TWI801834B - Composition analysis method of electrical and electronic machine parts scraps, method of processing electrical and electronic machine parts scraps, composition analysis device for electrical and electronic machine parts scraps, and processing device for electrical and electronic machine parts scraps - Google Patents
Composition analysis method of electrical and electronic machine parts scraps, method of processing electrical and electronic machine parts scraps, composition analysis device for electrical and electronic machine parts scraps, and processing device for electrical and electronic machine parts scraps Download PDFInfo
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Abstract
本發明提供一種無關個人經驗或技能而能夠於短時間內且高效率地分析電子電氣機器零件屑中之零件屑之組成的電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置。 本發明之電子電氣機器零件屑之組成分析方法之特徵在於包含: 自對包含多種零件種類之多個電子電氣機器零件屑拍攝所得之拍攝圖像中,提取電子電氣機器零件屑; 對所提取出之電子電氣機器零件屑賦予識別框,該識別框包含電子電氣機器零件屑及電子電氣機器零件屑周圍之背景圖像; 基於零件種類面積率資料,針對多種零件種類之每一種,推測附加有識別框之電子電氣機器零件屑之合計面積,該零件種類面積率資料具有電子電氣機器零件屑相對於識別框之面積率之資訊;以及 藉由將合計面積之推測結果與多種零件種類每一種之每單位面積之設想重量相乘,分別分析多種零件種類每一種之電子電氣機器零件屑之重量比率,而分析拍攝圖像內之電子電氣機器零件屑之組成。The present invention provides a method for analyzing the composition of electrical and electronic equipment scraps and a method for processing electrical and electronic equipment scraps that can analyze the composition of electrical and electronic equipment scraps in a short period of time and efficiently regardless of personal experience or skills , Composition analysis device for electronic and electrical machine parts scraps and processing device for electronic and electrical machine parts scraps. The composition analysis method of electronic and electrical machine parts chips of the present invention is characterized in that it comprises: Extracting electrical and electronic equipment parts scraps from photographed images obtained by photographing a plurality of electronic and electrical equipment scraps including various types of parts; Assigning an identification frame to the extracted electronic and electrical machine parts scraps, the identification frame includes the electronic and electrical machine parts scraps and the background image around the electronic and electrical machine parts scraps; Based on the part type area ratio data, for each of the various types of parts, estimate the total area of the electronic and electrical machine parts scraps with the identification frame attached. information; and By multiplying the estimated total area by the assumed weight per unit area of each of the various types of parts, the weight ratio of electrical and electronic equipment scraps for each of the various types of parts is analyzed separately, and the electronic and electrical components in the captured image are analyzed. Composition of machine parts chips.
Description
本發明係關於一種電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置。The present invention relates to a composition analysis method of electronic and electrical machine parts scraps, a processing method of electronic and electrical machine parts scraps, a composition analysis device for electronic and electrical machine parts scraps and a processing device for electronic and electrical machine parts scraps.
近年來,就資源保護之觀點而言,自廢家電製品、PC或行動電話等電子電氣機器零件屑回收有價金屬不斷盛行。又,近年來,電子電氣機器零件屑之處理量有增加之傾向,研究並提出了其有效率之回收方法。In recent years, from the viewpoint of resource protection, the recovery of valuable metals from scraps of electrical and electronic equipment such as waste household appliances, PCs, and mobile phones has become increasingly popular. In addition, in recent years, the amount of electronic and electrical equipment parts scraps tends to increase, and efficient recycling methods have been studied and proposed.
例如,於日本特開2015-123418號公報(專利文獻1)中,記載有將包含銅之電氣、電子機器零件屑焚燒之後,粉碎成規定尺寸以下,將已粉碎之電氣、電子機器零件屑利用銅熔煉爐進行處理。For example, in JP-A-2015-123418 (Patent Document 1), it is described that electric and electronic equipment parts scraps containing copper are incinerated, crushed to a size below a predetermined size, and the pulverized electric and electronic equipment parts scraps are utilized Copper smelting furnace for processing.
然而,由於電子電氣機器零件屑之處理量增加,因此,根據電子電氣機器零件屑所含之物質種類不同,不利於其後之銅冶煉步驟中之處理的物質(冶煉阻礙物質)較以往被投入更多量。若此種進入銅冶煉步驟之冶煉阻礙物質之量變多,則產生不得不限制電子電氣機器零件屑之投入量之情況。However, due to the increase in the processing volume of electronic and electrical equipment parts scraps, substances that are not conducive to the treatment in the subsequent copper smelting process (smelting hindering substances) are added according to the types of substances contained in electrical and electronic equipment scraps. more amount. If the amount of such smelting hindering substances entering the copper smelting step increases, there will be a situation where it is necessary to limit the input amount of electrical and electronic equipment parts scraps.
例如,電子電氣機器零件屑包含各種形狀及種類之零件屑,根據供給來源之差異等,其原料組成發生變化。為了適當地篩選投入至銅冶煉步驟之原料,目前,預先藉由目視判定或化學分析而評估電子電氣機器零件屑之原料組成,並使評估結果反映於篩選處理之操作管理、運轉條件之設定。For example, electronic and electrical equipment parts scraps include parts scraps of various shapes and types, and the raw material composition changes depending on the source of supply. In order to properly screen the raw materials input into the copper smelting process, at present, the raw material composition of electronic and electrical equipment parts chips is evaluated in advance by visual judgment or chemical analysis, and the evaluation results are reflected in the operation management and operation condition setting of the screening process.
然而,藉由目視而判定原料組成之方法中,因個人經驗或技能而導致評估結果存在不均,亦無法進行定量的評估。用於特定出原料組成之化學分析或手動篩選亦需要時間。 [先前技術文獻] [專利文獻]However, in the method of visually determining the composition of raw materials, the evaluation results are uneven due to personal experience or skills, and quantitative evaluation cannot be performed. Chemical analysis or manual screening to specify the composition of raw materials also takes time. [Prior Art Literature] [Patent Document]
[專利文獻1]日本特開2015-123418號公報[Patent Document 1] Japanese Patent Laid-Open No. 2015-123418
[發明所欲解決之課題][Problem to be Solved by the Invention]
本發明提供一種無關個人經驗或技能而能夠於短時間內且高效率地分析電子電氣機器零件屑中之零件屑之組成的電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置。 [解決課題之技術手段]The present invention provides a method for analyzing the composition of electrical and electronic equipment scraps and a method for processing electrical and electronic equipment scraps that can analyze the composition of electrical and electronic equipment scraps in a short period of time and efficiently regardless of personal experience or skills , Composition analysis device for electronic and electrical machine parts scraps and processing device for electronic and electrical machine parts scraps. [Technical means to solve the problem]
本發明實施形態之電子電氣機器零件屑之組成分析方法於一實施態樣中,係下述電子電氣機器零件屑之組成分析方法,其包含: 自對包含多種零件種類之多個電子電氣機器零件屑拍攝所得之拍攝圖像中,按照多種零件種類之每一種,提取電子電氣機器零件屑; 對所提取出之電子電氣機器零件屑賦予識別框,該識別框包含電子電氣機器零件屑及電子電氣機器零件屑周圍之背景圖像; 基於零件種類面積率資料,針對多種零件種類之每一種,推測附加有識別框之電子電氣機器零件屑之合計面積,該零件種類面積率資料至少具有電子電氣機器零件屑相對於識別框之面積率之資訊; 藉由將合計面積之推測結果與多種零件種類每一種之每單位面積之設想重量相乘,分別分析多種零件種類每一種之電子電氣機器零件屑之重量比率,而分析拍攝圖像內之電子電氣機器零件屑之組成。The method for analyzing the composition of electronic and electrical machine parts scraps according to the embodiment of the present invention is the following method for analyzing the composition of electronic and electrical machine parts scraps, which includes: Extracting electrical and electronic equipment parts scraps for each of the multiple types of parts from a photographed image obtained by photographing a plurality of electronic and electrical equipment scraps including various types of parts; Assigning an identification frame to the extracted electronic and electrical machine parts scraps, the identification frame includes the electronic and electrical machine parts scraps and the background image around the electronic and electrical machine parts scraps; Based on the area ratio data of the part types, for each of the various types of parts, estimate the total area of the electronic and electrical machine parts scraps with the identification frame attached. the information of By multiplying the estimated total area by the assumed weight per unit area of each of the various types of parts, the weight ratio of electrical and electronic equipment scraps for each of the various types of parts is analyzed separately, and the electronic and electrical components in the captured image are analyzed. Composition of machine parts chips.
本發明實施形態之電子電氣機器零件屑之處理方法於一實施態樣中,係下述電子電氣機器零件屑之處理方法,其包含篩選步驟,該篩選步驟基於上述電子電氣機器零件屑之組成之分析結果,自多種零件種類中篩選特定之零件種類。In one embodiment, the method for processing electronic and electrical equipment parts scraps according to the embodiment of the present invention is the following processing method for electronic and electrical equipment parts scraps, which includes a screening step, and the screening step is based on the composition of the above-mentioned electronic and electrical equipment scraps Analyze the results and filter specific part types from various part types.
本發明實施形態之電子電氣機器零件屑之組成分析裝置於一實施態樣中,係下述電子電氣機器零件屑之組成分析裝置,其具備: 提取手段:自對包含多種零件種類之多個電子電氣機器零件屑拍攝所得之拍攝圖像中,提取電子電氣機器零件屑; 識別框賦予手段:對所提取出之電子電氣機器零件屑賦予識別框,該識別框包含電子電氣機器零件屑及電子電氣機器零件屑周圍之背景圖像; 面積推測手段:基於零件種類面積率資料,針對多種零件種類之每一種,推測附加有識別框之電子電氣機器零件屑之合計面積,該零件種類面積率資料具有電子電氣機器零件屑相對於識別框之面積率之資訊;以及 分析手段:藉由將合計面積之推測結果與多種零件種類每一種之每單位面積之設想重量相乘,分別分析多種零件種類每一種之電子電氣機器零件屑之重量比率,而分析拍攝圖像內之電子電氣機器零件屑之組成。In one embodiment, the composition analysis device for electronic and electrical machine parts scraps according to the embodiment of the present invention is the following composition analysis device for electronic and electrical machine parts scraps, which includes: Extraction means: extracting electrical and electronic equipment parts scraps from photographed images obtained by photographing a plurality of electronic and electrical equipment scraps including various types of parts; Identification frame imparting means: assigning an identification frame to the extracted electronic and electrical machine parts scraps, the identification frame including the electronic and electrical machine parts scraps and the background image around the electronic and electrical machine parts scraps; Area estimation method: based on the area ratio data of the part type, for each of the various types of parts, estimate the total area of the electronic and electrical machine parts scraps with the identification frame attached. information on the area ratio; and Analysis method: By multiplying the estimated total area by the assumed weight per unit area of each of the various types of parts, the weight ratio of the scraps of electrical and electronic equipment for each of the various types of parts is analyzed separately, and the captured image is analyzed Composition of electronic and electrical machine parts scraps.
本發明實施形態之電子電氣機器零件屑之處理裝置於一實施態樣中,提供下述電子電氣機器零件屑之處理裝置,其具備: 拍攝手段:對包含多種零件種類之多個電子電氣機器零件屑進行拍攝; 組成分析裝置:具備提取手段、識別框賦予手段、面積推測手段及分析手段,該提取手段自拍攝圖像中提取電子電氣機器零件屑;該識別框賦予手段對所提取出之電子電氣機器零件屑賦予識別框,該識別框包含電子電氣機器零件屑及電子電氣機器零件屑周圍之背景圖像;該面積推測手段基於零件種類面積率資料,針對多種零件種類之每一種,推測附加有識別框之上述電子電氣機器零件屑之合計面積,該零件種類面積率資料具有電子電氣機器零件屑相對於識別框之面積率之資訊;該分析手段係藉由將合計面積之推測結果與多種零件種類每一種之每單位面積之設想重量相乘,分別分析多種零件種類每一種之電子電氣機器零件屑之重量比率,而分析拍攝圖像內之電子電氣機器零件屑之組成;以及 篩選機:基於藉由組成分析裝置分析出之組成分析結果,自電子電氣機器零件屑篩選特定之零件屑。 [發明之效果]The processing device for scraps of electronic and electrical equipment parts according to the embodiment of the present invention provides the following processing device for scraps of electrical and electronic equipment, which includes: Shooting method: Shooting multiple electronic and electrical machine parts scraps containing various types of parts; Composition analysis device: equipped with extraction means, recognition frame assignment means, area estimation means, and analysis means, the extraction means extracts electronic and electrical equipment parts scraps from photographed images; the identification frame assignment means extracts electronic and electrical equipment parts scraps Assign an identification frame, the identification frame includes electrical and electronic equipment parts scraps and the background image around the electrical and electronic equipment scraps; the area estimation means is based on the area ratio data of the type of parts, and for each of the various types of parts, it is estimated that the identification frame is added For the total area of the above-mentioned electronic and electrical machine parts scraps, the data on the area ratio of the electronic and electrical machine parts has information on the area ratio of the electronic and electrical machine parts scraps relative to the identification frame; Multiply the assumed weight per unit area to analyze the weight ratio of electronic and electrical equipment parts scraps for each of the various types of parts, and analyze the composition of electronic and electrical equipment scraps in the captured image; and Screening machine: Based on the composition analysis results analyzed by the composition analysis device, specific parts scraps are screened from electronic and electrical machine parts scraps. [Effect of Invention]
若根據本發明,可提供一種無關個人經驗或技能而能夠於短時間內且高效率地分析電子電氣機器零件屑中之零件屑之組成的電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置。According to the present invention, it is possible to provide a method for analyzing the composition of electrical and electronic equipment scraps, and an electrical and electronic equipment component that can efficiently analyze the composition of electrical and electronic equipment scraps in a short period of time regardless of personal experience or skills. The processing method of shavings, the composition analysis device of electronic and electrical machine parts shavings, and the processing device of electronic and electrical machine parts shavings.
以下,一邊參照圖式,一邊對本發明之實施形態進行說明。以下所示之實施形態係例示用以使本發明之技術思想具體化之裝置或方法者,本發明之技術思想並不將構成零件之構造、配置等特定為下述者。Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments shown below are examples of devices or methods for realizing the technical idea of the present invention, and the technical idea of the present invention does not specify the structure, arrangement, etc. of the constituent parts as follows.
如圖1所示,本發明實施形態之電子電氣機器零件屑之處理裝置具備: 拍攝裝置12:對電子電氣機器零件屑進行拍攝; 組成分析裝置10:具備對電子電氣機器零件屑之組成進行分析之分析手段;以及 篩選機13:基於藉由組成分析裝置10分析出之組成分析結果,自電子電氣機器零件屑篩選特定之零件屑。As shown in Fig. 1, the processing device of electronic and electrical machine parts scraps according to the embodiment of the present invention has: Photographing device 12: photographing electronic and electrical machine parts scraps; Composition analysis device 10: equipped with an analysis means for analyzing the composition of electrical and electronic equipment scraps; and Screening machine 13 : based on the composition analysis result analyzed by the composition analysis device 10 , selects specific scraps of parts from the scraps of electrical and electronic equipment.
本實施形態中所謂之「電子電氣機器零件屑」,係指將廢家電製品、PC或行動電話等電子、電氣機器加以破碎之屑,回收後被破碎成適當大小者。於本實施形態中,用以形成電子電氣機器零件屑之破碎可由處理者本人進行,但亦可購買市場中已破碎者。The so-called "electronic and electrical equipment parts shavings" in this embodiment refers to the shavings of electronic and electrical equipment such as waste household appliances, PCs, and mobile phones, which are recovered and shredded into appropriate sizes. In this embodiment, the crushing to form electrical and electronic equipment parts scraps can be carried out by the processor himself, but it is also possible to purchase crushed ones in the market.
作為破碎方法,並不限定為特定之裝置,可為剪斷方式亦可為撞擊方式,但較理想的是儘量不損及零件形狀之破碎。因此,屬於以粉碎得較細為目的之粉碎機之範疇的裝置不包括在內。As a crushing method, it is not limited to a specific device, and it can be a shearing method or an impact method, but it is ideal to crush without damaging the shape of the parts as much as possible. Therefore, devices belonging to the category of pulverizers for finer pulverization are not included.
電子電氣機器零件屑包含基板、殼體等所使用之塑膠(合成樹脂類)、金屬片、銅線屑、電容器、IC晶片、其他等多種零件種類,可根據處理目的來更細地分類。於本實施形態中,可較佳地處理被破碎為粒度50 mm以下之電子電氣機器零件屑,但並不限定於此。粒度之下限並不特別限定,為5 mm以上,更典型為10 mm以上,進而為15 mm以上。Electronic and electrical equipment parts scraps include plastics (synthetic resins), metal sheets, copper wire scraps, capacitors, IC chips, and others used in substrates and housings, and can be classified in more detail according to the processing purpose. In this embodiment, it is preferable to process electronic and electrical equipment parts chips crushed to a particle size of 50 mm or less, but it is not limited thereto. The lower limit of the particle size is not particularly limited, but is 5 mm or more, more typically 10 mm or more, further 15 mm or more.
組成分析裝置10可具備用以控制組成分析處理之控制部(控制裝置)100、記憶各種控制所需要之資訊之記憶裝置110、輸入裝置120、顯示裝置130。控制部100可包含提取手段101、識別框賦予手段102、面積推測手段103、分析手段104、運轉條件形成手段105、位置資訊輸出手段106、學習手段107及更新手段108。The composition analysis device 10 may include a control unit (control device) 100 for controlling composition analysis processing, a
記憶裝置110可具備提取資料記憶手段111、零件面積率記憶手段112、分析資訊記憶手段113、附加資訊記憶手段114。分析手段104可經由網路11將分析手段104之分析結果向經由伺服器15或者網路11而連接之與篩選機13不同之篩選機14輸入輸出。The
提取資料記憶手段111記憶有提取資料,該提取資料用以自對電子電氣機器零件屑拍攝所得之圖像中,按照多種零件種類之每一種,將電子電氣機器零件屑之圖像加以分類並提取。例如,提取資料記憶手段111具備提取基本資訊,該提取基本資訊用以自電子電氣機器零件屑之圖像資訊,分類為多種零件種類即基板、塑膠、金屬片、銅線屑、電容器、IC晶片、其他(連接器、膜狀零件屑、被覆線屑等)之至少2種以上,較佳為7種以上,進而為10種以上。用以將電子電氣機器零件屑按照多種零件種類每一種分類並提取之條件,可由操作者根據其後之篩選處理目的等各種條件預先設定。Extracted data memory means 111 memorizes extracted data, and the extracted data is used to classify and extract images of electronic and electrical machine parts scraps according to each of various types of parts . For example, the extraction data memory means 111 has the ability to extract basic information. The extracted basic information is used to classify various types of parts from the image information of electronic and electrical machine parts scraps, namely substrates, plastics, metal sheets, copper wire scraps, capacitors, and IC chips. , and others (connectors, film-like component scraps, coated wire scraps, etc.), at least two, preferably seven or more, and furthermore ten or more. The conditions for sorting and extracting electronic and electrical equipment parts scraps according to each of the various types of parts can be preset by the operator according to various conditions such as the purpose of subsequent screening and processing.
作為用於提取處理之提取資料,例如,可包含用以提取電子電氣機器零件屑之輪廓等幾何形狀之形狀資訊、用以提取電子電氣機器零件屑之色彩的色彩資訊、用以提取電子電氣機器零件屑周圍之背景圖像之色彩、凹凸所形成之陰影等背景資訊的背景資訊等、電子電氣機器零件屑之旋轉圖像等。提取資料記憶於提取資料記憶手段111。提取手段101基於記憶於提取資料記憶手段111之提取資料,將電子電氣機器零件屑按照多種零件種類之每一種提取,並將提取結果記憶於提取資料記憶手段111。Extracted data for extraction processing may include, for example, shape information for extracting geometric shapes such as contours of electrical and electronic equipment scraps, color information for extracting the color of electrical and electronic equipment scraps, and information for extracting electrical and electronic equipment scraps. The color of the background image around parts chips, the background information of background information such as shadows formed by bumps, etc., the rotating image of electronic and electrical machine parts chips, etc. The extracted data is stored in the extracted data memory means 111 . The extracting means 101 extracts electronic and electrical equipment parts scraps for each type of parts based on the extracted data stored in the extracted data storage means 111 , and stores the extraction results in the extracted data storage means 111 .
識別框賦予手段102對提取手段提取出之電子電氣機器零件屑賦予識別框,該識別框包含電子電氣機器零件屑及電子電氣機器零件屑周圍之背景圖像。識別框賦予手段102藉由賦予包含背景圖像之識別框,而容易識別電子電氣機器零件屑之輪廓。The recognition frame assigning means 102 assigns a recognition frame including the electrical and electronic equipment scraps and a background image around the electrical and electronic equipment scraps to the electrical and electronic equipment scraps extracted by the extraction means. The recognition frame assigning means 102 can easily recognize the outline of electronic and electrical equipment parts chips by assigning a recognition frame including a background image.
識別框賦予手段102較佳賦予與電子電氣機器零件屑之輪廓外切之外切圖形作為識別框。外切圖形之形狀可具有外切矩形、外切圓形、外切多邊形等任意之形狀。識別框賦予手段102較理想的是針對每種零件種類賦予不同特性(色彩、線之濃淡、線之種類(粗度、虛線/實線等))之識別框,使得操作者能夠容易區分多個零件屑。圖2(a)係表示自拍攝圖像提取基板作為電子電氣機器零件屑之情形時之例的照片。圖2(b)之紙面上部表示基板,紙面下部表示塑膠之提取物之例。The identification frame assigning means 102 preferably assigns a circumscribed and circumscribed figure to the contour of the electrical and electronic machine parts chip as the identification frame. The shape of the circumscribed figure may have any shape such as a circumscribed rectangle, circumscribed circle, or circumscribed polygon. The identification frame imparting means 102 ideally assigns identification frames with different characteristics (color, line shade, line type (thickness, dotted line/solid line, etc.)) for each type of part, so that the operator can easily distinguish between multiple parts. Parts crumbs. FIG. 2( a ) is a photograph showing an example of a situation in which a substrate is extracted from a photographed image as electronic and electrical equipment component scraps. The upper part of the paper in Fig. 2(b) shows the substrate, and the lower part of the paper shows an example of a plastic extract.
面積推測手段103使用記憶於零件面積率記憶手段112之零件種類面積率資料,針對多種零件種類之每一種,推測附加有識別框之電子電氣機器零件屑之合計面積,該零件種類面積率資料至少具有電子電氣機器零件屑相對於識別框之面積率之資訊。作為零件種類面積率資料,可包含電子電氣機器零件屑之輪廓之形狀資訊、識別框之面積、電子電氣機器零件屑於識別框內所占之面積及背景面積、電子電氣機器零件屑相對於識別框之面積率之資訊、位置資訊等各種資訊,且係藉由下述學習手段107能夠在任意時點更新資料之學習資料。The area estimating means 103 uses the part type area ratio data stored in the part area ratio memory means 112 to estimate the total area of electronic and electrical equipment parts scraps with identification frames for each of the various part types. The part type area ratio data is at least Information on the area ratio of electronic and electrical machine parts scraps relative to the identification frame. As part type area rate data, it can include the shape information of the outline of electronic and electrical machine parts, the area of the identification frame, the area occupied by electronic and electrical machine parts in the identification frame and the background area, and the relative identification of electronic and electrical machine parts. Various information such as information on the area ratio of the frame, position information, etc., are learning materials that can be updated at any point in time by the learning means 107 described below.
分析手段104將每種零件種類之電子電氣機器零件屑之合計面積之推測結果與預先規定的多種零件種類每一種之每單位面積之設想重量相乘,對多種零件種類所包含之電子電氣機器零件屑之重量進行分析,藉此分別分析多種零件種類之重量比率,從而分析拍攝圖像內存在之電子電氣機器零件屑之組成。The analysis means 104 multiplies the estimation result of the total area of electrical and electronic equipment scraps for each type of parts by the predetermined weight per unit area of each of the various types of parts, and the electronic and electrical equipment parts included in the various types of parts Analyze the weight of scraps, so as to analyze the weight ratio of various parts types, and then analyze the composition of electronic and electrical machine parts scraps in the captured images.
多種零件種類之每單位面積之設想重量,可由操作者根據操作結果預先經由輸入裝置120等作設定。例如,於將電子電氣機器零件屑分類為基板、塑膠、其他零件之3種之情形時,可將基板屑之設想重量例如設定為2.0 g/cm2
,將塑膠之設想重量設定為1.5 g/cm2
,將其他零件設定為1.0 g/cm2
,但並不限定於此。The assumed weight per unit area of various types of parts can be set in advance by the operator through the
再者,分析手段104除了上述所說明之面積資訊以外,亦可對其他物理特性進行分析,並輸出至顯示裝置130等,該其他物理特性例如為所提取出之每種零件種類中構成該零件種類之零件個數(個)、根據上述面積推測結果與個數所算出之平均粒徑、構成各零件種類之元素之重量比等。Moreover, in addition to the area information described above, the analysis means 104 can also analyze other physical characteristics and output them to the
運轉條件形成手段105基於分析手段104獲得之多種零件種類之重量比率的分析結果,形成用以篩選多種零件種類之篩選機之運轉條件的資訊。作為篩選機,有挑選裝置、彩色分選儀、金屬分選儀、渦電流篩選機、風力篩選機、篩別機等各種篩選機。例如,根據分析手段104之分析結果,運轉條件形成手段105例如形成篩選基板與塑膠之彩色分選儀之運轉條件,將所形成之運轉條件儲存於附加資訊記憶手段114。儲存於附加資訊記憶手段114之運轉條件被輸出至篩選機13、14,篩選機13、14可根據所輸出之運轉條件進行篩選處理。The operating condition forming means 105 forms information on the operating conditions of the screening machine for screening the various types of parts based on the analysis results of the weight ratios of the various types of parts obtained by the analyzing means 104 . As the screening machine, there are various screening machines such as a sorting device, a color sorter, a metal sorter, an eddy current screener, a wind screener, and a screener. For example, according to the analysis result of the analyzing means 104, the operating condition forming means 105, for example, forms the operating conditions of a color sorter for screening substrates and plastics, and stores the formed operating conditions in the additional information memory means 114. The operating conditions stored in the additional information memory means 114 are output to the screening machines 13 and 14, and the screening machines 13 and 14 can perform screening processing according to the output operating conditions.
位置資訊輸出手段106於拍攝電子、電氣機器零件屑之圖像中取得由提取手段101分類之多種零件種類各自之位置資訊,並將該位置資訊儲存於附加資訊記憶手段114。而且,將位置資訊輸出至特定之篩選機13、14,該等特定之篩選機13、14用以自多種零件種類中提取特定之零件種類之位置並將其篩選出。例如,基板與金屬片無法由金屬分選儀等特定之篩選機13、14分離,但若利用圖像資訊個別地獲得位置資訊,則可藉由具備挑選功能之篩選機13、14將其等篩選。The location information output means 106 acquires the location information of each of the various types of parts classified by the extraction means 101 from the images of electronic and electrical machine parts scraps, and stores the location information in the additional information memory means 114 . Furthermore, the location information is output to specific screening machines 13, 14, and these specific screening machines 13, 14 are used to extract the location of a specific part type from a plurality of parts types and to filter it out. For example, substrates and metal sheets cannot be separated by specific screening machines 13, 14 such as metal sorters, but if position information is obtained individually by using image information, they can be separated by screening machines 13, 14 with a selection function. filter.
學習手段107藉由機械學習而製作提取處理及推測處理所需要之學習資料。例如,學習手段107學習基板、塑膠、金屬片、銅線屑等多種零件種類每一種之特徵,例如,於本實施形態中針對各零件種類每一種之色彩、形狀、識別框與零件屑之面積率之關係等資訊,基於數百份~數萬份資料之輸入而學習其特徵,目的在於提高提取處理及推測處理之精度。The learning means 107 creates learning data necessary for extraction processing and estimation processing by machine learning. For example, the learning means 107 learns the characteristics of each type of various parts such as substrates, plastics, metal sheets, and copper wire scraps. Information such as the relationship between rates is learned based on the input of hundreds to tens of thousands of data, and the purpose is to improve the accuracy of extraction processing and estimation processing.
進而,學習手段107於產生電子電氣機器零件屑之誤識別等之情形,當產生提取手段101之誤識別或提取遺漏之情形時,進一步學習產生誤識別或提取遺漏之電子電氣機器零件屑之特性。例如,學習手段107藉由機械學習等製作新的學習模型,該機械學習對應於各種資訊之輸入,例如,未由提取手段101提取之電子電氣機器零件屑之輪廓資訊、包含未由提取處理提取之電子電氣機器零件屑之背景圖像的新識別框資訊、電子電氣機器零件屑相對於該識別框之面積率之資訊等。Furthermore, the learning means 107 further learns the characteristics of the misrecognition or extraction omission of the electronic and electrical equipment part scraps when the misidentification or extraction omission of the extraction means 101 occurs when the misidentification of the electronic and electrical equipment parts scraps occurs. . For example, the learning means 107 creates a new learning model by machine learning, etc., and the machine learning corresponds to the input of various information, for example, the contour information of electronic and electrical equipment parts chips not extracted by the extraction means 101, including information not extracted by the extraction process. Information on the new identification frame of the background image of the electronic and electrical machine parts scraps, information on the area ratio of the electronic and electrical machine parts scraps to the identification frame, etc.
更新手段108可基於學習手段107之學習結果,更新提取手段101用於提取零件種類之提取資料及零件種類面積率資料。更新後之資料亦可向經由網路11連接之篩選機14或伺服器15發送。The update means 108 can update the extraction means 101 to extract the extraction data of the part type and the area ratio data of the part type based on the learning result of the learning means 107 . The updated data can also be sent to the screening machine 14 or
使用圖3之流程圖,說明圖1所示之使用電子電氣機器零件屑之處理裝置之電子電氣機器零件屑處理方法之一例。於步驟S100中,取得拍攝圖像。拍攝圖像可為經由輸入裝置120或者網路11而輸入之拍攝圖像,亦可使用拍攝裝置12所拍攝之拍攝圖像。於步驟S101中,圖1之提取手段101基於記憶於提取資料記憶手段111之提取資料,將藉由拍攝裝置12所拍攝之圖像內存在的電子電氣機器零件屑按照每種零件種類(例如,基板、塑膠、金屬片、銅線屑、電容器、IC晶片、其他零件種類之7種)分類。Using the flow chart of FIG. 3 , an example of the electrical and electronic equipment parts waste processing method using the electrical and electronic equipment parts waste processing apparatus shown in FIG. 1 will be described. In step S100, a captured image is obtained. The captured image may be a captured image input through the
提取手段101之分類結果可藉由顯示裝置130等而顯示。為使操作者容易確認,可將分類結果在顯示於顯示裝置130之圖像中按照每種零件種類標註不同顏色之識別框,例如,基板標註紅框,塑膠標註藍框等。此時,圖1之位置資訊輸出手段可將基於提取手段101之該提取結果之位置資訊儲存於附加資訊記憶手段114。The classification result of the extraction means 101 can be displayed by the
例如,於分類為基板、塑膠、金屬片、銅線屑、電容器、IC晶片、其他零件種類之7種之情形時,以將基板、銅線屑、電容器及IC晶片視為有價物,將金屬片(鋁或SUS)及塑膠視為冶煉阻礙物質進行篩選之方式,使篩選條件適當化,藉此可將電子電氣機器零件屑之分離效率或損耗率、操作成績加以數值化後進行管理。For example, when classified into seven types of substrates, plastics, metal sheets, copper wire scraps, capacitors, IC chips, and other parts, the substrates, copper wire scraps, capacitors, and IC chips are regarded as valuables, and metal Chips (aluminum or SUS) and plastics are regarded as smelting hindering substances and screened to make the screening conditions appropriate, so that the separation efficiency, loss rate, and operation performance of electronic and electrical machine parts scraps can be quantified and managed.
於步驟S102中,識別框賦予手段102對提取手段101提取出之多個電子、電氣機器零件屑,按照多種零件種類之每一種,賦予包含電子電氣機器零件屑周圍之背景圖像之識別框。於步驟S103中,面積推測手段103基於零件種類面積率資料,針對多種零件種類之每一種,推測賦予有識別框之電子電氣機器零件屑之面積(合計面積),該零件種類面積率資料具有電子電氣機器零件屑相對於識別框之面積率之資訊。於步驟S103中,分析手段104將由面積推測手段103獲得之面積推測結果與多種零件種類之每單位面積之設想重量相乘並分別分析多種零件種類之重量比率,藉此分析拍攝圖像內之電子電氣機器零件屑之組成。例如,若將圖像內之每種零件種類之合計面積乘以每單位面積之重量,則可大概算出零件屑之總重量。藉由將各零件種類每一種之零件屑之總重量分別比對,可分析拍攝圖像內所包含之電子電氣機器零件屑之組成。分析結果於步驟S104中被輸出。In step S102 , the recognition frame assigning means 102 assigns a recognition frame including a background image around the electronic and electrical equipment scraps to each of the plurality of types of electronic and electrical equipment parts scraps extracted by the extraction means 101 . In step S103, the area estimating means 103 estimates the area (total area) of the scraps of electrical and electronic equipment with identification frames for each of the plurality of types of parts based on the area ratio data of the type of parts. Information on the area ratio of electrical machine parts scraps relative to the identification frame. In step S103, the analyzing means 104 multiplies the area estimation result obtained by the area estimating means 103 by the assumed weight per unit area of various types of parts and analyzes the weight ratios of the various types of parts respectively, thereby analyzing electrons in the captured image. Composition of electrical machine parts scraps. For example, if the total area of each part type in the image is multiplied by the weight per unit area, the total weight of part chips can be roughly calculated. By comparing the total weight of the scraps of each type of parts, the composition of the scraps of electronic and electrical equipment contained in the captured image can be analyzed. The analysis result is output in step S104.
若根據本發明實施形態之電子電氣機器零件屑之組成分析方法及組成分析裝置,對拍攝圖像賦予包含電子電氣機器零件屑與其周圍背景圖像之識別框,較佳為外形矩形之識別框,使用電子電氣機器零件屑相對於識別框之面積率之資訊,分析每個零件屑之電子電氣機器零件屑之重量,藉此,可利用圖像分析,求出拍攝圖像中存在之電子電氣機器零件屑之每種零件種類之重量比率。藉此,可無關個人經驗或技能而迅速地推測原料組成。其結果,操作者可更早地進行原料之購入條件或原料之篩選方法之判斷,故而可更有效率地運用整個工廠。According to the composition analysis method and composition analysis device of electronic and electrical machine parts scraps according to the embodiment of the present invention, a recognition frame including electronic and electrical machine parts scraps and their surrounding background images is given to the captured image, preferably a recognition frame with a rectangular shape, Using the information on the area ratio of electronic and electrical equipment parts to the recognition frame, the weight of each electronic and electrical equipment parts is analyzed, and image analysis can be used to find out the electrical and electronic equipment that exists in the captured image The weight ratio of each part type to part scrap. Thereby, the composition of raw materials can be estimated rapidly regardless of personal experience or skills. As a result, the operator can judge the purchase conditions of raw materials or the screening method of raw materials earlier, so the entire factory can be used more efficiently.
電子電氣機器零件屑周圍之背景圖像有時根據拍攝地點之條件而不同,根據情形,提取手段101有時無法適當地提取電子電氣機器零件屑。於本實施形態中,藉由學習手段107重新製作用於電子電氣機器零件屑之提取處理的學習資料,可獲得與拍攝圖像中之各種條件對應之更靈活之組成分析裝置,該學習資料包含背景資訊與將組合電子電氣機器零件屑之鑲邊圖像所得之圖像加以合成的新識別框資訊。The background image around the electrical and electronic equipment scraps may vary depending on the conditions of the shooting location, and depending on the situation, the extraction means 101 may not be able to properly extract the electrical and electronic equipment scraps. In this embodiment, a more flexible composition analysis device corresponding to various conditions in the captured image can be obtained by recreating the learning data used for the extraction and processing of electronic and electrical machine parts scraps by the learning means 107. The learning data includes Background information and new identification frame information that is synthesized by combining images obtained by combining border images of electrical and electronic equipment parts scraps.
圖4係表示根據本發明實施形態之分析方法,自拍攝圖像中分別提取基板與塑膠作為電子、電氣機器零件屑,將其面積之推測結果與實測值進行比較之例的表。如圖4所示,若根據本發明實施形態之電子電氣機器零件屑之組成分析方法,對於基板能以未達5.0%之測定誤差進行適當評估,對於塑膠則能以未達10%之測定誤差進行適當評估,於包含兩種零件之情形時,可達成90%以上之識別率。因此,就能從數值上大致掌握原料之組成之方面而言,藉由本方法可獲得充分之效果。Fig. 4 is a table showing an example of comparing the estimated results of the areas with the actual measured values by extracting substrates and plastics from photographed images as electronic and electrical equipment parts chips according to the analysis method of the embodiment of the present invention. As shown in Figure 4, according to the composition analysis method of electronic and electrical equipment parts chips according to the embodiment of the present invention, the substrate can be properly evaluated with a measurement error of less than 5.0%, and the plastic can be evaluated with a measurement error of less than 10%. Proper evaluation can achieve a recognition rate of more than 90% when two parts are included. Therefore, this method can obtain a sufficient effect in that the composition of the raw material can be roughly grasped numerically.
本發明雖藉由上述實施形態記載,但不應理解為形成該揭示之一部分之論述及圖式限定本發明。即,本發明並不限定於各實施形態,可於不脫離其主旨之範圍內將構成要素變形而具體化。又,藉由各實施形態所揭示之多個構成要素之適當組合,可形成各種發明。例如,亦可自實施形態所示之所有構成要素刪除幾個構成要素。進而,亦可將不同之實施形態之構成要素適當組合。Although the present invention has been described by the above-mentioned embodiments, it should not be understood that the statements and drawings forming a part of this disclosure limit the present invention. That is, the present invention is not limited to the respective embodiments, and the constituent elements may be modified and embodied within a range not departing from the gist. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in each embodiment. For example, some constituent elements may be deleted from all the constituent elements shown in the embodiment. Furthermore, components of different embodiments may be appropriately combined.
例如,藉由分析手段104,可自拍攝圖像中將多種零件種類每一種之平均面積、個數、平均粒徑、重量比等加以數值化後進行分析,故而與以往藉由手動篩選評估電子電氣機器零件屑之原料組成相比,可更顯著迅速地對該原料組成進行數值化加以掌握。For example, with the analysis means 104, the average area, number, average particle size, weight ratio, etc. of each of various types of parts can be quantified and analyzed from the captured images. Compared with the raw material composition of electrical equipment parts chips, the composition of the raw material can be numerically grasped more quickly.
進而,基於分析手段104分析出之原料分析結果,來決定自多種零件種類中篩選特定之零件種類之篩選機的運轉條件之資訊,例如,用以對原料進行篩選處理之篩選機之選擇與篩選條件、篩選順序等操作條件,可基於該操作條件進行篩選處理。Furthermore, based on the raw material analysis results analyzed by the analysis means 104, information on the operating conditions of the screening machine for screening a specific type of parts from various types of parts is determined, for example, the selection and screening of a screening machine for screening raw materials Conditions, filter order and other operating conditions, based on the operating conditions for filtering processing.
例如,藉由對電子電氣機器零件屑使用風力篩選機進行風力篩選而篩選為輕量物與重量物,可進行用以提高篩選後之處理物中之基板與塑膠之重量比率的處理。於該情形時,於藉由篩選機13、14進行之處理中,基於分析手段104分析出之原料分析結果,可根據多種零件種類之平均粒徑來調整風力篩選機之風量。風量例如可設為5~20 m/s,更佳為5~12 m/s,進而為5~10 m/s左右。風力篩選可根據分析手段104分析出之原料分析結果,反覆進行2次以上。For example, by wind-screening electronic and electrical machine parts scraps into lightweight and heavy objects, treatment can be performed to increase the weight ratio of substrates and plastics in the processed products after screening. In this case, in the processing by the screening machines 13 and 14, based on the raw material analysis results analyzed by the analysis means 104, the air volume of the air screening machine can be adjusted according to the average particle diameter of various parts types. The air volume can be set at, for example, 5 to 20 m/s, more preferably 5 to 12 m/s, and furthermore about 5 to 10 m/s. Wind screening can be repeated more than 2 times according to the raw material analysis results analyzed by the analysis means 104 .
或者,於實施上述風力篩選之前,可藉由進行使用挑選裝置之挑選處理,進行將塊狀之銅線屑去除之挑選處理。於該挑選處理時,將記憶於附加資訊記憶手段114之銅線屑之位置資訊輸出至作為篩選機13之挑選裝置,挑選裝置可根據該輸出結果將銅線屑去除。該銅線屑例如可被送至有價金屬回收步驟。Alternatively, before performing the above-mentioned wind-force screening, a sorting process using a sorting device may be performed to perform a sorting process for removing massive copper wire scraps. During the sorting process, the position information of the copper wire scraps stored in the additional information memory means 114 is output to the sorting device as the sorting machine 13, and the sorting device can remove the copper wire scraps according to the output result. This copper wire scrap can be sent, for example, to a valuable metal recovery step.
於反覆進行兩次以上之風力篩選之情形時,可於第1次風力篩選與第2次風力篩選之間進行使用篩別機之篩選處理。於該情形時,作為篩選機13,可採用篩別機,並可基於分析手段104分析出之原料分析結果即多種零件種類之平均粒徑,變更用以篩選特定零件種類之篩別機之篩網尺寸。In the case of repeated wind screening for more than two times, the screening process using the screening machine can be carried out between the first wind screening and the second wind screening. In this case, as the screening machine 13, a screening machine can be used, and based on the raw material analysis results analyzed by the analysis means 104, that is, the average particle size of various types of parts, the sieve of the screening machine for screening a specific type of parts can be changed. mesh size.
除了上述所說明之方法以外,亦可藉由對磁力篩選步驟、渦電流篩選步驟、及光學篩選金屬物與非金屬物之光學式篩選步驟中所使用之篩選機13分別活用本發明實施形態之組成分析裝置的組成分析結果,而一面對運送中之電子電氣機器零件屑連續地進行攝影,一面即時地分析該圖像資料,從而分析原料組成。In addition to the methods described above, the screening machine 13 used in the magnetic screening step, the eddy current screening step, and the optical screening step of optical screening of metal objects and non-metal objects can also be used in the embodiment of the present invention. The composition analysis result of the composition analysis device continuously takes pictures of the electrical and electronic equipment parts scraps being transported, and at the same time analyzes the image data in real time, thereby analyzing the composition of the raw materials.
以往,電子電氣機器零件屑之原料組成係藉由目視判定或化學分析而評估,並使其評估結果反映於篩選處理之操作管理、運轉條件之設定,然而,於藉由目視判定來掌握原料組成之方法,並無法進行迅速之處理。In the past, the raw material composition of electrical and electronic equipment parts was evaluated by visual judgment or chemical analysis, and the evaluation results were reflected in the operation management and operation condition setting of the screening process. This method cannot be dealt with promptly.
若根據本發明之實施形態,基於圖像分析與規定之分類資料自組成時刻變化之電子電氣機器零件屑中分離其中之零件屑之組成,藉此可瞬時地判別並進行數值化,故而能夠以更適當之條件迅速地篩選大量之電子電氣機器零件屑。According to the embodiment of the present invention, based on the image analysis and the prescribed classification data, the composition of the electronic and electrical equipment parts scraps is separated from the electronic and electrical equipment parts scraps whose composition changes every moment, so that it can be judged instantaneously and digitized, so it is possible to More suitable conditions to quickly screen a large number of electronic and electrical machine parts scraps.
進而,藉由對利用篩選機13、14進行之處理前後之零件屑的原料組成進行圖像分析,可基於零件屑之變化量而評估篩選機13、14之篩選效率(成績)。判別電子電氣機器零件屑之原料組成並且提取其位置資訊,使其與挑選裝置或彩色分選儀、金屬分選儀等篩選機13、14連動,藉此容易地進行零件種類之個別分離。又,藉由將分析結果按照每種原料種類標註不同顏色之框並顯示於顯示裝置130,使得操作者容易識別,故而亦容易識別組成分析裝置之誤偵測。Furthermore, by image analysis of the raw material composition of the scraps before and after processing by the sorters 13, 14, the sorting efficiency (score) of the sorters 13, 14 can be evaluated based on the amount of change in scrap. Identify the raw material composition of electronic and electrical machine parts scraps and extract their position information, and make it linked with the sorting device or color sorter, metal sorter and other screening machines 13, 14, so as to easily separate the parts types individually. In addition, by marking the analysis results in boxes of different colors for each type of raw material and displaying them on the
10:組成分析裝置 11:網路 12:拍攝裝置 13,14:篩選機 15:伺服器 100:控制部 101:提取手段 102:識別框賦予手段 103:面積推測手段 104:分析手段 105:運轉條件形成手段 106:位置資訊輸出手段 107:學習手段 108:更新手段 110:記憶裝置 111:提取資料記憶手段 112:零件面積率記憶手段 113:分析資訊記憶手段 114:附加資訊記憶手段 120:輸入裝置 130:顯示裝置 S100:取得拍攝圖像 S101:賦予識別框 S102:推測面積 S103:分析組成 S104:輸出10: Composition analysis device 11: Network 12: Shooting device 13,14: Screening machine 15:Server 100: Control Department 101: Extraction means 102: Identification frame endowment means 103: Area estimation means 104: Analytical means 105: Formation means of operating conditions 106: Location information output means 107: Learning Means 108: Update means 110: memory device 111: Means of extracting data and memory 112: Part area ratio memory means 113: Analyzing Information Memory Means 114:Additional information memory means 120: input device 130: display device S100: Acquiring a captured image S101: assign a recognition frame S102: Estimated area S103: Analyze composition S104: output
[圖1]係表示本發明實施形態之電子電氣機器零件屑之處理裝置的方塊圖。 [圖2](a)係表示對拍攝圖像中存在之電子電氣機器零件屑(基板)賦予識別框之圖像之例的照片,圖2(b)係表示將經賦予識別框之電子電氣機器零件屑按照每種零件種類(基板、塑膠)排列之例的照片。 [圖3]係表示電子電氣機器零件屑之圖像分析處理之一例之流程圖。 [圖4]係表示基板、塑膠之合計面積之實測值與推測值之比較的圖表。[ Fig. 1 ] is a block diagram showing an apparatus for processing scraps of electronic and electrical equipment parts according to an embodiment of the present invention. [Fig. 2] (a) is a photograph showing an example of an image with a recognition frame attached to electronic and electrical equipment parts scraps (substrates) existing in the captured image, and Fig. 2(b) is a photo showing an electronic and electrical device with a recognition frame attached to it. Photo of an example of machine parts shavings arranged by each part type (substrate, plastic). [ Fig. 3 ] is a flow chart showing an example of image analysis processing of electrical and electronic equipment parts chips. [Fig. 4] is a graph showing the comparison between the actual measured value and the estimated value of the total area of the substrate and plastic.
10:組成分析裝置 10: Composition analysis device
11:網路 11: Network
12:拍攝裝置 12: Shooting device
13,14:篩選機 13,14: Screening machine
15:伺服器 15:Server
100:控制部 100: Control Department
101:提取手段 101: Extraction means
102:識別框賦予手段 102: Identification frame endowment means
103:面積推測手段 103: Area estimation means
104:分析手段 104: Analytical means
105:運轉條件形成手段 105: Formation means of operating conditions
106:位置資訊輸出手段 106: Location information output means
107:學習手段 107: Learning Means
108:更新手段 108: Update means
110:記憶裝置 110: memory device
111:提取資料記憶手段 111: Means of extracting data and memory
112:零件面積率記憶手段 112: Part area ratio memory means
113:分析資訊記憶手段 113: Analyzing Information Memory Means
114:附加資訊記憶手段 114:Additional information memory means
120:輸入裝置 120: input device
130:顯示裝置 130: display device
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