TWI789924B - Transfer apparatus and transfer method - Google Patents

Abstract

A transfer apparatus including a stage, a bond head, a sensor and a control unit is provided. A substrate is adapted to be placed on the stage and has a bonding surface. The bond head is adapted to be connected with a carrier, and a carrying surface of the carrier is adapted to carry at least one electrical element. The sensor is adapted to measure a distance between the bonding surface and the sensor and a distance between the carrying surface and the sensor to obtain an inaccuracy value. The control unit is adapted to control the bond head to adjust an angle of the carrying surface according to the inaccuracy value, and adapted to control the bond head to bond the electrical element onto the bonding surface. In addition, a transfer method is also provided.

Description

Transfer equipment and transfer method

The present invention relates to a transfer device and a transfer method, and in particular to a transfer device and a transfer method for transferring electronic components.

Light Emitting Diode (Light Emitting Diode; LED) is a light-emitting element, because of its low power consumption, high brightness, high resolution and high color saturation, it is suitable for building pixels of light-emitting diode display panels structure. The technique of transferring/bonding a large number of produced micro-LEDs to a substrate with pixel circuits is called Mass Transfer.

In conventional bonding equipment, generally before performing the bonding operation, the bonding head and the carrier of the device itself are measured and corrected for coplanarity by capacitive sensors or inductive sensors, and then Then actually perform the joining work. Alternatively, airbags or similar cushioning materials are added to the bonding head to compensate the coplanarity error between the bonding head and the stage in a semi-active manner. However, in terms of mass transfer, the number of light-emitting diode grains to be transferred is large and the area of the substrate is large, and a slight error will lead to poor bonding quality. The conventional correction/compensation methods cannot meet the requirements of mass transfer. precision for joints degree of demand.

The invention provides a transfer device and a transfer method, which can improve the bonding quality of electronic components.

The transfer device of the present invention includes a stage, a bonding head, a sensor and a control unit. A substrate is suitable for being placed on a stage and has a bonding surface. The bonding head is suitable for connecting a carrier, and a carrier surface of the carrier carries at least one electronic component. The sensor is suitable for measuring the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor to obtain an error value. The control unit is suitable for controlling the bonding head to adjust the angle of the carrying surface according to the error value, and is suitable for controlling the bonding head to bond the electronic component to the bonding surface.

In an embodiment of the present invention, the aforementioned sensors are optical sensors.

In an embodiment of the present invention, the aforementioned mobile device includes a heat insulation structure, wherein the heat insulation structure covers the sensor.

In an embodiment of the present invention, the above-mentioned heat insulation structure includes a main body and a heat insulation layer, the main body has a hollow portion, the hollow portion accommodates the sensor, and the heat insulation layer is disposed on the inner wall of the hollow portion.

In an embodiment of the present invention, the above-mentioned bonding head includes a body, a connecting portion and at least one adjustment unit, the connecting portion is movably connected to the body and is suitable for connecting with a carrier, the adjustment unit is configured on the body and is suitable for the controlled unit control and adjust the angle of the connecting portion relative to the body.

In an embodiment of the present invention, the above-mentioned transfer device includes a computing unit The calculation unit calculates the error value at least according to the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor.

In an embodiment of the present invention, the calculation unit further calculates the error value according to the operating temperature of at least one of the carrier and the substrate.

The transfer method of the present invention includes the following steps. A substrate is placed on a stage, wherein the substrate has a bonding surface. A carrier is connected to a bonding head, wherein a carrying surface of the carrier carries at least one electronic component. An error value is obtained by measuring the distance between a region of the bonding surface and the sensor and the distance between the carrying surface and the sensor by a sensor. A control unit is used to control the bonding head to adjust the angle of the bearing surface according to the error value. The bonding head is controlled by the control unit to bond the electronic component to the region of the bonding surface.

In an embodiment of the present invention, the step of measuring the distance between the bonding surface and the sensor and the distance between the bearing surface and the sensor includes: optically sensing the substrate and the sensor by the sensor carrier.

In an embodiment of the present invention, the above transfer method includes: covering the sensor with a heat insulating structure.

In an embodiment of the present invention, the above-mentioned bonding head includes a body, a connection portion and at least one adjustment unit, the connection portion is movably connected to the body and is suitable for connecting with a carrier, and the adjustment unit is disposed on the body. The step of adjusting the angle of the carrying surface includes: adjusting the angle of the connection part relative to the main body by controlling the adjustment unit through the control unit.

In an embodiment of the present invention, the above transfer method further includes the following steps. After the bonding head has bonded the electronic component to the region of the bonding surface, at least another electronic component is carried by the carrier surface. Sensing another area of the interface with the sensor Another error value is obtained from the distance between the sensors and the distance between the bearing surface and the sensors. The control unit controls the bonding head to adjust the angle of the bearing surface according to another error value. The bonding head is controlled by the control unit to bond at least another electronic component to another area of the bonding surface.

In an embodiment of the present invention, the step of obtaining the error value includes: using a calculation unit to calculate the error value according to the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor .

In an embodiment of the present invention, the calculation unit further calculates the error value according to the operating temperature of at least one of the carrier and the substrate.

Based on the above, in the transfer device and transfer method of the present invention, the sensor directly measures the carrier and the substrate, so as to obtain error values related to the actual position and angle of the carrier and the substrate. In this way, compared with the conventional calibration method that only indirectly measures the carrier and bonding head of the equipment itself before the actual operation, the error value obtained by the present invention is more accurate, and the carrier can be precisely adjusted accordingly The inclination angle of the bearing surface relative to the bonding surface of the substrate in each axial direction improves the bonding quality of the electronic components.

50, 50': electronic components

60: Substrate

60a: joint surface

70: carrier

70a: bearing surface

100:Transfer device

110: carrier

120:Joint head

122: Ontology

124: connection part

126: Adjustment unit

130: sensor

140: control unit

150: Insulation structure

150a: opening

152: subject

154: Insulation layer

160: computing unit

A1, A2: area

C: Hollow part

L: Sensing light

X, Y, Z: Axial

FIG. 1 is a schematic diagram of some components of a transfer device according to an embodiment of the present invention.

FIG. 2 is a block diagram of some components of the transfer device in FIG. 1 .

FIG. 3 is a flowchart corresponding to a transfer method of the transfer device of FIG. 1 .

FIG. 4 is a schematic diagram of the heat insulation structure and the sensor in FIG. 1 .

FIG. 5 is a schematic diagram of a part of the bonding head and a carrier of FIG. 1 .

FIG. 6 is a schematic view of a part of a bonding head and a carrier according to another embodiment of the present invention.

7A to 7H illustrate the operation flow of the transfer device in FIG. 1 .

FIG. 1 is a schematic diagram of some components of a transfer device according to an embodiment of the present invention. FIG. 2 is a block diagram of some components of the transfer device in FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the transfer equipment 100 of this embodiment is, for example, a mass transfer (Mass Transfer) equipment, which is used to transfer the fabricated plurality of micro-LED (micro-LED) crystal grains to a substrate. 60 on. The transfer device 100 includes a stage 110 , a bonding head 120 , a sensor 130 and a control unit 140 . The substrate 60 is suitable for being placed on the stage 110 and has a bonding surface 60a. The bonding head 120 is suitable for connecting a carrier 70, and a carrying surface 70a of the carrier 70 carries a plurality of electronic components 50 (for example, the above-mentioned micro light-emitting diode crystal grains), so that the electronic components 50 can be printed by stamping. Bonded to substrate 60 .

Factors such as the manufacturing and assembly errors of the various components of the transfer equipment 100, the installation and dimensional errors of the substrate 60 and the carrier 70, and the thermal expansion and contraction caused by the operating temperature may cause the bonding surface 60a of the substrate 60 and the carrying surface of the bonding head 120 to be different. There is an error value in the coplanarity of 70a, resulting in poor bonding quality. Based on the above, the sensor 130 of this embodiment is used to measure the distance between the bonding surface 60a of the substrate 60 and the sensor 130 and the distance between the bearing surface 70a of the bonding head 120 and the sensor 130, according to Estimates are made to obtain the above error values. The control unit 140 can be a control circuit integrated in the device body of the transfer device 100 or an external computer device, which is not limited in the present invention. control The unit 140 is coupled to the bonding head 120 and is adapted to control the bonding head 120 to adjust the angle of the bearing surface 70a according to the above-mentioned error value to compensate the above-mentioned error value, and then control the bonding head 120 to bond the electronic component 50 to the bonding surface of the substrate 60 60a.

FIG. 3 is a flowchart corresponding to a transfer method of the transfer device of FIG. 1 . Please refer to FIG. 3 , the transfer method of this embodiment includes the following steps. The substrate 60 is placed on the stage 110, wherein the substrate 60 has the bonding surface 60a (step S1). Connect the carrier 70 to the bonding head 120 , wherein the carrier surface 70 a of the carrier 70 carries the electronic component 50 (step S2 ). The sensor 130 measures the distance between an area A1 of the bonding surface 60 a and the sensor 130 and the distance between the carrying surface 70 a and the sensor 130 to obtain an error value (step S3 ). The control unit 140 controls the bonding head 120 to adjust the angle of the carrying surface 70 a according to the error value (step S4 ). The bonding head 120 is controlled by the control unit 140 to bond the electronic component 50 to the area A1 of the bonding surface 60 a (step S5 ).

Under the above configuration and working method, the sensor 130 directly measures the carrier 70 and the substrate 60 to obtain error values related to the actual positions and angles of the carrier 70 and the substrate 60 . In this way, compared with the conventional calibration method that only indirectly measures the stage and bonding head of the equipment itself before the actual operation, the error value obtained in this embodiment is more accurate, and can be precisely adjusted accordingly. The inclination angles of the carrying surface 70 a of the carrier 70 relative to the bonding surface 60 a of the substrate 60 in each axial direction improve the bonding quality of the electronic component 50 .

In this embodiment, the sensor 130 is, for example, an optical sensor, which uses laser, infrared, white light or other types of light to measure the distance between the bonding surface 60 a of the substrate 60 and the bearing surface 70 a of the carrier 70 . Compared to conventional bonding equipment utilizing capacitive A sensor or an inductive sensor performs distance measurement. The sensor 130 in this embodiment optically senses the bonding surface 60 a of the substrate 60 and the carrying surface 70 a of the carrier 70 , and has better sensing accuracy.

The transfer device 100 of this embodiment heats the bonding head 120 and the carrier 110 during the transfer operation, so as to facilitate the bonding of the electronic components 50 . As mentioned above, since the high temperature will affect the sensing of the optical sensor (sensor 130), the transfer device 100 of this embodiment may further include a heat insulating structure 150, and the heat insulating structure 150 is used to cover the sensor 130 , so as to avoid the high temperature from affecting the sensing of the sensor 130 .

FIG. 4 is a schematic diagram of the heat insulation structure and the sensor in FIG. 1 . Please refer to FIG. 4 , specifically, the heat insulation structure 150 of this embodiment includes a main body 152 and a heat insulation layer 154 , the main body 150 has a hollow portion C, and the hollow portion C accommodates the sensor 130 . The heat insulation layer 154 is disposed on the inner wall of the hollow portion C to provide heat insulation effect. The sensing light L of the sensor 130 passes through the opening 150 a of the heat insulation structure 150 and is emitted toward the bonding surface 60 a of the substrate 60 and the carrying surface 70 a of the carrier 70 . In this embodiment, the material of the main body 152 is, for example, aluminum, and the material of the heat insulation layer 154 is, for example, glass fiber, foam material, aluminum foil heat insulation roll or other heat insulation materials, which is not limited in the present invention. As mentioned above, the heat insulation layer 154 is arranged on the inner wall of the hollow portion C without being exposed, so that the heat insulation layer 154 can be prevented from being worn.

The relative arrangement relationship between the bonding head and the carrier in this embodiment will be specifically described below. FIG. 5 is a schematic diagram of a part of the bonding head and a carrier of FIG. 1 . Please refer to FIG. 1 and FIG. 5 , the bonding head 120 of this embodiment includes a body 122 , a connecting portion 124 and a plurality of adjustment units 126 (four adjustment units 126 are shown). The connection part 124 shown in Fig. 5 It is movably connected to the body 122 shown in FIG. 1 , and the connection portion 124 is suitable for connecting the carrier 70 through vacuum suction or other suitable methods. The adjusting unit 126 is disposed on the main body 122 and connected to the connecting portion 124 , so as to be controlled by the control unit 140 (shown in FIG. 2 ) to adjust the angle of the connecting portion 124 relative to the main body 122 . These adjustment units 126 are, for example, linear motors, which can respectively change the positions of different parts of the connecting portion 124 in the axial direction Z, so that the connecting portion 124 takes at least one of the axial directions X, axial Y, and axial Z as the rotation axis. The amount of rotation is generated to adjust the inclination angle of the connecting portion 124 in each axial direction. FIG. 6 is a schematic view of a part of a bonding head and a carrier according to another embodiment of the present invention. The difference between the embodiment shown in FIG. 6 and the embodiment shown in FIG. 5 lies in that the number of adjustment units 126 in the embodiment shown in FIG. 6 is three. In other embodiments, the number of the adjustment units 126 can be changed according to design requirements, which is not limited by the present invention.

The manner in which the error value is obtained according to the distance between the bonding surface 60 a of the substrate 60 and the sensor 130 and the distance between the carrying surface 70 a of the bonding head 120 and the sensor 130 in this embodiment will be described in detail below. Please refer to FIG. 1, the transfer device 100 of this embodiment includes a computing unit 160, the computing unit 160 is, for example, a computing circuit, which can be integrated into the aforementioned control circuit or integrated into an external computer device, and is coupled to the control unit 140 and sensor 130 . The calculation unit calculates the error value at least according to the distance between the bonding surface 60 a of the substrate 60 and the sensor 130 and the distance between the bearing surface 70 a of the carrier 70 and the sensor 130 . In more detail, the sensor 130 measures the distance in the axial direction Z between a plurality of positions in the area A1 of the bonding surface 60 a of the substrate 60 and the sensor 130 , and measures the distance between the sensor 130 and the bearing surface 70 a of the carrier 70 . The distance between a position and the sensor 130 in the axial direction Z is used to estimate the actual distance between the joint surface 60a and the bearing surface 70a The error between the coplanarity and the ideal coplanarity is the error value. The ideal coplanarity, for example, refers to a state where the joint surface 60a is completely parallel to the bearing surface 70a.

In other embodiments, the error value may be other error parameters related to the distance between the bonding surface 60a and the sensor 130 and the distance between the bearing surface 70a and the sensor 130, and the present invention is not limited thereto. . In addition, when the transfer equipment 100 heats the bonding head 120 and the carrier 110 as mentioned above, the carrier 110, the bonding head 120, the carrier 70 and the substrate 60 may all expand due to temperature rise, thereby affecting the bonding surface 60a and the carrier surface. The position and angle of 70a. Therefore, in addition to calculating the error value based on the distance between the bonding surface 60a and the sensor 130 and the distance between the carrying surface 70a and the sensor 130 as described above, the calculation unit 160 can also calculate the error value based on the carrier 70 and the substrate 60 at least one of the operating temperature to calculate the error value. For example, the dimensional offset caused by the temperature difference can be estimated according to the operating temperature and parameters such as the material and size of the corresponding components, and can be regarded as a part of the error.

The operation process of the transfer device of this embodiment will be described in detail below with reference to the drawings. 7A to 7H illustrate the operation flow of the transfer device in FIG. 1 . First, as shown in FIG. 7A , move the sensor 130 together with the heat insulating structure 150 between the substrate 60 and the carrier 70 to use the sensor 130 to sense the area A1 of the bonding surface 60a between the sensor 130 and the substrate 60 The distance between the sensor 130 and the bearing surface 70a of the carrier 70 is used to obtain the error value, and the error value can be calculated in the same manner as described above, and will not be repeated here. The sensor 130 and the heat insulation structure 150 can be moved by driving and moving devices such as mechanical arms, motors, cylinders, etc., and the present invention is not limited thereto. Next, as shown in FIG. 7B , the sensor 130 together with the thermal insulation structure 150 is separated from the substrate 60 and the carrier. 70, and adjust the inclination angle of the carrying surface 70a of the carrier 70 to compensate for the error value according to the sensing result of the sensor 130 and the error value of the operating temperature of the carrier 70 and the substrate 60, wherein the carrier The adjustment of the bearing surface 70a of 70 can be done in the same manner as described above, and will not be repeated here. Then, as shown in FIGS. 7C to 7D , the carrier 70 and the electronic components 50 thereon are bonded to the region A1 of the bonding surface 110 of the substrate 60 by using the bonding head 120 . So far, the bonding operation of the region A1 of the bonding surface 110 of the substrate 110 is completed.

On top of that, after the bonding head 120 bonds the electronic component 50 to the region A1 of the bonding surface 110, another electronic component 50' (shown as a plurality of electronic components) is carried by the carrying surface 70a of the carrier 70 as shown in FIG. 7E 50'), move the bonding head 120 together with the carrier 70 to a position corresponding to another area A2 of the bonding surface 110a of the substrate 110, and move the sensor 130 together with the heat insulating structure 150 between the substrate 60 and the carrier 70 to Using the sensor 130 to sense the distance between the sensor 130 and the area A2 of the bonding surface 60a of the substrate 60 and the distance between the sensor 130 and the bearing surface 70a of the carrier 70 to obtain another error value, wherein the error The value can be calculated in the same manner as described above, and will not be repeated here. Next, as shown in FIG. 7F , the sensor 130 and the thermal insulation structure 150 are removed from between the substrate 60 and the carrier 70, and according to the sensing results related to the sensor 130 and the operating temperature of the carrier 70 and the substrate 60 The other error value is used to adjust the inclination angle of the bearing surface 70a of the carrier 70 to compensate for the other error value, wherein the adjustment of the bearing surface 70a of the carrier 70 can be done in the same manner as described above, and will not be repeated here. Then, as shown in FIG. 7G to FIG. 7H , the carrier 70 and the electronic components 50' on it are bonded to the area A2 of the bonding surface 110 of the substrate 60 by using the bonding head 120. So far, the bonding surface 110 of the substrate 110 is completed. The joining operation of the area A2. By analogy, more regions of the bonding surface 110 of the substrate 110 can be bonded sequentially.

To sum up, in the transfer equipment and transfer method of the present invention, before the bonding operation of each area of the bonding surface of the substrate is performed, the sensor can be used to directly sense the substrate and the carrier, and the difference between the carrier can be detected accordingly. The inclination angle of the bearing surface is compensated and adjusted. In this way, compared with the conventional calibration method that only indirectly measures the stage and bonding head of the equipment itself before the actual operation, the sensing method of the present invention is more real-time, and the obtained error value is more accurate. Accurate, and can precisely adjust the inclination angle of the bearing surface of the carrier relative to the bonding surface of the substrate in each axial direction, thereby improving the bonding quality of the electronic components.

50: Electronic components

60: Substrate

60a: joint surface

70: carrier

70a: bearing surface

100:Transfer device

110: carrier

120:Joint head

122: Ontology

126: Adjustment unit

130: sensor

150: Insulation structure

A1: area

X, Y, Z: Axial

Claims (14)

A transfer device comprising: a carrier, a substrate is suitable for placing on the carrier and has a bonding surface; a bonding head, suitable for connecting a carrier, wherein a carrier surface of the carrier carries at least one electronic component; a sensor adapted to measure the distance between the bonding surface and the sensor and the distance between the bearing surface and the sensor to obtain an error value; and A control unit is adapted to control the bonding head to adjust the angle of the bearing surface according to the error value, and is adapted to control the bonding head to bond at least one electronic component to the bonding surface. The transfer device as claimed in claim 1, wherein the sensor is an optical sensor. The transfer device as claimed in claim 1, comprising a heat insulating structure, wherein the heat insulating structure covers the sensor. The transfer device as described in claim 3, wherein the heat insulation structure includes a main body and a heat insulation layer, the main body has a hollow portion, the hollow portion accommodates the sensor, and the heat insulation layer is disposed on the hollow portion inner wall. The transfer device as claimed in claim 1, wherein the bonding head includes a body, a connecting portion and at least one adjustment unit, the connecting portion is movably connected to the body and is suitable for connecting to the carrier, and the at least one adjustment unit is disposed on The body is adapted to be controlled by the control unit to adjust the angle of the connecting portion relative to the body. The transfer device as claimed in claim 1, comprising a calculation unit, wherein the calculation unit calculates the difference. The transfer device as claimed in claim 6, wherein the calculating unit calculates the error value further according to an operating temperature of at least one of the carrier and the substrate. A transfer method comprising: placing a substrate on a stage, wherein the substrate has a bonding surface; connecting a carrier to a bonding head, wherein a carrier surface of the carrier carries at least one electronic component; Obtaining an error value by measuring the distance between a region of the bonding surface and the sensor and the distance between the bearing surface and the sensor by a sensor; controlling the bonding head to adjust the angle of the bearing surface by a control unit according to the error value; and The bonding head is controlled by the control unit to bond the at least one electronic component to the region of the bonding surface. The transfer method as described in claim 8, wherein the step of measuring the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor comprises: The substrate and the carrier are optically sensed by the sensor. The transfer method as described in Claim 8, comprising: The sensor is covered by a thermal insulation structure. The transfer method according to claim 8, wherein the bonding head includes a body, a connecting portion and at least one adjustment unit, the connecting portion is movably connected to the body and is suitable for connecting to the carrier, and the at least one adjustment unit is disposed on The body, the steps of adjusting the angle of the bearing surface include: The at least one adjustment unit is controlled by the control unit to adjust the angle of the connecting portion relative to the main body. The transfer method as described in Claim 8, further comprising: carrying at least another electronic component by the carrying surface after the bonding head has bonded the at least one electronic component to the region of the bonding surface; Obtaining another error value by sensing the distance between another area of the bonding surface and the sensor and the distance between the bearing surface and the sensor by the sensor; controlling the bonding head to adjust the angle of the carrying surface by the control unit according to the other error value; and The bonding head is controlled by the control unit to bond the at least another electronic component to the other region of the bonding surface. The transfer method as described in claim item 8, wherein the step of obtaining the error value comprises: The error value is calculated by a calculation unit according to the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor. The transfer method as claimed in claim 13, wherein the calculating unit calculates the error value according to an operating temperature of at least one of the carrier and the substrate.

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