TWI803048B - Plating apparatus and substrate cleaning method - Google Patents

Abstract

[Problem] The object of the present invention is to efficiently clean a substrate. [Solution] The plating module 400 includes: a plating tank 410, which constitutes a state for containing the plating solution; a substrate holder 440, which constitutes a state for holding the substrate Wf with the surface to be plated Wf-a facing downward; Mechanism 446, which constitutes a state in which the substrate holder 440 is rotated; a tilting mechanism 447, which constitutes a state in which the substrate holder 440 is inclined; The surface to be plated Wf-a is cleaned; wherein, the substrate cleaning member 472 constitutes a state in which cleaning liquid is discharged to the surface to be plated Wf-a of the substrate Wf, and the substrate Wf is tilted by the rotation mechanism 446 from and by the tilt mechanism 447. The position corresponding to the lower end of the substrate Wf is rotated toward the position corresponding to the upper end.

Description

Plating apparatus and substrate cleaning method

This case relates to a plating device and a contact piece cleaning method.

As an example of a plating apparatus, a cup type plating apparatus is known. The cup-type electroplating device immerses the substrate (such as a semiconductor wafer) held in the substrate holder with the surface to be plated facing down in the plating solution, and applies a voltage between the substrate and the anode, thereby depositing a conductive film on the surface of the substrate .

For example, Patent Document 1 discloses a cleaning device for cleaning a plated substrate. This cleaning device has a configuration in which a plurality of cleaning nozzles are arranged below the substrate along the radial direction of the substrate, and the cleaning liquid is discharged upward toward the surface to be plated while rotating the substrate, thereby washing off the plated surface adhering to the substrate. Coated plating solution, etc. [Prior Technical Literature] [Patent Document]

[Patent Document 1] Japanese Invention Patent No. 6934127

[Problem to be solved by the invention]

There is still room for improvement in terms of efficient cleaning of substrates in conventional plating devices.

That is, in the prior art, if the cleaning solution impacts the surface to be plated, the plating solution attached to the surface to be plated is washed away by the cleaning solution, and a part of it falls and is recovered, but the remaining part is deposited on the surface to be plated attached to the substrate. Directly following the rotation of the substrate, it moves to the downstream side of the cleaning area. The plating solution that has moved to the downstream side of the cleaning area is not washed off until the substrate rotates 360° and moves to the cleaning area again, so the cleaning process takes longer to fully clean the entire surface to be plated.

Therefore, one of the objectives of this case is to efficiently clean the substrate. [Means to solve the problem]

According to one embodiment, a plating device is disclosed, which includes: a plating tank, which constitutes a state for containing a plating solution; a substrate holder, which constitutes a state for holding a substrate with a plated surface facing downward; a rotating mechanism, It constitutes a mode for rotating the aforementioned substrate holder; a tilting mechanism, which constitutes a mode for tilting the aforementioned substrate holder; and a substrate cleaning member for cleaning the coated surface of the substrate held by the aforementioned substrate holder; Wherein the substrate cleaning member is configured to discharge cleaning liquid on the surface to be plated of the substrate, which is rotated by the rotation mechanism from a position corresponding to the lower end of the substrate tilted by the tilt mechanism toward a position corresponding to the upper end.

Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same reference numerals are assigned to the same or corresponding constituent elements, and overlapping descriptions are omitted. ＜Overall configuration of the coating equipment＞

FIG. 1 is a perspective view showing the overall configuration of a coating device of this embodiment. Fig. 2 is a plan view showing the overall configuration of the coating device of this embodiment. As shown in Figures 1 and 2, the plating device 1000 includes: a loading port 100, a transfer robot 110, an aligner 120, a prepreg module 300, a plating module 400, a spin rinse dryer (spin rinse dryer) 600, The transport device 700 and the control module 800 .

The loading port 100 is used to carry substrates stored in cassettes such as FOUP (Front Opening Unified Pod) not shown in the figure into the plating device 1000, or to carry substrates out of the plating device 1000 Mods for the box. In this embodiment, four load ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and it is configured to transport substrates between the load port 100 , the aligner 120 and the spin rinse dryer 600 . When the transfer robot 110 and the transfer device 700 transfer the substrate between the transfer robot 110 and the transfer device 700 , the transfer of the substrate can be performed through a temporary stand not shown in the figure.

The aligner 120 is a module for aligning the position of the orientation plane or notch of the substrate to a predetermined direction. In this embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary.

The pre-dip module 300 constitutes, for example, an aspect of performing a pre-dip treatment. The pre-dip treatment is to use a treatment solution such as sulfuric acid or hydrochloric acid to reduce the high density of the surface of the seed layer formed on the surface of the substrate to be plated before the plating treatment. The resistive oxide film is etched and removed to clean or activate the surface of the plated bottom layer. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of prepreg modules 300 are arbitrary. The plating module 400 performs plating treatment on the substrate. In this embodiment, there are two groups of 12 coating modules 400, totaling 24 coating modules 400. In each group, 3 coating modules 400 are arranged side by side in the vertical direction and 4 coating modules 400 are arranged side by side in the horizontal direction. , but the number and configuration of the plating modules 400 are arbitrary.

The spin rinse dryer 600 is a module for drying the cleaned substrate by rotating it at high speed. In the present embodiment, two spin rinsing and drying machines are arranged side by side in the vertical direction, but the number and arrangement of the spinning rinsing and drying machines are arbitrary. The transport device 700 is a device for transporting substrates between a plurality of modules in the coating device 1000 . The control module 800 is configured to control a plurality of modules of the coating device 1000, and it can be configured by, for example, a general computer or a dedicated computer having an input/output interface with an operator.

An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, the substrates stored in the cassette are loaded into the loading port 100 . Then, the transfer robot 110 takes out the substrate from the cassette of the load port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the position of the orientation plane of the board|substrate, a cutout, etc. in a predetermined direction. The transfer robot 110 sends and receives the substrate passing the alignment direction of the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the plating module 400 . The coating module 400 performs pre-wetting treatment on the substrate. The transport device 700 transports the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg treatment on the substrate. The conveying device 700 conveys the prepreg-treated substrate to the plating module 400 . The plating module 400 performs plating treatment on the substrate. Furthermore, the plating module 400 performs a cleaning process on the plated substrate.

The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600 . The spin rinse dryer 600 performs a drying process on the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 , and transfers the dried substrate to the cassette of the load port 100 . Finally, the cassette containing the substrate is carried out from the loading port 100 . ＜Composition of Plating Module＞

Next, the configuration of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same configuration, only one plating module 400 will be described. FIG. 3 is a longitudinal sectional view schematically showing the structure of the coating module 400 of this embodiment. As shown in FIG. 3 , the plating module 400 has a plating tank 410 for containing the plating solution. The coating tank 410 is a container having a cylindrical side wall and a circular bottom wall, and a circular opening is formed on the top thereof. Furthermore, the coating module 400 includes an overflow tank 405 arranged outside the upper opening of the coating tank 410 . The overflow tank 405 is a container for receiving the plating solution overflowing from the upper opening of the plating tank 410 .

The plating module 400 includes a membrane (membrane) 420 that partitions the inside of the plating tank 410 in the vertical direction. The inside of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by a diaphragm 420 . The cathode region 422 and the anode region 424 are respectively filled with plating solution. An anode 430 is disposed on the bottom surface of the plating tank 410 in the anode region 424 . A resistance body 450 facing the diaphragm 420 is disposed in the cathode region 422 . The resister 450 is a member for uniformly performing the plating process on the surface Wf-a to be plated of the substrate Wf, and is composed of a plate-shaped member formed with a large number of holes.

Furthermore, the coating module 400 includes a substrate holder 440 for holding the substrate Wf with the surface to be coated Wf-a facing downward. The coating module 400 includes a lift mechanism 442 for lifting the substrate holder 440 . The lifting mechanism 442 can be realized by known mechanisms such as motors, for example. Furthermore, the coating module 400 includes a rotation mechanism 446 that rotates the substrate holder 440 so as to rotate the substrate Wf around a virtual rotation axis extending perpendicular to the center of the surface to be coated Wf-a. The rotation mechanism 446 can be realized by a known mechanism such as a motor, for example.

The plating module 400 is configured in such a way that the substrate Wf is immersed in the plating solution in the cathode area 422 using the lifting mechanism 442, and a voltage is applied between the anode 430 and the substrate Wf while rotating the substrate Wf using the rotating mechanism 446. In this way, the plating process is performed on the surface Wf-a to be plated of the substrate Wf.

Furthermore, the coating module 400 includes a tilt mechanism 447 configured to tilt the substrate holder 440 . The tilting mechanism 447 can be realized by known mechanisms such as tilting (tilt) mechanism, for example.

The coating module 400 includes: a cover member 460 disposed above the coating tank 410 ; and a cleaning device 470 for cleaning the substrate Wf held by the substrate holder 440 . The cover member 460 and the cleaning device 470 will be described below. ＜Cover member＞

FIG. 4 is a perspective view schematically showing the composition of the coating module of this embodiment. FIG. 5A is a perspective view schematically showing the cover member of the coating module of this embodiment. FIG. 5B is a top view schematically showing the cover member of the coating module of this embodiment. Fig. 6 is a longitudinal sectional view schematically showing the cover member of the coating module of the present embodiment.

As shown in FIGS. 4 to 6 , the cover member 460 has a cylindrical side wall 461 disposed above the plating tank 410 . The side wall 461 is arranged to surround the lifting path of the substrate holder 440 . Also, the cover member 460 has a bottom wall 462 connected to the lower end of the side wall 461 . The bottom wall 462 is a plate-shaped member covering the outer portion of the upper opening of the plating tank 410 than the side wall 461 .

As shown in FIGS. 4 to 6 , an exhaust port 464 is formed on the bottom wall 462 . As shown in FIG. 6 , the exhaust port 464 communicates with the outside of the space in the coating module 400 provided with components such as the coating tank 410 , the substrate holder 440 , and the cover member 460 . Therefore, the ambient gas generated by the atomization of the plating solution in the plating tank 410 (plating solution ambient gas) is discharged to the outside of the plating module 400 through the exhaust port 464 . In addition, the example of forming the exhaust port 464 on the bottom wall 462 is shown in this embodiment, but it is not limited thereto, and the exhaust port 464 can also be formed on at least one of the side wall 461 and the bottom wall 462 .

As shown in FIGS. 5A and 5B , an opening 461 a is formed in the side wall 461 of the cover member 460 . The opening 461 a becomes a passage for the cleaning device 470 to move between the outside and the inside of the side wall 461 . The coating module 400 includes an opening and closing mechanism 467 configured to open and close the opening 461 a.

The opening and closing mechanism 467 includes a first door panel 468-1 and a second door panel 468-2 for opening and closing the opening 461a. The first door panel 468 - 1 and the second door panel 468 - 2 are arranged side by side along the circumferential direction of the side wall 461 . The first door panel 468-1 is rotatably supported by a rotating shaft 468-1a provided at one side end of the opening 461a. The second door panel 468-2 is rotatably supported by a rotating shaft 468-2a provided at the other end of the opening 461a.

The opening and closing mechanism 467 includes: a first door panel driving member 469-1, used to make the first door panel 468-1 rotate toward the inside of the cover member 460; and a second door panel driving member 469-2, used to make the second door panel 468 -2 is rotationally moved towards the inside of the cover member 460 . The first door panel driving member 469-1 and the second door panel driving member 469-2 can be realized by known mechanisms such as motors, for example.

According to this embodiment, cleaning of the substrate Wf and suppression of the ambient gas of the plating solution in the plating bath 410 from being discharged into the plating module 400 can be performed simultaneously. That is, by setting the cover member 460, the upper opening of the plating tank 410 is covered by the bottom wall 462, the side wall 461 and the substrate holder 440, so the plating solution ambient gas in the plating tank 410 can be prevented from being plated. The upper opening of the tank 410 is drained. Moreover, an exhaust port 464 is formed on the bottom wall 462 , so the ambient gas of the coating solution in the coating tank 410 is discharged to the outside of the coating module 400 through the exhaust port 464 . Thereby, rusting or corrosion of various parts and wiring arranged in the coating module 400 can be suppressed.

In addition, an opening 461a is formed on the side wall 461, and the opening 461a can be opened and closed by the first door panel 468-1 and the second door panel 468-2. Therefore, when the substrate Wf is not being cleaned, the first door driving member 469-1 and the second door driving member 469-2 can close the opening 461a to suppress the discharge of the plating solution ambient gas. On the other hand, when cleaning the substrate Wf, the first door driving member 469-1 and the second door driving member 469-2 can open the opening 461a, thereby moving the cleaning device 470 to the inside of the cover member 460. , so cleaning processing can be performed. The details of the cleaning process using the cleaning device 470 will be described below.

In addition, although the example which rotated and moved the 1st door panel 468-1 and the 2nd door panel 468-2 toward the inside of the cover member 460 was shown in the said embodiment, it is not limited to this. 7A and 7B are perspective views schematically showing a cover member of a modification. FIG. 7A and FIG. 7B have shown the state which opened the opening 461a by the 1st door panel 468-1 and the 2nd door panel 468-2.

As shown in FIG. 7A , the first door panel 468 - 1 and the second door panel 468 - 2 may be attached to the side wall 461 so as to move along the circumferential direction of the side wall 461 . The first door panel driving member 469 - 1 may also be configured to slide the first door panel 468 - 1 along the circumferential direction of the side wall 461 of the cover member 460 . The second door panel driving member 469 - 2 may also be configured to slide the second door panel 468 - 2 along the circumferential direction of the side wall 461 of the cover member 460 .

As shown in FIG. 7B , the first door panel 468 - 1 and the second door panel 468 - 2 may be attached to the side wall 461 so as to move vertically along the side wall 461 . The first door panel driving member 469 - 1 may be configured to slide the first door panel 468 - 1 in the vertical direction along the side wall 461 of the cover member 460 . The second door panel driving member 469 - 2 may be configured to slide the second door panel 468 - 2 in the vertical direction along the side wall 461 of the cover member 460 . ＜Cleaning device＞

Next, the cleaning device 470 will be described. FIG. 8 is a top view schematically showing the composition of the coating module of this embodiment. As shown in FIG. 3 , FIG. 4 and FIG. 8 , the cleaning device 470 includes a substrate cleaning member 472 for cleaning the plated surface Wf-a of the substrate Wf held by the substrate holder 440 . The substrate cleaning unit 472 includes a plurality of (four in this embodiment) substrate cleaning nozzles 472 a. When the substrate cleaning member 472 is arranged at the cleaning position, the plurality of substrate cleaning nozzles 472a are arranged along the radial direction of the substrate Wf or in a direction intersecting the rotation direction of the substrate Wf. A pipeline 471 is connected to the substrate cleaning member 472 . Cleaning liquid (for example, pure water) supplied from a liquid source not shown in the figure is sent to the substrate cleaning member 472 through the pipeline 471, and is discharged from a plurality of substrate cleaning nozzles 472a.

Furthermore, the cleaning device 470 includes a contact cleaning member 482 for cleaning a contact member for supplying power to the substrate Wf held by the substrate holder 440 . The contact cleaning member 482 includes a contact cleaning nozzle 482 a for discharging cleaning liquid. A pipe 481 is connected to the contact cleaning member 482 . Cleaning liquid (for example, pure water) supplied from a liquid source not shown in the figure is sent to the contact cleaning member 482 through the pipeline 481, and is discharged from the contact cleaning nozzle 482a. The details of the cleaning of the contact member using the contact cleaning member 482 will be described below.

The cleaning device 470 includes a driving mechanism 476 configured to rotate the arm portion 474 . The drive mechanism 476 can be implemented by known mechanisms such as motors, for example. The arm portion 474 is a plate-like member extending in the horizontal direction from the drive mechanism 476 . The substrate cleaning member 472 and the contact cleaning member 482 are held on the arm portion 474 . The drive mechanism 476 is configured to rotate the arm portion 474 to move the substrate cleaning member 472 and the contact cleaning member 482 between the cleaning position and the retracted position. The cleaning position is between the plating tank 410 and the substrate holder 440. The retracted position is a position retracted from between the plating tank 410 and the substrate holder 440 . 8 shows a state in which the substrate cleaning member 472 and the contact cleaning member 482 are disposed at the retracted position by solid lines, and a state in which the substrate cleaning member 472 and the contact cleaning member 482 are disposed at the cleaning position is represented by dotted lines.

As shown in FIGS. 4 and 8 , the cleaning device 470 includes a tray member 478 disposed below the substrate cleaning member 472 . The tray member 478 is a container configured to receive the cleaning liquid that is discharged from the substrate cleaning member 472 and hits the surface Wf-a to be plated of the substrate Wf and falls. In addition, the tray member 478 is configured to receive the cleaning liquid that is discharged from the contact cleaning member 482 and falls after colliding with the contact member. In this embodiment, the substrate cleaning member 472 , the contact cleaning member 482 and the arm portion 474 are integrally housed in the tray member 478 . The drive mechanism 476 is configured to rotate between the cleaning position and the retracted position together with the substrate cleaning member 472 , the contact cleaning member 482 , the arm portion 474 , and the tray member 478 . However, the drive mechanism 476 may also be configured to drive the substrate cleaning member 472 , the contact cleaning member 482 , the arm portion 474 , and the tray member 478 separately.

As shown in FIG. 4 , a fixed tray member 484 is disposed below the tray member 478 . The cleaning solution falling into the tray member 478 will fall into the fixed tray member 484 . A drain pipe 488 is attached to the fixed tray member 484 . The cleaning liquid falling into the fixed tray member 484 is discharged through the drain pipe 488 .

The cleaning device 470 is equipped with a conductivity meter 486 for measuring the conductivity of the cleaning liquid falling into the tray member 478 . Specifically, the conductivity meter 486 is disposed at the place where the cleaning liquid of the fixed tray member 484 flows. The plating module 400 can measure the conductivity of the cleaning liquid in the fixed tray member 484 to know the extent of the plating liquid contained in the cleaning liquid, that is, the progress of the cleaning process. The plating module 400 can, for example, determine the end of the cleaning process according to the conductivity of the cleaning solution measured by the conductivity meter 486 . ＜Cleaning of substrate＞

After finishing the plating process, the plating module 400 lifts the substrate holder 440 from the plating tank 410 by the lifting mechanism 442 and arranges the substrate holder 440 at a position surrounded by the cover member 460 (side wall 461 ). As shown by the dotted line in FIG. 8 , the coating module 400 disposes the substrate cleaning member 472 at the cleaning position. Thereby, the substrate cleaning nozzle 472a is directed toward the surface to be coated Wf-a of the substrate Wf. In addition, the coating module 400 rotates the substrate holder 440 through the rotation mechanism 446 . The rotation mechanism 446 is configured to rotate the substrate holder 440 at a rotation speed of 1 rpm to 20 rpm, for example. Furthermore, the coating module 400 cleans the surface to be coated Wf-a of the substrate Wf while the substrate holder 440 is tilted by the tilt mechanism 447 . This point is explained below.

FIG. 9 is a top view schematically showing the composition of the coating module of this embodiment. Fig. 10 is a longitudinal sectional view schematically showing the constitution of the coating module of this embodiment. Fig. 11 is an enlarged longitudinal sectional view schematically showing a part of the configuration of the coating module of the present embodiment.

As shown in FIG. 10, the substrate holder 440 has: a support mechanism 494 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf; a back plate assembly 492 for clamping the substrate Wf together with the support mechanism 494; The shaft 491 extends vertically upward from the back plate assembly 492 . The supporting mechanism 494 is a ring-shaped member having an opening at the center for exposing the plated surface Wf-a of the substrate Wf, and is lifted and held by the column member 496 .

The back plate assembly 492 includes a disk-shaped floating plate 492 - 2 for clamping the substrate Wf together with the supporting mechanism 494 . The floating plate 492-2 is disposed on the back side of the surface to be plated Wf-a of the substrate Wf. Also, the back plate assembly 492 includes a disk-shaped back plate 492-1 disposed above the floating plate 492-2. In addition, the back plate assembly 492 is equipped with: a floating mechanism 492-4, used to push the floating plate 492-2 to a direction away from the back surface of the substrate Wf; The pressing force presses the floating plate 492-2 to the back surface of the substrate Wf.

The floating mechanism 492-4 includes a compression spring installed between the upper end of the shaft extending upward from the floating plate 492-2 through the back plate 492-1 and the back plate 492-1. The floating mechanism 492-4 is configured as follows: by the compression reaction force of the compression spring, the floating plate 492-2 is lifted up through the shaft and pushed away from the back surface of the substrate Wf.

The pressing mechanism 492-3 is configured in such a way that the fluid is supplied to the floating plate 492-2 through the flow path formed inside the back plate 492-1, thereby pressing the floating plate 492-2 below. When the fluid is supplied, the pressing mechanism 492-3 presses the substrate Wf to the supporting mechanism 494 with a stronger force than the pressing force formed by the floating mechanism 492-4.

As shown in FIG. 11 , the support mechanism 494 includes an annular support member 494 - 1 for supporting the outer periphery of the plated surface Wf - a of the substrate Wf. The support member 494-1 has a flange 494-1a protruding from the outer periphery of the lower surface of the back plate assembly 492 (floating plate 492-2). An annular seal member 494-2 is disposed on the flange 494-1a. The sealing member 494-2 is an elastic member. The supporting member 494-1 supports the outer peripheral portion of the surface to be plated Wf-a of the substrate Wf via the sealing member 494-2. The substrate Wf is held between the sealing member 494-2 and the floating plate 492-2, thereby sealing between the support member 494-1 (substrate holder 440) and the substrate Wf.

The support mechanism 494 includes: an annular base 494-3 attached to the inner peripheral surface of the support member 494-1; and an annular conductive member 494-5 attached to the upper surface of the base 494-3. The pedestal 494-3 is, for example, a conductive member such as stainless steel. The conductive member 494-5 is, for example, a conductive annular member such as copper.

The support mechanism 494 includes a contact member 494-4 for supplying power to the substrate Wf. The contact member 494-4 is annularly attached to the inner peripheral surface of the pedestal 494-3 by screws or the like. The support member 494-1 holds the contact member 494-4 through the pedestal 494-3. The contact member 494-4 has a conductive member for supplying power to the substrate Wf held by the substrate holder 440 from a power source not shown in the figure. The contact member 494-4 has: a plurality of substrate contacts 494-4a contacting the outer periphery of the plated surface Wf-a of the substrate Wf; and a body part 494-4b extending above the substrate contacts 494-4a.

When the substrate Wf is subjected to the plating process, the substrate Wf is sandwiched between the sealing member 494-2 and the back plate assembly 492, thereby sealing the support member 494-1 and the substrate Wf.

As shown in FIGS. 9 and 10 , the tilt mechanism 447 tilts the substrate holder 440 . Accordingly, the substrate Wf held by the substrate holder 440 is also inclined. In addition, for convenience of description, illustration of components such as the tray member 478 is omitted in FIG. 9 .

The substrate cleaning member 472 is disposed facing an area where the substrate Wf tilted by the tilt mechanism 447 and rotated by the rotation mechanism 446 has an upward rotation component. In other words, the substrate cleaning member 472 is configured such that the substrate Wf rotated by the rotation mechanism 446 is cleaned from the position Lo corresponding to the lower end of the substrate Wf tilted by the tilt mechanism 447 toward the position Hi corresponding to the upper end. The plated surface Wf-a discharges the cleaning solution.

The plurality of substrate cleaning nozzles 472a are fan-shaped nozzles, which are dispersed as they are farther from the front end of the substrate cleaning nozzle 472a, and discharge cleaning liquid in a fan shape. Also, as shown in FIG. 9, a plurality of substrate cleaning nozzles 472a are configured in such a manner that the cleaning liquids ejected from adjacent substrate cleaning nozzles 472a are shown by arrow A in the figure without colliding with each other. The rotation direction of the substrate Wf partially overlaps. Thereby, the whole to-be-plated surface Wf-a of the board|substrate Wf can be cleaned.

FIG. 12A is a diagram schematically showing the relationship between the rotation direction of the substrate and the arrangement of substrate cleaning nozzles. As shown in FIG. 12A , the substrate cleaning member 472 and the substrate cleaning nozzle 472a can discharge cleaning liquid toward the surface to be plated Wf-a of the substrate Wf while being inclined similarly to the inclination of the substrate Wf. FIG. 12B is a diagram showing a variation example of the discharge direction of the cleaning liquid from the substrate cleaning nozzle. As shown in FIG. 12B , regardless of whether the substrate Wf is tilted, the substrate cleaning nozzle 472a can spout the cleaning liquid vertically upward.

According to this embodiment, the substrate Wf can be cleaned efficiently. That is, if the cleaning solution hits the surface to be plated with the substrate Wf in a horizontal state, the plating solution adhering to the surface to be plated is washed away by the cleaning solution, and a part of it falls and is recovered, while the remaining part is deposited on the surface to be plated. In the state of the plated surface of the substrate, it moves to the downstream side of the cleaning area directly following the rotation of the substrate. The plating solution moved to the downstream side of the cleaning area is not cleaned until the substrate rotates 360° and moves to the cleaning area again, so the cleaning process takes longer to fully clean the entire surface to be plated.

On the other hand, according to the present embodiment, since the substrate Wf is inclined, the plating solution washed away by the cleaning solution flows in an inclined direction (downward in FIG. 9 ) due to gravity. Also, according to the present embodiment, the cleaning solution is discharged to the region of the substrate Wf that rotates with an upward component, so the cleaned region of the substrate Wf rotates with an upward component (in the direction of arrow A in FIG. 9 ). Therefore, as shown in FIG. 9 , in a plan view, the angle formed by the flow direction of the plating solution washed away by the cleaning solution and the rotation direction of the cleaned area on the substrate Wf is about 180°. That is, the direction in which the cleaned area on the substrate Wf rotates is opposite to the direction in which the plating solution flows, so the cleaned area on the substrate Wf is less likely to be mixed with the plating solution. As a result, the entire plated area can be fully cleaned in a short time. cover.

Fig. 13 is a graph showing the results of cleaning performed in the present embodiment and cleaning performed in the comparative example. In FIG. 13 , the vertical axis represents the amount of contamination remaining on the plated surface Wf-a of the substrate Wf (the amount of plating solution), and the horizontal axis represents the cleaning time (how many times the substrate holder has been rotated). In FIG. 13, graph α represents the amount of pollution caused by this embodiment, and graph β represents the amount of pollution caused by the comparative example. The comparative example shows the amount of contamination when the cleaning process is performed with the rotation speed of the substrate holder 440 unchanged (10 rpm) and the rotation direction reversed.

As shown in FIG. 13 , in the comparative example, contamination remained even after the substrate holder 440 was rotated twice. On the other hand, compared with the comparative example, the amount of contamination in this embodiment was reduced in a shorter time, and the amount of contamination was almost zero when the substrate holder 440 was rotated twice. Thus, according to the present embodiment, the substrate Wf can be cleaned efficiently.

In addition, in this embodiment, as shown in FIG. 9, in a plan view, the angle formed by the flow direction of the plating solution washed away by the cleaning solution and the rotation direction of the cleaned area on the substrate Wf is about 180°. example, but not limited to. For example, if the substrate cleaning member 472 is arranged in the region A shown by the dotted line in FIG. In this case, the direction in which the cleaned region on the substrate Wf rotates is the same as the direction in which the plating solution flows, so the effect of this embodiment (the comparative example described above) cannot be obtained. If the substrate cleaning member 472 is arranged in the B region, the angle is 90°, and if the substrate cleaning member 472 is arranged in the C region, the angle is 270°. In this case, the effect of this embodiment is limited.

On the other hand, if the angle is greater than 90° and less than 270°, the cleaned area on the substrate Wf is less likely to be mixed with the plating solution. Therefore, the substrate cleaning member 472 can make the angle larger than 90° and smaller than 270°, in other words, for the surface to be coated of the substrate rotated from the position Lo corresponding to the lower end of the inclined substrate Wf toward the position Hi corresponding to the upper end (FIG. The area clamped by the one-point chain line AA-AA of 9) spits out the cleaning solution. Also, if the substrate cleaning member 472 makes the angle greater than 135° and less than 225°, in other words, if the cleaning liquid is discharged to the area sandwiched by the chain line BB-BB in FIG. good.

In addition, in the above-mentioned embodiment, the example in which the cleaning process was performed with the substrate Wf tilted was shown, but it is not limited thereto. Fig. 14 is a side view schematically showing the configuration of a plating module according to a modification. The basic configuration of the coating module of this modification is the same as that of the above-mentioned embodiment, so the description of the same configuration will be omitted, and only the different configuration will be described.

As shown in FIG. 14 , the plating module 400 of this modification is configured to perform the cleaning process while keeping the surface to be plated Wf - a of the substrate Wf substantially horizontal without inclining the substrate holder 440 . Further, the substrate cleaning member 472 is configured to discharge the cleaning liquid having a velocity component in a direction opposite to the rotation direction of the substrate Wf rotated by the rotation mechanism 446 .

Specifically, the substrate cleaning member 472 and the substrate cleaning nozzle 472a are arranged inclined so that the discharge direction of the cleaning liquid is opposite to the rotation direction of the substrate Wf. In this state, the substrate cleaning member 472 discharges the cleaning liquid toward the surface Wf-a to be plated of the substrate Wf, thereby efficiently cleaning the substrate Wf.

That is, by discharging the cleaning solution as in this modification, the cleaning solution collides with the surface to be plated Wf-a of the substrate Wf, and the plating solution adhering to the surface to be plated Wf-a is rushed toward the upstream side in the rotation direction of the substrate. Falls to one side and is recovered. On the other hand, the cleaned area on the substrate Wf is rotated to the downstream side in the substrate rotation direction. Therefore, the direction in which the cleaned region on the substrate Wf rotates is opposite to the direction in which the plating solution flows, so that the cleaned region on the substrate Wf is less likely to be mixed with the plating solution. As a result, the entire substrate Wf can be sufficiently cleaned in a short time. plated surface.

In this modification, all (four) substrate cleaning nozzles 472a arranged on the substrate cleaning member 472 discharge the cleaning liquid having a velocity component opposite to the rotation direction of the substrate Wf, so the above-mentioned effect can be obtained. Assuming that a part of the substrate cleaning nozzles 472a arranged in the substrate cleaning member 472 discharges the cleaning solution having a velocity component along the direction of the rotation direction of the substrate Wf, the plating solution washed away by the cleaning solution flows toward the direction of the rotation direction of the substrate. Downstream, therefore, the cleaned area on the substrate Wf is likely to be mixed with the plating solution, and it is difficult to obtain the above-mentioned effect or reduce the effect.

In addition, in the above-mentioned embodiment, an example in which four substrate cleaning nozzles 472a are arranged on the substrate cleaning member 472 is shown, but it is not limited thereto. Fig. 15A is a plan view schematically showing the configuration of a plating module according to a modification. FIG. 15B is a schematic side view viewed from the arrow B direction of the coating module shown in FIG. 15A . In FIG. 15, the description of the structure overlapping with the embodiment of FIG. 9 is omitted.

As shown in FIG. 15A , the substrate cleaning unit 472 includes a plurality (four) of substrate cleaning nozzles 472 a and a seal cleaning nozzle 472 b arranged on the outer peripheral side of the substrate than the plurality of substrate cleaning nozzles 472 a. The seal cleaning nozzle 472b is used to clean the sealing member 494-2 used to seal between the substrate holder 440 and the substrate Wf.

The seal cleaning nozzle 472b is a fan-shaped nozzle, which is configured to be vertically upward and inclined to discharge the cleaning liquid toward the direction of the substrate holder 440 located at a relatively high position in a fan-like state. The seal washing nozzle 472b is configured to discharge the washing liquid having a velocity component in a direction along the direction of the seal member 494 rotating in the direction indicated by the arrow A in FIG. 15A toward the inner peripheral surface of the seal member 494-2. -2 the direction of rotation.

According to this modification, the sealing member 494-2 can be cleaned efficiently. That is, in the region indicated by the dotted line 473 in FIG. 15A , the cleaning liquid ejected from the substrate cleaning nozzle 472a hits the substrate and falls along the inclination of the substrate. As a result, a thick liquid film of the cleaning liquid is formed on the inner peripheral surface of the sealing member 494-2 in the region indicated by the dotted line 473 . Therefore, when the cleaning liquid is jetted from the seal cleaning nozzle 472b toward the downward sealing member 494-2 in FIG. 2. As a result, the cleaning efficiency of the sealing member 494-2 becomes poor.

In contrast, in this modification, the seal cleaning nozzle 472b is configured to discharge the cleaning liquid toward the sealing member 494-2 installed at a relatively high position of the inclined substrate holder 440 . Therefore, no liquid film is formed or the liquid film is thin on the inner peripheral surface of the sealing member 494-2 impacted by the cleaning liquid, so the sealing member 494-2 can be cleaned with sufficient impact force, and as a result, the sealing member can be cleaned efficiently. 494-2.

In addition, according to this modification, it is possible to suppress an increase in size of the tray member 478 . That is, if the cleaning liquid is discharged from the seal cleaning nozzle 472b toward the downward sealing member 494-2 in FIG. The liquid film is washed away in the direction indicated by the dotted arrow 475 . In this way, there is a possibility that the washed-off liquid film may spill to the outside of the front end portion 478a of the tray member 478 . In order to prevent cleaning liquid from spilling from the tray member 478, it is conceivable to increase the size of the tray member 478 by enlarging the front end portion 478a, etc., but this is not preferable from the viewpoint of enlarging the entire device or interfering with other parts.

On the other hand, according to this modification, the seal cleaning nozzle 472b is configured to discharge the cleaning liquid toward the inner peripheral surface of the sealing member 494-2 in the region where the liquid film is less likely to accumulate. Therefore, the liquid film accumulated in the area indicated by the dotted line 473 is not easily washed away, so that the cleaning liquid is not easily spilled from the tray member 478, and as a result, the size of the tray member 478 can be suppressed from being enlarged.

In addition, in the modification example shown in FIG. 15, the example in which the seal wash nozzle 472b is a fan nozzle was shown, but it is not limited to this. Fig. 16A is a plan view schematically showing the configuration of a plating module of a modification. Fig. 16B is a schematic side view viewed from the arrow B direction of the coating module shown in Fig. 16A. In FIG. 16 , description of configurations that overlap with those of the modification example in FIG. 15 is omitted.

As shown in FIG. 16A , the seal cleaning nozzle 472b may be a straight nozzle that discharges the cleaning liquid linearly. According to this modification, similar to the modification of FIG. 15 , the sealing member 494 - 2 can be cleaned efficiently, and the size increase of the tray member 478 can be suppressed.

In addition, although the above description shows an example in which the substrate cleaning member 472 is used to wash off the plating liquid from the surface Wf-a to be plated of the substrate Wf after the plating process, the present invention is not limited thereto. The coating module 400 can also use the substrate cleaning component 472 to perform pre-wetting treatment. That is, the plating module 400 can use the substrate cleaning member 472 to wet the surface to be plated Wf-a of the substrate Wf before the plating process with a processing liquid such as pure water or degassed water, thereby cleaning the surface of the substrate Wf formed on the surface of the substrate. The air inside the pattern is replaced with the treatment liquid.

In addition, in the above description, the example in which the tray member 478 constitutes the whole housing of the substrate cleaning member 472, the contact cleaning member 482, and the arm portion 474 was shown, but the present invention is not limited thereto. 17A to 17C are top views schematically showing a tray member of a modification.

As shown in FIG. 17A , the tray member 478A of the modified example may also include the following members: a substantially circular first tray 478A-1 arranged at a position corresponding to the center of the inclined substrate Wf; a substantially circular first tray 478A-1; 2. The tray 478A-2 is disposed at a position corresponding to the lower end of the inclined substrate Wf; and the connecting tray 478A-3 connects the first tray 478A-1 and the second tray 478A-2. A drain line 478A- 4 is connected to the center of the first tray 478A- 1 , and the cleaning solution and plating solution flowing into the drain line 478A- 4 fall into the fixed tray member 484 .

The substrate Wf held by the substrate holder 440 is deflected and the center becomes slightly lower, so the cleaning solution discharged to the plated surface Wf-a of the substrate Wf flows to the center of the substrate Wf or to the lower end of the inclined substrate Wf. . Regarding this point, in this modification example, the first tray 478A-1 is arranged at a position corresponding to the center of the substrate Wf, and the second tray 478A-2 is arranged at a position corresponding to the lower end of the inclined substrate Wf, so that Efficiently recover cleaning fluid.

As shown in FIG. 17B , a tray member 478B of a modification includes an L-shaped tray 478B- 1 disposed at positions corresponding to the center and lower end of the inclined substrate Wf. A drain line 478B- 2 is connected to the L-shaped tray 478B- 1 , and the cleaning liquid and plating liquid flowing into the drain line 478B- 2 fall into the fixed tray member 484 . Also in this modification, since the L-shaped tray 478B-1 is disposed at positions corresponding to the center and the lower end of the substrate Wf, the cleaning liquid can be recovered efficiently.

As shown in FIG. 17C , a tray member 478C of a modification includes a plurality (five in this modification) of triangular trays 478C- 1 . The plurality of triangular trays 478C-1 are vertically stacked and arranged to be rotatable around the top of each tray 478C-1. A drain line 478C- 2 is connected to the plurality of triangular trays 478C- 1 , and the cleaning liquid and plating liquid flowing into the drain line 478C- 2 fall into the fixed tray member 484 . When the plurality of triangular trays 478C-1 are arranged at the cleaning position shown in FIG. 17C , they are arranged at different rotation angles to form a fan shape as a whole. Thereby, since a plurality of triangular trays 478C-1 are arranged at positions corresponding to the center and the lower end of the substrate Wf, the cleaning liquid can be recovered efficiently. On the other hand, when the plurality of triangular trays 478C- 1 are arranged at the retracted position, they are respectively arranged at the same rotation angle, thereby reducing the installation space of the tray member 478C. ＜Cleaning of contact parts＞

Next, cleaning of the contact member mounted on the substrate holder 440 will be described. Fig. 18 is a diagram schematically showing cleaning of the contact member with the plating module of this embodiment. The description of the same components as those described using FIG. 11 is omitted.

As described using FIG. 11 , when the substrate Wf is subjected to the plating process, the support member 494 - 1 and the substrate Wf can be sealed by sandwiching the substrate Wf between the sealing member 494 - 2 and the back plate assembly 492 . However, if there is a slight gap between the sealing member 494-2 and the substrate Wf, the plating solution may penetrate and adhere to the contact member 494-4. Also, when the substrate Wf is raised after the plating process, the plating solution may drop from the substrate Wf and adhere to the contact member 494-4.

Then, as shown in FIG. 18 , the contact cleaning member 482 (contact cleaning nozzle 482 a ) is configured to discharge cleaning liquid from below the substrate holder 440 toward the main body portion 494 - 4 b of the contact member. Specifically, when cleaning the contact member 494-4, the back plate assembly 492 is disposed at a higher position than the position surrounded by the contact member 494-4, which is not shown in FIG. 18 . The contact cleaning member 482 is configured to discharge cleaning liquid to the main body portion 494 - 4 b through the opening of the supporting mechanism 494 (supporting member 494 - 1 ). The contact cleaning nozzle 482a is a fan nozzle configured to discharge the cleaning liquid in a fan shape. 18 shows an example in which the contact cleaning nozzle 482a discharges the cleaning liquid at an elevation angle of about 45° with respect to the horizontal plane, but the present invention is not limited thereto, and the discharge angle of the cleaning liquid is arbitrary. The cleaning solution impacting the main body 494-4b will flow downward from the main body 494-4b due to gravity, so the plating solution adhering to the main body 494-4b and the substrate contact 494-4a is washed off and recovered to the tray member 478 .

According to this embodiment, the contact member can be cleaned with a simple structure. That is, in this embodiment, the contact cleaning member 482 is arranged at the cleaning position below the substrate holder 440 by the driving mechanism 476, and the opening of the supporting mechanism 494 (supporting member 494-1) is opposite to the main body portion 494-4b. Spit out the cleaning fluid. Therefore, it is not necessary to use a brush to clean the contact member or to arrange a nozzle on the side or upper side of the contact member, so that the contact member can be cleaned with a simple structure.

In the above-mentioned embodiment, the example in which the cleaning fluid discharged from the contact cleaning nozzle 482a directly hits the main body 494-4b is shown, but the present invention is not limited thereto. Fig. 19 is a diagram schematically showing cleaning of the contact member with the coating module of this embodiment. As shown in FIG. 19 , in this embodiment, when cleaning the contact member 494 - 4 , the back plate assembly 492 (floating plate 492 - 2 ) is arranged at a position surrounded by the contact member 494 - 4 .

The contact cleaning member 482 discharges cleaning liquid toward the lower surface of the back plate assembly 492, and directs the cleaning liquid that hits the lower surface of the back plate assembly 492 and bounces back toward the main body 494-4b. The cleaning liquid that hits the lower surface of the back plate assembly 492 and bounces back will flow downward from the main body 494-4b due to gravity after impacting the main body 494-4b. Thereby, the plating solution adhering to the main body portion 494 - 4 b and the substrate contact 494 - 4 a falls together with the cleaning solution and is recovered to the tray member 478 .

According to this embodiment, the contact member can be cleaned with a simple structure similarly to the above-mentioned embodiment. In addition, according to the present embodiment, rusting of metal members (such as the conductive member 494 - 5 ) mounted on the substrate holder 440 can be suppressed. That is, when cleaning the contact member 494-4, in the technique of disposing the contact cleaning member 482 above or on the side of the contact member 494-4, the contact cleaning member 482 contacts the back plate assembly 492. Doubts, so the back plate assembly 492 is retracted to a higher position. In this way, the cleaning solution discharged from the contact cleaning member 482 and hits the contact member 494 - 4 splashes and adheres to the metal member (for example, the conductive member 494 - 5 ), possibly causing rust. In order to prevent the cleaning liquid from splashing and adhering to the metal member, it is not preferable to precisely control the arrangement position of the contact cleaning member 482 , the discharge angle of the cleaning liquid, the discharge intensity of the cleaning liquid, and the like.

On the other hand, in this embodiment, the contact cleaning member 482 is arranged below the substrate holder 440 , and the cleaning solution is discharged from below the substrate holder 440 . Therefore, a space can be separated at the position surrounded by the contact member 494-4, so the back plate assembly 492 can be disposed in this space. As shown in Figure 19, the back plate assembly 492 becomes the wall portion opposite to the metal member (such as the conductive member 494-5) above the contact member 494-4, so the cleaning ejected from the contact cleaning member 482 can be suppressed. Liquid splashes onto metal components. As a result, according to this embodiment, the contact member 494-4 can be easily cleaned without precisely controlling the arrangement position of the contact cleaning member 482, the discharge angle of the cleaning liquid, the discharge intensity of the cleaning liquid, and the like.

Although the example in which the contact member 494-4 is cleaned while the substrate holder 440 is horizontal has been described above, the present invention is not limited thereto. Fig. 20 is a diagram schematically showing cleaning of contact members by the plating module of this embodiment.

As shown in FIG. 20 , the contact cleaning member 482 can also clean the contact member 494 - 4 while the substrate holder 440 is tilted by the tilt mechanism 447 . In this case, as shown in FIG. 20 , the contact cleaning member 482 can discharge cleaning liquid toward the body portion 494-4b of the contact member 494-4 installed on the opposite side by tilting the tilt mechanism 447. on the substrate holder 440 at the lower position.

In addition, in the above-mentioned embodiment, the example in which the cleaning liquid is discharged in a fan shape from the contact cleaning nozzle 482a is shown, but the present invention is not limited thereto. Fig. 21 is a diagram schematically showing a modified example of the contact cleaning nozzle. As shown in FIG. 21, the contact cleaning nozzle 482a' of the modified example may be a straight nozzle that discharges cleaning liquid in a straight line. By using a straight nozzle, it is possible to spout the cleaning liquid for a position aiming at the body portion 494-4b of the contact member 494-4. <Board cleaning method and contact cleaning method>

Next, the method of cleaning the substrate and the method of cleaning the contacts in this embodiment will be described. FIG. 22 is a flow chart showing the method for cleaning the substrate and the method for cleaning the contacts in this embodiment. The flowchart of FIG. 22 shows each process after the substrate Wf held by the substrate holder 440 is dipped in the plating tank 410 to perform the plating process. Also, the flow chart of FIG. 22 shows a substrate cleaning method and a contact cleaning method using the plating module shown in FIG. 15 or FIG. 16 .

In the substrate cleaning method, after the plating process is completed, the substrate holder 440 is raised from the plating tank 410 by using the lifting mechanism 442, and the substrate holder 440 is disposed at a position surrounded by the cover member 460 (side wall 461) (lifting step 102).

Next, in the substrate cleaning method, the first door panel 468 - 1 and the second door panel 468 - 2 arranged in the opening 461 a of the side wall 461 of the cover member 460 are moved to open the opening 461 a (opening step 104 ). As shown in FIG. 5B , the opening step 104 can rotate and move the first door panel 468 - 1 and the second door panel 468 - 2 toward the inside of the cover member 460 . But not limited thereto, as shown in FIG. 7A , the opening step 104 can also make the first door panel 468 - 1 and the second door panel 468 - 2 slide along the circumferential direction of the side wall 461 of the cover member 460 . In addition, as shown in FIG. 7B , in the opening step 104 , the first door panel 468 - 1 and the second door panel 468 - 2 may be slid up and down along the side wall 461 of the cover member 460 .

Next, in the substrate cleaning method, the substrate cleaning nozzle 472 a is directed toward the surface to be plated Wf - a of the substrate Wf (step 106 ). Also, in the substrate cleaning method, the seal cleaning nozzle 472 b is directed toward the sealing member 494 - 2 (step 107 ). In addition, step 106 and step 107 are described as separate steps for convenience, but step 106 and step 107 are executed by the first moving step using the drive mechanism 476 by opening the step 104 to open the opening 461 a to move the cleaning device 470 (the substrate cleaning member 472 and the contact member cleaning member 482 ) to the cleaning position.

Next, in the substrate cleaning method, the substrate holder 440 (and the substrate Wf) is tilted using the tilt mechanism 447 (tilting step 108 ). Next, in the substrate cleaning method, the substrate holder 440 (and the substrate Wf) is rotated using the rotation mechanism 446 (rotation step 110 ). In addition, the opening step 104 , the tilting step 108 and the rotating step 110 may be executed in different order, or may be executed simultaneously.

Next, in the substrate cleaning method, the cleaning liquid is discharged to the plated surface Wf-a of the substrate Wf by the rotation step 110 from the position Lo corresponding to the lower end of the substrate Wf tilted by the tilt step 108 toward The position Hi corresponding to the upper end is rotated (substrate cleaning step 112 ). The plating solution attached to the surface to be plated Wf-a is cleaned by the substrate cleaning step 112 . In addition, the substrate cleaning step 112 may also discharge cleaning liquid having a velocity component opposite to the rotation direction of the rotating substrate. In this case, the substrate Wf may also be kept horizontal, and therefore the tilting step 108 may not be performed.

Also, in the substrate cleaning method, the cleaning liquid having a velocity component in a direction along the rotation direction of the sealing member 494-2 rotated by the rotating step 110 is discharged from the seal cleaning nozzle 472b toward the inner peripheral surface of the sealing member 494-2. (Seal wash step 113). The plating solution adhering to the inner peripheral surface of the sealing member 494-2 is washed away by the seal cleaning step 113. In addition, for convenience, the substrate cleaning step 112 and the seal cleaning step 113 are described as separate steps, but the two steps can also be performed simultaneously.

Next, in the substrate cleaning method, according to the conductivity of the cleaning solution measured by the conductivity meter 486 , the discharge of the cleaning solution to the plated surface Wf - a of the substrate Wf is stopped (stopping step 114 ). That is, the plating solution adhering to the surface Wf-a to be plated of the substrate Wf is washed away by the cleaning solution, falls into the tray member 478, and is discharged through the fixed tray member 484. At this time, the conductivity of the cleaning solution is measured by the conductivity meter 486 . If the measured electrical conductivity is low enough, it can be known that the amount of the plating solution contained in the cleaning solution is sufficiently reduced, that is, it can be known that the cleaning process has been completed, so the substrate cleaning method can end the substrate cleaning.

Next, in the contact cleaning method, the substrate holder 440 (and the substrate) tilted by the tilting step 108 is returned to the state before tilting, that is, the horizontal state (tilting release step 116 ). Next, in the contact cleaning method, the rotation of the substrate holder 440 rotated by the rotation step 110 is stopped (rotation stop step 118 ). In addition, the execution order of the tilt release step 116 and the rotation stop step 118 may be changed, or may be executed simultaneously.

Next, in the contact cleaning method, the backplate assembly 492 is raised to take out the substrate Wf from the substrate holder 440 (substrate takeout step 120 ). Next, in the contact cleaning method, the contact cleaning nozzle 482 a is directed toward the contact member 494 - 4 mounted on the substrate holder 440 (step 121 ). In addition, for the sake of convenience, in step 121, it is described that the contact cleaning nozzle 482a is directed toward the contact member 494-4, but step 121 is executed by the above-mentioned first moving step.

Next, in the contact cleaning method, the back plate assembly 492 is lowered and arranged at a position surrounded by the contact member 494 - 4 (arrangement step 122 ). Next, in the contact cleaning method, the substrate holder 440 (and the substrate Wf) is tilted using the tilt mechanism 447 (tilt step 124 ). Next, in the contact cleaning method, the substrate holder 440 (and the substrate Wf) is rotated using the rotation mechanism 446 (rotation step 126 ). In addition, the configuration step 122 , the tilting step 124 and the rotation step 126 can be executed in different order, or can be executed at the same time.

Next, in the contact cleaning method, cleaning liquid is discharged from the contact cleaning member 482 arranged below the substrate holder 440 toward the main body portion 494 - 4 b of the contact member 494 - 4 (contact cleaning step 128 ). The contact cleaning step 128 is performed on the contact member 494 - 4 mounted on the substrate holder 440 tilted by the tilting step 124 in a relatively lower position. Specifically, as shown in FIG. 20 , in the contact cleaning step 128, the cleaning solution can be spit out toward the lower surface of the backplane assembly 492, and the cleaning fluid that hits the lower surface of the backplane assembly 492 and bounces back toward the body portion 494 -4b. However, the present invention is not limited thereto, and the contact cleaning step 128 may also directly discharge the cleaning liquid from the contact cleaning nozzle 482 a to the main body 494 - 4 b. The plating solution attached to the contact member 494 - 4 is cleaned by the contact cleaning step 128 .

Next, in the contact cleaning method, if the conductivity of the cleaning solution measured by the conductivity meter 486 is less than a predetermined threshold, the substrate holder 440 (and the substrate) tilted by the tilting step 124 is returned to the state before tilting , that is, the horizontal state (tilt release step 130). Next, in the contact cleaning method, the cleaning liquid is discharged to the main body portion 494 - 4 b of the contact member 494 - 4 of the substrate holder 440 which is horizontalized by the tilt releasing step 130 (wetting step 132 ). The wetting step 132 is a step of uniformly wetting the entire contact member 494-4 with a cleaning solution (pure water) to avoid uneven power supply during the subsequent plating process.

After cleaning of the substrate Wf and cleaning of the contact member 494 - 4 , in the substrate cleaning method, the cleaning device 470 (the substrate cleaning member 472 and the contact cleaning member 482 ) is moved to the withdrawn position (second moving step 134 ). Next, in the substrate cleaning method, the first door panel 468 - 1 and the second door panel 468 - 2 are moved to the opening 461 a of the side wall 461 of the cover member 460 to close the opening 461 a (closing step 136 ).

Several embodiments of the present invention have been described above, but the embodiments of the invention described above are intended to facilitate the understanding of the present invention and are not intended to limit the present invention. This invention can be changed and improved unless it deviates from the summary, and it goes without saying that this invention also includes the equivalent. In addition, in the range where at least part of the above-mentioned problems can be solved or at least a part of the effect can be exhibited, the respective constituent elements described in the claims and the specification can be arbitrarily combined or omitted.

This case discloses a plating device as an implementation form, which includes: a plating tank, which constitutes a state for accommodating a plating solution; a substrate holder, which constitutes a state for holding a substrate with a plated surface facing downward; a rotating mechanism, It constitutes a mode for rotating the aforementioned substrate holder; a tilting mechanism, which constitutes a mode for tilting the aforementioned substrate holder; and a substrate cleaning member for cleaning the coated surface of the substrate held by the aforementioned substrate holder; Wherein the substrate cleaning member is configured to discharge cleaning liquid on the surface to be plated of the substrate, which is rotated by the rotation mechanism from a position corresponding to the lower end of the substrate tilted by the tilt mechanism toward a position corresponding to the upper end.

Moreover, this case discloses a coating device as an implementation form, which further includes a driving mechanism, and the driving mechanism constitutes an aspect for moving the aforementioned substrate cleaning member between the cleaning position and the retracted position; the cleaning position is in the aforementioned A position between the coating tank and the aforementioned substrate holder; the retracted position is a position retracted from between the aforementioned coating tank and the aforementioned substrate holder.

Moreover, this application discloses a coating device as an implementation form, which further includes a tray member, which is arranged below the substrate cleaning member and configured to receive the cleaning liquid spouted and dropped from the substrate cleaning member. Sample.

Furthermore, this application discloses a plating device as an implementation form, which further includes a conductivity meter for measuring the conductivity of the cleaning solution falling into the aforementioned tray member.

Furthermore, this application discloses a coating device as an embodiment, wherein the substrate cleaning member includes a plurality of substrates arranged in a direction intersecting with the rotation direction of the substrate when the substrate cleaning member is arranged at the cleaning position Clean nozzles.

Furthermore, this case discloses a coating device as an implementation form, wherein the aforementioned substrate holder includes a sealing member for sealing between the aforementioned substrate holder and the aforementioned substrate, and the substrate cleaning member further includes seal cleaning Nozzle, the seal cleaning nozzle is arranged on the outer peripheral side of the substrate than the plurality of substrate cleaning nozzles, and is used to clean the sealing member. The direction is along the rotation direction of the aforementioned sealing member that is rotated by the aforementioned rotating mechanism.

Furthermore, this case discloses a coating device as an implementation form, wherein the plurality of substrate cleaning nozzles respectively form a state in which the cleaning liquid is ejected into a fan shape from the front ends of the substrate cleaning nozzles, and constitute the cleaning solution from the adjacent substrates. The aspect in which the cleaning liquids discharged from the cleaning nozzles partially overlap in the rotation direction of the substrate without colliding with each other.

Furthermore, this application discloses a coating device as an embodiment, wherein the rotation mechanism is configured to rotate the substrate holder at a rotation speed of 1 rpm to 20 rpm.

Furthermore, this case discloses a substrate cleaning method as an implementation form, which includes: the step of directing the substrate cleaning nozzle toward the downward coated surface of the substrate held by the substrate holder; the tilting step of tilting the substrate holder a rotating step of rotating the aforementioned substrate holder; and a substrate cleaning step of spouting a cleaning liquid from the aforementioned substrate cleaning nozzle against the surface to be plated of the substrate by the aforementioned rotating step from the substrate tilted by the aforementioned tilting step The position corresponding to the lower end rotates toward the position corresponding to the upper end.

Furthermore, this application discloses a substrate cleaning method as an implementation form, which further includes: the step of directing the seal cleaning nozzle towards the sealing member, and the sealing member is used to seal between the aforementioned substrate holder and the aforementioned substrate; and seal cleaning The step of discharging from the seal cleaning nozzle the cleaning liquid having a velocity component in a direction along the rotation direction of the sealing member rotated by the rotation step.

Furthermore, this case discloses a plating device as an implementation form, which includes: a plating tank, which constitutes a state for containing a plating solution; a substrate holder, which constitutes a state for holding a substrate with a plated surface facing downward; A rotating mechanism that rotates the aforementioned substrate holder; and a substrate cleaning member that cleans the coated surface of the substrate held by the aforementioned substrate holder; The aspect of the amount of cleaning liquid is that the direction is opposite to the direction of rotation of the substrate rotated by the above-mentioned rotation mechanism.

100: Loading port 110: Handling robot 120: aligner 300: Prepreg module 400: Plating module 405: overflow tank 410: Plating tank 420: Diaphragm 422: cathode area 424: anode area 430: anode 440: Substrate holder 442: lifting mechanism 446: Rotary Mechanism 447: tilt mechanism 450: resistance body 460: cover body component 461: side wall 461a: opening 462: bottom wall 464: Exhaust port 467: opening and closing mechanism 468-1: 1st door panel 468-1a: Axis of rotation 468-2: 2nd door panel 468-2a: Axis of rotation 469-1: 1st door panel drive member 469-2: 2nd door panel drive member 470: cleaning device 471: pipeline 472: Substrate cleaning components 472a: Substrate cleaning nozzle 472b: Seal wash nozzle 473: dotted line 474: arm 475: dotted arrow 476: drive mechanism 478: Pallet component 478A: Pallet member 478A-1: 1st pallet 478A-2: The second pallet 478A-3: link tray 478A-4: Drain Line 478a: front end 478B: Pallet components 478B-1: Tray 478B-2: Drain line 478C: Pallet components 478C-1: Triangular Tray 478C-2: Drain line 481: pipeline 482: Contact cleaning components 482a: Contact cleaning nozzle 484: Fixed pallet component 486: Conductivity Meter 488: drain pipe 491:Rotary axis 492: Backplane Assembly 492-1: Backplane 492-2: floating plate 492-3: Press attachment mechanism 492-4: Floating mechanism 494: Support mechanism 494-1: Support member 494-1a: Flange 494-2: sealing member 494-3: Pedestal 494-4: Contact member 494-4a: Substrate contact 494-4b: body part 494-5: Conductive member 496: column member 600: Spin Rinse Dryer 700: Handling device 800: Control module 1000: Plating device α: chart β: Chart Hi: Location Lo: location Wf: Substrate Wf-a: plated surface

FIG. 1 is a perspective view showing the overall configuration of a coating device of this embodiment. Fig. 2 is a plan view showing the overall configuration of the coating device of this embodiment. Fig. 3 is a longitudinal sectional view schematically showing the constitution of the coating module of this embodiment. FIG. 4 is a perspective view schematically showing the composition of the coating module of this embodiment. FIG. 5A is a perspective view schematically showing the cover member of the coating module of this embodiment. FIG. 5B is a top view schematically showing the cover member of the coating module of this embodiment. Fig. 6 is a longitudinal sectional view schematically showing the cover member of the coating module of the present embodiment. Fig. 7A is a perspective view schematically showing a cover member of a modification. Fig. 7B is a perspective view schematically showing a cover member of a modification. FIG. 8 is a top view schematically showing the composition of the coating module of this embodiment. FIG. 9 is a top view schematically showing the composition of the coating module of this embodiment. Fig. 10 is a longitudinal sectional view schematically showing the constitution of the coating module of this embodiment. Fig. 11 is an enlarged longitudinal sectional view schematically showing a part of the configuration of the coating module of the present embodiment. FIG. 12A is a diagram schematically showing the relationship between the rotation direction of the substrate and the arrangement of substrate cleaning nozzles. FIG. 12B is a diagram showing a variation example of the discharge direction of the cleaning liquid from the substrate cleaning nozzle. Fig. 13 is a graph showing the results of cleaning performed in the present embodiment and cleaning performed in the comparative example. Fig. 14 is a side view schematically showing the configuration of a plating module according to a modification. Fig. 15A is a plan view schematically showing the configuration of a plating module according to a modification. FIG. 15B is a schematic side view viewed from the arrow B direction of the coating module shown in FIG. 15A . Fig. 16A is a plan view schematically showing the configuration of a plating module of a modification. Fig. 16B is a schematic side view viewed from the arrow B direction of the coating module shown in Fig. 16A. Fig. 17A is a top view schematically showing a tray member of a modification. Fig. 17B is a top view schematically showing a tray member of a modification. Fig. 17C is a top view schematically showing a tray member of a modification. Fig. 18 is a diagram schematically showing cleaning of the contact member with the plating module of this embodiment. Fig. 19 is a diagram schematically showing cleaning of the contact member with the coating module of this embodiment. Fig. 20 is a diagram schematically showing cleaning of contact members by the plating module of this embodiment. Fig. 21 is a diagram schematically showing a modified example of the contact cleaning nozzle. FIG. 22 is a flow chart showing the method for cleaning the substrate and the method for cleaning the contacts in this embodiment.

400: Plating module 405: overflow tank 410: Plating tank 420: Diaphragm 422: cathode area 424: anode area 430: anode 440: Substrate holder 442: lifting mechanism 446: Rotary Mechanism 447: tilt mechanism 450: resistance body 460: cover body component 470: cleaning device 472: Substrate cleaning components 472a: Substrate cleaning nozzle 474: arm 476: drive mechanism 478: Pallet component Wf: Substrate Wf-a: plated surface

Claims (11)

A coating device comprising: a coating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a plated surface facing downward; a rotating mechanism configured to rotate the substrate holder the aspect of the substrate holder; the tilting mechanism, which constitutes the aspect of tilting the aforementioned substrate holder; and the substrate cleaning member, which is used to clean the plated surface of the substrate held by the aforementioned substrate holder after the substrate plating process; wherein the aforementioned The substrate cleaning means is configured to discharge cleaning liquid to the surface to be plated of the substrate that is rotated by the rotation mechanism from a position corresponding to the lower end of the substrate tilted by the tilt mechanism toward a position corresponding to the upper end, wherein The above-mentioned substrate cleaning member, when the substrate is cleaned, if the plated surface of the substrate is viewed from below, the angle formed by the flow direction of the plating solution washed away by the cleaning liquid and the rotation direction of the area of the substrate cleaned by the above-mentioned substrate cleaning member The system is greater than 135° and less than 225°. The coating device according to claim 1, further comprising a driving mechanism configured to move the aforementioned substrate cleaning member between a cleaning position and a retracted position; the cleaning position is held between the aforementioned coating tank and the aforementioned substrate The position between the implements; the withdrawn position is a position withdrawn from between the aforementioned coating tank and the aforementioned substrate holder. The coating apparatus according to claim 1 or 2, further comprising a tray member disposed below the substrate cleaning member and configured to receive the cleaning liquid discharged and dropped from the substrate cleaning member. The coating device according to claim 3, further comprising a conductivity meter for measuring the conductivity of the cleaning solution falling into the tray member. The coating apparatus according to claim 2, wherein the substrate cleaning member includes a plurality of substrate cleaning nozzles arranged in a direction intersecting with a rotation direction of the substrate when the substrate cleaning member is arranged at the cleaning position. The coating device according to claim 5, wherein the substrate holder includes a sealing member for sealing between the substrate holder and the substrate, and the substrate cleaning member further includes a seal cleaning nozzle, and the seal cleaning nozzle is larger than The plurality of substrate cleaning nozzles are arranged on the outer peripheral side of the substrate to clean the sealing member, and the sealing cleaning nozzles discharge the cleaning liquid having a velocity component in one direction along the The rotation direction of the aforementioned sealing member in which the rotation mechanism rotates. The coating device according to claim 5 or 6, wherein the plurality of substrate cleaning nozzles are configured to discharge the cleaning liquid into a fan shape from the front ends of the substrate cleaning nozzles, and constitute the nozzles ejected from the adjacent substrate cleaning nozzles. A state in which cleaning solutions partially overlap in the rotation direction of the substrate without colliding with each other. The coating apparatus according to claim 1, wherein the rotation mechanism is configured to rotate the substrate holder at a rotation speed of 1 rpm to 20 rpm. A method for cleaning a substrate, comprising: a step of directing a substrate cleaning nozzle toward the downward-facing plated surface of a substrate held by a substrate holder; a tilting step of tilting the aforementioned substrate holder; a rotating step of rotating the aforementioned substrate holder; a substrate cleaning step of spouting a cleaning solution from the aforementioned substrate cleaning nozzle to the plated surface of the substrate corresponding to the lower end of the substrate tilted by the aforementioned tilting step by the aforementioned rotating step The position of the substrate is rotated toward the position corresponding to the upper end; and the step of arranging the aforementioned substrate cleaning nozzle, so that when the substrate is cleaned, if the plated surface of the substrate is viewed from below, the flow direction of the plating solution washed away by the cleaning solution is the same as that of the aforementioned The angle formed by the rotation direction of the area of the substrate cleaned by the substrate cleaning nozzle is larger than 135° and smaller than 225°. The substrate cleaning method according to claim 9, further comprising: a step of directing the seal cleaning nozzle toward a sealing member, and the sealing member is used to seal between the substrate holder and the substrate; and a seal cleaning step, from the seal cleaning nozzle Discharging the cleaning fluid having a velocity component in a direction along the rotation direction of the aforementioned sealing member rotated by the aforementioned rotating step. The coating apparatus according to claim 1, wherein the substrate cleaning member is configured to discharge the cleaning liquid having a velocity component in a direction opposite to the rotation direction of the substrate rotated by the rotation mechanism.

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