TWI801993B - Modular connection device - Google Patents
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本發明係關於一種模組化連接裝置,尤其是指一種利用多條傳輸線將電子零組件之至少一第四連接器電性連結至電路板之模組化連接裝置。The present invention relates to a modular connection device, in particular to a modular connection device for electrically connecting at least one fourth connector of an electronic component to a circuit board by using a plurality of transmission lines.
一般來說,常見的電腦或伺服器等主機中,通常主機板上會設置有多組連接器,以供使用者將各種裝置安裝置主機板上,而由於主機內的空間有限,因此除了直接插接安裝的方式外,有更多的裝置是透過傳輸線連接位於主機板上的連接器與裝置上的連接器,藉以有效的利用主機內的空間配置。Generally speaking, in common computers or servers and other mainframes, there are usually multiple sets of connectors on the mainboard for users to install various devices on the mainboard. However, due to the limited space in the mainframe, other than direct In addition to the way of plug-in installation, there are more devices that connect the connectors on the motherboard and the connectors on the devices through transmission lines, so as to effectively utilize the space configuration in the host.
當主機板上有多個連接器需要對接到另一裝置上的多個連接器,且其兩者間的排列不一致,亦或者無法平行對接時,大多利用多個傳輸線分別一對一的對接,因此實際操作時非常的耗費人力作業成本,並容易發生作業員因為對接錯誤而需重工的問題,或者為了避免對接錯誤而需要在對接連接器上設計相對應的標籤或指示,亦會增加額外成本。此外,利用多個連接器分別進行連接的裝置,在維修保養時也會因為繁複的拆裝而需要花費更多的時間,相對的提高維修的成本,甚至有可能在拆裝的過程中又發生對接錯誤的問題。When there are multiple connectors on the motherboard that need to be connected to multiple connectors on another device, and the arrangement of the two is inconsistent, or they cannot be connected in parallel, most of them use multiple transmission lines for one-to-one connection. Therefore, the actual operation is very labor-intensive and cost-intensive, and it is easy for the operator to rework due to docking errors, or in order to avoid docking errors, it is necessary to design corresponding labels or instructions on the docking connector, which will also increase additional costs. . In addition, for devices that are connected separately using multiple connectors, it will take more time during maintenance due to the complicated disassembly and assembly, which will relatively increase the maintenance cost, and may even occur again during the disassembly and assembly process. Docking error problem.
請參閱第一圖,第一圖係顯示先前技術之伺服器主機之平面示意圖。如第一圖所示,一伺服器主機PA100包含一機殼PA1、一電路板PA2、複數個電子元件PA3(圖中僅標示一個)以及複數個傳輸線PA4。Please refer to the first figure, the first figure is a schematic plan view showing the server mainframe of the prior art. As shown in the first figure, a server host PA100 includes a casing PA1, a circuit board PA2, a plurality of electronic components PA3 (only one is marked in the figure), and a plurality of transmission lines PA4.
機殼PA1具有一支架PA11。電路板PA2是安裝於機殼PA1內,並具有多個第一連接器PA21。多個電子元件PA3是分別固定於支架PA11上,並分別具有一第二連接器PA31。其中,由於多個電子元件PA3之第二連接器PA31與第一連接器PA21之排列不一致,因此第一連接器PA21與第二連接器PA31之間需透過多條傳輸線PA4來分別電性連接,導致非常的耗時費力,且由於第一連接器PA21與電路板PA2上的其他連接器的規格通常都相同,因此在實際操作上很容易會有傳輸線PA4插到並非用於連接電子元件PA3的其他第一連接器PA21的問題。The casing PA1 has a bracket PA11. The circuit board PA2 is installed in the casing PA1 and has a plurality of first connectors PA21. A plurality of electronic components PA3 are respectively fixed on the bracket PA11 and have a second connector PA31 respectively. Wherein, because the arrangement of the second connector PA31 and the first connector PA21 of the plurality of electronic components PA3 is inconsistent, the first connector PA21 and the second connector PA31 need to be electrically connected through a plurality of transmission lines PA4 respectively, It is very time-consuming and labor-intensive, and since the specifications of the first connector PA21 and other connectors on the circuit board PA2 are usually the same, it is easy to insert the transmission line PA4 into a terminal not used to connect the electronic component PA3 in actual operation. Other problems with the first connector PA21.
有鑒於在先前技術中,為了將主機板上的多個連接器對接於一裝置上的多個排列相異之連接器,只能透過多條傳輸線來分別對接,進而造成費力耗時且容易出錯的問題;緣此,本發明的主要目的在於提供一種模組化連接裝置,可以快速地組裝多個彼此排列不一的連接器,進而避免組裝錯誤與費力耗時的問題。In view of the prior art, in order to connect multiple connectors on the mainboard to multiple connectors on a device with different arrangements, they can only be connected separately through multiple transmission lines, which is laborious, time-consuming and error-prone. Therefore, the main purpose of the present invention is to provide a modular connection device that can quickly assemble a plurality of connectors that are not aligned with each other, thereby avoiding assembly errors and labor-intensive and time-consuming problems.
本發明為解決先前技術之問題,所採用的必要技術手段是提供一種模組化連接裝置,係用以將至少一電子零組件電性連結至一電路板,該模組化連接裝置包含一第一連接模組、一第二連接模組以及一傳輸纜線。In order to solve the problems of the prior art, the necessary technical means adopted by the present invention is to provide a modular connection device, which is used to electrically connect at least one electronic component to a circuit board, and the modular connection device includes a first A connection module, a second connection module and a transmission cable.
第一連接模組包含一第一絕緣基座以及複數個第一連接器。複數個第一連接器係嵌設於該第一絕緣基座,並用以插接於該電路板之複數個第二連接器。The first connection module includes a first insulating base and a plurality of first connectors. A plurality of first connectors are embedded in the first insulating base and used for plugging in a plurality of second connectors of the circuit board.
第二連接模組包含一第二絕緣基座以及複數個第三連接器。複數個第三連接器係嵌設於該第二絕緣基座,並用以供該至少一電子零組件之至少一第四連接器插接。The second connection module includes a second insulating base and a plurality of third connectors. A plurality of third connectors are embedded in the second insulating base, and are used for insertion of at least one fourth connector of the at least one electronic component.
傳輸纜線包含複數條傳輸線以及一包覆管。複數條傳輸線係分別電性連接於該些第一連接器,以及該些第三連接器。包覆管係於該第一絕緣基座與該第二絕緣基座之間包覆該些傳輸線,以將該些傳輸線整合為該傳輸纜線。The transmission cable includes a plurality of transmission lines and a covering tube. The plurality of transmission lines are respectively electrically connected to the first connectors and the third connectors. The cladding tube wraps the transmission lines between the first insulating base and the second insulating base, so as to integrate the transmission lines into the transmission cable.
在上述必要技術手段所衍生之一附屬技術手段中,該第一絕緣基座更具有一支撐固定結構,該支撐固定結構係用以卡固連接於該電路板。In an auxiliary technical means derived from the above necessary technical means, the first insulating base further has a supporting and fixing structure, and the supporting and fixing structure is used for fastening connection to the circuit board.
較佳者,該第一絕緣基座更具有一基座本體,該支撐固定結構係一體成型地連結於該基座本體。其中,該基座本體具有一第一面,該些第一連接器係分別自該第一面露出。此外,該基座本體更具有一與該第一面彼此相對之第二面,該些傳輸線係分別自該第二面延伸出。Preferably, the first insulating base further has a base body, and the supporting and fixing structure is integrally connected to the base body. Wherein, the base body has a first surface, and the first connectors are respectively exposed from the first surface. In addition, the base body further has a second surface opposite to the first surface, and the transmission lines respectively extend from the second surface.
在上述必要技術手段所衍生之一附屬技術手段中,該第二絕緣基座具有複數個安裝空間,該些第三連接器係分別設置於該些安裝空間。In an auxiliary technical means derived from the above necessary technical means, the second insulating base has a plurality of installation spaces, and the third connectors are respectively arranged in the installation spaces.
在上述必要技術手段所衍生之一附屬技術手段中,該第二絕緣基座為一風扇組接框架。In an auxiliary technical means derived from the above necessary technical means, the second insulating base is a fan assembly frame.
在上述必要技術手段所衍生之一附屬技術手段中,該第二絕緣基座具有複數個安裝空間,該些第三連接器係分別設置於該些安裝空間。較佳者,每一該些安裝空間係為一風扇安裝空間。In an auxiliary technical means derived from the above necessary technical means, the second insulating base has a plurality of installation spaces, and the third connectors are respectively arranged in the installation spaces. Preferably, each of the installation spaces is a fan installation space.
本發明所提供之模組化連接裝置是利用第一連接模組之第一連接器來對應地電性連接於電路板上的多個第二連接器,並利用第二連接模組提供多個第三連接器來電性連接於電子零組件的至少一第四連接器,然後透過傳輸纜線電性連接第一連接器與第三連接器,可使電子零組件可以經由本發明所提供之模組化連接裝置便利地安裝於電路板上,有效的降低組裝難度而增加組裝效率,也因此相對地降低了組裝成本。The modular connection device provided by the present invention uses the first connector of the first connection module to be electrically connected to a plurality of second connectors on the circuit board correspondingly, and uses the second connection module to provide multiple The third connector is electrically connected to at least one fourth connector of the electronic component, and then the first connector and the third connector are electrically connected through a transmission cable, so that the electronic component can pass through the module provided by the present invention. The modular connection device is conveniently installed on the circuit board, which effectively reduces assembly difficulty and increases assembly efficiency, and thus relatively reduces assembly cost.
本發明所採用的具體實施例,將藉由以下之實施例及圖式作進一步之說明。The specific embodiments adopted by the present invention will be further described by the following embodiments and drawings.
請參閱第二圖至第四圖,第二圖係顯示電子零組件透過本發明之模組化連接裝置組接於主機之平面分解示意圖;第二A圖係為第二圖之圈A放大示意圖;第三圖係顯示電子零組件透過本發明之模組化連接裝置組接於主機之立體分解示意圖;第四圖係顯示電子零組件透過本發明之模組化連接裝置組接於主機之立體示意圖。Please refer to the second figure to the fourth figure, the second figure is a schematic diagram showing the plane exploded view of electronic components connected to the host through the modular connection device of the present invention; the second figure A is an enlarged schematic diagram of circle A in the second figure ; The third figure is a three-dimensional exploded view showing electronic components connected to the host through the modular connection device of the present invention; schematic diagram.
如第二圖至第四圖所示,一種模組化連接裝置100包含二第一連接模組1與1'、一第二連接模組2以及二傳輸纜線3(圖中僅標示一個)。As shown in the second figure to the fourth figure, a
第一連接模組1包含一第一絕緣基座11以及四個第一連接器12(圖中僅標示一個)。第一絕緣基座11包含一基座本體111與一支撐固定結構112。基座本體111具有彼此相對之一第一面1111與一第二面1112。支撐固定結構112是一體成型地連結於基座本體111之側邊。四個第一連接器12是分別嵌設於第一絕緣基座11,並自第一面1111露出。此外,由於第一連接模組1'與第一連接模組1為相同之構造,故在此不多加贅述。The
第二連接模組2包含一第二絕緣基座21以及八個第三連接器22(圖中僅標示一個)。第二絕緣基座21具有二安裝空間S(圖中僅標示一個),藉以供二電子零組件200(圖中僅標示一個)分別對應地容置於二安裝空間S中。在本實施例中,第二絕緣基座21為一風扇組接框架,而安裝空間S為一風扇安裝空間。此外,每一電子零組件200包含四個彼此互相連接之電子零件201,且每個電子零件201具有一第四連接器2011。The
八個第三連接器22係嵌設於第二絕緣基座21,並分別設置於安裝空間S,藉以在電子零組件200進入安裝空間S時,使第四連接器2011可以對應地插接於第三連接器22,進而使電子零組件200安裝於第二連接模組2。Eight
傳輸纜線3包含四條傳輸線31(圖中僅標示一個)以及一包覆管32。四條傳輸線31係分別電性連接於四個第一連接器12以及四個第三連接器22,意即每個傳輸線31之兩端分別電性連接於第一連接器12與第三連接器22。包覆管32係於第一絕緣基座11與第二絕緣基座21之間包覆四個傳輸線31,以將四個傳輸線31整合為傳輸纜線3。以此類推,另一傳輸纜線(圖未標示)也是分別電性連接四個第一連接器12以及四個第三連接器22,但由於其構造與傳輸纜線3之構造相同,故在此不多加贅述。The
承上所述,在本實施例中,第二連接模組2是可拆卸地組接於一主機300之一機殼301;其中,主機300還包含有一電路板302,而電路板302是安裝於機殼301中,且電路板302包含多個第二連接器3021(圖中僅標示一個),上述之四個第一連接器12是用以插接於多個第二連接器3021。Based on the above, in this embodiment, the
另一方面,第一連接模組1與1'是分別用以安裝於電路板302,以第一連接模組1為例,四個第一連接器12是透過設置於基座本體111而分別對應於多個第二連接器3021其中之四個第二連接器3021。當第一連接模組1透過第一連接器12與第二連接器3021之插接而安裝於電路板302上時,第一連接模組1還可透過支撐固定結構112鎖固於電路板302,而基座本體111也可因此得到支撐,進而使第一連接模組1更加穩定的安裝於電路板302上。On the other hand, the
在第一連接模組1與1'安裝於電路板302後,由於傳輸纜線3是透過多條傳輸線31分別電性連接第一連接模組1之多個第一連接器12與第二連接模組2之多個第三連接器22,因此安裝於第二連接模組2之電子零組件200之多個第四連接器2011便可透過模組化連接裝置電性連接至電路板302,藉此,即使第二連接器3021之排列間距與第四連接器2011之排列間距不一致,電子零組件200也可透過本實施例之模組化連接裝置100快速的安裝於電路板302上,非常的便利。After the
此外,由於第一連接模組1之多個第一連接器12是分別對應於多個第二連接器3021而固定於第一絕緣基座11,因此使用者可以輕鬆的將多個第一連接器12同步對接於多個第二連接器3021;相似地,多個第三連接器22也是分別對應於多個第四連接器2011而固定於第二絕緣基座21,因此使用者可以輕鬆的將多個第四連接器2011同步對接於多個第三連接器22。In addition, since the plurality of
需特別說明的是,在本實施例中,雖然第二連接模組2所包含之八個第三連接器22是分成前後兩排各四個的排列設置於第二絕緣基座21,但第一連接模組1是透過傳輸纜線3電性連接位於第二絕緣基座21之前排的二個第三連接器22與同一側後排的二個第三連接器22,相對的,第一連接模組1'也是透過另一傳輸纜線3電性連接位於第二絕緣基座21之前排另一側的二個第三連接器22與同一側後排的二個第三連接器22。然而,在其他實施例中則不限於此,亦可是第一連接模組1分別電性連接於同一排的第三連接器22,而第一連接模組1'分別電性連接於另一排的第三連接器22。It should be noted that, in this embodiment, although the eight
請繼續參閱第五圖,第五圖係顯示另一電子零組件透過本發明之另一模組化連接裝置組接於主機之平面分解示意圖。如第一圖至第五圖所示,本發明在另一較佳實施例中更提供了一種模組化連接裝置100a,而模組化連接裝置100a相較於模組化連接裝置100是以一第二連接模組2a替換模組化連接裝置100之第二連接模組2,而第二連接模組2a則是將原本的多個第三連接器22其中一者替換為一尺寸相異之第三連接器22a;藉此,當一電子零組件200a包含三個上述之電子零件201與一尺寸相異之電子零件202時,便可藉由相對應之模組化連接裝置100a來安裝固定於主機300。Please continue to refer to the fifth figure. The fifth figure is an exploded plan view showing another electronic component connected to the host through another modular connection device of the present invention. As shown in the first figure to the fifth figure, the present invention further provides a
綜上所述,相較於先前技術為了將主機板上的多個連接器對接於一裝置上的多個排列相異之連接器,只能透過多條傳輸線來分別對接,進而造成費力耗時且容易出錯的問題;本發明所提供之模組化連接裝置是利用第一連接模組之第一連接器來對應地電性連接於電路板上的多個第二連接器,並利用第二連接模組提供多個第三連接器來電性連接於電子零組件的至少一第四連接器,然後透過傳輸纜線電性連接第一連接器與第三連接器,可使電子零組件可以經由本發明所提供之模組化連接裝置便利地安裝於電路板上,有效的降低組裝難度而增加組裝效率,也因此相對地降低了組裝成本。To sum up, compared with the prior art, in order to connect multiple connectors on the motherboard to multiple connectors with different arrangements on a device, only multiple transmission lines can be used to connect them separately, which results in laborious and time-consuming And error-prone problem; the modular connection device provided by the present invention uses the first connector of the first connection module to be electrically connected to a plurality of second connectors on the circuit board correspondingly, and uses the second The connection module provides a plurality of third connectors to be electrically connected to at least one fourth connector of the electronic component, and then electrically connects the first connector and the third connector through a transmission cable, so that the electronic component can be connected via The modular connection device provided by the present invention is conveniently installed on the circuit board, which effectively reduces assembly difficulty and increases assembly efficiency, and thus relatively reduces assembly cost.
在本發明的一實施例中,本發明之模組化連接裝置係可應用於伺服器,該伺服器係可用於人工智慧(英語:Artificial Intelligence,簡稱AI)運算、邊緣運算(Edge Computing),亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In an embodiment of the present invention, the modular connection device of the present invention can be applied to a server, and the server can be used for artificial intelligence (English: Artificial Intelligence, AI for short) computing, edge computing (Edge Computing), It can also be used as a 5G server, cloud server or Internet of Vehicles server.
藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本發明之特徵與精神,而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。Through the above detailed description of the preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various changes and equivalent arrangements within the scope of the claimed patent scope of the present invention.
PA100:伺服器主機
PA1:機殼
PA11:支架
PA2:電路板
PA21:第一連接器
PA3:電子元件
PA31:第二連接器
PA4:傳輸線
100,100a:模組化連接裝置
1,1':第一連接模組
11:第一絕緣基座
111:基座本體
1111:第一面
1112:第二面
112:支撐固定結構
12:第一連接器
2,2a:第二連接模組
21:第二絕緣基座
22,22a:第三連接器
3:傳輸纜線
31:傳輸線
32:包覆管
200,200a:電子零組件
201,202:電子零件
2011:第四連接器
300:主機
301:機殼
302:電路板
3021:第二連接器
S:安裝空間
PA100: server host
PA1: Chassis
PA11: Bracket
PA2: circuit board
PA21: First connector
PA3: Electronic components
PA31: Second connector
PA4: transmission line
100,100a:
第一圖係顯示先前技術之伺服器主機之平面示意圖; 第二圖係顯示電子零組件透過本發明之模組化連接裝置組接於主機之平面分解示意圖; 第二A圖係為第二圖之圈A放大示意圖; 第三圖係顯示電子零組件透過本發明之模組化連接裝置組接於主機之立體分解示意圖; 第四圖係顯示電子零組件透過本發明之模組化連接裝置組接於主機之立體示意圖;以及 第五圖係顯示另一電子零組件透過本發明之另一模組化連接裝置組接於主機之平面分解示意圖。 The first figure is a schematic plan view showing a server host in the prior art; The second figure is an exploded plan view showing electronic components connected to the host through the modular connection device of the present invention; The second picture A is an enlarged schematic diagram of circle A in the second picture; The third figure is a three-dimensional exploded view showing electronic components connected to the host through the modular connection device of the present invention; Figure 4 is a perspective view showing electronic components connected to the host through the modular connection device of the present invention; and The fifth figure is an exploded plan view showing another electronic component connected to the host through another modular connection device of the present invention.
100:模組化連接裝置
1,1':第一連接模組
11:第一絕緣基座
111:基座本體
1112:第二面
112:支撐固定結構
12:第一連接器
2:第二連接模組
21:第二絕緣基座
22:第三連接器
3:傳輸纜線
32:包覆管
200:電子零組件
201:電子零件
2011:第四連接器
300:主機
301:機殼
302:電路板
3021:第二連接器
S:安裝空間
100:
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110133170A TWI801993B (en) | 2021-09-07 | 2021-09-07 | Modular connection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110133170A TWI801993B (en) | 2021-09-07 | 2021-09-07 | Modular connection device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202312609A TW202312609A (en) | 2023-03-16 |
TWI801993B true TWI801993B (en) | 2023-05-11 |
Family
ID=86690646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110133170A TWI801993B (en) | 2021-09-07 | 2021-09-07 | Modular connection device |
Country Status (1)
Country | Link |
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TW (1) | TWI801993B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201623313U (en) * | 2010-01-15 | 2010-11-03 | 黄懋林 | Connector of signal wire of computer mainframe |
TW202025557A (en) * | 2018-10-02 | 2020-07-01 | 德商鳳凰康特公司 | Subassembly of an electrical device and method for producing such a subassembly |
-
2021
- 2021-09-07 TW TW110133170A patent/TWI801993B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201623313U (en) * | 2010-01-15 | 2010-11-03 | 黄懋林 | Connector of signal wire of computer mainframe |
TW202025557A (en) * | 2018-10-02 | 2020-07-01 | 德商鳳凰康特公司 | Subassembly of an electrical device and method for producing such a subassembly |
Also Published As
Publication number | Publication date |
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TW202312609A (en) | 2023-03-16 |
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