TWI800407B - 具有門襯墊之基板容器 - Google Patents

具有門襯墊之基板容器 Download PDF

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Publication number
TWI800407B
TWI800407B TW111122053A TW111122053A TWI800407B TW I800407 B TWI800407 B TW I800407B TW 111122053 A TW111122053 A TW 111122053A TW 111122053 A TW111122053 A TW 111122053A TW I800407 B TWI800407 B TW I800407B
Authority
TW
Taiwan
Prior art keywords
substrate container
door gasket
gasket
door
container
Prior art date
Application number
TW111122053A
Other languages
English (en)
Other versions
TW202301540A (zh
Inventor
亞倫 維斯塔
馬修 Ａ 富勒
克里斯多夫 史崔克豪斯
Original Assignee
美商恩特葛瑞斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商恩特葛瑞斯股份有限公司 filed Critical 美商恩特葛瑞斯股份有限公司
Publication of TW202301540A publication Critical patent/TW202301540A/zh
Application granted granted Critical
Publication of TWI800407B publication Critical patent/TWI800407B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Gasket Seals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Closures For Containers (AREA)
TW111122053A 2021-06-14 2022-06-14 具有門襯墊之基板容器 TWI800407B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163210342P 2021-06-14 2021-06-14
US63/210,342 2021-06-14

Publications (2)

Publication Number Publication Date
TW202301540A TW202301540A (zh) 2023-01-01
TWI800407B true TWI800407B (zh) 2023-04-21

Family

ID=84490664

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111122053A TWI800407B (zh) 2021-06-14 2022-06-14 具有門襯墊之基板容器

Country Status (6)

Country Link
US (1) US20220406637A1 (zh)
EP (1) EP4356420A1 (zh)
KR (1) KR20240018635A (zh)
CN (1) CN117425955A (zh)
TW (1) TWI800407B (zh)
WO (1) WO2022266005A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150122699A1 (en) * 2012-05-04 2015-05-07 Entegris, Inc. Wafer container with door interface seal
US20160141194A1 (en) * 2013-06-18 2016-05-19 Entegris, Inc. Front opening wafer container with weight ballast
US20180204751A1 (en) * 2015-07-13 2018-07-19 Entegris, Inc. Substrate container with enhanced containment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6354601B1 (en) * 1999-01-06 2002-03-12 Fluoroware, Inc. Seal for wafer containers
US7413099B2 (en) * 2001-06-08 2008-08-19 Shin-Etsu Polymer Co., Ltd. Sealing element with a protruding part approximately obliquely outward and a hermetic container using the same
US6719302B2 (en) * 2001-07-02 2004-04-13 Vertex, Inc. Symmetrical gasket for a pipe joint with increased surface contact
JP2005225545A (ja) * 2004-02-16 2005-08-25 Miraial Kk シール部材
JP4482655B2 (ja) * 2005-04-22 2010-06-16 ゴールド工業株式会社 精密基板収納容器のガスケット
JP2007062804A (ja) * 2005-08-31 2007-03-15 Miraial Kk シール部材
JP5151241B2 (ja) * 2007-05-10 2013-02-27 Ｎｏｋ株式会社 密封構造
JP5281697B2 (ja) * 2010-01-26 2013-09-04 ミライアル株式会社 半導体ウエハ収納容器
KR101183027B1 (ko) * 2012-06-18 2012-09-14 (주)상아프론테크 밀봉 수납용기
US10985043B2 (en) * 2015-11-26 2021-04-20 Miraial Co., Ltd. Substrate housing container
DE102016105047A1 (de) * 2016-03-18 2017-09-21 Gea Mechanical Equipment Gmbh Dichtungsanordnung zur Abdichtung eines Spaltes
FR3058562B1 (fr) * 2016-11-07 2019-05-10 Pfeiffer Vacuum Dispositif et procede de controle de l'etancheite d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs
CN110870055B (zh) * 2017-07-07 2023-09-08 信越聚合物股份有限公司 基板收纳容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150122699A1 (en) * 2012-05-04 2015-05-07 Entegris, Inc. Wafer container with door interface seal
US20160141194A1 (en) * 2013-06-18 2016-05-19 Entegris, Inc. Front opening wafer container with weight ballast
US20180204751A1 (en) * 2015-07-13 2018-07-19 Entegris, Inc. Substrate container with enhanced containment

Also Published As

Publication number Publication date
US20220406637A1 (en) 2022-12-22
CN117425955A (zh) 2024-01-19
WO2022266005A1 (en) 2022-12-22
EP4356420A1 (en) 2024-04-24
KR20240018635A (ko) 2024-02-13
TW202301540A (zh) 2023-01-01

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