TWI804118B - Actinic radiation-curable compositions containing polyamide - Google Patents
Actinic radiation-curable compositions containing polyamide Download PDFInfo
- Publication number
- TWI804118B TWI804118B TW110147736A TW110147736A TWI804118B TW I804118 B TWI804118 B TW I804118B TW 110147736 A TW110147736 A TW 110147736A TW 110147736 A TW110147736 A TW 110147736A TW I804118 B TWI804118 B TW I804118B
- Authority
- TW
- Taiwan
- Prior art keywords
- actinic radiation
- radiation curable
- polyamide
- meth
- curable composition
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 332
- 229920002647 polyamide Polymers 0.000 title claims abstract description 241
- 239000004952 Polyamide Substances 0.000 title claims abstract description 239
- 230000005855 radiation Effects 0.000 claims abstract description 348
- 150000001875 compounds Chemical class 0.000 claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 claims abstract description 53
- 239000007788 liquid Substances 0.000 claims abstract description 49
- 239000000654 additive Substances 0.000 claims abstract description 19
- 230000000996 additive effect Effects 0.000 claims abstract description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 181
- 238000000034 method Methods 0.000 claims description 66
- -1 butylcyclohexyl Chemical group 0.000 claims description 54
- 239000000178 monomer Substances 0.000 claims description 43
- 239000002904 solvent Substances 0.000 claims description 34
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 25
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 24
- 229920000570 polyether Polymers 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 24
- 125000000524 functional group Chemical group 0.000 claims description 23
- 229920001400 block copolymer Polymers 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 229920001223 polyethylene glycol Polymers 0.000 claims description 18
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000002202 Polyethylene glycol Substances 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 17
- 125000004122 cyclic group Chemical group 0.000 claims description 16
- 229920000728 polyester Polymers 0.000 claims description 16
- 125000001931 aliphatic group Chemical group 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 229920001451 polypropylene glycol Polymers 0.000 claims description 8
- 229920000299 Nylon 12 Polymers 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 7
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 6
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 6
- 229920000571 Nylon 11 Polymers 0.000 claims description 6
- 229920002292 Nylon 6 Polymers 0.000 claims description 6
- 229920000572 Nylon 6/12 Polymers 0.000 claims description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 6
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 5
- 229920001748 polybutylene Polymers 0.000 claims description 5
- 238000011417 postcuring Methods 0.000 claims description 5
- HSPRVWPULGKMRC-UHFFFAOYSA-N 57526-50-8 Chemical compound C12CCCC2C2CC(CO)C1C2 HSPRVWPULGKMRC-UHFFFAOYSA-N 0.000 claims description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical class C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 claims description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical class OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- XJDDLMJULQGRLU-UHFFFAOYSA-N 1,3-dioxane-4,6-dione Chemical class O=C1CC(=O)OCO1 XJDDLMJULQGRLU-UHFFFAOYSA-N 0.000 claims description 2
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 claims description 2
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- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229940074076 glycerol formal Drugs 0.000 claims description 2
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- 229920005989 resin Polymers 0.000 abstract description 21
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- 238000001723 curing Methods 0.000 description 37
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- 229920002614 Polyether block amide Polymers 0.000 description 20
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- 238000002156 mixing Methods 0.000 description 16
- 229920005862 polyol Polymers 0.000 description 15
- 150000003077 polyols Chemical class 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 12
- 239000000047 product Substances 0.000 description 12
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- 238000009472 formulation Methods 0.000 description 9
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 8
- 150000002009 diols Chemical class 0.000 description 8
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 150000001298 alcohols Chemical class 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 125000004386 diacrylate group Chemical group 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000000016 photochemical curing Methods 0.000 description 6
- LAIJAUHBAWLPCO-UHFFFAOYSA-N (4-tert-butylcyclohexyl) prop-2-enoate Chemical compound CC(C)(C)C1CCC(OC(=O)C=C)CC1 LAIJAUHBAWLPCO-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 5
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 5
- 125000002015 acyclic group Chemical group 0.000 description 5
- 150000001412 amines Chemical group 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
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- 150000003254 radicals Chemical class 0.000 description 5
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
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- 206010073306 Exposure to radiation Diseases 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
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- 125000003545 alkoxy group Chemical group 0.000 description 3
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- 238000006482 condensation reaction Methods 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
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- 238000004090 dissolution Methods 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
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- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
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- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
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- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Images
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
Abstract
Description
發明領域field of invention
本發明係關於含聚醯胺之組成物,該等組成物能夠使用光化輻射來固化,以提供有用物品,包括使用積層製造技術製備之三維物品。This invention relates to polyamide-containing compositions which can be cured using actinic radiation to provide useful articles, including three-dimensional articles prepared using additive manufacturing techniques.
發明背景Background of the invention
傳統上,「熔融沈積成型」型三維(3D)列印技術使用熱塑性樹脂。使用此類樹脂將可達到之解析度限制為可鋪設之聚合物珠粒寬度。此外,使用熱塑性樹脂及3D列印方法製造之物品的連續列印層之間的黏著性較差,因為作用層(列印之層)中之移動聚合物鏈無法與現冷卻之前一層中之玻璃態聚合物鏈一起再纏繞,產生機械弱點。雖然可光固化丙烯酸類系統代表已用於3D列印物品之另一類型樹脂,但是此類系統在固化時通常具有高交聯密度。此產生對突加應力及應變之抗性不佳的物品,從而導致脆性斷裂。因此,可光固化丙烯酸類樹脂系統主要僅用於原型設計應用。Traditionally, three-dimensional (3D) printing techniques of the "fused deposition modeling" type have used thermoplastic resins. The use of such resins limits the achievable resolution to the width of the polymer bead that can be laid. Furthermore, the adhesion between successively printed layers of articles made using thermoplastic resins and 3D printing methods is poor because the mobile polymer chains in the active layer (the printed layer) cannot match the glassy state in the layer before cooling. The polymer chains rewind together, creating a mechanical weakness. While photocurable acrylic systems represent another type of resin that has been used for 3D printed items, such systems typically have a high crosslink density when cured. This produces articles that are poorly resistant to sudden applied stresses and strains, leading to brittle fracture. Therefore, photocurable acrylic resin systems are mainly used only for prototyping applications.
因此,用於3D列印及其他積層製造應用之樹脂系統的研發將受到極大關注,其減少已知熱塑性樹脂及可光固化丙烯酸類調配物之上述不足。Therefore, great attention will be paid to the development of resin systems for 3D printing and other additive manufacturing applications that alleviate the above-mentioned deficiencies of known thermoplastic resins and photocurable acrylic formulations.
美國專利第4,384,011號揭露可輻射固化樹脂塗料組成物,其包含溶解於溶劑中的特定比率之可溶性聚醯胺樹脂與可輻射聚合之單體或其類似物;及此類組成物在用於產生樹脂凹版列印板之方法中的用途。適合於此類用途之可溶性聚醯胺包括已藉由各種類型之反應改質之聚醯胺。此外,可溶性聚醯胺樹脂之量相對於可輻射聚合之單體化合物之量較高(100重量份可溶性聚醯胺樹脂比50-100重量份可輻射聚合之單體化合物)。U.S. Patent No. 4,384,011 discloses a radiation-curable resin coating composition, which comprises a specific ratio of soluble polyamide resin dissolved in a solvent and a radiation-polymerizable monomer or the like; and such compositions are used in the production of Use in methods for resin gravure printing plates. Soluble polyamides suitable for such uses include polyamides that have been modified by various types of reactions. In addition, the amount of soluble polyamide resin is relatively high relative to the amount of radiation polymerizable monomeric compound (100 parts by weight soluble polyamide resin to 50-100 parts by weight of radiation polymerizable monomeric compound).
WO 2018/033296 A1揭露在用於3D列印,諸如用於油墨、塗料及黏著劑之可光固化樹脂中用於增強抗衝擊性及流變特性之聚合誘導之相分離(PIPS)組成物。此類組成物在諸如抗衝擊性、剪切黏著力及黏合強度之特性方面為有利的。PIPS組成物可包括組分X、Y及Z,其中X包括丙烯酸類單體;Y包括嵌段A與嵌段B之共聚物;且Z包括多官能交聯劑。未揭露包括聚醯胺嵌段之嵌段共聚物。WO 2018/033296 A1 discloses a polymerization-induced phase separation (PIPS) composition for enhancing impact resistance and rheological properties in photocurable resins for 3D printing, such as inks, coatings and adhesives. Such compositions are advantageous in properties such as impact resistance, shear adhesion, and bond strength. The PIPS composition may include components X, Y, and Z, wherein X includes an acrylic monomer; Y includes a copolymer of block A and block B; and Z includes a multifunctional crosslinker. Block copolymers comprising polyamide blocks are not disclosed.
EP 0919873 B1揭露一種可光固化樹脂組成物,其包含(A)經酸改質之含乙烯基之環氧樹脂;(B)彈性體(其可為聚醯胺類彈性體);(C)光聚合引發劑;(D)稀釋劑;及(E)固化劑,且該可光固化樹脂組成物可產生高效固化膜。EP 0919873 B1 discloses a photocurable resin composition comprising (A) an acid-modified vinyl-containing epoxy resin; (B) an elastomer (which may be a polyamide-based elastomer); (C) a photopolymerization initiator; (D) a diluent; and (E) a curing agent, and the photocurable resin composition can produce an efficient cured film.
JP 2676662 B2揭露光固膜,其藉由將感光性芳族聚醯胺及光聚合引發劑均勻溶解於基本上由特定聚醚化合物組成之有機溶劑中在低暴露下製得。將該感光性含聚醯胺之組成物塗覆於基底材料上且乾燥塗層以形成含有感光性芳族聚醯胺及光聚合引發劑之感光性薄膜(乾膜)。藉由光輻照使膜進行光固化。JP 2676662 B2 discloses a photocurable film prepared under low exposure by uniformly dissolving photosensitive aramid and a photopolymerization initiator in an organic solvent substantially composed of a specific polyether compound. The photosensitive polyamide-containing composition is coated on a base material and the coating is dried to form a photosensitive film (dry film) containing photosensitive aromatic polyamide and a photopolymerization initiator. The film is photocured by light irradiation.
發明概要Summary of the invention
本發明之一面提供一種光化輻射可固化組成物,其包含: a)至少一種聚醯胺,其不含光化輻射可固化官能基;及 b)至少一種光化輻射可固化化合物,其中該至少一種光化輻射可固化化合物在25℃下為液體; 其中滿足條件i)、條件ii)或條件iii): i)該至少一種聚醯胺為未經改質之聚醯胺或未經改質之聚醯胺之組合,且該至少一種聚醯胺在25℃下完全溶解於該光化輻射可固化組成物中; ii)該至少一種聚醯胺之至少一部分在25℃下呈分散於該光化輻射可固化組成物中之粒子存在; iii)該光化輻射固化組成物在25℃下為凝膠且在100℃或更高溫度下為液體。 One aspect of the present invention provides an actinic radiation curable composition comprising: a) at least one polyamide free of actinic radiation curable functional groups; and b) at least one actinic radiation curable compound, wherein the at least one actinic radiation curable compound is liquid at 25°C; Where condition i), condition ii) or condition iii) is satisfied: i) the at least one polyamide is unmodified polyamide or a combination of unmodified polyamides, and the at least one polyamide is completely soluble in the actinic radiation curable composition at 25°C in the thing; ii) at least a portion of the at least one polyamide is present as particles dispersed in the actinic radiation curable composition at 25°C; iii) The actinic radiation curable composition is a gel at 25°C and a liquid at 100°C or higher.
本發明亦提供一種製造固化聚合物材料之方法,其中該方法包含使用光化輻射使以上提及之光化輻射可固化組成物固化。根據此等方法獲得之固化聚合物材料為本發明之另一面。The present invention also provides a method of manufacturing a cured polymer material, wherein the method comprises curing the above-mentioned actinic radiation curable composition with actinic radiation. The cured polymeric material obtained according to these methods is another aspect of the invention.
本發明進一步提供一種藉由積層製造(諸如藉由三維列印)來製造三維物品之方法,其包含使用以上提及之光化輻射可固化組成物製造三維物品;以及藉由此等方法製造之三維物品。The present invention further provides a method of manufacturing a three-dimensional article by additive manufacturing, such as by three-dimensional printing, comprising manufacturing a three-dimensional article using the above-mentioned actinic radiation curable composition; and manufactured by such methods three-dimensional objects.
本發明之光化輻射可固化組成物可呈聚醯胺於由一或多種光化輻射可固化化合物構成之液體基質中之均質溶液的形式。在其他實施例中,聚醯胺之至少一部分可呈分散於由一或多種光化輻射可固化化合物構成之液體基質中之粒子的形式。可使用光化學3D列印技術使光化輻射可固化組成物快速固化,以提供由於聚醯胺作為組成物之組分存在而具有改良之機械特徵的高解析度物品。The actinic radiation curable composition of the present invention may be in the form of a homogeneous solution of polyamide in a liquid matrix of one or more actinic radiation curable compounds. In other embodiments, at least a portion of the polyamide may be in the form of particles dispersed in a liquid matrix of one or more actinic radiation curable compounds. Actinic radiation curable compositions can be rapidly cured using photochemical 3D printing techniques to provide high resolution articles with improved mechanical characteristics due to the presence of polyamide as a component of the composition.
較佳實施例之詳細說明 光化輻射可固化組成物之示例性特徵 Detailed Description of the Preferred Embodiment Exemplary Features of Actinic Radiation Curable Compositions
根據本發明之合乎需要之態樣(詳言之,其中光化輻射可固化組成物意欲用於在環境溫度下進行之製造製程,諸如積層製造製程),調配光化輻射可固化組成物以使得其在25℃下為液體。例如,光化輻射可固化組成物可在25℃下為均質液體。然而,在其他實施例中,調配光化輻射可固化組成物以使得其在25℃下為凝膠,但在較高溫度(例如,120℃)下為液體。According to a desirable aspect of the invention (specifically, wherein the actinic radiation curable composition is intended for use in a manufacturing process carried out at ambient temperature, such as an additive manufacturing process), the actinic radiation curable composition is formulated such that It is liquid at 25°C. For example, the actinic radiation curable composition may be a homogeneous liquid at 25°C. However, in other embodiments, the actinic radiation curable composition is formulated such that it is a gel at 25°C, but a liquid at higher temperatures (eg, 120°C).
在組成物中使用之一或多種聚醯胺在25℃下正常為固體的實施例中,聚醯胺可完全溶解於光化輻射可固化組成物之其他組分中。然而,根據本發明之其他態樣,至少一種聚醯胺之粒子分散於由至少一種光化輻射可固化化合物構成之液體基質中。組成物之聚醯胺組分在25℃下可完全或僅部分不溶。例如,根據本發明之各種實施例,在25℃下以重量計0%、至少10%、至少20%、至少30%、至少40%、至少50%、至少60%、至少70%、至少80%、至少90%或100%之聚醯胺組分不溶。在聚醯胺組分之至少一部分呈未溶解之分散粒子形式的實施例中,此類粒子可穩定地分散於至少一種光化輻射可固化化合物之液體基質中。分散液之穩定性可經由使用分散劑及/或改質聚醯胺(例如藉由改質聚醯胺以引入幫助穩定分散之聚醯胺粒子的官能基)來提高。一般而言,分散之聚醯胺粒子之粒徑宜保持相對較小,例如d50值小於300 μm、小於250 μm或小於200 μm及/或D90值小於400 μm、小於350 μm或小於300 μm。In embodiments where one or more polyamides are used in the composition that are normally solid at 25°C, the polyamides are completely soluble in the other components of the actinic radiation curable composition. However, according to other aspects of the invention, particles of at least one polyamide are dispersed in a liquid matrix consisting of at least one actinic radiation curable compound. The polyamide component of the composition may be completely or only partially insoluble at 25°C. For example, according to various embodiments of the invention, 0%, at least 10%, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80% by weight at 25°C %, at least 90% or 100% of the polyamide component is insoluble. In embodiments where at least a portion of the polyamide component is in the form of undissolved dispersed particles, such particles can be stably dispersed in a liquid matrix of at least one actinic radiation curable compound. The stability of the dispersion can be improved by using a dispersant and/or modifying the polyamide (eg, by modifying the polyamide to introduce functional groups that help stabilize the dispersed polyamide particles). In general, the particle size of the dispersed polyamide particles is preferably kept relatively small, for example, a d50 value of less than 300 μm, less than 250 μm or less than 200 μm and/or a D90 value of less than 400 μm, less than 350 μm or less than 300 μm.
根據本發明之較佳實施例,如使用布氏黏度計(Brookfield viscometer)型號DV-II使用27轉軸(轉軸速度通常在20與200 rpm之間變化,視黏度而定)所量測,光化輻射可固化組成物在25℃下之黏度不超過100,000 mPa.s,不超過50,000 mPa.s,不超過25,000 mPa.s,不超過10,000 mPa.s,或不超過5000 mPa.s。相對較高之黏度在將可固化組成物加熱到超過25℃之應用中,諸如在採用具有加熱樹脂缸之機器的三維列印操作或其類似操作中可提供令人滿意之效能。According to a preferred embodiment of the present invention, the actinic The radiation curable composition has a viscosity at 25°C of not more than 100,000 mPa.s, not more than 50,000 mPa.s, not more than 25,000 mPa.s, not more than 10,000 mPa.s, or not more than 5000 mPa.s. Relatively high viscosities may provide satisfactory performance in applications where the curable composition is heated above 25°C, such as in three-dimensional printing operations using machines with heated resin tanks or the like.
一旦藉由暴露於有效量之光化輻射(諸如紫外線或可見光或電子束輻射)進行固化,光化輻射可固化組成物就轉化為聚合物材料。聚合物材料之外觀可為透明(透明)、半透明或不透明的。可存在人類肉眼可見的於衍生自光化輻射可固化化合物之聚合基質中之聚醯胺粒子。聚醯胺可在聚合物材料內形成人類肉眼不可見之域。舉例而言,聚合物材料可包含二相,一相為聚醯胺且另一相為一或多種光化輻射可固化化合物之固化反應產物。聚醯胺亦可以分子位準分散於聚合物材料內。例如,聚合物材料可包含互穿聚合物網路。 聚醯胺 The actinic radiation curable composition is converted to a polymeric material upon curing by exposure to an effective amount of actinic radiation, such as ultraviolet or visible light or electron beam radiation. The appearance of the polymeric material can be transparent (transparent), translucent or opaque. Polyamide particles visible to the human eye may be present in a polymeric matrix derived from an actinic radiation curable compound. Polyamides create domains within polymer materials that are invisible to the human eye. For example, a polymeric material may comprise two phases, one phase being polyamide and the other phase being the cured reaction product of one or more actinic radiation curable compounds. Polyamides can also be molecularly dispersed within the polymeric material. For example, a polymeric material may comprise an interpenetrating polymer network. Polyamide
本發明之光化輻射可固化組成物包含一或多種聚醯胺。如本文所用,術語「聚醯胺」係指醯胺鍵(-C(=O)NH-)沿著分子鏈(亦即,沿著聚合物主鏈)出現之聚合物。然而,如隨後將更詳細地解釋,聚合物主鏈可另外含有除醯胺鍵以外的一或多個其他類型之鍵,諸如醚鍵及/或酯鍵。詳言之,組成物包含至少一種不含任何光化輻射可固化官能基(亦即,能夠在暴露於光化輻射時反應以使得聚醯胺共價結合至聚合物基質中之官能基,該聚合物基質藉由組成物中另外存在之至少一種光化輻射可固化化合物,諸如(甲基)丙烯酸酯官能化合物的光化輻射誘發之固化而形成)之聚醯胺。然而,在某些實施例中,光化輻射可固化組成物可另外包含載有至少一種光化輻射可固化官能基之至少一種聚醯胺。The actinic radiation curable compositions of the present invention comprise one or more polyamides. As used herein, the term "polyamide" refers to a polymer in which amide linkages (-C(=O)NH-) occur along the molecular chain (ie, along the polymer backbone). However, as will be explained in more detail subsequently, the polymer backbone may additionally contain one or more other types of linkages than amide linkages, such as ether linkages and/or ester linkages. In particular, the composition comprises at least one functional group that does not contain any actinic radiation curable functional groups (i.e., functional groups capable of reacting upon exposure to actinic radiation such that the polyamide is covalently incorporated into the polymer matrix, which The polymer matrix is polyamide formed by actinic radiation-induced curing of at least one actinic radiation-curable compound, such as a (meth)acrylate-functional compound, additionally present in the composition. However, in certain embodiments, the actinic radiation curable composition may additionally comprise at least one polyamide bearing at least one actinic radiation curable functional group.
根據某些實施例,不含任何光化輻射可固化官能基之聚醯胺(有時在本文中稱為「非官能化聚醯胺」)為脂族聚醯胺。非官能化聚醯胺可例如具有至少5000 g/mol、至少10,000 g/mol、至少15,000 g/mol或至少20,000 g/mol之數目平均分子量。在其他實施例中,非官能化聚醯胺之數目平均分子量不超過150,000 g/mol,不超過100,000 g/mol,或不超過75,000 g/mol。例如,本發明中使用之非官能化聚醯胺可具有10,000至100,000 g/mol之數目平均分子量。在本文中根據ISO 16014-1:2012使用氣體滲透層析法(GPC)量測數目平均分子量Mn。將產物溶解於用0.05 M三氟乙酸鉀穩定化之六氟丙-2-醇中且在環境溫度下保持在1 g/L之濃度下24小時。接著在PTFE膜(0.2 µm孔隙度)上過濾所獲得之溶液且以1 mL/min之流動速率注射在配備有來自Polymer Standards Service之一組管柱PFG之液體層析系統中。該組管柱由預管柱(尺寸50×8 mm)、1000Å管柱(尺寸300×8 mm,粒徑7 µm)及100Å管柱(尺寸300×8 mm,粒徑7 µm)組成。使用折射率量測來偵測。量測之分子量以PMMA同等物(用於校準)給出。According to certain embodiments, the polyamides that do not contain any actinic radiation curable functional groups (sometimes referred to herein as "non-functionalized polyamides") are aliphatic polyamides. The non-functionalized polyamide may, for example, have a number average molecular weight of at least 5000 g/mol, at least 10,000 g/mol, at least 15,000 g/mol or at least 20,000 g/mol. In other embodiments, the number average molecular weight of the non-functionalized polyamide is no greater than 150,000 g/mol, no greater than 100,000 g/mol, or no greater than 75,000 g/mol. For example, the non-functionalized polyamides used in the present invention may have a number average molecular weight of 10,000 to 100,000 g/mol. The number average molecular weight Mn is measured here according to ISO 16014-1:2012 using gas permeation chromatography (GPC). The product was dissolved in hexafluoropropan-2-ol stabilized with 0.05 M potassium trifluoroacetate and maintained at a concentration of 1 g/L for 24 hours at ambient temperature. The resulting solution was then filtered on a PTFE membrane (0.2 µm porosity) and injected at a flow rate of 1 mL/min in a liquid chromatography system equipped with a set of columns PFG from Polymer Standards Service. The set of columns consisted of a pre-column (50×8 mm in size), a 1000Å column (300×8 mm in size, 7 μm in particle size) and a 100Å column (300×8 mm in size, 7 μm in particle size). Detection is performed using refractive index measurements. The measured molecular weights are given as PMMA equivalents (for calibration).
適用於本發明之各種態樣的聚醯胺可為經改質之聚醯胺。在各種其他態樣中,利用係未經改質之聚醯胺之聚醯胺。亦可採用一或多種未經改質之聚醯胺與一或多種經改質之聚醯胺的組合。如本文所用,術語「經改質之聚醯胺」意謂在聚合反應中產生之後藉由化學反應改質以引入新官能基或取代基之聚醯胺。通常,形成聚醯胺之聚合涉及使一或多種多元胺與一或多種多羧酸(或其同等物)反應之縮合反應;涉及經胺及羧酸基取代之單體的縮合反應;或環內醯胺之開環聚合。因此,「未經改質之聚醯胺」為藉助於聚合反應直接獲得且不以將新官能基或取代基引入聚合物中之方式進一步反應的聚醯胺。若此類未經改質之聚醯胺隨後與一或多種試劑以進行化學轉化之方式反應,則其被視為經改質之聚醯胺。Polyamides suitable for use in various aspects of the present invention may be modified polyamides. In various other aspects, polyamides that are unmodified polyamides are utilized. Combinations of one or more unmodified polyamides and one or more modified polyamides may also be employed. As used herein, the term "modified polyamide" means a polyamide modified by a chemical reaction to introduce new functional groups or substituents after being produced in a polymerization reaction. Generally, polymerization to form polyamides involves a condensation reaction involving the reaction of one or more polyamines with one or more polycarboxylic acids (or their equivalents); a condensation reaction involving monomers substituted with amine and carboxylic acid groups; or a ring Ring-opening polymerization of lactams. Thus, an "unmodified polyamide" is a polyamide obtained directly by means of a polymerization reaction and not reacted further in such a way as to introduce new functional groups or substituents into the polymer. Such unmodified polyamides are considered modified polyamides if they are subsequently reacted with one or more reagents in such a way as to effect a chemical transformation.
在本發明之某些實施例中,光化輻射可固化組成物在25℃下為均質液體,其中使利用之非官能化聚醯胺完全可溶於組成物之其他組分(詳言之,完全可溶於組成物中存在之一或多種光化輻射可固化化合物)。在此類實施例中,聚醯胺及光化輻射可固化化合物或光化輻射可固化化合物之混合物可經選擇以具有能夠提供呈均質液體形式之光化輻射可固化組成物的溶解度參數。然而,在其他實施例中,聚醯胺在光化輻射可固化組成物中在25℃下僅具有有限溶解度。在其他實施例中,非官能化聚醯胺在光化輻射可固化組成物之其他組分中在25℃下不溶。在聚醯胺不完全溶解之實施例中,未溶解之聚醯胺或其未溶解部分在25℃下可呈粒子、例如分散粒子形式存在於組成物中。In certain embodiments of the present invention, the actinic radiation curable composition is a homogeneous liquid at 25° C., wherein the non-functionalized polyamide utilized is made completely soluble in the other components of the composition (specifically, One or more actinic radiation curable compounds are present in the composition completely soluble). In such embodiments, the polyamide and the actinic radiation curable compound or mixture of actinic radiation curable compounds may be selected to have solubility parameters capable of providing the actinic radiation curable composition in the form of a homogeneous liquid. However, in other embodiments, the polyamide has only limited solubility at 25°C in the actinic radiation curable composition. In other embodiments, the non-functionalized polyamide is insoluble at 25°C in the other components of the actinic radiation curable composition. In an embodiment where the polyamide is not completely dissolved, the undissolved polyamide or its undissolved portion may exist in the composition in the form of particles, such as dispersed particles, at 25°C.
根據本發明之某些有利實施例,用作光化輻射可固化組成物之組分(b)的光化輻射可固化化合物或光化輻射可固化化合物之混合物係基於其漢森溶解度參數選擇,該等參數反映有機物質之物理化學溶解特性,亦稱為溶劑化能力。漢森溶解度參數可根據Charles Hansen在名為「Hansen Solubility Parameters: A user's handboo」, 第二版(2007) Boca Raton, Fla.: CRC Press. ISBN 978-O-8493-7248-3之工作中提出之方法計算。根據此方法,三個參數(稱為「漢森參數」:δ d、δ p及δ h)足以預測溶劑相對於所指定分子之行為。參數δ d(以MPa 1/2為單位)定量分子間之分散力(亦即,凡得瓦爾力(van der Waals force))的能量。參數δ p(以MPa 1/2為單位)表示分子間偶極相互作用之能量。最後,參數δ h(以MPa 1/2為單位)定量來自分子間氫鍵之能量,亦即,經由氫鍵相互作用之能力。三個參數之平方和相當於希德布蘭溶解度參數(Hildebrand solubility parameter) (δ tot)之平方數。如此項技術中已知,漢森溶解度參數可用作預測一種材料是否將溶解於另一種材料中且形成溶液之方式。其係基於「相似相容」之概念,其中若一個分子以類似方式鍵結至其自身,則一個分子定義為「相似於」另一分子。因此,三個漢森溶解度參數可作為三維(漢森)空間之座標來對待。在此漢森空間中二個分子愈靠在一起,其愈可能一起形成溶液。本發明人已發現,非官能化聚醯胺組分a)及光化輻射可固化組分b)之分散參數δ d足夠類似,以使得各組分之希德布蘭溶解度參數主要視δ p及δ h而定,因此,若此等參數在二維空間中相對於彼此繪製,則其指示光化輻射可固化組分b)中之非官能化聚醯胺組分a)之溶解性。 According to certain advantageous embodiments of the present invention, the actinic radiation curable compound or mixture of actinic radiation curable compounds used as component (b) of the actinic radiation curable composition is selected on the basis of its Hansen solubility parameter, These parameters reflect the physicochemical solubility properties of organic substances, also known as solvating power. Hansen Solubility Parameters can be proposed based on the work of Charles Hansen entitled "Hansen Solubility Parameters: A user's handboo", Second Edition (2007) Boca Raton, Fla.: CRC Press. ISBN 978-O-8493-7248-3 method to calculate. According to this method, three parameters (referred to as "Hansen parameters": δd , δp , and δh ) are sufficient to predict the behavior of a solvent with respect to a given molecule. The parameter δ d (in MPa 1/2 ) quantifies the energy of the dispersion force (ie, the van der Waals force) between molecules. The parameter δ p (in MPa 1/2 as the unit) represents the energy of the dipole interaction between molecules. Finally, the parameter δ h (in MPa 1/2 ) quantifies the energy from intermolecular hydrogen bonds, ie the ability to interact via hydrogen bonds. The sum of the squares of the three parameters is equivalent to the square number of the Hildebrand solubility parameter (δ tot ). As is known in the art, the Hansen solubility parameter can be used as a way to predict whether one material will dissolve in another material and form a solution. It is based on the concept of "like compatible", wherein a molecule is defined to be "similar" to another molecule if it is bonded to itself in a similar manner. Therefore, the three Hansen solubility parameters can be treated as coordinates in three-dimensional (Hansen) space. The closer together two molecules are in this Hansen space, the more likely they are to form a solution together. The inventors have found that the dispersion parameters δ d of the non-functionalized polyamide component a) and the actinic radiation curable component b) are sufficiently similar that the Hildebrand solubility parameters for each component depend primarily on δ p and δ h , thus, if these parameters are plotted against each other in two-dimensional space, it indicates the solubility of the non-functionalized polyamide component a) in the actinic radiation curable component b).
適當時,附圖上所示之所有化合物均適用作組分(a)及(b);圖上未展示之其他化合物(包括例如其他等級之PEBAX
®彈性體)亦適用作組分(a)及(b)。在本發明之某些實施例中,組分(a)及組分(b)可具有7至10 MPa
1/2之漢森溶解度參數δ
p及4.5至8.5 MPa
1/2之漢森溶解度參數δ
h。根據此等實施例且參看圖,組分(a)可為PEBAX® 2533、聚醯胺12 (PA12)、PEBAX® 3533、PEBAX® 4033及PEBAX® 7433中之至少一者,且組分(b)可為SR217、SR420、SR423D、SR506D、SR9075、SR504D、SR567P、SR261、SR789、SR285、SR239EU及CN1964CG中之至少一者。所有此等產物可自其受讓人購得。
Where appropriate, all compounds shown on the drawings are suitable as components (a) and (b); other compounds not shown on the drawings (including, for example, other grades of PEBAX® elastomers) are also suitable as component (a) and (b). In certain embodiments of the present invention, component (a) and component (b) may have a Hansen solubility parameter δ p of 7 to 10 MPa 1/2 and a Hansen solubility parameter of 4.5 to 8.5 MPa 1/2 δ h . According to these embodiments and referring to the figures, component (a) can be at least one of
在某些實施例中,光化輻射可固化組成物在25℃下可為凝膠,其能夠在加熱(例如,至80℃、90℃、100℃、110℃、120℃、130℃或140℃)時及/或在與合適非反應性溶劑或非反應性溶劑之組合進行組合時液化。如本文所用,術語「凝膠」可定義為分散相為液體且分散介質為固體之一種膠體系統。凝膠可為不能動之半固體,換言之,其在自身重量下不流動。在25℃下,凝膠可為均質、透明及/或可撓性的。可在例如3D列印操作期間可加熱光化輻射可固化組成物以降低其黏度,以便於處置。根據某些實施例,光化輻射可固化組成物可保持於腔室或缸中且加熱至一定溫度以降低光化輻射可固化組成物之黏度。舉例而言,可將光化輻射可固化組成物加熱至高於組分a)之熔點的溫度。In certain embodiments, the actinic radiation curable composition can be a gel at 25°C, which can be heated (for example, to 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, or 140°C). °C) and/or when combined with a suitable non-reactive solvent or combination of non-reactive solvents. As used herein, the term "gel" can be defined as a colloidal system in which the dispersed phase is liquid and the dispersion medium is solid. A gel can be an immobile semisolid, in other words, it does not flow under its own weight. At 25°C, the gel may be homogeneous, transparent and/or flexible. The actinic radiation curable composition can be heated to reduce its viscosity, for example during a 3D printing operation, to facilitate handling. According to certain embodiments, the actinic radiation curable composition may be maintained in a chamber or tank and heated to a temperature to reduce the viscosity of the actinic radiation curable composition. For example, the actinic radiation curable composition may be heated to a temperature above the melting point of component a).
根據某些實施例,組成物包含至少一種熱塑性聚醯胺。在其他實施例中,組成物包含至少一種為熱塑性彈性體之聚醯胺。According to certain embodiments, the composition comprises at least one thermoplastic polyamide. In other embodiments, the composition includes at least one polyamide that is a thermoplastic elastomer.
根據本發明之各種態樣,非官能化聚醯胺可為線性聚醯胺。然而,亦可使用分支聚醯胺。非官能化聚醯胺可具有末端基團,該等末端基團為羧酸基、胺基或羧酸基及胺基二者。除光化輻射可固化端基(例如(甲基)丙烯酸酯端基)以外,亦可或替代地存在其他類型之端基。According to various aspects of the invention, the non-functionalized polyamide may be a linear polyamide. However, branched polyamides may also be used. Non-functionalized polyamides can have end groups that are carboxylic acid groups, amine groups, or both carboxylic acid groups and amine groups. In addition to actinic radiation curable end groups such as (meth)acrylate end groups, other types of end groups may also or alternatively be present.
適用於本發明之非官能化聚醯胺包括此項技術中已知之均聚聚醯胺及共聚聚醯胺中之任一者,諸如聚醯胺6,6、聚醯胺6,10、聚醯胺10,10、聚醯胺6,12、聚醯胺4,6、聚醯胺6、聚醯胺11及聚醯胺12。Non-functionalized polyamides suitable for use in the present invention include any of the homopolyamides and copolyamides known in the art, such as polyamide 6,6,
由至少一種聚醯胺嵌段構成之嵌段共聚物在本發明中亦適用作非官能化聚醯胺。此類嵌段共聚物另外包含至少一種不為聚醯胺嵌段之嵌段(下文中有時稱為非聚醯胺嵌段),諸如至少一種聚酯嵌段、至少一種聚醚-酯嵌段、至少一種聚醚嵌段或至少一種聚有機矽氧烷嵌段。至少一種聚醯胺嵌段可構成「硬」嵌段(例如,玻璃轉移溫度(Tg)為30℃或更高之嵌段),而除聚醯胺嵌段以外之至少一種嵌段可構成「軟」嵌段(例如,Tg小於30℃之嵌段,尤其是Tg為0℃或更低之嵌段)。Block copolymers consisting of at least one polyamide block are also suitable as non-functionalized polyamides in the present invention. Such block copolymers additionally comprise at least one block that is not a polyamide block (hereinafter sometimes referred to as a non-polyamide block), such as at least one polyester block, at least one polyether-ester block, segment, at least one polyether block or at least one polyorganosiloxane block. At least one polyamide block may constitute a "hard" block (e.g., a block having a glass transition temperature (Tg) of 30° C. or greater), while at least one block other than a polyamide block may constitute a "hard" block. Soft blocks (for example, blocks with a Tg of less than 30°C, especially blocks with a Tg of 0°C or lower).
合適聚醯胺嵌段包括此項技術中已知之均聚聚醯胺及共聚聚醯胺中之任一者之嵌段,諸如聚醯胺6,6、聚醯胺6,10、聚醯胺10,10、聚醯胺6,12、聚醯胺4,6、聚醯胺6、聚醯胺11及聚醯胺12。Suitable polyamide blocks include blocks of any of the homopolyamides and copolyamides known in the art, such as polyamide 6,6,
聚醯胺嵌段之數目平均分子量不受特別限制且可根據期望而變化,以賦予光化輻射可固化組成物與自其獲得之固化產物中之一或二者某些特徵。舉例而言,一或多種聚醯胺嵌段之數目平均分子量可為至少400 g/mol或至少500 g/mol,及/或數目平均分子量不超過20,000 g/mol或不超過10,000 g/mol。根據某些實施例,聚醯胺嵌段之數目平均分子量可為400至20,000 g/mol或500至10,000 g/mol。The number average molecular weight of the polyamide blocks is not particularly limited and may vary as desired to impart certain characteristics to either or both the actinic radiation curable composition and the cured product obtained therefrom. For example, the one or more polyamide blocks may have a number average molecular weight of at least 400 g/mol or at least 500 g/mol, and/or a number average molecular weight of no more than 20,000 g/mol or no more than 10,000 g/mol. According to certain embodiments, the number average molecular weight of the polyamide blocks may be 400 to 20,000 g/mol or 500 to 10,000 g/mol.
如先前所提及,非聚醯胺嵌段可例如選自於由以下組成之群:聚醚嵌段(聚合物主鏈中包含多個醚鍵之嵌段)、聚酯嵌段(聚合物主鏈中包含多個酯鍵之嵌段)、聚醚-酯嵌段(聚合物主鏈中包含多個醚鍵及酯鍵之嵌段)及聚有機矽氧烷嵌段(聚合物主鏈中包含多個-O-Si(R) 2-鍵之嵌段,其中各R為有機部分,諸如甲基)。因此,可用於本發明之嵌段聚合物包括但不限於聚醯胺-聚醚嵌段共聚物、聚醯胺至聚酯嵌段共聚物、聚醯胺-聚醚-聚酯嵌段共聚物及聚醯胺-聚有機矽氧烷嵌段共聚物。 As mentioned previously, the non-polyamide blocks may, for example, be selected from the group consisting of: polyether blocks (blocks containing multiple ether linkages in the polymer backbone), polyester blocks (polymer A block containing multiple ester bonds in the main chain), a polyether-ester block (a block containing multiple ether bonds and ester bonds in the polymer main chain) and a polyorganosiloxane block (a polymer main chain A block containing multiple -O-Si(R) 2 -bonds in which each R is an organic moiety such as methyl). Accordingly, block polymers useful in the present invention include, but are not limited to, polyamide-polyether block copolymers, polyamide-to-polyester block copolymers, polyamide-polyether-polyester block copolymers And polyamide-polyorganosiloxane block copolymers.
合適聚醚嵌段尤其包括聚氧伸烷基嵌段,諸如藉由環氧烷,諸如環氧乙烷、環氧丙烷、氧雜環丁烷及四氫呋喃之開環聚合形成之嵌段。在某些實施例中,雖然聚氧伸烷基嵌段為均聚的(亦即,包含結構一致之重複單元),但由二個或更多個不同氧基伸烷基重複單元構成之共聚嵌段亦為可能的。合適聚醚嵌段包括但不限於聚乙二醇嵌段(其亦可稱為聚氧伸乙基嵌段)、聚丙二醇嵌段(其亦可稱為聚氧伸丙基嵌段)、聚伸丙二醇嵌段(其亦可稱為聚氧三亞甲基嵌段)及聚伸丁二醇嵌段(其亦可稱為聚氧四亞甲基嵌段)。聚醚嵌段亦可為包含經聚氧伸烷基部分(諸如聚氧伸乙基部分)取代之中心非醚部分,諸如雙酚部分之嵌段。例如,聚醚嵌段可為乙氧基化雙酚A嵌段。Suitable polyether blocks include especially polyoxyalkylene blocks, such as blocks formed by ring-opening polymerization of alkylene oxides, such as ethylene oxide, propylene oxide, oxetane and tetrahydrofuran. In certain embodiments, although the polyoxyalkylene blocks are homopolymeric (i.e., comprise structurally consistent repeat units), copolymeric blocks composed of two or more different oxyalkylene repeat units Sections are also possible. Suitable polyether blocks include, but are not limited to, polyethylene glycol blocks (which may also be referred to as polyoxyethylene blocks), polypropylene glycol blocks (which may also be referred to as polyoxypropylene blocks), poly Propylene glycol blocks (which may also be referred to as polyoxytrimethylene blocks) and polybutylene glycol blocks (which may also be referred to as polyoxytetramethylene blocks). The polyether blocks may also be blocks comprising a central non-ether moiety, such as a bisphenol moiety, substituted with a polyoxyalkylene moiety, such as a polyoxyethylene moiety. For example, the polyether blocks may be ethoxylated bisphenol A blocks.
適用於本發明之聚醯胺中亦可存在一或多種聚酯嵌段,其中聚醯胺為嵌段共聚物。此類聚酯嵌段可為脂族聚酯嵌段,不過亦可使用芳族聚酯嵌段。One or more polyester blocks may also be present in polyamides suitable for use in the present invention, wherein the polyamides are block copolymers. Such polyester blocks may be aliphatic polyester blocks, although aromatic polyester blocks may also be used.
在其他實施例中,一或多種非聚醯胺嵌段可為聚有機矽氧烷嵌段,諸如聚二甲基矽氧烷嵌段。In other embodiments, one or more of the non-polyamide blocks may be polyorganosiloxane blocks, such as polydimethylsiloxane blocks.
非聚醯胺嵌段之數目平均分子量不受特別限制且可根據期望而變化,以賦予光化輻射可固化組成物與自其獲得之固化產物中之一或二者某些特徵。舉例而言,一或多種非聚醯胺嵌段之數目平均分子量可為至少200 g/mol或至少300 g/mol,及/或數目平均分子量不超過6000 g/mol或不超過3000 g/mol。根據某些實施例,非聚醯胺嵌段之數目平均分子量可為200至6000 g/mol或300至3000 g/mol。The number average molecular weight of the non-polyamide blocks is not particularly limited and may vary as desired to impart certain characteristics to either or both the actinic radiation curable composition and the cured product obtained therefrom. For example, the one or more non-polyamide blocks may have a number average molecular weight of at least 200 g/mol or at least 300 g/mol, and/or a number average molecular weight of not more than 6000 g/mol or not more than 3000 g/mol . According to certain embodiments, the number average molecular weight of the non-polyamide blocks may be 200 to 6000 g/mol or 300 to 3000 g/mol.
包含至少一種聚醯胺嵌段及至少一種非聚醯胺嵌段之嵌段共聚物可包含以嵌段共聚物之重量計例如5至95重量%之聚醯胺嵌段及5至95重量%非聚醯胺嵌段、10至90重量%聚醯胺嵌段及10至90重量%非聚醯胺嵌段或15至85重量%聚醯胺嵌段及15至85重量%非聚醯胺嵌段。Block copolymers comprising at least one polyamide block and at least one non-polyamide block may comprise, for example, 5 to 95% by weight of polyamide blocks and 5 to 95% by weight, based on the weight of the block copolymer Non-polyamide blocks, 10 to 90% by weight polyamide blocks and 10 to 90% by weight non-polyamide blocks or 15 to 85% by weight polyamide blocks and 15 to 85% by weight non-polyamide blocks block.
在某些實施例中,聚醯胺為包含單個非聚醯胺嵌段(例如,聚醚或聚酯嵌段)及二個聚醯胺嵌段之嵌段共聚物,其中該非聚醯胺嵌段形成中心嵌段且該等聚醯胺嵌段形成嵌段末端,具有通用結構A-B-A,其中一種=聚醯胺嵌段且B=非聚醯胺嵌段)。然而,在其他實施例中,聚醯胺為包含單個非聚醯胺嵌段及單個聚醯胺嵌段之嵌段共聚物,具有通用結構A-B,其中A=聚醯胺嵌段且B=聚醚嵌段。在其他實施例中,非官能化聚醯胺為包含二個或更多個非聚醯胺嵌段及二個或更多個聚醯胺嵌段之多嵌段共聚物,該等嵌段呈交替方式排列且對應於通用結構(A-B) n,其中A=聚醯胺嵌段,B=非聚醯胺嵌段,且n=2或更大之整數。 In certain embodiments, the polyamide is a block copolymer comprising a single non-polyamide block (e.g., a polyether or polyester block) and two polyamide blocks, wherein the non-polyamide block The segments form the central block and the polyamide blocks form the block ends, having the general structure ABA, where one = polyamide block and B = non-polyamide block). However, in other embodiments, the polyamide is a block copolymer comprising a single non-polyamide block and a single polyamide block, having the general structure AB, where A=polyamide block and B=polyamide block ether blocks. In other embodiments, the non-functionalized polyamide is a multi-block copolymer comprising two or more non-polyamide blocks and two or more polyamide blocks, the blocks being Alternately arranged and corresponding to the general structure (AB) n , wherein A=polyamide block, B=non-polyamide block, and n=2 or greater integer.
製造包含一或多個聚醯胺嵌段及一或多個非聚醯胺嵌段之嵌段共聚物之方法為此項技術中所熟知且此類方法中之任一者可用於製備用於本發明之聚醯胺嵌段共聚物。Methods of making block copolymers comprising one or more polyamide blocks and one or more non-polyamide blocks are well known in the art and any of such methods can be used to make The polyamide block copolymer of the present invention.
適用於本發明中之示例性聚醯胺嵌段共聚物描述於例如以下公開專利申請案中,該等申請案之揭示內容以全文引用的方式併入本文中以達成所有目的:US 2015/0166746 A1;US 2016/0369098 A1;及US 2016/0251484 A1。Exemplary polyamide block copolymers suitable for use in the present invention are described, for example, in the following published patent application, the disclosure of which is incorporated herein by reference in its entirety for all purposes: US 2015/0166746 A1; US 2016/0369098 A1; and US 2016/0251484 A1.
本發明中可利用二種或更多種不同聚醯胺之組合。如本文所用之術語「聚醯胺組分」係指光化輻射可固化組成物之為聚醯胺之所有成分(不論單一聚醯胺或聚醯胺組合)。Combinations of two or more different polyamides can be utilized in the present invention. As used herein, the term "polyamide component" refers to all components of an actinic radiation curable composition that are polyamides (whether a single polyamide or a combination of polyamides).
光化輻射可固化組成物中存在之聚醯胺組分之量可根據期望或需要而變化,以在藉由暴露於光化輻射而固化後實現光化輻射可固化組成物與自其獲得之固化產物中之一或二者的特性或特徵。例如,光化輻射可固化組成物可包含以光化輻射可固化組成物之總重量計至少0.5重量%、至少1重量%、至少2重量%、至少5重量%或至少10重量%聚醯胺。根據某些實施例,光化輻射可固化組成物可由以光化輻射可固化組成物之總重量計不超過50重量%、不超過40重量%或不超過30重量%聚醯胺構成。The amount of the polyamide component present in the actinic radiation curable composition can be varied as desired or needed to achieve the effect of the actinic radiation curable composition and the product obtained therefrom after curing by exposure to actinic radiation. A property or characteristic of one or both of the cured products. For example, the actinic radiation curable composition may comprise at least 0.5%, at least 1%, at least 2%, at least 5%, or at least 10% by weight polyamide, based on the total weight of the actinic radiation curable composition. . According to certain embodiments, the actinic radiation curable composition may consist of no more than 50 wt%, no more than 40 wt%, or no more than 30 wt% polyamide, based on the total weight of the actinic radiation curable composition.
在本發明之其他態樣中,光化輻射可固化組成物包含每100重量份光化輻射可固化化合物至多30重量份聚醯胺(在存在超過一種光化輻射可固化化合物之情況下,每100重量份光化輻射可固化化合物之總量)。在其他態樣中,光化輻射可固化組成物可包含每100重量份光化輻射可固化化合物至少0.5重量份聚醯胺。例如,在某些實施例中,光化輻射可固化組成物可包含每100重量份光化輻射可固化化合物0.5至25重量份聚醯胺。在一個實施例中,光化輻射可固化組成物可包含每100重量份光化輻射可固化化合物0.5至20、0.5至15、0.5至10、0.5至8或0.5至6重量份聚醯胺。在另一實施例中,光化輻射可固化組成物可包含每100重量份光化輻射可固化化合物5至25重量份、8至25重量份、10至25重量份或15至25重量份聚醯胺。 光化輻射可固化化合物 In other aspects of the invention, the actinic radiation curable composition comprises up to 30 parts by weight polyamide per 100 parts by weight actinic radiation curable compound (in the case of more than one actinic radiation curable compound, each 100 parts by weight of the total amount of actinic radiation curable compound). In other aspects, the actinic radiation curable composition may comprise at least 0.5 parts by weight polyamide per 100 parts by weight actinic radiation curable compound. For example, in certain embodiments, the actinic radiation curable composition may comprise 0.5 to 25 parts by weight polyamide per 100 parts by weight actinic radiation curable compound. In one embodiment, the actinic radiation curable composition may comprise 0.5 to 20, 0.5 to 15, 0.5 to 10, 0.5 to 8, or 0.5 to 6 parts by weight polyamide per 100 parts by weight of actinic radiation curable compound. In another embodiment, the actinic radiation curable composition may contain 5 to 25 parts by weight, 8 to 25 parts by weight, 10 to 25 parts by weight, or 15 to 25 parts by weight of polyamide per 100 parts by weight of actinic radiation curable compound. Amide. actinic radiation curable compound
除了一或多種聚醯胺之外,本發明之光化輻射可固化組成物包含一或多種光化輻射可固化化合物。此類光化輻射可固化化合物包括包含一或多種官能基之化合物,該一或多種官能基在暴露於光化輻射時能夠參與聚合或固化反應以使得因涉及此類化合物之多個個別分子上之官能基的共價鍵結而形成聚合物基質。用於達成此目的之合適官能基包括烯系不飽和官能基,諸如(甲基)丙烯酸酯官能基(亦即,丙烯酸酯官能基、甲基丙烯酸酯官能基)、(甲基)丙烯醯胺官能基(亦即,丙烯醯胺官能基、甲基丙烯醯胺官能基)、氰基丙烯酸酯官能基、丙二酸亞甲酯官能基、衣康酸酯官能基、乙烯基官能基、乙烯基醚官能基及其類似物。本發明中所用之光化輻射可固化化合物每分子可具有單個此類光化輻射可固化官能基,或每分子可具有二個、三個、四個或更多個光化輻射可固化官能基。若光化輻射可固化化合物每分子包含二個或更多個光化輻射可固化官能基,則此類官能基可此相同或彼不同。In addition to one or more polyamides, the actinic radiation curable compositions of the present invention comprise one or more actinic radiation curable compounds. Such actinic radiation curable compounds include compounds comprising one or more functional groups capable of participating in a polymerization or curing reaction upon exposure to actinic radiation such that the The covalent bonding of the functional groups of the polymers forms the polymer matrix. Suitable functional groups for this purpose include ethylenically unsaturated functional groups such as (meth)acrylate functional groups (i.e., acrylate functional groups, methacrylate functional groups), (meth)acrylamide functional groups (i.e., acrylamide functional groups, methacrylamide functional groups), cyanoacrylate functional groups, methylene malonate functional groups, itaconate functional groups, vinyl functional groups, vinyl functional groups, Ether functional groups and their analogs. The actinic radiation curable compounds used in the present invention may have a single such actinic radiation curable functional group per molecule, or may have two, three, four or more actinic radiation curable functional groups per molecule . If the actinic radiation curable compound comprises two or more actinic radiation curable functional groups per molecule, such functional groups may be the same or different.
如以下更詳細地描述,光化輻射可固化化合物在特徵上可為單體或寡聚物。合適(甲基)丙烯酸酯官能化之化合物例如包括(甲基)丙烯酸酯官能化之單體及(甲基)丙烯酸酯官能化之寡聚物。As described in more detail below, the actinic radiation curable compound can be monomeric or oligomeric in character. Suitable (meth)acrylate functional compounds include, for example, (meth)acrylate functional monomers and (meth)acrylate functional oligomers.
根據本發明之某些實施例,光化輻射可固化組成物包含至少一種每分子包含二個或更多個(甲基)丙烯酸酯官能基之(甲基)丙烯酸酯官能化之單體或寡聚物。每分子包含二個或更多個(甲基)丙烯酸酯官能基之適用的(甲基)丙烯酸酯官能化之單體之實例包括多元醇之丙烯酸酯及甲基丙烯酸酯(每分子包含二個或更多個(例如2至6個)羥基之有機化合物)。合適多元醇之特定實例包括C 2-20烷二醇(具有C 2-10伸烷基之二醇可為較佳,其中碳鏈可為分支鏈;例如乙二醇、伸丙二醇、1,2-丙二醇、1,2-丁二醇、1,3-丁二醇、2,3-丁二醇、伸丁二醇(1,4-丁二醇)、1,5-戊二醇、1,6-己二醇、1,8-辛二醇、1,9-壬二醇、1,12-十二烷二醇、環己烷-1,4-二甲醇、雙酚及氫化雙酚,以及其烷氧基化(例如,乙氧基化及/或丙氧基化)衍生物,其中例如1至20莫耳之環氧烷,諸如環氧乙烷及/或環氧丙烷,已與1莫耳二醇反應);二乙二醇;甘油;烷氧基化甘油;三乙二醇;二丙二醇;三丙二醇;三羥甲基丙烷;烷氧基化三羥甲基丙烷;二(三羥甲基丙烷);烷氧基化二(三羥甲基丙烷);季戊四醇;烷氧基化季戊四醇;二季戊四醇;烷氧基化二季戊四醇;環己二醇;烷氧基化環己二醇;環己烷二甲醇;烷氧基化環己烷二甲醇;降莰烯二甲醇;烷氧基化降莰烯二甲醇;降莰烷二甲醇;烷氧基化降莰烷二甲醇;包含芳環之多元醇;環己烷-1,4-二甲醇環氧乙烷加合物;雙酚環氧乙烷加合物;氫化雙酚環氧乙烷加合物;雙酚環氧丙烷加合物;氫化雙酚環氧丙烷加合物;環己烷-1,4-二甲醇環氧丙烷加合物;糖醇及烷氧基化糖醇。此類多元醇可完全或部分酯化(藉由(甲基)丙烯酸、(甲基)丙烯酸酐、(甲基)丙烯醯氯或其類似物),限制條件為此類多元醇每分子包含至少二個(甲基)丙烯酸酯官能基。如本文所用,術語「烷氧基化」係指如下化合物,其中一或多種環氧化物,諸如環氧乙烷及/或環氧丙烷已與鹼化合物(諸如多元醇)之活性含氫基團(例如,羥基)反應,形成一或多個氧基伸烷基部分。舉例而言,每莫耳之鹼化合物可與1至25莫耳之環氧化物發生反應。根據本發明之某些態樣,所使用之(甲基)丙烯酸酯官能化之單體的分子量可相對較低(例如,100至1000 g/mol)。 According to certain embodiments of the present invention, the actinic radiation curable composition comprises at least one (meth)acrylate functionalized monomer or oligomeric monomer comprising two or more (meth)acrylate functional groups per molecule. Polymer. Examples of suitable (meth)acrylate functional monomers containing two or more (meth)acrylate functional groups per molecule include acrylate and methacrylate esters of polyols (containing two or more (eg, 2 to 6) hydroxyl organic compounds). Specific examples of suitable polyols include C2-20 alkanediols (diols with C2-10 alkylene groups may be preferred, where the carbon chain may be branched; for example ethylene glycol, propylene glycol, 1,2 -Propylene glycol, 1,2-butanediol, 1,3-butanediol, 2,3-butanediol, butylene glycol (1,4-butanediol), 1,5-pentanediol, 1 ,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,12-dodecanediol, cyclohexane-1,4-dimethanol, bisphenol and hydrogenated bisphenol , and alkoxylated (for example, ethoxylated and/or propoxylated) derivatives thereof, wherein, for example, 1 to 20 molar alkylene oxides, such as ethylene oxide and/or propylene oxide, have been with 1 mole of diol); diethylene glycol; glycerol; alkoxylated glycerol; triethylene glycol; dipropylene glycol; tripropylene glycol; trimethylolpropane; alkoxylated trimethylolpropane; (trimethylolpropane); alkoxylated bis(trimethylolpropane); pentaerythritol; alkoxylated pentaerythritol; dipentaerythritol; alkoxylated dipentaerythritol; cyclohexanediol; alkoxylated cyclohexane Diol; Cyclohexane Dimethanol; Alkoxylated Cyclohexane Dimethanol; Norcamphene Dimethanol; Alkoxylated Norborne Dimethanol; Norbornane Dimethanol; ; Polyols containing aromatic rings; Cyclohexane-1,4-dimethanol ethylene oxide adducts; Bisphenol ethylene oxide adducts; Hydrogenated bisphenol ethylene oxide adducts; Bisphenol rings Propylene oxide adduct; hydrogenated bisphenol propylene oxide adduct; cyclohexane-1,4-dimethanol propylene oxide adduct; sugar alcohol and alkoxylated sugar alcohol. Such polyols may be fully or partially esterified (by (meth)acrylic acid, (meth)acrylic anhydride, (meth)acryloyl chloride or the like), provided that such polyols contain at least Two (meth)acrylate functional groups. As used herein, the term "alkoxylated" refers to compounds in which one or more epoxides, such as ethylene oxide and/or propylene oxide, have been combined with reactive hydrogen-containing groups of base compounds such as polyols (eg, hydroxyl) to form one or more oxyalkylene moieties. For example, 1 to 25 moles of epoxide can be reacted per mole of base compound. According to certain aspects of the invention, the molecular weight of the (meth)acrylate functional monomer used may be relatively low (eg, 100 to 1000 g/mol).
本發明之光化輻射可固化組成物中亦可使用此項技術中已知之任一種(甲基)丙烯酸酯官能化之寡聚物。根據某些實施例,此類寡聚物每分子包含二個或更多個(甲基)丙烯酸酯官能基。此類寡聚物之數目平均分子量可廣泛變化,例如約500至約50,000。Any of the (meth)acrylate functional oligomers known in the art may also be used in the actinic radiation curable compositions of the present invention. According to certain embodiments, such oligomers comprise two or more (meth)acrylate functional groups per molecule. The number average molecular weight of such oligomers can vary widely, eg, from about 500 to about 50,000.
合適(甲基)丙烯酸酯官能化之寡聚物包括例如聚酯(甲基)丙烯酸酯寡聚物、環氧基(甲基)丙烯酸酯寡聚物、聚醚(甲基)丙烯酸酯寡聚物、聚胺基甲酸酯(甲基)丙烯酸酯寡聚物、丙烯酸類(甲基)丙烯酸酯寡聚物、聚二烯(甲基)丙烯酸酯寡聚物、聚碳酸酯(甲基)丙烯酸酯寡聚物、聚醯胺(甲基)丙烯酸酯寡聚物以及其組合。可選擇此類寡聚物且與一或多種(甲基)丙烯酸酯官能化之單體組合使用以調整或調節使用本發明之光化輻射可固化組成物製備之固化樹脂的特性。Suitable (meth)acrylate functionalized oligomers include, for example, polyester (meth)acrylate oligomers, epoxy (meth)acrylate oligomers, polyether (meth)acrylate oligomers Polyurethane (meth)acrylate oligomer, Acrylic (meth)acrylate oligomer, Polydiene (meth)acrylate oligomer, Polycarbonate (meth)acrylate Acrylate oligomers, polyamide (meth)acrylate oligomers, and combinations thereof. Such oligomers can be selected and used in combination with one or more (meth)acrylate functional monomers to tune or tune the properties of cured resins prepared using the actinic radiation curable compositions of the present invention.
示例性聚酯(甲基)丙烯酸酯寡聚物包括丙烯酸或甲基丙烯酸或其混合物與羥基封端之聚酯多元醇的反應產物。特定而言,在聚酯多元醇為雙官能之情況下,可進行反應過程,使得聚酯多元醇之所有或基本上所有羥基已經(甲基)丙烯酸化。可藉由使聚羥基官能性組分(特定言之,二醇)與聚羧酸官能性化合物(特定言之,二羧酸及酸酐)發生聚縮合反應來製造聚酯多元醇。聚羥基官能組分及聚羧酸官能組分可各自具有直鏈、分支鏈、環脂族或芳族結構且可個別地使用或混合使用。Exemplary polyester (meth)acrylate oligomers include the reaction products of acrylic or methacrylic acid or mixtures thereof with hydroxyl terminated polyester polyols. In particular, where the polyester polyol is difunctional, the reaction process can be carried out such that all or substantially all of the hydroxyl groups of the polyester polyol have been (meth)acrylated. Polyester polyols can be produced by polycondensation of polyhydroxy-functional components (specifically, diols) with polycarboxylic acid-functional compounds (specifically, dicarboxylic acids and anhydrides). The polyhydroxy-functional component and the polycarboxylic acid-functional component may each have a linear, branched, cycloaliphatic or aromatic structure and may be used individually or in admixture.
合適環氧基(甲基)丙烯酸酯寡聚物之實例包括丙烯酸或甲基丙烯酸或其混合物與縮水甘油醚或酯之反應產物。Examples of suitable epoxy (meth)acrylate oligomers include reaction products of acrylic or methacrylic acid or mixtures thereof with glycidyl ethers or esters.
合適聚醚(甲基)丙烯酸酯寡聚物包括但不限於丙烯酸或甲基丙烯酸或其混合物與為聚醚多元醇(諸如聚乙二醇、聚丙二醇或聚伸丁二醇)之聚醚醇的縮合反應產物。合適聚醚醇可為包含醚鍵及末端羥基之直鏈或分支鏈物質。聚醚醇可藉由環醚(諸如四氫呋喃或環氧烷)與起始分子之開環聚合來製備。合適起始分子包括水、聚羥基官能材料、聚酯多元醇及胺。Suitable polyether (meth)acrylate oligomers include, but are not limited to, acrylic or methacrylic acid or mixtures thereof and polyether alcohols that are polyether polyols such as polyethylene glycol, polypropylene glycol, or polybutylene glycol. condensation reaction products. Suitable polyether alcohols may be linear or branched substances comprising ether linkages and terminal hydroxyl groups. Polyether alcohols can be prepared by ring-opening polymerization of cyclic ethers such as tetrahydrofuran or alkylene oxides with starter molecules. Suitable starter molecules include water, polyhydroxy functional materials, polyester polyols and amines.
能夠用於本發明之多組分系統中之聚胺基甲酸酯(甲基)丙烯酸酯寡聚物(有時亦被稱作「胺基甲酸酯(甲基)丙烯酸酯寡聚物」)包括藉由(甲基)丙烯酸酯端基封端之基於脂族及/或芳族聚酯多元醇及聚醚多元醇與脂族及/或芳族聚酯二異氰酸酯及聚醚二異氰酸酯的胺基甲酸酯。合適聚胺基甲酸酯(甲基)丙烯酸酯寡聚物包括例如脂族聚酯類胺基甲酸酯二丙烯酸酯及四丙烯酸酯寡聚物、脂族聚醚類胺基甲酸酯二丙烯酸酯及四丙烯酸酯寡聚物,以及脂族聚酯/聚醚類胺基甲酸酯二丙烯酸酯及四丙烯酸酯寡聚物。Polyurethane (meth)acrylate oligomers (sometimes referred to as "urethane (meth)acrylate oligomers") that can be used in the multi-component system of the present invention ) include those based on aliphatic and/or aromatic polyester polyols and polyether polyols with aliphatic and/or aromatic polyester diisocyanates and polyether diisocyanates, terminated by (meth)acrylate end groups Urethane. Suitable polyurethane (meth)acrylate oligomers include, for example, aliphatic polyester urethane diacrylate and tetraacrylate oligomers, aliphatic polyether urethane diacrylate Acrylate and tetraacrylate oligomers, and aliphatic polyester/polyether urethane diacrylate and tetraacrylate oligomers.
在各種實施例中,聚胺基甲酸酯(甲基)丙烯酸酯寡聚物可藉由使脂族及/或芳族二異氰酸酯與OH基團封端之聚酯多元醇(包括芳族、脂族及混合脂族/芳族聚酯多元醇)、聚醚多元醇、聚碳酸酯多元醇、聚己內酯多元醇、聚二甲基矽氧烷多元醇或聚丁二烯多元醇或其組合反應以形成異氰酸酯官能化之寡聚物,接著使異氰酸酯官能化之寡聚物與羥基官能化之(甲基)丙烯酸酯(諸如丙烯酸羥基乙酯或甲基丙烯酸羥基乙酯)反應以提供末端(甲基)丙烯酸酯基團來製備。例如,聚胺基甲酸酯(甲基)丙烯酸酯寡聚物每分子可包含二個、三個、四個或更多個(甲基)丙烯酸酯官能基。In various embodiments, polyurethane (meth)acrylate oligomers can be prepared by combining aliphatic and/or aromatic diisocyanates with OH group-terminated polyester polyols (including aromatic, aliphatic and mixed aliphatic/aromatic polyester polyols), polyether polyols, polycarbonate polyols, polycaprolactone polyols, dimethicone polyols or polybutadiene polyols or Their combination reacts to form an isocyanate-functionalized oligomer, which is then reacted with a hydroxyl-functionalized (meth)acrylate such as hydroxyethyl acrylate or hydroxyethyl methacrylate to provide prepared with terminal (meth)acrylate groups. For example, a polyurethane (meth)acrylate oligomer may contain two, three, four or more (meth)acrylate functional groups per molecule.
合適丙烯酸類(甲基)丙烯酸酯寡聚物(在此項技術中有時亦稱為「丙烯酸類寡聚物」)包括可描述為具有寡聚丙烯酸主鏈之物質的寡聚物,該主鏈經一或多個(甲基)丙烯酸酯基(其可位於寡聚物之末端或側接於丙烯酸主鏈)官能化。丙烯酸主鏈可為包含丙烯酸單體之重複單元之均聚物、無規共聚物或嵌段共聚物。(甲基)丙烯酸單體可為任何單體(甲基)丙烯酸酯,諸如(甲基)丙烯酸C1-C6烷酯;以及官能化(甲基)丙烯酸酯,諸如帶有羥基、羧酸及/或環氧基之(甲基)丙烯酸酯。丙烯酸類(甲基)丙烯酸酯寡聚物可使用此項技術中已知之任何程序製備,諸如藉由使單體發生寡聚而製備,該等單體之至少一部分經羥基、羧酸及/或環氧基官能化(例如(甲基)丙烯酸羥基烷酯、(甲基)丙烯酸、(甲基)丙烯酸縮水甘油酯)以得到官能化之寡聚物中間物,該中間物隨後與一或多種含(甲基)丙烯酸酯之反應物反應以引入所需(甲基)丙烯酸酯官能基。Suitable acrylic (meth)acrylate oligomers (also sometimes referred to in the art as "acrylic oligomers") include oligomers that can be described as species having an oligomeric acrylic acid backbone that The chain is functionalized with one or more (meth)acrylate groups, which may be located at the end of the oligomer or pendant to the acrylic backbone. The acrylic backbone can be a homopolymer, a random copolymer or a block copolymer comprising repeat units of acrylic monomers. (Meth)acrylic monomers can be any monomeric (meth)acrylates, such as C1-C6 alkyl (meth)acrylates; and functionalized (meth)acrylates, such as those with hydroxyl, carboxylic acid and/or Or epoxy (meth)acrylate. Acrylic (meth)acrylate oligomers can be prepared using any procedure known in the art, such as by oligomerizing monomers, at least a portion of which are modified by hydroxyl, carboxylic acid and/or Epoxy functionalization (e.g. hydroxyalkyl (meth)acrylate, (meth)acrylic acid, glycidyl (meth)acrylate) to obtain a functionalized oligomer intermediate which is subsequently combined with one or more The (meth)acrylate-containing reactants react to introduce the desired (meth)acrylate functional groups.
示例性(甲基)丙烯酸酯官能化之單體及寡聚物可包括乙氧基化雙酚A二(甲基)丙烯酸酯;三乙二醇二(甲基)丙烯酸酯;乙二醇二(甲基)丙烯酸酯;四乙二醇二(甲基)丙烯酸酯;聚乙二醇二(甲基)丙烯酸酯;1,4-丁二醇二丙烯酸酯;1,4-丁二醇二甲基丙烯酸酯;二乙二醇二丙烯酸酯;二乙二醇二甲基丙烯酸酯;1,6-己二醇二丙烯酸酯;1,6-己二醇二甲基丙烯酸酯;新戊二醇二丙烯酸酯;新戊二醇二(甲基)丙烯酸酯;聚乙二醇(600)二甲基丙烯酸酯(其中600係指聚乙二醇部分之大致數目平均分子量);聚乙二醇(200)二丙烯酸酯;1,12-十二烷二醇二甲基丙烯酸酯;四乙二醇二丙烯酸酯;三乙二醇二丙烯酸酯;1,3-丁二醇二甲基丙烯酸酯;三丙二醇二丙烯酸酯;聚丁二烯二丙烯酸酯;甲基戊二醇二丙烯酸酯;聚乙二醇(400)二丙烯酸酯;乙氧基化 2雙酚A二甲基丙烯酸酯;乙氧基化 3雙酚A二甲基丙烯酸酯;乙氧基化 3雙酚A二丙烯酸酯;環己烷二甲醇二甲基丙烯酸酯;環己烷二甲醇二丙烯酸酯;乙氧基化 10雙酚A二甲基丙烯酸酯(其中「乙氧基化」之後的數字為每分子氧基伸烷基部分之平均數目);二丙二醇二丙烯酸酯;乙氧基化 4雙酚A二甲基丙烯酸酯;乙氧基化 6雙酚A二甲基丙烯酸酯;乙氧基化 8雙酚A二甲基丙烯酸酯;烷氧基化己二醇二丙烯酸酯;烷氧基化環己烷二甲醇二丙烯酸酯;十二烷二丙烯酸酯;乙氧基化 4雙酚A二丙烯酸酯;乙氧基化 10雙酚A二丙烯酸酯;聚乙二醇(400)二甲基丙烯酸酯;聚丙二醇(400)二甲基丙烯酸酯;金屬二丙烯酸酯;經改質之金屬二丙烯酸酯;金屬二甲基丙烯酸酯;聚乙二醇(1000)二甲基丙烯酸酯;(甲基)丙烯酸化聚丁二烯;丙氧基化 2新戊二醇二丙烯酸酯;乙氧基化 30雙酚A二甲基丙烯酸酯;乙氧基化 30雙酚A二丙烯酸酯;烷氧基化新戊二醇二丙烯酸酯;聚乙二醇二甲基丙烯酸酯;1,3-丁二醇二丙烯酸酯;乙氧基化 2雙酚A二甲基丙烯酸酯;二丙二醇二丙烯酸酯;乙氧基化 4雙酚A二丙烯酸酯;聚乙二醇(600)二丙烯酸酯;聚乙二醇(1000)二甲基丙烯酸酯;三環癸烷二甲醇二丙烯酸酯;丙氧基化新戊二醇二丙烯酸酯,諸如丙氧基化 2新戊二醇二丙烯酸酯;烷氧基化脂族醇三羥甲基丙烷三甲基丙烯酸酯之二丙烯酸酯;三羥甲基丙烷三丙烯酸酯;參(2-羥乙基)異氰尿酸酯三丙烯酸酯;乙氧基化 20三羥甲基丙烷三丙烯酸酯;季戊四醇三丙烯酸酯;乙氧基化 3三羥甲基丙烷三丙烯酸酯;丙氧基化 3三羥甲基丙烷三丙烯酸酯;乙氧基化 6三羥甲基丙烷三丙烯酸酯;丙氧基化 6三羥甲基丙烷三丙烯酸酯;乙氧基化 9三羥甲基丙烷三丙烯酸酯;烷氧基化三官能丙烯酸酯;三官能甲基丙烯酸酯;三官能丙烯酸酯;丙氧基化 3甘油基三丙烯酸酯;丙氧基化 5.5甘油基三丙烯酸酯;乙氧基化 15三羥甲基丙烷三丙烯酸酯;三官能磷酸酯;三官能丙烯酸酯;季戊四醇四丙烯酸酯;二-三羥甲基丙烷四丙烯酸酯;乙氧基化 4季戊四醇四丙烯酸酯;季戊四醇聚氧伸乙基四丙烯酸酯;二季戊四醇五丙烯酸酯;五丙烯酸酯;環氧基丙烯酸酯寡聚物;環氧基甲基丙烯酸酯寡聚物;丙烯酸胺基甲酸酯寡聚物;胺基甲酸酯甲基丙烯酸酯寡聚物;丙烯酸聚酯寡聚物;聚酯甲基丙烯酸酯寡聚物;硬脂基甲基丙烯酸酯寡聚物;丙烯酸類丙烯酸酯寡聚物;全氟化丙烯酸酯寡聚物;全氟化甲基丙烯酸酯寡聚物;胺丙烯酸酯寡聚物;經胺改質之聚醚丙烯酸酯寡聚物;以及胺甲基丙烯酸酯寡聚物。 Exemplary (meth)acrylate functionalized monomers and oligomers may include ethoxylated bisphenol A di(meth)acrylate; triethylene glycol di(meth)acrylate; ethylene glycol di(meth)acrylate; (Meth)acrylate; Tetraethylene glycol di(meth)acrylate; Polyethylene glycol di(meth)acrylate; 1,4-Butanediol diacrylate; 1,4-Butanediol diacrylate Methacrylate; Diethylene glycol diacrylate; Diethylene glycol dimethacrylate; 1,6-Hexanediol diacrylate; 1,6-Hexanediol dimethacrylate; Neopentyl dimethacrylate Alcohol diacrylate; Neopentyl glycol di(meth)acrylate; Polyethylene glycol (600) dimethacrylate (where 600 refers to the approximate number average molecular weight of the polyethylene glycol moiety); Polyethylene glycol (200) Diacrylate; 1,12-Dodecanediol Dimethacrylate; Tetraethylene Glycol Diacrylate; Triethylene Glycol Diacrylate; 1,3-Butanediol Dimethacrylate ; tripropylene glycol diacrylate; polybutadiene diacrylate; methylpentanediol diacrylate; polyethylene glycol (400) diacrylate; ethoxylated 2 bisphenol A dimethacrylate; Oxylated 3 Bisphenol A Dimethacrylate; Ethoxylated 3 Bisphenol A Diacrylate; Cyclohexanedimethanol Dimethacrylate; Cyclohexanedimethanol Diacrylate; Ethoxylated 10 Bisphenol A dimethacrylate (where the number after "ethoxylated" is the average number of oxyalkylene moieties per molecule); dipropylene glycol diacrylate; ethoxylated 4 bisphenol A dimethacrylate Esters; Ethoxylated 6 Bisphenol A Dimethacrylate; Ethoxylated 8 Bisphenol A Dimethacrylate; Alkoxylated Hexylene Glycol Diacrylate; Alkoxylated Cyclohexanedimethanol Diacrylate; Dodecane Diacrylate; Ethoxylated 4 Bisphenol A Diacrylate; Ethoxylated 10 Bisphenol A Diacrylate; Polyethylene Glycol (400) Dimethacrylate; Polypropylene Glycol (400) Dimethacrylate; Metal Diacrylate; Modified Metal Diacrylate; Metal Dimethacrylate; Polyethylene Glycol (1000) Dimethacrylate; Butadiene; Propoxylated 2 Neopentyl Glycol Diacrylate; Ethoxylated 30 Bisphenol A Dimethacrylate; Ethoxylated 30 Bisphenol A Diacrylate; Alkoxylated Neopentyl Diacrylate Alcohol Diacrylate; Polyethylene Glycol Dimethacrylate; 1,3-Butanediol Diacrylate; Ethoxylated 2 Bisphenol A Dimethacrylate; Dipropylene Glycol Diacrylate; Ethoxylated 4 Bisphenol A diacrylate; Polyethylene glycol (600) diacrylate; Polyethylene glycol (1000) dimethacrylate; Tricyclodecane dimethanol diacrylate; Propoxylated neopentyl glycol Diacrylates, such as propoxylated 2- neopentyl glycol diacrylate; diacrylate ester of alkoxylated aliphatic alcohol trimethylolpropane trimethacrylate; trimethylolpropane triacrylate; cf. (2-Hydroxyethyl)isocyanurate triacrylate; Ethoxylated 20 Trimethylolpropane Triacrylate; Pentaerythritol Triacrylate; Ethoxylated 3 Trimethylolpropane Triacrylate; Oxylated 3 -Trimethylolpropane Triacrylate; Ethoxylated 6 -Trimethylolpropane Triacrylate; Propoxylated 6 -Trimethylolpropane Triacrylate; Ethoxylated 9 -Trimethylolpropane Propane Triacrylate; Alkoxylated Trifunctional Acrylate; Trifunctional Methacrylate; Trifunctional Acrylate; Propoxylated 3- Glyceryl Triacrylate; Propoxylated 5.5 -Glyceryl Triacrylate; Ethoxylated 15- trimethylolpropane triacrylate; trifunctional phosphate; trifunctional acrylate; pentaerythritol tetraacrylate; di-trimethylolpropane tetraacrylate; ethoxylated 4- pentaerythritol tetraacrylate; Oxyethylene tetraacrylate; dipentaerythritol pentaacrylate; pentaacrylate; epoxy acrylate oligomer; epoxy methacrylate oligomer; acrylate urethane oligomer; amine Formate methacrylate oligomer; Acrylic polyester oligomer; Polyester methacrylate oligomer; Stearyl methacrylate oligomer; Acrylic acrylate oligomer; Perfluorinated Acrylate oligomers; perfluorinated methacrylate oligomers; amine acrylate oligomers; amine-modified polyether acrylate oligomers; and amine methacrylate oligomers.
本發明之光化輻射可固化組成物可包含每分子包含單個丙烯酸酯或甲基丙烯酸酯官能基之一或多種(甲基)丙烯酸酯官能化之化合物(在本文中稱為「單(甲基)丙烯酸酯官能化之化合物」)。可使用此項技術中已知之任一種此類化合物。The actinic radiation curable compositions of the present invention may comprise one or more (meth)acrylate functionalized compounds comprising a single acrylate or methacrylate functional group per molecule (referred to herein as "mono(meth)acrylate ) acrylate-functionalized compounds"). Any such compound known in the art may be used.
合適單(甲基)丙烯酸酯官能化之化合物之實例包括但不限於脂族醇(其中脂族醇可為直鏈、分支鏈或脂環族且可為單醇、二醇或多元醇,限制條件為僅一個羥基經(甲基)丙烯酸酯化)之單(甲基)丙烯酸酯;芳族醇(諸如苯酚,包括烷基化苯酚)之單(甲基)丙烯酸酯;烷芳基醇(諸如苄醇)之單(甲基)丙烯酸酯;寡聚及聚合二醇(諸如二乙二醇、三乙二醇、二丙二醇、三丙二醇、聚乙二醇及聚丙二醇)之單(甲基)丙烯酸酯;二醇、寡聚二醇、聚合二醇之單烷基醚之單(甲基)丙烯酸酯;烷氧基化(例如,乙氧基化及/或丙氧基化)脂族醇(其中脂族醇可為直鏈、分支鏈或脂環族且可為單醇、二醇或多元醇,限制條件為烷氧基化脂族醇之僅一個羥基經(甲基)丙烯酸酯化)之單(甲基)丙烯酸酯;烷氧基化(例如,乙氧基化及/或丙氧基化)芳族醇(諸如烷氧基化苯酚)之單(甲基)丙烯酸酯;己內酯單(甲基)丙烯酸酯;及其類似物。Examples of suitable mono(meth)acrylate functionalized compounds include, but are not limited to, aliphatic alcohols (where the aliphatic alcohol may be linear, branched, or cycloaliphatic and may be monoalcohol, diol, or polyol, limited to Mono(meth)acrylates with only one hydroxyl group (meth)acrylated); mono(meth)acrylates of aromatic alcohols such as phenol, including alkylated phenols; alkaryl alcohols ( mono(meth)acrylates such as benzyl alcohol); mono(meth)acrylates of oligomeric and polymeric diols such as diethylene glycol, triethylene glycol, dipropylene glycol, tripropylene glycol, polyethylene glycol and polypropylene glycol ) acrylates; mono(meth)acrylates of diols, oligomeric diols, monoalkyl ethers of polymeric diols; alkoxylated (e.g. ethoxylated and/or propoxylated) aliphatic Alcohols (of which the aliphatic alcohols may be straight-chain, branched or cycloaliphatic and may be mono-, di- or polyols, provided that only one hydroxyl group of the alkoxylated aliphatic alcohol is passed through (meth)acrylate Mono(meth)acrylates of alkoxylated (for example, ethoxylated and/or propoxylated) aromatic alcohols (such as alkoxylated phenols) mono(meth)acrylates; caprolactone mono(meth)acrylate; and analogs thereof.
以下化合物為適用於本發明之可固化組成物中之單(甲基)丙烯酸酯官能化之化合物的特定實例:(甲基)丙烯酸甲酯;(甲基)丙烯酸乙酯;(甲基)丙烯酸正丙酯;(甲基)丙烯酸正丁酯;(甲基)丙烯酸異丁酯;(甲基)丙烯酸正己酯;(甲基)丙烯酸2-乙基己酯;(甲基)丙烯酸正辛酯;(甲基)丙烯酸異辛酯;(甲基)丙烯酸正癸酯;(甲基)丙烯酸正十二烷酯;(甲基)丙烯酸十三烷酯;(甲基)丙烯酸十四烷酯;(甲基)丙烯酸十六烷酯;(甲基)丙烯酸2-羥基乙酯;(甲基)丙烯酸2-及3-羥基丙酯;(甲基)丙烯酸2-甲氧基乙酯;(甲基)丙烯酸2-乙氧基乙酯;(甲基)丙烯酸2-及3-乙氧基丙酯;四氫呋喃基(甲基)丙烯酸酯;烷氧基化四氫呋喃基(甲基)丙烯酸酯;(甲基)丙烯酸異莰酯;(甲基)丙烯酸2-(2-乙氧基乙氧基)乙酯;(甲基)丙烯酸環己酯;(甲基)丙烯酸縮水甘油酯;(甲基)丙烯酸異癸酯:(甲基)丙烯酸2-苯氧基乙酯:(甲基)丙烯酸月桂酯;(甲基)丙烯酸異莰酯;(甲基)丙烯酸2-苯氧基乙酯;烷氧基化苯酚(甲基)丙烯酸酯;烷氧基化壬基苯酚(甲基)丙烯酸酯;環三羥甲基丙烷(甲基)丙烯酸酯;三甲基環己醇(甲基)丙烯酸酯;二乙二醇單甲醚(甲基)丙烯酸酯;二乙二醇單乙醚(甲基)丙烯酸酯;二乙二醇單丁醚(甲基)丙烯酸酯;三乙二醇單乙醚(甲基)丙烯酸酯;乙氧基化月桂基(甲基)丙烯酸酯;甲氧基聚乙二醇(甲基)丙烯酸酯;以及其組合。The following compounds are specific examples of mono(meth)acrylate functionalized compounds suitable for use in the curable compositions of the present invention: methyl (meth)acrylate; ethyl (meth)acrylate; (meth)acrylic acid n-propyl (meth)acrylate; n-butyl (meth)acrylate; isobutyl (meth)acrylate; n-hexyl (meth)acrylate; 2-ethylhexyl (meth)acrylate; n-octyl (meth)acrylate ; Isooctyl (meth)acrylate; n-decyl (meth)acrylate; n-dodecyl (meth)acrylate; tridecyl (meth)acrylate; tetradecyl (meth)acrylate; Cetyl (meth)acrylate; 2-hydroxyethyl (meth)acrylate; 2- and 3-hydroxypropyl (meth)acrylate; 2-methoxyethyl (meth)acrylate; base) 2-ethoxyethyl acrylate; 2- and 3-ethoxypropyl (meth)acrylates; tetrahydrofuryl (meth)acrylates; alkoxylated tetrahydrofuryl (meth)acrylates; ( Isocamphoryl methacrylate; 2-(2-ethoxyethoxy)ethyl (meth)acrylate; cyclohexyl (meth)acrylate; glycidyl (meth)acrylate; Isodecyl acrylate: 2-Phenoxyethyl (meth)acrylate: Lauryl (meth)acrylate; Isocamphoryl (meth)acrylate; 2-Phenoxyethyl (meth)acrylate; Alkoxy Alkoxylated nonylphenol (meth)acrylate; Alkoxylated nonylphenol (meth)acrylate; Cyclotrimethylolpropane (meth)acrylate; Trimethylcyclohexanol (meth)acrylate; Diethylene glycol monomethyl ether (meth)acrylate; Diethylene glycol monoethyl ether (meth)acrylate; Diethylene glycol monobutyl ether (meth)acrylate; Triethylene glycol monoethyl ether (methyl) ) acrylates; ethoxylated lauryl (meth)acrylates; methoxypolyethylene glycol (meth)acrylates; and combinations thereof.
在一較佳實施例中,至少一種光化輻射可固化化合物包含至少一種空間位阻型(甲基)丙烯酸酯單體。In a preferred embodiment, at least one actinic radiation curable compound comprises at least one sterically hindered (meth)acrylate monomer.
空間位阻型(甲基)丙烯酸酯單體可具有一或二個(甲基)丙烯酸酯基,較佳一個(甲基)丙烯酸酯基,更佳丙烯酸酯基。空間位阻型(甲基)丙烯酸酯單體可包含環狀部分及/或三級丁基。環狀部分可為單環、雙環或三環,包括橋連、稠合及/或螺環環系統。環狀部分可為碳環(所有環原子均為碳)或雜環(至少一個環原子為雜原子,諸如N、O或S)。環狀部分可為脂族、芳族,或脂族與芳族之組合。特定言之,環狀部分可包含選自環烷基、雜環烷基、芳基、雜芳基及其組合之環或環系統。更特定言之,環狀部分可包含選自以下之環或環系統:苯基、環戊基、環己基、降莰基、三環癸基、二環戊二烯基、環氧乙烷基、氧雜環丁烷基、四氫呋喃基、四氫哌喃基、二氧雜環戊烷基、二㗁烷基、二氧雜螺癸烷基及二氧雜螺十一烷基。環或環系統可任擇地經選自以下之一或多個基團取代:羥基、烷氧基、烷基、羥基烷基、環烷基、芳基、烷基芳基及芳基烷基。The sterically hindered (meth)acrylate monomer may have one or two (meth)acrylate groups, preferably one (meth)acrylate group, more preferably an acrylate group. The sterically hindered (meth)acrylate monomer may contain a cyclic moiety and/or a tertiary butyl group. Cyclic moieties can be monocyclic, bicyclic or tricyclic, including bridged, fused and/or spiro ring systems. A cyclic moiety can be carbocyclic (all ring atoms are carbon) or heterocyclic (at least one ring atom is a heteroatom, such as N, O or S). The cyclic moiety can be aliphatic, aromatic, or a combination of aliphatic and aromatic. In particular, the cyclic moiety can comprise a ring or ring system selected from the group consisting of cycloalkyl, heterocycloalkyl, aryl, heteroaryl, and combinations thereof. More specifically, the cyclic moiety may comprise a ring or ring system selected from the group consisting of phenyl, cyclopentyl, cyclohexyl, norbornyl, tricyclodecanyl, dicyclopentadienyl, oxiranyl , oxetanyl, tetrahydrofuranyl, tetrahydropyranyl, dioxolanyl, dioxanyl, dioxaspirodecanyl and dioxasiroundecyl. The ring or ring system may be optionally substituted with one or more groups selected from the group consisting of hydroxy, alkoxy, alkyl, hydroxyalkyl, cycloalkyl, aryl, alkylaryl and arylalkyl .
特定言之,環狀部分可對應於以下各式之一: 其中 符號 表示附接至包含(甲基)丙烯酸酯官能基之部分的連接點, 切割鍵 表示單鍵或雙鍵; 且各環原子可任擇地經選自以下之一或多個基團取代:羥基、烷氧基、烷基、羥基烷基、環烷基、芳基、烷基芳基及芳基烷基。 In particular, the cyclic moiety can correspond to one of the following formulae: where the symbol Indicates the point of attachment to a moiety containing a (meth)acrylate functional group, cleavage bond Represents a single bond or a double bond; and each ring atom may be optionally substituted by one or more groups selected from: hydroxyl, alkoxy, alkyl, hydroxyalkyl, cycloalkyl, aryl, alkyl Aryl and arylalkyl.
詳言之,空間位阻型(甲基)丙烯酸酯單體包含環狀部分,諸如包含脂族環之部分,尤其選自以下之脂族環:環己烷、三環癸烷、四氫呋喃、莰烷、1,3-二氧雜環戊烷及1,3-二㗁烷。Specifically, the sterically hindered (meth)acrylate monomer comprises a cyclic moiety, such as a moiety comprising an aliphatic ring, especially an aliphatic ring selected from the group consisting of cyclohexane, tricyclodecane, tetrahydrofuran, camphene alkanes, 1,3-dioxolanes and 1,3-dioxanes.
空間位阻型(甲基)丙烯酸酯單體之實例為(甲基)丙烯酸三級丁酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸苯甲酯、壬基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸三級丁基環己酯、(甲基)丙烯酸3,3,5-三甲基環己酯、(甲基)丙烯酸二環戊二烯酯、三環癸烷甲醇單(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、四氫呋喃基(甲基)丙烯酸酯、環狀三羥甲基丙烷甲醯基(甲基)丙烯酸酯(CTFA,亦稱為(甲基)丙烯酸5-乙基-1,3-二㗁烷-5-基)甲酯)、(甲基)丙烯酸(2,2-二甲基-1,3-二氧雜環戊烷-4-基)甲酯、(甲基)丙烯酸(2-乙基-2-甲基-1,3-二氧雜環戊烷-4-基)甲酯、甘油縮甲醛甲基丙烯酸酯、其烷氧基化(亦即乙氧基化及/或丙氧基化)衍生物及其混合物。Examples of sterically hindered (meth)acrylate monomers are tertiary butyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, nonylphenol (Meth)acrylate, Isocamphoryl (meth)acrylate, tertiary butylcyclohexyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, (meth) ) dicyclopentadienyl acrylate, tricyclodecane methanol mono(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, tetrahydrofuryl (meth)acrylate, cyclic trimethylol propaneformyl (meth)acrylate (CTFA, also known as 5-ethyl-1,3-dioxan-5-yl)methyl (meth)acrylate), (meth)acrylic acid (2 ,2-Dimethyl-1,3-dioxolan-4-yl)methyl ester, (2-ethyl-2-methyl-1,3-dioxolane (meth)acrylic acid Alk-4-yl)methyl esters, glycerol formal methacrylate, their alkoxylated (ie ethoxylated and/or propoxylated) derivatives and mixtures thereof.
詳言之,至少一種光化輻射可固化化合物包含選自以下之空間位阻型(甲基)丙烯酸酯單體:壬基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸三級丁基環己酯、(甲基)丙烯酸3,3,5-三甲基環己酯、三環癸烷甲醇單(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、四氫呋喃基(甲基)丙烯酸酯、環狀三羥甲基丙烷甲醯基(甲基)丙烯酸酯及其混合物。In particular, at least one actinic radiation curable compound comprises a sterically hindered (meth)acrylate monomer selected from the group consisting of nonylphenol (meth)acrylate, isobornyl (meth)acrylate, ( Tertiary butylcyclohexyl methacrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, tricyclodecane methanol mono(meth)acrylate, tricyclodecane dimethanol dimethanol (Meth)acrylates, tetrahydrofuryl (meth)acrylates, cyclic trimethylolpropaneformyl (meth)acrylates and mixtures thereof.
空間位阻型(甲基)丙烯酸酯單體可佔光化輻射可固化組成物之總重量的至少10重量%、10重量%至90重量%、20重量%至85重量%、30重量%至80重量%、40重量%至75重量%或50重量%至70重量%。The sterically hindered (meth)acrylate monomers may comprise at least 10 wt %, 10 wt % to 90 wt %, 20 wt % to 85 wt %, 30 wt % to 80 wt%, 40 wt% to 75 wt%, or 50 wt% to 70 wt%.
在一較佳實施例中,至少一種光化輻射可固化化合物包含至少一種非環狀(甲基)丙烯酸酯單體。In a preferred embodiment, at least one actinic radiation curable compound comprises at least one acyclic (meth)acrylate monomer.
非環狀(甲基)丙烯酸酯單體可具有一或二個(甲基)丙烯酸酯基,較佳二個(甲基)丙烯酸酯基。非環狀(甲基)丙烯酸酯單體可經烷氧基化,尤其經烷氧基化或丙氧基化。The acyclic (meth)acrylate monomer may have one or two (meth)acrylate groups, preferably two (meth)acrylate groups. Acyclic (meth)acrylate monomers may be alkoxylated, especially alkoxylated or propoxylated.
非環狀(甲基)丙烯酸酯單體之實例為(甲基)丙烯酸月桂酯、(甲基)丙烯酸二十二烷酯、聚乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯以及其烷氧基化(亦即乙氧基化及/或丙氧基化)衍生物及其混合物。Examples of acyclic (meth)acrylate monomers are lauryl (meth)acrylate, behenyl (meth)acrylate, polyethylene glycol di(meth)acrylate, 1,6-hexyl Diol di(meth)acrylates, 1,10-decanediol di(meth)acrylates and their alkoxylated (i.e. ethoxylated and/or propoxylated) derivatives and mixtures thereof .
非環狀(甲基)丙烯酸酯單體可佔可固化組成物之總重量的至少5重量%、5重量%至60重量%、8重量%至55重量%、10重量%至50重量%、15重量%至45重量%或20重量%至40重量%。The acyclic (meth)acrylate monomer may comprise at least 5 wt%, 5 wt% to 60 wt%, 8 wt% to 55 wt%, 10 wt% to 50 wt% of the total weight of the curable composition, 15% to 45% by weight or 20% to 40% by weight.
在一較佳實施例中,至少一種光化輻射可固化化合物包含至少一種胺基甲酸酯(甲基)丙烯酸酯。In a preferred embodiment, the at least one actinic radiation curable compound comprises at least one urethane (meth)acrylate.
胺基甲酸酯(甲基)丙烯酸酯可具有一或二個(甲基)丙烯酸酯基,較佳二個(甲基)丙烯酸酯基。胺基甲酸酯(甲基)丙烯酸酯可為脂族胺基甲酸酯(甲基)丙烯酸酯,尤其脂族胺基甲酸酯二(甲基)丙烯酸酯。The urethane (meth)acrylate may have one or two (meth)acrylate groups, preferably two (meth)acrylate groups. The urethane (meth)acrylate may be an aliphatic urethane (meth)acrylate, especially an aliphatic urethane di(meth)acrylate.
胺基甲酸酯(甲基)丙烯酸酯單體可佔可固化組成物之總重量的至少10重量%、10重量%至90重量%、15重量%至85重量%、20重量%至80重量%、25重量%至75重量%或30重量%至70重量%。The urethane (meth)acrylate monomer may comprise at least 10 wt%, 10 wt% to 90 wt%, 15 wt% to 85 wt%, 20 wt% to 80 wt% of the total weight of the curable composition %, 25% to 75% by weight or 30% to 70% by weight.
在一尤其較佳實施例中,至少一種光化輻射可固化化合物包含至少一種(甲基)丙烯酸酯官能化之單體及至少一種(甲基)丙烯酸酯官能化之寡聚物;詳言之,至少一種光化輻射可固化化合物包含: -至少一種空間位阻型(甲基)丙烯酸酯單體,諸如壬基苯酚(甲基)丙烯酸酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸三級丁基環己酯、(甲基)丙烯酸3,3,5-三甲基環己酯、三環癸烷甲醇單(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、四氫呋喃基(甲基)丙烯酸酯、環狀三羥甲基丙烷甲醯基(甲基)丙烯酸酯及其混合物;及 -至少一種胺基甲酸酯(甲基)丙烯酸酯,諸如脂族胺基甲酸酯(甲基)丙烯酸酯。 In an especially preferred embodiment, the at least one actinic radiation curable compound comprises at least one (meth)acrylate-functional monomer and at least one (meth)acrylate-functional oligomer; in particular , at least one actinic radiation curable compound comprising: - at least one sterically hindered (meth)acrylate monomer such as nonylphenol (meth)acrylate, isobornyl (meth)acrylate, tertiary butylcyclohexyl (meth)acrylate, ( 3,3,5-Trimethylcyclohexyl methacrylate, Tricyclodecane methanol mono(meth)acrylate, Tricyclodecane dimethanol di(meth)acrylate, Tetrahydrofuranyl(meth)acrylate Acrylates, cyclic trimethylolpropaneformyl (meth)acrylates and mixtures thereof; and - at least one urethane (meth)acrylate, such as an aliphatic urethane (meth)acrylate.
空間位阻型(甲基)丙烯酸酯單體可佔光化輻射可固化組成物之總重量的至少10重量%、10重量%至100重量%、15重量%至95重量%、20重量%至90重量%、25重量%至85重量%或30重量%至80%。The sterically hindered (meth)acrylate monomer may comprise at least 10 wt%, 10 wt% to 100 wt%, 15 wt% to 95 wt%, 20 wt% to 90% by weight, 25% to 85% by weight, or 30% to 80% by weight.
胺基甲酸酯(甲基)丙烯酸酯可佔光化輻射可固化化合物之總重量的至少10重量%、10重量%至100重量%、15重量%至95重量%、20重量%至90重量%、25重量%至85重量%或30重量%至80重量%。 光引發劑 The urethane (meth)acrylate may comprise at least 10%, 10% to 100%, 15% to 95%, 20% to 90% by weight of the total weight of the actinic radiation curable compound %, 25% to 85% by weight or 30% to 80% by weight. Photoinitiator
在本發明之某些實施例中,本文所述之光化輻射可固化組成物包括至少一種光引發劑且可經輻射能(可見光、紫外光)固化。光引發劑可視為在暴露於輻射(例如光化輻射)後形成引發可固化組成物中存在之聚合有機物質之反應及固化的物種之任何類型物質。合適光引發劑包括自由基光引發劑以及陽離子型光引發劑及其組合。In certain embodiments of the present invention, the actinic radiation curable compositions described herein include at least one photoinitiator and are curable by radiant energy (visible light, ultraviolet light). A photoinitiator can be considered any type of substance that, upon exposure to radiation, such as actinic radiation, forms a species that initiates the reaction and cure of the polymerized organic species present in the curable composition. Suitable photoinitiators include free radical photoinitiators as well as cationic photoinitiators and combinations thereof.
自由基聚合引發劑為當經照射時形成自由基之物質。使用自由基光引發劑尤其較佳。適用於本發明之可固化組成物中之自由基光引發劑之非限制性類型包括例如安息香、安息香醚、苯乙酮、苯甲基、苯甲基縮酮、蒽醌、膦氧化物、α-羥基酮、苯基乙醛酸酯、α-胺基酮、二苯甲酮、9-氧硫 、氧蒽酮、吖啶衍生物、吩衍生物、喹㗁啉衍生物及三化合物。Free radical polymerization initiators are substances that form free radicals when irradiated. The use of free radical photoinitiators is especially preferred. Non-limiting classes of free radical photoinitiators suitable for use in curable compositions of the present invention include, for example, benzoin, benzoin ether, acetophenone, benzyl, benzyl ketal, anthraquinone, phosphine oxide, alpha -Hydroxyketone, phenylglyoxylate, α-aminoketone, benzophenone, 9-oxosulfur , Oxyanthrone, acridine derivatives, phen derivatives, quinoline derivatives and three compound.
若光引發劑存在於光化輻射可固化組成物中,則典型濃度為以可固化組成物之總重量計至多約15重量%。舉例而言,以可固化組成物之總重量計,光化輻射可固化組成物可包含總計0.1重量%至10重量%光引發劑。 非反應性溶劑 If the photoinitiator is present in the actinic radiation curable composition, the typical concentration is up to about 15% by weight, based on the total weight of the curable composition. For example, the actinic radiation curable composition may comprise a total of 0.1% to 10% by weight photoinitiator, based on the total weight of the curable composition. non reactive solvent
根據本發明之某些實施例,光化輻射可固化組成物經調配,不含或基本上不含非反應性溶劑。如本文所用,術語「非反應性溶劑」意謂與組成物中存在之光化輻射可固化化合物對比,不能藉由光化輻射固化之溶劑。然而,非反應性溶劑可經由其他機制與組成物之一或多種組分反應。According to certain embodiments of the present invention, actinic radiation curable compositions are formulated to be free or substantially free of non-reactive solvents. As used herein, the term "non-reactive solvent" means a solvent that is not curable by actinic radiation in contrast to the actinic radiation curable compounds present in the composition. However, non-reactive solvents may react with one or more components of the composition via other mechanisms.
例如,光化輻射可固化組成物可包含以組成物之總重量計小於5重量%、小於2重量%、小於1重量%、小於0.5重量%、小於0.1重量%或甚至0重量%非反應性溶劑。For example, the actinic radiation curable composition may contain less than 5%, less than 2%, less than 1%, less than 0.5%, less than 0.1%, or even 0% by weight of the total weight of the composition. solvent.
然而,對於某些應用,可能需要在光化輻射可固化組成物中包括大量的一或多種非反應性溶劑。舉例而言,非反應性溶劑可用於幫助溶解組成物之一或多種組分(尤其聚醯胺組分)及/或降低組成物之黏度。可使用之非反應性溶劑之類型不受限制,限制條件為其不干擾藉由將組成物暴露於光化輻射而使組成物固化之能力。合適非反應性溶劑包括例如酮(例如,丙酮)、酯、醚、醇(包括鹵化醇,諸如氟化醇)、芳族烴及其類似物以及其組合。例如,光化輻射可固化組成物可經調配以包括以組成物之總重量計至少0.5重量%、至少1重量%、至少2重量%或至少5重量%之一或多種非反應性溶劑。根據其他實施例,光化輻射可固化組成物包含以組成物之總重量計至多90重量%、至多80重量%、至多70重量%、至多60重量%、至多50重量%、至多40重量%、至多30重量%、至多25重量%或至多20重量%之非反應性溶劑。例如,光化輻射可固化組成物可包含1重量%至50重量%或1重量%至25重量%非反應性溶劑。For certain applications, however, it may be desirable to include substantial amounts of one or more non-reactive solvents in the actinic radiation curable composition. For example, non-reactive solvents can be used to help dissolve one or more components of the composition (especially the polyamide component) and/or reduce the viscosity of the composition. The type of non-reactive solvent that can be used is not limited, provided that it does not interfere with the ability to cure the composition by exposing the composition to actinic radiation. Suitable non-reactive solvents include, for example, ketones (eg, acetone), esters, ethers, alcohols (including halogenated alcohols, such as fluorinated alcohols), aromatic hydrocarbons, and the like, and combinations thereof. For example, the actinic radiation curable composition can be formulated to include at least 0.5%, at least 1%, at least 2%, or at least 5% by weight of one or more non-reactive solvents, based on the total weight of the composition. According to other embodiments, the actinic radiation curable composition comprises at most 90 wt%, at most 80 wt%, at most 70 wt%, at most 60 wt%, at most 50 wt%, at most 40 wt%, based on the total weight of the composition, Up to 30%, up to 25%, or up to 20% by weight of non-reactive solvent. For example, the actinic radiation curable composition may comprise 1% to 50% by weight or 1% to 25% by weight of non-reactive solvent.
非反應性溶劑若存在,則可為揮發性非反應性溶劑或非揮發性反應性溶劑。如本文所用,術語「揮發性」意謂在大氣壓下之沸點不超過100℃之物質且術語「非揮發性」意謂在大氣壓下之沸點超過100℃之物質。亦可採用揮發性及非揮發性溶劑之組合。The non-reactive solvent, if present, can be a volatile non-reactive solvent or a non-volatile reactive solvent. As used herein, the term "volatile" means a substance whose boiling point at atmospheric pressure does not exceed 100°C and the term "nonvolatile" means a substance whose boiling point at atmospheric pressure exceeds 100°C. Combinations of volatile and non-volatile solvents may also be employed.
當調配組成物時使用一或多種幫助溶解某些組分(尤其聚醯胺組分)之非反應性溶劑亦在本發明之範疇內,其中在組成物組分(包括非反應性溶劑)組合之後,接著移除非反應性溶劑之至少一部分以提供適用於期望應用(例如,積層製造)的最終經調配之光化輻射可固化組成物。舉例而言,組成物之組分可經組合且隨後經受諸如混合及/或加熱之處理步驟以獲得均質產物或溶液,其中隨後藉由諸如蒸餾或真空汽提之合適手段移除非反應性溶劑之至少一部分。 其他任擇的添加劑 It is also within the scope of the present invention to use one or more non-reactive solvents that aid in dissolving certain components (particularly polyamide components) when formulating a composition where the composition components (including the non-reactive solvent) in combination Thereafter, at least a portion of the non-reactive solvent is then removed to provide a final formulated actinic radiation curable composition suitable for the desired application (eg, build-up fabrication). For example, the components of the composition can be combined and then subjected to processing steps such as mixing and/or heating to obtain a homogeneous product or solution, wherein the non-reactive solvent is then removed by suitable means such as distillation or vacuum stripping at least part of it. other optional additives
視光化輻射可固化組成物及自其獲得之固化產物之特定期望最終用途應用及所需特性而定,一或多種其他添加劑可任擇地存在於組成物中。此類添加劑可例如選自於由以下組成之群:鏈轉移劑、光阻斷劑(遮光劑)、潤濕劑(表面張力調節劑)、消光劑、著色劑、染料、顏料、黏著促進劑、填充劑、流變改質劑/製劑、流平或整平劑、搖變劑、增塑劑、光吸收劑、光穩定劑、分散劑、抗氧化劑、抗靜電劑、潤滑劑、失透劑、消泡劑、聚合抑制劑以及其組合,包括通常用於塗佈、密封劑、黏著劑、成型、3D列印、積層製造或油墨技術中之任一種添加劑。Depending on the particular desired end use application and desired properties of the actinic radiation curable composition and cured product obtained therefrom, one or more other additives may optionally be present in the composition. Such additives may for example be selected from the group consisting of chain transfer agents, light blockers (opacifiers), wetting agents (surface tension modifiers), matting agents, colorants, dyes, pigments, adhesion promoters , fillers, rheology modifiers/formulations, leveling or leveling agents, thixotropic agents, plasticizers, light absorbers, light stabilizers, dispersants, antioxidants, antistatic agents, lubricants, devitrification Agents, defoamers, polymerization inhibitors and combinations thereof, including any additives commonly used in coatings, sealants, adhesives, molding, 3D printing, additive manufacturing or ink technology.
本發明之光化輻射可固化組成物可包含一或多種光阻斷劑(在此項技術中有時稱為吸收劑),尤其在可固化組成物用作涉及可固化組成物光固化之三維列印方法中之樹脂的情況下。光阻斷劑可為三維列印技術中已知之任何此類物質,包括例如非反應性顏料及染料。例如,光阻斷劑可為可見光阻斷劑或UV光阻斷劑。合適光阻斷劑之實例包括但不限於:二氧化鈦、碳黑及有機紫外光吸收劑,諸如羥基二苯甲酮、羥基苯基苯并三唑、草醯苯胺、二苯甲酮、9-氧硫 、羥基苯基三、蘇丹(Sudan) I、溴百里酚藍、2,2'-(2,5-噻吩二基)雙(5-三級丁基苯并㗁唑) (以商標「Benetex OB Plus」銷售)及苯并三唑紫外光吸收劑。The actinic radiation curable compositions of the present invention may contain one or more photoblockers (sometimes referred to in the art as absorbers), especially when the curable composition is used as a three-dimensional light source involving photocuring of the curable composition. In the case of resin in the printing method. The light blocking agent can be any such substance known in 3D printing technology, including, for example, non-reactive pigments and dyes. For example, the light blocking agent can be a visible light blocking agent or a UV light blocking agent. Examples of suitable photoblockers include, but are not limited to: titanium dioxide, carbon black, and organic UV light absorbers such as hydroxybenzophenones, hydroxyphenylbenzotriazoles, oxalanilides, benzophenones, 9-oxo sulfur , hydroxyphenyl tri , Sudan (Sudan) I, bromothymol blue, 2,2'-(2,5-thiophenediyl)bis(5-tertiary butylbenzoxazole) (sold under the trademark "Benetex OB Plus") And benzotriazole UV absorber.
光阻斷劑之量可視需要或適合於特定應用而變化。一般而言,若光化輻射可固化組成物包含光阻斷劑,則其以按可固化組成物之重量計0.001重量%至10重量%之濃度存在。 製造方法 The amount of photoblocker can vary as desired or as appropriate for a particular application. Generally, if the actinic radiation curable composition includes a photoblocker, it is present at a concentration of 0.001% to 10% by weight of the curable composition. Manufacturing method
本發明之光化輻射可固化組成物可藉由任何合適之方法製備。舉例而言,可簡單地組合及混合各種所需組分。在希望達成聚醯胺組分之一定程度之溶解的情況下,此類溶解可藉由各種手段促進,諸如加熱組合之組分及/或劇烈攪拌組合之組分。亦可採用均質化方法。另外,可利用一或多種溶劑來促進聚醯胺組分之溶解,如先前所描述。在一個實施例中,細粉狀聚醯胺在20℃至90℃之溫度下緩慢添加至組成物之其他組分,同時混合。接著所得光化輻射可固化組成物可儲存於合適保護條件下,直至需要使用其形成物品或固化產物。The actinic radiation curable compositions of the present invention may be prepared by any suitable method. For example, the various desired components can be simply combined and mixed. Where it is desired to achieve some degree of dissolution of the polyamide components, such dissolution may be facilitated by various means, such as heating and/or vigorous stirring of the combined components. Homogenization methods can also be used. Additionally, one or more solvents may be utilized to facilitate dissolution of the polyamide components, as previously described. In one embodiment, the finely powdered polyamide is slowly added to the other components of the composition at a temperature of 20°C to 90°C while mixing. The resulting actinic radiation curable composition may then be stored under suitable protective conditions until required for use thereof to form an article or cured product.
本發明亦關於一種製造根據本發明之光化輻射可固化組成物之方法,其中該方法包含將至少一種聚醯胺、至少一種光化輻射可固化化合物及能夠溶解至少一種聚醯胺之至少一種揮發性溶劑組合以提供初始混合物且自初始混合物移除揮發性溶劑之至少一部分以提供光化輻射可固化組成物。 光化輻射可固化組成物之用途 The present invention also relates to a method of manufacturing an actinic radiation curable composition according to the invention, wherein the method comprises mixing at least one polyamide, at least one actinic radiation curable compound and at least one compound capable of dissolving at least one polyamide The volatile solvents are combined to provide an initial mixture and at least a portion of the volatile solvent is removed from the initial mixture to provide an actinic radiation curable composition. Uses of Actinic Radiation Curable Compositions
如先前所提及,根據本發明製備之光化輻射可固化組成物可包含一或多種光引發劑且為可光固化的。在本發明之某些其他實施例中,本文所述之光化輻射可固化組成物不包括任何引發劑且可(至少部分)用電子束能量固化。As previously mentioned, actinic radiation curable compositions prepared according to the present invention may comprise one or more photoinitiators and be photocurable. In certain other embodiments of the present invention, the actinic radiation curable compositions described herein do not include any initiators and are curable (at least in part) with electron beam energy.
本文所述之光化輻射可固化組成物可為藉助於自由基聚合、陽離子聚合或其他類型之聚合進行固化之組成物。在特定實施例中,可固化組成物經光固化(亦即,藉由暴露於光化輻射,諸如光,尤其可見光、UV光、近UV光、紅外光及/或近紅外光而固化)。The actinic radiation curable compositions described herein may be compositions that cure by means of free radical polymerization, cationic polymerization, or other types of polymerization. In particular embodiments, the curable composition is photocured (ie, cured by exposure to actinic radiation, such as light, especially visible, UV, near-UV, infrared, and/or near-infrared light).
本發明係關於一種製造固化產物(亦稱為固化聚合物材料)之方法,其中該方法包含使本發明之光化輻射可固化組成物固化。詳言之,光化輻射可固化組成物可藉由將該組成物暴露於輻射來固化。更具體而言,光化輻射可固化組成物可藉由將組成物暴露於UV光、近UV光、可見光、紅外光及/或近紅外光輻射或電子束而固化。藉由本發明方法得到之固化產物可為油墨、塗層、密封劑、黏著劑、模製物品或3D列印物品。The present invention relates to a method of producing a cured product, also called cured polymeric material, wherein the method comprises curing the actinic radiation curable composition of the present invention. In particular, actinic radiation curable compositions can be cured by exposing the composition to radiation. More specifically, actinic radiation curable compositions can be cured by exposing the composition to UV light, near UV light, visible light, infrared light, and/or near infrared light radiation or electron beams. The cured product obtained by the method of the present invention can be ink, coating, sealant, adhesive, molded article or 3D printed article.
用於可固化組成物之最終用途應用包括但不限於油墨、塗層、黏著劑、積層製造樹脂(諸如3D列印樹脂)、成型樹脂、密封劑、複合材料、抗靜電層、電子應用、可回收材料、能夠偵測刺激且對刺激有反應之智能材料及生物醫學材料。End-use applications for curable compositions include, but are not limited to, inks, coatings, adhesives, build-up resins (such as 3D printing resins), molding resins, sealants, composites, antistatic layers, electronic applications, Recycled materials, smart materials that can detect and respond to stimuli, and biomedical materials.
有利地,如藉由ASTM D256-10 (2018)所量測,與藉由將組成與光化輻射可固化組成物相同但不含至少一種聚醯胺之類似光化輻射可固化組成物光固化所獲得的固化聚合物材料相比,用本發明之光化輻射可固化組成物獲得之固化聚合物材料具有較高斷裂能。Advantageously, as measured by ASTM D256-10 (2018), by photocuring a similar actinic radiation curable composition having the same composition as the actinic radiation curable composition but without at least one polyamide The cured polymeric material obtained with the actinic radiation curable composition of the present invention has a higher fracture energy than the cured polymeric material obtained.
因此,本發明係關於一種用於增加藉由將光化輻射可固化組成物光固化所獲得之固化聚合物材料之斷裂能的方法,其中該方法包含在光固化之前將至少一種不含光化輻射可固化官能基之聚醯胺添加至該光化輻射可固化組成物中。詳言之,可輻射固化組成物包含在25℃下為液體之至少一種光化輻射可固化化合物。Accordingly, the present invention relates to a method for increasing the fracture energy of a cured polymer material obtained by photocuring an actinic radiation curable composition, wherein the method comprises, prior to photocuring, at least one Polyamides with radiation curable functional groups are added to the actinic radiation curable composition. In particular, the radiation curable composition comprises at least one actinic radiation curable compound that is liquid at 25°C.
本發明亦關於不含光化輻射可固化官能基之聚醯胺增加藉由將光化輻射可固化組成物光固化所獲得之固化聚合物材料之斷裂能的用途。詳言之,可輻射固化組成物包含在25℃下為液體之至少一種光化輻射可固化化合物。The present invention also relates to the use of polyamides free of actinic radiation curable functional groups to increase the fracture energy of cured polymeric materials obtained by photocuring actinic radiation curable compositions. In particular, the radiation curable composition comprises at least one actinic radiation curable compound that is liquid at 25°C.
詳言之,固化產物可為3D-列印物品。3D-列印物品可定義為使用電腦輔助設計(CAD)模型或數位3D模型用3D-列印機獲得的物品。特定言之,3D-列印物品可藉由製造3D-列印物品之方法獲得,該方法包含用本發明之光化輻射可固化組成物列印3D物品。Specifically, the cured product can be a 3D-printed item. A 3D-printed item can be defined as an item obtained with a 3D-printing machine using a computer-aided design (CAD) model or a digital 3D model. In particular, a 3D-printed article can be obtained by a method of manufacturing a 3D-printed article, which method comprises printing a 3D article with the actinic radiation curable composition of the present invention.
詳言之,該方法可包含逐層或連續列印3D物品。根據本發明之光化輻射可固化組成物之多個層可塗覆於基板表面上;該多個層可同時固化(例如藉由暴露於單個劑量之輻射)或各層可在光化輻射可固化組成物之另一層塗覆之前依次固化。本文所述之光化輻射可固化組成物可用作三維列印應用中之樹脂。因此,本發明係關於一種藉由積層製造來製造三維物品之方法,其包含使用本發明之光化輻射可固化組成物來製造三維物品。Specifically, the method may include layer-by-layer or continuous printing of 3D objects. Multiple layers of actinic radiation curable compositions according to the present invention may be applied to the surface of a substrate; the multiple layers may be cured simultaneously (e.g. by exposure to a single dose of radiation) or the layers may be curable under actinic radiation Another layer of composition is sequentially cured before being applied. The actinic radiation curable compositions described herein are useful as resins in 3D printing applications. Accordingly, the present invention relates to a method of manufacturing a three-dimensional object by additive manufacturing, which comprises using the actinic radiation curable composition of the invention to manufacture a three-dimensional object.
本文所述之光化輻射可固化組成物可適用於稱為熱製程3D列印之製程,其中組成物可以與熔結絲製程3D製造類似之方式擠出且同時或稍後藉由光化輻射固化。如本文所述之任何3D列印製程可在適於實現所期望之黏度的溫度下進行。The actinic radiation curable compositions described herein are suitable for use in a process known as thermal 3D printing, in which the composition can be extruded in a manner similar to 3D fabrication in the fused filament process and simultaneously or later exposed with actinic radiation. solidified. Any 3D printing process as described herein can be performed at a temperature suitable to achieve the desired viscosity.
由如本文所述之光化輻射可固化組成物製備的固化組成物可用於例如三維物品(其中該三維物品可基本上由固化組成物組成或由固化組成物組成)、塗覆物品(其中基板塗有固化組成物之一或多個層,包括包封物品,其中基板完全由固化組成物包覆)、層壓或黏著物品(其中物品之第一組分藉助於固化組成物層壓或黏著於第二組分)、複合材料物品或列印物品(其中使用固化組成物將圖形或類似物壓印在諸如含紙張、塑膠及/或金屬之基板的基板上)。Cured compositions prepared from actinic radiation curable compositions as described herein are useful, for example, in three-dimensional articles (wherein the three-dimensional article may consist essentially of or consist of the cured composition), coated articles (wherein the substrate Coated with one or more layers of a cured composition, including encapsulated articles in which the substrate is completely covered by the cured composition), laminated or adhered articles (where the first component of the article is laminated or adhered by means of the cured composition In the second component), a composite article or a printed article (where a cured composition is used to emboss graphics or the like on a substrate such as a substrate comprising paper, plastic and/or metal).
根據本發明之光化輻射可固化組成物之固化可藉由任何合適方法,諸如自由基及/或陽離子聚合進行。一或多種引發劑,諸如自由基引發劑(例如,當經輻射時產生自由基物種之光引發劑),可存在於光化輻射可固化組成物中。在固化之前,光化輻射可固化組成物可以任何已知之習知方式塗覆於基材表面,例如藉由噴塗、刮刀塗佈、輥塗、澆鑄、鼓塗、浸漬及其類似方式及其組合。亦可使用利用轉印製程之間接應用。塗覆至基板表面可在環境溫度(例如室溫)下或在高溫下進行。舉例而言,若光化輻射可固化組成物在環境溫度下為固體(諸如凝膠),則可將其加熱至可有效使光化輻射可固化組成物液化以有助於塗覆至基板表面之溫度。本發明之此類實施例可用於例如採用具有加熱樹脂缸或腔室之機器的三維列印操作或其類似操作中,或用於可擠壓光化輻射可固化組成物且接著稍後固化或在擠壓步驟期間固化的方法中。Curing of the actinic radiation curable composition according to the invention may be carried out by any suitable method, such as free radical and/or cationic polymerization. One or more initiators, such as free radical initiators (eg, photoinitiators that generate free radical species when irradiated), may be present in the actinic radiation curable composition. Prior to curing, the actinic radiation curable composition may be applied to the substrate surface in any known conventional manner, such as by spraying, knife coating, rolling, casting, drum coating, dipping, and the like, and combinations thereof . Indirect application using a transfer printing process can also be used. Application to the substrate surface can be performed at ambient temperature (eg, room temperature) or at elevated temperature. For example, if the actinic radiation curable composition is a solid (such as a gel) at ambient temperature, it can be heated to a temperature effective to liquefy the actinic radiation curable composition to facilitate application to the substrate surface temperature. Such embodiments of the invention may be used, for example, in three-dimensional printing operations or the like employing machines with heated resin tanks or chambers, or in extrudable actinic radiation curable compositions and then later cured or In the process of solidification during the extrusion step.
基板可為任何商業上相關之基板,諸如高表面能基板或低表面能基板,分別諸如金屬基板或塑膠基板。該等基板可包含金屬、紙張、卡紙板、玻璃、熱塑性塑料(諸如聚烯烴、聚碳酸酯、丙烯腈丁二烯苯乙烯(ABS)及其摻合物)、複合材料、木材、皮革及其組合。當用作黏著劑時,可將光化輻射可固化組成物置放於二個基板之間且隨後固化,經固化組成物藉此將該等基板黏合在一起以提供黏著物品。根據本發明之光化輻射可固化組成物亦可以整體方式形成或固化(例如,光化輻射可固化組成物可澆鑄至合適模具中且接著固化)。The substrate may be any commercially relevant substrate, such as a high surface energy substrate or a low surface energy substrate, such as a metal substrate or a plastic substrate, respectively. Such substrates may comprise metal, paper, cardboard, glass, thermoplastics such as polyolefins, polycarbonate, acrylonitrile butadiene styrene (ABS) and blends thereof, composites, wood, leather and their combination. When used as an adhesive, the actinic radiation curable composition can be placed between two substrates and subsequently cured, whereby the cured composition bonds the substrates together to provide an adhesive article. Actinic radiation curable compositions according to the present invention may also be formed or cured in bulk (for example, an actinic radiation curable composition may be cast into a suitable mold and then cured).
固化可藉由將能量供應至光化輻射可固化組成物,諸如藉由使光化輻射可固化組成物暴露於輻射源,諸如可見光或UV光、紅外輻射及/或電子束輻射來加速或促進。因此,固化組成物可視為經固化而形成之光化輻射可固化組成物的反應產物。可固化組成物可藉由暴露於光化輻射來部分固化,其中進一步固化係藉由加熱部分固化之物品來達成。舉例而言,由可固化組成物形成之物品(例如,3D列印物品)可在40℃至120℃之溫度下加熱5分鐘至12小時之時段。Curing can be accelerated or facilitated by supplying energy to the actinic radiation curable composition, such as by exposing the actinic radiation curable composition to a radiation source, such as visible or UV light, infrared radiation, and/or electron beam radiation . Thus, a cured composition can be considered a reaction product of an actinic radiation curable composition that is cured to form an actinic radiation curable composition. Curable compositions can be partially cured by exposure to actinic radiation, wherein further curing is achieved by heating the partially cured article. For example, an article formed from a curable composition (eg, a 3D printed article) may be heated at a temperature of 40°C to 120°C for a period of 5 minutes to 12 hours.
根據本發明之光化輻射可固化組成物之多個層可塗覆於基板表面上;該多個層可同時固化(例如藉由暴露於單個劑量之輻射)或各層可在光化輻射可固化組成物之另一層塗覆之前依次固化。Multiple layers of actinic radiation curable compositions according to the present invention may be applied to the surface of a substrate; the multiple layers may be cured simultaneously (e.g. by exposure to a single dose of radiation) or the layers may be curable under actinic radiation Another layer of composition is sequentially cured before being applied.
本文所述之光化輻射可固化組成物可用作三維列印應用中之樹脂。The actinic radiation curable compositions described herein are useful as resins in 3D printing applications.
本發明係關於一種藉由積層製造來製造三維物品之方法,其包含使用本發明之光化輻射可固化組成物來製造三維物品。在積層製造步驟之後,可對三維物品進行使用光化輻射或熱中之至少一者進行後固化之另一步驟。在積層製造步驟之後,可使用熱降解或用有機溶劑洗滌中之至少一者自三維物品移除三維物品中之光化輻射固化聚合物相。在移除光化輻射固化聚合物相之後,聚醯胺相可保留於三維物品中,且聚醯胺相可隨後經受熱燒結。The present invention relates to a method of manufacturing a three-dimensional article by additive manufacturing, which comprises using the actinic radiation curable composition of the present invention to manufacture a three-dimensional article. After the lamination fabrication step, the three-dimensional article may be subjected to a further step of post-curing using at least one of actinic radiation or heat. After the lamination fabrication step, the actinic radiation cured polymer phase in the three-dimensional article may be removed from the three-dimensional article using at least one of thermal degradation or washing with an organic solvent. After removal of the actinic radiation-cured polymer phase, the polyamide phase can remain in the three-dimensional article, and the polyamide phase can then be subjected to thermal sintering.
三維(3D)列印(其為一種類型積層製造)為藉由構築材料之增長來製造3D數位模型之製程。3D列印物體係藉由利用物體之電腦輔助設計(CAD)資料經由對應於3D物體之橫截面的二維(2D)層或片層之依序構築來產生。立體微影(SL)為一種類型積層製造,其中液體樹脂藉由選擇性暴露於輻射而硬化以形成各2D層。輻射可呈電磁波或電子束之形式。最常應用之能量源為紫外線、可見光或紅外輻射。Three-dimensional (3D) printing, which is a type of additive manufacturing, is the process of making 3D digital models by the growth of building materials. 3D printed object systems are produced by using computer-aided design (CAD) data of the object through the sequential construction of two-dimensional (2D) layers or slices corresponding to the cross-section of the 3D object. Stereolithography (SL) is a type of additive manufacturing in which a liquid resin is hardened by selective exposure to radiation to form 2D layers. Radiation may be in the form of electromagnetic waves or electron beams. The most commonly used energy sources are ultraviolet, visible light or infrared radiation.
本文所述之本發明光化輻射可固化組成物可用作3D列印樹脂調配物,亦即,意欲用於使用3D列印技術製造三維物品之組成物。此類三維物品可為獨立式/自撐式的,且可基本上由已固化之根據本發明之光化輻射可固化組成物組成或由其組成。三維物品亦可為一種複合材料,其包含至少一種基本上由如先前所提及之固化組成物或由該固化組成物組成之組分以及包含一或多種除此類固化組成物以外之材料的至少一種額外組分(例如金屬組分或熱塑性組分)。本發明之光化輻射可固化組成物尤其適用於數位光列印(DLP),但亦可使用本發明之可固化組成物(例如,SLA、噴墨)實施其他類型之三維(3D)列印方法。本發明之光化輻射可固化組成物可連同另一種材料一起用於三維列印操作中,該另一種材料充當由本發明之光化輻射可固化組成物形成之物品的支架或載體。The inventive actinic radiation curable compositions described herein can be used as 3D printing resin formulations, ie, compositions intended for the manufacture of three-dimensional objects using 3D printing techniques. Such three-dimensional articles may be freestanding/self-supporting and may consist essentially of or consist of cured actinic radiation curable compositions according to the invention. The three-dimensional object may also be a composite material comprising at least one component consisting essentially of or consisting of a solidified composition as mentioned previously and comprising one or more materials other than such solidified composition At least one additional component (such as a metallic component or a thermoplastic component). The actinic radiation curable compositions of the present invention are particularly suitable for use in digital photoprinting (DLP), but other types of three-dimensional (3D) printing can also be implemented using the curable compositions of the present invention (e.g., SLA, inkjet) method. The actinic radiation curable composition of the present invention can be used in a three-dimensional printing operation together with another material that acts as a support or support for an article formed from the actinic radiation curable composition of the present invention.
因此,本發明之光化輻射可固化組成物適用於實施各種類型之三維製造或列印技術,包括以逐步或逐層方式構築三維物體的方法。在此類方法中,層形成可藉由光化輻射可固化組成物在暴露於輻射,諸如可見光、UV或其他光化輻照之作用下凝固(固化)來進行。舉例而言,可在生長物體之頂表面或生長物體之底表面形成新層。本發明之光化輻射可固化組成物亦可有利地用於藉由積層製造生產三維物體之方法中,其中該方法連續進行。舉例而言,物體可從液體界面產生。此類型之合適方法在此項技術中有時稱為「連續液體界面(或相間)產品(或列印)」(「CLIP」)方法。此類方法描述於例如WO 2014/126830;WO 2014/126834;WO 2014/126837;及Tumbleston等人, 「Continuous Liquid Interface Production of 3D Objects」, Science 第347卷, 第6228期, 第1349-1352頁. (2015年3月20日)中,其全部揭露內容出於所有目的以全文引用之方式併入本文中。Therefore, the actinic radiation curable composition of the present invention is suitable for implementing various types of three-dimensional manufacturing or printing techniques, including methods of constructing three-dimensional objects in a step-by-step or layer-by-layer manner. In such methods, layer formation may be performed by solidification (curing) of the actinic radiation curable composition upon exposure to radiation, such as visible light, UV or other actinic radiation. For example, a new layer can be formed on the top surface of the growing object or the bottom surface of the growing object. The actinic radiation curable composition according to the invention can also advantageously be used in a process for the production of three-dimensional objects by additive manufacturing, wherein the process is carried out continuously. For example, objects can be generated from liquid interfaces. A suitable method of this type is sometimes referred to in the art as a "continuous liquid interface (or interphase) production (or printing)" ("CLIP") method. Such methods are described, for example, in WO 2014/126830; WO 2014/126834; WO 2014/126837; and Tumbleston et al., "Continuous Liquid Interface Production of 3D Objects", Science vol. 347, No. 6228, pp. 1349-1352 . (March 20, 2015), the entire disclosure of which is incorporated herein by reference in its entirety for all purposes.
當在透氧建構窗口上方進行立體微影時,可在CLIP程序中,藉由建立含氧「死區」使得能夠使用根據本發明之光化輻射可固化組成物產生物品,死區為在產生固化物品時在窗口與固化製品之表面之間的可固化組成物之未固化薄層。在此類製程中,使用光化輻射可固化組成物,其中藉由分子氧之存在抑制固化(聚合);此類抑制通常在例如能夠藉由自由基機制固化之可固化組成物中觀測到。期望死區厚度可藉由選擇各種控制參數來維持,該等控制參數諸如光子通量及可固化組成物之光學及固化特性。CLIP製程藉由以下進行:經由在維持液體形式之光化輻射可固化組成物的浴槽下方的透氧之光化輻射(例如UV)透明窗口,投影一系列連續光化輻射(例如,UV)圖像(其可藉例如由數位光加工成像單元來產生)。藉由在窗戶上方產生之死區維持前進(生長)物品下方之液體界面。將固化物品自死區上方之光化輻射可固化組成物浴槽連續抽出,其可藉由將額外量之可固化組成物饋入浴槽中以補償固化及併入至生長物品中之光化輻射可固化組成物之量來補充。When stereolithography is performed above an oxygen-permeable build window, articles can be produced using the actinic radiation curable composition according to the invention by creating an oxygen-containing "dead zone" during the CLIP process, which The cured article is a thin uncured layer of curable composition between the window and the surface of the cured article. In such processes, actinic radiation is used to curable compositions in which curing (polymerization) is inhibited by the presence of molecular oxygen; such inhibition is typically observed, for example, in curable compositions capable of curing by free radical mechanisms. The desired dead zone thickness can be maintained by selecting various control parameters such as photon flux and optical and curing properties of the curable composition. The CLIP process is performed by projecting a series of continuous actinic radiation (e.g., UV) patterns through an oxygen-permeable actinic radiation (e.g., UV) transparent window beneath a bath that maintains the actinic radiation-curable composition in liquid form An image (which may be generated, for example, by a digital light processing imaging unit). The liquid interface below the advancing (growing) item is maintained by the dead zone created above the window. The cured article is continuously withdrawn from the actinic radiation curable composition bath above the dead zone, which can be compensated for by feeding an additional amount of the curable composition into the bath to compensate for the possible actinic radiation curing and incorporation into the growing article. The amount of curing composition to supplement.
本發明係關於一種製造三維物品之方法,其包含: a) 將第一層根據本發明之光化輻射可固化組成物塗覆至表面上; b) 使該第一層至少部分地固化,以提供固化第一層; c) 將第二層該光化輻射可固化組成物塗覆至該固化第一層上; d) 使第二層至少部分地固化,以提供與該固化第一層黏著之固化第二層; 重複步驟c)及d)所需次數以累積由呈固化形式之該光化輻射可固化組成物構成的三維物品。 The present invention relates to a method of manufacturing a three-dimensional object, comprising: a) applying a first layer of the actinic radiation curable composition according to the invention to the surface; b) at least partially curing the first layer to provide a cured first layer; c) applying a second layer of the actinic radiation curable composition onto the cured first layer; d) at least partially curing the second layer to provide a cured second layer adhered to the cured first layer; Steps c) and d) are repeated as many times as necessary to accumulate a three-dimensional object consisting of the actinic radiation curable composition in cured form.
雖然固化步驟可藉由任何合適手段進行,在一些情況下手段將視可固化組成物中存在之組分而定,但在本發明之某些實施例中,藉由將有待固化之層暴露於有效量之輻射,尤其是光化輻射(例如,電子束輻射、UV輻射、可見光等)來實現固化。可加熱所形成之三維物品以便實現熱固化。Although the curing step may be performed by any suitable means, and in some cases the means will depend on the components present in the curable composition, in some embodiments of the invention, the curing step is achieved by exposing the layer to be cured to Curing is effected with an effective amount of radiation, especially actinic radiation (eg, electron beam radiation, UV radiation, visible light, etc.). The formed three-dimensional article can be heated to achieve thermal curing.
因此,在各種實施例中,本發明提供一種製造三維物品之方法,其包含以下步驟: a) 將第一層根據本發明及呈液體形式之光化輻射可固化組成物提供(例如,塗佈)至表面上; b) 使該第一層逐像暴露於光化輻射以形成第一暴露之成像橫截面,其中該輻射具有足以引起該暴露區域中該層至少部分固化的強度及持續時間; c) 將另一層光化輻射可固化組成物提供(例如塗佈)至先前暴露之成像橫截面上; d) 將該另一層逐像暴露於光化輻射以形成另一成像橫截面,其中該輻射具有足以引起該等暴露區域中該另一層至少部分固化且引起該另一層與先前暴露之成像橫截面黏著的強度及持續時間; e) 將步驟c)及d)重複所需次數以累積三維物品。 Accordingly, in various embodiments, the present invention provides a method of fabricating a three-dimensional article comprising the steps of: a) providing (eg coating) a first layer of an actinic radiation curable composition according to the invention and in liquid form onto a surface; b) imagewise exposing the first layer to actinic radiation to form a first exposed imaged cross-section, wherein the radiation has an intensity and duration sufficient to cause at least partial curing of the layer in the exposed areas; c) providing (eg, coating) another layer of actinic radiation curable composition onto the previously exposed imaged cross-section; d) image-wise exposing the further layer to actinic radiation to form a further imaged cross-section, wherein the radiation is of a magnitude sufficient to cause at least partial curing of the further layer in the exposed regions and to cause the further layer to differ from the previously exposed imaged cross-section. the strength and duration of the adhesion; e) Steps c) and d) are repeated the required number of times to accumulate three-dimensional objects.
在列印3D物品之後,可對其進行一或多個後處理步驟。後處理步驟可選自以下步驟中之一或多者:移除任何列印之支撐結構、用水及/或有機溶劑洗滌以移除殘餘樹脂及同時或依次使用熱處理及/或光化輻射進行後固化。後處理步驟可用於將新列印物品轉換為成品之功能物品以備用於其預定應用。After printing a 3D object, it can be subjected to one or more post-processing steps. The post-processing step may be selected from one or more of the following steps: removal of any printed support structures, washing with water and/or organic solvents to remove residual resin, and post-treatment using heat treatment and/or actinic radiation simultaneously or sequentially. solidified. Post-processing steps can be used to convert newly printed items into finished functional items ready for their intended application.
在一個實施例中,製造三維物品之方法包含將光化輻射可固化組成物加熱至高於組分a)至少一種聚醯胺之熔點的步驟。In one embodiment, the method of manufacturing a three-dimensional object comprises the step of heating the actinic radiation curable composition above the melting point of the at least one polyamide of component a).
因此,製造三維物品之方法可包含以下步驟: a') 將根據本發明之光化輻射可固化組成物加熱至高於組分a)之熔點的溫度; b') 將第一層經加熱之光化輻射可固化組成物塗覆至表面上; c') 使該第一層冷卻至低於組分a)之熔點的溫度,得到冷卻之第一層; d') 使該冷卻之第一層至少部分地固化,以提供固化第一層; e') 將第二層經加熱之光化輻射可固化組成物塗覆至該固化第一層上; f') 使該第二層冷卻至低於組分a)之熔點的溫度,得到冷卻之第二層; g') 使第二層至少部分地固化,以提供與該固化第一層黏著之固化第二層; h') 重複步驟e')、f')及g')所需次數以累積由呈固化形式之該光化輻射可固化組成物構成的三維物品。 Therefore, the method of manufacturing a three-dimensional object may include the following steps: a') heating the actinic radiation curable composition according to the invention to a temperature above the melting point of component a); b') applying a first layer of heated actinic radiation curable composition to the surface; c') cooling the first layer to a temperature below the melting point of component a) to obtain a cooled first layer; d') at least partially solidifying the cooled first layer to provide a solidified first layer; e') applying a second layer of heated actinic radiation curable composition onto the cured first layer; f') cooling the second layer to a temperature below the melting point of component a), resulting in a cooled second layer; g') at least partially curing the second layer to provide a cured second layer adhered to the cured first layer; h') Steps e'), f') and g') are repeated as many times as necessary to accumulate a three-dimensional object consisting of said actinic radiation curable composition in cured form.
詳言之,步驟c')及d')可同時進行且步驟f')及g')可同時進行。In particular, steps c') and d') can be carried out simultaneously and steps f') and g') can be carried out simultaneously.
本發明亦關於一種使用數位光投影、立體微影或多噴射列印製造三維列印物品之方法,其包含以逐層方式輻照根據本發明之光化輻射可固化組成物以形成三維列印物品。 本發明之態樣 The invention also relates to a method of producing a three-dimensionally printed article using digital light projection, stereolithography or multi-jet printing, comprising irradiating an actinic radiation curable composition according to the invention in a layer-by-layer manner to form a three-dimensional print thing. Aspects of the invention
本發明之示例性態樣可概述如下: 態樣1:一種光化輻射可固化組成物,其包含: a)至少一種聚醯胺,其不含光化輻射可固化官能基;及 b)至少一種光化輻射可固化化合物,其中該至少一種光化輻射可固化化合物在25℃下為液體; 其中滿足條件i)、條件ii)或條件iii): i)該至少一種聚醯胺為未經改質之聚醯胺或未經改質之聚醯胺之組合,且該至少一種聚醯胺在25℃下完全溶解於該光化輻射可固化組成物中; ii)該至少一種聚醯胺之至少一部分在25℃下呈分散於該光化輻射可固化組成物中之粒子存在; iii)該光化輻射可固化組成物在25℃下為凝膠且在100℃或更高溫度下為液體。 Exemplary aspects of the invention can be summarized as follows: Aspect 1: An actinic radiation curable composition comprising: a) at least one polyamide free of actinic radiation curable functional groups; and b) at least one actinic radiation curable compound, wherein the at least one actinic radiation curable compound is liquid at 25°C; Where condition i), condition ii) or condition iii) is satisfied: i) the at least one polyamide is unmodified polyamide or a combination of unmodified polyamides, and the at least one polyamide is completely soluble in the actinic radiation curable composition at 25°C in the thing; ii) at least a portion of the at least one polyamide is present as particles dispersed in the actinic radiation curable composition at 25°C; iii) The actinic radiation curable composition is a gel at 25°C and a liquid at 100°C or higher.
態樣2:如態樣1之光化輻射可固化組成物,其中該光化輻射可固化組成物包含每100重量份光化輻射可固化化合物至多30重量份聚醯胺。Aspect 2: The actinic radiation curable composition of
態樣3:如態樣1或態樣2之光化輻射可固化組成物,其中該光化輻射可固化組成物包含每100重量份光化輻射可固化化合物0.5至25重量份聚醯胺。Aspect 3: The actinic radiation curable composition according to
態樣4:如態樣1至3中任一項之光化輻射可固化組成物,其中該光化輻射可固化組成物在25℃下為均質液體。Aspect 4: The actinic radiation curable composition according to any one of
態樣5:如態樣1至3中任一項之光化輻射可固化組成物,其中滿足條件iii)。Aspect 5: The actinic radiation curable composition according to any one of
態樣6:如態樣1至3中任一項之光化輻射可固化組成物,其中滿足條件ii),且該至少一種聚醯胺之粒子係分散於該至少一種光化輻射可固化化合物之液體基質中。Aspect 6: The actinic radiation curable composition according to any one of
態樣7:如態樣1至6中任一項之光化輻射可固化組成物,其中該至少一種光化輻射可固化化合物包含至少一種選自於由以下組成之群的光化輻射可固化化合物:(甲基)丙烯酸酯官能化之化合物、氰基丙烯酸酯、亞甲基丙二酸酯、衣康酸酯及其組合。Aspect 7: The actinic radiation curable composition of any one of
態樣8:如態樣1至7中任一項之光化輻射可固化組成物,其中該至少一種光化輻射可固化化合物包含至少一種(甲基)丙烯酸酯官能化之寡聚物。Aspect 8: The actinic radiation curable composition of any of
態樣9:如態樣1至8中任一項之光化輻射可固化組成物,其中該至少一種光化輻射可固化化合物包含至少一種選自於由以下組成之群的(甲基)丙烯酸酯官能化之化合物:聚酯(甲基)丙烯酸酯寡聚物、聚醚(甲基)丙烯酸酯寡聚物、胺(甲基)丙烯酸酯寡聚物、環氧基(甲基)丙烯酸酯寡聚物、胺基甲酸酯(甲基)丙烯酸酯寡聚物及其組合。Aspect 9: The actinic radiation curable composition of any one of
態樣10:如態樣1至9中任一項之光化輻射可固化組成物,其中該光化輻射可固化組成物在25℃下之黏度不超過100,000 mPa.s。Aspect 10: The actinic radiation curable composition according to any one of
態樣11:如態樣1至10中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺包括至少一種聚醯胺,該至少一種聚醯胺為由至少一種聚醯胺嵌段及至少一種選自於由以下組成之群之嵌段構成的嵌段共聚物:聚酯嵌段、聚矽氧烷嵌段、聚醚-酯嵌段、聚醚嵌段及聚有機矽氧烷嵌段。Aspect 11: The actinic radiation curable composition of any one of
態樣12. 如態樣1至11中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺包括至少一種聚醯胺,該至少一種聚醯胺為由至少一種聚醯胺嵌段及至少一種選自於由以下組成之群之嵌段構成的嵌段共聚物:聚乙二醇嵌段、聚丙二醇嵌段、聚伸丁二醇嵌段、聚二甲基矽氧烷嵌段及乙氧基化雙酚A嵌段。Aspect 12. The actinic radiation curable composition of any one of
態樣13:如態樣1至12中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺嵌段為選自於由以下組成之群的聚醯胺嵌段:聚醯胺6,6、聚醯胺6,10、聚醯胺10,10、聚醯胺6,12、聚醯胺4,6、聚醯胺6、聚醯胺11及聚醯胺12。Aspect 13: The actinic radiation curable composition of any one of
態樣14:如態樣1至13中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺包括至少一種聚醯胺,該至少一種聚醯胺為熱塑彈性體且為由至少一種選自於由以下組成之群之聚醯胺嵌段及至少一種聚伸丁二醇嵌段構成的嵌段共聚物:聚醯胺6,6、聚醯胺6,10、聚醯胺10,10、聚醯胺6,12、聚醯胺4,6、聚醯胺6、聚醯胺11及聚醯胺12。Aspect 14: The actinic radiation curable composition of any one of
態樣15:如態樣1至14中任一項之光化輻射可固化組成物,其中該光化輻射可固化組成物能夠藉由暴露於紫外光、可見光及電子束輻射中之至少一者而固化。Aspect 15: The actinic radiation curable composition of any one of
態樣16:如態樣1至15中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺包括數目平均分子量為10,000至100,000 g/mol之至少一種聚醯胺。Aspect 16: The actinic radiation curable composition of any one of
態樣17:如態樣1至16中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺包括至少一種選自於由以下組成之群的聚醯胺:聚醯胺6,6、聚醯胺6,10、聚醯胺10,10、聚醯胺6,12、聚醯胺4,6、聚醯胺6、聚醯胺11及聚醯胺12。Aspect 17: The actinic radiation curable composition of any one of
態樣18:如態樣1至17中任一項之光化輻射可固化組成物,其另外包含至少一種光引發劑。Aspect 18: The actinic radiation curable composition of any one of
態樣19:如態樣1至18中任一項之光化輻射可固化組成物,其中該光化輻射可固化組成物包含以該光化輻射可固化組成物之重量計小於0.1重量%之非反應性溶劑。Aspect 19: The actinic radiation curable composition of any one of
態樣20:如態樣1至19中任一項之光化輻射可固化組成物,其中該光化輻射可固化組成物不含非反應性溶劑。Aspect 20: The actinic radiation curable composition of any one of
態樣21:如態樣1至20中任一項之光化輻射可固化組成物,其中滿足條件i),且該光化輻射可固化組成物另外包含在25℃下有效地使該至少一種聚醯胺完全溶解於該光化輻射可固化組成物中之量的至少一種非反應性溶劑。Aspect 21: The actinic radiation curable composition of any one of
態樣22:如態樣1至21中任一項之光化輻射可固化組成物,其中在25℃下該至少一種聚醯胺部分溶解於該至少一種光化輻射可固化化合物中。Aspect 22: The actinic radiation curable composition of any one of
態樣23:如態樣1至22中任一項之光化輻射可固化組成物,其中該至少一種聚醯胺包括至少一種為熱塑性材料之聚醯胺。Aspect 23: The actinic radiation curable composition of any of
態樣24:如態樣1至23中任一項之光化輻射可固化組成物,其中至少一種聚醯胺包含至少一種為熱塑彈性體之聚醯胺。Aspect 24: The actinic radiation curable composition of any one of
態樣25:如態樣1至24中任一項之光化輻射可固化組成物,其中組分a)及組分b)具有7至10 MPa
1/2之漢森溶解度參數δp及4.5至8.5 MPa
1/2之漢森溶解度參數δh。
Aspect 25: The actinic radiation curable composition of any one of
態樣26:如態樣1至25中任一項之光化輻射可固化組成物,其中該光化輻射可固化組成物係選自於由以下組成之群:黏著劑、密封劑、塗層、三維列印及積層製造樹脂、油墨及成型樹脂。Aspect 26: The actinic radiation curable composition of any one of
態樣27:一種製造固化聚合物材料之方法,其中該方法包含使用光化輻射使如態樣1至26中任一項之光化輻射可固化組成物固化。Aspect 27: A method of making a cured polymeric material, wherein the method comprises curing the actinic radiation curable composition of any one of
態樣28:如態樣27的方法,其中該方法利用紫外光或可見光中之至少一者。Aspect 28: The method of Aspect 27, wherein the method utilizes at least one of ultraviolet light or visible light.
態樣29:一種固化聚合物材料,其根據如態樣27或態樣28之方法獲得。Aspect 29: A cured polymer material obtained according to the method of Aspect 27 or Aspect 28.
態樣30:如態樣29之固化聚合物材料,其中如藉由ASTM D256-10 (2018)所量測,與藉由將組成與該光化輻射可固化組成物相同但不含該至少一種聚醯胺之類似光化輻射可固化組成物光固化所獲得的固化聚合物材料相比,該固化聚合物材料具有較高斷裂能。Aspect 30: The cured polymeric material of Aspect 29, wherein, as measured by ASTM D256-10 (2018), is identical to the actinic radiation curable composition by making the composition without the at least one The cured polymer material has a higher fracture energy than the cured polymer material obtained by photocuring similar actinic radiation curable compositions of polyamides.
態樣31:一種藉由積層製造來製造三維物品之方法,其包含使用如態樣1至26中任一項之光化輻射可固化組成物來製造該三維物品。Aspect 31: A method of manufacturing a three-dimensional article by additive manufacturing, comprising using the actinic radiation curable composition according to any one of aspects 1-26 to manufacture the three-dimensional article.
態樣32:如態樣31之方法,其中在積層製造步驟之後,對該三維物品進行使用光化輻射或熱中之至少一者進行後固化之另一步驟。Aspect 32: The method of Aspect 31, wherein after the lamination fabrication step, the three-dimensional article is subjected to a further step of post-curing using at least one of actinic radiation or heat.
態樣33:如態樣31或態樣32之方法,其中在積層製造步驟之後,使用熱降解或用有機溶劑洗滌中之至少一者自該三維物品移除該三維物品中之光化輻射固化聚合物相。Aspect 33: The method of Aspect 31 or Aspect 32, wherein after the lamination fabrication step, the actinic radiation curing in the three-dimensional article is removed from the three-dimensional article using at least one of thermal degradation or washing with an organic solvent polymer phase.
態樣34:如態樣33之方法,在移除該光化輻射固化聚合物相之後,聚醯胺相保留於該三維物品中,且該聚醯胺相隨後經受熱燒結。Aspect 34: The method of Aspect 33, after removing the actinic radiation-cured polymer phase, a polyamide phase remains in the three-dimensional article, and the polyamide phase is then subjected to thermal sintering.
態樣35:一種製造三維物品之方法,其包含:
a)將第一層根據態樣1至26中任一項之光化輻射可固化組成物塗覆至表面上;
b)使該第一層固化,以提供固化第一層;
c)將第二層該光化輻射可固化組成物塗覆至該固化第一層上;
d)使該第二層固化,以提供與該固化第一層黏著之固化第二層;
e)重複步驟c)及d)所需次數以累積由呈固化形式之該光化輻射可固化組成物構成的三維物品。
Aspect 35: A method of manufacturing a three-dimensional article, comprising:
a) applying a first layer of the actinic radiation curable composition according to any one of
態樣36:如態樣35之方法,其中將該光化輻射可固化組成物加熱至高於該a)至少一種不含光化輻射可固化官能基之聚醯胺的熔點。Aspect 36: The method of Aspect 35, wherein the actinic radiation curable composition is heated above the melting point of the a) at least one polyamide free of actinic radiation curable functional groups.
態樣37:一種使用數位光投影、立體微影或多噴射列印製造三維列印物品之方法,其包含以逐層方式照射根據態樣1至26中任一項之光化輻射可固化組成物以形成該三維列印物品。Aspect 37: A method of manufacturing a three-dimensionally printed article using digital light projection, stereolithography, or multi-jet printing, comprising irradiating the actinic radiation curable composition according to any one of
態樣38:一種製造三維物品之方法,其包含:
a)將根據態樣1至26中任一項之光化輻射可固化組成物加熱至高於組分a)之熔點的溫度;
b)將第一層經加熱之光化輻射可固化組成物塗覆至表面上;
c)使該第一層冷卻至低於組分a)之熔點的溫度,得到冷卻之第一層;
d)使該冷卻之第一層固化,以提供固化第一層;
e)將第二層經加熱之光化輻射可固化組成物塗覆至該固化第一層上;
f)使該第二層冷卻至低於組分a)之熔點的溫度,得到冷卻之第二層;
g)使該第二層固化,以提供與該固化第一層黏著之固化第二層;
h)重複步驟e)、f)及g)所需次數以累積由呈固化形式之該光化輻射可固化組成物構成的三維物品。
Aspect 38: A method of manufacturing a three-dimensional article, comprising:
a) heating the actinic radiation curable composition according to any one of
態樣39:如態樣38之方法,其中步驟c)及d)同時進行且步驟f)及g)同時進行。Aspect 39: The method of Aspect 38, wherein steps c) and d) are performed simultaneously and steps f) and g) are performed simultaneously.
態樣40:一種製造根據態樣1至26中任一項之光化輻射可固化組成物之方法,其中該方法包含將至少一種聚醯胺、至少一種光化輻射可固化化合物及能夠溶解至少一種聚醯胺之至少一種揮發性溶劑以提供初始混合物且自該初始混合物移除該揮發性溶劑之至少一部分以提供該光化輻射可固化組成物。Aspect 40: A method of making the actinic radiation curable composition according to any one of
在本說明書內,已以能夠撰寫明晰且簡潔之說明書之方式來描述實施例,但意欲且應瞭解,可在不脫離本發明的情況下將實施例以各種方式組合或分離。舉例而言,應瞭解,本文所述之所有較佳特徵均適用於本文所述之所有本發明之態樣。Within this specification, the embodiments have been described in such a manner that a clear and concise description can be written, but it is intended and understood that the embodiments may be combined or separated in various ways without departing from the invention. For example, it should be understood that all preferred features described herein apply to all aspects of the invention described herein.
在一些實施例中,本文中之本發明可解釋為排除不會實質上影響光化輻射可固化組成物、用於製造光化輻射可固化組成物之方法、使用光化輻射可固化組成物之方法及由光化輻射可固化組成物製備之物品之基礎及新穎特徵的任何要素或製程步驟。另外,在一些實施例中,本發明可解釋為排除本文中未說明之任何要素或製程步驟。In some embodiments, the invention herein may be construed to exclude acts that do not substantially affect the actinic radiation curable composition, methods for making the actinic radiation curable composition, use of the actinic radiation curable composition Any element or process step that is the basic and novel feature of the method and of the articles made from the actinic radiation curable composition. Additionally, in some embodiments, the invention may be construed excluding any element or process step not described herein.
儘管本發明在本文中參考特定實施例說明及描述本發明,但本發明不意欲限於所展示之細節。實際上,可在申請專利範圍之同等物之範疇及範圍內且在不脫離本發明之情況下詳細地作出各種修改。
實例 實例1:不包含光化輻射可固化官能基之聚醯胺(PEBAX®等級2533及4023,Arkema)與光化輻射可固化化合物(SARTOMER® CN1964CG;SR210CG;SR506D,均來自Arkema)之混合物的相容性
Although the invention is illustrated and described herein with reference to particular embodiments, the invention is not intended to be limited to the details shown. In fact, various modifications may be made in detail within the scope and scope of equivalents of the claims and without departing from the invention.
EXAMPLES Example 1: Composition of mixtures of polyamides (
此等材料為:
SARTOMER
®PRO22456:於SARTOMER
®SR506D中之10 wt %的PEBAX
®2533
SARTOMER
®PRO22457:於SARTOMER
®SR506D中之10 wt %的PEBAX
®4023
These materials are: SARTOMER ® PRO22456: 10 wt
藉由在鍋中於110℃ (對於PEBAX® 2533)或120℃ (對於PEBAX®4023)下熔融Pebax丸粒來製備PRO22456及PRO22457。接著添加預加熱之單體SR506D,同時在1000 ppm MEHQ下且在O 2下攪拌。 SARTOMER ®SR210CG:聚乙二醇(200)二甲基丙烯酸酯(PEG200DMA) SARTOMER ®SR506D:丙烯酸異莰酯(IBOA) SARTOMER ®CN1964CG:胺基甲酸酯二甲基丙烯酸酯 PRO22456 and PRO22457 were prepared by melting Pebax pellets in a pot at 110°C (for PEBAX® 2533) or 120°C (for PEBAX® 4023). Then preheated monomer SR506D was added while stirring at 1000 ppm MEHQ and under 02 . SARTOMER ® SR210CG: polyethylene glycol (200) dimethacrylate (PEG200DMA) SARTOMER ® SR506D: isobornyl acrylate (IBOA) SARTOMER ® CN1964CG: urethane dimethacrylate
表1-3展示聚醯胺與光化輻射可固化化合物之各種組合的混合條件及相容性結果。聚醯胺、寡聚物及單體之量以重量份給出。調配物中之PEBAX%表示為以調配物之總重量計的PEBAX重量%。
[表1]
以上結果顯示將聚醯胺添加至光化輻射可固化化合物通常緊接在混合之後尚熱時提供液體或具有小聚結物之液體。然而,混合物在室溫下冷卻24小時之後幾乎始終產生均質凝膠。預期此等形式中之任一者適用作積層製造之介質。 實例2:固化調配物之特性: The above results show that the addition of polyamides to actinic radiation curable compounds generally provides liquids or liquids with small agglomerates while still hot immediately after mixing. However, the mixture almost always produced a homogeneous gel after cooling at room temperature for 24 hours. Either of these forms is expected to be suitable as a medium for additive manufacturing. Example 2: Properties of Cured Formulations:
此實例係基於將PEBAX粉末分散於寡聚物或單體摻合物中。四種不同調配物藉由將不含光化輻射可固化官能基之聚醯胺的粉末與四種不同光化輻射可固化化合物組合來製備。聚醯胺之量表示為以調配物之重量計聚醯胺之重量%。所有製備及測試均在室溫下進行且詳述於下文中。This example is based on dispersing PEBAX powder in an oligomer or monomer blend. Four different formulations were prepared by combining powders of polyamides without actinic radiation curable functional groups with four different actinic radiation curable compounds. The amount of polyamide is expressed as weight percent polyamide based on the weight of the formulation. All preparations and testing were performed at room temperature and are described in detail below.
使用Glass-Col Rugged Rotator進行混合。使樣品在聚矽氧模具中在LED輸送機下在全強度、395 nm波長、50 rpm下固化,且對各樣品進行二次通過。 測試如下進行: Use a Glass-Col Rugged Rotator for mixing. The samples were cured in silicone molds under an LED conveyor at full intensity, 395 nm wavelength, 50 rpm with two passes for each sample. The test proceeds as follows:
在固化之前使用布氏椎板流變儀量測黏度。根據ASTM D638中之程序使用Instron量測固化之後的拉伸特性。Viscosity was measured prior to curing using a Brookfield disc rheometer. Tensile properties after curing were measured using an Instron according to the procedure in ASTM D638.
除了黏度之外,固化之後的結果及特性展示於表4中,黏度在固化之前對混合物進行量測。
[表4]
此等結果顯示併入有聚醯胺之所有樣品的斷裂能提高(高於對照)。一般而言,併入有聚醯胺之所有樣品的不透明性均增加。在聚醯胺與光化輻射可固化化合物P-220及I-150之混合物中觀測到固化之前改良的(低於對照)黏度。 實例3:與100%丙烯酸4-三級丁基環己酯相比具有17 wt%聚醯胺之丙烯酸4-三級丁基環己酯的特性 These results show that the fracture energy of all samples incorporating polyamide was increased (higher than the control). In general, the opacity of all samples incorporating polyamide increased. Improved (lower than control) viscosity prior to curing was observed in the mixture of polyamide and actinic radiation curable compounds P-220 and 1-150. Example 3: Properties of 4-tert-butylcyclohexyl acrylate with 17 wt% polyamide compared to 100% 4-tert-butylcyclohexyl acrylate
藉由首先將丙烯酸4-三級丁基環己酯(TBCHA) (SARTOMER
®SR217,Arkema)與以組成物之重量計17 wt%聚醯胺(PEBAX
®2533,Arkema)混合來製備樣品。第一步驟為在鍋中在110℃或120℃下熔融Pebax丸粒,接著在第二步驟中在1000 ppm MEHQ下且在O
2下攪拌下添加預加熱之單體SR217。接著在110℃下將此製備物與4 wt%光聚合引發劑(Irgacure
®TPO-L,BASF)混合在一起。此等與亦與4 wt%相同光聚合引發劑組合之純丙烯酸4-三級丁基環己酯相比。使樣品在LED輸送機下在全強度、395 nm波長下固化,且對各樣品以5 m/min進行每一側5次通過。當後固化時,其在烘箱中在120℃下進行2小時。使用動力學分析(DMA)以及三點彎曲來比較其特性。用熱使丙烯酸4-三級丁基環己酯與17 wt%聚醯胺之摻合物之固化樣品後固化,且用DMA及三點彎曲量測其特性。結果呈現在表5中。
[表5]
(無)(none)
[圖1]為在本文中適用作組分(a)及(b)之多種化合物的二個漢森參數之圖表,亦即參數δh (以MPa 1/2為單位),其定量來源於分子間氫鍵之能量;對比參數,參數δp (亦以MPa 1/2為單元),其表示分子間偶極相互作用之能量。 [Fig. 1] is a graph of two Hansen parameters applicable to various compounds used herein as components (a) and (b), namely the parameter δh (in MPa 1/2 ), which is quantified from the molecular The energy of the hydrogen bond between them; the comparison parameter, the parameter δp (also in MPa 1/2 unit), which represents the energy of the dipole interaction between molecules.
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