TWI805970B - High-insulation multilayer flat transformer - Google Patents

Abstract

A high-insulation multilayer flat transformer includes a pair of iron core and a circuit board integration. The circuit board integration is stacked between the pair of iron cores and has a through hole. The circuit board integration includes first to third insulating layers and first to second coil windings. The first and third insulating layers include at least two stacked insulating plates separately, and the insulating plates on the outer side are not provided with any circuits. The second insulating layer includes at least one insulating plate. The coil winding is arranged between adjacent insulating layers and surrounds the through hole in a planar shape. Thereby, the reinforced insulation requirements in compliance with safety regulations can be achieved.

Description

High insulation multi-layer planar transformer

The invention relates to a transformer, especially a flat-plate transformer.

The winding coils of known planar transformers are mostly made of double-layer or multi-layer printed circuit boards or prefabricated flat copper plates; and the winding coils include primary side coils and secondary side coils, and the primary side coils and secondary side coils The coils must meet the safety requirements of the transformer, such as clearance and creepage.

Furthermore, in order to meet the Reinforced Insulation level requirements of safety regulations, a certain gap must be maintained between the primary and secondary side coils. This makes it difficult to reduce the volume of the planar transformer and cannot meet the trend of miniaturized products.

In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's improvement.

One object of the present invention is to provide a high-insulation multi-layer planar transformer to meet the requirements of reinforced insulation in compliance with safety regulations.

In order to achieve the above purpose, the present invention is a high-insulation multi-layer planar transformer, which includes a pair of iron cores and a circuit board integrated. The circuit board is integrated stacked on There is a through hole between the pair of irons, including a first insulating layer, a second insulating layer, a first coil winding, a third insulating layer and a second coil winding. The first insulating layer includes at least two first insulating plates stacked. The second insulating layer includes at least one second insulating board. The first coil winding is arranged between the first insulating layer and the second insulating layer, and the first coil winding surrounds the through hole in a planar shape. The third insulating layer includes at least two third insulating plates stacked. The second coil winding is disposed between the second insulating layer and the third insulating layer, and the second coil winding surrounds the through hole in a plane shape.

Compared with the conventional ones, the circuit board integration of the present invention includes the first insulating layer, the second insulating layer, the first coil winding, the third insulating layer and the second coil winding arranged in sequence; wherein, the first insulating layer includes stacked At least two first insulating plates are placed, and the first insulating plate located on the outer side (the side facing the iron core) is not provided with any circuit. In addition, the third insulating layer includes at least two third insulating plates stacked, and is located on the The third insulating plate on the outside (the side facing the iron core) is not provided with any circuit. Accordingly, the high-insulation multi-layer flat-plate transformer can meet the reinforced insulation requirements of safety regulations, and reduce the volume of the flat-plate transformer to meet miniaturization product trends, increasing the utility of the present invention.

1: High insulation multi-layer planar transformer

10, 10a: circuit board integration

100, 100a: through holes

100': center hole

11, 11a: the first insulating layer

111, 111a: the first insulating board

12, 12a: second insulating layer

121, 121a: second insulating board

13, 13a: first coil winding

14, 14a: the third insulating layer

141, 141a: the third insulation board

15, 15a: second coil winding

16: The third coil winding

17: The fourth insulating layer

171: The third insulation board

18: Fourth coil winding

19: Fifth insulating layer

191: The fifth insulation board

20: iron core

21: The first iron core

211: The first base

212: The first stem

22: The second iron core

221:Second Base

222: Second stem

30: insulating glue

H: distance

Fig. 1 is a three-dimensional exploded schematic diagram of a high-insulation multi-layer planar transformer of the present invention.

Fig. 2 is a three-dimensional perspective schematic diagram of the high-insulation multi-layer planar transformer of the present invention.

Fig. 3 is a cross-sectional view of the high insulation multilayer planar transformer of the present invention.

Fig. 4 is a three-dimensional exploded schematic view of another embodiment of the high-insulation multi-layer planar transformer of the present invention.

The detailed description and technical content of the present invention are described below with the drawings, but the attached drawings are only for reference and description, and are not used to limit the present invention.

Please refer to FIG. 1 to FIG. 3 , which are respectively a three-dimensional exploded schematic diagram, a three-dimensional perspective schematic diagram and a cross-sectional view of the high-insulation multi-layer planar transformer of the present invention. The present invention provides a high-insulation multi-layer planar transformer 1 , which includes a circuit board assembly 10 and a pair of iron cores 20 . The circuit board assembly 10 is arranged between the pair of iron cores 20 to form the high insulation multilayer planar transformer 1 .

In an embodiment of the present invention, the pair of iron cores 20 includes a first iron core 21 and a second iron core 22 oppositely disposed. The first iron core 21 has a first base 211 and a first stem 212 connected to the first base 211 . Moreover, the second iron core 22 has a second base 221 and a second stem 222 connected to the second base 221 .

Furthermore, the circuit board assembly 10 is stacked between the first iron core 21 and the second iron core 22 and has a through hole 100 penetrating therethrough. The first stem 212 and the second stem 222 of the pair of iron cores 20 pass through the through hole 100 .

The circuit board integration 10 includes a first insulating layer 11, a second insulating layer 12, a first coil winding 13, a third insulating layer 14, a second coil winding 15, a third coil winding 16, a first Four insulating layers 17 , a fourth coil winding 18 and a fifth insulating layer 19 . Also, the first insulating layer 11, the first coil winding 13, the second insulating layer 12, the second coil winding 15, the third insulating layer 14, the third coil winding 16, the fourth insulating layer 17 , the fourth coil winding 18 and the fifth insulating layer 19 are sequentially stacked to form the integrated circuit board 10 .

It should be noted that the first insulating layer 11, the second insulating layer 12, the first coil winding 13, the third insulating layer 14, the second coil winding 15, the third coil winding 16, the fourth insulation The central positions of the layer 17, the fourth coil winding 18 and the fifth insulating layer 19 are respectively provided with a corresponding central hole 100', and these central holes 100' constitute the through hole 100 of the circuit board assembly 10.

In this embodiment, the first insulating layer 11 includes at least two stacked first insulating plates 111 . It should be noted that the first insulating layer 11 can be configured as a double-layer or triple-layer first insulating board 111 , and the thickness of the first insulating layer 11 after lamination is 0.05 mm to 1.0 mm.

The second insulating layer 12 includes at least one second insulating plate 121 . Preferably, the second insulating layer 12 can be configured as a single-layer insulating board or include at least two stacked second insulating boards 121 , such as double-layer or triple-layer second insulating board 121 .

Moreover, the first coil winding 13 is disposed between the first insulating layer 11 and the second insulating layer 12 . The first coil winding 13 surrounds the through hole 100 (central hole 100') in a planar manner.

It should be noted that, during actual assembly, the first coil winding 13 can be arranged on the second insulating layer 12 or on the first insulating plate 111 of the first insulating layer 11 facing the side of the second insulating layer 12 .

The third insulating layer 14 includes at least one third insulating plate 141 . It should be noted that the third insulating layer 14 can be configured as a single-layer insulating board or include at least two third insulating boards 141 stacked, for example, the third insulating layer 14 can be configured as a third insulating board including double or triple layers. The insulating plate 141, and the thickness of the third insulating layer 14 after lamination is 0.05 mm to 1.0 mm.

Moreover, the second coil winding 15 is disposed between the second insulating layer 12 and the third insulating layer 14 . The second coil winding 15 surrounds the through hole 100 in a planar manner. It should be noted that, during actual assembly, the second coil winding 15 can be arranged on the third insulating layer 14 or on the second insulating plate 121 of the second insulating layer 12 facing the side of the third insulating layer 14 .

Furthermore, the fourth insulating layer 17 includes at least one fourth insulating plate 171 stacked; similarly, the fourth insulating layer 17 can be configured as a single-layer insulating plate or include at least two fourth insulating plates 171 stacked, For example, the fourth insulating layer 17 can be configured as a double-layer or triple-layer fourth insulating board 171 , and the thickness of the fourth insulating layer 17 after lamination is 0.05 mm to 1.0 mm.

Moreover, the third coil winding 16 is disposed between the third insulating layer 14 and the fourth insulating layer 17, and the third coil winding 16 surrounds the through hole 100 (central hole 100') in a planar shape. In actual assembly, the third coil winding 16 can be disposed on the fourth insulating layer 17 or on the third insulating plate 141 of the third insulating layer 14 facing the side of the fourth insulating layer 17 .

It is worth noting that the first coil winding 13 and the third coil winding 16 are used to connect or input power, and are connected in series or in parallel; in addition, the first coil winding 13 and the third coil winding 16 can be Have the same or different number of winding turns, and their connection terminals are on the same side.

The fifth insulating layer 19 includes at least two fifth insulating plates 191 stacked together. The fifth insulating layer 19 can be configured as a double-layer or triple-layer fifth insulating board 191 , and the thickness of the fifth insulating layer 19 after lamination is 0.05 mm to 1.0 mm.

It should be noted that, among the insulating layers attached to the pair of iron cores 20 , the outer insulating plate is not provided with any circuit in the area covered by the pair of iron cores 20 . Specifically, in this embodiment, the first insulating plate 111 on the outer side (the side facing the first iron core 21 ) of the first insulating layer 11 is not provided with any circuit in the area covered by the pair of iron cores 20 . In addition, the fifth insulating plate 191 on the outer side (the side facing the second iron core 22 ) of the fifth insulating layer 19 is not provided with any circuit in the area covered by the pair of iron cores 20 .

Moreover, the fourth coil winding 18 is disposed between the fourth insulating layer 17 and the fifth insulating layer 19, and the fourth coil winding 18 surrounds the through hole 100 (central hole 100') in a planar shape. . In actual assembly, the fourth coil winding 18 can be disposed on the fifth insulating layer 19 or the fourth insulating plate 171 facing the side of the fifth insulating layer 19 in the fourth insulating layer 17 .

It should be noted that the second coil winding 15 and the fourth coil winding 18 are used for outputting or connecting loads, and are connected in parallel or in series; in addition, the second coil winding 15 and the fourth coil winding 18 can be Have the same or different number of winding turns, and their connection terminals are on the same side.

It should be noted that, in this embodiment, the outer edge positions of the first coil winding 13 to the fourth coil winding 18 are equal; in addition, the outer edge positions of the first insulating layer 11 to the fifth insulating layer 19 are equal. Preferably, the distance H between the outer edges of the first coil winding 13 to the fourth coil winding 18 relative to the outer edges of the first insulating layer 11 to the fifth insulating layer 19 is at least 0.1 mm to 1.0 mm.

In this embodiment, the first coil winding 13 and the third coil winding 16 have different winding turns and are connected in series to form a primary side coil; in addition, the second coil winding 15 and the fourth coil winding 18 have the same winding The number of turns is the secondary side, and the first coil winding 13 to the fourth coil winding 18 are stacked to form a form in which the primary and secondary sides are adjacent and the primary and secondary sides are stacked. However, in actual use, the number of insulating layers and coil windings and the form of stacking can be adjusted according to the actual use conditions.

It should be noted that, in this embodiment, the high-insulation multi-layer planar transformer 1 further includes an insulating glue 30 . The insulating glue 30 is filled in the gaps between the coil windings and the insulating layers, so as to make the combination between them more stable, and has the effects of flame retardancy, corrosion resistance, insulation, and aging resistance.

In addition, it should be noted that since the transformer safety regulations require a minimum safety distance, the safety regulations must be met between the primary side coil and the secondary side coil; in addition, the distance between the primary side coil and the secondary side coil in this embodiment Although it is reduced in size, the high-insulation multi-layer planar transformer 1 in this case can still meet the requirements of safety regulations after being verified by the safety company.

Please refer to FIG. 4 again, which is a three-dimensional exploded schematic view of another embodiment of the high-insulation multilayer planar transformer of the present invention. Compared with the previous embodiment, this embodiment is substantially the same, the difference lies in the number of insulating layers and coil windings and the form of stacking. In this embodiment, the circuit board integration 10a has A through hole 100a passes through, including a first insulating layer 11a, a second insulating layer 12a, a first coil winding 13a, a third insulating layer 14a and a second coil winding 15a. Moreover, the first insulating layer 11a, the first coil winding 13a, the second insulating layer 12a, the second coil winding 15a and the third insulating layer 14a are sequentially stacked to form the integrated circuit board 10a.

Specifically, the first insulating layer 11a includes at least two stacked first insulating plates 111a. The second insulating layer 12a includes at least one second insulating plate 121a. The first coil winding 13a is disposed between the first insulating layer 11a and the second insulating layer 12a and surrounds the through hole 100a in a plane shape. The third insulating layer 14a includes at least two stacked third insulating plates 141a. The second coil winding 15a is disposed between the second insulating layer 12a and the third insulating layer 14a, and surrounds the through hole 100a in a plane shape.

It should be noted that, the present embodiment is the same as the previous embodiment in that, among the insulating layers attached to the pair of iron cores 20 , the outer insulating plate is not provided with any circuit in the area covered by the pair of iron cores 20 . Specifically, in this embodiment, the first insulating plate 111 a on the outer side (the side facing the first iron core 21 ) of the first insulating layer 11 a is not provided with any circuit in the area covered by the pair of iron cores 20 . In addition, the third insulating plate 141 a on the outer side (the side facing the second iron core 22 ) of the third insulating layer 14 a is not provided with any circuit in the area covered by the pair of iron cores 20 .

It should be noted that, in this embodiment, the first coil winding 13a includes a primary coil or a secondary coil, and the second coil winding 15a also includes a primary coil or a secondary coil. In addition, in actual implementation, the number of insulating layers and coil windings, the form of lamination, and the arrangement of the primary side coil and the secondary side coil are not limited, and can be adjusted according to actual use conditions.

It should be noted that the insulating board of the present invention is made of glass fiber, or the insulating board is a glued sheet (Prepreg, PP) formed by dipping glass fiber cloth into epoxy resin varnish and drying.

The above descriptions are only preferred embodiments of the present invention, and are not used to define the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all belong to the patent scope of the present invention.

1: High insulation multi-layer planar transformer

10: Circuit board integration

100: through hole

100': center hole

11: The first insulating layer

111: the first insulation board

12: Second insulating layer

121: the second insulation board

13: First coil winding

14: The third insulating layer

141: The third insulation board

15: Second coil winding

16: The third coil winding

17: The fourth insulating layer

171: The third insulation board

18: Fourth coil winding

19: Fifth insulating layer

191: The fifth insulation board

20: iron core

21: The first iron core

211: The first base

212: The first stem

22: The second iron core

221:Second Base

222: Second stem

Claims (5)

A high-insulation multi-layer planar transformer, comprising: a pair of iron cores, including a first iron core and a second iron core oppositely arranged, the first iron core has a first base and a base connected to the first base A first stem, and the second iron core has a second base and a second stem connected to the second base; and a circuit board integrated, stacked on the first iron core and the second There is a through hole penetrating between the iron cores, the through hole passes through the first core column and the second core column, including: a first insulating layer, including at least two first insulating plates stacked and pressed together ; a second insulating layer, including at least two second insulating plates stacked and pressed together; a first coil winding, arranged between the first insulating layer and the second insulating layer, the first coil winding is planar surrounding the through hole in a shape; a third insulating layer, including at least two third insulating plates stacked and pressed together; and a second coil winding, arranged between the second insulating layer and the third insulating layer and Surrounding the through hole in a planar shape; wherein, the insulating plate on the outer side of the insulating layers attached to the pair of iron cores is not provided with any circuit in the covered area of the pair of iron cores, the first insulating layer, the second insulating layer and the thickness of the third insulating layer after lamination is 0.05mm to 1mm, the outer edge of the first coil winding, the second coil winding and the outer edge of the first insulating layer, the outer edge of the second insulating layer and The distance between the outer edges of the third insulating layer is at least 0.1 mm to 1 mm. The high-insulation multi-layer planar transformer according to claim 1, wherein the first coil winding is disposed on the second insulation layer; the second coil winding is disposed on the third insulation layer. The high-insulation multi-layer planar transformer according to claim 1, wherein the first insulation board, the second insulation board and the third insulation board layer are made of glass fibers. The high-insulation multi-layer planar transformer as described in claim 1 further includes a third coil winding, a fourth insulation layer, a fourth coil winding and a fifth insulation layer arranged outside the third insulation layer in sequence. layer, and the fourth insulating layer and the fifth insulating layer include at least two insulating plates stacked and pressed together. The high-insulation multi-layer planar transformer as described in claim 4, wherein the third coil winding is arranged on the fourth insulation layer; the fourth coil winding is arranged on the fifth insulation layer; the fourth insulation layer and the first insulation layer The thickness of the five insulating layers after lamination is 0.05mm to 1mm; The distance is at least 0.1mm to 1.0mm.

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