TWI802286B - Laminating device calibration method and laminating equipment - Google Patents

Laminating device calibration method and laminating equipment Download PDF

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Publication number
TWI802286B
TWI802286B TW111106412A TW111106412A TWI802286B TW I802286 B TWI802286 B TW I802286B TW 111106412 A TW111106412 A TW 111106412A TW 111106412 A TW111106412 A TW 111106412A TW I802286 B TWI802286 B TW I802286B
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head
laminating
calibrating
bonding
shaft
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TW111106412A
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Chinese (zh)
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TW202335143A (en
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張凱閔
柯有濂
王炫祥
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萬潤科技股份有限公司
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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

本發明提供一種貼合裝置校正方法及貼合設備,包括:提供一貼合裝置,設有一貼抵頭;提供一校正裝置,設有一距離感測器;使該距離感測器對該貼抵頭的不同位置進行量測以取得複數個量測值並依據所述量測值調整該貼抵頭的水平角度;藉此可對貼合裝置進行水平校正。 The present invention provides a bonding device calibration method and bonding equipment, comprising: providing a bonding device, provided with a bonding head; providing a calibration device, provided with a distance sensor; making the distance sensor Different positions of the head are measured to obtain a plurality of measurement values, and the horizontal angle of the abutting head is adjusted according to the measurement values; thereby, the lamination device can be horizontally calibrated.

Description

貼合裝置校正方法及貼合設備 Laminating device calibration method and laminating equipment

本發明係有關於一種貼合裝置校正方法及貼合設備,尤指一種用於對將散熱膠墊貼合在被貼物上之貼合裝置進行校正的貼合裝置校正方法及貼合設備。 The invention relates to a bonding device calibration method and bonding equipment, in particular to a bonding device calibration method and bonding equipment for calibrating a bonding device for bonding a heat dissipation rubber pad to an object to be pasted.

專利號第I716906號「散熱膠墊貼合方法及設備」已公開一種貼合設備,其設有一貼抵頭於一貼合裝置上,該貼抵頭被驅動以其桿狀的輪體滾動間接經由一下表面黏附一散熱膠墊的一包膜接觸該散熱膠墊的方式,自該散熱膠墊相對一被貼物的另一側移輥位移,使該散熱膠墊被貼合於該被貼物上。 Patent No. I716906 "Laminating Method and Equipment for Heat Dissipating Rubber Pads" has disclosed a laminating equipment, which is provided with a sticking head on a laminating device, and the sticking head is driven to roll indirectly with its rod-shaped wheel body. Through the way that an envelope of a heat dissipation rubber pad adhered to the lower surface contacts the heat dissipation rubber pad, and the other side shifting roller is displaced from the heat dissipation rubber pad relative to an object to be pasted, so that the heat dissipation rubber pad is attached to the pasted object things.

先前技術之貼合裝置在經該貼抵頭將該散熱膠墊輥貼於該被貼物的過程中,因該被貼物通常係水平地擺放在載盤上,故該貼合裝置之該貼抵頭亦需水平地設置,方利於貼合作業進行時,該貼合裝置可均勻地將力施加於該被貼物上,故如何校正該貼合裝置的水平為待解決議題。 In the pasting device of the prior art, in the process of pasting the heat-dissipating rubber pad roller on the pasted object through the pasting head, because the pasted object is usually placed horizontally on the carrier tray, the pasting device's The sticking head also needs to be set horizontally so that the sticking device can apply force evenly on the object to be stuck when the sticking operation is in progress. Therefore, how to correct the level of the sticking device is an issue to be solved.

爰是,本發明的目的,在於提供一種可對貼合裝置進行水平校正之貼合裝置校正方法。 Therefore, the object of the present invention is to provide a bonding device calibration method that can perform horizontal calibration on the bonding device.

本發明的另一目的,在於提供一種用以執行如所述貼合裝置校正方法的貼合設備。 Another object of the present invention is to provide a bonding equipment for performing the calibration method of the bonding device.

本發明的又一目的,在於提供一種可對貼合裝置進行水平校正的貼合設備。 Another object of the present invention is to provide a laminating equipment capable of leveling the laminating device.

依據本發明目的之貼合裝置校正方法,包括:提供一貼合裝置,設有一貼抵頭;提供一校正裝置,設有一距離感測器;使該距離感測器對該貼抵頭的不同位置進行量測以取得複數個量測值並依據所述量測值調整該貼抵頭的水平角度。 According to the bonding device calibration method of the object of the present invention, comprising: providing a bonding device, is provided with a sticking head; Provides a calibration device, is provided with a distance sensor; The position is measured to obtain a plurality of measured values, and the horizontal angle of the abutting head is adjusted according to the measured values.

依據本發明另一目的之貼合設備,用以執行如所述貼合裝置之校正方法。 According to another object of the present invention, the bonding equipment is used to implement the calibration method of the bonding device.

依據本發明又一目的之貼合設備,設有:一貼合裝置,設有一貼抵頭;一校正裝置,設有一距離感測器;該距離感測器可對該貼抵頭的不同位置進行量測。 According to the bonding equipment of another object of the present invention, it is provided with: a bonding device, which is provided with a sticking head; a calibration device, which is provided with a distance sensor; the distance sensor can be used for different positions of the sticking head Take measurements.

本發明實施例之貼合裝置校正方法及貼合設備,可校正該貼合裝置之該貼抵頭的水平,利於後續貼合作業的進行。 The bonding device calibration method and bonding equipment of the embodiment of the present invention can correct the level of the bonding head of the bonding device, which is beneficial to the subsequent bonding operation.

A:機台 A: machine

B:輸送流路 B: delivery flow path

B1:第一軌架 B1: The first rail frame

B11:治具 B11: Fixture

B111:吸附座 B111: Adsorption seat

B12:側架 B12: side frame

B13:皮帶 B13: belt

B14:軌道 B14: track

B2:第二軌架 B2: second rail frame

C:轉換流路 C: Conversion flow path

C1:活動軌架 C1: movable rail frame

C11:側架 C11: side frame

C12:皮帶 C12: belt

C13:軌道 C13: track

C2:驅動件 C2: Driver

D:移送裝置 D: transfer device

D1:龍門軌架 D1: Gantry rail frame

D11:立柱 D11: column

D12:橫樑 D12: Beam

D13:驅動件 D13: Driver

D2:懸梁 D2: suspension beam

D21:驅動件 D21: Driver

D3:操作座 D3: Operating seat

E:貼合裝置 E: Fitting device

E1:固定板 E1: Fixed plate

E2:軌座 E2: rail seat

E3:貼合機構 E3: Fitting mechanism

E31:貼抵頭 E31: stick to the head

E32:調整座 E32: Adjustment seat

E321:樞扣部 E321: Pivot Department

E322:凹溝 E322: concave groove

E323:第一通孔 E323: First through hole

E324:第二通孔 E324: Second through hole

E325:調整孔 E325: Adjustment hole

E33:安裝座 E33: Mounting seat

E331:第一固定孔 E331: The first fixing hole

E332:第二固定孔 E332: Second fixing hole

E34:軸桿 E34: shaft

E341:第三通孔 E341: Third through hole

E35:連結件 E35: link

E36:調整件 E36: Adjustment parts

E4:上檢視機構 E4: Upward Inspection Organization

E41:上取像器 E41: Upper image finder

E5:驅動機構 E5: drive mechanism

E51:驅動件 E51: Driver

E52:針輪 E52: pin wheel

E6:料帶輪 E6: material pulley

E61:驅動件 E61: Driver

E7:第一捲輪 E7: The first reel

E71:驅動件 E71: Driver

E8:第二捲輪 E8: Second reel

E81:驅動件 E81: Driver

F:校正裝置 F: Calibration device

F1:測距機構 F1: ranging mechanism

F11:距離感測器 F11: distance sensor

F2:下檢視機構 F2: Down view organization

F21:下取像器 F21: Lower image finder

F22:環形光源 F22: Ring Light

F23:對位平台 F23: Alignment platform

F231:透光片 F231: Translucent film

F232:對位標記 F232: Alignment mark

L:直線 L: Straight line

T:載盤 T: tray

T1:鏤空區間 T1: hollow interval

W:被貼物 W: Sticker

W1:基板 W1: Substrate

W2:晶粒 W2: grain

S:散熱膠墊 S: cooling pad

K:料帶 K: Tape

K1:第一包膜 K1: first envelope

K2:第二包膜 K2: second envelope

K21:針孔 K21: pinhole

K3:料捲 K3: material roll

K31:軸孔 K31: shaft hole

K32:套筒 K32: Sleeve

圖1係本發明實施例中貼合設備之立體示意圖。 Fig. 1 is a three-dimensional schematic view of laminating equipment in an embodiment of the present invention.

圖2係本發明實施例中被貼物之立體示意圖。 Fig. 2 is a three-dimensional schematic diagram of the object to be stuck in the embodiment of the present invention.

圖3係本發明實施例中被貼物貼覆散熱膠墊之示意圖。 Fig. 3 is a schematic diagram of a thermal pad covered with an object in the embodiment of the present invention.

圖4係本發明實施例中料帶之立體示意圖。 Fig. 4 is a three-dimensional schematic view of the material tape in the embodiment of the present invention.

圖5係本發明實施例中貼合裝置之前視示意圖。 Fig. 5 is a schematic front view of the bonding device in the embodiment of the present invention.

圖6係本發明實施例中調整座、安裝座、軸桿之立體分解示意圖。 Fig. 6 is a three-dimensional exploded schematic diagram of the adjustment seat, the installation seat, and the shaft rod in the embodiment of the present invention.

圖7係本發明實施例中調整座、安裝座、軸桿與貼抵頭位置關係之示意圖。 Fig. 7 is a schematic diagram of the positional relationship between the adjustment seat, the mounting seat, the shaft and the abutment head in the embodiment of the present invention.

圖8係本發明實施例中校正裝置之立體示意圖。 Fig. 8 is a three-dimensional schematic view of the calibration device in the embodiment of the present invention.

圖9係本發明實施例中距離感測器對貼抵頭的一端量測之示意圖。 FIG. 9 is a schematic diagram of a distance sensor measuring one end of an abutment head in an embodiment of the present invention.

圖10係本發明實施例中距離感測器對貼抵頭的另一端量測之示意圖。 Fig. 10 is a schematic diagram of the measurement of the distance sensor to the other end of the abutment head in the embodiment of the present invention.

請參閱圖1,本發明實施例之貼合裝置校正方法可以如圖所示的貼合設備為例進行說明,其係在一機台A上設有:一輸送流路B,由一第一軌架B1及一第二軌架B2所構成;該第一軌架B1中設有一治具B11,該治具B11上設有矩陣排列呈矩形凸起狀的複數個吸附座B111,每一吸附座B111各提供負壓的吸力;該第一軌架B1上設有由相間隔的兩個側架B12及分別各靠置兩個該側架B12相對之內側的二條皮帶B13所構成的軌道B14,該皮帶B13可受驅動使矩形的一載盤T於該軌道B14中作X軸向位移搬送或定位在該治具B11上方;該載盤T上設有矩陣排列的複數個鏤空區間T1,每一個該鏤空區間T1上方可供一被貼物W定位於該處,該治具B11可作上下昇降使該吸附座B111經該鏤空區間T1對該被貼物W吸附作上頂或下降操作;該第二軌架B2與該第一軌架B1左右對稱且具有相同之構造,在此不再贅述;一轉換流路C,設於該輸送流路B的一端,該轉換流路C設有一活動軌架C1與一驅動件C2,該活動軌架C1可被該驅動件C2驅動作Y軸向位移選擇性直線串聯對接該第一軌架B1或該第二軌架B2;該活動軌架C1上設有由相間隔的兩個側架C11及分別各靠置兩個該側架C11相對之內側的二條皮帶C12所構成的軌道C13,該皮帶C12可受驅動使該載盤T於該軌道C13中作X軸向位移搬送;一移送裝置D,設有相隔間距分別設於該輸送流路B兩側的二個龍門軌架D1,每一龍門軌架D1包括分別各位於該輸送流路C兩側之Z軸向的兩個立柱D11,及位於所述立柱D11上方呈水平X軸向橫設的一橫樑D12,各橫樑D12上分別各設有例如線碼之X軸向的一驅動件D13;二個龍門軌架D1的二個橫樑D12上共同跨設Y軸向的一懸梁D2上,該懸梁D2兩端並受該驅 動件D13所驅動可作X軸向位移,該懸梁D2上設有例如線碼之Y軸向的一驅動件D21,一操作座D3設於該懸梁D2上,並可受該驅動件D21所驅動作Y軸向位移;一貼合裝置E,設於該輸送流路B的上方,並位於該移送裝置D的該操作座D3上,可受驅動作X、Y軸向位移;一校正裝置F,設於該輸送流路B中,並位於該第一軌架B1與該第二軌架B2之間,該貼合裝置E可受驅動位移至該校正裝置F上方經該校正裝置F進行預設的校正。 Please refer to Fig. 1, the laminating device calibration method of the embodiment of the present invention can be explained by taking the laminating equipment as shown in the figure as an example. Consists of a rail frame B1 and a second rail frame B2; the first rail frame B1 is provided with a jig B11, and the jig B11 is provided with a plurality of adsorption seats B111 arranged in a matrix in the shape of rectangular protrusions, each adsorption Seats B111 each provide negative pressure suction; the first rail frame B1 is provided with a track B14 formed by two side frames B12 spaced apart and two belts B13 respectively placed on the opposite inner sides of the two side frames B12 , the belt B13 can be driven so that a rectangular tray T is transported in the X-axis direction in the track B14 or positioned above the jig B11; the tray T is provided with a plurality of hollowed-out intervals T1 arranged in a matrix, An object W can be positioned above each of the hollowed-out sections T1, and the jig B11 can be moved up and down so that the adsorption seat B111 can absorb the attached object W through the hollowed-out section T1 for upward or downward operation. The second rail frame B2 is symmetrical to the first rail frame B1 and has the same structure, which will not be repeated here; a conversion flow path C is located at one end of the delivery flow path B, and the conversion flow path C is set There is a movable rail frame C1 and a driving part C2, and the movable rail frame C1 can be driven by the driving part C2 for Y-axis displacement and selectively connected in series with the first rail frame B1 or the second rail frame B2; the movable rail The frame C1 is provided with a track C13 formed by two spaced side frames C11 and two belts C12 respectively abutting on the opposite inner sides of the two side frames C11. The belts C12 can be driven to make the tray T The track C13 is used for X-axis displacement transfer; a transfer device D is provided with two gantry rail frames D1 respectively arranged on both sides of the conveying flow path B at intervals, each gantry rail frame D1 includes a Two uprights D11 in the Z-axis on both sides of the flow path C, and a crossbeam D12 horizontally placed on the top of the upright D11 in the X-axis. A driving part D13; the two beams D12 of the two gantry rail frames D1 are jointly straddled on a suspension beam D2 in the Y-axis, and the two ends of the suspension beam D2 are driven by the drive The moving part D13 can be driven by the X-axis displacement. The suspension beam D2 is provided with a driving part D21 in the Y-axis such as the line code. An operating seat D3 is arranged on the suspension beam D2 and can be moved by the driving part D21. Driven for Y-axis displacement; a laminating device E, located above the conveying flow path B, and located on the operating seat D3 of the transfer device D, which can be driven for X, Y-axis displacement; a correction device F, located in the conveying flow path B, and located between the first rail B1 and the second rail B2, the laminating device E can be driven to move above the correction device F and pass through the correction device F Preset corrections.

請參閱圖2、3,本發明實施例係以圖中所示已在一基板W1上黏附一晶粒W2的物件作為該被貼物W;該貼合設備將在該被貼物W的該晶粒W2上方貼覆一散熱膠墊S。 Please refer to Fig. 2, 3, the embodiment of the present invention uses the object shown in the figure to have adhered a crystal grain W2 on a substrate W1 as the object W; A thermal pad S is pasted on the top of the die W2.

請參閱圖4,該散熱膠墊S被長條帶狀的第一包膜K1及第二包膜K2所包覆而形成一料帶K,複數個該散熱膠墊S被依序等間隔連續排列,各該散熱膠墊S上、下兩面各具黏性而分別與該第一包膜K1及該第二包膜K2內層黏附,其中,該第二包膜K2的兩側各具有一排等間隔連續排列的複數個針孔K21,兩排針孔K21間相隔一間距,該間距大於該散熱膠墊S的長度並供該散熱膠墊S黏置其中,該料帶K可供捲在一設有軸孔K31的套筒K32外徑上而成一環捲狀的料捲K3。 Please refer to Fig. 4, the heat dissipation rubber pad S is covered by the strip-shaped first coating K1 and the second coating K2 to form a strip K, and a plurality of the heat dissipation rubber pads S are sequentially and continuously spaced Arranged, the upper and lower sides of each heat dissipation pad S are viscous and adhere to the inner layer of the first envelope K1 and the second envelope K2 respectively, wherein each of the two sides of the second envelope K2 has a A plurality of pinholes K21 are arranged continuously at equal intervals, and there is a distance between the two rows of pinholes K21, the distance is greater than the length of the heat dissipation pad S and the heat dissipation pad S is glued therein, and the material tape K can be rolled A ring-shaped material roll K3 is formed on the outer diameter of a sleeve K32 provided with a shaft hole K31.

請參閱圖1、5,該貼合裝置E的一固定板E1與該移送裝置D的該操作座D3之間設有Z軸向的一軌座E2,藉此使該貼合裝置E可相對該操作座D3作Z軸向位移;該貼合裝置E設有:一貼合機構E3,設有一貼抵頭E31可將如圖4中該料帶K上的散熱膠墊S貼覆於如圖3中該被貼物W上; 一上檢視機構E4,設於該貼合機構E3的一側,該上檢視機構E4設有在Z軸向上由上往下進行取像的一上取像器E41,可檢視該載盤T上之該被貼物W的方位以利後續對位;一驅動機構E5,設於該貼合機構E3相對該上檢視機構E4的另一側;該驅動機構E5可以一驅動件E51經該固定板E1後側圖未示的皮帶驅動一針輪E52對如圖4中該料帶K的第二包膜K2進行牽引驅動;一料帶輪E6,設於該貼合機構E3的上方,並受該固定板E1後側的一驅動件E61驅動而可作旋轉,該料帶輪E6可套置如圖4中該料捲K;一第一捲輪E7,設於該貼合機構E3相對該上檢視機構E4的另一側,並位於該驅動機構E5上方,其可受該固定板E1後側的一驅動件E71驅動作旋轉以捲收如圖4中該料帶K的第一包膜K1;一第二捲輪E8,設於該貼合機構E3相對該上檢視機構E4的另一側,並位於該驅動機構E5上方與該第一捲輪E7下方之間,其可受該固定板E1後側的一驅動件E81驅動旋轉以捲收如圖4中該料帶K的第二包膜K2。 Please refer to Figures 1 and 5, a rail seat E2 in the Z-axis is provided between a fixed plate E1 of the bonding device E and the operating seat D3 of the transfer device D, so that the bonding device E can be relatively The operating seat D3 is displaced in the Z axial direction; the fitting device E is provided with: a fitting mechanism E3, which is provided with a sticking head E31, which can stick the heat dissipation rubber pad S on the material belt K as shown in Figure 4. Above the object W in Figure 3; An upper inspection mechanism E4 is arranged on one side of the bonding mechanism E3. The upper inspection mechanism E4 is provided with an upper image picker E41 that takes images from top to bottom in the Z-axis direction, and can inspect the upper surface of the tray T. The azimuth of the object W to be pasted is convenient for the follow-up alignment; a driving mechanism E5 is located on the other side of the pasting mechanism E3 relative to the upper inspection mechanism E4; E1 rear side figure not shown belt drives a pin wheel E52 to the second coating K2 of this material band K as shown in Fig. 4 is carried out tractive driving; A material pulley E6 is located at the top of this laminating mechanism E3, and is subjected to A driving member E61 on the rear side of the fixed plate E1 is driven to rotate, and the material pulley E6 can be nested in the material roll K as shown in Figure 4; a first roll E7 is located on the bonding mechanism E3 opposite to the The other side of the upper inspection mechanism E4 is located above the drive mechanism E5, which can be driven by a drive member E71 on the rear side of the fixed plate E1 to rotate to roll up the first coating of the material tape K as shown in Figure 4 K1; a second reel E8, located on the other side of the bonding mechanism E3 relative to the upper inspection mechanism E4, and between the top of the driving mechanism E5 and the bottom of the first reel E7, which can be fixed by the A driving member E81 on the rear side of the plate E1 is driven to rotate to take up the second wrapping film K2 of the strip K as shown in FIG. 4 .

請參閱圖6,該貼抵頭E31由中心軸呈X軸向設置之桿狀的輪體所構成並設於一調整座E32上,該調整座E32上方設有一安裝座E33,該調整座E32與該安裝座E33之間夾設有一軸桿E34,該調整座E32可以該軸桿E34為支點相對該安裝座E33作擺動,該貼抵頭E31的中心軸與該軸桿E34的中心軸相垂直;該調整座E32設有由兩端向下凸伸的兩個樞扣部E321供該貼抵頭E31的兩端樞設;該調整座E32上側的一端設有一凹溝E322供該軸桿E34的中心軸呈Y軸向設置,並設有穿經該凹溝E322之Z軸向的兩個第一通孔E323;該調整座E32的另一端設有Z軸向的兩個第二通孔E324與Z軸向具螺紋的兩個調整孔E325; 該安裝座E33的一端設有對應所述第一通孔E323之Z軸向具螺紋的兩個第一固定孔E331,該安裝座E33的另一端設有對應所述第二通孔E324之Z軸向具螺紋的兩個第二固定孔E332;該軸桿E34設有對應所述第一通孔E323之Z軸向的兩個第三通孔E341。 Please refer to Fig. 6, the sticking head E31 is composed of a rod-shaped wheel with the central axis in the X axial direction and is arranged on an adjustment seat E32. An installation seat E33 is arranged above the adjustment seat E32, and the adjustment seat E32 A shaft E34 is sandwiched between the mounting seat E33, the adjusting seat E32 can swing relative to the mounting seat E33 with the shaft E34 as a fulcrum, and the central axis of the abutting head E31 is aligned with the central axis of the shaft E34. Vertical; the adjustment seat E32 is provided with two pivoting parts E321 protruding downward from both ends for the two ends of the abutment head E31 to pivot; the upper end of the adjustment seat E32 is provided with a groove E322 for the shaft The central axis of E34 is arranged in the Y-axis direction, and is provided with two first through holes E323 passing through the groove E322 in the Z-axis direction; the other end of the adjustment seat E32 is provided with two second through-holes E323 in the Z-axis direction Hole E324 and two adjustment holes E325 with threads in the Z axis; One end of the mounting seat E33 is provided with two first fixing holes E331 threaded in the Z direction corresponding to the first through hole E323, and the other end of the mounting seat E33 is provided with a Z corresponding to the second through hole E324. There are two second fixing holes E332 threaded in the axial direction; the shaft E34 is provided with two third through holes E341 corresponding to the Z-axis of the first through hole E323.

請參閱圖6、7,該調整座E32與該安裝座E33之間藉由四個例如螺絲的連結件E35相連結,所述連結件E35由下往上穿經該調整座E32的所述第一通孔E323與所述第二通孔E324,使該連結件E35的上端固定於該安裝座E33的所述第一固定孔E331與所述第二固定孔E332中,可提供該調整座E32朝該安裝座E33靠近的力;其中,因該軸桿E34係夾設於該調整座E32與該安裝座E33之間,故所述連結件E35穿經該調整座E32的所述第一通孔E323時,所述連結件E35同時穿經該軸桿E34的所述第三通孔E341;該調整座E32相對該安裝座E33作擺動係藉由將兩個例如螺絲的調整件E36的一端螺設於該調整座E32的所述調整孔E325中,並使所述調整件E36的另一端朝上延伸靠抵於該安裝座E33的底面,可提供該調整座E32朝該安裝座E33遠離的力;該調整座E32以其一端的該軸桿E34作為擺動的支點,並藉由調整所述調整件E36相對該調整座E32的位移改變該調整座E32的另一端與該安裝座E33之間的間距,以令該調整座E32可相對該安裝座E33擺動以調整該貼抵頭E31的水平角度。 Please refer to Figures 6 and 7, the adjustment base E32 and the installation base E33 are connected by four connecting parts E35 such as screws, and the connecting parts E35 pass through the first part of the adjusting base E32 from bottom to top. A through hole E323 and the second through hole E324, so that the upper end of the link E35 is fixed in the first fixing hole E331 and the second fixing hole E332 of the mounting seat E33, and the adjustment seat E32 can be provided The force approaching the mounting seat E33; wherein, because the shaft E34 is sandwiched between the adjusting seat E32 and the mounting seat E33, the connecting member E35 passes through the first passage of the adjusting seat E32 When opening the hole E323, the connecting piece E35 passes through the third through hole E341 of the shaft E34 at the same time; It is screwed in the adjustment hole E325 of the adjustment seat E32, and the other end of the adjustment member E36 extends upwards to abut against the bottom surface of the installation seat E33, so that the adjustment seat E32 can move away from the installation seat E33. The adjustment seat E32 uses the shaft E34 at one end as a fulcrum for swinging, and changes the distance between the other end of the adjustment seat E32 and the installation seat E33 by adjusting the displacement of the adjustment member E36 relative to the adjustment seat E32. The spacing between them is such that the adjustment seat E32 can swing relative to the installation seat E33 to adjust the horizontal angle of the abutting head E31.

請參閱圖8,該校正裝置F設有一測距機構F1與一下檢視機構F2;該測距機構F1設有一距離感測器F11可在Z軸向上對如圖7中該貼抵頭E31進行量測;在本發明實施例中,該距離感測器F11為接觸式位移計,但不以此為限,非接觸式位移計亦可對該貼抵頭E31進行量測; 該下檢視機構F2設有在Z軸向上由下往上進行取像的一下取像器F21,可檢視如圖4中該料帶K上的散熱膠墊S的方位以利後續對位;該下取像器F21上方設有一環形光源F22與一對位平台F23,該對位平台F23上設有圓形的一透光片F231,其上設有例如十字型的一對位標記F232;該對位平台F23可選擇性的移入或移出該環形光源F22的上方,使該對位標記F232的中心對應該環形光源F22的中心。 Please refer to Fig. 8, the calibration device F is provided with a distance-measuring mechanism F1 and an inspection mechanism F2; In the embodiment of the present invention, the distance sensor F11 is a contact displacement gauge, but it is not limited thereto, and a non-contact displacement gauge can also measure the abutting head E31; The lower viewing mechanism F2 is provided with a lower image picker F21 that takes images from bottom to top on the Z axis, and can check the orientation of the heat dissipation rubber pad S on the material tape K as shown in Figure 4 for subsequent alignment; A ring-shaped light source F22 and an alignment platform F23 are arranged above the lower image taker F21, and a circular light-transmitting sheet F231 is provided on the alignment platform F23, and a cross-shaped alignment mark F232 is provided on it; The alignment platform F23 can selectively move in or out above the ring light source F22, so that the center of the alignment mark F232 corresponds to the center of the ring light source F22.

本發明實施例貼合裝置校正方法在實施上,該貼合設備在執行將該散熱膠墊S貼覆於該被貼物W上的製程之前,需先將該貼合裝置E位移至該校正裝置F上方進行預設的校正作業,其中,預設的校正作業包含在該料帶K尚未置於該貼合裝置E前的該貼抵頭E31水平度校正或位置校正。 In the implementation of the bonding device calibration method of the embodiment of the present invention, the bonding device needs to move the bonding device E to the calibration point before executing the process of bonding the heat dissipation pad S to the object W. A preset calibration operation is performed above the device F, wherein the preset calibration operation includes level calibration or position calibration of the bonding head E31 before the material strip K is placed on the bonding device E.

該貼抵頭E31水平度校正係使該移送裝置D驅動該貼合裝置E位移至該校正裝置F上方,並使該貼抵頭E31的不同位置壓觸該距離感測器F11的上端,使該距離感測器F11對該貼抵頭E31的不同位置進行量測以取得複數個量測值並依據所述量測值調整該調整座E32以該軸桿E34為支點作擺動進而調整該貼抵頭E31的水平角度;其中,請參閱圖9、10,所述不同位置係分布於與該貼抵頭E31之桿狀的輪體的中心軸平行的一直線L上的多個位置,該直線L位於桿狀的輪體的底緣;所述不同位置優選為該貼抵頭E31靠近該軸桿E34之一端的底緣與該貼抵頭E31遠離該軸桿E34之另一端的底緣;所述量測值包含在該貼抵頭E31靠近該軸桿E34之一端的底緣所測得的一第一量測值與在該貼抵頭E31遠離該軸桿E34之另一端的底緣所測得的一第二量測值;依據所述量測值調整該貼抵頭E31的水平角度係將該第二量測值調整至與該第一量測值相同;如該第一量測值測得為+5mm,該第二量測值測得為+6mm,即可知該貼抵頭E31的兩端存在+1mm高低落差,使用者可藉由調整所述調整件E36的位移,使該調整座E32遠離 該軸桿E34的另一端朝上擺動以調整該貼抵頭E31的兩端底緣係在相同的水平線上。 The correction of the levelness of the affixing head E31 is to make the transfer device D drive the laminating device E to displace above the correction device F, and make different positions of the affixing head E31 touch the upper end of the distance sensor F11, so that The distance sensor F11 measures the different positions of the sticking head E31 to obtain a plurality of measured values, and adjusts the adjusting seat E32 to swing with the shaft E34 as a fulcrum according to the measured values to adjust the sticking The horizontal angle of the abutting head E31; wherein, referring to Fig. 9 and 10, the different positions are distributed in a plurality of positions on a straight line L parallel to the central axis of the rod-shaped wheel body of the affixing head E31, the straight line L is located at the bottom edge of the rod-shaped wheel body; the different positions are preferably the bottom edge of the abutment head E31 near one end of the shaft E34 and the bottom edge of the abutment head E31 away from the other end of the shaft E34; The measured value includes a first measured value measured at the bottom edge of the end of the sticking head E31 close to the shaft E34 and a bottom edge of the other end of the sticking head E31 away from the shaft E34. A second measured value measured; adjusting the horizontal angle of the sticking head E31 according to the measured value is to adjust the second measured value to be the same as the first measured value; as the first measured value The measured value is +5 mm, and the second measured value is +6 mm, which means that there is a height difference of +1 mm between the two ends of the affixing head E31, and the user can adjust the displacement of the adjusting part E36, Keep the adjustment seat E32 away from The other end of the shaft E34 swings upwards to adjust the bottom edges of the two ends of the abutting head E31 to be on the same horizontal line.

該貼抵頭E31位置校正係使該對位平台F23移入該環形光源F22的上方,並使該貼合裝置E位移至該上取像器E41對應該對位標記F232的中心,使該上取像器E41與該下取像器F21同時對該對位標記F232的中心進行檢視,以取得該上取像器E41與該下取像器F21的相對位置關係;接著,令該貼合裝置E位移至該貼抵頭E31的中心對應該對位標記F232的中心,以取得該下取像器F21與該貼抵頭E31的相對位置關係,藉此計算出該上取像器E41、該下取像器F21與該貼抵頭E31三者間的相對位置關係。 The position correction system of the sticking head E31 is to make the alignment platform F23 move into the top of the ring light source F22, and make the bonding device E move to the center of the upper image picker E41 corresponding to the alignment mark F232, so that the upper pick-up The imager E41 and the lower imager F21 inspect the center of the alignment mark F232 at the same time to obtain the relative positional relationship between the upper imager E41 and the lower imager F21; then, make the bonding device E Displace to the center of the sticking head E31 corresponding to the center of the alignment mark F232, to obtain the relative positional relationship between the lower image picker F21 and the sticking head E31, thereby calculating the upper image picker E41, the lower The relative positional relationship between the image pickup device F21 and the affixing head E31.

本發明實施例之貼合裝置校正方法及貼合設備,可校正該貼合裝置E之該貼抵頭E31的水平,利於後續貼合作業的進行。 The bonding device calibration method and bonding equipment of the embodiment of the present invention can correct the level of the bonding head E31 of the bonding device E, which is beneficial to the subsequent bonding operation.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 But the above-mentioned ones are only preferred embodiments of the present invention, and the scope of implementation of the present invention cannot be limited with this, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the contents of the description of the invention, All still belong to the scope covered by the patent of the present invention.

E31:貼抵頭 E31: stick to the head

E32:調整座 E32: Adjustment seat

E34:軸桿 E34: shaft

E36:調整件 E36: Adjustment parts

L:直線 L: Straight line

Claims (10)

一種貼合裝置校正方法,包括:提供一貼合裝置,設有一貼抵頭;提供一校正裝置,設有一距離感測器;該貼合裝置可被驅動位移至該校正裝置上方;使該距離感測器對該貼抵頭的不同位置進行量測以取得複數個量測值並依據所述量測值調整該貼抵頭的水平角度。 A method for calibrating a bonding device, comprising: providing a bonding device, provided with a bonding head; providing a calibration device, provided with a distance sensor; the bonding device can be driven to move above the calibration device; making the distance The sensor measures different positions of the affixing head to obtain a plurality of measured values, and adjusts the horizontal angle of the affixed head according to the measured values. 如請求項1所述貼合裝置校正方法,其中,該貼抵頭由桿狀的輪體所構成;所述不同位置係分布於與桿狀的輪體的中心軸平行的一直線上。 The method for calibrating the laminating device as described in Claim 1, wherein the abutting head is formed by a rod-shaped wheel body; the different positions are distributed on a straight line parallel to the central axis of the rod-shaped wheel body. 如請求項2所述貼合裝置校正方法,其中,該直線位於桿狀的輪體的底緣。 The method for calibrating the laminating device according to claim 2, wherein the straight line is located at the bottom edge of the rod-shaped wheel body. 如請求項1所述貼合裝置校正方法,其中,該貼抵頭設於一調整座上,該調整座與一安裝座之間夾設有一軸桿,該調整座可以該軸桿為支點作擺動以調整該貼抵頭的水平角度;該貼抵頭的中心軸與該軸桿的中心軸相垂直。 The method for calibrating the laminating device as described in Claim 1, wherein, the affixing head is set on an adjustment seat, and a shaft is interposed between the adjustment seat and a mounting seat, and the adjustment seat can be used as a fulcrum of the shaft Swing to adjust the horizontal angle of the sticking head; the central axis of the sticking head is perpendicular to the central axis of the shaft. 如請求項4所述貼合裝置校正方法,其中,該調整座的一端供該軸桿設置,該調整座的另一端供一調整件設置,該調整件的一端螺設於該調整座,另一端朝上延伸靠抵於該安裝座的底面,該調整件可調整該調整座的另一端與該安裝座之間的間距以令該調整座可相對該安裝座擺動。 The method for calibrating the bonding device as described in claim 4, wherein one end of the adjustment seat is provided for the shaft rod, the other end of the adjustment seat is provided for an adjustment member, and one end of the adjustment member is screwed on the adjustment seat, and One end extends upwards and leans against the bottom surface of the mounting base, and the adjusting member can adjust the distance between the other end of the adjusting base and the mounting base so that the adjusting base can swing relative to the mounting base. 如請求項4所述貼合裝置校正方法,其中,所述量測值包含在該貼抵頭靠近該軸桿的一端所測得的一第一量測值與在該貼抵頭遠離該軸桿的另一端所測得的一第二量測值;依據所述量測值調整該貼抵頭的水平角度係將該第二量測值調整至與該第一量測值相同。 The method for calibrating the laminating device according to claim 4, wherein the measured value includes a first measured value measured at the end of the abutting head close to the shaft and a first measured value measured at the end of the abutting head far away from the shaft A second measurement value measured at the other end of the rod; adjusting the horizontal angle of the abutting head according to the measurement value is to adjust the second measurement value to be the same as the first measurement value. 如請求項1所述貼合裝置校正方法,其中,該貼抵頭的不同位置壓觸該距離感測器以取得所述量測值。 The method for calibrating a laminating device as described in Claim 1, wherein different positions of the affixing head are pressed against the distance sensor to obtain the measurement value. 一種貼合設備,用以執行如請求項1至7項任一項所述貼合裝置校正方法。 A laminating equipment, used to execute the calibrating method of laminating device as described in any one of Claims 1 to 7. 一種貼合設備,設有:一貼合裝置,設有一貼抵頭;一校正裝置,設有一距離感測器;及可驅動該貼合裝置位移至該校正裝置上方的一移送裝置;該距離感測器可對該貼抵頭的不同位置進行量測。 A laminating equipment is provided with: a laminating device with a sticking head; a calibration device with a distance sensor; and a transfer device that can drive the laminating device to be displaced above the calibrating device; the distance The sensor can measure different positions of the abutment head. 如請求項9所述貼合設備,其中,該貼合裝置、該校正裝置與該移送裝置設於一機台上。 The laminating equipment according to claim 9, wherein the laminating device, the calibrating device and the transferring device are arranged on a machine platform.
TW111106412A 2022-02-22 2022-02-22 Laminating device calibration method and laminating equipment TWI802286B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200919560A (en) * 2007-10-04 2009-05-01 Nitto Denko Corp Protective tape separation method and apparatus using the same
CN102806768A (en) * 2012-08-30 2012-12-05 青岛友结意电子有限公司 Automatic nano-imprinting equipment for original materials of electronic products
CN110890293A (en) * 2018-09-11 2020-03-17 Pyxis Cf私人有限公司 Semiconductor device chip mounting device and chip mounting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200919560A (en) * 2007-10-04 2009-05-01 Nitto Denko Corp Protective tape separation method and apparatus using the same
CN102806768A (en) * 2012-08-30 2012-12-05 青岛友结意电子有限公司 Automatic nano-imprinting equipment for original materials of electronic products
CN110890293A (en) * 2018-09-11 2020-03-17 Pyxis Cf私人有限公司 Semiconductor device chip mounting device and chip mounting method

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