TWI799766B - Method for manufacturing semiconductor film by using sputtering technology - Google Patents
Method for manufacturing semiconductor film by using sputtering technology Download PDFInfo
- Publication number
- TWI799766B TWI799766B TW109144478A TW109144478A TWI799766B TW I799766 B TWI799766 B TW I799766B TW 109144478 A TW109144478 A TW 109144478A TW 109144478 A TW109144478 A TW 109144478A TW I799766 B TWI799766 B TW I799766B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor film
- manufacturing semiconductor
- sputtering technology
- sputtering
- technology
- Prior art date
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109144478A TWI799766B (en) | 2020-12-16 | 2020-12-16 | Method for manufacturing semiconductor film by using sputtering technology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109144478A TWI799766B (en) | 2020-12-16 | 2020-12-16 | Method for manufacturing semiconductor film by using sputtering technology |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202226347A TW202226347A (en) | 2022-07-01 |
TWI799766B true TWI799766B (en) | 2023-04-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109144478A TWI799766B (en) | 2020-12-16 | 2020-12-16 | Method for manufacturing semiconductor film by using sputtering technology |
Country Status (1)
Country | Link |
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TW (1) | TWI799766B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040045810A1 (en) * | 2002-09-05 | 2004-03-11 | Plasmion Corporation | Apparatus and method of forming thin film from negatively charged sputtered ions |
US20050011757A1 (en) * | 2003-07-16 | 2005-01-20 | Toshinari Noda | Sputtering apparatus |
TW200532040A (en) * | 2004-03-26 | 2005-10-01 | Applied Films Gmbh & Co Kg | Device for reactive sputtering |
US20120118726A1 (en) * | 2009-11-18 | 2012-05-17 | Idemitsu Kosan Co., Ltc. | In-ga-zn-o type sputtering target |
US20180044780A1 (en) * | 2004-02-22 | 2018-02-15 | Zond, Llc | Apparatus and method for sputtering hard coatings |
-
2020
- 2020-12-16 TW TW109144478A patent/TWI799766B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040045810A1 (en) * | 2002-09-05 | 2004-03-11 | Plasmion Corporation | Apparatus and method of forming thin film from negatively charged sputtered ions |
US20050011757A1 (en) * | 2003-07-16 | 2005-01-20 | Toshinari Noda | Sputtering apparatus |
US20180044780A1 (en) * | 2004-02-22 | 2018-02-15 | Zond, Llc | Apparatus and method for sputtering hard coatings |
TW200532040A (en) * | 2004-03-26 | 2005-10-01 | Applied Films Gmbh & Co Kg | Device for reactive sputtering |
US20120118726A1 (en) * | 2009-11-18 | 2012-05-17 | Idemitsu Kosan Co., Ltc. | In-ga-zn-o type sputtering target |
Also Published As
Publication number | Publication date |
---|---|
TW202226347A (en) | 2022-07-01 |
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