TWI808552B - Release film and laminated film - Google Patents

Release film and laminated film Download PDF

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TWI808552B
TWI808552B TW110145157A TW110145157A TWI808552B TW I808552 B TWI808552 B TW I808552B TW 110145157 A TW110145157 A TW 110145157A TW 110145157 A TW110145157 A TW 110145157A TW I808552 B TWI808552 B TW I808552B
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release
film
peeling force
release layer
heating
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TW202227582A (en
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小野侑司
中谷充晴
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日商東洋紡股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/0427Coating with only one layer of a composition containing a polymer binder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/401Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明提供一種離型膜,係於加熱前後均具有輕剝離力,且即便於以高速剝離之情形時亦能夠具有輕剝離力,實質上不含聚矽氧。 本發明之離型膜之特徵在於:係於基材膜積層有離型層,該離型層至少含有含長鏈烷基之丙烯酸樹脂(A)及交聯劑(B),且實質上不含聚矽氧成分;並且,前述離型層所含之含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b滿足式(I):(I) 0.1 ≦ a/b ≦ 7.0。 The present invention provides a release film, which has light peeling force before and after heating, and can also have light peeling force even in the case of high-speed peeling, and does not contain polysiloxane substantially. The release film of the present invention is characterized in that: a release layer is laminated on the substrate film, and the release layer contains at least a long-chain alkyl-containing acrylic resin (A) and a crosslinking agent (B), and does not substantially contain silicone components; and the ratio a/b of the weight (a) of the long-chain alkyl-containing acrylic resin contained in the release layer to the weight (b) of the crosslinking agent (b) satisfies the formula (I): (I) 0.1≦a/b≦7.0.

Description

離型膜以及積層膜Release film and laminated film

本發明係關於一種離型膜。The invention relates to a release film.

於聚乙烯膜等基材積層離型層而構成之離型膜被用於電池用構成構件、黏著劑層保護(OCA(Optical Clear Adhesive;光學膠)用保護、黏著帶用保護等)、醫療領域之經皮吸收型貼附藥用隔離片、陶瓷電容器等電子零件之製造步驟所用之步驟用紙(processing paper)、圖像顯示用構件之保護等多方面之用途。若列舉具體之一例,則黏著片係由基材及黏著劑層所構成,被用作電子零件等之製造步驟用膜。黏著片於用作步驟用膜之前,貼附於離型膜。於該離型膜之表面(與黏著劑層之接觸面),為了提高離型性而設有離型劑層。作為該離型劑層之構成材料,可列舉聚矽氧系離型劑、氟系離型劑或長鏈烷基系離型劑。The release film formed by laminating a release layer on a base material such as a polyethylene film is used for various purposes such as battery structural members, adhesive layer protection (OCA (Optical Clear Adhesive; optical adhesive) protection, adhesive tape protection, etc.), percutaneous absorption type adhesive pharmaceutical separators in the medical field, processing paper used in the manufacturing steps of electronic parts such as ceramic capacitors, and image display members. If a specific example is given, the adhesive sheet is composed of a base material and an adhesive layer, and is used as a film for manufacturing steps of electronic parts and the like. The adhesive sheet is attached to the release film before being used as a process film. On the surface of the release film (the contact surface with the adhesive layer), a release agent layer is provided in order to improve the release property. Examples of the constituent material of the release agent layer include silicone-based release agents, fluorine-based release agents, and long-chain alkyl-based release agents.

聚矽氧系離型劑具有優異之離型性。然而,聚矽氧成分容易轉印到受離型體,有由聚矽氧所致之污染引起電子機器誤動作等問題,難以用於電子零件。氟系離型劑具有優異之離型性及耐熱性。然而,有昂貴且潤濕性差之問題。長鏈烷基系離型劑係潤濕性較聚矽氧系離型劑及氟系離型劑更優異。然而,未必具有充分之離型性。Polysiloxane-based release agents have excellent release properties. However, polysiloxane components are easily transferred to the release body, and there are problems such as contamination of polysiloxane and malfunction of electronic equipment, so it is difficult to use in electronic parts. Fluorine-based release agents have excellent release properties and heat resistance. However, there are problems of being expensive and having poor wettability. Long-chain alkyl-based release agents have better wettability than polysiloxane-based release agents and fluorine-based release agents. However, it does not necessarily have sufficient release properties.

於專利文獻1(日本特開2010-144046號公報),作為能夠防止將接著樹脂塗佈於離型劑時之收縮(cissing),進而維持自接著樹脂膜之剝離性能良好的離型劑,揭示有包含下述聚(甲基)丙烯酸酯作為主劑之離型劑,該聚(甲基)丙烯酸酯係含有(A)烷基或芳基末端單或聚伸烷基二醇(甲基)丙烯酸酯單元、及(B)烷基之碳數為1至30之(甲基)丙烯酸烷基酯單元。In Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2010-144046), as a release agent capable of preventing cissing when the adhesive resin is applied to the release agent and maintaining good peeling performance from the adhesive resin film, a release agent comprising the following poly(meth)acrylate as a main agent is disclosed. Alkyl (meth)acrylate units.

於專利文獻2(日本特開2007-002092號公報),作為具有較聚矽氧樹脂製離型劑更輕之剝離性且不具有轉移性之離型劑,揭示有包含下述有效成分之離型劑,該有效成分係使至少由(甲基)丙烯酸烷基酯與(甲基)丙烯酸羥基烷基酯共聚而成之預聚物利用含異氰酸酯基之化合物交聯而成。In Patent Document 2 (Japanese Unexamined Patent Application Publication No. 2007-002092 ), as a release agent having lighter release properties than silicone resin release agents and without transferability, a release agent containing an active ingredient is disclosed. The active ingredient is formed by cross-linking a prepolymer formed by copolymerizing at least an alkyl (meth)acrylate and a hydroxyalkyl (meth)acrylate with an isocyanate group-containing compound.

於專利文獻3(日本特開2014-151481號公報),作為由加工時之熱所致的離型性之劣化少的離型聚酯膜,揭示有下述積層聚酯膜,其特徵在於:於聚酯膜之至少單面,具有由含有離型劑及活性亞甲基封閉異氰酸酯化合物之塗佈液所形成之塗佈層。 [先前技術文獻] [專利文獻] Patent Document 3 (Japanese Patent Laid-Open No. 2014-151481 ) discloses the following laminated polyester film as a release polyester film with little deterioration in release properties due to heat during processing, which is characterized in that at least one side of the polyester film has a coating layer formed of a coating solution containing a release agent and an active methylene-blocked isocyanate compound. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2010-144046號公報。 [專利文獻2]日本特開2007002092號公報。 [專利文獻3]日本特開2014-151481號公報。 [Patent Document 1] Japanese Unexamined Patent Publication No. 2010-144046. [Patent Document 2] Japanese Patent Laid-Open No. 2007002092. [Patent Document 3] Japanese Patent Laid-Open No. 2014-151481.

[發明所欲解決之課題][Problem to be Solved by the Invention]

然而,專利文獻1之技術中,剝離力大,需求剝離力更輕之離型劑。However, in the technology of Patent Document 1, the peeling force is large, and a release agent with a lighter peeling force is required.

另外,專利文獻2之技術中,有離型劑之潤濕性不充分之問題。專利文獻3之技術中,有加熱後剝離力重,由加熱所致之剝離力的增加之抑制不充分之問題。In addition, in the technique of Patent Document 2, there is a problem that the wettability of the release agent is insufficient. In the technology of Patent Document 3, there is a problem that the peeling force is heavy after heating, and the increase in peeling force by heating is insufficiently suppressed.

另外,於電子零件等之製造步驟中,有時對離型膜施加熱或壓力,此時,長鏈烷基系離型劑有於加熱後剝離力增加之傾向。進而,於製造步驟中高速剝離之情形時,亦有剝離力上升而剝離力增加之傾向。而且,即便能夠剝離,亦有離型層發生內聚破壞(cohesive failure)而離型層成分轉印到受離型體之虞。 如此一來,長鏈烷基系離型劑有無法充分發揮作為離型劑之性能之問題,要求改善該問題。 In addition, heat or pressure may be applied to the release film in the manufacturing process of electronic parts, etc. In this case, the long-chain alkyl-based release agent tends to increase the release force after heating. Furthermore, in the case of high-speed peeling in the manufacturing process, the peeling force tends to increase and the peeling force increases. And even if peeling is possible, cohesive failure (cohesive failure) may occur in the release layer, and the release layer components may be transferred to the release-receiving body. Thus, the long-chain alkyl-based release agent has a problem that it cannot fully exhibit the performance as a release agent, and it is desired to improve this problem.

本發明係解決上述課題,例如提供一種離型膜,係於加熱前後均具有輕剝離力,且即便於以高速剝離之情形時亦能夠具有輕剝離力,實質上不含聚矽氧。 [用以解決課題之手段] The present invention solves the above problems. For example, it provides a release film that has light peeling force before and after heating, and can have light peeling force even when peeling at high speed, and does not contain polysiloxane substantially. [Means to solve the problem]

本案發明人為了解決上述課題而進行了潛心研究,結果發現,藉由具有下述構成之離型膜而能夠達成前述目的,以至完成了本發明。The inventors of the present application conducted intensive studies to solve the above-mentioned problems, and as a result, found that the above-mentioned object can be achieved by a release film having the following configuration, and completed the present invention.

亦即,本發明係由以下之構成所構成。 [1]一種離型膜,其特徵在於:係於基材膜積層有離型層,該離型層至少含有含長鏈烷基之丙烯酸樹脂(A)及交聯劑(B),且實質上不含聚矽氧成分;並且,前述離型層所含之含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b滿足式(I):(I) 0.1 ≦ a/b ≦ 7.0。 [2]於一態樣中,本發明之離型膜中之離型層更含有離型劑(C),前述離型層所含之交聯劑之重量(b)與離型劑之重量(c)之比率c/b滿足式(II):(II) 0.1 ≦ c/b ≦10.0。 [3]於一態樣中,本發明之離型膜係於剝離速度0.3m/min.時之常態剝離力(PF1)為8000mN/50mm以下。 [4]於一態樣中,本發明之離型膜係於剝離速度0.3m/min.時之加熱後(90℃、20h)剝離力(PF2)為前述常態剝離力(PF1)之2倍以下。 [5]於一態樣中,本發明之離型膜係於剝離速度30m/min.時之加熱後(90℃、20h)剝離力(PF3)為前述常態剝離力(PF1)之10倍以下。 [6]本發明之另一態樣中,提供一種積層膜,係於本發明之離型膜之至少一面上積層有黏著層。 [發明功效] That is, the present invention is constituted by the following configurations. [1] A release film, characterized in that: a release layer is laminated on the substrate film, the release layer contains at least a long-chain alkyl-containing acrylic resin (A) and a cross-linking agent (B), and does not substantially contain silicone components; and the ratio a/b of the weight (a) of the long-chain alkyl-containing acrylic resin contained in the release layer to the weight (b) of the cross-linking agent (b) satisfies the formula (I): (I) 0.1≦a/b≦7.0. [2] In one aspect, the release layer of the release film of the present invention further contains a release agent (C), and the ratio c/b of the weight (b) of the crosslinking agent contained in the release layer to the weight (c) of the release agent satisfies the formula (II): (II) 0.1≦c/b≦10.0. [3] In one aspect, the release film of the present invention has a normal peeling force (PF1) of 8000 mN/50 mm or less at a peeling speed of 0.3 m/min. [4] In one aspect, the peeling force (PF2) of the release film of the present invention after heating (90°C, 20h) at a peeling speed of 0.3m/min. is twice or less than the aforementioned normal peeling force (PF1). [5] In one aspect, the peeling force (PF3) of the release film of the present invention after heating (90°C, 20h) at a peeling speed of 30m/min. is 10 times or less than the aforementioned normal peeling force (PF1). [6] In another aspect of the present invention, there is provided a laminated film in which an adhesive layer is laminated on at least one side of the release film of the present invention. [Efficacy of the invention]

根據本發明,可提供一種離型膜,係於加熱前後均具有輕剝離性,而且即便以高速剝離亦維持輕離型性。According to the present invention, it is possible to provide a release film which has light release properties both before and after heating, and which maintains light release properties even if it is peeled at high speed.

發明人進行了潛心研究,結果發現了一種離型膜,其特徵在於:於基材膜積層有離型層,該離型層至少含有含長鏈烷基之丙烯酸樹脂(A)及交聯劑(B),且實質上不含聚矽氧成分,並且,離型層所含之含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b滿足式(I):(I) 0.1 ≦ a/b ≦7.0;藉此,於加熱前後均剝離力輕而且即便高速剝離亦能夠維持輕剝離。 本發明之離型膜係由離型層及基材膜所構成,前述離型層至少含有含長鏈烷基之丙烯酸樹脂(A)及交聯劑(B),且實質上不含聚矽氧成分。 The inventors conducted intensive research and found a release film, which is characterized in that: a release layer is laminated on the substrate film, the release layer contains at least long-chain alkyl-containing acrylic resin (A) and cross-linking agent (B), and does not substantially contain silicone components, and the ratio a/b of the weight (a) of the long-chain alkyl-containing acrylic resin contained in the release layer to the weight (b) of the cross-linking agent satisfies the formula (I): (I) 0.1≦a/b≦7.0; Thereby, the peeling force is light before and after heating, and even if it peels at high speed, it can maintain light peeling. The release film of the present invention is composed of a release layer and a substrate film. The release layer contains at least an acrylic resin (A) containing a long-chain alkyl group and a crosslinking agent (B), and does not substantially contain silicone components.

[基材膜] 本發明中之離型膜具備基材、及配置於前述基材之表面的離型層。若於前述離型膜之離型層上配置受離型體,則能夠將受離型體成形為與基材同樣之形狀。另外,離型層與受離型體係容易剝離,故而亦能夠將受離型體之形狀變形、維持於所需之形狀。離型層可配置於基材之表面之一面,亦可配置於兩面。 [Substrate film] The release film in this invention is equipped with the release layer arrange|positioned on the surface of a base material and the said base material. If the release-receiving body is arranged on the release layer of the release film, the release-receiving body can be formed into the same shape as the substrate. In addition, the release layer and the release-receiving system are easy to peel off, so the shape of the release-receiving body can be deformed and maintained in the desired shape. The release layer can be arranged on one side of the surface of the base material, and can also be arranged on both sides.

作為基材,可使用公知之基材。例如,可使用藉由聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯等聚酯、聚丙烯等聚烯烴、聚醯亞胺等所形成之樹脂膜作為基材。尤其就成本或生產性之觀點而言,較佳為聚酯膜,進而較佳為聚對苯二甲酸乙二酯膜。As a base material, a well-known base material can be used. For example, a resin film formed of polyester such as polyethylene terephthalate and polyethylene naphthalate, polyolefin such as polypropylene, polyimide, or the like can be used as the base material. In particular, from the viewpoint of cost or productivity, a polyester film is preferred, and a polyethylene terephthalate film is further preferred.

基材之厚度較佳為10μm以上至188μm以下,進而較佳為25μm以上至100μm以下。藉由基材之厚度為10μm以上,而於基材生產時、加工步驟、成型時,能夠抑制由熱所致之變形。另一方面,若基材之厚度為188μm以下,則能夠滿足基材所要求之物性,並且亦抑制於使用後廢棄之基材之量,能夠減小對環境負荷之負擔。The thickness of the substrate is preferably not less than 10 μm and not more than 188 μm, and more preferably not less than 25 μm and not more than 100 μm. With the thickness of the base material being 10 μm or more, deformation caused by heat can be suppressed during production, processing steps, and molding of the base material. On the other hand, if the thickness of the base material is 188 μm or less, the physical properties required for the base material can be satisfied, and the amount of the base material discarded after use can be suppressed, thereby reducing the burden on the environment.

於基材與離型層之間,亦可配置有用以提高接著性之易接著塗層。另外,於基材中的與配置離型層之面相反之面,亦可配置有用以賦予易滑性或耐熱性、抗靜電性等之塗層。Between the base material and the release layer, an easy-to-adhesive coating for improving adhesion can also be arranged. In addition, a coating layer for imparting slipperiness, heat resistance, antistatic property, etc. may be disposed on the surface of the substrate opposite to the surface on which the release layer is disposed.

本發明所用之基材膜的積層有離型層之面之區域表面平均粗糙度(Sa)較佳為處於1nm至50nm之範圍,更佳為2nm至30nm。本發明所用之基材膜的積層有離型層之面之最大突起高度(P)較佳為2μm以下,更佳為1.5μm以下。若Sa為50nm以下、P為2μm以下,則能夠抑制離型層之厚度不均以及將離型層表面之平滑性保持於一定,進而能夠減少受離型體之厚度不均,能夠抑制將受離型體自離型膜剝離時以厚度薄之部分作為起點而破裂之可能性。The surface average roughness (Sa) of the substrate film used in the present invention on the surface on which the release layer is laminated is preferably in the range of 1 nm to 50 nm, more preferably in the range of 2 nm to 30 nm. The maximum protrusion height (P) of the release layer-laminated surface of the substrate film used in the present invention is preferably 2 μm or less, more preferably 1.5 μm or less. When Sa is 50nm or less and P is 2 μm or less, the uneven thickness of the release layer can be suppressed and the smoothness of the surface of the release layer can be kept constant, thereby reducing the uneven thickness of the release object and suppressing the possibility of cracking from the thin part as the starting point when the release object is peeled from the release film.

本發明所用之基材膜之霧度較佳為10%以下,進而較佳為5%以下,更佳為3%以下。若霧度為10%以下,則於加工離型膜或於離型膜上加工黏著層等時外觀檢查容易。The haze of the substrate film used in the present invention is preferably 10% or less, more preferably 5% or less, more preferably 3% or less. When the haze is 10% or less, it is easy to inspect the appearance when processing a release film or processing an adhesive layer on a release film.

[離型層] 本發明中之離型層係至少含有含長鏈烷基之丙烯酸樹脂(A)及交聯劑(B),且實質上不含聚矽氧成分。例如,藉由使含有含長鏈烷基之丙烯酸樹脂(A)及交聯劑(B)之離型層形成組成物硬化,而能夠形成離型層。於一態樣中,本發明之離型層更含有離型劑(C)。 [release layer] The release layer in the present invention contains at least long-chain alkyl-containing acrylic resin (A) and crosslinking agent (B), and does not substantially contain polysiloxane components. For example, the release layer can be formed by curing the release layer forming composition containing the long-chain alkyl group-containing acrylic resin (A) and the crosslinking agent (B). In one aspect, the release layer of the present invention further contains a release agent (C).

[黏合劑] 作為本發明之離型層所含之黏合劑,係含有含長鏈烷基之丙烯酸樹脂(A)。 另外,作為本發明之離型層所含之黏合劑,可使用各種聚合物。離型層較佳為包含聚酯樹脂、醇酸樹脂、胺基甲酸酯樹脂、含長鏈烷基之丙烯酸樹脂(A)以外之丙烯酸樹脂、環氧樹脂等。進而,前述樹脂較佳為具有長鏈烷基。雖尚未完成理論上的分析,但反覆實驗之結果可認為,藉由黏合劑樹脂中具有長鏈烷基,而能夠使後述之離型劑高效率地配向於離型層表面。尤其本發明之含長鏈烷基之丙烯酸樹脂(A)例如能夠對於形成黏著劑之黏著劑組成物顯示良好之潤濕性。進而,本發明之含長鏈烷基之丙烯酸樹脂(A)能夠提供下述離型膜:對於形成於離型層之上的黏著劑等之受離型體,於加熱前後均具有輕剝離性,且即便以高速剝離亦維持輕離型性。 如此一來,含長鏈烷基之丙烯酸樹脂(A)除了作為離型層中之黏合劑之功能以外,亦可有助於離型性。例如,含長鏈烷基之丙烯酸樹脂(A)之分子量較佳為超過500。 [adhesive] The adhesive contained in the release layer of the present invention contains an acrylic resin (A) containing a long-chain alkyl group. Moreover, various polymers can be used as a binder contained in the release layer of this invention. The release layer preferably contains polyester resins, alkyd resins, urethane resins, acrylic resins other than the long-chain alkyl group-containing acrylic resin (A), epoxy resins, and the like. Furthermore, the aforementioned resin preferably has a long-chain alkyl group. Although the theoretical analysis has not been completed, the results of repeated experiments can be considered that the long-chain alkyl group in the binder resin can efficiently align the release agent described later on the surface of the release layer. In particular, the long-chain alkyl group-containing acrylic resin (A) of the present invention, for example, can exhibit good wettability to an adhesive composition for forming an adhesive. Furthermore, the long-chain alkyl group-containing acrylic resin (A) of the present invention can provide a release film that has light release properties before and after heating, and maintains light release properties even at high-speed peeling, for the release object such as an adhesive formed on the release layer. In this way, the long-chain alkyl group-containing acrylic resin (A) can contribute to the release property in addition to its function as a binder in the release layer. For example, the molecular weight of the long-chain alkyl-containing acrylic resin (A) is preferably over 500.

另外,本發明之離型層係含有含長鏈烷基之丙烯酸樹脂(A),且實質上不含聚矽氧成分。因此,能夠抑制聚矽氧成分轉印到受離型體,因而例如能夠防止受離型體受聚矽氧污染,例如能夠避免由受離型體所引起之電子機器之誤動作。本說明書中所謂「實質上不含聚矽氧成分」,意指不於形成離型層之成分中特意添加聚矽氧成分。例如,於離型層之製造步驟等中,有可能極少地含有預料之外地可存在之聚矽氧組成等。考慮到此種實態,相對於離型層100質量份,離型層所含之聚矽氧成分之量較佳為未達0.1質量份。In addition, the release layer of the present invention contains long-chain alkyl-containing acrylic resin (A) and does not substantially contain silicone components. Therefore, it is possible to suppress the transfer of the polysiloxane component to the release object, thereby preventing the release object from being polluted by polysiloxane, for example, avoiding malfunctions of electronic equipment caused by the release object. The term "substantially free of silicone components" in this specification means that no silicone components are intentionally added to the components forming the release layer. For example, in the manufacturing steps of the release layer, etc., there may be very little polysiloxane composition that may exist unexpectedly. In consideration of such a situation, the amount of the polysiloxane component contained in the release layer is preferably less than 0.1 parts by mass relative to 100 parts by mass of the release layer.

含長鏈烷基之丙烯酸樹脂(A)例如可為將長鏈烷基丙烯酸酯共聚而成之丙烯酸聚合物,亦可為接枝有長鏈烷基之接枝聚合物、使長鏈烷基加成於末端之嵌段聚合物等。關於基質可含有之聚酯樹脂等,亦可採取同樣之態樣。 以下,作為一例,對含長鏈烷基之丙烯酸樹脂(A)加以詳細說明,但關於基質可含有之聚酯樹脂等,亦同樣符合。 The long-chain alkyl-containing acrylic resin (A) may be, for example, an acrylic polymer obtained by copolymerizing long-chain alkyl acrylate, or a graft polymer grafted with a long-chain alkyl group, or a block polymer in which a long-chain alkyl group is added to the terminal. The same aspect can also be adopted regarding the polyester resin etc. which may be contained in the matrix. Hereinafter, as an example, the long-chain alkyl group-containing acrylic resin (A) will be described in detail, but the polyester resin etc. which may be contained in the matrix are similarly applicable.

作為含長鏈烷基之丙烯酸樹脂(A),較佳為包含下述式(1)所表示之X成分及下述式(2)所表示之Y成分的聚合物進行交聯而成。The long-chain alkyl group-containing acrylic resin (A) is preferably obtained by cross-linking a polymer containing an X component represented by the following formula (1) and a Y component represented by the following formula (2).

式(1)中,R 1表示(CnH2n+1)(n=8以上至20以下之整數),R 4表示H或CH 3In formula (1), R 1 represents (CnH2n+1) (n=an integer of 8 to 20), and R 4 represents H or CH 3 .

式(2)中,R 2表示(CmH2mOH)(m=1以上至10以下之整數)或H,R 4表示H或CH 3In formula (2), R 2 represents (CmH2mOH) (m=integer of 1 to 10) or H, and R 4 represents H or CH 3 .

表示X成分之式(1)中,R 1係碳數n為8以上至20以下之烷基。藉由碳數n為8以上,而X成分能夠顯示良好之離型性,能夠抑制由碳數少之烷基可能引起的離型層顯示黏著性之情況。另一方面,若碳數n為20以下,則變得能夠保持X成分之柔軟性,能夠充分確保離型層之被膜表面之潤濕性。碳數n較佳為10以上至18以下,進而較佳為12以上至16以下。另外,R 1可為直鏈狀及分支狀的任一種。若R 1為直鏈狀,則有離型層之剝離性變輕之傾向,故而較佳。 In the formula (1) representing the X component, R 1 is an alkyl group having a carbon number n of 8 to 20. When the carbon number n is 8 or more, the X component can exhibit good release properties, and it is possible to suppress the adhesiveness of the release layer that may be caused by an alkyl group with a small carbon number. On the other hand, when carbon number n is 20 or less, the flexibility of X component can be maintained, and the wettability of the film surface of a release layer can fully be ensured. The carbon number n is preferably from 10 to 18, and more preferably from 12 to 16. In addition, R 1 may be either linear or branched. When R 1 is a straight chain, the peelability of the release layer tends to be light, which is preferable.

表示X成分之式(1)中,R 4為H或CH 3,均合適。作為X成分之原料,可使用下述式(7)所表示之單體。 In the formula (1) representing the X component, R 4 is H or CH 3 , whichever is suitable. As a raw material of X component, the monomer represented by following formula (7) can be used.

式(7)中,R 1表示(CnH2n+1)(n=8以上至20以下之整數),R 4表示H或CH 3In formula (7), R 1 represents (CnH2n+1) (n=an integer from 8 to 20), and R 4 represents H or CH 3 .

作為X成分之原料,具體可使用(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯等。As a raw material of X component, lauryl (meth)acrylate, stearyl (meth)acrylate, etc. can be used specifically,.

表示Y成分之式(2)之R 2中,碳數m為1以上至10以下。若碳數m為10以下,則能夠避免本發明之離型層之交聯密度變稀疏,能夠抑制離型層自身之凝聚力變弱,進而能夠抑制剝離力變重。碳數m較佳為2以上至8以下,進而較佳為2以上至4以下。 In R 2 of the formula (2) representing the Y component, the carbon number m is 1 or more and 10 or less. When the carbon number m is 10 or less, the crosslink density of the release layer of the present invention can be prevented from becoming sparse, the cohesion of the release layer itself can be suppressed from weakening, and the peeling force can be suppressed from becoming heavy. The carbon number m is preferably 2 or more and 8 or less, and more preferably 2 or more and 4 or less.

表示Y成分之式(2)中,R 4為H或CH 3,均合適。作為Y成分之原料,可使用下述式(8)所表示之單體。 In the formula (2) representing the Y component, R 4 is H or CH 3 , whichever is suitable. As a raw material of the Y component, a monomer represented by the following formula (8) can be used.

式(8)中,R 2表示(CmH 2mOH)(m=1以上至10以下之整數)或H,R 4表示H或CH 3In formula (8), R 2 represents (CmH 2 mOH) (m=an integer ranging from 1 to 10) or H, and R 4 represents H or CH 3 .

作為Y成分之原料,具體可使用:(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯等。As a raw material of the Y component, specifically, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, etc. can be used.

[交聯劑] 作為用於形成本發明之離型層之交聯劑(B),可使用聚異氰酸酯、三聚氰胺、環氧化物、鋁螯合物、鈦螯合物、紫外線硬化型樹脂或這些之兩種以上之混合物。其中,藉由使用三聚氰胺而硬化膜為剛性,且耐藥品性、耐候性優異,故而較佳。利用鋁螯合物、鈦螯合物之交聯根據用途不同,有時不宜含有金屬成分。 [Crosslinking agent] As the crosslinking agent (B) for forming the release layer of the present invention, polyisocyanate, melamine, epoxy, aluminum chelate, titanium chelate, ultraviolet curable resin, or a mixture of two or more of these can be used. Among them, since the cured film is rigid by using melamine, and is excellent in chemical resistance and weather resistance, it is preferable. Cross-linking using aluminum chelate and titanium chelate may not contain metal components depending on the application.

本發明中,離型層所含之含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b滿足式(I):(I) 0.1 ≦ a/b ≦ 7.0。 於一態樣中,含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b為0.2以上至5.0以下,例如為0.2以上至4.0以下,亦可為0.2以上至2.5以下。若含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b成為上述範圍內,則含長鏈烷基之丙烯酸樹脂(A)、根據需要進而添加之黏合劑樹脂藉由交聯劑而交聯,離型層之彈性模數提高,故而能夠進一步減輕剝離力。另外,於加熱後亦藉由交聯劑將配向於離型層表面之離型成分加以固定,故而加熱後剝離力之上升受到抑制。若含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b之比率為0.1以下,則存在於離型層表面之黏合劑之離型成分變少,故而例如於受離型體使用黏著劑之態樣中,有可能剝離力變重。 另外,若含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b為7.0以上,則交聯劑變少,故而黏合劑未充分交聯,有離型層強度變得不充分之虞,有可能剝離力變大。另外,該問題有於以高速剝離時變得更明顯之傾向。 In the present invention, the ratio a/b of the weight (a) of the long-chain alkyl-containing acrylic resin contained in the release layer to the weight (b) of the crosslinking agent satisfies the formula (I): (I) 0.1≦a/b≦7.0. In one aspect, the ratio a/b of the weight (a) of the long-chain alkyl-containing acrylic resin to the weight (b) of the crosslinking agent is 0.2 to 5.0, for example, 0.2 to 4.0, or 0.2 to 2.5. When the ratio a/b of the weight (a) of the long-chain alkyl group-containing acrylic resin to the weight (b) of the cross-linking agent falls within the above range, the long-chain alkyl group-containing acrylic resin (A) and, if necessary, the binder resin added are cross-linked by the cross-linking agent, and the modulus of elasticity of the release layer increases, so that the release force can be further reduced. In addition, after heating, the release component aligned on the surface of the release layer is also fixed by the crosslinking agent, so the increase in peeling force after heating is suppressed. If the ratio a/b of the weight (a) of the long-chain alkyl group-containing acrylic resin to the weight (b) of the crosslinking agent is 0.1 or less, the release component of the adhesive present on the surface of the release layer will be reduced, so for example, in the form of using an adhesive on the release type, the peeling force may increase. In addition, if the ratio a/b of the weight (a) of the long-chain alkyl group-containing acrylic resin to the weight (b) of the crosslinking agent is 7.0 or more, the crosslinking agent will be reduced, so the adhesive will not be sufficiently crosslinked, and the strength of the release layer may become insufficient, and the peeling force may increase. In addition, this problem tends to become more conspicuous when peeling at high speed.

作為本發明中之離型層所用之三聚氰胺系化合物,可使用通常之化合物,並無特別限定,較佳為將三聚氰胺與甲醛加以縮合而得,於一分子中分別具有一個以上之三嗪環、以及羥甲基及/或烷氧基甲基。具體而言,較佳為使作為低級醇之甲醇、乙醇、異丙醇、丁醇等,與將三聚氰胺與甲醛加以縮合而得之羥甲基三聚氰胺衍生物進行脫水縮合反應而醚化之化合物等。作為羥甲基化三聚氰胺衍生物,例如可列舉:單羥甲基三聚氰胺、二羥甲基三聚氰胺、三羥甲基三聚氰胺、四羥甲基三聚氰胺、五羥甲基三聚氰胺、六羥甲基三聚氰胺。可使用一種,亦可使用兩種以上都無妨。As the melamine-based compound used for the release layer in the present invention, common compounds can be used without any particular limitation. It is preferably obtained by condensing melamine and formaldehyde, and has one or more triazine rings, and methylol and/or alkoxymethyl groups in one molecule. Specifically, compounds obtained by dehydrating and condensing methanol, ethanol, isopropanol, butanol, which are lower alcohols, and methylol melamine derivatives obtained by condensing melamine and formaldehyde to etherify them are preferred. Examples of methylolated melamine derivatives include monomethylolmelamine, dimethylolmelamine, trimethylolmelamine, tetramethylolmelamine, pentamethylolmelamine, and hexamethylolmelamine. One type may be used, or two or more types may be used.

本發明中使用之三聚氰胺亦可使用市售品。例如可列舉:Cymel 300、Cymel 301、Cymel 303LF、Cymel 350、Cymel 370N、Cymel 771、Cymel 325、Cymel 327、Cymel 703、Cymel 712、Cymel 701、Cymel 266、Cymel 267、Cymel 285、Cymel 232、Cymel 235、Cymel 236、Cymel 238、Cymel 272、Cymel 212、Cymel 253、Cymel 254、Cymel 202、Cymel 207(Allnex Japan股份有限公司製造);Nikalac MW-30M、Nikalac MW-30、Nikalac MW-30HM、Nikalac MW-390、Nikalac MW-100LM、Nikalac MX-750LM、Nikalac MW-22、Nikalac MS-21、Nikalac MS-11、Nikalac MW-24X、Nikalac MS-001、Nikalac MX-002、Nikalac MX-730,Nikalac MX-750、Nikalac MX-708、Nikalac MX-706、Nikalac MX-042、Nikalac MX-035、Nikalac MX-45、Nikalac MX-43、Nikalac MX-417、Nikalac MX-410(日本電石(Nippon Carbide)股份有限公司製造)等。這些中,全醚型之甲基化三聚氰胺樹脂於低溫、短時間時之硬化性及對聚酯膜之密接性之方面而言較佳。作為市售品,可列舉Cymel 303LF、Nikalac MW-30等。The melamine used in this invention can also use a commercial item. For example, Cymel 300, Cymel 301, Cymel 303LF, Cymel 350, Cymel 370N, Cymel 771, Cymel 325, Cymel 327, Cymel 703, Cymel 712, Cymel 701, Cymel 266, Cymel 267, Cymel 285, Cymel 232, Cymel 235, Cymel 236, Cymel 238, Cymel 272, Cymel 212, Cymel 253, Cymel 254, Cymel 202, Cymel 207 (manufactured by Allnex Japan Co., Ltd.); Nikalac MW-30M, Nikalac MW-30, Nikalac MW-30HM, Nikal ac MW-390, Nikalac MW-100LM, Nikalac MX-750LM, Nikalac MW-22, Nikalac MS-21, Nikalac MS-11, Nikalac MW-24X, Nikalac MS-001, Nikalac MX-002, Nikalac MX-730, Nikalac MX-750, Nikalac MX-708, Nikalac MX-706, Nikalac MX-042, Nikalac MX-035, Nikalac MX-45, Nikalac MX-43, Nikalac MX-417, Nikalac MX-410 (manufactured by Nippon Carbide Co., Ltd.), etc. Among these, the full ether type methylated melamine resin is preferable in terms of low temperature, curability in a short time, and adhesiveness to a polyester film. As a commercial item, Cymel 303LF, Nikalac MW-30, etc. are mentioned.

於本發明中之離型層,較佳為添加酸觸媒以促進三聚氰胺系化合物之交聯反應,較佳為於離型層形成用組成物添加酸觸媒並塗佈、硬化。作為所使用之酸觸媒,並無特別限定,可使用現有之酸觸媒,較佳為使用磺酸系觸媒。In the release layer of the present invention, it is preferable to add an acid catalyst to promote the cross-linking reaction of the melamine-based compound, and it is preferable to add an acid catalyst to the composition for forming the release layer, apply it, and harden it. The acid catalyst to be used is not particularly limited, and an existing acid catalyst can be used, but a sulfonic acid catalyst is preferably used.

作為磺酸系觸媒,例如可合適地使用:對甲苯磺酸、二甲苯磺酸、異丙苯磺酸、十二烷基苯磺酸、二壬基萘磺酸、三氟甲磺酸等,就反應性之觀點而言,可尤合適地使用對甲苯磺酸。As the sulfonic acid-based catalyst, for example, p-toluenesulfonic acid, xylenesulfonic acid, cumenesulfonic acid, dodecylbenzenesulfonic acid, dinonylnaphthalenesulfonic acid, trifluoromethanesulfonic acid, etc. can be suitably used. From the viewpoint of reactivity, p-toluenesulfonic acid is particularly suitably used.

原因在於:磺酸系觸媒與羧酸系等其他酸觸媒相比較,酸性度較高而反應性優異,故而可於更低溫加工離型層。因此,能夠抑制由加工時之熱所致的膜之平面性降低、捲繞外觀之劣化故而較佳。The reason is that compared with other acid catalysts such as carboxylic acid, the sulfonic acid catalyst has higher acidity and excellent reactivity, so the release layer can be processed at a lower temperature. Therefore, since the fall of the planarity of a film by the heat at the time of processing, and the deterioration of a winding appearance can be suppressed, it is preferable.

本發明中使用之磺酸系觸媒亦可使用市售品。作為市售品之例,可列舉:Dryer(註冊商標)900(對甲苯磺酸,日立化成公司製造)、NACURE(註冊商標)DNNDSA系列(二壬基萘二磺酸,楠本化成公司製造)、同樣DNNSA系列(二壬基萘(單)磺酸,楠本化成公司製造)、同樣DDBSA系列(十二烷基苯磺酸,楠本化成股份有限公司製造)、同樣p-TSA系列(對甲苯磺酸,楠本化成股份有限公司製造)等。As the sulfonic acid-based catalyst used in the present invention, commercially available ones can also be used. Examples of commercially available products include: Dryer (registered trademark) 900 (p-toluenesulfonic acid, manufactured by Hitachi Chemical Co., Ltd.), NACURE (registered trademark) DNNDSA series (dinonylnaphthalene disulfonic acid, manufactured by Kusumoto Chemical Co., Ltd.), the same DNNSA series (dinonylnaphthalene (mono)sulfonic acid, manufactured by Kusumoto Chemical Co., Ltd.), the same DDBSA series (dodecylbenzenesulfonic acid, manufactured by Kusumoto Chemical Co., Ltd.), the same p-TSA series (p-toluenesulfonic acid, manufactured by Kusumoto Chemical Co., Ltd. Chemical Industry Co., Ltd.), etc.

[離型劑] 於一態樣中,離型層更含有離型劑(C)。本發明所用之離型劑較佳為含有不含聚矽氧之長鏈烷基,較佳為低分子量聚烯烴蠟、長鏈烷基系添加劑、高級醇等。這些之結構可為直鏈狀或分支狀都無妨。這些之中,亦可將兩種以上之材料混合使用。 [Release agent] In one aspect, the release layer further contains a release agent (C). The release agent used in the present invention preferably contains long-chain alkyl groups that do not contain polysiloxane, preferably low-molecular-weight polyolefin waxes, long-chain alkyl-based additives, higher alcohols, and the like. These structures may be linear or branched. Among these, two or more kinds of materials may be mixed and used.

於一態樣中,離型層所含之交聯劑之重量(b)與離型劑之重量(c)之比率c/b滿足式(II):(II) 0.1 ≦ c/b ≦ 10.0。 例如,作為本發明中之離型劑之添加量,較佳為交聯劑之重量(b)與離型劑之重量(c)之比率c/b為7.0以下,例如為5.0以下。另外,比率c/b亦可為0.15以上。 藉由在該範圍調整離型劑/交聯劑之比率(c/b),而離型劑成分朝離型層表面偏析,藉此能夠減輕常態剝離力。進而,於加熱後配向於離型層表面之離型成分亦由交聯劑固定,故而抑制加熱後剝離力之上升。 另一方面,若離型劑/交聯劑之比率為10.0以上則交聯劑少,故而有可能於加熱時無法使離型成分預先停留於離型層表層,有加熱後剝離力變重之虞。 In one aspect, the ratio c/b of the weight (b) of the crosslinking agent contained in the release layer to the weight (c) of the release agent satisfies the formula (II): (II) 0.1≦c/b≦10.0. For example, as the addition amount of the release agent in the present invention, the ratio c/b of the weight (b) of the crosslinking agent to the weight (c) of the release agent is preferably 7.0 or less, for example, 5.0 or less. In addition, the ratio c/b may be 0.15 or more. By adjusting the release agent/crosslinking agent ratio (c/b) within this range, the release agent components segregate toward the surface of the release layer, thereby reducing the normal peeling force. Furthermore, since the release component aligned on the surface of the release layer after heating is also fixed by the crosslinking agent, the increase in peeling force after heating is suppressed. On the other hand, if the ratio of release agent/crosslinking agent is 10.0 or more, there will be less crosslinking agent, so the release component may not be able to stay on the surface of the release layer during heating, and the release force may become heavier after heating.

本發明所用之離型劑較佳為低分子量,分子量較佳為100以上至500以下。藉由將離型劑之分子量設為上述範圍內,而能夠容易地朝離型層表面配向,能夠減小剝離力。另一方面,若分子量為100以上,則能夠發揮離型劑之離型性,能夠抑制顯示黏著性之虞。另外,若分子量為500以下,則能夠抑制離型劑之溶解性降低,能夠抑制離型膜表面之平面性之降低,能夠降低所得之受離型體之外觀受損之虞。再者,本說明書中,有時將此種離型劑例如稱為低分子量離型劑。The release agent used in the present invention is preferably low molecular weight, and the molecular weight is preferably more than 100 and less than 500. By making the molecular weight of a release agent into the said range, it becomes easy to align to the surface of a release layer, and a peeling force can be made small. On the other hand, when a molecular weight is 100 or more, the release property of a release agent can be exhibited, and the possibility of showing stickiness can be suppressed. In addition, when the molecular weight is 500 or less, the decrease in the solubility of the release agent can be suppressed, the decrease in the planarity of the surface of the release film can be suppressed, and the possibility of damage to the appearance of the obtained release object can be reduced. In addition, in this specification, such a release agent may be called a low molecular weight release agent, for example.

[低分子量聚烯烴蠟] 作為低分子量聚烯烴蠟,例如可使用聚乙烯蠟、聚丙烯蠟等低分子量之聚烯烴蠟。 [Low molecular weight polyolefin wax] As the low-molecular-weight polyolefin wax, low-molecular-weight polyolefin waxes such as polyethylene wax and polypropylene wax can be used, for example.

[長鏈烷基系添加劑] 作為長鏈烷基系添加劑,可添加含長鏈烷基之丙烯酸樹脂(A)以外之添加劑。例如,可適時使用Peel oil 1010或Peel oil 1010S(以上均為一方社油脂工業公司製造)等具有烷基鏈之低分子量添加物等。上述離型用添加劑係適時添加能夠表現出預定之離型性的添加量。 [Long chain alkyl series additives] As the long-chain alkyl-based additive, additives other than the long-chain alkyl group-containing acrylic resin (A) may be added. For example, low-molecular-weight additives having an alkyl chain such as Peel oil 1010 or Peel oil 1010S (all of which are manufactured by Ichisha Oil Industry Co., Ltd.) can be used as appropriate. The above-mentioned release additives are timely added in an amount capable of expressing a predetermined release property.

[高級醇] 作為高級醇,可列舉作為直鏈狀之高級醇的辛醇、壬醇、癸醇、十一烷醇、十二烷醇、十三烷醇、十四烷醇、十五烷醇、鯨蠟醇、十七烷醇、硬脂醇、二十烷醇、二十二烷醇等。 [higher alcohol] Examples of the higher alcohol include octanol, nonanol, decyl alcohol, undecanol, dodecanol, tridecanol, myristyl alcohol, pentadecyl alcohol, cetyl alcohol, heptadecanol, stearyl alcohol, eicosanol, behenyl alcohol, etc., which are linear higher alcohols.

作為本發明所用之離型劑,較佳為含有反應性之官能基。由於含有官能基,而能夠藉由與黏合劑成分或交聯劑之反應將離型劑加以固定於離型層,故而能夠抑制加熱前後之離型層之移動,能夠顯示良好之剝離性。The release agent used in the present invention preferably contains reactive functional groups. Since it contains a functional group, the release agent can be fixed to the release layer by reacting with the adhesive component or the cross-linking agent, so the movement of the release layer before and after heating can be suppressed, and good peelability can be exhibited.

於本發明之離型層,只要為不損及本發明功效之範圍,則亦可添加密接改善劑或抗靜電劑等添加劑等。另外,為了提高與基材之密接性,亦較佳為於設置離型塗佈層之前對聚酯膜表面實施底塗(anchor coat)、電暈處理、電漿處理、大氣壓電漿處理等前處理。Additives such as adhesion improving agents and antistatic agents may be added to the release layer of the present invention as long as the effects of the present invention are not impaired. In addition, in order to improve the adhesion to the substrate, it is also preferable to perform pretreatments such as anchor coat, corona treatment, plasma treatment, and atmospheric pressure plasma treatment on the surface of the polyester film before the release coating layer is provided.

離型層之厚度較佳為0.01μm以上至10μm以下,進而較佳為0.05μm以上至1μm以下。於離型層之厚度未達0.01μm之情形時,難以均勻地成形離型層,有剝離力變得不穩定之虞。另一方面,若離型層之厚度超過10μm,則再生原料之使用比率降低而不經濟,故而欠佳。The thickness of the release layer is preferably not less than 0.01 μm and not more than 10 μm, and more preferably not less than 0.05 μm and not more than 1 μm. When the thickness of the release layer is less than 0.01 μm, it is difficult to form the release layer uniformly, and the release force may become unstable. On the other hand, when the thickness of the release layer exceeds 10 μm, the usage ratio of the recycled raw material is lowered, which is uneconomical, which is not preferable.

於本發明中,離型塗佈層之形成方法並無特別限定,可使用下述方法:將溶解或分散有離型性之樹脂的塗液藉由塗佈等而展開於基材之聚酯膜的一面,藉由乾燥將溶媒等去除後,進行加熱乾燥、熱硬化或紫外線硬化。此時,溶媒乾燥、熱硬化時之乾燥溫度較佳為180℃以下,更佳為160℃以下,最佳為140℃以下。溶媒乾燥、熱硬化時之加熱時間較佳為30秒以下,更佳為20秒以下,進而較佳為10秒以下。於180℃以下之情形時,保持膜之平面性,引起離型層之厚度不均之虞小而較佳。若為140℃以下則能夠不損及膜之平面性而進行加工,引起離型層之厚度不均之虞進一步降低,故而尤佳。In the present invention, the method of forming the release coating layer is not particularly limited, and the following method can be used: the coating liquid in which the release resin is dissolved or dispersed is spread on one side of the polyester film of the base material by coating, etc., and the solvent etc. are removed by drying, followed by heat drying, thermosetting or ultraviolet curing. At this time, the drying temperature during solvent drying and thermosetting is preferably below 180°C, more preferably below 160°C, most preferably below 140°C. The heating time for solvent drying and thermosetting is preferably 30 seconds or less, more preferably 20 seconds or less, and still more preferably 10 seconds or less. When the temperature is below 180°C, the planarity of the film is maintained, and the risk of uneven thickness of the release layer is small, which is better. If it is 140 degrees C or less, since it can process without impairing the planarity of a film, and the possibility of causing the thickness unevenness of a release layer will be further reduced, it is especially preferable.

於本發明中,於塗佈離型塗佈層時之塗液中,雖無特別限定,但較佳為添加沸點為70℃以上之溶劑。藉由添加沸點為70℃以上之溶劑,而能夠防止乾燥時之突沸,使塗膜調平,能夠提高乾燥後之塗膜表面之平面性。作為該溶劑之添加量,較佳為相對於塗液總體而添加50質量%至99質量%左右。In the present invention, although not particularly limited, it is preferable to add a solvent having a boiling point of 70° C. or higher to the coating liquid at the time of coating the release coating layer. By adding a solvent with a boiling point of 70°C or higher, bumping during drying can be prevented, the coating can be leveled, and the flatness of the surface of the coating after drying can be improved. As the addition amount of this solvent, it is preferable to add about 50 mass % to 99 mass % with respect to the whole coating liquid.

作為上述塗液之塗佈法,可應用公知之任意之塗佈法,例如可利用凹版塗佈法或反向塗佈法等輥塗法、線棒等之棒塗法、模塗法、噴塗法、氣刀塗佈法等先前以來已知之方法。As the coating method of the above-mentioned coating solution, any known coating method can be applied, for example, conventionally known methods such as roll coating such as gravure coating or reverse coating, bar coating such as wire bar, die coating, spray coating, and air knife coating can be used.

本發明中所得之離型膜較佳為針對常態剝離力、加熱後剝離力、加熱後高速剝離時之剝離力成為以下所示之範圍。The release film obtained in the present invention preferably has a normal peeling force, peeling force after heating, and peeling force at high-speed peeling after heating within the ranges shown below.

於一態樣中,本發明中所得之離型膜係於剝離速度0.3m/min.時之常態剝離力(PF1)為8000mN/50mm以下,例如常態剝離力為6000mN/50mm以上至8000mN/50mm以下,例如為6000mN/50mm以上至7500mN/50mm以下,亦可為6000mN/50mm以上至7000mN/50mm以下。 若為上述範圍內,則常態剝離力輕故而較佳。若常態剝離力為6000mN/50mm以上,則受離型體於搬運步驟中剝落之可能性低而較佳。若加熱前之剝離力為8000mN/50mm以下,則於剝離受離型體時受離型體變形之可能性低而較佳。 常態剝離力意指於剝離速度0.3m/min.時之常態剝離力,可針對將本發明之離型層上所配置之受離型體、例如黏著劑(作為一例,為丙烯酸系黏著帶(日東電工公司製造,No.31B)等)加以剝離時之剝離力進行評價。另外,常態剝離力之測定可於常溫(25℃)之條件下進行。關於以下之加熱後剝離力,亦可應用同樣之受離型體。 In one aspect, the normal peeling force (PF1) of the release film obtained in the present invention is 8000mN/50mm or less at a peeling speed of 0.3m/min., for example, the normal peeling force is from 6000mN/50mm to 8000mN/50mm, for example, from 6000mN/50mm to 7500mN/50mm, or from 6000mN/50mm to 70 00mN/50mm or less. If it is in the said range, it is preferable since normal peeling force is light. If the normal peeling force is 6000mN/50mm or more, the possibility of peeling off the release object during the conveying step is low, which is preferable. If the peeling force before heating is 8000mN/50mm or less, the possibility of deformation of the release body is low when the release body is peeled off, which is preferable. The normal peeling force means the normal peeling force at a peeling speed of 0.3 m/min., and can be evaluated for the peeling force when peeling off a release object disposed on the release layer of the present invention, such as an adhesive (as an example, an acrylic adhesive tape (manufactured by Nitto Denko Co., Ltd., No. 31B), etc.). In addition, the measurement of the normal peel force can be carried out at normal temperature (25°C). The same release type can be applied to the following peeling force after heating.

於一態樣中,於剝離速度0.3m/min.時之加熱後(90℃、20h)剝離力(PF2)為常態剝離力(PF1)之2倍以下。若加熱後剝離力(PF2)為常態剝離力之2倍以下,則加熱後剝離力低而較佳。加熱後剝離力(PF2)進而較佳為常態剝離力(PF1)之1.7倍以下,最佳為1.5倍以下。若加熱後剝離力為常態剝離力之2倍以下,則於加熱後將受離型體剝離時,受離型體不變形故而較佳。另外,於本發明中,加熱後剝離力(PF2)可為6000mN/50mm以上,受離型體於搬運步驟中剝落之可能性低而較佳。In one aspect, the peeling force (PF2) after heating (90°C, 20h) at a peeling speed of 0.3m/min. is less than twice the normal peeling force (PF1). If the post-heating peeling force (PF2) is twice or less than the normal peeling force, the post-heating peeling force is low, which is preferable. The peeling force after heating (PF2) is more preferably 1.7 times or less of the normal peeling force (PF1), most preferably 1.5 times or less. If the peeling force after heating is less than twice the normal peeling force, it is preferable that the release body does not deform when the release body is peeled off after heating. In addition, in the present invention, the post-heating peeling force (PF2) may be 6000 mN/50 mm or more, and the possibility of peeling off the release object during the conveying step is low, which is preferable.

於一態樣中,於剝離速度30m/min.時之加熱後(90℃、20h)剝離力(PF3)為常態剝離力(PF1)之10倍以下。藉由具有此種關係,加熱後高速剝離力低而較佳。剝離力(PF3)進而較佳為常態剝離力(PF1)之7倍以下,最佳為5倍以下。若剝離力(PF3)為常態剝離力(PF1)之10倍以下,則於加熱後將受離型體以高速剝離時,受離型體變形之可能性低而較佳。In one aspect, the peeling force (PF3) after heating (90°C, 20h) at a peeling speed of 30m/min. is less than 10 times the normal peeling force (PF1). By having such a relationship, it is preferable that the high-speed peeling force after heating is low. The peel force (PF3) is further preferably 7 times or less, more preferably 5 times or less, the normal peel force (PF1). If the peeling force (PF3) is less than 10 times of the normal peeling force (PF1), then when the release body is peeled off at high speed after heating, the possibility of deformation of the release body is low, which is preferable.

於本發明中,藉由在離型膜之至少單面設置黏著層,而能夠獲得積層膜。積層膜例如係藉由下述方式獲得:於本發明之離型膜之至少單面側之表面塗佈黏著劑組成物,根據需要進行乾燥,於基材之至少單面側形成黏著層。例如,亦可於離型層中之與基材為相反側之面具有黏著層。In the present invention, a laminated film can be obtained by providing an adhesive layer on at least one surface of a release film. The laminated film can be obtained, for example, by coating an adhesive composition on at least one side of the release film of the present invention, drying as necessary, and forming an adhesive layer on at least one side of the substrate. For example, an adhesive layer may be provided on the surface opposite to the substrate in the release layer.

本發明不限於黏著片,亦可應用於電池用構成構件、黏著劑層保護(OCA用保護、黏著帶用保護等)、醫療領域之經皮吸收型貼附藥用隔離片、陶瓷電容器等電子零件之製造步驟所用之步驟用紙、圖像顯示用構件之保護等其他用途。關於效果,亦可期待同樣之效果。 [實施例] The present invention is not limited to adhesive sheets, but can also be applied to structural members for batteries, protection of adhesive layers (protection for OCA, protection for adhesive tapes, etc.), percutaneous absorption type adhesive pharmaceutical separators in the medical field, process paper used in the manufacturing steps of electronic parts such as ceramic capacitors, protection of members for image display, and other uses. Regarding the effect, the same effect can also be expected. [Example]

以下,使用實施例針對本發明加以更詳細說明,但本發明不受這些實施例之任何限定。本發明中所用之特性值係使用下述方法進行評價。Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited by these examples. The characteristic values used in the present invention were evaluated using the following methods.

[評價] [常態剝離力(PF1)] 於離型膜表面貼合黏著帶(日東電工股份有限公司製造之「31B」),以線壓5kgf/mm之壓接輥壓接後,於溫度22℃、濕度60%之條件下放置20小時。將貼合有黏著帶之離型膜裁斷成寬度25mm、長度150mm之短條狀。將黏著帶之一端固定,握持離型膜之一端,以300mm/min.之速度拉伸離型膜側,測定T字剝離強度。測定中使用拉伸試驗機(島津製作所股份有限公司製造之「AUTOGRAPHAG-X」)。結果顯示於表1。 [evaluate] [Normal Peel Force (PF1)] Attach an adhesive tape ("31B" manufactured by Nitto Denko Co., Ltd.) to the surface of the release film, press it with a pressure roller with a linear pressure of 5kgf/mm, and place it at a temperature of 22°C and a humidity of 60% for 20 hours. Cut the release film attached with the adhesive tape into short strips with a width of 25mm and a length of 150mm. Fix one end of the adhesive tape, hold one end of the release film, stretch the side of the release film at a speed of 300mm/min., and measure the T-peel strength. A tensile tester ("AUTOGRAPHAG-X" manufactured by Shimadzu Corporation) was used for the measurement. The results are shown in Table 1.

[加熱後剝離力(PF2)] 於離型膜表面貼合黏著帶(日東電工股份有限公司製造,商品名「31B」),以線壓5kgf/mm之壓接輥壓接後,將貼合有黏著帶之離型膜裁斷成寬度25mm、長度150mm之短條狀,利用溫度90℃之烘箱加熱20小時。然後,將黏著帶之一端固定,握持離型膜之一端,以300mm/min.之速度拉伸離型膜側而剝離,測定T字剝離強度。T字剝離強度之測定中,使用拉伸試驗機(島津製作所股份有限公司製造之「AUTOGRAPHAG-X」)。結果顯示於表1。 [Peel force after heating (PF2)] Adhesive tape (manufactured by Nitto Denko Co., Ltd., trade name "31B") was attached to the surface of the release film. After crimping with a pressure roller with a linear pressure of 5kgf/mm, the release film with the adhesive tape attached was cut into short strips with a width of 25mm and a length of 150mm, and heated in an oven at a temperature of 90°C for 20 hours. Then, fix one end of the adhesive tape, hold one end of the release film, stretch the side of the release film at a speed of 300mm/min. to peel off, and measure the T-peel strength. For the measurement of the T-peel strength, a tensile tester ("AUTOGRAPHAG-X" manufactured by Shimadzu Corporation) was used. The results are shown in Table 1.

[加熱後高速剝離力(PF3)] 於離型膜表面貼合黏著帶(日東電工股份有限公司製造,商品名「31B」),以線壓5kgf/mm之壓接輥壓接後,將貼合有黏著帶之離型膜裁斷成寬度25mm、長度150mm之短條狀,利用溫度90℃之烘箱加熱20小時。然後,利用雙面膠帶將離型膜側固定於金屬板,握持黏著帶之一端,以30m/min.之速度拉伸黏著帶側而剝離,測定180°剝離強度。180°剝離強度之測定中,使用拉伸試驗機(測試機(Tester)產業股份有限公司之「高速剝離試驗機TE-701」)。結果顯示於表1。 [High speed peel force after heating (PF3)] Adhesive tape (manufactured by Nitto Denko Co., Ltd., trade name "31B") was attached to the surface of the release film. After crimping with a pressure roller with a linear pressure of 5kgf/mm, the release film with the adhesive tape attached was cut into short strips with a width of 25mm and a length of 150mm, and heated in an oven at a temperature of 90°C for 20 hours. Then, fix the release film side to the metal plate with double-sided tape, hold one end of the adhesive tape, stretch the adhesive tape side at a speed of 30m/min. to peel off, and measure the 180°peel strength. In the measurement of the 180° peel strength, a tensile tester ("High Speed Peel Tester TE-701" of Tester Sangyo Co., Ltd.) was used. The results are shown in Table 1.

[黏合劑及離型層塗敷液之準備] 將甲基丙烯酸月桂酯(CH 2=C(CH 3)COOC 12H 25)、甲基丙烯酸羥基乙酯(CH 2=C(CH 3)COOC 2H 4OH)、甲基丙烯酸甲酯(CH 2=C(CH 3)COOCH 3)以50:30:20之比率混合,以固形物濃度成為40重量%之方式添加甲苯,於氮氣流下添加0.5莫耳%之偶氮雙異丁腈(AIBN)進行共聚,獲得含長鏈烷基之丙烯酸樹脂。 [Preparation of adhesive and release layer coating solution] Mix lauryl methacrylate (CH 2 =C(CH 3 )COOC 12 H 25 ), hydroxyethyl methacrylate (CH 2 =C(CH 3 )COOC 2 H 4 OH), and methyl methacrylate (CH 2 =C(CH 3 )COOCH 3 ) at a ratio of 50:30:20, and add so that the solid content becomes 40% by weight Add 0.5 mol% of azobisisobutyronitrile (AIBN) to toluene under a nitrogen stream for copolymerization to obtain an acrylic resin containing long-chain alkyl groups.

[實施例1] 以表1所記載之調配量添加含長鏈烷基之丙烯酸樹脂、作為交聯劑之三聚氰胺樹脂(日本電石股份有限公司製造,Nikalac MW-30)、作為低分子離型劑之高級醇(東京化成工業股份有限公司製造,十五烷醇)、作為硬化觸媒之對甲苯磺酸(日立化成聚合物股份有限公司製造,Dryer#900),進而添加溶劑(甲苯/MEK(methyl ethyl ketone;甲基乙基酮)=50/50:質量比),將固形物濃度設為6.0質量%,獲得離型層塗敷液。 [Example 1] Add an acrylic resin containing a long-chain alkyl group, a melamine resin as a cross-linking agent (manufactured by Nippon Denshi Co., Ltd., Nikalac MW-30), a high-molecular-weight release agent (manufactured by Tokyo Chemical Industry Co., Ltd., pentadecyl alcohol), and p-toluenesulfonic acid as a hardening catalyst (manufactured by Hitachi Chemical Polymer Co., Ltd., Dryer#900) in the amount described in Table 1, and then add a solvent (toluene/MEK (methyl ethyl ketone; methyl ethyl ketone) =50/50: mass ratio), the solid content concentration was 6.0 mass %, and the release layer coating liquid was obtained.

[離型層之形成] 使用凹版塗佈機將所得之離型層塗敷液塗佈於聚對苯二甲酸乙二酯膜(東洋紡公司製造,E5100,厚度:38μm,表面粗糙度(Sa):0.0365nm(電暈處理面)、表面最大剖面高度(St):3.72,霧度:3.7%)之電暈處理面後,於130℃、30秒之條件進行乾燥,形成厚度0.2μm之離型層。針對所得之離型膜進行常態剝離力、加熱後剝離力、加熱後高速剝離力之評價。 [Formation of release layer] The obtained release layer coating solution was coated on the corona-treated surface of polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., E5100, thickness: 38 μm, surface roughness (Sa): 0.0365 nm (corona-treated surface), maximum surface section height (St): 3.72, haze: 3.7%), and dried at 130° C. for 30 seconds to form a release layer with a thickness of 0.2 μm. . For the obtained release film, the normal peeling force, the peeling force after heating, and the high-speed peeling force after heating were evaluated.

[實施例2至實施例5、比較例1、比較例2] 除了將組成變更為表1之組成以外,以與實施例1同樣之順序形成離型層。針對所得之離型膜進行常態剝離力、加熱後剝離力、加熱後高速剝離力之評價。 [Example 2 to Example 5, Comparative Example 1, Comparative Example 2] Except having changed the composition into the composition of Table 1, the release layer was formed in the same procedure as Example 1. For the obtained release film, the normal peeling force, the peeling force after heating, and the high-speed peeling force after heating were evaluated.

[表1] 重量比(%) 相對於交聯劑之比率 剝離力(mN/50mm) 相對於PF1之比率 黏合劑(a) 交聯劑(b) 離型劑(c) 觸媒 a/b c/b 常態(PF1) 加熱後(PF2) 加熱後高速(PF3) PF2/PF1 PF3/PF1 實施例1 37.4 45.6 15.0 1.9 0.8 0.3 6579 9741 31126 1.5 4.7 實施例2 37.4 25.6 35.1 1.9 1.5 1.4 6312 7639 20035 1.2 3.2 實施例3 37.4 15.6 45.1 1.9 2.4 2.9 6602 7310 14999 1.1 2.3 實施例4 37.4 10.6 50.1 1.9 3.5 4.7 7018 8378 20183 1.2 2.9 實施例5 76.9 21.2 0.0 1.9 3.6 0.0 6453 8765 26453 1.4 4.1 比較例1 37.4 5.0 55.6 1.9 7.5 11.1 9561 21554 無法剝離 2.3 無法剝離 比較例2 37.4 0.0 60.6 1.9 0.0 0.0 無法剝離 無法剝離 無法剝離 無法剝離 無法剝離 [Table 1] weight ratio(%) Relative to the ratio of crosslinking agent Peel force (mN/50mm) Ratio relative to PF1 Adhesive (a) Crosslinking agent (b) Release agent (c) catalyst a/b c/b Normal (PF1) After heating (PF2) High speed after heating (PF3) PF2/PF1 PF3/PF1 Example 1 37.4 45.6 15.0 1.9 0.8 0.3 6579 9741 31126 1.5 4.7 Example 2 37.4 25.6 35.1 1.9 1.5 1.4 6312 7639 20035 1.2 3.2 Example 3 37.4 15.6 45.1 1.9 2.4 2.9 6602 7310 14999 1.1 2.3 Example 4 37.4 10.6 50.1 1.9 3.5 4.7 7018 8378 20183 1.2 2.9 Example 5 76.9 21.2 0.0 1.9 3.6 0.0 6453 8765 26453 1.4 4.1 Comparative example 1 37.4 5.0 55.6 1.9 7.5 11.1 9561 21554 Can't peel off 2.3 Can't peel off Comparative example 2 37.4 0.0 60.6 1.9 0.0 0.0 Can't peel off Can't peel off Can't peel off Can't peel off Can't peel off

[評價結果] 根據本發明,可提供一種離型膜,係於加熱前後均具有輕剝離性,而且即便以高速剝離亦維持輕離型性。另一方面,比較例1中,含長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b為本發明之範圍外,故而無法測定加熱後高速剝離力(PF3)。進而,於加熱後剝離力增加,無法將離型層與黏著帶剝離。另外,比較例2不含交聯劑(B),故而即便於常溫亦無法將黏著帶自離型層剝離。 [Evaluation results] According to the present invention, it is possible to provide a release film which has light release properties both before and after heating, and which maintains light release properties even if it is peeled at high speed. On the other hand, in Comparative Example 1, the ratio a/b of the weight (a) of the long-chain alkyl group-containing acrylic resin to the weight (b) of the crosslinking agent is outside the scope of the present invention, so the high-speed peeling force (PF3) after heating cannot be measured. Furthermore, the peeling force increased after heating, and the release layer and the adhesive tape could not be peeled off. In addition, since Comparative Example 2 does not contain a crosslinking agent (B), the adhesive tape cannot be peeled from the release layer even at normal temperature.

應認為本次揭示之實施形態及實施例於所有方面為例示,且並非限制性。本發明之範圍係由申請專利範圍而非上述實施形態表示,意指包含與申請專利範圍均等之含意及範圍內之所有變更。 [產業可利用性] It should be considered that the embodiments and examples disclosed this time are illustrative in all points and not restrictive. The scope of the present invention is shown by the claims rather than the above-mentioned embodiments, and it is intended that all modifications within the meaning and range equivalent to the claims are included. [Industrial availability]

本發明之離型膜可較合適地用於難以使用聚矽氧離型膜之電子零件製造步驟等用途。The release film of the present invention can be more suitably used in the manufacturing steps of electronic parts where it is difficult to use a polysiloxane release film.

Claims (7)

一種離型膜,係於基材膜積層有離型層,前述離型層係至少含有含碳數為8以上至20以下的長鏈烷基之丙烯酸樹脂(A)、交聯劑(B)及離型劑(C),且實質上不含聚矽氧成分;前述交聯劑(B)為三聚氰胺;前述離型劑(C)的分子量為100以上至500以下;並且,前述離型層所含之含碳數為8以上至20以下的長鏈烷基之丙烯酸樹脂之重量(a)與交聯劑之重量(b)之比率a/b滿足式(I):(I)0.1≦a/b≦7.0。 A release film, which is laminated with a release layer on a substrate film, the release layer at least contains an acrylic resin (A) containing a long-chain alkyl group with a carbon number of 8 to 20, a crosslinking agent (B) and a release agent (C), and does not substantially contain silicone components; the aforementioned crosslinking agent (B) is melamine; the molecular weight of the aforementioned release agent (C) is 100 to 500; The ratio a/b of the weight (a) of the acrylic resin of the alkyl group to the weight (b) of the crosslinking agent satisfies the formula (I): (I) 0.1≦a/b≦7.0. 如請求項1所記載之離型膜,其中前述離型層所含之交聯劑之重量(b)與離型劑之重量(c)之比率c/b滿足式(II):(II)0.1≦c/b≦10.0。 The release film as described in Claim 1, wherein the ratio c/b of the weight (b) of the crosslinking agent contained in the release layer to the weight (c) of the release agent satisfies the formula (II): (II) 0.1≦c/b≦10.0. 如請求項1或2所記載之離型膜,其中於剝離速度0.3m/min.時之常態剝離力(PF1)為8000mN/50mm以下。 The release film as described in claim 1 or 2, wherein the normal peeling force (PF1) at a peeling speed of 0.3m/min. is 8000mN/50mm or less. 如請求項3所記載之離型膜,其中於剝離速度0.3m/min.時之加熱後(90℃、20h)剝離力(PF2)為前述常態剝離力(PF1)之2倍以下。 The release film as described in claim 3, wherein the peeling force (PF2) after heating (90°C, 20h) at a peeling speed of 0.3m/min. is less than twice the normal peeling force (PF1). 如請求項3所記載之離型膜,其中於剝離速度30m/min.時之加熱後(90℃、20h)剝離力(PF3)為前述常態剝離力(PF1)之10倍以下。 The release film as described in claim 3, wherein the peeling force (PF3) after heating (90°C, 20h) at a peeling speed of 30m/min. is less than 10 times the normal peeling force (PF1). 如請求項4所記載之離型膜,其中於剝離速度30m/min.時之加熱後(90℃、20h)剝離力(PF3)為前述常態剝離力(PF1)之10倍以下。 The release film as described in claim 4, wherein the peeling force (PF3) after heating (90°C, 20h) at a peeling speed of 30m/min. is less than 10 times the normal peeling force (PF1). 一種積層膜,係於如前述請求項1至6中任一項所記載之離型膜之至少一面上積層有黏著層。 A laminated film comprising an adhesive layer laminated on at least one side of the release film as described in any one of claims 1 to 6 above.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202022064A (en) * 2018-09-25 2020-06-16 日商日本化工塗料股份有限公司 Thermosetting release coating agent and laminated film
TW202033350A (en) * 2018-12-20 2020-09-16 日商東洋紡股份有限公司 Release film

Family Cites Families (5)

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JP2007002092A (en) 2005-06-23 2007-01-11 Kyoeisha Chem Co Ltd Mold release agent comprising cross-linked copolymerized prepolymer
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JP5730922B2 (en) 2013-02-06 2015-06-10 三菱樹脂株式会社 Laminated polyester film
JP6692968B2 (en) * 2019-06-24 2020-05-13 日東電工株式会社 Optical surface protection film with separator
JP6761084B2 (en) * 2019-07-17 2020-09-23 藤森工業株式会社 Manufacturing method of antistatic surface protective film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202022064A (en) * 2018-09-25 2020-06-16 日商日本化工塗料股份有限公司 Thermosetting release coating agent and laminated film
TW202033350A (en) * 2018-12-20 2020-09-16 日商東洋紡股份有限公司 Release film

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