TWI794783B - Apparatus of transferring a plurality of chips and method of transferring a plurality of chips - Google Patents

Abstract

A device for transferring a plurality of wafers, comprising: a tape support configured to support an attachment tape having an adhesive layer pattern attached to a plurality of wafers; an ultraviolet laser light source configured on the belt support below and movable toward the attachment tape, the ultraviolet laser light source is configured to selectively irradiate ultraviolet laser light toward an area of the attachment tape where a selected one of the wafers is located, to selectively cure the one of the adhesive layer patterns; and a pick-up tool disposed above the tape support to be movable toward the attachment tape, the pick-up tool configured to pick up the selected one corresponding to the cured adhesive layer pattern from the attachment tape and place the selected wafer on the substrate.

Description

Device for transferring multiple wafers and method for transferring multiple wafers

The present invention relates to an apparatus for selectively transferring a plurality of wafers from an attachment tape and a method for selectively transferring a plurality of wafers using the apparatus.

While performing multiple semiconductor manufacturing processes, the step of transferring multiple wafers occurs quite frequently. Typically, wafers in a semiconductor wafer manufacturing process have been processed, re-sorted and transferred to subsequent steps, and the wafers are placed on attaching tapes.

In particular, in order to pick up the wafer from the attachment tape, it is possible to apply mechanical force to the wafer while using eject pins or posts. At this time, when a mechanical force is applied to the wafer, it may cause damage to the wafer.

On the other hand, in the case of picking up a plurality of wafers at a time, all wafers included in a predetermined area are picked up. All wafers arranged at the same pitch in a predetermined area may be picked up and transferred. Therefore, a re-sorting step of sorting the transferred wafers and the like in grades may be additionally required. Therefore, it may be necessary to provide an apparatus for transferring a wafer and a method for transferring a plurality of wafers to selectively pick up only some of the plurality of wafers arranged in a specific area.

The present invention provides an apparatus that selectively transfers a plurality of wafers in grades within a predetermined area without causing damage to the wafers.

The present invention provides a method for selectively transferring a plurality of wafers in grades within a predetermined area without causing damage to the wafers.

According to an exemplary embodiment of the present invention, an apparatus for transferring a plurality of wafers includes: a tape support configured to support an attachment tape having an adhesive layer pattern to which a plurality of wafers are attached; an ultraviolet laser light source , which is disposed under the tape support and can move toward the attachment tape, the ultraviolet laser light source is configured to selectively irradiate ultraviolet laser light toward the area of the attachment tape where a selected wafer of the wafers is located, so as to selectively curing one of the adhesive layer patterns in the area; and a pick-up tool disposed above the band support to be movable toward the attachment band, the pick-up tool being configured to pick up from the attachment band a corresponding patterning the selected wafer with the cured adhesive layer, and placing the selected wafer on the substrate.

In exemplary embodiments, the attachment tape may include a base layer and an adhesive layer pattern formed of an ultraviolet curable resin on the base layer.

Here, each of the adhesive layer patterns may be dotted. In addition, the adhesive layer patterns may respectively correspond to the wafers.

Alternatively, the adhesive layer patterns may be strip-shaped, respectively, and may be arranged in a matrix shape.

In an exemplary embodiment, the pick-up tool may include an adhesive layer having a flat surface therebelow.

According to an exemplary embodiment of the present invention, a method of transferring a plurality of wafers is performed by supporting an attachment tape having an adhesive layer pattern to which multiple wafers are attached. a wafer; selectively irradiating an area of the attachment tape where a selected wafer of the wafers is located to selectively cure one of the adhesive layer patterns in the area; picking up from the attachment tape a wafer corresponding to the pattern of the cured adhesive layer located in the region; and placing the wafer on the substrate.

In an exemplary embodiment, the attachment tape includes a base layer and an adhesive layer pattern formed on the base layer, the adhesive layer pattern having an ultraviolet curable resin.

Here, each of the adhesive layer patterns may be dotted.

In exemplary embodiments, the adhesive layer patterns may be strip-shaped, respectively, and may be arranged in a matrix shape.

In an exemplary embodiment, a pick-up tool may be used to pick up the wafer located in the selected area, and the pick-up tool may include an adhesive layer having a flat surface therebelow.

According to an exemplary embodiment of the present invention, an ultraviolet laser light source can selectively cure one of the adhesive layer patterns corresponding to a selected wafer in the area, and a pick-up tool is provided to pick up the selected wafer from the cured area of the attached tape And place the selected wafer on the substrate. Accordingly, selected ones of the plurality of wafers can be selectively transferred without causing damage to the wafers.

Meanwhile, even if the pick-up tool includes an adhesive layer having a flat surface without other protrusions, the pick-up tool can selectively pick up selected wafers corresponding to a specific grade in a specific area.

In addition, only selected wafers among a plurality of wafers arranged in a specific area may be selectively picked up. Therefore, a re-sorting step of sorting transferred wafers and the like can be omitted.

The above summary of the present disclosure is not intended to describe each illustrated embodiment or every implementation of the present disclosure. The Detailed Description and Claims that follow more particularly exemplify these embodiments.

10: Object

12: Wafer

12a: wafer body

12b: wafer pad

14: Attachment strap

14a: Basal layer

14b: Adhesive layer pattern

14c: Selected area

14d: Adhesive layer pattern

14e: Adhesive layer pattern

16: Install the frame

20: with support

24: support ring

26: Extension ring

30: Pickup Tool

40: Tool drive unit

50: Visual unit

60: Ultraviolet laser light source

70: Horizontal drive unit

100: device

Exemplary embodiments can be understood in more detail from the following description in conjunction with the accompanying drawings, wherein: FIG. 1 is a cross-sectional view illustrating an apparatus for transferring a wafer according to an exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an attachment tape to which a plurality of dies are attached.

Fig. 3 is a plan view showing an example of an attachment strap.

Fig. 4 is a plan view showing another example of the attachment strap.

FIG. 5 is a flowchart illustrating a method of transferring a wafer according to an exemplary embodiment of the present invention.

While various embodiments are susceptible to various modifications and alternative forms, details thereof have been shown in the drawings by way of example and will be described in detail. It should be understood, however, that the intention is not to limit the claimed invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the claims.

Hereinafter, specific embodiments will be described in detail with reference to the drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Throughout, like reference symbols refer to like elements. In the drawings, the dimensions of layers and regions are exaggerated for clarity of illustration.

Terms such as first, second, etc. may be used to describe various elements, but the above elements defined by the above terms should not be limited. The above terms are only used to distinguish one element from other elements. For example, in the present invention, without departing from the scope of the first component to the second component, they can be similarly named, and the second component to the first component can also be named.

The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting of the inventive concepts. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will be further understood that when the terms "comprising" and/or "comprises" are used in this specification, they specify the existence of said features, integers, steps, operations, elements and/or components, but do not exclude a or the presence or addition of multiple other features, integers, steps, operations, elements, components and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries, unless expressly defined herein, should be interpreted to have a meaning consistent with their meaning in the context of the relevant art, and not in an idealized or overly formal sense to explain.

FIG. 1 is a cross-sectional view illustrating an apparatus for transferring a wafer according to an exemplary embodiment of the present invention. FIG. 2 is a cross-sectional view showing an attachment tape to which a plurality of dies are attached.

Referring to FIGS. 1 and 2 , an apparatus 100 for transferring a wafer according to an embodiment of the present invention includes a tape support 20 , an ultraviolet (UV) laser light source 60 and a pick-up tool 30 . Apparatus 100 may pick up a plurality of wafers 12 attached to attachment tape 14 and may place wafers 12 on a substrate (not shown). The attachment strip 14 and the plurality of dies 12 attached to the attachment strip 14 are defined as an item 10 . Each wafer 12 includes a wafer body 12a and a chip pad 12b.

The attachment tape 14 includes a base layer 14a and an adhesive layer pattern 14b formed on the base layer 14a using an ultraviolet curable resin. When ultraviolet rays are irradiated to the adhesive layer patterns 14b, each adhesive layer pattern 14b has a second adhesive force decreased from the first adhesive force. Since the wafer 12 is adhered to the adhesive layer pattern 14b under the second adhesive force, the wafer 12 on the adhesive layer pattern 14b can be easily separated from the attachment tape 14 . Since the adhesive layer pattern 14b does not cover the entire area of the base layer 14a but is patterned to cover a partial area thereof, the pick-up tool 30 can easily pick up the wafer from the attaching tape 14 .

The tape support 20 supports the attachment tape 14 with the plurality of wafers 12 attached to the adhesive layer pattern 14b. For example, the strap support 20 may support the attachment strap 14 by maintaining the outer circumference of the attachment strap 14 .

The strap support 20 may include a support ring 24 for supporting the outer circumference of the attachment strap 14 , and an extension ring 26 for extending the attachment strap 14 by lowering the support ring 24 and the mounting frame 16 .

The ultraviolet laser light source 60 is disposed below the tape support 20 and is configured to be movable toward the attachment tape 14 . For example, the ultraviolet laser light source 60 can move in a horizontal direction or a vertical direction. The ultraviolet laser light source 60 can selectively irradiate ultraviolet laser light on the area of the attachment tape 14 where a selected one of the wafers is located. That is, the ultraviolet laser light source 60 is moved to selectively irradiate selected areas of the attachment tape 14 with ultraviolet laser light. Therefore, when one of the adhesive layer patterns 14b belonging to the selected area is selectively cured, the one of the adhesive layer patterns 14b has the second adhesive force decreased from the first adhesive force.

In addition, since the on/off of the ultraviolet laser light source is controlled, the ultraviolet laser light source 60 selectively irradiates ultraviolet laser light on some adhesive layer patterns 14b located in selected regions, and does not irradiate ultraviolet laser light on other patterns 14b. on the adhesive layer pattern 14b. Accordingly, certain adhesive layer patterns 14b located in selected regions may be selectively cured.

Therefore, as the ultraviolet laser light source 60 is moved and turned on/off, some adhesive layer patterns 14b may be cured. The wafer 12 that was previously tightly adhered to certain adhesive layer patterns 14b in selected regions loses the first adhesive force and becomes weakly adhered to certain adhesive layer patterns 14b. Therefore, since the pick-up tool 30 can selectively pick up the selected wafer 12 in the selected area of the attachment tape 14, it is possible to suppress possible damage to the wafer during the pick-up process, and it is possible to easily perform the pick-up process from Attachment belt 14 selectively picks up a plurality of wafers 12 .

The ultraviolet laser light source 60 can be connected to the horizontal driving unit 70 . The horizontal driving unit 70 can move the ultraviolet laser light source 60 in the horizontal direction, that is, in both the X direction and the Y direction.

The horizontal driving unit 70 may include, for example, a pair of guide rails (not shown) arranged to intersect each other and a body motion source (not shown), which uses a cylinder or a motor that generates a driving source to drive the ultraviolet laser light source 60 along the Rail moves.

A pick-up tool 30 is arranged above the belt support 20 so as to be movable towards the attachment belt 14 . The pick tool 30 picks up the wafer 12 located in the selected area from the attachment tape 14 and places it.

The pick-up tool 30 may include an adhesive layer 31 having a flat surface thereunder. The adhesive layer 31 can pick up the wafer 12 from the base layer 14 a because the adhesive layer 31 has an adhesive force higher than the second adhesive force that bonds the wafer 12 to the attachment tape 14 . Therefore, even if the pick-up tool 30 is provided with the adhesive layer 31 having a flat surface therebelow without separating protrusions, it is possible to selectively pick up wafers classified into a specific class in a specific area.

Alternatively, the pickup tool 30 may pick up the wafer 12 by using vacuum force.

Here, the pick-up tool 30 can selectively pick up wafers 12 having a weakened adhesion to the second adhesive force from the base layer 14 a while the flat surface of the pick-up tool 30 is in full contact with selected areas of the attachment tape 14 .

The pick-up tool 30 may be disposed over an object supported by the belt support 20 for transferring the object, and may be mounted on a tool driving unit 40 . The tool driving unit 40 can drive the pick tool 30 in horizontal and vertical directions, so that the pick tool 30 picks up the wafer 12 separated from the attaching tape 14 and transfers the wafer 12 .

In addition, a vision unit 50 for determining the position of the wafer 12 may be disposed above the object 10 supported by the tape support 20 . The vision unit 50 can acquire an image of the wafer 12 to be picked up, and acquire the position coordinates of the wafer 12 from the acquired wafer image.

Fig. 3 is a plan view showing an example of an attachment strap. Fig. 4 is a plan view showing another example of the attachment strap.

Referring to FIG. 3 , the attachment tape 14 may respectively include a base layer 14 a and an adhesive layer pattern 14 b disposed on the base layer 14 a and arranged in a dot shape.

The adhesive layer patterns 14 b arranged in dots partially overlap the respective wafers 12 . Therefore, the adhesive layer pattern 14 b does not fix the entire area of each die 12 on the attaching tape 14 , but partially adheres each die to the attaching tape 14 .

Certain adhesive layer patterns 14b define selected areas 14c of the attachment strip 14 . In selected regions 14c, certain adhesive layer patterns 14d may be cured while other adhesive layer patterns 14e may remain in an uncured state.

Therefore, when the adhesive layer patterns 14b respectively attaching the wafer 12 to the base layer 14a are selectively cured and the adhesive force is weakened by the reduced second adhesive force, the wafer 12 can be easily picked up.

Therefore, when the adhesive layer patterns 14b for attaching the wafers 12 to the base layer 14a respectively are selectively cured to weaken the adhesive force to have the second adhesive force, the pick-up tool 30 can easily pick up the wafers 12 .

The respective adhesive layer patterns 14 b may be provided corresponding to the respective wafers 12 . The respective adhesive layer patterns 14 b may be formed to overlap the center portions of the respective wafers 12 . Therefore, the central portion of each wafer 12 By bonding each adhesive layer pattern 14b to the base layer 14a, the periphery of each chip 12 is in a state of straddling the base layer 14a. Therefore, the pick-up tool 30 can easily pick up the wafer 12 from the base layer 14a.

Alternatively, each adhesive layer pattern 14 b may correspond to partially overlap the outer peripheral portion of each wafer 12 .

Fig. 4 is a plan view showing another example of the attachment strap.

Referring to FIG. 4 , the attachment tape 14 may include a base layer 14 a and adhesive layer patterns 14 b each having a stripe shape crossing each other and disposed on an upper surface of the base layer 14 a. Accordingly, the adhesive layer patterns 14b may be arranged in a matrix shape.

FIG. 5 is a flowchart illustrating a method of transferring a wafer according to an exemplary embodiment of the present invention.

Referring to FIG. 5 , an attachment tape attaching a plurality of wafers to an adhesive layer pattern is supported ( S110 ). The attachment tape is in a state where the wafer is bonded to the attachment tape. The attachment tape includes a base layer and an adhesive layer pattern made of ultraviolet curable resin and formed on the base layer.

Subsequently, ultraviolet laser light is selectively irradiated on the area of the die attach tape where selected ones of the wafers are located. Accordingly, certain adhesive layer patterns present in the region are selectively cured (S130).

After that, the wafer located in the selected area is separated from the cured adhesive layer pattern, and picked up from the attachment tape (S150). Here, a pick tool is used to pick up a die located in this area from the die attach tape. In this case, the pick-up tool comprises an adhesive layer with a flat surface underneath.

Subsequently, the wafer is placed on the substrate (S170). Therefore, only selected wafers among wafers arranged in a specific area can be selectively picked up. Therefore, a re-sorting step for sorting wafers and the like can be omitted.

Although the apparatus for transferring a plurality of wafers and the method for transferring a plurality of wafers have been described with reference to specific embodiments, they are not limited thereto. Therefore, those skilled in the art can easily understand that without departing from Various modifications and changes may be made within the spirit and scope of the present disclosure as defined by the appended claims.

10 objects 12 chips 14 Adhesive layer pattern 16 Install the frame 20 with support 24 Support ring 26 extension ring 30 pick tool 40 Tool drive unit 50 visual units 60 Ultraviolet laser light source 70 Horizontal drive unit 100 devices

Claims (12)

A device for transferring a plurality of wafers, characterized in that it includes: a tape support member configured to support an attachment tape having an adhesive layer pattern attached to a plurality of wafers; an ultraviolet laser light source configured on below the tape support and horizontally movable toward the attachment tape, the ultraviolet laser light source is configured to selectively irradiate ultraviolet laser light respectively toward certain adhesive layer patterns corresponding to selected wafers by turning on/off, and Selected areas include both certain areas where the selected wafers are located and other areas where unselected wafers are located, to selectively cure the certain adhesive layer patterns in the certain areas; and a pick-up tool configured above the tape support so as to be movable toward the attachment tape, the pick tool is configured to pick up the selected wafer corresponding to the cured adhesive layer pattern from the certain areas of the attachment tape while the pick tool is in contact with the All wafers in the selected area are contacted and the selected wafer is placed on the substrate. The device according to claim 1, wherein the attachment tape includes a base layer and an adhesive layer pattern formed of an ultraviolet curable resin on the base layer. The device according to claim 2, wherein each of the adhesive layer patterns is dot-shaped. The device as claimed in claim 3, wherein the adhesive layer patterns respectively correspond to the wafers. The device as claimed in claim 2, wherein the adhesive layer patterns are strip-shaped and arranged in a matrix shape. The device as claimed in claim 1, wherein the pick-up tool includes an adhesive layer, and the adhesive layer has a flat surface thereunder. A method for transferring a plurality of wafers, comprising: supporting an attachment tape having an adhesive layer pattern to which a plurality of wafers are attached; Certain adhesive layer patterns of wafers are selectively irradiated with ultraviolet laser light, and selected areas include both certain areas where the selected wafers are located and other areas where unselected wafers are located, to selectively cure the certain adhesive layers. the certain adhesive layer patterns in the area; pick up the selected wafers corresponding to the cured adhesive layer patterns in the certain areas from the attaching tape while contacting all the wafers located in the selected areas; and The wafer is placed on the substrate. The method according to claim 7, wherein the attachment tape includes a base layer and an adhesive layer pattern formed on the base layer, the adhesive layer pattern having an ultraviolet curable resin. The method according to claim 8, wherein each of the adhesive layer patterns is dot-shaped. The method as described in Claim 7, wherein the adhesive layer patterns are strip-shaped and arranged in a matrix shape. The method as claimed in claim 7, wherein a pick-up tool is used to pick up the wafer located in the selected area, and the pick-up tool includes an adhesive layer having a flat surface thereunder. The method as recited in claim 7, wherein the wafer located in the selected area is picked up using a pick-up tool that generates a vacuum force.

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