TWI803405B - Touch module and electronic device having the same - Google Patents

Abstract

A touch module includes a sensing element, a circuit element and an optical element. The sensing element has a sensing circuit and a first connecting zone. The sensing circuit extends to the first connecting zone. The circuit element has a conductive portion. The sensing circuit extending to the first connecting zone electrically connects with the first conductive portion. The optical element has a connecting notch. The sensing element is disposed on the optical element. The first connecting zone corresponds to the connecting notch. The sensing circuit extending to the first connecting zone is exposed from the optical element.

Description

Touch module and its electronic device

The invention relates to a touch module and an electronic device including the touch module.

With the advantages of bright colors and low energy consumption, light-emitting diode (light-emitting diode; LED) display devices and organic light-emitting diode (organic light-emitting diode; OLED) display devices have been widely used in people's lives. . Because OLED display devices can be bent, they have become one of the main technologies used in curved display devices and flexible display devices.

Since the touch sensing technology has become one of the main input interfaces for people to operate electronic devices such as computers, mobile phones or tablet computers, the current display modules often need to be designed together with the touch function. However, as the functional requirements continue to increase, the display modules of these electronic devices also need to increase the number of stacked layers, and the manufacturing difficulty is also increasing. Therefore, how to manufacture a flexible touch display device that can provide good display images has become one of the problems that those skilled in the art want to solve.

The touch module provided by the embodiment of the present invention can have a good sensing signal transmission line, and can also prevent the sensing signal transmission line from breaking.

A touch module according to an embodiment of the present invention includes a sensing element and an optical element. The sensing element has a sensing circuit. The sensing element includes an opposite first surface and a second surface, the sensing element has a first connection area and a second connection area, the first connection area is located at the edge of the first surface, and the second connection area is located at the edge of the second surface, The sensing circuit has a first connection portion extending to the first connection area, the sensing circuit has a second connection portion extending to the second connection area, and the first connection portion and the second connection portion do not overlap each other. The optical element has a connection gap, and the optical element is arranged on the first surface of the sensing element. The first connection area corresponds to the connection gap, and the first connection portion extending to the first connection area is exposed in the connection gap.

In an embodiment of the present invention, the above-mentioned first connection area and the second connection area are at least partially overlapped.

In an embodiment of the present invention, the above-mentioned optical element includes at least a polarizing element, or the optical element includes a linear polarizer and a retardation film.

In an embodiment of the present invention, the above-mentioned sensing circuit includes sensing electrodes with silver nanowires and peripheral circuits with at least one of silver nanowires and metals, and the first connection part and the second connection part are located at The ends of the peripheral lines have solder pads.

In an embodiment of the present invention, the above-mentioned touch module further includes an adhesive layer, and the adhesive layer is disposed between the sensing element and the optical element.

A touch module according to an embodiment of the present invention includes a sensing element and an optical element. The sensing element has a sensing circuit and a first connection area, the sensing circuit has a plurality of first connection portions extending to the first connection area, and the first connection portions do not overlap each other. The optical element has a connection gap, and the sensing element is arranged on the optical element. The first connection area corresponds to the connection gap, and the first connection portion extending to the first connection area is exposed in the connection gap.

In an embodiment of the present invention, the above-mentioned optical element includes at least a polarizing element, or the optical element includes a linear polarizer and a retardation film.

In an embodiment of the present invention, the above-mentioned sensing circuit includes sensing electrodes with silver nanowires and peripheral circuits with at least one of silver nanowires and metals, the first connecting portion is located at the end of the peripheral circuits and with solder pads.

In an embodiment of the present invention, the above-mentioned touch module further includes an adhesive layer, and the adhesive layer is disposed between the sensing element and the optical element.

An electronic device according to an embodiment of the present invention includes the above-mentioned touch module.

It can be seen from the above that the touch module of the embodiment of the present invention includes optical elements, and the first connection area of the sensing element is located in the connection gap, so the sensing element, the first conductive connection layer and the circuit element can be formed well through thermal pressing. The electrical connection makes the touch module have a good sensing signal transmission line.

The touch module of the embodiment of the present invention can be used in a light-emitting diode display device or an organic light-emitting diode display device, and the present invention is not limited thereto. The touch module of the embodiment of the present invention can have a good sensing signal transmission line.

It should be understood that although the terms "first", "second", "third" etc. may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections do not shall be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "component," "region," "layer" or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" means that other elements exist between two elements.

FIG. 1 is an exploded view of the touch module 100 in an embodiment of the present invention. Please refer to FIG. 1 , in an embodiment of the present invention, the touch module 100 includes a sensing element 110 , a circuit element 120 and an optical element 140 .

Please refer to FIG. 2 , which is a schematic front view of the sensing element 110 in an embodiment of the present invention. In this embodiment, the sensing element 110 is a touch sensing element. The sensing element 110 includes a sensing circuit disposed on the second surface 113 (including the sensing electrode SC and the peripheral line PL described below), such as a transparent conductive electrode or a patterned transparent conductive film. In some embodiments, the sensing circuit may be flexible, for example, a touch sensing electrode formed by patterning a conductive film formed of metal nanowires or grid-shaped metal thin wires. In some embodiments, the sensing circuit is, for example, indium tin oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), cadmium tin oxide (Cadmium Tin Oxide, CTO) or aluminum-doped zinc oxide (Aluminum Tin Oxide). -doped Zinc Oxide, AZO) made of transparent conductive film. As used herein, "metal nanowires" is a collective noun that refers to a collection of metal wires comprising a plurality of elemental metals, metal alloys, or metal compounds (including metal oxides), in which metal nanowires The number of wires does not affect the scope of protection claimed by the present invention; and at least one cross-sectional dimension (ie, the diameter of the cross-section) of a single metal nanowire is less than about 500 nm, preferably less than about 100 nm, and more preferably less than about 50 nm nm; and the metal nanostructures referred to in the present invention as "wires" mainly have high aspect ratios, such as between about 10 and 100,000, and more specifically, the aspect ratio of metal nanowires (length: diameter of section) can be greater than about 10, preferably greater than about 50, and more preferably greater than about 100; metal nanowires can be any metal, including (but not limited to) silver, gold, copper, nickel and gold-plated silver. Other terms, such as silk, fiber, tube, etc., are also within the scope of this application if they also have the above-mentioned dimensions and high aspect ratios.

The metal nanowires may include a layer of silver nanowires, a layer of gold nanowires, or a layer of copper nanowires. The specific method of this embodiment is: forming the dispersion liquid or slurry (ink) with metal nanowires on the substrate of the sensing element 110 by coating method, and drying it so that the metal nanowires cover the surface of the substrate and formed into a metal nanowire layer. After the above-mentioned curing/drying step, the solvent and other substances in the slurry are volatilized, and the metal nanowires are randomly distributed on the surface of the substrate, and the metal nanowires can contact each other to provide a continuous current path, thereby forming Conductive network (conductive network); followed by patterning the metal nanowire layer to make the sensing circuit.

In addition, a film layer can be coated on the metal nanowires to form a composite structure with certain specific chemical, mechanical and optical properties, such as providing adhesion between the metal nanowires and the substrate, or better physical mechanical strength, Therefore, the film layer can also be called matrix (matrix). On the other hand, some specific polymers are used to make the film layer, so that the metal nanowires have additional surface protection against scratches and abrasions. In this case, the film layer can also be called a hard coat (hard coat). ) or overcoat, using such as polyacrylate, epoxy resin, polyurethane, polysilane, polysiloxane, poly(silicon-acrylic acid), etc. can make metal nanowires have a higher Surface strength for improved scratch resistance. Furthermore, UV stabilizers (UV stabilizers) may be added to the film layer to improve the UV resistance of the metal nanowires. However, the above is only to illustrate the possibility of other additional functions/names of the film layer, and is not intended to limit the present application.

Furthermore, FIG. 2 shows a single-sided sensing element 110, wherein a plurality of sensing electrodes SC arranged parallel to each other are arranged on the second surface 113 of the sensing element 110, and the sensing electrodes SC are roughly located in the visible area. VA. The sensing electrode SC is connected to the peripheral line PL located in the peripheral area PA, and the end of the peripheral line PL extends to the second connection area 114 to connect with the circuit element 120 (see FIG. 1 ). When the user touches the sensing element 110, the corresponding capacitance value is sent by the sensing electrode SC, and is transmitted to the external controller (not shown) through the circuit element 120, so as to calculate the position touched by the user or its gestures. For convenience of description, the sensing electrodes SC and the peripheral lines PL can be regarded as a sensing circuit of the sensing element 110 as a whole.

Specifically, the sensing element 110 includes a substrate on which sensing electrodes SC and peripheral lines PL can be disposed, and the sensing element 110 can roughly include a visible area VA and a peripheral area PA; The touch/gesture sensing electrodes SC are substantially located in the visible area VA, which can be made of the aforementioned metal nanowires, and the peripheral lines PL for transmitting electrical signals such as sensing signals/control signals are substantially located in the peripheral area PA. The lines PL can be made of the aforementioned metal nanowires or/and metals (such as copper, silver, etc.). In more detail, as shown in FIG. 2, the peripheral area PA may have at least a second connection area 114 on the second surface 113, the second connection area 114 is adjacent to the edge of the substrate, and one end of the peripheral line PL is electrically connected to the inductor. The measuring electrode SC, while the other end extends to the second connection area 114; one end of the peripheral line PL extending to the second connection area 114 can be provided with a connection part BN, such as a welding pad, which can be connected to the circuit on the circuit element 120 (ie Conductive part) for electrical connection to transmit signals.

FIG. 3 and FIG. 4 are schematic front views of the touch module 100 in an embodiment of the present invention, wherein FIG. 3 is a front view of the first surface 111 , and FIG. 4 is a front view of the second surface 113 . Please refer to FIG. 1 to FIG. 4 together, the first surface 111 faces away from the second surface 113 . The first connection area 112 is located on the first surface 111 , and the second connection area 114 is located on the second surface 113 . Specifically, the first connection region 112 is adjacent to the edge of the first surface 111 , and the second connection region 114 is adjacent to the edge of the second surface 113 . In this embodiment, the first connection region 112 and the second connection region 114 at least partially overlap, in other words, the position of the first connection region 112 on the first surface 111 substantially corresponds to that of the second connection region 114 on the second surface. 113 position. In this embodiment, the sensing electrodes SC and the peripheral lines PL are disposed on the second surface 113 (to simplify the drawing, the sensing electrodes SC are not shown in FIG. 4 ), the sensing element 110 is disposed on the optical element 140 , And the second surface 113 of the sensing element 110 faces the optical element 140 . In another embodiment, the sensing electrodes SC and the peripheral lines PL are disposed on the first surface 111 of the sensing element 110 , and the first surface 111 faces away from the optical element 140 . That is to say, the single-sided sensing element 110 can selectively arrange the sensing electrode SC on the surface facing the optical element 140 or the surface away from the optical element 140, and the position of the circuit element 120 will correspond to the sensing electrode SC. .

The circuit element 120 includes, for example, a flexible printed circuit (FPC) or a flexible printed circuit. The circuit element 120 may include at least one set of conductive parts, and the conductive parts are provided with connection pads or welding pads, which can be used to connect the sensing element 110 to achieve signal transmission. In this embodiment, the circuit element 120 includes three sets of second conductive portions 124 corresponding to the three sets of peripheral lines PL of the sensing element 110 (the above numbers are for example only, not limiting the present invention). In this embodiment, the second connection region 114 of the sensing element 110 can constitute a soldering area, for example, a second conductive connection layer 150 (see FIG. The layer 150 electrically connects the peripheral lines PL of the sensing element 110 to the connection pads on the second conductive portion 124 to achieve signal transmission. It should be noted that the distribution area of the second conductive connection layer 150 on the sensing element 110 does not overlap with the distribution area of the optical element 140 on the sensing element 110 . In one embodiment, a conductive glue (such as anisotropic conductive glue, ACF) can be used to form the second conductive connection layer 150 .

The optical element 140 includes at least one connecting side 141 , and the optical element 140 has a connecting notch 142 located on the connecting side 141 . Please refer to FIG. 1 and FIG. 4. At least one purpose of the connection gap 142 is to expose the second connection region 114 to form a place to avoid the peripheral circuit PL caused by the properties of the optical element 140 in the heat-pressing equipment during the heat-pressing process. 1. Problems such as poor contact and poor connection between the second conductive connection layer 150 and the soldering pad of the circuit element 120 . In other words, the size and position of the connection gap 142 of the optical element 140 will correspond to the second connection area 114 to expose the second connection area 114 of the sensing element 110 . Therefore, from the perspective of FIG. 4, the position where the second conductive portion 124 of the circuit element 120 and the connection portion BN of the peripheral line PL of the sensing element 110 are glued to each other will be located in the connection gap 142, and will not be affected by the optical element. 140 (viewed from the perspective of the second surface 113 ), while other parts of the peripheral lines PL and the sensing electrodes SC are blocked by the optical element 140 (viewed from the perspective of the second surface 113 ). In this way, when the upper and lower pressing heads of the thermal pressing equipment work, the upper pressing head can apply force to the first surface 111 of the sensing element 110 , while the lower pressing head avoids the optical element 140 and directly applies force to the second conductive part 124 , the second conductive connection layer 150 and the peripheral circuit PL, so that the upper and lower pressure heads can well apply predetermined pressure and heat to the second conductive part 124, the second conductive connection layer 150 and the peripheral circuit PL, forming a good glued structure, and also That is to say, good fixation and connection are formed between the conductive part, the conductive connection layer and the corresponding peripheral circuits. Conversely, when there are problems such as poor contact and poor connection, the pressure will be increased to achieve a better contact effect, but it may cause the rupture of the component/electrode; therefore, the embodiment of the present invention can avoid the method of increasing the pressure , it can avoid the cracking problem of the above-mentioned components/electrodes.

The embodiment of the present invention does not limit the size and shape of the connecting notch 142 , as long as the aforementioned relief effect is achieved, it belongs to the scope of the present invention.

In addition, from the perspective of FIG. 3, the position where the second conductive portion 124 of the circuit element 120 and the peripheral line PL of the sensing element 110 are glued to each other will be blocked by the substrate of the sensing element 110 (by the first surface 111 perspective).

Please refer to Figure 5 and Figure 6. FIG. 5 is an exploded view of the touch module 100 in an embodiment of the present invention, wherein the sensing element 110 is a double-sided form, for example, the sensing element 110 has a first sensing electrode SC1 located on the first surface 111 (please refer to FIG. 6) and the second sensing electrode SC2 on the second surface 113 (please refer to FIG. 6), and the first surface 111 and the second surface 113 are respectively connected to the first sensing electrode SC1 and the second The peripheral lines PL1 and PL2 of the second sensing electrode SC2 (please refer to FIG. 6 ). In this embodiment, the first sensing electrode SC1 and the second sensing electrode SC2 are respectively extended along the second direction d2 and the first direction d1, wherein three sets of first sensing electrodes SC1 are connected to the same peripheral line PL to form One channel, and two sets of second sensing electrodes SC2 are connected to different peripheral lines PL, so two channels can be formed, and the aforementioned circuit element 120 is bonded with these channels by thermocompression. Similar to the previous embodiment, the peripheral line PL located on the first surface 111 has an end extending to the first connection area 112 (ie, the bonding pad BN1), which passes through the first conductive connection layer 130 and the first conductive part of the circuit element 120 122 are glued to each other; and the peripheral line PL located on the second surface 113 has an end extending to the second connection area 114 (that is, the soldering pad BN2), which is connected to the second conductive portion 124 of the circuit element 120 through the second conductive connection layer 150 Gluing; In addition, the first connection area 112 and the second connection area 114 have corresponding sizes and positions, and the optical element 140 has a connection gap 142, which corresponds to the first connection area 112/second connection area 114, which can be used in the hot pressing process To achieve the effect of giving way. The components in this embodiment (such as the first conductive portion 122 /the second conductive portion 124 , the first conductive connection layer 130 /the second conductive connection layer 150 ) can refer to the content of the previous embodiment, and will not be repeated here.

Please cooperate with FIG. 7 and FIG. 8, the first conductive part 122 is disposed in the sub-region A of the first connection region 112, the second conductive part 124 is disposed in the sub-region B of the second connection region 114, and the sub-region A , B are mutually misaligned, therefore, the second surface 113 of the sensing element 110 can provide a sufficient force-bearing surface when the first conductive part 122 and the first conductive connection layer 130 are thermally pressed to transfer the heat provided by the thermal pressing device , pressure to form a good glue between the first conductive part 122 and the peripheral circuit PL; similarly, the first surface 111 of the sensing element 110 can provide sufficient The force-receiving surface makes good adhesion between the second conductive part 124 and the peripheral line PL.

Specifically, the sensing element 110 of this embodiment is, for example, a capacitive touch sensing element, and the first surface 111 of the sensing element 110 has, for example, a driving signal line (ie, the first sensing electrode SC1 ), and the second For example, there is a sensing signal line (ie, the second sensing electrode SC2 ) on the surface 113 . The conductive connection layer 130 / 150 includes, for example, anisotropic conductive adhesive, and the circuit element 120 includes, for example, a flexible printed circuit board. Therefore, by making way for the connection gap 142, the optical element 140 will not affect the pressure distribution during the hot pressing process. Therefore, during the hot pressing process, one end of the peripheral line PL located on the first surface 111 is connected to the driving signal line, and the other end is connected to the driving signal line. (that is, the welding pad BN1) can be glued to the first conductive part 122 without defects, and one end of the peripheral line PL on the second surface 113 is connected to the induction signal line, and the other end (that is, the welding pad BN2) can be glued to the first conductive part 122 without defects. The second conductive part 124 . The good and defect-free gluing formed in this embodiment can achieve better signal transmission quality.

In other words, except for the connection gap 142 of the optical element 140 to give way, in this embodiment, the first conductive part 122 / the first conductive connection layer 130 in the distribution area of the sensing element 110 (that is, sub-area A) and The second conductive part 124 / the second conductive connection layer 150 do not overlap with each other in the distribution area of the sensing element 110 (that is, the sub-area B), so it will not affect the bonding of the double-sided sensing element 110 during the hot pressing process. quality.

In another embodiment, the aforementioned sub-regions A and B overlap partially or completely.

FIG. 9 is a side view of the touch module 100 according to an embodiment of the present invention. Please refer to FIG. 9. In this embodiment, the touch module 100 further includes a display element 160, which is disposed on the first surface 111 of the sensing element 110, that is, disposed on the sensing element 110 away from the optical element 140. side. The display element 160 can, for example, provide image light L to be transmitted to the outside through the optical element 140 to display images for users to watch. The display element 160 is, for example, a liquid crystal display element or an organic light emitting diode (OLED) display element, and the display element 160 and the sensing element 110 can be bonded with optically transparent glue or other similar adhesives (not shown). In addition, FIG. 9 also shows that the first conductive portion 122 and the second conductive portion 124 are respectively connected to the peripheral lines PL on the upper and lower surfaces of the sensing element 110 in a Y-shaped structure.

Furthermore, the optical element 140 can be a polarizing element, such as a circular polarizer, so when the display element 160 provides the image light L, the optical element 140 can reduce the problem of ambient light reflection. The optical element 140 can be a stretched polarizer or a liquid crystal polarizer. The optical element 140 may include a linear polarizer and a retardation film, wherein the retardation film may include a λ/4 film, or the retardation film may have a multilayer structure including a λ/4 film and a λ/2 film. Optical glue or other similar adhesives (not shown) can be used to bond the optical element 140 and the sensing element 110 . The term "adhesive layer" or similar terms used herein may include a bonding layer and an adhesion-promoting layer. The adhesive layer may be composed of a pressure sensitive adhesive (PSA) composition or an optically clear adhesive (OCA). As used herein, the term "transparent/transparent" means that the transmittance of light (such as visible light) is >85%, >88%, >90%, >95%, etc. The light-transmitting adhesive layer/optical transparent adhesive in the embodiment of the present invention can have proper adhesion, so that delamination, air bubbles, peeling, etc. will not occur when being bent and bent in the optical stack, and the light-transmitting adhesive layer can also have Viscoelasticity for flexible displays. In an embodiment, the light-transmitting adhesive layer can be formed using an acrylate composition. In one embodiment, the liquid crystal composition can be coated on the substrate surface of the sensing element 110 /display element 160 to form a liquid crystal polarizer. That is to say, the liquid crystal polarizer can directly contact the sensing element 110/display element 160; in one embodiment, the liquid crystal composition can include a reactive liquid crystal compound and a dichroic dye; the liquid crystal composition can be changed Contains solvents such as propylene glycol monomethyl ether acetate (PGMEA), xylene (Xylene), methyl ethyl ketone (MEK), or chloroform, among others.

FIG. 10 is a plan front view of a touch module 100A according to another embodiment of the present invention, and FIG. 10 is a plan front view showing the second surface 113 of the sensing element 110 and the optical element 140A. Please refer to FIG. 10 , in this embodiment, the touch module 100A includes a sensing element 110 and circuit elements 120 / 125 similar to the touch module 100 of the above embodiment. The same elements and their detailed descriptions will not be repeated here.

The difference between the touch module 100A and the touch module 100 is at least that the touch module 100A includes an optical element 140A, which is disposed on the second surface 113, and the optical element 140A includes a plurality of aforesaid relief gaps, specifically In other words, the optical element 140A has two relief gaps (namely connection gaps 142 / 146 ) disposed on the connection side 141 and the connection side 145 . That is to say, this embodiment utilizes the gaps in two different positions to form dislocations, so that the above-mentioned better heat and pressure conditions during the hot pressing process can be achieved, thereby achieving good hot pressing bonding.

In this embodiment, the connection side 141 extends along the first direction d1, the connection side 145 extends along the second direction d2, the first direction d1 and the second direction d2 are substantially perpendicular, and the connection side 141 and the connection side 145 are mutually connect. That is to say, the connection positions of the first sensing electrode SC1/second sensing electrode SC2 (not shown) of the double-sided sensing element 110 in this embodiment can be set to different sides, so that the two There is no mutual influence in the hot pressing process. In this embodiment, two circuit elements (ie, the circuit element 120 and the circuit element 125 ) can be used to connect the aforementioned first sensing electrode SC1 /second sensing electrode SC2 . Since the optical element 140A has the connection notches 142 and the connection notches 146 that are misaligned on different sides, the first conductive portion 122 of the circuit element 120 and the third conductive portion 126 of the circuit element 125 can form good electrical properties through thermal pressing. Connection, the optical element 140A will not affect the connection effect after hot pressing. Specifically, the first conductive portion 122 can be glued to the peripheral line PL connected to the second sensing electrode SC2 , and the third conductive portion 126 can be glued to the peripheral line PL connected to the first sensing electrode SC1 . In another embodiment, the first conductive portion 122 and the third conductive portion 126 may belong to the same flexible printed circuit board.

FIG. 11 is a plan front view of a touch module 100B according to yet another embodiment of the present invention, and FIG. 11 is a plan front view showing the second surface 113 of the sensing element 110 and the optical element 140B. Please refer to FIG. 11 , in this embodiment, the touch module 100B is similar to the touch module 100A of the above-mentioned embodiment, and the same elements and their detailed descriptions will not be repeated here.

The difference between the touch module 100B and the touch module 100A is at least that the touch module 100B includes an optical element 140B disposed on the second surface 113, and the optical element 140B includes a plurality of aforesaid relief gaps, specifically In other words, the optical element 140B has two relief gaps (namely connection gaps 142 / 148 ) disposed on the connection side 141 and the connection side 147 . That is to say, this embodiment utilizes the gaps in two different positions to form dislocations, so that the above-mentioned better heat and pressure conditions during the hot pressing process can be achieved, thereby achieving good hot pressing bonding.

In this embodiment, both the connecting side 141 and the connecting side 147 extend along the first direction d1, and the connecting side 141 and the connecting side 147 are respectively located on opposite sides of the optical element 140B. That is to say, the connection positions of the first sensing electrode SC1/second sensing electrode SC2 (not shown) of the double-sided sensing element 110 in this embodiment can be set to different sides, so that the two There is no mutual influence in the hot pressing process. In this embodiment, two circuit elements (ie, the circuit element 120 and the circuit element 125 ) can be used to connect the aforementioned first sensing electrode SC1 /second sensing electrode SC2 . Since the optical element 140B has the connection notch 142 and the connection notch 148 that are misaligned on different sides, the first conductive portion 122 of the circuit element 120 and the third conductive portion 126 of the circuit element 125 can form good electrical properties through thermal pressing. Connection, the optical element 140B will not affect the connection effect after hot pressing. As shown in the figure, the first conductive portion 122 can be glued to the peripheral line PL connected to the second sensing electrode SC2 , and the third conductive portion 126 can be glued to the peripheral line PL connected to the first sensing electrode SC1 . In another embodiment, the first conductive portion 122 and the third conductive portion 126 may belong to the same flexible printed circuit board.

To sum up, because the optical element in the embodiment of the present invention has a connection gap, the conductive part of the circuit element can be electrically connected to the conductive connection layer of the sensing element through thermocompression bonding without being affected by the optical element, thereby providing A touch module with good sensing signal transmission lines.

The touch module provided by the embodiments of the disclosure can be applied to display devices, for example, electronic devices with panels, such as mobile phones, tablets, wearable electronic devices, TVs, monitors, notebook computers, e-books, Digital photo frame, navigator, or similar. Specifically, the touch module of the embodiment of the present invention can be assembled with other electronic components to form a device/product, such as a display with touch function, for example, the touch module can be attached to the display element (not shown in the figure) , such as liquid crystal display elements or organic light emitting diode (OLED) display elements, which can be bonded with optical glue or other similar adhesives; or the touch module of the embodiment of the present invention can be applied to portable Electronic devices such as phones, tablet computers, laptops, car devices (such as dashboards, driving recorders, car rearview mirrors, car windows, etc.), or can also be applied to flexible products, such as wearable Devices (such as smart bracelets, smart watches, virtual reality devices, glasses, smart clothes, smart shoes, etc.).

A: sub-area B: sub-area BN: connection part BN1: soldering pad BN2: soldering pad d1: the first direction d2: second direction L: image light PA: Peripheral area PL: peripheral line PL1: Peripheral lines PL2: Peripheral lines SC: Sensing electrode SC1: the first sensing electrode SC2: Second sensing electrode VA: visible area 100:Touch module 100A: Touch module 100B: Touch module 110: sensing element 111: first surface 112: The first connection area 113: second surface 114: Second connection area 120: circuit components 122: the first conductive part 124: the second conductive part 125: circuit components 126: The third conductive part 130: the first conductive connection layer 140: Optical components 140A: Optics 140B: Optical components 141: connection side 142: Connection gap 145: connection side 146: Connection gap 147: Connection side 148: Connection Gap 150: the second conductive connection layer 160: display components

FIG. 1 is an exploded view of a touch module in an embodiment of the present invention. FIG. 2 is a schematic front view of the sensing element in an embodiment of the present invention. FIG. 3 is a top view of the touch module in an embodiment of the present invention. FIG. 4 is a bottom view of the touch module in an embodiment of the present invention. FIG. 5 is an exploded view of the touch module in another embodiment of the present invention. FIG. 6 is a schematic front view of the sensing element in another embodiment of the present invention. FIG. 7 is a top view of the touch module in an embodiment of the present invention. FIG. 8 is a bottom view of the touch module in an embodiment of the present invention. FIG. 9 is a side view of a touch module according to an embodiment of the present invention. FIG. 10 is a bottom view of the touch module in an embodiment of the present invention. FIG. 11 is a bottom view of the touch module in an embodiment of the present invention.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

d1: the first direction

d2: second direction

100:Touch module

110: sensing element

111: first surface

113: second surface

114: Second connection area

120: circuit components

124: the second conductive part

140: Optical components

142: Connection gap

150: the second conductive connection layer

Claims (10)

A touch module, comprising: A sensing element has a sensing circuit, wherein the sensing element includes a first surface and a second surface opposite to each other, the sensing element has a first connection area and a second connection area, the The first connection area is located at the edge of the first surface, the second connection area is located at the edge of the second surface, the sensing circuit has a first connection portion extending to the first connection area, and The sensing circuit has a second connection portion extending to the second connection area, the first connection portion and the second connection portion do not overlap each other; and an optical element having a connection gap, the optical element is disposed on the first surface of the sensing element, Wherein the first connection area corresponds to the connection gap, and the first connection portion extending to the first connection area is exposed in the connection gap. The touch module according to claim 1, wherein the first connection area and the second connection area are at least partially overlapped. The touch module according to claim 1, wherein the optical element includes at least a polarizing element, or the optical element includes a linear polarizer and a retardation film. The touch module according to claim 1, wherein the sensing circuit includes sensing electrodes with silver nanowires and peripheral circuits with at least one of silver nanowires and metals, and the first connection part The second connecting portion is located at the end of the peripheral circuit and has a welding pad. The touch module as described in claim 1 further includes: An adhesive layer is arranged between the sensing element and the optical element. A touch module, comprising: A sensing element has a sensing circuit and a first connection area, the sensing circuit has a plurality of first connection portions extending to the first connection area, and the first connection portions do not overlap with each other ;as well as An optical element has a connection gap, the sensing element is arranged on the optical element, Wherein the first connection area corresponds to the connection gap, and the first connection portions extending to the first connection area are exposed in the connection gap. The touch module according to claim 6, wherein the optical element includes at least a polarizing element, or the optical element includes a linear polarizer and a retardation film. The touch module according to claim 6, wherein the sensing circuit includes sensing electrodes with silver nanowires and peripheral circuits with at least one of silver nanowires and metals, and the first The connection part is located at the end of the peripheral circuit and has a welding pad. The touch module as described in claim 6 further includes: An adhesive layer is arranged between the sensing element and the optical element. An electronic device, comprising the touch module according to any one of Claims 1 to 9.

Images