TWI800336B - 半導體結晶晶圓的製造方法及製造裝置 - Google Patents
半導體結晶晶圓的製造方法及製造裝置 Download PDFInfo
- Publication number
- TWI800336B TWI800336B TW111111939A TW111111939A TWI800336B TW I800336 B TWI800336 B TW I800336B TW 111111939 A TW111111939 A TW 111111939A TW 111111939 A TW111111939 A TW 111111939A TW I800336 B TWI800336 B TW I800336B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor crystal
- crystal wafer
- manufacturing semiconductor
- wafer
- manufacturing
- Prior art date
Links
- 239000013078 crystal Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-160583 | 2021-09-30 | ||
JP2021160583A JP7007625B1 (ja) | 2021-09-30 | 2021-09-30 | 半導体結晶ウェハの製造方法および製造装置 |
JP2021205895A JP7041931B1 (ja) | 2021-12-20 | 2021-12-20 | 半導体結晶ウェハの製造方法および製造装置 |
JP2021-205895 | 2021-12-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202316510A TW202316510A (zh) | 2023-04-16 |
TWI800336B true TWI800336B (zh) | 2023-04-21 |
Family
ID=85782148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111111939A TWI800336B (zh) | 2021-09-30 | 2022-03-29 | 半導體結晶晶圓的製造方法及製造裝置 |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI800336B (zh) |
WO (1) | WO2023053476A1 (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080277667A1 (en) * | 2005-01-07 | 2008-11-13 | Sumitomo Electric Industries, Ltd. | Method of producing III-nitride substrate |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010099808A (ja) * | 2008-10-27 | 2010-05-06 | Sumitomo Metal Fine Technology Co Ltd | ワイヤソー装置 |
JP2018064030A (ja) * | 2016-10-13 | 2018-04-19 | 株式会社Tkx | マルチワイヤソー装置 |
JP6604313B2 (ja) * | 2016-11-10 | 2019-11-13 | 株式会社Sumco | 砥粒の評価方法並びにウェーハの製造方法 |
JP2019188510A (ja) * | 2018-04-24 | 2019-10-31 | 住友電気工業株式会社 | 炭化珪素基板の製造方法 |
-
2022
- 2022-02-03 WO PCT/JP2022/004211 patent/WO2023053476A1/ja unknown
- 2022-03-29 TW TW111111939A patent/TWI800336B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080277667A1 (en) * | 2005-01-07 | 2008-11-13 | Sumitomo Electric Industries, Ltd. | Method of producing III-nitride substrate |
Also Published As
Publication number | Publication date |
---|---|
WO2023053476A1 (ja) | 2023-04-06 |
TW202316510A (zh) | 2023-04-16 |
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