TWI800622B - Magnetic printed circuit board and manufacturing method thereof - Google Patents

Magnetic printed circuit board and manufacturing method thereof Download PDF

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Publication number
TWI800622B
TWI800622B TW108108872A TW108108872A TWI800622B TW I800622 B TWI800622 B TW I800622B TW 108108872 A TW108108872 A TW 108108872A TW 108108872 A TW108108872 A TW 108108872A TW I800622 B TWI800622 B TW I800622B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
printed circuit
magnetic printed
magnetic
Prior art date
Application number
TW108108872A
Other languages
Chinese (zh)
Other versions
TW201942991A (en
Inventor
古川佳宏
奧村圭佑
Original Assignee
日商日東電工股份有限公司
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Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201942991A publication Critical patent/TW201942991A/en
Application granted granted Critical
Publication of TWI800622B publication Critical patent/TWI800622B/en

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TW108108872A 2018-03-16 2019-03-15 Magnetic printed circuit board and manufacturing method thereof TWI800622B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-049147 2018-03-16
JP2018049147 2018-03-16
JP2019044770A JP7352363B2 (en) 2018-03-16 2019-03-12 Magnetic wiring circuit board and its manufacturing method
JP2019-044770 2019-03-12

Publications (2)

Publication Number Publication Date
TW201942991A TW201942991A (en) 2019-11-01
TWI800622B true TWI800622B (en) 2023-05-01

Family

ID=68066172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108108872A TWI800622B (en) 2018-03-16 2019-03-15 Magnetic printed circuit board and manufacturing method thereof

Country Status (3)

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JP (1) JP7352363B2 (en)
CN (1) CN111837208B (en)
TW (1) TWI800622B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379066B2 (en) * 2019-10-09 2023-11-14 株式会社村田製作所 inductor parts
JP7243569B2 (en) * 2019-10-25 2023-03-22 株式会社村田製作所 Inductor components and substrates with built-in inductor components
JP7226409B2 (en) * 2020-07-31 2023-02-21 株式会社村田製作所 Inductor parts and DCDC converters

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1074626A (en) * 1996-06-27 1998-03-17 Kiyoto Yamazawa Thin magnetic element, its manufacture, and transformer
JP2000334742A (en) * 1999-05-27 2000-12-05 Jsr Corp Mold, its manufacture, casting mold for manufacturing mold, and manufacture of anisotropic conductive sheet
TW201739016A (en) * 2016-04-25 2017-11-01 Tdk股份有限公司 Electronic circuit package

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154327A (en) * 1997-08-04 1999-02-26 Murata Mfg Co Ltd Coil parts
TW550842B (en) * 2001-06-26 2003-09-01 Matsushita Electric Ind Co Ltd Magnetic resistance element and its manufacturing method
US6977796B2 (en) * 2002-02-08 2005-12-20 Headway Technologies, Inc. Wiring pattern and method of manufacturing the same and thin film magnetic head and method of manufacturing the same
TWI476103B (en) * 2003-07-01 2015-03-11 Sumitomo Bakelite Co A release film and a method of manufacturing a flexible printed wiring board using the release film
JPWO2005032226A1 (en) * 2003-09-29 2006-12-14 株式会社タムラ製作所 Multilayer circuit board
JP4826196B2 (en) * 2005-10-05 2011-11-30 住友ベークライト株式会社 Release film and circuit board manufacturing method
DE102012216101B4 (en) * 2012-09-12 2016-03-24 Festo Ag & Co. Kg Method for producing a coil integrated in a substrate, method for producing a multilayer printed circuit board and electronic device
JP6297281B2 (en) * 2013-05-27 2018-03-20 日東電工株式会社 Soft magnetic resin composition, soft magnetic adhesive film, soft magnetic film laminated circuit board, and position detection device
JP6170790B2 (en) * 2013-09-13 2017-07-26 新光電気工業株式会社 Wiring board and manufacturing method thereof
JP2017005115A (en) * 2015-06-10 2017-01-05 日東電工株式会社 Coil module and manufacturing method therefor
JP7464352B2 (en) * 2018-03-09 2024-04-09 日東電工株式会社 Wiring board and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1074626A (en) * 1996-06-27 1998-03-17 Kiyoto Yamazawa Thin magnetic element, its manufacture, and transformer
JP2000334742A (en) * 1999-05-27 2000-12-05 Jsr Corp Mold, its manufacture, casting mold for manufacturing mold, and manufacture of anisotropic conductive sheet
TW201739016A (en) * 2016-04-25 2017-11-01 Tdk股份有限公司 Electronic circuit package

Also Published As

Publication number Publication date
CN111837208A (en) 2020-10-27
CN111837208B (en) 2023-01-24
JP7352363B2 (en) 2023-09-28
JP2019165221A (en) 2019-09-26
TW201942991A (en) 2019-11-01

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