TWI799758B - Wafer fixing device and its forming method, plasma processing equipment - Google Patents

Wafer fixing device and its forming method, plasma processing equipment Download PDF

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Publication number
TWI799758B
TWI799758B TW109140825A TW109140825A TWI799758B TW I799758 B TWI799758 B TW I799758B TW 109140825 A TW109140825 A TW 109140825A TW 109140825 A TW109140825 A TW 109140825A TW I799758 B TWI799758 B TW I799758B
Authority
TW
Taiwan
Prior art keywords
fixing device
forming method
processing equipment
plasma processing
wafer fixing
Prior art date
Application number
TW109140825A
Other languages
Chinese (zh)
Other versions
TW202125693A (en
Inventor
涂樂義
如彬 葉
Original Assignee
大陸商中微半導體設備（上海）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商中微半導體設備（上海）股份有限公司 filed Critical 大陸商中微半導體設備（上海）股份有限公司
Publication of TW202125693A publication Critical patent/TW202125693A/en
Application granted granted Critical
Publication of TWI799758B publication Critical patent/TWI799758B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW109140825A 2019-12-13 2020-11-20 Wafer fixing device and its forming method, plasma processing equipment TWI799758B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911283373.3 2019-12-13
CN201911283373.3A CN112992635B (en) 2019-12-13 2019-12-13 Wafer fixing device, forming method thereof and plasma processing equipment

Publications (2)

Publication Number Publication Date
TW202125693A TW202125693A (en) 2021-07-01
TWI799758B true TWI799758B (en) 2023-04-21

Family

ID=76341720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109140825A TWI799758B (en) 2019-12-13 2020-11-20 Wafer fixing device and its forming method, plasma processing equipment

Country Status (2)

Country Link
CN (1) CN112992635B (en)
TW (1) TWI799758B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113990727B (en) * 2021-12-24 2022-03-15 北京凯世通半导体有限公司 Ultra-low temperature wafer injection platform

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170133258A1 (en) * 2014-06-23 2017-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
TW201836056A (en) * 2017-01-20 2018-10-01 美商應用材料股份有限公司 Electrostatic chuck with radio frequency isolated heaters
US20190244788A1 (en) * 2016-07-25 2019-08-08 Lam Research Corporation Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge rf generators

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB880475A (en) * 1957-02-09 1961-10-25 John Somerset Murray Transistor amplifier providing a balanced output signal
JP2000216231A (en) * 1999-01-20 2000-08-04 Hitachi Ltd Electrostatic chucking device and semiconductor manufacturing apparatus
CN104112638B (en) * 2013-04-22 2017-07-18 中微半导体设备(上海)有限公司 A kind of plasma-reaction-chamber and its electrostatic chuck
CN104752130A (en) * 2013-12-30 2015-07-01 中微半导体设备(上海)有限公司 Plasma-processing device and electrostatic chuck thereof
CN106898574A (en) * 2015-12-17 2017-06-27 北京北方微电子基地设备工艺研究中心有限责任公司 Electrostatic chuck mechanism and semiconductor processing equipment
KR20180019906A (en) * 2016-08-17 2018-02-27 삼성전자주식회사 Plasma etching apparatus and method of manufacturing semiconductor devices using the same
CN109216144B (en) * 2017-07-03 2021-08-06 中微半导体设备(上海)股份有限公司 Plasma reactor with low-frequency radio frequency power distribution adjusting function
CN109920716B (en) * 2017-12-13 2021-06-08 中微半导体设备(上海)股份有限公司 Plasma processing device and method for balancing etching rate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170133258A1 (en) * 2014-06-23 2017-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US20190244788A1 (en) * 2016-07-25 2019-08-08 Lam Research Corporation Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge rf generators
TW201836056A (en) * 2017-01-20 2018-10-01 美商應用材料股份有限公司 Electrostatic chuck with radio frequency isolated heaters

Also Published As

Publication number Publication date
CN112992635B (en) 2023-10-24
TW202125693A (en) 2021-07-01
CN112992635A (en) 2021-06-18

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