TWI801268B - Electrical connection pad structure of semiconductor device and flip chip - Google Patents

Electrical connection pad structure of semiconductor device and flip chip Download PDF

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Publication number
TWI801268B
TWI801268B TW111122651A TW111122651A TWI801268B TW I801268 B TWI801268 B TW I801268B TW 111122651 A TW111122651 A TW 111122651A TW 111122651 A TW111122651 A TW 111122651A TW I801268 B TWI801268 B TW I801268B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
electrical connection
connection pad
flip chip
pad structure
Prior art date
Application number
TW111122651A
Other languages
Chinese (zh)
Other versions
TW202401683A (en
Inventor
高雷
晏勤曉
章軍富
Original Assignee
大陸商北京集創北方科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 大陸商北京集創北方科技股份有限公司 filed Critical 大陸商北京集創北方科技股份有限公司
Priority to TW111122651A priority Critical patent/TWI801268B/en
Application granted granted Critical
Publication of TWI801268B publication Critical patent/TWI801268B/en
Publication of TW202401683A publication Critical patent/TW202401683A/en

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TW111122651A 2022-06-17 2022-06-17 Electrical connection pad structure of semiconductor device and flip chip TWI801268B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111122651A TWI801268B (en) 2022-06-17 2022-06-17 Electrical connection pad structure of semiconductor device and flip chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111122651A TWI801268B (en) 2022-06-17 2022-06-17 Electrical connection pad structure of semiconductor device and flip chip

Publications (2)

Publication Number Publication Date
TWI801268B true TWI801268B (en) 2023-05-01
TW202401683A TW202401683A (en) 2024-01-01

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ID=87424340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111122651A TWI801268B (en) 2022-06-17 2022-06-17 Electrical connection pad structure of semiconductor device and flip chip

Country Status (1)

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TW (1) TWI801268B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200644200A (en) * 2005-06-03 2006-12-16 Sitronix Technology Corp Electric connecting pad structure
US20120112343A1 (en) * 2010-11-03 2012-05-10 Texas Instruments Incorporated Electroplated posts with reduced topography and stress
TW201225231A (en) * 2010-12-13 2012-06-16 Ili Technology Corp Bonding pad structure and integrated cicruit comprise a pluirality of bonding pad structures

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200644200A (en) * 2005-06-03 2006-12-16 Sitronix Technology Corp Electric connecting pad structure
US20120112343A1 (en) * 2010-11-03 2012-05-10 Texas Instruments Incorporated Electroplated posts with reduced topography and stress
TW201225231A (en) * 2010-12-13 2012-06-16 Ili Technology Corp Bonding pad structure and integrated cicruit comprise a pluirality of bonding pad structures

Also Published As

Publication number Publication date
TW202401683A (en) 2024-01-01

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