located between the porous surface structure and the substrate, the intermediate body is connected to the connection region of the prosthesis body, such that the porosity The surface structure is located in the connection area of the prosthesis body; wherein the substrate and the complex are placed between the first polarity electrode and the second polarity electrode, and the first polarity electrode and the porous surface structure and/or the intermediate body is in conductive contact, and the substrate is in conductive contact with the second polarity electrode to form a current loop, so that the intermediate body and the substrate are subjected to resistance welding to realize the connection between the composite body and the substrate.

較佳地,所述假體是關節假體。 Preferably, the prosthesis is a joint prosthesis.

較佳地,所述複合體形成為殼體,包覆在所述假體主體的連接區域上;所述殼體的外層包含多孔性表面結構;所述殼體的內層包含中間體,其與所述假體主體的連接區域連接。 Preferably, the complex is formed as a shell covering the connecting region of the prosthesis body; the outer layer of the shell comprises a porous surface structure; the inner layer of the shell comprises an intermediate body, which is combined with The connecting regions of the prosthesis body are connected.

較佳地,所述複合體形成的殼體是一個整體;或者,所述複合體形成的殼體包含多個殼體片體;其中,多個殼體片體相互獨立,或者相鄰的殼體片體之間在至少一側的鄰邊相連接。 Preferably, the shell formed by the composite body is a whole; or, the shell formed by the composite body includes a plurality of shell pieces; wherein, the multiple shell pieces are independent of each other, or adjacent shells The body sheets are connected on at least one adjacent edge.

較佳地,所述假體包含髖關節的股骨柄,所述股骨柄包含柄體,其形成為基底;所述連接區域的位置為柄體上部的表面。 Preferably, the prosthesis includes a femoral stem of the hip joint, and the femoral stem includes a stem body formed as a base; the position of the connection area is the upper surface of the stem body.

較佳地,所述柄體下部的表面為光滑表面,所述柄體下部開設複數個縱向的溝槽,所述柄體下部插入股骨髓腔。 Preferably, the surface of the lower part of the handle body is a smooth surface, a plurality of longitudinal grooves are opened in the lower part of the handle body, and the lower part of the handle body is inserted into the medullary cavity of the femur.

較佳地,所述股骨柄還包含頭部和頸部,所述頭部、頸部和所述柄體是一體的或是組裝形成;所述股骨柄的頭部為錐台結構,其第一端通過頸部與柄體連接,頭部與頸部相對柄體有一定的偏轉角度,以相對於柄體一側傾斜的形式佈置,股骨柄的頭部的第二端插入至股骨球頭。 Preferably, the femoral stem also includes a head and a neck, and the head, neck and the handle are integral or assembled; the head of the femoral stem is a truncated cone structure, and its second One end is connected to the handle body through the neck, and the head and neck have a certain deflection angle relative to the handle body, and are arranged in the form of an inclination relative to one side of the handle body. The second end of the head of the femoral stem is inserted into the femoral ball head .

較佳地,所述複合體形成為殼體包裹在所述柄體的連接區域周邊;所述複合體包含多個殼體片體。 Preferably, the composite body is formed such that the shell wraps around the connection area of the handle; the composite body includes a plurality of shell pieces.

較佳地,所述假體包含髖關節的髖臼杯,所述髖臼杯包含內側的杯體主體,其形成為基底;所述連接區域的位置為髖臼杯的外周面。 Preferably, the prosthesis includes an acetabular cup of the hip joint, and the acetabular cup includes an inner cup body formed as a base; the position of the connection area is the outer peripheral surface of the acetabular cup.

較佳地,所述假體包含脛骨平臺,所述脛骨平臺包含脛骨托,其形成為基底;所述連接區域的位置為脛骨托的遠端的表面。 Preferably, the prosthesis comprises a tibial plateau comprising a tibial tray formed as a base; the location of the connection region is the surface of the distal end of the tibial tray.

較佳地,所述假體包含股骨髁,所述股骨髁包含髁內固定面,其形成為基底;所述連接區域的位置為髁內固定面。 Preferably, the prosthesis includes a femoral condyle, and the femoral condyle includes a condylar internal fixation surface, which is formed as a base; the position of the connection area is the condylar internal fixation surface.

較佳地,所述假體是以下的任意一種或多種:髕骨、脊柱融合器、脊柱椎間小平面關節、踝關節、肩關節、肘關節、指關節、趾關節、人工椎間盤、下頜關節、腕關節。 Preferably, the prosthesis is any one or more of the following: patella, spinal fusion cage, spinal facet joint, ankle joint, shoulder joint, elbow joint, finger joint, toe joint, artificial intervertebral disc, mandibular joint, LOL.

較佳地,所述複合體中的多孔性表面結構稱為第一多孔結構;所述中間體是實心結構,或者,所述中間體是第二多孔結構並且所述第二多孔結構的孔隙率低於所述第一多孔結構的孔隙率。 Preferably, the porous surface structure in the complex is called a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure and the second porous structure The porosity is lower than the porosity of the first porous structure.

較佳地,所述基底由導電材料製成,所述多孔性表面結構由導電材料製成,所述中間體由導電材料製成。 Preferably, the base is made of conductive material, the porous surface structure is made of conductive material, and the intermediate body is made of conductive material.

較佳地,所述中間體包含中間板結構。 Preferably, the intermediate body comprises an intermediate plate structure.

較佳地,所述中間板結構上設置多個凸起結構,所述凸起結構設置在所述中間板結構上靠近所述基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, a plurality of protruding structures are arranged on the middle plate structure, and the protruding structures are arranged on the side of the middle plate structure close to the base, and the protruding points of the protruding structures are in contact with the base touch.

較佳地,所述中間體是所述第二多孔結構,所述第二多孔結構包含多個凸起結構,所述凸起結構形成在所述第二多孔結構上靠近所述基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, the intermediate body is the second porous structure, the second porous structure comprises a plurality of protruding structures, and the protruding structures are formed on the second porous structure close to the substrate On one side, the bumps of the raised structure are in contact with the substrate.

較佳地,所述中間體包含複數個分散佈置的凸起結構,形成在所述多孔性表面結構靠近基底的一側,所述凸起結構的凸點與所述基底接觸。 Preferably, the intermediate body includes a plurality of protruding structures dispersedly arranged on the side of the porous surface structure close to the substrate, and the bumps of the protruding structures are in contact with the substrate.

較佳地,所述複合體包含複數個支撐柱,每個支撐柱的全部或至少部分位於多孔性表面結構內。 Preferably, the composite body comprises a plurality of support pillars, all or at least part of each support pillar is located in the porous surface structure.

較佳地,所述支撐柱與所述中間體的凸起結構對應佈置並接觸,或所述支撐柱與所述中間體的凸起結構錯位分佈且不接觸。 Preferably, the supporting pillars are arranged correspondingly to and in contact with the protruding structures of the intermediate body, or the supporting pillars are dislocated and not in contact with the protruding structures of the intermediate body.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面;或者,所述支撐柱的遠離基底一側的表面低於所述多孔性表面結構的表面;或者,所述支撐柱的遠離基底一側的表面與所述多孔性表面結構的表面平齊。 Preferably, the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure; or, the surface of the support column on the side away from the substrate is lower than the surface of the porous surface structure; or , the surface of the support column away from the substrate is flush with the surface of the porous surface structure.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面時,在電阻焊完成後,切割所述支撐柱超出所述多孔性表面結構的部分。 Preferably, when the surface of the supporting column on the side away from the base exceeds the surface of the porous surface structure, after the resistance welding is completed, the part of the supporting column exceeding the porous surface structure is cut.

較佳地,所述支撐柱位於所述多孔性表面結構的預製空隙內,所述支撐柱開設凹槽,用於放置所述第一極性電極中的多個電極單體,插入後的電極單體與所述支撐柱導電接觸;所述支撐柱的表面超出或平齊於或低於所述多孔性表面結構的表面,所述支撐柱為多孔結構或實心結構。 Preferably, the support column is located in the prefabricated void of the porous surface structure, and the support column is provided with a groove for placing a plurality of electrode units in the first polarity electrode, and the inserted electrode unit The body is in conductive contact with the support column; the surface of the support column is higher than or equal to or lower than the surface of the porous surface structure, and the support column is a porous structure or a solid structure.

較佳地,所述支撐柱的遠離基底一側的表面超出所述多孔性表面結構的表面時:所述支撐柱為多段結構,至少包含超出所述多孔性表面結構的第一段部分和剩餘的第二段部分;所述第一段部分為多孔結構;所述第二段部分為多孔結構或實心結構,所述第二段部分上遠離基底一側的表面平齊於所述多孔性表面結構的表面,使得第一段部分因與第一極性電極接觸生熱導致所述支撐柱下沉至所述第二段部分的遠離基底一側的表面。 Preferably, when the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure: the support column is a multi-segment structure, at least including the first section beyond the porous surface structure and the remaining The second section; the first section is a porous structure; the second section is a porous structure or a solid structure, and the surface on the side of the second section away from the substrate is flush with the porous surface The surface of the structure is such that the heat generated by the first section part due to contact with the first polarity electrode causes the support column to sink to the surface of the second section part away from the base.

較佳地,所述支撐柱為導電體時,所述支撐柱接入到所述電流回路,所述支撐柱與以下任意一個或多個部件導電接觸:第一極性電極、多孔性表面結構、中間體。 Preferably, when the support column is a conductor, the support column is connected to the current loop, and the support column is in conductive contact with any one or more of the following components: first polarity electrode, porous surface structure, intermediate.

較佳地,所述支撐柱為絕緣體。 Preferably, the support column is an insulator.

較佳地,所述凸起結構位於所述中間體上的位置,靠近所述多孔性表面結構與所述中間體的接觸位置。 Preferably, the protruding structure is located on the intermediate body, close to the contact position between the porous surface structure and the intermediate body.

較佳地,所述多孔性表面結構內至少部分的孔隙內填充導電材料。 Preferably, at least part of the pores in the porous surface structure are filled with conductive materials.

較佳地,所述多孔性表面結構內至少部分的孔隙內填充粉末狀的導電材料。 Preferably, at least part of the pores in the porous surface structure are filled with powdery conductive material.

較佳地,多孔性表面結構的至少部分的表面鋪設固體薄膜狀的可變形導電介質,所述可變形導電介質位於所述第一極性電極和所述多孔性表面結構之間;和/或,至少部分的多孔性表面結構的表面與所述第一極性電極之間噴塗固態導電介質或液態導電劑。 Preferably, at least part of the surface of the porous surface structure is covered with a solid film-like deformable conductive medium, and the deformable conductive medium is located between the first polarity electrode and the porous surface structure; and/or, A solid conductive medium or a liquid conductive agent is sprayed between at least part of the surface of the porous surface structure and the first polarity electrode.

較佳地,所述多孔性表面結構的表面噴塗以下塗層中的一種或多種:骨傳導塗層、骨誘導塗層、抗菌塗層、細胞或生長因數載體。 Preferably, the surface of the porous surface structure is sprayed with one or more of the following coatings: osteoconductive coating, osteoinductive coating, antibacterial coating, cell or growth factor carrier.

較佳地,至少部分的多孔性表面結構的孔隙內注入熔融狀的導電介質,和/或,至少部分的多孔性表面結構的孔隙內置導電介質並通過高溫使導電介質成熔融狀;所述導電介質的熔點低於基底的熔點和/或多孔性表面結構的熔點。 Preferably, at least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or, at least part of the pores of the porous surface structure has a built-in conductive medium and the conductive medium is melted by high temperature; The melting point of the medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure.

較佳地,所述基底是實心結構,或者,所述基底是第三多孔結構且所述第三多孔結構的孔隙率小於所述多孔性表面結構的孔隙率。 Preferably, the substrate is a solid structure, or, the substrate is a third porous structure and the porosity of the third porous structure is smaller than that of the porous surface structure.

較佳地,所述基底通過鍛造或鑄造或機加工或粉末冶金或金屬注塑製程製成。 Preferably, the substrate is made by forging or casting or machining or powder metallurgy or metal injection molding process.

較佳地,所述複合體的多孔性表面結構與中間體一體成型。 Preferably, the porous surface structure of the composite body is integrally formed with the intermediate body.

較佳地,所述複合體的多孔性表面結構與中間體,通過3D列印增材製造製程、或氣相沉澱製程實現。 Preferably, the porous surface structure and the intermediate body of the composite are realized through a 3D printing additive manufacturing process or a vapor deposition process.

較佳地,所述多孔性表面結構、所述中間體和所述支撐柱一體成型。 Preferably, the porous surface structure, the intermediate body and the support column are integrally formed.

較佳地,所述多孔性表面結構的表面設置複數個凹槽,所述凹槽的表面低於所述多孔性表面結構的表面,將所述多孔性表面結構劃分成多個區域;與所述多孔性表面結構的任意一區域對應接觸的第一極性電極的邊緣,與鄰近所述任意一區域的凹槽的位置關係是:第一極性電極的邊緣,未到達凹槽的第一側且與凹槽的第一側不接觸、或到達凹槽的第一側、或跨過凹槽的第一側且不超出凹槽的第二側、或跨過凹槽的第一側直至凹槽的第二側、或跨過凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,凹槽的第一側為靠近所述任意一區域的一側,凹槽的第二側為遠離所述任意一區域的一側。 Preferably, the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porous surface structure is divided into multiple regions; and the Any region of the porous surface structure corresponds to the edge of the first polarity electrode in contact, and the positional relationship with the groove adjacent to the arbitrary region is: the edge of the first polarity electrode does not reach the first side of the groove and out of contact with the first side of the groove, or to the first side of the groove, or across the first side of the groove and not beyond the second side of the groove, or across the first side of the groove to the groove The second side of the groove, or across the second side of the groove and contact at least a part of another adjacent area; wherein, the first side of the groove is the side close to any one area, and the second side of the groove The side is the side away from any one of the regions.

較佳地,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的第一極性電極同時覆蓋;或者,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別 被兩個不同的第一極性電極按先後次序分兩次覆蓋;或者,所述多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,被同一個第一極性電極按先後次序分兩次覆蓋。 Preferably, on the surface of the porous surface structure, two adjacent regions divided by grooves are respectively covered simultaneously by two different first polarity electrodes whose covering positions do not overlap; or, the porous surface On the surface of the structure, two adjacent areas divided by the groove, respectively Covered twice by two different electrodes of the first polarity in sequence; or, on the surface of the porous surface structure, the adjacent two regions divided by grooves are divided in sequence by the same electrode of the first polarity Cover twice.

較佳地,所述凹槽為長條狀。 Preferably, the groove is strip-shaped.

較佳地,將多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為第一區域的多孔結構和第二區域的多孔結構;第一區域的多孔結構與對應的第一區域的第一極性電極接觸,完成第一區域的多孔結構與基底的電阻焊接後,所述第一區域的多孔結構與所述第一區域的第一極性電極的接觸邊緣形成凸邊;所述第二區域的多孔結構與對應的第二區域的第一極性電極接觸,第二區域的第一極性電極至少覆蓋到第一區域的多孔結構上靠近第二區域的多孔結構一側的凸邊,完成第二區域的多孔結構與基底的電阻焊接。 Preferably, the porous surface structure is divided into a plurality of areas, and any two adjacent areas divided are called the porous structure of the first area and the porous structure of the second area; the porous structure of the first area and the corresponding second area The electrodes of the first polarity in one area are in contact, and after the resistance welding between the porous structure of the first area and the substrate is completed, the contact edge between the porous structure of the first area and the electrode of the first polarity in the first area forms a convex edge; The porous structure in the second region is in contact with the corresponding electrode of the first polarity in the second region, and the electrode of the first polarity in the second region covers at least the convex edge on the porous structure in the first region close to the porous structure in the second region , completing the resistance welding of the porous structure in the second region and the substrate.

較佳地,所述基底包含一表面連接層,所述底表面連接層與基底的主體預先連接,所述表面連接層介於所述複合體的中間體與基底的主體之間;所述表面連接層包含凸起結構,所述凸起結構的凸點與所述複合體的中間體接觸。 Preferably, the substrate comprises a surface connection layer, the bottom surface connection layer is pre-connected to the main body of the substrate, and the surface connection layer is interposed between the intermediate body of the composite and the main body of the substrate; the surface The connection layer contains raised structures, the bumps of which are in contact with the intermediate body of the composite.

較佳地,所述基底的表面連接層與基底的主體預先焊接連接。 Preferably, the surface connecting layer of the base is pre-welded to the main body of the base.

較佳地,所述中間體上靠近所述基底的一側為平面狀;或者,所述中間體上靠近所述基底的一側設置的凸起結構與所述表面連接層的凸起結構錯開。 Preferably, the side of the intermediate body close to the base is planar; or, the protruding structure on the side of the intermediate body close to the base is staggered from the protruding structure of the surface connecting layer .

本發明還提供了一種假體,其設置一基底和至少兩個如上文所述連接結構中的複合體,所述基底用於形成假體主體,所述假體主體的至少部分表面作為連接區域,用於與所述複合體連接,所述中間體位於所述多孔性表面結構與所述基底之間,所述中間體與所述假體主體的連接區域相連接,使得所述多孔性表面結構位於所述假體主體的連接區 域;兩個複合體分別為第一複合體和第二複合體,第一複合體、基底和第二複合體設置在第一極性電極和第二極性電極之間;所述第一複合體置於所述第一極性電極與所述基底之間,所述第一複合體中的中間體與所述基底接觸,所述第一極性電極與所述第一複合體中的多孔性表面結構和/或中間體導電接觸,所述第二複合體置於所述第二極性電極與所述基底之間,所述第二複合體中的中間體與所述基底接觸,所述第二極性電極與所述第二複合體中的多孔性表面結構和/或中間體導電接觸,用以形成電流回路;所述第一複合體的中間體與所述基底,以及所述第二複合體中的中間體與所述基底進行電阻焊接,實現所述複合體與所述基底的連接。 The present invention also provides a prosthesis, which is provided with a base and at least two composites in the connection structure as described above, the base is used to form a prosthesis body, at least part of the surface of the prosthesis body is used as a connection area , used to connect with the composite body, the intermediate body is located between the porous surface structure and the substrate, the intermediate body is connected to the connection area of the prosthesis body, so that the porous surface structure located in the attachment zone of the prosthetic body domain; the two complexes are respectively the first complex and the second complex, the first complex, the substrate and the second complex are arranged between the first polarity electrode and the second polarity electrode; the first complex is placed Between the first polarity electrode and the substrate, the intermediate in the first complex is in contact with the substrate, the first polarity electrode is in contact with the porous surface structure in the first complex and / or the intermediate body is in conductive contact, the second composite body is placed between the second polarity electrode and the substrate, the intermediate body in the second composite body is in contact with the substrate, and the second polarity electrode Conductive contact with the porous surface structure and/or intermediate in the second composite to form a current loop; the intermediate of the first composite and the substrate, and the intermediate in the second composite The intermediate body and the base are subjected to resistance welding to realize the connection between the composite body and the base.

較佳地,所述第一複合體和所述第二複合體的結構相同;或者,所述第一複合體和所述第二複合體的結構不同。 Preferably, the first complex and the second complex have the same structure; or, the first complex and the second complex have different structures.

較佳地,所述假體包含髖關節的股骨柄,所述股骨柄包含柄體,其形成為基底;所述連接區域的位置為柄體上部的表面;所述第一複合體和所述第二複合體分別形成為殼體包裹在所述柄體的連接區域周邊;所述第一複合體和所述第二複合體分別包含多個殼體片體。 Preferably, the prosthesis comprises a femoral stem of the hip joint, the femoral stem comprises a stem, which is formed as a base; the position of the connecting region is the surface of the upper part of the stem; the first complex and the The second composite body is respectively formed such that the shell is wrapped around the connection area of the handle; the first composite body and the second composite body respectively include a plurality of shell pieces.

與習知技術相比,本發明提供一種用於製備多孔性表面結構和基底的連接結構的方法和裝置,一種多孔性表面結構和基底的連接結構,以及基於多孔性表面結構和基底的連接結構的假體,有益效果在於: Compared with the prior art, the present invention provides a method and device for preparing a connection structure between a porous surface structure and a substrate, a connection structure between a porous surface structure and a substrate, and a connection structure based on a porous surface structure and a substrate The beneficial effect of the prosthesis is:

(1)本發明示例地通過3D列印或其它製程製造一個複合體,包含多孔表面結構和相對其有更高緻密度的中間體(例如低孔隙率的多孔結構或實心板),採用電阻焊法(例如凸焊式電阻焊或點焊式電阻焊等)將所述複合體與基底進行有效結合,既能避免鐳射焊接方法中可能出現鐳射能量直接擊斷支架結構導致無法對多孔性結構的支架和基底支架實現焊接連接的情況;另外,凸焊式電阻焊法利用接觸電阻產生局部熱源實現焊接,大大減少或避免了熱壓製程(如滲透焊製程)等造 成基底的力學性能大幅下降的問題;本發明還可以將凸焊式電阻焊和點焊式電阻焊配合使用,加強中間體與基底之間的焊接強度以及減小多孔性表面結構的表面損傷。 (1) The present invention exemplarily manufactures a composite body through 3D printing or other processes, including a porous surface structure and a relatively denser intermediate (such as a low-porosity porous structure or solid plate), using resistance welding Method (such as projection welding type resistance welding or spot welding type resistance welding, etc.) to effectively combine the composite body with the substrate, which can avoid the possibility of laser energy directly breaking the support structure in the laser welding method, resulting in the failure of the porous structure. In addition, the projection welding resistance welding method uses the contact resistance to generate a local heat source to achieve welding, which greatly reduces or avoids the hot pressing process (such as the penetration welding process) and other manufacturing processes. The mechanical properties of the substrate are greatly reduced; the present invention can also use projection welding resistance welding and spot welding resistance welding together to enhance the welding strength between the intermediate and the substrate and reduce the surface damage of the porous surface structure.

(2)本發明不僅可採用大平面電極貼覆於多孔性表面結構上,還能將電極分成多個正電極單體(或負電極單體)並將其豎向插入至多孔性表面結構內特別預留的空隙內,電極與多孔性表面結構的表面不接觸,避免多孔性表面結構的表面與正電極之間因接觸電阻產生電阻熱發生損傷(凹陷、變黑、孔隙空間減小等);另外,貼覆於多孔性表面結構的大平面電極採用柔性材料時,柔性正電極產生一定的變形使得其與多孔性表面結構的頂部之間的接觸面積增大,不僅可以降低電極和多孔性表面結構之間的接觸電阻,減小多孔性表面結構的表面損傷,而且還能增大電流傳導使得中間體與基底之間的焊接強度增大。 (2) The present invention can not only use a large plane electrode to stick on the porous surface structure, but also divide the electrode into multiple positive electrode monomers (or negative electrode monomers) and insert them vertically into the porous surface structure In the specially reserved gap, the electrode is not in contact with the surface of the porous surface structure, so as to avoid damage (depression, blackening, reduction of pore space, etc.) between the surface of the porous surface structure and the positive electrode due to resistance heat generated by contact resistance ; In addition, when the large planar electrode attached to the porous surface structure is made of flexible materials, the flexible positive electrode will be deformed to a certain extent so that the contact area between it and the top of the porous surface structure will increase, which will not only reduce the electrode and porosity The contact resistance between the surface structures can reduce the surface damage of the porous surface structure, and can also increase the current conduction to increase the welding strength between the intermediate body and the substrate.

(3)本發明通過在多孔性表面結構的孔隙內填充良導電材料或在表面噴塗良導電材料,以降低電極和多孔性表面結構之間的接觸電阻,減小多孔性表面結構的表面損傷。 (3) The present invention reduces the contact resistance between the electrode and the porous surface structure by filling the pores of the porous surface structure with a good conductive material or spraying a good conductive material on the surface, thereby reducing the surface damage of the porous surface structure.

(4)本發明在多孔性表面結構內設置實心結構(高緻密度)的支撐柱,保證電阻焊接完成後的多孔性表面結構的表面的高度能達至預設高度,避免多孔性表面結構被過多壓縮;當所述支撐柱為良導電材料時,引導電極輸出的電流大部分優先流經支撐柱直至基底,既能保證中間體與基底之間的焊接強度,還能減小多孔性表面結構的表面產生的損傷;本發明利用上述的支撐柱與其下方的凸點結構結合,並且凸點結構可以與基底直接接觸,同樣能滿足中間體與基底的焊接強度的要求以及減小多孔性表面結構的表面產生的損傷。 (4) The present invention sets a solid structure (high density) support column in the porous surface structure to ensure that the height of the surface of the porous surface structure after the resistance welding is completed can reach a preset height, so as to avoid the porous surface structure being damaged. Excessive compression; when the support column is a good conductive material, most of the current output by the leading electrode flows through the support column to the substrate, which can not only ensure the welding strength between the intermediate body and the substrate, but also reduce the porous surface structure The damage produced on the surface; the present invention utilizes the above-mentioned supporting pillars to combine with the bump structure below, and the bump structure can be in direct contact with the substrate, which can also meet the requirements of the welding strength between the intermediate body and the substrate and reduce the porous surface structure damage to the surface.

(5)本發明示例地通過鍛造、鑄造或機加工等製程製造一個實心(高緻密度)的基底,或者基底可以是多孔性結構,但多孔表面結構的緻密度要低於基底,而中間體的緻密度介於多孔性表面結構和基底之間。 (5) The present invention exemplarily manufactures a solid (high density) substrate by processes such as forging, casting or machining, or the substrate can be a porous structure, but the density of the porous surface structure is lower than that of the substrate, and the intermediate The density is between the porous surface structure and the substrate.

(6)本發明使多孔表面結構與基底連接的加工操作得以簡化,降低了製造成本,也節約了時間。 (6) The present invention simplifies the processing operation of connecting the porous surface structure with the substrate, reduces the manufacturing cost and saves time.

(7)本發明利用多孔性表面結構和基底的連接結構及其製備方法和裝置,製成了各種人工植入假體,尤其是骨科假體,比如股骨柄體,髖臼杯、脛骨平臺、股骨髁等,使假體主體便於加工且具有高強度,同時通過與之有效結合的多孔表面結構來優化骨長入的性能,還可以使假體(如股骨柄)的截面最小化。 (7) The present invention utilizes the connection structure of the porous surface structure and the substrate and its preparation method and device to make various artificial implant prostheses, especially orthopedic prostheses, such as femoral stems, acetabular cups, tibial plateaus, Femoral condyles, etc., make the main body of the prosthesis easy to process and have high strength. At the same time, the performance of bone ingrowth is optimized through the porous surface structure effectively combined with it, and the cross-section of the prosthesis (such as the femoral stem) can be minimized.

01:內側表面 01: Inner surface

001,541,814b,914b:正電極單體 001, 541, 814b, 914b: positive electrode monomer

0001:薄片 0001: flakes

02:後側表面 02: Rear side surface

0002:實心基底 0002: Solid base

03:外側表面 03: Outer surface

04:前側表面 04: Front side surface

1:假體主體 1: Prosthesis body

10a,5a:空隙 10a,5a: void

10b:支撐結構 10b: Support structure

1011,1111,1211,1311,1311-1,1311-2,1411,1411-1,1411-2,1511,201,21,2501,2601,271,51,601,6001,61,71,811,911:多孔性表面結構 1011,1111,1211,1311,1311-1,1311-2,1411,1411-1,1411-2,1511,201,21,2501,2601,271,51,601,6001,61,71,811,911: porous surface structure

1012a,1212,1312,1412,1512,22,2202,2502,2602,52,62,72,812,912a:非多孔性底板 1012a, 1212, 1312, 1412, 1512, 22, 2202, 2502, 2602, 52, 62, 72, 812, 912a: Non-porous base plates

1013,1113,1213,1313,1413,1513,23,2403,2503,2603,273,283,43,53,603,6003,63,73,813,913:基底 1013,1113,1213,1313,1413,1513,23,2403,2503,2603,273,283,43,53,603,6003,63,73,813,913: Base

1014a,1114,1214,1314-1,1314-2,1414-1,1414-2,1514,2204,2404,24,274,44,54,604,6004,814,914:正電極 1014a, 1114, 1214, 1314-1, 1314-2, 1414-1, 1414-2, 1514, 2204, 2404, 24, 274, 44, 54, 604, 6004, 814, 914: positive electrode

1015,1115,1215,1315,1415,2205,2405,25,275,285,45,55,605,6005,65,75,815,915:負電極 1015,1115,1215,1315,1415,2205,2405,25,275,285,45,55,605,6005,65,75,815,915: negative electrode

1112a,1112b,1112c,1112d,12a,221,521:凸起結構 1112a, 1112b, 1112c, 1112d, 12a, 221, 521: raised structures

1116a,1116b,1116c,1116d,1216,816a,816b,816c,916a,916b:支撐柱 1116a, 1116b, 1116c, 1116d, 1216, 816a, 816b, 816c, 916a, 916b: support columns

13a,14a:凹槽 13a, 14a: Groove

15a:限位元結構 15a: Limiter structure

2,2A,4A:複合體 2,2A,4A: Complex

2-1,2-2:殼體片體 2-1,2-2: shell body

202,22,2402,272,602,6002:中間體 202,22,2402,272,602,6002: intermediates

2201,2401:多孔結構 2201, 2401: porous structure

272A:帶凸點的結構 272A: Structure with bumps

281-1:第一多孔性表面結構 281-1: The first porous surface structure

281-2:第二多孔性表面結構 281-2: Second Porous Surface Structure

282-1:第一非多孔性底板 282-1: First non-porous base plate

282-2:第二非多孔性底板 282-2: Second non-porous base plate

3:股骨柄 3: femoral stem

3-3:杯體主體 3-3: Cup body

300-1:脛骨托 300-1: tibial support

300-2:支撐部分 300-2: support part

300a:髖臼杯 300a: Acetabular cup

300b:脛骨平臺 300b: tibial plateau

300c:股骨髁 300c: femoral condyle

301:頭部 301: head

302:頸部 302: Neck

303:柄體 303: handle body

303a:柄體主體 303a: handle body

41,71:第一多孔結構 41,71: The first porous structure

42,72:第二多孔結構 42,72: Second porous structure

421:凸點 421: bump

606:易變形良導電介質 606: Deformable and good conductive medium

6006:良導電材料粉末 6006: Good conductive material powder

64,74:柔性正電極 64,74: flexible positive electrode

圖1為習知技術的基底和多孔性表面結構的連接結構示意圖;圖2為本發明實施例一的多孔性表面結構和基底的連接結構示意圖;圖3為本發明實施例一的多孔性底板結構示意圖;圖4a為本發明實施例二的多孔性表面結構和基底的連接結構示意圖(低孔隙率區域的下表面不帶凸點);圖4b為本發明實施例二的多孔性表面結構和基底的連接結構示意圖(低孔隙率區域的下表面帶有凸點);圖5為本發明實施例三的多孔性表面結構和基底的連接結構示意圖;圖6a為本發明實施例四的多孔性表面結構和基底的連接結構示意圖;圖6b-圖6c本發明實施例四中連接結構的相關變形的原理示意圖;圖7為本發明實施例五的多孔性表面結構和基底的連接結構示意圖;圖8a為本發明實施例六的多孔性表面結構和基底的連接結構示意圖;圖8b為本發明實施例七的多孔性表面結構和基底的連接結構示意圖;圖8c為本發明實施例八的多孔性表面結構和基底的連接結構示意圖;圖9a為本發明實施例九的多孔性表面結構和基底的連接結構示意圖;圖9b為本發明實施例十的多孔性表面結構和基底的連接結構示意圖;圖10a為本發明實施例十一的多孔性表面結構和基底的連接結構示意圖; 圖10b為本發明實施例十二的多孔性表面結構和基底的連接結構示意圖;圖11a為本發明實施例十三的多孔性表面結構和基底的連接結構示意圖;圖11b-圖11d為本發明實施例十四的多孔性表面結構和基底的連接結構示意圖;圖12為本發明實施例十五的多孔性表面結構和基底的連接結構示意圖;圖13-圖14為本發明實施例十六的多孔性表面結構和基底的連接結構示意圖;圖15為本發明實施例十八的多孔性表面結構和基底的連接結構示意圖;圖16a-圖16b為本發明實施例二十的人工假體的股骨柄的示意圖;圖16c為本發明的圖16a的截面示意圖;圖17a-圖17e為本發明實施例二十一的人工假體的柄體殼體的示意圖;圖18a為本發明實施例二十一的人工假體的髖臼杯的示意圖;圖18b為本發明的圖18a的局部示意圖;圖19a為本發明實施例二十二的人工假體的脛骨平臺的示意圖;圖19b為本發明的圖19a的局部示意圖;圖20a為本發明實施例二十三的人工假體的股骨髁的示意圖;圖20b為本發明的圖20a的局部示意圖;以及圖21-圖22分別為本發明實施例十九中改進方案的多孔性表面結構和基底的連接結構示意圖。 Fig. 1 is a schematic diagram of the connection structure of the substrate and the porous surface structure of the prior art; Fig. 2 is a schematic diagram of the connection structure of the porous surface structure and the substrate of the first embodiment of the present invention; Fig. 3 is the porous bottom plate of the first embodiment of the present invention Schematic diagram of the structure; Figure 4a is a schematic diagram of the connection structure between the porous surface structure and the substrate of Example 2 of the present invention (the lower surface of the low-porosity region has no bumps); Figure 4b is the porous surface structure and substrate of Example 2 of the present invention Schematic diagram of the connection structure of the substrate (the lower surface of the low-porosity region has bumps); Fig. 5 is a schematic diagram of the connection structure between the porous surface structure and the substrate of the third embodiment of the present invention; Fig. 6a is the porous surface structure of the fourth embodiment of the present invention Schematic diagram of the connection structure between the surface structure and the substrate; Figure 6b-6c is a schematic diagram of the principle of the related deformation of the connection structure in Embodiment 4 of the present invention; Figure 7 is a schematic diagram of the connection structure between the porous surface structure and the substrate in Embodiment 5 of the present invention; 8a is a schematic diagram of the connection structure between the porous surface structure and the substrate in Example 6 of the present invention; Figure 8b is a schematic diagram of the connection structure between the porous surface structure and the substrate in Example 7 of the present invention; A schematic diagram of the connection structure between the surface structure and the substrate; Figure 9a is a schematic diagram of the connection structure between the porous surface structure and the substrate in Example 9 of the present invention; Figure 9b is a schematic diagram of the connection structure between the porous surface structure and the substrate in Example 10 of the present invention; 10a is a schematic diagram of the connection structure between the porous surface structure and the substrate according to Embodiment 11 of the present invention; Figure 10b is a schematic diagram of the connection structure between the porous surface structure and the substrate in Example 12 of the present invention; Figure 11a is a schematic diagram of the connection structure between the porous surface structure and the substrate in Example 13 of the present invention; Figure 11b-Figure 11d is a schematic diagram of the present invention A schematic diagram of the connection structure between the porous surface structure and the substrate in Embodiment 14; FIG. 12 is a schematic diagram of the connection structure between the porous surface structure and the substrate in Embodiment 15 of the present invention; FIGS. 13-14 are the schematic diagrams of Embodiment 16 of the present invention Schematic diagram of the connection structure between the porous surface structure and the substrate; FIG. 15 is a schematic diagram of the connection structure between the porous surface structure and the substrate of Embodiment 18 of the present invention; FIG. 16a-16b is the femur of the artificial prosthesis of Embodiment 20 of the present invention Schematic diagram of the handle; Figure 16c is a schematic cross-sectional view of Figure 16a of the present invention; Figure 17a-Figure 17e is a schematic diagram of the handle body shell of the artificial prosthesis of the twenty-first embodiment of the present invention; Figure 18a is the twenty-first embodiment of the present invention A schematic diagram of the acetabular cup of the artificial prosthesis; FIG. 18b is a partial schematic diagram of FIG. 18a of the present invention; FIG. 19a is a schematic diagram of the tibial plateau of the artificial prosthesis of Embodiment 22 of the present invention; FIG. Figure 19a is a partial schematic view; Figure 20a is a schematic view of the femoral condyle of the artificial prosthesis of the twenty-third embodiment of the present invention; Figure 20b is a partial schematic view of Figure 20a of the present invention; and Figures 21-22 are respectively the embodiment of the present invention Schematic diagram of the connection structure between the porous surface structure and the substrate of the nineteenth improvement.

為使本發明實施例的目的、技術方案和優點更加清楚,下面將結合本發明實施例中的附圖,對本發明實施例中的技術方案進行清楚、完整 地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,所屬技術領域中具有通常知識者在沒有做出進步性勞動前提下所獲得的所有其他實施例,都屬於本發明保護的範圍。 In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons with ordinary knowledge in the technical field without making progressive efforts belong to the protection scope of the present invention.

實施例一:如圖2所示,本發明提供一種連接結構,包含基底23、中間體22、多孔性表面結構21。其中,多孔性表面結構21的多孔性結構包含眾多交錯佈置的支架(或梁),並在這些支架(或梁)之間構成一些多向貫通、形狀規則或不規則的孔隙。中間體22位於多孔性表面結構21和基底23之間。較佳地,中間體22為非多孔性底板,即實心底板。多孔性表面結構21、中間體22均由導電材料(如金屬材料)製成。多孔性表面結構21與中間體22是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Embodiment 1: As shown in FIG. 2 , the present invention provides a connection structure, which includes a substrate 23 , an intermediate body 22 , and a porous surface structure 21 . Wherein, the porous structure of the porous surface structure 21 includes many struts (or beams) arranged in a staggered manner, and some multi-directional through-through, regular or irregular pores are formed between these struts (or beams). The intermediate body 22 is located between the porous surface structure 21 and the substrate 23 . Preferably, the intermediate body 22 is a non-porous bottom plate, that is, a solid bottom plate. Both the porous surface structure 21 and the intermediate body 22 are made of conductive materials (such as metal materials). The porous surface structure 21 and the intermediate body 22 are integrally formed, for example, through a 3D printing additive manufacturing process, or a vapor deposition process.

示例地,基底23是實心的,有利於連接結構的整體強度,基底23可由導電材料(例如金屬材料)製成,通過鍛造、鑄造等各種方式成型,並可以對其實行各種機械加工。 Exemplarily, the base 23 is solid, which is beneficial to the overall strength of the connection structure. The base 23 can be made of conductive material (such as metal material), shaped by forging, casting, etc., and can be subjected to various machining processes.

本實施例中,多孔性表面結構21與中間體22預先連接形成複合體2A,並且中間體22與基底23通過電阻焊法進行有效地結合,使該複合體2A與基底23實現連接。所述電阻焊法包含點焊式和/或凸焊式等。以下實施例著重以中間體22與基底23採用凸焊式電阻焊法進行連接進行示例說明。 In this embodiment, the porous surface structure 21 and the intermediate body 22 are pre-connected to form a composite body 2A, and the intermediate body 22 and the substrate 23 are effectively combined by resistance welding, so that the composite body 2A and the substrate 23 are connected. The resistance welding method includes spot welding and/or projection welding and the like. The following embodiments focus on the connection between the intermediate body 22 and the base 23 by a projection welding resistance welding method for illustration.

具體而言,多孔性表面結構21的頂部的至少一部分與正電極24接觸,由於多孔性表面結構21與中間體22預先連接,即多孔性表面結構21的底部的至少一部分與中間體22的頂部接觸。中間體22的底部預先製造出多個凸起結構221,該凸起結構221與基底23頂部相接觸,以及基底23的底部與負電極25相接觸。其中,凸起結構221是朝向基底23的一側 凸起。較佳地,多個凸起結構221的製造位置同多孔性表面結構21的底部與中間體22的頂部所接觸的位置以及其鄰近區域相對應。其中,圖2中所示的X軸正方向表示右,X軸負方向表示左,Y軸正方向表示頂,Y軸負方向表示底,後續實施例的方位規定與本實施例一相同,用以更清楚地描述本發明的技術方案,上述方位規定僅用於表示圖示,不影響實際應用中的方位。 Specifically, at least a portion of the top of the porous surface structure 21 is in contact with the positive electrode 24. touch. A plurality of protruding structures 221 are prefabricated on the bottom of the intermediate body 22 , the protruding structures 221 are in contact with the top of the substrate 23 , and the bottom of the substrate 23 is in contact with the negative electrode 25 . Wherein, the protruding structure 221 is towards the side of the base 23 raised. Preferably, the manufacturing position of the plurality of protruding structures 221 corresponds to the position where the bottom of the porous surface structure 21 is in contact with the top of the intermediate body 22 and its adjacent area. Wherein, the positive direction of the X-axis shown in FIG. 2 represents the right, the negative direction of the X-axis represents the left, the positive direction of the Y-axis represents the top, and the negative direction of the Y-axis represents the bottom. In order to describe the technical solution of the present invention more clearly, the above-mentioned orientation regulations are only for illustration purposes, and do not affect the orientation in actual application.

由於多孔性表面結構21與中間體22形成的複合體2A,以及基底23被壓緊在正電極24和負電極25之間。當通以電流,電流流經多孔性表面結構21、中間體22直至凸起結構221與基底23的頂端的接觸面及鄰近區域,因接觸電阻產生電阻熱從而將凸起結構221和基底23的頂部加熱到熔化或塑性狀態,使得中間體22的凸起結構221與基底23的頂端形成金屬結合體,最終實現中間體22與基底23之間的固連作用,從而使多孔性表面結構21與中間體22形成的複合體2A與基底23緊密結合在一起。 As a result of the complex 2A formed by the porous surface structure 21 and the intermediate body 22 , the substrate 23 is compressed between the positive electrode 24 and the negative electrode 25 . When the current is applied, the current flows through the porous surface structure 21, the intermediate body 22 until the contact surface and the adjacent area of the top of the raised structure 221 and the base 23, and the resistance heat generated by the contact resistance will connect the raised structure 221 and the base 23. The top is heated to a molten or plastic state, so that the protruding structure 221 of the intermediate body 22 forms a metal bond with the top of the base 23, and finally realizes the solid connection between the intermediate body 22 and the base 23, so that the porous surface structure 21 and the base 23 The composite body 2A formed by the intermediate body 22 is closely combined with the substrate 23 .

由於中間體22的底部設有多個凸起結構221,使得凸起結構221與基底23的頂部表面接觸,兩者之間存在接觸電阻,由於通電使得電流經過從而產生電阻熱,則凸起結構221與基底23的這些接觸點形成焊點。其中,接觸電阻是指兩個獨立的工件之間在接觸時通過電流而產生的電阻,電阻熱Q正比於IR2,R為接觸電阻,I為通過工件的電流,即電流越大,接觸電阻越大,則電阻熱的值越大,反之電阻熱的值越小。 Since the bottom of the intermediate body 22 is provided with a plurality of protruding structures 221, so that the protruding structures 221 are in contact with the top surface of the base 23, there is a contact resistance between the two, and the resistance heat is generated due to the current passing through the electrification, and the protruding structures These contact points of 221 and substrate 23 form solder joints. Among them, the contact resistance refers to the resistance generated by the current passing between two independent workpieces. The resistance heat Q is proportional to IR 2 , R is the contact resistance, and I is the current passing through the workpiece, that is, the larger the current, the greater the contact resistance. The larger the value of the resistance heat is, the smaller the value of the resistance heat is.

基於上述可知,本示例的中間體22通過凸起結構(如凸點),來增大其與基底23的接觸電阻,產生足夠的電阻熱量,則凸起結構221與基底23有足夠的焊接強度。較佳地,基底23由鈦合金製成。 Based on the above, it can be seen that the intermediate body 22 of this example increases its contact resistance with the substrate 23 through a raised structure (such as a bump), and generates sufficient resistance heat, so that the raised structure 221 and the substrate 23 have sufficient welding strength . Preferably, the base 23 is made of titanium alloy.

較佳地,中間體22的凸起結構221的形狀可為球狀或弧狀或環狀或長條狀等等,本實施例對此不做具體限定,也不限定在其他示例中,如圖3所示,中間體22可帶各種凸起或紋理,用以減少接觸面積,增大接觸 電阻,從而相應地增加其與基底之間的結合效率,提高中間體與基底之間的焊接強度。 Preferably, the shape of the protruding structure 221 of the intermediate body 22 can be spherical, arc-shaped, ring-shaped, strip-shaped, etc., which is not specifically limited in this embodiment, nor is it limited in other examples, such as As shown in Figure 3, the intermediate body 22 can have various protrusions or textures to reduce the contact area and increase the contact area. resistance, thereby correspondingly increasing the bonding efficiency between it and the substrate, and improving the welding strength between the intermediate and the substrate.

示例地,正電極24和負電極25由導電材料(如金屬材料)製成;負電極25的頂部與基底23的底部緊貼,正電極24的底部與多孔性表面結構21的頂部緊貼,相互接觸的接觸面可為平面或弧面或曲面等,本發明對該接觸面的形狀、尺寸等都不做具體限定,可以根據實際應用情況設計。 Exemplarily, the positive electrode 24 and the negative electrode 25 are made of a conductive material (such as a metal material); the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21, The contact surfaces in contact with each other can be plane, arc or curved surfaces, etc. The present invention does not specifically limit the shape and size of the contact surfaces, which can be designed according to actual application conditions.

因此,本發明通過在多孔性表面結構21和基底23之間添加中間體22,並利用電阻焊方法(例如凸焊式)將中間體22與多孔性表面結構21形成的複合體和基底23進行焊接結合,可以在多孔性結構的孔隙率很高(>50%)的時候,也能保證較高的結合效率(例如70%~80%)。 Therefore, the present invention is by adding the intermediate body 22 between the porous surface structure 21 and the substrate 23, and utilizes resistance welding method (such as projection welding) to carry out the composite body formed by the intermediate body 22 and the porous surface structure 21 and the substrate 23. Welding can ensure high bonding efficiency (such as 70%~80%) when the porosity of the porous structure is high (>50%).

本實施例中的正電極24和負電極25也可互換,該拓展方式同樣也適用於後續的各個實施例,本發明對此不做贅述。 The positive electrode 24 and the negative electrode 25 in this embodiment can also be interchanged, and this expansion method is also applicable to the subsequent embodiments, which will not be described in detail in the present invention.

實施例二:對於上述的實施例一,多孔性表面結構21為一定孔隙率的結構,中間體22位於多孔性表面結構21和基底23之間,且中間體22為非多孔性底板22。其實,中間體22可以是實施例一所述的實心板,也可以是實施例二中闡述的低孔隙率的多孔性結構。 Embodiment 2: For the above embodiment 1, the porous surface structure 21 is a structure with a certain porosity, the intermediate body 22 is located between the porous surface structure 21 and the substrate 23 , and the intermediate body 22 is a non-porous bottom plate 22 . In fact, the intermediate body 22 can be the solid plate described in the first embodiment, or the porous structure with low porosity described in the second embodiment.

因此,與實施例一的主要區別在於,本實施例二的連接結構包含高孔隙率區域的第一多孔結構41、低孔隙率區域的第二多孔結構42(作為中間體)和基底43,如圖4a所示。第二多孔結構42位於第一多孔結構41和基底43之間。 Therefore, the main difference from Embodiment 1 is that the connection structure of Embodiment 2 includes a first porous structure 41 in a high-porosity region, a second porous structure 42 in a low-porosity region (as an intermediate) and a substrate 43 , as shown in Figure 4a. The second porous structure 42 is located between the first porous structure 41 and the substrate 43 .

示例地,第一多孔結構41和第二多孔結構42的孔性結構均是包含眾多交錯佈置的支架(或梁),在這些支架(或梁)之間構成一些多向貫通、形狀規則或不規則的孔隙。其中,第一多孔結構41的孔隙率大小記為a%,第二多孔結構42的孔隙率大小記為b%,a%>b%。當b%數值 等於0時,這裡的第二多孔結構42就是實施例一所述的實心結構的中間體。因此,相比構成多孔性表面結構的第一多孔結構41,中間體採用第二多孔結構42時,該第二多孔結構42的緻密度更高,如表現為第二多孔結構42中的支架(梁)更粗和/或孔隙率更低。 Illustratively, the porous structures of the first porous structure 41 and the second porous structure 42 both contain numerous staggered supports (or beams), and some multidirectional through-throughs with regular shapes are formed between these supports (or beams). or irregular pores. Wherein, the porosity of the first porous structure 41 is marked as a%, and the porosity of the second porous structure 42 is marked as b%, where a%>b%. when b% value When equal to 0, the second porous structure 42 here is the intermediate of the solid structure described in the first embodiment. Therefore, compared with the first porous structure 41 constituting the porous surface structure, when the intermediate adopts the second porous structure 42, the density of the second porous structure 42 is higher, as shown in the second porous structure 42 The supports (beams) in are thicker and/or less porous.

本實施例中,第一多孔結構41、第二多孔結構42均由導電材料(如金屬材料)製成。第一多孔結構41與第二多孔結構42是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 In this embodiment, both the first porous structure 41 and the second porous structure 42 are made of conductive materials (such as metal materials). The first porous structure 41 and the second porous structure 42 are integrally formed structures, for example, realized through a 3D printing additive manufacturing process or a vapor deposition process.

第一多孔結構41與第二多孔結構42形成為複合體4A,並且第二多孔結構42與基底43之間通過電阻焊法,進行有效地結合,例如凸焊式阻焊法:第二多孔結構42底部至少部分的支架(或梁)與基底43頂部相接觸,因接觸電阻產生電阻熱,從而將兩者的接觸部分加熱到熔化或塑性狀態,使得第二多孔結構42與基底43頂端形成金屬結合體,使複合體4A與基底43實現連接。 The first porous structure 41 and the second porous structure 42 are formed into a complex 4A, and the second porous structure 42 and the substrate 43 are effectively bonded by resistance welding, such as a projection welding resist method: the first At least part of the support (or beam) at the bottom of the second porous structure 42 is in contact with the top of the substrate 43, and resistance heat is generated due to contact resistance, thereby heating the contact portion of the two to a melting or plastic state, so that the second porous structure 42 and the top of the substrate 43 are in contact with each other. A metal combination is formed on the top of the base 43 , so that the complex 4A is connected to the base 43 .

第一多孔結構41的頂部的至少一部分與正電極44接觸,第二多孔結構42的底部的至少一部分與基底43的頂部相接觸,基底43的底部與負電極45接觸。正電極24和負電極25由金屬材料製成。負電極45的頂部與基底43的底部緊貼,正電極44的底部與第一多孔結構41的頂部緊貼。 At least a portion of the top of the first porous structure 41 is in contact with the positive electrode 44 , at least a portion of the bottom of the second porous structure 42 is in contact with the top of the substrate 43 , and the bottom of the substrate 43 is in contact with the negative electrode 45 . The positive electrode 24 and the negative electrode 25 are made of a metal material. The top of the negative electrode 45 is in close contact with the bottom of the substrate 43 , and the bottom of the positive electrode 44 is in close contact with the top of the first porous structure 41 .

與實施例一的主要區別在於,本實施例二利用低孔隙率區域的第二多孔結構42來替換實施例一的實心結構的中間體,實施例二的中間體雖然為多孔性結構,但是由於其的孔隙率較低並處於一定範圍值,能夠保證第二多孔結構42與基底43保持一定的接觸面積,從而保證一定的結合效率,原則上來說,第二多孔結構42的孔隙率越小,複合體4A與基底43之間的結合效率越高,反之效率越低;同時,最終的結合效率還與多孔結構內部交錯佈置的支架(或梁)的具體佈置方式有關,可以根據實際應用情況設計。 The main difference from Example 1 is that this Example 2 uses the second porous structure 42 in the low-porosity region to replace the solid-structure intermediate of Example 1. Although the intermediate of Example 2 is a porous structure, it is Because its porosity is low and in a certain range, it can ensure that the second porous structure 42 maintains a certain contact area with the substrate 43, thereby ensuring a certain combination efficiency. In principle, the porosity of the second porous structure 42 The smaller it is, the higher the binding efficiency between the complex 4A and the substrate 43, and vice versa; at the same time, the final binding efficiency is also related to the specific arrangement of the staggered supports (or beams) inside the porous structure, which can be determined according to the actual situation. Application case design.

上述的第二多孔結構42的下表面也可以帶有凸點421,如圖4b所示。當通以電流後,電流流經第一多孔結構41和第二多孔結構42,通過第二多孔結構42的凸點421與基底43的頂部的接觸產生電阻熱從而使得第二多孔結構42的底部與基底43的頂部形成金屬結合體,從而使得第一多孔結構41和第二多孔結構42形成的複合體4A與基底43緊密結合在一起。 The lower surface of the above-mentioned second porous structure 42 may also have bumps 421, as shown in FIG. 4b. When the current is applied, the current flows through the first porous structure 41 and the second porous structure 42, and the contact between the bump 421 of the second porous structure 42 and the top of the substrate 43 generates resistance heat so that the second porous structure The bottom of the structure 42 and the top of the substrate 43 form a metal combination, so that the composite 4A formed by the first porous structure 41 and the second porous structure 42 is tightly bonded to the substrate 43 .

實施例三:對於上述的實施例一,負電極25的頂部與基底23的底部緊貼,以及正電極24的底部與多孔性表面結構21的頂部緊貼;較佳地,正電極24和負電極25為大平面電極且正電極24覆蓋於多孔性表面結構21頂部之上,負電極25貼覆在基底23的底部之下。由於實施例一的大平面的正電極24壓在多孔性表面結構21頂部,大平面的正電極24與多孔性表面結構21的表面接觸並產生擠壓,使得多孔性表面結構21的表面發生損傷,例如因被壓產生凹陷以及因接觸電阻生熱導致溫度升高而變黑、凹陷、孔隙空間減小等。 Embodiment 3: For the above-mentioned embodiment 1, the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21; preferably, the positive electrode 24 and the negative The electrode 25 is a large planar electrode, and the positive electrode 24 covers the top of the porous surface structure 21 , and the negative electrode 25 covers the bottom of the substrate 23 . Since the large-plane positive electrode 24 of Embodiment 1 is pressed on the top of the porous surface structure 21, the large-plane positive electrode 24 is in contact with the surface of the porous surface structure 21 and squeezed, causing damage to the surface of the porous surface structure 21. , such as depression due to being pressed, and blackening, depression, and reduction of pore space due to temperature rise due to contact resistance heat generation.

為了保護多孔性表面結構的表面,本實施例三中的正電極54並非採用大平面電極貼覆於多孔性表面結構51上,而是將正電極分成多個正電極單體541並將正電極單體541沿著豎向方向插入至多孔性表面結構51內的空隙5a中,而且正電極單體541置於非多孔性底板52(作為中間體)頂端,如圖5所示。同樣地,本示例中的多孔性表面結構51與非多孔性底板52是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。本實施例中的基底53、非多孔性底板52、多孔性表面結構51的材質及製作製程等,都可以參見實施例一,在此不做贅述。 In order to protect the surface of the porous surface structure, the positive electrode 54 in the third embodiment does not use a large planar electrode to stick on the porous surface structure 51, but divides the positive electrode into a plurality of positive electrode monomers 541 and separates the positive electrode The monomer 541 is inserted into the void 5a in the porous surface structure 51 along the vertical direction, and the positive electrode monomer 541 is placed on the top of the non-porous bottom plate 52 (as an intermediate body), as shown in FIG. 5 . Likewise, the porous surface structure 51 and the non-porous bottom plate 52 in this example are integrally formed structures, for example, realized by 3D printing additive manufacturing process or vapor deposition process. The material and manufacturing process of the substrate 53 , the non-porous bottom plate 52 , and the porous surface structure 51 in this embodiment can be referred to in Embodiment 1, and will not be repeated here.

本實施例中,各個正電極單體541並聯連接且均連接到電源正極端,負電極55連接在電源負極端。如圖5所示,非多孔性底板52的底部預先製造出多個凸起結構521,該凸起結構521與基底53的頂部相接觸,以及 基底53的底部與負電極55相接觸。較佳地,多孔性表面結構51內的空隙5a作為對應正電極單體541的插入空間,該空隙5a為預製的孔隙部分,空隙5a是從多孔性表面結構51的表面開始,穿過多孔性表面結構51直至非多孔性底板52的上方,使得非多孔性底板52的頂部在空隙5a內暴露,供插入的正電極單體541底部與非多孔性底板52的頂部接觸。 In this embodiment, each positive electrode unit 541 is connected in parallel and is connected to the positive terminal of the power supply, and the negative electrode 55 is connected to the negative terminal of the power supply. As shown in FIG. 5 , the bottom of the non-porous base plate 52 is prefabricated with a plurality of raised structures 521, which are in contact with the top of the substrate 53, and The bottom of the substrate 53 is in contact with the negative electrode 55 . Preferably, the void 5a in the porous surface structure 51 serves as the insertion space for the corresponding positive electrode monomer 541, the void 5a is a prefabricated pore part, and the void 5a starts from the surface of the porous surface structure 51 and passes through the porous The surface structure 51 goes up to the top of the non-porous bottom plate 52 , so that the top of the non-porous bottom plate 52 is exposed in the gap 5 a for the bottom of the inserted positive electrode unit 541 to contact the top of the non-porous bottom plate 52 .

本實施例三的正電極54與多孔性表面結構51的表面未產生接觸,解決了多孔性表面結構的表面與正電極之間因接觸電阻產生電阻熱發生損傷的問題。 The positive electrode 54 of the third embodiment is not in contact with the surface of the porous surface structure 51 , which solves the problem of damage between the surface of the porous surface structure and the positive electrode due to resistance heat generated by contact resistance.

示例地,空隙5a與正電極單體541側向配合,例如是間隙配合,即空隙5a需要保證在插入正電極單體541後還要與臨近部分的多孔性表面結構51間隔開,避免該部分的多孔性表面結構51的表面因電阻熱而受損,用以保護多孔性表面結構的表面。較佳地,正電極單體541為柱狀結構或其他形狀的結構,本實施例對此不做限定,也不限定在其他相關示例中。 Exemplarily, the gap 5a is laterally fitted with the positive electrode monomer 541, for example, a clearance fit, that is, the gap 5a needs to be spaced apart from the porous surface structure 51 of the adjacent part after the positive electrode monomer 541 is inserted, so as to avoid this part The surface of the porous surface structure 51 is damaged due to resistance heat, so as to protect the surface of the porous surface structure. Preferably, the positive electrode unit 541 is a columnar structure or other shapes, which is not limited in this embodiment, nor in other related examples.

示例地,非多孔性底板52的底部的多個凸起結構521與各個正電極單體541的位置相對應,例如,正電極單體541與非多孔性底板52的頂部之間接觸位置是處在各凸起結構521的正上方或者處於凸起結構521相鄰部分區域內,用以保證電流順利傳導至非多孔性底板52直至凸起結構521與基底53的頂端的接觸面及鄰近區域,產生電阻熱從而將凸起結構521與基底53的頂端形成結合體。本實施例的凸起結構521的形狀等都可以參見實施例一,在此不做贅述。 Exemplarily, the plurality of protruding structures 521 on the bottom of the non-porous bottom plate 52 correspond to the position of each positive electrode monomer 541, for example, the contact position between the positive electrode monomer 541 and the top of the non-porous bottom plate 52 is at Directly above each raised structure 521 or in the area adjacent to the raised structure 521, to ensure that the current is smoothly conducted to the non-porous bottom plate 52 until the contact surface and the adjacent area between the raised structure 521 and the top of the base 53, Resistance heat is generated to form a combination of the protruding structure 521 and the top of the base 53 . For the shape of the protruding structure 521 in this embodiment, etc., reference may be made to Embodiment 1, which will not be repeated here.

值得說明的是,本實施例三中將正電極分成多個正電極單體並將正電極單體沿著豎向方向插入至多孔性表面結構內的空隙,同樣適用於中間體是第二多孔結構(比所述多孔性表面結構的孔隙率低)的實施例二,即將實施例二中的正電極44替換為多個正電極單體並分別將各個正電極單體沿著豎向方向插入至多孔性表面結構41內的空隙,此時, 該預製的空隙從第一多孔結構的表面開始,穿過第一多孔結構後直至第二多孔結構上方或第二多孔結構內部,使得第二多孔結構的部分在空隙5a內暴露,供插入的正電極單體的底部與部分的第二多孔結構接觸,同樣地,該空隙與正電極單體側向配合,例如是間隙配合,即空隙需要保證在插入正電極單體後還要與臨近部分的多孔性表面結構間隔開,避免該部分的多孔性表面結構的表面因電阻熱而受損,用以保護多孔性表面結構的表面,其他具體結構和製程等與本實施例三相同,在此不做贅述。 It is worth noting that in the third embodiment, the positive electrode is divided into a plurality of positive electrode monomers and the positive electrode monomers are inserted into the voids in the porous surface structure along the vertical direction. The second embodiment of the pore structure (lower than the porosity of the porous surface structure), that is, the positive electrode 44 in the second embodiment is replaced by a plurality of positive electrode monomers and each positive electrode monomer is vertically inserted into the voids in the porous surface structure 41, at this time, The prefabricated void starts from the surface of the first porous structure, passes through the first porous structure to the top of the second porous structure or inside the second porous structure, so that part of the second porous structure is exposed in the void 5a , the bottom of the inserted positive electrode monomer is in contact with part of the second porous structure. Similarly, the gap is laterally fitted with the positive electrode monomer, such as a gap fit, that is, the gap needs to ensure that after the positive electrode monomer is inserted, It should also be spaced apart from the porous surface structure of the adjacent part to prevent the surface of the porous surface structure of this part from being damaged by resistance heat, so as to protect the surface of the porous surface structure. Other specific structures and processes are the same as those of this embodiment. The three are the same, and will not be repeated here.

實施例四:對於上述的實施例一,正電極24和負電極25可由導電材料(例如金屬材料)製成;負電極25的頂部與基底23的底部緊貼,正電極24的底部與多孔性表面結構21的頂部緊貼;正電極24和負電極25為大平面電極,並且正電極24覆蓋於多孔性表面結構21的頂部之上,負電極25貼覆在基底23的底部之下。 Embodiment four: For above-mentioned embodiment one, positive electrode 24 and negative electrode 25 can be made by conductive material (such as metal material); The top of the surface structure 21 is closely attached; the positive electrode 24 and the negative electrode 25 are large planar electrodes, and the positive electrode 24 covers the top of the porous surface structure 21 , and the negative electrode 25 covers the bottom of the substrate 23 .

與實施例一的主要區別在於,本實施例四中的正電極是柔性正電極64,如圖6a所示。本實施例四中,柔性正電極64為大平面電極並覆蓋於多孔性表面結構61的頂部之上,負電極65貼覆在基底63的底部之下,非多孔性底板62位於多孔性表面結構61和基底63之間。示例地,多孔性表面結構61與非多孔性底板62是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。本實施例的基底63、非多孔性底板62、多孔性表面結構61的材質及製作製程等,都可以參見實施例一,在此不做贅述。 The main difference from Embodiment 1 is that the positive electrode in Embodiment 4 is a flexible positive electrode 64, as shown in FIG. 6a. In the fourth embodiment, the flexible positive electrode 64 is a large planar electrode and covers the top of the porous surface structure 61, the negative electrode 65 is attached to the bottom of the substrate 63, and the non-porous bottom plate 62 is located on the porous surface structure. 61 and base 63. Exemplarily, the porous surface structure 61 and the non-porous bottom plate 62 are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process. The materials and manufacturing process of the substrate 63 , the non-porous bottom plate 62 , and the porous surface structure 61 in this embodiment can be referred to in the first embodiment, and will not be repeated here.

本實施例四中,由於柔性正電極64覆蓋於多孔性表面結構61的頂部表面,對多孔性表面結構61的表面產生一定壓力,此時柔性正電極64在壓力的相互作用下產生一定柔性變形,使得其與多孔性表面結構61的頂部之間的接觸面積增大(相比於同等條件下的硬性正電極與多孔性 表面結構頂部之間的接觸面積),不僅可以降低柔性正電極64與多孔性表面結構61之間的接觸電阻,改善或避免多孔性表面因電阻熱導致表面損傷(例如凹陷、變黑、孔隙空間減小等),保護多孔性表面結構61的表面,而且可以增強電流傳導,非多孔性底板62與基底63之間的焊接結合效率增大,增大焊接強度。 In the fourth embodiment, since the flexible positive electrode 64 covers the top surface of the porous surface structure 61, a certain pressure is generated on the surface of the porous surface structure 61. At this time, the flexible positive electrode 64 produces a certain flexible deformation under the interaction of pressure. , so that the contact area between it and the top of the porous surface structure 61 increases (compared to the rigid positive electrode and the porous The contact area between the top of the surface structure), not only can reduce the contact resistance between the flexible positive electrode 64 and the porous surface structure 61, but also improve or avoid surface damage (such as depression, blackening, pore space, etc.) caused by resistance heat on the porous surface. reduction, etc.), the surface of the porous surface structure 61 is protected, and the current conduction can be enhanced, the welding bonding efficiency between the non-porous bottom plate 62 and the base 63 is increased, and the welding strength is increased.

示例地,柔性材料為導電材料,例如銅箔或錫箔等,本實施例對此不做限定,也不限定在其他相關示例中,可以根據實際應用情況設計。 Exemplarily, the flexible material is a conductive material, such as copper foil or tin foil, which is not limited in this embodiment or in other related examples, and can be designed according to actual application conditions.

作為實施例四的一種變形,如下:如圖6b所示,在正電極604的底部和多孔性表面結構601的頂部之間增加易變形良導電介質606,所述易變形良導電介質606覆蓋於多孔性表面結構601的頂面。較佳地,所述易變形良導電介質606為連續的固體薄膜狀,例如銅箔等。同樣地,中間體602位於多孔性表面結構601和基底603之間,負電極605的頂部與基底603的底部緊貼。正電極604為大平面電極並覆蓋於易變形良導電介質606的頂面,由於易變形良導電介質606極易產生變形,使得其與多孔性表面結構601之間的接觸面積增大,不僅可以降低多孔性表面結構601與其上方的正電極604之間的接觸電阻,降低電阻熱,減少多孔性表面結構601的表面損傷,而且可以增大電流傳導作用,使得中間體602與基底603之間的焊接強度增大。 As a modification of Embodiment 4, it is as follows: as shown in FIG. 6b, a deformable and highly conductive medium 606 is added between the bottom of the positive electrode 604 and the top of the porous surface structure 601, and the deformable and highly conductive medium 606 covers the The top surface of the porous surface structure 601 . Preferably, the deformable and good conductive medium 606 is in the form of a continuous solid film, such as copper foil. Likewise, the intermediate body 602 is located between the porous surface structure 601 and the substrate 603 , and the top of the negative electrode 605 is in close contact with the bottom of the substrate 603 . The positive electrode 604 is a large planar electrode and covers the top surface of the deformable and highly conductive medium 606. Since the deformable and highly conductive medium 606 is easily deformed, the contact area between it and the porous surface structure 601 increases, which not only can Reduce the contact resistance between the porous surface structure 601 and the positive electrode 604 above it, reduce the resistance heat, reduce the surface damage of the porous surface structure 601, and increase the current conduction effect, so that the intermediate body 602 and the substrate 603 Increased welding strength.

根據上述變形方式,還可做進一步地拓展,如下:如圖6c所示,在正電極6004的底部和多孔性表面結構6001的頂部之間的孔隙內填充良導電材料粉末6006(或良導電絲材),這樣可以降低正電極6004與多孔性表面結構6001的表面之間的接觸電阻,從而減小了多孔性表面結構6001的表面損傷,同時還可增大電流傳導作用,增大中間體6002與基底6003之間的焊接結合效率。較佳地,良導電材料粉末6006(或良導電絲材)的材質與多孔性表面結構6001的材質相同,例如為鈦粉(或鈦絲)。同樣地,如圖6c,中間體6002位於多孔性表 面結構6001和基底6003之間,負電極6005的頂部與基底6003的底部緊貼。在另一不同的示例中,通過在多孔性表面結構6001的表面噴塗導電材料,同樣也可以降低電極和多孔性表面結構6001之間的接觸電阻,減少多孔性表面結構6001的表面損傷,本發明對此不做贅述。 According to the above deformation method, it can be further expanded as follows: as shown in Figure 6c, the pores between the bottom of the positive electrode 6004 and the top of the porous surface structure 6001 are filled with good conductive material powder 6006 (or good conductive wire material), which can reduce the contact resistance between the positive electrode 6004 and the surface of the porous surface structure 6001, thereby reducing the surface damage of the porous surface structure 6001, and at the same time, it can also increase the current conduction effect and increase the intermediate body 6002 Solder bonding efficiency with substrate 6003. Preferably, the material of the good conductive material powder 6006 (or the good conductive wire) is the same as that of the porous surface structure 6001, such as titanium powder (or titanium wire). Similarly, as shown in Figure 6c, the intermediate body 6002 is located on the porous surface Between the planar structure 6001 and the substrate 6003, the top of the negative electrode 6005 is in close contact with the bottom of the substrate 6003. In another different example, by spraying conductive material on the surface of the porous surface structure 6001, the contact resistance between the electrode and the porous surface structure 6001 can also be reduced, and the surface damage of the porous surface structure 6001 can be reduced. The present invention I won't go into details on this.

無論上述的易變形良導電介質606、良導電材料粉末6006(或良導電絲材)、噴塗的導電材料或液態導電劑等,均需要在多孔性表面結構與基底完成焊接結合之後適當去除以致於保證多孔性表面結構的孔隙敞開。 Regardless of the above-mentioned easily deformable good conductive medium 606, good conductive material powder 6006 (or good conductive wire), sprayed conductive material or liquid conductive agent, etc., all need to be properly removed after the porous surface structure and the substrate are welded and bonded so that Keep the pores of the porous surface structure open.

值得說明的是,在上述任一實施例完成多孔性表面結構與基底連接之後,還可在多孔性表面結構的表面地單獨地噴塗一層羥基磷灰石(HA)塗層,該HA塗層具有良好的生物活性和生物相容性,有利於後續的骨長入過程;或者,還可在多孔性表面結構的表面地單獨地噴塗一層包含抗菌的銀離子的塗層或者其他含有細胞生長因數等。 It is worth noting that after any of the above-mentioned embodiments completes the connection of the porous surface structure to the substrate, a layer of hydroxyapatite (HA) coating can also be sprayed separately on the surface of the porous surface structure, and the HA coating has Good bioactivity and biocompatibility are beneficial to the subsequent bone ingrowth process; alternatively, a coating containing antibacterial silver ions or other cell growth factors can also be sprayed on the surface of the porous surface structure separately .

基於上述,本發明還提供一個變形示例,具體如下:為了避免或改善多孔性表面結構的表面因電阻熱發生損傷,需要盡可能地提高多孔性表面結構的導電性能,用以減少其與電極之間的接觸電阻。本變形示例中,將特定材料(導電性較好的材質)的熔液滲透到多孔性表面結構中,熔液幾乎可以將選定部分(間隔層的上方部分)的多孔性表面結構內的孔隙填滿,此時不僅需要限定所述導電性質較好的熔液的熔點較低,還需要在多孔性表面結構內設置一間隔層,間隔層較佳為由導電材料製成,從而避免熔液向下滲透而流至下方的中間體上,避免影響電阻焊的效果。待電阻焊過程結束後,將結合後的整體放入到高溫環境中,由於特定導電介質的熔點低於多孔性表面結構和基底(如鈦合金),則高溫環境對基底影響不大,但是低熔點的導電介質會被熔化,並通過現有技術的一些製程將該添加的低熔點的導電介質去除。 Based on the above, the present invention also provides a deformation example, which is as follows: In order to avoid or improve the surface damage of the porous surface structure due to resistance heat, it is necessary to improve the electrical conductivity of the porous surface structure as much as possible to reduce the distance between it and the electrode. contact resistance between them. In this modified example, the melt of a specific material (material with better conductivity) is infiltrated into the porous surface structure, and the melt can almost fill the pores in the porous surface structure of the selected part (the upper part of the spacer layer). At this time, it is not only necessary to limit the melting point of the melt with better conductive properties, but also to set a spacer layer in the porous surface structure. The spacer layer is preferably made of a conductive material, so as to prevent the melt from flowing Penetrate down and flow to the intermediate body below, so as to avoid affecting the effect of resistance welding. After the resistance welding process is over, put the combined whole into a high-temperature environment. Since the melting point of the specific conductive medium is lower than that of the porous surface structure and substrate (such as titanium alloy), the high-temperature environment has little effect on the substrate, but low The conductive medium with a melting point is melted, and the added conductive medium with a low melting point is removed through some processes in the prior art.

實施例五:對於上述的實施例二,正電極24和負電極25由導電材料(金屬材料)製成,負電極45的頂部與基底43的底部緊貼,正電極44的底部與高孔隙率區域的第一多孔結構41的頂部緊貼。與實施例二的主要區別在於:本實施例五的正電極是由柔性材料製成的柔性正電極74,並非是上述實施例中的金屬材料,如圖7所示。 Embodiment five: For above-mentioned embodiment two, positive electrode 24 and negative electrode 25 are made of conductive material (metal material), and the top of negative electrode 45 is close to the bottom of substrate 43, and the bottom of positive electrode 44 and high porosity The top of the first porous structure 41 of the region is in close contact. The main difference from the second embodiment is that the positive electrode of the fifth embodiment is a flexible positive electrode 74 made of flexible material, not the metal material in the above embodiment, as shown in FIG. 7 .

本實施例五中,柔性正電極74為大平面電極並覆蓋於高孔隙率區域的第一多孔結構71的頂部之上,負電極75貼覆在基底73的底部之下,低孔隙率區域的第二多孔結構72位於高孔隙率區域的第一多孔結構71和基底73之間。較佳地,第一多孔結構71與第二多孔結構72是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。本實施例中的基底73、第二多孔結構72、第一多孔結構71的材質及製作製程等,都可以參見實施例二,在此不做贅述。 In the fifth embodiment, the flexible positive electrode 74 is a large planar electrode and covers the top of the first porous structure 71 in the high-porosity region, the negative electrode 75 is attached under the bottom of the substrate 73, and the low-porosity region The second porous structure 72 is located between the first porous structure 71 and the substrate 73 in the high-porosity region. Preferably, the first porous structure 71 and the second porous structure 72 are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process. The material and manufacturing process of the substrate 73 , the second porous structure 72 , and the first porous structure 71 in this embodiment can be referred to in the second embodiment, and will not be repeated here.

本實施例中,柔性正電極74覆蓋於第一多孔結構71的頂面,對第一多孔結構71的頂面產生一定的壓力,此時柔性正電極74的柔性材料會在壓力的相互作用下產生一定柔性變形,使得其與第一多孔結構71的頂部之間的接觸面積增大(相比於同等條件下的硬性正電極與第一多孔結構頂部之間的接觸面積),不僅可以降低柔性正電極74與多孔性表面結構71之間的接觸電阻,改善或避免多孔性表面因電阻熱導致表面損傷(例如凹陷、變黑、孔隙空間減小等),保護多孔性表面結構71的表面,而且可以增強電流傳導,非多孔性底板72與基底73之間的焊接結合效率增大,增大焊接強度。 In this embodiment, the flexible positive electrode 74 covers the top surface of the first porous structure 71, and generates a certain pressure on the top surface of the first porous structure 71. At this time, the flexible material of the flexible positive electrode 74 will be under mutual pressure. Under the action, a certain flexible deformation is produced, so that the contact area between it and the top of the first porous structure 71 increases (compared with the contact area between the rigid positive electrode and the top of the first porous structure under the same conditions), It can not only reduce the contact resistance between the flexible positive electrode 74 and the porous surface structure 71, improve or avoid surface damage (such as depression, blackening, and reduction of pore space) on the porous surface due to resistance heat, and protect the porous surface structure. 71, and can enhance the current conduction, the welding bonding efficiency between the non-porous bottom plate 72 and the base 73 is increased, and the welding strength is increased.

示例地,柔性材料為導電材料,例如銅箔或錫箔等,本實施例對此不做限定,也不限定在其他相關示例中,可以根據實際應用情況設計。 Exemplarily, the flexible material is a conductive material, such as copper foil or tin foil, which is not limited in this embodiment or in other related examples, and can be designed according to actual application conditions.

類似實施例二(圖4b所示),第二多孔結構(低孔隙率底板)72的下表面可以帶有凸點,以增加電阻焊效率。 Similar to Embodiment 2 (shown in FIG. 4 b ), the lower surface of the second porous structure (low-porosity bottom plate) 72 may have bumps to increase the efficiency of resistance welding.

實施例六:基於上述實施例一,本實施例六不僅在多孔性表面結構811和基底813之間設置非多孔性底板812(或低孔隙率的多孔結構),以及非多孔性底板812的底面預製造出多個凸起結構,凸起結構與基底813頂部相接觸,同時還在非多孔性底板812上靠近多孔性表面結構811的一側的表面設置複數個支撐柱816a,如圖8a所示,所述支撐柱816a介於非多孔性底板812和正電極814之間。支撐柱816a位於多孔性表面結構811的內部,支撐柱816a的頂端與多孔性表面結構811的頂端基本平齊,支撐柱816a的高度基本等於多孔性表面結構811的高度。同樣地,本實施例六中的負電極815的頂部也與基底813的底部緊貼。當然這裡的所述的高度方向為圖示的方位,上述方位規定僅用於表示圖示,不一定作為實際應用中的方位,後續相關實施例的規定同此一致。 Embodiment 6: Based on the above Embodiment 1, this Embodiment 6 not only sets a non-porous bottom plate 812 (or a porous structure with low porosity) between the porous surface structure 811 and the substrate 813, but also the bottom surface of the non-porous bottom plate 812 A plurality of protruding structures are prefabricated, and the protruding structures are in contact with the top of the substrate 813, and at the same time, a plurality of support columns 816a are provided on the surface of the non-porous bottom plate 812 close to the porous surface structure 811, as shown in FIG. 8a As shown, the support column 816a is interposed between the non-porous bottom plate 812 and the positive electrode 814. The support column 816a is located inside the porous surface structure 811 , the top of the support column 816a is substantially flush with the top of the porous surface structure 811 , and the height of the support column 816a is substantially equal to the height of the porous surface structure 811 . Similarly, the top of the negative electrode 815 in the sixth embodiment is also in close contact with the bottom of the substrate 813 . Of course, the height direction mentioned here is the orientation shown in the figure, and the above-mentioned orientation regulations are only used to represent the illustration, not necessarily as the orientation in actual application, and the provisions of the subsequent related embodiments are consistent with this.

本實施例中,支撐柱816a為良導電的實心結構。各個支撐柱816a分別與其下方對應的各凸起結構正對,使得支撐柱816a覆蓋的區域同凸起結構與基底813之間的接觸部分至少有部分重合,且支撐柱816a的尺寸與凸起結構相匹配。 In this embodiment, the support column 816a is a solid structure with good electrical conductivity. Each supporting column 816a is directly opposite to each corresponding raised structure below it, so that the area covered by the supporting column 816a is at least partially overlapped with the contact portion between the raised structure and the base 813, and the size of the supporting column 816a is the same as that of the raised structure. match.

較佳地,非多孔性底板812、多孔性表面結構811以及支撐柱816a是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Preferably, the non-porous bottom plate 812 , the porous surface structure 811 and the support column 816 a are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process.

本示例中雖然多孔性表面結構811的表面仍與其上方的正電極814有部分接觸,但由於支撐柱816a為良導電的實心結構,而多孔性表面結構811因有孔隙存在,則電極流出的大部分電流優先通過實心結構的良導電的支撐柱816a,大大降低多孔性表面結構811因電阻熱產生的表面損傷,還能增強電流傳導作用,非多孔性底板812與基底813之間的焊接結合效率增大,保證足夠的焊接強度。 In this example, although the surface of the porous surface structure 811 is still in partial contact with the positive electrode 814 above it, since the support pillar 816a is a solid structure with good conductivity, and the porous surface structure 811 has pores, the large amount of electrode outflow Part of the current preferentially passes through the solid structure of the good conductive support column 816a, which greatly reduces the surface damage of the porous surface structure 811 due to resistance heat, and can also enhance the current conduction effect, and the welding bonding efficiency between the non-porous bottom plate 812 and the substrate 813 Increase to ensure sufficient welding strength.

實施例七: 作為本實施例六的一種變形,本實施例七的變形在於:為了完全避免多孔性表面結構與其上方的正電極接觸產生電阻熱導致多孔性表面結構的表面產生損傷,如圖8b所示,本實施例七將所有支撐柱816b的頂端設置成高於多孔性表面結構811的頂面,各個支撐柱816b的高度均高於其對應鄰近部分的多孔性表面結構811的高度,這樣的話,正電極會與較高位置處的支撐柱816b先接觸,從而避免了正電極與較低位置的多孔性表面結構811進行接觸。 Embodiment seven: As a modification of the sixth embodiment, the modification of the seventh embodiment is: in order to completely avoid the contact between the porous surface structure and the positive electrode above it to generate resistance heat and cause damage to the surface of the porous surface structure, as shown in Figure 8b, this Embodiment 7 Set the tops of all the support columns 816b higher than the top surface of the porous surface structure 811, and the height of each support column 816b is higher than the height of the porous surface structure 811 of its corresponding adjacent part. In this case, the positive electrode It will first contact with the support pillar 816b at the higher position, thereby avoiding the contact of the positive electrode with the porous surface structure 811 at the lower position.

由於本例中的支撐柱816b的高度超出多孔性表面結構,為了保證整個連接結構的基本功能,焊接完成後可以通過切削等製程將支撐柱816b高出多孔性表面結構811的這部分去除,保證表面平整。進一步地,如圖8b所示,正電極不僅可以是圖8a所示的連續式大平面正電極,還可以是分段的多個正電極單體814b,每段正電極單體814b均壓在對應的支撐柱816b的頂端,且正電極單體814b並聯連接至一個大平面電極或直接連接至電源正極端。 Since the height of the support column 816b in this example exceeds the porous surface structure, in order to ensure the basic functions of the entire connection structure, the part of the support column 816b higher than the porous surface structure 811 can be removed by cutting or other processes after welding to ensure flat surface. Further, as shown in FIG. 8b, the positive electrode can not only be the continuous large planar positive electrode shown in FIG. The top of the corresponding support column 816b, and the positive electrode unit 814b are connected in parallel to a large planar electrode or directly connected to the positive terminal of the power supply.

實施例八:基於上述實施例六和實施例七,本實施例八做進一步地拓展,該拓展的思路在於:如圖8c所示,各個支撐柱816c的頂端低於對應部分的多孔性表面結構811的頂面,支撐柱816c的高度低於多孔性表面結構811的高度,所述支撐柱816a隱藏在多孔性表面結構811的內部,即支撐柱816c上方是多孔結構。這樣的話,正電極814會與其下方的多孔性表面結構811的表面先接觸,從而多孔性表面結構811的頂面因接觸電阻生熱導致發生少量下沉,直至下沉至支撐柱816c的頂端位置為止(最大下沉程度也只能下沉至支撐柱頂端位置,當下沉程度不大時,下沉位置高於支撐柱頂端位置),因為支撐柱816c為實心結構,支撐柱816c起到限位的作用,保證最終的多孔性表面結構811的表面的高度達至支撐柱816c所在的高度位置,避免多孔性表面結構811被過多壓縮。較佳 地,支撐柱816c上方也可以是凹陷結構,使得支撐柱816c的頂端低於對應部分的多孔性表面結構811的頂面,所述支撐柱816c也能起到限位的作用。 Embodiment 8: Based on the above Embodiment 6 and Embodiment 7, this Embodiment 8 is further expanded. The idea of this expansion is: as shown in Figure 8c, the top of each support column 816c is lower than the porous surface structure of the corresponding part On the top surface of 811, the height of the support column 816c is lower than that of the porous surface structure 811, and the support column 816a is hidden inside the porous surface structure 811, that is, the support column 816c is above the porous structure. In this case, the positive electrode 814 will first contact the surface of the porous surface structure 811 below it, so that the top surface of the porous surface structure 811 sinks a little due to the heat generated by the contact resistance until it sinks to the top position of the support column 816c So far (the maximum sinking degree can only sink to the top position of the support column, when the sinking degree is not large, the sinking position is higher than the top position of the support column), because the support column 816c is a solid structure, the support column 816c acts as a limit function, to ensure that the height of the surface of the final porous surface structure 811 reaches the height position where the supporting pillars 816c are located, so as to avoid excessive compression of the porous surface structure 811 . better Alternatively, the top of the support column 816c may also be a recessed structure, so that the top of the support column 816c is lower than the top surface of the corresponding portion of the porous surface structure 811, and the support column 816c can also play a position-limiting role.

示例地,非多孔性底板812、多孔性表面結構811以及支撐柱816c可以是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Exemplarily, the non-porous bottom plate 812 , the porous surface structure 811 and the supporting pillars 816 c may be integrally formed, for example, through a 3D printing additive manufacturing process, or a vapor deposition process.

本實施例中雖然多孔性表面結構811的頂面與上方的正電極814接觸,但支撐柱816c為良導電的實心結構,而多孔性表面結構811因有孔隙存在,則電流大部分選擇性地流經支撐柱816c直至凸起結構與基底813,既保證了非多孔性底板812與基底813之間的焊接強度,也能一定程度減小多孔性表面結構811的表面的損傷。本實施例八中雖然仍然導致多孔性表面結構811的表面發生一定程度的損傷,但是因支撐柱816c的頂端始終低於多孔性表面結構811的表面,終究不影響連接結構應用到相應領域的基本功能。 In this embodiment, although the top surface of the porous surface structure 811 is in contact with the upper positive electrode 814, the support column 816c is a solid structure with good conductivity, and because the porous surface structure 811 has pores, most of the current is selectively Flowing through the support column 816c until the protruding structure and the base 813 not only ensures the welding strength between the non-porous bottom plate 812 and the base 813, but also reduces the surface damage of the porous surface structure 811 to a certain extent. In the eighth embodiment, although the surface of the porous surface structure 811 is still damaged to a certain extent, because the top of the support column 816c is always lower than the surface of the porous surface structure 811, it does not affect the basic application of the connection structure to the corresponding field. Function.

基於圖8b和圖8c的實施方式,在另外的一個示例中(未圖示),在原本高於多孔性表面結構811的表面的支撐柱上選擇一設定高度位置並將該位置的上方設計為孔隙結構,不再是圖8b中所示的表面齊平的支撐柱。此時,正電極與較高位置的頂部孔隙結構先接觸,支撐柱的頂部孔隙結構被壓並因接觸電阻生熱發生少量下沉,支撐柱下沉至支撐柱的上述設定位置,使得支撐柱與其旁邊的多孔結構基本齊平(最大下沉程度也只能下沉至設定位置,當下沉程度不大時,下沉位置高於設定位置)。這種情況下,既能完全避免多孔性表面結構與其上方的正電極接觸產生電阻熱導致其表面產生損傷,又不需要用於將支撐柱高出多孔性表面結構的多餘部分去除的額外加工製程。 Based on the implementation of Fig. 8b and Fig. 8c, in another example (not shown), a set height position is selected on the support column originally higher than the surface of the porous surface structure 811 and the position above is designed as The pore structure is no longer the surface-flush support pillars shown in Fig. 8b. At this time, the positive electrode first contacts with the top pore structure at a higher position, the top pore structure of the support column is pressed and a small amount of subsidence occurs due to the heat generated by the contact resistance, and the support column sinks to the above-mentioned set position of the support column, so that the support column It is basically flush with the porous structure next to it (the maximum sinking degree can only sink to the set position, and when the sinking degree is not large, the sinking position is higher than the set position). In this case, it is possible to completely avoid the contact between the porous surface structure and the positive electrode above it to cause resistance heat to cause damage to its surface, and it does not require additional processing for removing the excess part of the support column that is higher than the porous surface structure. .

實施例九: 對於上述的實施例六,多孔性表面結構811和基底813之間設置非多孔性底板812(或低孔隙率的多孔結構),以及非多孔性底板812的底面預製造出多個凸起結構,凸起結構與基底813的頂部相接觸,同時還在非多孔性底板812上靠近多孔性表面結構811的一側的表面設置多個良導電的實心結構的支撐柱816a,支撐柱816a介於非多孔性底板812和正電極814之間。 Embodiment nine: For the sixth embodiment above, a non-porous bottom plate 812 (or a porous structure with low porosity) is arranged between the porous surface structure 811 and the substrate 813, and a plurality of raised structures are prefabricated on the bottom surface of the non-porous bottom plate 812, The protruding structure is in contact with the top of the base 813, and at the same time, a plurality of solid structure support columns 816a with good conductivity are provided on the surface of the non-porous bottom plate 812 close to the porous surface structure 811. The support columns 816a are interposed between the non-porous between the porous bottom plate 812 and the positive electrode 814 .

與實施例六的主要區別在於,本實施例九中的多孔性表面結構911和基底913之間設置的非多孔性底板912a的底面並未製造出上述的凸起結構(如凸點),且也還在非多孔性底板912a上靠近多孔性表面結構911的一側的表面設置了多個良導電的支撐柱916a,支撐柱916a介於非多孔性底板912a和正電極914之間,如圖9a所示,非多孔性底板912a的底面與基底913幾乎是平面接觸。 The main difference from the sixth embodiment is that the bottom surface of the non-porous bottom plate 912a provided between the porous surface structure 911 and the substrate 913 in the ninth embodiment does not produce the above-mentioned raised structures (such as bumps), and A plurality of good conductive support pillars 916a are also provided on the surface of the non-porous bottom plate 912a near the side of the porous surface structure 911, and the support pillars 916a are interposed between the non-porous bottom plate 912a and the positive electrode 914, as shown in Figure 9a As shown, the bottom surface of the non-porous bottom plate 912a is in almost planar contact with the substrate 913 .

示例地,支撐柱916a位於多孔性表面結構911的內部,支撐柱916a的高度與多孔性表面結構911的頂面基本平齊,支撐柱916a的高度基本等於多孔性表面結構911的高度,同樣地,負電極915的頂部也與基底913的底部緊貼。 Exemplarily, the support column 916a is located inside the porous surface structure 911, the height of the support column 916a is substantially flush with the top surface of the porous surface structure 911, the height of the support column 916a is substantially equal to the height of the porous surface structure 911, and similarly , the top of the negative electrode 915 is also in close contact with the bottom of the substrate 913 .

示例地,非多孔性底板912a、多孔性表面結構911以及支撐柱916a是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Exemplarily, the non-porous bottom plate 912a, the porous surface structure 911 and the support column 916a are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process.

本實施例九中,多孔性表面結構911的表面雖然仍與其上方的正電極914存在部分接觸,但是支撐柱916a為良導電的實心結構,而多孔性表面結構911因有孔隙存在,則電極流出的大部分電流優先通過良導電的實心結構的支撐柱916a並經過非多孔性底板912a直至基底913,即使非多孔性底板912a的底端未設置凸起結構,但本實施例九已設置多個良導電柱狀的支撐柱916a,仍然有足夠的電流量和電阻熱量使得非多孔 性底板912a與基底913有足夠的焊接強度,也能一定程度減小多孔性表面結構911的表面的損傷。 In the ninth embodiment, although the surface of the porous surface structure 911 is still partially in contact with the positive electrode 914 above it, the support column 916a is a solid structure with good conductivity, and the porous surface structure 911 has pores, so the electrode flows out Most of the electric current preferentially passes through the support column 916a of solid structure with good conductivity and passes through the non-porous bottom plate 912a to the base 913. Good conductive columnar support column 916a still has enough current flow and resistance heat to make non-porous The permanent bottom plate 912a and the base 913 have sufficient welding strength, and can also reduce damage to the surface of the porous surface structure 911 to a certain extent.

實施例十:作為實施例九的一種變形,本實施例十的變形思路在於:如圖9b所示,本實施例十中除了實施例九中有關未設有凸起結構的非多孔性底板(或低孔隙率的多孔結構)的特徵以外,還為了完全避免多孔性表面結構911因接觸電阻生熱導致其表面損傷,特地將所有的支撐柱916b的頂端設置成高於多孔性表面結構的頂面,各個支撐柱916b的高度均高於其對應鄰近部分的多孔性表面結構。本示例中的正電極會與較高位處置的支撐柱916b先接觸,進而避免了正電極與較低位置的多孔性表面結構911進行接觸。另外,由於支撐柱916b的高度超出多孔性表面結構911,為了保證整體連接結構的基本功能,在焊接完成後,可以通過切削等製程將支撐柱916b高出多孔性表面結構911的這部分去除,保證表面平整。進一步地,如圖9b所示,正電極不僅可以是圖9a所示的連續式的大平面正電極,還可以是分段的多個正電極單體914b,每段正電極單體914b均壓在對應的支撐柱916b上端,且正電極單體914b並聯連接至一個大平面電極或直接連接至電源正極端。 Embodiment 10: As a modification of Embodiment 9, the idea of the modification of Embodiment 10 is: as shown in FIG. In addition to the characteristics of the porous structure with low porosity), in order to completely avoid the surface damage of the porous surface structure 911 due to the heat generated by the contact resistance, the tops of all the support columns 916b are specially set higher than the top of the porous surface structure. On the surface, the height of each support column 916b is higher than the porous surface structure of its corresponding adjacent part. In this example, the positive electrode will contact the support pillar 916 b disposed at a higher position first, thereby preventing the positive electrode from contacting the porous surface structure 911 at a lower position. In addition, since the height of the support column 916b exceeds the porous surface structure 911, in order to ensure the basic function of the overall connection structure, after the welding is completed, the part of the support column 916b higher than the porous surface structure 911 can be removed by cutting or other processes. Make sure the surface is flat. Further, as shown in FIG. 9b, the positive electrode can not only be the continuous large-planar positive electrode shown in FIG. 9a, but also can be a plurality of segmented positive electrode monomers 914b, and each positive electrode monomer 914b is equalized. At the upper end of the corresponding support column 916b, the positive electrode unit 914b is connected in parallel to a large planar electrode or directly connected to the positive terminal of the power supply.

實施例十一:與實施例一不同,本實施例十一中的正電極1014a並非採用大平面電極貼覆於多孔性表面結構1011上,而是將正電極1014a分成多個正電極單體001並將正電極單體001沿著豎向方向插入至多孔性表面結構1011內的空隙10a中,如圖10a所示,而且正電極單體001置於非多孔性底板1012a(或低孔隙率的多孔結構)頂端。示例地,多個所述正電極單體001並聯連接且都連接到一個大平面電極或直接連接至電源正極端,負電極1015連接在電源負極端。 Embodiment 11: Different from Embodiment 1, the positive electrode 1014a in this Embodiment 11 is not pasted on the porous surface structure 1011 with a large planar electrode, but the positive electrode 1014a is divided into multiple positive electrode units 001 And insert the positive electrode monomer 001 into the void 10a in the porous surface structure 1011 along the vertical direction, as shown in Figure 10a, and the positive electrode monomer 001 is placed on the non-porous bottom plate 1012a (or a porous structure) at the top. As an example, a plurality of positive electrode units 001 are connected in parallel and are all connected to a large planar electrode or directly connected to the positive terminal of the power supply, and the negative electrode 1015 is connected to the negative terminal of the power supply.

較佳地,多孔性表面結構1011與非多孔性底板1012a是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Preferably, the porous surface structure 1011 and the non-porous bottom plate 1012a are integrally formed, for example, by 3D printing additive manufacturing process or vapor deposition process.

如圖10a所示,多孔性表面結構1011內的空隙10a作為對應的正電極單體001的插入空間,空隙10a為預製的孔隙。本示例中的正電極1014a的底端與多孔性表面結構1011的頂端不接觸,避免多孔性表面結構1011的表面因電阻熱導致損傷。其中,空隙10a與正電極單體001側向配合,例如是間隙配合,即空隙10a需要保證在插入正電極單體001後還要與臨近部分的多孔性表面結構1011間隔開,避免該部分的多孔性表面結構1011產生電阻熱而受損。 As shown in FIG. 10a, the voids 10a in the porous surface structure 1011 serve as the insertion space for the corresponding positive electrode monomer 001, and the voids 10a are prefabricated pores. In this example, the bottom end of the positive electrode 1014 a is not in contact with the top end of the porous surface structure 1011 , so as to prevent the surface of the porous surface structure 1011 from being damaged by resistance heat. Among them, the gap 10a is laterally matched with the positive electrode monomer 001, for example, it is a gap fit, that is, the gap 10a needs to be separated from the porous surface structure 1011 of the adjacent part after the positive electrode monomer 001 is inserted, so as to avoid the gap of this part. The porous surface structure 1011 is damaged due to resistance heat.

上述實施例一中的非多孔性底板設置用以產生較大接觸電阻以及電阻熱量的凸起結構(如凸點),但是本實施例十一與之不同,本例中的非多孔性底板1012a的底部未設置凸起結構,但是由於正電極1014a本身與非多孔性底板1012a直接接觸,而且每個正電極單體001分別與電源連接,電流直接從正電極單體001流出並經過非多孔性底板1012a和基底1013(不經過多孔性表面結構1011),即仍然能保證足夠的電流量和電阻熱量,使得非多孔性底板1012a與基底1013有足夠的焊接強度。 The non-porous base plate in the above-mentioned embodiment 1 is provided with a raised structure (such as a bump) to generate larger contact resistance and heat resistance, but this embodiment 11 is different, the non-porous base plate 1012a in this example No protruding structure is provided at the bottom of , but because the positive electrode 1014a itself is in direct contact with the non-porous bottom plate 1012a, and each positive electrode unit 001 is connected to a power source, the current flows directly from the positive electrode unit 001 and passes through the non-porous The bottom plate 1012a and the substrate 1013 (without passing through the porous surface structure 1011 ) can still ensure sufficient current flow and resistance heat, so that the non-porous bottom plate 1012a and the substrate 1013 have sufficient welding strength.

實施例十二:作為實施例十一的一種變形,本實施例十二變形點在於:非多孔性底板1012b(或低孔隙率的多孔結構)頂面上設置複數個良導電的實心結構的支撐結構10b,支撐結構10b置於多孔性表面結構1011內部預留的孔隙中,如圖10b所示。所述支撐結構10b分別用於放置和支撐正電極1014a中的各個正電極單體001,正電極單體001位於支撐結構10b開設的凹槽內,並與凹槽相配合,保證所有的正電極單體001與對應的支撐結構10b之間良好地接觸。 Embodiment 12: As a modification of Embodiment 11, the modification point of Embodiment 12 is that a plurality of solid structures with good electrical conductivity are provided on the top surface of the non-porous bottom plate 1012b (or a porous structure with low porosity) The structure 10b, the supporting structure 10b is placed in the reserved pores inside the porous surface structure 1011, as shown in FIG. 10b. The support structure 10b is respectively used to place and support each positive electrode unit 001 in the positive electrode 1014a. The positive electrode unit 001 is located in the groove opened by the support structure 10b and cooperates with the groove to ensure that all the positive electrodes There is good contact between the cell 001 and the corresponding support structure 10b.

示例地,非多孔性底板1012b、多孔性表面結構1011以及支撐結構10b是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Exemplarily, the non-porous bottom plate 1012b, the porous surface structure 1011 and the support structure 10b are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process.

較佳地,支撐結構10b的頂端與多孔性表面結構1011的頂端基本平齊,支撐結構10b的高度基本等於多孔性表面結構1011的高度;或者,支撐結構10b的頂端低於多孔性表面結構1011的頂端;或者,支撐結構10b的頂端高於多孔性表面結構1011的頂端並借助後續的切削製程,使得最終的支撐結構10b的頂端與多孔性表面結構1011的頂端平齊;選擇何種高度設計方式,本發明對此不做限制。同樣地,本例中即使非多孔性底板1012b的底端並未設置凸起結構,但是由於正電極1014a通過良導電的實心結構的支撐結構10b與非多孔性底板1012b進行導電連接,而且每個正電極單體001分別與電源連接,電流直接從正電極單體001流出並經過非多孔性底板1012b和基底1013(不經過多孔性表面結構1011),即仍然能保證足夠的電流量和電阻熱量,使得非多孔性底板1012b與基底1013有足夠的焊接強度。 Preferably, the top of the support structure 10b is substantially flush with the top of the porous surface structure 1011, and the height of the support structure 10b is substantially equal to the height of the porous surface structure 1011; or, the top of the support structure 10b is lower than the porous surface structure 1011 Or, the top of the support structure 10b is higher than the top of the porous surface structure 1011 and by subsequent cutting process, the top of the final support structure 10b is flush with the top of the porous surface structure 1011; choose which height design way, the present invention is not limited to this. Similarly, even though the bottom end of the non-porous bottom plate 1012b is not provided with a raised structure in this example, since the positive electrode 1014a is conductively connected to the non-porous bottom plate 1012b through the support structure 10b of a solid structure with good conductivity, and each The positive electrode monomer 001 is connected to the power supply respectively, and the current flows directly from the positive electrode monomer 001 and passes through the non-porous bottom plate 1012b and the substrate 1013 (without passing through the porous surface structure 1011), that is, sufficient current flow and resistance heat can still be guaranteed , so that the non-porous bottom plate 1012b and the base 1013 have sufficient welding strength.

實施例十三:與實施例八不同,本實施例十三中的多孔性表面結構1111與基底1113之間並未設置非多孔性底板,改進之處在於:多孔性表面結構1111至少部分區域的底部連接有良導電的實心結構的凸起結構1112a(如凸點),凸起結構1112a與基底1113的頂部接觸,如圖11a所示,同時,多孔性表面結構1111內的任意位置處可設置實心結構且良導電的支撐柱1116a。 Embodiment 13: Different from Embodiment 8, there is no non-porous bottom plate between the porous surface structure 1111 and the substrate 1113 in this embodiment 13. The improvement is that: at least part of the porous surface structure 1111 A protruding structure 1112a (such as a bump) with a solid structure of good conductivity is connected to the bottom, and the protruding structure 1112a is in contact with the top of the substrate 1113, as shown in Figure 11a. At the same time, any position in the porous surface structure 1111 can be set The support column 1116a has a solid structure and good electrical conductivity.

本例中的支撐柱1116a與凸起結構1112a可以錯位分佈,如圖11a所示。 In this example, the support columns 1116a and the protruding structures 1112a may be distributed in a misaligned manner, as shown in FIG. 11a.

示例地,多孔性表面結構1111、凸起結構1112a、支撐柱1116a是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Exemplarily, the porous surface structure 1111, the protruding structure 1112a, and the support column 1116a are integrally formed structures, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.

較佳地,支撐柱1116a隱藏於多孔性表面結構1111的內部,支撐柱1116a的頂端低於多孔性表面結構1111的頂端,支撐柱1116a的底端高於多孔性表面結構1111的底端。 Preferably, the support column 1116a is hidden inside the porous surface structure 1111 , the top of the support column 1116a is lower than the top of the porous surface structure 1111 , and the bottom of the support column 1116a is higher than the bottom of the porous surface structure 1111 .

本示例中既可以利用支撐柱1116a的限位作用來避免多孔性表面結構1111被過度壓縮,因為正電極1114會與其下方的多孔性表面結構1111的頂面先接觸,進而多孔性表面結構1111的表面因接觸電阻生熱導致損傷而發生少量下沉,直至下沉至支撐柱1116a的頂端為止(最大下沉程度也只能下沉至頂端位置,甚至下沉程度不大時,下沉位置高於頂端位置),因為支撐柱1116a為實心結構,支撐柱1116a起到限位作用,保證最終的多孔性表面結構1111的表面的高度達至支撐柱1116a所在的高度位置;同時,還可利用支撐柱1116a的良導電的實心結構,使得電流大多優選選擇經過支撐柱1116a,再經過該支撐柱1116a附近部分的多孔性表面結構1111後到達凸起結構1112a,則可以改善多孔性表面結構1111的表面因接觸電阻生熱造成的損傷問題;再者,本例中進一步利用凸起結構1112a的凸點來增加與基底1113的接觸電阻,用以產生足夠的電阻熱量,使得凸起結構1112a與基底1113有足夠的焊接強度。 In this example, the limiting effect of the supporting pillars 1116a can be used to avoid excessive compression of the porous surface structure 1111, because the positive electrode 1114 will first contact the top surface of the porous surface structure 1111 below it, and then the porous surface structure 1111 The surface sinks slightly due to damage caused by contact resistance heat generation, until it sinks to the top of the support column 1116a (the maximum sinking degree can only sink to the top position, and even when the sinking degree is not large, the sinking position is high at the top position), because the support column 1116a is a solid structure, the support column 1116a acts as a limiter to ensure that the height of the surface of the final porous surface structure 1111 reaches the height position of the support column 1116a; at the same time, the support column 1116a can also be used to The good conductive solid structure of the pillar 1116a makes the current preferably pass through the supporting pillar 1116a, and then pass through the porous surface structure 1111 in the vicinity of the supporting pillar 1116a and then reach the raised structure 1112a, which can improve the surface of the porous surface structure 1111. The problem of damage caused by heat generated by contact resistance; moreover, in this example, the bumps of the raised structure 1112a are further used to increase the contact resistance with the substrate 1113, so as to generate enough resistance heat to make the raised structure 1112a contact with the substrate 1113 There is sufficient welding strength.

實施例十四:上述實施例十三描述了支撐柱1116a與凸起結構1112a是錯位分佈,那麼作為實施例十三的一種變形,本實施例十四將凸起結構1112b與其上方的支撐柱1116b設計成正對配合,兩者至少部分重合(如一部分重合或完全重合),如圖11b所示。 Embodiment 14: The above embodiment 13 describes that the support column 1116a and the protruding structure 1112a are dislocated, so as a modification of the embodiment 13, this embodiment 14 combines the protruding structure 1112b and the support column 1116b above it It is designed to be positively matched, and the two are at least partially overlapped (such as partially overlapped or completely overlapped), as shown in Figure 11b.

示例地,多孔性表面結構1111、凸起結構1112b、支撐柱1116b是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Exemplarily, the porous surface structure 1111 , the protruding structure 1112 b , and the support pillar 1116 b are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process.

本實施例十四中,支撐柱1116b隱藏於多孔性表面結構1111內部,支撐柱1116b的頂端低於多孔性表面結構1111的頂端,支撐柱1116b的高度 低於多孔性表面結構1111的高度。所述凸起結構1112b與基底1113的頂部接觸。 In the fourteenth embodiment, the support column 1116b is hidden inside the porous surface structure 1111, the top of the support column 1116b is lower than the top of the porous surface structure 1111, and the height of the support column 1116b Below the height of the porous surface structure 1111. The protruding structure 1112b is in contact with the top of the substrate 1113 .

本例中同樣既可以利用支撐柱1116b來避免多孔性表面結構1111過渡壓縮,因為正電極1114首先會與其下方的多孔性表面結構1111的表面接觸,進而多孔性表面結構1111的表面因接觸電阻生熱導致損傷而導致少量下沉,直至下沉至支撐柱1116b的頂端為止(最大下沉程度也只能下沉至頂端位置,甚至下沉程度不大時,下沉位置高於頂端位置),因為支撐柱1116b為良導電的實心結構,支撐柱1116b起到限位作用,保證最終的多孔性表面結構1111的表面的高度達至支撐柱1116b所在的高度位置;同時,還可利用支撐柱1116b實心的良導電結構,電流大多優選選擇經過支撐柱1116b,可以改善多孔性表面結構1111的頂面因接觸電阻生熱造成損傷的問題;再者,本例中還可利用凸起結構1112b來增加基底1113的接觸電阻,用以產生足夠的電阻熱量,使得凸起結構1112b與基底1113有足夠的焊接強度。值得說明的是,本實施例十四的焊接效率比實施例十三較好,因為凸起結構1112b與支撐柱1116b正對配合,電流流經支撐柱1116b後直接通過凸起結構1112b,而實施例十三中電流流經支撐柱1116a後還需經過多孔性表面結構1111中的孔隙結構後再流經凸起結構1112a。 In this example, the support pillars 1116b can also be used to avoid excessive compression of the porous surface structure 1111, because the positive electrode 1114 will first contact the surface of the porous surface structure 1111 below it, and then the surface of the porous surface structure 1111 will be generated due to contact resistance. Heat causes damage and causes a small amount of sinking until it sinks to the top of the support column 1116b (the maximum sinking degree can only sink to the top position, even when the sinking degree is not large, the sinking position is higher than the top position), Because the support column 1116b is a solid structure with good electrical conductivity, the support column 1116b acts as a limiter to ensure that the height of the surface of the final porous surface structure 1111 reaches the height of the support column 1116b; at the same time, the support column 1116b can also be used For a solid good conductive structure, most of the current is preferably selected to pass through the supporting pillars 1116b, which can improve the problem of damage to the top surface of the porous surface structure 1111 due to heat generated by contact resistance; moreover, in this example, the raised structure 1112b can also be used to increase The contact resistance of the base 1113 is used to generate sufficient resistance heat so that the protruding structure 1112b and the base 1113 have sufficient welding strength. It is worth noting that the welding efficiency of the fourteenth embodiment is better than that of the thirteenth embodiment, because the raised structure 1112b and the support column 1116b are in direct contact with each other, and the current flows through the support column 1116b and then directly passes through the raised structure 1112b to implement In Example 13, after the current flows through the supporting pillars 1116a, it needs to pass through the pore structure in the porous surface structure 1111 and then flow through the protruding structure 1112a.

作為本實施例十四的一種變形,該變形思路在於:將上述支撐柱的高度低於多孔性表面結構改成:支撐柱1116c位於多孔性表面結構111的內部且支撐柱1116c的頂端基本與多孔性表面結構1111的頂端平齊,支撐柱1116c的高度與多孔性表面結構1111的高度基本相等,此時,凸起結構1112c也與其上方的支撐柱1116c正對配合,兩者至少部分重合(如一部分重合或完全重合),如圖11c所示。 As a modification of the fourteenth embodiment, the idea of this modification is to change the height of the support column below the porous surface structure into: the support column 1116c is located inside the porous surface structure 111 and the top of the support column 1116c is basically in line with the porous surface structure. The top of the porous surface structure 1111 is flush, and the height of the support column 1116c is substantially equal to the height of the porous surface structure 1111. At this time, the raised structure 1112c is also facing the support column 1116c above it, and the two are at least partially overlapped (such as partially coincident or completely coincident), as shown in Figure 11c.

示例地,多孔性表面結構1111、凸起結構1112c、支撐柱1116c是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實 現。該變形的實施方式中的其他內容可參照上述實施例六和上述實施例十四,在此不做贅述。 Exemplarily, the porous surface structure 1111, the protruding structure 1112c, and the support column 1116c are integrally formed structures, for example, through a 3D printing additive manufacturing process, or a vapor deposition process, etc. now. For other content in the modified implementation manner, reference may be made to the above-mentioned sixth embodiment and the above-mentioned embodiment 14, and details are not repeated here.

同理,作為本實施例十四的另一種變形,該變形思路在於:將上述記載的支撐柱的高度低於多孔性表面結構改成:將所有的支撐柱1116d的頂面設置成高於多孔性表面結構1111的頂面,如圖11d所示,各個支撐柱1116d的高度均高於其對應鄰近部分的多孔性表面結構1111的高度。此時,凸起結構1112d也與其上方的支撐柱1116d正對配合,兩者至少部分重合(如一部分重合或完全重合),如圖11d所示。示例地,多孔性表面結構1111、凸起結構1112d、支撐柱1116d是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。該變形的實施方式中的其他內容可參照上述實施例七和上述實施例十四,在此不做贅述。 Similarly, as another modification of the fourteenth embodiment, the idea of this modification is to change the above-mentioned support column height lower than the porous surface structure to: set the top surfaces of all support columns 1116d higher than the porous surface structure. On the top surface of the porous surface structure 1111, as shown in FIG. 11d, the height of each support column 1116d is higher than that of the corresponding adjacent portion of the porous surface structure 1111. At this time, the protruding structure 1112d is also in direct contact with the support column 1116d above it, and the two are at least partially overlapped (such as partially overlapped or completely overlapped), as shown in FIG. 11d. Exemplarily, the porous surface structure 1111, the protruding structure 1112d, and the support column 1116d are integrally formed structures, such as realized by 3D printing additive manufacturing process or vapor deposition process. For other content in this modified implementation manner, reference may be made to the foregoing seventh embodiment and the foregoing fourteenth embodiment, and details are not repeated here.

實施例十五:如圖12所示,本實施例十五在實施例一的基礎上,進一步地在非多孔性底板1212(或低孔隙率的多孔結構)和正電極1214之間設置複數個限位用的支撐柱1216,支撐柱1216置於非多孔性底板1212上的靠近多孔性表面結構1211的一側的表面。較佳地,支撐柱1216的頂面低於對應部分的多孔性表面結構1211的頂面,支撐柱1216的高度低於多孔性表面結構1211的高度,支撐柱1216隱藏在多孔性表面結構1211的內部。同樣地,本實施例十五中的非多孔性底板1212的底端預製造出多個凸起結構12a,凸起結構12a與基底1213的頂部相接觸。 Embodiment 15: As shown in FIG. 12 , on the basis of Embodiment 1, this Embodiment 15 further sets a plurality of limiting electrodes between the non-porous bottom plate 1212 (or a porous structure with low porosity) and the positive electrode 1214. The supporting column 1216 is used for positioning, and the supporting column 1216 is placed on the surface of the non-porous bottom plate 1212 close to the side of the porous surface structure 1211 . Preferably, the top surface of the support column 1216 is lower than the top surface of the corresponding part of the porous surface structure 1211, the height of the support column 1216 is lower than the height of the porous surface structure 1211, and the support column 1216 is hidden in the porous surface structure 1211. internal. Likewise, a plurality of protruding structures 12 a are prefabricated at the bottom of the non-porous bottom plate 1212 in the fifteenth embodiment, and the protruding structures 12 a are in contact with the top of the substrate 1213 .

本實施例十五中,正電極1214首先會與其下方的較高位置的多孔性表面結構1211的表面接觸,進而多孔性表面結構1211的表面因接觸電阻生熱導致損傷而發生下沉,直至下沉至支撐柱1216的頂端位置為止(最大下沉程度也只能下沉至頂端位置,甚至下沉程度不大時,下沉位置高於頂端位置),因為支撐柱1216為實心結構,支撐柱1216起到限位 作用,保證最終的多孔性表面結構1211的表面的高度達至支撐柱1216所在的高度位置,避免多孔性表面結構1211被過多壓縮。 In the fifteenth embodiment, the positive electrode 1214 first contacts the surface of the porous surface structure 1211 at a higher position below it, and then the surface of the porous surface structure 1211 sinks due to damage caused by contact resistance heat generation, until the lower surface Sink until the top position of the support column 1216 (the maximum sinking degree can only sink to the top position, even when the sinking degree is not large, the sinking position is higher than the top position), because the support column 1216 is a solid structure, the support column 1216 reaches the limit function, to ensure that the height of the final surface of the porous surface structure 1211 reaches the height position of the support column 1216, so as to avoid excessive compression of the porous surface structure 1211.

示例地,支撐柱1216可以與其下方對應的各凸起結構12a正對分佈或者錯開分佈;同時,本實施例中的支撐柱1216的材質是否為導電材料或不導電材料,本發明對此均不做限制,只要最終能滿足支撐柱1216的限位作用,避免多孔性表面結構1211被過多壓縮即可。其中,當支撐柱1216為導電材料時,電流大多優選選擇經過支撐柱1216,再經過該支撐柱1216附近部分的多孔性表面結構1211後到達對應的凸起結構12a,這樣可以改善多孔性表面結構1211的表面因接觸電阻生熱造成的損傷問題。當支撐柱1216為非導電材料時,電流從正電極1214到達多孔性表面結構1211直至凸起結構12a。本實施例的上述情況,雖然仍然導致多孔性表面結構1211的表面一定程度的損傷,但是由於支撐柱1216始終低於多孔性表面結構1211表面,終究不會影響整個連接結構應用到相關領域的基本功能。 For example, the supporting pillars 1216 can be distributed directly opposite to or staggered from the corresponding protruding structures 12a below them; at the same time, whether the material of the supporting pillars 1216 in this embodiment is a conductive material or a non-conductive material is irrelevant to the present invention. As long as the limiting effect of the supporting pillars 1216 can be satisfied in the end, the porous surface structure 1211 can be prevented from being too compressed. Wherein, when the supporting pillar 1216 is a conductive material, most of the current is preferably selected to pass through the supporting pillar 1216, and then pass through the porous surface structure 1211 near the supporting pillar 1216 to reach the corresponding raised structure 12a, which can improve the porous surface structure The surface of 1211 is damaged due to heat generated by contact resistance. When the support pillar 1216 is a non-conductive material, the current flows from the positive electrode 1214 to the porous surface structure 1211 to the protruding structure 12a. Although the above situation of this embodiment still causes damage to the surface of the porous surface structure 1211 to a certain extent, since the support column 1216 is always lower than the surface of the porous surface structure 1211, it will not affect the basic application of the entire connection structure to related fields. Function.

實施例十六:本發明的多孔性表面結構和基底通過電阻焊(例如凸焊)結合起來,當被焊工件的面積過大時,就需要更多數量的凸起結構。當凸起結構確定後,為了保證每個凸起結構與基底之間的焊接強度時,需要增大電極的總電流,可能導致電源設備成本增加、電極損傷以及多孔性表面結構的表面損傷增大,此時可以採用分區域、分批次對被焊工件進行焊接。 Embodiment 16: The porous surface structure of the present invention is combined with the substrate by resistance welding (such as projection welding). When the area of the workpiece to be welded is too large, more convex structures are required. After the protrusion structure is determined, in order to ensure the welding strength between each protrusion structure and the substrate, it is necessary to increase the total current of the electrode, which may lead to an increase in the cost of power supply equipment, electrode damage, and increased surface damage of the porous surface structure. , at this time, the workpieces to be welded can be welded in different areas and in batches.

本實施例十六中,將多孔性表面結構1311分區域並與基底1313分批次地進行電阻焊接,如圖13所示,第一區域對應的多孔性表面結構1311-1的上方連接有第一正電極1314-1,第二區域對應的多孔性表面結構1311-2的上方連接有第二正電極1314-2。負電極1315的頂部與基底1313的底部緊貼,多孔性表面結構1311和基底1313之間設置非多孔性底板 1312(或低孔隙率的多孔結構),以及非多孔性底板1312的底面預製造出多個凸起結構,凸起結構與基底1313的頂部相接觸。 In the sixteenth embodiment, the porous surface structure 1311 is divided into regions and subjected to resistance welding with the substrate 1313 in batches. As shown in FIG. 13 , the porous surface structure 1311-1 corresponding to the first region is connected with a A positive electrode 1314-1, and a second positive electrode 1314-2 connected above the porous surface structure 1311-2 corresponding to the second region. The top of the negative electrode 1315 is in close contact with the bottom of the substrate 1313, and a non-porous bottom plate is set between the porous surface structure 1311 and the substrate 1313 1312 (or a porous structure with low porosity), and the bottom surface of the non-porous bottom plate 1312 is prefabricated with a plurality of raised structures, and the raised structures are in contact with the top of the substrate 1313 .

本實施例是將多孔性表面結構1311採用分區域的電阻焊接,但在分區焊接時各個區域對應的正電極可能出現無法完全覆蓋對應的多孔性表面結構的情況,例如任意被劃分的相兩鄰區域相靠近一側的邊緣無法被完全覆蓋,此時各區域的邊緣相比於被覆蓋的其他部分的位置可能略微偏高(即凸邊),則影響多孔性表面結構1311的表面平整度,甚至會影響連接結構應用到相關領域的基本功能(如骨長入)。 In this embodiment, the porous surface structure 1311 is welded by subregional resistance, but the positive electrode corresponding to each region may not completely cover the corresponding porous surface structure during subregional welding, for example, any divided adjacent The edges of the adjacent sides of the regions cannot be completely covered. At this time, the positions of the edges of each region may be slightly higher than the other parts covered (that is, convex edges), which will affect the surface flatness of the porous surface structure 1311. It may even affect the basic function of connecting structures applied to related fields (such as bone ingrowth).

為了克服上述缺陷,本實施例十六的多孔性表面結構1311設置凹槽13a,將多孔性表面結構1311的頂部劃分成了多個區域,例如圖中第一區域的多孔性表面結構1311-1和第二區域的多孔性表面結構1311-2。凹槽13a為長條狀,第一區域的多孔性表面結構1311-1和第二區域的多孔性表面結構1311-2分別位於長條狀的凹槽13a的兩側。凹槽13a的頂端低於多孔性表面結構1311的頂端。凹槽13a的高度小於多孔性表面結構1311的高度。 In order to overcome the above defects, the porous surface structure 1311 of the sixteenth embodiment is provided with a groove 13a, which divides the top of the porous surface structure 1311 into multiple regions, such as the porous surface structure 1311-1 in the first region in the figure and the porous surface structure 1311-2 in the second region. The groove 13a is in the shape of a strip, and the porous surface structure 1311-1 in the first region and the porous surface structure 1311-2 in the second region are respectively located on both sides of the strip-shaped groove 13a. The top of the groove 13 a is lower than the top of the porous surface structure 1311 . The height of the groove 13 a is smaller than the height of the porous surface structure 1311 .

示例地,非多孔性底板1312的主體、凹槽13a、多孔性表面結構1311是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。所述凹槽13a也可以通過機加工形成。 Exemplarily, the main body of the non-porous bottom plate 1312, the groove 13a, and the porous surface structure 1311 are integrally formed, for example, through a 3D printing additive manufacturing process, or a vapor deposition process. The groove 13a may also be formed by machining.

圖13所示表明了第一正電極1314-1和第二正電極1314-2之間存在間隙,此時第一正電極1314-1和第二正電極1314-2可以分先後次序,則圖13僅代表位置示意,或者第一正電極1314-1和第二正電極1314-2不分先後次序,可以同時壓在對應區域的多孔性表面結構上;而且劃分的各個區域所對應的正電極的覆蓋面積均大於對應區域的多孔性表面結構1311-1表面面積。 Figure 13 shows that there is a gap between the first positive electrode 1314-1 and the second positive electrode 1314-2, at this time the first positive electrode 1314-1 and the second positive electrode 1314-2 can be in sequence, then the figure 13 only represents the location, or the first positive electrode 1314-1 and the second positive electrode 1314-2 can be pressed on the porous surface structure of the corresponding area at the same time, regardless of the order; and the positive electrodes corresponding to the divided areas The coverage area of each is larger than the surface area of the porous surface structure 1311-1 in the corresponding area.

由於本實施例設計了凹槽13a,凹槽13a靠近第一正電極1314-1的一側記作為第一側,凹槽13a靠近第二正電極1314-2的另一側記作為第二側。 Since the groove 13a is designed in this embodiment, the side of the groove 13a close to the first positive electrode 1314-1 is marked as the first side, and the other side of the groove 13a close to the second positive electrode 1314-2 is marked as the second side.

本實施例中,第一區域的多孔性表面結構1311-1先通過電阻焊與基底1313完成連接:第一正電極1314-1的底面覆蓋對應區域的多孔性表面結構1311-1,並且,第一正電極1314-1超出連接區域的部分不超過凹槽13a的第二側的邊緣,第一正電極1314-1和第一區域的多孔性表面結構1311-1之間因接觸電阻生熱導致第一區域的多孔性表面結構1311-1表面雖有少量下沉但不會形成凸邊;然後繼續開始第二區域的多孔性表面結構1311-2與基底1313完成電阻焊接:第二正電極1314-2覆蓋對應區域的多孔性表面結構1311-2的表面接觸,並且,第二正電極1314-2超出連接區域的部分不超出第一正電極1314-1的靠近第二正電極1314-2的一側邊緣,第二正電極1314-2和第二區域的多孔性表面結構1311-2之間因接觸電阻生熱導致第二區域的多孔性表面結構1311-2的表面雖有少量下沉但不會形成凸邊。當第一正電極1314-1和第二正電極1314-2分先後次序時,第一正電極1314-1和第二正電極1314-2可以是同一電極。 In this embodiment, the porous surface structure 1311-1 in the first region is first connected to the substrate 1313 by resistance welding: the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 in the corresponding region, and the second The portion of a positive electrode 1314-1 beyond the connection area does not exceed the edge of the second side of the groove 13a, and the contact resistance between the first positive electrode 1314-1 and the porous surface structure 1311-1 in the first area is caused by heat generation. Although the surface of the porous surface structure 1311-1 in the first region has a small amount of subsidence, no convex edges are formed; then continue to start the resistance welding between the porous surface structure 1311-2 in the second region and the substrate 1313: the second positive electrode 1314 -2 The surface of the porous surface structure 1311-2 covering the corresponding area is in contact, and the part of the second positive electrode 1314-2 beyond the connection area does not exceed the part of the first positive electrode 1314-1 close to the second positive electrode 1314-2 On one edge, the surface of the porous surface structure 1311-2 in the second region sinks slightly due to heat generated by contact resistance between the second positive electrode 1314-2 and the porous surface structure 1311-2 in the second region. No knurling will be formed. When the first positive electrode 1314-1 and the second positive electrode 1314-2 are in sequence, the first positive electrode 1314-1 and the second positive electrode 1314-2 may be the same electrode.

或者,第一正電極1314-1和第二正電極1314-2不分先後次序,同時壓在對應區域的多孔性表面結構1311上,則第一區域的多孔性表面結構1311-1和第二區域的多孔性表面結構1311-2同時與基底1313完成電阻焊接,其中,第一正電極1314-1的底面覆蓋對應區域的多孔性表面結構1311-1,並且第一正電極1314-1超出連接區域的部分不超過凹槽13a的第二側的邊緣;以及,第二正電極1314-2覆蓋對應區域的多孔性表面結構1311-2的表面接觸,並且第二正電極1314-2超出連接區域的部分不超出凹槽13a的第一側的邊緣。 Or, the first positive electrode 1314-1 and the second positive electrode 1314-2 are pressed on the porous surface structure 1311 in the corresponding area at the same time, regardless of the sequence, then the porous surface structure 1311-1 in the first area and the second positive electrode 1311-1 At the same time, the porous surface structure 1311-2 of the region completes resistance welding with the substrate 1313, wherein the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 of the corresponding region, and the first positive electrode 1314-1 exceeds the connection The portion of the region does not exceed the edge of the second side of the groove 13a; and, the second positive electrode 1314-2 covers the surface contact of the porous surface structure 1311-2 of the corresponding region, and the second positive electrode 1314-2 extends beyond the connection region The portion does not exceed the edge of the first side of the groove 13a.

這種方法解決了分區域焊接導致的邊緣凸邊的問題。製程過程需要控制多孔性表面結構下沉的位置比凹槽13a的頂端高。 This method solves the problem of edge convex caused by regional welding. The manufacturing process needs to control the sinking position of the porous surface structure to be higher than the top of the groove 13a.

作為本實施例十六的一種變形,如下:如圖14所示,第一區域對應的多孔性表面結構1411-1的上方連接有第一正電極1414-1,第二區域對應的多孔性表面結構1411-2的上方連接有第二正電極1414-2。負電極1415的頂部與基底1413的底部緊貼,多孔性表面結構1411和基底1413之間設置非多孔性底板1412(或低孔隙率的多孔結構),以及非多孔性底板1412的底面預製造出多個凸起結構,凸起結構與基底1413頂部相接觸。 As a modification of the sixteenth embodiment, it is as follows: as shown in Figure 14, the first positive electrode 1414-1 is connected above the porous surface structure 1411-1 corresponding to the first region, and the porous surface structure 1414-1 corresponding to the second region A second positive electrode 1414-2 is connected above the structure 1411-2. The top of the negative electrode 1415 is in close contact with the bottom of the substrate 1413, a non-porous bottom plate 1412 (or a porous structure with low porosity) is set between the porous surface structure 1411 and the substrate 1413, and the bottom surface of the non-porous bottom plate 1412 is prefabricated A plurality of protruding structures, the protruding structures are in contact with the top of the base 1413 .

多孔性表面結構1411設置凹槽14a,將多孔性表面結構1411的頂部劃分成了多個區域,例如圖中第一區域的多孔性表面結構1411-1和第二區域的多孔性表面結構1411-2。凹槽14a為長條狀,第一區域的多孔性表面結構1411-1和第二區域的多孔性表面結構1411-2分別位於長條狀的凹槽14a的兩側。凹槽14a頂端低於多孔性表面結構1411的頂端。凹槽14a的高度小於多孔性表面結構1411的高度。由於本實施例設計了凹槽14a,凹槽14a靠近第一正電極1414-1的一側記作為第一側,凹槽14a靠近第二正電極1414-2的另一側記作為第二側。 The porous surface structure 1411 is provided with a groove 14a, which divides the top of the porous surface structure 1411 into multiple regions, such as the porous surface structure 1411-1 in the first region and the porous surface structure 1411- in the second region in the figure. 2. The groove 14a is strip-shaped, and the porous surface structure 1411-1 in the first region and the porous surface structure 1411-2 in the second region are located on both sides of the strip-shaped groove 14a. The top of the groove 14a is lower than the top of the porous surface structure 1411 . The height of the groove 14a is smaller than the height of the porous surface structure 1411 . Since the groove 14a is designed in this embodiment, the side of the groove 14a close to the first positive electrode 1414-1 is marked as the first side, and the other side of the groove 14a close to the second positive electrode 1414-2 is marked as the second side.

如圖14所示,第一正電極1414-1和第二正電極1414-2之間有重合部分(第一正電極1414-1和第二正電極1414-2分先後次序,圖14僅代表位置示意)。 As shown in Figure 14, there is overlap between the first positive electrode 1414-1 and the second positive electrode 1414-2 (the first positive electrode 1414-1 and the second positive electrode 1414-2 are in sequence, Figure 14 only represents position indication).

第一正電極1414-1與第一區域的多孔性表面結構1411-1接觸,並且第一正電極1414-1超出部分的凹槽14a(即第一正電極1414-1跨過凹槽14a的第一側但不超出凹槽14a的第二側),並與部分的第二區域的多孔性表面結構1411-2進一步接觸,焊接過程完成後,第二區域的多孔性表面結構1411-2的表面有少量下沉且第二區域的多孔性表面結構1411-2邊緣的表面會有壓痕凸邊;然後第二正電極1414-2與第二區域的多孔性表面結構1411-2接觸,並且第二正電極1414-2跨過剩餘部分的凹槽14a或跨過整個凹槽14a,第二正電極1414-2超出上述壓痕凸邊,保證 第二正電極1414-2壓到上述多孔性表面結構1411-2可能產生的壓痕凸邊,使得上述壓痕凸邊被壓平。 The first positive electrode 1414-1 is in contact with the porous surface structure 1411-1 of the first region, and the first positive electrode 1414-1 exceeds the part of the groove 14a (that is, the first positive electrode 1414-1 straddles the groove 14a The first side but not beyond the second side of the groove 14a), and further contact with the porous surface structure 1411-2 of the second region of the part, after the welding process is completed, the porous surface structure 1411-2 of the second region There is a small amount of subsidence on the surface and the surface at the edge of the porous surface structure 1411-2 in the second region has an indentation convex edge; then the second positive electrode 1414-2 is in contact with the porous surface structure 1411-2 in the second region, and The second positive electrode 1414-2 spans the rest of the groove 14a or across the entire groove 14a, and the second positive electrode 1414-2 exceeds the above-mentioned indentation bead, ensuring The second positive electrode 1414-2 is pressed to the indentation bead that may be produced by the porous surface structure 1411-2, so that the indentation bead is flattened.

或者,第一正電極1414-1與第一區域的多孔性表面結構1411-1接觸,並且第一正電極1414-1未超出凹槽14a的第一側,焊接過程完成後,第一區域的多孔性表面結構1411-1的表面有少量下沉且表面會有壓痕凸邊,然後第二正電極1414-2與第二區域的多孔性表面結構1411-2接觸,第二正電極1414-2跨過整個凹槽14a,而且第二正電極1414-2超出多孔性表面結構1411-1的表面產生的壓痕凸邊,保證第二正電極1414-2壓到多孔性表面結構1411-1的表面產生的壓痕凸邊,使得壓痕凸邊被壓平。製程過程需要控制多孔性表面結構1411的下沉的位置比凹槽14a的頂端高或者基本齊平。 Alternatively, the first positive electrode 1414-1 is in contact with the porous surface structure 1411-1 of the first region, and the first positive electrode 1414-1 does not exceed the first side of the groove 14a. After the welding process is completed, the first region of the The surface of the porous surface structure 1411-1 has a small amount of subsidence and the surface has indentations and convex edges, and then the second positive electrode 1414-2 is in contact with the porous surface structure 1411-2 in the second region, and the second positive electrode 1414- 2 across the entire groove 14a, and the second positive electrode 1414-2 exceeds the indentation convex edge produced on the surface of the porous surface structure 1411-1, ensuring that the second positive electrode 1414-2 is pressed to the porous surface structure 1411-1 The indentation convex edge produced on the surface of the surface makes the indentation convex edge be flattened. The manufacturing process needs to control the sinking position of the porous surface structure 1411 to be higher than or substantially flush with the top of the groove 14a.

實施例十七:與實施例十六的相同點在於,本實施例十七依然採用分區域的電阻焊接;但是與實施例十六的區別在於,同樣為了解決分區域焊接導致的壓痕凸邊的問題,本實施例十七(未圖示)的多孔性表面結構不採用凹槽設計。本示例中,當相鄰兩個分區域的多孔性表面結構按照先後順序依次進行電阻焊,由於第一正電極的覆蓋面積小於對應區域的面積時,第一次分區電阻焊後第一區域的邊緣出現凸起(這裡的凸起是一種高度的相對位置關係,指未發生凹陷的邊緣部分相對於其他發生凹陷的部分較高),此時需要保證下一次進行電阻焊的第二正電極能覆蓋住原先發生凸起的第一區域中的邊緣部分,這樣利用第二次電阻焊過程中該凸起的邊緣部分的多孔性表面結構會發生凹陷,從而避免了分區域焊接導致的邊緣壓痕凸邊的問題。 Embodiment 17: The same point as Embodiment 16 is that this Embodiment 17 still adopts resistance welding in sub-regions; but the difference from Embodiment 16 is that it also solves the indentation convex edge caused by sub-regional welding For the problem, the porous surface structure of the seventeenth embodiment (not shown) does not adopt the groove design. In this example, when the porous surface structures of two adjacent subregions are resistance welded sequentially, since the coverage area of the first positive electrode is smaller than the area of the corresponding region, the first region after the first subregional resistance welding Bulge appears on the edge (the bulge here is a relative positional relationship of height, which means that the edge part without depression is higher than other parts with depression), at this time, it is necessary to ensure that the second positive electrode for the next resistance welding can Covering the edge part in the first area where the protrusion originally occurred, so that the porous surface structure of the raised edge part will be depressed during the second resistance welding process, thereby avoiding edge indentation caused by regional welding convex edge problem.

實施例十八:如圖15所示,本實施例十八的非多孔性底板1512頂端設置限位元結構15a,限位元結構15a為長條狀,可作為區域劃分的基準,所述限位元 結構15a設置在任意兩鄰近區域的相鄰側的邊緣處。限位元結構15a的頂端低於多孔性表面結構1511的頂端,限位元結構15a的高度小於多孔性表面結構1511的高度。示例地,非多孔性底板1512的主體、限位元結構15a、多孔性表面結構1511是一體成型的結構,例如通過3D列印增材製造製程、或氣相沉澱製程等實現。 Embodiment 18: As shown in FIG. 15 , the top of the non-porous bottom plate 1512 of this embodiment 18 is provided with a limiter structure 15a, and the limiter structure 15a is strip-shaped, which can be used as a benchmark for area division. bits The structures 15a are arranged at the edges of adjacent sides of any two adjacent regions. The top of the spacer structure 15 a is lower than the top of the porous surface structure 1511 , and the height of the spacer structure 15 a is smaller than the height of the porous surface structure 1511 . Exemplarily, the main body of the non-porous bottom plate 1512, the spacer structure 15a, and the porous surface structure 1511 are integrally formed, for example, through a 3D printing additive manufacturing process, or a vapor deposition process.

本實施中的限位元結構15a為實心結構或比多孔性表面結構1311-1和多孔性表面結構1311-2孔隙率低的多孔結構。 The spacer structure 15a in this embodiment is a solid structure or a porous structure with a lower porosity than the porous surface structure 1311-1 and the porous surface structure 1311-2.

本實施例十八的正電極可以是圖15所示為大平面的正電極1514,覆蓋多個區域的多孔性表面結構1511,也可以是圖13中的存在間隙的第一正電極1314-1和第二正電極1314-2,或者是圖14中至少部分重合的第一正電極1414-1和第二正電極1414-2。此時,通過電阻焊將多孔性表面結構1511與非多孔性底板1512形成的複合體與基底1513結合後,各個區域的多孔性表面結構1511的表面雖有少量下沉但不會形成凸邊,且通過限位元結構15a進行限位元,限定下沉的限度。這種方法不僅解決了分區域焊接導致的邊緣凸邊的問題,還可對多孔性表面結構1511因焊接過程導致下沉的位置進行限定。 The positive electrode in the eighteenth embodiment can be the positive electrode 1514 with a large plane as shown in FIG. 15 and the porous surface structure 1511 covering multiple regions, or it can be the first positive electrode 1314-1 with gaps in FIG. 13 and the second positive electrode 1314-2, or at least partially overlap the first positive electrode 1414-1 and the second positive electrode 1414-2 in FIG. 14 . At this time, after the complex formed by the porous surface structure 1511 and the non-porous bottom plate 1512 is combined with the substrate 1513 by resistance welding, although the surface of the porous surface structure 1511 in each region sinks slightly, no convex edges are formed. And the limit element is implemented by the limit element structure 15a to limit the limit of sinking. This method not only solves the problem of edge protruding caused by regional welding, but also limits the position where the porous surface structure 1511 sinks due to the welding process.

實施例十九:值得說明的是,本發明並不僅限於上述任意一實施例中的單獨採用凸焊式電阻焊法,還可以採用單獨採用點焊式電阻焊法或者將凸焊式電阻焊法和點焊式電阻焊法配合使用,將中間體與基底結合起來。具體地:點焊式電阻焊法與通過設置凸起結構的凸焊式電阻焊法不同,所述點焊式電阻焊法中,中間體未設置凸起結構,在一個焊接迴圈過程中,通過單個電極以及每次移動被焊工件(例如複合體和基底)或者通過單個電極以及每次移動電極來完成一個焊點的焊接,直至完成設定個數的焊點,保證中間體與基底之間有足夠的焊接強度。另外,本發明還可以將凸焊式電阻焊法和點焊式電阻焊法配合使用,例如在上 述任意一實施例中的凸焊式電阻焊法完成後,進一步地採用點焊式電阻焊法操作,用以加強中間體與基底之間的焊接強度。 Embodiment 19: It is worth noting that the present invention is not limited to the single use of the projection welding resistance welding method in any of the above-mentioned embodiments, and the single use of the spot welding resistance welding method or the projection welding resistance welding method can also be used. Used in conjunction with spot welding resistance welding to join intermediates to substrates. Specifically: the spot welding resistance welding method is different from the projection welding resistance welding method by setting a raised structure. In the spot welding resistance welding method, the intermediate body is not provided with a raised structure. In a welding cycle process, The welding of a spot is completed by a single electrode and moving the welded workpiece (such as the composite body and the substrate) or by a single electrode and moving the electrode each time, until the set number of welding spots is completed, ensuring the connection between the intermediate body and the substrate There is sufficient welding strength. In addition, the present invention can also use the projection welding resistance welding method and the spot welding resistance welding method together, for example, in the above After the projection welding resistance welding method in any one of the above embodiments is completed, the spot welding resistance welding method is further used to strengthen the welding strength between the intermediate body and the substrate.

本發明凸焊式電阻焊的方法可以在一個焊接迴圈內可同時焊接多個焊點,生產效率高,而且沒有分流影響;同時,由於電流密度集中於凸點,電流密度大,所以可以採用較小的電流進行焊接,並能可靠地形成較小的熔核,克服了點焊式電阻焊的熔核偏移現象;凸焊式電阻焊法的凸點位置準確、尺寸一致,各點的強度比較均勻,因此對於給定的焊接強度、單個凸焊焊點的尺寸可以小於點焊;另外,由於採用大平面電極,且凸點設置在中間體上,所以可最大限度地減輕基底外露表面上的壓痕,同時大平面電極的電流密度小、散熱好,電極的磨損要比點焊式小得多,因而大大降低了電極的保養和維修費用。 The projection welding resistance welding method of the present invention can simultaneously weld a plurality of welding spots in one welding loop, has high production efficiency, and has no shunt influence; at the same time, because the current density is concentrated on the bumps and the current density is large, it can be used Welding with a small current can reliably form a small nugget, which overcomes the nugget offset phenomenon of the spot welding resistance welding method; the bump position of the projection welding resistance welding method is accurate and the size is consistent, and the The strength is relatively uniform, so for a given welding strength, the size of a single projection welding spot can be smaller than that of spot welding; in addition, due to the use of large flat electrodes and the bumps are set on the intermediate body, the exposed surface of the substrate can be minimized At the same time, the current density of the large flat electrode is small, the heat dissipation is good, and the wear of the electrode is much smaller than that of the spot welding type, thus greatly reducing the maintenance and repair costs of the electrode.

針對上述任一實施例中的凸焊電阻焊過程中,由於凸起結構主要是中間部分的凸起受到上方電極的壓力較大並與基底通過接觸產生電阻熱進行結合,而凸起結構的側邊部分未與基底充分接觸導致無法焊接結合。為了提高中間體的凸起結構與基底之間的焊接強度,通過旋轉電極、基底、中間體中的任意一個或多個,對中間體分多次並從多個方向進行焊接,確保凸起結構與基底全方位的進行焊接。 For the projection welding resistance welding process in any of the above-mentioned embodiments, since the protrusion in the middle part of the protrusion structure is mainly pressed by the upper electrode and is combined with the base through contact to generate resistance heat, while the side of the protrusion structure The edge portion is not in sufficient contact with the substrate to prevent a solder joint. In order to improve the welding strength between the protruding structure of the intermediate body and the base, the intermediate body is divided into multiple times and welded from multiple directions by rotating any one or more of the electrode, base, and intermediate body to ensure the protruding structure Weld with the substrate in all directions.

另外,作為上述實施例方式的一個拓展方式,具體包含:由於上述某些實施例的多孔性表面結構21與其上方的大平面正電極24接觸,則多孔性表面結構的表面可能因接觸電阻生熱導致表面發生損傷(凹陷、變黑),為了克服該缺陷,保護多孔性表面結構的表面,通過在多孔性表面結構覆蓋一絕緣件,並在所述絕緣件上相應位置開設多個孔,用以放入正電極或良導電的支撐柱等,使得未開孔位置的絕緣件下方的多孔性表面結構不受任何損傷。其中,所述絕緣件的厚度適度,因為需要保證完整的電流回路導通,使得焊接製程得以順序進行。 In addition, as an extension of the above-mentioned embodiment, it specifically includes: since the porous surface structure 21 of some of the above-mentioned embodiments is in contact with the large-plane positive electrode 24 above it, the surface of the porous surface structure may generate heat due to contact resistance Cause surface damage (depression, blackening), in order to overcome this defect, protect the surface of the porous surface structure, by covering an insulating part on the porous surface structure, and opening a plurality of holes in the corresponding position on the insulating part, use The positive electrode or a good conductive support column can be put in, so that the porous surface structure under the insulating part at the unopened position will not be damaged in any way. Wherein, the thickness of the insulating member is moderate, because it is necessary to ensure complete current loop conduction, so that the welding process can be performed sequentially.

如圖21所示,基於實施例一/實施例二還可做如下改進:本發明將實施例一和例二中的非多孔性底板(圖2)或低孔隙率區域(圖4b)的凸點去除變換成一種無凸起結構的(非多孔性或低孔隙率)中間板結構272,並將基底273改成一種基底273的主體和其頂面上的另一帶凸點的結構272A的基底複合體,所述帶凸點的結構272A與所述基底273的主體預先連接(如電阻焊/鐳射焊),所述帶凸點的結構272A的凸起結構是朝向不帶凸點的中間板272結構一側,即所述帶凸點的結構272A的凸點與複合體中的中間板272的結構的底面進行接觸。 As shown in Figure 21, the following improvements can also be made based on Embodiment 1/Embodiment 2: the present invention converts the non-porous bottom plate (Fig. 2) or the convexity of the low-porosity area (Fig. Point removal transforms to a non-protruded structure (non-porous or low porosity) intermediate plate structure 272 and changes the substrate 273 to a substrate of the main body of the substrate 273 and another raised structure 272A on its top surface Composite body, the structure with bumps 272A is pre-connected (such as resistance welding/laser welding) to the main body of the substrate 273, and the raised structure of the structure with bumps 272A is facing the middle plate without bumps One side of the 272 structure, ie the bumps of the bumped structure 272A, is in contact with the bottom surface of the structure of the intermediate plate 272 in the composite.

由多孔性表面結構271與中間板272的結構形成的表面複合體,以及由所述帶凸點的結構272A與基底273的主體形成的基底複合體,被壓緊在正電極274和負電極275之間。當通以電流,電流流經多孔性表面結構271、中間板272的結構直至所述帶凸點的結構272A的凸點,因接觸電阻產生電阻熱從而將所述帶凸點的結構272A的凸點與中間板272的結構的底部加熱到熔化或塑性狀態,最終達到中間板272的結構與所述帶凸點的結構272A之間的固連作用,從而使所述表面複合體與所述基底複合體緊密結合在一起。另外一示例中,表面複合體仍然採用實施例一和例二中帶有凸點的中間板272的結構,其凸起結構朝向基底273的主體一側,並讓中間板272的結構的凸起結構與基底上方的所述帶凸點的結構272A的凸起結構錯開佈置,最終也可實現所述表面複合體與所述基底複合體緊密結合在一起。本發明的上述改進不僅限於實施例一的基礎上,還可適用於上述任一實施例,本發明對此不做贅述。 The surface complex formed by the structure of the porous surface structure 271 and the middle plate 272, and the base complex formed by the structure 272A with bumps and the main body of the substrate 273 are pressed against the positive electrode 274 and the negative electrode 275 between. When the current is applied, the current flows through the structure of the porous surface structure 271 and the middle plate 272 until the bumps of the structure 272A with bumps, and the contact resistance generates resistance heat so that the bumps of the structure 272A with bumps Points and the bottom of the structure of the intermediate plate 272 are heated to a molten or plastic state, eventually achieving a solid connection between the structure of the intermediate plate 272 and the structure with bumps 272A, thereby making the surface composite body and the substrate The complexes are tightly bound together. In another example, the surface composite still adopts the structure of the middle plate 272 with bumps in Embodiments 1 and 2, and the raised structure faces the main body side of the base 273, and the raised structure of the middle plate 272 The staggered arrangement of the structures and the protruding structures of the structure with protruding points 272A above the substrate can finally realize the close integration of the surface composite and the substrate composite. The above-mentioned improvement of the present invention is not limited to the basis of the first embodiment, but can also be applicable to any of the above-mentioned embodiments, and the present invention will not describe it in detail.

如圖22所示,基於實施例一還可做採用以下實施方案:首先和實施一相同,在基底283的頂部一側設置由第一多孔性表面結構281-1與第一非多孔性底板282-1預先連接形成的第一複合體,第一複合體置於正電極24與基底283的頂面之間,且第一多孔性表面結構281-1的頂部的至少一部分與正電極24接觸;第一非多孔性底板282-1的底部預先製造出 多個第一凸起結構,該第一凸起結構與基底283的頂部相接觸。同時,基底283的底部一側設置由第二多孔性表面結構281-2與第二非多孔性底板282-2預先連接形成的第二複合體,第二複合體置於基底283的底面與負電極285之間,且第二多孔性表面結構281-2的底部的至少一部分與負電極285接觸。其中,第二複合體與所述第一複合體結構相同,且關於基底283為軸對稱。按照實施例一的原理,第一複合體和第二複合體分別與基底283的上下表面同時進行電阻焊接,實現第一複合體、第二複合體、基底的連接。此種變形同樣適用於上述任意一實施例,本發明對此不做贅述。 As shown in Figure 22, the following implementations can also be adopted based on Embodiment 1: First, the same as Embodiment 1, a first porous surface structure 281-1 and a first non-porous bottom plate are arranged on the top side of the substrate 283 282-1 is pre-connected to form the first composite body, the first composite body is placed between the positive electrode 24 and the top surface of the substrate 283, and at least a part of the top of the first porous surface structure 281-1 is connected to the positive electrode 24 contact; the bottom of the first non-porous base plate 282-1 is prefabricated A plurality of first protruding structures, the first protruding structures are in contact with the top of the base 283 . At the same time, the bottom side of the base 283 is provided with a second composite body formed by pre-connecting the second porous surface structure 281-2 and the second non-porous bottom plate 282-2, and the second composite body is placed on the bottom surface of the base 283 and the second composite body. Between the negative electrodes 285 , and at least a part of the bottom of the second porous surface structure 281 - 2 is in contact with the negative electrode 285 . Wherein, the second complex has the same structure as the first complex, and is axisymmetric with respect to the base 283 . According to the principle of Embodiment 1, the first composite body and the second composite body are respectively resistance-welded to the upper and lower surfaces of the substrate 283 to realize the connection of the first composite body, the second composite body, and the substrate. This modification is also applicable to any one of the above embodiments, which will not be described in detail in the present invention.

實施例二十:如圖16a-圖16c結合所示,本實施例提供一種人工植入假體,較佳的是一種骨科假體;可以使用上述實施例一到實施例十九及其各自變形示例中的任意一種或多種連接結構及方法。假體主體對應於連接結構中的基底,假體主體的至少部分表面作為連接區域,與包含中間體及多孔性表面結構的複合體2連接,通過中間體(例如實施例一中的非多孔性底板22、實施例二中的低孔隙率區域的第二多孔結構42等等)與基底(例如實施例一中的基底23,實施例二中的基底43等等)的連接(凸焊式電阻焊和/或點焊式電阻焊),實現多孔性表面結構與基底的連接,形成對假體上連接區域的表面覆蓋。 Embodiment 20: As shown in the combination of Figure 16a-Figure 16c, this embodiment provides an artificially implanted prosthesis, preferably an orthopedic prosthesis; the above-mentioned Embodiment 1 to Embodiment 19 and their respective deformations can be used Any one or more connection structures and methods in the example. The prosthesis body corresponds to the substrate in the connection structure, and at least part of the surface of the prosthesis body is used as a connection area to connect with the composite body 2 comprising the intermediate body and the porous surface structure, through the intermediate body (such as the non-porous material in Example 1) The connection (projection welding type resistance welding and/or spot welding) to achieve the connection of the porous surface structure to the substrate, forming a surface coverage of the connection area on the prosthesis.

結合實施例一至實施例十九或其變形示例的結構及方法,設置假體殼體,外層為多孔性表面結構,內層為中間體接觸並通過電阻焊焊接固定至假體本體的連接區域,實現多孔性表面結構與假體本體的連接,形成對假體本體上連接區域的表面覆蓋,從而在其他種類的骨科假體、人工關節等各種人工植入假體應用,如股骨柄、髖臼杯、股骨髁、脛骨平臺等,具體參照後續實施例二十至二十三的描述。 Combining the structures and methods of Embodiment 1 to Embodiment 19 or their modified examples, a prosthesis shell is set, the outer layer is a porous surface structure, and the inner layer is a connection area where the intermediate body contacts and is fixed to the prosthesis body by resistance welding, Realize the connection between the porous surface structure and the prosthesis body, forming a surface coverage of the connection area on the prosthesis body, so that it can be used in other types of orthopedic prosthesis, artificial joints and other artificial implants, such as femoral stem, acetabulum For the cup, femoral condyle, tibial plateau, etc., refer to the description of subsequent embodiments 20 to 23 for details.

以人工髖關節為例進行說明。人工髖關節包含股骨柄、股骨球頭(圖未示出)、髖臼杯、襯體(圖未示出),均為假體,使用可植入人體的醫用材料製成,例如是鈦合金、鈷鉻鉬合金、不銹鋼等金屬材料,超高分子量聚乙烯等聚合物,陶瓷等,且不限於此。 Take the artificial hip joint as an example. The artificial hip joint includes a femoral stem, a femoral ball head (not shown), an acetabular cup, and a liner (not shown), all of which are prostheses made of medical materials that can be implanted into the human body, such as titanium Metal materials such as alloys, cobalt-chromium-molybdenum alloys, stainless steel, polymers such as ultra-high molecular weight polyethylene, ceramics, etc., and are not limited thereto.

所述股骨柄3(圖16a-圖16c)包含頭部301、頸部302、柄體303,可以是一體的或是組裝形成的。股骨柄3的頭部301為錐台結構,第一端通過頸部302與柄體303連接,頭部301與頸部302相對柄部有一定的偏轉角度,以相對於柄部一側傾斜的形式佈置。柄體303下部插入股骨髓腔。柄體303下部可以開設複數個縱向的溝槽。在柄體303的表面,較佳的是柄體303的上部的表面為多孔性結構;柄體303的下部可以具有光滑表面。 The femoral stem 3 ( FIGS. 16 a - 16 c ) includes a head 301 , a neck 302 , and a stem body 303 , which can be formed integrally or assembled. The head 301 of the femoral stem 3 is a truncated cone structure, and the first end is connected to the handle body 303 through the neck 302. The head 301 and the neck 302 have a certain deflection angle relative to the handle, so as to be inclined relative to one side of the handle. Form arrangement. The lower part of the handle body 303 is inserted into the medullary cavity of the femur. A plurality of longitudinal grooves may be opened in the lower part of the handle body 303 . On the surface of the handle body 303, preferably, the upper part of the handle body 303 has a porous structure; the lower part of the handle body 303 may have a smooth surface.

股骨柄3的頭部301的第二端插入至股骨球頭的內錐安裝結構;髖臼杯套設在股骨球頭的外側,股骨球頭與髖臼襯體的內凹面接觸,使股骨球頭可在此處旋轉。一些示例中的髖臼杯為部分球形(如半球形)的穹頂狀;髖臼杯內設有與之配合的襯體;股骨球頭與襯體的內凹面形成接觸,使股骨球頭可在此處旋轉。所述髖臼杯上可以開設通孔,用於設置將髖臼杯連接至髖臼窩的連接件(螺釘等);襯體可以開設對應的通孔或者不開設通孔。襯體的內凹面與股骨球頭接觸;襯體可以由金屬材料或者由非金屬材料(如聚乙烯或陶瓷等)製成,以減少人工關節的磨損。殼體通常由金屬材料製成。髖臼杯的外周面,較佳的是使用多孔性結構。 The second end of the head 301 of the femoral stem 3 is inserted into the inner cone installation structure of the femoral ball; The head can be rotated here. The acetabular cup in some examples is partially spherical (eg, hemispherical) dome-shaped; the acetabular cup is provided with a liner that fits therein; Spin here. The acetabular cup can be provided with a through hole for setting the connecting piece (screw, etc.) connecting the acetabular cup to the acetabular fossa; the liner can be provided with a corresponding through hole or not provided with a through hole. The inner concave surface of the liner is in contact with the femoral ball head; the liner can be made of metal material or non-metal material (such as polyethylene or ceramics, etc.), so as to reduce the wear and tear of the artificial joint. The housing is usually made of metal material. The outer peripheral surface of the acetabular cup preferably uses a porous structure.

股骨柄3的柄體303的上部表面,髖臼杯外殼的外周面使用多孔性結構,一方面可以增大粗糙度;另一方面可以誘使成骨細胞骨長入,進而有效地將股骨柄與股骨,髖臼杯與髖臼窩固定連接,形成良好的長期生物固定,增強人工髖關節與宿主骨組織之間的介面穩定性。 The upper surface of the handle body 303 of the femoral stem 3 and the outer peripheral surface of the acetabular cup shell use a porous structure, which can increase the roughness on the one hand; It is fixedly connected with the femur, the acetabular cup and the acetabular fossa to form a good long-term biological fixation and enhance the stability of the interface between the artificial hip joint and the host bone tissue.

為了加速或加強骨組織與多孔性假體表面的結合,任意一種假體(同樣適用於後續實施例的人工關節)在其接觸骨組織的表面,可以形成羥基磷灰石(HA)等塗層;或者,使用凝膠/膠原蛋白等材料作為植入細胞、生長因數等的載體,附著在假體多孔性表面;或者形成抗菌塗層(如抗菌素/銀離子等)。 In order to accelerate or strengthen the combination of bone tissue and the surface of the porous prosthesis, any prosthesis (also applicable to the artificial joints of the subsequent embodiments) can form a coating such as hydroxyapatite (HA) on the surface that contacts the bone tissue Or, use materials such as gel/collagen as carriers for implanting cells, growth factors, etc., and attach to the porous surface of the prosthesis; or form an antibacterial coating (such as antibiotics/silver ions, etc.).

股骨柄3可使用上述實施例一至實施例十九或其變形示例的結構及方法(電阻焊),在此不做贅述,具體可參照上述對應實施例內容。其中,所述股骨柄3的柄體303對應於連接結構中的基底;包含中間體(如非多孔性底板,或低孔隙率區域的多孔結構等等,具體需要根據不同實施例確定)及多孔性表面結構的複合體2形成柄體殼體,其覆蓋在柄體主體303a(上部)的連接區域,通過中間體與基底的焊接,實現多孔性表面結構201與基底的連接,形成對連接區域的覆蓋,得到股骨柄3的柄體303上的多孔性結構。 The femoral stem 3 can use the structure and method (resistance welding) of the above-mentioned embodiment 1 to embodiment 19 or their modified examples, which will not be repeated here, and details can be referred to the contents of the above-mentioned corresponding embodiments. Wherein, the handle body 303 of the femoral stem 3 corresponds to the base in the connecting structure; it includes an intermediate body (such as a non-porous bottom plate, or a porous structure in a low-porosity region, etc., which needs to be determined according to different embodiments) and porous The composite body 2 of the porous surface structure forms the handle body shell, which covers the connection area of the handle body main body 303a (upper part), through the welding of the intermediate body and the substrate, the connection of the porous surface structure 201 and the substrate is realized, forming a connection area Covering, obtain the porous structure on the stem body 303 of the femoral stem 3.

在一些示例中,柄體主體303a使用鍛造、鑄造或機加工等方式製成,優選是實心結構,便於加工且具有高強度;或者柄體主體303a也可以是高緻密度的多孔性結構;中間體可以是實心的,或是比多孔性表面結構緻密度更高的多孔性結構;柄體主體303a與中間體202都使用多孔性結構時,中間體202的緻密度介於柄體主體303a與多孔性表面結構201的緻密度之間。複合體2形成柄體殼體的中間體202與多孔性表面結構201,較佳的使用3D列印增材製造製程實現,可以很好地形成符合設計要求的孔隙等。柄體主體303a與複合體2形成柄體殼體的中間體202通過電阻焊實現有效連接,避免了目前通過熱壓製程(如滲透焊製程)等在股骨柄3的表面連接多孔性結構時整體強度大幅下降的問題。 In some examples, the handle body 303a is made by forging, casting or machining, and is preferably a solid structure, which is easy to process and has high strength; or the handle body 303a can also be a high-density porous structure; The body can be solid, or a porous structure with a higher density than the porous surface structure; when both the handle body body 303a and the intermediate body 202 use a porous structure, the density of the intermediate body 202 is between the handle body body 303a and the intermediate body 202. The density of the porous surface structure 201 is between. The composite body 2 forms the intermediate body 202 and the porous surface structure 201 of the handle body, preferably using 3D printing additive manufacturing process, which can well form pores that meet the design requirements. The handle main body 303a and the composite body 2 form the intermediate body 202 of the handle body shell to realize effective connection through resistance welding, which avoids the overall process of connecting the porous structure on the surface of the femoral stem 3 through a hot pressing process (such as a penetration welding process) etc. A problem with a sharp drop in intensity.

另一示例中,如圖16c所示對應於上述實施例一中的圖2。內側的柄體303對應連接結構中的基底,外側的多孔結構2201對應連接結構的多孔性表面結構,多孔結構2201和柄體303之間設置中間體(非多孔性底板 2202)。由於多孔結構2201與非多孔性底板2202形成的複合體,以及柄體303被壓緊在正電極2204和負電極2205之間。當通以電流,電流流經多孔結構2201、非多孔性底板2202直至與柄體303的外側的接觸面及鄰近區域,產生電阻熱從而將其加熱到熔化或塑性狀態,使得非多孔性底板2202與柄體303形成結合體,實現非多孔性底板2202與柄體303之間的固連作用,從而使多孔結構2201與非多孔性底板2202形成的複合體與柄體303緊密結合在一起。有關股骨柄適用於實施例一的其他內容在此不做贅述。 In another example, as shown in FIG. 16c, it corresponds to FIG. 2 in the first embodiment above. The inner handle 303 corresponds to the base in the connection structure, the outer porous structure 2201 corresponds to the porous surface structure of the connection structure, and an intermediate (non-porous bottom plate) is arranged between the porous structure 2201 and the handle 303 2202). Due to the complex formed by the porous structure 2201 and the non-porous bottom plate 2202 , and the handle 303 is compressed between the positive electrode 2204 and the negative electrode 2205 . When the current is applied, the current flows through the porous structure 2201, the non-porous bottom plate 2202 until the contact surface with the outside of the handle body 303 and the adjacent area, generating resistance heat and heating it to a molten or plastic state, making the non-porous bottom plate 2202 Form a combined body with the handle body 303 to realize the fixing effect between the non-porous bottom plate 2202 and the handle body 303 , so that the complex formed by the porous structure 2201 and the non-porous bottom plate 2202 and the handle body 303 are closely combined. Other content applicable to the first embodiment of the femoral stem will not be repeated here.

一個具體示例中,股骨柄3的柄體主體303a上部設有連接區域;為方便敘述,以股骨柄3的頭部301與頸部302傾斜佈置的一側為股骨柄3的內側,按照圖16a所示的逆時針方向,將柄體主體303a的其他方向作為後側、外側至前側,內側與外側相對,後側與前側相對;圖16a示出前側,圖16b示出外側。 In a specific example, the upper part of the stem body 303a of the femoral stem 3 is provided with a connection area; for the convenience of description, the side where the head 301 and the neck 302 of the femoral stem 3 are obliquely arranged is the inner side of the femoral stem 3, according to Figure 16a In the counterclockwise direction shown, the other directions of the handle body 303a are taken as the rear side, the outer side to the front side, the inner side is opposite to the outer side, and the rear side is opposite to the front side; FIG. 16a shows the front side, and FIG. 16b shows the outer side.

本例中,股骨柄3的連接區域,包含柄體主體303a上部的內側、後側、外側、前側的表面。如圖17a-圖17e結合所示,柄體殼體(複合體形成的)2包含兩個殼體片體,一個殼體片體2-1對應柄體主體303a上部的內側表面01的一部分、後側表面02、外側表面03的一部分;另一個殼體片體2-2對應柄體主體303a上部內側表面01的剩餘部分、前側表面04、外側表面03的剩餘部分。兩個殼體片體合攏後,分別接觸並焊接至柄體主體上部所述連接區域的對應位置。每個殼體片體的內層為中間體202,外層全部或大部分為多孔性表面結構201。 In this example, the connection area of the femoral stem 3 includes the inner, posterior, lateral, and anterior surfaces of the upper part of the stem body 303a. As shown in combination of Figures 17a-17e, the handle body shell (formed by a composite body) 2 includes two shell pieces, and one shell piece 2-1 corresponds to a part of the inner surface 01 of the upper part of the handle main body 303a, A part of the rear side surface 02 and the outer side surface 03; the other shell body 2-2 corresponds to the remaining part of the upper inner side surface 01, the front side surface 04, and the remaining part of the outer side surface 03 of the handle body 303a. After the two shell pieces are closed, they are respectively contacted and welded to the corresponding positions of the connection area on the upper part of the handle main body. The inner layer of each casing sheet is an intermediate body 202 , and all or most of the outer layer is a porous surface structure 201 .

如圖17d和圖17e所示,兩個殼體片體可以是對稱的(或是錯位交叉的,圖未示出)。示例地,兩個殼體片體在成型和合攏後,鄰邊都可以是相互分離而不進行連接的。或者,兩個殼體片體在成型時一側的鄰邊(如外側表面03)可以是相連的,並且可以在鄰邊附近有一定彎曲(以使兩個殼體片體合攏)時仍保持連接。又或者,兩個殼體片體在成型 時鄰邊相互分離,而在合攏後對每一側的鄰邊都進行連接(例如焊接或使用連接件或其他連接方式)。所述鄰邊是指兩個殼體片體合攏後相鄰的邊緣。鄰邊的相互連接,可以是對每個殼體片體內層的中間體和/或外層的多孔性表面結構進行連接。 As shown in Fig. 17d and Fig. 17e, the two shell pieces may be symmetrical (or dislocated and intersected, not shown in the figure). For example, after the two shell pieces are formed and folded together, the adjacent sides can be separated from each other without being connected. Alternatively, the adjacent edges (such as the outer surface 03) on one side of the two shell sheets can be connected when they are molded, and they can still be kept when there is a certain bending near the adjacent edges (to make the two shell sheets close together). connect. Alternatively, two shell pieces are forming When the adjacent sides are separated from each other, the adjacent sides on each side are connected (such as welding or using connectors or other connection methods) after closing. The adjacent edge refers to the adjacent edge after the two casing sheets are closed. The interconnection of adjacent sides may be the connection between the intermediate body of the inner layer of each shell sheet and/or the porous surface structure of the outer layer.

實施例二十一:本實施例中,髖臼杯300a外周面的多孔性結構,可以類似地使用上述實施例一至實施例十九或其變形示例的結構及方法實現。 Embodiment 21: In this embodiment, the porous structure of the outer peripheral surface of the acetabular cup 300a can be realized by similarly using the structures and methods of the above-mentioned embodiments 1 to 19 or their modified examples.

在一個示例中,一個具體示例中,如圖18a和圖18b結合所示,對應於上述實施例一中的圖2,所述髖臼杯300a的外殼處,內側的杯體主體對應連接結構中的基底2403,外側的多孔結構2401對應連接結構的多孔性表面結構,多孔結構2401和基底2403之間設置中間體(非多孔性底板2402)。由於多孔結構2401與非多孔性底板2402形成的複合體(該複合體形成在杯體主體3-3的外側,且覆蓋在杯體主體3-3的連接區域),以及基底2403被壓緊在正電極2404和負電極2405之間。當通以電流,電流流經多孔結構2401、非多孔性底板2402直至與基底2403外側的接觸面及鄰近區域,產生電阻熱從而將其加熱到熔化或塑性狀態,使得非多孔性底板2402與基底2403形成結合體,實現非多孔性底板2402與基底2403之間的固連作用,從而使多孔結構2401與非多孔性底板2402形成的複合體與基底2403緊密結合在一起,因此形成對杯體主體上連接區域的覆蓋,得到髖臼杯(外殼)外周面上的多孔性結構。本發明的髖臼杯的杯體主體與複合體(或其包含的中間體)在接觸及連接的部位相適配。有關髖臼杯適用於實施例一的其他內容在此不做贅述,以及有關髖臼杯適用於其他實施例的具體內容在此不做贅述。 In one example, in a specific example, as shown in combination of Figure 18a and Figure 18b, corresponding to Figure 2 in the first embodiment above, at the shell of the acetabular cup 300a, the inner cup body corresponds to the connection structure The outer porous structure 2401 corresponds to the porous surface structure of the connection structure, and an intermediate (non-porous bottom plate 2402) is arranged between the porous structure 2401 and the substrate 2403. Due to the complex formed by the porous structure 2401 and the non-porous bottom plate 2402 (the complex is formed on the outside of the cup body 3-3 and covers the connection area of the cup body 3-3), and the base 2403 is pressed against the Between the positive electrode 2404 and the negative electrode 2405. When the current is applied, the current flows through the porous structure 2401, the non-porous bottom plate 2402 until the contact surface and the adjacent area with the outside of the substrate 2403, generating resistance heat and heating it to a molten or plastic state, so that the non-porous bottom plate 2402 and the substrate 2403 forms a combination to realize the solid connection between the non-porous bottom plate 2402 and the substrate 2403, so that the composite formed by the porous structure 2401 and the non-porous bottom plate 2402 is closely combined with the substrate 2403, thus forming a cup body. The coverage of the upper connection area results in a porous structure on the peripheral surface of the acetabular cup (shell). The cup body of the acetabular cup of the present invention is adapted to the complex (or the intermediate body it contains) at the contact and connection sites. Other content about the acetabular cup applicable to the first embodiment will not be repeated here, and specific content about the acetabular cup applicable to other embodiments will not be repeated here.

在一些示例中,髖臼杯的杯體主體使用鍛造、鑄造或機加工等方式製成,較佳的是實心結構,便於加工且具有高強度;或者杯體主體也可以是高緻密度的多孔性結構;中間體可以是實心的,或是比多孔性表 面結構緻密度更高的多孔性結構;杯體主體與中間體都使用多孔性結構時,中間體的緻密度介於柄體主體與多孔性表面結構的緻密度之間。中間體與多孔性表面結構,較佳的使用3D列印增材製造製程實現,可以很好地控制孔隙等,以滿足設計要求。杯體主體與中間體通過電阻焊方法實現有效連接,避免了目前通過熱壓製程(如滲透焊製程)等造成整體強度大幅下降的問題。 In some examples, the cup body of the acetabular cup is made by forging, casting or machining, preferably a solid structure, which is easy to process and has high strength; or the cup body can also be a high-density porous structure; intermediates can be solid, or A porous structure with a higher surface structure density; when the cup body and the intermediate body both use a porous structure, the density of the intermediate body is between that of the handle body and the porous surface structure. The intermediate body and porous surface structure are preferably realized by 3D printing additive manufacturing process, which can control the pores well to meet the design requirements. The main body of the cup body and the intermediate body are effectively connected by resistance welding, which avoids the problem that the overall strength is greatly reduced by the current hot pressing process (such as the penetration welding process).

具體的示例中,可以將杯體主體的整個外表面作為一個連接區域,設置一個整體的複合體與之對應接觸並通過所包含的中間體在連接區域進行焊接。也可以在杯體主體的整個外表面劃分多個獨立的連接區域;多個複合體(各自可以是片狀或其他形狀,與穹頂外殼相適配),分別與這些連接區域對應接觸,並通過各自的中間體在這些連接區域相應焊接。其中,每個複合體的內層為中間體,外層全部或大部分為多孔性表面結構。 In a specific example, the entire outer surface of the main body of the cup can be used as a connection area, and an integral composite body is arranged to be in corresponding contact with it and welded in the connection area through the contained intermediate body. It is also possible to divide a plurality of independent connection areas on the entire outer surface of the cup body; a plurality of composite bodies (each can be a sheet or other shape, and is adapted to the dome shell), respectively contact with these connection areas correspondingly, and pass through The respective intermediate body is correspondingly welded in these connection regions. Wherein, the inner layer of each complex is an intermediate body, and all or most of the outer layers are porous surface structures.

實施例二十二:脛骨近端與股骨遠端形成膝關節,脛骨與股骨遠端接觸的面為脛骨平臺,脛骨平臺是膝關節的重要負荷結構。在植入假體中,用於替代股骨側骨質的部件稱為股骨髁,用於替代脛骨側骨質的部件稱為脛骨平臺,股骨髁與脛骨平臺之間有聚乙烯墊片,從而起到降低磨損和恢復膝關節功能的作用。 Embodiment 22: The proximal end of the tibia and the distal end of the femur form a knee joint, and the contact surface between the tibia and the distal end of the femur is the tibial plateau, which is an important load-bearing structure of the knee joint. In the implant prosthesis, the part used to replace the bone on the femoral side is called the femoral condyle, and the part used to replace the bone on the tibial side is called the tibial plateau. There is a polyethylene spacer between the femoral condyle and the tibial plateau to reduce the The role of wear and restore knee joint function.

如圖19a和圖19b所示,脛骨平臺300b呈T型結構,包含上方的脛骨托300-1和下方的支撐部分300-2。脛骨平臺300b的下表面使用多孔性結構,一方面可以增大粗糙度;另一方面可以誘使成骨細胞骨長入,進而有效地將脛骨平臺假體與人體脛骨連接固定,替代受損病變的脛骨面,形成良好的長期生物固定,用以承受人體壓力載荷、滿足運動和抗磨損功能要求。所述脛骨平臺300b的下表面的多孔性結構可以類似地使用上述實施例一至實施例十九或其變形示例的結構及方法實現。 As shown in Fig. 19a and Fig. 19b, the tibial plateau 300b has a T-shaped structure, including an upper tibial tray 300-1 and a lower support portion 300-2. The lower surface of the tibial plateau 300b uses a porous structure, on the one hand, it can increase the roughness; on the other hand, it can induce osteoblast bone ingrowth, and then effectively connect and fix the tibial plateau prosthesis with the human tibia, replacing damaged lesions The tibial surface forms a good long-term biological fixation to bear the pressure load of the human body and meet the functional requirements of movement and wear resistance. The porous structure of the lower surface of the tibial plateau 300b can be similarly realized by using the structures and methods of the first to nineteenth embodiments above or their modified examples.

一個具體示例中,如圖19a和圖19b結合所示,脛骨托300-1的下表面對應連接結構的多孔性表面結構2501,脛骨托300-1的上端對應連接結構的內側的基底2503;多孔性表面結構2501和基底2503之間設置中間體(非多孔性底板2502)。由於多孔性表面結構2501與非多孔性底板2502形成的複合體,以及基底2503被壓緊在正電極2504和負電極2505之間。當通以電流,電流流經多孔性表面結構2501、非多孔性底板2502直至與基底2503遠端的接觸面及鄰近區域,產生電阻熱從而將其加熱到熔化或塑性狀態,使得非多孔性底板2502與基底2503形成結合體,實現非多孔性底板2502與基底2503之間的固連作用,從而使多孔性表面結構2501與非多孔性底板2502形成的複合體與基底2503緊密結合在一起。本示例中的多孔性表面結構2501與中間體構成的複合體,形成在脛骨托下端,且覆蓋脛骨托的連接區域。有關脛骨平臺適用於實施例一的其他內容在此不做贅述。有關脛骨平臺適用於其他實施例的具體內容在此不做贅述。 In a specific example, as shown in combination of Figure 19a and Figure 19b, the lower surface of the tibial tray 300-1 corresponds to the porous surface structure 2501 of the connecting structure, and the upper end of the tibial tray 300-1 corresponds to the inner base 2503 of the connecting structure; An intermediate (non-porous bottom plate 2502) is provided between the porous surface structure 2501 and the substrate 2503. Due to the composite formed by the porous surface structure 2501 and the non-porous bottom plate 2502 , the substrate 2503 is compressed between the positive electrode 2504 and the negative electrode 2505 . When an electric current is applied, the current flows through the porous surface structure 2501, the non-porous bottom plate 2502 until the contact surface with the far end of the substrate 2503 and the adjacent area, generating resistance heat and heating it to a molten or plastic state, making the non-porous bottom plate 2502 forms a combination with the substrate 2503 to realize the solid connection between the non-porous bottom plate 2502 and the substrate 2503, so that the complex formed by the porous surface structure 2501 and the non-porous bottom plate 2502 is closely combined with the substrate 2503. In this example, the complex formed by the porous surface structure 2501 and the intermediate body is formed at the lower end of the tibial tray and covers the connection area of the tibial tray. Other content applicable to the first embodiment of the tibial plateau will not be repeated here. The specific content about the tibial plateau applicable to other embodiments will not be repeated here.

實施例二十三:人工膝關節假體包括股骨髁,脛骨托,及設置在二者之間的襯墊,和髕骨假體。股骨髁連接到股骨遠端,脛骨托連接到脛骨近端。襯墊部件與脛骨托部件連接,股骨髁與襯墊接觸。襯墊的下部與脛骨平臺的上表面接觸,股骨髁的外凸面與襯墊的上部及髕骨假體關節面接觸,可以在規定範圍內實現屈伸、滑動、旋轉等活動。 Embodiment 23: The artificial knee joint prosthesis includes a femoral condyle, a tibial tray, a pad between them, and a patella prosthesis. The femoral condyles attach to the distal femur, and the tibial tray attaches to the proximal tibia. The pad component is connected to the tibial tray component, and the femoral condyles are in contact with the pad. The lower part of the liner is in contact with the upper surface of the tibial plateau, and the convex surface of the femoral condyle is in contact with the upper part of the liner and the articular surface of the patella prosthesis, which can achieve flexion, extension, sliding, rotation and other activities within the specified range.

其中,股骨髁300c主體的外凸面通常非常光滑,以減少其與襯墊之間的磨損;而股骨髁主體會在其內凹面,與股骨遠端形成的截骨截面相匹配且相接觸,因而較佳地是在股骨髁主體的內凹面(如內側髁固定面)上形成多孔結構,說明骨長入,實現假體和骨組織的緊密結合,降低假體術後鬆動導致關節置換手術失敗的風險。本實施例中,股骨髁300c的內凹面使用多孔性結構,一方面可以增大粗糙度以增強假體 術後初始穩定性;另一方面可以促進骨長入,進而有效地將股骨髁假體與人體股骨髁連接固定。脛骨襯墊位於股骨髁假體與脛骨平臺假體中間,承受人體壓力載荷、滿足關節運動學和抗磨損要求。 Wherein, the outer convex surface of femoral condyle 300c main body is usually very smooth, to reduce the wear and tear between it and the liner; It is preferable to form a porous structure on the inner concave surface of the main body of the femoral condyle (such as the medial condyle fixation surface) to explain bone ingrowth, realize the tight integration of the prosthesis and bone tissue, and reduce the possibility of joint replacement surgery failure caused by postoperative loosening of the prosthesis risk. In this embodiment, the inner concave surface of the femoral condyle 300c uses a porous structure, on the one hand, the roughness can be increased to strengthen the prosthesis Postoperative initial stability; on the other hand, it can promote bone ingrowth, and then effectively connect and fix the femoral condyle prosthesis with the human femoral condyle. The tibial liner is located between the femoral condyle prosthesis and the tibial plateau prosthesis, which bears the pressure load of the human body and meets the requirements of joint kinematics and anti-wear.

所述股骨髁300c內表面的多孔性結構,可以類似地使用上述實施例一至實施例十九或其變形示例的結構及方法實現。 The porous structure of the inner surface of the femoral condyle 300c can be similarly realized by using the structures and methods of the above-mentioned embodiments 1 to 19 or their modified examples.

在一個示例中,如圖20b所示對應於上述實施例一中的圖2。股骨髁的內表面中,由外向內依次對應連接結構的多孔性表面結構2601、中間體(非多孔性底板2602)和基底2603。股骨髁300c的內側髁對應連接結構的基底2603,股骨髁300c的內側髁固定面使用多孔性表面結構2601。由於多孔結構2601與非多孔性底板2602形成的複合體,以及基底2603被壓緊在正電極和負電極之間。當通以電流,電流流經多孔性表面結構2601、非多孔性底板2602直至與基底2603的外側的接觸面及鄰近區域,產生電阻熱從而將其加熱到熔化或塑性狀態,使得非多孔性底板2602與基底2603形成結合體,實現非多孔性底板2602與基底2603之間的固連作用,從而使多孔性表面結構2601與非多孔性底板2602形成的複合體與基底2603緊密結合在一起。本示例中的多孔性表面結構與中間體構成的複合體,形成在股骨髁的內凹面,且覆蓋股骨髁的連接區域。有關股骨髁適用於實施例一的其他內容在此不做贅述。有關股骨髁適用於其他實施例的具體內容在此不做贅述。同樣地,髕骨假體同樣可以使用上述任意一實施例或其變形示例的結構及方法,在其與骨骼接觸的表面增加多孔性結構。 In one example, as shown in FIG. 20b , it corresponds to FIG. 2 in the first embodiment above. In the inner surface of the femoral condyle, the porous surface structure 2601 , the intermediate body (non-porous bottom plate 2602 ) and the base 2603 of the connection structure are sequentially corresponding from outside to inside. The medial condyle of the femoral condyle 300c corresponds to the base 2603 of the connection structure, and the medial condyle fixation surface of the femoral condyle 300c uses a porous surface structure 2601 . Due to the composite formed by the porous structure 2601 and the non-porous bottom plate 2602, and the substrate 2603 is compressed between the positive and negative electrodes. When an electric current is applied, the current flows through the porous surface structure 2601, the non-porous bottom plate 2602 until the contact surface with the outside of the substrate 2603 and the adjacent area, generating resistance heat and heating it to a molten or plastic state, making the non-porous bottom plate 2602 forms a combination with the substrate 2603 to realize the solid connection between the non-porous bottom plate 2602 and the substrate 2603, so that the complex formed by the porous surface structure 2601 and the non-porous bottom plate 2602 is closely combined with the substrate 2603. In this example, the composite body composed of the porous surface structure and the intermediate body is formed on the inner concave surface of the femoral condyle and covers the connection area of the femoral condyle. Other content applicable to the first embodiment of the femoral condyle will not be repeated here. The specific content about the femoral condyle applicable to other embodiments will not be repeated here. Similarly, the patella prosthesis can also use the structure and method of any one of the above-mentioned embodiments or its modified examples to add a porous structure on its surface in contact with the bone.

本發明的實施例一到十九還不僅限應用於上述假體示例,同樣可應用於如脊柱假體、踝關節、肩關節、肘關節、指關節、趾關節、椎間小關節、下頜關節、腕關節等等,具體結構和原理參照上述,本發明在此不做贅述。 Embodiments 1 to 19 of the present invention are not limited to the above-mentioned prosthesis examples, and can also be applied to such as spinal prosthesis, ankle joint, shoulder joint, elbow joint, finger joint, toe joint, intervertebral facet joint, mandibular joint , wrist joint, etc., the specific structure and principle refer to the above, and the present invention will not repeat them here.

儘管本發明的內容已經通過上述較佳的實施例作了詳細介紹,但應當認識到上述的描述不應被認為是對本發明的限制。在所屬技術領域中具有通常知識者閱讀了上述內容後,對於本發明的多種修改和替代都將是顯而易見的。因此,本發明的保護範圍應由所附的申請專利範圍來限定。 Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. Various modifications and alterations to the present invention will become apparent to those of ordinary skill in the art after reading the foregoing disclosure. Therefore, the protection scope of the present invention should be defined by the appended patent application scope.

2A:複合體 2A: Complex

21:多孔性表面結構 21: Porous surface structure

22:中間體 22: Intermediate

221:凸起結構 221: Raised structure

23:基底 23: Base

24:正電極 24: positive electrode

25:負電極 25: negative electrode

Claims (137)

一種用於連接多孔性表面結構和基底的方法,其中,該方法包含:形成一複合體,該複合體包含預先連接或一體成型的一多孔性表面結構、一中間體、多個支撐柱;該中間體位於該多孔性表面結構與一基底之間,該中間體與該基底接觸;每個該支撐柱的全部或至少部分位於該多孔性表面結構內;該基底與該複合體置於一第一極性電極和一第二極性電極之間;該支撐柱為導電體時,該第一極性電極與該多孔性表面結構、該支撐柱、該中間體之中的至少一個導電接觸,該基底與該第二極性電極導電接觸,形成一電流回路;或者,該支撐柱為絕緣體時,該第一極性電極與該多孔性表面結構、該中間體之中的至少一個導電接觸,該基底與該第二極性電極導電接觸,形成一電流回路;該中間體和該基底進行電阻焊接,實現該複合體與該基底的連接。 A method for connecting a porous surface structure and a substrate, wherein the method includes: forming a composite body, the composite body comprising a pre-connected or integrally formed porous surface structure, an intermediate body, and a plurality of support columns; The intermediate body is located between the porous surface structure and a substrate, the intermediate body is in contact with the substrate; all or at least part of each of the support columns is located in the porous surface structure; the substrate and the composite are placed in a Between the first polarity electrode and a second polarity electrode; when the support pillar is a conductor, the first polarity electrode is in conductive contact with at least one of the porous surface structure, the support pillar, and the intermediate body, and the substrate Conducting contact with the second polarity electrode to form a current loop; or, when the support column is an insulator, the first polarity electrode is in conductive contact with at least one of the porous surface structure and the intermediate body, and the substrate and the The second polarity electrode is in conductive contact to form a current loop; the intermediate body and the substrate are subjected to resistance welding to realize the connection between the composite body and the substrate. 如請求項1所述的方法,其中,該複合體中的該多孔性表面結構稱為一第一多孔結構;該中間體是實心結構,或者,該中間體是一第二多孔結構並且該第二多孔結構的孔隙率低於該第一多孔結構的孔隙率。 The method of claim 1, wherein the porous surface structure in the composite is called a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure and The porosity of the second porous structure is lower than the porosity of the first porous structure. 如請求項2所述的方法,其中,該電阻焊接為凸焊式電阻焊和/或點焊式電阻焊。 The method according to claim 2, wherein the resistance welding is projection welding resistance welding and/or spot welding resistance welding. 如請求項2所述的方法,其中, 當該電阻焊接為凸焊式電阻焊時,該第一極性電極是連續的平面電極或分段的多個電極單體,該第二極性電極是連續的平面電極或分段的多個電極單體;當該電阻焊接為點焊式電阻焊時,該第一極性電極和/或該第二極性電極是分段的多個電極單體。 The method of claim 2, wherein, When the resistance welding is projection welding resistance welding, the first polarity electrode is a continuous planar electrode or a plurality of segmented electrode units, and the second polarity electrode is a continuous planar electrode or a segmented plurality of electrode units body; when the resistance welding is spot welding resistance welding, the first polarity electrode and/or the second polarity electrode are a plurality of segmented electrode monomers. 如請求項4所述的方法,其中,當點焊式電阻焊時,通過移動以下任意一個或多個部件:該第一極性電極、該第二極性電極、已在至少一個接觸位置完成焊接的該中間體與該基底結合體,使得從當前焊接位置移動到下一焊接位置。 The method according to claim 4, wherein, during spot welding resistance welding, by moving any one or more of the following components: the first polarity electrode, the second polarity electrode, the electrode that has been welded at least one contact position The intermediate body is combined with the base so as to move from a current welding position to a next welding position. 如請求項4所述的方法,其中,該第一極性電極分成多個電極單體時,該電極單體插入至該多孔性表面結構內的預製空隙,該電極單體靠近該中間體,使得插入後的該電極單體與該中間體導電接觸或者使得插入後的該電極單體經過該多孔性表面結構與該中間體導電接觸。 The method according to claim 4, wherein when the first polarity electrode is divided into a plurality of electrode monomers, the electrode monomers are inserted into the prefabricated gaps in the porous surface structure, and the electrode monomers are close to the intermediate body, so that The inserted electrode monomer is in conductive contact with the intermediate body or the inserted electrode monomer is in conductive contact with the intermediate body through the porous surface structure. 如請求項4所述的方法,其中,該電極單體從該多孔性表面結構的表面穿過直至穿透至該中間體的表面或該中間體的內部,使得插入後的該電極單體與該中間體導電接觸。 The method according to claim 4, wherein the electrode monomer passes through the surface of the porous surface structure until it penetrates to the surface of the intermediate body or the interior of the intermediate body, so that the inserted electrode monomer and The intermediate body is electrically conductive. 如請求項6所述的方法,其中,該電極單體與該多孔性表面結構為側向間隙配合,使得該電極單體與該多孔性表面結構完全不接觸。 The method according to claim 6, wherein the electrode unit and the porous surface structure are laterally spaced, so that the electrode unit does not contact the porous surface structure at all. 如請求項6所述的方法,其中,該多個電極單體並聯連接至另一平面電極且該另一平面電極與電源端連接, 或者,該多個電極單體並聯並直接連接至電源端。 The method according to claim 6, wherein the plurality of electrode monomers are connected in parallel to another planar electrode and the other planar electrode is connected to a power supply terminal, Alternatively, the plurality of electrode units are connected in parallel and directly connected to the power supply terminal. 如請求項2所述的方法,其中,該第一極性電極為一柔性電極,該柔性電極在壓力作用下,通過柔性變形使得其與該多孔性表面結構的表面相匹配,增大該柔性電極與該多孔性表面結構的表面的接觸面積。 The method according to claim 2, wherein the first polarity electrode is a flexible electrode, and the flexible electrode is deformed flexibly under the action of pressure to match the surface of the porous surface structure, thereby increasing the size of the flexible electrode. The contact area with the surface of the porous surface structure. 如請求項1所述的方法,其中,該第一極性電極為正電極,該第二極性電極為負電極;或者,該第一極性電極為負電極,該第二極性電極為正電極。 The method according to claim 1, wherein the electrode of the first polarity is a positive electrode and the electrode of the second polarity is a negative electrode; or, the electrode of the first polarity is a negative electrode and the electrode of the second polarity is a positive electrode. 如請求項1所述的方法,其中,該第一極性電極和該第二極性電極由導電材料製成;該基底由導電材料製成,該多孔性表面結構由導電材料製成,該中間體由導電材料製成。 The method according to claim 1, wherein, the first polarity electrode and the second polarity electrode are made of conductive material; the substrate is made of conductive material, the porous surface structure is made of conductive material, and the intermediate Made of conductive material. 如請求項1所述的方法,其中,該中間體包含一中間板結構。 The method of claim 1, wherein the intermediate body comprises an intermediate plate structure. 如請求項13所述的方法,其中,該中間板結構上設置多個凸起結構,該凸起結構設置在該中間板結構上靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The method according to claim 13, wherein a plurality of protruding structures are arranged on the intermediate plate structure, the protruding structures are disposed on the side of the intermediate plate structure close to the base, and the protruding points of the protruding structures are in contact with the base contact. 如請求項2所述的方法,其中,該中間體是該第二多孔結構,該第二多孔結構包含多個凸起結構,該凸起結構形成在該第二多孔結構上靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The method according to claim 2, wherein the intermediate body is the second porous structure, the second porous structure comprises a plurality of protruding structures, and the protruding structures are formed on the second porous structure close to the On one side of the substrate, the bumps of the raised structure are in contact with the substrate. 如請求項1所述的方法,其中,該中間體包含複數個分散佈置的凸起結構,形成在若干個多孔性表面結構靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The method according to claim 1, wherein the intermediate body comprises a plurality of protruding structures dispersedly arranged on the side of several porous surface structures close to the substrate, and the bumps of the protruding structures are in contact with the substrate . 如請求項1所述的方法,其中,該支撐柱與該中間體的一凸起結構對應佈置並接觸,或該支撐柱與該中間體的該凸起結構錯位分佈且不接觸;該凸起結構的凸點與該基底接觸;其中,該凸起結構形成在該多孔性表面結構上靠近該基底的一側;或者,該中間體是一第二多孔結構並且該第二多孔結構的孔隙率低於該多孔性表面結構的孔隙率;該凸起結構形成在該第二多孔結構上靠近該基底的一側;或者,該中間體包含的一中間板結構,形成在該多孔性表面結構上靠近該基底的一側;該凸起結構形成在該中間板結構上靠近該基底的一側。 The method according to claim 1, wherein, the support column is arranged correspondingly to and in contact with a protruding structure of the intermediate body, or the support column is dislocated and not in contact with the protruding structure of the intermediate body; the protrusion The bumps of the structure are in contact with the substrate; wherein the raised structure is formed on the side of the porous surface structure close to the substrate; or, the intermediate is a second porous structure and the second porous structure The porosity is lower than that of the porous surface structure; the protruding structure is formed on the side of the second porous structure close to the substrate; or, the intermediate body includes a middle plate structure formed on the porous surface The side of the surface structure close to the base; the protruding structure is formed on the side of the middle plate structure close to the base. 如請求項1所述的方法,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面;或者,該支撐柱的遠離該基底一側的表面低於該多孔性表面結構的表面;或者,該支撐柱的遠離該基底一側的表面與該多孔性表面結構的表面平齊。 The method as claimed in claim 1, wherein, the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure; or, the surface of the support column on the side away from the substrate is lower than the porous surface the surface of the structure; or, the surface of the support column away from the substrate is flush with the surface of the porous surface structure. 如請求項18所述的方法,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面時,在電阻焊完成後,切割該支撐柱超出該多孔性表面結構的部分。 The method as claimed in claim 18, wherein when the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure, after the resistance welding is completed, cutting the part of the support column that exceeds the porous surface structure . 如請求項18所述的方法,其中,該第一極性電極分成多個電極單體時,該支撐柱位於該多孔性表面結構的預製空隙內,該支撐柱開設一凹槽,用於放置該電極單體,插入後的該電極單體與該支撐柱導電接觸;該支撐柱的表面超出或平齊於或低於該多孔性表面結構的表面,該支撐柱為多孔結構或實心結構。 The method according to claim 18, wherein when the first polarity electrode is divided into a plurality of electrode units, the supporting column is located in the prefabricated space of the porous surface structure, and the supporting column is provided with a groove for placing the The electrode unit is in conductive contact with the supporting column after being inserted; the surface of the supporting column is higher than or equal to or lower than the surface of the porous surface structure, and the supporting column is a porous structure or a solid structure. 如請求項18所述的方法,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面時:該支撐柱為多段結構,至少包含超出該多孔性表面結構的一第一段部分和剩餘的一第二段部分;該第一段部分為多孔結構;該第二段部分為多孔結構或實心結構,該第二段部分上遠離該基底一側的表面平齊於該多孔性表面結構的表面,使得該第一段部分因與該第一極性電極接觸生熱導致該支撐柱下沉至該第二段部分的遠離該基底一側的表面。 The method according to claim 18, wherein, when the surface of the support column away from the substrate exceeds the surface of the porous surface structure: the support column is a multi-segment structure, including at least a first section beyond the porous surface structure A section and a remaining second section; the first section is a porous structure; the second section is a porous structure or a solid structure, and the surface of the second section on the side away from the base is flush with the The surface of the porous surface structure makes the first section part sink to the surface of the second section part away from the base due to heat generated by contacting the first polarity electrode. 如請求項1所述的方法,其中,該支撐柱為導電體時,該支撐柱接入到該電流回路,該支撐柱與以下任意一個或多個部件導電接觸:該第一極性電極、該多孔性表面結構、該中間體。 The method according to claim 1, wherein when the support column is a conductor, the support column is connected to the current loop, and the support column is in conductive contact with any one or more of the following components: the first polarity electrode, the Porous surface structure, the intermediate. 如請求項14-17中任意一項所述的方法,其中,該凸起結構位於該中間體上的位置,靠近該多孔性表面結構與該中間體的接觸位置。 The method according to any one of claims 14-17, wherein the protruding structure is located on the intermediate body, close to the contact position of the porous surface structure and the intermediate body. 如請求項1-22中任意一項所述的方法,其中,該多孔性表面結構內至少部分的孔隙內填充導電材料。 The method according to any one of claims 1-22, wherein at least part of the pores in the porous surface structure are filled with conductive materials. 如請求項24所述的方法,其中,該多孔性表面結構內至少部分的孔隙內填充粉末狀的導電材料或絲材狀的導電材料或網狀的導電材料。 The method according to claim 24, wherein at least part of the pores in the porous surface structure are filled with powdery conductive material or wire-like conductive material or mesh-like conductive material. 如請求項1-22中任意一項所述的方法,其中,該多孔性表面結構的至少部分的表面鋪設固體薄膜狀或絲狀或網狀的一可變形導電介質,該可變形導電介質位於該第一極性電極和該多孔性表面結構之間;和/或,至少部分的該多孔性表面結構的表面與該第一極性電極之間噴塗固態導電介質或液態導電劑。 The method according to any one of claims 1-22, wherein at least part of the surface of the porous surface structure is covered with a deformable conductive medium in the form of a solid film or wire or mesh, and the deformable conductive medium is located at A solid conductive medium or a liquid conductive agent is sprayed between the first polarity electrode and the porous surface structure; and/or, between at least part of the surface of the porous surface structure and the first polarity electrode. 如請求項1-22中任意一項所述的方法,其中,至少部分的該多孔性表面結構的孔隙內注入熔融狀的導電介質,和/或,至少部分的該多孔性表面結構的孔隙內置導電介質並通過高溫使導電介質成熔融狀;該導電介質的熔點低於該基底的熔點和/或該多孔性表面結構的熔點。 The method according to any one of claims 1-22, wherein at least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or at least part of the pores of the porous surface structure are built into The conductive medium is melted by high temperature; the melting point of the conductive medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure. 如請求項1-22中任意一項所述的方法,其中,該基底是實心結構,或者,該基底是一第三多孔結構且該第三多孔結構的孔隙率小於該多孔性表面結構的孔隙率。 The method according to any one of claims 1-22, wherein the substrate is a solid structure, or the substrate is a third porous structure and the porosity of the third porous structure is smaller than that of the porous surface structure porosity. 如請求項28所述的方法,其中,該基底通過鍛造或鑄造或機加工製成。 The method of claim 28, wherein the substrate is made by forging or casting or machining. 如請求項1-22中任意一項所述的方法,其中,該複合體的該多孔性表面結構與該中間體為一體成型。 The method according to any one of claims 1-22, wherein the porous surface structure of the composite body is integrally formed with the intermediate body. 如請求項30所述的方法,其中,該複合體的該多孔性表面結構與該中間體,通過3D列印增材製造製程、或氣相沉澱製程實現。 The method according to claim 30, wherein the porous surface structure of the composite and the intermediate are realized through a 3D printing additive manufacturing process or a vapor deposition process. 如請求項1-22中任意一項所述的方法,其中,該多孔性表面結構、該中間體和該支撐柱一體成型。 The method according to any one of claims 1-22, wherein the porous surface structure, the intermediate body and the supporting pillar are integrally formed. 如請求項1-22中任意一項所述的方法,其中,該多孔性表面結構的表面設置複數個凹槽,該凹槽的表面低於該多孔性表面結構的表面,將該多孔性表面結構劃分成多個區域;經該凹槽劃分出的各區域,均被各區域對應接觸的該第一極性電極覆蓋,與該多孔性表面結構的任意一區域對應接觸的該第一極性電極的邊緣,與鄰近所述任意一區域的該凹槽的位置關係是:該第一極性電極的邊緣,未到達該凹槽的第一側且與該凹槽的第一側不接觸、或到達該凹槽的第一側、或跨過該凹槽的第一側且不超出該凹槽的第二側、或跨過該凹槽的第一側並到達該凹槽的第二側、或跨過該凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,該凹槽的第一側為靠近所述任意一區域的一側,該凹槽的第二側為遠離所述任意一區域的一側。 The method according to any one of claims 1-22, wherein the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porous surface The structure is divided into multiple areas; each area divided by the groove is covered by the first polarity electrode corresponding to each area, and the first polarity electrode corresponding to any area of the porous surface structure The positional relationship between the edge and the groove adjacent to any one of the regions is: the edge of the first polarity electrode does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the the first side of the groove, or across the first side of the groove and not beyond the second side of the groove, or across the first side of the groove and to the second side of the groove, or across the first side of the groove Passing through the second side of the groove and contacting at least a part of another adjacent area; wherein, the first side of the groove is the side close to any one area, and the second side of the groove is away from the other area. One side of any one of the areas mentioned above. 如請求項33所述的方法,其中,該多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的該第一極性電極同時覆蓋;或者,該多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,分別被兩 個不同的該第一極性電極按先後次序分兩次覆蓋;或者,該多孔性表面結構的表面上,經凹槽劃分的相鄰兩區域,被同一個該第一極性電極按先後次序分兩次覆蓋。 The method according to claim 33, wherein, on the surface of the porous surface structure, two adjacent regions divided by grooves are respectively simultaneously covered by two different electrodes of the first polarity whose covering positions do not overlap; Or, on the surface of the porous surface structure, the adjacent two regions divided by the groove are respectively divided by two Two different electrodes of the first polarity are sequentially covered twice; or, on the surface of the porous surface structure, two adjacent areas divided by grooves are divided into two by the same first polarity electrode in sequence. coverage. 如請求項33所述的方法,其中,該凹槽為長條狀。 The method according to claim 33, wherein the groove is in the shape of a strip. 如請求項33所述的方法,其中,該第二極性電極為連續的平面電極;或者,該第二極性電極分為多個區域的該第二極性電極,分別與各個區域相匹配。 The method according to claim 33, wherein the second polarity electrode is a continuous planar electrode; or, the second polarity electrode is divided into a plurality of regions, and the second polarity electrode is respectively matched with each region. 如請求項1-22中任意一項所述的方法,其中,將該多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為一第一區域的多孔結構和一第二區域的多孔結構;該第一區域的多孔結構與對應的該第一區域的該第一極性電極接觸,完成該第一區域的多孔結構與該基底的電阻焊接後,該第一區域的該多孔結構與該第一區域的該第一極性電極的接觸邊緣形成一凸邊;該第二區域的多孔結構與對應的該第二區域的該第一極性電極接觸,該第二區域的該第一極性電極至少覆蓋到該第一區域的多孔結構上靠近該第二區域的多孔結構一側的該凸邊,完成該第二區域的多孔結構與該基底的電阻焊接。 The method according to any one of claims 1-22, wherein the porous surface structure is divided into multiple regions, and any two adjacent regions are divided into a porous structure of a first region and a first region. The porous structure of the second region; the porous structure of the first region is in contact with the first polarity electrode corresponding to the first region, and after the resistance welding of the porous structure of the first region and the substrate is completed, the porous structure of the first region is The contact edge between the porous structure and the electrode of the first polarity in the first region forms a raised edge; the porous structure in the second region is in contact with the electrode of the first polarity corresponding to the second region, and the electrode of the first polarity in the second region contacts A polarity electrode covers at least the convex side of the porous structure in the first region close to the porous structure in the second region to complete resistance welding between the porous structure in the second region and the substrate. 如請求項37所述的方法,其中,該第二極性電極為連續的平面電極; 或者,該第二極性電極分為多個區域的該第二極性電極,分別與各個區域相匹配。 The method of claim 37, wherein the second polarity electrode is a continuous planar electrode; Alternatively, the second polarity electrode is divided into a plurality of regions, and the second polarity electrode is respectively matched with each region. 如請求項13-15中任意一項所述的方法,其中,該基底包含一表面連接層,該底表面連接層與該基底的主體預先連接,該表面連接層介於該複合體的該中間體與該基底的主體之間;該表面連接層包含一凸起結構,該凸起結構的凸點與該複合體的該中間體接觸。 The method of any one of claims 13-15, wherein the substrate comprises a surface tie layer, the bottom surface tie layer is pre-bonded to the main body of the substrate, the surface tie layer is interposed in the middle of the composite Between the body and the main body of the substrate; the surface connection layer includes a raised structure, and the bumps of the raised structure are in contact with the intermediate body of the composite body. 如請求項39所述的方法,其中,該表面連接層與該基底的主體預先焊接連接。 The method of claim 39, wherein the surface connection layer is pre-welded to the main body of the substrate. 如請求項39所述的方法,其中,該中間體上靠近該基底的一側為平面狀;或者,該中間體上靠近該基底的一側設置的複數個凸起結構與該表面連接層的該凸起結構錯開。 The method according to claim 39, wherein, the side of the intermediate body close to the base is planar; or, the plurality of raised structures disposed on the side of the intermediate close to the base and the surface connection layer The raised structures are staggered. 一種用於製備連接結構的方法,其中,該方法包含以下過程:採用如請求項1-41中任意一項所述方法提供至少兩個複合體,包含一第一複合體和一第二複合體;一第一極性電極和一第二極性電極之間設置該第一複合體、一基底和該第二複合體;該第一複合體置於該第一極性電極與該基底之間,該第一複合體中的一中間體與該基底接觸;該第二複合體置於該第二極性電極與該基底之間,該第二複合體中的該中間體與該基底接觸; 該支撐柱為導電體時,該第一極性電極與該第一複合體中的一多孔性表面結構、支撐柱、該中間體之中的至少一個導電接觸,該第二極性電極與該第二複合體中的該多孔性表面結構、支撐柱、該中間體之中的至少一個導電接觸,用以形成一電流回路;該支撐柱為絕緣體時,該第一極性電極與該第一複合體中的一多孔性表面結構、該中間體之中的至少一個導電接觸,該第二極性電極與該第二複合體中的一多孔性表面結構、該中間體之中的至少一個導電接觸,用以形成一電流回路;該第一複合體的該中間體與該基底,以及該第二複合體的該中間體與該基底進行電阻焊接,實現該複合體與該基底的連接。 A method for preparing a connection structure, wherein the method comprises the following process: using a method as described in any one of claims 1-41 to provide at least two complexes, including a first complex and a second complex ; The first composite body, a substrate and the second composite body are arranged between a first polarity electrode and a second polarity electrode; the first composite body is placed between the first polarity electrode and the substrate, and the first composite body is placed between the first polarity electrode and the substrate. an intermediate in a composite is in contact with the substrate; the second composite is placed between the second polarity electrode and the substrate, the intermediate in the second composite is in contact with the substrate; When the support column is a conductor, the first polarity electrode is in conductive contact with at least one of a porous surface structure in the first composite body, the support column, and the intermediate body, and the second polarity electrode is in contact with the first polarity electrode. At least one of the porous surface structure, the support column, and the intermediate body in the two composites is in conductive contact to form a current loop; when the support column is an insulator, the first polarity electrode and the first composite body A porous surface structure in the body, at least one conductive contact among the intermediate body, the second polarity electrode is in conductive contact with a porous surface structure in the second composite body, at least one of the intermediate body , to form a current loop; the intermediate body of the first composite body and the substrate, and the intermediate body of the second composite body and the substrate are resistance welded to realize the connection between the composite body and the substrate. 如請求項42所述的方法,其中,採用如請求項1-41中任意一項所述的方法得到該第一複合體的方法稱為第一方法,採用如請求項1-41中任意一項所述的方法得到該第二複合體的方法稱為第二方法,該第一方法與該第二方法相同或不同。 The method as described in claim item 42, wherein, the method for obtaining the first complex as described in any one of claim items 1-41 is called the first method, and adopting any one of claim items 1-41 The method for obtaining the second complex is called the second method, and the first method is the same as or different from the second method. 一種多孔性表面結構和基底的連接結構,其中,包含:一複合體,包含預先連接或一體成型的一多孔性表面結構、一中間體、多個支撐柱;每個該支撐柱的全部或至少部分位於該多孔性表面結構內;一基底,與該中間體接觸,該中間體位於該多孔性表面結構與該基底之間;該支撐柱為導電體時,該基底與該複合體置於一第一極性電極和一第二極性電極之間,通過該第一極性電極與該多孔性表面結構、該支撐柱、該中間體之中的至少一個導電接觸,以及該基底與該第二極性電極導電接觸,形成一電流回路,使得該中間體和該基底進行電阻焊接,實現該複合體與該基底的連接; 或者,該支撐柱為絕緣體時,該基底與該複合體置於一第一極性電極和一第二極性電極之間,通過該第一極性電極與該多孔性表面結構、該中間體之中的至少一個導電接觸,以及該基底與該第二極性電極導電接觸,形成一電流回路,使得該中間體和該基底進行電阻焊接,實現該複合體與該基底的連接。 A connection structure between a porous surface structure and a substrate, including: a composite body, including a pre-connected or integrally formed porous surface structure, an intermediate body, and a plurality of support columns; all or all of each support column At least partly located in the porous surface structure; a substrate, in contact with the intermediate body, the intermediate body is located between the porous surface structure and the substrate; when the support column is an electrical conductor, the substrate and the composite body are placed Between an electrode of a first polarity and an electrode of a second polarity, the first polarity electrode is in contact with at least one of the porous surface structure, the support column, and the intermediate body, and the substrate is in contact with the second polarity The electrodes are in conductive contact to form a current loop, so that the intermediate body and the substrate are resistance welded to realize the connection between the composite body and the substrate; Or, when the supporting column is an insulator, the substrate and the complex are placed between a first polarity electrode and a second polarity electrode, and the first polarity electrode and the porous surface structure, the intermediate body At least one conductive contact, and the conductive contact between the base and the second polarity electrode form a current loop, so that the intermediate body and the base are subjected to resistance welding to realize the connection between the complex and the base. 如請求項44所述的連接結構,其中,該複合體中的該多孔性表面結構稱為一第一多孔結構;該中間體是實心結構,或者,該中間體是一第二多孔結構並且該第二多孔結構的孔隙率低於該第一多孔結構的孔隙率。 The connection structure as claimed in claim 44, wherein the porous surface structure in the composite is called a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure And the porosity of the second porous structure is lower than the porosity of the first porous structure. 如請求項44所述的連接結構,其中,該基底、該多孔性表面結構、該間體由導電材料製成。 The connection structure according to claim 44, wherein the substrate, the porous surface structure, and the intermediate body are made of conductive materials. 如請求項45所述的連接結構,其中,該中間體包含一中間板結構。 The connecting structure as claimed in claim 45, wherein the intermediate body comprises an intermediate plate structure. 如請求項47所述的連接結構,其中,該中間板結構上設置多個凸起結構,該凸起結構設置在該中間板結構上靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The connecting structure as claimed in item 47, wherein a plurality of protruding structures are arranged on the intermediate plate structure, and the protruding structures are arranged on the side of the intermediate plate structure close to the base, and the protruding points of the protruding structures are in contact with the The substrate contacts. 如請求項45所述的連接結構,其中,該中間體是該第二多孔結構,該第二多孔結構包含多個凸起結構,該凸起結構形成在該第二多孔結構上靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The connection structure according to claim 45, wherein the intermediate body is the second porous structure, the second porous structure includes a plurality of protruding structures, and the protruding structures are formed on the second porous structure close to On one side of the base, the bumps of the raised structure are in contact with the base. 如請求項45所述的連接結構,其中, 該中間體包含複數個分散佈置的凸起結構,形成在該多孔性表面結構靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The connection structure as claimed in claim 45, wherein, The intermediate body comprises a plurality of protruding structures dispersedly arranged on the side of the porous surface structure close to the substrate, and the protruding points of the protruding structures are in contact with the substrate. 如請求項44所述的連接結構,其中,該支撐柱與該中間體的一凸起結構對應佈置並接觸,或該支撐柱與該中間體的該凸起結構錯位分佈且不接觸;該凸起結構的凸點與該基底接觸;其中,該凸起結構形成在該述多孔性表面結構上靠近該基底的一側;或者,該中間體是一第二多孔結構並且該第二多孔結構的孔隙率低於該多孔性表面結構的孔隙率;該凸起結構形成在該第二多孔結構上靠近該基底的一側;或者,該中間體包含的一中間板結構,形成在該多孔性表面結構上靠近該基底的一側;該凸起結構形成在該中間板結構上靠近該基底的一側。 The connecting structure according to claim 44, wherein, the support column is arranged correspondingly to and in contact with a protruding structure of the intermediate body, or the support column is dislocated and not in contact with the protruding structure of the intermediate body; The bumps of the raised structure are in contact with the substrate; wherein, the raised structure is formed on the side of the porous surface structure close to the substrate; or, the intermediate is a second porous structure and the second porous The porosity of the structure is lower than the porosity of the porous surface structure; the protruding structure is formed on the side of the second porous structure close to the substrate; or, an intermediate plate structure included in the intermediate body is formed on the The side of the porous surface structure close to the base; the protruding structure is formed on the side of the middle plate structure close to the base. 如請求項44所述的連接結構,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面;或者,該支撐柱的遠離該基底一側的表面低於該多孔性表面結構的表面;或者,該支撐柱的遠離該基底一側的表面與該多孔性表面結構的表面平齊。 The connection structure as claimed in claim 44, wherein, the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure; or, the surface of the support column on the side away from the substrate is lower than the porosity the surface of the surface structure; or, the surface of the support column away from the substrate is flush with the surface of the porous surface structure. 如請求項52所述的連接結構,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面時,在電阻焊完成後,切割該支撐柱超出該多孔性表面結構的部分。 The connection structure as claimed in claim 52, wherein, when the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure, after the resistance welding is completed, cutting the support column beyond the surface of the porous surface structure part. 如請求項52所述的連接結構,其中, 該支撐柱位於該多孔性表面結構的預製空隙內,該支撐柱開設一凹槽,用於放置該第一極性電極中的多個電極單體,插入後的該電極單體與該支撐柱導電接觸;該支撐柱為多孔結構或實心結構。 The connection structure as claimed in claim 52, wherein, The support column is located in the prefabricated void of the porous surface structure, and the support column defines a groove for placing a plurality of electrode units in the first polarity electrode, and the inserted electrode units conduct electricity with the support column contact; the support column is a porous structure or a solid structure. 如請求項52所述的連接結構,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面時:該支撐柱為多段結構,至少包含超出該多孔性表面結構的一第一段部分和剩餘的一第二段部分;該第一段部分為多孔結構;該第二段部分為多孔結構或實心結構,該第二段部分上遠離該基底一側的表面平齊於該多孔性表面結構的表面,使得該第一段部分因與該第一極性電極接觸生熱導致該支撐柱下沉至該第二段部分的遠離該基底一側的表面。 The connection structure according to claim 52, wherein, when the surface of the support column away from the substrate exceeds the surface of the porous surface structure: the support column is a multi-segment structure, including at least one section beyond the porous surface structure The first section and the remaining one second section; the first section is a porous structure; the second section is a porous structure or a solid structure, and the surface on the side of the second section away from the base is flush with the The surface of the porous surface structure is such that the first segment generates heat due to contact with the first polarity electrode, causing the support column to sink to the surface of the second segment that is away from the base. 如請求項44所述的連接結構,其中,該支撐柱為導電體時,該支撐柱接入到該電流回路,該支撐柱與以下任意一個或多個部件導電接觸:該第一極性電極、該多孔性表面結構、該中間體。 The connection structure according to claim 44, wherein when the support column is a conductor, the support column is connected to the current loop, and the support column is in conductive contact with any one or more of the following components: the first polarity electrode, The porous surface structure, the intermediate. 如請求項48-50、51中任意一項所述的連接結構,其中,該凸起結構位於該中間體上的位置,靠近該多孔性表面結構與該中間體的接觸位置。 The connecting structure according to any one of claims 48-50, 51, wherein the protruding structure is located on the intermediate body, close to the contact position between the porous surface structure and the intermediate body. 如請求項44-56中任意一項所述的連接結構,其中,該多孔性表面結構內至少部分的孔隙內填充導電材料。 The connection structure according to any one of claims 44-56, wherein at least part of the pores in the porous surface structure are filled with conductive materials. 如請求項58所述的連接結構,其中, 該多孔性表面結構內至少部分的孔隙內填充粉末狀的導電材料。 The connection structure of claim 58, wherein, At least part of the pores in the porous surface structure are filled with powdery conductive material. 如請求項44-56中任意一項所述的連接結構,其中,該多孔性表面結構的至少部分的表面鋪設固體薄膜狀的一可變形導電介質,該可變形導電介質位於該第一極性電極和該多孔性表面結構之間;和/或,至少部分的該多孔性表面結構的表面與該第一極性電極之間噴塗固態導電介質或液態導電劑。 The connection structure according to any one of claims 44-56, wherein at least part of the surface of the porous surface structure is covered with a deformable conductive medium in the form of a solid film, and the deformable conductive medium is located on the first polarity electrode and between the porous surface structure; and/or, between at least part of the surface of the porous surface structure and the first polarity electrode by spraying a solid conductive medium or a liquid conductive agent. 如請求項44-56中任意一項所述的連接結構,其中,至少部分的該多孔性表面結構的孔隙內注入熔融狀的一導電介質,和/或,至少部分的該多孔性表面結構的孔隙內置該導電介質並通過高溫使該導電介質成熔融狀;該導電介質的熔點低於該基底的熔點和/或該多孔性表面結構的熔點。 The connection structure according to any one of claims 44-56, wherein at least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or at least part of the porous surface structure The conductive medium is built into the pores and the conductive medium is melted by high temperature; the melting point of the conductive medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure. 如請求項44-56中任意一項所述的連接結構,其中,該基底是實心結構,或者,該基底是一第三多孔結構且該第三多孔結構的孔隙率小於該多孔性表面結構的孔隙率。 The connection structure according to any one of claims 44-56, wherein the substrate is a solid structure, or the substrate is a third porous structure and the porosity of the third porous structure is smaller than that of the porous surface The porosity of the structure. 如請求項62所述的連接結構,其中,該基底通過鍛造或鑄造或機加工或粉末冶金或金屬注塑製程製成。 The connecting structure as claimed in claim 62, wherein the substrate is made by forging or casting or machining or powder metallurgy or metal injection molding process. 如請求項44-56中任意一項所述的連接結構,其中,該複合體的該多孔性表面結構與該中間體一體成型。 The connection structure according to any one of claims 44-56, wherein the porous surface structure of the composite body is integrally formed with the intermediate body. 如請求項64所述的連接結構,其中,該複合體的該多孔性表面結構與該中間體,通過3D列印增材製造製程、或氣相沉澱製程實現。 The connection structure as claimed in claim 64, wherein the porous surface structure of the composite and the intermediate are realized through a 3D printing additive manufacturing process or a vapor deposition process. 如請求項44-56中任意一項所述的連接結構,其中,該多孔性表面結構、該中間體和該支撐柱一體成型。 The connection structure according to any one of claims 44-56, wherein the porous surface structure, the intermediate body and the supporting column are integrally formed. 如請求項44-56中任意一項所述的連接結構,其中,該多孔性表面結構的表面設置複數個凹槽,該凹槽的表面低於該多孔性表面結構的表面,將該多孔性表面結構劃分成多個區域;經該凹槽劃分出的各區域,均被各區域對應接觸的該第一極性電極覆蓋,與該多孔性表面結構的任意一區域對應接觸的該第一極性電極的邊緣,與鄰近所述任意一區域的該凹槽的位置關係是:該第一極性電極的邊緣,未到達該凹槽的第一側且與該凹槽的第一側不接觸、或到達該凹槽的第一側、或跨過該凹槽的第一側且不超出該凹槽的第二側、或跨過該凹槽的第一側並到達該凹槽的第二側、或跨過該凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,該凹槽的第一側為靠近所述任意一區域的一側,該凹槽的第二側為遠離所述任意一區域的一側。 The connection structure according to any one of claims 44-56, wherein the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porous The surface structure is divided into multiple areas; each area divided by the groove is covered by the first polarity electrode corresponding to each area, and the first polarity electrode corresponding to any area of the porous surface structure The positional relationship between the edge of the edge and the groove adjacent to any one of the regions is: the edge of the first polarity electrode does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or across the first side of the groove and not beyond the second side of the groove, or across the first side of the groove and to the second side of the groove, or Across the second side of the groove and contact at least a part of another adjacent area; wherein, the first side of the groove is the side close to any one area, and the second side of the groove is away from One side of any one of the regions. 如請求項67所述的連接結構,其中,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的該第一極性電極同時覆蓋;或者,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,分別被兩個不同的該第一極性電極按先後次序分兩次覆蓋;或者,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,被同一個該第一極性電極按先後次序分兩次覆蓋。 The connecting structure according to claim 67, wherein, on the surface of the porous surface structure, two adjacent regions divided by the groove are respectively covered by two different electrodes of the first polarity whose positions do not overlap. or, on the surface of the porous surface structure, the two adjacent areas divided by the groove are respectively covered twice by two different electrodes of the first polarity in sequence; or, the porous surface structure On the surface, two adjacent areas divided by the groove are covered twice by the same first polarity electrode sequentially. 如請求項67所述的連接結構,其中,該凹槽為長條狀。 The connection structure according to claim 67, wherein the groove is in the shape of a strip. 如請求項44-56中任意一項所述的連接結構,其中,將該多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為一第一區域的多孔結構和一第二區域的多孔結構;該第一區域的多孔結構與對應的該第一區域的該第一極性電極接觸,完成該第一區域的多孔結構與該基底的電阻焊接後,該第一區域的多孔結構與該第一區域的該第一極性電極的接觸邊緣形成一凸邊;該第二區域的多孔結構與對應的該第二區域的該第一極性電極接觸,該第二區域的該第一極性電極至少覆蓋到該第一區域的多孔結構上靠近該第二區域的多孔結構一側的該凸邊,完成該第二區域的多孔結構與該基底的電阻焊接。 The connection structure as described in any one of claims 44-56, wherein the porous surface structure is divided into multiple regions, and any two adjacent regions are divided into a porous structure of a first region and a The porous structure of the second region; the porous structure of the first region is in contact with the first polarity electrode corresponding to the first region, and after the resistance welding of the porous structure of the first region and the substrate is completed, the porous structure of the first region is The contact edge between the porous structure and the electrode of the first polarity in the first region forms a raised edge; the porous structure in the second region is in contact with the electrode of the first polarity corresponding to the second region, and the electrode of the first polarity in the second region contacts A polarity electrode covers at least the convex side of the porous structure in the first region close to the porous structure in the second region to complete resistance welding between the porous structure in the second region and the substrate. 如請求項44-56中任意一項所述的連接結構,其中,該基底包含一表面連接層,該表面連接層與該基底的主體預先連接,該表面連接層介於該複合體的該中間體與該基底的主體之間;該表面連接層包含一凸起結構,該表面連接層的該凸起結構的凸點與該複合體的該中間體接觸。 The connection structure according to any one of claims 44-56, wherein the substrate comprises a surface connection layer, the surface connection layer is pre-connected to the main body of the substrate, and the surface connection layer is interposed in the middle of the composite Between the body and the main body of the substrate; the surface connection layer includes a raised structure, and the bumps of the raised structure of the surface connection layer are in contact with the intermediate body of the composite body. 如請求項71所述的連接結構,其中,該基底的該表面連接層與該基底的主體預先焊接連接。 The connection structure as claimed in claim 71, wherein the surface connection layer of the substrate is pre-welded to the main body of the substrate. 如請求項71所述的連接結構,其中,該中間體上靠近該基底的一側為平面狀;或者,該中間體上靠近該基底的一側設置的該凸起結構與該表面連接層的該凸起結構錯開。 The connection structure according to claim 71, wherein, the side of the intermediate body close to the base is planar; or, the protrusion structure disposed on the side of the intermediate body close to the base and the surface connection layer The raised structures are staggered. 一種多孔性表面結構和基底的連接結構,其中,包含兩個複合體, 分別為一第一複合體和一第二複合體,是如請求項44-73中任意一項所述連接結構中的任意兩個複合體;該第一複合體、該第二複合體,各自包含預先連接或一體成型的一多孔性表面結構、一中間體、多個支撐柱;每個該支撐柱的全部或至少部分位於該多孔性表面結構內;該第一複合體、一基底和該第二複合體設置在一第一極性電極和一第二極性電極之間;該第一複合體置於該第一極性電極與該基底之間,該第一複合體中的該中間體與該基底接觸;該第二複合體置於該第二極性電極與該基底之間,該第二複合體中的該中間體與該基底接觸;該支撐柱為導電體時,該第一極性電極與該第一複合體中的該多孔性表面結構、該支撐柱、該中間體之中的至少一個導電接觸,該第二極性電極與該第二複合體中的該多孔性表面結構、該支撐柱、該中間體之中的至少一個導電接觸,用以形成一電流回路;該支撐柱為絕緣體時,該第一極性電極與該第一複合體中的一多孔性表面結構、該中間體之中的至少一個導電接觸,該第二極性電極與該第二複合體中的一多孔性表面結構、該中間體之中的至少一個導電接觸,用以形成一電流回路;該第一複合體的該中間體與該基底,以及該第二複合體中的該中間體與該基底進行電阻焊接,實現該複合體與該基底的連接。 A connection structure of a porous surface structure and a substrate, wherein, comprising two complexes, Respectively a first complex and a second complex, which are any two complexes in the connection structure described in any one of claim items 44-73; the first complex and the second complex, respectively It includes a porous surface structure, an intermediate body, and a plurality of supporting columns that are pre-connected or integrally formed; all or at least part of each of the supporting columns is located in the porous surface structure; the first composite body, a substrate and The second composite body is arranged between a first polarity electrode and a second polarity electrode; the first composite body is placed between the first polarity electrode and the substrate, the intermediate in the first composite body and the The substrate is in contact; the second composite is placed between the second polarity electrode and the substrate, and the intermediate in the second composite is in contact with the substrate; when the support column is a conductor, the first polarity electrode In conductive contact with at least one of the porous surface structure in the first complex, the support column, and the intermediate body, the second polarity electrode is in contact with the porous surface structure in the second complex, the support At least one conductive contact among the column and the intermediate body is used to form a current loop; when the supporting column is an insulator, the first polarity electrode and a porous surface structure in the first composite body, the intermediate body At least one conductive contact among them, the second polarity electrode is in conductive contact with a porous surface structure in the second composite body, at least one conductive contact among the intermediate body, to form a current loop; the first composite The intermediate body of the body and the substrate, and the intermediate body in the second composite body and the substrate are subjected to resistance welding to realize the connection between the composite body and the substrate. 如請求項74所述的連接結構,其中,該第一複合體和該第二複合體的結構相同;或者,該第一複合體和該第二複合體的結構不同。 The connection structure according to claim 74, wherein the first composite body and the second composite body have the same structure; or, the first composite body and the second composite body have different structures. 一種製備裝置,用於製備如請求項44-73中任意一項所述多孔性表面結構和基底的連接結構,其中形成一複合體,該複合體包含預先連接或 一體成型的一多孔性表面結構、一中間體、多個支撐柱;每個該支撐柱的全部或至少部分位於該多孔性表面結構內;該製備裝置包含:一第一極性電極,該支撐柱為導電體時,一第一極性電極與一複合體中的一多孔性表面結構、一支撐柱、一中間體之中的至少一個導電接觸;該支撐柱為絕緣體時,一第一極性電極與一複合體中的一多孔性表面結構、一中間體之中的至少一個導電接觸;一第二極性電極,其與一基底導電接觸,該中間體位於該多孔性表面結構與該基底之間,該中間體與該基底接觸,該基底與該複合體置於該第一極性電極和該第二極性電極之間,使得該中間體和該基底進行電阻焊接,實現該複合體與該基底的連接。 A preparation device for preparing a connection structure of a porous surface structure and a substrate as described in any one of claim items 44-73, wherein a composite is formed, and the composite includes pre-connected or A porous surface structure, an intermediate body, and a plurality of support columns are integrally formed; all or at least part of each support column is located in the porous surface structure; the preparation device includes: a first polarity electrode, the support When the column is a conductor, a first polarity electrode is in conductive contact with at least one of a porous surface structure, a support column, and an intermediate in a composite; when the support column is an insulator, a first polarity electrode The electrode is in conductive contact with at least one of a porous surface structure and an intermediate in a composite; a second polarity electrode is in conductive contact with a substrate, and the intermediate is located between the porous surface structure and the substrate Between, the intermediate body is in contact with the substrate, and the substrate and the composite body are placed between the first polarity electrode and the second polarity electrode, so that the intermediate body and the substrate are resistance welded to realize the composite body and the composite body base connection. 如請求項76所述的製備裝置,其中,該電阻焊接為凸焊式電阻焊和/或點焊式電阻焊。 The manufacturing device according to claim 76, wherein the resistance welding is projection welding resistance welding and/or spot welding resistance welding. 如請求項77所述的製備裝置,其中,當該電阻焊接為凸焊式電阻焊時,該第一極性電極是連續的平面電極或分段的多個電極單體,該第二極性電極是連續的平面電極或分段的多個電極單體;當該電阻焊接為點焊式電阻焊時,該第一極性電極和/或該第二極性電極是分段的多個電極單體。 The manufacturing device as claimed in item 77, wherein, when the resistance welding is projection welding resistance welding, the first polarity electrode is a continuous planar electrode or a plurality of segmented electrode monomers, and the second polarity electrode is A continuous planar electrode or a plurality of segmented electrode monomers; when the resistance welding is spot welding resistance welding, the first polarity electrode and/or the second polarity electrode are segmented plurality of electrode monomers. 如請求項77所述的製備裝置,其中,點焊式電阻焊時,通過移動以下任意一個或多個部件,使得從當前焊接位置移動到下一焊接位置:該第一極性電極、第該二極性電極、已在至少一個接觸位置完成焊接的該中間體與該基底的結合體。 The manufacturing device according to claim 77, wherein during spot welding resistance welding, any one or more of the following components is moved to move from the current welding position to the next welding position: the first polarity electrode, the second polarity electrode Combination of polarized electrodes, the intermediate body and the substrate having been welded at least one contact location. 如請求項76-79中任意一項所述的製備裝置,其中,該第一極性電極分成多個電極單體時,該電極單體插入至該多孔性表面結構內的預製空隙,該電極單體靠近該中間體,使得插入後的該電極單體與該中間體導電接觸或者使得插入後的該電極單體經過該多孔性表面結構與該中間體導電接觸。 The preparation device according to any one of claim items 76-79, wherein when the first polarity electrode is divided into a plurality of electrode units, the electrode units are inserted into the prefabricated gaps in the porous surface structure, and the electrode units The body is close to the intermediate body, so that the inserted electrode monomer is in conductive contact with the intermediate body or the inserted electrode monomer is in conductive contact with the intermediate body through the porous surface structure. 如請求項80所述的製備裝置,其中,該電極單體從該多孔性表面結構的表面穿過直至穿透至該中間體的表面或該中間體的內部,使得插入後的該電極單體與該中間體導電接觸。 The preparation device as claimed in claim 80, wherein the electrode monomer penetrates from the surface of the porous surface structure until it penetrates to the surface of the intermediate body or the interior of the intermediate body, so that the inserted electrode monomer Make conductive contact with the intermediate body. 如請求項80所述的製備裝置,其中,該電極單體與該多孔性表面結構為側向間隙配合,使得該電極單體與該多孔性表面結構完全不接觸。 The preparation device according to claim 80, wherein the electrode unit and the porous surface structure are laterally spaced, so that the electrode unit does not contact the porous surface structure at all. 如請求項80所述的製備裝置,其中,該多個電極單體並聯連接至另一平面電極且該另一平面電極與電源端連接,或者,該多個電極單體並聯並直接連接至電源端。 The preparation device according to claim 80, wherein the plurality of electrode units are connected in parallel to another planar electrode and the other planar electrode is connected to a power supply terminal, or, the plurality of electrode units are connected in parallel and directly connected to the power supply end. 如請求項76-79中任意一項所述的製備裝置,其中,該第一極性電極為一柔性電極,該柔性電極在壓力作用下,通過柔性變形使得其與該多孔性表面結構的表面相匹配,增大該柔性電極與該多孔性表面結構的表面的接觸面積。 The preparation device according to any one of claim items 76-79, wherein the first polarity electrode is a flexible electrode, and the flexible electrode is deformed flexibly under pressure so that it is in contact with the surface of the porous surface structure Matching increases the contact area between the flexible electrode and the surface of the porous surface structure. 如請求項76所述的製備裝置,其中,該第一極性電極為正電極,該第二極性電極為負電極;或者,該第一極性電極為負電極,該第二極性電極為正電極。 The preparation device according to claim 76, wherein the electrode of the first polarity is a positive electrode and the electrode of the second polarity is a negative electrode; or, the electrode of the first polarity is a negative electrode and the electrode of the second polarity is a positive electrode. 如請求項76所述的製備裝置,其中,該一極性電極和該第二極性電極由導電材料製成;該第二極性電極為連續的平面電極;或者,該第二極性電極分為多個區域的該第二極性電極,分別與各個區域相匹配。 The preparation device as described in claim 76, wherein, the electrode of one polarity and the electrode of the second polarity are made of conductive materials; the electrode of the second polarity is a continuous planar electrode; or, the electrode of the second polarity is divided into a plurality of The second polarity electrodes of the regions are respectively matched with the respective regions. 如請求項76-79、85-86中任意一項所述的製備裝置,其中,該多孔性表面結構的表面設置複數個凹槽,該凹槽的表面低於該多孔性表面結構的表面,將該多孔性表面結構劃分成多個區域;經該凹槽劃分出的各區域,均被各區域對應接觸的該第一極性電極覆蓋,與該多孔性表面結構的任意一區域對應接觸的該第一極性電極的邊緣,與鄰近所述任意一區域的該凹槽的位置關係是以下是:該第一極性電極的邊緣,未到達該凹槽的第一側且與該凹槽的第一側不接觸、或到達該凹槽的第一側、或跨過該凹槽的第一側且不超出該凹槽的第二側、或跨過該凹槽的第一側並到達凹槽的第二側、或跨過該凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,該凹槽的第一側為靠近所述任意一區域的一側,該凹槽的第二側為遠離所述任意一區域的一側。 The preparation device according to any one of claims 76-79, 85-86, wherein the surface of the porous surface structure is provided with a plurality of grooves, and the surface of the grooves is lower than the surface of the porous surface structure, The porous surface structure is divided into a plurality of regions; each region divided by the groove is covered by the first polarity electrode correspondingly in contact with each region, and the first polarity electrode correspondingly in contact with any region of the porous surface structure The positional relationship between the edge of the first polarity electrode and the groove adjacent to the arbitrary region is as follows: the edge of the first polarity electrode does not reach the first side of the groove and is connected to the first side of the groove. side does not touch, or reach the first side of the groove, or across the first side of the groove and not beyond the second side of the groove, or across the first side of the groove and reach the first side of the groove The second side, or across the second side of the groove and in contact with at least a part of another adjacent area; wherein, the first side of the groove is the side close to any one area, and the groove's The second side is a side away from any one of the regions. 如請求項87所述的製備裝置,其中,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的該第一極性電極同時覆蓋;或者,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,分別被兩個不同的該第一極性電極按先後次序分兩次覆蓋;或者,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,被同一個該第一極性電極按先後次序分兩次覆蓋。 The preparation device according to claim 87, wherein, on the surface of the porous surface structure, two adjacent regions divided by the groove are respectively covered by two different electrodes of the first polarity whose positions do not overlap. or, on the surface of the porous surface structure, the two adjacent areas divided by the groove are respectively covered twice by two different electrodes of the first polarity in sequence; or, the porous surface structure On the surface, two adjacent areas divided by the groove are covered twice by the same first polarity electrode sequentially. 如請求項76-79、85-86中任意一項所述的製備裝置,其中,將該多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為一第一區域的多孔結構和一第二區域的多孔結構;該第一區域的多孔結構與對應的該第一區域的該第一極性電極接觸,完成該第一區域的多孔結構與該基底的電阻焊接後,該第一區域的多孔結構與該第一區域的該第一極性電極的接觸邊緣形成一凸邊;該第二區域的多孔結構與對應的該第二區域的該第一極性電極接觸,該第二區域的該第一極性電極至少覆蓋到該第一區域的多孔結構上靠近該第二區域的多孔結構一側的該凸邊,完成該第二區域的多孔結構與該基底的電阻焊接。 The preparation device as described in any one of claims 76-79, 85-86, wherein the porous surface structure is divided into multiple regions, and any two adjacent regions divided are called a first region. A porous structure and a porous structure in a second region; the porous structure in the first region is in contact with the first polarity electrode corresponding to the first region, and after the resistance welding between the porous structure in the first region and the substrate is completed, the The porous structure of the first region forms a convex edge with the contact edge of the first polarity electrode of the first region; the porous structure of the second region contacts the corresponding first polarity electrode of the second region, and the second The first polarity electrode of the region at least covers the convex edge on the porous structure of the first region close to the porous structure of the second region, completing the resistance welding of the porous structure of the second region and the substrate. 一種假體,其中,設置一連接結構,該連接結構包含:一複合體,包含預先連接的一多孔性表面結構、一中間體、多個支撐柱;每個該支撐柱的全部或至少部分位於該多孔性表面結構內;一基底,用於形成一假體主體,該假體主體的至少部分表面作為連接區域,用於與該複合體連接,該中間體位於該多孔性表面結構與該基底之間,該中間體與該假體主體的連接區域相連接,使得該多孔性表面結構位於該假體主體的連接區域。 A prosthesis, wherein a connection structure is provided, and the connection structure includes: a composite body, including a pre-connected porous surface structure, an intermediate body, and a plurality of support columns; all or at least part of each support column Located in the porous surface structure; a base, used to form a prosthesis body, at least part of the surface of the prosthesis body as a connection area, used to connect with the composite body, the intermediate body is located between the porous surface structure and the Between the substrates, the intermediate body is connected to the connection area of the prosthesis body, so that the porous surface structure is located in the connection area of the prosthesis body. 如請求項90所述的假體,其中,該支撐柱為導電體時,該基底與該複合體置於一第一極性電極和一第二極性電極之間,通過該第一極性電極與該多孔性表面結構、該支撐柱、該中間體之中的至少一個導電接觸,以及該基底與該第二極性電極導電接觸,形成一電流回路,使得該中間體和該基底進行電阻焊接,實現該複合體與該基底的連接。 The prosthesis as claimed in claim 90, wherein, when the supporting pillar is an electrical conductor, the base and the composite body are placed between a first polarity electrode and a second polarity electrode, and the first polarity electrode and the At least one conductive contact among the porous surface structure, the supporting column, the intermediate body, and the conductive contact between the substrate and the second polarity electrode form a current loop, so that the intermediate body and the substrate are resistance welded to realize the Linkage of the complex to the substrate. 如請求項90所述的假體,其中,該假體是關節假體。 The prosthesis of claim 90, wherein the prosthesis is a joint prosthesis. 如請求項90所述的假體,其中,該複合體形成為一殼體,包覆在該假體主體的連接區域上;該殼體的外層包含該多孔性表面結構;該殼體的內層包含該中間體,其與該假體主體的連接區域連接。 The prosthesis as claimed in claim 90, wherein the composite body is formed as a shell covering the connecting region of the prosthesis body; the outer layer of the shell contains the porous surface structure; the inner layer of the shell The intermediate body is included and attached to the attachment region of the prosthesis body. 如請求項93所述的假體,其中,該複合體形成的該殼體是一個整體;或者,該複合體形成的該殼體包含多個殼體片體;其中,該多個殼體片體相互獨立,或者相鄰的該殼體片體之間在至少一側的鄰邊相連接。 The prosthesis as claimed in claim 93, wherein the shell formed by the composite body is a whole; or, the shell formed by the composite body comprises a plurality of shell pieces; wherein the multiple shell pieces The bodies are independent of each other, or the adjacent shell bodies are connected on at least one adjacent edge. 如請求項90所述的假體,其中,該假體包含一髖關節的一股骨柄,該股骨柄包含一柄體,其形成為該基底;所述連接區域的位置為該柄體的上部的表面。 Prosthesis as claimed in claim 90, wherein the prosthesis comprises a femoral stem of a hip joint, the femoral stem comprises a stem formed as the base; the position of the connecting region is the upper part of the stem s surface. 如請求項95所述的假體,其中,該柄體的下部的表面為光滑表面,該柄體的下部開設複數個縱向的溝槽,該柄體的下部插入一股骨髓腔。 The prosthesis as claimed in claim 95, wherein the surface of the lower part of the handle body is a smooth surface, a plurality of longitudinal grooves are opened in the lower part of the handle body, and the lower part of the handle body is inserted into a bone marrow cavity. 如請求項95所述的假體,其中,該股骨柄還包含一頭部和一頸部,該頭部、該頸部和該柄體是一體的或是組裝形成;該股骨柄的該頭部為錐台結構,其第一端通過該頸部與該柄體連接,該頭部與該頸部相對該柄體有一定的偏轉角度,以相對於該柄體一側傾斜的形 式佈置,該股骨柄的該頭部的第二端插入至一股骨球頭。 The prosthesis as claimed in claim 95, wherein the femoral stem also includes a head and a neck, and the head, the neck and the handle are integral or assembled; the head of the femoral stem The head is a frustum of cone structure, the first end of which is connected to the handle through the neck, and the head and the neck have a certain deflection angle relative to the handle, in the form of an inclination relative to one side of the handle. Type arrangement, the second end of the head of the femoral stem is inserted into the femoral ball head. 如請求項95所述的假體,其中,該複合體形成為一殼體包裹在該柄體的連接區域周邊;該複合體包含多個殼體片體。 The prosthesis as claimed in claim 95, wherein the composite body is formed as a shell wrapping around the connection area of the handle; the composite body comprises a plurality of shell pieces. 如請求項90所述的假體,其中,該假體包含一髖關節的一髖臼杯,該髖臼杯包含內側的一杯體主體,其形成為該基底;所述連接區域的位置為該髖臼杯的外周面。 The prosthesis of claim 90, wherein the prosthesis comprises an acetabular cup of a hip joint, the acetabular cup comprising an inner cup body formed as the base; the attachment region is located at the The outer surface of the acetabular cup. 如請求項90所述的假體,其中,該假體包含一脛骨平臺,該脛骨平臺包含一脛骨托,其形成為該基底;所述連接區域的位置為該脛骨托的遠端的表面。 The prosthesis of claim 90, wherein the prosthesis comprises a tibial plateau comprising a tibial tray formed as the base; the location of the attachment region is a surface of the distal end of the tibial tray. 如請求項90所述的假體,其中,該假體包含一股骨髁,該股骨髁包含一髁內固定面,其形成為該基底;所述連接區域的位置為該髁內固定面。 The prosthesis as claimed in claim 90, wherein the prosthesis comprises a femoral condyle, and the femoral condyle comprises a condyle internal fixation surface formed as the base; the position of the connecting region is the condyle internal fixation surface. 如請求項90所述的假體,其中,該假體是以下的任意一種或多種:髕骨、脊柱融合器、脊柱椎間小平面關節、踝關節、肩關節、肘關節、指關節、趾關節、人工椎間盤、下頜關節、腕關節。 The prosthesis as claimed in claim 90, wherein the prosthesis is any one or more of the following: patella, spinal fusion cage, spinal intervertebral facet joint, ankle joint, shoulder joint, elbow joint, finger joint, toe joint , Artificial disc, mandibular joint, wrist joint. 如請求項92-102中任意一項所述的假體,其中,該複合體中的該多孔性表面結構稱為一第一多孔結構;該中間體是實心結構,或者,該中間體是一第二多孔結構並且該第二多孔結構的孔隙率低於該第一多孔結構的孔隙率。 The prosthesis according to any one of claims 92-102, wherein the porous surface structure in the composite is called a first porous structure; the intermediate is a solid structure, or the intermediate is A second porous structure having a lower porosity than the first porous structure. 如請求項90所述的假體,其中,該複合體中的該多孔性表面結構稱為一第一多孔結構;該中間體是實心結構,或者,該中間體是一第二多孔結構並且該第二多孔結構的孔隙率低於該第一多孔結構的孔隙率。 The prosthesis of claim 90, wherein the porous surface structure in the composite is referred to as a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure And the porosity of the second porous structure is lower than the porosity of the first porous structure. 如請求項104所述的假體,其中,該基底由導電材料製成,該多孔性表面結構由導電材料製成,該中間體由導電材料製成。 The prosthesis according to claim 104, wherein the substrate is made of conductive material, the porous surface structure is made of conductive material, and the intermediate body is made of conductive material. 如請求項104所述的假體,其中,該中間體包含一中間板結構。 The prosthesis of claim 104, wherein the intermediate body comprises an intermediate plate structure. 如請求項106所述的假體,其中,該中間板結構上設置多個凸起結構,該凸起結構設置在該中間板結構上靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The prosthesis as claimed in claim 106, wherein a plurality of protruding structures are arranged on the intermediate plate structure, and the protruding structures are arranged on the side of the intermediate plate structure close to the base, and the protruding points of the protruding structures are in contact with the The substrate contacts. 如請求項104所述的假體,其中,該中間體是該第二多孔結構,該第二多孔結構包含多個凸起結構,該凸起結構形成在該第二多孔結構上靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The prosthesis according to claim 104, wherein the intermediate body is the second porous structure, the second porous structure comprises a plurality of protruding structures formed on the second porous structure adjacent to On one side of the base, the bumps of the raised structure are in contact with the base. 如請求項104所述的假體,其中,該中間體包含複數個分散佈置的凸起結構,形成在該多孔性表面結構靠近該基底的一側,該凸起結構的凸點與該基底接觸。 The prosthesis as claimed in claim 104, wherein the intermediate body comprises a plurality of protruding structures dispersedly arranged on the side of the porous surface structure close to the substrate, and the protruding points of the protruding structures are in contact with the substrate . 如請求項104所述的假體,其中,該支撐柱與該中間體的凸起結構對應佈置並接觸,或該支撐柱與該中間體 的該凸起結構錯位分佈且不接觸;該凸起結構的凸點與該基底接觸;其中,該凸起結構形成在該多孔性表面結構上靠近該基底的一側;或者,該中間體是該第二多孔結構並且該第二多孔結構的孔隙率低於該多孔性表面結構的孔隙率;該凸起結構形成在該第二多孔結構上靠近該基底的一側;或者,該中間體包含的一中間板結構,形成在該多孔性表面結構上靠近該基底的一側;該凸起結構形成在該中間板結構上靠近該基底的一側。 The prosthesis as claimed in claim 104, wherein, the supporting column is arranged corresponding to and contacts with the convex structure of the intermediate body, or the supporting column is in contact with the intermediate body The protruding structure is dislocated and not in contact; the protruding point of the protruding structure is in contact with the substrate; wherein, the protruding structure is formed on the porous surface structure on the side close to the substrate; or, the intermediate is The second porous structure and the porosity of the second porous structure is lower than the porosity of the porous surface structure; the raised structure is formed on the side of the second porous structure close to the substrate; or, the A middle plate structure included in the intermediate body is formed on the side of the porous surface structure close to the base; the protruding structure is formed on the side of the middle plate structure close to the base. 如請求項104所述的假體,其中,該支撐柱的遠離該基底一側的表面超出該孔性表面結構的表面;或者,該支撐柱的遠離該基底一側的表面低於該多孔性表面結構的表面;或者,該支撐柱的遠離該基底一側的表面與該多孔性表面結構的表面平齊。 The prosthesis as claimed in claim 104, wherein, the surface of the support column on the side away from the base exceeds the surface of the porous surface structure; or, the surface of the support column on the side away from the base is lower than the porosity the surface of the surface structure; or, the surface of the support column away from the substrate is flush with the surface of the porous surface structure. 如請求項111所述的假體,其中,該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面時,在電阻焊完成後,切割該支撐柱超出該多孔性表面結構的部分。 The prosthesis as claimed in claim 111, wherein, when the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure, after the resistance welding is completed, cutting the support column beyond the surface of the porous surface structure part. 如請求項111所述的假體,其中,該支撐柱位於該多孔性表面結構的預製空隙內,該支撐柱開設一凹槽,用於放置該第一極性電極中的多個電極單體,插入後的電極單體與該支撐柱導電接觸;該支撐柱為多孔結構或實心結構。 The prosthesis as claimed in claim 111, wherein the support column is located in the prefabricated void of the porous surface structure, and the support column defines a groove for placing a plurality of electrode cells in the first polarity electrode, The inserted electrode monomer is in conductive contact with the support column; the support column is a porous structure or a solid structure. 如請求項111所述的假體,其中, 該支撐柱的遠離該基底一側的表面超出該多孔性表面結構的表面時:該支撐柱為多段結構,至少包含超出該多孔性表面結構的一第一段部分和剩餘的一第二段部分;該第一段部分為多孔結構;該第二段部分為多孔結構或實心結構,該第二段部分上遠離該基底一側的表面平齊於該多孔性表面結構的表面,使得該第一段部分因與該第一極性電極接觸生熱導致該支撐柱下沉至該第二段部分的遠離該基底一側的表面。 The prosthesis of claim 111, wherein, When the surface of the support column away from the substrate exceeds the surface of the porous surface structure: the support column is a multi-segment structure, including at least a first segment beyond the porous surface structure and a remaining second segment ; The first section is a porous structure; the second section is a porous structure or a solid structure, and the surface on the side of the second section away from the base is flush with the surface of the porous surface structure, so that the first The heat generated by the segment portion contacting the first polarity electrode causes the support column to sink to the surface of the second segment portion away from the base. 如請求項104所述的假體,其中,該支撐柱為導電體時,該支撐柱接入到該電流回路,該支撐柱與以下任意一個或多個部件導電接觸:該第一極性電極、該多孔性表面結構、該中間體。 The prosthesis according to claim 104, wherein when the support column is a conductor, the support column is connected to the current circuit, and the support column is in conductive contact with any one or more of the following components: the first polarity electrode, The porous surface structure, the intermediate. 如請求項111所述的假體,其中,該支撐柱為絕緣體,該基底與該複合體置於一第一極性電極和一第二極性電極之間,通過該第一極性電極與該多孔性表面結構、該中間體之中的至少一個導電接觸,以及該基底與該第二極性電極導電接觸,形成一電流回路,使得該中間體和該基底進行電阻焊接,實現該複合體與該基底的連接。 The prosthesis as claimed in claim 111, wherein the support column is an insulator, the substrate and the composite are placed between a first polarity electrode and a second polarity electrode, and the first polarity electrode and the porous The surface structure, at least one conductive contact among the intermediate body, and the conductive contact between the substrate and the second polarity electrode form a current loop, so that the intermediate body and the substrate are subjected to resistance welding to realize the bonding between the composite body and the substrate connect. 如請求項107-109、110中任意一項所述的假體,其中,該凸起結構位於該中間體上的位置,靠近該多孔性表面結構與該中間體的接觸位置。 The prosthesis according to any one of claims 107-109, 110, wherein the protruding structure is located on the intermediate body, close to the contact position between the porous surface structure and the intermediate body. 如請求項104-116中任意一項所述的假體,其中,該多孔性表面結構內至少部分的孔隙內填充導電材料。 The prosthesis according to any one of claims 104-116, wherein at least part of the pores in the porous surface structure are filled with conductive materials. 如請求項118所述的假體,其中,該多孔性表面結構內至少部分的孔隙內填充粉末狀的導電材料。 The prosthesis according to claim 118, wherein at least part of the pores in the porous surface structure are filled with powdery conductive material. 如請求項104-116中任意一項所述的假體,其中,該多孔性表面結構的至少部分的表面鋪設固體薄膜狀的一可變形導電介質,該述可變形導電介質位於該第一極性電極和該多孔性表面結構之間;和/或,至少部分的該多孔性表面結構的表面與該第一極性電極之間噴塗固態導電介質或液態導電劑。 The prosthesis according to any one of claims 104-116, wherein at least part of the surface of the porous surface structure is covered with a deformable conductive medium in the form of a solid film, and the deformable conductive medium is located at the first polarity A solid conductive medium or a liquid conductive agent is sprayed between the electrode and the porous surface structure; and/or, between at least part of the surface of the porous surface structure and the first polarity electrode. 如請求項104所述的假體,其中,該多孔性表面結構的表面噴塗以下塗層中的一種或多種:骨傳導塗層、骨誘導塗層、抗菌塗層、細胞或生長因數載體。 The prosthesis according to claim 104, wherein the surface of the porous surface structure is sprayed with one or more of the following coatings: osteoconductive coating, osteoinductive coating, antibacterial coating, cell or growth factor carrier. 如請求項104-116中任意一項所述的假體,其中,至少部分的該多孔性表面結構的孔隙內注入熔融狀的一導電介質,和/或,至少部分的該多孔性表面結構的孔隙內置該導電介質並通過高溫使導電介質成熔融狀;該導電介質的熔點低於該基底的熔點和/或該多孔性表面結構的熔點。 The prosthesis according to any one of claims 104-116, wherein at least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or at least part of the porous surface structure The conductive medium is built into the pores and melted by high temperature; the melting point of the conductive medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure. 如請求項104-116中任意一項所述的假體,其中,該基底是實心結構,或者,該基底是一第三多孔結構且該第三多孔結構的孔隙率小於該多孔性表面結構的孔隙率。 The prosthesis according to any one of claims 104-116, wherein the substrate is a solid structure, or the substrate is a third porous structure having a porosity less than the porous surface The porosity of the structure. 如請求項123所述的假體,其中,該基底通過鍛造或鑄造或機加工或粉末冶金或金屬注塑製程製成。 The prosthesis of claim 123, wherein the base is made by forging or casting or machining or powder metallurgy or metal injection molding process. 如請求項104-116中任意一項所述的假體,其中, 該複合體的該多孔性表面結構與該中間體一體成型。 The prosthesis according to any one of claims 104-116, wherein, The porous surface structure of the composite body is integrally formed with the intermediate body. 如請求項125所述的假體,其中,該複合體的該多孔性表面結構與該中間體,通過3D列印增材製造製程、或氣相沉澱製程實現。 The prosthesis as claimed in claim 125, wherein the porous surface structure of the composite body and the intermediate body are realized through a 3D printing additive manufacturing process or a vapor deposition process. 如請求項104-116中任意一項所述的假體,其中,該多孔性表面結構、該中間體和該支撐柱一體成型。 The prosthesis as claimed in any one of claims 104-116, wherein the porous surface structure, the intermediate body and the support post are integrally formed. 如請求項104-116中任意一項所述的假體,其中,該多孔性表面結構的表面設置複數個凹槽,該凹槽的表面低於該多孔性表面結構的表面,將該多孔性表面結構劃分成多個區域;經該凹槽劃分出的各區域,均被各區域對應接觸的該第一極性電極覆蓋,與該多孔性表面結構的任意一區域對應接觸的該第一極性電極的邊緣,與鄰近該任意一區域的該凹槽的位置關係是:該第一極性電極的邊緣,未到達該凹槽的第一側且與該凹槽的第一側不接觸、或到達該凹槽的第一側、或跨過該凹槽的第一側且不超出該凹槽的第二側、或跨過該凹槽的第一側直至該凹槽的第二側、或跨過該凹槽的第二側並接觸到鄰近的另一區域的至少一部分;其中,該凹槽的第一側為靠近所述任意一區域的一側,該凹槽的第二側為遠離所述任意一區域的一側。 The prosthesis according to any one of claim items 104-116, wherein the surface of the porous surface structure is provided with a plurality of grooves, the surface of the grooves is lower than the surface of the porous surface structure, and the porosity The surface structure is divided into multiple areas; each area divided by the groove is covered by the first polarity electrode corresponding to each area, and the first polarity electrode corresponding to any area of the porous surface structure The positional relationship between the edge of the edge and the groove adjacent to the arbitrary area is: the edge of the first polarity electrode does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the the first side of the groove, or across the first side of the groove and not beyond the second side of the groove, or across the first side of the groove to the second side of the groove, or across The second side of the groove is in contact with at least a part of another adjacent region; wherein, the first side of the groove is the side close to any one region, and the second side of the groove is away from the side of any region. 如請求項128所述的假體,其中,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,分別被覆蓋位置不相重合的兩個不同的該第一極性電極同時覆蓋;或者,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,分別被兩個不同的該第一極性電極按先後次序分兩次覆蓋; 或者,該多孔性表面結構的表面上,經該凹槽劃分的相鄰兩區域,被同一個該第一極性電極按先後次序分兩次覆蓋。 The prosthesis according to claim 128, wherein, on the surface of the porous surface structure, two adjacent regions divided by the groove are respectively covered by two different electrodes of the first polarity whose positions do not overlap. Covering; or, on the surface of the porous surface structure, the two adjacent regions divided by the groove are respectively covered twice by two different electrodes of the first polarity in sequence; Alternatively, on the surface of the porous surface structure, two adjacent regions divided by the groove are covered by the same first polarity electrode in sequence twice. 如請求項128所述的假體,其中,該凹槽為長條狀。 The prosthesis as claimed in claim 128, wherein the groove is elongated. 如請求項104-116中任意一項所述的假體,其中,將該多孔性表面結構劃分成多個區域,劃分的任意相鄰的兩個區域稱為一第一區域的多孔結構和一第二區域的多孔結構;該第一區域的多孔結構與對應的該第一區域的該第一極性電極接觸,完成該第一區域的多孔結構與該基底的電阻焊接後,該第一區域的多孔結構與該第一區域的該第一極性電極的接觸邊緣形成一凸邊;該第二區域的多孔結構與對應的該第二區域的該第一極性電極接觸,該第二區域的該第一極性電極至少覆蓋到該第一區域的多孔結構上靠近該第二區域的多孔結構一側的該凸邊,完成該第二區域的多孔結構與該基底的電阻焊接。 The prosthesis as described in any one of claim items 104-116, wherein the porous surface structure is divided into multiple regions, and any two adjacent regions are divided into a porous structure of a first region and a The porous structure of the second region; the porous structure of the first region is in contact with the first polarity electrode corresponding to the first region, and after the resistance welding of the porous structure of the first region and the substrate is completed, the porous structure of the first region is The contact edge between the porous structure and the electrode of the first polarity in the first region forms a raised edge; the porous structure in the second region is in contact with the electrode of the first polarity corresponding to the second region, and the electrode of the first polarity in the second region contacts A polarity electrode covers at least the convex side of the porous structure in the first region close to the porous structure in the second region to complete resistance welding between the porous structure in the second region and the substrate. 如請求項104-116中任意一項所述的假體,其中,該基底包含一表面連接層,該底表面連接層與該基底的主體預先連接,該表面連接層介於該複合體的該中間體與該基底的主體之間;該表面連接層包含凸起結構,該凸起結構的凸點與該複合體的該中間體接觸。 The prosthesis according to any one of claims 104-116, wherein the base comprises a surface tie layer, the bottom surface tie layer is pre-attached to the main body of the base, the surface tie layer is interposed between the Between the intermediate body and the main body of the substrate; the surface connection layer includes a raised structure, and the bumps of the raised structure are in contact with the intermediate body of the composite body. 如請求項132所述的假體,其中,該基底的該表面連接層與該基底的主體預先焊接連接。 The prosthesis of claim 132, wherein the surface connection layer of the substrate is pre-welded to the main body of the substrate. 如請求項132所述的假體,其中, 該中間體上靠近該基底的一側為平面狀;或者,該中間體上靠近該基底的一側設置的該凸起結構與該表面連接層的該凸起結構錯開。 The prosthesis of claim 132, wherein, The side of the intermediate body close to the base is planar; or, the protruding structure disposed on the side of the intermediate close to the base is staggered from the protruding structure of the surface connection layer. 一種假體,其中,其設置一基底和至少兩個複合體,該基底用於形成一假體主體,該假體主體的至少部分表面作為連接區域,用於與該複合體連接,一中間體位於一多孔性表面結構與該基底之間,該中間體與該假體主體的連接區域相連接,使得該多孔性表面結構位於該假體主體的連接區域;該兩個複合體分別為一第一複合體和一第二複合體,各自包含預先連接或一體成型的該多孔性表面結構、該中間體和多個支撐柱;每個該支撐柱的全部或至少部分位於該多孔性表面結構內;該第一複合體、該第二複合體是如請求項90、92-134中任意一項所述假體中,與該基底連接的任意兩個複合體;該第一複合體和該第二複合體的結構相同;或者,該第一複合體和該第二複合體的結構不同;該第一複合體的該中間體與該基底,以及該二複合體的該中間體與該基底進行電阻焊接,實現該複合體與該基底的連接。 A prosthesis, wherein it is provided with a base and at least two composite bodies, the base is used to form a prosthesis body, at least part of the surface of the prosthesis body is used as a connection area for connecting with the composite body, an intermediate body Located between a porous surface structure and the substrate, the intermediate body is connected to the connection area of the prosthesis body so that the porous surface structure is located at the connection area of the prosthesis body; the two composite bodies are respectively a A first composite body and a second composite body, each comprising the porous surface structure, the intermediate body, and a plurality of support columns pre-connected or integrally formed; all or at least part of each of the support columns is located on the porous surface structure Inside; the first complex and the second complex are any two complexes connected to the substrate in the prosthesis described in any one of claim items 90, 92-134; the first complex and the The structure of the second complex is the same; or, the structures of the first complex and the second complex are different; the intermediate and the substrate of the first complex, and the intermediate and the substrate of the two complexes Resistance welding is performed to join the composite to the substrate. 如請求項135所述的假體,其中,該第一複合體、該基底和該第二複合體設置在一第一極性電極和一第二極性電極之間;該第一複合體置於該第一極性電極與該基底之間,該第一複合體的該中間體與該基底接觸,該第二複合體置於該第二極性電極與該基底之間,該第二複合體中的該中間體與該基底接觸;該支撐柱為導電體時,該第一極性電極與該第一複合體的該多孔性表面結構、該支撐柱、該中間體之中的至少一個導電接觸,該第二極性電極與該第二複合體的該多孔性表面結構、該支撐柱、該中間體之中的至少一個導 電接觸,用以形成一電流回路,使該第一複合體的該中間體與該基底,以及該第二複合體的該中間體與該基底進行電阻焊接,實現該複合體與該基底的連接;或者,該支撐柱為絕緣體時,該第一極性電極與該第一複合體中的一多孔性表面結構、該中間體之中的至少一個導電接觸,該第二極性電極與該第二複合體中的一多孔性表面結構、該中間體之中的至少一個導電接觸,用以形成一電流回路,使該第一複合體的該中間體與該基底,以及該第二複合體的該中間體與該基底進行電阻焊接,實現該複合體與該基底的連接。 The prosthesis of claim 135, wherein the first composite body, the substrate, and the second composite body are disposed between a first polarity electrode and a second polarity electrode; the first composite body is disposed on the Between the first polarity electrode and the substrate, the intermediate body of the first complex is in contact with the substrate, the second complex is placed between the second polarity electrode and the substrate, the second complex is in the The intermediate body is in contact with the substrate; when the support column is a conductor, the first polarity electrode is in conductive contact with at least one of the porous surface structure of the first composite body, the support column, and the intermediate body, and the first polarity electrode At least one conduction among the bipolar electrode and the porous surface structure of the second composite body, the support pillar, and the intermediate body Electrical contact is used to form a current loop, so that the intermediate body of the first composite body and the substrate, and the intermediate body of the second composite body and the substrate are resistance welded to realize the connection between the composite body and the substrate or, when the support column is an insulator, the first polarity electrode is in conductive contact with at least one of a porous surface structure in the first complex and the intermediate body, and the second polarity electrode is in contact with the second A porous surface structure in the composite body, at least one conductive contact among the intermediate body, is used to form a current circuit, the intermediate body and the substrate of the first composite body, and the second composite body The intermediate body and the substrate are welded by resistance to realize the connection between the composite body and the substrate. 如請求項135所述的假體,其中,該假體包含一髖關節的一股骨柄,該股骨柄包含一柄體,其形成為該基底;該連接區域的位置為該柄體的上部的表面;該第一複合體和該第二複合體分別形成為一殼體包裹在該柄體的連接區域周邊;該第一複合體和該第二複合體分別包含多個殼體片體。 The prosthesis as claimed in claim 135, wherein the prosthesis comprises a femoral stem of a hip joint, the femoral stem comprises a stem formed as the base; the position of the connecting region is the upper part of the stem surface; the first composite body and the second composite body are respectively formed as a shell wrapped around the connection area of the handle; the first composite body and the second composite body respectively include a plurality of shell pieces.
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CN201911395087.6A CN111012551A (en) 2019-12-30 2019-12-30 Prosthesis based on porous surface structure and substrate connecting structure
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