TWI790412B - Hole structure and manufacturing method thereof, and different material joint structure and manufacturing method thereof - Google Patents

Abstract

A hole structure and a manufacturing method thereof, and a different material joint structure and a manufacturing method thereof are provided. The different material joint structure includes a first substrate and a second substrate. The first substrate has a first surface, a second surface, and a hole structure. The hole structure is formed between the first surface and the second surface. The hole structure has a first aperture, a second aperture, and a third aperture in sequence along a depth direction, which is the direction from the first surface toward the second surface. The first aperture is located on the first surface, and the second aperture is smaller than the first aperture and the third aperture. The second substrate is embedded in the hole structure.

Description

Hole structure and manufacturing method thereof, and dissimilar material joining structure including hole structure and manufacturing method thereof

The present disclosure relates to a structure and a method for forming the structure, and particularly relates to a hole structure and a manufacturing method thereof, and a dissimilar material joint structure and a manufacturing method thereof.

Composite structural coatings are commonly used in many fields, among which the application of composite structural coatings in the development of geothermal systems to prevent corrosion of geothermal pipes is one of the application areas. However, the bonding yield of dissimilar materials has always been an insurmountable problem.

The sandblasting or phosphate treatment used by traditional coating industry often leads to residual stress on the surface of the metal substrate or the formation of a loose structure, which reduces the corrosion resistance. Once the surface coating film is slightly scratched, it will be out of control. Penetration into the coating interface will cause the coating of the composite structure to peel off and lose its anti-corrosion function.

From the above, it can be seen that how to make the coating closely fit with the substrate is an urgent problem to be solved at present.

The present disclosure provides a pore structure that provides good fit.

The present disclosure provides a method for fabricating the hole structure forming the above hole structure.

The present disclosure provides a joint structure of dissimilar materials with good fitting effect.

The present disclosure provides a method for fabricating the dissimilar material joint structure forming the above dissimilar material joint structure.

A hole structure of the present disclosure is formed inside the substrate from the first surface of the substrate toward the depth direction of the second surface of the substrate, wherein along the depth direction, the hole structure has a first pore diameter, a second pore diameter and For the third aperture, the first aperture is located on the first surface, and the second aperture is smaller than the first aperture and the third aperture.

A method for manufacturing a hole structure disclosed in the present disclosure, comprising: providing a base material; forming a first hole on the first surface of the base material; plating a masking layer on the first surface of the base material, wherein the masking layer fills the part of the first hole and etching the substrate coated with the masking layer to form a hole structure.

A dissimilar material bonding structure of the present disclosure includes a first base material and a second base material. The first substrate has a first surface, a second surface and a hole structure, the hole structure is formed between the first surface and the second surface, and along the depth direction from the first surface toward the second surface, the hole structure has sequentially The first aperture, the second aperture and the third aperture, the first aperture is located on the first surface, and the second aperture is smaller than the first aperture and the third aperture. The second base material is embedded in the hole structure.

A manufacturing method of a dissimilar material bonding structure disclosed in the present disclosure at least includes the following steps: providing a first base material; forming a first hole on the first surface of the first base material; coating a masking layer on the first surface of the first base material , wherein the shielding layer is filled into the portion of the first hole; the first substrate coated with the shielding layer is etched to form a hole structure; and a second substrate is coated on the first surface of the first substrate material, wherein the material of the second substrate fills the hole structure.

Based on the above, a hole structure with a special shape can be formed on the base material through the above-mentioned hole structure manufacturing method, and through the use of this hole structure, the fitting stability of dissimilar material bonding can be increased.

110, 310: the first substrate

110a, 310a: first surface

110b: second surface

120: Patterned mask

130: masking layer

140, 340: second substrate

200, 400: joint structure of different materials

H1: the first hole

H2, H23, H24: hole structure

H21: Wedge

H22: Ball

D: Depth direction

L1: first aperture

L2: second aperture

L3: third aperture

FIG. 1A to FIG. 1F are flow charts of the fabrication of the dissimilar material bonding structure according to the first embodiment of the present disclosure.

FIG. 2 is a schematic diagram of etching the first substrate without forming a patterned mask on the first surface of the first substrate.

FIG. 3A and FIG. 3B are schematic diagrams of the joint structure of dissimilar materials applied to a hollow tube.

4A to 4H are schematic views of the first hole on the first substrate.

[first embodiment]

FIG. 1A to FIG. 1F are flow charts of the fabrication of the dissimilar material bonding structure according to the first embodiment of the present disclosure.

Please refer to FIG. 1A to FIG. 1F in sequence. As shown in FIG. 1A , a first substrate 110 is provided, and a patterned mask 120 is formed on the first surface 110 a of the first substrate 110 . The first base material 110 can be made of metal, such as iron, copper, aluminum, magnesium, or stainless steel. In addition, the first base material 110 is not limited to a flat plate shape, and may also be a hollow tube shape, that is, the first surface 110 a is not limited to a flat surface, and may also be an arc-shaped surface.

As shown in FIG. 1B, the first substrate 110 with the patterned mask 120 formed on its first surface 110a is etched for the first time, and the first etching in this embodiment is partial etching, and then the pattern is removed. The mask 120 is formed to form a first hole H1 in the depth direction D of the first substrate 110 as shown in FIG. 1C, wherein the depth direction D refers to the direction in which the first surface 110a faces the second surface 110b on the opposite side. . Likewise, the second surface 110b is not limited to a plane, and may also be an arcuate surface.

As shown in FIG. 1D, a masking layer 130 is coated on the first surface 110a of the first substrate 110, wherein the method of painting, transfer printing, electroplating, vapor deposition or sputtering can be selected on the first surface 110a according to requirements. A masking layer 130 is formed thereon. Specifically, the shielding layer 130 is filled into the first hole H1 and forms a thin layer on the surface of the first hole H1 along the contour of the first hole H1.

It should be noted that the masking layer 130 is formed by selecting a material whose activity is lower than that of the first substrate 110, wherein the material of the masking layer 130 can be selected from nickel, copper, chromium, lead, silver, gold and polymer materials. one of the In one embodiment, the common The active arrangement of the metals is roughly as follows: aluminum>zinc>iron>cobalt>nickel>tin>lead>copper>silver>platinum>gold, but the active arrangement of corrosion products will vary due to the type, concentration and temperature of the solution. For example, in the active arrangement of metals in seawater, the reactants formed on the surface of lead are less active than those formed on the surface of copper, so the overall arrangement order should be adjusted according to the conditions of the etching solution.

In one embodiment, the material of the first substrate 110 can be one of iron, copper, aluminum, magnesium or alloys thereof; the material of the shielding layer 130 can be selected from nickel, copper, chromium, lead, silver, gold and One of the polymer materials.

In addition, in the step of coating the shielding layer 130 on the first surface 110a of the substrate, the thickness of the shielding layer 130 at the corner where the first surface 110a is connected to the first hole H1 is thicker than that at other places of the shielding layer 130 caused by the edge effect. , and along the depth direction D, the deeper the first hole H1 goes, the thickness of the shielding layer 130 becomes thinner.

Next, as shown in FIG. 1E , the first substrate 110 coated with the masking layer 130 on the first surface 110 a is etched. Specifically, the masking layer 130 and the first substrate 110 are etched simultaneously to form the hole structure H2 in the first substrate 110 .

Based on the above, since the activity of the first substrate 110 is higher than that of the masking layer 130, the masking layer 130 is etched at a slower rate than the first substrate 110 when the second etching is performed, and thus from From the cross-sectional view of FIG. 1E , along the depth direction D, the formed hole structure H2 is somewhat similar to a gourd shape, with a constricted portion in the middle.

Specifically, along the depth direction D, the hole structure H2 has a first aperture L1, a second aperture L2 and a third aperture L3 in sequence, wherein the first aperture L1 is located at the a surface 110a, and the second aperture L2 is smaller than the first aperture L1 and the third aperture L3. The first aperture L1 and the third aperture L3 may be tapered toward the second aperture L2.

More precisely, along the depth direction D, the hole structure H2 is roughly formed by a wedge portion H21 and a ball portion H22, wherein the wedge portion H21 is defined by the first aperture L1 and the second aperture L2, and the third aperture L3 is the diameter of the spherical portion H22. In short, the wedge portion H21 and the ball portion H22 are separated by the second aperture L2.

Incidentally, after the etching process, the next step can be performed with the remaining masking layer 130 retained; or, the remaining masking layer 130 can be removed after the etching process, and then the next step can be performed.

Afterwards, as shown in FIG. 1F , the material of the second substrate 140 is coated on the first surface 110 a of the first substrate 110 , wherein the material of the second substrate 140 is filled into the hole structure H2 to form a joint structure of different materials. 200. The material of the second substrate 140 can be selected from nylon, phenolic epoxy, epoxy resin, difluoroethylene, tetrafluoroethylene, silicon oxide, silicon carbide, diamond powder, carbon tube, graphene, polymer fiber, mineral One of the fibers and their composite materials. In one embodiment, silicon oxide, silicon carbide, diamond powder, and carbon can be added to one or a combination of polymer materials such as nylon, novolak epoxy, epoxy resin, difluoroethylene, and tetrafluoroethylene. At least one of tubes, graphene, polymer fibers and mineral fibers to form the second substrate 140. When the materials selected for making the second base material 140 are different, the functions that can be provided to the first base material 110 are different.

Since the material of the second substrate 140 is filled in the hole structure H2, the second substrate 140 is embedded in the hole structure H2, and the second substrate 140 is embedded in the hole structure The portion in H2 conforms to the hole structure H2.

From the above, it can be known that the fitting between the second base material 140 and the first base material 110 is more stable through the special shape of the hole structure H2.

Usually composite structural coatings are formed by laminating different materials. And because different materials have different coefficients of thermal expansion, thermal expansion and contraction caused by temperature changes can easily cause the substrates of the composite structural coating to separate from each other due to different expansion and contraction capabilities, making the coating as the surface layer It cannot provide good protection for the base layer, causing structural corrosion of the base layer.

However, in this embodiment, the first base material 110 and the second base material 140 of different materials can be tightly fitted through the hole structure of a special shape, even if the temperature changes, it can prevent the The phenomenon that the substrates are separated from each other caused by the expansion and contraction ability. In this way, the service life of the dissimilar material bonding structure can be extended.

In addition, the material of the second base material 140 filled in the hole structure H2 can be selected according to requirements. For example, choose the aforementioned nylon, phenolic epoxy, epoxy resin, difluoroethylene, tetrafluoroethylene, silicon oxide, silicon carbide, diamond powder, carbon tube, graphene, polymer fiber, mineral fiber and its composite materials When one of them is used as the material of the second base material 140 , the resistance to acid corrosion, scale and erosion of the dissimilar material joint structure 200 can be increased. And when the material of the second base material 140 filled in the hole structure H2 is selected from other materials, for example, when the material of the second base material 140 is tetrafluoroethylene, the acid corrosion resistance of the joint structure 200 of different materials can be increased; For example, when the composite material of the second base material 140 contains graphene, the heat conduction of the dissimilar material bonding structure 200 can be increased. ability.

[Second embodiment]

This embodiment is the same as the aforementioned first embodiment, and the difference is that: as shown in FIG. 2 , the first The substrate 110 is etched to form a first hole H1 as shown in FIG. 1C .

Subsequent manufacturing processes and structures are the same as those of the aforementioned first embodiment, and thus will not be described again.

In the above-mentioned first embodiment, the patterned mask 120 is first formed on the first surface 110a of the first substrate 110, and then the first hole H1 is formed by etching. In the second embodiment, the patterned mask 120 is not formed. Under the circumstances, the first hole H1 is directly formed by etching; however, in the present disclosure, the formation method of the first hole H1 is not limited to the method of the first embodiment or the second embodiment.

In other embodiments, laser, sandblasting, printing, cutting or laser engraving can also be used to form the first hole H1 as shown in FIG. 1C in the first substrate 110 .

In particular, the foregoing first and second embodiments are described by taking the first base material 110 as a plate as an example, but the hole structure H2 disclosed in the present disclosure is not limited to be applied only on plates; in other words, the first base material 110 The shape of the material 110 can be selected arbitrarily according to requirements, for example, a hollow tube.

FIG. 3A and FIG. 3B are schematic diagrams of the joint structure of dissimilar materials applied to a hollow tube. Please refer to FIG. 3A, when the shape of the first base material 310 is a hollow tube, forming The first surface 310a with the hole structure H23 may be the inner surface of the tube, and the hole structure H23 is formed on the first surface 310a by laser engraving or mechanical cutting in the tube.

Please refer to FIG. 3B again, which is a schematic diagram of another application of the dissimilar material bonding structure. In this embodiment, the hole structure H24 is formed on the outer surface of the hollow tube. It should be noted that, in another embodiment, hole structures may also be formed on both the inner surface and the outer surface of the hollow tube.

Thereafter, the material of the second base material 340 is coated on the first surface 310a, and the material of the second base material 340 is filled into the hole structure H23, so that the second base material 340 is closely fitted to the first base material 310 .

In addition, it is also possible to roll the plate-shaped dissimilar material joining structure 200 into a tube shape by post-processing.

In another non-illustrated embodiment, the first surface may also be the outer surface of the tubular first substrate, and the material of the second substrate is sprayed on the first surface.

Incidentally, the shape of the first hole H1 formed on the first substrate 110 can be designed according to requirements. 4A to 4H are schematic views of the first hole H1 on the first substrate 110 . As shown in FIG. 4A and FIG. 4B , each of the plurality of first holes H1 may be substantially circular, and the circles have the same diameter and are arranged at regular intervals. As shown in Figure 4C, in one embodiment, the circular diameters of each of the plurality of first holes H1 can also be designed to be different from each other, and the positions of the plurality of first holes H1 can also be randomly set. . As shown in Figure 4D, a plurality of first holes H1 can be relatively They are concentrated around the edge of the first base material 110 , but the distribution of the plurality of first holes H1 in the middle part of the first base material 110 is relatively sparse. In yet another embodiment, the plurality of first holes H1 may be densely arranged in the middle portion of the first substrate 110 and distributed relatively loosely at the edge. That is to say, the shape and density distribution of the plurality of first holes H1 can be designed according to requirements.

Furthermore, as shown in FIG. 4E , the plurality of first holes H1 can also be designed to have a strip shape, and the plurality of strip-shaped first holes H1 are arranged at intervals parallel to each other along the same direction. In one embodiment, as shown in FIG. 4F , the lengths of the plurality of first holes H1 can be changed according to requirements, or are different from each other, and a plurality of holes arranged at intervals from each other can be simultaneously provided along the length direction of the first holes H1. First hole H1. Alternatively, as shown in FIG. 4G , a plurality of first holes H1 may also be arranged in a manner of interlacing each other.

In addition, as shown in FIG. 4H , the length direction of the plurality of first holes H1 is not parallel to the edge of the first substrate 110 , but forms an angle with the edge of the first substrate 110 .

It can be known from the above that the shape, length, arrangement and density of the plurality of first holes H1 in the present disclosure can be changed according to actual needs.

To sum up, the hole structure formed on the surface of the first substrate in the present disclosure has a special shape, wherein the pore diameter of the middle part of the hole structure is smaller than the pore diameter of the parts on the opposite sides. After the material of the second base material with different materials is filled into the pore structure, the first base material and the second base material can achieve a good fitting effect, effectively preventing the second base material from detaching from the first base material.

In this way, the second base for filling the hole structure can be selected according to actual needs. The materials of different materials make the dissimilar material joining structure of the present disclosure applicable to the joining of various kinds of dissimilar materials, and can be generally used in various fields, so it has wide applicability.

110: first substrate

110a: first surface

110b: second surface

130: masking layer

140: second substrate

200: Dissimilar material joint structure

H2: hole structure

Claims (22)

A hole structure is formed inside a substrate in a depth direction from a first surface of a substrate toward a second surface of the substrate, wherein along the depth direction, the hole structure has a first A hole, a second hole and a third hole, the first hole is located on the first surface, and the second hole is smaller than the first hole and the third hole, wherein along the depth direction, the hole structure has A wedge portion and a ball portion, the second aperture is the boundary between the wedge portion and the ball portion. The hole structure as described in claim 1, wherein the first hole diameter and the third hole diameter are tapered toward the second hole diameter. The hole structure described in claim 1, wherein the first aperture and the second aperture define the wedge-shaped portion, and the third aperture is the diameter of the spherical portion. A method for making a hole structure, comprising: providing a base material; forming a first hole on a first surface of the base material; coating a masking layer on the first surface of the base material, and the activity of the base material Activity superior to that of the obscuring layer, wherein the obscuring layer fills the first hole and forms a thin layer on the surface of the first hole along the contour of the first hole, the first surface being connected to the first hole The masking layer at the corner is thicker than the masking layer at other places due to edge effect; and etching the substrate coated with the masking layer to form the hole structure. The manufacturing method of the hole structure as described in claim 4 of the patent application, wherein the method of forming the first hole includes laser, sandblasting, printing, cutting or etching. The method for manufacturing a hole structure as described in claim 4 of the patent application, wherein the first hole is a plurality of patterned holes. The manufacturing method of the hole structure as described in item 4 of the scope of the patent application, wherein the material of the base material is iron, copper, aluminum, magnesium or stainless steel, and the material of the shielding layer can be selected from nickel, copper, chromium, lead , silver, gold and one of the polymer materials. The manufacturing method of the hole structure as described in claim 4 of the patent application, wherein the method of coating the masking layer on the first surface of the substrate includes painting, transfer printing, vapor deposition, electroplating or sputtering. According to the manufacturing method of the hole structure described in item 4 of the scope of the patent application, the base material also has a second surface, and the second surface and the first surface are opposite surfaces of the base material, wherein along the The first surface faces a depth direction of the second surface, the deeper the first hole is, the thickness of the shielding layer becomes thinner. The manufacturing method of the hole structure as described in item 4 of the scope of the patent application further includes removing the remaining masking layer after the etching process. A joint structure of dissimilar materials, comprising: a first substrate having a first surface, a second surface and a hole structure, the hole structure is formed between the first surface and the second surface, and along the The first surface faces a depth direction of the second surface, the hole structure has a first aperture, a second aperture and a third aperture in sequence, the first aperture is located on the first surface, and the second aperture smaller than the first aperture and the third aperture; and A second base material is embedded in the hole structure, wherein along the depth direction, the hole structure has a wedge portion and a ball portion, and the second aperture is a boundary between the wedge portion and the ball portion. The dissimilar material joining structure as described in claim 11, wherein the first aperture and the third aperture are tapered toward the second aperture. The joint structure of dissimilar materials as described in claim 11, wherein the first aperture and the second aperture define the wedge-shaped portion, and the third aperture is the diameter of the spherical portion. The dissimilar material joining structure described in claim 11, wherein the part of the second base material embedded in the hole structure conforms to the hole structure. A method for fabricating a joint structure of different materials, comprising: providing a first base material; forming a first hole on a first surface of the first base material; coating the first surface of the first base material with a a masking layer, the activity of the first substrate being greater than that of the masking layer, wherein the masking layer fills the first hole and forms a thin layer on the surface of the first hole along the contour of the first hole, And the shielding layer at the corner where the first surface is connected to the first hole is thicker than the shielding layer at other places due to edge effects; the first substrate coated with the shielding layer is etched, forming the hole structure; and coating a second base material on the first surface of the first base material, wherein the second base material fills the hole structure. The manufacturing method of the dissimilar material joining structure as described in claim 15 of the patent application, wherein the method of forming the first hole includes laser, sandblasting, printing, cutting or etching. According to the manufacturing method of the dissimilar material joint structure described in claim 15, the first base material also has a second surface, and the second surface and the first surface are opposite surfaces of the first base material , wherein along a depth direction from the first surface toward the second surface, the deeper the first hole is, the thickness of the shielding layer becomes thinner. The method for fabricating a dissimilar material joining structure as described in claim 15, wherein the first hole is a plurality of patterned holes. According to the method for making a joint structure of different materials as described in item 15 of the scope of the patent application, wherein the material of the first base material is iron, copper, aluminum, magnesium or alloys thereof, and the material of the shielding layer can be selected from nickel, One of copper, chromium, lead, silver, gold and polymer materials. The method for fabricating a joint structure of different materials as described in claim 15 of the patent application, wherein the method of coating the masking layer on the first surface of the first substrate includes painting, transfer printing, vapor deposition, electroplating or Sputtering. The manufacturing method of the dissimilar material bonding structure as described in item 15 of the scope of the patent application further includes removing the remaining masking layer after the etching process. The method for fabricating a dissimilar material joining structure as described in claim 15, wherein the material of the second base material is a polymer material.

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