TWI790484B - Touch unit and touch display module with touch unit - Google Patents

Abstract

A touch unit includes a sensing unit, an optical processing unit, a flexible circuit and a transparent cover. The cover is disposed on the optical processing unit. The sensing unit, the optical processing unit and the cover define an accommodating space. A connecting space between the cover and the flexible circuit is defined. An adhesive is disposed in a connecting space to connect the cover and the flexible circuit.

Description

Touch element and touch display module including touch element

The present invention relates to a sensing module and a display device, in particular to a touch element and a touch display module.

Due to the advantages of bright colors and low energy consumption, light-emitting diode (LED) display devices and organic light-emitting diode (OLED) display devices have been widely used in people's daily life. . Because OLED display devices can be bent, they have become one of the main technologies used in curved display devices and flexible display devices.

Since touch sensing technology has become one of the main input interfaces for people to operate electronic devices such as computers, mobile phones or tablet computers, current electronic devices often need to have a touch display module. However, since the flexible printed circuit (FPC) used to transmit the touch signal needs to be electrically connected to the touch sensor in the touch display module through the anisotropic conductive adhesive by means of hot pressing. However, the anisotropic conductive adhesive and the thickness of the flexible printed circuit board will cause the deformation of the light-transmitting cover on the display module, and furthermore, there will be no space to fill the adhesive, resulting in a poor touch display module. rate decreased. Therefore, how to make a good touch display module is still one of the problems that those skilled in the art want to solve.

The touch element and the touch display module of the embodiment of the present invention can have good sensing signal transmission lines.

A touch element according to an embodiment of the present invention includes a sensing element, an optical element, a flexible circuit element, and a transparent cover. The optical element is configured on the sensing element. The transparent cover plate is configured on the optical element. The light-transmitting cover, the optical element and the sensing element define an accommodating space. The flexible circuit element is arranged in the accommodating space. A connecting space is formed between the light-transmitting cover and the flexible circuit element, and a fixed layer is configured to connect the light-transmitting cover and the flexible circuit element.

In an embodiment of the invention, the sensing element has a sensing surface. The normal direction of the sensing surface is parallel to the first direction. The thickness of the flexible circuit element along the first direction is 50%-80% of the thickness of the accommodating space along the first direction.

In an embodiment of the invention, the sensing element has a sensing surface. The normal direction of the sensing surface is parallel to the first direction. The thickness of the fixed layer in the first direction is 10% to 40% of the thickness of the accommodating space in the first direction, and the thickness of the conductive connection layer in the first direction is 10% to 40% of the thickness of the accommodating space in the first direction. 10%-25% of the thickness in the first direction.

In an embodiment of the present invention, the aforementioned touch element further includes a visible area and a peripheral area. The peripheral area has a connection area for setting flexible circuit elements. There is a glue filling area between the flexible circuit element and the optical element.

In an embodiment of the present invention, the above-mentioned optical element includes a first light-transmitting adhesive layer, a polarizing layer, and a second light-transmitting adhesive layer. The first light-transmitting adhesive layer is disposed on the visible area of the sensing surface of the sensing element. The polarizing layer is configured on the first transparent adhesive layer. The second transparent adhesive layer is configured on the polarizing layer.

In an embodiment of the present invention, the normal direction of the sensing surface of the sensing element is parallel to the first direction. The thickness of the flexible circuit element in the first direction falls within the range of 30 microns to 43 microns. Alternatively, the thickness of the flexible circuit element in the first direction falls within a range of 10 microns to 15 microns.

In an embodiment of the present invention, the above-mentioned touch element further includes a conductive connection layer. The conductive connection layer is disposed between the flexible circuit element and the connection area of the sensing surface of the sensing element, and the thickness of the conductive connection layer in the first direction is equal to that of the accommodating space in the first direction. 10%~25% of the thickness in one direction.

A touch element according to an embodiment of the present invention includes a sensing element, an optical element, and a flexible circuit element. The optical element is configured on the sensing element. The flexible circuit element is connected to the sensing element. The flexible circuit element is connected to the sensing element. The thickness of the flexible circuit element along the first direction is smaller than the thickness of the optical element along the first direction.

In an embodiment of the invention, the sensing element has a sensing surface. The normal direction of the sensing surface is parallel to the first direction. The thickness of the flexible circuit element along the first direction is 50%-80% of the thickness of the accommodating space along the first direction.

In an embodiment of the invention, the sensing element has a sensing surface. The normal direction of the sensing surface is parallel to the first direction. The thickness of the fixed layer along the first direction is 10%-40% of the thickness of the accommodation space along the first direction.

In an embodiment of the present invention, the touch element includes a visible area and a peripheral area, and the peripheral area has a connection area for disposing a flexible circuit element. There is a glue filling area between the flexible circuit element and the sensing element.

In an embodiment of the present invention, the optical element includes a first transparent adhesive layer, a polarizing layer, and a second transparent adhesive layer. The first light-transmitting glue layer is configured on the visible area of the sensing surface of the sensing element. The polarizing layer is configured on the first transparent adhesive layer. The second transparent adhesive layer is configured on the polarizing layer.

In an embodiment of the present invention, the aforementioned touch element is conductively connected to the layer. The conductive connection layer is disposed between the flexible circuit element and the connection area of the sensing surface.

In an embodiment of the invention, the normal direction of the sensing surface of the sensing element is parallel to the first direction. The thickness of the flexible circuit element in the first direction falls within the range of 30 microns to 43 microns. Alternatively, the thickness of the flexible circuit element in the first direction falls within a range of 10 microns to 15 microns.

A device according to an embodiment of the present invention includes the aforementioned touch element.

From the above, it can be seen that a connection space is formed between the light-transmitting cover plate and the flexible circuit element of the touch device and the touch display module according to the embodiment of the present invention, and the fixing layer is disposed in the connection space. Therefore, the flexible circuit element and the sensing element can be stably connected without affecting the arrangement position of the light-transmitting cover.

The touch element and the touch display module of the embodiments of the present invention can be used in a light emitting diode display device or an organic light emitting diode display device, and the present invention is not limited thereto. The touch element and the touch display module of the embodiment of the present invention can have good sensing signal transmission lines.

It should be understood that although the terms "first", "second", "third" etc. may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections do not shall be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "component," "region," "layer" or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

In the accompanying drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" means that other elements exist between two elements.

In one embodiment of the present invention, the touch element is mainly obtained by integrating the sensing element 110 and the optical element 120, while the flexible circuit element 130 is electrically connected to the sensing element 110 by means of heat and pressure; through the integration of the above elements Assembly, in the embodiment of the present invention, the thickness of the flexible circuit element 130 (that is, the dimension along the first direction d1 described later) is smaller than the thickness of the optical element 120 (that is, the dimension along the first direction d1 described later) size) to avoid deformation of the light-transmitting cover plate 140 assembled on the touch element. In addition, when the thickness of the flexible circuit element 130 is smaller than the thickness of the optical element 120, a gap is formed between the flexible circuit element 130 and the light-transmitting cover plate 140 (ie, the connection space S1 described later); in the present invention In one embodiment, the connection space S1 can be filled with glue or the like to form the fixed layer 150. The fixed layer 150 can make the flexible circuit element 130, the light-transmitting cover plate 140 and the touch element (the sensing element 110 and the optical element 120) to form a highly integrated product with better assembly strength. FIG. 1 is a cross-sectional view of a touch element in an embodiment of the present invention. Please refer to FIG. 1 , for convenience of description, in one embodiment of the present invention, the touch element 100 includes a sensing element 110 , an optical element 120 , a flexible circuit element 130 , a transparent cover 140 and a fixed layer 150 .

Please cooperate with FIG. 2 (for simplicity, the optical element 120, the light-transmitting cover plate 140 and the fixed layer 150 are not drawn in FIG. 2), the sensing element 110 has a sensing surface 111 on which the sensing electrodes SC and Peripheral lines PL, the sensing surface 111 can roughly include a visible area 112 and a peripheral area PA, in detail, the sensing electrodes SC for sensing user touches/gestures are substantially located in the visible area 112, and are used for transmitting sensing The peripheral lines PL for electrical signals such as signals/control signals are actually located in the peripheral area PA. In more detail, the peripheral area PA may at least have a connection area 113 adjacent to the edge 114 of the sensing surface 111, one end of the peripheral line PL is electrically connected to the sensing electrode SC, and the other end extends to the connection area 113. The end of the peripheral line PL extending to the connection area 113 may be provided with a connection portion (also called a pad), which can be electrically connected to the circuit on the flexible circuit element 130 to transmit signals. Please refer to FIG. 1, the peripheral area PA can further have a glue filling area 115, specifically, the glue filling area 115 can be defined between the optical element 120 and the flexible circuit element 130, which can be used to fill the fixed layer 150, The fixed layer 150 covers the peripheral lines PL. In one embodiment, the glue-filled region 115 may be a gap (such as a void) not filled in the fixing layer 150 . In one embodiment, the peripheral area PA is not designed with the glue filling area 115 , that is to say, the front edge of the flexible circuit element 130 extends toward the visible area 112 as much as possible to touch the edge 114 of the visible area 112 .

The position of the optical element 120 substantially corresponds to that of the sensing element 110 . Specifically, the size of the optical element 120 is substantially the same as that of the sensing element 110 , but the aforementioned connection area 113 /filling area 115 is exposed. In this embodiment, the visible area 112 and the connection area 113 do not overlap with each other, and the glue filling area 115 is mainly defined by the corresponding sidewalls of the optical element 120 and the flexible circuit element 130 .

Please refer to FIG. 1 again, the transparent cover 140 , the optical element 120 and the sensing element 110 substantially define an accommodating space for accommodating the flexible circuit element 130 . The flexible circuit element 130 is disposed on the sensing element 110, specifically, the flexible circuit element 130 is disposed on the connection area 113 of the sensing surface 111, so as to achieve electrical connection with the connection portion of the peripheral line PL on the connection area 113. sexual connection. In one embodiment, the glue-filling area 115 has a distance g, so that the fixing layer 150 can fill the entire glue-filling area 115 well without problems such as air bubbles and overflowing glue.

The light-transmitting cover plate 140 is an outermost element, which is mainly disposed on the optical element 120 and part of the flexible circuit element 130 . In one embodiment, the two sides of the optical element 120 (the lower surface and the upper surface) are connected to the sensing element 110 and the light-transmitting cover 140 respectively, and the strength of the flexible circuit element 130 and the structural factors of the overall product are considered. A connecting space S1 can be formed between the transparent cover plate 140 and the flexible circuit element 130 . Specifically, the light-transmitting cover 140 of this embodiment exceeds the sensing element 110 in the second direction d2 to cover the visible area 112 and the surrounding area PA. As shown in FIG. 1 , the edge 141 of the light-transmitting cover 140 is at The edge 114 protruding from the optical element 120 in the second direction d2 forms a distance L1. The protruding part of the light-transmitting cover plate 140 can be used to assemble the outer frame of the terminal product, and can cover non-transparent elements such as the flexible circuit element 130, To avoid being observed by the user, specifically, the light-transmitting cover plate 140 is provided with a light-shielding layer BM to cover non-transparent elements such as the flexible circuit element 130 . In one embodiment, due to the demand for products with narrow borders, the smaller the distance L1, the more adhesive the fixing layer 150 must be used to effectively fix the flexible circuit element 130 and the light-transmitting cover plate 140; For large-sized products (such as mobile phones, watches, etc.), the distance L1 is recommended to be more than 0.1mm, and for medium and large-sized products (such as tablets, notebook computers, digital whiteboards, TVs, etc.), the distance L1 is recommended to be 0.5 mm above. In addition, the thickness h6 of the connecting space S1 in the first direction d1 is 10%-40% of the thickness h4 of the accommodating space in the first direction d1, by controlling the size of the connecting space S1 (ie distance L1, thickness h6) To obtain proper properties of the fixing layer 150 , and then to have better assembly strength between the flexible circuit element 130 and other components (such as the transparent cover plate 140 , the optical element 120 and the sensing element 110 , etc.). In one embodiment, the size of the fixing layer 150 (after curing) is substantially equal to the size of the connection space S1 (ie, the distance L1 and the thickness h6). In addition, as shown in FIG. 1 , the first direction d1 is parallel to the thickness direction of the entire stack, and the second direction d2 is perpendicular to the thickness direction of the entire stack.

On the other hand, a glue-filling space S2 is formed on the glue-filling area 115 between the light-transmitting cover 140 and the sensing element 110. Specifically, the glue-filling space S2 is defined by the glue-filling area 115 along the first direction d1. The glue-filling space S2 is connected to the connection space S1, so materials such as glue are poured into the connection space S1 and the glue-filling space S2 to form a fixed layer 150 with an L-shaped cross section. In one embodiment, the fixing layer 150 and the optical element 120 form a coplanar surface, so as to facilitate the assembly of the light-transmitting cover plate 140 .

As shown in the figure, in this embodiment, the light-transmitting cover 140 , the optical element 120 and the sensing element 110 substantially define an accommodating space, which has a thickness h1. The light-transmitting cover 140 , the optical element 120 and The accommodating space defined by the sensing element 110 can be used for accommodating the flexible circuit element 130; in addition, the accommodating space may include the connection space S1 and/or the glue filling space S2. In this way, after the flexible circuit element 130 is accommodated in the accommodating space defined by the light-transmitting cover plate 140, the optical element 120 and the sensing element 110, the fixing layer 150 can be arranged in the connection space S1 and/or the glue filling space S2, Thus, the flexible circuit element 130 is fixed to the light-transmitting cover plate 140 , the optical element 120 and the sensing element 110 .

Since in the touch element 100 of this embodiment, a connecting space S1 is formed between the light-transmitting cover plate 140 and the flexible circuit element 130 , the fixing layer 150 can connect the light-transmitting cover plate 140 and the flexible circuit element 130 , In order to further increase the strength and stability of the touch element 100 .

On the other hand, because there is a connection space S1 between the light-transmitting cover 140 and the flexible circuit element 130, the flexible circuit element 130 will not directly touch the light-transmitting cover 140, while the sensing element 110, the optical Both the element 120 and the light-transmitting cover plate 140 can be stacked parallel to each other without being affected by the flexible circuit element 130 .

The sensing element 110 of this embodiment may include a touch sensing element. For example, the touch sensing element of the sensing element 110 includes a sensing circuit disposed on the sensing surface 111 , such as a transparent conductive electrode or a patterned transparent conductive film. In some embodiments, the sensing circuit can be flexible, such as a touch sensor formed by patterning a conductive film formed of metal nanowire or carbon nanotube. electrode. In some embodiments, the sensing circuit is, for example, indium tin oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), cadmium tin oxide (Cadmium Tin Oxide, CTO) or aluminum doped zinc oxide (Aluminum Tin Oxide). -doped Zinc Oxide, AZO) made of transparent conductive film. As used herein, "metal nanowires" is a collective noun that refers to a collection of metal wires comprising a plurality of elemental metals, metal alloys, or metal compounds (including metal oxides), in which metal nanowires The number of wires does not affect the scope of protection claimed by the present invention; and at least one cross-sectional dimension (that is, the diameter of the cross-section) of a single metal nanowire is less than about 500nm, preferably less than about 100nm, and more preferably less than about 50nm; and The metal nanostructures referred to in the present invention as "wires" mainly have a high aspect ratio, such as between about 10 and 100,000. In more detail, the aspect ratio of the metal nanowire (length: The diameter of the cross-section) can be greater than about 10, preferably greater than about 50, and more preferably greater than about 100; the metal nanowires can be any metal, including (but not limited to) silver, gold, copper, nickel and gold-plated silver. Other terms, such as silk, fiber, tube, etc., are also within the scope of this application if they also have the above-mentioned dimensions and high aspect ratios.

The metal nanowires may include layers of silver nanowires, gold nanowires or copper nanowires. The specific method in this embodiment is: the dispersion liquid or slurry (ink) with metal nanowires is formed on the sensing element 110 by coating method, and dried so that the metal nanowires cover the sensing element 110 The surface is formed into a metal nanowire layer. After the above-mentioned curing/drying step, the solvent and other substances in the slurry are volatilized, and the metal nanowires are randomly distributed on the surface of the sensing element 110, and the metal nanowires can contact each other to provide a continuous current path. , and then form a conductive network (conductive network); and then pattern the metal nanowire layer to fabricate a sensing circuit.

In addition, a film layer can be coated with the metal nanowires to form a composite structure with certain specific chemical, mechanical, and optical properties, such as providing adhesion between the metal nanowires and the sensing element 110, or a better physical mechanism. Strength, so the film layer can also be called the matrix (matrix). On the other hand, some specific polymers are used to make the film layer, so that the metal nanowires have additional surface protection against scratches and abrasions. In this case, the film layer can also be called a hard coat (hard coat). ) or overcoat, using such as polyacrylate, epoxy resin, polyurethane, polysilane, polysiloxane, poly(silicon-acrylic acid), etc. can make metal nanowires have a higher Surface strength for improved scratch resistance. Furthermore, UV stabilizers (UV stabilizers) may be added to the film layer to improve the UV resistance of the metal nanowires. However, the above is only to illustrate the possibility of other additional functions/names of the film layer, and is not intended to limit the present application.

Please refer to Figure 2 and Figure 3 first. FIG. 2 and FIG. 3 respectively show top views of sensing circuits on different sensing elements 110 in different embodiments of the present invention. In Figures 2 and 3, similar elements are given similar reference numerals for simplicity of illustration.

FIG. 2 shows an embodiment of a single-sided sensing element 110 , in which a plurality of sensing electrodes SC arranged parallel to each other are disposed on the sensing surface 111 of the sensing element 110 . The sensing electrodes SC are connected to the flexible circuit element 130 through the peripheral lines PL. The sensing device 110 shown in FIG. 2 can be applied to the touch device (such as the touch device 100 ) of the present disclosure. When the user touches the touch element, the corresponding capacitance value is sent by the sensing electrode SC, and is transmitted to the external controller (not shown) through the flexible circuit element 130, so as to calculate the position touched by the user or its gestures.

FIG. 3 shows an embodiment of a double-sided sensing element 110, wherein a first sensing circuit C1 is disposed on the upper surface of the sensing element 110 (such as the sensing surface 111), and the sensing element 110 is relatively sensitive to the sensing element 110. The lower surface of the surface 111 (for example, the light-receiving surface 116 (refer to FIG. 1)) is provided with a second sensing circuit C2, which is represented by a dotted line in FIG. 3 and corresponds to the first sensing circuit C1 and the second sensing circuit C1. In the circuit C2 , peripheral lines PL are disposed on the upper and lower surfaces of the sensing element 110 , and the ends of the peripheral lines PL extend to the connection area 113 and are electrically connected to the flexible circuit element 130 as in the foregoing embodiments. In addition, the flexible circuit element 130 in this embodiment may have two extension plates, respectively connected to the peripheral lines PL on the upper and lower surfaces of the sensing element 110; therefore, the flexible circuit PL connected to the upper surface of the sensing element 110 The extension board of the type circuit element 130 is arranged in the aforesaid accommodating space, so its structural features are similar to those described in the aforesaid embodiments. In this implementation, the first sensing circuit C1 may be a circuit for transmitting driving signals, and the second sensing circuit C2 may be a circuit for transmitting touch sensing signals. The first sensing circuit C1 and the second sensing circuit C1 may The sensing circuits C2 extend alternately along the horizontal and vertical directions respectively, but the present invention is not limited thereto. In other embodiments, the first sensing circuit may be a circuit for transmitting touch sensing signals, and the second sensing circuit may be a circuit for transmitting driving signals. When the user touches the touch element, The capacitance value between the first sensing circuit C1 and the second sensing circuit C2 can be changed and transmitted to an external controller (not shown) through the flexible circuit element 130, so as to calculate the position touched by the user. position or its gesture.

In yet another embodiment, the first sensing circuit C1 and the second sensing circuit C2 can also be arranged on the sensing surface 111 or the light receiving surface 116 at the same time, and are insulated at the places where they intersect each other. function of location.

Go back to Figure 1. The optical element 120 includes a first transparent adhesive layer 121 , a polarizing layer 122 and a second transparent adhesive layer 123 . The first transparent adhesive layer 121 is disposed on the visible area 112 of the sensing surface 111 . The polarizing layer 122 is disposed on the first transparent adhesive layer 121 . The second transparent adhesive layer 123 is disposed on the polarizing layer 122 . In this embodiment, the first transparent adhesive layer 121, the polarizing layer 122 and the second transparent adhesive layer 123 are sequentially stacked on the visible area 112 of the sensing surface 111 along the first direction d1, and the first direction d1 parallel to the normal direction of the sensing surface 111 . The polarizing layer 122 may be a stretched polarizer.

The polarizing layer 122 may include a circular polarizer. The polarizing layer 122 may include a linear polarizer and a retardation film, wherein the retardation film may include a λ/4 film, or the retardation film may have a multilayer structure including a λ/4 film and a λ/2 film.

Each of the first transparent adhesive layer 121 and the second transparent adhesive layer 123 includes optical clear adhesive (OCA). The term "adhesive layer" used herein may include a bonding layer and an adhesion-promoting layer, and the adhesive layer may be formed using a pressure sensitive adhesive (PSA) composition or an optically clear adhesive (OCA) composition. , the term "light transmission" used herein means that the transmittance of light (such as visible light) is >85%, >88%, >90%, >95%, etc. The light-transmitting adhesive layer in the embodiment of the present invention can have proper adhesion, so that delamination, air bubbles, peeling, etc. will not occur when being bent and bent in the optical stack, and the light-transmitting adhesive layer can also have viscoelasticity for application for flexible displays. In an embodiment, the light-transmitting adhesive layer can be formed using an acrylate composition.

In some implementations, as shown in FIG. 4 , which is a cross-sectional view of the touch element 100' in an embodiment of the present invention, the polarizing layer 122 may include a coated polarizer. For example, the polarizing layer 122 may include a liquid crystal layer, and is directly coated between the transparent cover plate 140 and the sensing element 110 without the first transparent adhesive layer 121 and the second transparent adhesive layer 123 . In one embodiment, the liquid crystal composition can be coated on the surface of the transparent cover 140 to form a liquid crystal layer. That is to say, the polarizing layer 122 formed by the liquid crystal layer can directly contact the light-transmitting cover plate 140 and be assembled and fixed with the sensing element 110 . In one embodiment, the liquid crystal composition may include reactive liquid crystal compounds and dichroic dyes; the liquid crystal composition may further include solvents such as propylene glycol monomethyl ether acetate (PGMEA), xylene (Xylene ), methyl ethyl ketone (MEK) or chloroform, etc.

In another embodiment, as shown in FIG. 5 , which is a cross-sectional view of the touch element 100 ″ in an embodiment of the present invention, only one transparent adhesive layer can be used. For example, only the first light-transmitting adhesive layer 121 may be used without using the second light-transmitting adhesive layer 123 . Specifically, the aforementioned liquid crystal composition coating method can be used to directly form the polarizing layer 122 on the light-transmitting cover plate 140, and the sensing element 110 is formed by bonding the first light-transmitting adhesive layer 121 to the liquid crystal composition. on the polarizing layer 122.

In another embodiment, as shown in FIG. 6 , which is a cross-sectional view of the touch element 100''' in an embodiment of the present invention, only the second transparent adhesive layer 123 can be used instead of the first transparent adhesive layer. Photoresist layer 121 . Specifically, the above-mentioned liquid crystal composition coating method can be used to directly form the polarizing layer 122 on the sensing element 110, and the light-transmitting cover plate 140 is polarized by the second light-transmitting adhesive layer 123 and the liquid crystal composition. Layer 122 fits securely.

Go back to Figure 1. The flexible circuit element 130 may include a flexible printed circuit board (FPC). The touch element 100 may further include a conductive connection layer 160 . The conductive connection layer 160 is disposed between the flexible circuit element 130 and the connection portion of the peripheral line PL on the connection area 113 . The conductive connection layer 160 may include an anisotropic conductive film (ACF) with a thickness h5 of about 6 microns. Further, the thickness h5, the thickness h1 and the thickness of the fixing layer 150 are substantially the same as the thickness of the accommodating space.

Further, the flexible circuit element 130 may include a base layer 131 and a first metal layer 132 .

In this embodiment, the thickness h1 of the flexible circuit element 130 in the first direction d1 falls within a range of 30 microns to 43 microns. For example, in this embodiment, the thickness h2 of the base layer 131 is 25 micrometers; the thickness h3 of the first metal layer 132 is 12 micrometers. Therefore, the thickness of the flexible circuit element 130 is about 42.5 microns, and the thickness of the optical element 120 is about 53.8 microns (also equivalent to the thickness h4 of the accommodation space in the first direction d1), so the flexible circuit element 130 and The thickness of the conductive connection layer 160 will not exceed the optical element 120 , and the flexible circuit element 130 will not affect the configuration of the transparent cover plate 140 . In this embodiment, the thickness h1 of the flexible circuit element 130 accounts for about 79% of the thickness h4 of the accommodating space along the first direction d1.

Further, in this embodiment, the first metal layer 132 may include copper, and the first metal layer 132 is formed on the base layer 131 through a hole plating process; or the first metal layer 132 may further include an electroplating layer. Therefore, the thickness h1 of the flexible circuit element 130 can fall within the range of 30 microns to 45 microns (calculated, equivalent to about 55% of the thickness h4 (based on 53.8 microns) of the accommodating space in the first direction d1. % to 83%), but the present invention is not limited thereto. In other embodiments, the thickness h1 of the base layer 131 of the flexible circuit element 130 may also be about 10 to 15 microns (for example, about 12.5 microns), so as to provide a thinner flexible circuit element 130 (calculated, equivalent to It accounts for about 23% of the thickness h4 (calculated based on 53.8 μm) of the accommodating space in the first direction d1). In other embodiments, the thickness h1 of the base layer 131 of the flexible circuit element 130 may be about 12.5 microns, so as to provide a thinner flexible circuit element 130 and cooperate with a thinner optical element 120 (such as FIG. 6 The single-layer light-transmitting adhesive layer shown has a thickness of about 28.8 microns), after calculation, the thickness of the flexible circuit element 130 is equivalent to the thickness h4 of the accommodation space in the first direction d1 (calculated based on 28.8 microns ) of 45%. In other embodiments, the thickness h1 of the base layer 131 of the flexible circuit element 130 may be about 12.5 micrometers, so as to provide a thinner flexible circuit element 130 to match the thinner optical element 120 (such as shown in FIG. 6 The thickness of the single-layer light-transmitting adhesive layer shown is about 28.8 microns), and considering the thickness of the conductive connection layer 160 (about 6 microns), after calculation, the thickness of the flexible circuit element 130 is equivalent to occupying the accommodation space of about 55% of the thickness h4 (calculated based on 28.8 microns) in one direction d1, the thickness of the conductive connection layer 160 is equivalent to about 21% of the thickness h4 (calculated based on 28.8 microns) of the accommodating space in the first direction d1 , the thickness of the fixed layer 150 is equivalent to approximately 24% of the thickness h4 (based on 28.8 microns) of the accommodating space in the first direction d1.

The accommodating space defined by the transparent cover 140 , the optical element 120 and the sensing element 110 has a thickness h4 along the first direction d1 . The flexible circuit element 130 has a thickness h1 in the first direction d1, and the optical element 120 has a thickness h4 in the first direction d1. The thickness h4 is greater than the thickness h1, and the condition that the thickness h1 is 50% to 80% of the thickness h4 is selected so that the strength of the flexible circuit element 130 is sufficient for the subsequent hot pressing process, that is, the sensing element 110 and the flexible circuit element 130 solder pads are subjected to thermocompression soldering process. Therefore, after assembly, the flexible circuit element 130 will not interfere structurally with the light-transmitting cover plate 140 on the optical element 120 , and can meet the mechanical structure requirements of subsequent manufacturing processes.

Further, as shown in FIG. 1 , the connection space S1 has a thickness h6, which corresponds to the thickness h4 of the accommodating space defined by the light-transmitting cover plate 140, the optical element 120, and the sensing element 110 in the first direction d1. The thickness h1 of the flexible circuit element 130 in the first direction d1 is subtracted. In this embodiment, the fixing layer 150 disposed in the connection space S1 also has a thickness h6 in the first direction d1. Due to the thinned flexible circuit element 130, the thickness h6 of the fixing layer 150 in the connection space S1 along the first direction d1 is 10%-40% of the thickness h4 of the receiving space along the first direction d1. When the thickness h6 of the fixed layer 150 is less than 10% of the thickness h4 of the accommodating space, the fixed layer 150 may not be able to effectively fix the flexible circuit element 130, resulting in product reliability problems; while the thickness h6 is greater than the thickness h4 of the accommodating space When it is 40%, it may cause the flexible circuit element 130 to be too thin to perform the thermocompression welding process; in addition, the thickness of the conductive connection layer 160 accounts for about 10% of the thickness h4 of the accommodating space in the first direction d1~ 25%. To sum up, this application can mainly avoid the unexpected protrusion problem caused by the structural interference between the flexible circuit element 130 and the light-transmitting cover plate 140, and also proposes a good solution in view of product structural strength and process requirements. .

The touch element 100 of the embodiment of the present invention can be assembled with other electronic components to form a device/product, such as a display with touch function. For example, the sensing element 110 can be attached to the display element 210 (please refer to FIG. 7 ), For example, a liquid crystal display element or an organic light-emitting diode (OLED) display element can be bonded with optical glue or other similar adhesives. The touch element 100 of the embodiment of the present invention can be applied to electronic devices such as portable phones, tablet computers, notebook computers, etc., and can also be applied to flexible products. The touch element 100 of the embodiment of the present invention can also be fabricated in wearable devices (such as watches, glasses, smart clothes, smart shoes, etc.), vehicle devices (such as instrument panels, driving recorders, car rearview mirrors, car windows, etc. )superior.

FIG. 7 is a cross-sectional view of the touch display module in an embodiment of the present invention. Please refer to FIG. 7 , the touch display module 200 includes a display element 210 , a sensing element 110 , an optical element 120 , a flexible circuit element 130 , a transparent cover 140 and a fixed layer 150 . The configurations of the sensing element 110 , the optical element 120 , the flexible circuit element 130 , the light-transmitting cover 140 and the fixing layer 150 are similar to those of the above-mentioned touch element 100 , and will not be repeated here. The display element 210 has a display surface 211 , and the sensing element 110 is disposed on the display surface 211 , so the light-receiving surface 116 of the sensing element 110 can receive the image light L and let the image light L pass out from the sensing surface 111 .

In summary, since the touch element and the touch display module of the embodiment of the present invention include a flexible circuit element and a light-transmitting cover, and a connection space is formed between the flexible circuit element and the light-transmitting cover for fixing Layer configuration, so the flatness of the light-transmitting cover plate will not be affected by the flexible circuit components, and at the same time, the overall stability can be further increased.

d1: the first direction d2: second direction g: distance h1: thickness h2: thickness h3: thickness h4: thickness h5: thickness h6: thickness L: image light L1: distance S1: Connection Space S2: glue filling space SC: Sensing electrode C1: the first sensing circuit C2: Second sensing circuit BM: shading layer PA: Peripheral area 100,100’,100’’,100’’’: Touch elements 110: sensing element 111: sensing surface 112: Visual area 113: Connection area 114: edge 115: glue filling area 116: light receiving surface 120: Optical components 121: the first transparent adhesive layer 122: polarizing layer 123: the second light-transmitting adhesive layer 130: Flexible circuit components 131: basal layer 132: The first metal layer 140: Translucent cover 141: edge 150: fixed layer 160: Conductive connection layer 200:Touch display module 210: display components 211: display surface

Figure 1 is a cross-sectional view of a touch element in an embodiment of the present invention; Fig. 2 is a top view of a sensing element and a flexible circuit element in an embodiment of the present invention; Fig. 3 is a top view of a sensing element and a flexible circuit element in an embodiment of the present invention; Fig. 4 is a cross-sectional view of a touch element in an embodiment of the present invention; Fig. 5 is a cross-sectional view of a touch element in an embodiment of the present invention; Figure 6 is a cross-sectional view of a touch element in an embodiment of the present invention; and FIG. 7 is a cross-sectional view of the touch display module in an embodiment of the present invention.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

d1: the first direction

d2: second direction

g: distance

h1: thickness

h2: thickness

h3: thickness

h4: thickness

h5: thickness

h6: thickness

L1: distance

S1: Connection Space

S2: glue filling space

BM: shading layer

PA: Peripheral area

100: Touch element

110: sensing element

111: sensing surface

112: Visual area

113: Connection area

114: edge

115: glue filling area

116: light receiving surface

120: Optical components

121: the first transparent adhesive layer

122: polarizing layer

123: the second light-transmitting adhesive layer

130: Flexible circuit components

131: basal layer

132: The first metal layer

140: Translucent cover

141: edge

150: fixed layer

160: Conductive connection layer

Claims (14)

A touch element, comprising: a sensing element, the sensing element has a sensing surface, the normal direction of the sensing surface is parallel to a first direction; an optical element, configured on the sensing element above, including a first light-transmitting adhesive layer, a second light-transmitting adhesive layer and a polarizing layer, the first light-transmitting adhesive layer is arranged on the sensing surface of the sensing element, and the second The light-transmitting adhesive layer is disposed on the polarizing layer, and the polarizing layer is disposed between the first light-transmitting adhesive layer and the second light-transmitting adhesive layer; a light-transmitting cover plate is disposed on the optical element , wherein the light-transmitting cover plate, the optical element and the sensing element define an accommodating space; a flexible circuit element is arranged in the accommodating space, and the light-transmitting cover plate A connection space is formed between the flexible circuit element and a fixing layer is arranged to connect the light-transmitting cover plate and the flexible circuit element. The touch device according to claim 1, wherein the thickness of the fixed layer in the first direction is 10%-40% of the thickness of the accommodating space in the first direction. The touch element according to claim 1, comprising a visible area and a peripheral area, wherein the peripheral area has a connection area for setting the flexible circuit element, and the flexible circuit element and the There is a glue-filling area between the sensing elements, wherein the first light-transmitting glue layer is disposed on the visible area of the sensing surface of the sensing element. The touch element according to claim 3, further comprising a conductive connection layer disposed between the flexible circuit element and the connection area of the sensing surface, the conductive connection layer on the The thickness in the first direction is 10%-25% of the thickness of the accommodating space in the first direction. The touch element according to claim 1, wherein the thickness of the flexible circuit element in the first direction falls within the range of 30 microns to 43 microns, or the thickness of the flexible circuit element in the first direction The thickness in one direction falls within the range of 10 microns to 15 microns. The touch element according to claim 1, wherein the thickness of the flexible circuit element in the first direction is 50%-80% of the thickness of the accommodating space in the first direction. A touch element, comprising: a sensing element, the sensing element has a sensing surface, the normal direction of the sensing surface is parallel to a first direction; an optical element, configured on the sensing element above, including a first light-transmitting adhesive layer, a second light-transmitting adhesive layer and a polarizing layer, the first light-transmitting adhesive layer is arranged on the sensing surface of the sensing element, and the second a light-transmitting adhesive layer is disposed on the polarizing layer, and the polarizing layer is disposed between the first light-transmitting adhesive layer and the second light-transmitting adhesive layer; and A flexible circuit element connected to the sensing element, and the thickness of the flexible circuit element along the first direction is smaller than the thickness of the optical element along the first direction, wherein the touch The element further has an accommodating space, and the flexible circuit element is arranged in the accommodating space. The touch element according to claim 7, wherein the flexible circuit element has a fixed layer, and the thickness of the fixed layer in the first direction is equal to that of the accommodating space in the first direction. 10%~40% of the upward thickness. The touch element according to claim 7, comprising a visible area and a peripheral area, wherein the peripheral area has a connection area for setting the flexible circuit element, and the flexible circuit element and the There is a glue-filling area between the sensing elements, wherein the first light-transmitting glue layer is disposed on the visible area of the sensing surface of the sensing element. The touch element according to claim 9, further comprising a conductive connection layer disposed between the flexible circuit element and the connection area of the sensing surface, the conductive connection layer is on the The thickness in the first direction is 10%-25% of the thickness of the accommodating space in the first direction. The touch element according to claim 7, wherein the thickness of the flexible circuit element in the first direction falls within 30 microns to 43 microns The range of meters, or the thickness of the flexible circuit element in the first direction falls in the range of 10 microns to 15 microns. The touch element according to claim 7, wherein the thickness of the flexible circuit element in the first direction is 50%-80% of the thickness of the accommodating space in the first direction. A touch display module, comprising: a display element; and the touch element according to claim 1, wherein the touch element is pasted on the display element. A touch element, comprising: a sensing element, the sensing element has a sensing surface, the normal direction of the sensing surface is parallel to a first direction; a first transparent adhesive layer, the first A light-transmitting adhesive layer is disposed on the sensing surface of the sensing element; a polarizing layer; a second light-transmitting adhesive layer, the second light-transmitting adhesive layer is disposed on the polarizing layer, the The polarizing layer is arranged between the first transparent adhesive layer and the second transparent adhesive layer; a transparent cover is arranged on the second transparent adhesive layer, wherein the transparent cover, The polarizing layer and the sensing element define an accommodating space; a flexible circuit element is fixedly arranged in the accommodating space, and the The flexible circuit element is electrically connected to the sensing element.

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