TWI800456B - A method and device for backsealing a silicon wafer - Google Patents

A method and device for backsealing a silicon wafer Download PDF

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Publication number
TWI800456B
TWI800456B TW111133334A TW111133334A TWI800456B TW I800456 B TWI800456 B TW I800456B TW 111133334 A TW111133334 A TW 111133334A TW 111133334 A TW111133334 A TW 111133334A TW I800456 B TWI800456 B TW I800456B
Authority
TW
Taiwan
Prior art keywords
backsealing
silicon wafer
wafer
silicon
Prior art date
Application number
TW111133334A
Other languages
Chinese (zh)
Other versions
TW202303709A (en
Inventor
衡鵬
鄒亞輝
徐鵬
Original Assignee
大陸商西安奕斯偉材料科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商西安奕斯偉材料科技有限公司 filed Critical 大陸商西安奕斯偉材料科技有限公司
Publication of TW202303709A publication Critical patent/TW202303709A/en
Application granted granted Critical
Publication of TWI800456B publication Critical patent/TWI800456B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02016—Backside treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW111133334A 2021-11-01 2022-09-02 A method and device for backsealing a silicon wafer TWI800456B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111281508.X 2021-11-01
CN202111281508.XA CN113725070B (en) 2021-11-01 2021-11-01 Method and equipment for back sealing silicon wafer

Publications (2)

Publication Number Publication Date
TW202303709A TW202303709A (en) 2023-01-16
TWI800456B true TWI800456B (en) 2023-04-21

Family

ID=78686263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111133334A TWI800456B (en) 2021-11-01 2022-09-02 A method and device for backsealing a silicon wafer

Country Status (2)

Country Link
CN (1) CN113725070B (en)
TW (1) TWI800456B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115527903B (en) * 2022-11-24 2023-11-03 西安奕斯伟材料科技股份有限公司 Equipment and method for back sealing silicon wafer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW465802U (en) * 2000-08-19 2001-11-21 Wafer Works Corp Silicon wafer substrate material without peripheral oxide
US20030010280A1 (en) * 2001-07-09 2003-01-16 Shigenori Sugihara Epitaxial semiconductor wafer and a manufacturing method thereof
TWI430336B (en) * 2009-08-19 2014-03-11 Sumco Corp Method of fabricating epitaxial silicon wafer
CN106158771A (en) * 2015-04-17 2016-11-23 上海申和热磁电子有限公司 Trimming super back of the body seal coat structure and manufacture method thereof is had for silicon chip
CN111933692A (en) * 2020-10-12 2020-11-13 晶芯成(北京)科技有限公司 Wafer back sealing structure and manufacturing method thereof
US20200365754A1 (en) * 2016-11-11 2020-11-19 Infineon Technologies Ag Semiconductor Wafers and Semiconductor Devices with Barrier Layer and Methods of Manufacturing
CN113496871A (en) * 2020-04-03 2021-10-12 重庆超硅半导体有限公司 Back film layer of silicon wafer for epitaxial substrate and manufacturing method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653570B (en) * 2016-12-21 2019-12-03 南京国盛电子有限公司 A kind of preparation method of heavily doped substrate transoid high resistant IC epitaxial wafer
CN111519245B (en) * 2020-04-29 2021-07-20 西安微电子技术研究所 Silicon substrate epitaxial layer growth method based on barrel type epitaxial furnace
CN112151423A (en) * 2020-10-09 2020-12-29 西安奕斯伟硅片技术有限公司 Method and system for depositing back sealing film on silicon wafer
CN112151424A (en) * 2020-10-09 2020-12-29 西安奕斯伟硅片技术有限公司 Method and system for depositing back sealing film on silicon wafer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW465802U (en) * 2000-08-19 2001-11-21 Wafer Works Corp Silicon wafer substrate material without peripheral oxide
US20030010280A1 (en) * 2001-07-09 2003-01-16 Shigenori Sugihara Epitaxial semiconductor wafer and a manufacturing method thereof
TWI430336B (en) * 2009-08-19 2014-03-11 Sumco Corp Method of fabricating epitaxial silicon wafer
CN106158771A (en) * 2015-04-17 2016-11-23 上海申和热磁电子有限公司 Trimming super back of the body seal coat structure and manufacture method thereof is had for silicon chip
US20200365754A1 (en) * 2016-11-11 2020-11-19 Infineon Technologies Ag Semiconductor Wafers and Semiconductor Devices with Barrier Layer and Methods of Manufacturing
CN113496871A (en) * 2020-04-03 2021-10-12 重庆超硅半导体有限公司 Back film layer of silicon wafer for epitaxial substrate and manufacturing method thereof
CN111933692A (en) * 2020-10-12 2020-11-13 晶芯成(北京)科技有限公司 Wafer back sealing structure and manufacturing method thereof

Also Published As

Publication number Publication date
CN113725070A (en) 2021-11-30
CN113725070B (en) 2022-01-25
TW202303709A (en) 2023-01-16

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