TWI799005B - Heat conduction plate and its manufacturing method - Google Patents
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Abstract
一種製法包括:第一殼體合併第二殼體成為中空的蒸氣室並接收毛細結構,第一殼體遮蔽第二殼體以狹道通到蒸氣室的連接端,致使狹道的抽氣端露出第一殼體外,毛細結構的凸部伸出蒸氣室而置入第一殼體和第二殼體之間,焊接蒸氣室周邊的第一殼體和第二殼體,卻跳過狹道與凸部,成為熱導板的半成品,並讓凸部周邊產生吸液間隙;工作流體經由吸液間隙進入蒸氣室中;封閉吸液間隙,決定工作流體的流量;透過抽氣端降低蒸氣室的氣體密度,操作工作流體布置在蒸氣室與毛細結構上;以及,封閉抽氣端,決定蒸氣室的流體壓力值,製作熱導板的完成品,符合薄型化的需求。A manufacturing method includes: the first shell merges with the second shell to form a hollow vapor chamber and receives the capillary structure, the first shell covers the second shell so that the narrow passage leads to the connection end of the vapor chamber, so that the suction end of the narrow passage Exposed outside the first shell, the convex part of the capillary structure protrudes out of the steam chamber and is placed between the first shell and the second shell, welding the first shell and the second shell around the vapor chamber, but skipping the narrow passage With the convex part, it becomes the semi-finished product of the heat guide plate, and creates a liquid suction gap around the convex part; the working fluid enters the steam chamber through the liquid suction gap; closes the liquid suction gap to determine the flow rate of the working fluid; lowers the steam chamber through the suction end The gas density of the operating fluid is arranged on the steam chamber and the capillary structure; and, the suction end is closed to determine the fluid pressure value of the steam chamber, and the finished product of the heat conduction plate is made to meet the demand for thinning.
Description
本發明涉及一種熱導板的製法,將工作流體導入蒸氣室。根據該項方法製成一個具備蒸氣室的熱導板(或稱均溫板)。The invention relates to a method for making a heat conducting plate, which guides working fluid into a vapor chamber. According to this method, a heat conduction plate (or a uniform temperature plate) with a vapor chamber is made.
已知工作流體在蒸氣室進行相變轉換,提升熱傳導速率,兼具較佳的散熱效果。隨著行動裝置的薄型化,導致具備蒸氣室的熱導板體積縮小,相對增加工作流體導入蒸氣室的困難度。It is known that the working fluid undergoes a phase change in the vapor chamber, which improves the heat transfer rate and has a better heat dissipation effect. With the thinning of mobile devices, the volume of the heat conduction plate with the vapor chamber is reduced, which relatively increases the difficulty of introducing the working fluid into the vapor chamber.
現有的熱導板,增加一些管體或流道,引導工作流體進入蒸氣室。完成後,從熱導板去除管體或流道。某些熱導板採用氣室,來完成工作流體導入蒸氣室的工作。Add some tubes or channels to the existing heat guide plate to guide the working fluid into the vapor chamber. When complete, remove the tube body or runner from the heat spreader. Some heat spreaders use air chambers to do the job of introducing the working fluid into the vapor chamber.
事實上,熱導板愈薄,入口愈窄,導致工作流體填充不易,降低熱導板的製作效率。In fact, the thinner the thermal guide plate is, the narrower the inlet is, making it difficult to fill the working fluid and reducing the production efficiency of the thermal guide plate.
因此,如何提升工作流體導入蒸氣室的流速,改善熱導板的製程,成為本發明亟待解決的課題。Therefore, how to increase the flow rate of the working fluid into the vapor chamber and improve the manufacturing process of the thermal conductive plate has become an urgent problem to be solved in the present invention.
鑒於此,本案發明人提出新的製作方法,主要目的在於:透過吸液間隙讓工作流體進入熱導板半成品的蒸氣室,藉由抽氣端降低蒸氣室的氣體密度,再封閉蒸氣室,取得熱導板的完成品。In view of this, the inventor of this case proposed a new manufacturing method, the main purpose of which is to allow the working fluid to enter the steam chamber of the semi-finished heat guide plate through the liquid suction gap, reduce the gas density of the steam chamber through the suction end, and then close the steam chamber to obtain The finished thermal plate.
本發明其他目的,在於:採用減壓方式排除蒸氣室內氣體,相對提升工作流體布置蒸氣室與毛細結構的速率,改善薄型化熱導板的製作效率。Other purposes of the present invention are to use decompression to remove gas from the steam chamber, relatively increase the speed of working fluid to arrange the steam chamber and capillary structure, and improve the production efficiency of the thinned heat conducting plate.
源於上述目的之達成,本發明製作熱導板的方法,包括下列的流程: 第一殼體合併第二殼體成為中空的蒸氣室並接收毛細結構,第一殼體遮蔽第二殼體以狹道通到蒸氣室的連接端,致使狹道的抽氣端露出第一殼體外,毛細結構的凸部伸出蒸氣室而置入第一殼體和第二殼體之間,焊接蒸氣室周邊的第一殼體和第二殼體,卻跳過狹道與凸部,成為熱導板的半成品,並讓凸部周邊產生吸液間隙; 工作流體經由吸液間隙進入蒸氣室中; 封閉吸液間隙,決定工作流體的流量; 透過抽氣端降低蒸氣室的氣體密度,操作工作流體布置在蒸氣室與毛細結構上;以及 封閉抽氣端,決定蒸氣室的流體壓力值,製作熱導板的完成品。 Due to the achievement of the above-mentioned purpose, the method for manufacturing a heat conduction plate of the present invention includes the following process: The first shell merges with the second shell to form a hollow vapor chamber and receives the capillary structure. The first shell covers the second shell and leads to the connection end of the vapor chamber with a narrow passage, so that the suction end of the narrow passage exposes the first shell. In vitro, the convex part of the capillary structure extends out of the steam chamber and is placed between the first shell and the second shell, welding the first shell and the second shell around the steam chamber, but skipping the narrow passage and the convex part, Become a semi-finished product of the heat guide plate, and create a liquid suction gap around the convex part; The working fluid enters the vapor chamber through the suction gap; Close the suction gap to determine the flow of working fluid; The gas density of the vapor chamber is reduced through the suction port, and the operating working fluid is arranged on the vapor chamber and the capillary structure; and Close the suction end, determine the fluid pressure value of the steam chamber, and make the finished product of the heat conduction plate.
其中,第一殼體以容納槽的開口對著第二殼體的氣室開口成為中空的蒸氣室。而且,毛細結構置入容納槽,並接觸氣室底部的顆粒。Wherein, the opening of the receiving groove of the first housing faces the opening of the air chamber of the second housing to form a hollow vapor chamber. Furthermore, the capillary structure is placed into the holding tank and contacts the particles at the bottom of the air chamber.
所述的方法製作一種熱導板,包括: 一個第一殼體的底面形成一個容納槽; 一個第二殼體的頂面形成一個氣室,以及一個狹道的一個連接端通到氣室,另端為抽氣端;以及 一個毛細結構周邊延伸一個凸部。 Described method makes a kind of thermal guide plate, comprises: A receiving groove is formed on the bottom surface of the first housing; An air chamber is formed on the top surface of a second housing, and a connection end of a narrow passage leads to the air chamber, and the other end is an air suction end; and A protrusion extends around a capillary structure.
當第一殼體的底面接觸第二殼體的頂面,該第一殼體遮蔽狹道的連接端,使抽氣端露出第一殼體外。該容納槽的開口對著該氣室開口組成一個蒸氣室,該蒸氣室接收工作流體和毛細結構,該凸部伸出蒸氣室並置入第一殼體與該第二殼體之間,在凸部周邊有至少一個吸液間隙。焊接蒸氣室周邊的第一殼體和第二殼體,封閉抽氣端與吸液間隙,以密閉的蒸氣室保留工作流體和毛細結構。When the bottom surface of the first casing touches the top surface of the second casing, the first casing covers the connecting end of the narrow passage, so that the suction end is exposed outside the first casing. The opening of the accommodating groove faces the opening of the air chamber to form a steam chamber, which receives the working fluid and capillary structure, and the convex part extends out of the steam chamber and is placed between the first casing and the second casing. There is at least one liquid suction gap around the convex part. The first casing and the second casing around the vapor chamber are welded, the suction end and the liquid suction gap are closed, and the working fluid and capillary structure are retained in the sealed vapor chamber.
其中,該毛細結構置入所述的容納槽。而且,該毛細結構接觸該氣室的底部陣列一組顆粒。Wherein, the capillary structure is put into the accommodating groove. Also, the capillary structure contacts the bottom of the gas chamber to array a set of particles.
如此,本發明的方法,透過吸液間隙讓工作流體進入熱導板半成品的蒸氣室,藉由抽氣端降低蒸氣室的氣體密度,再封閉蒸氣室,取得熱導板的完成品。當然,採用減壓方式排除蒸氣室內氣體,相對提升工作流體布置蒸氣室與毛細結構的速率,改善薄型化熱導板的製作效率,符合薄型化的需求。In this way, the method of the present invention allows the working fluid to enter the steam chamber of the semi-finished heat conduction plate through the liquid suction gap, reduces the gas density of the steam chamber through the suction port, and then closes the vapor chamber to obtain the finished heat conduction plate. Of course, the use of decompression to remove the gas in the steam chamber can relatively increase the speed of the working fluid to arrange the steam chamber and the capillary structure, and improve the production efficiency of the thinner heat conduction plate, which meets the demand for thinner.
為使本發明之目的、特徵和優點,淺顯易懂,茲舉一個或以上較佳的實施例,配合所附的圖式詳細說明如下。In order to make the purpose, features and advantages of the present invention easy to understand, one or more preferred embodiments will be described in detail as follows in conjunction with the attached drawings.
接下來,結合附圖,描述本案的實施例。附圖中,用相同的標號表示相同或近似的結構或單元。可預知的是,所述的實施例僅為本案部分的範例,不是全部的實施例。基於所述的範例能夠推演獲得其他的實施例,或視需要更改、變化的構造,均屬本案保護的範圍。Next, in conjunction with the accompanying drawings, describe the embodiment of this case. In the drawings, the same or similar structures or units are denoted by the same reference numerals. It is foreseeable that the described embodiments are only some examples of this case, not all embodiments. Other embodiments that can be deduced based on the examples described above, or structures that can be modified or changed as needed, all belong to the scope of protection of this case.
在以下描述中,方向用語如「上」、「下」、「左」、「右」、「前」、「後」、「內」、「外」與「側面」,只是參照附圖的方向。方向用語的使用,是為了更好的、更清楚的描述且理解本案,不明示或暗示所述的裝置或元件必須具備特定的方位、構造和操作,故不能理解為對本案技術內容的限制。In the following descriptions, directional terms such as "upper", "lower", "left", "right", "front", "rear", "inner", "outer" and "side" refer only to the directions of the drawings . The use of directional terms is for a better and clearer description and understanding of this case, and does not express or imply that the device or component described must have a specific orientation, structure, and operation, so it cannot be understood as a limitation on the technical content of this case.
除非特定且明確的規範和限定,在以下描述中,「安裝」、「相連」、「連接」或「設在…上」應做廣義理解,例如固定連接、拆卸式連接、一體連接、機械連接、直接地相連、間接地相連或是兩個元件內部的連接。對屬於本案領域的技術人員而言,憑藉普通知識或經驗能夠理解上述術語在各個實施例,甚至於本案具體的含義。In the following descriptions, "mounted", "connected", "connected" or "set on" should be interpreted in a broad sense, such as fixed connection, detachable connection, integral connection, mechanical connection, unless there are specific and clear specifications and limitations , directly connected, indirectly connected, or internally connected between two elements. Those skilled in the field of this case can understand the specific meanings of the above terms in each embodiment and even this case by virtue of common knowledge or experience.
除非另有說明,在以下描述中,「多個」表示兩個或兩個以上。Unless otherwise specified, in the following description, "plurality" means two or more.
第1圖是流程圖,顯示本發明從一道「組合10」步驟開始,歷經「吸液12」和「吸液口密封14」二道步驟,進行一道「抽氣16」程序後,至一道「抽氣口密封18」步驟結束,製作熱導板的完成品。Figure 1 is a flow chart showing that the present invention starts from a "
描述製程前,先瞭解如第2〜5圖所示一個熱導板20,包括一個第一殼體21、一個第二殼體30與一個毛細結構40等零組件。其中,該第一殼體21是薄的矩形片,擁有一個頂面22和一個底面23。一個容納槽24形成於該底面23的中間部位,界定該第一殼體21圍在容納槽24四周的部分為二個側邊25、一個寬邊26和一個窄邊27。Before describing the manufacturing process, let us understand that a
該第二殼體30也是薄的矩形片,同樣具備頂面31與底面32。不同的是,一個氣室33形成於該頂面31的中間部位,將第二殼體30圍在該氣室33的四邊視為側邊36、寬邊37和窄邊38,該寬邊37陷入二個狹道39,該狹道39的一個連接端39a通到氣室33,另端為抽氣端39b。另外,一組顆粒35陣列在該氣室33的底部34。The
該毛細結構40呈現矩形設計,其擁有二個長邊42和二個短邊43。一個指示部44與一個凸部45分別設在兩個短邊43。二個長邊42之間則是陣列在毛細結構40的一組網目41。在本實施例,該指示部44是半圓槽。某些實施例中,該指示部44是其他的幾何形體。The
接下來,配合第1〜6圖陳述製作熱導板20的流程。Next, the process of making the
在「組合10」步驟中,在側邊25對側邊36、寬邊26對寬邊37(或窄邊27對窄邊38)模式下,使第一殼體21合併第二殼體30成為中空的蒸氣室50來接收毛細結構40。In the "
此處所稱的蒸氣室50,泛指所述容納槽24的開口對著所述氣室33的開口,共同圍成一定容積的內部空間。而且,毛細結構40置入容納槽24,並接觸氣室33底部34的顆粒35。The
合併期間,該第一殼體21的寬邊26遮蔽狹道39通到蒸氣室50的連接端39a,致使狹道39的抽氣端39b露出第一殼體21外。此刻,該凸部45伸出蒸氣室50而置入兩個窄邊27、38(或第一殼體21和第二殼體30)之間。焊接蒸氣室50周邊的第一、第二殼體21、30,卻跳過狹道39與凸部45,成為熱導板20的半成品。該凸部45被兩個窄邊27、38圍著的周邊產生至少一道吸液間隙51。During merging, the
在「吸液12」步驟中,工作流體(圖未示)經由吸液間隙51進入蒸氣室50中。沿著吸入52(見第6圖)方向,工作流體(譬如:水)根據毛細現象,通常會經由凸部45與兩個窄邊27、38的縫隙漫延至蒸氣室50內。In the step of “
在「吸液口密封14」程序中,焊接兩個窄邊27、38覆蓋凸部45的段落,封閉吸液間隙51使其堵塞不得通往外界,從而決定工作流體進入蒸氣室50的流量。In the procedure of "sealing the
在「抽氣16」步驟中,沿著抽出53(見第6圖)方向,利用一套減壓設備(圖未示)對著抽氣端39b產生可控的吸力。因為蒸氣室50的氣體密度降低,所以工作流體布置在蒸氣室50與毛細結構40的速率,變得既快速,又均勻。In the step of "
最後是「抽氣口密封18」步驟,焊接第一殼體21的寬邊26遮蔽狹道39的段落,堵塞狹道39且封閉抽氣端39b,決定蒸氣室50的流體(包含水和空氣)壓力值,製作熱導板20的完成品,符合薄型化需求。Finally, there is the step of "sealing the
具體而言,所述方法製作的熱導板20,包括:一個第一殼體21的底面23形成一個容納槽24;一個第二殼體30的頂面31形成一個氣室33,一個狹道39的一個連接端39a通到氣室33,另端為抽氣端39b;以及,一個毛細結構40周邊延伸一個凸部45。Specifically, the
當第一殼體21的底面23接觸第二殼體30的頂面31,該第一殼體21遮蔽狹道39的連接端39a,使抽氣端39b露出第一殼體21外。該容納槽24的開口對著該氣室33開口組成一個蒸氣室50,該蒸氣室50接收工作流體和毛細結構40,該凸部45伸出蒸氣室50並置入第一殼體21與該第二殼體30之間,在凸部45周邊有至少一個吸液間隙51。焊接蒸氣室50周邊的第一殼體21和第二殼體30,封閉抽氣端39b與吸液間隙51,以密閉的蒸氣室50保留工作流體和毛細結構40。When the
其中,該毛細結構40置入所述的容納槽24,該毛細結構40接觸該氣室33的底部34陣列一組顆粒35。Wherein, the
在不背離本案廣義的概念下,熟習此項技術者能理解,並對上開的實施例進行改變。因此,本案不限於說明書揭示的特定實施例,舉凡根據本案精神與技術範疇所為的修改,均應為申請專利範圍界定的文字內容所涵蓋和保護。Those skilled in the art can understand and make changes to the above-disclosed embodiments without departing from the broad concepts of the present disclosure. Therefore, this case is not limited to the specific embodiments disclosed in the specification, and all modifications made according to the spirit and technical scope of this case shall be covered and protected by the textual content defined in the scope of the patent application.
10:組合12:吸液
14:吸液口密封16:抽氣
18:抽氣口密封
20:熱導板21:第一殼體
22、31:頂面23、32:底面
24:容納槽25、36:側邊
26、37:寬邊27、38:窄邊
30:第二殼體33:氣室
34:底部35:顆粒
39:狹道
40:毛細結構41:網目
42:長邊43:短邊
44:指示部45:凸部
50:蒸氣室51:吸液間隙
52:吸入53:抽出
10: combination 12: liquid absorption
14: Liquid suction port seal 16: Air extraction
18: Air suction port seal
20: thermal guide plate 21:
第1圖是本發明製作熱導板的流程。 第2圖是製作熱導板所需的零組件。 第3圖繪製熱導板的俯視圖。 第4、5圖是沿著第3圖的不同角度切開熱導板。 第6圖透視熱導板內部導入工作流體的動作。 Fig. 1 is the process flow of the present invention to make the heat conduction plate. Figure 2 shows the components needed to make the heat guide. Figure 3 draws a top view of the heat spreader. Figures 4 and 5 are cutting the heat guide plate at different angles along Figure 3. Figure 6 sees through the action of introducing working fluid inside the heat guide plate.
10:組合 10: combination
12:吸液 12: Suction
14:吸液口密封 14: Liquid suction port seal
16:抽氣 16: Pumping
18:抽氣口密封 18: Air suction port seal
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TW110147052A TWI799005B (en) | 2021-12-15 | 2021-12-15 | Heat conduction plate and its manufacturing method |
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TW (1) | TWI799005B (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102092307B1 (en) * | 2018-09-05 | 2020-03-23 | 조인셋 주식회사 | Vapor chamber |
TW202035937A (en) * | 2019-03-21 | 2020-10-01 | 賴耀惠 | Composite siphon vapor chamber the installation of a capillary structure can raise the hydraulic fluid to a position higher than the level of the hydraulic fluid, thereby the roll bond plate can be equipped with a heat source no matter it is at the bottom, middle or top side |
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2021
- 2021-12-15 TW TW110147052A patent/TWI799005B/en active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102092307B1 (en) * | 2018-09-05 | 2020-03-23 | 조인셋 주식회사 | Vapor chamber |
TW202035937A (en) * | 2019-03-21 | 2020-10-01 | 賴耀惠 | Composite siphon vapor chamber the installation of a capillary structure can raise the hydraulic fluid to a position higher than the level of the hydraulic fluid, thereby the roll bond plate can be equipped with a heat source no matter it is at the bottom, middle or top side |
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TW202326056A (en) | 2023-07-01 |
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