TWI790964B - Package structure with magnetocaloric material - Google Patents

Abstract

A package structure with magnetocaloric material is composed of a substrate, a conductor structure, a die, and a die seal. The substrate is made of a magnetocaloric material and other materials. The die is electrically connected to the substrate and then is packaged with the die seal. When the package structure is on, the current will induce a magnetic field, and the magnetocaloric material in the substrate will have a magnetocaloric effect to cool down the package structure. In this way, the temperature difference between the package structure and the outsides is increased, thereby improving the efficiency of heat dissipation.

Description

Encapsulation structure with magnetocaloric material

The invention relates to a semiconductor package structure, especially a package structure with magnetocaloric material.

Semiconductor package (semiconductor package) is one of the most important processes in the back end of the transistor manufacturing process. When the core of semiconductor components or integrated circuits are etched from the wafer and cut into independent chips, in the packaging stage, the One or several dies are assembled and potted together with the semiconductor package, so as to provide protection for the dies against impact, water vapor, etc., and at the same time, the electrical connection points of the dies are also connected to the pins of the external circuit through the packaging process or contacts; semiconductor process technology continues to improve, the performance of transistors continues to increase, and the size of transistors continues to shrink with the progress, so that multiple functions, such as: processors, memories, and logical operation units, have been integrated into a single circuit. Crystal, or transistors with different functions in 2.5D, 3D and other three-dimensional packaging structures to integrate transistors heterogeneously; and the aforementioned packaging methods are widely used today, or have the potential to be an advanced packaging method that continues Moore's Law. These packaging methods require good heat dissipation efficiency. Although there are the following patents to improve heat dissipation, such as: Patent Publication No. TW202103277A, which uses graphite materials to improve heat dissipation efficiency, and Patent Publication No. CN213459708U, Patent Publication No. CN213304111U, etc., however , in order to cope with the increasingly improved performance and smaller volume of transistor chips, the heat dissipation scheme still needs to be improved; accordingly, how to effectively increase the heat dissipation efficiency of the package structure under the original package structure is an issue to be solved question.

In view of the above-mentioned problems, the present inventor has improved the packaging structure based on years of experience in related industries; therefore, the main purpose of the present invention is to provide a magnetic-caloric material that utilizes the magnetic refrigeration effect to effectively improve heat dissipation efficiency. package structure.

In order to achieve the above-mentioned purpose, the packaging structure with magneto-caloric material of the present invention can be achieved by adding a magneto-caloric material to the substrate, such as: gadolinium oxide Gd ₂ O ₃ , gadolinium-germanium-silicon compound Gd ₅ Ge ₂ Si ₂ and other materials. When the package structure is turned on, the magnetic cooling effect generated by the magnetocaloric effect can help the bare crystal in the package structure to dissipate heat, which can effectively increase the heat dissipation efficiency of the package structure under the original package structure.

In order to enable your examiner to clearly understand the purpose, technical features and effects of the present invention after implementation, the following descriptions are illustrated with illustrations, please refer to them.

Please refer to "Fig. 1", Fig. 1 is a system architecture diagram of the present invention, as shown in the figure, the packaging structure 1 with magnetocaloric material of the present invention includes a substrate 11, an electrical connection structure 12, a bare chip 13, and A molding body 14, each component is exemplified and described as follows: (1) Substrate 11, which can be a lead frame (lead frame) for carrying bare crystal 13, which is mainly made of metal materials such as copper alloy or nickel-iron alloy Composition, and a magneto-caloric material will be added during manufacture, the amount of which can be, for example, 1% to 10% by weight of the main material, and mixed with copper alloy or nickel-iron alloy as the raw material of the substrate 11 through melting; wherein, the magneto-caloric The material can be, for example, Gd ₂ O ₃ oxide, Gd ₅ Ge ₂ Si ₂ and other materials; preferably, the substrate 11 can include a crystal seat with a positioning die 13, a plurality of inner leads, and a plurality of Outer pins, wherein, during implementation, the inner pins and the outer pins are covered by the molded body 14, the outer pins are not covered by the molded body 14, and both the inner pins and the outer pins belong to the substrate Part 11 is hereby clarified. (2) The two ends of the electrical connection structure 12 are respectively assembled on the electrical contacts and the inner pins, so as to form an electrical connection between the bare crystal 13 and the external circuit. The electrical connection structure 12 can be, for example, wire bonding (Wire bonding), Ball grid array (BGA), flip-chip (Flip-chip) or tape-automated bonding (Tape-Automated Bonding, TAB) and other process methods corresponding to metal wires, conductive metal balls, film-type bonding Pins, etc., any method that can realize the electrical connection between the bare crystal 13 and the external circuit can be implemented. (3) The bare crystal 13 can be, for example, a bare crystal (die) for the manufacture of semiconductor elements and electrodes of integrated circuits such as bipolar transistors (BJT) and field effect transistors (FETs), which have a plurality of electrical contacts. The point is used as the position where the die 13 is electrically connected to the external circuit. (4) The molding body 14 (Compound) is formed on the substrate 11 and covers the electrical connection structure 12, the bare crystal 13, and the inner pins. The material composition of the molding body 14 can be, for example, epoxy resin (Epoxy), Or a composite material in which epoxy resin is mixed with one of metal and ceramic materials or a combination thereof, and the molding body 14 is used to make the encapsulation structure 1 with magnetocaloric material have good impact resistance and weather resistance.

Please refer to "Fig. 2". Fig. 2 is a schematic diagram of the implementation of the present invention. As shown in the figure, the packaging structure 1 with magnetocaloric material of the present invention is used to package various integrated circuits. When the packaged integrated circuit switch is turned on When the cut-off changes, the current flowing into the bare crystal 13 from the external circuit through the substrate 11 will induce a change in the magnetic field. At this time, the magnetocaloric material coated on the substrate 11 will increase the heat dissipation efficiency due to the change in the magnetic field; specifically, when When the external circuit induces a magnetic field through the flow of current from the substrate 11, the magnetic moment of the magnetocaloric material in the substrate 11 will be regularly arranged along the direction of the magnetic field, and the magnetic entropy and heat capacity of the material will decrease. The heat is dissipated by the substrate 11 through heat conduction, and when the external current stops flowing in, the magnetic field induced by the substrate 11 disappears, and the magnetic moment will return to a non-directional state, thereby producing a magnetic refrigeration phenomenon to effectively reduce the temperature. In this way, not only the magnetic The cooling phenomenon achieves the effect of heat dissipation, and because of the temperature change generated when the magnetic field is generated and disappeared, a higher temperature difference between the substrate 11 and the outside is formed, so that the heat conduction can maintain a higher efficiency.

Please refer to "Fig. 3". Fig. 3 is an embodiment (1) of the present invention. Embodiment (1) takes flip-chip bonding (Flip-chip) as an example. As shown in the figure, the electrical contact of the bare chip 13 is Face down, and use conductive metal balls (Bump) as the electrical connection structure 12 to complete the electrical connection with the substrate 11, and the electrical connection structure 12 and the die 13 are all covered by the mold package 14, thus completing the magnetocaloric material The packaging structure 1 can effectively achieve the effect of magnetic cooling and heat dissipation when each bare chip 13 is switched.

Please refer to "Fig. 4". Fig. 4 is an embodiment (2) of the present invention. As shown in the figure, the packaging structure 1 with magnetocaloric material of the present invention may include a silicon interposer 15 (Silicon interposer), which has multiple Silicon interposer micro-bump 151 (Micro Bump), internal metal lines, and a plurality of silicon interposer through-holes 152 (TSV), silicon interposer micro-bump 151 is used to make the electrical contacts of each die 13 and the silicon interposer The metal wires within 15 are electrically connected, so that the silicon interposer 15 can be connected to the electronic signals of different bare crystals 13; since each inner metal wire is electrically connected to the through hole 152 of the silicon interposer, and then passes through the through hole 152 of the silicon interposer To connect the electrical connection structure 12 at the other end of the silicon interposer 15 (shown as a metal bump (Solder Bump) in this figure), the electrical connection structure 12 is electrically connected to the substrate 11 with magneto-caloric material, and the electrical connection structure 12 , the bare die 13, and the silicon interposer 15 are all covered by the molding body 14, thus completing the 2.5D three-dimensional packaging structure 1 with magnetocaloric materials, and can effectively achieve magnetic cooling and heat dissipation when each bare die 13 is switched on and off effect.

Please refer to "Fig. 5", Fig. 5 is an embodiment (3) of the present invention, which is the above-mentioned 2.5D three-dimensional packaging structure, and each bare die 13 has a plurality of bare die micro-bumps 131 electrically connected to electrical contacts and a plurality of TSVs 132, and the TSVs 131 and TSVs 132 are electrically connected to each other. Each die 13 can be stacked up and down through the TSVs 131 and electrically connected to each other to complete the stacked die. Die 13, and as mentioned above, is electrically connected to the silicon interposer 15, and the silicon interposer 15 is also electrically connected to the substrate 11, and the electrical connection structure 12, the bare die 13, and the silicon interposer 15 are all encapsulated by the molded body 14 Coating, thus completing the 3D three-dimensional packaging structure 1 with magnetocaloric material, and can effectively achieve the effect of magnetic cooling and heat dissipation when each bare chip 13 is switched on and off.

Please refer to "Fig. 6". Fig. 6 is a comparison table of operating temperatures of the present invention. The figure shows that copper alloys with no added magnetocaloric material, 5% magnetocaloric material, and 10% magnetocaloric material are used as the substrate composition. The surface temperature difference when the metal oxide half field effect transistor (MOSFET) is working can be seen from the table, when the metal oxide half field effect transistor is packaged in a package structure with a magnetocaloric material, it will show a better heat dissipation effect, and Compared with the encapsulation structure without using the magnetocaloric material of the present invention (with no magnetocaloric material added to the substrate), the operating temperature has a significant drop performance.

It can be seen from the above that the package structure with magnetocaloric material of the present invention mainly uses the magnetocaloric material as the raw material of the substrate, and uses the magnetic field generated by the external current to change the magnetic moment of the magnetocaloric material, so that not only magnetic refrigeration can be achieved. The effect achieves a good cooling effect, and can further increase the heat dissipation efficiency of the packaging structure through the temperature difference. The present invention can be applied to various mature packaging structures, and can also be applied to the current forward-looking three-dimensional packaging technology; the packaging of the present invention has a magnetic thermal material After the structure is implemented, it can indeed solve the problem of effectively increasing the heat dissipation efficiency of the packaging structure under the original packaging structure, and achieve the purpose of providing a packaging structure with magnetocaloric materials that effectively improves heat dissipation efficiency by using the magnetic refrigeration effect.

However, the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; anyone skilled in this art can make equivalent changes and modifications without departing from the spirit and scope of the present invention , should be covered within the patent scope of the present invention.

To sum up, the present invention has the patent requirements of "industrial applicability", "novelty" and "progressiveness". The applicant filed an application for an invention patent with the Jun Bureau in accordance with the provisions of the Patent Law.

1: Encapsulation structure with magnetocaloric material 11: Substrate 12: Electrical connection structure 13: Bare crystal 14: Molded body 131:Bare Die Micro Bump 132: Bare crystal through hole 15: Silicon interposer 151: Silicon interposer micro-bump 152: Silicon interposer perforation

Fig. 1 is a system architecture diagram of the present invention. Fig. 2 is a schematic diagram of the implementation of the present invention. Fig. 3 is an embodiment (1) of the present invention. Fig. 4 is the embodiment (2) of the present invention. Fig. 5 is the embodiment (3) of the present invention. Fig. 6 is a comparison table of the working temperature of the present invention.

1: Encapsulation structure with magnetocaloric material

11: Substrate

12: Electrical connection structure

13: Bare crystal

14: Molded body

Claims (10)

A packaging structure with magneto-caloric material for packaging a bare chip with a plurality of electrical contacts, including: A substrate, composed of a metal material added with a magneto-caloric material, includes a plurality of internal pins; A plurality of electrical connection structures, the two ends of each electrical connection structure are respectively assembled on each of the electrical contacts and each of the inner pins, so that the bare crystal and the substrate are electrically connected; and A molding body is molded on the substrate and the bare crystal, the plurality of electrical connection structures, and the inner pins are covered by the molding body. The package structure with a magneto-caloric material as described in claim 1, wherein the magneto-caloric material is one of gadolinium oxide or gadolinium-germanium-silicon compound or a combination thereof. The package structure with magneto-caloric material as claimed in claim 1, wherein the content of the magneto-caloric material in the substrate is 1%-10% by weight. The package structure with magnetocaloric material as claimed in claim 1, wherein the electrical connection structure is one of metal wires, conductive metal balls, and jelly-roll pins. A packaging structure with magneto-caloric material for packaging a plurality of bare crystals with a plurality of electrical contacts, including: A substrate, composed of a metal material added with a magneto-caloric material, includes a plurality of internal pins; A plurality of electrical connection structures, the two ends of each electrical connection structure are respectively assembled on a silicon interposer and each of the inner pins, so that the silicon interposer and the substrate are electrically connected; The silicon interposer has a plurality of silicon interposer micro-bumps and a plurality of silicon interposer through-holes, and the silicon interposer is electrically connected to each of the bare chips through the silicon interposer micro-bumps and the silicon interposer through-holes; and A molding body is molded on the base plate so that each of the bare crystals, the plurality of electrical connection structures, the silicon interposer, and the inner pins are covered by the molding body. The package structure with a magneto-caloric material as described in claim 5, wherein the magneto-caloric material is one of gadolinium oxide or gadolinium-germanium-silicon compound or a combination thereof. The package structure with magneto-caloric material as described in claim 5, wherein the content of the magneto-caloric material in the substrate is 1%-10% by weight. The packaging structure with magnetocaloric material as described in Claim 5, wherein each of the die has a plurality of die micro-bumps and a plurality of die through-holes, and the die micro-bumps are electrically connected to the die-through holes, And the bare crystal microbump is electrically connected with each of the electrical contacts. The package structure with magneto-caloric material as claimed in claim 8, wherein the magneto-caloric material is one of gadolinium oxide or gadolinium-germanium-silicon compound or a combination thereof. The package structure with magneto-caloric material as claimed in claim 8, wherein the content of the magneto-caloric material in the substrate is 1%-10% by weight.

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