TWI794550B - Production method of thermoplastic liquid crystal polymer structure - Google Patents

Production method of thermoplastic liquid crystal polymer structure Download PDF

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TWI794550B
TWI794550B TW108137402A TW108137402A TWI794550B TW I794550 B TWI794550 B TW I794550B TW 108137402 A TW108137402 A TW 108137402A TW 108137402 A TW108137402 A TW 108137402A TW I794550 B TWI794550 B TW I794550B
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liquid crystal
crystal polymer
thermoplastic liquid
temperature
polymer structure
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TW108137402A
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TW202031450A (en
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中島崇裕
砂本辰也
小野寺稔
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日商可樂麗股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • B29C43/12Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies using bags surrounding the moulding material or using membranes contacting the moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/52Heating or cooling

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Provided is a production method of a thermoplastic liquid crystal polymer structure. The production method is a method of producing a thermoplastic liquid crystal polymer structure in which a plurality of thermoplastic liquid crystal polymer substructures are integrated using autoclave, the method comprises: enveloping an overlaid stack comprising a plurality of thermoplastic liquid crystal polymer substructures with a bagging film and sealing the bagging film at the edge portion; evacuating inside of the bagging film, and elevating temperature to a first temperature that is a preparatory heating temperature; elevating temperature from the first temperature as the starting point to a second temperature that is a thermo-compression temperature while elevating internal pressure of autoclave to a predetermined pressure that 2.8 MPa or lower (gage pressure) so as to carry out thermo-compression bonding.

Description

熱塑性液晶聚合物結構體之製造方法Method for manufacturing thermoplastic liquid crystal polymer structure

本發明係關於一種熱塑性液晶聚合物結構體之製造方法,其中該熱塑性液晶聚合物結構體係以可形成光學上各向異性的熔融相之熱塑性聚合物(以下將其稱為熱塑性液晶聚合物)所構成。The present invention relates to a method for producing a thermoplastic liquid crystal polymer structure, wherein the thermoplastic liquid crystal polymer structure system is made of a thermoplastic polymer capable of forming an optically anisotropic molten phase (hereinafter referred to as thermoplastic liquid crystal polymer) constitute.

具有高強度、高彈性係數、耐熱性之熱塑性液晶聚合物係作為在電氣・電子領域、或事務設備・精密設備領域等中使用的零件而備受關注。Thermoplastic liquid crystal polymers with high strength, high modulus of elasticity, and heat resistance are attracting attention as parts used in the electrical and electronic fields, business equipment, and precision equipment fields.

例如,專利文獻1(日本特開2004-136671號公報)已揭示一種多層結構,其具備第1層、及第2層,前述第1層包含第1LCP(液晶聚合物)介電體材料,且以未使用將前述第1LCP介電體材料與前述第2層結合的外因性黏著材料,而使前述第1LCP介電體材料與前述第2層直接結合之方式來將前述第1層與前述第2層結合。該文獻已記載了在積層用高壓釜積層加壓機中,將施加高溫及高壓之為媒體的氣體自氣體源供給至腔室,並將積層體以壓力1000psi(7MPa)~3000psi(21MPa)進行熱壓接。 [先前技術文獻] [專利文獻]For example, Patent Document 1 (Japanese Unexamined Patent Publication No. 2004-136671) has disclosed a multilayer structure comprising a first layer and a second layer, the first layer comprising a first LCP (liquid crystal polymer) dielectric material, and The aforementioned first layer and the aforementioned second layer are bonded in such a manner that the aforementioned first LCP dielectric material is directly bonded to the aforementioned second layer without using an extrinsic adhesive material for bonding the aforementioned first LCP dielectric material to the aforementioned second layer. 2 layers combined. This document has described that in an autoclave lamination press for lamination, a gas with a medium of high temperature and high pressure is supplied from a gas source to the chamber, and the lamination is carried out at a pressure of 1000psi (7MPa) to 3000psi (21MPa). thermocompression. [Prior Art Literature] [Patent Document]

專利文獻1:日本特開2004-136671號公報Patent Document 1: Japanese Patent Laid-Open No. 2004-136671

然而,專利文獻1中,在製造多層結構之際,於高壓釜積層加壓機中,也許是因為自氣體源一口氣地供給加熱・加壓氣體,所以需要在高壓下之熱壓接。因此,急劇的加熱的情況,產生的揮發成分之除氣變得不足夠,且之後在加工熱塑性液晶聚合物結構體之際產生膨脹。又,在細微的導體圖案所形成的電路等需要電路間安全間距(clearance)時,急劇的加壓後,因樹脂之流動而產生電路之填埋或移動。因此,專利文獻1,端部或許可抑制樹脂之溢出,但無法抑制在結構體內部中產生的聚合物分子之過度的流動。However, in Patent Document 1, when manufacturing a multilayer structure, in an autoclave lamination press, heating and pressurizing gas may be supplied at one go from a gas source, so thermocompression bonding under high pressure may be required. Therefore, in the case of rapid heating, the outgassing of the generated volatile components becomes insufficient, and swelling occurs later when the thermoplastic liquid crystal polymer structure is processed. Also, when a circuit formed of a fine conductor pattern requires a clearance between circuits, the circuit is buried or moved due to the flow of the resin after rapid pressurization. Therefore, in Patent Document 1, although the overflow of the resin may be suppressed at the end portion, it cannot suppress the excessive flow of polymer molecules generated inside the structure.

一般而言,熱塑性液晶聚合物分子,也許是因為在剛直的棒狀之分子間纏繞少,所以在高壓下之熱壓接,棒狀的分子相互滑動流動,因此若欲提高黏著性,則導致過剩的分子流動,另一方面,為了抑制過剩的分子流動,若減低壓力,則有損及黏著性的困境。Generally speaking, thermoplastic liquid crystal polymer molecules may be less entangled between the rigid rod-shaped molecules, so under high pressure thermocompression, the rod-shaped molecules slide and flow with each other, so if you want to improve the adhesion, it will lead to Excessive molecular flow, on the other hand, in order to suppress the excessive molecular flow, if the pressure is reduced, it will damage the predicament of adhesion.

因此,本發明的目的在於提供一種熱塑性液晶聚合物結構體,其黏著性優異,同時抑制在結構體內部之過度的分子流動。Therefore, an object of the present invention is to provide a thermoplastic liquid crystal polymer structure having excellent adhesiveness while suppressing excessive molecular flow inside the structure.

本發明之其它的目的在於提供一種熱塑性液晶聚合物結構體,其通常具有藉由射出成形品達成的厚度,同時具有射出成形品無法得到的各向同性。Another object of the present invention is to provide a thermoplastic liquid crystal polymer structure, which generally has a thickness achieved by an injection molded product, and at the same time has an isotropy that cannot be obtained by an injection molded product.

本發明之另一其它的目的在於提供一種有效率地製造這樣的熱塑性液晶聚合物結構體之方法。Another object of the present invention is to provide a method for efficiently manufacturing such a thermoplastic liquid crystal polymer structure.

本發明的發明人等,為了達成上述目的而仔細探討的結果發現:熱塑性液晶聚合物係以極低剪切速度極端地降低熔融黏度,因此即使在密封下進行高壓釜積層加壓,若為了提高黏著性而自氣體源一口氣地供給加熱・加壓氣體,且在高壓下進行熱壓接,則或許不會有樹脂在端部的溢出,但熱塑性液晶聚合物內部中之分子的流動變激烈,尤其是流動的樹脂汙染用以排氣的通氣管(breather)的可能性變高。The inventors of the present invention, as a result of earnest research to achieve the above object, found that the thermoplastic liquid crystal polymer system extremely reduces the melt viscosity at an extremely low shear rate, so even if the autoclave lamination is carried out under sealing, if in order to improve Adhesive, when heating and pressurized gas is supplied from a gas source at one go, and thermocompression bonding is performed under high pressure, there may be no overflow of resin at the end, but the flow of molecules in the thermoplastic liquid crystal polymer becomes intense , especially the possibility that the flowing resin contaminates the breather used for exhausting becomes high.

然後,進一步重複研究的結果發現:使用高壓釜,將多個熱塑性液晶聚合物次結構進行一體化時,(i)進行包裝薄膜(bagging film)內部之排氣後,為了逐漸地進行加熱而將高壓釜內暫時升溫至預備加熱溫度,(ii)若自該狀態,隔著包裝薄膜,對為密合狀態之預備積層體進行升壓至規定的壓力,同時藉由高壓釜內之加熱氣體升溫至熱壓接溫度,進行熱壓接步驟,則(iii)可極高度地抑制多個熱塑性液晶聚合物次結構經一體化之結構體的內部中之分子的流動性,進而完成本發明。Then, as a result of repeated studies, it was found that when a plurality of thermoplastic liquid crystal polymer substructures are integrated using an autoclave, (i) after degassing the inside of the packaging film (bagging film), the Temporarily raise the temperature in the autoclave to the preliminary heating temperature, (ii) from this state, through the packaging film, the pressure of the preliminary laminate in the sealed state is raised to the specified pressure, and at the same time, the temperature is raised by the heating gas in the autoclave To the thermocompression bonding temperature, the thermocompression bonding step is carried out, then (iii) the fluidity of molecules in the structure in which multiple thermoplastic liquid crystal polymer substructures are integrated can be extremely highly suppressed, thereby completing the present invention.

亦即,本發明,可採用以下的態樣而構成。 [態樣1] 一種熱塑性液晶聚合物結構體之製造方法,其係使用高壓釜來製造多個熱塑性液晶聚合物次結構經一體化的熱塑性液晶聚合物結構體之方法,其至少具備:將重疊有多個熱塑性液晶聚合物次結構的預備積層體以包裝薄膜被覆,並將該包裝薄膜的端部進行密封的封入步驟、進行該包裝薄膜內部之排氣,進行升溫至為預備加熱溫度之第1溫度的升溫步驟、及以該第1溫度為起點,將高壓釜的內壓升壓至2.8MPa以下(錶壓力)(較佳為2.5MPa以下(錶壓力),更佳為2MPa以下(錶壓力))之所需的壓力,同時升溫至為熱壓接溫度之第2溫度的熱壓接步驟。 That is, the present invention can be configured in the following aspects. [Form 1] A method for manufacturing a thermoplastic liquid crystal polymer structure, which is a method of using an autoclave to manufacture a thermoplastic liquid crystal polymer structure in which multiple thermoplastic liquid crystal polymer substructures are integrated. The preliminary laminated body of the polymer substructure is covered with a packaging film, the sealing step of sealing the end of the packaging film, the exhaust of the inside of the packaging film, and the heating step of raising the temperature to the first temperature which is the preliminary heating temperature , and starting from the first temperature, the internal pressure of the autoclave is raised to below 2.8MPa (gauge pressure) (preferably below 2.5MPa (gauge pressure), more preferably below 2MPa (gauge pressure)) The required pressure, while raising the temperature to the thermocompression bonding step of the second temperature which is the thermocompression bonding temperature.

[態樣2] [Form 2]

如態樣1記載之熱塑性液晶聚合物結構體之製造方法,將預備積層體之中熔點最低的熱塑性液晶聚合物要素之熔點設為ML時,第1溫度為(ML-150)℃~(ML-50)℃(較佳為(ML-130)℃~(ML-70)℃、或是150~250℃,較佳為180~230℃)左右的範圍。 In the method for producing a thermoplastic liquid crystal polymer structure as described in Aspect 1, when the melting point of the thermoplastic liquid crystal polymer element with the lowest melting point among the preliminary laminates is taken as ML, the first temperature is (ML-150)°C~(ML -50)°C (preferably (ML-130)°C~(ML-70)°C, or 150~250°C, preferably 180~230°C).

[態樣3] [Form 3]

如態樣1或2記載之熱塑性液晶聚合物結構體之製造方法,在第1溫度之保持時間為1~120分鐘(較佳為3~60分鐘)左右。 In the manufacturing method of the thermoplastic liquid crystal polymer structure described in aspect 1 or 2, the holding time at the first temperature is about 1 to 120 minutes (preferably 3 to 60 minutes).

[態樣4] [Aspect 4]

如態樣1至3中任一項記載之熱塑性液晶聚合物結構體之製造方法,向第1溫度之升溫速度為1~10℃/min(較佳為2~8℃/min)。 In the manufacturing method of the thermoplastic liquid crystal polymer structure described in any one of aspects 1 to 3, the heating rate to the first temperature is 1-10°C/min (preferably 2-8°C/min).

[態樣5] [Aspect 5]

如態樣1至4中任一項記載之熱塑性液晶聚合物結構體之製造方法,將預備積層體之中熔點最高的熱塑性液晶聚合物要素之熔點設為MH時,第2溫度為(MH-30)℃~(MH+10)℃(較佳為(MH-10)℃~(MH+5)℃)左右的範圍。 In the method for producing a thermoplastic liquid crystal polymer structure described in any one of aspects 1 to 4, when the melting point of the thermoplastic liquid crystal polymer element with the highest melting point among the preliminary laminates is set as MH, the second temperature is (MH- 30) °C~(MH+10)°C (preferably (MH-10)°C~(MH+5)°C).

[態樣6] [Form 6]

如態樣1至5中任一項記載之熱塑性液晶聚合物結構體之製造方法,在第2溫度之保持時間為15~60分鐘(較佳為20~50分鐘,更佳為20~40分鐘)左右。 The manufacturing method of the thermoplastic liquid crystal polymer structure as described in any one of aspects 1 to 5, the holding time at the second temperature is 15 to 60 minutes (preferably 20 to 50 minutes, more preferably 20 to 40 minutes) )about.

[態樣7] [Aspect 7]

如態樣1至6中任一項記載之熱塑性液晶聚合物結構體之製造方法,向第2溫度之升溫速度為2~20℃/min(較佳為3~15℃/min,更佳為4~10℃/min)。 The method for producing a thermoplastic liquid crystal polymer structure as described in any one of aspects 1 to 6, the heating rate to the second temperature is 2~20°C/min (preferably 3~15°C/min, more preferably 4~10℃/min).

[態樣8] [Aspect 8]

如態樣1至7中任一項記載之熱塑性液晶聚合物結構體之製造方法,在升溫步驟之前,進行除氣乾燥步驟。 In the method for producing a thermoplastic liquid crystal polymer structure described in any one of aspects 1 to 7, a degassing and drying step is performed before the temperature raising step.

[態樣9] [Aspect 9]

如態樣8記載之製造方法,除氣乾燥步驟後的熱塑性液晶聚合物薄膜之水分率為380ppm以下(300ppm以下、或200ppm以下)。 In the manufacturing method described in aspect 8, the moisture content of the thermoplastic liquid crystal polymer film after the degassing drying step is 380 ppm or less (300 ppm or less, or 200 ppm or less).

[態樣10] [Aspect 10]

如態樣8或9記載之熱塑性液晶聚合物結構體之製造方法,在第1溫度之保持時間為1~20分鐘(較佳為2~15分鐘,更佳為2~10分鐘)左右。 In the manufacturing method of the thermoplastic liquid crystal polymer structure described in aspect 8 or 9, the holding time at the first temperature is about 1-20 minutes (preferably 2-15 minutes, more preferably 2-10 minutes).

[態樣11] [Form 11]

如態樣1至10中任一項記載之製造方法,升溫步驟後的預備加熱對象之熱塑性液晶聚合物要素的水分率為380ppm以下(300ppm以下、或200ppm以下)。 The production method according to any one of aspects 1 to 10, wherein the moisture content of the thermoplastic liquid crystal polymer element to be preheated after the temperature raising step is 380 ppm or less (300 ppm or less, or 200 ppm or less).

在此,熱塑性液晶聚合物要素意指熱塑性液晶聚合物結構體中之熱塑性液晶聚合物部分。又,熱塑性液晶聚合物結構體的熱塑性液晶聚合物次結構所含之熱塑性液晶聚合物要素為層狀時,有將熱塑性液晶聚合物要素稱為熱塑性液晶聚合物層的情況。再者,在熱壓接前的熱塑性液晶聚合物次結構包含熱塑性液晶聚合物薄膜時,熱壓接後,前述熱塑性液晶聚合物薄膜,各別在熱塑性液晶聚合物結構體中形成熱塑性液晶聚合物層。 Here, the thermoplastic liquid crystal polymer element means the thermoplastic liquid crystal polymer part in the thermoplastic liquid crystal polymer structure. Also, when the thermoplastic liquid crystal polymer element contained in the thermoplastic liquid crystal polymer substructure of the thermoplastic liquid crystal polymer structure is layered, the thermoplastic liquid crystal polymer element may be referred to as a thermoplastic liquid crystal polymer layer. Furthermore, when the thermoplastic liquid crystal polymer substructure before thermocompression bonding includes a thermoplastic liquid crystal polymer film, after thermocompression bonding, the aforementioned thermoplastic liquid crystal polymer film forms a thermoplastic liquid crystal polymer in the thermoplastic liquid crystal polymer structure. layer.

再者,申請專利範圍及/或說明書及/或圖式所揭示之至少2個構成要素的任何組合均包含於本發明中。特別是申請專利範範圍所記載的請求項之2個以上的任何組合也包含於本發明中。 Furthermore, any combination of at least two components disclosed in the scope of claims and/or the specification and/or drawings is included in the present invention. In particular, any combination of two or more of the claims described in the claims is also included in the present invention.

本發明係將抑制在結構體內部之過度的分子流動之熱塑性液晶聚合物結構體,未使用黏著劑而藉由熱壓接進行一體化,且可有效率地得到。 In the present invention, a thermoplastic liquid crystal polymer structure that suppresses excessive molecular flow inside the structure can be efficiently obtained by integrating it by thermocompression bonding without using an adhesive.

[用以實施發明的形態][Mode for Carrying Out the Invention]

本發明中,可使用高壓釜而製造多個熱塑性液晶聚合物次結構經一體化的熱塑性液晶聚合物結構體。 熱塑性液晶聚合物結構體為多個熱塑性液晶聚合物次結構經一體化的結構體。多個熱塑性液晶聚合物次結構只要為2以上即可,且視所需的形狀,適當使用需要的數量之熱塑性液晶聚合物次結構。熱塑性液晶聚合物次結構的數量之上限沒有特別設定,也可為1000左右。熱塑性液晶聚合物次結構,至少包含熱塑性液晶聚合物。In the present invention, an autoclave can be used to manufacture a thermoplastic liquid crystal polymer structure in which a plurality of thermoplastic liquid crystal polymer substructures are integrated. The thermoplastic liquid crystal polymer structure is a structure in which multiple thermoplastic liquid crystal polymer substructures are integrated. As long as the number of thermoplastic liquid crystal polymer substructures is 2 or more, a required number of thermoplastic liquid crystal polymer substructures can be appropriately used depending on the desired shape. The upper limit of the number of thermoplastic liquid crystal polymer substructures is not particularly set, and it may be about 1000. The thermoplastic liquid crystal polymer substructure includes at least a thermoplastic liquid crystal polymer.

(熱塑性液晶聚合物) 熱塑性液晶聚合物係以可熔融成形的液晶性聚合物(或是可形成光學上各向異性的熔融相之聚合物)構成,該熱塑性液晶聚合物,只要為可熔融成形的液晶性聚合物,則尤其是關於其化學的構成,沒有特別限定,可舉出例如,熱塑性液晶聚酯、或對其導入醯胺鍵的熱塑性液晶聚酯醯胺等。(thermoplastic liquid crystal polymer) The thermoplastic liquid crystal polymer is composed of a melt-formable liquid crystal polymer (or a polymer capable of forming an optically anisotropic molten phase), and the thermoplastic liquid crystal polymer, as long as it is a melt-formable liquid crystal polymer, In particular, its chemical constitution is not particularly limited, and examples thereof include thermoplastic liquid crystal polyester, thermoplastic liquid crystal polyester amide having an amide bond introduced thereto, and the like.

又,熱塑性液晶聚合物,也可為在芳香族聚酯或芳香族聚酯醯胺進一步導入醯亞胺鍵、碳酸酯鍵、碳二亞胺鍵或異三聚氰酸酯鍵等源自異氰酸酯的鍵等之聚合物。In addition, the thermoplastic liquid crystal polymer may be derived from isocyanate, such as an imide bond, a carbonate bond, a carbodiimide bond, or an isocyanurate bond, etc., in an aromatic polyester or an aromatic polyester amide. Polymers such as bonds.

作為本發明所使用之熱塑性液晶聚合物的具體例,可舉出由以下所例示之分類為(1)至(4)的化合物及其衍生物衍生之周知的熱塑性液晶聚酯及熱塑性液晶聚酯醯胺。但是,為了形成可形成光學上各向異性的熔融相之聚合物,各種的原料化合物之組合當然有適當的範圍。Specific examples of the thermoplastic liquid crystal polymer used in the present invention include known thermoplastic liquid crystal polyesters and thermoplastic liquid crystal polyesters derived from compounds classified as (1) to (4) and derivatives thereof as exemplified below. Amide. However, in order to form a polymer capable of forming an optically anisotropic melt phase, the combination of various raw material compounds naturally has an appropriate range.

(1)芳香族或脂肪族二羥基化合物(代表例參照表1) [表1]

Figure 02_image001
(1) Aromatic or aliphatic dihydroxy compounds (refer to Table 1 for representative examples) [Table 1]
Figure 02_image001

(2)芳香族或脂肪族二羧酸(代表例參照表2) [表2]

Figure 02_image003
(2) Aromatic or aliphatic dicarboxylic acids (refer to Table 2 for representative examples) [Table 2]
Figure 02_image003

(3)芳香族羥基羧酸(代表例參照表3) [表3]

Figure 02_image005
(3) Aromatic hydroxycarboxylic acid (refer to Table 3 for representative examples) [Table 3]
Figure 02_image005

(4)芳香族二胺、芳香族羥胺或芳香族胺基羧酸(代表例參照表4) [表4]

Figure 02_image007
(4) Aromatic diamine, aromatic hydroxylamine, or aromatic aminocarboxylic acid (refer to Table 4 for representative examples) [Table 4]
Figure 02_image007

作為由該等之原料化合物得到的液晶聚合物之代表例,可舉出具有表5及6所示之結構單元的共聚物。Typical examples of liquid crystal polymers obtained from these raw material compounds include copolymers having structural units shown in Tables 5 and 6.

[表5]

Figure 02_image009
[表6]
Figure 02_image011
[table 5]
Figure 02_image009
[Table 6]
Figure 02_image011

該等之共聚物中,較佳為至少包含對羥基苯甲酸及/或6-羥基-2-萘酸作為重複單元的聚合物,尤其較佳為(i)包含對羥基苯甲酸與6-羥基-2-萘酸之重複單元的聚合物、或(ii)包含選自含有對羥基苯甲酸及6-羥基-2-萘酸的群組之至少一種的芳香族羥基羧酸、至少一種的芳香族二醇、及至少一種的芳香族二羧酸之重複單元的共聚物。Among these copolymers, preferably a polymer comprising at least p-hydroxybenzoic acid and/or 6-hydroxy-2-naphthoic acid as repeating units, especially preferably (i) comprising p-hydroxybenzoic acid and 6-hydroxybenzoic acid - A polymer of repeating units of 2-naphthoic acid, or (ii) comprising at least one aromatic hydroxycarboxylic acid selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, at least one aromatic A copolymer of repeating units of aromatic diol and at least one aromatic dicarboxylic acid.

例如,(i)的聚合物,熱塑性液晶聚合物至少包含對羥基苯甲酸與6-羥基-2-萘酸之重複單元時,重複單元(A)的對羥基苯甲酸與重複單元(B)的6-羥基-2-萘酸之莫耳比(A)/(B),較佳為液晶聚合物中(A)/(B)=10/90~90/10左右,更佳也可為(A)/(B)=15/85~85/15左右,進一步更佳亦可為(A)/(B)=20/80~80/20左右。For example, in the polymer of (i), when the thermoplastic liquid crystal polymer at least includes repeating units of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, the p-hydroxybenzoic acid of the repeating unit (A) and the repeating unit of the repeating unit (B) The molar ratio (A)/(B) of 6-hydroxyl-2-naphthoic acid is preferably about (A)/(B)=10/90~90/10 in the liquid crystal polymer, more preferably also can be ( A)/(B)=about 15/85 to 85/15, more preferably about (A)/(B)=20/80 to 80/20.

又,(ii)的聚合物之情況,選自包含對羥基苯甲酸及6-羥基-2-萘酸的群組之至少一種的芳香族羥基羧酸(C)、選自包含4,4’-二羥基聯苯、氫醌、苯基氫醌、及4,4’-二羥基二苯醚的群組之至少一種的芳香族二醇(D)、以及選自包含對苯二甲酸、間苯二甲酸及2,6-萘二羧酸的群組之至少一種的芳香族二羧酸(E)之液晶聚合物中之各重複單元的莫耳比,可為芳香族羥基羧酸(C):前述芳香族二醇(D):前述芳香族二羧酸(E)=(30~80):(35~10):(35~10)左右,更佳也可為(C):(D):(E)=(35~75):(32.5~12.5):(32.5~12.5)左右,進一步更佳亦可為(C):(D):(E)=(40~70):(30~15):(30~15)左右。Also, in the case of the polymer of (ii), at least one aromatic hydroxycarboxylic acid (C) selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, selected from the group consisting of 4,4' - at least one aromatic diol (D) selected from the group consisting of dihydroxybiphenyl, hydroquinone, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether, and an aromatic diol (D) selected from the group consisting of terephthalic acid, m- The molar ratio of each repeating unit in the liquid crystal polymer of at least one aromatic dicarboxylic acid (E) of the group of phthalic acid and 2,6-naphthalene dicarboxylic acid can be the aromatic hydroxycarboxylic acid (C ): the aforementioned aromatic diol (D): the aforementioned aromatic dicarboxylic acid (E) = (30-80): (35-10): about (35-10), more preferably (C): ( D): (E)=(35~75): (32.5~12.5): around (32.5~12.5), and it can be even better (C): (D): (E)=(40~70): (30~15): About (30~15).

又,芳香族羥基羧酸(C)中,源自6-羥基-2-萘酸的重複單元之莫耳比率,可為例如85莫耳%以上,可較佳為90莫耳%以上,更佳為95莫耳%以上。芳香族二羧酸(E)中,源自2,6-萘二羧酸的重複單元之莫耳比率,可為例如85莫耳%以上,亦可較佳為90莫耳%以上,更佳為95莫耳%以上。In addition, in the aromatic hydroxycarboxylic acid (C), the molar ratio of the repeating unit derived from 6-hydroxy-2-naphthoic acid may be, for example, 85 mole % or more, preferably 90 mole % or more, and more preferably Preferably it is more than 95 mole%. In the aromatic dicarboxylic acid (E), the molar ratio of the repeating unit derived from 2,6-naphthalene dicarboxylic acid may be, for example, 85 mole % or more, preferably 90 mole % or more, and more preferably It is more than 95 mole%.

又,芳香族二醇(D),也可為源自選自包含氫醌、4,4’-二羥基聯苯、苯基氫醌、及4,4’-二羥基二苯醚的群組之相異的兩種芳香族二醇之重複單元(D1)與(D2),該情況中,兩種芳香族二醇之莫耳比,可為(D1)/(D2)=23/77~77/23,更佳為25/75~75/25,進一步更佳亦可為30/70~70/30。In addition, the aromatic diol (D) may be derived from the group consisting of hydroquinone, 4,4'-dihydroxybiphenyl, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether Repeating units (D1) and (D2) of the two different aromatic diols, in this case, the molar ratio of the two aromatic diols can be (D1)/(D2)=23/77~ 77/23, more preferably 25/75-75/25, more preferably 30/70-70/30.

又,源自芳香族二醇的重複結構單元與源自芳香族二羧酸的重複結構單元之莫耳比,較佳為(D)/(E)=95/100~100/95。若超出該範圍,則有聚合度不會提升,且機械強度降低的傾向。Moreover, the molar ratio of the repeating structural unit derived from an aromatic diol to the repeating structural unit derived from an aromatic dicarboxylic acid is preferably (D)/(E)=95/100 to 100/95. When it exceeds this range, there exists a tendency for mechanical strength to fall, without raising a degree of polymerization.

再者,本發明所言之可形成光學上各向異性的熔融相,例如,可藉由將試料乘載於熱載台,在氮氣環境下升溫加熱,觀察試料之透射光而認定。Furthermore, the formation of an optically anisotropic molten phase as mentioned in the present invention can be identified, for example, by placing a sample on a thermal stage, heating it under a nitrogen atmosphere, and observing the transmitted light of the sample.

作為熱塑性液晶聚合物,也可為熔點(以下稱為Tm)為200~360℃的範圍者,較佳為240~360℃的範圍,更佳為260~360℃的範圍者,進一步更佳為Tm為270~350℃者。再者,Tm係藉由示差掃描熱量計(島津製作所(股)DSC)測定主吸熱峰值出現的溫度,藉以求出。The thermoplastic liquid crystal polymer may have a melting point (hereinafter referred to as Tm) in the range of 200 to 360°C, preferably in the range of 240 to 360°C, more preferably in the range of 260 to 360°C, still more preferably Those whose Tm is 270-350°C. In addition, Tm was obtained by measuring the temperature at which the main endothermic peak appears with a differential scanning calorimeter (Shimadzu Corporation DSC).

前述熱塑性液晶聚合物,在不損及本發明之效果的範圍內,亦可添加聚對苯二甲酸乙二酯、改質聚對苯二甲酸乙二酯、聚烯烴、聚碳酸酯、聚芳香酯、聚醯胺、聚苯硫醚、聚醚醚酮、氟樹脂等熱塑性聚合物、各種添加劑、填充劑等。The aforementioned thermoplastic liquid crystal polymers may also be added with polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyaromatic Thermoplastic polymers such as ester, polyamide, polyphenylene sulfide, polyether ether ketone, fluororesin, various additives, fillers, etc.

熱塑性液晶聚合物薄膜,例如,將前述熱塑性液晶聚合物的熔融混練物擠製成形而得到。作為擠製成形法係使用任意方法,但工業上周知的T型模法、充氣(inflation)法等為有利。尤其是充氣法,不僅對熱塑性液晶聚合物薄膜的機械軸方向(以下簡稱為MD方向),且也對與其正交的方向(以下簡稱為TD方向)施加應力,因為可朝MD方向、TD方向均勻地拉伸,所以得到控制MD方向與TD方向中之分子配向性、介電特性等之熱塑性液晶聚合物薄膜。The thermoplastic liquid crystal polymer film is obtained, for example, by extruding a molten kneaded product of the aforementioned thermoplastic liquid crystal polymer. Any method may be used as the extrusion molding method, but industrially known T-die methods, inflation methods, and the like are advantageous. In particular, the inflation method applies stress not only to the mechanical axis direction (hereinafter referred to as the MD direction) of the thermoplastic liquid crystal polymer film, but also to the direction perpendicular to it (hereinafter referred to as the TD direction), because it can be directed toward the MD direction and the TD direction. Uniformly stretched, so a thermoplastic liquid crystal polymer film with controlled molecular alignment, dielectric properties, etc. in the MD and TD directions is obtained.

例如,利用T型模法的擠製成形,可將自T型模擠製的熔融體薄片,不僅對熱塑性液晶聚合物薄膜之MD方向,且對於其與TD方向之雙方,同時進行拉伸而製膜,或者,也可將自T型模擠製的熔融體薄片,暫時朝MD方向拉伸,接著朝TD方向進行拉伸而製膜。For example, in the extrusion molding by the T-die method, the melt sheet extruded from the T-die can be stretched not only in the MD direction of the thermoplastic liquid crystal polymer film, but also in both the TD direction and the TD direction. Alternatively, a melt sheet extruded from a T-die may be stretched in the MD direction once, and then stretched in the TD direction to form a film.

又,利用充氣法的擠製成形,可對於自環模熔融擠製的圓筒狀薄片,以規定的拉延比(draw ratio)(相當於MD方向的拉伸倍率)及吹脹比(相當於TD方向的拉伸倍率)進行拉伸而製膜。In addition, extrusion molding by the inflation method can be performed at a predetermined draw ratio (equivalent to the draw ratio in the MD direction) and inflation ratio (equivalent to The stretch ratio in the TD direction) is stretched to form a film.

如前述的擠製成形的拉伸倍率,作為MD方向的拉伸倍率(或拉延比),可為例如1.0~10左右,可較佳為1.2~7左右,更佳為1.3~7左右。又,作為TD方向的拉伸倍率(或吹脹比(blow ratio)),可為例如1.5~20左右,可較佳為2~15左右,更佳為2.5~14左右。As mentioned above, the stretching ratio of extrusion molding is, for example, about 1.0-10, preferably about 1.2-7, and more preferably about 1.3-7 as the stretching ratio (or drawing ratio) in the MD direction. In addition, the draw ratio (or blow ratio) in the TD direction may be, for example, about 1.5 to 20, preferably about 2 to 15, and more preferably about 2.5 to 14.

視需要也可進行周知或慣用的熱處理,將熱塑性液晶聚合物薄膜之面方向的熱膨脹係數調整為所需的範圍。熱塑性液晶聚合物薄膜的面方向之熱膨脹係數,例如,藉由日本特開2005-103989號公報所記載的方法,可調整為所需的數值。If necessary, known or customary heat treatment may be performed to adjust the thermal expansion coefficient of the thermoplastic liquid crystal polymer film in the plane direction to a desired range. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer film can be adjusted to a desired value by, for example, the method described in JP-A-2005-103989.

熱塑性液晶聚合物薄膜的熱膨脹係數,例如,也可調整為-10ppm/℃~50ppm/℃的範圍之任一者的值。在多個熱塑性液晶聚合物次結構中,構成各次結構之熱塑性液晶聚合物薄膜的熱膨脹係數,因應用途,例如,最高值的熱膨脹係數與最低值的熱膨脹係數之公差,也可為50ppm/℃以下、40ppm/℃以下、30ppm/℃以下、20ppm/℃以下、15ppm/℃以下、10ppm/℃以下、5ppm/℃以下、3ppm/℃以下、或1ppm/℃以下。The coefficient of thermal expansion of the thermoplastic liquid crystal polymer film can also be adjusted to any value within the range of -10 ppm/°C to 50 ppm/°C, for example. Among multiple thermoplastic liquid crystal polymer substructures, the thermal expansion coefficient of the thermoplastic liquid crystal polymer film constituting each substructure, depending on the application, for example, the tolerance between the highest thermal expansion coefficient and the lowest thermal expansion coefficient can also be 50ppm/℃ Below, below 40ppm/°C, below 30ppm/°C, below 20ppm/°C, below 15ppm/°C, below 10ppm/°C, below 5ppm/°C, below 3ppm/°C, or below 1ppm/°C.

另一方面,為了對於熱塑性液晶聚合物結構體賦予雙金屬的性質,可使構成各次結構之熱塑性液晶聚合物薄膜的熱膨脹係數相隔開而組合各次結構,該情況中,例如,鄰接之熱塑性液晶聚合物薄膜的熱膨脹係數,可相隔開15ppm/℃以上,較佳為18ppm/℃以上,更佳為20ppm/℃以上。On the other hand, in order to impart bimetallic properties to the thermoplastic liquid crystal polymer structure, the thermal expansion coefficients of the thermoplastic liquid crystal polymer films constituting each substructure can be separated and the substructures can be combined. In this case, for example, adjacent thermoplastic The thermal expansion coefficients of the liquid crystal polymer films can be separated by at least 15 ppm/°C, preferably at least 18 ppm/°C, and more preferably at least 20 ppm/°C.

(導體層與熱塑性液晶聚合物薄膜之一體化步驟) 對於熱塑性液晶聚合物薄膜,形成導體層(訊號層、電源層、接地層等有導電性的層,例如,以導體圖案、導體箔、導體膜等形成的層)時,可藉由周知或慣用的方法,進行導體層與熱塑性液晶聚合物薄膜之一體化步驟。藉由該一體化步驟,可製作在一方之面具有導體層的熱塑性液晶聚合物薄膜,也可製作在雙方之面具有導體層的熱塑性液晶聚合物薄膜。 例如,對於熱塑性液晶聚合物薄膜,將金屬箔等進行熱壓接,藉以成為單面覆金屬積層體或兩面覆金屬積層體,且也可視需要藉由進一步進行蝕刻等,形成需要的導體層之形狀。(Integration step of conductor layer and thermoplastic liquid crystal polymer film) For the thermoplastic liquid crystal polymer film, when forming a conductive layer (a conductive layer such as a signal layer, a power supply layer, and a ground layer, for example, a layer formed with a conductive pattern, a conductive foil, a conductive film, etc.), known or customary methods can be used. In the method, the step of integrating the conductor layer and the thermoplastic liquid crystal polymer film is carried out. Through this integration step, a thermoplastic liquid crystal polymer film having a conductive layer on one side can be produced, and a thermoplastic liquid crystal polymer film having a conductive layer on both sides can also be produced. For example, for a thermoplastic liquid crystal polymer film, a metal foil or the like is bonded by thermocompression to form a single-sided metal-clad laminate or a double-sided metal-clad laminate, and if necessary, further etching or the like is performed to form a required conductor layer. shape.

作為形成導體層的導體,也可為具有導電性的各種金屬,例如,金、銀、銅、鐵、鎳、鋁或該等之合金金屬等。導體層的厚度,可視需要而適當設定,可為例如5~50μm左右,更佳也可為8~35μm的範圍。As the conductor forming the conductor layer, various metals having conductivity may be used, for example, gold, silver, copper, iron, nickel, aluminum, or alloy metals thereof. The thickness of the conductor layer can be appropriately set as needed, and may be, for example, about 5 to 50 μm, more preferably in the range of 8 to 35 μm.

如前述進行,例如,作為在熱塑性液晶聚合物多層結構體中使用的熱塑性液晶聚合物次結構,可製作(i)熱塑性液晶聚合物薄膜、(ii)在一方之面具有導體層的熱塑性液晶聚合物薄膜、及(iii)在雙方之面具有導體層的熱塑性液晶聚合物薄膜。As described above, for example, as a thermoplastic liquid crystal polymer substructure used in a thermoplastic liquid crystal polymer multilayer structure, (i) a thermoplastic liquid crystal polymer film, (ii) a thermoplastic liquid crystal polymer having a conductive layer on one side can be produced. and (iii) a thermoplastic liquid crystal polymer film having a conductive layer on both sides.

(除氣乾燥步驟) 視需要,在後述的升溫步驟之前,熱塑性液晶聚合物次結構,也可供給至用以除去存在於熱塑性液晶聚合物薄膜之空氣或水分的除氣乾燥步驟。除氣乾燥步驟,在形成重疊有熱塑性液晶聚合物次結構的預備積層體之前,可對於各別的熱塑性液晶聚合物次結構及該等之組合進行,也可對於預備積層體進行,亦可進行雙方。藉由進行除氣乾燥步驟,可更強固熱塑性液晶聚合物結構體之一體性。又,可縮短花費於升溫步驟或熱壓接步驟的時間。(degassing drying step) If necessary, the thermoplastic liquid crystal polymer substructure may be subjected to a degassing drying step for removing air or moisture present in the thermoplastic liquid crystal polymer film before the temperature raising step described later. The degassing drying step may be carried out for individual thermoplastic liquid crystal polymer substructures and combinations thereof, may be performed for the preliminary laminate, or may be performed prior to forming a preliminary laminate having superimposed thermoplastic liquid crystal polymer substructures both sides. By performing the degassing and drying step, the integrity of the thermoplastic liquid crystal polymer structure can be strengthened. In addition, the time spent in the temperature raising step or the thermocompression bonding step can be shortened.

在形成預備積層體之前進行時,除氣乾燥步驟,可在熱塑性液晶聚合物薄膜與導體層之一體化步驟之前,於熱塑性液晶聚合物薄膜中進行,也可作為熱塑性液晶聚合物薄膜與導體層之一體化步驟之一部分進行。 藉由除氣乾燥步驟,可提升熱塑性液晶聚合物次結構之熱黏著性,且可提升熱塑性液晶聚合物次結構之層間黏著性。When performing before forming a preliminary laminate, the degassing and drying step can be performed in the thermoplastic liquid crystal polymer film before the step of integrating the thermoplastic liquid crystal polymer film and the conductor layer, and can also be used as a thermoplastic liquid crystal polymer film and conductor layer. part of the integration step. Through the degassing drying step, the thermal adhesiveness of the thermoplastic liquid crystal polymer substructure can be improved, and the interlayer adhesion of the thermoplastic liquid crystal polymer substructure can be improved.

供於除氣乾燥步驟的熱塑性液晶聚合物次結構,只要熱塑性液晶聚合物薄膜可除氣乾燥,則其形狀沒有特別限定。例如,在除氣乾燥步驟中,熱塑性液晶聚合物次結構,可為熱塑性液晶聚合物薄膜本身,也可作為在熱塑性液晶聚合物薄膜之一方或雙方的面形成導體層之熱塑性液晶聚合物次結構的薄片物供給。再者,該等之熱塑性液晶聚合物次結構,視需要,也可作為卷狀物供給。The shape of the thermoplastic liquid crystal polymer substructure to be subjected to the outgassing drying step is not particularly limited as long as the thermoplastic liquid crystal polymer film can be outgassed and dried. For example, in the degassing drying step, the thermoplastic liquid crystal polymer substructure can be the thermoplastic liquid crystal polymer film itself, or it can be used as a thermoplastic liquid crystal polymer substructure forming a conductive layer on one or both sides of the thermoplastic liquid crystal polymer film. supply of flakes. Furthermore, the thermoplastic liquid crystal polymer substructures can also be supplied as a roll if necessary.

甚至視需要,熱塑性液晶聚合物次結構,也可以多個熱塑性液晶聚合物次結構的多層積層物(例如,熱塑性液晶聚合物次結構多層重疊的多層積層物、暫時組裝的多層電路等)的狀態,供給至除氣乾燥步驟。Even if desired, the thermoplastic liquid crystal polymer substructure may also be in the form of a multilayer laminate of a plurality of thermoplastic liquid crystal polymer substructures (e.g., a multilayer laminate of multiple layers of thermoplastic liquid crystal polymer substructures, a temporarily assembled multilayer circuit, etc.) , supplied to the degassing drying step.

除氣乾燥步驟,藉由對於熱塑性液晶聚合物次結構,進行特定在真空下之除氣乾燥(例如,真空乾燥)及/或在加熱下之除氣乾燥(例如,加熱乾燥),可極高度地減低存在於熱塑性液晶聚合物薄膜之內部或表面的空氣或水分。然後,經由如前述的除氣乾燥步驟的熱塑性液晶聚合物次結構,可提升其熱黏著性。The outgassing drying step, by performing specific outgassing drying under vacuum (for example, vacuum drying) and/or outgassing drying under heating (for example, heat drying) for the thermoplastic liquid crystal polymer substructure, can be extremely highly Minimize the air or moisture present in the interior or surface of the thermoplastic liquid crystal polymer film. Then, through the TLP substructure through the outgassing drying step as described above, its thermal adhesion can be improved.

例如,進行除氣乾燥步驟的熱塑性液晶聚合物薄膜,即使不進行破壞表皮層之軟化處理,也可達成高黏著性。但是,並非否定軟化處理。熱塑性液晶聚合物薄膜,視需要亦可進行軟化處理等表面處理。For example, a thermoplastic liquid crystal polymer film subjected to a degassing drying step can achieve high adhesiveness even without softening treatment that damages the skin layer. However, softening treatment is not negated. The thermoplastic liquid crystal polymer film can also be treated with surface treatment such as softening treatment if necessary.

除氣乾燥步驟中,將熱塑性液晶聚合物次結構,藉由(a)在真空度1500Pa以下、30分鐘以上,於真空下進行除氣乾燥、及/或藉由(b)在80℃~300℃的範圍,於加熱下進行除氣乾燥,而可將熱塑性液晶聚合物薄膜除氣乾燥。除氣乾燥步驟,只要採用滿足上述(a)在真空下之除氣乾燥步驟或(b)在加熱下之除氣乾燥步驟的任一方的條件進行除氣乾燥即可,但較佳為採用滿足上述(a)及(b)之雙方的條件進行除氣乾燥。In the degassing and drying step, the thermoplastic liquid crystal polymer substructure is degassed and dried under vacuum by (a) degassing and drying at a vacuum degree of less than 1500 Pa for more than 30 minutes, and/or (b) at 80° C. to 300° C. In the range of ℃, the thermoplastic liquid crystal polymer film can be degassed and dried by degassing and drying under heating. In the degassing drying step, as long as the degassing drying is carried out under any one of the above-mentioned (a) degassing drying step under vacuum or (b) degassing drying step under heating, it is preferable to use The conditions of both (a) and (b) above are degassed and dried.

採用滿足(a)及(b)之雙方的條件進行除氣乾燥時,可為採用同時滿足(a)及(b)之雙方的條件(亦即,真空加熱下)進行的除氣乾燥步驟,也可為對於熱塑性液晶聚合物次結構,各別進行(a)及(b)之條件的除氣乾燥步驟,亦即,以(a)至(b)之順序、或(b)至(a)之順序,各別進行的除氣乾燥步驟。When the degassing drying is carried out under the conditions satisfying both (a) and (b), it may be a degassing drying step under the conditions satisfying both (a) and (b) simultaneously (that is, under vacuum heating), It is also possible to carry out the degassing drying steps of (a) and (b) conditions separately for the thermoplastic liquid crystal polymer substructure, that is, in the order of (a) to (b), or (b) to (a ) in the order of degassing and drying steps carried out separately.

再者,各別進行除氣乾燥步驟時,也可在不會對熱塑性液晶聚合物薄膜之熱黏著性造成不良影響的範圍下在(a)及(b)之間、或(b)及(a)之間進行其他乾燥步驟。Furthermore, when carrying out the degassing drying step separately, it is also possible to perform the degassing and drying step between (a) and (b), or between (b) and ( a) with further drying steps in between.

又,氣乾燥步驟中,從提升除氣乾燥性之觀點而言,也可在實質上不進行加壓之無加壓下(壓力釋放下)進行除氣乾燥。例如,亦可在低加壓或壓力釋放狀態(例如,0~0.7MPa左右(錶壓力)之壓力下,較佳為0~0.5MPa左右(錶壓力)之壓力下)進行除氣乾燥步驟。In addition, in the gas drying step, from the viewpoint of improving the degassing drying property, degassing drying may be performed under no pressurization (under pressure release) that does not substantially pressurize. For example, the degassing and drying step can also be carried out in a low pressurized or pressure released state (for example, at a pressure of about 0-0.7 MPa (gauge pressure), preferably at a pressure of about 0-0.5 MPa (gauge pressure)).

(a)在真空下之除氣乾燥,可在真空度1500Pa以下進行,可較佳在1300Pa以下,更佳在1100Pa以下進行。獨立進行在真空下之除氣乾燥時,可在常溫下(例如,10~50℃、較佳為15~45℃的範圍)進行,但從提高除氣乾燥效率之觀點而言,也可在加熱下進行。此時的加熱溫度,可為例如為50~300℃(例如,50~250℃),較佳為80~250℃,更佳為80~200℃左右。(a) Degassing and drying under vacuum can be carried out at a vacuum degree below 1500Pa, preferably below 1300Pa, more preferably below 1100Pa. When degassing and drying under vacuum are carried out independently, it can be carried out at normal temperature (for example, in the range of 10 to 50° C., preferably 15 to 45° C.), but from the viewpoint of improving the degassing and drying efficiency, it can also be carried out at Proceed under heating. The heating temperature at this time may be, for example, 50 to 300°C (for example, 50 to 250°C), preferably 80 to 250°C, more preferably about 80 to 200°C.

(b)在加熱下之除氣乾燥,可在80~300℃的範圍進行,可較佳在80~250℃的範圍,更佳在80~200℃的範圍進行。又,在加熱下之除氣乾燥也可相對於熱塑性液晶聚合物或熱塑性液晶聚合物薄膜的熔點Tm設定規定的溫度範圍。該情況,可在例如(Tm-235)℃~(Tm-10)℃的範圍(例如,(Tm-200)℃~(Tm-50)℃的範圍)進行加熱,可較佳在(Tm-225)℃~(Tm-50)℃的範圍(例如,(Tm-190)℃~(Tm-60)℃的範圍),更佳在(Tm-215)℃~(Tm-70)℃的範圍(例如,(Tm-180)℃~(Tm-70)℃的範圍)進行。再者,熱塑性液晶聚合物薄膜的熔點(Tm),可為例如270~380℃,可較佳為280~370℃的範圍者。(b) Degassing drying under heating can be carried out in the range of 80-300°C, preferably in the range of 80-250°C, more preferably in the range of 80-200°C. In addition, the outgassing drying under heating may be performed within a predetermined temperature range relative to the melting point Tm of the thermoplastic liquid crystal polymer or thermoplastic liquid crystal polymer film. In this case, heating can be carried out in the range of (Tm-235) °C to (Tm-10) °C (for example, the range of (Tm-200) °C to (Tm-50) °C), preferably at (Tm- 225)°C to (Tm-50)°C (for example, (Tm-190)°C to (Tm-60)°C), more preferably (Tm-215)°C to (Tm-70)°C (for example, in the range of (Tm-180)°C to (Tm-70)°C). Furthermore, the melting point (Tm) of the thermoplastic liquid crystal polymer film can be, for example, 270-380°C, preferably in the range of 280-370°C.

藉由在如上述之特定的溫度範圍中進行加熱,可抑制自薄膜急劇地產生水分,且可將薄膜中(例如,薄膜內部或薄膜表面)的水分作為水蒸氣進行除氣乾燥、或提高存在於表面之空氣的動能,而自薄膜表面進行除氣乾燥。By heating in the above-mentioned specific temperature range, the rapid generation of moisture from the film can be suppressed, and the moisture in the film (for example, inside the film or on the surface of the film) can be degassed and dried as water vapor, or the presence of water can be increased. The kinetic energy of the air on the surface degasses and dries from the surface of the film.

再者,單獨進行在加熱下之除氣乾燥時,可在不含真空度1500Pa以下的條件下進行,亦可在例如未調整壓力的大氣壓下(或常壓下)進行,但視需要也可在自大氣壓減壓的條件下(例如,超過1500Pa且小於100000Pa,較佳為3000~50000Pa左右)進行加熱。Furthermore, when degassing and drying under heating are carried out alone, it can be carried out without vacuum degree below 1500 Pa, and can also be carried out, for example, under atmospheric pressure (or normal pressure) without adjusting the pressure, but it can also be carried out if necessary. Heating is performed under reduced pressure from atmospheric pressure (for example, more than 1,500 Pa and less than 100,000 Pa, preferably about 3,000 to 50,000 Pa).

除氣乾燥步驟所需的時間,可根據熱塑性液晶聚合物次結構中之熱塑性液晶聚合物薄膜的狀態、真空度及/或加熱溫度等各種條件而適當設定,但從自熱塑性液晶聚合物薄膜整體除去水分或空氣之觀點而言,例如,針對各別的除氣乾燥步驟(真空下、加熱下、真空加熱下),可相同或不同,且為30分鐘以上、40分鐘以上、或50分鐘以上,也可為6小時以下、4小時以下、3小時以下、2小時以下、或1.5小時以下。 又,除氣乾燥步驟所需的時間,例如可對熱塑性液晶聚合物薄膜的水分率成為規定的範圍(例如,380ppm以下、300ppm以下、或200ppm以下)之時間點進行估計而適當設定。The time required for the degassing and drying step can be appropriately set according to various conditions such as the state of the thermoplastic liquid crystal polymer film in the thermoplastic liquid crystal polymer substructure, the degree of vacuum and/or the heating temperature, but from the overall temperature of the thermoplastic liquid crystal polymer film From the viewpoint of removing moisture or air, for example, each degassing drying step (under vacuum, under heating, under vacuum heating) may be the same or different, and may be 30 minutes or more, 40 minutes or more, or 50 minutes or more , may be less than 6 hours, less than 4 hours, less than 3 hours, less than 2 hours, or less than 1.5 hours. Also, the time required for the degassing drying step can be appropriately set by estimating, for example, the time when the moisture content of the thermoplastic liquid crystal polymer film falls within a predetermined range (for example, 380 ppm or less, 300 ppm or less, or 200 ppm or less).

如上所述,在除氣乾燥步驟中,組合(a)在真空下之除氣乾燥與(b)在加熱下之除氣乾燥而進行時,於可提升熱塑性液晶聚合物次結構之熱黏著性的範圍,(a)在真空下之除氣乾燥與(b)在加熱下之除氣乾燥的順序可以是任一者在先,但可較佳為在進行在加熱下之除氣乾燥作為第一除氣乾燥步驟後,進行在真空下之除氣乾燥作為第二除氣乾燥步驟。 具體而言,例如,除氣乾燥步驟,也可具備:在80℃~300℃的範圍進行規定的時間加熱而進行除氣乾燥之第一除氣乾燥步驟、及在真空度1500Pa以下而進一步進行規定的時間除氣乾燥之第二除氣乾燥步驟。在進行該等之除氣乾燥步驟之際,可適當組合上述的條件而進行。As mentioned above, in the degassing drying step, the combination of (a) degassing drying under vacuum and (b) degassing drying under heating can improve the thermal adhesiveness of the thermoplastic liquid crystal polymer substructure The order of (a) degassing drying under vacuum and (b) degassing drying under heating can be either first, but it is preferable to carry out degassing drying under heating as the second After the first degassing drying step, degassing drying under vacuum is carried out as the second degassing drying step. Specifically, for example, the degassing drying step may include: a first degassing drying step of performing degassing and drying by heating in the range of 80° C. to 300° C. for a predetermined time; The second degassing drying step of degassing drying for a specified time. When performing these degassing drying steps, it can carry out combining suitably the above-mentioned conditions.

(熱塑性液晶聚合物結構體之製造方法) 本發明中,可製造:對於將熱塑性液晶聚合物次結構多個積層的預備積層體,使用高壓釜,並將該等藉由熱壓接進行一體化的熱塑性液晶聚合物結構體。 前述製造方法至少具備:將重疊有多個熱塑性液晶聚合物次結構的預備積層體以包裝薄膜被覆,並將該包裝薄膜的端部進行密封的封入步驟;進行該包裝薄膜內部之排氣,進行升溫至為預備加熱溫度之第1溫度的升溫步驟;及以該第1溫度為起點,將高壓釜的內壓升壓至2.8MPa以下(錶壓力)之所需的壓力,同時升溫至為熱壓接溫度之第2溫度的熱壓接步驟。(Method for producing thermoplastic liquid crystal polymer structure) In the present invention, it is possible to manufacture a thermoplastic liquid crystal polymer structure in which a plurality of thermoplastic liquid crystal polymer substructures are laminated in an autoclave and these are integrated by thermocompression bonding. The aforementioned manufacturing method at least includes: covering the pre-laminated body with a plurality of thermoplastic liquid crystal polymer substructures with a packaging film, and sealing the end of the packaging film; performing exhaust inside the packaging film, performing The step of raising the temperature to the first temperature which is the preheating temperature; and taking the first temperature as a starting point, raising the internal pressure of the autoclave to the required pressure below 2.8MPa (gauge pressure), and simultaneously raising the temperature to The thermocompression bonding step of the second temperature of the crimping temperature.

(預備積層體對包裝薄膜之封入步驟) 封入步驟係準備重疊有多個熱塑性液晶聚合物次結構的預備積層體,將前述預備積層體以包裝薄膜被覆後(較佳為包覆後),將前述包裝薄膜的端部進行密封。前述預備積層體的積層結構係因應用途等而適當決定。(Prepare the step of encapsulating the laminate into the packaging film) The enclosing step is to prepare a pre-laminate with a plurality of thermoplastic liquid crystal polymer substructures overlapped, cover the pre-laminate with a packaging film (preferably after wrapping), and seal the end of the packaging film. The layered structure of the aforementioned preliminary layered body is appropriately determined depending on the application and the like.

包裝薄膜,只要可被覆預備積層體,同時可承受高壓釜加熱條件,則沒有特別限定,可為單層,也可為多個材料組合為層狀的多層。The packaging film is not particularly limited as long as it can cover the pre-laminate and withstand the heating conditions of the autoclave, and it may be a single layer or a multi-layer composed of a plurality of materials.

包裝薄膜,可為例如,耐熱性高分子薄膜(例如,聚醯亞胺薄膜、氟系薄膜),也可為金屬與耐熱性高分子薄膜之複合材。The packaging film can be, for example, a heat-resistant polymer film (eg, polyimide film, fluorine-based film), or a composite material of metal and heat-resistant polymer film.

可將預備積層體以包裝薄膜直接被覆,從使排氣變良好之觀點而言,在預備積層體與包裝薄膜之間,也可適當介隔脫模材、金屬板、透氣性薄片等。此時,除預備積層體之外,也可藉由包裝薄膜被覆、或包覆其它的構成構件(例如,脫模材、金屬板、透氣性薄片等)。The preliminary laminate can be directly covered with a packaging film, and from the viewpoint of improving air exhaust, a release material, metal plate, air-permeable sheet, etc. can also be properly interposed between the preliminary laminate and the packaging film. At this time, in addition to the pre-laminated body, other constituent members (for example, a release material, a metal plate, an air-permeable sheet, etc.) may be covered with a packaging film or covered.

作為脫模材,只要為對於熱塑性液晶聚合物具有脫模性的材料,則沒有特別限定,可使用例如,聚醯亞胺薄膜或氟系薄膜(例如,聚四氟乙烯薄膜)、脫模性多層複合材(例如,第1金屬箔、MD方向相互正交之1對的高密度聚乙烯薄片、第2金屬箔、及低摩擦性薄膜)等。在此,第1及第2金屬箔,較佳可為鋁箔,低摩擦性薄膜,也可為具有以JIS K 7125定義之靜摩擦係數為0.30以下(較佳為0.05~0.25左右)之低摩擦係數的薄膜,具體而言,也可為超高分子量聚乙烯薄膜、聚四氟乙烯薄膜等。As the release material, it is not particularly limited as long as it is a material having releasability with respect to thermoplastic liquid crystal polymers, for example, polyimide film or fluorine-based film (for example, polytetrafluoroethylene film), releasability Multilayer composite material (for example, a first metal foil, a pair of high-density polyethylene sheets perpendicular to each other in MD directions, a second metal foil, and a low-friction film), etc. Here, the first and second metal foils are preferably aluminum foils, or low-friction films that have a static friction coefficient defined in JIS K 7125 of 0.30 or less (preferably about 0.05 to 0.25). The film, specifically, may also be an ultra-high molecular weight polyethylene film, a polytetrafluoroethylene film, or the like.

作為透氣性薄片,只要以具有耐熱性的多孔質材料形成,則沒有特別限定,可使用例如,玻璃布、耐熱性纖維布帛、或金屬網眼的片狀物等。The air-permeable sheet is not particularly limited as long as it is formed of a heat-resistant porous material, and for example, a glass cloth, a heat-resistant fiber cloth, or a metal mesh sheet can be used.

又,使用透氣性薄片時,為了防止源自透氣性薄片,於預備積層體之表面轉印紋理,在預備積層與透氣性薄片之間,也可適當介隔金屬板。作為構成金屬板的金屬,可使用例如,耐壓縮性高之周知或慣用的金屬材料,且較佳為不鏽鋼。In addition, when using an air-permeable sheet, in order to prevent the texture from being transferred from the air-permeable sheet to the surface of the preliminary laminate, a metal plate may be appropriately interposed between the preliminary laminate and the air-permeable sheet. As the metal constituting the metal plate, for example, known or commonly used metal materials having high compression resistance can be used, and stainless steel is preferred.

金屬板,例如,厚度可為0.1mm~1cm左右,可較佳為0.2mm~0.8mm左右,更佳為0.3mm~0.6mm左右。The metal plate, for example, may have a thickness of about 0.1 mm to 1 cm, preferably about 0.2 mm to 0.8 mm, more preferably about 0.3 mm to 0.6 mm.

將預備積層體以包裝薄膜被覆後,為了進行包裝薄膜內部之排氣而將前述包裝薄膜的端部進行密封。在密封端部時,只要可密封包裝薄膜之相對向的端部,則沒有特別限定,可以膠帶類等密封手段進行密封,也可以老虎鉗等治具固定而進行密封,亦可組合該等而進行密封。After covering the preliminary laminate with a packaging film, the ends of the packaging film are sealed in order to ventilate the inside of the packaging film. When sealing the ends, as long as the opposite ends of the packaging film can be sealed, there are no particular limitations. Sealing means such as tapes can be used for sealing, and jigs such as vise can also be used for sealing, or a combination of these can be used. seal.

(升溫步驟) 升溫步驟係進行該包裝薄膜內部之排氣,進行升溫至為預備加熱溫度之第1溫度。包裝薄膜內部的排氣機構,只要可排氣,則沒有特別限定,例如,將包裝薄膜的端部密封後,進行包裝薄膜內部之排氣。升溫可在包裝薄膜的排氣之前,也可與排氣重疊,亦可在排氣之後進行,任一者均可。(heating step) The temperature raising step is to exhaust the inside of the packaging film and raise the temperature to the first temperature which is the preheating temperature. The exhaust mechanism inside the packaging film is not particularly limited as long as it can exhaust gas. For example, after sealing the end of the packaging film, the inside of the packaging film is exhausted. The temperature rise may be performed before the degassing of the packaging film, may overlap with the degassing, or may be performed after the degassing, either.

升溫步驟,可藉由在第1溫度保持規定的時間,進行預備加熱。至預備加熱之期間,較佳為不在高壓釜內部進行利用加壓氣體的供給之積極的加壓。In the temperature raising step, preliminary heating can be performed by maintaining the first temperature for a predetermined time. It is preferable not to actively pressurize the inside of the autoclave by supplying pressurized gas until the preliminary heating.

第1溫度為預備加熱溫度。較佳為第1溫度中,熱塑性液晶聚合物分子不具有激烈的流動性。The first temperature is the preliminary heating temperature. Preferably, at the first temperature, the thermoplastic liquid crystal polymer molecules do not have severe fluidity.

第1溫度,例如,在形成預備積層體之中將預備加熱對象的熱塑性液晶聚合物要素之熔點設為ML時,第1溫度,可為例如(ML-150)℃~(ML-50)℃的範圍,也可較佳為(ML-130)℃~(ML-70)℃左右。從防止熱塑性液晶聚合物分子急劇地流動之觀點而言,預備加熱對象的熱塑性液晶聚合物要素,也可為在預備積層體之中,熔點最低的熱塑性液晶聚合物要素。第1溫度,可因應熱塑性液晶聚合物的流動開始溫度而適當設定,可為例如,150~250℃的範圍,較佳也可為180~230℃左右。The first temperature, for example, when the melting point of the thermoplastic liquid crystal polymer element to be heated in the formation of the preliminary laminate is ML, the first temperature can be, for example, (ML-150)°C to (ML-50)°C The range can also be preferably about (ML-130)°C to (ML-70)°C. From the viewpoint of preventing the rapid flow of the thermoplastic liquid crystal polymer molecules, the thermoplastic liquid crystal polymer element to be preheated may be the thermoplastic liquid crystal polymer element having the lowest melting point in the preliminary laminate. The first temperature can be appropriately set according to the flow initiation temperature of the thermoplastic liquid crystal polymer, and may be, for example, in the range of 150 to 250°C, preferably about 180 to 230°C.

升溫步驟中之升溫速度,可以例如1~10℃/min進行,較佳也可以2~8℃/min進行。The temperature raising rate in the temperature raising step can be, for example, 1-10°C/min, preferably 2-8°C/min.

在第1溫度之保持時間(或預備加熱時間),只要進行預備積層體的層間中之熱壓接,則沒有特別限定,且因應除氣處理之有無或預備加熱溫度而適當不同,在第1溫度之保持時間(或預備加熱時間),例如,可進行1~120分鐘左右,較佳也可進行3~60分鐘左右。又,經過在第1溫度之規定的保持時間(或預備加熱時間)時,例如,預備加熱對象的熱塑性液晶聚合物要素之水分率,可為規定的範圍(例如,380ppm以下、300ppm以下、或200ppm以下)。The holding time at the first temperature (or the preliminary heating time) is not particularly limited as long as the thermal compression bonding between the layers of the preliminary laminate is carried out, and it varies appropriately depending on the presence or absence of degassing treatment and the preliminary heating temperature. The temperature holding time (or preheating time) may be, for example, about 1 to 120 minutes, preferably about 3 to 60 minutes. Also, when the predetermined holding time (or preheating time) at the first temperature has elapsed, for example, the moisture content of the thermoplastic liquid crystal polymer element to be preheated may be within a predetermined range (for example, 380ppm or less, 300ppm or less, or 200ppm or less).

進行除氣乾燥步驟時,在第1溫度之保持時間,可進行1~20分鐘左右,較佳可進行2~15分鐘左右,更佳也可進行2~10分鐘左右。When performing the degassing drying step, the holding time at the first temperature may be about 1 to 20 minutes, preferably about 2 to 15 minutes, more preferably about 2 to 10 minutes.

(熱壓接步驟) 熱壓接步驟係以該第1溫度為起點,將高壓釜的內壓升壓至2.8MPa以下(錶壓力)之所需的壓力,同時升溫至為熱壓接溫度之第2溫度,進行預備積層體的層間中之熱壓接。(Thermocompression step) The thermocompression bonding step is to start from the first temperature, increase the internal pressure of the autoclave to the required pressure below 2.8MPa (gauge pressure), and simultaneously raise the temperature to the second temperature, which is the thermocompression bonding temperature, for preparation Thermocompression bonding between layers of a laminate.

與升壓同時進行第2升溫步驟至所需的第2溫度。升溫速度,可為2~20℃/min,較佳為3~15℃/min,更佳也可為4~10℃/min。第2溫度可為最高加熱溫度,且藉由第2溫度,熱壓接預備積層體中之熱塑性液晶聚合物次結構。之後,熱塑性液晶聚合物次結構的積層體進行冷卻,且釋放壓力後,可得到作為熱塑性液晶聚合物結構體。Simultaneously with increasing the pressure, a second temperature raising step is carried out to the desired second temperature. The heating rate may be 2-20°C/min, preferably 3-15°C/min, more preferably 4-10°C/min. The second temperature may be the highest heating temperature, and the thermoplastic liquid crystal polymer substructure in the pre-laminate is thermocompressed by the second temperature. Afterwards, the laminated body of the thermoplastic liquid crystal polymer substructure is cooled, and after the pressure is released, a thermoplastic liquid crystal polymer structure can be obtained.

在加壓下為了防止熱塑性液晶聚合物過度地流動,高壓釜中之最大壓力,需要為2.8MPa以下(錶壓力),且較佳為2.5MPa以下(錶壓力),更佳也可為2MPa以下(錶壓力)。只要可黏著熱塑性液晶聚合物次結構,則最大壓力之下限值沒有特別限定,可為例如,1.5MPa(錶壓力)。In order to prevent the thermoplastic liquid crystal polymer from excessively flowing under pressure, the maximum pressure in the autoclave needs to be 2.8MPa or less (gauge pressure), preferably 2.5MPa or less (gauge pressure), more preferably 2MPa or less (gauge pressure). As long as the thermoplastic liquid crystal polymer substructure can be adhered, the lower limit of the maximum pressure is not particularly limited, and may be, for example, 1.5 MPa (gauge pressure).

第2溫度為熱壓接溫度。熱壓接溫度,在熱塑性液晶聚合物次結構的熱塑性液晶聚合物要素間,只要為可融接鄰接的次結構之任一方的範圍,則沒有特別限定。例如,熱壓接溫度,可在事前把握熱塑性液晶聚合物次結構的熱融接溫度之後而決定。例如,在形成預備積層體之中將融接對象的熱塑性液晶聚合物要素之熔點設為MH時,第2溫度可為例如(MH-30)℃~(MH+10)℃的範圍,較佳也可為(MH-10)℃~(MH+5)℃左右。從進行確實的融接之觀點而言,融接對象的熱塑性液晶聚合物要素,也可為在預備積層體之中,熔點最高的熱塑性液晶聚合物要素。The second temperature is the thermocompression bonding temperature. The thermocompression bonding temperature is not particularly limited as long as it is within a range in which any of the adjacent substructures can be fused between the thermoplastic liquid crystal polymer elements of the thermoplastic liquid crystal polymer substructure. For example, the thermocompression bonding temperature can be determined after grasping the thermal fusion bonding temperature of the thermoplastic liquid crystal polymer substructure in advance. For example, when the melting point of the thermoplastic liquid crystal polymer element to be fused is set to MH in forming the preliminary laminate, the second temperature may be, for example, in the range of (MH-30)°C to (MH+10)°C, preferably It may be about (MH-10)°C to (MH+5)°C. From the viewpoint of performing reliable fusion, the thermoplastic liquid crystal polymer element to be welded may be the thermoplastic liquid crystal polymer element having the highest melting point among the preliminary laminates.

在第2溫度之保持時間(或熱壓接時間),只要進行預備積層體的層間中之熱壓接,則沒有特別限定,且可因應除氣乾燥處理之有無或熱壓接溫度而適當變更,例如,可進行15~60分鐘左右,較佳為20~50分鐘左右,更佳也可進行20~40分鐘左右。The holding time at the second temperature (or thermocompression bonding time) is not particularly limited as long as the thermocompression bonding between the layers of the preliminary laminate is performed, and can be appropriately changed depending on the presence or absence of degassing drying treatment or the thermocompression bonding temperature For example, it can be performed for about 15 to 60 minutes, preferably for about 20 to 50 minutes, and more preferably for about 20 to 40 minutes.

藉由如前述的製造方法,可抑制急劇的熱塑性液晶聚合物分子之流動,同時也在鄰接之熱塑性液晶聚合物次結構間達成良好的黏著性。By the above-mentioned manufacturing method, the rapid flow of TLC molecules can be suppressed, and at the same time, good adhesion can be achieved between adjacent TLC substructures.

以下將使用高壓釜的熱塑性液晶聚合物結構體之製造方法,例示一實施態樣,同時進一步說明。Hereinafter, a method for manufacturing a thermoplastic liquid crystal polymer structure using an autoclave will be exemplified and further described.

在圖1表示利用本發明的一實施態樣之用以說明高壓釜式熱壓接法的概略圖。高壓釜9內部中,藉由包裝薄膜1進行包覆,且根據所需的構成而重疊多個熱塑性液晶聚合物次結構的預備積層體5係安裝於載板6上。在此,包裝薄膜1的內部中,脫模材4a、4b配置於預備積層體5之上下面,甚至在上面之脫模材4a上,介隔頂板3,而配置透氣性薄片2。FIG. 1 shows a schematic diagram for explaining an autoclave thermocompression bonding method using an embodiment of the present invention. The interior of the autoclave 9 is covered with a packaging film 1 , and a pre-laminated body 5 in which a plurality of thermoplastic liquid crystal polymer substructures are overlapped is mounted on a carrier plate 6 according to a desired configuration. Here, in the inside of the packaging film 1, the release materials 4a, 4b are arranged on the upper and lower sides of the preliminary laminate 5, and even on the upper release material 4a, the air-permeable sheet 2 is arranged through the top plate 3.

包裝薄膜1係藉由真空密封膠帶8密封,且在包裝薄膜1之適當處,連接用以抽真空的真空噴嘴7。包裝薄膜1內部的空氣係藉由真空噴嘴7進行排氣。再者,在包裝薄膜1之內側,視需要也可配置透氣性薄片2。藉由存在透氣性薄片2,可更提高包裝薄膜1的內部之排氣性。The packaging film 1 is sealed by a vacuum sealing tape 8, and a vacuum nozzle 7 for vacuuming is connected to an appropriate position of the packaging film 1. The air inside the packaging film 1 is exhausted through the vacuum nozzle 7 . Furthermore, on the inner side of the packaging film 1, the air-permeable sheet 2 may also be arranged if necessary. By the presence of the air-permeable sheet 2, the air permeability inside the packaging film 1 can be further improved.

再者,在圖1中,透氣性薄片2係配置成由預備積層體5之上方經過預備積層體5之側面,通往真空噴嘴7。但是,透氣性薄片2的設定位置,在預備積層體5之周圍中,只要可提高排氣性,則沒有限定。例如,透氣性薄片2,也可在選自預備積層體5的上方、下方、側面之至少一處中配置。又,將透氣性薄片2設置於預備積層體5之上方及/或下方時,較佳為在脫模材4a、4b與透氣性薄片2之間介隔設置金屬板。Furthermore, in FIG. 1 , the air-permeable sheet 2 is disposed so as to pass through the side of the preliminary laminate 5 from above the preliminary laminate 5 and lead to the vacuum nozzle 7 . However, the setting position of the air-permeable sheet 2 is not limited as long as the air-gas performance can be improved in the periphery of the preliminary laminated body 5 . For example, the air-permeable sheet 2 may be arranged in at least one of the upper, lower, and side surfaces of the preliminary laminate 5 . Moreover, when installing the air permeable sheet 2 above and/or below the preliminary laminate 5 , it is preferable to provide a metal plate between the release materials 4 a , 4 b and the air permeable sheet 2 .

又,在圖1中,包裝薄膜1係配置於預備積層體5的上方及下方之雙方,且在端部藉由真空密封膠帶8密封,以捆包預備積層體5的狀態進行被覆。In addition, in FIG. 1 , the packaging film 1 is arranged on both the upper and lower sides of the preliminary laminated body 5 , and the ends are sealed with vacuum sealing tape 8 to cover the preliminary laminated body 5 in a packaged state.

再者,只要包裝薄膜1內部可排氣,則也可不配置下方的包裝薄膜1。也可將預備積層體5以包裝薄膜1自上方被覆,且將前述包裝薄膜1的端部,相對於載板6,使用規定的密封手段(例如,真空密封膠帶等膠帶類)進行密封。利用前述密封手段之密合低的情況,也可進一步將密封手段與醯亞胺薄膜以老虎鉗等治具固定。Furthermore, as long as the inside of the packaging film 1 can be exhausted, the packaging film 1 below may not be arranged. The pre-laminated body 5 may be covered with the packaging film 1 from above, and the end of the packaging film 1 may be sealed with respect to the carrier plate 6 using a predetermined sealing means (for example, tapes such as vacuum sealing tape). Taking advantage of the low adhesion of the aforementioned sealing means, the sealing means and the imide film can be further fixed with jigs such as vise.

在進行熱壓接之際,由氣體源(圖中未示出)對高壓釜9內部供給加壓氣體。供給的加壓氣體,因為均勻地存在於包裝薄膜1之周圍,所以可均等地加壓包裝薄膜1的內部。When thermocompression bonding is performed, pressurized gas is supplied to the inside of the autoclave 9 from a gas source (not shown in the figure). Since the supplied pressurized gas exists uniformly around the packaging film 1, the inside of the packaging film 1 can be uniformly pressurized.

另一方面,包裝薄膜1的內部係進行排氣,因此對於包裝薄膜1施加的壓力,直接變成對於積層體5施加。 其結果,預備積層體5,不僅上面及下面,且也自其側面加壓相等的壓力,並可將預備積層體5內部的各熱塑性液晶聚合物次結構互相黏著。On the other hand, since the inside of the packaging film 1 is exhausted, the pressure applied to the packaging film 1 is directly applied to the laminate 5 . As a result, not only the upper and lower surfaces of the pre-laminated body 5 but also the side surfaces thereof are subjected to equal pressure, and the respective thermoplastic liquid crystal polymer substructures inside the pre-laminated body 5 can be adhered to each other.

在高壓釜9中使用的各種構件,可使用周知或慣用的構件。又,也可使用別的構件代替、或補充上述的構件。For various members used in the autoclave 9, well-known or conventional ones can be used. In addition, other members may be used instead of or in addition to the above-mentioned members.

例如,包裝薄膜1,只要為具有耐熱性及耐壓性的可撓性材料,則沒有特別限定,可舉出例如,聚醯亞胺薄膜等。作為脫模材4a、4b,使用例如,聚醯亞胺薄膜、氟系薄膜、脫模性多層複合材等。For example, the packaging film 1 is not particularly limited as long as it is a flexible material having heat resistance and pressure resistance, and examples thereof include polyimide films and the like. As the release materials 4a and 4b, for example, a polyimide film, a fluorine-based film, a releasable multilayer composite material, etc. are used.

又,作為透氣性薄片2,只要可用以將存在於包裝薄膜1與預備積層體5之間的空氣排氣,則沒有特別限定,可使用例如,玻璃布、耐熱性纖維布帛、或金屬網眼的片狀物等。Also, the air-permeable sheet 2 is not particularly limited as long as it can be used to exhaust the air existing between the packaging film 1 and the preliminary laminate 5, and for example, glass cloth, heat-resistant fiber cloth, or metal mesh can be used. flakes etc.

又,金屬板係用以防止源自透氣性薄片2的形狀印於熱塑性液晶聚合物結構體的表面而配置。因此,未配置透氣性薄片2時,關於金屬板,也可以不配置。In addition, the metal plate is arranged to prevent the shape derived from the air-permeable sheet 2 from being imprinted on the surface of the thermoplastic liquid crystal polymer structure. Therefore, when the air-permeable sheet 2 is not arranged, the metal plate need not be arranged.

作為加壓氣體,只要不是在加熱下具有高反應性的氣體,則沒有特別限定,可為通常的大氣等,但也可適當使用氮氣等。The pressurized gas is not particularly limited as long as it is not a gas having high reactivity under heating, and it may be normal air or the like, but nitrogen or the like may be suitably used.

本發明中,於高壓釜式熱壓接法中,藉由進行特定的加熱條件,可抑制熱塑性液晶聚合物分子過度流動,同時黏著熱塑性液晶聚合物次結構之間。然後,可使熱塑性液晶聚合物分子之流動變緩慢,因此可使熱塑性液晶聚合物結構體之配向變均勻,同時提高熱塑性液晶聚合物結構體之一體性。又,在存在導體圖案所形成的電路時,使電路附近中之熱塑性液晶聚合物的流動變緩慢,即使存在電路,也可使熱塑性液晶聚合物之配向性變均勻。In the present invention, in the autoclave-type thermocompression bonding method, by performing specific heating conditions, the excessive flow of the thermoplastic liquid crystal polymer molecules can be suppressed, and at the same time, the adhesion between the thermoplastic liquid crystal polymer substructures can be achieved. Then, the flow of the thermoplastic liquid crystal polymer molecules can be slowed down, so that the alignment of the thermoplastic liquid crystal polymer structure can be made uniform, and at the same time, the integrity of the thermoplastic liquid crystal polymer structure can be improved. In addition, when there is a circuit formed by the conductor pattern, the flow of the thermoplastic liquid crystal polymer in the vicinity of the circuit is slowed down, and even if the circuit is present, the alignment of the thermoplastic liquid crystal polymer can be made uniform.

以第1溫度為起點,在高壓釜內部供給加熱・加壓氣體,將高壓釜的內壓升壓至所需的最大壓力。此時,在2.8MPa以下(錶壓力)之所需的壓力下加壓預備積層體,進行熱壓接。Starting from the first temperature, a heated and pressurized gas is supplied inside the autoclave to increase the internal pressure of the autoclave to the required maximum pressure. At this time, the pre-laminated body is pressurized under a required pressure of 2.8 MPa or less (gauge pressure), and thermocompression bonding is performed.

(熱塑性液晶聚合物結構體) 所得的熱塑性液晶聚合物結構體,係熱塑性液晶聚合物次結構之一體性優異,同時可抑制源自在製造過程中構成結構體的熱塑性液晶聚合物分子過度地流動的樹脂流動之產生。(thermoplastic liquid crystal polymer structure) The resulting thermoplastic liquid crystal polymer structure is excellent in the integrity of the thermoplastic liquid crystal polymer substructure, and can suppress the occurrence of resin flow caused by excessive flow of the thermoplastic liquid crystal polymer molecules constituting the structure during the manufacturing process.

本發明的熱塑性液晶聚合物結構體,可使用高壓釜而將多個熱塑性液晶聚合物次結構進行一體化,藉此控制積層後之各次結構的熱塑性液晶聚合物要素之熱膨脹係數為規定的值,也可在形成熱塑性液晶聚合物結構體之前,預先調整熱塑性液晶聚合物薄膜的熱膨脹係數。 再者,在積層之際的熱壓接時,未調整熱塑性液晶聚合物要素的熱膨脹係數時,熱塑性液晶聚合物要素(或熱塑性液晶聚合物層)的熱膨脹係數,也可判斷為與構成熱塑性液晶聚合物結構體的各熱塑性液晶聚合物次結構所使用之熱塑性液晶聚合物薄膜的熱膨脹係數相同。In the thermoplastic liquid crystal polymer structure of the present invention, a plurality of thermoplastic liquid crystal polymer substructures can be integrated using an autoclave, thereby controlling the coefficient of thermal expansion of the thermoplastic liquid crystal polymer elements of each substructure after lamination to a predetermined value , the thermal expansion coefficient of the thermoplastic liquid crystal polymer film can also be adjusted in advance before forming the thermoplastic liquid crystal polymer structure. Furthermore, when the thermal expansion coefficient of the thermoplastic liquid crystal polymer element is not adjusted during thermocompression bonding at the time of lamination, the thermal expansion coefficient of the thermoplastic liquid crystal polymer element (or thermoplastic liquid crystal polymer layer) can also be judged to be related to the composition of the thermoplastic liquid crystal. The thermoplastic liquid crystal polymer films used for each thermoplastic liquid crystal polymer substructure of the polymer structure have the same thermal expansion coefficient.

熱塑性液晶聚合物結構體中之熱塑性液晶聚合物要素的面方向之熱膨脹係數,可為例如-10ppm/℃~50ppm/℃的範圍,可較佳為10ppm/℃~50ppm/℃的範圍,更佳為15ppm/℃~45ppm/℃的範圍。再者,熱塑性液晶聚合物結構體中之熱塑性液晶聚合物要素的面方向之熱膨脹係數,也可各別針對熱塑性液晶聚合物結構體的表面或背面,藉由採取規定的厚度(例如,10~100μm的範圍,最外層的熱塑性液晶聚合物層之積層狀態明確時為其厚度)之熱塑性液晶聚合物要素的數值進行評價。The thermal expansion coefficient of the thermoplastic liquid crystal polymer element in the thermoplastic liquid crystal polymer structure in the plane direction may be, for example, in the range of -10ppm/°C to 50ppm/°C, preferably in the range of 10ppm/°C to 50ppm/°C, more preferably It is in the range of 15 ppm/°C to 45 ppm/°C. Furthermore, the thermal expansion coefficient of the thermoplastic liquid crystal polymer element in the thermoplastic liquid crystal polymer structure in the plane direction can also be respectively for the surface or the back surface of the thermoplastic liquid crystal polymer structure, by adopting a predetermined thickness (for example, 10~ In the range of 100 μm, the thickness of the outermost thermoplastic liquid crystal polymer layer was evaluated as the thickness) of the thermoplastic liquid crystal polymer element.

又,熱塑性液晶聚合物結構體中之熱塑性液晶聚合物要素的面方向之熱膨脹係數的公差,因應用途,可為例如,50ppm/℃以下、40ppm/℃以下、30ppm/℃以下、20ppm/℃以下,亦可為15ppm/℃以下、10ppm/℃以下、5ppm/℃以下、3ppm/℃以下、或1ppm/℃以下。再者,熱塑性液晶聚合物結構體中之熱塑性液晶聚合物要素的面方向之熱膨脹係數的公差係自熱塑性液晶聚合物結構體隨機地採取多個熱塑性液晶聚合物要素作為樣本片,且可為得到的樣本片之面方向的熱膨脹係數之最大值及最小值的差,但從簡便性之觀點而言,也可各別針對熱塑性液晶聚合物結構體之表面及背面,採取規定的厚度(例如,10~100μm的範圍,最外層的熱塑性液晶聚合物層之積層狀態明確時為其厚度)的熱塑性液晶聚合物要素,且將其面方向的熱膨脹係數之差作為公差。In addition, the tolerance of the thermal expansion coefficient of the thermoplastic liquid crystal polymer element in the thermoplastic liquid crystal polymer structure in the plane direction may be, for example, 50 ppm/°C or less, 40 ppm/°C or less, 30 ppm/°C or less, or 20 ppm/°C or less depending on the application. , may be 15 ppm/°C or less, 10 ppm/°C or less, 5 ppm/°C or less, 3 ppm/°C or less, or 1 ppm/°C or less. Furthermore, the tolerance of the thermal expansion coefficient of the thermoplastic liquid crystal polymer element in the thermoplastic liquid crystal polymer structure in the plane direction is that a plurality of thermoplastic liquid crystal polymer elements are randomly selected from the thermoplastic liquid crystal polymer structure as sample pieces, and can be obtained The difference between the maximum value and the minimum value of the thermal expansion coefficient in the surface direction of the sample sheet, but from the viewpoint of simplicity, it is also possible to adopt a predetermined thickness for the surface and the back surface of the thermoplastic liquid crystal polymer structure (for example, The range of 10 to 100 μm, the thickness of the thermoplastic liquid crystal polymer element when the layered state of the outermost thermoplastic liquid crystal polymer layer is clear), and the difference in the thermal expansion coefficient in the plane direction is taken as a tolerance.

在熱塑性液晶聚合物結構體中,前述熱塑性液晶聚合物次結構,較佳也可以選自包含(i)熱塑性液晶聚合物層、(ii)在一方之面具有導體層的熱塑性液晶聚合物層、及(iii)在雙方之面具有導體層的熱塑性液晶聚合物層的組群之至少2層的熱塑性液晶聚合物次結構構成。In the thermoplastic liquid crystal polymer structure, the aforementioned thermoplastic liquid crystal polymer substructure can also preferably be selected from the group consisting of (i) a thermoplastic liquid crystal polymer layer, (ii) a thermoplastic liquid crystal polymer layer having a conductor layer on one side, and (iii) at least 2 layers of thermoplastic liquid crystal polymer substructure of the group of thermoplastic liquid crystal polymer layers having conductive layers on both sides.

就熱塑性液晶聚合物次結構而言,只要由熱塑性液晶聚合物形成,且多個次結構可成為一體化,則可使用各式各樣的形狀之次結構。較佳為熱塑性液晶聚合物次結構,可選自包含(i)單獨的熱塑性液晶聚合物層(L)、(ii)在一方之面具有導體層的熱塑性液晶聚合物層(CL)、及(iii)在雙方之面具有導體層的熱塑性液晶聚合物層(CLC)的群組。在此,就導體層而言,可舉出有導電性的層,例如,訊號層、電源層、接地層等,具體而言,可舉出以導體圖案、導體箔、導體膜等形成的層,且該等之導體層,視需要也可形成適當所需的形狀。As the thermoplastic liquid crystal polymer substructure, as long as it is formed of thermoplastic liquid crystal polymer and a plurality of substructures can be integrated, various shapes of substructures can be used. A thermoplastic liquid crystal polymer substructure is preferred, selected from the group consisting of (i) a single thermoplastic liquid crystal polymer layer (L), (ii) a thermoplastic liquid crystal polymer layer (CL) with a conductor layer on one side, and ( iii) A group of thermoplastic liquid crystal polymer layers (CLC) with conductor layers on both sides. Here, examples of the conductive layer include conductive layers such as signal layers, power supply layers, and ground layers, and specifically, layers formed of conductive patterns, conductive foils, and conductive films. , and these conductor layers can also be formed into appropriate desired shapes as needed.

就熱塑性液晶聚合物次結構之較佳的組合而言,可舉出例如,以下的組合。 (I)多個L (II)多個CL (III)多個CLC (IV)一或多個L及一或多個CL (V)一或多個L及一或多個CLC (VI)一或多個L、一或多個CL、及一或多個CLC、以及 (VII)一或多個CL及一或多個CLC。 在此,意指L:單獨的熱塑性液晶聚合物層、CL:在一方之面具有導體層的熱塑性液晶聚合物層、及CLC:在雙方之面具有導體層的熱塑性液晶聚合物層。該等之中,重疊L、CL、及LCL的順序或方向,可因應用途而適當設定。Examples of preferred combinations of thermoplastic liquid crystal polymer substructures include the following combinations. (I) multiple L (II) Multiple CLs (III) Multiple CLCs (IV) One or more L and one or more CL (V) one or more L and one or more CLC (VI) one or more L, one or more CL, and one or more CLC, and (VII) One or more CLs and one or more CLCs. Here, L: a single thermoplastic liquid crystal polymer layer, CL: a thermoplastic liquid crystal polymer layer having a conductive layer on one side, and CLC: a thermoplastic liquid crystal polymer layer having a conductive layer on both sides. Among them, the order or direction of overlapping L, CL, and LCL can be appropriately set according to the application.

構成熱塑性液晶聚合物次結構之熱塑性液晶聚合物薄膜(在熱壓接後為熱塑性液晶聚合物層)的厚度,可因應用途而適當設定,但也可較佳全部為140μm以下,更佳為120μm以下,進一步更佳為110μm以下。又,熱塑性液晶聚合物薄膜(或熱塑性液晶聚合物層)的厚度之下限值,可為10μm左右,但因應作為目的之厚度,亦可為15μm以上、30μm以上、60μm以上、或85μm以上。構成各次結構之熱塑性液晶聚合物薄膜(或熱塑性液晶聚合物層)的厚度,可相同也可不同,但較佳為同程度(例如,各厚度之差為10%以下,較佳為5%以下)。The thickness of the thermoplastic liquid crystal polymer film (the thermoplastic liquid crystal polymer layer after thermocompression bonding) constituting the thermoplastic liquid crystal polymer substructure can be appropriately set according to the application, but it is also preferably all below 140 μm, more preferably 120 μm It is not more than 110 μm, and more preferably not more than 110 μm. In addition, the lower limit of the thickness of the thermoplastic liquid crystal polymer film (or thermoplastic liquid crystal polymer layer) may be about 10 μm, but it may be 15 μm or more, 30 μm or more, 60 μm or more, or 85 μm or more depending on the intended thickness. The thicknesses of the thermoplastic liquid crystal polymer films (or thermoplastic liquid crystal polymer layers) constituting each substructure can be the same or different, but preferably at the same level (for example, the difference between each thickness is 10% or less, preferably 5% the following).

因應用途,熱塑性液晶聚合物次結構的數量,可適當設定,熱塑性液晶聚合物次結構的數量,作為輕薄用途使用時,例如為2~10左右,較佳也可為3~8左右。該情況中,各熱塑性液晶聚合物次結構的厚度為10~70μm左右,較佳也可為10~60μm左右。 輕薄用途的情況,例如,熱塑性液晶聚合物結構體的厚度,可為30μm以上、50μm以上、100μm以上。厚度的上限,可適當設定,可為例如,150μm以下。Depending on the application, the number of substructures of the thermoplastic liquid crystal polymer can be appropriately set. When the number of substructures of the thermoplastic liquid crystal polymer is used for light and thin applications, it is, for example, about 2-10, preferably about 3-8. In this case, the thickness of each thermoplastic liquid crystal polymer substructure is about 10-70 μm, preferably about 10-60 μm. For light and thin applications, for example, the thickness of the thermoplastic liquid crystal polymer structure may be 30 μm or more, 50 μm or more, or 100 μm or more. The upper limit of the thickness can be appropriately set, and may be, for example, 150 μm or less.

又,熱塑性液晶聚合物次結構的數量,作為厚重用途使用時,因應熱塑性液晶聚合物結構體所需要的厚度、或熱塑性液晶聚合物次結構的厚度,可為例如,2以上、3以上、4以上、9以上、或10以上。又,上限沒有特別限定,可為例如,200以下、150以下、100以下、50以下、20以下、或15以下。再者,關於該等之上限及下限的記載,可自由地組合。該情況中,各熱塑性液晶聚合物次結構的厚度為50~140μm左右,較佳也可為70~120μm左右。 厚重用途的情況,例如,熱塑性液晶聚合物結構體,可超過150μm,也可為250μm以上、350μm以上、450μm以上、或550μm以上。厚度的上限,可適當設定,可為例如,5mm以下。In addition, the number of thermoplastic liquid crystal polymer substructures, when used as a thick application, can be, for example, 2 or more, 3 or more, 4 or more depending on the thickness required for the thermoplastic liquid crystal polymer structure or the thickness of the thermoplastic liquid crystal polymer substructure. Above, above 9, or above 10. In addition, the upper limit is not particularly limited, and may be, for example, 200 or less, 150 or less, 100 or less, 50 or less, 20 or less, or 15 or less. In addition, the description about these upper limits and lower limits can be freely combined. In this case, the thickness of each thermoplastic liquid crystal polymer substructure is about 50-140 μm, preferably about 70-120 μm. In the case of heavy application, for example, a thermoplastic liquid crystal polymer structure may be more than 150 μm, and may be 250 μm or more, 350 μm or more, 450 μm or more, or 550 μm or more. The upper limit of the thickness can be appropriately set, and may be, for example, 5 mm or less.

又,構成熱塑性液晶聚合物結構體的各熱塑性液晶聚合物次結構之熱塑性液晶聚合物要素,各別的熔點可相同,亦可不同。不同的情況,熔點最低的熱塑性液晶聚合物要素與熔點最高的熱塑性液晶聚合物要素之間的溫度差為超過0℃且100℃以下,可較佳為10℃以上90℃以下,更佳為20℃以上80℃以下。In addition, the thermoplastic liquid crystal polymer elements of the respective thermoplastic liquid crystal polymer substructures constituting the thermoplastic liquid crystal polymer structure may have the same or different melting points. In different cases, the temperature difference between the thermoplastic liquid crystal polymer element with the lowest melting point and the thermoplastic liquid crystal polymer element with the highest melting point is more than 0°C and less than 100°C, preferably 10°C to 90°C, more preferably 20°C Above 80°C and below 80°C.

前述熱塑性液晶聚合物結構體,也可具有3層以上之導體層(例如,金屬箔層或包含金屬箔的導體圖案)。又,因應用途,也可具有5層以上、7層以上之導體層。導體層之上限沒有特別限定,也可為20層左右。The aforementioned thermoplastic liquid crystal polymer structure may have three or more conductive layers (for example, a metal foil layer or a conductive pattern including a metal foil). Also, depending on the application, it may have 5 or more conductor layers, or 7 or more conductor layers. The upper limit of the conductor layer is not particularly limited, and may be about 20 layers.

熱塑性液晶聚合物結構體為以前述熱塑性液晶聚合物層構成的熱塑性液晶聚合物次結構之積層體時,本發明的熱塑性液晶聚合物結構體,因為一體性優異,所以在鄰接的熱塑性液晶聚合物次結構間具有熱壓接性。在此,具有熱壓接性(或黏著性)指藉由後述的實施例所記載之方法評價的黏著強度,例如為0.4N/mm以上,也可較佳為0.5N/mm以上,進一步較佳為0.6N/mm以上,更佳為0.7N/mm以上,進一步更佳為0.8N/mm以上,特佳為0.9N/mm以上,進一步特佳為1.0N/mm以上。黏著強度之上限沒有特別限定,也可為2.0N/mm左右。 特別是本發明用於厚重用途時,也可藉由熱壓接而將結構一體化,且可提高鄰接的次結構間之黏著強度,因而較佳。When the thermoplastic liquid crystal polymer structure is a laminate of thermoplastic liquid crystal polymer substructures composed of the aforementioned thermoplastic liquid crystal polymer layers, the thermoplastic liquid crystal polymer structure of the present invention is excellent in integrity, so the adjacent thermoplastic liquid crystal polymer There is thermocompression bonding between the substructures. Here, having thermocompression bondability (or adhesiveness) means that the adhesive strength evaluated by the method described in the examples described later is, for example, 0.4 N/mm or more, preferably 0.5 N/mm or more, and further higher It is preferably at least 0.6 N/mm, more preferably at least 0.7 N/mm, further preferably at least 0.8 N/mm, particularly preferably at least 0.9 N/mm, and still more preferably at least 1.0 N/mm. The upper limit of the adhesive strength is not particularly limited, and may be about 2.0 N/mm. Especially when the present invention is used for thick and heavy applications, the structure can also be integrated by thermocompression bonding, and the adhesive strength between adjacent substructures can be improved, so it is preferable.

又,本發明也可得到各向同性優異的熱塑性液晶聚合物結構體,該情況中,熱塑性液晶聚合物結構體的分子配向度SOR,可為例如0.95~1.25左右,可較佳為0.98~1.18左右。再者,熱塑性液晶聚合物結構體的分子配向度SOR為藉由後述的實施例所記載之方法測定的數值。In addition, the present invention can also obtain a thermoplastic liquid crystal polymer structure with excellent isotropy. In this case, the molecular orientation SOR of the thermoplastic liquid crystal polymer structure can be, for example, about 0.95 to 1.25, preferably 0.98 to 1.18 about. In addition, the degree of molecular orientation SOR of the thermoplastic liquid crystal polymer structure is a numerical value measured by a method described in Examples described later.

又,本發明中,鄰接的熱塑性液晶聚合物次結構中之各別的熱塑性液晶聚合物要素之面方向的熱膨脹係數之差,可為例如15ppm/℃以上,可較佳為18ppm/℃以上,更佳為20ppm/℃以上。此時,也可得到在於規定的溫度中具有低熱膨脹率的熱塑性液晶聚合物次結構側彎曲之具有雙金屬的性質之熱塑性液晶聚合物結構體。Also, in the present invention, the difference in the thermal expansion coefficients of the respective thermoplastic liquid crystal polymer elements in the plane direction in adjacent thermoplastic liquid crystal polymer substructures may be, for example, 15 ppm/°C or more, preferably 18 ppm/°C or more, More preferably, it is 20 ppm/°C or higher. In this case, also, a thermoplastic liquid crystal polymer structure having a bimetallic property can be obtained in which the side of the thermoplastic liquid crystal polymer substructure having a low thermal expansion coefficient is bent at a predetermined temperature.

本發明的熱塑性液晶聚合物結構體,藉由組合各式各樣的熱塑性液晶聚合物次結構,可得到板狀物等三維立體結構體、棒狀物等二維立體結構體等,且結構體,一體性高,且抑制在結構體內部的分子之過度的流動。 例如,本發明的熱塑性液晶聚合物結構體,可作為在電氣・電子領域、或事務設備・精密設備領域等中使用的零件有效地使用,例如,可作為多層電路基板(特別是毫米波雷達用基板)、電源模組等有用地使用。 [實施例]The thermoplastic liquid crystal polymer structure of the present invention can obtain a three-dimensional structure such as a plate, a two-dimensional structure such as a rod, etc. by combining various thermoplastic liquid crystal polymer substructures, and the structure , high integrity, and suppress excessive flow of molecules inside the structure. For example, the thermoplastic liquid crystal polymer structure of the present invention can be effectively used as parts used in the electric and electronic fields, or in the field of business equipment and precision equipment, for example, as a multilayer circuit board (especially for millimeter-wave radar) substrate), power modules, etc. are usefully used. [Example]

以下根據實施例更詳細地說明本發明,但本發明並沒有限定於本實施例。再者,在以下的實施例及比較例中,藉由下述的方法測定各種物性。Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In addition, in the following examples and comparative examples, various physical properties were measured by the following methods.

[熔點] 將使用TA Instruments製DSC Q2000,針對樣本5mg,自室溫以每分鐘20℃的速度進行升溫至聚合樣本的溫度,且在此溫度保持2分鐘,並以每分鐘20℃的速度進行冷卻至25℃,且在25℃保持2分鐘,並再度以每分鐘20℃的速度升溫之際的吸熱峰值溫度設為熔點。[melting point] Using DSC Q2000 manufactured by TA Instruments, for 5 mg of the sample, the temperature was raised from room temperature at a rate of 20°C per minute to the temperature of the polymerized sample, kept at this temperature for 2 minutes, and cooled to 25°C at a rate of 20°C per minute , and kept at 25° C. for 2 minutes, and the endothermic peak temperature when the temperature was raised again at a rate of 20° C. per minute was defined as the melting point.

[熱膨脹係數] 熱塑性液晶聚合物薄膜的熱膨脹係數係基於使用熱機械分析裝置(島津製作所(股)製TMA-60),在寬5mm、長度20mm的熱塑性液晶聚合物薄膜之兩端施加1g的拉伸荷重,自室溫以5℃/分鐘的速度升溫至200℃後,以20℃/分鐘的速度冷卻至30℃,並再度以5℃/分鐘的速度升溫時的30℃與150℃之間的長度之變化進行算出。 熱塑性液晶聚合物結構體中之熱塑性液晶聚合物要素的面方向之熱膨脹係數係作為代表值,各別針對表面及背面,剝離最外層的熱塑性液晶聚合物層,且將得到的二層各別視為熱塑性液晶聚合物薄膜。然後,如上所述,採用與熱塑性液晶聚合物薄膜的熱膨脹係數之測定同樣的方法,進行各別的層之測定。關於熱塑性液晶聚合物結構體中之熱塑性液晶聚合物要素的面方向之熱膨脹係數的公差,針對得到的二層之各別的熱膨脹係數,將一方作為最大值,將另一方作為最小值,並將其差作為熱塑性液晶聚合物要素之熱膨脹係數的公差。[Thermal expansion coefficient] The coefficient of thermal expansion of the thermoplastic liquid crystal polymer film is based on a thermomechanical analysis device (TMA-60 manufactured by Shimadzu Corporation), and a tensile load of 1 g is applied to both ends of a thermoplastic liquid crystal polymer film with a width of 5 mm and a length of 20 mm. After the temperature is raised to 200°C at a speed of 5°C/min, it is cooled to 30°C at a speed of 20°C/min, and the length between 30°C and 150°C is changed when the temperature is raised again at a speed of 5°C/min. figured out. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element in the thermoplastic liquid crystal polymer structure is taken as a representative value, and the outermost thermoplastic liquid crystal polymer layer is peeled off for the front surface and the back surface respectively, and the obtained two layers are respectively viewed. It is a thermoplastic liquid crystal polymer film. Then, as described above, the measurement of each layer was carried out by the same method as the measurement of the thermal expansion coefficient of the thermoplastic liquid crystal polymer film. Regarding the tolerance of the coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element in the thermoplastic liquid crystal polymer structure, one of the thermal expansion coefficients of the obtained two layers is taken as the maximum value, the other is taken as the minimum value, and The difference serves as a tolerance for the coefficient of thermal expansion of the thermoplastic liquid crystal polymer element.

[黏著強度] 依據JIS C5016-1994,以每分鐘50mm的速度,在鄰接的熱塑性液晶聚合物薄膜間,將一方相對於另一方,朝90°的方向剝離,同時藉由拉伸試驗機(IMADA(股)製數位測力計ZTS-500N),測定剝離強度,並將得到的數值作為黏著強度。熱壓接性之判斷,確認鄰接的熱塑性液晶聚合物次結構之間沒有剝離之實用上沒問題的黏著強度之下限值為0.4N/mm後,將鄰接的熱塑性液晶聚合物次結構間的黏著強度為0.4N/mm以上的情況視為黏著性良好,且判斷為合格的範圍內。 再者,針對熱塑性液晶聚合物薄膜之一方向(MD方向)、及相對於此之正交方向(TD方向),藉由分別自兩側剝離,針對MD順方向(或MD進行方向)、MD逆方向(或MD非進行方向)、TD順方向(或TD右方向)、TD逆方向(或TD左方向)之4方向測定黏著強度,並將其平均值作為熱塑性液晶聚合物薄膜間之黏著強度的代表值。 又,黏著強度係將隨機地選擇之相鄰的二層剝離,並藉由其強度進行評價。[Adhesive Strength] According to JIS C5016-1994, at a speed of 50 mm per minute, between adjacent thermoplastic liquid crystal polymer films, one side is peeled in a direction of 90° with respect to the other side, and at the same time, it is tested by a tensile tester (IMADA Co., Ltd.) Digital dynamometer ZTS-500N), measure the peel strength, and use the obtained value as the adhesive strength. For the judgment of thermocompression bondability, after confirming that there is no peeling between the adjacent thermoplastic liquid crystal polymer substructures, the lower limit of the practically no problem adhesive strength is 0.4N/mm, and then the adjacent thermoplastic liquid crystal polymer substructures are separated. When the adhesive strength is 0.4 N/mm or more, it is considered that the adhesiveness is good, and it is judged to be within the acceptable range. Furthermore, for one direction (MD direction) of the thermoplastic liquid crystal polymer film, and the orthogonal direction (TD direction) relative thereto, by peeling from both sides respectively, for MD forward direction (or MD forward direction), MD Measure the adhesion strength in the four directions of reverse direction (or MD non-progressive direction), TD forward direction (or TD right direction), TD reverse direction (or TD left direction), and use the average value as the adhesion between thermoplastic liquid crystal polymer films A representative value of strength. In addition, the adhesion strength was evaluated by peeling off adjacent two layers randomly selected, and evaluating the strength.

[分子配向度(SOR)] 由熱塑性液晶聚合物結構體,切出可插入至微波共振導波管中之程度的切片,並作為樣本。再者,熱塑性液晶聚合物結構體可直接插入時,不用切出切片而作為樣本。 在微波分子配向度測定機中,對微波的進行方向,使樣本面成為垂直而將樣本插入至微波共振導波管中,並測定透射該樣本之微波的電場強度(微波透射強度)。然後,基於該測定值,藉由以下式,算出m值(稱為折射率)。 m=(Zo/Δz)X[1-νmax/νo] 在此,Zo為裝置定數,Δz為物體的平均厚度,νmax為使微波的頻率產生變化時,賦予最大的微波透射強度之頻率,νo為平均厚度零時(亦即,沒有物體時),賦予最大微波透射強度的頻率。[Molecular Orientation (SOR)] From the thermoplastic liquid crystal polymer structure, slices of an extent capable of being inserted into a microwave resonance waveguide were cut out and used as samples. Furthermore, when the thermoplastic liquid crystal polymer structure can be inserted directly, there is no need to cut out slices to serve as samples. In the microwave molecular orientation measuring machine, the sample surface is perpendicular to the direction of the microwave, the sample is inserted into the microwave resonant waveguide, and the electric field intensity (microwave transmission intensity) of the microwave transmitted through the sample is measured. And based on this measured value, m value (referred to as a refractive index) was computed by the following formula. m=(Zo/Δz)X[1-νmax/νo] Here, Zo is the device constant, Δz is the average thickness of the object, νmax is the frequency that gives the maximum microwave transmission intensity when the microwave frequency is changed, and νo is when the average thickness is zero (that is, when there is no object), The frequency at which the maximum microwave transmission intensity is given.

接著,對於微波之振動方向的物體之旋轉角為0°時,亦即微波的振動方向與物體之分子為最佳的配向之方向,將與賦予最小微波透射強度的方向符合時的m值作為m0,將旋轉角為90°時的m值作為m90,並藉由m0/m90算出分子配向度SOR。Next, when the rotation angle of the object in the vibration direction of the microwave is 0°, that is, the direction in which the vibration direction of the microwave and the molecules of the object are optimally aligned, the m value when it coincides with the direction that gives the minimum microwave transmission intensity is taken as m0, the value of m when the rotation angle is 90° is taken as m90, and the degree of molecular orientation SOR is calculated from m0/m90.

[樹脂流動] 樹脂流動之有無,採用積層後之熱塑性液晶聚合物結構體的端面,與熱壓接前之切割尺寸相比,將確認在端面橫跨3mm以上之寬,且具有1.5mm以上之廣度的樹脂之流出者作為樹脂流動「有」,並判斷為不良。[resin flow] The presence or absence of resin flow, using the end face of the thermoplastic liquid crystal polymer structure after lamination, compared with the cut size before thermocompression, will confirm that the end face spans a width of 3 mm or more and has a width of 1.5 mm or more. Those that flowed out were regarded as "existing" in resin flow, and judged to be defective.

[水分率] 基於卡爾-費雪(Karl Fischer)法(利用卡爾-費雪滴定的原理,藉由使水分被溶劑吸收的電位差之變化測定水分的方法),使用微量水分測定裝置(Mitsubishi Chemical Analytech(股)製Karl Fischer VA-100),將7.0~1.5g的熱塑性液晶聚合物薄膜切為寬3mm、長度10mm,且投入至試料埠,並將採用以下的條件測定而得到的數值作為熱塑性液晶聚合物薄膜的水分率。 ・加熱溫度:300℃ ・N2 錶壓力:0.2MPa ・測定準備(自動) 沖洗(Purge)    1分鐘 預熱(Preheat)  2分鐘   試料埠空燒 冷卻(Cooling)  4分鐘   試料埠冷卻 ・測定 滴定槽內存放時間(以N2送出水分的時間):15分鐘[Moisture content] Based on the Karl Fischer method (using the principle of Karl-Fischer titration, the method of measuring moisture by changing the potential difference that causes moisture to be absorbed by the solvent), using a trace moisture measuring device (Mitsubishi Chemical Analytech (Karl Fischer VA-100 manufactured by Co., Ltd.), 7.0 to 1.5 g of thermoplastic liquid crystal polymer films were cut into widths of 3 mm and lengths of 10 mm, and were put into the sample port, and the values obtained by measuring under the following conditions were used as thermoplastic liquid crystal Moisture content of the polymer film.・Heating temperature: 300℃ ・N2 gauge pressure: 0.2MPa ・Measurement preparation (automatic) Purge (Purge) 1 minute preheating (Preheat) 2 minutes sample port cooling (Cooling) 4 minutes sample port cooling ・Measurement titration tank Internal storage time (time to send out water with N2): 15 minutes

[實施例1] 作為熱塑性液晶聚合物次結構,使用熔點310℃、熱膨脹係數18ppm/℃、厚度18μm的熱塑性液晶聚合物薄膜(Kuraray(股)製VECSTAR(註冊商標)),重疊3片次結構作為預備積層體,並將該預備積層體使用高壓釜(蘆田製作所(股)製AC-1200×2100),進行熱壓接。[Example 1] As the thermoplastic liquid crystal polymer substructure, a thermoplastic liquid crystal polymer film (VECSTAR (registered trademark) manufactured by Kuraray Co., Ltd.) with a melting point of 310°C, a thermal expansion coefficient of 18ppm/°C, and a thickness of 18 μm was used, and three sheets were stacked as a preliminary laminate. And this preliminary laminate was thermocompression-bonded using an autoclave (AC-1200×2100, manufactured by Ashida Seisakusho Co., Ltd.).

將預備積層體以剝離薄片夾持,並將在其上下面進一步配置金屬板及透氣性薄片(玻璃布)者安裝於載板。接著,將該安裝物整體以包裝薄膜(聚醯亞胺薄膜)被覆,且將包裝薄膜的端部以密封材(AIRTECH公司製真空密封膠帶GS-8003-G)進行密封,藉以密封整體作為樣本包。再者,包裝薄膜內部的空氣係藉由真空噴嘴進行排氣,且為了使對真空噴嘴之排氣變良好而在安裝板的側面也配置透氣性薄片。The preliminary laminate was sandwiched between release sheets, and a metal plate and an air-permeable sheet (glass cloth) were further arranged on the upper and lower surfaces thereof, and mounted on a carrier plate. Next, the entire mounting object was covered with a packaging film (polyimide film), and the end of the packaging film was sealed with a sealing material (vacuum sealing tape GS-8003-G manufactured by AIRTECH Co., Ltd.) to seal the whole as a sample. Bag. Furthermore, the air inside the packaging film is exhausted through the vacuum nozzle, and in order to improve the exhaust of the vacuum nozzle, a breathable sheet is also arranged on the side of the mounting plate.

接著,一邊計測樣本的實際溫度,一邊進行利用高壓釜的熱壓接。首先,將樣本包內部排氣,接著,升溫至為第1溫度之200℃。升溫速度係以5℃/min實施。使薄膜的水分率成為100ppm以下,在200℃保持30分鐘,藉以預備加熱後,將高壓釜內壓自大氣壓緩緩地升壓至2MPa(錶壓力)。同時升溫至為第2溫度之300℃,並保持30分鐘。冷卻係以6℃/min實施。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為18ppm/℃。再者,針對存在於中央之熱塑性液晶聚合物要素,也測定熱膨脹係數後,其熱膨脹係數為18ppm/℃。 又,熱塑性液晶聚合物結構體的SOR為1.02。Next, thermocompression bonding in an autoclave was performed while measuring the actual temperature of the sample. First, the inside of the sample pack was exhausted, and then, the temperature was raised to 200° C. which is the first temperature. The heating rate is implemented at 5°C/min. After the moisture content of the film was kept at 200°C for 30 minutes for preliminary heating, the moisture content of the film was kept below 100ppm, and then the internal pressure of the autoclave was gradually increased from atmospheric pressure to 2MPa (gauge pressure). Simultaneously, the temperature was raised to 300°C, which is the second temperature, and kept for 30 minutes. The cooling system is implemented at 6°C/min. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 18 ppm/°C for the front surface and the back surface, respectively. Furthermore, when the thermal expansion coefficient was also measured for the thermoplastic liquid crystal polymer element existing in the center, the thermal expansion coefficient was 18 ppm/°C. Also, the SOR of the thermoplastic liquid crystal polymer structure was 1.02.

[實施例2] 作為熱塑性液晶聚合物次結構,使用對於實施例1之熱塑性液晶聚合物薄膜的單面形成導體圖案者,除此以外係與實施例1同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為18ppm/℃。 再者,導體圖案係使用銅箔CF-H9A-DS-HD2-12(福田金屬箔粉工業(股)製),且使用真空批次加壓(北川精機(股)製商品名:VH2-1600),在290℃、2MPa(錶壓力)進行積層後,藉由蝕刻形成銅箔圖案。[Example 2] A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Example 1 except that the thermoplastic liquid crystal polymer film in Example 1 was used as the thermoplastic liquid crystal polymer substructure in which a conductive pattern was formed on one side. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 18 ppm/°C for the front surface and the back surface, respectively. In addition, copper foil CF-H9A-DS-HD2-12 (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.) was used as the conductor pattern, and vacuum batch pressure (manufactured by Kitagawa Seiki Co., Ltd., product name: VH2-1600) was used. ), after lamination at 290°C and 2MPa (gauge pressure), a copper foil pattern was formed by etching.

[實施例3] 作為熱塑性液晶聚合物次結構,使用6片熔點310℃、厚度100μm的熱塑性液晶聚合物薄膜,同時將加熱溫度設為310℃,除此以外係與實施例1同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為20ppm/℃。[Example 3] As the thermoplastic liquid crystal polymer substructure, six thermoplastic liquid crystal polymer films with a melting point of 310° C. and a thickness of 100 μm were used, and the heating temperature was set to 310° C., except that it was carried out in the same manner as in Example 1 to obtain a thermoplastic liquid crystal polymer structure. body. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 20 ppm/°C for the front surface and the back surface, respectively.

[實施例4] 作為熱塑性液晶聚合物次結構,使用對於實施例3之熱塑性液晶聚合物薄膜的單面形成導體圖案者,除此以外係與實施例3同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為20ppm/℃。 再者,導體圖案係使用銅箔CF-H9A-DS-HD2-12(福田金屬箔粉工業(股)製),且使用真空批次加壓(北川精機(股)製商品名:VH2-1600),在290℃、2MPa(錶壓力)進行積層後,藉由蝕刻形成銅箔圖案。[Example 4] A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Example 3, except that the thermoplastic liquid crystal polymer film of Example 3 having a conductor pattern formed on one side thereof was used as the thermoplastic liquid crystal polymer substructure. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 20 ppm/°C for the front surface and the back surface, respectively. In addition, copper foil CF-H9A-DS-HD2-12 (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.) was used as the conductor pattern, and vacuum batch pressure (manufactured by Kitagawa Seiki Co., Ltd., product name: VH2-1600) was used. ), after lamination at 290°C and 2MPa (gauge pressure), a copper foil pattern was formed by etching.

[實施例5] 作為熱塑性液晶聚合物次結構,使用12片熔點310℃、厚度100μm的熱塑性液晶聚合物薄膜,除此以外係與實施例1同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為18ppm/℃。[Example 5] A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Example 1 except that 12 thermoplastic liquid crystal polymer films having a melting point of 310° C. and a thickness of 100 μm were used as the thermoplastic liquid crystal polymer substructure. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 18 ppm/°C for the front surface and the back surface, respectively.

[實施例6] 將熱壓接時之壓力設為1MPa(錶壓力),除此以外係與實施例5同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為18ppm/℃。[Example 6] Except having set the pressure at the time of thermocompression bonding to 1 MPa (gauge pressure), it carried out similarly to Example 5, and obtained the thermoplastic liquid crystal polymer structure. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 18 ppm/°C for the front surface and the back surface, respectively.

[實施例7] 作為熱塑性液晶聚合物次結構,使用100片熔點310℃、厚度100μm的熱塑性液晶聚合物薄膜,除此以外係與實施例1同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為18ppm/℃。[Example 7] A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Example 1 except that 100 thermoplastic liquid crystal polymer films having a melting point of 310° C. and a thickness of 100 μm were used as the thermoplastic liquid crystal polymer substructure. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 18 ppm/°C for the front surface and the back surface, respectively.

[實施例8] 作為熱塑性液晶聚合物次結構,使用2片熱膨脹係數相異之熔點310℃、厚度100μm的熱塑性液晶聚合物薄膜,除此以外係與實施例1同樣進行,得到熱塑性液晶聚合物結構體。各別之熱塑性液晶聚合物薄膜的熱膨脹係數為10ppm/℃、30ppm/℃。 積層的結構體,具有因溫度變化而改變形狀的特徵,亦即,具有雙金屬的特徵。亦即,得到的積層體,在積層隨後存在翹曲,且具有該翹曲即使以熱加壓暫時機械地成型為平坦,也因溫度變化而再度於低熱膨脹率側彎曲,藉以改變形狀的特徵。[Example 8] A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Example 1, except that two thermoplastic liquid crystal polymer films with different thermal expansion coefficients and a melting point of 310° C. and a thickness of 100 μm were used as the thermoplastic liquid crystal polymer substructure. The thermal expansion coefficients of the respective thermoplastic liquid crystal polymer films are 10 ppm/°C and 30 ppm/°C. The laminated structure has a characteristic of changing shape due to temperature change, that is, a bimetallic characteristic. That is, the obtained laminate has warpage after lamination, and even if the warpage is temporarily mechanically formed flat by heat and pressure, it is bent again on the side with a low thermal expansion rate due to temperature changes, thereby changing its shape. .

[實施例9] 將熱壓接時之加熱溫度設為260℃,同時將壓力設為1MPa(錶壓力),除此以外係與實施例3同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為18ppm/℃。[Example 9] A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Example 3 except that the heating temperature during thermocompression bonding was 260° C. and the pressure was 1 MPa (gauge pressure). The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 18 ppm/°C for the front surface and the back surface, respectively.

[實施例10] 將熱塑性液晶聚合物次結構,使用熱風烘箱,在200℃進行60分鐘除氣乾燥,且在使水分率成為100ppm以下後,作為預備積層體使用,並將預備加熱中之升溫速度變更為20℃/min,將保持時間變更為5分鐘,除此以外係與實施例3同樣進行,得到熱塑性液晶聚合物結構體。 作為代表值之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數,表面及背面分別為20ppm/℃。[Example 10] The thermoplastic liquid crystal polymer substructure is degassed and dried at 200°C for 60 minutes using a hot air oven, and after the moisture content is reduced to 100ppm or less, it is used as a preliminary laminate, and the temperature increase rate in the preliminary heating is changed to 20°C /min, except that the holding time was changed to 5 minutes, the same procedure as in Example 3 was carried out to obtain a thermoplastic liquid crystal polymer structure. The coefficient of thermal expansion in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer, which is a representative value, is 20 ppm/°C for the front surface and the back surface, respectively.

[比較例1] [Comparative example 1]

重疊3片熔點310℃、厚度100μm的熱塑性液晶聚合物薄膜,使用真空批次加壓(北川精機(股)製商品名:VH2-1600),以真空4torr、260℃、4MPa(錶壓力)加壓30分鐘。 Three sheets of thermoplastic liquid crystal polymer films with a melting point of 310°C and a thickness of 100 μm were stacked, and pressure was applied in batches using a vacuum (manufactured by Kitagawa Seiki Co., Ltd., trade name: VH2-1600). Press for 30 minutes.

[比較例2] [Comparative example 2]

將熱壓接時之溫度設為290℃,除此以外係與比較例1同樣進行,得到熱塑性液晶聚合物結構體。 Except having set the temperature at the time of thermocompression bonding to 290 degreeC, it carried out similarly to the comparative example 1, and obtained the thermoplastic liquid crystal polymer structure.

[比較例3] [Comparative example 3]

將熱壓接時之溫度設為310℃,將壓力設為2MPa(錶壓力),除此以外係與比較例1同樣進行,得到熱塑性液晶聚合物結構體。 A thermoplastic liquid crystal polymer structure was obtained in the same manner as in Comparative Example 1 except that the temperature at the time of thermocompression bonding was 310° C. and the pressure was 2 MPa (gauge pressure).

[比較例4] [Comparative example 4]

重疊6片實施例4所使用之導體圖案形成於單面的熱塑性液晶聚合物薄膜,使用真空批次加壓(北川精機(股)製商品名:VH2-1600),以真空4torr、300℃、2MPa(錶壓力)加壓30分鐘。 Overlap 6 sheets of thermoplastic liquid crystal polymer films with the conductor pattern used in Example 4 formed on one side, and use vacuum batch press (trade name: VH2-1600 manufactured by Kitagawa Seiki Co., Ltd.) at a vacuum of 4 torr, 300°C, Pressurize at 2 MPa (gauge pressure) for 30 minutes.

[比較例5] [Comparative Example 5]

使用3片熔點310℃、厚度100μm的熱塑性液晶聚合物薄膜,同時在熱壓接時將壓力設為3MPa(錶壓力),除此以外係與實施例3同樣進行,得到熱塑性液晶聚合物結構體。 Using three thermoplastic liquid crystal polymer films with a melting point of 310°C and a thickness of 100 μm, and setting the pressure at 3 MPa (gauge pressure) at the time of thermocompression bonding, the same procedure was carried out as in Example 3 to obtain a thermoplastic liquid crystal polymer structure. .

將實施例及比較例所得之熱塑性液晶聚合物結構體的積層構成示於表7,將積層方法示於表8,將物性示於表9。Table 7 shows the layered configuration of the thermoplastic liquid crystal polymer structures obtained in Examples and Comparative Examples, Table 8 shows the layered method, and Table 9 shows the physical properties.

[表7]   積層構成 薄膜厚(µm) 總厚(µm) 實施例1 18/18/18         54 實施例2 18/18/18 ※       54 實施例3 100/100/100/100/100/100       600 實施例4 100/100/100/100/100/100 ※     600 實施例5 100/100/100/100/100/100/100/100/100/100/100/100   1200 實施例6 100/100/100/100/100/100/100/100/100/100/100/100   1200 實施例7 (100/100/100/100/100/100/100/100/100/100)×10組 10000 實施例8 100/100         200 實施例9 100/100/100/100/100/100       600 實施例10 100/100/100/100/100/100       600               比較例1 100/100/100         300 比較例2 100/100/100         300 比較例3 100/100/100         300 比較例4 100/100/100/100/100/100 ※     600 比較例5 100/100/100         300 ※在各層包含導體圖案 [Table 7] Thickness of laminated film (µm) Total thickness (µm) Example 1 18/18/18 54 Example 2 18/18/18 ※ 54 Example 3 100/100/100/100/100/100 600 Example 4 100/100/100/100/100/100 ※ 600 Example 5 100/100/100/100/100/100/100/100/100/100/100/100 1200 Example 6 100/100/100/100/100/100/100/100/100/100/100/100 1200 Example 7 (100/100/100/100/100/100/100/100/100/100)×10 groups 10000 Example 8 100/100 200 Example 9 100/100/100/100/100/100 600 Example 10 100/100/100/100/100/100 600 Comparative example 1 100/100/100 300 Comparative example 2 100/100/100 300 Comparative example 3 100/100/100 300 Comparative example 4 100/100/100/100/100/100 ※ 600 Comparative Example 5 100/100/100 300 ※Conductor patterns are included in each layer

[表8]   積層方法 除氣乾燥 步驟 預備加熱 熱壓接 第1溫度 (℃) 時間 (分鐘) 溫度 (℃) 時間 (分鐘) 壓力 (MPa) 實施例1 高壓釜 200 30 300 30 2 實施例2 高壓釜 200 30 300 30 2 實施例3 高壓釜 200 30 310 30 2 實施例4 高壓釜 200 30 310 30 2 實施例5 高壓釜 200 30 300 30 2 實施例6 高壓釜 200 30 300 30 1 實施例7 高壓釜 200 30 300 30 2 實施例8 高壓釜 200 30 300 30 2 實施例9 高壓釜 200 30 260 30 1 實施例10 高壓釜 200 5 310 30 2                 比較例1 真空批次加壓 - - 260 30 4 比較例2 真空批次加壓 - - 290 30 4 比較例3 真空批次加壓 - - 310 30 2 比較例4 真空批次加壓 - - 300 30 2 比較例5 高壓釜 200 30 310 30 3 [Table 8] Layer method Degassing drying step preheating thermocompression 1st temperature (°C) time (minutes) temperature(℃) time (minutes) Pressure (MPa) Example 1 Autoclave none 200 30 300 30 2 Example 2 Autoclave none 200 30 300 30 2 Example 3 Autoclave none 200 30 310 30 2 Example 4 Autoclave none 200 30 310 30 2 Example 5 Autoclave none 200 30 300 30 2 Example 6 Autoclave none 200 30 300 30 1 Example 7 Autoclave none 200 30 300 30 2 Example 8 Autoclave none 200 30 300 30 2 Example 9 Autoclave none 200 30 260 30 1 Example 10 Autoclave have 200 5 310 30 2 Comparative example 1 vacuum batch pressurization none - - 260 30 4 Comparative example 2 vacuum batch pressurization none - - 290 30 4 Comparative example 3 vacuum batch pressurization none - - 310 30 2 Comparative example 4 vacuum batch pressurization none - - 300 30 2 Comparative Example 5 Autoclave none 200 30 310 30 3

[表9]   黏著性 (N/mm) 樹脂 流動 實施例1 0.7 實施例2 0.7 實施例3 1.2 實施例4 1.1 實施例5 0.9 實施例6 0.8 實施例7 0.9 實施例8 0.9 實施例9 0.4 實施例10 1.1       比較例1 0.3 比較例2 0.3 比較例3 0.8 比較例4 0.6 比較例5 1.2 [Table 9] Adhesion (N/mm) resin flow Example 1 0.7 none Example 2 0.7 none Example 3 1.2 none Example 4 1.1 none Example 5 0.9 none Example 6 0.8 none Example 7 0.9 none Example 8 0.9 none Example 9 0.4 none Example 10 1.1 none Comparative example 1 0.3 none Comparative example 2 0.3 none Comparative example 3 0.8 have Comparative example 4 0.6 have Comparative Example 5 1.2 have

如表9所示,實施例1~10均沒有樹脂流動,且熱塑性液晶聚合物次結構間的熱壓接性為良好。亦即,得到的熱塑性液晶聚合物結構體均抑制分子之流動性,且前述與在利用目視的外觀形狀之觀察中,未確認到源自分子之流動的變色或變形等一致。As shown in Table 9, there is no resin flow in Examples 1 to 10, and the thermocompression bondability between the thermoplastic liquid crystal polymer substructures is good. That is, all of the obtained thermoplastic liquid crystal polymer structures suppressed the fluidity of molecules, and in the observation of the external shape by visual observation, no discoloration or deformation due to the flow of molecules was confirmed as described above.

再者,實施例2及4係形成導體圖案,但即使為形成導體圖案的情況,導體周邊的液晶聚合物也不會過度地流動,因此即使在細微的導體圖案所形成之電路等需要電路間安全間距的情況,也可滿足此需求。Furthermore, in Examples 2 and 4, conductive patterns are formed, but even in the case of forming conductive patterns, the liquid crystal polymer around the conductors does not flow too much, so even between circuits that require circuits such as circuits formed by fine conductive patterns The safety distance can also meet this requirement.

又,實施例9不僅相較於使用真空批次加壓之比較例2為更低溫的熱壓接溫度,且儘管積層比較例2之2倍的片數,但為實用上沒有問題的熱壓接性。In addition, Example 9 not only has a lower thermocompression bonding temperature than Comparative Example 2 using vacuum batch pressurization, but also has no practical problems in thermocompression even though the number of laminated sheets is twice that of Comparative Example 2. connection.

再者,使經由除氣乾燥步驟之熱塑性液晶聚合物次結構作為預備結構體成為一體時,儘管預備加熱時間僅實施例3之1/6,但可達成與實施例3同程度的黏著性。Furthermore, when the thermoplastic liquid crystal polymer substructure after the degassing drying step is integrated as a preliminary structure, although the preliminary heating time is only 1/6 of that of Example 3, the same degree of adhesion as that of Example 3 can be achieved.

再者,實施例1所得之熱塑性液晶聚合物結構體的SOR為1.02。又,針對實施例1~10所得之熱塑性液晶聚合物結構體中之最外層的熱塑性液晶聚合物要素之面方向的熱膨脹係數之公差為1ppm/℃以下。Furthermore, the SOR of the thermoplastic liquid crystal polymer structure obtained in Example 1 was 1.02. In addition, the tolerance of the thermal expansion coefficient in the plane direction of the thermoplastic liquid crystal polymer element of the outermost layer in the thermoplastic liquid crystal polymer structures obtained in Examples 1 to 10 was 1 ppm/°C or less.

另一方面,使用真空批次加壓之比較例1及2沒有樹脂流動,也沒有分子之過度的流動,但黏著強度沒有在合格的範圍。儘管比較例1為與實施例6相同的熱壓接溫度,比較例2為較實施例6更高的熱壓接溫度,但真空批次加壓,在積層各層為100μm之熱塑性液晶聚合物薄膜時,無法達成充分的黏著強度。On the other hand, Comparative Examples 1 and 2, which use vacuum batch pressurization, do not have resin flow and excessive molecular flow, but the adhesive strength is not within the acceptable range. Although the thermocompression bonding temperature of Comparative Example 1 is the same as that of Example 6, and that of Comparative Example 2 is higher than that of Example 6, the vacuum batch pressure is applied, and the thermoplastic liquid crystal polymer film of each layer is 100 μm. , sufficient adhesive strength cannot be achieved.

比較例3及4,因為熱壓接溫度較比較例2更高,所以黏著強度進入合格的範圍,但另一方面,產生樹脂流動。In Comparative Examples 3 and 4, since the thermocompression bonding temperature is higher than that of Comparative Example 2, the adhesive strength falls within the acceptable range, but on the other hand, resin flow occurs.

比較例5,因為高壓釜積層加壓中之熱壓接時的壓力為3MPa(錶壓力),所以黏著強度進入合格的範圍,但另一方面,產生樹脂流動。 又,若參照比較例5的結果,則可預測未進行預備加熱,藉由來自高壓釜的加熱加壓氣體,在高壓下進行熱壓接時,因分子之過度的流動而產生樹脂流動。 [產業上利用之可能性]In Comparative Example 5, since the pressure at the time of thermocompression bonding in autoclave lamination pressurization was 3 MPa (gauge pressure), the adhesive strength fell within the acceptable range, but on the other hand, resin flow occurred. Also, referring to the results of Comparative Example 5, it can be predicted that resin flow would occur due to excessive molecular flow when thermocompression bonding was performed at high pressure with heated and pressurized gas from an autoclave without preheating. [Possibility of industrial use]

本發明之製造方法對得到抑制樹脂流動之產生的熱塑性液晶聚合物結構體為有用,且得到的熱塑性液晶聚合物結構體,可作為在電氣・電子領域、或事務設備・精密設備領域、電源半導體領域等中使用的零件有效地使用。The production method of the present invention is useful for obtaining a thermoplastic liquid crystal polymer structure that suppresses resin flow, and the obtained thermoplastic liquid crystal polymer structure can be used as a Parts used in fields etc. are used effectively.

如以上,說明本發明之適當的實施形態,但可在不脫離本發明之主旨的範圍進行各種追加、變更或刪除,且這樣的發明也包含於本發明的範圍內。As mentioned above, although the suitable embodiment of this invention was demonstrated, various additions, changes, and deletions are possible in the range which does not deviate from the summary of this invention, and such invention is also included in the scope of this invention.

1:包裝薄膜 2:透氣性薄片 3:頂板 4a,4b:脫模材 5:預備積層體 6:載板 7:真空噴嘴 8:真空密封膠帶 9:高壓釜1: Packaging film 2: breathable sheet 3: top plate 4a, 4b: release material 5: Preparing the laminate 6: carrier board 7: Vacuum nozzle 8: Vacuum sealing tape 9: Autoclave

由以附加的圖式為參考的以下之適當的實施形態之說明,可更清楚地理解本發明。然而,實施形態及圖式為用於單純的圖示及說明,並非利用於用以定義本發明的範圍。本發明的範圍係藉由附加的請求項定義。在附加的圖式中,多個圖式中之同一零件編號表示同一部分。圖式未必以一定的縮尺表示,且在表示本發明的原理方面成為誇大者。 圖1為利用本發明的一實施態樣之用以說明高壓釜式熱壓接法的概略圖。The present invention can be understood more clearly from the description of the following suitable embodiments with reference to the attached drawings. However, the embodiments and drawings are for simple illustration and description, and are not used to define the scope of the present invention. The scope of the invention is defined by the appended claims. In the attached drawings, the same part number in multiple drawings indicates the same part. The drawings are not necessarily to scale and are exaggerated in illustrating the principles of the invention. FIG. 1 is a schematic diagram illustrating an autoclave thermocompression bonding method using an embodiment of the present invention.

1:包裝薄膜 1: Packaging film

2:透氣性薄片 2: breathable sheet

3:頂板 3: top plate

4a,4b:脫模材 4a, 4b: release material

5:預備積層體 5: Preparing the laminate

6:載板 6: carrier board

7:真空噴嘴 7: Vacuum nozzle

8:真空密封膠帶 8: Vacuum sealing tape

9:高壓釜 9: Autoclave

Claims (11)

一種熱塑性液晶聚合物結構體之製造方法,其係使用高壓釜來製造多個熱塑性液晶聚合物次結構經一體化的熱塑性液晶聚合物結構體之方法,其至少具備:封入步驟,其將重疊有多個熱塑性液晶聚合物次結構的預備積層體以包裝薄膜(bagging film)被覆,並將該包裝薄膜的端部進行密封;升溫步驟,其進行該包裝薄膜內部之排氣,進行升溫至為預備加熱溫度之第1溫度;及熱壓接步驟,其以該第1溫度為起點,將高壓釜的內壓升壓至2.8MPa以下(錶壓力)之所需的壓力,同時升溫至為熱壓接溫度之第2溫度。 A method for manufacturing a thermoplastic liquid crystal polymer structure, which is a method of using an autoclave to manufacture a plurality of thermoplastic liquid crystal polymer substructures integrated with a thermoplastic liquid crystal polymer structure, which at least includes: an enclosing step, which will overlap The pre-laminated body of a plurality of thermoplastic liquid crystal polymer substructures is covered with a bagging film, and the end of the bagging film is sealed; the temperature raising step is performed to exhaust the inside of the bagging film, and the temperature is raised to a preparatory The first temperature of the heating temperature; and the step of thermocompression, which takes the first temperature as the starting point, raises the internal pressure of the autoclave to the required pressure below 2.8MPa (gauge pressure), and simultaneously raises the temperature to the pressure required for hot pressing The second temperature of the contact temperature. 如請求項1之熱塑性液晶聚合物結構體之製造方法,其中在將預備積層體之中熔點最低的熱塑性液晶聚合物要素之熔點設為ML時,第1溫度為(ML-150)℃~(ML-50)℃的範圍。 The method for producing a thermoplastic liquid crystal polymer structure according to claim 1, wherein when the melting point of the thermoplastic liquid crystal polymer element having the lowest melting point among the preliminary laminates is set as ML, the first temperature is (ML-150)°C~( ML-50) °C range. 如請求項1或2之熱塑性液晶聚合物結構體之製造方法,其中在第1溫度之保持時間為1~120分鐘。 The method for manufacturing a thermoplastic liquid crystal polymer structure according to claim 1 or 2, wherein the holding time at the first temperature is 1 to 120 minutes. 如請求項1或2之熱塑性液晶聚合物結構體之製造方法,其中向第1溫度之升溫速度為1~10℃/min。 The method for producing a thermoplastic liquid crystal polymer structure according to Claim 1 or 2, wherein the temperature increase rate to the first temperature is 1-10°C/min. 如請求項1或2之熱塑性液晶聚合物結構體之製造方法,其中將預備積層體之中熔點最高的熱塑性液晶聚合物要素之熔點設為MH時,第2溫度為(MH-30)℃~(MH+10)℃的範圍。 The method for producing a thermoplastic liquid crystal polymer structure according to claim 1 or 2, wherein when the melting point of the thermoplastic liquid crystal polymer element with the highest melting point among the preliminary laminates is set as MH, the second temperature is (MH-30)°C~ (MH+10)°C range. 如請求項1或2之熱塑性液晶聚合物結構體之製造 方法,其中在第2溫度之保持時間為15~60分鐘。 Manufacture of thermoplastic liquid crystal polymer structure as claimed in item 1 or 2 method, wherein the holding time at the second temperature is 15 to 60 minutes. 如請求項1或2之熱塑性液晶聚合物結構體之製造方法,其中向第2溫度之升溫速度為2~20℃/min。 The method for manufacturing a thermoplastic liquid crystal polymer structure according to claim 1 or 2, wherein the temperature increase rate to the second temperature is 2~20°C/min. 如請求項1或2之熱塑性液晶聚合物結構體之製造方法,其中在升溫步驟之前,進行除氣乾燥步驟。 The method for manufacturing a thermoplastic liquid crystal polymer structure according to claim 1 or 2, wherein a degassing drying step is performed before the temperature raising step. 如請求項8之製造方法,其中除氣乾燥步驟後的熱塑性液晶聚合物薄膜之水分率為380ppm以下。 The production method according to claim 8, wherein the moisture content of the thermoplastic liquid crystal polymer film after the degassing drying step is 380 ppm or less. 如請求項8之熱塑性液晶聚合物結構體之製造方法,其中在第1溫度之保持時間為1~20分鐘。 The method for manufacturing a thermoplastic liquid crystal polymer structure according to claim 8, wherein the holding time at the first temperature is 1 to 20 minutes. 如請求項1或2之製造方法,其中升溫步驟後的預備加熱對象之熱塑性液晶聚合物要素的水分率為380ppm以下。 The production method according to claim 1 or 2, wherein the moisture content of the thermoplastic liquid crystal polymer element to be heated after the temperature raising step is 380 ppm or less.
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