CN213130117U

CN213130117U - Porous surface structure and substrate connecting structure and preparation device

Info

Publication number: CN213130117U
Application number: CN201922439530.7U
Authority: CN
Inventors: 姚建清; 史金虎; 朱永良
Original assignee: Jiaoying Medical Equipment Shanghai Co ltd
Current assignee: Abbott Medical Technology Suzhou Co ltd; Jiaoying Medical Equipment Shanghai Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2021-05-07
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a porous surface structure and a substrate connecting structure and a preparation device, wherein the porous surface structure and an intermediate are connected in advance to form a complex; the intermediate is positioned between the porous surface structure and the substrate and is in contact with the substrate; the substrate and the composite body are arranged between the first polarity electrode and the second polarity electrode; the first polar electrode is in conductive contact with the porous surface structure and/or the intermediate, and the substrate is in conductive contact with the second polar electrode to form a current loop; and carrying out resistance welding on the intermediate body and the substrate to realize the connection of the composite body and the substrate. The utility model realizes the fastening connection of the complex body and the substrate by a resistance welding method, and keeps the mechanical property of the substrate; can ensure that the artificial implant prosthesis has excellent bone ingrowth performance and ensure that the strength of the substrate is not substantially influenced.

Description

Porous surface structure and substrate connecting structure and preparation device

Technical Field

The utility model relates to a mechanical structure's connection technology, in particular to medical instrument provides a connection structure and preparation facilities that is used for preparing porotic surface structure and basement.

Background

Engineering applications often place different demands on the overall and surface properties of mechanical structures. For example, the overall performance (such as fatigue strength) of the acetabular cup and the femoral stem of the artificial hip joint needs to meet the fatigue resistance requirement under the dynamic load born by the prosthesis in decades after being implanted into the body and one million to two million walks per year on average, and the surface of the prosthesis has specific performance requirements so as to meet the requirement that the surface of the prosthesis is firmly combined with the bone of a patient and ensure that the prosthesis is not loosened; otherwise, the patient may experience pain and must remove the prosthesis and allow the patient to undergo a revision surgery to implant a new prosthesis. Similar situations and needs exist for other orthopedic implants, such as the spine. In fact, in other fields, there are also situations where there are different performance requirements for the substrate and the surface, and a reliable and effective connection between the two is required.

The common artificial materials for joint prostheses are titanium alloy/cobalt chromium steel alloy/stainless steel, etc., which cannot form effective biological or chemical bonds with bones. The interface between the prosthesis and the bone is generally primarily through physical/mechanical bonding. For example, the highly polished surface of the prosthesis and the bone tissue cannot form an effective bonding force, and thus, it is necessary to increase bone conduction, bone induction, and bone regeneration to accelerate or enhance the bonding of the bone tissue to the surface of the prosthesis, thereby further improving the bone ingrowth or bone ingrowth properties. Sometimes, titanium wires or titanium beads can be sintered or diffusion welded to form a porous coating on the surface of the prosthesis (e.g., acetabular cup/femoral stem). Alternatively, a sheet 0001 with a porous structure is manufactured in advance by a metal 3D printing additive manufacturing process, a vapor deposition process and the like, and then the sheet 0001 is combined with a solid substrate 0002 of the prosthesis by means of diffusion welding, as shown in fig. 1. These means provide a porous surface for the prosthesis, the bone tissue in contact with the prosthesis can be regenerated, and new bone tissue fills the interpenetrated porous structure, achieving the effect of "bone ingrowth" of the prosthesis. However, these processes have the inevitable consequence that the mechanical strength of the base is greatly reduced, thus increasing the risk of breakage of the prosthesis, particularly when the prosthesis (for example the femoral stem) is subjected to bending torques or tensile stresses. Therefore, how to reliably and firmly combine a porous structure with its substrate, and ensure that the mechanical properties of the substrate are not significantly affected becomes a design/process difficulty.

In contrast, the welding process has a low impact on the mechanical properties of the substrate. However, when the porosity of the porous structure is high (> 50%), the interconnected scaffold is low in occupancy and weak; a plurality of pores are formed between the brackets. Such high porosity structure no matter is realized with metal 3D printing vibration material disk manufacturing process, still realizes through modes such as sintering, when directly using laser welding to connect porous structure and basement, as long as the laser beam effective diameter is close when even being greater than the support width, laser energy probably directly breaks the support structure, beats porous structure, can't realize effectual welded connection to porous structure's support and basement support. Alternatively, when the porous structure and the substrate are connected by the penetration welding, the strength of the substrate structure is greatly reduced due to the high temperature and high pressure.

In order to avoid the above-mentioned drawbacks of laser welding and penetration welding, the porous structure and the substrate are connected by a resistance welding method in which two workpieces to be welded are pressed between two electrodes and are formed into an effective bond between the metal workpieces by resistance heat generated by electric current flowing through the contact surface and the adjacent area between the two workpieces. However, for the high porosity structure, when the porous structure and the substrate are directly connected by resistance welding, the bonding efficiency is low, which results in insufficient welding bonding strength or too high current to achieve sufficient welding strength, and the latter results in too high heat generation caused by the contact between the upper electrode and the upper surface of the porous structure, which may damage the surface of the porous structure too much, including the sinking of the porous structure, and so on.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a connection structure and preparation facilities for porotic surface structure and basement, realize fastening the connection with porotic surface structure, midbody (solid plate structure or the porous structure of low porosity) and base plate through the resistance welding method (for example projection welding formula resistance welding or spot welding formula resistance welding etc.) and keep basement mechanical properties; based on the utility model discloses a porous structure's surface can guarantee that artifical implantation prosthesis possesses good bone and grows into the performance to make the intensity of basement not influenced by substantively.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:

a porous surface structure and substrate connection structure comprising:

a composite comprising a porous surface structure and an intermediate body that are pre-connected;

a substrate in contact with the intermediate, the intermediate being located between the porous surface structure and the substrate; the substrate and the composite body are arranged between a first polarity electrode and a second polarity electrode, and are in conductive contact with the porous surface structure and/or the intermediate body through the first polarity electrode and are in conductive contact with the second polarity electrode to form a current loop, so that the intermediate body and the substrate are subjected to resistance welding, and the composite body is connected with the substrate.

Preferably, the porous surface structure in the composite is referred to as a first porous structure; the intermediate is a solid structure, or the intermediate is a second porous structure and the second porous structure has a porosity lower than the porosity of the first porous structure.

Preferably, the substrate, the porous surface structure, the intermediate body are made of an electrically conductive material.

Preferably, the intermediate body comprises an intermediate plate structure.

Preferably, a plurality of protruding structures are arranged on the middle plate structure, the protruding structures are arranged on one side, close to the substrate, of the middle plate structure, and protruding points of the protruding structures are in contact with the substrate.

Preferably, the intermediate body is the second porous structure, the second porous structure includes a plurality of protruding structures, the protruding structures are formed on one side of the second porous structure close to the substrate, and the bumps of the protruding structures are in contact with the substrate.

Preferably, the intermediate body comprises a plurality of raised structures which are dispersedly arranged and formed on one side of the porous surface structure close to the substrate, and the salient points of the raised structures are in contact with the substrate.

Preferably, the connecting structure further comprises a plurality of support columns, all or at least part of each support column being located within the porous surface structure.

Preferably, the support columns of the intermediate body are arranged and contacted with the raised structures of the intermediate body correspondingly, or the support columns of the intermediate body and the raised structures of the intermediate body are distributed in a staggered manner and are not contacted.

Preferably, the surface of the side of the support column far away from the substrate exceeds the surface of the porous surface structure; or the surface of the side of the support column far away from the substrate is lower than the surface of the porous surface structure; or the surface of the side of the support column far away from the substrate is flush with the surface of the porous surface structure.

Preferably, when the surface of the side of the support column far away from the substrate exceeds the surface of the porous surface structure, the part of the support column exceeding the porous surface structure is cut after the resistance welding is completed.

Preferably, the supporting column is located in a preformed gap of the porous surface structure, the supporting column is provided with a groove for placing a plurality of electrode monomers in the first polarity electrode, and the inserted electrode monomers are in conductive contact with the supporting column; the surface of the support column is beyond or flush with or lower than the surface of the porous surface structure, and the support column is of a porous structure or a solid structure.

Preferably, when the surface of the side of the support column far from the substrate exceeds the surface of the porous surface structure: the supporting column is of a multi-section structure and at least comprises a first section part exceeding the porous surface structure and a remaining second section part; the first section part is of a porous structure; the second section part is of a porous structure or a solid structure, and the surface of one side, far away from the substrate, of the second section part is flush with the surface of the porous surface structure, so that the first section part is in contact with the first polar electrode to generate heat to enable the supporting column to sink to the surface, far away from the substrate, of the second section part.

Preferably, when the supporting column is an electric conductor, the supporting column is connected to the current loop, and the supporting column is in conductive contact with any one or more of the following components: a first polar electrode, a porous surface structure, and an intermediate.

Preferably, the support column is an insulator.

Preferably, the raised structure is located on the intermediate body at a position near a contact position of the porous surface structure with the intermediate body.

Preferably, at least part of the pores in the porous surface structure are filled with a conductive material.

Preferably, at least part of the pores in the porous surface structure are filled with a powdered conductive material.

Preferably, at least part of the surface of the porous surface structure is paved with a deformable conductive medium in a solid film shape, and the deformable conductive medium is positioned between the first polarity electrode and the porous surface structure; and/or spraying a solid conductive medium or a liquid conductive agent between at least part of the surface of the porous surface structure and the first polar electrode.

Preferably, at least part of the pores of the porous surface structure are filled with the conductive medium in a molten state, and/or at least part of the pores of the porous surface structure are filled with the conductive medium and the conductive medium is made into a molten state by high temperature; the melting point of the conductive medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure.

Preferably, the substrate is a solid structure, or the substrate is a third porous structure and the porosity of the third porous structure is smaller than the porosity of the porous surface structure.

Preferably, the substrate is made by forging or casting or machining or powder metallurgy or metal injection molding processes.

Preferably, the porous surface structure of the composite is integrally formed with the intermediate body.

Preferably, the porous surface structure and the intermediate of the composite body are realized through a 3D printing additive manufacturing process or a gas phase deposition process.

Preferably, the porous surface structure, the intermediate body and the support post are integrally formed.

Preferably, the surface of the porous surface structure is provided with a plurality of grooves, the surface of each groove is lower than the surface of the porous surface structure, and the porous surface structure is divided into a plurality of areas;

each region divided by the groove is covered by the first polarity electrode correspondingly contacted with each region, the edge of the first polarity electrode correspondingly contacted with any region of the porous surface structure and the position relation of the groove adjacent to any region are as follows: an edge of the first polarity electrode that does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or crosses the first side of the groove and does not exceed the second side of the groove, or crosses the first side of the groove and reaches the second side of the groove, or crosses the second side of the groove and contacts at least a portion of another adjacent region; the first side of the groove is one side close to any one region, and the second side of the groove is one side far away from any one region.

Preferably, two adjacent regions divided by the groove on the surface of the porous surface structure are respectively covered by two different first polarity electrodes whose covering positions are not coincident; or two adjacent areas divided by the grooves on the surface of the porous surface structure are respectively covered by two different first polarity electrodes twice according to the sequence; or, two adjacent areas divided by the grooves on the surface of the porous surface structure are covered by the same first polarity electrode twice in sequence.

Preferably, the groove is elongated.

Preferably, the porous surface structure is divided into a plurality of regions, and any two adjacent divided regions are called a porous structure of the first region and a porous structure of the second region;

the porous structure of the first area is in contact with a first polarity electrode of the corresponding first area, and after the resistance welding of the porous structure of the first area and the substrate is completed, a convex edge is formed on the contact edge of the porous structure of the first area and the first polarity electrode of the first area;

and the porous structure of the second area is in contact with a first polarity electrode of the corresponding second area, and the first polarity electrode of the second area at least covers the convex edge of the porous structure of the first area, which is close to one side of the porous structure of the second area, so that the resistance welding of the porous structure of the second area and the substrate is completed.

Preferably, the substrate comprises a surface connection layer, the bottom surface connection layer being pre-connected to the substrate body, the surface connection layer being interposed between the intermediate of the composite and the substrate body; the surface connecting layer comprises a convex structure, and the convex points of the convex structure of the surface connecting layer are in contact with the intermediate body of the complex.

Preferably, the surface connection layer of the substrate is connected with the substrate main body in a pre-welding mode.

Preferably, one side of the intermediate body close to the substrate is planar; or the convex structure arranged on one side of the intermediate body close to the substrate is staggered with the convex structure of the surface connecting layer.

The utility model also provides a porous surface structure and substrate connection structure, which comprises two complexes in the connection structure as described above, namely a first complex and a second complex, wherein the first complex, the substrate and the second complex are arranged between a first polarity electrode and a second polarity electrode; the first composite is placed between the first polar electrode and the substrate, the intermediate in the first composite is in contact with the substrate, the first polar electrode is in electrically conductive contact with the porous surface structure and/or the intermediate in the first composite, the second composite is placed between the second polar electrode and the substrate, the intermediate in the second composite is in contact with the substrate, the second polar electrode is in electrically conductive contact with the porous surface structure and/or the intermediate in the second composite, so as to form a current loop; and performing resistance welding on the intermediate body of the first composite body and the substrate and the intermediate body of the second composite body and the substrate to realize the connection of the composite body and the substrate.

Preferably, the first complex and the second complex are structurally identical; alternatively, the first complex and the second complex are structurally different.

The utility model discloses a preparation facilities for preparing connection structure described above is further provided, this preparation facilities contains: a first polar electrode in electrically conductive contact with a porous surface structure in a composite and/or an intermediate in a composite, the porous surface structure and the intermediate being pre-connected to form the composite; and the second polarity electrode is in conductive contact with the substrate, the intermediate body is positioned between the porous surface structure and the substrate, the intermediate body is in contact with the substrate, and the substrate and the composite body are arranged between the first polarity electrode and the second polarity electrode, so that the intermediate body and the substrate are subjected to resistance welding to realize the connection of the composite body and the substrate.

Preferably, the resistance welding is projection resistance welding and/or spot resistance welding.

Preferably, when the resistance welding is projection type resistance welding, the first polarity electrode is a continuous planar electrode or a segmented plurality of electrode cells, and the second polarity electrode is a continuous planar electrode or a segmented plurality of electrode cells; when the resistance welding is spot welding, the first polarity electrode and/or the second polarity electrode are segmented multiple electrode cells.

Preferably, the spot welding is resistance welding by moving any one or more of: the combination of the first polarity electrode, the second polarity electrode, the intermediate body having completed the welding at the at least one contact position, and the substrate is moved from the current welding position to the next welding position.

Preferably, when the first polarity electrode is divided into a plurality of electrode monomers, the electrode monomers are inserted into the preformed gaps in the porous surface structure, and the electrode monomers are close to the intermediate body, so that the inserted electrode monomers are in conductive contact with the intermediate body or the inserted electrode monomers are in conductive contact with the intermediate body through the porous surface structure.

Preferably, the electrode monomer penetrates from the surface of the porous surface structure until penetrating into the surface of the intermediate body or the interior of the intermediate body, such that the electrode monomer after insertion is in electrically conductive contact with the intermediate body.

Preferably, the electrode monomer and the porous surface structure are in a lateral clearance fit such that the electrode monomer and the porous surface structure are not in contact at all.

Preferably, the plurality of electrode units are connected in parallel to another planar electrode and the another planar electrode is connected to a power supply terminal, or the plurality of electrode units are connected in parallel and directly connected to the power supply terminal.

Preferably, the first polarity electrode is a flexible electrode, and the flexible electrode is matched with the surface of the porous surface structure through flexible deformation under the action of pressure, so that the contact area of the flexible electrode and the surface of the porous surface structure is increased.

Preferably, the first polarity electrode is a positive electrode and the second polarity electrode is a negative electrode; alternatively, the first polarity electrode is a negative electrode and the second polarity electrode is a positive electrode.

Preferably, the first polarity electrode and the second polarity electrode are made of a conductive material.

Preferably, the surface of the porous surface structure is provided with a plurality of grooves, the surface of each groove is lower than the surface of the porous surface structure, and the porous surface structure is divided into a plurality of areas; each region divided by the groove is covered by the first polarity electrode correspondingly contacted with each region, and the position relation between the edge of the first polarity electrode correspondingly contacted with any region of the porous surface structure and the groove adjacent to any region is as follows: an edge of the first polarity electrode that does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or crosses the first side of the groove and does not exceed the second side of the groove, or crosses the first side of the groove and reaches the second side of the groove, or crosses the second side of the groove and contacts at least a portion of another adjacent region; the first side of the groove is one side close to any one region, and the second side of the groove is one side far away from any one region.

Preferably, two adjacent areas divided by the groove on the surface of the porous surface structure are respectively covered by two different first polarity electrodes whose covering positions are not coincident; or, two adjacent areas divided by the grooves on the surface of the porous surface structure are respectively covered by two different first polarity electrodes twice according to the sequence; or, two adjacent areas divided by the grooves on the surface of the porous surface structure are covered by the same first polarity electrode twice in sequence.

Preferably, the groove is elongated.

Preferably, the second polarity electrode is a continuous planar electrode; or the second polarity electrode is divided into a plurality of areas and is matched with each area respectively.

Compared with the prior art, the beneficial effects of the utility model reside in that:

(1) the utility model provides a method for preparing the connection structure of porotic surface structure and basement, through 3D printing or other technologies manufacturing a complex body, contain porous surface structure and relative its midbody that has higher density (for example, porous structure or solid plate of low porosity), the utility model discloses a resistance welding method (for example projection welding formula resistance welding or spot welding formula resistance welding etc.) will the complex body is effectively combined with the basement, can avoid probably appearing laser energy in the laser welding method and directly hit off the situation that the welding connection can not be realized to porous structure's support and basement support; in addition, the projection welding type resistance welding method utilizes the contact resistance to generate a local heat source to realize welding, thereby greatly reducing or avoiding the problem that the mechanical property of the substrate is greatly reduced due to a hot pressing process (such as a penetration welding process) and the like; the utility model discloses can also use projection welding formula resistance welding and spot welding formula resistance welding cooperation, strengthen the welding strength between midbody and the basement and reduce porousness surface structure's surface damage.

(2) The utility model can not only adopt the large plane electrode to be pasted on the porous surface structure, but also divide the electrode into a plurality of positive electrode monomers (or negative electrode monomers) and vertically insert the positive electrode monomers into the specially reserved gaps in the porous surface structure, the electrode is not contacted with the surface of the porous surface structure, and the damage (sinking, blackening, pore space reduction, etc.) caused by resistance heat generated by contact resistance between the surface of the porous surface structure and the positive electrode is avoided; in addition, when the large plane electrode attached to the porous surface structure is made of a flexible material, the flexible positive electrode deforms to a certain extent so that the contact area between the flexible positive electrode and the top of the porous surface structure is increased, the contact resistance between the electrode and the porous surface structure can be reduced, the surface damage of the porous surface structure is reduced, and the current conduction is increased so that the welding strength between the intermediate body and the substrate is increased.

(3) The utility model discloses a pack good conducting material or at surface spraying good conducting material in porotic surface structure's hole to reduce the contact resistance between electrode and the porotic surface structure, reduce porotic surface structure's surface damage.

(4) The utility model arranges the support columns with solid structures in the porous surface structure, ensures that the height of the surface of the porous surface structure after the resistance welding is finished can reach the preset height, and avoids the porous surface structure from being compressed too much; when the supporting column is made of a good conductive material, most of the current output by the guide electrode preferentially flows through the supporting column to the substrate, so that the welding strength between the intermediate body and the substrate can be ensured, and the damage generated on the surface of the porous surface structure can be reduced; the utility model discloses utilize foretell support column and the bump structure combination of its below to the bump structure can with basement direct contact, can satisfy the requirement of the welding strength of midbody and basement equally and reduce the damage that porose surface structure surface produced.

(5) The utility model discloses a solid (high density) basement is made to processes such as forging, casting or machine tooling, perhaps the basement can be porotic structure, but porous surface structure's density will be less than the basement, and the density of midbody is between porotic surface structure and basement.

(6) The utility model discloses processing operation can simplify, has reduced manufacturing cost, has also practiced thrift the time.

(7) The utility model discloses utilize the connection structure and the method of porotic surface structure and basement, made various artifical implants false body, especially orthopedics false body, for example the thighbone handle body, acetabular cup, tibial plateau, thighbone condyle etc. make the false body be convenient for process and have high strength, optimize the performance that the bone grows into through the porous surface structure who effectively combines with it simultaneously, can also make the cross-section minimizing of false body (like the thighbone handle).

Drawings

FIG. 1 is a schematic view of a prior art connection of a substrate and a porous surface structure;

fig. 2 is a schematic view illustrating a connection structure between a porous surface structure and a substrate according to a first embodiment of the present invention;

fig. 3 is a schematic structural view of a porous bottom plate according to a first embodiment of the present invention;

fig. 4a is a schematic view of a connection structure between a porous surface structure and a substrate according to a second embodiment of the present invention (the lower surface of the low porosity region does not have a bump);

fig. 4b is a schematic view of a connection structure between the porous surface structure and the substrate according to the second embodiment of the present invention (the lower surface of the low porosity region has bumps);

fig. 5 is a schematic view illustrating a connection structure between a porous surface structure and a substrate according to a third embodiment of the present invention;

fig. 6a is a schematic view illustrating a connection structure between a porous surface structure and a substrate according to a fourth embodiment of the present invention;

fig. 6 b-6 c are schematic diagrams illustrating related variations of the connection structure according to a fourth embodiment of the present invention;

fig. 7 is a schematic view illustrating a connection structure between a porous surface structure and a substrate according to a fifth embodiment of the present invention;

fig. 8a is a schematic view of a connection structure between a porous surface structure and a substrate according to a sixth embodiment of the present invention;

fig. 8b is a schematic view of a connection structure between the porous surface structure and the substrate according to a seventh embodiment of the present invention;

fig. 8c is a schematic view of a connection structure between the porous surface structure and the substrate according to an eighth embodiment of the present invention;

fig. 9a is a schematic view of a connection structure between a porous surface structure and a substrate according to a ninth embodiment of the present invention;

fig. 9b is a schematic view of a connection structure between a porous surface structure and a substrate according to a tenth embodiment of the present invention;

fig. 10a is a schematic view of a connection structure between a porous surface structure and a substrate according to an eleventh embodiment of the present invention;

fig. 10b is a schematic view of a connection structure between a porous surface structure and a substrate according to a twelfth embodiment of the present invention;

fig. 11a is a schematic view of a connection structure between a porous surface structure and a substrate according to a thirteenth embodiment of the present invention;

11 b-11 d are schematic views of the connection structure between the porous surface structure and the substrate according to the fourteenth embodiment of the present invention;

fig. 12 is a schematic view illustrating a connection structure between a porous surface structure and a substrate according to a fifteenth embodiment of the present invention;

fig. 13-14 are schematic views of the connection structure of the porous surface structure and the substrate according to sixteen embodiments of the present invention;

fig. 15 is a schematic view illustrating a connection structure between a porous surface structure and a substrate according to an eighteenth embodiment of the present invention;

fig. 16 a-16 b are schematic views of femoral stems of an artificial prosthesis according to an embodiment twenty of the present invention;

fig. 16c is a schematic cross-sectional view of fig. 16a according to the present invention;

figures 17 a-17 e are schematic views of a stem shell of an artificial prosthesis according to twenty one embodiments of the present invention;

figure 18a is a schematic view of an acetabular cup of a prosthetic prosthesis according to twenty-one embodiments of the present invention;

fig. 18b is a partial schematic view of fig. 18a according to the present invention;

fig. 19a is a schematic view of a tibial plateau of a prosthesis according to twenty-two embodiments of the present invention;

fig. 19b is a partial schematic view of fig. 19a according to the present invention;

fig. 20a is a schematic view of a femoral condyle of a prosthesis according to twenty-three embodiments of the present invention;

fig. 20b is a partial schematic view of fig. 20a according to the present invention;

fig. 21-22 are schematic views of the connection structure between the porous surface structure and the substrate according to the nineteenth modification of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The first embodiment is as follows:

as shown in fig. 2, the present invention provides a connection structure, which comprises a substrate 23, an intermediate 22, and a porous surface structure 21. Wherein the porous structure of the porous surface structure 21 comprises a plurality of scaffolds (or beams) arranged in a staggered manner, and a plurality of pores with multi-directional penetration, regular shape or irregular shape are formed between the scaffolds (or beams). The intermediate body 22 is located between the porous surface structure 21 and the substrate 23. Alternatively, the intermediate body 22 is a non-porous base plate, i.e., a solid base plate. The porous surface structure 21 and the intermediate body 22 are made of a conductive material (e.g., a metal material). The porous surface structure 21 and the intermediate body 22 are integrally formed structures, for example, by a 3D printing additive manufacturing process, a vapor deposition process, or the like.

Illustratively, the base 23 is solid to facilitate the overall strength of the connection structure, and the base 23 may be made of an electrically conductive material (e.g., a metal material), formed by various means such as forging, casting, powder metallurgy, or metal injection molding, and may be subjected to various machining processes.

In this embodiment, the porous surface structure 21 and the intermediate body 22 are connected in advance to form the composite body 2A, and the intermediate body 22 and the base 23 are effectively bonded by the resistance welding method to connect the composite body 2A and the base 23. The resistance welding method includes spot welding and/or projection welding. The following examples are described with emphasis on the intermediate body 22 and the substrate 23 being joined by projection resistance welding.

Specifically, at least a part of the top of porous surface structure 21 is in contact with positive electrode 24, since porous surface structure 21 is pre-connected with intermediate body 22, i.e., at least a part of the bottom of porous surface structure 21 is in contact with the top of intermediate body 22. The bottom of the intermediate body 22 is prefabricated with a plurality of raised structures 221, the raised structures 221 being in contact with the top of the substrate 23, and the bottom of the substrate 23 being in contact with the negative electrode 25. Wherein, the convex structure 221 is convex toward the substrate 23 side. Preferably, the plurality of protrusion structures 221 are fabricated at positions corresponding to positions where the bottom of the porous surface structure 21 contacts the top of the intermediate body 22 and the adjacent regions thereof. Wherein, the positive direction of the X axis shown in FIG. 2 represents the right, the negative direction of the X axis represents the left, the positive direction of the Y axis represents the top, the negative direction of the Y axis represents the bottom, the orientation specification of the following embodiment is the same as that of the present embodiment, so as to describe the technical scheme of the present invention more clearly, the above orientation specification is only used for representing the diagram, and the orientation in the practical application is not affected.

Due to the complex 2A formed by the porous surface structure 21 and the intermediate body 22, and the substrate 23 are compressed between the positive electrode 24 and the negative electrode 25. When current is applied, the current flows through the porous surface structure 21 and the intermediate body 22 to the contact surface and the adjacent area of the top end of the protruding structure 221 and the substrate 23, and resistance heat is generated due to contact resistance, so that the top end of the protruding structure 221 and the substrate 23 are heated to a molten or plastic state, the protruding structure 221 of the intermediate body 22 and the top end of the substrate 23 form a metal combination, and finally, the fixing effect between the intermediate body 22 and the substrate 23 is realized, so that the complex 2A formed by the porous surface structure 21 and the intermediate body 22 and the substrate 23 are tightly combined together.

Since the bottom of the intermediate body 22 is provided with the plurality of convex structures 221, so that the convex structures 221 are in contact with the top surface of the substrate 23, contact resistance exists between the convex structures 221 and the top surface of the substrate 23, and due to the fact that current passes through the convex structures and resistance heat is generated, the contact points of the convex structures 221 and the substrate 23 areAnd forming a welding spot. Wherein, the contact resistance refers to the resistance generated by current passing between two independent workpieces during contact, and the resistance heat Q is proportional to the IR²R is the contact resistance, I is the current through the workpiece, i.e. the larger the current, the larger the contact resistance, the larger the resistance heat value, and vice versa.

Based on the above, the intermediate body 22 of the present example increases the contact resistance with the substrate 23 by the bump structure (e.g., bump), and generates sufficient resistance heat, so that the bump structure 221 has sufficient welding strength with the substrate 23. Preferably, the substrate 23 is made of a titanium alloy.

Optionally, the shape of the protruding structure 221 of the middle body 22 may be a sphere, an arc, a ring, an elongated bar, or the like, which is not limited in this embodiment, and is also not limited in other examples, as shown in fig. 3, the middle body 22 may have various protrusions or textures for reducing the contact area and increasing the contact resistance, so as to correspondingly increase the bonding efficiency between the middle body and the substrate, and improve the welding strength between the middle body and the substrate.

Illustratively, the positive electrode 24 and the negative electrode 25 are made of a conductive material (e.g., a metal material); the top of negative electrode 25 is hugged closely with the bottom of basement 23, and the bottom of positive electrode 24 is hugged closely with the top of porotic surface structure 21, and the contact surface of mutual contact can be plane or cambered surface or curved surface etc. the utility model discloses do not specifically limit to shape, size etc. of this contact surface, can design according to the actual application condition.

Therefore, the present invention can ensure high bonding efficiency (e.g. 70% to 80%) even when the porosity of the porous structure is high (> 50%) by adding the intermediate between the porous surface structure and the substrate and welding and bonding the intermediate and the complex formed by the porous surface structure and the substrate by using an electric resistance welding method (e.g. projection welding).

The positive electrode 24 and the negative electrode 25 in this embodiment can be interchanged, and this expansion mode is also applicable to each of the subsequent embodiments, which is not described herein again.

Example two:

for the first embodiment, the porous surface structure 21 is a structure with a certain porosity, the intermediate body 22 is located between the porous surface structure 21 and the substrate 23, and the intermediate body 22 is a non-porous bottom plate 22. In fact, the intermediate body 22 may be a solid plate as described in example one, or may be a porous structure with low porosity as described in example two.

Therefore, the main difference from the first embodiment is that the connection structure of the second embodiment includes a first porous structure 41 of a high porosity region, a second porous structure 42 (as an intermediate) of a low porosity region, and a substrate 43, as shown in fig. 4 a. The second porous structure 42 is located between the first porous structure 41 and the substrate 23.

Illustratively, the porous structure of the first porous structure 41 and the second porous structure 42 each includes a plurality of alternately arranged supports (or beams) between which pores with multi-directional penetration, regular or irregular shapes are formed. The porosity of the first porous structure 41 is denoted by a%, the porosity of the second porous structure 42 is denoted by b%, and a% > b%. When the b% value is equal to 0, the second porous structure 42 is an intermediate of the solid structure described in the first embodiment. Thus, when the intermediate body employs the second porous structure 42, the second porous structure 42 is more dense than the first porous structure 41 constituting the porous surface structure, as evidenced by a coarser support (beam) and/or lower porosity in the second porous structure 42.

In this embodiment, the first porous structure 41 and the second porous structure 42 are made of a conductive material (e.g., a metal material). The first porous structure 41 and the second porous structure 42 are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process.

The first porous structure 41 and the second porous structure 42 are formed into the composite 4A, and the second porous structure 42 and the substrate 43 are effectively bonded by resistance welding, such as projection welding: at least a portion of the support (or beam) at the bottom of the second porous structure 42 contacts the top of the substrate 43, and resistance heat is generated due to the contact resistance, so that the contact portion between the two is heated to a molten or plastic state, and the second porous structure 42 and the top of the substrate 43 form a metal combination, so that the combination is connected with the substrate 43.

At least a portion of the top of the first porous structure 41 is in contact with the positive electrode 44, at least a portion of the bottom of the second porous structure 42 is in contact with the top of the substrate 43, and the bottom of the substrate 43 is in contact with the negative electrode 45. The positive electrode 24 and the negative electrode 25 are made of a metal material. The top of the negative electrode 45 is in close proximity to the bottom of the substrate 43 and the bottom of the positive electrode 44 is in close proximity to the top of the first porous structure 41.

The main difference from the first embodiment is that the second embodiment uses the second porous structure 42 with a low porosity region to replace the intermediate body with the solid structure of the first embodiment, and the intermediate body of the second embodiment, although it is a porous structure, can ensure that the second porous structure 42 and the substrate 43 maintain a certain contact area due to its low porosity and a certain range of values, thereby ensuring a certain bonding efficiency, in principle, the smaller the porosity of the second porous structure 42, the higher the bonding efficiency between the composite body 4A and the substrate 43, and vice versa; meanwhile, the final combination efficiency is also related to the specific arrangement mode of the brackets (or beams) which are arranged in a staggered way in the porous structure, and the combination efficiency can be designed according to the practical application condition.

The lower surface of the second porous structure 42 may also have bumps 421, as shown in fig. 4 b. When current is applied, the current flows through the first porous structure 41 and the second porous structure 42, and resistive heat is generated by the contact of the bumps 421 of the second porous structure 42 and the top of the substrate 43, so that the bottom of the second porous structure 42 and the top of the substrate 23 form a metal combination, and the combination 4A formed by the first porous structure 41 and the second porous structure 42 is tightly combined with the substrate 43.

Example three:

for the first embodiment, the top of negative electrode 25 is attached to the bottom of substrate 23, and the bottom of positive electrode 24 is attached to the top of porous surface structure 21; alternatively, the positive electrode 24 and the negative electrode 25 are large planar electrodes and the positive electrode 24 is overlaid on top of the porous surface structure 21 and the negative electrode 25 is overlaid under the bottom of the substrate 23. Since the large planar positive electrode 24 of the first embodiment is pressed on the top of the porous surface structure 21, the large planar positive electrode 24 contacts and presses the surface of the porous surface structure 21, so that the surface of the porous surface structure 21 is damaged, for example, it is blackened, dented, and the pore space is reduced due to the depression generated by the pressing and the temperature increase caused by the heat generation of the contact resistance.

In order to protect the surface of the porous surface structure, the positive electrode 54 in the third embodiment is not a large plane electrode attached to the porous surface structure 51, but the positive electrode is divided into a plurality of positive electrode units 541 and the positive electrode units 541 are inserted into the gaps 5a in the porous surface structure 51 along the vertical direction, and the positive electrode units 541 are disposed on the top of the non-porous base plate 52 (as an intermediate), as shown in fig. 5. Likewise, the porous surface structure 51 and the non-porous base plate 52 in this example are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, or the like. The materials and manufacturing processes of the substrate 53, the non-porous substrate 52, and the porous surface structure 51 in this embodiment can be referred to in the first embodiment, and are not described herein again.

In the present embodiment, the positive electrode cells 541 are connected in parallel and are each connected to the positive power supply terminal, and the negative electrode 55 is connected to the negative power supply terminal. As shown in fig. 5, a plurality of raised structures 521 are prefabricated on the bottom of the non-porous base plate 52, the raised structures 521 are in contact with the top of the substrate 53, and the bottom of the substrate 53 is in contact with the negative electrode 55. Alternatively, the void 5a in the porous surface structure 51 is used as an insertion space corresponding to the positive electrode monomer 541, the void 5a is a prefabricated void part, and the void 5a starts from the surface of the porous surface structure 51 and passes through the porous surface structure 51 to the upper side of the non-porous base plate 52, so that the top of the non-porous base plate 52 is exposed in the void 5a for the bottom of the inserted positive electrode monomer 541 to contact with the top of the non-porous base plate 52.

In the third embodiment, the positive electrode 54 is not in contact with the surface of the porous surface structure 51, so that the problem of resistance heat damage between the surface of the porous surface structure and the positive electrode due to contact resistance is solved.

Illustratively, the gap 5a is laterally fitted, for example, in a clearance fit, with the positive electrode single body 541, that is, the gap 5a needs to be ensured to be spaced from the adjacent portion of the porous surface structure after the positive electrode single body 541 is inserted, so as to prevent the surface of the portion of the porous surface structure from being damaged by resistance heat, so as to protect the surface of the porous surface structure. Optionally, the positive electrode unit 541 is a columnar structure or a structure with other shapes, which is not limited in this embodiment, nor in other related examples.

Illustratively, the plurality of convex structures 521 at the bottom of the non-porous base plate 52 correspond to the position of each positive electrode unit 541, for example, the contact position between the positive electrode unit 541 and the top of the non-porous base plate 52 is located directly above each convex structure 521 or in the adjacent partial area of the convex structure 521, so as to ensure that the current is smoothly conducted to the non-porous base plate 52 until the contact surface and the adjacent area between the convex structure 521 and the top of the substrate 53, and generate resistance heat to form a combination of the convex structure 521 and the top of the substrate 23. The shape and the like of the protruding structure 521 of this embodiment can be referred to in the first embodiment, and are not described herein.

It is worth noting that the third embodiment of the present invention also applies to the second embodiment of the intermediate body being a second porous structure (with lower porosity than the porous surface structure) in which the positive electrode is divided into a plurality of positive electrode cells and the positive electrode cells are inserted into the voids in the porous surface structure along the vertical direction, that is, the positive electrode 44 in the second embodiment is replaced by a plurality of positive electrode cells and each positive electrode cell is inserted into the voids in the porous surface structure 41 along the vertical direction, at this time, the preformed voids start from the surface of the first porous structure, pass through the first porous structure until the second porous structure is above or inside the second porous structure, so that part of the second porous structure is exposed in the voids 5a, the bottom of the inserted positive electrode cell is in contact with part of the second porous structure, and similarly, the voids are laterally matched with the positive electrode cells, for example, the positive electrode unit is in clearance fit, that is, the gap needs to be ensured to be spaced from the adjacent porous surface structure after the positive electrode unit is inserted, so as to prevent the surface of the porous surface structure of the adjacent portion from being damaged due to resistance heat, so as to protect the surface of the porous surface structure.

Example four:

with the first embodiment described above, the positive electrode 24 and the negative electrode 25 may be made of a conductive material (e.g., a metal material); the top of negative electrode 25 is closely attached to the bottom of substrate 23, and the bottom of positive electrode 24 is closely attached to the top of porous surface structure 21; the positive electrode 24 and the negative electrode 25 are large planar electrodes, and the positive electrode 24 is overlaid on top of the porous surface structure 21 and the negative electrode 25 is overlaid under the bottom of the substrate 23.

The main difference from the first embodiment is that the positive electrode in the fourth embodiment is a flexible positive electrode 64, as shown in fig. 6 a. In the fourth embodiment, the flexible positive electrode 64 is a large planar electrode and covers the top of the porous surface structure 61, the negative electrode 65 is attached to the bottom of the substrate 63, and the non-porous bottom plate 62 is located between the porous surface structure 61 and the substrate 63. Illustratively, the porous surface structure 61 is an integrally formed structure with the non-porous base plate 62, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, or the like. The materials and manufacturing processes of the substrate 63, the non-porous substrate 62, and the porous surface structure 61 in this embodiment can be referred to in the first embodiment, which is not described herein again.

In the fourth embodiment, since the flexible positive electrode 64 covers the top surface of the porous surface structure 61 to generate a certain pressure on the surface of the porous surface structure 61, at this time, the flexible positive electrode 64 generates a certain flexible deformation under the interaction of the pressure, so that the contact area between the flexible positive electrode 64 and the top of the porous surface structure 61 is increased (compared with the contact area between the rigid positive electrode and the top of the porous surface structure under the same condition), which not only can reduce the contact resistance between the positive electrode 64 and the porous surface structure 61, improve or avoid the surface damage (such as dent, blackening, pore space reduction, etc.) of the porous surface due to resistance heat, protect the surface of the porous surface structure, but also can enhance the current conduction, increase the welding bonding efficiency between the non-porous base plate 62 and the substrate 63, and increase the welding strength.

The flexible material is a conductive material, such as a copper foil or a tin foil, and the like, which is not limited in this embodiment, and is also not limited in other related examples, and the flexible material may be designed according to an actual application situation.

As a modification of the fourth embodiment, the following:

as shown in fig. 6b, a good easily deformable conductive medium 606 is added between the bottom of the positive electrode 604 and the top of the porous surface structure 601, and the good easily deformable conductive medium 606 covers the top of the porous surface structure 601. Alternatively, the easily deformable conductive medium 606 is a continuous solid film, such as a copper foil. Similarly, intermediate body 602 is positioned between porous surface structure 601 and substrate 603, and the top of negative electrode 605 is proximate to the bottom of substrate 603. The positive electrode 604 is a large plane electrode and covers the top surface of the easy-to-deform conductive medium 606, and since the easy-to-deform conductive medium 606 is easy to deform, the contact area between the easy-to-deform conductive medium and the porous surface structure 601 is increased, so that the contact resistance between the porous surface structure 601 and the positive electrode 604 above the porous surface structure can be reduced, the resistance heat is reduced, the surface damage of the porous surface structure 601 is reduced, the current conduction function can be increased, and the welding strength between the intermediate 602 and the substrate 603 is increased.

According to the above deformation mode, further expansion can be made as follows:

as shown in fig. 6c, the pores between the bottom of the positive electrode 6004 and the top of the porous surface structure 6001 are filled with a good conductive material powder 6006 (or a good conductive wire), which can reduce the contact resistance between the positive electrode 6004 and the surface of the porous surface structure 6001, thereby reducing the surface damage of the porous surface structure 6001, and can also increase the current conduction effect, increasing the efficiency of the solder bonding between the intermediate body 6002 and the substrate 6003. Preferably, the material of the good conductive material powder 6006 (or the good conductive wire material) is the same as the material of the porous surface structure 6001, and is, for example, titanium powder (or a titanium wire). Similarly, as in fig. 6c, the intermediate 6002 is located between the porous surface structure 6001 and the substrate 6003, with the top of the negative electrode 6005 abutting the bottom of the substrate 6003. In another different example, through the surface spraying conducting material at porotic surface structure, also can reduce the contact resistance between electrode and the porotic surface structure equally, reduce porotic surface structure's surface damage, the utility model discloses do not give unnecessary details to this.

Whether the above-mentioned easily deformable good conductive medium 606, the good conductive material powder 6006 (or the good conductive wire), the sprayed conductive material or the liquid conductive agent, etc., need to be properly removed after the porous surface structure and the substrate are soldered and bonded so as to ensure that the pores of the porous surface structure are open.

It is worth mentioning that after the porous surface structure is connected with the substrate in any of the above embodiments, a Hydroxyapatite (HA) coating may be separately sprayed on the surface of the porous surface structure, and the HA coating HAs good bioactivity and biocompatibility, which is beneficial to the subsequent bone ingrowth process; alternatively, the porous surface structure may be surface coated with a layer containing antimicrobial silver ions or other cell growth factors.

Based on the foregoing, the utility model discloses still provide a deformation example, specifically as follows:

in order to avoid or improve the damage of the surface of the porous surface structure due to resistance heat, it is necessary to increase the conductivity of the porous surface structure as much as possible to reduce the contact resistance between the porous surface structure and the electrode. In this modified example, the molten liquid of a specific material (a material with good conductivity) penetrates into the porous surface structure, and the molten liquid can almost fill up the pores in the porous surface structure of the selected portion (the upper portion of the spacer layer), so that not only the melting point of the molten liquid with good conductivity needs to be limited to be low, but also a spacer layer needs to be disposed in the porous surface structure, and the spacer layer is preferably made of a conductive material, so as to prevent the molten liquid from penetrating downwards and flowing onto the intermediate body below, and avoid affecting the effect of the resistance welding. After the resistance welding process is finished, the combined whole body is placed into a high-temperature environment, and the melting point of the specific conductive medium is lower than that of the porous surface structure and the substrate (such as titanium alloy), so that the substrate is not greatly influenced by the high-temperature environment, but the conductive medium with the low melting point is melted, and the added conductive medium with the low melting point is removed by some processes in the prior art.

Example five:

for the second embodiment described above, the positive electrode 24 and the negative electrode 25 are made of a conductive material (metal material), the top of the negative electrode 45 is abutted against the bottom of the substrate 43, and the bottom of the positive electrode 44 is abutted against the top of the first porous structure 41 of the high porosity region. The main difference from the second embodiment is that: the positive electrode of the fifth embodiment is a flexible positive electrode 74 made of a flexible material, not a metal material in the above-described embodiment, as shown in fig. 7.

In the fifth embodiment, the flexible positive electrode 74 is a large planar electrode and covers the top of the first porous structure 71 in the high porosity region, the negative electrode 75 covers the bottom of the substrate 73, and the second porous structure 72 in the low porosity region is located between the first porous structure 71 in the high porosity region and the substrate 73. Optionally, the first porous structure 71 and the second porous structure 72 are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, etc. In this embodiment, materials and manufacturing processes of the substrate 73, the second porous structure 72, and the first porous structure 71 can be referred to in embodiment two, and are not described herein.

In this embodiment, the flexible positive electrode 74 covers the top surface of the first porous structure 71, and generates a certain pressure on the top surface of the first porous structure 71, and at this time, the flexible material of the flexible positive electrode 74 generates a certain flexible deformation under the interaction of the pressure, so that the contact area between the flexible positive electrode 74 and the top of the first porous structure 71 is increased (compared with the contact area between the rigid positive electrode and the top of the first porous structure under the same condition), which not only can reduce the contact resistance between the positive electrode 74 and the porous surface structure 71, improve or avoid surface damage (such as depression, blackening, pore space reduction, etc.) of the porous surface due to resistance heat, protect the surface of the porous surface structure, but also can enhance current conduction, increase the welding bonding efficiency between the non-porous bottom plate 72 and the substrate 73, and increase the welding strength.

Similar to embodiment two (shown in fig. 4b), the lower surface of the low porosity substrate 72 may be bumped to increase the efficiency of the resistance weld.

Example six:

based on the first embodiment, in the sixth embodiment, not only the non-porous bottom plate 812 (or the porous structure with low porosity) is disposed between the porous surface structure 811 and the substrate 813, but also a plurality of protrusion structures are prefabricated on the bottom surface of the non-porous bottom plate 812, the protrusion structures contact with the top of the substrate 813, and a plurality of support columns 816a are disposed on the surface of the non-porous bottom plate 812 near one side of the porous surface structure, as shown in fig. 8a, the support columns 816a are disposed between the non-porous bottom plate 812 and the positive electrode 814. The supporting columns 816a are located inside the porous surface structure 811, the top ends of the supporting columns 816a are substantially flush with the top ends of the porous surface structure, and the height of the supporting columns 816a is substantially equal to the height of the porous surface structure. Similarly, the top of the negative electrode 815 in the sixth embodiment is also closely attached to the bottom of the substrate 813. It is to be understood that the height direction described here is an orientation shown in the drawings, and the above orientation is defined only for the purpose of illustration and not necessarily as an orientation in actual use, and the following description of the related embodiments is consistent therewith.

In this embodiment, the supporting pillars 816a are solid structures with good electrical conductivity. Each support column 816a is directly opposite to each corresponding bump structure below the support column 816a, so that the area covered by the support column 816a is at least partially overlapped with the contact part between the bump structure and the substrate 813, and the size of the support column 816a is matched with that of the bump structure.

Optionally, the non-porous base plate 812, the porous surface structure 811, and the support posts 816a are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, etc.

Although the surface of the porous surface structure 811 is still partially in contact with the positive electrode 814 above the porous surface structure 811 in this example, since the support columns 816a are a solid structure with good conductivity and the porous surface structure 811 has pores, most of the current flowing out from the electrode preferentially passes through the support columns 816a with good conductivity of the solid structure, surface damage of the porous surface structure 811 due to resistance heat is greatly reduced, and the current conduction effect is also enhanced, so that the welding bonding efficiency between the non-porous base plate 812 and the substrate 813 is increased, and sufficient welding strength is ensured.

Example seven:

as a modification of the sixth embodiment, the seventh embodiment is modified in that: in order to completely avoid the damage of the surface of the porous surface structure caused by resistance heat generated by the contact between the porous surface structure and the positive electrode above the porous surface structure, as shown in fig. 8b, in the seventh embodiment, the top ends of all the supporting columns 816b are set to be higher than the top surface of the porous surface structure, and the height of each supporting column 816b is higher than the height of the porous surface structure corresponding to the adjacent portion, so that the positive electrode contacts with the supporting column 816b at the higher position first, thereby avoiding the contact between the positive electrode and the porous surface structure 811 at the lower position.

Since the height of the support column 816b in this embodiment exceeds the porous surface structure, in order to ensure the basic function of the whole connection structure, the portion of the support column 816b higher than the porous surface structure 811 can be removed by cutting or the like after the welding is completed, so as to ensure the surface flatness. Further, as shown in fig. 8b, the positive electrode can be not only a continuous large plane positive electrode as shown in fig. 8a, but also a plurality of segmented positive electrode units 814b, each segment of positive electrode unit 814b is voltage-equalized on the top of the corresponding support column 816b, and the positive electrode units 814b are connected in parallel to one large plane electrode or directly connected to the positive terminal of the power supply.

Example eight:

based on the sixth embodiment and the seventh embodiment, the eighth embodiment is further expanded, and the expansion concept is as follows: as shown in fig. 8c, the top of each supporting column 816c is lower than the top surface of the corresponding part of the porous surface structure, the height of the supporting column 816c is lower than the height of the porous surface structure, and the supporting column 816a is hidden inside the porous surface structure 811, i.e. the supporting column 816c is a porous structure above. In this way, the positive electrode 814 contacts with the first surface of the porous surface structure 811 therebelow, so that the top surface of the porous surface structure 811 sinks a small amount due to heat generation of contact resistance until it sinks to the top position of the supporting column 816c (the maximum sinking level can only sink to the top position of the supporting column, and when the sinking level is not large, the sinking position is higher than the top position of the supporting column), because the supporting column 816c is a solid structure, the supporting column 816c plays a role of limiting, so as to ensure that the height of the final surface of the porous surface structure reaches the height position of the supporting column, thereby avoiding the porous surface structure from being compressed too much. Optionally, a recessed structure may be disposed above the supporting column 816c, so that the top end of the supporting column 816c is lower than the top surface of the corresponding portion of the porous surface structure, and the supporting column 816c can also function as a position limitation.

For example, the non-porous base plate 812, the porous surface structure 811, and the support posts 816c may be integrally formed structures, for example, by a 3D printing additive manufacturing process, a vapor deposition process, or the like.

In this embodiment, although the top surface of the porous surface structure 811 is in contact with the upper positive electrode 814, the supporting posts 816c are solid structures with good electrical conductivity, and the porous surface structure 811 has pores, so that most of the current selectively flows through the supporting posts 816c to the bump structure and the substrate 813, which not only ensures the welding strength between the non-porous bottom plate 812 and the substrate 813, but also reduces the damage to the surface of the porous surface structure to a certain extent. In the eighth embodiment, although the surface of the porous surface structure is still damaged to a certain extent, the top end of the supporting column 816c is always lower than the surface of the porous surface structure 811, and therefore the basic function of the connection structure applied to the corresponding field is not affected.

Based on the embodiments of fig. 8b and 8c, in another example (not shown), a set height position is selected on the support posts originally higher than the surface of the porous surface structure 811 and the position above is designed as a pore structure, not the support posts with flush surface shown in fig. 8 b. At this time, the positive electrode contacts with the top pore structure at a higher position first, the top pore structure of the support pillar is pressed and sinks a little due to heat generation of the contact resistance, and the support pillar sinks to the set position of the support pillar, so that the support pillar is basically flush with the porous structure beside the support pillar (the maximum sinking degree can only sink to the set position, and when the sinking degree is not large, the sinking position is higher than the set position). In this case, the damage of the surface of the porous surface structure due to resistance heat generated by the contact of the porous surface structure and the positive electrode above the porous surface structure can be completely avoided, and an additional processing process for removing the redundant part of the support column higher than the porous surface structure is not needed.

Example nine:

for the sixth embodiment, a non-porous bottom plate 812 (or a porous structure with low porosity) is disposed between the porous surface structure 811 and the substrate 813, and a plurality of protrusion structures are prefabricated on the bottom surface of the non-porous bottom plate 812, the protrusion structures contact with the top of the substrate 813, and a plurality of support columns 816a with good conductivity and solid structure are disposed on the surface of the non-porous bottom plate 812 near one side of the porous surface structure, and the support columns 816a are interposed between the non-porous bottom plate 812 and the positive electrode 814.

The main difference from the sixth embodiment is that the bottom surface of the non-porous base plate 912a disposed between the porous surface structure 911 and the substrate 913 in the ninth embodiment does not have the above-mentioned bump structure (such as bumps), and a plurality of good conductive support columns 916a are also disposed on the surface of the non-porous base plate 912a near the porous surface structure, the support columns 916a are interposed between the non-porous base plate 912a and the positive electrode 914, as shown in fig. 9a, the bottom surface of the non-porous base plate 912a is almost in plane contact with the substrate 813.

Illustratively, the support columns 916a are located inside the porous surface structure 911, the height of the support columns 916a is substantially flush with the top surface of the porous surface structure, the height of the support columns 916a is substantially equal to the height of the porous surface structure, and similarly, the top of the negative electrode 915 is also closely attached to the bottom of the substrate 913.

Illustratively, the non-porous base plate 812, the porous surface structure 811, and the support posts 816a are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, or the like.

In the ninth embodiment, although the surface of the porous surface structure is still partially in contact with the positive electrode 814 above the surface, the supporting column 916a is a solid structure with good conductivity, and the porous surface structure 911 has a pore, most of the current flowing from the electrode preferentially passes through the supporting column 916a with the solid structure with good conductivity and passes through the non-porous base plate 912a to the substrate 913, even if the bottom end of the non-porous base plate 912a is not provided with the bump structure, but in the ninth embodiment, a plurality of supporting columns 916a with good conductivity and a column shape are provided, so that there is still enough current amount and resistance heat to enable the non-porous base plate 912a and the substrate 913 to have enough welding strength, and damage to the surface of the porous surface structure can be reduced to a certain extent.

Example ten:

as a variation of the ninth embodiment, the tenth embodiment has a variation idea that: as shown in fig. 9b, in this embodiment, in addition to the features of the embodiment nine regarding the non-porous bottom plate without the raised structure (or the porous structure with low porosity), in order to completely avoid the surface damage of the porous surface structure 911 caused by heat generation due to contact resistance, the top ends of all the supporting columns 916b are set to be higher than the top surface of the porous surface structure, and the height of each supporting column 916b is higher than the corresponding adjacent portion of the porous surface structure. The positive electrode in this example would contact the higher disposed support posts 916b first, thereby avoiding the positive electrode contacting the lower porous surface structure 911. In addition, since the height of the support column 916b exceeds the porous surface structure, in order to ensure the basic function of the integral connection structure, after the welding is completed, the part of the support column 916b higher than the porous surface structure 911 can be removed by cutting or the like, so as to ensure the surface flatness. Further, as shown in fig. 9b, the positive electrode can be not only a continuous large-plane positive electrode as shown in fig. 9a, but also a plurality of segmented positive electrode cells 914b, each segment of positive electrode cells 914b is voltage-equalized on the upper end of the corresponding support column 916b, and the positive electrode cells 914b are connected in parallel to one large-plane electrode or directly connected to the positive end of the power supply.

Example eleven:

unlike the first embodiment, the positive electrode 1014a in the eleventh embodiment is not a large plane electrode attached on the porous surface structure 1011, but the positive electrode 54 is divided into a plurality of positive electrode units 001 and the positive electrode units 001 are inserted into the gaps 10a in the porous surface structure 1011 along the vertical direction, as shown in fig. 10a, and the positive electrode units 001 are placed on the top of the non-porous base plate 1012a (or the porous structure with low porosity). Illustratively, a plurality of the positive electrode cells 001 are connected in parallel and are all connected to one large planar electrode or directly connected to the positive terminal of a power supply, and the negative electrodes 1015 are connected to the negative terminal of the power supply.

Alternatively, the porous surface structure 1011 and the non-porous base plate 1012a are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, etc.

As shown in fig. 10a, the voids 10a in the porous surface structure 1011 serve as insertion spaces for the corresponding positive electrode cell 001, and the voids 10a are prepared pores. The bottom end of the positive electrode 1014a in this example is not in contact with the top end of the porous surface structure 101, so as to avoid damage to the surface of the porous surface structure 1011 due to resistance heat. The gap 10a is laterally fitted with the positive electrode single body 001, for example, a clearance fit is adopted, that is, the gap 10a needs to be ensured to be spaced from the porous surface structure of the adjacent portion after the positive electrode single body 001 is inserted, so as to prevent the porous surface structure of the portion from generating resistance heat and being damaged.

The non-porous base plate in the first embodiment is provided with a protrusion structure (such as a bump) for generating a larger contact resistance and resistance heat, but the embodiment is different from the first embodiment in that the protrusion structure is not provided at the bottom of the non-porous base plate 1012a, but since the positive electrode 1014a itself is directly contacted with the non-porous base plate 1012a and each positive electrode 001 is connected to the power source, the current directly flows out from the positive electrode 001 and passes through the non-porous base plate 1012a and the substrate 1013 (not passing through the porous surface structure 1011), i.e. sufficient current amount and resistance heat can still be ensured, so that the non-porous base plate 1012a and the substrate 1013 have sufficient welding strength.

Example twelve:

as a modification of the eleventh embodiment, the twelfth modification point of the present embodiment is: a plurality of support structures 10b with a solid structure with good conductivity are disposed on the top surface of the non-porous base plate 1012b (or porous structure with low porosity), and the support structures 10b are disposed in the pores reserved inside the porous surface structure 1011, as shown in fig. 10 b. The supporting structures 10b are respectively used for placing and supporting each positive electrode monomer 001 in the positive electrode 1014a, and the positive electrode monomers 001 are located in the grooves formed in the supporting structures 10b and are matched with the grooves, so that good contact between all the positive electrode monomers 001 and the corresponding supporting structures 10b is ensured.

Illustratively, the non-porous base plate 1012b, the porous surface structures 1011, and the support post support structures 10b are integrally formed structures, such as by a 3D printing additive manufacturing process, or a vapor deposition process, or the like.

Optionally, the top of the support structure 10b is substantially flush with the top of the porous surface structure 1011, and the height of the support structure 10b is substantially equal to the height of the porous surface structure 1011; alternatively, the top end of the support structure 10b is lower than the top end of the porous surface structure 1011; alternatively, the top end of the support structure 10b is higher than the top end of the porous surface structure 1011 and the final top end of the support structure 10b is flush with the top end of the porous surface structure 1011 by means of a subsequent cutting process; select which kind of high design mode, the utility model discloses do not limit to this. Similarly, even though the bottom end of the non-porous base plate 1012b is not provided with the protrusion structure, since the positive electrode 1014a is electrically connected to the non-porous base plate 1012b through the support structure 10b having a solid structure with good conductivity and each of the positive electrode cells 001 is connected to the power source, the current flows directly from the positive electrode cell 001 through the non-porous base plate 1012b and the substrate 1013 (without passing through the porous surface structure 1011), i.e., a sufficient amount of current and resistance heat can still be ensured, so that the non-porous base plate 1012b and the substrate 1013 have sufficient welding strength.

Example thirteen:

unlike the eighth embodiment, in the thirteenth embodiment, a non-porous bottom plate is not disposed between the porous surface structure 1111 and the substrate 1113, and the improvement is: at least a portion of the bottom of the porous surface structure 1111 is connected to a bump structure 1112a (e.g., a bump) with a solid structure and good conductivity, and the bump structure 1112a is in contact with the top of the substrate 1113, as shown in fig. 11a, and a support post 1116a with a solid structure and good conductivity can be disposed at any position in the porous surface structure 1111.

The support columns 1116a and the protrusion structures 1112a in this example may be arranged in a staggered manner, as shown in FIG. 11 a.

Illustratively, the porous surface structure 1111, the protrusion structure 1112a, and the support columns 1116a are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, etc.

Optionally, the supporting posts 1116a are hidden inside the porous surface structure 1111, the top ends of the supporting posts 1116a are lower than the top ends of the porous surface structure 1111, and the bottom ends of the supporting posts 1116a are higher than the bottom ends of the porous surface structure 1111.

In this example, the limiting function of the supporting pillar 1116a can be utilized to prevent the porous surface structure 1111 from being over-compressed, because the positive electrode 1114 will contact with the top surface of the porous surface structure 1111 thereunder first, and further the surface of the porous surface structure 1111 will sink a little because of the heat generated by the contact resistance until it sinks to the top of the supporting pillar 1116a (the maximum sinking level can only sink to the top position, even if the sinking level is not large, the sinking position is higher than the top position), because the supporting pillar 1116a is a solid structure, the supporting pillar 1116a plays a limiting role, and it is ensured that the height of the final surface of the porous surface structure reaches the height position of the supporting pillar; meanwhile, the solid structure with good conductivity of the supporting pillar 1116a can be utilized, so that most of the current preferably passes through the supporting pillar 1116a and then reaches the protrusion structure 1112a after passing through the porous surface structure near the supporting pillar 1116a, and the damage problem of the surface of the porous surface structure caused by heat generation of contact resistance can be improved; furthermore, in this embodiment, the bump of the bump 1112a is further utilized to increase the contact resistance with the substrate 1113, so as to generate sufficient resistance heat, so that the bump 1112a and the substrate 1113 have sufficient welding strength.

Example fourteen:

while the thirteenth embodiment describes the offset arrangement of the support columns 1116a and the raised structures 1112a, as a variation of the thirteenth embodiment, the fourteenth embodiment designs the raised structures 1112b and the support columns 1116b above the raised structures to be in direct-facing engagement, and the two are at least partially (e.g., partially or completely) coincident, as shown in fig. 11 b.

Illustratively, the porous surface structure 1111, the protrusion structure 1112b, and the support columns 1116b are integrally formed structures, for example, by a 3D printing additive manufacturing process, a vapor deposition process, or the like.

In the fourteenth embodiment, the supporting posts 1116b are hidden inside the porous surface structure 1111, the top ends of the supporting posts 1116b are lower than the top ends of the porous surface structure 1111, and the height of the supporting posts 1116b is lower than the height of the porous surface structure. The raised structures 1112b are in contact with the top of the substrate 1113.

In this embodiment, the supporting pillar 1116b can be used to avoid excessive compression of the porous surface structure 1111, because the positive electrode 1114 first contacts with the surface of the porous surface structure 1111 thereunder, and further the surface of the porous surface structure 1111 is damaged due to heat generation of contact resistance, causing a small amount of sinking until sinking to the top of the supporting pillar 1116b (the maximum sinking degree can only sink to the top position, even if the sinking degree is not large, the sinking position is higher than the top position), because the supporting pillar 1116b is a solid structure with good conductivity, the supporting pillar 1116b plays a role of limiting, and ensures that the height of the final surface of the porous surface structure reaches the height position of the supporting pillar; meanwhile, a solid good conductive structure of the support columns 1116a can be utilized, most of the current preferably passes through the support columns 1116a, and the problem that the top surface of the porous surface structure is damaged due to heat generation of contact resistance can be solved; in addition, the bump structure 1112b may be utilized to increase the contact resistance of the substrate 1113 to generate enough resistance heat, so that the bump structure 1112b and the substrate 1113 have enough welding strength. It is worth noting that the welding efficiency of the fourteenth embodiment is better than that of the thirteenth embodiment, because the protrusion structure 1112b is directly matched with the supporting pillar 1116b, the current directly passes through the protrusion structure 1112b after passing through the supporting pillar 1116b, and the current in the thirteenth embodiment also passes through the protrusion structure 1112a after passing through the pore structure in the porous surface structure after passing through the supporting pillar 1116 a.

As a variation of the fourteenth embodiment, the variation idea lies in: the height of the support column lower than the porous surface structure is changed into: the supporting columns 1116c are located inside the porous surface structure 111, the top ends of the supporting columns 1116c are substantially flush with the top ends of the porous surface structure, the height of the supporting columns 1116c is substantially equal to the height of the porous surface structure, and at this time, the protrusion structures 1112c are also in direct contact with the supporting columns 1116c above the protrusion structures, and the two are at least partially overlapped (e.g. partially overlapped or completely overlapped), as shown in fig. 11 c.

Illustratively, the porous surface structure 1111, the protrusion structure 1112c, and the support columns 1116c are integrally formed structures, for example, by a 3D printing additive manufacturing process, a vapor deposition process, or the like. For other contents in this modified implementation manner, reference may be made to the sixth embodiment and the fourteenth embodiment, which are not described herein again.

Similarly, as another variation of the fourteenth embodiment, the variation idea lies in: the height of the support column lower than the porous surface structure is changed into: the top surfaces of all the support columns 1116d are set higher than the top surfaces of the porous surface structures, as shown in fig. 11d, and the height of each support column 1116d is higher than that of the porous surface structure of its corresponding adjacent portion. At this point, the raised structure 1112d also engages the support post 1116d directly above it, at least partially (e.g., partially or completely) coincident therewith, as shown in fig. 11 d. Illustratively, the porous surface structure 1111, the protrusion structure 1112D, and the support pillar 1116D are integrally formed structures, for example, by a 3D printing additive manufacturing process, a vapor deposition process, or the like. For other contents in this modified implementation manner, reference may be made to the seventh embodiment and the fourteenth embodiment, which are not described herein again.

Example fifteen:

as shown in fig. 12, in the fifteenth embodiment, on the basis of the first embodiment, a plurality of supporting pillars 1216 for limiting are further disposed between the non-porous bottom plate 1212 (or the porous structure with low porosity) and the positive electrode 1214, and the supporting pillars 1216 are disposed on the surface of the non-porous bottom plate 1212, which is close to the porous surface structure 1211. Optionally, the top surface of the supporting column 1216 is lower than the top surface of the corresponding portion of the porous surface structure, the height of the supporting column 1216 is lower than the height of the porous surface structure, and the supporting column 1216 is hidden inside the porous surface structure 1211. Similarly, in the fifteenth embodiment, a plurality of raised structures 12a are pre-fabricated on the bottom side of the non-porous base plate 1212, and the raised structures 12a contact the top of the substrate 1213.

In the fifteenth embodiment, the positive electrode 1214 first contacts with the surface of the porous surface structure 1211 located at a higher position therebelow, and then the surface of the porous surface structure 1211 sinks due to damage caused by heat generation of the contact resistance until it sinks to the top position of the supporting post 1216 (the maximum sinking degree can only sink to the top position, even if the sinking degree is not large, the sinking position is higher than the top position), because the supporting post 1216 is a solid structure, the supporting post 1216 plays a limiting role, so as to ensure that the height of the final surface of the porous surface structure reaches the height position of the supporting post 1216, thereby preventing the porous surface structure from being compressed too much.

For example, the support posts 1216 may be aligned with or staggered from the corresponding raised structures 12a below the support posts; simultaneously, whether the material of support column 1216 in this embodiment is conducting material or non-conducting material, the utility model discloses do not do the restriction to this all, as long as can finally satisfy the limiting displacement of support column 1216, avoid porous surface structure by too much compression can. When the supporting posts 1216 are made of a conductive material, the current is preferably selected to pass through the supporting posts 1216 and then pass through the porous surface structure near the supporting posts 1216 to reach the corresponding bump structures 12a, so as to improve the damage problem caused by the heat generation of the contact resistance on the surface of the porous surface structure. When the support posts 1216 are non-conductive materials, the current flows from the positive electrode 1214 to the porous surface structure 1211 to the raised structures 12 a. In the above situation of this embodiment, although the surface of the porous surface structure is still damaged to some extent, the supporting posts 1216 are always lower than the surface of the porous surface structure 1212, which ultimately does not affect the basic function of the whole connection structure applied in the related art.

Example sixteen:

the porous surface structure and the substrate of the present invention are combined by resistance welding (e.g., projection welding), and when the area of the workpiece to be welded is too large, a greater number of projection structures are required. After the bump structures are determined, in order to ensure the welding strength between each bump structure and the substrate, the total current of the electrode needs to be increased, which may cause the cost increase of power supply equipment, the damage of the electrode and the surface damage of the porous surface structure to be increased, and at this time, the welded workpiece can be welded in a divisional and batch manner.

In the sixteenth embodiment, the porous surface structure 1311 is resistance-welded to the substrate 1313 in batches by dividing into regions, and as shown in fig. 13, a first positive electrode 1314-1 is connected to the upper portion of the porous surface structure 1311-1 corresponding to the first region, and a second positive electrode 1314-2 is connected to the upper portion of the porous surface structure 1311-2 corresponding to the second region. The top of the negative electrode 1315 is attached to the bottom of the substrate 1313, a non-porous bottom plate 1312 (or a porous structure with low porosity) is disposed between the porous surface structure 1311 and the substrate 1313, and a plurality of protruding structures are prefabricated on the bottom surface of the non-porous bottom plate 1312, and the protruding structures are in contact with the top of the substrate 1313.

In this embodiment, the porous surface structure 1311 is resistance welded by using divided regions, but the positive electrode corresponding to each region may not completely cover the corresponding porous surface structure during the divided welding, for example, the edge of one side of any two adjacent divided regions may not be completely covered, and the position of the edge of each region compared with the other covered portion may be slightly higher (i.e., raised edge), which affects the surface flatness of the porous surface structure 1311, and even affects the basic function (e.g., bone ingrowth) of the connection structure applied to the related field.

In order to overcome the above-mentioned defects, the recess 13a is disposed on the porous surface structure 1311 of the sixteen embodiment, and the top of the porous surface structure 1311 is divided into a plurality of regions, such as the porous surface structure 1311-1 of the first region and the porous surface structure 1311-2 of the second region in the figure. The groove 13a is in a long strip shape, and the porous surface structure 1311-1 of the first region and the porous surface structure 1311-2 of the second region are respectively located at two sides of the long strip-shaped groove 13 a. The top of the groove 13a is lower than the top of the porous surface structure 1311. The height of the grooves 13a is less than the height of the porous surface structure 1311.

Illustratively, the body of the non-porous base plate 1312, the grooves 13a, and the porous surface structure 1311 are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, or the like. The groove 13a may also be formed by machining.

Fig. 13 shows that there is a gap between the first positive electrode 1314-1 and the second positive electrode 1314-2, and when the first positive electrode 1314-1 and the second positive electrode 1314-2 are in sequence, fig. 13 only represents a schematic position, or the first positive electrode 1314-1 and the second positive electrode 1314-2 are not in sequence and can be pressed on the porous surface structure of the corresponding region at the same time; and the coverage area of the positive electrode corresponding to each divided region is larger than the surface area of the porous surface structure 1311-1 of the corresponding region.

Since the groove 13a is designed in this embodiment, the side of the groove 13a near the first positive electrode 1314-1 is referred to as the first side, and the other side of the groove 13a near the second positive electrode 1314-2 is referred to as the second side.

In this embodiment, the porous surface structure 1311-1 of the first region is first connected to the substrate 1313 by resistance welding: the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 of the corresponding area, the part of the first positive electrode 1314-1 exceeding the connection area does not exceed the edge of the second side of the groove 13a, and a small amount of sinking but no convex edge is formed on the surface of the porous surface structure 1311-1 of the first area due to heat generation of contact resistance between the first positive electrode 1314-1 and the porous surface structure 1311-1 of the first area; the resistance welding of the porous surface structure 1311-2 of the second region to the substrate 1313 then continues: the second positive electrode 1314-2 covers the surface contact of the porous surface structure 1311-2 of the corresponding region, and the part of the second positive electrode 1314-2 exceeding the connection region does not exceed one side edge of the first positive electrode 1314-1 close to the second positive electrode 1314-2, and the surface of the porous surface structure 1311-2 of the second region sinks a little but does not form a convex edge due to heat generation of contact resistance between the second positive electrode 1314-2 and the porous surface structure 1311-2 of the second region. When the first positive electrode 1314-1 and the second positive electrode 1314-2 are in sequence, the first positive electrode 1314-1 and the second positive electrode 1314-2 can be the same electrode.

Or, the first positive electrode 1314-1 and the second positive electrode 1314-2 are not in sequence and are pressed on the porous surface structures of the corresponding regions at the same time, so that the porous surface structures 1311-1 of the first regions and the porous surface structures 1311-2 of the second regions are in resistance welding with the substrate at the same time, wherein the bottom surface of the first positive electrode 1314-1 covers the porous surface structures 1311-1 of the corresponding regions, and the part of the first positive electrode 1314-1 exceeding the connecting region does not exceed the edge of the second side of the groove 13 a; and the second positive electrode 1314-2 covers the porous surface structure 1311-2 surface contact of the corresponding area, and the part of the second positive electrode 1314-2 beyond the connection area does not exceed the edge of the first side of the groove 13 a.

The method solves the problem of edge convex edge caused by welding in the subareas. The process requires controlling the position of the porous surface structure to sink higher than the top of the groove 13 a.

As a variation of the sixteen embodiments, the following:

as shown in fig. 14, a first positive electrode 1414-1 is connected to the porous surface structure 1411-1 corresponding to the first region, and a second positive electrode 1414-2 is connected to the porous surface structure 1411-2 corresponding to the second region. The top of negative electrode 1415 is attached to the bottom of substrate 1413, a non-porous base plate 1412 (or a porous structure of low porosity) is disposed between porous surface structure 1411 and substrate 1413, and a plurality of raised structures are preformed on the bottom surface of non-porous base plate 1412, which contact the top of substrate 1413.

The porous surface structure 1411 is provided with grooves 14a dividing the top of the porous surface structure 1411 into a plurality of regions, such as a first region of the porous surface structure 1411-1 and a second region of the porous surface structure 1411-2. The groove 14a is in a long strip shape, and the porous surface structure 1411-1 of the first region and the porous surface structure 1411-2 of the second region are respectively located at two sides of the long strip groove 14 a. The top of the groove 14a is lower than the top of the porous surface structure 1411. The height of the grooves 14a is less than the height of the porous surface structure 1411. Since the groove 14a is designed in this embodiment, the side of the groove 14a near the first positive electrode 1414-1 is referred to as the first side, and the other side of the groove 14a near the second positive electrode 1414-2 is referred to as the second side.

As shown in fig. 14, there is an overlapping portion between the first positive electrode 1414-1 and the second positive electrode 1414-2 (the first positive electrode 1414-1 and the second positive electrode 1414-2 are in sequence, and fig. 14 only represents a schematic position).

The first positive electrode 1414-1 is in contact with the porous surface structure 1411-1 of the first region, and the first positive electrode 1414-1 exceeds a part of the groove 14a (i.e. the first positive electrode 1414-1 crosses over the first side of the groove 14a but does not exceed the second side of the groove 14 a), and is further in contact with a part of the porous surface structure 1411-2 of the second region, after the welding process is completed, the surface of the porous surface structure 1411-2 of the second region sinks a little, and the surface of the edge of the porous surface structure 1411-2 of the second region has an indentation; then the second positive electrode 1414-2 contacts with the porous surface structure 1411-2 of the second area, and the second positive electrode 1414-2 crosses the remaining part of the groove 14a or crosses the whole groove 14a, and the second positive electrode 1414-2 exceeds the indentation convex edge, so that the indentation convex edge is pressed and flattened by pressing the second positive electrode 1414-2 to the indentation convex edge possibly generated by the porous surface structure 1411-2.

Or, the first positive electrode 1414-1 is in contact with the porous surface structure 1411-1 of the first area, and the first positive electrode 1414-1 does not exceed the first side of the groove 14a, after the welding process is completed, the surface of the porous surface structure 1411-1 of the first area sinks a little and has an indentation convex edge, then the second positive electrode 1414-2 is in contact with the porous surface structure 1411-2 of the second area, the second positive electrode 1414-2 spans the whole groove 13a, and the indentation convex edge generated by the surface of the second positive electrode 1414-2 exceeding the porous surface structure 1411-1 ensures that the second positive electrode 1414-2 presses the indentation convex edge generated by the surface of the porous surface structure 1411-1, so that the indentation convex edge is pressed to be flattened. The process requires controlling the position of the porous surface structure to sink higher than or substantially flush with the top of the groove 14 a.

Example seventeen:

the seventeenth embodiment still adopts the resistance welding with the divided areas; the difference from the sixteenth embodiment is that the porous surface structure of the seventeenth embodiment (not shown) does not adopt a groove design, also in order to solve the problem of raised edges of the indentations caused by welding in different areas. In this example, when the porous surface structures of two adjacent sub-areas are sequentially resistance welded, because the coverage area of the first positive electrode is smaller than the area of the corresponding area, after the first resistance welding, the edge of the first area is raised (the raised position is a relative position of a height, which means that the edge part which is not recessed is higher than other recessed parts), and at this time, it is required to ensure that the second positive electrode which is next resistance welded can cover the edge part in the first area which is originally raised, so that the porous surface structure of the raised edge part in the second resistance welding process can be recessed, thereby avoiding the problem of edge indentation and convex edge caused by the sub-area welding.

Example eighteen:

as shown in fig. 15, the top end of the non-porous bottom plate 1512 in this embodiment eighteen is provided with a limiting structure 15a, the limiting structure 15a is in an elongated shape and can be used as a reference for dividing regions, and the limiting structure 15a is disposed at the edge of the adjacent side of any two adjacent regions. The top of the position-limiting structure 15a is lower than the top of the porous surface structure 1511, and the height of the position-limiting structure 15a is less than the height of the porous surface structure 1511. Illustratively, the body of the non-porous base plate 1512, the limiting structure 15a, and the porous surface structure 1511 are integrally formed structures, for example, by a 3D printing additive manufacturing process, or a vapor deposition process, etc.

The stopper structure 15a in this embodiment is a solid structure or a porous structure having a porosity lower than those of the porous surface structures 1311-1 and 1311-2.

The positive electrode in this embodiment eighteen may be a large planar electrode 1514 shown in fig. 15, a porous surface structure covering multiple regions, a first positive electrode 1314-1 and a second positive electrode 1314-2 with gaps in fig. 13, or a first positive electrode 1414-1 and a second positive electrode 1414-2 at least partially overlapped in fig. 14. At this time, after the composite body of the porous surface structure 1511 and the non-porous base plate 1512 is bonded to the substrate 1513 by resistance welding, the surface of the porous surface structure 1511 in each region is slightly depressed without forming a convex edge, and the limit of the depression is limited by the stopper structure 15 a. The method not only solves the problem of edge convex edge caused by welding in different areas, but also limits the sinking position of the porous surface structure caused by the welding process.

Example nineteenth:

it should be noted that the present invention is not limited to the projection welding type resistance welding method alone in any of the above embodiments, and may also be used by combining the intermediate body and the substrate by adopting the spot welding type resistance welding method alone or by using the projection welding type resistance welding method and the spot welding type resistance welding method in combination. Specifically, the method comprises the following steps: the spot welding type resistance welding method is different from the projection welding type resistance welding method by providing a projection structure, in which a projection structure is not provided in an intermediate body, and in a welding cycle, welding of one welding spot is completed by a single electrode and moving a workpiece to be welded (such as a complex and a substrate) each time or by a single electrode and moving the electrode each time until a set number of welding spots are completed, thereby ensuring sufficient welding strength between the intermediate body and the substrate. In addition, the present invention can also be used in combination with the projection welding type resistance welding method and the spot welding type resistance welding method, for example, after the projection welding type resistance welding method in any of the above embodiments is completed, the spot welding type resistance welding method is further adopted for operation, so as to enhance the welding strength between the intermediate body and the substrate.

The projection welding type resistance welding method of the utility model can weld a plurality of welding spots simultaneously in one welding cycle, has high production efficiency and has no shunt influence; meanwhile, as the current density is concentrated on the salient points and is high, the welding can be carried out by adopting smaller current, smaller nuggets can be reliably formed, and the nugget offset phenomenon of spot welding type resistance welding is overcome; the convex points of the projection welding type resistance welding method are accurate in position and consistent in size, and the strength of each point is uniform, so that the size of a single projection welding spot can be smaller than that of spot welding for the given welding strength; in addition, because of the adoption of the large plane electrode and the arrangement of the salient points on the intermediate body, the indentation on the exposed surface of the substrate can be reduced to the maximum extent, and meanwhile, the large plane electrode has small current density and good heat dissipation, and the abrasion of the electrode is much smaller than that of a spot welding type, thereby greatly reducing the maintenance and repair cost of the electrode.

In the projection welding resistance welding process in any of the above embodiments, the projection structure is mainly characterized in that the projection of the middle part is pressed by the upper electrode to be larger and is combined with the substrate by resistance heat generated by contact, and the side parts of the projection structure are not in sufficient contact with the substrate, so that the welding combination cannot be performed. In order to improve the welding strength between the protruding structure of the intermediate body and the substrate, the intermediate body is welded from multiple directions by rotating one or more of the electrode, the substrate and the intermediate body, and the protruding structure and the substrate are welded in all directions.

In addition, as an extension of the above embodiment, the method specifically includes: since the porous surface structure 21 of some embodiments is in contact with the large-plane positive electrode 24 above the porous surface structure, the surface of the porous surface structure may be damaged (dented, blackened) due to heat generation of contact resistance, in order to overcome this defect, the surface of the porous surface structure is protected, and the porous surface structure below the insulator at the position where no hole is formed is not damaged by covering an insulator on the porous surface structure and forming a plurality of holes at corresponding positions on the insulator for placing the positive electrode or the good conductive support pillar, etc. The thickness of the insulating part is moderate, and the welding process can be performed sequentially due to the need of ensuring the complete current loop conduction.

As shown in fig. 21, the following modifications can be made based on the first embodiment/the second embodiment: the present invention transforms the bump removal of the non-porous bottom plate (fig. 2) or the low porosity region (fig. 4b) in the first and second embodiments into a (non-porous or low porosity) middle plate structure 272 without a bump structure, and changes the substrate 273 into a substrate composite of the substrate main body 273 and another bumped structure 272A on the top surface thereof, wherein the structure 272A is pre-connected (e.g., resistance welding/laser welding) with the substrate main body 273, and the bump structure of 272A is towards the middle plate structure 272 side without a bump, i.e., the bump of structure 272A contacts the bottom surface of the middle plate structure 272 in the composite.

The surface complex formed by the porous surface structure 271 and the middle plate structure 272, and the base complex formed by the bump structure 272A and the base main body 273 are compressed between the positive electrode 274 and the negative electrode 275. When current is applied, the current flows through the porous surface structure 271, the middle plate structure 272 and the bumps of the structure 272A, and resistance heat is generated due to the contact resistance, so that the bumps of the structure 272A and the bottom of the middle plate structure 272 are heated to a molten or plastic state, and finally, the fixed connection between the

structures

272 and 272A is achieved, so that the surface composite body and the substrate composite body are tightly combined together. In another example, the surface composite still employs the bumpy structures 272 of the first and second embodiments, with the bumps facing the substrate body 273 and the bumps of the structures 272 staggered from the bumps of the structure 272A above the substrate, so that the surface composite and the substrate composite can be bonded together. The utility model discloses an above-mentioned improvement not only is limited to the basis of embodiment one, still is applicable to above-mentioned arbitrary embodiment, the utility model discloses do not do this and describe repeatedly.

As shown in FIG. 22, the following embodiments can be made based on the first embodiment: first, as in the first embodiment, a first complex formed by pre-connecting the first porous surface structure 281-1 and the first non-porous bottom plate 282-1 is disposed on one side of the top of the substrate 283, the first complex is disposed between the positive electrode 24 and the top surface of the substrate 283, and at least a portion of the top of the first porous surface structure 281-1 is in contact with the positive electrode 24; the bottom of the first non-porous bottom plate 282-1 is pre-fabricated with a plurality of first raised structures that contact the top of the substrate 283. Meanwhile, a second complex formed by pre-connecting the second porous surface structure 281-2 and the second non-porous bottom plate 282-2 is disposed on the bottom side of the substrate 283, the second complex is disposed between the bottom surface of the substrate 283 and the negative electrode 285, and at least a portion of the bottom of the second porous surface structure 281-2 is in contact with the negative electrode 285. The second complex has the same structure as the first complex and is axisymmetric with respect to the base 283. According to the principle of the first embodiment, the first composite and the second composite are resistance-welded to the upper and lower surfaces of the base 283 at the same time, respectively, to connect the first composite, the second composite, and the base. This kind of deformation is applicable to above-mentioned arbitrary embodiment equally, and the utility model discloses do not do this and describe again.

Example twenty:

as shown in fig. 16 a-16 c in combination, the present embodiment provides a prosthetic implant, preferably an orthopaedic prosthesis; any one or more of the connection structures and methods in the above-described first to nineteenth embodiments and their respective modified examples may be used. The prosthesis body 1 corresponds to the substrate in the connection structure, at least a part of the surface of the prosthesis body 1 serves as a connection region, and is connected with the composite body 2 comprising the intermediate body and the porous surface structure, and the connection (projection type resistance welding and/or spot type resistance welding) between the intermediate body (e.g., the non-porous base plate 22 in the first embodiment, the second porous structure 42 of the low porosity region in the second embodiment, etc.) and the substrate (e.g., the substrate 23 in the first embodiment, the substrate 43 in the second embodiment, etc.) is realized, so as to form a surface covering for the connection region on the prosthesis.

With reference to the structure and method of the first to nineteenth embodiments or the modified examples thereof, the prosthesis housing is provided, the outer layer is a porous surface structure, the inner layer is a connecting region that is contacted with the intermediate body and is fixed to the prosthesis body by resistance welding, so as to realize connection between the porous surface structure and the prosthesis body and form surface coverage on the connecting region on the prosthesis body, and therefore, the prosthesis housing is applied to various artificial implant prostheses such as other types of orthopaedic prostheses and artificial joints, for example, femoral stems, acetabular cups, femoral condyles, tibial platforms, and the like, and specific reference is made to the description of the twenty-three embodiments later.

The description will be given by taking an artificial hip joint as an example. The artificial hip joint comprises a femoral stem, a femoral ball head (not shown), an acetabular cup and a liner body (not shown), which are all prostheses, and are made of medical materials capable of being implanted into a human body, such as metal materials of titanium alloy, cobalt-chromium-molybdenum alloy, stainless steel and the like, polymers of ultra-high molecular weight polyethylene and the like, ceramics and the like, but are not limited thereto.

The femoral stem 3 (fig. 16 a-16 c) comprises a head 301, a neck 302, and a stem 303, which may be integral or assembled. The head 301 of the femoral stem 3 is in a frustum structure, the first end is connected with the stem body 303 through the neck 302, and the head 301 and the neck 302 have a certain deflection angle relative to the stem and are arranged in a manner of inclining relative to one side of the stem. The lower part of the handle body 303 is inserted into a femoral medullary cavity. The lower portion of the handle 303 may be formed with a plurality of longitudinal grooves. The surface of the stem 303, preferably the surface of the upper part of the stem 303, is porous; the lower portion of the shank 303 may have a smooth surface.

The second end of the head 301 of the femoral stem 3 is inserted into the inner cone mounting structure of the femoral head; the acetabulum cup is sleeved on the outer side of the femoral ball head, and the femoral ball head is contacted with the inner concave surface of the acetabulum lining body, so that the femoral ball head can rotate at the position. The acetabular cup in some examples is a dome that is partially spherical (e.g., hemispherical); a lining body matched with the acetabular cup is arranged in the acetabular cup; the femoral ball head is contacted with the inner concave surface of the lining body, so that the femoral ball head can rotate at the position. The acetabulum cup can be provided with a through hole for arranging a connecting piece (a screw and the like) for connecting the acetabulum cup to the acetabulum socket; the lining body can be provided with corresponding through holes or not. The inner concave surface of the lining body is contacted with the femoral head; the liner body may be made of a metallic material or a non-metallic material (e.g., polyethylene or ceramic, etc.) to reduce wear of the prosthetic joint. The housing is typically made of a metallic material. The outer peripheral surface of the acetabular cup is preferably porous.

The upper surface of the femoral stem handle body 303 and the outer peripheral surface of the acetabular cup shell adopt a porous structure, so that on one hand, the roughness can be increased; on the other hand, osteoblast bone can be induced to grow in, so that the femoral stem is effectively and fixedly connected with the femur, the acetabular cup and the acetabular fossa to form good long-term biological fixation, and the interface stability between the artificial hip joint and host bone tissues is enhanced.

In order to accelerate or strengthen the combination of the bone tissue and the surface of the porous prosthesis, the surface of any prosthesis (which is also applicable to the artificial joint in the subsequent embodiment) contacting the bone tissue can be coated with Hydroxyapatite (HA) and the like; or, gel/collagen or other material is used as carrier for implanting cell, growth factor, etc. and is adhered to the porous surface of the prosthesis; or to form an antimicrobial coating (e.g., antibiotics/silver ions, etc.).

The femoral stem 3 may use the structures and methods (resistance welding) of the first to nineteenth embodiments or the modified examples thereof, which are not described herein again, and reference may be made to the contents of the corresponding embodiments. Wherein the stem body 303 of the femoral stem 3 corresponds to the base in the connection structure; the composite body including the intermediate body (e.g., a non-porous base plate, a porous structure of a low porosity region, etc., as required in various embodiments) and the porous surface structure forms a stem body housing 2, which covers the connection region of the stem body 303a (upper portion), and the porous surface structure 201 is connected to the base by welding the intermediate body to the base, so as to cover the connection region, thereby obtaining the porous structure on the femoral stem body 303.

In some examples, the shank body 303a is formed using forging, casting or machining or powder metallurgy or metal injection molding processes, and the like, preferably of solid construction, easy to machine and of high strength; or the handle body 303a may have a high-density porous structure; the intermediate body can be solid or a porous structure with higher density than the porous surface structure; when both the handle body 303a and the intermediate body 202 are porous structures, the density of the intermediate body 202 is between the density of the handle body 303a and the porous surface structure 201. The intermediate body 202 and the porous surface structure 201 of the stem body housing 2 are preferably implemented by a 3D printing additive manufacturing process, and can form pores and the like well according to design requirements. The shank body 303a and the intermediate body 202 of the shank body housing 2 are effectively connected by resistance welding, so that the problem that the overall strength is greatly reduced when the porous structure is connected to the surface of the femoral shank 3 by a hot pressing process (such as a penetration welding process) and the like at present is solved.

In another example, as shown in fig. 16c, it corresponds to fig. 2 in the first embodiment. The inner stem 303 corresponds to the substrate in the connection structure, the outer porous structure 2201 corresponds to the porous surface structure of the connection structure, and an intermediate (non-porous bottom plate 2202) is provided between the porous structure 2201 and the stem 303. Due to the complex formed by porous structure 2201 and non-porous base plate 2202, and handle body 303 is compressed between positive electrode 2204 and negative electrode 2205. When current is applied, the current flows through the porous structure 2201 and the non-porous bottom plate 2202 to the contact surface and the adjacent area outside the handle body 303, resistance heat is generated to heat the porous structure 2201 and the non-porous bottom plate 2202 to a melting or plastic state, so that the non-porous bottom plate 2202 and the handle body 303 form a combined body, and the fixed connection effect between the non-porous bottom plate 2202 and the handle body 303 is realized, so that the combined body formed by the porous structure 2201 and the non-porous bottom plate 2202 is tightly combined with the handle body 303. Other details regarding the femoral stem suitable for use in the first embodiment are not described herein. It should be noted that, for the femoral stem in this example, as shown in fig. 16c, the positive electrode 2204 is in contact with a part of the porous structure 2201, while the negative electrode 2205 is not in contact with the stem 303 serving as the base, and the negative electrode 2205 may be in contact with the other part of the porous structure 2201, which is the case when the femoral stem is applied to the expanded embodiment shown in fig. 22 in nineteenth embodiment, and the description of the present invention is omitted here.

In a specific example, the upper part of the handle body 303a of the femoral handle 3 is provided with a connecting area; for convenience of description, the side of the femoral stem 3 where the head 301 and the neck 302 are obliquely arranged is the inner side of the femoral stem 3, and the other directions of the stem body 303a are from the rear side to the outer side, the inner side is opposite to the outer side, and the rear side is opposite to the front side according to the counterclockwise direction shown in fig. 16 a; fig. 16a shows the front side and fig. 16b the outer side.

In this example, the connection region of the femoral stem 3 includes the inner, rear, outer, and front surfaces of the upper portion of the stem body 303 a. As shown in fig. 17a to 17e in combination, the grip body case 2 includes two case pieces, one case piece 2-1 corresponding to a part of the inner side surface 01, the rear side surface 02, and a part of the outer side surface 03 of the upper portion of the grip body main body 303 a; the other housing piece 2-2 corresponds to the remaining portion of the upper inside surface 01, the front side surface 04, and the outside surface 03 of the grip main body 303 a. After the two shell body pieces are folded, the two shell body pieces are respectively contacted and welded to the corresponding positions of the connecting areas on the upper portion of the handle body main body. The inner layer of each shell sheet is a central body 202 and the outer layer is wholly or mostly a porous surface structure 201.

As shown in fig. 17d and 17e, the two housing pieces may be symmetrical (or staggered, not shown). For example, after the two shell pieces are formed and folded, adjacent edges may be separated from each other without being connected. Alternatively, the adjacent edges of the two shell pieces on one side (e.g., outer side 03) may be joined when formed and may remain joined when there is some curvature near the adjacent edges (to allow the two shell pieces to close together). Alternatively, the adjacent sides of the two shell pieces may be separated from one another during molding and the adjacent sides of each side may be joined after folding (e.g., by welding or using a connector or other attachment means). The adjacent side refers to the adjacent edge of the two folded shell body bodies. The interconnection of adjacent edges may be made by joining the porous surface structures of the intermediate and/or outer layers of the inner layer of each shell sheet.

Example twenty one:

in this embodiment, the porous structure on the outer circumferential surface of the acetabular cup 300a can be similarly realized by using the structures and methods of the first to nineteenth embodiments or the modified examples thereof.

In one example, as shown in fig. 18a and 18b in combination, corresponding to fig. 2 in the first embodiment, at the outer shell of the acetabular cup, the inner cup body corresponds to the base 2403 of the connection structure, the outer porous structure 2401 corresponds to the porous surface structure of the connection structure, and an intermediate body (non-porous bottom plate 2402) is disposed between the porous structure 2401 and the base 2403. Since the porous structure 2401 is formed as a composite with the non-porous bottom plate 2402 (the composite is formed outside the cup body 3-3 and covers the connection region of the cup body), and the substrate 2403 is compressed between the positive electrode 2404 and the negative electrode 2405. When current is applied, the current flows through the porous structure 2401 and the non-porous bottom plate 2402 to the contact surface and the adjacent area outside the substrate 2403, resistance heat is generated to heat the porous structure 2401 and the non-porous bottom plate 2402 to a molten or plastic state, so that the non-porous bottom plate 2402 and the substrate 2403 form a combined body, the fixed connection effect between the non-porous bottom plate 2402 and the substrate 2403 is realized, the combined body formed by the porous structure 2401 and the non-porous bottom plate 2402 is tightly combined with the substrate 2403, and therefore, the connection area on the cup body is covered, and the porous structure on the outer peripheral surface of the acetabular cup (shell) is obtained. The cup body main body of the acetabular cup of the utility model is matched with the complex (or the intermediate body contained by the complex) at the contact and connection parts. Other details regarding the application of the acetabular cup in the first embodiment are not described herein, and further details regarding the application of the acetabular cup in other embodiments are not described herein.

In some examples, the cup body of the acetabular cup is forged, cast, machined, etc., and is preferably a solid structure that is easy to machine and has high strength; or the cup body main body can also be a high-density porous structure; the intermediate body can be solid or a porous structure with higher density than the porous surface structure; when the cup body main body and the intermediate body both adopt porous structures, the density of the intermediate body is between the density of the handle body main body and the density of the porous surface structure. The intermediate and the porous surface structure are preferably realized by using a 3D printing additive manufacturing process, and the pores and the like can be well controlled to meet the design requirements. The cup body main body and the intermediate body are effectively connected through a resistance welding method, and the problem that the overall strength is greatly reduced due to the hot pressing process (such as a penetration welding process) and the like at present is solved.

In a specific example, the entire outer surface of the cup body may be used as a joining region, and an integral composite body may be disposed in contact therewith and welded at the joining region through an intermediate body included therein. Or a plurality of independent connecting areas can be divided on the whole outer surface of the cup body main body; a plurality of composite bodies (each of which may be in the form of a sheet or other shape, adapted to the dome casing) are respectively brought into corresponding contact with the joining regions and are welded thereto by respective intermediate bodies. Wherein, the inner layer of each complex is an intermediate, and the whole or most of the outer layer is a porous surface structure.

Example twenty two:

the proximal tibia end and the distal femur end form a knee joint, the contact surface of the tibia and the distal femur end is a tibial plateau, and the tibial plateau is an important load structure of the knee joint. In the implant prosthesis, a component for replacing the bone on the femoral side is called a femoral condyle, a component for replacing the bone on the tibial side is called a tibial plateau, and a polyethylene gasket is arranged between the femoral condyle and the tibial plateau, so that the effects of reducing abrasion and restoring the function of the knee joint are achieved.

As shown in fig. 19a and 19b, the tibial plateau 300b is a T-shaped structure that includes an upper tibial tray 300-1 and a lower support portion 300-2. The lower surface of the tibial platform 300b is porous, which can increase roughness; on the other hand, osteoblast bone can be induced to grow in, so that the tibial plateau prosthesis and the tibia of the human body are effectively connected and fixed to replace the damaged and diseased tibial surface, and good long-term biological fixation is formed to bear the pressure load of the human body and meet the requirements of movement and abrasion resistance functions. The porous structure of the lower surface of the tibial plateau 300b may be similarly implemented using the structures and methods of the first through nineteenth embodiments or their modified examples.

In one specific example, as shown in fig. 19a and 19b in combination, the lower surface of the tibial tray 300-1 corresponds to the porous surface structure 2501 of the coupling structure and the upper end of the tibial tray 300-1 corresponds to the base 2503 of the inner side of the coupling structure; an intermediate (non-porous backing plate 2502) is disposed between the porous structure 2501 and the substrate 2503. Due to the complex formed by the porous structure 2501 and the non-porous substrate 2502, and the substrate 2503 is compressed between the positive electrode 2504 and the negative electrode 2505. When an electric current is applied, the electric current flows through the porous structure 2501, the non-porous bottom plate 2502 to the contact surface and the adjacent area of the distal end of the substrate 2503, and resistance heat is generated to heat the porous structure 2501, the non-porous bottom plate 2502 and the substrate 2503 to a molten or plastic state, so that the non-porous bottom plate 2502 and the substrate 2503 form a combined body, and the fixed connection between the non-porous bottom plate 2502 and the substrate 2503 is realized, and the combined body formed by the porous structure 2501 and the non-porous bottom plate 2502 and the substrate 2503 are tightly. The complex of the porous surface structure and the intermediate body in this example is formed at the lower end of the tibial tray and covers the connecting area of the tibial tray. Other details regarding the tibial plateau suitable for use in the first embodiment are not described herein. Details regarding the tibial plateau as applied to other embodiments are not described herein.

Example twenty three:

the artificial knee joint prosthesis comprises a femoral condyle, a tibial tray, a gasket arranged between the femoral condyle and the tibial tray, and a patellar prosthesis. The femoral condyle is connected to the distal femur and the tibial tray is connected to the proximal tibia. The pad component is connected to the tibial tray component and the femoral condyle is in contact with the pad. The lower part of the pad is contacted with the upper surface of the tibial plateau, the outer convex surface of the femoral condyle is contacted with the upper part of the pad and the patella prosthesis joint surface, and the movements of flexion, extension, sliding, rotation and the like can be realized in a specified range.

Wherein the outer convex surface of the main body of the femoral condyle 300c is generally very smooth to reduce wear between it and the liner; the main body of the femoral condyle can be matched and contacted with the osteotomy section formed at the distal end of the femur on the concave surface, so that a porous structure is preferably formed on the concave surface (such as an intracondylar fixing surface) of the main body of the femoral condyle, bone ingrowth is facilitated, close combination of a prosthesis and bone tissues is realized, and the risk of joint replacement operation failure caused by prosthesis loosening after operation is reduced. In this embodiment, the intracondylar fixation surface of the femoral condyle 300c uses a porous structure, which can increase roughness to enhance the initial stability of the prosthesis after operation; on the other hand, the bone ingrowth can be promoted, and the femoral condyle prosthesis and the human femoral condyle can be effectively connected and fixed. The tibia liner is positioned between the femur condyle prosthesis and the tibia platform prosthesis, bears the pressure load of a human body, and meets the requirements of joint kinematics and abrasion resistance.

The porous structure of the intracondylar fixation surface of the femoral condyle 300c can be similarly realized by using the structures and methods of the first to nineteen embodiments or the modified examples thereof.

In one example, as shown in fig. 20b, corresponds to fig. 2 in the first embodiment described above. The inner surface of the femoral condyle corresponds, in order from the outside to the inside, to the porous structure 2601 of the connecting structure, the intermediate body (non-porous base plate 2602) and the base 2603. The medial condyle of the femoral condyle 300c corresponds to the base 2603 of the connection structure, and the intracondylar fixation surface of the femoral condyle 300c uses a porous surface structure 2601. Due to the composite of the porous structure 2601 and the non-porous base plate 2602, and the substrate 2603 is compressed between the positive electrode and the negative electrode. When current is applied, the current flows through the porous structure 2601 and the non-porous base plate 2602 to the contact surface and the adjacent region outside the substrate 2603, and resistance heat is generated to heat the porous structure 2601 and the non-porous base plate 2602 to a molten or plastic state, so that the non-porous base plate 2602 and the substrate 2603 form a combined body, and the non-porous base plate 2602 and the substrate 2603 are fixedly connected, and the combined body formed by the porous structure 2601 and the non-porous base plate 2602 and the substrate 2603 are tightly combined together. The complex of the porous surface structure and the intermediate body in this example is formed on the medial concave surface of the femoral condyle and covers the connection area of the femoral condyle. Other details regarding the femoral condyle that are suitable for use in the first embodiment are not repeated herein. Details regarding the femoral condyle that are applicable to other embodiments are not repeated herein. Likewise, the patellar prosthesis may also employ the structures and methods of any of the above embodiments or variations thereof to add porosity to the bone-contacting surface.

The embodiment of the utility model discloses an embodiment one still not only limits to be applied to above-mentioned prosthesis example to nineteen, equally can be applied to like spinal fusion ware, spine intervertebral facet joint, ankle joint, shoulder joint, elbow joint, finger joint, toe joint, artificial intervertebral disc, intervertebral facet joint, lower jaw joint, wrist joint etc. and concrete structure and principle refer to above-mentioned, the utility model discloses do not do here and describe repeatedly.

While the present invention has been described in detail with reference to the preferred embodiments thereof, it should be understood that the above description should not be taken as limiting the present invention. Numerous modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims.

Claims

1. A porous surface structure and substrate connection structure, comprising:

2. The connection structure according to claim 1,

the porous surface structure in the composite is referred to as a first porous structure;

the intermediate is a solid structure, or the intermediate is a second porous structure and the second porous structure has a porosity lower than the porosity of the first porous structure.

3. The connection structure according to claim 1,

the substrate, the porous surface structure and the intermediate body are made of conductive materials.

4. The connection structure according to claim 2,

the intermediate body comprises an intermediate plate structure.

5. The connection structure according to claim 4,

the middle plate is provided with a plurality of protruding structures, the protruding structures are arranged on one side, close to the substrate, of the middle plate, and protruding points of the protruding structures are in contact with the substrate.

6. The connection structure according to claim 2,

the intermediate body is the second porous structure, the second porous structure comprises a plurality of protruding structures, the protruding structures are formed on one side, close to the substrate, of the second porous structure, and the protruding points of the protruding structures are in contact with the substrate.

7. The connection structure according to claim 2,

the intermediate body comprises a plurality of raised structures which are dispersedly arranged and formed on one side of the porous surface structure close to the substrate, and the salient points of the raised structures are in contact with the substrate.

8. The connection structure according to claim 1,

the connecting structure further comprises a plurality of support posts, all or at least part of each support post being located within the porous surface structure.

9. The connection structure according to claim 8,

the supporting columns are correspondingly arranged and contacted with the convex structures of the intermediate body, or the supporting columns of the intermediate body and the convex structures of the intermediate body are distributed in a staggered mode and are not contacted;

the salient points of the protruding structures are in contact with the substrate;

wherein the raised structure is formed on the porous surface structure on a side adjacent to the substrate; alternatively, the intermediate is a second porous structure and the porosity of the second porous structure is lower than the porosity of the porous surface structure; the convex structure is formed on one side of the second porous structure close to the substrate;

alternatively, the intermediate body comprises an intermediate plate structure formed on the porous surface structure on a side adjacent to the substrate; the convex structure is formed on one side of the middle plate structure close to the substrate.

10. The connection structure according to claim 8,

the surface of the side of the support column far away from the substrate exceeds the surface of the porous surface structure;

or the surface of the side of the support column far away from the substrate is lower than the surface of the porous surface structure;

or the surface of the side of the support column far away from the substrate is flush with the surface of the porous surface structure.

11. The connection structure according to claim 10,

and when the surface of the side of the support column far away from the substrate exceeds the surface of the porous surface structure, cutting the part of the support column exceeding the porous surface structure after the resistance welding is finished.

12. The connection structure according to claim 10,

the supporting columns are positioned in the prefabricated gaps of the porous surface structure, grooves are formed in the supporting columns and used for placing the plurality of electrode monomers in the first polarity electrode, and the inserted electrode monomers are in conductive contact with the supporting columns; the support column is of a porous structure or a solid structure.

13. The connection structure according to claim 10,

when the surface of the side of the support column far away from the substrate exceeds the surface of the porous surface structure: the supporting column is of a multi-section structure and at least comprises a first section part exceeding the porous surface structure and a remaining second section part;

the first section part is of a porous structure;

the second section part is of a porous structure or a solid structure, and the surface of one side, far away from the substrate, of the second section part is flush with the surface of the porous surface structure, so that the first section part is in contact with the first polar electrode to generate heat to enable the supporting column to sink to the surface, far away from the substrate, of the second section part.

14. The connection structure according to claim 8,

when the supporting column is an electric conductor, the supporting column is connected to the current loop, and the supporting column is in conductive contact with any one or more of the following components: a first polar electrode, a porous surface structure, and an intermediate.

15. The connection structure according to claim 8,

the support column is an insulator.

16. The connecting structure according to any one of claims 5 to 7 or 9, wherein the projection structure is located at a position on the intermediate body near a contact position of the porous surface structure with the intermediate body.

17. The connecting structure according to any one of claims 1 to 15,

at least part of the pores in the porous surface structure are filled with a conductive material.

18. The connection structure according to claim 17,

at least part of the pores in the porous surface structure are filled with powdered conductive material.

19. The connecting structure according to any one of claims 1 to 15,

laying a deformable conductive medium in a solid film shape on at least part of the surface of the porous surface structure, wherein the deformable conductive medium is positioned between the first polar electrode and the porous surface structure; and/or spraying a solid conductive medium or a liquid conductive agent between at least part of the surface of the porous surface structure and the first polar electrode.

20. The connecting structure according to any one of claims 1 to 15,

injecting a molten conductive medium into at least part of the pores of the porous surface structure, and/or placing the conductive medium into at least part of the pores of the porous surface structure and melting the conductive medium by high temperature;

the melting point of the conductive medium is lower than the melting point of the substrate and/or the melting point of the porous surface structure.

21. The connecting structure according to any one of claims 1 to 15,

the substrate is a solid structure, or the substrate is a third porous structure and the porosity of the third porous structure is less than the porosity of the porous surface structure.

22. The connection structure according to claim 21,

the substrate is made by forging or casting or machining or powder metallurgy or metal injection molding processes.

23. The connecting structure according to any one of claims 1 to 15,

the porous surface structure of the composite is integrally formed with the intermediate.

24. The connection structure according to claim 23,

the porous surface structure and the intermediate of the complex are realized through a 3D printing additive manufacturing process or a vapor deposition process.

25. The connecting structure according to any one of claims 1 to 15,

the porous surface structure, the intermediate body and the support column are integrally formed.

26. The connecting structure according to any one of claims 1 to 15,

the surface of the porous surface structure is provided with a plurality of grooves, the surfaces of the grooves are lower than the surface of the porous surface structure, and the porous surface structure is divided into a plurality of areas;

27. The connection structure according to claim 26,

on the surface of the porous surface structure, two adjacent areas divided by the grooves are respectively covered by two different first polarity electrodes with different covering positions which are not overlapped;

or two adjacent areas divided by the grooves on the surface of the porous surface structure are respectively covered by two different first polarity electrodes twice according to the sequence;

or, two adjacent areas divided by the grooves on the surface of the porous surface structure are covered by the same first polarity electrode twice in sequence.

28. The connection structure according to claim 26,

the groove is long.

29. The connecting structure according to any one of claims 1 to 15,

dividing the porous surface structure into a plurality of regions, wherein any two adjacent divided regions are called a porous structure of a first region and a porous structure of a second region;

the porous structure of the first area is in contact with the corresponding first polarity electrode of the first area, and after the resistance welding of the porous structure of the first area and the substrate is completed, a convex edge is formed on the contact edge of the porous structure of the first area and the first polarity electrode of the first area;

and the porous structure of the second area is in contact with the corresponding first polarity electrode of the second area, and the first polarity electrode of the second area at least covers the convex edge of one side, close to the porous structure of the second area, of the porous structure of the first area, so that the resistance welding of the porous structure of the second area and the substrate is completed.

30. The connecting structure according to any one of claims 1 to 15,

the substrate comprises a surface connecting layer, the surface connecting layer is connected with the substrate main body in advance, and the surface connecting layer is arranged between the intermediate of the complex and the substrate main body;

the surface connecting layer comprises a convex structure, and the convex points of the convex structure of the surface connecting layer are in contact with the intermediate body of the complex.

31. The connection structure according to claim 30,

the surface connecting layer of the substrate is connected with the substrate main body in a pre-welding mode.

32. The connection structure according to claim 30,

one side of the intermediate body, which is close to the substrate, is planar;

or the convex structure arranged on one side of the intermediate body close to the substrate is staggered with the convex structure of the surface connecting layer.

33. A manufacturing apparatus for manufacturing a connection structure of the porous surface structure according to any one of claims 1 to 32 and a substrate, comprising:

a first polar electrode in electrically conductive contact with a porous surface structure in a composite and/or an intermediate in a composite, the porous surface structure and the intermediate being pre-connected to form the composite;

and the second polarity electrode is in conductive contact with the substrate, the intermediate body is positioned between the porous surface structure and the substrate, the intermediate body is in contact with the substrate, and the substrate and the composite body are arranged between the first polarity electrode and the second polarity electrode, so that the intermediate body and the substrate are subjected to resistance welding to realize the connection of the composite body and the substrate.

34. The manufacturing apparatus of claim 33,

the resistance welding is projection welding type resistance welding and/or spot welding type resistance welding.

35. The manufacturing apparatus of claim 34,

when the resistance welding is projection welding type resistance welding, the first polarity electrode is a continuous plane electrode or a plurality of segmented electrode monomers, and the second polarity electrode is a continuous plane electrode or a plurality of segmented electrode monomers;

when the resistance welding is spot welding, the first polarity electrode and/or the second polarity electrode are segmented multiple electrode cells.

36. The manufacturing apparatus of claim 34,

in spot welding resistance welding, the welding is performed by moving any one or more of the following members so as to move from a current welding position to a next welding position: a combination of a first polarity electrode, a second polarity electrode, an intermediate body that has completed a weld at least one contact location, and a substrate.

37. The manufacturing apparatus as set forth in any one of claims 33 to 36 wherein when the first polar electrode is divided into a plurality of electrode cells, the electrode cells are inserted into the preformed voids in the porous surface structure, and the electrode cells are adjacent to the intermediate body such that the inserted electrode cells are in conductive contact with the intermediate body or the inserted electrode cells are in conductive contact with the intermediate body via the porous surface structure.

38. The manufacturing apparatus of claim 37,

the electrode monomer penetrates from the surface of the porous surface structure until penetrating to the surface of the intermediate body or the interior of the intermediate body, so that the inserted electrode monomer is in conductive contact with the intermediate body.

39. The manufacturing apparatus of claim 37,

the electrode monomer and the porous surface structure are in lateral clearance fit, so that the electrode monomer and the porous surface structure are not contacted at all.

40. The manufacturing apparatus of claim 37,

the plurality of electrode monomers are connected in parallel to another planar electrode and the other planar electrode is connected with a power supply terminal, or the plurality of electrode monomers are connected in parallel and directly connected to the power supply terminal.

41. The manufacturing apparatus as set forth in any one of claims 33 to 36 wherein said first polarity electrode is a flexible electrode, said flexible electrode being flexibly deformed under pressure to match said porous surface structure surface, thereby increasing the contact area between said flexible electrode and said porous surface structure surface.

42. The manufacturing apparatus of claim 33,

the first polarity electrode is a positive electrode, and the second polarity electrode is a negative electrode;

alternatively, the first polarity electrode is a negative electrode and the second polarity electrode is a positive electrode.

43. The manufacturing apparatus of claim 33,

the first polarity electrode and the second polarity electrode are made of a conductive material.

44. The manufacturing apparatus according to any one of claims 33 to 36 and 42 to 43, wherein a plurality of grooves are formed on the surface of the porous surface structure, and the surface of each groove is lower than the surface of the porous surface structure to divide the porous surface structure into a plurality of regions;

each region divided by the groove is covered by the first polarity electrode correspondingly contacted with each region, and the position relation between the edge of the first polarity electrode correspondingly contacted with any region of the porous surface structure and the groove adjacent to any region is as follows: an edge of the first polarity electrode that does not reach the first side of the groove and is not in contact with the first side of the groove, or reaches the first side of the groove, or crosses the first side of the groove and does not exceed the second side of the groove, or crosses the first side of the groove and reaches the second side of the groove, or crosses the second side of the groove and contacts at least a portion of another adjacent region; the first side of the groove is one side close to any one region, and the second side of the groove is one side far away from any one region.

45. The manufacturing apparatus of claim 44,

on the surface of the porous surface structure, two adjacent areas divided by the grooves are respectively covered by two different first polarity electrodes of which the covering positions are not coincident;

or, two adjacent areas divided by the grooves on the surface of the porous surface structure are respectively covered by two different first polarity electrodes twice according to the sequence;

46. The manufacturing apparatus of claim 44,

the groove is long.

47. A production apparatus according to any one of claims 33 to 36 and 42 to 43, wherein the porous surface structure is divided into a plurality of regions, and any two adjacent regions of the division are referred to as a porous structure of the first region and a porous structure of the second region;

48. The manufacturing apparatus of claim 44,

the second polarity electrode is a continuous planar electrode;

or the second polarity electrode is divided into a plurality of areas and is matched with each area respectively.

49. The manufacturing apparatus of claim 45,

the second polarity electrode is a continuous planar electrode;

50. The manufacturing apparatus of claim 47,

the second polarity electrode is a continuous planar electrode;

51. A connection structure of a porous surface structure and a substrate is characterized by comprising two complexes, namely a first complex and a second complex; a first composite body and a second composite body each including a porous surface structure and an intermediate body connected in advance;

the first composite, the substrate and the second composite are disposed between the first polarity electrode and the second polarity electrode; the first composite is placed between the first polar electrode and the substrate, the intermediate in the first composite is in contact with the substrate, the first polar electrode is in electrically conductive contact with the porous surface structure and/or the intermediate in the first composite, the second composite is placed between the second polar electrode and the substrate, the intermediate in the second composite is in contact with the substrate, the second polar electrode is in electrically conductive contact with the porous surface structure and/or the intermediate in the second composite, so as to form a current loop;

and performing resistance welding on the intermediate body of the first composite body and the substrate and the intermediate body of the second composite body and the substrate to realize the connection of the composite body and the substrate.

52. The connection according to claim 51,

the first composite and the second composite have the same structure;

alternatively, the first complex and the second complex are structurally different.

53. The connection according to claim 51,

the porous surface structure is referred to as a first porous structure;

54. The connection according to claim 51,

55. The connection according to claim 53,

the intermediate body comprises an intermediate plate structure.

56. The connection according to claim 55,

57. The connection according to claim 53,

58. The connection according to claim 53,

59. The connection according to claim 51,

60. The connection according to claim 59,

61. The connection according to claim 59,

62. The connection according to claim 61,

63. The connection according to claim 61,

64. The connection according to claim 61,

the first section part is of a porous structure;

65. The connection according to claim 59,

66. The connection according to claim 61,

the support column is an insulator.

67. The connecting structure according to any one of claims 56 to 58 or 60, wherein the projection structure is located on the intermediate body at a position close to a contact position of the porous surface structure with the intermediate body.

68. A connection according to any of claims 51 to 66,

69. The connection according to claim 68,

70. A connection according to any of claims 51 to 66,

71. A connection according to any of claims 51 to 66,

72. A connection according to any of claims 51 to 66,

73. The connection according to claim 72,

74. A connection according to any of claims 51 to 66,

the porous surface structure included in any one of the composites is integrally formed with the intermediate body.

75. The connection according to claim 74,

the porous surface structure and the intermediate contained in any one composite body are realized through a 3D printing additive manufacturing process or a gas phase deposition process.

76. A connection according to any of claims 51 to 66,

the porous surface structure, the intermediate body and the support column included in any one of the composites are integrally formed.

77. A connection according to any of claims 51 to 66,

78. The connection according to claim 77,

79. The connection according to claim 78,

the groove is long.

80. The connecting structure according to any one of claims 51 to 66, wherein the porous surface structure is divided into a plurality of regions, and any two adjacent regions of the division are referred to as a porous structure of the first region and a porous structure of the second region;

81. The bonding structure according to any one of claims 51 to 66, wherein the substrate comprises a surface bonding layer, the surface bonding layer is pre-bonded to the substrate body, and the surface bonding layer is interposed between the intermediate of any one of the composites and the substrate body;

82. The connection according to claim 81,

83. The connection according to claim 81,

one side of the intermediate body, which is close to the substrate, is planar;