TWI799783B - Etching solution, replenishing solution, and method of forming copper wiring - Google Patents

Etching solution, replenishing solution, and method of forming copper wiring Download PDF

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Publication number
TWI799783B
TWI799783B TW110102077A TW110102077A TWI799783B TW I799783 B TWI799783 B TW I799783B TW 110102077 A TW110102077 A TW 110102077A TW 110102077 A TW110102077 A TW 110102077A TW I799783 B TWI799783 B TW I799783B
Authority
TW
Taiwan
Prior art keywords
solution
copper wiring
forming copper
replenishing
etching solution
Prior art date
Application number
TW110102077A
Other languages
Chinese (zh)
Other versions
TW202136581A (en
Inventor
浜口仁美
仁頃丈二郎
Original Assignee
日商Ｍｅｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｍｅｃ股份有限公司 filed Critical 日商Ｍｅｃ股份有限公司
Publication of TW202136581A publication Critical patent/TW202136581A/en
Application granted granted Critical
Publication of TWI799783B publication Critical patent/TWI799783B/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW110102077A 2020-01-24 2021-01-20 Etching solution, replenishing solution, and method of forming copper wiring TWI799783B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-009907 2020-01-24
JP2020009907A JP7129711B2 (en) 2020-01-24 2020-01-24 Etching liquid, replenishing liquid and method for forming copper wiring

Publications (2)

Publication Number Publication Date
TW202136581A TW202136581A (en) 2021-10-01
TWI799783B true TWI799783B (en) 2023-04-21

Family

ID=76921623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110102077A TWI799783B (en) 2020-01-24 2021-01-20 Etching solution, replenishing solution, and method of forming copper wiring

Country Status (4)

Country Link
JP (2) JP7129711B2 (en)
KR (1) KR20210095806A (en)
CN (1) CN113179590A (en)
TW (1) TWI799783B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7505836B1 (en) 2024-02-21 2024-06-25 メック株式会社 Etching solution, replenishment solution, and method for forming copper wiring

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079284A (en) * 2007-09-04 2009-04-16 Mec Kk Etching liquid, and method for forming conductor pattern
JP2009221596A (en) * 2008-02-20 2009-10-01 Mec Kk Etching liquid, and method for forming copper wiring using the same
JP2013104104A (en) * 2011-11-14 2013-05-30 Mec Kk Etching solution, replenishment solution, and method for forming copper wiring
JP2014224303A (en) * 2013-04-15 2014-12-04 メック株式会社 Etchant, replenishment liquid, and method for forming copper wiring
TW201829744A (en) * 2016-10-31 2018-08-16 韓商易案愛富科技有限公司 Etching composition
TW201920766A (en) * 2017-09-22 2019-06-01 日商Ｍｅｃ股份有限公司 Microetching agent for copper, copper surface roughening method and wiring board production method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4224436B2 (en) 2003-07-25 2009-02-12 メック株式会社 Etching agent, replenisher, and copper wiring manufacturing method using the same
JP6000420B1 (en) * 2015-08-31 2016-09-28 メック株式会社 Etching solution, replenisher, and method for forming copper wiring
JP6736088B2 (en) 2017-05-22 2020-08-05 メック株式会社 Etching solution, replenishing solution and method for forming copper wiring

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079284A (en) * 2007-09-04 2009-04-16 Mec Kk Etching liquid, and method for forming conductor pattern
JP2009221596A (en) * 2008-02-20 2009-10-01 Mec Kk Etching liquid, and method for forming copper wiring using the same
JP2013104104A (en) * 2011-11-14 2013-05-30 Mec Kk Etching solution, replenishment solution, and method for forming copper wiring
JP2014224303A (en) * 2013-04-15 2014-12-04 メック株式会社 Etchant, replenishment liquid, and method for forming copper wiring
TW201829744A (en) * 2016-10-31 2018-08-16 韓商易案愛富科技有限公司 Etching composition
TW201920766A (en) * 2017-09-22 2019-06-01 日商Ｍｅｃ股份有限公司 Microetching agent for copper, copper surface roughening method and wiring board production method

Also Published As

Publication number Publication date
JP2022008849A (en) 2022-01-14
CN113179590A (en) 2021-07-27
KR20210095806A (en) 2021-08-03
JP7129711B2 (en) 2022-09-02
JP2021116449A (en) 2021-08-10
TW202136581A (en) 2021-10-01

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