TWI802723B - Evaporation process jig - Google Patents

Abstract

An evaporation process jig is disclosed, which includes a carrier and an upper cover. The carrier is for carrying at least one work piece. At least one buffer member is disposed on edge of a first surface of the upper cover. The buffer member is protruding out of the first surface. The hardness of buffer member is smaller than the hardness of work piece. The upper cover is disposed on the carrier with the first surface facing the carrier and the buffer member is against the work piece.

Description

Evaporation process fixture

The invention relates to an improved design of a vapor deposition process fixture, in particular to a vapor deposition process fixture which can prevent workpieces from being damaged during the vapor deposition process.

During the evaporation process of workpieces (such as wafers), the production line personnel need to put the workpiece into the carrier tray of the evaporation fixture, cover the upper cover of the evaporation fixture, then put it into the evaporation pot, and then start Perform evaporation process.

When the evaporation process is over, the production line personnel take out the workpiece from the carrier tray, and then put the workpiece into the workpiece rotating box.

In the above vapor deposition process, it is easy to cause workpiece abnormality. Taking the wafer as an example, the thinned wafer is easily damaged by external force. For example, when the upper cover of the evaporation fixture is covered, because the upper cover is directly pressed against the wafer, it is easy to cause the wafer to be damaged. damage. In addition, due to some external force, such as the external force exerted by the operator during the operation, or the external force generated when the evaporation pot rotates during the evaporation process, the wafer is easily damaged. However, none of the current evaporation process fixtures can effectively reduce and control the occurrence rate of the above abnormalities.

Accordingly, how to have an "evaporation process jig" that can prevent workpieces from being damaged during the evaporation process is an urgent problem to be solved by people in the relevant technical field.

In one embodiment, the present invention provides an evaporation process jig, comprising: a carrier plate for carrying at least one workpiece; and an upper cover with at least one buffer member disposed on the periphery of a first surface thereof. , the cushioning piece protrudes from the first surface, the hardness of the cushioning piece is smaller than that of the workpiece, the first surface of the upper cover faces the carrying plate and is arranged on the carrying plate, and the cushioning piece presses against the workpiece.

1: Evaporation process fixture

10: Upper cover

11, 11A, 11B: the first side

111, 111A, 111B: groove

12, 12A, 12B: Buffer

20: carrying plate

30: Workpiece

31: invalid area

H, HA, HB: Height

W, WA: radial width

WB: cross section size

Fig. 1 is a schematic diagram of an exploded structure of an embodiment of the present invention.

FIG. 2 is a schematic diagram of an exploded structure of the top cover of the embodiment in FIG. 1 .

Fig. 3 is a schematic cross-sectional structure diagram of the embodiment in Fig. 1 .

FIG. 4 is a schematic diagram of the structure of the upper cover disposed on the carrier tray in the embodiment of FIG. 1 .

Fig. 5 is a schematic diagram of the bottom structure of another embodiment of the top cover of the present invention.

Fig. 6 is a schematic diagram of the A-A sectional structure of the embodiment in Fig. 5 .

Fig. 7 is a schematic diagram of the bottom structure of another embodiment of the top cover of the present invention.

Fig. 8 is a schematic diagram of the B-B sectional structure of the embodiment in Fig. 7 .

Referring to FIG. 1 to FIG. 3 , an evaporation process jig 1 provided by the present invention includes an upper cover 10 and a carrier plate 20 . The carrier plate 20 is used for carrying the workpiece 30 . The upper cover 10 is provided with a buffer member 12 on a periphery of a first surface 11 thereof. In this embodiment, on the first surface 11 of the upper cover 10 An annular groove 111 is provided, and an annular buffer member 12 is arranged in the groove 111 .

2 and 3, the cushioning member 12 is embedded in the groove 111, and the buffering member 12 protrudes from the first surface 11 to a height H. The range of the height H is not limited, for example, it can be between 0.1 and 3 kg. centimeter range. The buffer member 12 has a radial width W, and the size of the radial width W is not limited, for example, it may be within a range of 1-2.5 mm. There is an ineffective area 31 at the periphery of the workpiece 30 , and the position of the buffer member 12 corresponds to the inactive area 31 . The size of the ineffective area 31 is not limited. As far as the wafer is concerned, the inactive area is about 3 mm from the periphery of the wafer.

Regarding the cushioning member 12 that can be used in this case, its material is not limited, for example, it can be one of rubber or foam. Furthermore, the material of the buffer member 12 can be one of silicone rubber (silicone) or fluororubber (FKM, Viton).

Since the buffer member 12 directly presses against the workpiece 30 , the hardness of the buffer member 12 must be smaller than that of the workpiece 30 , for example, the hardness of the buffer member 12 can range from 30 to 90 degrees of Shore Hardness.

In addition, the buffer member 12 has heat-resistant properties, for example, the heat-resistant temperature can be in the range of −20°C to 290°C, so as to be suitable for high-temperature evaporation process.

3 and 4, after the workpiece 30 is placed in the carrier tray 20, the first surface 11 of the upper cover 10 is placed on the carrier tray 20 toward the carrier tray 20, and the buffer member 12 is pressed against the workpiece 30. The invalid area 31 is shown in FIG. 4 . Then, the operator can send the evaporation process jig 1 carrying the workpiece 30 into the evaporation pot (not shown in the figure), and then start the evaporation process.

Since the hardness of the buffer member 12 is smaller than that of the workpiece 30 and the buffer member 12 is made of elastic rubber or foam, the upper cover 10 can avoid direct contact with the workpiece 30 to cause damage to the workpiece 30 .

Please refer to FIG. 5 and FIG. 6 , in this embodiment, the first surface 11A of the upper cover 10A is provided with a circular groove 111A, and a plurality of arc-shaped buffer members 12A are arranged in the groove 111A. The height HA of the buffer member 12A protruding from the first surface 11A is in the range of 0.1-3 mm. The radial width WA of each arc-shaped buffer member 12A is in the range of 1-2.5 mm.

Please refer to FIG. 7 and FIG. 8 , in this embodiment, the first surface 11B of the upper cover 10B is provided with a plurality of grooves 111B, and a columnar buffer member 12B is arranged in each groove 111B. The height HB of the buffer element 12B protruding from the first surface 11B is in the range of 0.1-3 mm. The cross-sectional dimension WB of each columnar buffer member 12B is in the range of 1-2.5 mm.

It must be noted that the length of the buffer member 12A in FIG. 5 can be changed as required, and the number is not limited to the four in the figure. Moreover, the circular groove 111A in FIG. 5 can also be provided with a post as in FIG. In addition, the shape of the groove 111B in FIG. 7 corresponds to the shape of the buffer 12B, and is not limited to the cylindrical shape shown in the figure.

Looking at the embodiments shown in Fig. 3, Fig. 5 and Fig. 7, although the appearance of the buffer is slightly different, they all do not deviate from the main technical features of the present invention, that is, the buffer is protrudingly arranged on one side of the upper cover, and the upper cover is covered. When the loading plate of the workpiece is put on, the buffer member can be pressed against the surface of the workpiece, so that the upper cover will not be in direct contact with the workpiece.

Therefore, although the buffer members in the illustrated embodiment of this case are all arranged on the upper cover in the manner of being embedded in the groove, the buffer members can also be connected to the upper cover by means of adhesion or fixing by screws or other fixing members. The way shown in the figure is not limited to being embedded in the groove.

To sum up, the vapor deposition process jig provided by the present invention can avoid damage to the workpiece due to direct contact between the upper cover and the workpiece because the upper cover is provided with a buffer member to contact the workpiece, and the pressure of the buffer member can Provide a fixed force on the workpiece, avoiding the external force exerted by the operator during the operation The external force generated when the evaporation pot rotates during the evaporation process will cause damage to the workpiece. Through actual verification, taking wafers as an example, the present invention can increase the production capacity of the machine by 114%, and improve the production yield.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

1: Evaporation process fixture

10: Upper cover

11: The first side

12: Buffer

20: carrying plate

30: Workpiece

Claims (8)

An evaporation process jig, comprising: a carrier plate, used to carry at least one workpiece; and an upper cover, at least one buffer member is provided on the periphery of a first surface thereof, and the buffer member protrudes from the first On the surface, the hardness of the buffer is smaller than the hardness of the workpiece, the upper cover is arranged on the carrier plate and covers the workpiece, and the buffer is pressed against the workpiece; wherein the first surface is provided with a circular groove, A circular cushioning piece or a plurality of arc-shaped or columnar cushioning pieces are arranged in the groove; the periphery of the workpiece has an invalid area, and the buffering piece presses against the invalid area. The vapor deposition process jig described in item 1 of the scope of the patent application, wherein the material of the buffer is one of rubber or foam. The vapor deposition process jig described in item 2 of the scope of the patent application, wherein the material of the buffer is one of silicon rubber or fluororubber. The vapor deposition process jig described in item 1 of the scope of the patent application, wherein the heat-resistant temperature of the buffer is in the range of -20 to 290 degrees Celsius. The vapor deposition process jig described in item 1 of the scope of the patent application, wherein the height of the buffer member protruding from the first surface is in the range of 0.1 to 3 mm. The vapor deposition process jig described in item 1 of the scope of the patent application, wherein the hardness of the buffer is in the range of 30-90 Shore hardness. The vapor deposition process jig described in item 1 of the scope of the patent application, wherein the radial width of the circular buffer, or the radial width of each arc-shaped buffer, or columnar The cross-sectional dimension of the cushioning member is in the range of 1-2.5 mm. The vapor deposition process jig described in item 1 of the scope of the patent application, wherein the upper cover is provided with a plurality of grooves, and a buffer member is provided in each groove.

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