TWI801268B - Electrical connection pad structure of semiconductor device and flip chip - Google Patents
Electrical connection pad structure of semiconductor device and flip chip Download PDFInfo
- Publication number
- TWI801268B TWI801268B TW111122651A TW111122651A TWI801268B TW I801268 B TWI801268 B TW I801268B TW 111122651 A TW111122651 A TW 111122651A TW 111122651 A TW111122651 A TW 111122651A TW I801268 B TWI801268 B TW I801268B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- electrical connection
- connection pad
- flip chip
- pad structure
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111122651A TWI801268B (en) | 2022-06-17 | 2022-06-17 | Electrical connection pad structure of semiconductor device and flip chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111122651A TWI801268B (en) | 2022-06-17 | 2022-06-17 | Electrical connection pad structure of semiconductor device and flip chip |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI801268B true TWI801268B (en) | 2023-05-01 |
TW202401683A TW202401683A (en) | 2024-01-01 |
Family
ID=87424340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111122651A TWI801268B (en) | 2022-06-17 | 2022-06-17 | Electrical connection pad structure of semiconductor device and flip chip |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI801268B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200644200A (en) * | 2005-06-03 | 2006-12-16 | Sitronix Technology Corp | Electric connecting pad structure |
US20120112343A1 (en) * | 2010-11-03 | 2012-05-10 | Texas Instruments Incorporated | Electroplated posts with reduced topography and stress |
TW201225231A (en) * | 2010-12-13 | 2012-06-16 | Ili Technology Corp | Bonding pad structure and integrated cicruit comprise a pluirality of bonding pad structures |
-
2022
- 2022-06-17 TW TW111122651A patent/TWI801268B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200644200A (en) * | 2005-06-03 | 2006-12-16 | Sitronix Technology Corp | Electric connecting pad structure |
US20120112343A1 (en) * | 2010-11-03 | 2012-05-10 | Texas Instruments Incorporated | Electroplated posts with reduced topography and stress |
TW201225231A (en) * | 2010-12-13 | 2012-06-16 | Ili Technology Corp | Bonding pad structure and integrated cicruit comprise a pluirality of bonding pad structures |
Also Published As
Publication number | Publication date |
---|---|
TW202401683A (en) | 2024-01-01 |
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