TWI800401B - 具有殘餘應力補償及聲阻之回饋控制的聲學裝置 - Google Patents

具有殘餘應力補償及聲阻之回饋控制的聲學裝置 Download PDF

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Publication number
TWI800401B
TWI800401B TW111121256A TW111121256A TWI800401B TW I800401 B TWI800401 B TW I800401B TW 111121256 A TW111121256 A TW 111121256A TW 111121256 A TW111121256 A TW 111121256A TW I800401 B TWI800401 B TW I800401B
Authority
TW
Taiwan
Prior art keywords
acoustic
feedback control
residual stress
stress compensation
devices
Prior art date
Application number
TW111121256A
Other languages
English (en)
Other versions
TW202304021A (zh
Inventor
席亞赫 迪米崔維奇 巴蘇科
Original Assignee
美商天工方案公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商天工方案公司 filed Critical 美商天工方案公司
Publication of TW202304021A publication Critical patent/TW202304021A/zh
Application granted granted Critical
Publication of TWI800401B publication Critical patent/TWI800401B/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/02—Circuits for transducers, loudspeakers or microphones for preventing acoustic reaction, i.e. acoustic oscillatory feedback
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0054—For holding or placing an element in a given position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0056—Adjusting the distance between two elements, at least one of them being movable, e.g. air-gap tuning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/10—Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H04R3/04—Circuits for transducers, loudspeakers or microphones for correcting frequency response
    • H04R3/06—Circuits for transducers, loudspeakers or microphones for correcting frequency response of electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
TW111121256A 2021-06-17 2022-06-08 具有殘餘應力補償及聲阻之回饋控制的聲學裝置 TWI800401B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202163202608P 2021-06-17 2021-06-17
US202163202611P 2021-06-17 2021-06-17
US63/202,611 2021-06-17
US63/202,608 2021-06-17

Publications (2)

Publication Number Publication Date
TW202304021A TW202304021A (zh) 2023-01-16
TWI800401B true TWI800401B (zh) 2023-04-21

Family

ID=82705333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111121256A TWI800401B (zh) 2021-06-17 2022-06-08 具有殘餘應力補償及聲阻之回饋控制的聲學裝置

Country Status (3)

Country Link
US (2) US20220408195A1 (zh)
GB (2) GB2609299B (zh)
TW (1) TWI800401B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220408208A1 (en) * 2021-06-17 2022-12-22 Skyworks Solutions, Inc. Method of manufacturing acoustic devices with improved sensitivity

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200622240A (en) * 2004-09-13 2006-07-01 Octec Inc Apparatus and method for inspecting minute structure
TW200639407A (en) * 2005-03-03 2006-11-16 Tokyo Electron Ltd Minute structure inspection device, minute structure inspection method, and minute structure inspection program

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US7493821B2 (en) * 2005-04-16 2009-02-24 Yunlong Wang Micromachined acoustic transducer and method of operating the same
US7538477B2 (en) * 2006-11-27 2009-05-26 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-layer transducers with annular contacts
WO2009126378A2 (en) * 2008-03-11 2009-10-15 Drexel University Enhanced detection sensitivity with piezoelectric microcantilever sensors
US8141427B2 (en) * 2008-06-04 2012-03-27 Georgia Tech Research Corporation Piezoelectric and piezoresistive cantilever sensors
JP5325630B2 (ja) * 2009-03-27 2013-10-23 株式会社東芝 マイクロホン装置並びにその調整装置及び調整方法
US9712128B2 (en) * 2014-02-09 2017-07-18 Sitime Corporation Microelectromechanical resonator
US9866938B2 (en) * 2015-02-19 2018-01-09 Knowles Electronics, Llc Interface for microphone-to-microphone communications
US10045121B2 (en) * 2016-04-29 2018-08-07 Invensense, Inc. Microelectromechanical systems (MEMS) microphone bias voltage
US10063978B2 (en) * 2016-09-13 2018-08-28 Akustica, Inc. Cantilevered shear resonance microphone
US11254559B2 (en) * 2017-03-05 2022-02-22 Kris Vossough FET based sensory systems
DE102017208911A1 (de) * 2017-05-26 2018-11-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanischer Schallwandler
WO2019178355A1 (en) * 2018-03-16 2019-09-19 Vesper Technologies, Inc. Transducer system with configurable acoustic overload point
IT201900019058A1 (it) * 2019-10-16 2021-04-16 St Microelectronics Srl Trasduttore con disposizione piezoelettrica migliorata, dispositivo mems comprendente il trasduttore, e metodi di fabbricazione del trasduttore
US11323797B2 (en) * 2020-07-11 2022-05-03 xMEMS Labs, Inc. Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer
US11399228B2 (en) * 2020-07-11 2022-07-26 xMEMS Labs, Inc. Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200622240A (en) * 2004-09-13 2006-07-01 Octec Inc Apparatus and method for inspecting minute structure
TW200639407A (en) * 2005-03-03 2006-11-16 Tokyo Electron Ltd Minute structure inspection device, minute structure inspection method, and minute structure inspection program

Also Published As

Publication number Publication date
GB202208891D0 (en) 2022-08-10
GB2618713A (en) 2023-11-15
TW202304021A (zh) 2023-01-16
US20220408195A1 (en) 2022-12-22
GB202312523D0 (en) 2023-09-27
GB2609299A (en) 2023-02-01
US20220408185A1 (en) 2022-12-22
GB2609299B (en) 2023-11-22

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